WO2023078377A1 - 屏蔽装置及其制作方法及电子内窥镜系统 - Google Patents

屏蔽装置及其制作方法及电子内窥镜系统 Download PDF

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WO2023078377A1
WO2023078377A1 PCT/CN2022/129765 CN2022129765W WO2023078377A1 WO 2023078377 A1 WO2023078377 A1 WO 2023078377A1 CN 2022129765 W CN2022129765 W CN 2022129765W WO 2023078377 A1 WO2023078377 A1 WO 2023078377A1
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image sensor
shielding
electronic endoscope
shielding layer
shielding device
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PCT/CN2022/129765
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English (en)
French (fr)
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陈东
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新光维医疗科技(苏州)股份有限公司
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Publication of WO2023078377A1 publication Critical patent/WO2023078377A1/zh

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/00071—Insertion part of the endoscope body
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00064—Constructional details of the endoscope body
    • A61B1/00105—Constructional details of the endoscope body characterised by modular construction
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/00131—Accessories for endoscopes

Definitions

  • the invention relates to the technical field of endoscopes, in particular to a shielding device, a manufacturing method thereof, and an electronic endoscope system.
  • Endoscopes can be divided into optical endoscopes, fiber endoscopes and electronic endoscopes according to the way of imaging.
  • the image sensors of optical endoscopes and fiberscopes are located at the rear end, and optical lenses or optical fibers are used to transmit the image light at the front end to the image sensor at the rear end for photosensitive imaging; while electronic endoscopes directly place the image sensor on the The front end of the endoscope directly receives the image light without the transmission of optical fiber or other media.
  • electronic endoscopy is the development trend and mainstream in the field of endoscopy.
  • the structure of the front end of the existing disposable electronic endoscope is basically a structural member made of plastic material, in which an image sensor and an instrument channel are arranged.
  • an image sensor and an instrument channel are arranged.
  • the high-frequency instrument extends to the front end through the instrument channel of the disposable electronic endoscope, and protrudes out.
  • the outer diameter of the front end is usually less than 3mm.
  • at least one lighting module usually 2
  • irrigation ports, etc. need to be set, so the space available for installing image sensors is extremely limited, and it needs to be controlled within 1.5mm2 at least.
  • resolution is the core indicator of disposable electronic endoscopes, and the resolution is positively correlated with the number of pixels of the image sensor, it is necessary to select as large a size as possible in the space where the image sensor is installed at the front end.
  • the pixel image sensor is used as the imaging element to improve the resolution of the disposable electronic endoscope.
  • the size of existing image sensors is mostly on the micron scale, and every time the size increases by 0.1mm2 , it is possible to add more than 10,000 pixels (the specific value depends on the unit pixel size), such as the pixel size of a 1.4mm2 image sensor
  • the number is about 2 times that of 1.0mm 2 and the sensitivity is very high. Therefore, if the image sensor is covered with a shielding material and the thickness of the material is increased to prevent the image sensor from being interfered by electromagnetic signals, the size of the image sensor will be reduced, the number of pixels of the image sensor will be sacrificed, and the cost of disposable electronic endoscopes will be reduced. On the contrary, if the thickness of the shielding material covering the image sensor is too small, effective shielding cannot be achieved.
  • the technical problem to be solved by the present invention is to provide a shielding device with a reasonable structure, which can effectively reduce the electromagnetic interference caused by high-frequency instruments to the image sensor of the disposable electronic endoscope.
  • the present invention provides a shielding device, which is used to shield the electromagnetic interference of the high-frequency equipment on the image sensor in the disposable electronic endoscope when the disposable electronic endoscope is used in conjunction with the high-frequency equipment. It is characterized by including:
  • the shielding layer is used to resist the electromagnetic interference signal generated by the high-frequency instrument on the image sensor
  • a guide wire used to guide the electromagnetic interference signal on the shielding layer into the ground
  • the shielding layer is coated/coated on the image sensor or all or a section of the image sensor and its wiring harness; the first end of the guide wire is connected to the shielding layer, and the second end is grounded;
  • the shielding layer comprises aluminum, tin or tin-aluminum alloy material
  • the thickness x of the shielding layer is:
  • k is the correlation constant of aluminum, tin or tin-aluminum alloy materials.
  • the shielding layer forms a rough surface.
  • the second end of the guide wire is grounded through the signal relay circuit board of the disposable electronic endoscope, and the electromagnetic interference signal on the shielding layer is passed through the signal relay circuit board Import the earth.
  • the guide wire is wound at least once around the wire harness of the image sensor, so as to use the electromagnetic signal radiated by the wire harness of the image sensor to offset the conduction of the guide wire radiation from the shielding layer EMI signal; or,
  • the guide wire is wound at least once around the wire harness of the image sensor and the wire harness of the lighting module of the disposable electronic endoscope, so as to offset the electromagnetic signal radiated by the wire harness of the image sensor and the wire harness of the lighting module
  • the electromagnetic interference signal radiated by the guide wire is conducted from the shielding layer.
  • the wire harness of the image sensor includes an outer sheath layer and power supply lines and signal lines wrapped inside the outer sheath layer, and the power supply lines and signal lines both include an inner sheath layer;
  • the first end of the guide wire is connected to the shielding layer, the second end is connected to the outer sheath layer and/or the inner sheath layer of the image sensor to be grounded, and the electromagnetic interference signal on the shielding layer is passed through The outer jacket layer and/or the inner jacket layer lead into the ground.
  • the present invention also provides a method for manufacturing a shielding device, which is used to manufacture the above-mentioned shielding device, which includes the following steps:
  • the first end of the guide wire is connected to the shielding layer, and the second end is grounded.
  • the manufacturing method of the shielding device further includes the following steps:
  • the manufacturing method of the shielding device further includes the following steps:
  • the guide wire is wound on the wire harness of the image sensor and the wire harness of the lighting module.
  • the manufacturing method of the shielding device further includes the following steps:
  • the second end of the guide wire is connected to the outer sheath layer and/or the inner sheath layer of the image sensor.
  • the present invention also provides an electronic endoscope system, including a disposable electronic endoscope, the above-mentioned shielding device is integrated on the disposable electronic endoscope, and the shielding device is used for When the mirror is used in conjunction with high-frequency instruments, it can resist the electromagnetic interference of the high-frequency instruments on the image sensor in the disposable electronic endoscope.
  • the shielding device of the present invention coats/covers the image sensor through the shielding layer, and uses the shielding layer to shield the electromagnetic interference signal generated by the high-frequency device; under the thickness of the shielding layer, the image sensor can be selected to maximize the number of pixels/resolution; And use the guide wire or multiple sheath layer structure to guide the electromagnetic interference signal remaining on the shielding layer into the ground, further reducing the electromagnetic interference caused by high-frequency instruments to the image sensor of the disposable electronic endoscope; the device is integrated in the disposable electronic In the small space at the front end of the endoscope, the compatible use of the disposable electronic endoscope and high-frequency instruments can be realized.
  • the shielding device of the present invention also has a good electromagnetic shielding effect on high-power high-frequency instruments.
  • Figure 1 is a partial assembly diagram of the shielding device and the disposable electronic endoscope in Embodiment 1 of the present invention
  • FIG. 2 is an overall assembly diagram of the shielding device and the disposable electronic endoscope in Embodiment 1 of the present invention
  • Fig. 3 is a schematic diagram of the connection structure between the endoscope host and the signal cable;
  • FIG. 4 is a partial assembly diagram of the shielding device and the disposable electronic endoscope in Embodiment 3 of the present invention.
  • Fig. 5 is a partial assembly diagram of the shielding device and the disposable electronic endoscope in Embodiment 4 of the present invention.
  • Fig. 6 is a partial assembly diagram of the shielding device and the disposable electronic endoscope in Embodiment 5 of the present invention.
  • Fig. 8 is a radial cross-sectional view of power supply lines and signal lines in Embodiment 5 of the present invention.
  • Fig. 9 is an axial cross-sectional view of the positive power supply line and the signal line in Embodiment 5 of the present invention.
  • this embodiment discloses a shielding device, which is used to shield the impact of high-frequency instruments on the image sensor 20 in the disposable electronic endoscope when the disposable electronic endoscope is used in conjunction with high-frequency instruments. electromagnetic interference.
  • the shielding device consists of:
  • the shielding layer 41 is used to resist the electromagnetic interference generated by high-frequency instruments on the image sensor 20 .
  • the shielding layer is coated/covered on the image sensor 20 or all or a section of the image sensor 20 and its wiring harness 21 . It is characterized in that the thickness x of the shielding layer 41 is determined by the following formula:
  • the frequency of the electromagnetic interference signal is f
  • k is a correlation constant of aluminum, tin or tin-aluminum alloy material
  • the correlation constant is related to the relative magnetic permeability and resistivity of the material selected for the shielding layer 41 .
  • the present invention selects materials with high resistivity such as tin, aluminum or tin-aluminum alloy (i.e. tinfoil paper) as the material of the shielding layer 41.
  • Tin layer, aluminum layer, tin-aluminum alloy layer or tin-aluminum composite layer, etc. are coated/coated on the image sensor 20 or all or a section of the image sensor 20 and its wiring harness 21, and part of the electromagnetic interference signal is reflected on the surface of the shielding layer 41 Finally, part of the shielding layer 41 body in the remaining part causes the electromagnetic interference signal to form an eddy current on the surface of the shielding material due to the skin effect, thereby weakening the influence of the electromagnetic interference signal on the image sensor.
  • the thickness x of the shielding material is calculated by using the skin depth formula combined with the frequency range of high-frequency instruments applicable to endoscopic surgery.
  • the shielding effectiveness of high-frequency instruments for endoscopic surgery is about 67.17dB at this thickness, which has a good electromagnetic shielding effect. Sizing an image sensor at this thickness will yield the highest pixel count/resolution. Moreover, tin, aluminum, etc. are common materials, are easy to obtain, and have economic benefits for disposable electronic endoscopes.
  • the electromagnetic shielding effect is measured by the electromagnetic shielding effectiveness S E , which characterizes the degree of attenuation of the electromagnetic wave by the shielding body.
  • S E includes absorption loss A, reflection loss R, and multiple reflection correction factor B.
  • Interference source distance D is the distance from the tip of the high-frequency instrument to the shielding layer of the image sensor, generally
  • Interference signal length of electromagnetic interference signal Interference source distance It is a near-field electromagnetic interference signal, high-frequency equipment is a high-voltage discharge, and the radiation field is mainly an electric field. The efficiency of reflection loss is calculated by using the near-field electric field.
  • the efficiency A of absorption loss is less than 10dB, so it is necessary to consider the multiple reflection correction factor B:
  • the electromagnetic shielding effectiveness of the shielding device in this embodiment is:
  • the surface of the shielding layer 41 can be configured as a rough surface, which is equivalent to increasing the length of its propagation path for the eddy currents propagating near the surface of the shielding layer caused by electromagnetic interference signals, so this type of surface will cause a larger The resistive loss further improves the shielding performance.
  • the shielding effectiveness represents the attenuation degree of the shielding body to electromagnetic waves, that is, the ratio of the electromagnetic field intensity E1 when there is no shielding to the electromagnetic field intensity E2 when there is shielding, it represents the shielding effect of the shielding layer 41.
  • the absolute value of the electromagnetic field intensity E1 that is finally transmitted to the image sensor is also related to the intensity of the electromagnetic interference signal sent by the high-frequency device. The greater the intensity of the electromagnetic field of the image sensor 20 , directly affects whether the image sensor 20 can work normally.
  • the thickness x of the shielding layer 41 derived from the skin depth is the depth at which the eddy current density decays to the remaining 37%.
  • Embodiment 2 adds a guide wire 42 on the basis of Embodiment 1.
  • the first end of the wire 42 is connected to the shielding layer 41, and the second end is connected to the ground terminal on the signal relay circuit board 13 of the disposable electronic endoscope, which is used to guide the residual electromagnetic interference signal on the shielding layer 41 away from One side of the image sensor 20 is gradually lost, offset, or finally introduced into the ground during the distance.
  • the material of the guide wire 42 is metal, preferably, nickel-titanium wire or the like.
  • the guide wire 42 is wound at least once around the periphery of the wire harness 21 of the image sensor, and the electromagnetic signal radiated by the wire harness 21 of the image sensor is used to offset the electromagnetic interference signal radiated by the guide wire 42 from the self-shielding layer 41;
  • the guide wire 42 and the wire harness 21 of the image sensor, or the composite wire harness of the image sensor 20 and the lighting module 30 are wound in a twisted pair.
  • This method can not only reduce the area of the induction loop between the wiring harnesses, but also locally, the polarity of the induced voltage is opposite, and the induced current on each wire cancels each other, thereby improving the electromagnetic shielding effect.
  • the period of the twisted pair is smaller, the twist distance is shorter, and the shielding effect is better.
  • the disposable electronic endoscope includes a signal relay circuit board 13, an endoscope housing 14, and an endoscope host 15, and the signal relay circuit board 13 is arranged on the endoscope housing 14 , the signal relay circuit board 13 is connected to the endoscope host 15 through the signal cable 16, the signal relay circuit board 13 has a first ground terminal and a second ground terminal (not shown in the figure), and the first ground terminal The second ground terminal is located on the side close to the image sensor 20 , and the second ground terminal is on the side away from the image sensor 20 , which are the common ground terminals of the guide wire 42 and various wiring harnesses in the signal cable 16 respectively.
  • the endoscope main body 15 is provided with a ground terminal.
  • the guide wire 42 introduces the remaining electromagnetic interference signal on the shielding layer 41 to the first ground terminal, then transmits it to the second ground terminal, and then transmits it to the endoscope host 15 through the signal cable 16, and finally passes the endoscope
  • the ground terminal of the host computer 15 guides the electromagnetic interference signal into the ground.
  • the signal relay circuit board 13 can be used to identify the serial number of each disposable electronic endoscope and to record the use time. It cannot be used after the specified time, preventing multiple long-term operations by humans, and realizing For single use purposes.
  • the endoscope main unit 15 includes an internal circuit board 151 and a ground terminal 152, and the electromagnetic interference signal flows to the internal circuit board 151 and the shell of the endoscope main unit 15 respectively through the ground wire 161 in the signal cable 16, and flows to The electromagnetic interference signal of the casing flows to the ground after passing through the ground terminal 152 , and the electromagnetic interference signal flowing to the internal circuit board 151 also flows to the ground through the ground terminal 152 .
  • the electromagnetic interference signal is completely eliminated by means of two-way flow.
  • the high-power high-frequency instrument is integrated by setting the guide wire 42 and a variety of winding methods, using the ground terminal of the signal relay circuit board, the two-way shunt of the endoscope host, and the combined shielding method of setting the ground terminal.
  • the insertion part including the front end 11 will experience several times of bending in the human body , if the wire harness is distributed as multiple single wires in the insertion part, then there will be a single wire distributed in different positions in the insertion part may interfere with other parts in the insertion part during the continuous bending process, resulting in a single
  • the risk of disconnection between the wire and the image sensor 20 or the welding point of the lighting module 30 located in the front end 11, while tightly winding a plurality of loose wire bundles into a bundle through a guide wire can enhance the toughness and strength of the cable, which solves the problem
  • the risk problem caused by a single wire improves the safety of use;
  • the wire harness 21 of the image sensor includes an outer sheath layer and a power supply line and a signal line wrapped inside the outer sheath layer
  • the power supply line includes a positive power supply line
  • the signal line includes an input signal line 25 and
  • the output signal line 26 the outer sheath layer includes the outer shielding layer 22 and the first sheath 23 arranged in sequence from the inside to the outside
  • the positive power supply line 24, the input signal line 25 and the output signal line 26 all include an inner sheath layer
  • the layers include an inner shielding layer 211 and a second sheath 212 arranged in sequence from the inside to the outside, and the wire core 213 is located in the inner sheath layer.
  • the embodiment of the present invention discloses a shielding device, which is different from Embodiment 2 in that: the first end of the guide wire 42 is connected to the shielding layer 41, and the second end is connected to the outside of the wire harness 21 of the image sensor.
  • the sheath layer and/or the inner sheath layer are connected to guide the electromagnetic interference signal on the shielding layer 41 into the ground through the outer sheath layer and/or the inner sheath layer.
  • the outer shielding layer 22 and the inner shielding layer 211 of the positive power supply line 24 , the input signal line 25 and the output signal line 26 are connected to form a negative power supply line of the image sensor 20 .
  • a wire harness with a multi-sheath structure is adopted, and the outer sheath layer of the wire harness itself and/or the shielding layer in the inner sheath layer are fully utilized, which not only serves as the guide wire 42 (i.e. conducting , loss of residual electromagnetic interference signal caused by high-frequency equipment), and can also be used as a positive power supply line, a negative power supply line of the input/output signal line, and the utilization rate is high.
  • each line in the outer sheath layer has an independent shielding layer, which prevents signal crosstalk between lines.
  • the wire harness of multiple sheath layers is a single integrated structure, which enhances the toughness and strength of the disposable electronic endoscope, and has a better effect than the enhanced toughness of the winding method described in Example 2.
  • the outer sheath layer and/or the inner sheath layer are denser, have a better shielding effect than the guide wire 42, and are more convenient for mass production.
  • This embodiment discloses a method for manufacturing a shielding device, which is used to manufacture the shielding device in Embodiment 2.
  • the method includes the following steps:
  • the shielding layer 41 is connected to the ground terminal on the signal relay circuit board 13 of the disposable electronic endoscope by the guide wire 42, so as to guide the electromagnetic interference signal on the shielding layer 41 into the ground.
  • the guide wire 42 is wound on the wire harness 21 of the image sensor, and the electromagnetic interference signal radiated by the guide wire 42 is used to cancel the electromagnetic interference signal radiated by the wire harness 21 of the image sensor; or,
  • the guide wire 42 is wound on the combined wire harness of the image sensor 20 and the lighting module 30 , and the electromagnetic interference signal radiated by the guide wire 42 is used to cancel the electromagnetic interference signal radiated by the combined wire harness.
  • the guide wire 42 is twisted with the wire harness 21 of the image sensor in a twisted pair; or,
  • the guide wire 42 and the synthesized wire bundle are twisted in a twisted pair.
  • This embodiment discloses a method for manufacturing a shielding device, which is used to manufacture the shielding device in Embodiment 5.
  • the method includes the following steps:
  • the first end of the guide wire 42 is connected to the shielding layer 41 , and the second end is connected to the outer sheath layer and/or the inner sheath layer of the image sensor 20 .
  • This embodiment discloses an electronic endoscope system, including a disposable electronic endoscope, on which the shielding device described in any one of the first to fifth embodiments is integrated, and the shielding device is used for When the electronic endoscope is used in conjunction with high-frequency equipment, the electromagnetic interference of the high-frequency equipment on the image sensor in the disposable electronic endoscope is shielded.
  • the disposable electronic endoscope includes a signal relay circuit board 13, an endoscope housing 14, and an endoscope host 15, and the signal relay circuit board 13 is arranged on the endoscope housing 14, and the signal relay The circuit board 13 is connected to the endoscope host 15 through a signal cable 16, and the endoscope host 15 is provided with a ground terminal.

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Abstract

一种屏蔽装置、其制作方法及电子内窥镜系统，该屏蔽装置用于在一次性电子内窥镜与高频器械（1）配合使用时，屏蔽掉高频器械（1）对一次性电子内窥镜中图像传感器（20）的电磁干扰，包括：屏蔽层（41），用于抵抗高频器械（1）对图像传感器（20）产生的电磁干扰信号；导丝（42），用于将屏蔽层（41）上的电磁干扰信号导入大地；屏蔽层（41）涂/覆于图像传感器（20）或者图像传感器（20）及其线束（21）的全部或一段；导丝（42）的第一端与屏蔽层（41）连接，第二端接地；屏蔽层（41）包含铝、锡或锡铝合金材料；屏蔽装置通过屏蔽层（41）将图像传感器（20）涂/覆，利用屏蔽层（41）对高频器械（1）产生的电磁干扰信号进行屏蔽，能够实现一次性电子内窥镜与高频器械（1）的兼容使用。

Description

屏蔽装置及其制作方法及电子内窥镜系统 技术领域
本发明涉及内窥镜技术领域，特别涉及一种屏蔽装置及其制作方法及电子内窥镜系统。
背景技术
内窥镜按照成像的方式，可分为光学内窥镜、纤维内窥镜和电子内窥镜。光学内窥镜和纤维内窥镜的图像传感器位于后端，采用光学透镜或光导纤维将前端的图像光传输到后端的图像传感器上进行感光成像；而电子内窥镜是直接将图像传感器置于内窥镜的最前端，直接接收图像光，无需经过光导纤维或其他介质的传播。目前内窥镜领域中电子内窥镜是发展趋势和主流。
传统内窥镜都是消毒灭菌后反复使用的，然而目前的消毒灭菌水平无法彻底消灭微生物细菌，存在很大的交叉感染的隐患。所以现有技术的电子内窥镜在朝着一次性使用的方向发展，也就是一次性电子内窥镜。
现有一次性电子内窥镜的前端部的结构基本为一个塑料材质的结构件，其内设置有图像传感器和器械孔道。在诊治某些病变组织时，需要使用高频器械对息肉等多余组织进行电切或电凝(止血)。高频器械通过一次性电子内窥镜的器械孔道一直伸到最前端，并伸出。
然而，现有一次性电子内窥镜前端部的结构少有对图像传感器的保护措施，导致图像传感器和高频器械前端紧挨在一起，高频器械在工作时会释放出电磁干扰信号，并且工作的功率越大，释放出的电磁干扰信号的能量越强，该电磁干扰信号会传播至紧挨着的图像传感器，图像传感器通过像素感光面的光电转换将光信号转换为电信号，如果在光电转换过程中受到电磁信号干扰，轻微情 况下会造成图像不停闪烁，干扰手术的进行，严重情况下会导致监视器图像直接黑屏，医生在手术过程中无法观察到患者体内的图像，不得不暂停手术过程等待维修或者更换备用产品，对患者而言非常容易引发医疗事故。
进一步地，对于比较细的一次性电子内窥镜，比如用于泌尿科的一次性电子内窥镜，其前端部外径通常不到3mm，在前端部结构狭小的空间内除了设置图像传感器和器械孔道外，还需要设置至少一个照明模块(通常为2个)、灌注口等，所以，可用于安装图像传感器的空间极为有限，至少需要控制在1.5mm 2以内。由于分辨率是一次性电子内窥镜的核心指标，且分辨率大小与图像传感器的像素数量呈正相关关系，因此应当在前端部用于安装图像传感器的空间内，尽可能选型大尺寸的高像素图像传感器作为成像元件，以提升一次性电子内窥镜的分辨率。更重要的是，现有图像传感器的尺寸多为微米级，每增加0.1mm 2尺寸即有可能新增万级以上像素数量(具体数值依赖于单位像素尺寸)，比如1.4mm 2图像传感器的像素数量约为1.0mm 2的2倍，灵敏度非常高。因此，若通过在图像传感器外部包覆屏蔽材料，并依靠增加材料厚度来避免图像传感器受电磁信号干扰，将限缩图像传感器的尺寸，牺牲图像传感器的像素数量，进而降低一次性电子内窥镜的分辨率；反之，如果包覆图像传感器屏蔽材料的厚度过小，将无法实现有效屏蔽。
综上，为使一次性电子内窥镜能够与高频器械兼容，亟需一种既不占用前端部结构空间以满足大尺寸高像素图像传感器的选用，又可有效抵抗高频器械对图像传感器电磁干扰的屏蔽装置，以此扩展一次性电子内窥镜的使用功能，促进其发展与市场应用。
发明内容
本发明要解决的技术问题是提供一种结构合理、可有效降低高频器械对一次性电子内窥镜的图像传感器带来的电磁干扰的屏蔽装置。
为了解决上述问题，本发明提供了一种屏蔽装置，用于在一次性电子内窥镜与高频器械配合使用时，屏蔽掉高频器械对一次性电子内窥镜中图像传感器 的电磁干扰，其特征在于，包括：
屏蔽层，用于抵抗所述高频器械对所述图像传感器产生的电磁干扰信号；
导丝，用于将所述屏蔽层上的电磁干扰信号导入大地；
所述屏蔽层涂/覆于所述图像传感器或者所述图像传感器及其线束的全部或一段；所述导丝的第一端与所述屏蔽层连接，第二端接地；
所述屏蔽层包含铝、锡或锡铝合金材料；
当所述高频器械对所述图像传感器产生的电磁干扰信号频率为f时，所述屏蔽层的厚度x为：
Figure PCTCN2022129765-appb-000001
其中，k为铝、锡或锡铝合金材料的相关常数。
作为本发明的进一步改进，所述屏蔽层形成粗糙表面。
作为本发明的进一步改进，所述导丝的第二端通过一次性电子内窥镜的信号中继电路板接地，将所述屏蔽层上的电磁干扰信号经所述信号中继电路板导入大地。
作为本发明的进一步改进，所述导丝在所述图像传感器的线束外周至少卷绕一圈，以利用所述图像传感器的线束辐射的电磁信号抵消所述导丝辐射的自所述屏蔽层传导的电磁干扰信号；或者，
所述导丝在所述图像传感器的线束和一次性电子内窥镜的照明模块的线束外周至少卷绕一圈，以利用所述图像传感器的线束和所述照明模块的线束辐射的电磁信号抵消所述导丝辐射的自所述屏蔽层传导的电磁干扰信号。
作为本发明的进一步改进，所述图像传感器的线束包括外护套层和包覆于所述外护套层内部的供电线和信号线，所述供电线和信号线均包括内护套层；
所述导丝的第一端与所述屏蔽层连接，第二端与所述图像传感器的外护套层和/或内护套层连接以接地，将所述屏蔽层上的电磁干扰信号经所述外护套层和/或内护套层导入大地。
本发明还提供了一种屏蔽装置的制作方法，用于制作上述屏蔽装置，其包括以下步骤：
在所述图像传感器或者所述图像传感器及其线束的全部或一段上涂/覆所述屏蔽层；
将所述导丝的第一端与所述屏蔽层连接，第二端接地。
作为本发明的进一步改进，所述屏蔽装置的制作方法还包括以下步骤：
将所述导丝的第二端与一次性电子内窥镜的信号中继电路板连接。
作为本发明的进一步改进，所述屏蔽装置的制作方法还包括以下步骤：
将所述导丝卷绕在所述图像传感器的线束上；或者，
将所述导丝卷绕在所述图像传感器的线束和照明模块的线束上。
作为本发明的进一步改进，所述屏蔽装置的制作方法还包括以下步骤：
将所述导丝的第二端与所述图像传感器的外护套层和/或内护套层连接。
本发明还提供了一种电子内窥镜系统，包括一次性电子内窥镜，所述一次性电子内窥镜上集成有上述屏蔽装置，所述屏蔽装置用于在所述一次性电子内窥镜与高频器械配合使用时，抵抗所述高频器械对一次性电子内窥镜中图像传感器的电磁干扰。
本发明的有益效果：
本发明的屏蔽装置通过屏蔽层将图像传感器涂/覆，利用屏蔽层对高频器械产生的电磁干扰信号进行屏蔽；在此屏蔽层厚度下选型图像传感器可以实现像素数量/分辨率最大化；并利用导丝或多重护套层结构将屏蔽层上残存的电磁干扰信号导入大地，进一步降低高频器械对一次性电子内窥镜的图像传感器带来的电磁干扰；该装置集成在一次性电子内窥镜前端部微小空间内部，能够实现一次性电子内窥镜与高频器械的兼容使用。本发明的屏蔽装置对于高功率的高频器械也具有良好的电磁屏蔽效果。
上述说明仅是本发明技术方案的概述，为了能够更清楚了解本发明的技术手段，而可依照说明书的内容予以实施，并且为了让本发明的上述和其他目的、 特征和优点能够更明显易懂，以下特举较佳实施例，并配合附图，详细说明如下。
附图说明
图1是本发明实施例一中屏蔽装置与一次性电子内窥镜的局部装配图；
图2是本发明实施例一中屏蔽装置与一次性电子内窥镜的整体装配图；
图3是内窥镜主机与信号线缆的连接结构示意图；
图4是本发明实施例三中屏蔽装置与一次性电子内窥镜的局部装配图；
图5是本发明实施例四中屏蔽装置与一次性电子内窥镜的局部装配图；
图6是本发明实施例五中屏蔽装置与一次性电子内窥镜的局部装配图；
图7是本发明实施例五中图像传感器的线束的径向截面图；
图8是本发明实施例五中供电线和信号线的径向截面图；
图9是本发明实施例五中正极供电线和信号线的轴向截面图。
标记说明：1、高频器械；11、前端部；12、器械孔道；13、信号中继电路板；14、内窥镜壳体；15、内窥镜主机；151、内部电路板；152、接地端子；16、信号线缆；161、地线；20、图像传感器；21、图像传感器的线束；22、外屏蔽层；23、第一外皮；；24、正极供电线；；25、输入信号线；26、输出信号线；211、内屏蔽层；212、第二外皮；213、线芯；30、照明模块；31、照明模块的线束；41、屏蔽层；42、导丝。
具体实施方式
下面结合附图和具体实施例对本发明作进一步说明，以使本领域的技术人员可以更好地理解本发明并能予以实施，但所举实施例不作为对本发明的限定。
实施例一
如图1所示，本实施例公开了一种屏蔽装置，用于在一次性电子内窥镜与高频器械配合使用时，屏蔽掉高频器械对一次性电子内窥镜中图像传感器20 的电磁干扰。
该屏蔽装置包括：
屏蔽层41，用于抵抗高频器械对图像传感器20产生的电磁干扰。
可选地，屏蔽层涂/覆于图像传感器20或者图像传感器20及其线束21的全部或一段。其特征在于屏蔽层41的厚度x由以下公式决定：
Figure PCTCN2022129765-appb-000002
其中，电磁干扰信号频率为f，k为铝、锡或锡铝合金材料的相关常数，相关常数与屏蔽层41选用材料的相对导磁率和电阻率有关。
根据上述公式，电磁干扰信号的频率f越小，屏蔽层41的相关常数k越大，所需要的屏蔽层41的厚度x也越厚。然而如前述所说，屏蔽层的厚度x每增加0.1mm，图像传感器的尺寸将随之被限缩，且将牺牲万级以上的像素数量。所以，为了在保证屏蔽效果的前提下，使屏蔽层厚度尽量薄，本发明选用锡、铝或锡铝合金(即锡箔纸)等电阻率高的材料作为屏蔽层41的材料，在结构上采用锡层、铝层、锡铝合金层或锡铝复合层等，涂/覆于图像传感器20或者图像传感器20及其线束21的全部或一段，在部分电磁干扰信号在屏蔽层41的表面被反射后，剩下部分中的一部分被屏蔽层41本体因趋肤效应使电磁干扰信号在屏蔽材料的表面形成涡流，从而削弱电磁干扰信号对图像传感器的影响。通过趋肤深度公式，结合内窥镜手术适用的高频器械的频率范围，计算得到屏蔽材料的厚度x。内窥镜手术用高频器械在该厚度下的屏蔽效能约为67.17dB，具有良好的电磁屏蔽效果。在此厚度下选型图像传感器，将能够获得最高的像素数量/分辨率。并且锡、铝等为常见的材料，容易获得，对一次性电子内窥镜具有经济效益。
本发明屏蔽层41的电磁屏蔽效能的推导过程说明如下：
表1锡和铝材料在高频器械工作频率下的屏蔽材料厚度x
Figure PCTCN2022129765-appb-000003
电磁屏蔽效果以电磁屏蔽效能S E衡量，表征屏蔽体对电磁波的衰减程度。S E包括吸收损失A、反射损失R、多重反射修正因子B，表达式为：S E＝A+R+B，当A＞10dB时，多重反射修正因子B可以忽略。
以电磁干扰信号的中心频率f＝430kHz，屏蔽材料使用锡为例：
趋肤深度
Figure PCTCN2022129765-appb-000004
故吸收损失的效能为：
Figure PCTCN2022129765-appb-000005
干扰源距离D为高频器械尖端部距离图像传感器屏蔽层的距离，一般为
10mm～20mm，取中间值D＝15mm。
电磁干扰信号的干扰信号长
Figure PCTCN2022129765-appb-000006
干扰源距离
Figure PCTCN2022129765-appb-000007
为近场电磁干扰信号，高频器械为高压放电，辐射场主要为电场，以近场电场计算反射损失的效能。
Figure PCTCN2022129765-appb-000008
吸收损失的效能A＜10dB，故需考虑多重反射修正因子B：
Figure PCTCN2022129765-appb-000009
综上，本实施例中屏蔽装置的电磁屏蔽效能为：
S E＝8.56dB+60.93dB-2.32dB＝67.17dB
此外，可以将屏蔽层41的表面构造成粗糙表面，这对于电磁干扰信号引起 的在屏蔽层表面附近传播的涡流而言，相当于增加了其传播路径的长度，因此此类表面将导致更大的电阻性损耗，进一步提升了屏蔽性能。
实施例二
进一步地，由于屏蔽效能表征的是屏蔽体对电磁波的衰减程度，即没有屏蔽存在时的电磁场强度E1与有屏蔽时的电磁场强度E2的比值，其代表的是屏蔽层41的屏蔽效果。最终传播至图像传感器的电磁场强度E1的绝对值还与高频器械发出的电磁干扰信号强度有关，当高频器械的功率越高时，其发出的电磁干扰信号越强，穿透屏蔽层41到达图像传感器20的电磁场强度越大，直接影响到图像传感器20能否正常工作。而且趋肤深度推导出的屏蔽层41的厚度x为涡流密度衰减到剩下37％时的深度，如要完全屏蔽，需要屏蔽层41厚度x需至少为趋肤深度的3～6倍，这在1.5mm×1.5mm以内的狭小空间内是无法实现的。为更好地使一次性电子内窥镜与高功率高频器械配合使用，需要在前面工作基础上进行升级，进一步提升屏蔽效果，实施例二在实施例一基础上，增加导丝42，导丝42的第一端与屏蔽层41连接，第二端与一次性电子内窥镜的信号中继电路板13上的接地端连接，用于将屏蔽层41上残留的电磁干扰信号引导远离图像传感器20一侧，在远离的过程中逐渐被损耗、抵消，或者最终导入至大地中。其中，导丝42的材质为金属，优选地，可为镍钛丝等。
可选地，如图4，导丝42在图像传感器的线束21外周至少卷绕一圈，利用图像传感器的线束21辐射的电磁信号抵消导丝42辐射的自屏蔽层41传导的电磁干扰信号；
或者，如图5，先将图像传感器的线束21和照明模块的线束31合成一束，再将导丝42在合成后的线束外周至少卷绕一圈，利用图像传感器的线束21和照明模块的线束31辐射的电磁信号抵消导丝42辐射的自屏蔽层41传导的电磁干扰信号。
优选地，导丝42与图像传感器的线束21，或图像传感器20和照明模块30的合成线束，以双绞线的方式卷绕。这种方式不仅能够缩小线束之间的感应回路圈围面积，而且就局部来说，感应电压的极性相反，在每根导线上的感应电流是相互抵消的，进而提升电磁屏蔽效果。其中，当双绞的周期越小，绞距越 短，屏蔽效果越好。
如图2所示，一次性电子内窥镜包括信号中继电路板13、内窥镜壳体14、内窥镜主机15，信号中继电路板13设置于内窥镜壳体14上，信号中继电路板13与内窥镜主机15通过与信号线缆16连接，信号中继电路板13具有第一接地端和第二接地端(图中未示出)，第一接地端位于靠近图像传感器20一侧，第二接地端远离图像传感器20一侧，分别为导丝42和信号线缆16中的各种线束的共地端。内窥镜主机15上设有接地端子。导丝42将屏蔽层41上的残存的电磁干扰信号引入到第一接地端上，随后传输至第二接地端，再通过信号线缆16传输至内窥镜主机15中，最后通过内窥镜主机15自身的接地端将电磁干扰信号导入大地。此外，信号中继电路板13可用于识别每一根一次性电子内窥镜的序列号以及用于记录使用时间，超过规定的时间后就不能使用，防止人为的多次长时间操作，实现一次性使用的目的。
如图3所示，内窥镜主机15包括内部电路板151和接地端子152，电磁干扰信号通过信号线缆16中的地线161分别流向内部电路板151和内窥镜主机15的外壳，流向外壳的电磁干扰信号经过接地端子152后流向大地，流向内部电路板151的电磁干扰信号同样经过接地端子152流向大地。通过二分流向的方式，将电磁干扰信号排除干净。
本实施例通过设置导丝42及多种绕线方式、利用信号中继电路板的接地端、内窥镜主机的二向分流以及设置接地端子的组合式屏蔽方式，将高功率高频器械释放的电磁干扰信号，在被实施例一所述的屏蔽层进行第一次损耗后，残留的电磁干扰信号被引导远离图像传感器一侧，并且传输的过程中被逐渐损耗、抵消，最终残余部分也被引入大地，近一步提升了一次性电子内窥镜的抗电磁干扰能力；此外，在实际操作一次性电子内窥镜时，其包含前端部11的插入部会在人体内会经历若干次弯曲，如果线束在插入部内分布为多股单根的线，那么就会存在在不断弯曲的过程中，分布于插入部内不同位置的单根线可能与插入部内的其他零部件产生干涉，导致单根线与位于前端部11内的图像传感器20或照明模块30的焊接点处断开的风险，而通过导丝将多根松散的线束紧密卷绕成一束能够增强线缆的韧性和强度，解决了单根线引致的风险问题，提高了使用安全性；另外也有利于在生产时将线束穿过插入部，使其便于组装，有利于提升一次性电子内窥镜的生产效能。
实施例三
如图7-9所示，图像传感器的线束21包括外护套层和包覆于外护套层内部的供电线和信号线，供电线包括正极供电线24，信号线包括输入信号线25和输出信号线26，外护套层包括由内向外依次设置的外屏蔽层22和第一外皮23，正极供电线24、输入信号线25和输出信号线26均包括内护套层，内护套层包括由内向外依次设置的内屏蔽层211、第二外皮212，线芯213位于内护套层内。
如图6所示，本发明实施例公开了一种屏蔽装置，其与实施例二的区别在于：导丝42的第一端与屏蔽层41连接，第二端与图像传感器的线束21的外护套层和/或内护套层连接，以将屏蔽层41上的电磁干扰信号经外护套层和/或内护套层导入大地。
优选地，外屏蔽层22和正极供电线24、输入信号线25和输出信号线26的内屏蔽层211四者连接并形成图像传感器20的负极供电线。
在本实施例中，采用了具有多重护套层结构的线束，充分利用线束自身的外护套层和/或内护套层内的屏蔽层，其既充当了导丝42的作用(即传导、损耗高频器械引致的残留电磁干扰信号)，又可以作为正极供电线、输入/输出信号线的负极供电线，利用率高。并且外护套层内的各线路具有独立的屏蔽层，起到防止线路之间信号互相串扰的作用。此外，多重护套层的线束为单根一体化结构，增强了一次性电子内窥镜的韧性与强度，并且与实施例二中所述的绕线方式增强韧性相比效果更好，另外因为外护套层和/或内护套层更加密集，相比导丝42屏蔽效果更好，对于批量生产制造来说也更加便捷。
实施例四
本实施例公开了一种屏蔽装置的制作方法，用于制作实施例二中的屏蔽装置，该方法包括以下步骤：
在图像传感器20或者图像传感器20及其线束21的全部或一段上涂/覆屏蔽层41；
利用导丝42将屏蔽层41与一次性电子内窥镜的信号中继电路板13上的接地端连接，以将屏蔽层41上的电磁干扰信号导入大地。
可选地，还包括以下步骤：
将导丝42卷绕在图像传感器的线束21上，利用导丝42辐射的电磁干扰信 号抵消图像传感器的线束21辐射的电磁干扰信号；或者，
将导丝42卷绕在图像传感器20和照明模块30合束后的线束上，利用导丝42辐射的电磁干扰信号抵消合束后的线束辐射的电磁干扰信号。
优选地，将导丝42与图像传感器的线束21以双绞线的方式缠绕；或者，
将导丝42与合成后的线束以双绞线的方式缠绕。
实施例五
本实施例公开了一种屏蔽装置的制作方法，用于制作实施例五中的屏蔽装置，该方法包括以下步骤：
将导丝42的第一端与屏蔽层41连接，第二端与图像传感器20的外护套层和/或内护套层连接。
实施例六
本实施例公开了一种电子内窥镜系统，包括一次性电子内窥镜，该一次性电子内窥镜上集成有如实施例一至五任一所述的屏蔽装置，该屏蔽装置用于在一次性电子内窥镜与高频器械配合使用时，屏蔽掉高频器械对一次性电子内窥镜中图像传感器的电磁干扰。其中，一次性电子内窥镜包括信号中继电路板13、内窥镜壳体14、内窥镜主机15，信号中继电路板13设置于内窥镜壳体14上，信号中继电路板13与内窥镜主机15通过与信号线缆16连接，内窥镜主机15上设有接地端。
以上实施例仅是为充分说明本发明而所举的较佳的实施例，本发明的保护范围不限于此。本技术领域的技术人员在本发明基础上所作的等同替代或变换，均在本发明的保护范围之内。本发明的保护范围以权利要求书为准。

Claims (10)

  1. 一种屏蔽装置，用于在一次性电子内窥镜与高频器械配合使用时，屏蔽掉高频器械对一次性电子内窥镜中图像传感器的电磁干扰，其特征在于，包括：
    屏蔽层，用于抵抗所述高频器械对所述图像传感器产生的电磁干扰信号；
    导丝，用于将所述屏蔽层上的电磁干扰信号导入大地；
    所述屏蔽层涂/覆于所述图像传感器或者所述图像传感器及其线束的全部或一段；所述导丝的第一端与所述屏蔽层连接，第二端接地；
    所述屏蔽层包含铝、锡或锡铝合金材料；
    当所述高频器械对所述图像传感器产生的电磁干扰信号频率为f时，所述屏蔽层的厚度x为：
    Figure PCTCN2022129765-appb-100001
    其中，k为铝、锡或锡铝合金材料的相关常数。
  2. 如权利要求1所述的屏蔽装置，其特征在于，所述屏蔽层形成粗糙表面。
  3. 如权利要求1所述的屏蔽装置，其特征在于，所述导丝的第二端通过一次性电子内窥镜的信号中继电路板接地，将所述屏蔽层上的电磁干扰信号经所述信号中继电路板导入大地。
  4. 如权利要求1所述的屏蔽装置，其特征在于，所述导丝在所述图像传感器的线束外周至少卷绕一圈，以利用所述图像传感器的线束辐射的电磁信号抵消所述导丝辐射的自所述屏蔽层传导的电磁干扰信号；或者，
    所述导丝在所述图像传感器的线束和一次性电子内窥镜的照明模块的线束外周至少卷绕一圈，以利用所述图像传感器的线束和所述照明模块的线束辐射的电磁信号抵消所述导丝辐射的自所述屏蔽层传导的电磁干扰信号。
  5. 如权利要求1所述的屏蔽装置，其特征在于，
    所述图像传感器的线束包括外护套层和包覆于所述外护套层内部的供电线 和信号线，所述供电线和信号线均包括内护套层；
    所述导丝的第一端与所述屏蔽层连接，第二端与所述图像传感器的外护套层和/或内护套层连接以接地，将所述屏蔽层上的电磁干扰信号经所述外护套层和/或内护套层导入大地。
  6. 一种屏蔽装置的制作方法，用于制作如权利要求1或2所述的屏蔽装置，其特征在于，包括以下步骤：
    在所述图像传感器或者所述图像传感器及其线束的全部或一段上涂/覆所述屏蔽层；
    将所述导丝的第一端与所述屏蔽层连接，第二端接地。
  7. 如权利要求6所述的屏蔽装置的制作方法，用于制作如权利要求3所述的屏蔽装置，其特征在于，包括以下步骤：
    将所述导丝的第二端与一次性电子内窥镜的信号中继电路板连接。
  8. 如权利要求6所述的屏蔽装置的制作方法，用于制作如权利要求4所述的屏蔽装置，其特征在于，包括以下步骤：
    将所述导丝卷绕在所述图像传感器的线束上；或者，
    将所述导丝卷绕在所述图像传感器的线束和照明模块的线束上。
  9. 如权利要求6所述的屏蔽装置的制作方法，用于制作如权利要求5所述的屏蔽装置，其特征在于，包括以下步骤：
    将所述导丝的第二端与所述图像传感器的外护套层和/或内护套层连接。
  10. 一种电子内窥镜系统，包括一次性电子内窥镜，其特征在于，所述一次性电子内窥镜上集成有如权利要求1-5任一所述的屏蔽装置，所述屏蔽装置用于在所述一次性电子内窥镜与高频器械配合使用时，抵抗所述高频器械对一次性电子内窥镜中图像传感器的电磁干扰。
PCT/CN2022/129765 2021-11-08 2022-11-04 屏蔽装置及其制作方法及电子内窥镜系统 WO2023078377A1 (zh)

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