WO2023075128A1

WO2023075128A1 - Electronic device comprising isolation structure

Info

Publication number: WO2023075128A1
Application number: PCT/KR2022/013315
Authority: WO
Inventors: 조영준; 천재봉; 윤용현; 이희준; 임병만; 정의철; 홍용의
Original assignee: 삼성전자주식회사
Priority date: 2021-10-26
Filing date: 2022-09-06
Publication date: 2023-05-04
Also published as: KR20230059353A

Abstract

In various embodiments, an electronic device may comprise: a housing including a side member formed so as to surround a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a space between the first plate and the second plate; an antenna module disposed in an inner space of the housing; an inner support member disposed in the inner space of the housing and electrically connected to the ground of the antenna module; a first antenna structure and a second antenna structure that are formed adjacent to at least a portion of the side member; a slit portion formed by cutting the side member between the first antenna structure and the second antenna structure; and an isolation structure extending from the inner support member toward the slit portion and positioned between the first antenna structure and the second antenna structure.

Description

Electronic Devices Containing Isolation Structures

Various embodiments of the present disclosure relate to an electronic device including an isolation structure.

As communication technology develops, various mobile communication methods and various frequency bands are being used for individual mobile communication. Recently, in order to meet the growing demand for wireless data traffic, a system related to 4G (4th-Generation) communication or 5G (5th-Generation) communication is being researched.

As various frequency bands are used, there are cases in which several multi-band antennas related to 2G, 3G, 4G, and/or 5G are disposed in one portable terminal. As the display area of the portable terminal increases or the internal density of components increases, the separation distance between adjacent antennas may decrease. If the separation distance between adjacent antennas is reduced, the performance of adjacent antennas may be affected.

According to various embodiments, an electronic device capable of reducing the influence between antennas disposed in a limited space may be provided.

According to various embodiments of the present disclosure, an electronic device having improved isolation between antennas may be provided by disposing an isolation structure between adjacent antennas.

According to various embodiments of the present disclosure, an electronic device having improved design and rigidity may be provided by making the isolation structure invisible from the outside of the electronic device.

According to various embodiments, the electronic device 301 includes a first plate 311 facing a first direction, a second plate 312 facing a second direction opposite to the first direction, and the first plate ( 311) and the second plate 312, the housing 310 including the side member 313 formed to surround the space, the antenna module disposed in the inner space of the housing 310, the housing 310 A first antenna structure 340 and a second antenna structure 350 formed adjacent to each other on at least a part of the inner support member disposed in the inner space and electrically connected to the ground of the antenna module and the side member 313 , the slit portion 360 formed by cutting the side member 313 between the first antenna structure 340 and the second antenna structure 350, and toward the slit portion 360 from the internal support member An isolation structure 321 extending and positioned between the first antenna structure 340 and the second antenna structure 350 may be included.

According to various embodiments, the electronic device 301 includes a first plate 311 facing a first direction, a second plate 312 facing a second direction opposite to the first direction, and the first plate ( 311) and the second plate 312, the housing 310 including a side member 313 formed to surround the space, an internal support member disposed in the inner space of the housing 310, the side member 313 ) The side member 313 between the first antenna structure 340 and the second antenna structure 350 formed adjacent to each other as a part of, and the first antenna structure 340 and the second antenna structure 350 includes a slit portion 360 formed by cutting, and at least a portion of the inner support member faces the slit portion 360 so as to be positioned between the first antenna structure 340 and the second antenna structure 350. It may be an isolation structure 321 extending to isolate the first antenna structure 340 and the second antenna structure 350 .

According to various embodiments, the electronic device 301 includes a first plate 311 facing a first direction, a second plate 312 facing a second direction opposite to the first direction, and the first plate ( 311) and the second plate 312, the housing 310 including the side member 313 formed to surround the space, the antenna module disposed in the inner space of the housing 310, the housing 310 A first antenna structure 340 and a second antenna structure 350 formed adjacent to each other on at least a part of the inner support member disposed in the inner space and electrically connected to the ground of the antenna module and the side member 313 , A slit formed by cutting the side member 313 between the first end 341 of the first antenna structure 340 and the second end 351 of the second antenna structure 350 positioned to face each other. The slit portion 360 extends from the portion 360 and the internal support member toward the slit portion 360 and has an end portion 3211 spaced apart from the first end portion 341 and the second end portion 351. an isolation structure (321) positioned at, wherein an end (3211) of the isolation structure (321) is positioned closer to the first end (341) than the second end (351), and the isolation structure (321) Silver may be covered by the injection structure 370 and not exposed to the outside of the electronic device 301 .

According to various embodiments, by disposing an isolation structure between adjacent antennas, an effect between adjacent antennas may be reduced.

According to various embodiments of the present disclosure, the design and rigidity of the electronic device may be improved by making the isolation structure invisible from the outside of the electronic device.

According to various embodiments, a new band signal can be generated using an existing antenna structure without adding a separate antenna structure for generating a new band signal.

1 is a block diagram of an electronic device 101 within a network environment 100 according to various embodiments.

2 is a block diagram 200 of a wireless communication module 192, a power management module 188, and an antenna module 197 of the electronic device 101, according to various embodiments.

3A is a front perspective view of an electronic device according to an exemplary embodiment;

3B is a rear perspective view of an electronic device according to an exemplary embodiment.

3C is an exploded perspective view of a rear surface of an electronic device according to an exemplary embodiment.

3D is a rear view illustrating a portion of a side member and an inner support member according to an embodiment.

3E is a schematic diagram schematically illustrating shapes and positions of a first antenna structure, a second antenna structure, and an isolation structure according to an exemplary embodiment.

3F and 3G are perspective views illustrating an isolation structure according to an exemplary embodiment.

3H is an external side view of an electronic device according to an exemplary embodiment.

4A to 4D are rear views illustrating an isolation structure and a slit unit according to various embodiments.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same reference numerals are given to the same components regardless of reference numerals, and overlapping descriptions thereof will be omitted.

1 is a block diagram of an electronic device 101 within a network environment 100 according to various embodiments. Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into one component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers commands or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to an embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of other functionally related components (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external

electronic devices

102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2 is a block diagram 200 of a wireless communication module 192, a power management module 188, and an antenna module 197 of the electronic device 101, according to various embodiments. Referring to FIG. 2 , the wireless communication module 192 may include the MST communication module 210 or the NFC communication module 230, and the power management module 188 may include the wireless charging module 250. In this case, the antenna module 197 includes the MST antenna 297-1 connected to the MST communication module 210, the NFC antenna 297-3 connected to the NFC communication module 230, and the wireless charging module 250 connected. It may include a plurality of antennas including the wireless charging antenna 297-5. For convenience of description, components overlapping those of FIG. 1 are omitted or briefly described.

The MST communication module 210 receives a signal including control information or payment information such as card information from the processor 120, and generates a magnetic signal corresponding to the received signal through the MST antenna 297-1. Then, the generated magnetic signal may be transferred to an external electronic device 102 (eg, a POS device). In order to generate the magnetic signal, according to an embodiment, the MST communication module 210 includes a switching module including one or more switches connected to the MST antenna 297-1 (not shown), and the switching module By controlling, the direction of the voltage or current supplied to the MST antenna 297-1 may be changed according to the received signal. Changing the direction of the voltage or current enables the direction of a magnetic signal (eg, magnetic field) transmitted through the MST antenna 297-1 to change accordingly. When the magnetic signal in a state where the direction is changed is detected by the external electronic device 102, the magnetic card corresponding to the received signal (eg, card information) is read by the card reader of the electronic device 102 ( can cause effects (e.g. waveforms) similar to magnetic fields that are swiped. According to an embodiment, the payment-related information and control signal received in the form of the magnetic signal from the electronic device 102 is transferred to the external server 108 (eg, payment server) through the network 199. can be sent to

The NFC communication module 230 obtains a signal including control information or payment information such as card information from the processor 120, and transmits the acquired signal to the external electronic device 102 through the NFC antenna 297-3. can be sent to According to an embodiment, the NFC communication module 230 may receive such a signal transmitted from the external electronic device 102 through the NFC antenna 297-3.

The wireless charging module 250 wirelessly transmits power to the external electronic device 102 (eg, mobile phone or wearable device) through the wireless charging antenna 297-5, or to the external electronic device 102 (eg : It is possible to wirelessly receive power from a wireless charging device). The wireless charging module 250 may support one or more of various wireless charging methods including, for example, a magnetic resonance method or a magnetic induction method.

According to an embodiment, some of the MST antenna 297-1, the NFC antenna 297-3, or the wireless charging antenna 297-5 may share at least a portion of the radiating part with each other. For example, the radiating part of the MST antenna 297-1 may be used as the radiating part of the NFC antenna 297-3 or the wireless charging antenna 297-5, and vice versa. In this case, the antenna module 297 is a wireless communication module 192 (eg MST communication module 210 or NFC communication module 230) or power management module 188 (eg wireless charging module 250) A switching circuit (not shown) configured to selectively connect (eg, close) or disconnect (eg, open) at least some of the antennas 297-1, 297-3, or 297-3 according to control may be included. there is. For example, when the electronic device 101 uses a wireless charging function, the NFC communication module 230 or the wireless charging module 250 controls the switching circuit so that the NFC antenna 297-3 and the wireless charging antenna ( At least a partial region of the radiation portion shared by 297-5 may be temporarily separated from the NFC antenna 297-3 and connected to the wireless charging antenna 297-5.

According to one embodiment, at least one function of the MST communication module 210, the NFC communication module 230, or the wireless charging module 250 may be controlled by an external processor (eg, the processor 120). . According to an embodiment, designated functions (eg, payment functions) of the MST communication module 210 or the NFC communication module 230 may be performed in a trusted execution environment (TEE). The Trusted Execution Environment (TEE) according to various embodiments is, for example, a function of the memory 130 to be used to perform a function requiring a relatively high level of security (eg, a financial transaction or a function related to personal information). An execution environment to which at least some designated areas are allocated may be formed. In this case, access to the designated area may be restrictedly allowed depending on, for example, a subject accessing the area or an application running in the trusted execution environment.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of this document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logic blocks, components, or circuits. can be used A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document describe one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the components described above may include a single object or a plurality of objects, and some of the multiple objects may be separately disposed in other components. . According to various embodiments, one or more components or operations among the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, operations performed by modules, programs, or other components are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

3A is a front perspective view of an electronic device according to an exemplary embodiment, FIG. 3B is a rear perspective view of an electronic device according to an exemplary embodiment, and FIG. 3C is an exploded rear perspective view of an electronic device according to an exemplary embodiment.

Referring to FIGS. 3A, 3B, and 3C , an electronic device 301 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment includes a housing 310, an internal support member 320, a display ( 330) and an antenna module (not shown).

In one embodiment, the housing 310 may form the outer shape of the electronic device 301 . The housing 310 includes a front surface 310a (eg, a surface in the +z direction), a rear surface 310b (eg, a surface in the -z direction), and an internal space between the front surface 310a and the rear surface 310b. An enclosing side surface 310c may be formed. For example, the housing 310 may include a first plate 311 (eg, a front plate), a second plate 312 (eg, a rear plate), and a side member 313 (eg, a side bezel structure). can

In one embodiment, the front surface 310a may be formed by a first plate 311 that is at least partially transparent. For example, the first plate 311 may face a first direction (eg, a +z direction). For example, the first plate 311 may include a glass plate or a polymer plate including at least one coating layer.

In one embodiment, the back surface 310b may be formed by a substantially opaque second plate 312 . For example, the second plate 312 may face a second direction (eg, -z direction) opposite to the first direction (eg, +z direction). For example, the second plate 312 may be formed of coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel, or magnesium), or a combination thereof.

In one embodiment, the side surface 310c may be formed by a side member 313 coupled to the first plate 311 and the second plate 312 . The side member 313 may surround at least a portion of the inner space between the front surface 310a and the rear surface 310b. For example, the side member 313 may be formed to surround a space between the first plate 311 and the second plate 312 . The side member 313 may include metal and/or polymer. For example, at least a part of the side member 313 may be formed of metal.

In one embodiment, the second plate 312 and the side members 313 may be integrally and seamlessly formed. In one embodiment, the second plate 312 and the side members 313 may be formed of substantially the same material (eg, aluminum).

In one embodiment, the internal support member 320 may be disposed in the inner space of the housing 310 . The internal support member 320 may provide a space and/or area in which various parts of the electronic device 301 are disposed. For example, various parts of the electronic device 301 may be fixedly connected to the internal support member 320 . For example, the inner support member 320 may be connected to the side member 313 or integrally formed with the side member 313 . For example, the internal support member 320 may fill a space between the first plate 311 and the second plate 312 . For example, the display 330 may be coupled to a front surface (eg, a surface in the +z direction) of the internal support member 320 . The inner support member 320 may include metal and/or polymer. For example, at least a portion of the internal support member 320 may be formed of metal.

In one embodiment, the display 330 (eg, the display module 160 of FIG. 1 ) may be located on the front surface 310a of the electronic device 301 . In one embodiment, the display 330 may be exposed through at least a portion of the first plate 311 .

In one embodiment, a printed circuit board (not shown) may be disposed in the inner space of the housing 310 . For example, a printed circuit board may be disposed on the inner support member 320 . An antenna module (eg, the antenna module 197 of FIG. 1 ) (not shown) may be connected to the printed circuit board. The ground provided in the antenna module 197 may be electrically connected to the internal support member 320 . For example, a ground provided in the antenna module 197 may be directly connected to the internal support member 320 . The internal support member 320 is electrically connected to the ground of the antenna module 197 and can function as a main ground.

3D is a rear view illustrating a portion of a side member and an inner support member according to an embodiment. 3E is a schematic diagram schematically illustrating shapes and positions of a first antenna structure, a second antenna structure, and an isolation structure according to an exemplary embodiment. 3F and 3G are perspective views illustrating an isolation structure according to an exemplary embodiment.

Referring to FIGS. 3D to 3G , in an embodiment, an electronic device (eg, the electronic device 301 of FIGS. 3A to 3C ) includes a first antenna structure 340, a second antenna structure 350, and a slit unit. 360 and an isolation structure 321 .

In one embodiment, the first antenna structure 340 and the second antenna structure 350 may be formed on at least a part of the side member 313 . For example, the first antenna structure 340 and the second antenna structure 350 may be formed as a part of the side member 313 . The first antenna structure 340 and the second antenna structure 350 may be formed adjacent to each other. A slit portion 360 formed by cutting the side member 313 may be formed between the first antenna structure 340 and the second antenna structure 350 . For example, as the slit portion 360 is formed, the side member 313 is segmented, and the segmented side member 313 may be formed as the first antenna structure 340 and the second antenna structure 350, respectively. there is. For example, the slit portion 360 may be formed at an upper edge (eg, on the +y direction side) of the electronic device 301 . The slit portion 360 may be formed in a slit shape to have a substantially narrow width (eg, a width in the x direction). However, this is exemplary, and the positions and/or shapes of the slit portion 360, the first antenna structure 340, and the second antenna structure 350 are not limited thereto.

In one embodiment, the first end 341 of the first antenna structure 340 and the second end 351 of the second antenna structure 350 may be positioned to face each other. The slit portion 360 may be formed between the first end 341 and the second end 351 . For example, one of the two ends of the side member 313 segmented by the slit portion 360 may be the first end 341 and the other may be the second end 351 . However, this is exemplary, and one or more slits 360 may be formed on the side member 313, and the side member 313 may include two or more antenna structures.

In one embodiment, the first antenna structure 340 and/or the second antenna structure 350 may be electrically connected to an antenna module (eg, the antenna module 197 of FIG. 1 ). For example, the first antenna structure 340 and the second antenna structure 350 may be connected to a common antenna module 197 or may be connected to separate antenna modules 197 respectively. The first antenna structure 340 and the second antenna structure 350 may function as radiators that radiate signals received from the antenna module 197 to the outside.

In one embodiment, a feeding part and/or a grounding part may be formed in the first antenna structure 340 and/or the second antenna structure 350, respectively. For example, a power feeding unit 342 may be formed at one position of the first antenna structure 340 . For example, the power supply unit 352 may be formed at one location of the second antenna structure 350 and the ground unit 353 may be formed at another location. For example, the second antenna structure 350 may be formed of a Planar Inverted-F Antenna (PIFA) structure. However, this is an example, and the structures of the first antenna structure 340 and/or the second antenna structure 350 are not limited thereto. For example, the feeding part and/or grounding part of the first antenna structure 340 and/or the second antenna structure 350 may be formed in various positions.

In one embodiment, the first antenna structure 340 and the second antenna structure 350 may generate signals of different bands. For example, the second antenna structure 350 may generate a signal of a relatively lower band than the first antenna structure 340 . For example, the second antenna structure 350 may generate a low-band signal, and the first antenna structure 340 may generate a mid-band signal. For example, the second antenna structure 350 may generate signals in the 600-900 MHz band, and the first antenna structure 340 may generate signals in the 1700-2100 MHz band. However, this is an example, and the band of the first antenna structure 340 and/or the second antenna structure 350 is not limited thereto. For example, the first antenna structure 340 and/or the second antenna structure 350 may generate multi-band signals. For example, the second antenna structure 350 can generate low-band as well as mid-band signals.

In one embodiment, the isolation structure 321 may extend from the inner support member 320 toward the slit portion 360 . At least a portion of the isolation structure 321 may be positioned between the first antenna structure 340 and the second antenna structure 350 . For example, one end 3211 of the isolation structure 321 may be positioned at the slit portion 360 to be spaced apart from the first end 341 and the second end 351 . The isolation structure 321 may be formed in a block shape extending from the internal support member 320 toward the slit portion 360 . For example, the isolation structure 321 may have a length extending from the internal support member 320 toward the slit portion 360 (eg, a length in the y direction) and may have a thickness in a width direction (eg, an x direction). there is. However, this is an example, and the shape and/or location of the isolation structure 321 is not limited thereto. For example, the isolation structure 321 may be formed in a shape capable of avoiding interference with other components.

In one embodiment, the isolation structure 321 may be integrally formed with the internal support member 320 . For example, the isolation structure 321 can be substantially part of the inner support member 320 . Alternatively, in one embodiment, the isolation structure 321 may be formed separately from the internal support member 320 and may be fastened to the internal support member 320 through a fastening member.

In one embodiment, at least a portion of the isolation structure 321 may be formed of metal. The isolation structure 321 is electrically connected to the internal support member 320 and may substantially function as a main grind. One end 3211 of the isolation structure 321 is positioned between the first antenna structure 340 and the second antenna structure 350, thereby generating a gap between the first antenna structure 340 and the second antenna structure 350. signal interference can be reduced. For example, when the first antenna structure 340 and the second antenna structure 350 generate similar band (eg, mid-band) signals, the isolation structure 321 may be used to separate the first antenna structure 340 and the second antenna structure 340 from each other. Since the antenna structures 350 are isolated from each other, signal interference that may occur between the first antenna structure 340 and the second antenna structure 350 can be reduced. Since the isolation structure 321 is spaced apart from the second end 351 of the second antenna structure 350, the second antenna structure 350 has an open end (eg, the second end 351). A Planar Inverted-F Antenna (PIFA) structure may be maintained. Thus, through the isolation structure 321, the first antenna structure 340 and

While the second antenna structures 350 can be isolated from each other, low-band signal performance of the second antenna structures 350 can be improved. As a result, a new band signal can be generated using an existing antenna structure (eg, the first antenna structure 340 or the second antenna structure 350) without adding a separate antenna structure for generating a new band signal. it may be possible to generate In addition, since the isolation structure 321 is directly connected to the internal support member 320 serving as the main ground instead of being connected via a printed circuit board, the effect can be further enhanced by omitting an additional connection structure.

In one embodiment, end 3211 of isolation structure 321 may be located closer to first end 341 than second end 351 . For example, a distance between end 3211 and first end 341 of isolation structure 321 may be less than a distance between end 3211 and second end 351 of isolation structure 321 . When the second antenna structure 350 generates a low-band signal, the more the isolation structure 321 is positioned farther away from the second end 351, the more the end of the second antenna structure 350 (eg, the second end 351 )) can be more open, so the performance of the second antenna structure 350 can be improved. In addition, when the first antenna structure 340 generates a mid-band signal, in order to prevent interference with the mid-band signal generated by the second antenna structure 350, the isolation structure 321 is provided close to the first end 341. As it is positioned, the performance of the first antenna structure 340 may be improved.

In one embodiment, the isolation structure 321 may be formed to have a cross-sectional area as large as possible (eg, cross-sectional area with respect to the y-z plane). When the isolation structure 321 has a large cross-sectional area, the performance of the antenna can be improved while reducing capacitance due to coupling between the first antenna structure 340 and the ground. For example, the isolation structure 321 may be formed to have a cross-sectional area as large as possible without interfering with other components. For example, the isolation structure 321 may have a length extending from the internal support member 320 toward the slit portion 360 (eg, a length in the y direction) as long as possible. For example, the isolation structure 321 may extend as long as possible on a line that does not extend outward beyond the side member 313 . For example, the isolation structure 321 may extend from a location on the inner support member 320 as far away from the side member 313 as possible. The isolation structure 321 may be formed as thick as possible (eg, the z-direction thickness) in the thickness direction (eg, z-direction) of the electronic device (eg, the electronic device 301 of FIG. 3A ).

In an embodiment, the width of the slit portion 360 may increase from the outside to the inside of the electronic device (eg, the electronic device 301 of FIG. 3A ). For example, based on FIG. 3D , the slit portion 360 may increase in width (eg, x-direction width) toward the -y direction. When the surfaces of the first end 341 and the second end 351 facing each other are referred to as the first end face 3411 and the second end face 3511, the second end face 3511 is the first end face 3511. It may be inclined in a direction away from the side surface 3411 . For example, the second end surface 3511 is further away from the first end surface 3411 in a direction from the outside to the inside of the electronic device 301 (eg, -y direction with respect to FIG. 3D ) ( Example: It may be formed inclined in the -x direction based on FIG. 3D). The end portion 3211 of the isolation structure 321 may be formed in a shape corresponding to that of the slit portion 360 . For example, a surface facing the second end surface 3511 of the end 3211 of the isolation structure 321 may be formed as an inclined surface corresponding to the second end surface 3511 . According to this structure, since the slit portion 360 can be formed with a narrow width (eg, x-direction width) outside the electronic device 301, the electronic device 301 does not impede the external design of the electronic device 301. Since the rigidity of the structure 301 can be maintained and the second end 351 can be further separated from the first end 341 inside the electronic device 301, the performance of the second antenna structure 350 can be improved. can Meanwhile, this is exemplary, and the first end surface 3411 may be inclined in a direction away from the second end surface 3511 .

3D to 3G , the isolation structure 321 has been described based on the slit portion 360 formed on the upper side (eg, +y side) of the electronic device 301, but this is exemplary and the isolation structure 321 ) is applied is not limited thereto. For example, the isolation structure 321 may be applied to the slit portion 360 formed in various locations.

Referring to FIG. 3H , in one embodiment, the slit portion 360 may be covered by an injection structure 370 . For example, the isolation structure (eg, the isolation structure 321 of FIG. 3D ) may be covered by the injection structure 370 and not exposed to the outside of the electronic device 301 . According to such a structure, since the isolation structure 321 is not exposed to the outside, antenna performance may be improved and the external design of the electronic device 301 may not be hindered.

Referring to FIG. 4A , in one embodiment, the isolation structure 421a may be substantially formed in a plate shape. For example, the isolation structure 421a may be formed in a plate shape extending from the internal support member 420 toward the slit portion 460 . For example, the isolation structure 421a may have a y-z direction surface, a length in the y direction and a width in the z direction, and a thin thickness in the x direction.

Referring to FIG. 4B , in one embodiment, at least a portion of the slit portion 460 may be formed to have a substantially constant width (eg, x-direction width). For example, the slit portion 460 may be formed such that a portion close to the outside of the electronic device (eg, the electronic device 301 of FIG. 3A ) has a substantially constant width (eg, x-direction width). For example, the first end face 4411 of the first end 441 of the first antenna structure 440 and the second end face 4511 of the second end 451 of the second antenna structure 450 are can be substantially parallel to each other

Referring to FIG. 4C , in an embodiment, an end portion 4211c of the isolation structure 421c may be formed to have a relatively thicker width (eg, a width in the x direction) than the other portion. For example, one end 4211c of the isolation structure 421c may be formed relatively thicker in the x direction than other parts of the isolation structure 421c. For example, one end 4211c of the isolation structure 421c may have a shape that further protrudes in a direction toward the first antenna structure 440 (eg, a +x direction).

Referring to FIG. 4D , in an embodiment, an end portion 4211d of the isolation structure 421d may be formed to be stepped in a width direction (eg, an x direction) compared to other portions. For example, one end 4211d of the isolation structure 421d may be formed to be relatively stepped in the x direction compared to other parts of the isolation structure 421d. For example, one end 4211d of the isolation structure 421d may have a stepped shape in a direction toward the first antenna structure 440 (eg, a +x direction).

However, FIGS. 4A to 4D are exemplary, and the shapes of the isolation structure and the slit are not limited thereto.

According to various embodiments, the first end 341 of the first antenna structure 340 and the second end 351 of the second antenna structure 350 may be positioned to face each other.

According to various embodiments, the slit portion 360 may be formed between the first end 341 and the second end 351 .

According to various embodiments, the end 3211 of the isolation structure 321 may be positioned in the slit part 360 to be spaced apart from the first end 341 and the second end 351 .

According to various embodiments, the end 3211 of the isolation structure 321 may be located closer to the first end 341 than the second end 351 .

According to various embodiments, the width of the slit portion 360 may increase from the outside to the inside of the electronic device 301 .

According to various embodiments, when surfaces of the first end 341 and the second end 351 facing each other are referred to as the first end face 3411 and the second end face 3511, the second end face 3411 and the second end face 3511, respectively. The side surface 3511 may be inclined in a direction away from the first end surface 3411 .

According to various embodiments, the end 3211 of the isolation structure 321 may be formed in a shape corresponding to the slit portion 360 .

According to various embodiments, the isolation structure 321 may be formed in a plate shape or block shape extending from the internal support member toward the slit portion 360 .

According to various embodiments, the internal support member may function as a main ground.

According to various embodiments, the isolation structure 321 may be integrally formed with the internal support member.

According to various embodiments, the isolation structure 321 may be formed separately from the internal support member and may be coupled to the internal support member through a fastening member.

According to various embodiments, the slit portion 360 may be covered by an injection structure 370 .

According to various embodiments, the isolation structure 321 may not be exposed to the outside of the electronic device 301 .

According to various embodiments, the first antenna structure 340 may generate a signal in a band of 1700 to 2100 MHz, and the second antenna structure 350 may generate a signal in a band of 600 to 900 MHz.

According to various embodiments, the isolation structure 321 may be positioned in the slit portion 360 to be spaced apart from the first end 341 and the second end 351 .

According to various embodiments, the isolation structure 321 may be covered by the injection structure 370 and not exposed to the outside of the electronic device 301 .

Claims

In electronic devices,

a housing including a first plate facing a first direction, a second plate facing a second direction opposite to the first direction, and a side member formed to surround a space between the first plate and the second plate;

an antenna module disposed in an inner space of the housing;

an inner support member disposed in the inner space of the housing and electrically connected to the ground of the antenna module;

a first antenna structure and a second antenna structure formed adjacent to each other on at least a portion of the side member;

a slit formed by cutting the side member between the first antenna structure and the second antenna structure; and

and an isolation structure extending from the inner support member toward the slit portion and positioned between the first antenna structure and the second antenna structure.
According to claim 1,

wherein the first end of the first antenna structure and the second end of the second antenna structure are positioned to face each other.
According to claim 2,

The electronic device, wherein the slit portion is formed between the first end and the second end.
According to claim 3,

An end of the isolation structure is positioned in the slit portion to be spaced apart from the first end and the second end.
According to claim 4,

and an end of the isolation structure is located closer to the first end than to the second end.
According to claim 4,

The electronic device of claim 1 , wherein a width of the slit portion increases from the outside to the inside of the electronic device.
According to claim 6,

When the first end face and the second end face facing each other are referred to as a first end face and a second end face, respectively, the second end face is formed to be inclined in a direction away from the first end face.
According to claim 6,

An end of the isolation structure is formed in a shape corresponding to the slit portion.
According to claim 1,

The electronic device of claim 1 , wherein the isolation structure is formed in a plate shape or a block shape extending from the inner support member toward the slit portion.
According to claim 1,

The internal support member functions as a main ground.
According to claim 10,

The electronic device of claim 1 , wherein the isolation structure is integrally formed with the inner support member.
According to claim 10,

The electronic device of claim 1 , wherein the isolation structure is formed separately from the inner support member and is fastened to the inner support member through a fastening member.
According to claim 4,

The electronic device of claim 1, wherein the slit portion is covered by an injection structure.
According to claim 13,

The isolation structure is not exposed to the outside of the electronic device.
According to claim 1,

The first antenna structure generates signals in the 1700 to 2100 MHz band,

The second antenna structure generates a signal in a 600 to 900 MHz band.