WO2023087580A1 - 高速连接器及通信设备 - Google Patents

高速连接器及通信设备 Download PDF

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Publication number
WO2023087580A1
WO2023087580A1 PCT/CN2022/080738 CN2022080738W WO2023087580A1 WO 2023087580 A1 WO2023087580 A1 WO 2023087580A1 CN 2022080738 W CN2022080738 W CN 2022080738W WO 2023087580 A1 WO2023087580 A1 WO 2023087580A1
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WO
WIPO (PCT)
Prior art keywords
speed connector
plastic
conductive plastic
connector according
insulating plastic
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PCT/CN2022/080738
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English (en)
French (fr)
Inventor
吴生玉
李东天
毕煜
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中兴通讯股份有限公司
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Publication of WO2023087580A1 publication Critical patent/WO2023087580A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40—Securing contact members in or to a base or case; Insulating of contact members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  

Definitions

  • the present application relates to the technical field of communication, in particular to a high-speed connector and communication equipment.
  • the high-speed connector can detect the performance problem of the high-speed channel of the chip on the printed circuit board (Printed Circuit Board, PCB) online.
  • the high-speed connector of the related technical solution holds the terminal through the insulator, which is limited by the structure of the fixed position of the terminal, and it is difficult to adjust the transmission.
  • the impedance of the link affects the integrity of signal transmission, making it difficult to increase the transmission rate of high-speed connectors. In actual product applications, it is impossible to thoroughly investigate the performance problems of high-speed channels in high-speed link products.
  • the application proposes a high-speed connector and communication equipment.
  • the embodiment of the present application provides a high-speed connector, including insulating plastic, conductive plastic, ground terminals and signal terminals, the conductive plastic is connected to the insulating plastic, and the conductive plastic is provided with a protrusion;
  • the ground terminal is arranged on the conductive plastic;
  • the signal terminal is arranged on the insulating plastic, and the signal terminal is coupled with the protruding part.
  • the embodiment of the present application provides a communication device, including the high-speed connector described in the embodiment of the first aspect of the present application.
  • Fig. 1 is a schematic structural diagram of a high-speed connector in some technical solutions
  • Fig. 2 is a schematic structural diagram of a high-speed connector provided by an embodiment of the present application.
  • Fig. 3 is a schematic structural diagram of an insulating plastic provided by an embodiment of the present application.
  • Fig. 4 is a schematic diagram of the back structure of the insulating plastic provided by another embodiment of the present application.
  • Fig. 5 is a schematic structural diagram of a conductive plastic provided by an embodiment of the present application.
  • Fig. 6 is a schematic structural view of a conductive plastic provided in another embodiment of the present application.
  • Fig. 7 is a top view of a high-speed connector provided by another embodiment of the present application.
  • Fig. 8 is a schematic cross-sectional view of a high-speed connector provided by another embodiment of the present application.
  • Fig. 9 is an enlarged view of place A of Fig. 8.
  • Fig. 10 is a schematic diagram of the rear structure of a high-speed connector provided by another embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a first ground terminal provided by an embodiment of the present application.
  • Fig. 12 is a schematic structural diagram of a second ground terminal provided by an embodiment of the present application.
  • Fig. 13 is a schematic structural diagram of a signal terminal provided by an embodiment of the present application.
  • Fig. 14 is a schematic structural diagram of a high-speed connector provided by another embodiment of the present application.
  • Fig. 15 is a schematic structural diagram of a high-speed connector provided by another embodiment of the present application.
  • the conventional structure of the high-speed connector of the related technical solution is that various terminals are fixed on the same insulating part. Since the grounding terminal and the signal terminal are limited by the positions held on the insulating part, the signal between the terminals It is easy to be affected, and it is difficult to adjust the impedance, so that the transmission rate of the high-speed connector cannot be improved, resulting in poor results when detecting high-speed channels in high-speed link products. In actual product applications, the performance problems of high-speed channels cannot be thoroughly checked.
  • Embodiments of the present application provide a high-speed connector and communication equipment, which can improve electromagnetic field distribution, reduce impedance of signal terminals, and effectively increase transmission rate.
  • the embodiment of the first aspect of the present application provides a high-speed connector 100 , including insulating plastic 200 , conductive plastic 300 , grounding terminal 400 and signal terminal 500 , and conductive plastic 300 is connected to insulating plastic 200 , the conductive plastic 300 is provided with a protruding portion 310 ; the ground terminal 400 is provided on the conductive plastic 300 ; the signal terminal 500 is provided on the insulating plastic 200 , and the signal terminal 500 is coupled with the protruding portion 310 .
  • the electromagnetic field distribution can be improved, the insulating plastic 200 and the conductive plastic 300 are connected to each other to form a whole, and the ground terminal 400 is fixed through the conductive plastic 300 , can form a complete return ground, fix the signal terminal 500 through the insulating plastic 200, and the conductive plastic 300 is provided with a protruding part 310, and form a coupling with the signal terminal 500 through the protruding part 310, which can reduce the impedance of the signal terminal 500, effectively Increase transfer rate.
  • the embodiment of the present application separates the insulating plastic 200 from the conductive plastic 300 and connects the insulating plastic 200 to the signal terminal 500 .
  • the conductive plastic 300 is connected to the ground terminal 400, and the electromagnetic field distribution can be changed by adjusting the contact area and distance between the insulating plastic 200 and the conductive plastic 300, thereby effectively adjusting the impedance.
  • the conductive plastic 300 is provided with a protruding portion 310.
  • the transmission rate of the high-speed connector 100 of the embodiment can reach 112G PM4, which can meet the performance requirements of reflection loss and insertion loss, wherein the reflection loss is usually represented by SDD11, and the insertion loss is usually represented by SDD21.
  • the realization form of the protruding part 310 can also be additionally provided with metal parts on the conductive plastic 300. It can be understood that the protruding part 310, that is, a metal part, can also be The effect of forming a coupling between the protruding portion 310 and the signal terminal 500 is realized.
  • the high-speed connector 100 of the embodiment of the present application has the structural characteristics of miniaturization and thinning while increasing the transmission rate, and can perform online performance tests on the high-speed channels of high-speed link products in the field of communication and consumer electronics, for example
  • the high-speed connector 100 can be applied to all high-speed link products such as the chip side, the high-speed input/output (Input/Output, I/O) side, and the board-to-board (Board-to-Board, BtB) side.
  • the signal terminal 500 is connected to the serial/parallel conversion (Serializer/Deserializer, Serdes) pads are connected, and the performance of the high-speed channel of the PCB chip can be detected online.
  • the embodiment of the present application uses stamped terminals and injection-molded plastic parts to make the high-speed connector 100, which is conducive to improving production efficiency.
  • the conductive plastic 300 and insulating plastic 200 can be hot-melt connected or connected by metal parts. connect.
  • the protruding portion 310 is disposed opposite to the signal terminal 500 , and a distance 600 is formed between the protruding portion 310 and the signal terminal 500 .
  • the protruding portion 310 of the conductive plastic 300 close to the signal terminal 500, a certain distance 600 is formed between the protruding portion 310 and the signal terminal 500, and the protruding portion 310 is arranged opposite to the signal terminal 500, The impedance of the signal terminal 500 can be effectively reduced, the integrity of signal transmission can be improved, and the transmission rate can be increased.
  • the distance 600 is between 0.05 mm and 0.5 mm.
  • the embodiment of the present application adjusts the pitch 600 between 0.05mm and 0.5mm, which can effectively reduce the signal impedance of terminal 500.
  • the pitch 600 of the embodiment of the present application the larger the capacitance, and the lower the impedance.
  • the size of the pitch 600 can be adjusted according to the performance requirements of the high-speed connector 100, thereby effectively improving impedance.
  • the conductive plastic 300 is provided with a positioning groove 320 , and the ground terminal 400 is disposed in the positioning groove 320 .
  • the ground terminal 400 can be positioned by setting the positioning groove 320, so that the ground terminal 400 can be stably fixed on the conductive plastic 300, which is beneficial to improve the reliability of the connection between the ground terminal 400 and other devices.
  • a metal layer is provided on the surface of the conductive plastic 300, and a plurality of ground terminals 400 are provided, and the plurality of ground terminals 400 are connected to the metal layer.
  • insulating plastic parts are used for injection molding, and then the surface of the plastic parts is plated with a metal layer by means of electroplating, so that the entire conductive plastic 300 can conduct electricity.
  • the metal layer connection achieves the purpose of connecting all the ground terminals 400 in series, and can form a complete return ground, thereby reducing the impedance of the transmission link and improving the SI performance of the high-speed connector 100 .
  • the metal layer is a part of the conductive plastic 300 , and the conductive plastic 300 of the embodiment of the present application can be formed by electroplating the surface of the insulating plastic part.
  • the insulating plastic 200 is provided with a pair of differential signal terminals 500
  • the conductive plastic 300 is provided with multiple ground terminals 400
  • the multiple ground terminals 400 are connected to each other through the conductive plastic 300
  • the protruding portion 310 is coupled with the signal terminal 500, which can effectively increase the transmission rate.
  • the conductive plastic 300 is provided with a card position 330
  • the insulating plastic 200 is provided with a card slot 210 matching the card position 330 .
  • the mutual fixing of the conductive plastic 300 and the insulating plastic 200 is realized, thereby connecting them into a whole, which is beneficial to Improve the stability of the connection between the conductive plastic 300 and the insulating plastic 200 .
  • the locking position 330 can be a dovetail protrusion
  • the locking groove 210 can be a dovetail groove, which can further improve the strength of the connection structure.
  • the conductive plastic 300 is provided with a first cutout 340 , and the first cutout 340 and the protruding portion 310 are on the same end surface.
  • the first slit 340 extends toward the position of the ground terminal 400 , and the first slit 340 is on the same end surface as the protruding portion 310 , so that the conductive plastic 300 Forming a gap with the connection surface of the insulating plastic 200 is beneficial to improving the electromagnetic field distribution and reducing the impedance of the signal terminal 500 .
  • the transmission rate of the signal can be further improved.
  • first cutout 340 may be a right-angled cutout or a triangular cutout, as long as a gap can be formed, and the embodiment of the present application does not specifically limit the shape of the first cutout 340 .
  • the conductive plastic 300 is provided with a second cutout 350 , and the second cutout 350 is located at an outer corner of the conductive plastic 300 .
  • the second cutouts 350 are distributed at each corner outside the conductive plastic 300 , which can effectively improve the distribution of the electromagnetic field.
  • the shape of the second cutout 350 can be designed according to the actual situation, as long as it can ensure the formation of a bent structure at the corner.
  • a connecting portion 220 is disposed on the back of the insulating plastic 200 , and the connecting portion 220 is disposed in a groove outside the insulating plastic 200 .
  • the connecting part 220 is stably arranged in the groove outside the insulating plastic 200, and the connecting part 220 can be connected with other devices, which is beneficial to increase the number of high-speed connectors 100 and Combination with other devices.
  • the high-speed connector 100 when detecting the high-speed channel on the backside of the PCB chip through the high-speed connector 100, only the signal terminal 500 and the ground terminal 400 are used to connect the PCB chip, and the welding area is relatively small. This makes the connection between the high-speed connector 100 and the PCB chip more firm, and further increases the holding force between the high-speed connector 100 and the PCB chip.
  • connection part 220 is a metal sheet, which is beneficial to improve the reliability of use.
  • a positioning post 230 is provided on the back of the insulating plastic 200 .
  • the positioning column 230 is provided on the back of the insulating plastic 200 to serve as a positioning guide, so as to facilitate the connection of the high-speed connector 100 and other devices.
  • the PCB chip is provided with a positioning hole that matches the positioning column 230, and the high-speed connector 100 can be quickly connected by inserting the positioning column 230 into the positioning hole on the PCB chip. convenient.
  • the ground terminal 400 includes a first ground terminal 410 and a second ground terminal 420, and the two ends of the first ground terminal 410 are respectively provided with first The bent portion 411 and the first elastic portion 412 are provided with a second bent portion 421 at one end of the second ground terminal 420 .
  • two different types of ground terminals 400 are provided, which are the first ground terminal 410 and the second ground terminal 420 respectively, wherein the two ends of the first ground terminal 410 are respectively provided with a first bending part 411 and a second ground terminal.
  • the back side of the plastic 200 is used for connecting with the test board, for example, connecting with the back side of the PCB chip, and the first elastic part 412 is located on the front side of the insulating plastic 200 for easy connection with other devices.
  • the second ground terminals 420 are distributed outside the first ground terminals 410 , which is beneficial to reduce the impedance of the transmission link and improve the SI performance of the high-speed connector 100 .
  • the two ends of the signal terminal 500 are respectively provided with a third bending portion 510 and a second elastic portion 520 , so as to facilitate connection of the signal terminal 500 with other devices.
  • first ground terminal 410 may be provided on the conductive plastic 300, and multiple first ground terminals 410 are connected together through the conductive plastic 300 to form a complete return ground, which is beneficial to reduce The impedance of the transmission link.
  • the conductive plastic 300 is disposed inside the insulating plastic 200 .
  • the conductive plastic 300 and the insulating plastic 200 are connected to each other.
  • this structure can effectively improve the reliability of the high-speed connector 100 .
  • the conductive plastic 300 and the insulating plastic 200 can also be spliced together, for example, half of the high-speed connector 100 is made of insulating plastic 200, and the other half is made of conductive plastic 300, which are connected together by thermal fusion , can also achieve the effect of transmission rate reaching 112G PM4.
  • the shape of the conductive plastic 300 and the number of the ground terminals 400 can be adaptively adjusted according to actual production requirements, which are not specifically limited in this embodiment of the present application.
  • the embodiment of the present application also provides a communication device, including the high-speed connector 100 in the above embodiment.
  • a high-speed connector 100 is provided.
  • the high-speed connector 100 includes insulating plastic 200, conductive plastic 300, grounding terminal 400 and signal terminal 500.
  • the insulating plastic 200 and the conductive plastic 300 are connected to each other to form a whole.
  • the ground terminal 400 is fixed by the conductive plastic 300 to form a complete return ground.
  • the signal terminal 500 is fixed by the insulating plastic 200.
  • the conductive plastic 300 is provided with a protruding portion 310 , and the protruding portion 310 forms a coupling with the signal terminal 500 , which can reduce the impedance of the signal terminal 500 and effectively increase the transmission rate.
  • the embodiment of the present application includes: a high-speed connector and a communication device.
  • the high-speed connector includes insulating plastic, conductive plastic, grounding terminals and signal terminals, the conductive plastic is connected to the insulating plastic, and the conductive plastic is provided with a protrusion; the grounding terminal is arranged on the conductive plastic; the The signal terminal is arranged on the insulating plastic, and the signal terminal forms a coupling with the protruding part.
  • the signal terminal is fixed by insulating plastic, and the conductive plastic is provided with a protruding part, which forms a coupling with the signal terminal through the protruding part, which can reduce the impedance of the signal terminal and effectively increase the transmission rate.

Abstract

一种高速连接器(100)及通信设备，高速连接器(100)包括绝缘塑胶(200)、导电塑胶(300)、接地端子(400)和信号端子(500)，所述导电塑胶(300)与所述绝缘塑胶(200)连接，所述导电塑胶(300)设置有凸出部(310)；所述接地端子(400)设置于所述导电塑胶(300)；所述信号端子(500)设置于所述绝缘塑胶(200)，所述信号端子(500)与所述凸出部(310)形成耦合。

Description

高速连接器及通信设备
相关申请的交叉引用
本申请基于申请号为202111367142.8、申请日为2021年11月18日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本申请涉及通讯技术领域，尤其涉及一种高速连接器及通信设备。
背景技术
随着高速通讯的不断发展，对应用于通讯领域的高速链路产品的性能有了更高要求，通过将高速连接器与高速链路产品相连，可以实现整个系统的数据传输和交换，例如，高速连接器能够在线检测印刷电路板(Printed Circuit Board，PCB)上芯片高速通道的性能问题，相关的技术方案的高速连接器通过绝缘件固持端子，受限于端子固定位置的结构，难以调整传输链路的阻抗，影响信号传输的完整性，使得高速连接器的传输速率难以得到提升，在实际的产品应用时，不能彻底排查高速链路产品中高速通道的性能问题。
发明内容
本申请提出一种高速连接器及通信设备。
第一方面，本申请实施例提供一种高速连接器，包括绝缘塑胶、导电塑胶、接地端子和信号端子，所述导电塑胶与所述绝缘塑胶连接，所述导电塑胶设置有凸出部；所述接地端子设置于所述导电塑胶；所述信号端子设置于所述绝缘塑胶，所述信号端子与所述凸出部形成耦合。
第二方面，本申请实施例提供一种通信设备，包括本申请第一方面实施例所述的高速连接器。
本申请的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本申请而了解。本申请的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本申请技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本申请的技术方案，并不构成对本申请技术方案的限制。
下面结合附图和实施例对本申请进一步地说明；
图1是一些技术方案中一种高速连接器的结构示意图；
图2是本申请的一个实施例提供的高速连接器的结构示意图；
图3是本申请的一个实施例提供的绝缘塑胶的结构示意图；
图4是本申请的另一个实施例提供的绝缘塑胶的背面结构示意图；
图5是本申请的一个实施例提供的导电塑胶的结构示意图；
图6是本申请的另一个实施例提供的导电塑胶的结构示意图；
图7是本申请的另一个实施例提供的高速连接器的俯视图；
图8是本申请的另一个实施例提供的高速连接器的截面示意图；
图9是图8的A处放大图；
图10是本申请的另一个实施例提供的高速连接器的背面结构示意图；
图11是本申请的一个实施例提供的第一接地端子的结构示意图；
图12是本申请的一个实施例提供的第二接地端子的结构示意图；
图13是本申请的一个实施例提供的信号端子的结构示意图；
图14是本申请的另一个实施例提供的高速连接器的结构示意图；
图15是本申请的另一个实施例提供的高速连接器的结构示意图。
具体实施方式
本部分将详细描述本申请的具体实施例，本申请之较佳实施例在附图中示出，附图的作用在于用图形补充说明书文字部分的描述，使人能够直观地、形象地理解本申请的每个技术特征和整体技术方案，但其不能理解为对本申请保护范围的限制。
在本申请的描述中，若干的含义是一个或者多个，多个的含义是两个以上，大于、小于、超过等理解为不包括本数，以上、以下、以内等理解为包括本数。如果有描述到第一、第二只是用于区分技术特征为目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。
本申请的描述中，除非另有明确的限定，设置、安装、连接等词语应做广义理解，所属技术领域技术人员可以结合技术方案的具体内容合理确定上述词语在本申请中的具体含义。
下面结合附图，对本申请实施例作进一步阐述。
如图1所示，相关的技术方案的高速连接器常规结构为各种端子均固定于同一绝缘零件上，由于接地端子和信号端子受限于固持在绝缘零件上的位置，端子之间的信号容易受到影响，难以调整阻抗，致使高速连接器的传输速率无法得到提升，导致在检测高速链路产品中高速通道时效果不佳，在实际的产品应用时，不能彻底排查高速通道的性能问题。
本申请实施例提供一种高速连接器及通信设备，能够改善电磁场分布，降低信号端子的阻抗，有效地提高传输速率。
如图2至图6所示，本申请的第一方面实施例提供一种高速连接器100，包括绝缘塑胶200、导电塑胶300、接地端子400和信号端子500，导电塑胶300与绝缘塑胶200连接，导电塑胶300设置有凸出部310；接地端子400设置于导电塑胶300；信号端子500设置于绝缘塑胶200，信号端子500与凸出部310形成耦合。
在本实施例中，通过将高速连接器100分成绝缘塑胶200和导电塑胶300两部分，能够改善电磁场分布，绝缘塑胶200和导电塑胶300相互连接以形成一个整体，通过导电塑胶300固定接地端子400，能够形成完整的回流地，通过绝缘塑胶200固定信号端子500，且导电塑胶300设置有凸出部310，通过凸出部310与信号端子500形成耦合，可以降低信号端子500的阻抗，有效地提高传输速率。
需要说明的是，区别于一些技术方案中将信号端子和接地端子均设置于绝缘塑胶上的方 案，本申请实施例通过将绝缘塑胶200和导电塑胶300分开，绝缘塑胶200和信号端子500连接，导电塑胶300和接地端子400连接，能够通过调整绝缘塑胶200和导电塑胶300之间的接触面积和间距，改变电磁场分布，从而有效地调整阻抗，另外，导电塑胶300设置有凸出部310，通过在导电塑胶300上相应的特征点增加凸筋结构，使得凸出部310与信号端子500形成耦合，能够进一步改善阻抗，从而改善信号端子500的传输性能，有利于提升信号传输的质量，本申请实施例的高速连接器100的传输速率能够达到112G PM4，可以满足反射损耗和插入损耗的性能要求，其中，反射损耗通常用SDD11表示，插入损耗通常用SDD21表示。
需要说明的是，凸出部310的实现形式除了在导电塑胶300上增加凸筋结构，还可以在导电塑胶300上额外设置金属零件，可以理解的是，凸出部310即金属零件，同样能够实现凸出部310与信号端子500形成耦合的效果。
本申请实施例的高速连接器100在提高传输速率的同时，具有体积小型化，薄型化的结构特点，能够对通讯领域和消费类电子领域的高速链路产品的高速通道进行在线性能测试，例如可以将高速连接器100应用于芯片侧，高速输入/输出(Input/Output，I/O)侧，板对板(Board-to-Board,BtB)侧等所有高速链路产品。若高速连接器100用于测试PCB芯片背侧通道的性能，通过将接地端子400与PCB芯片上的接地焊盘相连接，将信号端子500与PCB芯片上的串/并转换(Serializer/Deserializer，Serdes)焊盘相连接，能够在线检测PCB芯片的高速通道的性能。
需要说明的是，本申请实施例采用冲压成型的端子和注塑的塑胶零件制成高速连接器100，有利于提高生产效率，导电塑胶300和绝缘塑胶200之间可以为热熔连接或通过金属零件连接。
如图2、图7至图9所示，在上述的高速连接器100中，凸出部310与信号端子500相对设置，凸出部310与信号端子500之间形成间距600。
在本实施例中，通过令导电塑胶300的凸出部310靠近信号端子500，凸出部310与信号端子500之间形成一定的间距600，并令凸出部310与信号端子500相对设置，能够有效地降低信号端子500的阻抗，改善信号传输的完整性，提高传输速率。
如图2、图8和图9所示，在上述的高速连接器100中，间距600的大小在0.05mm-0.5mm之间。
在本实施例中，通过调整凸出部310与信号端子500之间的间距600，即调整绝缘塑胶200和导电塑胶300之间的相对位置，能够改善电磁场分布，便于调整阻抗。需要说明的是，若间距600为0，会造成短路的情况，本申请实施例为了保证高速连接器100的传输速率，将间距600大小调整在0.05mm至0.5mm之间，能够有效地降低信号端子500的阻抗。参照电容的工作原理，本申请实施例的间距600越小，电容越大，则阻抗越低，在具体实施过程中，可以根据高速连接器100的性能要求调整间距600的大小，从而有效地改善阻抗。
如图5和图6所示，在上述的高速连接器100中，导电塑胶300设置有定位槽320，接地端子400设置于定位槽320。
在本实施例中，通过设置定位槽320，能够对接地端子400进行定位，使得接地端子400能够稳定固定于导电塑胶300上，有利于提高接地端子400与其它设备连接的可靠性。
在上述的高速连接器100中，导电塑胶300的表面设置有金属层，接地端子400设置有多个，多个接地端子400与金属层连接。
在本实施例中，采用绝缘的塑胶零件注塑成型，再通过电镀的方式使塑胶零件的表面镀上一层金属层，从而可以实现整个导电塑胶300导电的效果，通过令多个接地端子400与金属层连接，实现所有的接地端子400串联在一起的目的，能够形成完整的回流地，从而降低传输链路的阻抗，改善高速连接器100的SI性能。需要说明的是，金属层属于导电塑胶300的一部分，通过对绝缘塑胶零件采用表面电镀的方式，能够形成本申请实施例的导电塑胶300。
具体地，如图2和图7所示，在一实施例中绝缘塑胶200设置有一对差分信号端子500，导电塑胶300设置有多个接地端子400，多个接地端子400通过导电塑胶300相互连通，且凸出部310与信号端子500产生耦合，能够有效地提高传输速率。
如图3、图6和图7所示，在上述的高速连接器100中，导电塑胶300设置有卡位330，绝缘塑胶200设置有与卡位330相匹配的卡槽210。
在本实施例中，通过在导电塑胶300设置卡位330，将卡位330嵌入绝缘塑胶200上的卡槽210，实现导电塑胶300和绝缘塑胶200的相互固定，从而连接成一个整体，有利于提高导电塑胶300和绝缘塑胶200连接的稳定性。需要说明的是，卡位330可以为燕尾凸块，卡槽210可以为燕尾槽，能够进一步提高连接结构的强度。
如图5和图10所示，在上述的高速连接器100中，导电塑胶300设置有第一切口340，第一切口340与凸出部310处于同一端面。
在本实施例中，通过在导电塑胶300设置第一切口340，第一切口340朝向接地端子400的位置延伸，第一切口340与凸出部310处于同一端面，从而在导电塑胶300和绝缘塑胶200的连接面形成间隙，有利于改善电磁场分布，降低信号端子500的阻抗。此外，通过在凸出部310的左右两侧均设置有第一切口340，能够进一步改善信号的传输速率。
需要说明的是，第一切口340可以为直角切口或三角切口，只要能形成间隙即可，本申请实施例不对第一切口340的形状作具体限制。
如图5和图6所示，在上述的高速连接器100中，导电塑胶300设置有第二切口350，第二切口350位于导电塑胶300的外侧转角处。
在本实施例中，通过设置第二切口350，第二切口350分布于导电塑胶300外侧的各个转角处，能够有效地改善电磁场的分布。第二切口350的形状可根据实际情况设计，只有能保证在转角处形成弯折结构即可。
如图4和图10所示，在上述的高速连接器100中，绝缘塑胶200的背面设置有连接部220，连接部220设置于绝缘塑胶200外侧的凹槽内。
在本实施例中，通过在绝缘塑胶200的背面设置连接部220，连接部220稳定设置在绝缘塑胶200外侧的凹槽内，连接部220能够与其它设备连接，有利于增加高速连接器100和其它设备的结合力。
例如，通过高速连接器100检测PCB芯片背侧高速通道时，仅靠信号端子500和接地端子400连接PCB芯片，焊接面积较小，通过在高速连接器100的外侧设置多个连接部220，可以使得高速连接器100与PCB芯片连接更加牢固，进一步增加高速连接器100和PCB芯片的固持力。
需要说明的是，连接部220为金属片，有利于提高使用的可靠性。
如图4和图10所示，，在上述的高速连接器100中，绝缘塑胶200的背面设置有定位柱230。
在本实施例中，通过在绝缘塑胶200的背面设置定位柱230，起到定位导向作用，方便将高速连接器100和其它设备连接在一起。以高速连接器100与PCB芯片连接为例，PCB芯片上设置有与定位柱230相匹配的定位孔，通过将定位柱230嵌入PCB芯片上的定位孔，即可快速连接高速连接器100，操作方便。
如图2、图10至图12所示，在上述的高速连接器100中，接地端子400包括第一接地端子410和第二接地端子420，第一接地端子410的两端分别设置有第一弯折部411和第一弹性部412，第二接地端子420的一端设置有第二弯折部421。
在本实施例中，设置有两种不同类型的接地端子400，分别为第一接地端子410和第二接地端子420，其中第一接地端子410的两端分别设置第一弯折部411和第一弹性部412，第一接地端子410的两端均需与其他设备连接，第二接地端子420的一端设置第二弯折部421，第一弯折部411和第二弯折部421位于绝缘塑胶200的背面，用于与测试板连接，例如与PCB芯片的背侧连接，第一弹性部412位于绝缘塑胶200的正面，便于与其他设备相连。
如图2和图10所示，在一实施例中，第二接地端子420分布在第一接地端子410外侧，有利于降低传输链路的阻抗，改善高速连接器100的SI性能。
如图13所示，需要说明的是，信号端子500的两端分别设置有第三弯折部510和第二弹性部520，便于信号端子500与其他设备连接。
如图14所示，需要说明的是，导电塑胶300上可以仅设置有第一接地端子410，多个第一接地端子410通过导电塑胶300连接在一起，能够形成完整的回流地，有利于降低传输链路的阻抗。
如图2或图14所示，在上述的高速连接器100中，导电塑胶300设置于绝缘塑胶200的内部。
在本实施例中，导电塑胶300和绝缘塑胶200相互连接，通过将导电塑胶300放置在绝缘塑胶200的内部，此种结构能够有效地提升高速连接器100的可靠性。
如图15所示，需要说明的是，导电塑胶300和绝缘塑胶200还可以为相互拼接的结构，例如高速连接器100一半为绝缘塑胶200，另一半为导电塑胶300，通过热熔连接在一起，同样能够实现传输速率达到112G PM4的效果。
需要说明的是，导电塑胶300的形状和接地端子400的数量可根据实际生产需求作适应性调整，本申请实施例不作具体限制。
本申请的实施例还提供一种通信设备，包括如上实施例的高速连接器100。
在本实施例提供的通信设备中，设置有高速连接器100，高速连接器100包括有绝缘塑胶200、导电塑胶300、接地端子400和信号端子500，通过将高速连接器100分成绝缘塑胶200和导电塑胶300两部分，能够改善电磁场分布，绝缘塑胶200和导电塑胶300相互连接以形成一个整体，通过导电塑胶300固定接地端子400，能够形成完整的回流地，通过绝缘塑胶200固定信号端子500，且导电塑胶300设置有凸出部310，通过凸出部310与信号端子500形成耦合，可以降低信号端子500的阻抗，有效地提高传输速率。
本申请实施例包括：高速连接器及通信设备。高速连接器包括绝缘塑胶、导电塑胶、接地端子和信号端子，所述导电塑胶与所述绝缘塑胶连接，所述导电塑胶设置有凸出部；所述接地端子设置于所述导电塑胶；所述信号端子设置于所述绝缘塑胶，所述信号端子与所述凸出部形成耦合。根据本申请实施例提供的方案，通过将高速连接器分成绝缘塑胶和导电塑胶 两部分，能够改善电磁场分布，绝缘塑胶和导电塑胶相互连接以形成一个整体，通过导电塑胶固定接地端子，能够形成完整的回流地，通过绝缘塑胶固定信号端子，且导电塑胶设置有凸出部，通过凸出部与信号端子形成耦合，可以降低信号端子的阻抗，有效地提高传输速率。
上面结合附图对本申请实施例作了详细说明，但是本申请不限于上述实施例，在所述技术领域普通技术人员所具备的知识范围内，还可以在不脱离本申请宗旨的前提下作出各种变化。

Claims (13)

  1. 一种高速连接器，包括：
    绝缘塑胶；
    导电塑胶，所述导电塑胶与所述绝缘塑胶连接，所述导电塑胶设置有凸出部；
    接地端子，所述接地端子设置于所述导电塑胶；
    信号端子，所述信号端子设置于所述绝缘塑胶，所述信号端子与所述凸出部形成耦合。
  2. 根据权利要求1所述的高速连接器，其中，所述凸出部与所述信号端子相对设置，所述凸出部与所述信号端子之间形成间距。
  3. 根据权利要求2所述的高速连接器，其中，所述间距的大小在0.05mm-0.5mm之间。
  4. 根据权利要求1所述的高速连接器，其中，所述导电塑胶设置有定位槽，所述接地端子设置于所述定位槽。
  5. 根据权利要求1所述的高速连接器，其中，所述导电塑胶的表面设置有金属层，所述接地端子设置有多个，多个所述接地端子与所述金属层连接。
  6. 根据权利要求1所述的高速连接器，其中，所述导电塑胶设置有卡位，所述绝缘塑胶设置有与所述卡位相匹配的卡槽。
  7. 根据权利要求2所述的高速连接器，其中，所述导电塑胶设置有第一切口，所述第一切口与所述凸出部处于同一端面。
  8. 根据权利要求1所述的高速连接器，其中，所述导电塑胶设置有第二切口，所述第二切口位于所述导电塑胶的外侧转角处。
  9. 根据权利要求1所述的高速连接器，其中，所述绝缘塑胶的背面设置有连接部，所述连接部设置于所述绝缘塑胶外侧的凹槽内。
  10. 根据权利要求1所述的高速连接器，其中，所述绝缘塑胶的背面设置有定位柱。
  11. 根据权利要求1所述的高速连接器，其中，所述接地端子包括第一接地端子和第二接地端子，所述第一接地端子的两端分别设置有第一弯折部和第一弹性部，所述第二接地端子的一端设置有第二弯折部。
  12. 根据权利要求1所述的高速连接器，其中，所述导电塑胶设置于所述绝缘塑胶的内部。
  13. 一种通信设备，包括权利要求1至12任意一项所述的高速连接器。
PCT/CN2022/080738 2021-11-18 2022-03-14 高速连接器及通信设备 WO2023087580A1 (zh)

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CN202585857U (zh) * 2011-12-31 2012-12-05 安费诺东亚电子科技(深圳)有限公司 高速连接器
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