WO2023083001A1 - 用于冷藏冷冻装置门体的密封梁 - Google Patents

用于冷藏冷冻装置门体的密封梁 Download PDF

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Publication number
WO2023083001A1
WO2023083001A1 PCT/CN2022/127705 CN2022127705W WO2023083001A1 WO 2023083001 A1 WO2023083001 A1 WO 2023083001A1 CN 2022127705 W CN2022127705 W CN 2022127705W WO 2023083001 A1 WO2023083001 A1 WO 2023083001A1
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WIPO (PCT)
Prior art keywords
semiconductor module
housing
casing
sealing
heat exchange
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PCT/CN2022/127705
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English (en)
French (fr)
Inventor
张纯
吕鹏
赵晓军
张�浩
孟亮
Original Assignee
青岛海尔电冰箱有限公司
海尔智家股份有限公司
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Application filed by 青岛海尔电冰箱有限公司, 海尔智家股份有限公司 filed Critical 青岛海尔电冰箱有限公司
Publication of WO2023083001A1 publication Critical patent/WO2023083001A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/04—Preventing the formation of frost or condensate
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/02—Doors; Covers

Definitions

  • the invention relates to the technical field of refrigeration and storage, in particular to a sealing beam used for a door body of a refrigeration and freezing device.
  • refrigerators, freezers and other refrigeration and freezing devices have become a necessity in family life.
  • Most of the ingredients in the refrigerator are stored inside the refrigerator.
  • French door refrigerators are a popular refrigerator product.
  • French side-by-side refrigerators are usually designed with a vertical beam between its two refrigerated doors.
  • the presence of this vertical beam will facilitate the lapping and sealing of the door seal between the two refrigerated doors.
  • the vertical beam can also be called a seal. beam.
  • the surface temperature of the refrigerator is relatively low during normal cooling, and condensation is prone to occur, which affects the appearance of the refrigerator and affects the user's sense of use. Therefore, in existing refrigerator products, the problem of condensation on the front surface of the vertical beam has always been a difficult problem to be solved, which affects user experience.
  • refrigerators are often equipped with heating wires to heat up and prevent condensation. However, when the heating wires heat the surface temperature of the vertical beams, the temperature difference here will increase, which will increase the loss of cooling capacity in the refrigerator compartment.
  • the existing sealing beam structure is relatively complicated.
  • the present invention is proposed in order to provide a sealing beam for the door body of a refrigerator-freezer that overcomes the above-mentioned problems or at least partially solves the above-mentioned problems, which can reduce the storage of refrigerator-freezers while improving the condensation problem.
  • the cooling capacity in the compartment is lost, and the structure is simple.
  • the present invention provides a sealing beam for the door body of a refrigerating and freezing device, which includes:
  • the casing has an accommodating space with an opening facing forward and extending along the length direction of the casing;
  • a semiconductor module has a cooling surface and a heating surface, the semiconductor module is installed in the accommodation space; and the heating surface of the semiconductor module is arranged at the opening of the accommodation space to form the front of the sealing beam Part or all of the surface; the cooling surface of the semiconductor module is thermally connected to the rear wall of the housing.
  • the sealing beam also includes:
  • a heat conduction device is arranged between the cooling surface of the semiconductor module and the rear wall of the housing, so that the rear wall of the housing can exchange heat with the cooling surface.
  • the heat conduction device includes:
  • the first heat exchange plate is in contact with the cooling surface
  • connection plates respectively extending from two edges of the first heat exchange plate extending along the length direction of the casing to a direction away from the semiconductor module;
  • the second heat exchange plate is in contact with the rear wall of the casing; the second heat exchange plate connects the two connecting plates.
  • the second heat exchange plate includes two plate parts, and each of the plate parts extends from an edge of one of the connection plates away from the first heat exchange plate to the other of the connection plates;
  • the sealing beam also includes a guide assembly
  • the guide assembly is arranged at one end of the space between the first heat exchange plate and the second heat exchange plate; or, an installation space is provided outside one end of the housing, and the guide assembly is arranged on the installation space.
  • a heat insulating device is provided between the rear side of the semiconductor module and the housing to fill the space between the rear side of the semiconductor module and the housing except for the heat conducting device.
  • the sealing beam further includes two sealing gaskets, which are respectively arranged at both ends of the semiconductor module, and each of the sealing gaskets is arranged between one end surface of the semiconductor module and the housing. between.
  • each of the sealing pads extends beyond the blocking piece in a direction away from the other sealing pad.
  • the heat conduction device includes a plurality of heat conduction fins, each of the heat conduction fins is perpendicular to the cooling surface of the semiconductor module, and is in contact with or fixedly connected to the cooling surface of the semiconductor module, and is connected to the cooling surface of the semiconductor module.
  • the rear wall of the housing is contacted against or fixedly connected.
  • the sealing beam further includes a rotating shaft sleeve assembly, and the rotating shaft sleeve assembly is installed on the housing;
  • the housing includes a rear case with an opening facing forward and a front frame, the front frame is installed at the opening of the rear case, and the semiconductor module is installed in the front frame;
  • the heating surface of the semiconductor module is a continuously extending surface, and the casing is made of plastic.
  • the sealing beam used for the door body of the refrigerating and freezing device of the present invention the characteristics of the semiconductor module heating on one side and cooling on the other side are utilized, and the hot end face of the semiconductor module is directly used as the front surface of the sealing beam to prevent the air in the room from being on the surface of the sealing beam. Condensation; at the same time, the cold end of the semiconductor module is thermally connected to the inner surface of the housing facing the refrigeration compartment to assist cooling, which can reduce the loss of cooling capacity in the storage compartment while improving the condensation problem of the sealed beam. That is, the sealing beam can compensate for the loss of cooling near the sealing beam when the traditional heating wire prevents condensation, and better maintain the indoor temperature of the storage room.
  • the semiconductor refrigerating sheet of the semiconductor module heats and cools at the same time, and its heating capacity is higher than the cooling capacity.
  • the heating surface of the semiconductor module is directly used as the front surface of the sealing beam, which is especially suitable for solving the condensation problem of the sealing beam, and has high condensation removal efficiency and good effect; in addition It also has the characteristics of high energy density, no noise, and small size, which can make the thickness of the sealing beam smaller, and has a higher ability to solve the problem of condensation on the front surface.
  • the heating surface of the semiconductor module is directly used as the front surface of the sealing beam, which is convenient for installation and manufacture, and there is no need to specially arrange a protective surface, a protective cover, etc. on the front side of the semiconductor module.
  • the guide assembly and the heat insulation device are arranged at special positions of the heat conduction device, which can make full use of the space without affecting the cooling capacity of the corresponding storage compartment.
  • the heat insulation device can be a foam piece, that is, a foam piece, which is arranged between the first heat exchange plate and the second heat exchange plate, and can prevent heat exchange between the inner and outer surfaces of the sealing beam, and can also be a semiconductor module and/or
  • the guide assembly and the like provide an installation positioning structure.
  • the sealing beam of the present invention also has a sealing gasket, which can reduce the heat exchange caused by the fit gap between the semiconductor module and the casing.
  • Fig. 1 is a schematic structural diagram of a sealed beam according to an embodiment of the present invention
  • Fig. 2 is a schematic structural diagram of another viewing angle of the sealing beam shown in Fig. 1;
  • Fig. 3 is a schematic exploded view of the sealing beam shown in Fig. 1;
  • Fig. 4 is a schematic partial structural diagram of the sealing beam shown in Fig. 1;
  • Fig. 5 is a schematic structural diagram of the heat conduction device in the sealed beam shown in Fig. 1;
  • Fig. 6 is a schematic structural diagram of a sealed beam according to an embodiment of the present invention.
  • Fig. 7 is a schematic structural diagram of another viewing angle of the sealing beam shown in Fig. 6;
  • Fig. 8 is a schematic exploded view of the sealing beam shown in Fig. 6;
  • Fig. 9 is a schematic structural view of the sealing gasket and the blocking piece in the sealing beam shown in Fig. 6 .
  • the refrigerating and freezing device of the present invention includes a box body, and one or more storage compartments are defined in the box body. Further, the refrigerating and freezing device further includes at least one door/cover for opening and closing the above-mentioned several storage compartments.
  • the refrigerator-freezer also includes a refrigeration system, which may be a compression refrigeration system for cooling each storage compartment.
  • a compressor refrigeration system may include a compressor, a condenser, a throttling element, and an evaporator connected in series.
  • the refrigerating and freezing device can be an air-cooled refrigerating and freezing device, and the evaporator can be arranged in the cooling chamber of the box body, so as to provide cold energy to the storage compartment through the air duct assembly and the fan.
  • the air duct assembly has a supply air path and a return air path, and the fan is configured to cause the gas in the storage room to enter the cooling room from the return air path, exchange heat with the evaporator, and enter the storage room through the air supply path. room.
  • the refrigerating-freezing device may be a direct-cooling refrigerating-freezing device.
  • the refrigeration system may be another type of refrigeration system such as a semiconductor refrigeration system.
  • the refrigerating and freezing device may be a refrigerator, a freezer, a freezer, and the like.
  • the compressor compresses the vaporized refrigerant into a high-temperature and high-pressure gas, and then discharges it from the exhaust port of the compressor.
  • the inlet of the condenser is connected to the exhaust port of the compressor.
  • the high-temperature and high-pressure gaseous refrigerant flows through the condenser, and gradually condenses into a high-pressure liquid during the process of radiating heat to the outside.
  • the inlet of the throttling element is connected to the outlet of the condenser.
  • the pressure decreases and becomes a gas-liquid mixture, and then enters the evaporator to absorb the heat in the gas to vaporize, and then returns to the compressor.
  • the fan makes the airflow flow between the storage compartment and the cooling compartment, so that the temperature in the storage compartment is reduced.
  • two doors are arranged on the front side of the box body of the refrigerating and freezing device, and the two doors are arranged oppositely, and the rear side of each door body has a storage compartment, or the two doors
  • the body is used to close a storage compartment.
  • a sealing beam also called a vertical beam
  • the sealing beam can be arranged on a door body.
  • the sealing beam can be arranged vertically, arranged horizontally and extending along the front-to-back direction, or arranged horizontally and extending along the left-right direction, or it can be arranged in other forms.
  • a sealing beam may also be arranged between the door body and the frame at the opening of the storage compartment.
  • Fig. 1 is a schematic structural diagram of a refrigerating and freezing device according to an embodiment of the present invention. As shown in FIG. 1 and with reference to FIGS. 2 to 9 , an embodiment of the present invention provides a sealing beam for a door body of a refrigerating and freezing device.
  • the sealing beam includes a housing 10 and a semiconductor module 20 .
  • the housing 10 has a receiving space with an opening facing forward and extending along the length direction of the housing 10 .
  • the semiconductor module 20 has a cooling surface and a heating surface, and the semiconductor module 20 is installed in the accommodation space.
  • the heating surface of the semiconductor module 20 is arranged at the opening of the accommodating space to form part or all of the front surface of the sealing beam, that is to say, the heating surface of the semiconductor module 20 is a continuously extending surface.
  • the heating surface directly closes the opening of the casing 10 to form the front surface of the sealing beam.
  • the cooling surface of the semiconductor module 20 is thermally connected to the rear wall of the housing 10 .
  • the characteristics of the semiconductor module 20 being heated on one side and cooled on the other side are utilized, and the hot end face of the semiconductor module 20 is directly used as the front surface of the sealed beam to prevent the air in the room from condensing on the surface of the sealed beam; at the same time
  • the cold end of the semiconductor module 20 is thermally connected to the inner surface of the housing 10 facing the cooling compartment to assist cooling, which can reduce the loss of cooling capacity in the storage compartment while improving the problem of condensation on the sealing beam.
  • the casing 10 has an accommodating space extending along the length direction of the casing 10, and the semiconductor module 20 is installed as a whole, which is convenient to install, compact in structure and low in cost.
  • the semiconductor refrigerating sheet of the semiconductor module 20 heats and cools at the same time, and its heating capacity is higher than the cooling capacity.
  • the heating surface of the semiconductor module 20 is directly used as the front surface of the sealing beam, which is especially suitable for solving the condensation problem of the sealing beam, and has high condensation removal efficiency and good effect ; In addition, it also has the characteristics of high energy density, no noise, and small size, which can make the thickness of the sealing beam smaller, and has a higher ability to solve the problem of condensation on the front surface.
  • the cooling surface and the heating surface of the semiconductor module 20 are both continuously extending surfaces, which can also be understood as having no holes or other structures on the cooling surface and the heating surface.
  • the sealing beam further includes a heat conduction device 30, and the heat conduction device 30 is arranged between the cooling surface of the semiconductor module 20 and the rear wall of the housing 10, so that the housing The rear wall of the body 10 exchanges heat with the cooling surface.
  • the cooling surface of the semiconductor module 20 is in contact with the rear wall of the casing 10, so that the rear wall of the casing 10 can exchange heat with the cooling surface.
  • a heat insulating device 60 is provided between the side of the semiconductor module 20 facing the heat conducting device 30 and the housing 10 to fill the gap between the side of the semiconductor module 20 facing the heat conducting device 30 and the housing 10. Part or all of the space outside the heat conduction device 30 .
  • the heat insulation device 60 can be formed by foaming, and the heat insulation device 60 can be called a foaming part, a foam part, an insulating layer, and the like.
  • the heat conduction device 30 includes a first heat exchange plate 31 , a second heat exchange plate 32 and two connecting plates 33 .
  • the first heat exchange plate 31 is in contact with the cooling surface.
  • the two connection plates 33 respectively extend from two edges of the first heat exchange plate 31 extending along the length direction of the casing 10 to a direction away from the semiconductor module 20 .
  • the second heat exchange plate 32 is in contact with the rear wall of the casing 10 .
  • the second heat exchange plate 32 connects the two connection plates 33 .
  • the heat conduction device 30 can be bent into shape.
  • the second heat exchange plate 32 includes two plate parts, and each plate part extends from the edge of one connecting plate 33 away from the first heat exchanging plate 31 to the other connecting plate 33. extend. There is a gap extending along the length direction of the housing 10 between the two plate portions.
  • the casing 10 is made of plastic. As shown in FIGS. 6 to 9 , the casing 10 includes a rear case 12 with an opening facing forward and a front frame 11 , the front frame 11 is installed at the opening of the rear case 12 , and the semiconductor module 20 is installed in the front frame 11 .
  • the housing 10 is integrally formed. Both the two connection plates 33 and the second heat exchange plate 32 are in contact with the inner surface of the rear shell 12, which can increase the cold parts of the rear shell 12 and further prevent the leakage of cold energy in the storage compartment.
  • the cooling surface of the semiconductor module 20 is bonded to the heat conduction device 30 through heat conduction silica gel, or is mechanically fixed to the heat conduction device 30 through a fixing structure.
  • the fixing structural parts can be screws, clamping parts and the like.
  • the sealing beam further includes a guide assembly 40. As shown in FIG. 10 is provided with a hole through which the guide assembly 40 passes.
  • the heat insulation device 60 may also be disposed between the first heat exchange plate 31 and the second heat exchange plate 32 .
  • the guide assembly 40 and the heat insulating device 60 are arranged at special positions of the heat conduction device 30 to make full use of the space without affecting the cooling capacity of the corresponding storage compartment.
  • the heat insulation device 60 can be a foam piece, that is, a foam piece, which is arranged between the first heat exchange plate 31 and the second heat exchange plate 32 to prevent heat exchange between the inner and outer surfaces of the sealing beam.
  • the sealing beam also includes a shaft sleeve assembly 50 installed on the casing 10 .
  • an installation space is provided outside one end of the housing 10, and the guide assembly 40 is provided in the installation space. That is to say, the guide assembly 40 is completely disposed on the casing 10 .
  • FIGS. Between one end end face of and the housing 10 . Further, a blocking piece 16 extends from the front edge of each sealing gasket 15 in a direction away from the other sealing gasket 15 , and the blocking piece 16 can be attached to the front surface of the housing 10 .
  • the gasket 15 can reduce the heat exchange caused by the fit gap between the casing 10 and the semiconductor module 20 .
  • the rotating shaft sleeve assembly 50 may include a shaft sleeve and a torsion spring.
  • the corresponding door body is provided with a rotating shaft, and the rotating shaft is inserted into the shaft sleeve. on the corresponding gate.
  • the guide assembly 40 may include a spring and a guide member, the guide member is telescopically arranged, and the spring is used for the guide member to extend out of the casing 10 .
  • the top wall of the storage compartment is provided with a guide groove with the opening facing downward.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

一种用于冷藏冷冻装置门体的密封梁。密封梁包括壳体和半导体模块。壳体具有开口朝前且沿壳体的长度方向延伸的容纳空间。半导体模块具有制冷面和制热面，半导体模块安装于容纳空间内。且半导体模块的制热面设置于容纳空间的开口处，以形成密封梁的前表面的部分或全部。半导体模块的制冷面与壳体的后壁热连接。利用半导体模块一面制热一面制冷的特性，将半导体模块的热端端面直接作为密封梁的前表面，安装方便，结构紧凑，成本低，且防止房间内的空气在密封梁表面凝露；同时辅助制冷，能够在改善密封梁凝露问题的同时，减少储物间室内的制冷量流失。

Description

用于冷藏冷冻装置门体的密封梁 技术领域
本发明涉及制冷储物技术领域，特别是涉及一种用于冷藏冷冻装置门体的密封梁。
背景技术
随着科技的发展、社会经济的发展以及人们生活水平的提高，高生活质量成了用户的必备需求，特别地冰箱、冷柜等冷藏冷冻装置已经成为家庭生活中的必需品，用户往往会将家庭中的大多数食材存储于冰箱内部。例如，法式对开门电冰箱是人们喜爱的冰箱产品。
法式对开门电冰箱通常在其两扇冷藏门之间会设计一个竖梁，该竖梁的存在会便于两扇冷藏门之间的门封的搭接和密封，竖梁也可被称为密封梁。冰箱在正常制冷时其表面温度比较低，容易产生凝露，影响冰箱美观且影响用户使用感。因此，在现有的冰箱产品中，竖梁前表面的凝露问题一直是函待解决的难题，影响用户体验。为了解决这一问题，冰箱上往往配有加热丝进行升温防凝露，但是加热丝加热竖梁外表温度的同时，此处因温差升大，会加剧冰箱间室在此处的冷量流失。而且，现有的密封梁结构比较复杂。
发明内容
鉴于上述问题，提出了本发明以便提供一种克服上述问题或者至少部分地解决上述问题的用于冷藏冷冻装置门体的密封梁，能够在改善凝露问题的同时，减少冷藏冷冻装置的储物间室内的制冷量流失，且结构简单。
具体地，本发明提供了一种用于冷藏冷冻装置门体的密封梁，其包括：
壳体，所述壳体具有开口朝前且沿所述壳体的长度方向延伸的容纳空间；
半导体模块，具有制冷面和制热面，所述半导体模块安装于所述容纳空间内；且所述半导体模块的制热面设置于所述容纳空间的开口处，以形成所述密封梁的前表面的部分或全部；所述半导体模块的制冷面与所述壳体的后壁热连接。
可选地，所述密封梁还包括：
导热装置，所述导热装置设置于所述半导体模块的制冷面与所述壳体的 后壁之间，以使所述壳体的后壁与所述制冷面进行热交换。
可选地，所述导热装置包括：
第一换热板，所述第一换热板与所述制冷面接触抵靠；
两个连接板，分别从所述第一换热板的两个沿所述壳体的长度方向延伸的边缘向远离所述半导体模块的方向延伸；和
第二换热板，所述第二换热板与所述壳体的后壁接触抵靠；所述第二换热板连接两个所述连接板。
可选地，所述第二换热板包括两个板部，每个所述板部从一个所述连接板的远离所述第一换热板的边缘向另一所述连接板延伸；
两个所述板部之间具有沿所述壳体的长度方向延伸的间隙。
可选地，所述密封梁还包括导向组件，
所述导向组件设置于所述第一换热板和所述第二换热板之间的空间的一端；或者，所述壳体的一端外侧设置有安装空间，所述导向组件设置于所述安装空间。
可选地，所述半导体模块的后侧与所述壳体之间设置有隔热装置，以填充所述半导体模块的后侧与所述壳体之间的除去所述导热装置外的空间的部分或全部。
可选地，所述密封梁还包括两个密封垫，分别设置于所述半导体模块的两端，且每个所述密封垫设置于所述半导体模块的一个端部端面与所述壳体之间。
可选地，每个所述密封垫的前边缘向远离另一密封垫的方向延伸出挡片。
可选地，所述导热装置包括多个导热翅片，每个所述导热翅片垂直于所述半导体模块的制冷面，且与所述半导体模块的制冷面接触抵靠或固定连接，与所述壳体的后壁接触抵靠或固定连接。
可选地，所述密封梁还包括转轴套组件，所述转轴套组件安装于所述壳体；
所述壳体包括开口朝前的后壳和前框，所述前框安装于所述后壳的开口处，所述半导体模块安装于所述前框内；
所述半导体模块的制热面为连续延伸的面，所述壳体由塑料制成。
本发明的用于冷藏冷冻装置门体的密封梁中，利用半导体模块一面制热 一面制冷的特性，将半导体模块的热端端面直接作为密封梁的前表面，防止房间内的空气在密封梁表面凝露；同时，将半导体模块的冷端与壳体的朝向面对制冷间室的内表面热连接，辅助制冷，能够在改善密封梁凝露问题的同时，减少储物间室内的制冷量流失。即，该密封梁可以补偿传统加热丝防凝露时，密封梁附近的冷量流失，更好的维持储物间室内温度。
壳体内具有沿壳体的长度方向延伸的容纳空间，将半导体模块作为一个整体进行安装，安装方便，结构紧凑，成本低。半导体模块的半导体制冷片同时制热制冷，其制热量高于制冷量，半导体模块的制热面直接作为密封梁的前表面，特别适用于解决密封梁凝露问题，除凝露效率高效果好；此外还拥有能量密度高、无噪音、体积小等特点，可使密封梁的厚度较小，且具有较高的解决前表面凝露问题的能力。半导体模块的制热面直接作为密封梁的前表面，安装制造方便，不用在半导体模块的前侧特别设置保护面、保护罩等。
进一步地，本发明的密封梁中，导向组件和隔热装置设置于导热装置的特殊位置处，可充分利用空间，且不会影响对应储物间室内的冷量。隔热装置可为泡沫件，即发泡件，设置于第一换热板和第二换热板之间，可防止密封梁的内外表面间的热交换，同时还可为半导体模块和/或导向组件等提供安装定位结构。
进一步地，本发明的密封梁中，还具有密封垫，可减少因半导体模块与壳体的配合间隙造成的换热。
根据下文结合附图对本发明具体实施例的详细描述，本领域技术人员将会更加明了本发明的上述以及其他目的、优点和特征。
附图说明
后文将参照附图以示例性而非限制性的方式详细描述本发明的一些具体实施例。附图中相同的附图标记标示了相同或类似的部件或部分。本领域技术人员应该理解，这些附图未必是按比例绘制的。附图中：
图1是根据本发明一个实施例的密封梁的示意性结构图；
图2是图1所示密封梁的另一视角的示意性结构图；
图3是图1所示密封梁的示意性爆炸图；
图4是图1所示密封梁的示意性局部结构图；
图5是图1所示密封梁中导热装置的示意性结构图；
图6是根据本发明一个实施例的密封梁的示意性结构图；
图7是图6所示密封梁的另一视角的示意性结构图；
图8是图6所示密封梁的示意性爆炸图；
图9是图6所示密封梁中密封垫和挡片的示意性结构图。
具体实施方式
本发明的冷藏冷冻装置包括箱体，箱体内限定有一个或多个储物间室。进一步地，冷藏冷冻装置还包括用于开闭上述若干个储物间室的至少一个门体/盖。冷藏冷冻装置还包括制冷系统，制冷系统可为用于为每个储物间室供冷的压缩制冷系统。压缩机制冷系统可包括串联连接的压缩机、冷凝器、节流元件和蒸发器。冷藏冷冻装置可为风冷式冷藏冷冻装置，蒸发器可设置于箱体的冷却室内，以便于通过风道组件和风机向储物间室提供冷量。具体地，风道组件具有送风风路和回风风路，风机配置成促使储物间室内的气体从回风风路进入冷却室，与蒸发器换热经由送风风路进入储物间室。在一些可选实施例中，冷藏冷冻装置可为直冷式冷藏冷冻装置。在一些可选实施例中，制冷系统可为半导体制冷系统等其他类的制冷系统。冷藏冷冻装置可以为冰箱、冰柜、冷柜等。
制冷系统为压缩制冷系统时，压缩机将汽化的制冷剂压缩成高温高压的气体，然后从压缩机的排气口排出。冷凝器的入口与压缩机的排气口相连，高温高压的气态制冷剂流经冷凝器，在向室外散热的过程中，逐渐冷凝成高压的液体。节流元件的入口与冷凝器的出口相连，高压的液态制冷剂流经节流元件后压力降低变成气液混合物，然后进入蒸发器吸收气体中的热量汽化，再返回压缩机。同时，风机使气流在储物间室和冷却室之间流动，使得储物间室内的温度降低。
在一些优选实施例中，冷藏冷冻装置的箱体的前侧设置有两个门体，两个门体相对设置，每个门体的后侧均具有一个储物间室，或者该两个门体用于封闭一个储物间室。为了保证两个门体之间的密封性能，两个门体之间通常具有密封梁，也可被称为竖梁。密封梁可设置于一个门体上。当然根据门体的安装位置，该密封梁可竖直设置，可水平设置且沿前后方向延伸，也可水平设置且沿左右方向延伸，淡然也可设置成其他形态。
当然，对于一个门体，其后侧对应一个储物间室，门体与储物间室的开口处的边框之间也可设置密封梁。
图1是根据本发明一个实施例的冷藏冷冻装置的示意性结构图。如图1所示并参考图2至图9，本发明实施例提供了一种用于冷藏冷冻装置门体的密封梁。
密封梁包括壳体10和半导体模块20。壳体10具有开口朝前且沿壳体10的长度方向延伸的容纳空间。半导体模块20具有制冷面和制热面，半导体模块20安装于容纳空间内。且半导体模块20的制热面设置于容纳空间的开口处，以形成密封梁的前表面的部分或全部，也就是说，半导体模块20的制热面为连续延伸的面，用半导体模块20的制热面直接封闭壳体10的开口，形成密封梁的前表面。半导体模块20的制冷面与壳体10的后壁热连接。
本发明实施例的密封梁中，利用半导体模块20一面制热一面制冷的特性，将半导体模块20的热端端面直接作为密封梁的前表面，防止房间内的空气在密封梁表面凝露；同时，将半导体模块20的冷端与壳体10的朝向面对制冷间室的内表面热连接，辅助制冷，能够在改善密封梁凝露问题的同时，减少储物间室内的制冷量流失。壳体10内具有沿壳体10的长度方向延伸的容纳空间，将半导体模块20作为一个整体进行安装，安装方便，结构紧凑，成本低。半导体模块20的半导体制冷片同时制热制冷，其制热量高于制冷量，半导体模块20的制热面直接作为密封梁的前表面，特别适用于解决密封梁凝露问题，除凝露效率高效果好；此外还拥有能量密度高、无噪音、体积小等特点，可使密封梁的厚度较小，且具有较高的解决前表面凝露问题的能力。
在本发明的一些实施例中，半导体模块20的制冷面和制热面均为连续延伸的面，也可以理解为制冷面和制热面上没有孔洞等结构。半导体模块20的半导体制冷片在通电后，一面制冷，一面制热，其工作原理是由直流电源提供电子流所需的能量，通上电源后，电子负极出发，首先经过P型半导体，于此吸热量，到了N型半导体，又将热量放出，每经过一个NP模块，就有热量由一边被送到另外一边造成温差而形成冷热端。
在本发明的一些实施例中，如图3和图8所示，密封梁还包括导热装置30，导热装置30设置于半导体模块20的制冷面与壳体10的后壁之间，以使壳体10的后壁与制冷面进行热交换。在本发明的一些可选实施例中，半 导体模块20的制冷面与壳体10的后壁接触抵靠，以使壳体10的后壁与制冷面进行热交换。
为了保证密封性能，半导体模块20的朝向导热装置30的一侧与壳体10之间设置有隔热装置60，以填充半导体模块20的朝向导热装置30的一侧与壳体10之间的除去导热装置30外的空间的部分或全部。例如，可通过发泡的方式形成隔热装置60，隔热装置60可被称为发泡件、泡沫件、保温层等。
在本发明的一些实施例中，如图5所示，导热装置30包括第一换热板31、第二换热板32和两个连接板33。第一换热板31与制冷面接触抵靠。两个连接板33分别从第一换热板31的两个沿壳体10的长度方向延伸的边缘向远离半导体模块20的方向延伸。第二换热板32与壳体10的后壁接触抵靠。第二换热板32连接两个连接板33。为了便于加工制造，导热装置30可弯折成型，第二换热板32包括两个板部，每个板部从一个连接板33的远离第一换热板31的边缘向另一连接板33延伸。两个板部之间具有沿壳体10的长度方向延伸的间隙。
进一步地，壳体10由塑料制成。如图6至图9所示，壳体10包括开口朝前的后壳12和前框11，前框11安装于后壳12的开口处，半导体模块20安装于前框11内。在一实施例中，如图1至图3所示，壳体10一体成型。两个连接板33和第二换热板32均与后壳12的内表面接触，可使后壳12的受冷部位增加，进一步防止储物间室内的冷量外泄。半导体模块20的制冷面通过导热硅胶粘接于导热装置30，或者通过固定结构件机械固定于导热装置30。固定结构件可为螺钉、卡接件等。
在本发明的一些实施例中，密封梁还包括导向组件40，如图4所示，导向组件40设置于第一换热板31和第二换热板32之间的空间的一端，壳体10上设置有同于导向组件40穿过的孔洞。隔热装置60也可设置于第一换热板31和第二换热板32之间。导向组件40和隔热装置60设置于导热装置30的特殊位置处，可充分利用空间，且不会影响对应储物间室内的冷量。隔热装置60可为泡沫件，即发泡件，设置于第一换热板31和第二换热板32之间，可防止密封梁的内外表面间的热交换。密封梁还包括转轴套组件50，转轴套组件50安装于壳体10。
在本发明的一些替代性实施例中，壳体10的一端外侧设置有安装空间，导向组件40设置于安装空间。也就是说，导向组件40完全设置于壳体10 上。
为了保证密封性能和隔热效果，如图6至图9所示，壳体10还包括两个密封垫15，分别设置于半导体模块20的两端，且每个密封垫15设置于半导体模块20的一个端部端面与壳体10之间。进一步地，每个密封垫15的前边缘向远离另一密封垫15的方向延伸出挡片16，挡片16可与壳体10的前表面贴合。密封垫15可减少因壳体10与半导体模块20的配合间隙造成的换热。
在本发明的一些实施例中，转轴套组件50可包括轴套和扭簧，对应的门体上设置有转轴，转轴插入轴套，扭簧设置于转轴和轴套之间，促使密封梁垂直于对应的门体。
导向组件40可包括弹簧和导向件，导向件可伸缩地设置，弹簧用于导向件伸出壳体10。储物间室顶壁设置有开口朝下的导向槽。在该门体打开时，密封梁处于近似垂直于门体的状态，即完全折叠状态。该门体关闭过程中，密封梁将沿竖直轴线转动至近似平行于门体的状态，即完全展开状态，以密封该门体与另一门体之间的间隙。在开关门过程中，导向件将沿导向槽的延伸轨迹运动，以引导密封梁正确转动。
至此，本领域技术人员应认识到，虽然本文已详尽示出和描述了本发明的多个示例性实施例，但是，在不脱离本发明精神和范围的情况下，仍可根据本发明公开的内容直接确定或推导出符合本发明原理的许多其他变型或修改。因此，本发明的范围应被理解和认定为覆盖了所有这些其他变型或修改。

Claims (10)

  1. 一种用于冷藏冷冻装置门体的密封梁，包括：
    壳体，所述壳体具有开口朝前且沿所述壳体的长度方向延伸的容纳空间；
    半导体模块，具有制冷面和制热面，所述半导体模块安装于所述容纳空间内；且所述半导体模块的制热面设置于所述容纳空间的开口处，以形成所述密封梁的前表面的部分或全部；所述半导体模块的制冷面与所述壳体的后壁热连接。
  2. 根据权利要求1所述的密封梁，还包括：
    导热装置，所述导热装置设置于所述半导体模块的制冷面与所述壳体的后壁之间，以使所述壳体的后壁与所述制冷面进行热交换。
  3. 根据权利要求2所述的密封梁，其中，所述导热装置包括：
    第一换热板，所述第一换热板与所述制冷面接触抵靠；
    两个连接板，分别从所述第一换热板的两个沿所述壳体的长度方向延伸的边缘向远离所述半导体模块的方向延伸；和
    第二换热板，所述第二换热板与所述壳体的后壁接触抵靠；所述第二换热板连接两个所述连接板。
  4. 根据权利要求3所述的密封梁，其中，
    所述第二换热板包括两个板部，每个所述板部从一个所述连接板的远离所述第一换热板的边缘向另一所述连接板延伸；
    两个所述板部之间具有沿所述壳体的长度方向延伸的间隙。
  5. 根据权利要求3所述的密封梁，还包括导向组件，
    所述导向组件设置于所述第一换热板和所述第二换热板之间的空间的一端；或者，所述壳体的一端外侧设置有安装空间，所述导向组件设置于所述安装空间。
  6. 根据权利要求2-5中任一项所述的密封梁，其中，
    所述半导体模块的后侧与所述壳体之间设置有隔热装置，以填充所述半 导体模块的后侧与所述壳体之间的除去所述导热装置外的空间的部分或全部。
  7. 根据权利要求1-5中任一项所述的密封梁，还包括两个密封垫，分别设置于所述半导体模块的两端，且每个所述密封垫设置于所述半导体模块的一个端部端面与所述壳体之间。
  8. 根据权利要求7所述的密封梁，其中，
    每个所述密封垫的前边缘向远离另一密封垫的方向延伸出挡片。
  9. 根据权利要求2-5中任一项所述的密封梁，其中，
    所述导热装置包括多个导热翅片，每个所述导热翅片垂直于所述半导体模块的制冷面，且与所述半导体模块的制冷面接触抵靠或固定连接，与所述壳体的后壁接触抵靠或固定连接。
  10. 根据权利要求1-5中任一项所述的密封梁，还包括转轴套组件，所述转轴套组件安装于所述壳体；
    所述壳体包括开口朝前的后壳和前框，所述前框安装于所述后壳的开口处，所述半导体模块安装于所述前框内；
    所述半导体模块的制热面为连续延伸的面，所述壳体由塑料制成。
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