WO2023075121A1 - Carte de circuit imprimé comprenant des antennes fonctionnant dans différentes bandes de fréquence, et dispositif électronique la comprenant - Google Patents

Carte de circuit imprimé comprenant des antennes fonctionnant dans différentes bandes de fréquence, et dispositif électronique la comprenant Download PDF

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Publication number
WO2023075121A1
WO2023075121A1 PCT/KR2022/013167 KR2022013167W WO2023075121A1 WO 2023075121 A1 WO2023075121 A1 WO 2023075121A1 KR 2022013167 W KR2022013167 W KR 2022013167W WO 2023075121 A1 WO2023075121 A1 WO 2023075121A1
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WO
WIPO (PCT)
Prior art keywords
area
antenna
electronic device
sub
circuit board
Prior art date
Application number
PCT/KR2022/013167
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English (en)
Korean (ko)
Inventor
유창하
김윤식
서민철
강우석
김정길
신동헌
윤수민
이민경
Original Assignee
삼성전자주식회사
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Priority claimed from KR1020220013998A external-priority patent/KR20230059682A/ko
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Publication of WO2023075121A1 publication Critical patent/WO2023075121A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present disclosure relates generally to electronic devices, including, for example, printed circuit boards containing antennas operating in different frequency bands.
  • An electronic device includes a first printed circuit board, a first antenna region including a plurality of first antennas operating in a first frequency band, and a circuit board operating in a second frequency band different from the first frequency band.
  • a second antenna area including a second antenna and connected to the first antenna area, and a connection area including a connector connecting the plurality of first antennas and the second antenna to the first printed circuit board. It may include a second printed circuit board.
  • a printed circuit board includes a first antenna area including a plurality of first antennas operating in a first frequency band and a second antenna operating in a second frequency band different from the first frequency band; It may include a second antenna area connected to the first antenna area, and a connection area including a connector connected to the plurality of first antennas and the second antenna.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.
  • FIG. 2A is an exploded perspective view of an electronic device according to an exemplary embodiment, in which an antenna is omitted.
  • FIG. 2B is an exploded perspective view of a mounting portion of a rear frame and an antenna according to an embodiment.
  • FIG. 2C is an exploded perspective view of a rear frame and an antenna according to an exemplary embodiment.
  • FIG. 2D is a diagram schematically illustrating another arrangement of the plurality of patch plates of FIGS. 2A to 2C.
  • 3A is a diagram of a printed circuit board including a first antenna operating in a first frequency band and a second antenna operating in a second frequency band in an electronic device according to an embodiment.
  • 3B is a diagram of a first layer of a printed circuit board according to one embodiment.
  • 3C is a diagram of an intermediate layer of a printed circuit board according to one embodiment.
  • 3D is a diagram of a second layer of a printed circuit board according to one embodiment.
  • 3E is a diagram of a second antenna according to an embodiment.
  • 3F is a diagram of a first sub-region of a second antenna according to an embodiment.
  • 3G is a diagram of a second sub-region of a second antenna according to an embodiment.
  • 3H is a diagram of a third sub-region of a second antenna according to an embodiment.
  • FIG. 4 is a diagram of a printed circuit board according to one embodiment.
  • FIG. 5 is a diagram of a printed circuit board according to one embodiment.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to an embodiment.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included.
  • at least one of these components eg, the connection terminal 178) may be omitted or one or more other components may be added.
  • some of these components eg, sensor module 176, camera module 180, or antenna module 197) are integrated into one component (eg, display module 160). It can be.
  • the processor 120 for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers commands or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • software eg, the program 140
  • the processor 120 transfers commands or data received from other components (eg, sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 .
  • the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor).
  • a main processor 121 eg, a central processing unit or an application processor
  • a secondary processor 123 eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor.
  • NPU neural network processing unit
  • the secondary processor 123 may be implemented separately from or as part of the main processor 121 .
  • the secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the auxiliary processor 123 eg, an image signal processor or a communication processor
  • the auxiliary processor 123 may include a hardware structure specialized for processing an artificial intelligence model.
  • AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples.
  • the artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 .
  • the data may include, for example, input data or output data for software (eg, program 140) and commands related thereto.
  • the memory 130 may include volatile memory 132 or non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user).
  • the input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101 .
  • the sound output module 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • a receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module).
  • a wireless communication module 192 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 eg, : a local area network (LAN) communication module or a power line communication module.
  • a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • a telecommunications network such as a computer network (eg, a LAN or a WAN).
  • These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips).
  • the wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 101 may be identified or authenticated.
  • the wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology).
  • NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low latency
  • -latency communications can be supported.
  • the wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • the wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported.
  • the wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199).
  • the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.
  • eMBB peak data rate for eMBB realization
  • a loss coverage for mMTC realization eg, 164 dB or less
  • U-plane latency for URLLC realization eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less
  • the antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC) may be additionally formed as a part of the antenna module 197 in addition to the radiator.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself.
  • one or more external electronic devices may be requested to perform the function or at least part of the service.
  • One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 .
  • the electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • An electronic device may be a device of various types.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance.
  • a portable communication device e.g, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a camera
  • a wearable device e.g., a smart bracelet
  • first, second, or first or secondary may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited.
  • a (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in an embodiment of this document may include a unit implemented by hardware, software, or firmware, and is interchangeably interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • One embodiment of this document is one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them.
  • a processor eg, the processor 120
  • a device eg, the electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.
  • a signal e.g. electromagnetic wave
  • the method according to the embodiment disclosed in this document may be included and provided in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • a computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play StoreTM) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • a device-readable storage medium e.g. compact disc read only memory (CD-ROM)
  • an application store e.g. Play StoreTM
  • It can be distributed (eg downloaded or uploaded) online, directly between smart phones.
  • at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.
  • each component (eg, module or program) of the components described above may include a single object or a plurality of objects, and some of the multiple objects may be separately disposed in other components. .
  • one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg modules or programs
  • the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. .
  • operations performed by modules, programs, or other components are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.
  • FIG. 2A is an exploded perspective view of an electronic device according to an exemplary embodiment, in which an antenna is omitted.
  • 2B is an exploded perspective view of a mounting portion of a rear frame and an antenna according to an embodiment.
  • 2C is an exploded perspective view of a rear frame and an antenna according to an exemplary embodiment.
  • FIG. 2D is a diagram schematically illustrating another arrangement of the plurality of patch plates of FIGS. 2A to 2C.
  • an electronic device 220 (eg, the electronic device 101 of FIG. 1 ) according to an embodiment includes a housing 222 , 228 , and 229 , at least one support structure 221 , 224 and 226), a display 223, a battery 225, and an antenna 227.
  • the housings 222 , 228 , and 229 may form the exterior of the electronic device 220 .
  • the housings 222, 228, and 229 include a front housing 222 (eg, a front cover glass) surrounding the front outer surface of the electronic device 220 and a side housing 229 ( For example, a bezel frame) and a rear housing 228 (eg, a rear cover glass) that surrounds a rear outer surface of the electronic device 220 .
  • Figure 2a shows that the housings (222, 228, 229) are divided into three parts covering the front, side and rear, respectively, but this is only one example, for example, the side housing 229 It may be integrally formed with the front housing 222 or the rear housing 229 . Alternatively, the entire exterior of the electronic device 220 may be formed by coupling the front housing 222 and the rear housing 228 to each other without a separate side housing 229 . Alternatively, it should be noted that the housings 222, 228, and 229 may be formed as two housings divided in different directions and numbers, for example, upper and lower. Unless stated to the contrary, the front, side, and bottom surfaces refer only to portions where the housing is positioned relative to the electronic device 220, and detailed descriptions thereof will be omitted.
  • the rear housing 228 has a structure surrounding the rear outer surface of the electronic device 220 so that the radiating portion 227-1 of the antenna 227 is not directly exposed to the outside, and the radiating portion ( 227-1) can be reduced.
  • a portion of the rear housing 228 overlapping the radiation unit 227-1 in the front-back direction is formed of a non-conductive material, so that transmission from the radiation unit 227-1
  • the gain of radio waves can be reduced.
  • overlapping parts may be understood as overlapping parts when viewed from one direction.
  • the support structures 221 , 224 , and 226 are disposed inside the housings 222 , 228 , and 229 and include at least one or more of the plurality of electronic components 223 , 224 , and 225 accommodated inside the electronic device 220 . Electronic components can be supported.
  • the radiating part 227 - 1 and the ground part 227 - 5 of the antenna 227 may be respectively disposed on both sides of the support structures 221 , 224 , and 226 .
  • the support structures 221, 224, and 226 that already exist to perform functions required in the electronic device 220 can be used as a substrate for the antenna 227, mounting Space efficiency can be improved.
  • the support structures 221, 224, and 226 typically have a sufficient thickness, so that the thickness of the substrate of the antenna 227 is improved. By having the effect, the radiation efficiency of the antenna 227 can also be improved.
  • the support structures 221, 224, and 226 may include a first frame 221 (eg, a front frame) for supporting the display 223, a printed circuit board 224, and a second frame 226 ( eg rear frame).
  • first frame 221 eg, a front frame
  • second frame 226 eg rear frame
  • the support structures 221, 224, and 226 have been described as including two frames 221 and 226, but any one of these frames may be omitted or an additional frame may be further provided.
  • the structure 221 positioned most forward among the one or more support structures 221, 224, and 226 based on the front-back direction is referred to as a "front frame”
  • the support structure 226 located at the rearmost position may be referred to as a "rear frame”.
  • the support structures 221 , 224 , and 226 include only one frame, the one frame may be referred to as a “rear frame” in that it is located at the rear with respect to the display 223 .
  • the display 223 may output visual information (eg, text, video, and/or image) and provide the information to the user through the front housing 222 .
  • visual information eg, text, video, and/or image
  • the front frame 221 may support the display 223 toward the front housing 222 at the rear of the front housing 222 .
  • the rigidity of the front frame 221 may be higher than that of the housings 222 , 228 , and 229 .
  • deformation of the entire electronic device 220 can be reduced by using the front frame 221 while relatively freely selecting the material of the housings 222 , 228 , and 229 .
  • the front frame 221 may have a structure connected to the side housing 229 .
  • the front frame 221 and the side housing 229 may be integrally formed, but are not necessarily limited in this way, and the front frame 221 and the side housing 229 are separate members, respectively. Those skilled in the art will understand that it may be provided.
  • the front frame 221 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the front frame 221 may have a display 223 coupled to a front surface and a printed circuit board 224 coupled to a rear surface.
  • One or more components may be mounted on the printed circuit board 224 .
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • a board connector 224-1 for transmitting a signal to or receiving a signal from the antenna 227 and various electronic components 224-2 (eg, a camera module) can be fitted.
  • the battery 225 may supply power to one or more components (eg, the display 223 , the printed circuit board 224 , and/or the antenna 227 ). For example, at least a portion of the battery 225 may be disposed substantially on the same plane as the printed circuit board 224 .
  • the battery 225 may be integrally disposed inside the electronic device 220 or may be disposed detachably from the electronic device 220 .
  • the rear frame 226 may be disposed behind the front frame 221 .
  • electronic components may be fixed to the rear frame 226 .
  • the rear frame 226 may be formed by injection molding.
  • the rear frame 226 can also be referred to as "rear injection molding".
  • the rigidity of the rear frame 226 may be higher than that of the housings 222 , 228 , and 229 .
  • the rear frame 226, together with the front frame 221, may form a space in which at least one electronic component 224-1 can be disposed between the front frame 221 and the rear frame 226. .
  • a part of the front frame 221 and a part of the rear frame 226 may directly contact each other to form a space between the front frame 221 and the rear frame 226 .
  • the rigidity of the front frame 221 and the rear frame 226 is higher than that of the printed circuit board 224, respectively, and the printed circuit board 224 includes the front frame 221 and the rear frame ( 226) can be placed between them. According to such a rigid space, it is possible to reduce the transfer of impact from the outside to the relatively flexible printed circuit board 224, so that various electronic components 224-1 inside the electronic device 220 can reduce their damage.
  • the rear frame 226 since the rear frame 226 is formed of a dielectric material, at least a portion of the rear frame 226 may be used as a substrate for the antenna 227 .
  • the rear frame 226 may include a seating portion 226-2, a connecting hole 226-1, a through portion 226-3, a recessed portion 226-4, and a protruding portion 226-5. .
  • the penetrating portion 226-3, the recessed portion 226-4, and the protruding portion 226-5 may be structures for appropriately supporting or accommodating various electronic components or various structures accommodated inside the electronic device 220.
  • one or more electronic components 224 - 2 eg, a camera module
  • installed on the printed circuit board 224 may pass through the through portion 226 - 3 and be exposed to the rear housing 228 .
  • the depression 226 - 4 may provide a space in which an electronic component (eg, an antenna) mounted on an inner wall of the rear housing 228 can be accommodated.
  • the protrusion 226-5 has a shape that is tightly fitted into a groove formed in the rear housing 228, so that the rear frame 226 and the rear housing 228 can be fastened to each other.
  • the protrusions 226-5 and/or the depressions 226-4 may be formed not only on the rear face of the rear frame 226 as shown, but also on the front face.
  • the protrusions 226-5 and/or the depressions 226-4 may be formed on the front face and/or other components adjacent to the rear face of the rear frame 226 (e.g., printed circuit board 224, battery 225 and And/or the rear housing 228 may support other components to reduce movement relative to the rear frame 226 .
  • the protrusions 226-5 may be formed not to interfere with other parts, but to function as reinforcing ribs for reinforcing the rigidity of the rear frame 226 itself.
  • the rear frame 226 does not have a simple planar shape, but may have protrusions 226-5, depressions 226-4, and/or penetrating portions 226-3 that perform various functions. make it clear that
  • the seating portion 226-2 on which the antenna 227 is seated may have, for example, a substantially flat shape.
  • a region of the mounting portion 226-2 overlapped with the radiation portion 227-1 of the antenna 227 in the front-rear direction may be flat. According to this shape, as will be described later, since the thickness of the mounting portion 226-2 functioning as a dielectric is constant, it is possible to improve the ease of designing the pattern of the antenna 227.
  • the seating portion 226-2 is a portion located between the radiation portion 227-1 and the ground portion 227-5 of the antenna 227, and is made of a dielectric, a material that causes an electrical induction action. , can serve as a substrate for the antenna 227.
  • the seating portion 226-2 is formed of (i) polycarbonate or (ii) a synthetic material including polycarbonate and glass fiber (eg, PC+GF30%) It can be.
  • the rear frame 226 may be made of the same dielectric material. According to this configuration, since the rear frame 226 including the mounting portion 226-2 can be integrally injection-molded, the ease of manufacture can be improved.
  • the seating portion 226 - 2 may have a more recessed shape than the adjacent peripheral area of the rear frame 226 , but is not necessarily limited thereto.
  • the seating portion 226-2' may not have a step with respect to an adjacent peripheral area of the rear frame 226'.
  • the connecting hole 226-1 is positioned adjacent to the seating portion 226-2 and may pass through the rear frame 226 in the front-rear direction. According to this configuration, the antenna 227 is physically and electrically connected to the printed circuit board 224 through the connecting hole 226-1, so that power can be supplied from the printed circuit board 224 to the antenna 227.
  • the connecting hole 226-1 may be disposed within 1 cm from the seating portion 226-2.
  • a step eg, a staircase
  • an inclined surface may be disposed between the connecting hole 226-1 and the seating portion 226-2.
  • the connecting hole 226-1 is shown as being formed inside the rear frame 226, otherwise, the connecting hole 226-1 may have a shape recessed from the side of the rear frame 226. make it clear that for example, it should be noted that the rear frame 226 may further include a cutout communicating with the outside in the lateral direction of the connecting hole 226-1. According to this structure, the antenna 227 can be installed on the rear frame 226 using a manufacturing method as described later in FIG. 5B.
  • the outer surfaces of the dielectric 227-3 of the antenna 227 may be disposed to face the inner wall of the connecting hole 226-1.
  • some of the exposed surfaces of the dielectric 227-3 that are not covered by the radiation portion 227-1 and the ground portion 227-5 are the inner walls of the connecting hole 226-1. It can be arranged to face.
  • the above-described exposed surface may face the inner wall of the connecting hole 226-1.
  • the dielectric 227-3 is formed on the inner surface of the connecting hole 226-1 so that there is no gap between the outer surface of the dielectric 227-3 and the inner surface of the connecting hole 226-1 facing each other. can be adhered to.
  • a fine gap may be generated between the outer surface of the dielectric 227-3 and the inner surface of the connecting hole 226-1 during the manufacturing process.
  • the connecting hole 226 - 1 may be formed in a shape different from that shown in FIGS. 2A and 2B (eg, a triangle, a pentagon, a hexagon, a circle, and/or an ellipse).
  • at least some of the outer surfaces of the dielectric 227-3 of the antenna 227 may be disposed to face the inner wall of the connecting hole 226-1.
  • the dielectric 227-3 of the antenna 227 may include polyimide.
  • the dielectric 227-3 of the antenna 227 may include modified polyimide (MPI).
  • MPI modified polyimide
  • Antenna 227 may be disposed between, for example, rear housing 228 and battery 225 .
  • the antenna 227 may include, for example, an ultra-wide band (UWB) antenna, a magnetic secure transmission (MST) antenna 297-1, a near field communication (NFC) antenna 297-3, and/or Alternatively, a wireless charging antenna 297-5 may be included.
  • the antenna 227 may, for example, perform long-distance communication with an external device, short-distance communication, or wirelessly transmit/receive power required for charging.
  • the antenna 227 will be illustratively described as an ultra-wideband (UWB) antenna, but unless otherwise stated, the following description can be applied to other types of antennas.
  • Ultra-wideband (UWB) antenna for example, uses a high frequency (2.1 GHz to 10.6 Ghz) to achieve high positioning accuracy with an error range of less than 10 cm and a time of flight (TOF) method that can utilize a wide bandwidth of 500 Mhz. It may be a technology with enhanced security.
  • Ultra-wideband (UWB) antennas may be used, for example, for access (ACCESS) technologies (e.g. security, car keys and/or digital keys), location based services (LBS) (e.g. indoor navigation), human/ It can be used for people/asset tracking technology, mobile payment, and internet of things (IoT) devices.
  • ACCESS access
  • LBS location based services
  • IoT internet of things
  • a positioning method using an ultra-wideband (UWB) antenna for example, a time of flight (ToF) measurement method, a time of arrival (ToA) measurement method, and/or an angle of arrival (angle of arrival, AoA) measurement method, and the case where the antenna 227 uses the angle-of-arrival measurement method will be exemplarily described below, but it will be clarified that other measurement methods may be used unless otherwise stated.
  • TOF time of flight
  • ToA time of arrival
  • AoA angle of arrival
  • the antenna 227 includes a radiating part 227-1 and a grounding part 227-5 disposed on both sides of the rear frame 226, respectively, and the above-described radiating part 227-1 and the grounding part 227-5. ) may include a dielectric 227-3 disposed between.
  • the radiation part 227-1 may be disposed on a rear surface of the seating part 226-2, and the ground part 227-5 may be disposed on a front surface of the seating part 226-2.
  • the antenna 227 is disposed on the rear frame 226, not on the other support structures 221 and 224, and the radiating part 227-1 is disposed on the rear surface of the rear frame 226.
  • the signal emitted from the radiation unit 227-1 is transmitted to internal parts (eg, the display 223, the board connector 224-1, and/or the electronic part 224-1) including various conductive materials. 2)), the radiation efficiency can be improved.
  • internal parts eg, the display 223, the board connector 224-1, and/or the electronic part 224-1 including various conductive materials. 2
  • a component having a conductive material such as an electronic component 224-2, overlaps the antenna 227 in the front-back direction and is located on the opposite side of the radiating portion 227-1. It is possible to place Therefore, according to this configuration, the degree of freedom in the design of internal components of the electronic device 220 can be improved.
  • the first part 227-11 of the radiation part 227-1 covers the dielectric 227-3, and the second part 227-12 of the radiation part 227-1 ) may cover a part of the rear frame 226 (eg, the seating portion 226-2).
  • a first portion of the ground portion 227-5 covers the dielectric 227-3, and a second portion of the ground portion 227-5 covers the rear frame 226 (eg, the seating portion 226-3). 2)) can cover part of.
  • the dielectric disposed on the rear surface of the rear frame 226 is not required, it can be confirmed that the thickness of the entire antenna 227 can be drastically reduced by the thickness of the dielectric.
  • the thickness can be dramatically reduced.
  • the radiation part 227 - 1 may include a plurality of patch plates P1 , P2 , and P3 in a patch shape. Using such a plurality of patch plates (P1, P2, P3), it is possible to detect the direction in which the electromagnetic source is located. For example, first, the magnitudes of signals received using the plurality of patch plates P1, P2, and P3 are compared, or second, the phases of signals received using the plurality of patch plates P1, P2, and P3. By comparing , it is possible to detect the direction in which the electromagnetic source is located.
  • the plurality of patch plates (P1, P2, P3) include, for example, three patch plates (P1, P2, P3) that are not located on a straight line, and the above-described three patch plates (P1, P2, According to P3), both components of horizontal polarization, which is a radio wave vibrating in a horizontal direction with respect to the traveling direction, and vertical polarization, which is a radio wave vibrating in a vertical direction with respect to the traveling direction, can be confirmed. Therefore, by detecting the above-mentioned angle of arrival (AoA), it can function as an ultra-wideband (UWB) antenna 227 that detects the direction of the electromagnetic source with high resolution.
  • UWB ultra-wideband
  • the three patch plates P1 , P2 , and P3 include (i) a first patch plate P1 disposed on the rear surface of the rear frame 226 and (ii) the rear frame 226 ) On the rear surface of the first patch plate (P1) in a first direction (eg, +x-axis direction) spaced apart from the patch-shaped second patch plate (P2), (iii) of the rear frame 226 On the rear surface, a patch-shaped third patch plate P3 spaced apart from the first patch plate P1 in a second direction (eg, the +y-axis direction) may be included.
  • a first direction eg, +x-axis direction
  • a patch-shaped third patch plate P3 spaced apart from the first patch plate P1 in a second direction (eg, the +y-axis direction) may be included.
  • the center of the first patch plate (P1), the center of the second patch plate (P2) and the center of the third patch plate (P3) are installed so as not to be located on a straight line, so that there are two types of horizontal polarization and vertical polarization All ingredients can be checked.
  • the first direction (eg, +x-axis direction) and the second direction (eg, +y-axis direction) may be orthogonal to each other on the rear surface of the rear frame 226 .
  • An angle formed by the second imaginary lines connecting centers to each other may range from about 45 degrees to about 135 degrees.
  • the angle formed by the first virtual line and the second virtual line may be about 90 degrees.
  • each of the three patch plates P1 , P2 , and P3 may be disposed at a position corresponding to a vertex of a right triangle on the rear surface of the rear frame 226 .
  • UWB ultra-wideband
  • the second patch plate P2 and the third patch plate P3 may have various shapes without being limited to the illustrated embodiment. For example, as shown in FIG.
  • the second patch plate P2 and the third patch plate P3 are directed in an oblique direction with respect to the first patch plate P1 (eg, +/ ⁇ x axis and +/ ⁇ x axis). direction between the -y axis) to form a substantially triangular structure together with the first patch plate (P1).
  • the antenna 227 may include two or fewer patch plates, or four or more patch plates.
  • the dielectric 227-3 may be positioned at a portion overlapping the board connector 224-1 when viewed in the front-back direction.
  • the dielectric 227-3 when viewed in the front-back direction, is (i) spaced apart from the second patch plate (P2) in a second direction (eg, +y-axis direction), (ii) It may be disposed at a position spaced apart from the third patch plate P3 in a first direction (eg, +x-axis direction).
  • the three patch plates P1, P2, and P3 and the dielectric 227-3 can form a substantially rectangular shape as a whole.
  • the three patch plates P1 , P2 , and P3 may form various shapes (eg, triangular structures) as described above.
  • 3A is a diagram of a printed circuit board including a first antenna operating in a first frequency band and a second antenna operating in a second frequency band in an electronic device according to an embodiment.
  • 3B is a diagram of a first layer of a printed circuit board according to one embodiment.
  • 3C is a diagram of an intermediate layer of a printed circuit board according to one embodiment.
  • 3D is a diagram of a second layer of a printed circuit board according to one embodiment.
  • an electronic device 301 may include a housing 310 (eg, housings 222 , 228 , and 229 ). there is.
  • the housing 310 includes a plurality of side members 311 defining a space in which at least one electronic component (eg, the antenna module 397) is disposed, and between a pair of adjacent side members 311. It may include at least one slot 312 .
  • the electronic device 301 may include a first printed circuit board 351 and a second printed circuit board 352 .
  • the first printed circuit board 351 may include, for example, a power management module (eg, the power management module 188 of FIG. 1 ).
  • the second printed circuit board 352 may include an antenna module 397 (eg, the antenna module 197 of FIG. 1 and/or the antenna 227 of FIGS. 2A to 2C).
  • the second printed circuit board 352 may include a plurality of layers 352A, 352B, and 352C.
  • the second printed circuit board 352 includes a first layer 352A including a feed pattern, a second layer 352C including a ground, and the first layer 352A and the second layer ( 352C) may include an intermediate layer 352B comprising a dielectric between them.
  • the second printed circuit board 352 may further include an additional layer comprising a dielectric above the first layer 352A and/or an additional layer comprising a dielectric below the second layer 352C.
  • the antenna module 397 includes a plurality of first antennas 381 configured to operate in a first frequency band (eg, ultra-wide band (UWB), about 6.5 GHz and about 8.5 GHz). ), and a second antenna 391 configured to operate in a second frequency band different from the first frequency band (eg, WiFi 802.11n, about 2.4 GHz and about 5 GHz).
  • a first frequency band eg, ultra-wide band (UWB), about 6.5 GHz and about 8.5 GHz.
  • a second antenna 391 configured to operate in a second frequency band different from the first frequency band (eg, WiFi 802.11n, about 2.4 GHz and about 5 GHz).
  • the plurality of first antennas 381 and the second antenna 391 may be disposed in a single second printed circuit board.
  • the second printed circuit board 352 includes a first antenna area A1 where a plurality of first antennas 381 are disposed, a second antenna area A2 where a second antenna 391 is disposed, and a first antenna A connection area A3 connecting the area A1 and/or the second antenna area A2 to the first printed circuit board 351 may be included.
  • the first antenna area A1 includes a first pattern area A11 in which one of the plurality of first antennas 381 (eg, the first patch plate P1) is disposed; A second pattern area A12 where another first antenna 381 (eg, the second patch plate P2) among the plurality of first antennas 381 is disposed, and the plurality of first antennas 381 ) may include a third pattern area A13 where another first antenna 381 (eg, the third patch plate P3) is disposed.
  • the first pattern area A11, the second pattern area A12, and the third pattern area A13 may be spaced apart from each other.
  • the second pattern area A12 and the third pattern area A13 include the first pattern area A11 between the second pattern area A12 and the third pattern area A13. It may be spaced apart from (A11) in different directions (eg, the left direction and the downward direction in FIG. 3A) and arranged.
  • the first antenna area A1 includes a first middle area A14 between the first pattern area A11 and the second pattern area A12, and a first pattern area A11 and a third A second middle area A15 between the pattern areas A13 may be included.
  • the plurality of first antennas 381 may not be disposed in the first middle area A14 and the second middle area A15.
  • the plurality of first antennas 381 include a plurality of first metal plates 382 located on the first layer 352A and a second metal plate 385 located on the second layer 352C. ), and a dielectric between the plurality of first metal plates 382 and the second metal plate 385 positioned on the middle layer 352B.
  • the plurality of first metal plates 382 may have a feed pattern.
  • the plurality of first metal plates 382 are formed from a pair of opposite edges of the first metal plate 382 (eg, side edges in FIG. 3B) to the first metal plate 382. It may include a pair of antenna slots (383A) formed toward the center of.
  • the plurality of first metal plates 382 include a pair of notches formed on a pair of opposite edges (eg, upper and lower edges in FIG. 3B ) of the first metal plate 382 . (383B).
  • the second metal plate 385 may serve as a ground.
  • the second metal plate 385 may be a single metal plate coupled to a plurality of first metal plates 382 .
  • the dielectric may be configured to bond the plurality of first metal plates 382 and the second metal plate 385 .
  • the dielectric can be, for example, a coverlay dielectric.
  • the coverlay dielectric may have a permittivity of about 3 to 4, for example.
  • the plurality of first antennas 381 may include a plurality of transmission lines 384 respectively connected to the plurality of first metal plates 382 . At least some of the plurality of transmission lines 384 are located in the first pattern area A11, the second pattern area A12, and the third pattern area A13 where each of the first antennas 381 are disposed, The rest of the plurality of transmission lines 384 may be located in the first middle area A14 and the second middle area A15.
  • the second antenna area A2 may include a plurality of sub areas A21, A22, and A23.
  • the second antenna area A2 may include a first sub area A21, a second sub area A22 and a third sub area A23.
  • the third subregion A23 is connected to the first antenna region A1 and may connect the first subregion A21 and the second subregion A22.
  • the first sub area A21 may extend from the third sub area A23.
  • the second sub area A22 may be located between the first sub area A21 and/or the third sub area A23 and the connection area A3.
  • the second antenna 391 forms a ground pattern as the same layer as the first metal layer 392 and the second layer 352B forming the feed pattern as the same layer as the first layer 352A. and a dielectric layer between the first metal layer 392 and the second metal layer 393 as the intermediate layer 352B.
  • the first metal layer 392 is disposed in the first conductive portion 3921 located in the third sub-region A23 and in one direction from the first conductive portion 3921 located in the first sub-region A21 (for example, A second conductive portion 3922 extending in a right direction in FIG. 3B), and a second conductive portion 3922 located in the first sub-region A21 and extending in another direction from the second conductive portion 3922 (eg, an upward direction in FIG.
  • a third conductive portion 3923 may be included.
  • the second metal layer 393 is disposed in one direction from the fourth conductive portion 3931 located in the third sub-region A23 and the fourth conductive portion 3931 located in the second sub-region A22 (for example, a fifth conductive portion 3932 extending in a downward direction in FIG. 3D), and a fifth conductive portion 3932 located in the second sub-region A22 and extending in another direction from the fifth conductive portion 3932 (e.g., a rightward direction in FIG. 3D).
  • a sixth conductive portion 3933 may be included.
  • the connection area A3 connects the plurality of first antennas 381 and the second antenna 391 to at least one electronic component (eg, the power management module 188 of FIG. 1) of the first printed circuit board 351. It may include a connector 399 to connect to.
  • the connector 399 is connected to a first connector region 398A located in the first layer 352A, and a fifth conductive portion 3932 facing the first connector region 398A and connected to the second layer 352C. It may include a second connector area 398B located at .
  • 3E is a diagram of a second antenna according to an embodiment.
  • 3F is a diagram of a first sub-region of a second antenna according to an embodiment.
  • 3G is a diagram of a second sub-region of a second antenna according to an embodiment.
  • 3H is a diagram of a third sub-region of a second antenna according to an embodiment.
  • the second printed circuit board 352 includes a second antenna area A2 where the second antenna 391 is disposed, and the second antenna area A2 has a different stack structure. It may include a plurality of sub-regions A21, A22, and A23 having .
  • the second antenna 391 in the first sub area A21 is configured to transmit and receive radio waves of the first band (eg, about 2.4 GHz), and
  • the second antenna 391 in the sub-area A22 is configured to transmit and receive radio waves of a second band (eg, about 5 GHz) different from the first band, and the second antenna 391 in the third sub-area A23 ) may implement impedance matching in each of the first subregion A21 and the second subregion A22.
  • the second antenna 391 in the first sub-region A21 includes a first surface 392A (eg, a top surface in FIG. 3F) and a second surface (opposite to the first surface 392A).
  • 392B eg, bottom surface in FIG. 3F
  • a third surface 393A eg, top surface in FIG. 3F
  • 393B e.g., the lower surface in FIG. 3F formed of a void, the first dielectric 394 on the first surface 392A, the second surface 392B and the third A second dielectric 395 between surfaces 393A and a third dielectric 396 on the fourth surface 393B.
  • the second layer 393 in the first sub area A21 may be formed as a fill-cut.
  • the second antenna 391 in the second sub-region A22 includes a first surface 392A (eg, a top surface in FIG. 3G ) and a second surface (opposite to the first surface 392A).
  • 392B) eg, bottom surface in FIG. 3G formed of a void, a third surface 393A (eg, top surface in FIG. 3G) and a fourth surface opposite to the third surface 393A.
  • 393B e.g., the lower surface in FIG. 3G
  • a second layer 393 of a metallic material a first dielectric 394 on a first side 392A, a second side 392B and a third side 393A.
  • the first layer 392 in the second sub area A22 may be formed as a fill-cut.
  • the second antenna 391 in the third sub-region A23 includes a first surface 392A (eg, a top surface in FIG. 3H) and a second surface (opposed to the first surface 392A).
  • 392B eg, lower surface in FIG. 3H
  • a third surface 393A eg, upper surface in FIG. 3H
  • 393B e.g., the lower surface in FIG. 3H
  • the first layer 392 and the second layer 393 may implement impedance matching of the first subregion A21 and the second subregion A22 by forming a capacitor structure.
  • the second dielectric 395 in the third sub-region A23 may be a coverlay dielectric.
  • the second dielectric 395 may have a permittivity of about 3 to 4.
  • the second dielectric 395 may include a first material (eg, polyimide) and a second material (eg, adhesive).
  • the first material may have a permittivity of about 3.2 and the second material may have a permittivity of about 3.4.
  • the second dielectric 395 may improve radiation efficiency by 0.5 dB in, for example, a band of about 2.4 GHz, and enable fine adjustment of capacitance compared to the case of using a multi-layer ceramic condenser (MLCC).
  • MLCC multi-layer ceramic condenser
  • the number of metal layers the number of dielectrics, the cross-sectional area of the layers, the cross-sectional area of the dielectrics, the material of the dielectrics, and/or the spacing between the layers.
  • the capacitance of can be determined.
  • FIG. 4 is a diagram of a printed circuit board according to one embodiment.
  • a printed circuit board 452 may include an antenna module 497 (eg, the antenna module 397 of FIG. 3A).
  • the antenna module 497 may include a plurality of first antennas 481 (eg, the first antenna 381) and a second antenna 491 (eg, the second antenna 391).
  • the printed circuit board 452 includes a first antenna area A1 where a plurality of first antennas 481 are disposed, a second antenna area A2 where a second antenna 491 is disposed, and a connector 499. It may include a connection area (A3) including.
  • the first antenna area A1 includes a first sub area A11, a second sub area A12, a third sub area A13, a first middle area A14, and a second middle area A15. can include
  • the second antenna area A2 may be connected to the second middle area A15. In some embodiments, the second antenna area A2 may be connected to the first sub area A11 and/or the third sub area A13.
  • the second antenna 491 may be configured to share a connector 499 with a plurality of first antennas 481 .
  • Each transmission line 485 of the plurality of first antennas 481 and the transmission line 485 of the second antenna 491 may be connected to the connector 499 .
  • At least one transmission line 485 of the transmission lines 485 of the plurality of first antennas 481 is located in the first middle region A14, and the transmission line 485 of the plurality of first antennas 481 Among them, the remaining transmission lines 485 and the transmission line 485 of the second antenna 491 may be located in the second middle area A15.
  • connection area A3 may include a plurality of shielding parts 486 configured to reduce interference between the plurality of transmission lines 485 connected to the connector 499 .
  • the shield 486 may be positioned at least partially along the transmission lines 485 between an adjacent pair of transmission lines 485 .
  • FIG. 5 is a diagram of a printed circuit board according to one embodiment.
  • an antenna module 597 (eg, the antenna module 497 of FIG. 4) includes a plurality of first antennas (eg, the first antenna 481) disposed in the first antenna area A1. , and a second antenna (eg, the second antenna 491) disposed in the second antenna area A2.
  • the first antenna area A1 includes a first sub area A11, a second sub area A12, a third sub area A13, a first middle area A14, and a second middle area A15.
  • the second antenna area A2 may be connected to the first middle area A14.
  • the second antenna area A2 may be connected to the first sub area A11 and/or the second sub area A12.
  • An aspect of the present disclosure may provide a printed circuit board that improves radiation performance through impedance matching of antennas operating in different frequency bands and an electronic device including the same.
  • the electronic device 301 may include a first printed circuit board 351 and a second printed circuit board 352 .
  • the second printed circuit board 352 may include a first antenna area A1.
  • the first antenna area A1 may include a plurality of first antennas 381 operating in a first frequency band.
  • the second printed circuit board 352 may include a second antenna area A2.
  • the second antenna area A2 may include a second antenna 391 operating in a second frequency band different from the first frequency band.
  • the second antenna area A2 may be connected to the first antenna area A1.
  • the second printed circuit board 352 may include a connection area A3.
  • the connection area A3 may include a connector 399 .
  • a connector 399 may connect the plurality of first antennas 381 and the second antenna 391 to the first printed circuit board 351 .
  • the second antenna area A2 may include a plurality of sub areas A21, A22, and A23 including a plurality of stacked layers 392, 393, 394, 395, and 396. there is.
  • the plurality of sub-regions A21, A22, and A23 may have different stack structures.
  • the plurality of subregions A21, A22, and A23 may include a first subregion A21 including a first stack structure configured to operate in a first subband among the second frequency bands.
  • the plurality of subregions A21, A22, and A23 include a second subregion A22 including a second stack structure configured to operate in a second subband different from the first subband among the second frequency bands.
  • the plurality of sub-regions A21, A22, and A23 may include a third sub-region A23 forming a capacitor connecting the first sub-region A21 and the second sub-region A22. .
  • the first sub-region A21 may include a metal layer 392 including a first surface 392A and a second surface 392B opposite to the first surface 392A. .
  • the first sub-region A21 includes a void layer 393 including a third surface 393A facing the second surface 392B and a fourth surface 393B opposite to the third surface 393A.
  • the first sub-region A21 may include a first dielectric 394 positioned on the first surface 392A.
  • the first sub-region A21 may include a second dielectric 395 positioned between the second surface 392B and the third surface 393A.
  • the first sub-region A21 may include a third dielectric 396 positioned on the fourth surface 393B.
  • the second sub area A22 may include a void layer 392 including a first surface 392A and a second surface 392B opposite to the first surface 392A.
  • the second sub-region A22 is a metal layer 393 including a third surface 393A facing the second surface 392B and a fourth surface 393B opposite to the third surface 393A.
  • the second sub-region A22 may include a first dielectric 394 positioned on the first surface 392A.
  • the second sub-region A22 may include a second dielectric 395 positioned between the second surface 392B and the third surface 393A.
  • the second sub-region A22 may include a third dielectric 396 positioned on the fourth surface 393B.
  • the third sub-region A23 may include a first metal layer 392 including a first surface 392A and a second surface 392B opposite to the first surface 392A.
  • the third sub-region A23 is a second metal layer including a third surface 393A facing the second surface 392B and a fourth surface 393B opposite to the third surface 393A. 393) may be included.
  • the third sub-region A23 may include a first dielectric 394 positioned on the first surface 392A.
  • the third sub-region A23 may include a second dielectric 395 positioned between the second surface 392B and the third surface 393A.
  • the third sub-region A23 may include a third dielectric 396 positioned on the fourth surface 393B.
  • At least one sub area A22 among the plurality of sub areas A21 , A22 , and A23 may be electrically connected to the connector 399 .
  • the first antenna area A1 may include a first pattern area A11.
  • the first antenna area A1 may include a second pattern area A12 spaced apart from the first pattern area A11 in a first direction.
  • the first antenna area A1 may include a third pattern area A13 spaced apart from the first pattern area A11 in a second direction crossing the first direction.
  • the first antenna area A1 may include a first middle area A14 between the first pattern area A11 and the second pattern area A12.
  • the first antenna area A1 may include a second middle area A15 between the first pattern area A11 and the third pattern area A13.
  • the second antenna area A2 or the connection area A3 may be connected to the second middle area A15.
  • the second printed circuit board 452 may include a plurality of first transmission lines 485 connecting the plurality of first antennas 481 and the connector 499 .
  • the second printed circuit board 452 may include a second transmission line 485 connecting the second antenna 491 and the connector 499 .
  • the plurality of first transmission lines 485 and the second transmission line 485 may be located in the second middle area A15.
  • the first antenna area A1 may include a first pattern area A11.
  • the first antenna area A1 may include a second pattern area A12 spaced apart from the first pattern area A11 in a first direction.
  • the first antenna area A1 may include a third pattern area A13 spaced apart from the first pattern area A11 in a second direction crossing the first direction.
  • the first antenna area A1 may include a first middle area A14 between the first pattern area A11 and the second pattern area A12.
  • the first antenna area A1 may include a second middle area A15 between the first pattern area A11 and the third pattern area A13.
  • the second antenna area A2 may be connected to the first middle area A14.
  • the connection area A3 may be connected to the second middle area A15.
  • the printed circuit board 352 includes a first antenna area A1 including a plurality of first antennas 381 operating in a first frequency band and a second frequency band different from the first frequency band.
  • a second antenna area A2 including a second antenna 391 operating in a band and connected to the first antenna area A1, and the plurality of first antennas 381 and the second antenna 391 It may include a connection area (A3) including a connector 399 connected to.
  • the second antenna area A2 includes a plurality of sub areas A21, A22 and A23 including a plurality of stacked layers 392, 393, 394, 395 and 396,
  • the plurality of sub-regions A21, A22, and A23 may have different stack structures.
  • the plurality of subregions A21, A22, and A23 include a first subregion A21 including a first stack structure configured to operate in a first subband among the second frequency band; A second subregion A22 including a second stack structure configured to operate in a second subband different from the first subband among second frequency bands, and the first subregion A21 and the second subregion A third sub-region A23 forming a capacitor connecting A22 may be included.
  • the first sub-region A21 includes a metal layer 392 including a first surface 392A and a second surface 392B opposite to the first surface 392A, the second A void layer 393 including a third surface 393A facing surface 392B and a fourth surface 393B opposite to the third surface 393A, located on the first surface 392A A first dielectric 394, a second dielectric 395 positioned between the second face 392B and the third face 393A, and a third dielectric 396 positioned on the fourth face 393B. ) may be included.
  • the second sub-region A22 includes a void layer 392 including a first surface 392A and a second surface 392B opposite to the first surface 392A, the second A metal layer 393 comprising a third surface 393A facing surface 392B and a fourth surface 393B opposite to the third surface 393A, located on the first surface 392A.
  • a first dielectric 394, a second dielectric 395 positioned between the second face 392B and the third face 393A, and a third dielectric 396 positioned on the fourth face 393B. ) may be included.
  • the third sub-region A23 includes a first metal layer 392 including a first surface 392A and a second surface 392B opposite to the first surface 392A, the A second metal layer 393 including a third surface 393A facing the second surface 392B and a fourth surface 393B opposite to the third surface 393A, the first surface 392A A first dielectric 394 located on, a second dielectric 395 located between the second surface 392B and the third surface 393A, and a second dielectric located on the fourth surface 393B. 3 dielectrics 396.
  • At least one sub area A22 among the plurality of sub areas A21 , A22 , and A23 may be electrically connected to the connector 399 .
  • the first antenna area A1 includes a first pattern area A11, a second pattern area A12 spaced apart from the first pattern area A11 in a first direction, and the second pattern area A12.
  • a third pattern area A13 spaced apart from the first pattern area A11 in a second direction intersecting the first direction, and a third pattern area A13 between the first pattern area A11 and the second pattern area A12.
  • 1 intermediate region A14 and a second intermediate region A15 between the first pattern region A11 and the third pattern region A13, and the second antenna region A2 or the connection region (A3) may be connected to the second middle region (A15).
  • the printed circuit board 452 includes a plurality of first transmission lines 485 connecting the plurality of first antennas 481 and the connector 499, and the second antenna ( 491) and a second transmission line 485 connecting the connector 499, wherein the plurality of first transmission lines 485 and the second transmission line 485 are connected to the second middle region ( A15).
  • the first antenna area A1 includes a first pattern area A11, a second pattern area A12 spaced apart from the first pattern area A11 in a first direction, and the second pattern area A12.
  • a third pattern area A13 spaced apart from the first pattern area A11 in a second direction intersecting the first direction, and a third pattern area A13 between the first pattern area A11 and the second pattern area A12.
  • interference with electronic component(s) in an electronic device may be reduced and gain of antennas may be improved.
  • manufacturing costs of electronic component(s) in an electronic device may be reduced.
  • the efficiency of an arrangement space of electronic component(s) in an electronic device may be improved.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Support Of Aerials (AREA)

Abstract

Un mode de réalisation de la présente invention concerne un dispositif électronique qui comprend une première carte de circuit imprimé et une seconde carte de circuit imprimé, la seconde carte de circuit imprimé comprenant : une première région d'antenne qui comprend une pluralité de premières antennes fonctionnant dans une première bande de fréquence ; une seconde région d'antenne qui comprend une seconde antenne fonctionnant dans une seconde bande de fréquence différente de la première bande de fréquence et est connectée à la première région d'antenne ; et une région de connexion qui comprend un connecteur connectant la pluralité de premières antennes et la seconde antenne à la première carte de circuit imprimé et est connectée à la première région d'antenne.
PCT/KR2022/013167 2021-10-26 2022-09-02 Carte de circuit imprimé comprenant des antennes fonctionnant dans différentes bandes de fréquence, et dispositif électronique la comprenant WO2023075121A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2021-0143405 2021-10-26
KR20210143405 2021-10-26
KR10-2022-0013998 2022-02-03
KR1020220013998A KR20230059682A (ko) 2021-10-26 2022-02-03 상이한 주파수 대역들에서 동작하는 안테나들을 포함하는 인쇄 회로 기판 및 이를 포함하는 전자 장치

Publications (1)

Publication Number Publication Date
WO2023075121A1 true WO2023075121A1 (fr) 2023-05-04

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Application Number Title Priority Date Filing Date
PCT/KR2022/013167 WO2023075121A1 (fr) 2021-10-26 2022-09-02 Carte de circuit imprimé comprenant des antennes fonctionnant dans différentes bandes de fréquence, et dispositif électronique la comprenant

Country Status (1)

Country Link
WO (1) WO2023075121A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170112715A (ko) * 2016-04-01 2017-10-12 삼성전자주식회사 안테나 장치 및 그것을 포함하는 전자 장치
KR20200142819A (ko) * 2019-06-13 2020-12-23 삼성전기주식회사 안테나 모듈 및 이를 포함하는 전자기기
KR20210001976A (ko) * 2019-06-28 2021-01-06 애플 인크. 다중 주파수 초광대역 안테나들을 갖는 전자 디바이스들
KR102220020B1 (ko) * 2020-11-13 2021-02-25 주식회사 이엠따블유 안테나 모듈 및 이를 포함하는 무선 통신 단말기
KR20210125345A (ko) * 2020-04-08 2021-10-18 삼성전자주식회사 도래각 측정을 위한 안테나를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170112715A (ko) * 2016-04-01 2017-10-12 삼성전자주식회사 안테나 장치 및 그것을 포함하는 전자 장치
KR20200142819A (ko) * 2019-06-13 2020-12-23 삼성전기주식회사 안테나 모듈 및 이를 포함하는 전자기기
KR20210001976A (ko) * 2019-06-28 2021-01-06 애플 인크. 다중 주파수 초광대역 안테나들을 갖는 전자 디바이스들
KR20210125345A (ko) * 2020-04-08 2021-10-18 삼성전자주식회사 도래각 측정을 위한 안테나를 포함하는 전자 장치
KR102220020B1 (ko) * 2020-11-13 2021-02-25 주식회사 이엠따블유 안테나 모듈 및 이를 포함하는 무선 통신 단말기

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