WO2023091876A1 - Antennes de station de base comprenant un circuit d'alimentation et un circuit d'étalonnage qui partagent une carte - Google Patents

Antennes de station de base comprenant un circuit d'alimentation et un circuit d'étalonnage qui partagent une carte Download PDF

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Publication number
WO2023091876A1
WO2023091876A1 PCT/US2022/079677 US2022079677W WO2023091876A1 WO 2023091876 A1 WO2023091876 A1 WO 2023091876A1 US 2022079677 W US2022079677 W US 2022079677W WO 2023091876 A1 WO2023091876 A1 WO 2023091876A1
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Prior art keywords
base station
radiating elements
circuitry
dielectric substrate
pcb
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PCT/US2022/079677
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English (en)
Inventor
Haifeng Li
Peter J. Bisiules
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Commscope Technologies Llc
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Publication of WO2023091876A1 publication Critical patent/WO2023091876A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/267—Phased-array testing or checking devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/246—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for base stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays
    • H01Q21/065—Patch antenna array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/24—Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction
    • H01Q21/26—Turnstile or like antennas comprising arrangements of three or more elongated elements disposed radially and symmetrically in a horizontal plane about a common centre

Definitions

  • the present invention generally relates to radio communications and, more particularly, to base station antennas for cellular communications systems.
  • Cellular communications systems are well known in the art. In a cellular communications system, a geographic area is divided into a series of regions or "cells" that are served by respective base stations. Each base station may include one or more base station antennas that are configured to provide two-way radio frequency (“RF") communications with subscribers that are within the cell served by the base station.
  • RF radio frequency
  • each base station is divided into "sectors.”
  • a hexagonally-shaped cell is divided into three 120o sectors in the azimuth plane, and each sector is served by one or more base station antennas that have an azimuth Half Power Beamwidth ("HPBW") of approximately 65°.
  • HPBW azimuth Half Power Beamwidth
  • the base station antennas are mounted on a tower or other raised structure, with the radiation patterns that are generated by the base station antennas directed outwardly.
  • Base station antennas are often implemented as linear or planar phased arrays of radiating elements. [0003]
  • base station antennas that include beamforming arrays and/or that are configured to operate with massive multi-input-multi-output (“MIMO”) radios have been introduced in recent years.
  • MIMO massive multi-input-multi-output
  • a beamforming array refers to an antenna array that includes multiple columns of radiating elements.
  • RF signals that are to be transmitted by the beamforming array are broken into sub-components that are transmitted through respective groups, or "sub-arrays," of one or more radiating elements.
  • the amplitudes and phases of the sub-components are adjusted by the radio so that the beamforming array generates antenna beams having reduced (narrower) beamwidths in, for example, the horizontal or "azimuth" plane, which increases the directivity or "gain” of the antenna, thereby increasing the supportable throughput.
  • MIMO refers to a communication technique in which a data stream is broken into pieces that are simultaneously transmitted using certain coding techniques over multiple relatively uncorrelated transmission paths between a transmitting station and a receiving station.
  • Multi-column antenna arrays may be used for MIMO transmissions, where each column in the array may be connected to a port of a MIMO radio and used to transmit/receive one of the multiple data streams.
  • the radiating elements in a MIMO array are typically implemented as dual-polarized radiating elements, allowing each column in the MIMO array to be connected to two ports on the radio (where the first port is connected to the first- polarization radiators of the radiating elements in the column, and the second port is connected to the second-polarization radiators of the radiating elements in the column). This technique can effectively halve the number of columns of radiating elements required, as each physical column of the array contains two independent columns of radiators.
  • MIMO and beamforming techniques can also be combined.
  • 8T8R 8-Transmit/8-Receive
  • antenna arrays that include four columns of dual-polarized radiating elements that are configured to form a single antenna beam per polarization within a sector.
  • the two polarizations may be used to implement 2xMIMO communications for each antenna beam.
  • These beamforming antennas are often used for time division duplex (“TDD”) communications and may generate a single antenna beam (at each polarization) during each individual time slot of the TDD communication scheme.
  • TDD time division duplex
  • 16-Transmit/16-Receive (“16T16R”) radios (which include sixteen radio ports) are known in the art that are connected to antenna arrays that include eight columns of dual-polarized radiating elements that are configured to form one or more antenna beams (per polarization) at a time within a sector.
  • the 16T16R solutions provide higher gain and less interference (and hence support higher data throughput) as compared to the 8T8R solution, but also require a larger array on the antenna and a more expensive 16T16R radio.
  • Beamforming antennas are also available that are capable of forming narrow antenna beams that are sometimes referred to as "pencil beams" that can be pointed at specific users or closely clustered groups of users.
  • antennas can generate different pencil beams on a time-slot by time-slot basis so that very-high-gain antenna beams can be electronically steered throughout a sector during different time slots to provide coverage to the users throughout the sector.
  • the relative amplitude and phases applied by the radio to the sub-components of the RF signal that are passed to each column of a beamforming antenna may not be maintained as the sub-components of the RF signal are passed from the radio to a high-power amplifier and then on to the beamforming array. If the relative amplitudes and phases change, then the resulting antenna beam will typically exhibit lower antenna gains in desired directions and higher antenna gains in undesired directions, resulting in degraded performance.
  • Variations in the relative amplitudes and phases may arise, for example, because of non-linearities in the amplifiers that are used to amplify the respective transmitted and received sub-components of an RF signal, differences in the lengths of the cabling connections between the different radio ports and respective RF ports on the antenna, variations in temperature, and the like. While some of the causes for the amplitude and phase variations may tend to be static (i.e., they do not change over time), others may be dynamic, and hence more difficult to compensate. [0007] To reduce the above-discussed amplitude and phase variations, beamforming base station antennas may include a calibration circuit that samples each sub-component of an RF signal and passes these samples back to the radio.
  • the calibration circuit may comprise a plurality of directional couplers, which are configured to tap RF energy from respective RF transmission paths that extend between the RF ports and the sub-arrays of radiating elements, as well as a calibration combiner that is used to combine the RF energy tapped off of each of these RF transmission paths.
  • the output of the calibration combiner is coupled to a calibration port on the antenna, which in turn is coupled back to the radio.
  • the radio may use the samples of each sub-component of the RF signal to determine the relative amplitude and/or phase variations along each transmission path, and may then adjust the applied amplitude and phase weights to account for these variations.
  • a base station antenna may include a printed circuit board ("PCB") having a first surface and a second surface that is opposite the first surface.
  • the base station antenna may include a plurality of sheet-metal radiating elements on the first surface of the PCB.
  • the base station antenna may include feed circuitry on the second surface of the PCB.
  • the base station antenna may include a reflector that faces the feed circuitry.
  • the base station antenna may include calibration circuitry on the second surface of the PCB.
  • the calibration circuitry and the feed circuitry may include, for example, traces on the second surface of the PCB.
  • the first surface of the PCB may be free of any traces of the feed circuitry and is free of any traces of the calibration circuitry.
  • the first surface of the PCB may have a ground plane thereon that faces the plurality of sheet-metal radiating elements.
  • the PCB may be a multi-layer PCB including a first dielectric substrate and a second dielectric substrate.
  • the multi-layer PCB may include a ground plane that is between the first dielectric substrate and the second dielectric substrate.
  • the PCB may include a single dielectric substrate layer.
  • a first of the plurality of sheet-metal radiating elements may include a metal sheet having a plurality of electroplated bent portions that protrude toward, and are soldered to, the PCB.
  • a first of the plurality of sheet-metal radiating elements may include a metal sheet having a plurality of bent portions that protrude toward, and are capacitively coupled to, the PCB. The bent portions may not be electroplated.
  • the base station antenna may include a plurality of plastic supports that space the metal sheet apart from the PCB.
  • a first of the plurality of sheet-metal radiating elements may include a metal sheet and a plurality of electroplated metal pins that are soldered to the PCB.
  • a first of the plurality of sheet-metal radiating elements may include a metal sheet and a plurality of metal pins that are capacitively coupled to the PCB. The metal pins may not be electroplated.
  • the base station antenna may include a plurality of plastic supports that space the metal sheet apart from the PCB.
  • the base station antenna may include a dielectric layer that is between the reflector and the feed circuitry.
  • a base station antenna may include a single PCB dielectric substrate layer having feed circuitry and calibration circuitry thereon.
  • the base station antenna may include a plurality of sheet-metal radiating elements that are elevated above a first surface of the single PCB dielectric substrate layer.
  • the feed circuitry and the calibration circuitry may be on a second surface of the single PCB dielectric substrate layer that is opposite the first surface.
  • the calibration circuitry and the feed circuitry may include traces on the second surface of the single PCB dielectric substrate layer.
  • a base station antenna may include a multi- layer PCB including a first dielectric substrate and a second dielectric substrate.
  • the multi- layer PCB may include a ground plane that is between the first dielectric substrate and the second dielectric substrate.
  • the base station antenna may include a plurality of radiating elements on the first dielectric substrate.
  • the base station antenna may include feed circuitry on the first dielectric substrate.
  • the base station antenna may include calibration circuitry on the second dielectric substrate.
  • the base station antenna may include a reflector that faces the calibration circuitry.
  • the radiating elements may include patch radiating elements comprising metal plates that are on the first dielectric substrate.
  • the radiating elements may include sheet- metal radiating elements that are on the first dielectric substrate.
  • the feed circuitry may include first feed circuitry that is on the first dielectric substrate.
  • the base station antenna may include second feed circuitry that is on the second dielectric substrate.
  • the first feed circuitry may include traces on the first dielectric substrate.
  • the second feed circuitry and the calibration circuitry may include traces on the second dielectric substrate.
  • the first feed circuitry may include a plurality of first- polarization sub-array power dividers that are coupled to respective sub-arrays of the radiating elements.
  • the first feed circuitry may include a plurality of second- polarization sub-array power dividers that are coupled to the respective sub-arrays of the radiating elements.
  • the second feed circuitry may include a plurality of first-polarization power dividers and a plurality of second-polarization power dividers.
  • the radiating elements may include dual-feed radiating elements that are each fed by a respective one of the first-polarization power dividers and a respective one of the second-polarization power dividers.
  • the base station antenna may include a plurality of phase shifters on the first dielectric substrate.
  • the base station antenna may include a radome.
  • the base station antenna may include a plurality of director elements on the radome and facing the radiating elements.
  • a base station antenna may include a multi- layer PCB.
  • the multi-layer PCB may include a first ground plane and a second ground plane.
  • the multi-layer PCB may include a first dielectric substrate and a second dielectric substrate that are between the first ground plane and the second ground plane.
  • the multi- layer PCB may include feed circuitry and calibration circuitry that are between the first dielectric substrate and the second dielectric substrate.
  • the base station antenna may include a plurality of radiating elements on the first ground plane, and a reflector that faces the second ground plane.
  • the radiating elements may include sheet-metal radiating elements that are elevated above the first ground plane.
  • FIG.1A is a schematic side view of an antenna that includes a multi-layer PCB having feed circuitry and calibration circuitry according to embodiments of the present invention.
  • FIG.1B is a schematic front view of the antenna of FIG.1A.
  • FIG.1C is a schematic block diagram of the first and second dielectric substrates of FIG.1A, in an example in which the first dielectric substrate includes phase shifters.
  • FIGS.1D and 1E are schematic block diagrams illustrating connections between the phase shifters of FIG. 1C and groups of the patch radiating elements of FIG.1B.
  • FIG.1F is a schematic block diagram of the first and second dielectric substrates of FIG.1A, in a dual-feed example in which the first dielectric substrate does not include phase shifters.
  • FIGS.1G and 1H are schematic block diagrams illustrating connections between the power dividers of FIG.1F and groups of the patch radiating elements of FIG. 1B.
  • FIG.1I is a schematic block diagram of the first and second dielectric substrates of FIG.1A, in a single-feed example in which the first dielectric substrate does not include phase shifters.
  • FIGS.1J and 1K are schematic block diagrams illustrating connections between the power dividers of FIG.1I and groups of the patch radiating elements of FIG.1B.
  • FIG.1L is a schematic block diagram of a dielectric layer that is between the reflector of FIG. 1A and the circuitry of the second dielectric substrate of FIG. 1A, according to embodiments in which the dielectric standoffs of FIG.1A are omitted.
  • FIG.1M is a schematic block diagram of the circuitry of the second dielectric substrate of FIG.1A.
  • FIG.1N is a schematic block diagram of the circuitry of the first dielectric substrate of FIG.1A.
  • FIG.1O is a schematic block diagram of the calibration circuitry of FIG.1B.
  • FIG.1P is a schematic block diagram of conductive vias that connect the radiating elements of FIG.1A to the circuitry of the second dielectric substrate of FIG.1A.
  • FIG.2A is a schematic side view of an antenna that includes a single PCB dielectric substrate layer having feed circuitry and calibration circuitry according to embodiments of the present invention.
  • FIG.2B is a schematic front view of the antenna of FIG.2A.
  • FIGS.2C-2F are bottom perspective views of different examples of the sheet- metal radiating elements of FIG.2A.
  • FIG.2G is a schematic block diagram of a dielectric layer that is between the circuitry of FIG.2A and the reflector of FIG.2A, according to embodiments in which the dielectric standoffs of FIG.2A are omitted.
  • FIG.2H is a schematic block diagram of the circuitry of FIG.2A.
  • FIG.2I is a schematic block diagram of the calibration circuitry of FIG.2B.
  • FIG.2J is a schematic block diagram of conductive vias that connect the radiating elements of FIG.2A to the circuitry of FIG.2H, according to some embodiments of the present invention.
  • FIG.2K is a schematic block diagram of non-conductive vias through which the radiating elements of FIG.2A connect to the circuitry of FIG. 2H, according to other embodiments of the present invention.
  • FIG.3 is a schematic side view of an antenna that includes a multi-layer PCB having feed circuitry and calibration circuitry according to further embodiments of the present invention.
  • DETAILED DESCRIPTION [0053] Pursuant to embodiments of the present invention, beamforming base station antennas are provided. Conventional beamforming base station antennas typically have separate (a) feed boards for feed circuitry and (b) calibration boards for calibration circuitry. Base station antennas according to embodiments of the present invention, however, may include feed circuitry and calibration circuitry that share a PCB.
  • FIG.1A is a schematic side view of an antenna 100 that includes a multi-layer PCB 101 having feed circuitry and calibration circuitry according to embodiments of the present invention.
  • the multi-layer PCB 101 may be inside a radome RA of the antenna 100.
  • the multi-layer PCB 101 may include first and second dielectric substrates SUB-1, SUB-2 and a ground plane G that extends therebetween.
  • the ground plane G may be a copper (or other metal) layer that is shared by the first and second dielectric substrates SUB-1, SUB-2.
  • Feed circuitry may be part of circuitry 120 on the first dielectric substrate SUB-1 and/or part of circuitry 110 on the second dielectric substrate SUB-2.
  • feed circuitry 120-F (FIG.1N) on the first dielectric substrate SUB-1 may comprise power dividers PX (FIG.1C) that are part of the circuitry 120.
  • feed circuitry 110-F (FIG. 1M) on the second dielectric substrate SUB-2 may comprise power dividers PD (FIG.1C) that are part of the circuitry 110.
  • the power dividers PX and the power dividers PD may be implemented as copper, or other metal, traces TR on the first dielectric substrate SUB-1 and the second dielectric substrate SUB-2, respectively.
  • the circuitry 110 may include calibration circuitry 110-C (FIG. 1C).
  • the calibration circuitry 110-C may be implemented as copper, or other metal, traces TR on the second dielectric substrate SUB-2, and may be coupled between the power dividers PD and RF ports 140 of the antenna 100.
  • the antenna 100 may include a reflector RL that faces the calibration circuitry 110-C.
  • Radiating elements RE of the antenna 100 are part of the circuitry 120.
  • the radiating elements RE may be patch radiating elements RE-P, which may be implemented as copper, or other metal, plates on the first dielectric substrate SUB-1.
  • directors 130 may be on an interior surface of the radome RA that faces the radiating elements RE.
  • the directors 130 may be parasitic radiating elements that receive and re-radiate radio waves from the driven radiating elements RE but in a different phase. The effect of the directors 130 is to enhance radiation in a given direction, thereby increasing the gain of the antenna 100 in that direction.
  • Various techniques can be used to provide the directors 130 on the interior surface of the radome RA.
  • the directors 130 can be on a thin PCB that is adhered (e.g., with double-sided tape) to the interior surface of the radome RA.
  • the directors 130 may be printed onto the interior surface of the radome RA.
  • the directors 130 can be implemented as sheet metal that is suspended from the interior surface of the radome RA.
  • the antenna 100 may, in some embodiments, include a plurality of dielectric standoffs 150 that support the multi-layer PCB 101 and separate the multi-layer PCB 101 from the reflector RL. In other embodiments, the standoffs 150 may be omitted and a dielectric layer 185 (FIG.1L) may separate the multi-layer PCB 101 from the reflector RL.
  • FIG.1B is a schematic front view of the antenna 100 of FIG.1A.
  • the antenna 100 includes calibration circuitry 110-C and an antenna array 112 that includes eight columns 170-1 through 170-8 of radiating elements RE.
  • the antenna array 112 may operate in a band of frequencies that includes 3.3- 4.2 gigahertz ("GHz") or a portion thereof.
  • the antenna array 112 may operate in other frequency bands, such as bands that include frequencies above 4.2 GHz and/or below 3.3 GHz.
  • the antenna array 112 may operate in a band of frequencies that includes 3.7-3.98 GHz, a band of frequencies that includes 1.7-2.2 GHz, a band of frequencies that includes 2.3-2.6 GHz, and/or a band of frequencies that includes 5.1- 5.8 GHz.
  • the antenna array 112 can be the only array in the antenna 100 or can be used in a larger antenna structure alongside a passive antenna array and/or another active antenna array. Passive base station antennas that are designed for use with integrated active antenna modules are discussed in detail in U.S. Patent Application Serial No.17/209,562, the entire content of which is incorporated herein by reference.
  • the radiating elements RE may be dual-polarized radiating elements so that the multi-column antenna array 112 may generate antenna beams at each of two polarizations (e.g., -45° and +45° slant polarizations). Each radiating element RE may be part of the circuitry 120 of the first dielectric substrate SUB-1 of the multi-layer PCB 101 (FIG.
  • Each column 170 includes one or more groups 122 (e.g., one or more sub-arrays) of radiating elements RE.
  • the antenna array 112 includes four rows 160-1 through 160-4 of the groups 122.
  • the antenna array 112 may be inside the radome RA (FIG.1A) of the antenna 100.
  • the radome RA is omitted from view in FIG.1B, as are the power dividers PD, PX (FIG.1C).
  • the antenna 100 may include dozens of (e.g., thirty-two or sixty-four) RF ports 140, which may also be referred to herein as "connectors" or “antenna signal ports,” that are coupled (e.g., electrically connected) to the columns 170, only eight of the antenna signal ports 140 are shown in FIG.1B, thus further simplifying the illustration.
  • the antenna signal ports 140 may also be coupled to respective radio signal ports of a radio.
  • the radio may be a massive MIMO beamforming radio for a cellular base station, and the antenna 100 and the radio may be located at (e.g., may be components of) a cellular base station.
  • the radio and the RF connections between the radio and the antenna signal ports 140 are omitted from view in FIG.1B.
  • the radio may be a 64T64R radio, and thus may include sixty-four RF ports that pass RF communication signals between the internal components of the radio and the antenna array 112. These ports may also be referred to herein as "radio signal ports.” For example, half (i.e., thirty-two) of the radio signal ports may be first-polarization ports and another half of the radio signal ports may be second- polarization ports, where the first and second polarizations are different polarizations.
  • the radio may also include one or more calibration ports that are not radio signal ports, but instead are ports that may be used in calibrating the internal circuitry of the radio to account for amplitude and/or phase differences between the RF signal paths external to the radio.
  • antennas according to the present invention may, in some embodiments, include more or fewer columns 170 and/or rows 160.
  • the 64T64R radio that is discussed with respect to the antenna 100 is merely an example, and antennas according to the present invention may be coupled to a radio that has more or fewer radio signal ports than the 64T64R radio.
  • the radio may be a 32T32R radio or a 16T16R radio.
  • FIG.1C is a schematic block diagram of the first and second dielectric substrates SUB-1, SUB-2 of FIG.1A, in an example in which the first dielectric substrate SUB-1 includes phase shifters PS.
  • the phase shifters PS may be used to electronically adjust the tilt angle of antenna beams generated by the columns 170 of radiating elements RE (FIG. 1B).
  • the columns 170, the power dividers PX, and the phase shifters PS may all be on the first dielectric substrate SUB-1.
  • each phase shifter PS may be coupled to two power dividers PX, and each power divider PX may be coupled to a group 122 (FIG.1B) of radiating elements RE that are in a column 170.
  • the power dividers PX are coupled between the phase shifters PS and the columns 170.
  • the phase shifters PS may comprise rotary wiper arc phase shifters that include arcuate conductive traces TR on the first dielectric substrate SUB-1.
  • Example phase shifters are discussed in U.S. Patent No.7,907,096, the disclosure of which is hereby incorporated herein by reference in its entirety.
  • the power dividers PD and the calibration circuitry 110-C may be on the second dielectric substrate SUB-2.
  • the power dividers PD may be coupled between the power dividers PX of the first dielectric substrate SUB-1 and the radiating elements RE, as will be explained in more detail below.
  • FIGS.1D and 1E are schematic block diagrams illustrating connections between the phase shifters PS of FIG.1C and two groups 122 of the patch radiating elements RE-P of FIG.1B.
  • FIG.1D shows radiating elements RE from a first half (e.g., a top half) of a column 170 (FIG.1B). Three of the radiating elements RE are from the first row 160-1 of the column 170, and another three of the radiating elements RE are from the second row 160- 2 of the column 170.
  • a first antenna signal port 140-1 is coupled to these six radiating elements RE of the column 170 via a first phase shifter PS-1, first and second power dividers PX-1, PX-2, and first through sixth power dividers PD-1 through PD-6.
  • the phase shifter PS-1 is coupled to both of the power dividers PX-1, PX-2.
  • Each power divider PX is a three-way (1:3) divider that is coupled to three two-way (1:2) power dividers PD. As shown in FIG.1D, the power divider PX-1 is coupled to the first through third power dividers PD-1 through PD-3, and the power divider PX-2 is coupled to the fourth through sixth power dividers PD-4 through PD-6.
  • Each group 122 (FIG.1B) of three radiating elements RE is coupled to a respective one of the power dividers PX via three of the power dividers PD, where each radiating element RE is coupled to a respective power divider PD.
  • the power dividers PX may thus be referred to herein as “sub-array splitters,” and the power dividers PD may be referred to herein as “radiating-element splitters.”
  • the three radiating elements RE in the row 160-1 are coupled to the power divider PX-1 via the power dividers PD-1 through PD-3, and the three radiating elements RE in the row 160-2 are coupled to the power divider PX-2 via the power dividers PD-4 through PX-6.
  • the antenna signal port 140-1 may be a first- polarization antenna signal port.
  • a second-polarization antenna signal port 140 may also be coupled to the six radiating elements RE of the column 170 via an arrangement of another phase shifter PS and additional power dividers PD, PX that is analogous to what is shown in FIG.1D.
  • FIG.1E shows radiating elements RE from a second half (e.g., a bottom half) of the column 170 whose first half is shown in FIG.1D. Three of the radiating elements RE are from the third row 160-3 of the column 170, and another three of the radiating elements RE are from the fourth row 160-4 of the column 170.
  • a second antenna signal port 140-2 is coupled to these six radiating elements RE of the column 170 via a second phase shifter PS-2, third and fourth power dividers PX-3, PX-4, and seventh through twelfth power dividers PD- 7 through PD-12.
  • the antenna signal port 140-2 may be coupled to these six radiating elements RE via the phase shifter PS-2 and power dividers PD, PX by connections that are analogous to those shown in FIG.1D.
  • another antenna signal port 140 that has a polarization different from that of the antenna signal port 140-2 may be analogously coupled to these six radiating elements RE.
  • each column 170 may be coupled to a single phase shifter PS per polarization.
  • FIG.1D is a schematic block diagram of the first and second dielectric substrates SUB-1, SUB-2 of FIG.1A, in a dual-feed example in which the first dielectric substrate SUB-1 does not include phase shifters PS (FIG.1C).
  • Each dual-feed radiating element RE has two feeds (per polarization) that may have a phase offset (e.g., 180 degrees) therebetween. Dual-feed radiating elements RE may have better radiation patterns, and significantly better cross polarization, than single-feed radiating elements RE. As a result, the dual-feed radiating elements RE may have better isolation and wider bandwidth.
  • FIGS.1G and 1H are schematic block diagrams illustrating connections between the power dividers PD, PX of FIG.1F and two groups 122 of the patch radiating elements RE-P of FIG.1B.
  • the power dividers PD, PX may each split power evenly such that all radiating elements RE are fed the same magnitude signal.
  • FIG.1G shows radiating elements RE from a first half (e.g., a top half) of a column 170 (FIG.1B). Three of the radiating elements RE are from the first row 160-1 of the column 170, and another three of the radiating elements RE are from the second row 160- 2 of the column 170.
  • a first antenna signal port 140-1 is coupled to the three radiating elements RE of the first row 160-1 via a first power divider PX-1 and first through third power dividers PD-1 through PD-3. Unlike the power divider PX-1 of FIG.1D, which is coupled to the first antenna signal port 140-1 via a phase shifter PS-1, no phase shifter PS is between the first antenna signal port 140-1 and the power divider PX-1 of FIG.1G. Moreover, the first antenna signal port 140-1 of FIG. 1G is coupled to a single group 122 of radiating elements RE, whereas the first antenna signal port 140-1 of FIG.1D is coupled to two groups 122 of radiating elements RE.
  • a second antenna signal port 140-2 is coupled to the three radiating elements RE of the second row 160-2 via a second power divider PX-2 and fourth through sixth power dividers PD-4 through PD-6.
  • the antenna signal ports 140-1, 140-2 may be first-polarization antenna signal ports.
  • two second-polarization antenna signal ports 140 may also be coupled to the six radiating elements RE of the column 170 via a group of power dividers PD, PX that is analogous to what is shown in FIG.1G.
  • the six radiating elements RE are thus coupled to two antenna signal ports 140 (per polarization) rather than the single antenna signal port 140 (per polarization) that is shown in FIG.1D.
  • FIG.1H shows radiating elements RE from a second half (e.g., a bottom half) of the column 170 whose first half is shown in FIG.1G.
  • Three of the radiating elements RE are from the third row 160-3 of the column 170, and another three of the radiating elements RE are from the fourth row 160-4 of the column 170.
  • a third antenna signal port 140-3 is coupled to the three radiating elements RE of the third row 160-3 via a third power divider PX-3 and seventh through ninth power dividers PD-7 through PD-9.
  • a fourth antenna signal port 140-4 is coupled to the three radiating elements RE of the fourth row 160-4 via a fourth power divider PX-4 and tenth through twelfth power dividers PD-10 through PD-12.
  • antenna signal ports 140 that have a polarization different from that of the antenna signal ports 140-3, 140-4 may be analogously coupled to these six radiating elements RE.
  • eight antenna signal ports 140 (four per polarization) may be coupled to the column 170. Connections analogous to those shown in FIGS.1G and 1H may be provided for each column 170 of the antenna 100.
  • the antenna 100 may be a 64T64R antenna having sixty-four antenna signal ports 140 that are coupled to the columns 170 of dual-feed radiating elements RE.
  • FIG.1I is a schematic block diagram of the first and second dielectric substrates SUB-1, SUB-2 of FIG.1A, in a single-feed example in which the first dielectric substrate SUB-1 does not include phase shifters PS (FIG.1C).
  • power dividers PD (FIG. 1F) are omitted from the second dielectric substrate SUB- 2.
  • the calibration circuitry 110-C of the second dielectric substrate SUB-2 is thus coupled to the power dividers PX of the first dielectric substrate SUB-1 without any phase shifters PS or power dividers PD coupled therebetween.
  • FIGS.1J and 1K are schematic block diagrams illustrating connections between the power dividers PX of FIG.1I and two groups 122 of the patch radiating elements RE-P of FIG.1B.
  • FIG.1J shows radiating elements RE from a first half (e.g., a top half) of a column 170 (FIG.1B). Three of the radiating elements RE are from the first row 160-1 of the column 170, and another three of the radiating elements RE are from the second row 160- 2 of the column 170.
  • a first antenna signal port 140-1 is coupled to the three radiating elements RE from the first row 160-1 via a first power divider PX-1.
  • a second antenna signal port 140-2 is coupled to the three radiating elements RE from the second row 160-2 via a second power divider PX-2. Unlike the dual-feed example that is shown in FIG.1G, each radiating element RE in this single-feed example is fed by a power divider PX without a power divider PD therebetween.
  • the antenna signal ports 140-1, 140-2 may be first- polarization antenna signal ports. Accordingly, for dual-polarized radiating elements RE, two second-polarization antenna signal ports 140 may also be coupled to the groups 122 of radiating elements RE of the column 170 via respective power dividers PX analogously to what is shown in FIG. 1J.
  • FIG.1K shows radiating elements RE from a second half (e.g., a bottom half) of the column 170 whose first half is shown in FIG.1J. Three of the radiating elements RE are from the third row 160-3 of the column 170, and another three of the radiating elements RE are from the fourth row 160-4 of the column 170.
  • a third antenna signal port 140-3 is coupled to the three radiating elements RE of the third row 160-3 via a third power divider PX-3.
  • a fourth antenna signal port 140-4 is coupled to the three radiating elements RE of the fourth row 160-4 via a fourth power divider PX-4. Moreover, two additional antenna signal ports 140 that have a polarization different from that of the antenna signal ports 140-3, 140-4 may be analogously coupled to these six radiating elements RE. [0090] Accordingly, referring to FIGS. 1J and 1K together, eight antenna signal ports 140 (four per polarization) may be coupled to the column 170. Connections analogous to those shown in FIGS. 1J and 1K may be provided for each column 170 of the antenna 100.
  • the antenna 100 may be a 64T64R antenna having sixty-four antenna signal ports 140 that are coupled to the columns 170 of single-feed radiating elements RE.
  • Each single-feed radiating element RE is coupled to a sub-array power divider PX without a radiating-element power divider PD therebetween.
  • groups 122 are illustrated, by way of example, as having exactly three radiating elements RE therein, groups 122 of the present invention are not limited thereto.
  • each group 122 may, in some embodiments, have exactly two radiating elements RE. In other embodiments, some groups 122 may have exactly two radiating elements RE and other groups 122 may have exactly three radiating elements RE.
  • FIG.1L is a schematic block diagram of a dielectric layer 185 that is between the reflector RL of FIG.1A and the circuitry 110 of the second dielectric substrate SUB-2 of FIG.1A, according to embodiments in which the dielectric standoffs 150 of FIG.1A are omitted. As the dielectric layer 185 physically and electrically separates the multi-layer PCB 101 (FIG. 1A) from the reflector RL, the standoffs 150 can be eliminated.
  • FIG.1M is a schematic block diagram of the circuitry 110 of the second dielectric substrate SUB-2 of FIG. 1A. As shown in FIG.1M, the circuitry 110 includes calibration circuitry 110-C and feed circuitry 110-F, each of which may be implemented as copper, or other metal, traces TR (FIG.1A) on the second dielectric substrate SUB-2.
  • the feed circuitry 110-F may comprise, for example, power dividers PD (FIG.1C) and RF transmission lines that are coupled between the patch radiating elements RE-P (FIG.1B) and a radio.
  • FIG.1N is a schematic block diagram of the circuitry 120 of the first dielectric substrate SUB-1 of FIG. 1A. As shown in FIG.1N, the circuitry 120 includes patch radiating elements RE-P and feed circuitry 120-F, each of which may be implemented as copper, or other metal, on the first dielectric substrate SUB-1.
  • the feed circuitry 120-F may comprise, for example, power dividers PX (FIG.1C) and RF transmission lines that are coupled between the patch radiating elements RE-P and a radio.
  • FIG.1O is a schematic block diagram of the calibration circuitry 110-C of FIG.1B.
  • the calibration circuitry 110-C has a plurality of directional couplers DC, a plurality of combiners, and a plurality of RF transmission paths RF.
  • Each directional coupler DC is adjacent, and configured to tap RF energy from, a respective one of the paths RF.
  • the directional couplers DC may be in parallel with, and coupled (e.g., electromagnetically coupled) to, the paths RF, respectively.
  • the calibration circuitry 110-C also includes calibration combiners 112, 113, 114. Pairs of the directional couplers DC are each coupled to a respective combiner 114 that combines the outputs of its coupler pair.
  • the combiners 114 are coupled to a calibration port 190-9 of the calibration circuitry 110-C via two further tiers of combiners 112, 113.
  • the calibration circuitry 110-C includes four first-tier combiners 114-1 through 114-4, two second-tier combiners 113-1, 113-2, and a single third-tier combiner 112.
  • the directional couplers DC-1 through DC-8, the paths RF-1 through RF-8, and the combiners 112-114 may each be implemented as, for example, copper, or other metal, traces TR (FIG. 1A) on the second dielectric substrate SUB-2 (FIG.1A). Examples of calibration circuits having combiners and directional couplers are discussed in U.S.
  • the calibration circuitry 110-C may have RF ports 190 that are coupled to antenna signal ports 140, respectively, of the antenna 100 (FIG.1B) by respective RF transmission lines, such as coaxial cables.
  • the RF ports 190 may comprise, for example, pads on the multi-layer PCB 101, and coaxial cables may extend between the RF ports 190 and these pads. For simplicity of illustration, only eight antenna signal ports 140 are shown in FIG.1O.
  • the calibration circuitry 110-C may be coupled to thirty-two or sixty- four antenna signal ports 140 when the antenna 100 is a 32T32R or 64T64R antenna.
  • the calibration circuitry 110-C may include thirty-two or sixty-four paths RF and thirty-two or sixty-four directional couplers DC, as well as two or three additional tiers of combiners that are coupled between the directional couplers DC and the combiners 114. Moreover, though eight RF ports 190-1 through 190-8 are illustrated as being coupled to eight antenna signal ports 140-1 through 140-8 in the simplified diagram of FIG.1O, the calibration circuitry 110-C may include thirty-two or sixty-four RF ports 190 that are coupled to thirty-two or sixty-four antenna signal ports. [0098] As shown by the simplified diagram of FIG.1O, the calibration circuitry 110- C may be coupled to the feed circuitry 110-F and/or the feed circuitry 120-F.
  • the calibration circuitry 110-C may comprise conductive traces TR that are coupled to groups 122 (FIG. 1B) of radiating elements RE (FIG.1B) via the feed circuitry 110-F/120-F.
  • the ports 190-1 through 190-8 are coupled by respective paths RF-1 through RF-8 to the conductive traces TR of the calibration circuitry 110-C.
  • the antenna 100 is a 32T32R or 64T64R antenna
  • thirty-two or sixty-four ports 190 may be coupled to the antenna array 112 by respective coaxial cables (or other RF transmission lines).
  • FIG.1P is a schematic block diagram of a row V-R of conductive vias V that connect radiating elements RE of FIG.1A to circuitry 110 of the second dielectric substrate SUB-2 of FIG.1A.
  • the conductive vias V may comprise plated through holes PTH that electrically connect the radiating elements RE to the feed circuitry 110-F and/or the calibration circuitry 110-C (FIG.1M).
  • the radiating elements RE are part of circuitry 120 of the first dielectric substrate SUB-1 (FIG. 1A). For simplicity of illustration, only two segments (e.g., two radiating elements RE) of the circuitry 120 are shown in FIG.1P.
  • Each radiating element RE of the antenna array 112 may be coupled to two plated through holes PTH (one per polarization) in a single-feed implementation, and to four plated through holes PTH (two per polarization) in a dual-feed implementation.
  • the row V-R may include, for example, sixteen (or thirty-two) plated through holes PTH.
  • the ground plane G will be electrically insulated from the plated through holes PTH. For simplicity of illustration, however, details of the electrical insulation are omitted from view in FIG.1P.
  • FIG.2A is a schematic side view of an antenna 200 that includes a single PCB 203 dielectric substrate layer SUB having feed circuitry 210-F (FIG.2H) and calibration circuitry 210-C (FIG.2B) according to embodiments of the present invention.
  • the PCB 203 has the single dielectric substrate layer SUB.
  • the PCB 203 may be inside a radome RA of the antenna 200.
  • a side surface of the radome RA is illustrated transparently in FIG.2A.
  • the dielectric substrate SUB has a first surface 201 and a second surface 202 that is opposite the first surface 201.
  • Circuitry 210 which includes the feed circuitry 210-F (FIG.2H) and the calibration circuitry 210-C, is on the second surface 202, and a ground plane G is on the first surface 201.
  • the calibration circuitry 210-C may be implemented as copper, or other metal, traces TR on the second surface 202 of the dielectric substrate SUB, and may be coupled between the feed circuitry 210-F and RF ports 140 of the antenna 200.
  • the first surface 201 may be free of any traces TR of feed circuitry and free of any traces TR of calibration circuitry.
  • the antenna 200 may include a reflector RL that faces the calibration circuitry 210-C.
  • Radiating elements RE of the antenna 200 may be on the first surface 201 of the dielectric substrate SUB.
  • the radiating elements RE and the circuitry 210 may thus be on opposite surfaces of the dielectric substrate SUB.
  • the ground plane G may be between the radiating elements RE and the circuitry 210.
  • the radiating elements RE may be, for example, sheet-metal radiating elements RE-S that extend from the first surface 201 toward the radome RA.
  • Each sheet- metal radiating element RE-S includes a metal sheet MS (FIGS.2C-2F) that is elevated above the ground plane G.
  • a primary (e.g., top) surface of the metal sheet MS may face the radome RA and may be closer to the radome RA than to the first surface 201.
  • a bottom surface of the metal sheet MS may face the ground plane G.
  • the circuitry 210 may face the reflector RL.
  • the antenna 200 may, in some embodiments, include a plurality of dielectric standoffs 150 that support the PCB 203 and separate the PCB 203 from the reflector RL. In other embodiments, the standoffs 150 may be omitted and a dielectric layer 220 (FIG.2G) may separate the circuitry 210 of the PCB 203 from the reflector RL.
  • FIG.2B is a schematic front view of the antenna 200 of FIG.2A.
  • the antenna 200 includes calibration circuitry 210-C and an antenna array 112 that includes eight columns 170-1 through 170-8 of radiating elements RE.
  • Each column 170 may include, for example, twelve radiating elements RE, as shown in FIG.2B. In some embodiments, each column 170 may include more or fewer (e.g., eight) than twelve radiating elements RE.
  • the radiating elements RE may be dual-polarized radiating elements so that the multi-column antenna array 112 may generate antenna beams at each polarization.
  • Each radiating element RE may comprise, for example, a sheet-metal radiating element RE-S.
  • the antenna array 112 may be inside the radome RA (FIG.2A) of the antenna 200.
  • the radome RA is omitted from view in FIG.2B.
  • the antenna 200 may include dozens (e.g., thirty-two or sixty-four) of RF ports 140 that are coupled (e.g., electrically connected) to the columns 170, only eight of the antenna signal ports 140 are shown in FIG.2B, thus further simplifying the illustration.
  • the antenna signal ports 140 may also be coupled to respective radio signal ports of a radio.
  • the radio may be a massive MIMO beamforming radio for a cellular base station, and the antenna 200 and the radio may be located at (e.g., may be components of) a cellular base station.
  • the radio and the RF connections between the radio and the antenna signal ports 140 are omitted from view in FIG.2B.
  • the radio may be a 64T64R radio, and thus may include sixty-four RF ports that pass RF communication signals between the internal components of the radio and the antenna array 112.
  • half (i.e., thirty-two) of the radio signal ports may be first-polarization ports and another half of the radio signal ports may be second-polarization ports, where the first and second polarizations are different polarizations.
  • the radio may also include one or more calibration ports that are not radio signal ports, but instead are ports that may be used in calibrating the internal circuitry of the radio to account for amplitude and/or phase differences between the RF signal paths external to the radio.
  • antennas according to the present invention may, in some embodiments, include more or fewer columns 170.
  • FIGS. 2C-2F are bottom perspective views of different examples of the sheet-metal radiating elements RE-S of FIG.2A.
  • each sheet-metal radiating element RE-S includes a metal sheet MS. A plurality of bent portions BP of the metal sheet MS may be punched and bent downward.
  • bent portions BP may be shaped out of the single metal sheet MS into posts that protrude downward from a primary surface of the metal sheet MS.
  • the metal sheet MS may be electrically connected to the circuitry 210 (FIG.2A) of the antenna 200 (FIG.2A) via the bent portions BP, which may be soldered to the circuitry 210.
  • the bent portions BP may be electroplated EP, as may unbent (i.e., flat) portions of the metal sheet MS.
  • FIG.2D shows that a plurality of metal pins MP may, in some embodiments, attach to, and extend downward from, the metal sheet MS.
  • the metal pins MP may comprise four cylindrical posts that are pressed (and/or rotated) into holes in the metal sheet MS without requiring solder, thereby reducing costs associated with using solder to assemble the antenna 200.
  • the metal pins MP may electrically connect (e.g., via solder) the metal sheet MS to the circuitry 210 of the antenna 200, and thus may be used instead of shaping bent portions BP (FIG.2C) of the metal sheet MS.
  • the metal pins MP may be electroplated EP, and the metal sheet MS may not be electroplated.
  • a plurality of dielectric (e.g., plastic) supports SP may, in some embodiments, be attached to the metal sheet MS.
  • each supports SP may each have one end that is on the ground plane G (FIG.2A) and an opposite end that is on the metal sheet MS.
  • the metal sheet MS may have bent portions BP that extend in parallel with the supports SP and electrically connect the metal sheet MS to the circuitry 210 of the antenna 200.
  • each of the bent portions BP may have a tab TB that protrudes parallel to a primary surface of the metal sheet MS and is capacitively coupled to the circuitry 210.
  • Each tab TB may be at the end of a respective bent portion BP that is farthest from the primary surface of the metal sheet MS. Because the bent portions BP are capacitively coupled (rather than soldered) to the circuitry 210, the bent portions BP do not need to be electroplated.
  • FIG.2F shows that metal pins MP, rather than bent portions BP (FIG.2E), may, in some embodiments, extend in parallel with the supports SP.
  • the metal pins MP may comprise four cylindrical posts that are pressed into (or otherwise attached to) the metal sheet MS.
  • each metal pin MP may include a coupling portion CP at an end thereof.
  • the coupling portion CP may be wider than a body of the metal pin MP.
  • the body of the metal pin may be a cylindrical body having a first diameter
  • the coupling portion CP may be a circular region having a second diameter that is wider than the first diameter.
  • the coupling portion CP is capacitively coupled to the circuitry 210 of the antenna 200. Because the metal pins MP are capacitively coupled (rather than soldered) to the circuitry 210, the metal pins MP do not need to be electroplated.
  • the radiating elements RE of FIGS.2C-2F are fed via the bent portions BP or the metal pins MP.
  • embodiments according to FIGS.2C and 2D may be solder-feed implementations of the radiating elements RE
  • embodiments according to FIGS.2E and 2F may be couple-feed implementations of the radiating elements RE.
  • the supports SP are provided with the couple-feed implementations to mechanically support radiating elements RE that are not supported with solder connections to the PCB 203 (FIG. 2A).
  • the radiating elements RE of FIGS.2C-2F are illustrated with four bent portions BP, or metal pins MP, each, these radiating elements RE may be dual-feed elements having four feeds (two feeds per polarization). In other embodiments, the radiating elements RE may be single-feed elements having two feeds (one feed per polarization).
  • the sheet-metal radiating elements RE-S of the antenna 200 may, in some embodiments, be used interchangeably with the patch radiating elements RE-P of the antenna 100.
  • the sheet-metal radiating elements RE-S may be fed by the multi- layer PCB 101 (FIG.1A) of the antenna 100.
  • FIG.2G is a schematic block diagram of a dielectric layer 220 that is between the circuitry 210 of FIG.2A and the reflector RL of FIG. 2A, according to embodiments in which the dielectric standoffs 150 of FIG.2A are omitted. As the dielectric layer 220 physically and electrically separates the PCB 203 (FIG.2A) from the reflector RL, the standoffs 150 can be eliminated.
  • FIG.2H is a schematic block diagram of the circuitry 210 of FIG.2A.
  • the circuitry 210 includes calibration circuitry 210-C and feed circuitry 210-F, each of which may be implemented as copper, or other metal, traces TR (FIG. 2A) on the second surface 202 of the dielectric substrate SUB.
  • the feed circuitry 210-F may comprise, for example, power dividers PX (FIG.2I) and RF transmission lines that are coupled between the sheet-metal radiating elements RE-S (FIG.2A) and a radio.
  • the power dividers PX may comprise a plurality of two-way dividers and/or a plurality of three-way dividers, and may be arranged to provide single-feed and/or dual-feed implementations of the radiating elements RE.
  • FIG.2I is a schematic block diagram of the calibration circuitry 210-C of FIG.2B. Connections in the calibration circuitry 210-C may be analogous to those described herein with respect to the calibration circuitry 110-C of FIG 1O.
  • FIG.2J is a schematic block diagram of a row V-R of conductive vias V that connect the radiating elements RE of FIG.2A to the circuitry 210 of FIG.2H, according to some embodiments of the present invention.
  • the conductive vias V may comprise plated through holes PTH that electrically connect the radiating elements RE to the feed circuitry 210-F.
  • the radiating elements RE may be sheet-metal radiating elements RE-S that are physically and electrically connected to the plated through holes PTH by the bent portions BP shown in FIG.2C or the metal pins MP shown in FIG. 2D.
  • the bent portions BP or the metal pins MP may be soldered to the plated through holes PTH.
  • the sheet-metal radiating elements RE-S may be capacitively coupled to (and thus spaced apart from) the plated through holes PTH via the tabs TB shown in FIG.2E or the coupling portions CP shown in FIG.2F.
  • the plated through holes PTH may be physically and electrically connected to the feed circuitry 210-F. [00122] For simplicity of illustration, only two radiating elements RE are shown in FIG.2J.
  • Each radiating element RE of the antenna array 112 may be coupled to two plated through holes PTH (one per polarization) in a single-feed implementation, and to four plated through holes PTH (two per polarization) in a dual-feed implementation.
  • the row V-R of the conductive vias V may include, for example, sixteen plated through holes PTH.
  • the ground plane G will be electrically insulated from the plated through holes PTH. For simplicity of illustration, however, details of the electrical insulation are omitted from view in FIG.2J.
  • FIG.2K is a schematic block diagram of a row V-R of non-conductive vias through which the radiating elements RE of FIG.2A connect to the circuitry 210 of FIG.2H, according to other embodiments of the present invention.
  • the non-conductive vias may comprise non-plated through holes NPTH.
  • the bent portions BP shown in FIG.2C, or the metal pins MP shown in FIG.2D, of the sheet-metal radiating elements RE-S may extend through the non-plated through holes NPTH to physically and electrically connect to the feed circuitry 210-F.
  • the bent portions BP or the metal pins MP may be soldered to the feed circuitry 210-F.
  • the tabs TB shown in FIG.2E, or the coupling portions CP shown in FIG. 2F, of the sheet-metal radiating elements RE-S may extend into the non-plated through holes NPTH and be capacitively coupled to (and thus spaced apart from) the feed circuitry 210-F.
  • the ground plane G Due to the absence of plated through holes PTH (FIG.2J) in embodiments according to FIG.2K, these embodiments may have a lower cost than embodiments according to FIG.2J.
  • the ground plane G has openings therein.
  • FIG.3 is a schematic side view of an antenna 300 that includes a multi-layer PCB 301 having circuitry 310 that comprises feed circuitry and calibration circuitry according to further embodiments of the present invention.
  • the feed circuitry may comprise feed power splitter circuitry, such as power dividers PD and/or power dividers PX that are described herein with respect to antennas 100, 200.
  • the calibration circuitry may comprise calibration circuitry 110-C of antenna 100 or calibration circuitry 210-C of antenna 200.
  • the feed circuitry and calibration circuitry of the circuitry 310 may be implemented as copper, or other metal, traces TR.
  • the multi-layer PCB 301 may be inside a radome RA of the antenna 300.
  • the multi-layer PCB 301 may include first and second dielectric substrates SUB-1, SUB-2 that have the circuitry 310 therebetween.
  • the substrates SUB-1, SUB-2 may have respective ground planes G-1, G-2 that each serve as electrical ground for the circuitry 310.
  • the ground plane G-1 faces radiating elements, such as sheet-metal radiating elements RE-S, that are elevated above the ground plane G-1, and the ground plane G-2 faces a reflector RL.
  • Each ground plane G may be a copper (or other metal) layer.
  • the antenna 100 may implement a very thin massive MIMO (e.g., 32T32R or 64T64R) antenna array 112 (FIG.1B) on a single multi-layer PCB 101 (FIG.1A) that includes feed circuitry 110-F/120-F (FIG.1C) and calibration circuitry 110-C (FIG.1C).
  • a very thin massive MIMO e.g., 32T32R or 64T64R
  • the calibration circuitry 110-C may be well-shielded (e.g., from radio or filter interference) and does not need to be covered.
  • feeds may be distributed between different layers of the multi- layer PCB 101.
  • the feed circuitry 120-F may share the first dielectric substrate SUB-1 of the multi-layer PCB 101 with the radiating elements RE, and the feed circuitry 110-F may share the second dielectric substrate SUB-2 of the multi-layer PCB 101 with the calibration circuitry 110-C.
  • Additional advantages of the antenna 100 include simpler assembly, lower cost, and fewer solder joints. Reducing the number of solder joints may improve the accuracy of assembling the antenna 100.
  • the antennas 200, 300 may have sheet-metal radiating elements RE-S (FIG.2A), which can have higher gain/directivity, wider bandwidth, and better pattern performance than patch radiating elements RE-P (FIG.1N) comprising conductive patches formed on a PCB.
  • the sheet-metal radiating elements RE-S may also have a low cost.
  • the single dielectric substrate SUB of the PCB 203 of the antenna 200 can be provided at a lower cost than the multi-layer PCB 101 of the antenna 100. Also, the absence of feed circuitry on the first surface 201 (FIG.2A) of the PCB 203 can result in better pattern performance.
  • first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present invention.
  • the term “and/or” includes any and all combinations of one or more of the associated listed items.

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  • Computer Networks & Wireless Communication (AREA)
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Abstract

L'invention concerne des antennes de station de base. Une antenne de station de base comprend une carte de circuit imprimé (PCB) ayant une première surface et une seconde surface qui est opposée à la première surface. L'antenne de station de base comprend une pluralité d'éléments rayonnants sur la première surface de la carte de circuit imprimé. L'antenne de station de base comprend un circuit d'alimentation sur la seconde surface de la carte de circuit imprimé. De plus, l'antenne de station de base comprend un réflecteur qui fait face au circuit d'alimentation.
PCT/US2022/079677 2021-11-19 2022-11-11 Antennes de station de base comprenant un circuit d'alimentation et un circuit d'étalonnage qui partagent une carte WO2023091876A1 (fr)

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