WO2023071887A1 - 扬声器及电子设备 - Google Patents

扬声器及电子设备 Download PDF

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Publication number
WO2023071887A1
WO2023071887A1 PCT/CN2022/126195 CN2022126195W WO2023071887A1 WO 2023071887 A1 WO2023071887 A1 WO 2023071887A1 CN 2022126195 W CN2022126195 W CN 2022126195W WO 2023071887 A1 WO2023071887 A1 WO 2023071887A1
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WO
WIPO (PCT)
Prior art keywords
diaphragm
magnetic
voice coil
speaker
loudspeaker
Prior art date
Application number
PCT/CN2022/126195
Other languages
English (en)
French (fr)
Inventor
秦仁轩
刘阳
赵文畅
郭李
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华为技术有限公司
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Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Publication of WO2023071887A1 publication Critical patent/WO2023071887A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present application relates to the technical field of loudspeakers, in particular to a loudspeaker and electronic equipment.
  • the speaker As a commonly used electro-acoustic transducer, the speaker is widely used in various electronic devices (such as mobile phones, smart glasses and other terminals). With the birth of new forms of electronic devices such as wearables and point reading pens, and the reduction in the size of electronic devices such as mobile phones, the space available for speakers has also been further reduced, and the speakers can only be made smaller, resulting in the sound radiation from the speakers The effective area is reduced, which affects the loudness of the speaker. How to improve the loudness of speakers under the condition of limited effective radiation area has become a research direction.
  • Embodiments of the present application provide a speaker and electronic equipment including the speaker.
  • the loudspeaker and the electronic equipment provided by the present application have high loudness on the basis of miniaturization.
  • a speaker in a first aspect, includes a housing, a vibrating assembly and a magnetic circuit assembly.
  • the shell has an inner cavity, the magnetic circuit assembly is arranged in the inner cavity, and the magnetic circuit assembly has a magnetic gap.
  • the vibration assembly includes a first diaphragm, a second diaphragm and a voice coil.
  • the first diaphragm and the second diaphragm are respectively located on opposite sides of the magnetic circuit assembly.
  • the peripheral edges of the first diaphragm and the second diaphragm are connected to the housing , the voice coil is located in the magnetic gap, and the opposite sides of the voice coil are respectively connected to the first diaphragm and the second diaphragm.
  • the voice coil is located between the first diaphragm and the second diaphragm, passes through the magnetic gap of the magnetic circuit assembly and connects the two diaphragms.
  • the voice coil When the voice coil is energized by the magnetic field force, the voice coil will generate a Lorentz force perpendicular to the plane of the first diaphragm and move along the direction to cut the magnetic induction line, and push the first diaphragm and the second diaphragm The membranes move back and forth together in this direction. That is to say, when the voice coil is energized, the voice coil, the first diaphragm and the second diaphragm will move in the same direction as a whole.
  • the diaphragm will deflect left and right or tilt to a certain extent during the movement (that is, a polarization phenomenon occurs). Moreover, this polarization phenomenon will become more obvious as the amplitude of the diaphragm increases.
  • the diaphragm When the diaphragm is polarized during the movement, it may touch the magnetic circuit components, rubbing and making a certain noise. The generation of noise will cause the diaphragm to fail to reach the expected amplitude setting value during actual work, which will affect the loudness of the speaker's sound.
  • the loudspeaker of the present application arranges the voice coil between the first diaphragm and the second diaphragm and connects the first diaphragm and the second diaphragm, so that the three form a moving whole, ensuring that the first diaphragm, the second diaphragm
  • the consistency of the diaphragm and the voice coil during the movement ensures the symmetry of the vibration stiffness of the vibration component up and down, and improves the vibration stability of the entire vibration component, which can more effectively improve the polarization phenomenon and improve the vibration component under the condition of large amplitude.
  • the loudspeaker of the present application can achieve a larger amplitude and a higher loudness on the basis of miniaturization, so that it can be used in
  • the loudness of speakers in small electronic devices such as wristbands and point reading pens is not restricted by space, which improves user experience.
  • the voice coil includes a first side portion and a second side portion disposed opposite to each other, both of the first side portion and the second side portion are parallel to the central axis of the voice coil, and the first side portion is connected to the first The vibrating membrane, the second side part is connected with the second vibrating membrane.
  • the voice coil is vertically arranged between the first diaphragm and the second diaphragm, and connects the first diaphragm and the second diaphragm, so that the size of the voice coil in the width direction of the speaker is smaller. Small, which is conducive to the miniaturization of the speaker width, and is more suitable for long-shaped products, such as electronic devices such as reading pens and selfie sticks.
  • the vibration assembly further includes a first connecting part and a second connecting part, the first connecting part connects the first side part and the first diaphragm, and the second connecting part connects the second side part and the second diaphragm membrane.
  • the first connecting part and the second connecting part are completely the same, and their materials can be hard materials, such as plastics, metals and the like.
  • the voice coil is indirectly connected to the first diaphragm and the second diaphragm through the first connecting piece and the second connecting piece, so that the voice coil is located at the best force-bearing position of the magnetic gap to ensure the best force on the voice coil good.
  • the three components form a vibrating whole, which improves the overall vibration stiffness of the vibrating assembly and ensures the overall vibration stability of the vibrating assembly.
  • connecting pieces are arranged on both sides of the voice coil, so that the structure of the vibrating component is symmetrical with respect to both sides of the voice coil, ensuring the symmetry of the vibration stiffness of the vibrating component up and down, and further improving the vibration Vibration stability of components.
  • the vibrating assembly further includes a support, which is arranged inside the voice coil, and one end of the support is connected to the first side, and the other end is connected to the second side, so as to be supported on the first side and the second side. between departments. Since the voice coil is a hollow structure, it is easy to deform during the movement and affect the vibration stability. This application ensures the rigidity of the voice coil by setting the support inside the voice coil, avoids its deformation during the movement, and ensures the vibration Vibration stability of components.
  • the magnetic circuit assembly includes a first part and a second part, the first part and the second part are both magnetic, the first part and the second part are arranged at a distance from each other, and a magnetic gap is formed between the first part and the second part .
  • the magnetism of the two opposing surfaces of the first part and the second part is opposite, and a magnetic gap is formed by setting the first part and the second part of the magnetic circuit assembly at intervals, so that the voice coil can be arranged between the first part and the second part. Between the two parts, the voice coil can be subjected to the action of the magnetic field force to generate the Lorentz force and move to cut the magnetic induction line when it is energized.
  • the voice coil includes a first end face and a second end face disposed opposite to each other, both of the first end face and the second end face are perpendicular to the central axis of the voice coil, the first end face is connected to the first diaphragm, and the second end face is connected to the first end face. The end face is connected with the second diaphragm.
  • the voice coil is arranged in parallel with the first diaphragm and the second diaphragm between the two, and connects the first diaphragm and the second diaphragm, so that the speaker can make full use of the space in the horizontal direction and reduce the The thickness makes it suitable for electronic devices with ultra-thin body designs such as mobile phones and tablets.
  • the first end surface is located inside the magnetic gap, and the second end surface is located outside the magnetic gap, so that the second end surface is connected to the second diaphragm.
  • the vibrating assembly further includes a third connecting piece, one end of the third connecting piece is connected to the first diaphragm, and the other end of the third connecting piece extends to the magnetic gap and connects to the first end surface. It can be understood that by providing a third connecting piece between the voice coil and the first diaphragm, the voice coil can pass through the magnetic circuit assembly and connect to the first diaphragm through the third connecting piece, so as to realize the connection of the voice coil.
  • the first diaphragm and the second diaphragm form a vibrating whole, and have consistency during the movement process, which improves the stiffness of the vibrating component and ensures that the vibrating component vibrates up and down
  • the symmetry of stiffness improves the vibration stability of the entire vibration component, ensures the symmetry of the vibration stiffness of the upper and lower vibration components, improves the vibration stability of the entire vibration component, can more effectively improve the polarization phenomenon, and improves the vibration component in large amplitude.
  • the vibration balance under the condition can avoid the noise caused by touching the magnetic circuit components, so that the speaker can reach the expected amplitude setting value in actual work.
  • the speaker with the voice coil-dual diaphragm design can achieve a larger amplitude and a higher frequency on the basis of miniaturization. Loudness, so that the loudness of speakers used in small electronic devices such as wristbands and reading pens is not limited by space, improving user experience.
  • the magnetic circuit assembly includes a connecting plate, a first magnetic circuit assembly and an escape hole, the first magnetic circuit assembly is fixed to the connecting plate, and the connecting plate is fixed to the housing , the first magnetic circuit assembly is arranged to form the magnetic gap, the avoidance hole is arranged on the connecting plate and communicates with the magnetic gap, and the other end of the third connecting piece extends through the avoidance hole to the the magnetic gap. It can be understood that by setting the avoidance hole in the magnetic circuit assembly, one end of the third connecting piece can be connected to the first diaphragm while the other end can pass through the avoidance hole and enter the magnetic gap to connect with the voice coil, so that the voice coil Can be connected between the first diaphragm and the second diaphragm.
  • the third connecting piece includes a joint fitting part and an extension part, the side of the fitting part away from the extension part is connected to the first diaphragm, and the extension part is connected to the first diaphragm on the first side through the avoidance hole.
  • the fitting portion On one end face, the fitting portion includes an installation side, the number of extensions is two, and the two extensions are connected to opposite ends of the installation side.
  • the bonding part of the third connecting member is a hollow ring structure, which is the same as the structure of the second end surface of the voice coil, so that the bonding area of the bonding part and the first diaphragm is the same as that of the second end surface of the voice coil.
  • the bonding area of the two end surfaces and the second diaphragm is the same, so that the bonding area of the whole formed by the third connecting member and the voice coil is the same as that of the first diaphragm and the second diaphragm, that is, the connection stiffness on both sides of the whole is the same, Improved vibration stability in vibration components.
  • the shape of the two extensions of the third connecting member is the same as that of the part of the voice coil that it contacts, so as to increase the connection area between the extension and the voice coil and ensure a stable connection between the extension and the voice coil.
  • the magnetic circuit assembly further includes a magnetic fluid, which fills the magnetic gap and wraps at least part of the voice coil.
  • a magnetic fluid which fills the magnetic gap and wraps at least part of the voice coil.
  • the ferrofluid is a functional material that has both fluidity and magnetism of solid magnetic materials. There is no magnetic attraction when the ferrofluid is at rest. When an external magnetic field is applied, the ferrofluid exhibits magnetism. Therefore, when the magnetic fluid is filled in the magnetic gap, since the magnetic circuit assembly generates a magnetic field, the magnetic fluid will be absorbed in the magnetic gap without dripping.
  • the magnetic fluid is filled in the magnetic gap. Since the magnetic fluid has fluidity, when the voice coil is placed in the magnetic gap, the ferrofluid can wrap the protruding part of the voice coil. When the voice coil vibrates in the non-moving direction during the vibration process, the ferrofluid has a limiting effect on the displacement or inclination of the voice coil in the non-moving direction, preventing the voice coil from colliding with the magnetic circuit components. At the same time, since the magnetic fluid improves the problem of the voice coil colliding with the magnetic circuit assembly, the magnetic gap of the speaker of the present application can be set smaller, which is beneficial to the miniaturization of the entire speaker.
  • the multiple voice coils are arranged along the length direction of the loudspeaker.
  • the size of the speaker provided by this application can be based on the specific shape of the product device, by adding a voice coil to make the size of the speaker more suitable for the product, and to obtain comparable performance in a limited device space. Moreover, the length-to-width ratio of the voice coil when the winding wire is too long will lead to a decrease in its dimensional accuracy. Changing one voice coil into multiple horizontally arranged voice coil housings improves the yield of the voice coil and saves costs.
  • the magnetic gap extends along the length direction of the speaker, and multiple voice coils are arranged in the magnetic gap at intervals; or, the speaker includes a plurality of magnetic gaps, and the plurality of magnetic gaps are arranged at intervals along the length direction of the speaker.
  • the voice coils are located in multiple magnetic gaps in one-to-one correspondence.
  • the vibrating component further includes a connecting line, the connecting line is provided on the surface of the first diaphragm or the second diaphragm close to the voice coil, and the connecting line is electrically connected to the voice coil. It can be understood that the electrical connection between the voice coil and the external electrical components of the loudspeaker can be realized by providing connection lines in the vibration assembly.
  • the connecting line is a flexible circuit board.
  • the present application electrically connects the circuit board of the electronic device by setting a flexible circuit board. , improve the electrical stability of the speaker.
  • connection line is a wire.
  • Printing copper wires on the surface of the first diaphragm is used as a line lead-out solution to replace the flexible circuit board, thereby reducing the vibration quality of the vibration component and improving the vibration performance of the vibration component.
  • the first diaphragm and the second diaphragm are arranged symmetrically with respect to the magnetic circuit assembly.
  • the speaker at this time is a dipole speaker, which can form a dipole sound field.
  • the speaker emits sound two sounds with opposite phases are respectively emitted from the first diaphragm and the second diaphragm and transmitted to the outside of the speaker. According to the dipole principle, the two sound waves will cancel each other in the far field, forming a noise-absorbing area, realizing far-field noise reduction, effectively improving the far-field privacy of electronic equipment, and improving the sound leakage problem of speakers.
  • an electronic device including a casing and the above-mentioned speaker, and the speaker is accommodated inside the casing.
  • An electronic device having the above speaker is louder on the basis of miniaturization.
  • the housing includes an installation space and a sound outlet communicating with the installation space
  • the speaker is installed in the installation space and separates the installation space to form a first chamber and a second chamber
  • the first chamber communicates with the sound outlet
  • the housing of the loudspeaker also includes an opening, the opening is arranged on the side wall of the housing, and the opening communicates with the inner cavity and the second cavity.
  • the opening leads the air inside the speaker to the second cavity, so that the volume of the air inside the speaker increases, so that the speaker can obtain greater amplitude and higher loudness under the same space conditions.
  • FIG. 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application.
  • Fig. 2 is a schematic structural view of the temples of the electronic device shown in Fig. 1 in some embodiments;
  • Fig. 3 is a schematic structural view of the temple shown in Fig. 2 in some embodiments;
  • Fig. 4 is a schematic diagram of an exploded structure of the temple shown in Fig. 2;
  • Fig. 5 is a schematic cross-sectional structure diagram of the mirror leg shown in Fig. 2 in the A-A direction;
  • Fig. 6 is a schematic structural diagram of a loudspeaker provided by the present application in some embodiments.
  • Fig. 7 is a schematic diagram of an exploded structure of the loudspeaker shown in Fig. 6;
  • Fig. 8 is a schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 6 in the B-B direction;
  • Fig. 9 is a schematic structural view of the upper cover of the speaker shown in Fig. 6 in some embodiments.
  • Fig. 10 is a structural schematic diagram of the magnetic circuit assembly of the loudspeaker shown in Fig. 6 in some embodiments;
  • Fig. 11 is a structural schematic diagram of the vibration assembly of the speaker shown in Fig. 6 in some embodiments;
  • Fig. 12 is a schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 6 in the C-C direction;
  • Fig. 13 is a schematic cross-sectional structure diagram of another embodiment of the loudspeaker shown in Fig. 6 in the C-C direction;
  • Fig. 14 is a schematic cross-sectional structure diagram of another embodiment of the loudspeaker shown in Fig. 6 in the C-C direction;
  • Fig. 15 is a schematic structural view of another embodiment of the loudspeaker shown in Fig. 6;
  • Fig. 16A is a schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 15 in the D-D direction;
  • Fig. 16B is a partial structural schematic diagram of the loudspeaker shown in Fig. 15;
  • Fig. 17 is a schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 15 in the E-E direction;
  • Fig. 18 is a structural schematic diagram of an embodiment of the connecting line of the loudspeaker vibration assembly shown in Fig. 15;
  • Fig. 19 is a schematic cross-sectional structure diagram of another embodiment of the loudspeaker shown in Fig. 6 in the B-B direction;
  • Fig. 20 is a schematic structural view of another embodiment of the loudspeaker shown in Fig. 6;
  • Fig. 21 is an exploded schematic diagram of a part of the structure of the loudspeaker shown in Fig. 20;
  • Fig. 22 is a schematic cross-sectional structure diagram of the loudspeaker shown in Fig. 20 in the F-F direction;
  • Fig. 23 is a schematic structural view of the magnetic circuit assembly of the loudspeaker shown in Fig. 20;
  • Fig. 24 is a schematic structural view of a third connecting member of the speaker shown in Fig. 20;
  • FIG. 25A is a specific schematic diagram of realizing far-field noise cancellation by the loudspeaker shown in FIG. 6;
  • Figure 25B is a schematic diagram of the sound waves emitted by the loudspeaker shown in Figure 6;
  • Fig. 26 is a schematic structural diagram of another electronic device provided by the present application.
  • Fig. 27 is a schematic cross-sectional structure diagram of the electronic device shown in Fig. 26 in the G-G direction;
  • Fig. 28 is a structural schematic diagram of another embodiment of the loudspeaker shown in Fig. 20;
  • FIG. 29 is an enlarged schematic view of a partial cross-sectional structure of another embodiment of the electronic device shown in FIG. 27 .
  • connection can be detachably connected, or It is a non-detachable connection; it can be directly connected or indirectly connected through an intermediary.
  • fixed connection means that they are connected to each other and the relative positional relationship after connection remains unchanged.
  • Rotally connected refers to being connected to each other and capable of relative rotation after being connected.
  • Slide connection refers to being connected to each other and being able to slide relative to each other after being connected.
  • first”, “second”, “third”, and “fourth” are used for descriptive purposes only, and should not be understood as indicating or implying relative importance or implicitly indicating the indicated The number of technical characteristics. Thus, a feature defined as “first”, “second”, “third” and “fourth” may expressly or implicitly include one or more of such features.
  • references to "one embodiment” or “some embodiments” or the like in this specification means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically stated otherwise.
  • the terms “including”, “comprising”, “having” and variations thereof mean “including but not limited to”, unless specifically stated otherwise.
  • FIG. 1 is a schematic structural diagram of an electronic device 1000 provided in an embodiment of the present application.
  • the electronic device 1000 can be a reading pen, a selfie stick, a wristband, a mobile phone, a smart watch, an augmented reality (augmented reality, AR) glasses, an AR helmet, or a virtual reality (virtual reality, VR) glasses, etc., which need to use a speaker to output audio.
  • the electronic device 1000 is AR glasses as an example for specific description.
  • the electronic device 1000 includes a mirror frame 10 , a display device 20 , a speaker 30 and a circuit board 40 .
  • the display device 20 , the speaker 30 and the circuit board 40 are all mounted on the frame 10 . Both the display device 20 and the speaker 30 are electrically connected to the circuit board 40 , and the circuit board 40 is used for controlling the display device 20 to display and controlling the speaker 30 to produce sound.
  • the mirror frame 10 includes a mirror frame 11 and mirror legs 12 connected with the mirror frame 11 . Wherein, there are two mirror legs 12 , and the two mirror legs 12 are connected to opposite ends of the mirror frame 11 . It should be noted that, in other embodiments, the spectacle frame 10 may also include a spectacle frame 11 and a fixing belt connected to the spectacle frame 11, which is not specifically limited in the present application.
  • the mirror frame 11 may include two frame bodies 111 and a beam 112 connected between the two frame bodies 111 .
  • the insides of the two frames 111 are provided with accommodating cavities for accommodating electronic components of the electronic device 1000 .
  • the beam 112 is integrally formed with the two frame bodies 111 to simplify the molding process of the mirror frame 11 and increase the overall strength of the mirror frame 11 .
  • the material of the mirror frame 11 includes and is not limited to metal, plastic, resin or natural materials and the like. It should be understood that the mirror frame 11 is not limited to the full-frame mirror frame shown in FIG. 1 , but can also be a half-frame or frameless.
  • the number of display devices 20 is two, and the structures of the two display devices 20 are the same. Specifically, the two display devices 20 are respectively installed on the two frame bodies 111 of the mirror frame 11 . When the electronic device 1000 is worn on the user's head, one display device 20 corresponds to the user's left eye, and the other display device 20 corresponds to the user's right eye. At this time, the user's eyes can view virtual scenes or real scenes through the two display devices 20. Scenes. It should be noted that, in other embodiments, the structures of the two display devices 20 may also be different, or the number of the two display devices 20 may also be one or more, which is not specifically limited in this application.
  • the display device 20 is mounted on the frame body 111 and electrically connected to the circuit board 40 .
  • two circuit boards 40 can be installed inside the mirror legs 12 .
  • the two circuit boards 40 are respectively located in the two mirror legs 12 and are electrically connected to the corresponding display devices 20 .
  • the number of circuit boards 40 may also be one, located in one of the temples 12 .
  • the circuit board 40 may also be installed on the frame body 111 . Or installed in the housing cavity of the frame body 111 .
  • the two mirror legs 12 are rotatably connected to opposite ends of the mirror frame 11 . Specifically, the two mirror legs 12 are respectively rotatably connected to the two frame bodies 111 of the mirror frame 11 .
  • the two temples 12 are rotated to face each other through the relative mirror frame 11. At this time, the two temples 12 of the electronic device 1000 can be mounted on the two ears of the user respectively.
  • the beam 112 is erected on the bridge of the user's nose to be worn on the user's head.
  • the two temples 12 are rotated relative to the frame 11 to at least partially overlap each other and be accommodated inside the frame 11 . At this time, the electronic device 1000 can be stored.
  • orientation terms such as “inside” and “outside” used in this application to refer to the electronic device 1000 are mainly based on the orientation when the electronic device 1000 is worn on the user's head.
  • the inner side is close to the user's head and the outer side is away from the user's head, which does not limit the orientation of the electronic device 1000 and other scenes.
  • the two temples 12 can be fixedly connected to the two frames 111 respectively, or the two temples 12 can be integrally formed with the mirror frame 11, that is, the electronic device 1000 is always in the unfolded state, This application does not specifically limit it.
  • the two temples 12 in this embodiment have the same structure, and the structure of the temple 12 will be described below by taking one of the temples 12 as an example. Of course, in other embodiments, the structures of the two temples 12 may also be different.
  • FIG. 2 is a schematic structural view of the temple 12 of the electronic device 1000 shown in FIG. 1 in some embodiments.
  • FIG. 3 is a schematic structural diagram of some embodiments of the temple 12 shown in FIG. 2 .
  • the mirror leg 12 may include a connecting section 121 , a middle section 122 and an ear section 123 .
  • the connecting section 121 , the middle section 122 and the hanging ear section 123 are sequentially connected.
  • the side of the connecting section 121 away from the middle section 122 can be rotatably connected with the corresponding frame body 111 , and the ear-hanging section 123 is used for wearing the temple 12 on the user's ear.
  • the middle section 122 is provided with a receiving cavity and a sounding hole 1223 connected to the receiving cavity.
  • the speaker 30 is installed in the receiving cavity. That is, the temple 12 is equivalent to the housing of the electronic device 1000 for accommodating the speaker 30 .
  • the middle section 122 can protrude relatively downward, and the protruding part is close to the user's external auditory canal, so that the sound hole 1223 can be closer to the user's ear, and the sound emitted by the speaker 30 is transmitted through the sound hole 1223 After entering the user's external auditory canal directly, the user can quickly hear the sound from the speaker 30 .
  • the middle section 122 may not protrude downward.
  • FIG. 4 is a schematic diagram of an exploded structure of the temple 12 shown in FIG. 2 ;
  • FIG. 5 is a schematic diagram of a partial cross-sectional structure of the temple 12 shown in FIG.
  • the middle section 122 may include a carrier body 1221 and a cover plate 1222 .
  • the carrier 1221 includes a groove 1224
  • the cover plate 1222 covers the opening of the groove 1224 to form a receiving cavity 1225 together with the groove 1224 .
  • the carrier body 1221 and the cover plate 1222 jointly surround and form a receiving cavity 1225 . That is to say, the receiving cavity 1225 is composed of two parts, so that the speaker 30 and other components can be installed in the receiving cavity 1225 conveniently.
  • the cover plate 1222 can be detachably connected to the opening of the groove 1224 so as to maintain the components in the receiving chamber 1225 .
  • the cover plate 1222 may also be non-detachably fixed to the opening of the groove 1224 .
  • the carrier 1221 may also include a limiting slot 1226 and a positioning slot 1227 .
  • the limiting groove 1226 is disposed at the opening of the groove 1224 , and the cover plate 1222 is installed in the limiting groove 1226 .
  • the positioning groove 1227 is formed on the bottom wall of the groove 1224 , and the speaker 30 is installed in the positioning groove 1226 .
  • the limiting groove 1227 is used for installing the cover plate 1222 on the one hand, and is also used for limiting the cover plate 1222 on the other hand, so that the cover plate 1222 is more firmly installed in the limiting groove 1227 .
  • the positioning groove 1226 is used to install the speaker 30 on the one hand, and is also used to limit the speaker 30 on the other hand, so that the speaker 30 is more firmly installed in the positioning groove 1226 .
  • the carrier body 1221 may not include a limiting groove and a positioning groove, and the cover plate 1222 may be directly fixed to the opening of the groove 1224 .
  • the speaker 30 can be directly fixed on the cavity wall of the receiving cavity 1225 .
  • the speaker 30 When the speaker 30 is installed in the positioning slot 1226 , the speaker 30 separates the receiving cavity 1225 to form two independent channels.
  • the channel above the speaker 30 is the first channel 1228
  • the channel below the speaker 30 is the second channel 1229 .
  • the sounding hole 1223 includes the first sounding hole 13 and the second sounding hole 14 .
  • the first sound hole 13 is disposed on the cover plate 1222 and communicates with the first channel 1228 .
  • the second sound hole 14 is disposed on the side of the carrier 1221 facing away from the cover plate 1222 and communicates with the second channel 1229 .
  • the directions of sound output from the two sound holes are opposite. Certainly, in other embodiments, the sound emitting directions of the two sound emitting holes may also form an included angle.
  • the second sound hole 14 is set on the side of the middle section 122 close to the user's ear, which is more conducive to the sound output from the speaker 30 to the user's ear, and improves the audio-visual function experience of the electronic device 1000 .
  • the number of speakers 30 is two, and the two speakers 30 are respectively disposed in the corresponding receiving cavities 1225 of the temples 12 .
  • the accommodating cavity 1225 may be located in front and above the user's ear, and when the speaker 30 emits sound, the user's ear can hear the sound more clearly and intuitively.
  • the speaker 30 may also be disposed at other positions, for example, the connecting section 121 , the ear-hanging section 123 , or other positions such as the frame body 111 .
  • the virtual reality image can be transmitted to the user's eyes through the display device 20, and the sound from the speaker 30 can be transmitted to the outside of the electronic device 1000 through the sound hole and heard by the user, so as to realize the audio-visual function of the electronic device 1000.
  • the speakers 30 provided on the two temples 12 have the same structure.
  • the structures of the speakers 30 provided on the two temples 12 may also be different.
  • the circuit board 40 integrates a processor, memory and other various circuit devices.
  • the display device 2020 and the speaker 30 are coupled to the processor.
  • the processor may include one or more processing units, for example: the processor may include an application processor (application processor, AP), a modem processor, a graphics processing unit (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), controller, video codec, digital signal processor (digital signal processor, DSP), baseband processor, and/or neural network processor (neural-network processing unit, NPU), etc.
  • different processing units may be independent devices, or may be integrated in one or more processors.
  • the processor can generate operation control signals according to instruction opcodes and timing signals to complete the control of fetching instructions and executing instructions.
  • An internal memory may also be provided in the processor for storing instructions and data.
  • the memory in the processor may be a cache memory.
  • the memory can store instructions or data used by the processor or used frequently. If the processor needs to use the instruction or data, it can be called directly from this memory. Repeated access is avoided, and the waiting time of the processor is reduced, thereby improving the efficiency of the system.
  • a processor may include one or more interfaces.
  • the interface may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous transmitter (universal asynchronous receiver/transmitter, UART) interface, mobile industry processor interface (mobile industry processor interface, MIPI), general-purpose input and output (general-purpose input/output, GPIO) interface, subscriber identity module (subscriber identity module, SIM) interface, and /or universal serial bus (universal serial bus, USB) interface, etc.
  • the processor can be connected to modules such as a touch sensor, a wireless communication module, a display, and a camera through at least one of the above interfaces.
  • the memory may be used to store computer-executable program code, including instructions.
  • the memory may include an area for storing programs and an area for storing data.
  • the storage program area can store an operating system, at least one application program required by a function (such as a camera function, a video function, etc.) and the like.
  • the storage data area can store data created during the use of the electronic device 1000 (such as image data, video data, etc.) and the like.
  • the memory may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, flash memory device, universal flash storage (universal flash storage, UFS) and the like.
  • the processor executes various functions, methods or data processing of the electronic device 1000 by executing instructions stored in the memory, and/or instructions stored in the memory provided in the processor, for example, making the display device 20 present a virtual reality picture, making The speaker 30 emits sound and the like.
  • FIG. 6 is a schematic structural diagram of a speaker 30 provided by the present application in some embodiments.
  • FIG. 7 is a schematic diagram of an exploded structure of the speaker 30 shown in FIG. 6 .
  • FIG. 8 is a schematic cross-sectional structure diagram of the loudspeaker 30 shown in FIG. 6 along the B-B direction.
  • the width direction of the speaker 30 is the X-axis direction
  • the length direction of the speaker 30 is the Y-axis direction
  • the thickness direction of the speaker 30 is the Z-axis direction.
  • the speaker 30 may include a housing 31 , a vibration component 32 and a magnetic circuit component 33 .
  • the casing 31 has an inner cavity 311
  • the magnetic circuit assembly 33 is disposed in the inner cavity 311 .
  • the magnetic circuit assembly 33 has a magnetic gap 333
  • the vibrating assembly 32 includes a first diaphragm 321, a second diaphragm 322 and a voice coil 323, and the first diaphragm 321 and the second diaphragm 322 are respectively located on opposite sides of the magnetic circuit assembly 33.
  • the two sides can also be understood as that the second diaphragm 322 , the magnetic circuit assembly 33 and the first diaphragm 321 are sequentially stacked in the Z-axis direction of the speaker 30 .
  • the peripheral edges of the first diaphragm 321 and the second diaphragm 322 are connected to the casing 31, the voice coil 323 is located in the magnetic gap 333, and the opposite sides of the voice coil 232 are respectively connected to the first diaphragm 321 and the second diaphragm. Film 322.
  • the periphery of the first diaphragm 321 may be fully connected to the casing 31 , or may be partially connected to the casing 31 .
  • the voice coil 323 when the voice coil 323 is energized, under the action of the magnetic field force, the voice coil 323 generates a Lorentz force parallel to the first direction and cuts the magnetic induction line along this direction, and pushes the first diaphragm 321 and the second diaphragm 322 move back and forth along this direction together.
  • the first direction is a direction perpendicular to the first diaphragm 321 and the second diaphragm 322 .
  • the voice coil 323 when the voice coil 323 is energized, the voice coil 323 , the first diaphragm 321 and the second diaphragm 322 move in the same direction as a whole, and both the first diaphragm 321 and the second diaphragm 322 produce sound.
  • the diaphragm will deflect left and right or tilt to a certain extent during the movement (that is, polarization occurs). Moreover, this polarization phenomenon will become more obvious as the amplitude of the diaphragm increases.
  • the diaphragm When the diaphragm is polarized during the movement, it may touch the magnetic circuit components, rubbing and making a certain noise. The generation of noise will cause the diaphragm to fail to reach the expected amplitude setting value during actual work, which will affect the loudness of the speaker's sound.
  • two diaphragms i.e. the first diaphragm 321 and the second diaphragm 322 are respectively arranged on both sides of the magnetic circuit assembly 33, and the voice coil 323 is arranged on the magnetic circuit assembly 33.
  • the gap 333 is connected to the first diaphragm 321 and the second diaphragm 322 on both sides respectively.
  • the first diaphragm 321, the second diaphragm 322 and the voice coil 323 have consistency during the movement process, ensuring the vibration stiffness of the vibration component 32 up and down
  • the symmetry improves the vibration stability of the entire vibrating assembly 32, can more effectively improve the polarization phenomenon, improves the vibration balance of the vibrating assembly 32 under large amplitude conditions, and avoids the noise generated by the magnetic circuit assembly, making the speaker In actual work, the expected amplitude setting value can be achieved.
  • the voice coil-dual-diaphragm designed speaker 30 can achieve a larger amplitude on the basis of miniaturization and obtain more
  • the high loudness makes the loudness of speakers used in small electronic devices such as wristbands and reading pens not subject to space constraints, improving user experience.
  • the loudspeaker of the present application can achieve a larger amplitude setting value and obtain higher loudness.
  • first diaphragm 321 and the second diaphragm 322 of the present application are respectively located on opposite sides of the magnetic circuit assembly 33, which can effectively increase the vibration area of the speaker and improve the Utilization of speakers in a limited space to obtain higher loudness.
  • the housing 31 is a substantially rectangular cylinder.
  • the casing 31 includes a frame body 312 , an upper cover 313 and a lower cover 314 .
  • the frame body 312 is a hollow structure with openings on both sides. Wherein, the two openings of the frame body 312 are the first opening 3122 and the second opening 3123 respectively, the first diaphragm 321 covers the first opening 3122 of the frame body 312, and the upper cover plate 313 fixes the first diaphragm 321 to the frame Body 312.
  • the second diaphragm 322 covers the second opening 3123 of the frame body 312 , and the lower cover 314 fixes the second diaphragm 322 to the frame body 312 . That is to say, the first diaphragm 321 and the second diaphragm 322 respectively cover opposite sides of the frame body 312 to seal the inner cavity 311 .
  • the casing 31 is composed of three parts (namely the frame body 312, the upper cover plate 313 and the lower cover plate 314), in order to fix the first diaphragm 321 and the second diaphragm 322 on the frame body 312, The assembly of the speaker 30 is facilitated.
  • the shape of the housing 31 may also be a cylinder, a square cylinder, or a special shape.
  • the frame body 312 may further include a first card slot 3123 and a second card slot 3124 , and the first card slot 3123 and the second card slot 3124 are respectively arranged inside the frame body 312 along the length direction. on opposite side walls.
  • the magnetic circuit assembly 33 is fixed inside the frame body 312 , and the magnetic circuit assembly 33 can be limited inside the frame body 312 by the first locking slot 3123 and the second locking slot 3124 , so that the magnetic circuit assembly 33 is stably fixed on the frame body 312 .
  • the frame body 312 may not include the first slot and the second slot, and the magnetic circuit assembly 33 may also be fixed on the frame body 312 by bonding, bolting, etc.
  • the connection method between the magnetic circuit assembly 33 and the frame body 312 is limited.
  • the frame body 312 may also include other limiting structures other than the first card slot and the second card slot, and the limit magnetic circuit assembly 33 is fixed on the frame body 312 .
  • the material of the frame body 312 may also be a thermally conductive material. It can be understood that the inner cavity of the speaker 30 is a sealed space. Since the voice coil 323 will emit heat when it moves, the pressure in the inner cavity of the speaker 30 will change, which will affect the working performance. By using a heat-conducting material to make the frame 312, it can The pressure inside the speaker 30 is effectively balanced, and the influence of pressure changes on the working performance of the speaker 30 is reduced.
  • the loudspeaker 30 in the present embodiment owing to adopting the voice coil-dual diaphragm design, two diaphragms (namely the first diaphragm 321 and the second diaphragm 322) are connected by the same voice coil 323 and move in the same direction, Therefore, there will be no air pressure change inside the speaker 30 due to the movement of the diaphragm. Moreover, since the pressure change caused by the heating of the voice coil 323 is actually small, the internal pressure relief requirements of the speaker 30 can be met only by using a heat-conducting material to make the frame 312, avoiding impurities and impurities caused by opening holes on the housing 31. The entry of water vapor effectively saves the protection cost while improving the dustproof ability of the speaker 30 itself.
  • the material of the frame body 312 may not be a heat-conducting material, and a heat-conducting material such as heat-conducting gel may be used to coat the surface of the frame body 312 to form a heat-conducting coating to seal the interior of the speaker.
  • the heat is exported to relieve the internal pressure of the speaker.
  • the frame body 312 can also dredge the internal air pressure of the speaker 30 by only opening micropores. Since the micropores have a small diameter, the impact on dust prevention is low, and it can meet the requirements of dustproof and air pressure at the same time. Cooling requirements.
  • the walls of the micropores may be straight. In some other embodiments, the walls of the microholes may also be curved, which is more effective in preventing impurities, water vapor, etc. from entering the inner cavity of the speaker.
  • the structure of the upper cover plate 313 and the lower cover plate 314 is the same, and the upper cover plate 313 will be described in detail below as an example.
  • FIG. 9 is a schematic structural view of the upper cover 313 of the speaker 30 shown in FIG. 6 in some embodiments.
  • the upper cover 313 may include a middle portion and an edge portion surrounding the middle portion.
  • the edge part is fixed on the side of the first diaphragm 321 facing away from the frame body 312 to fix the first diaphragm 321 to the frame body 312 .
  • the middle part is a hollow structure 3131 for avoiding the first diaphragm 321 and facilitating the vibration of the first diaphragm 321 .
  • the upper cover 313 may further include an avoidance groove 3132 , the avoidance groove 3132 is provided on the surface of the edge portion facing the first diaphragm 321 , and communicates with the hollow structure 3131 .
  • the escape groove 3132 is used to avoid the first diaphragm 321 to facilitate the vibration of the first diaphragm 321 .
  • the upper cover plate 313 may not include an escape groove, and the width of the edge portion may be made narrow enough to avoid hindering the vibration of the first diaphragm.
  • the casing 31 may only include the frame body 312, that is, the casing 31 may not include the upper cover and the lower cover, and the first diaphragm 321 and the second diaphragm 322 can be respectively directly fixed to the frame body 312 by bonding.
  • connection method between the second diaphragm 322 and the lower cover 314 is the same as that between the first diaphragm 321 and the upper cover 313 , and will not be repeated here.
  • FIG. 10 is a schematic structural diagram of the magnetic circuit assembly 33 of the speaker 30 shown in FIG. 6 in some embodiments.
  • the magnetic circuit assembly 33 may include an upper clamping plate 331 , a magnetic steel 332 and a lower clamping plate 334 .
  • the upper clamping plate 331 is fixed on one side of the magnetic steel 332
  • the lower clamping plate 334 is fixed on the side of the magnetic steel 332 facing away from the upper clamping plate 331, that is to say, the upper clamping plate 331 and the lower clamping plate 334 are respectively arranged on the magnetic steel 332 opposite sides.
  • the upper clamping plate 331 and the lower clamping plate 334 can be respectively fixed on opposite sides of the magnetic steel 332 by bonding.
  • the upper clamping plate 331 includes a first upper clamping plate 3311 and a second upper clamping plate 3312 arranged at intervals
  • the magnetic steel 332 includes first sub-magnetic steels 3321 and second sub-magnetic steels 3322 arranged at intervals
  • the lower clamping plate 334 includes first and second sub-magnetic steels 3322 arranged at intervals.
  • the lower clamping plate 3341 and the second lower clamping plate 3342, the first upper clamping plate 3311 and the first lower clamping plate 3341 are respectively fixed on opposite sides of the first sub-magnetic steel 3321
  • the second upper clamping plate 3312 and the second lower clamping plate 3342 are respectively fixed on Two opposite sides of the second sub-magnetic steel 3322.
  • first upper clamping plate 3311 of the upper clamping plate 331 , the first sub-magnetic steel 3321 of the magnetic steel 332 and the first lower clamping plate 3341 of the lower clamping plate 334 jointly form the first part of the magnetic circuit assembly 33 .
  • the second upper clamping plate 3312 of the upper clamping plate 331 , the second sub-magnetic steel 3322 of the magnetic steel 332 and the second lower clamping plate 3342 of the lower clamping plate 334 jointly form the second part of the magnetic circuit assembly 33 .
  • Both the first part and the second part are installed inside the frame body 312 , and the first part and the second part are relatively spaced apart, and a magnetic gap 333 is formed between the first part and the second part.
  • both the first part and the second part are magnetic, and the opposite surfaces of the first part and the second part have opposite magnetic properties. That is, the magnetic properties of the two opposing surfaces of the first sub-magnet 3321 and the second sub-magnet 3322 are opposite.
  • the part of the first sub-magnet 3321 close to the first upper clamping plate 3311 is an N pole
  • the part of the first sub-magnet 3321 close to the first lower clamping plate 3341 is an S pole
  • the second sub-magnet 3322 is close to the first
  • the part of the second upper clamping plate 3312 is the S pole
  • the part of the second sub-magnetic steel 3322 close to the second lower clamping plate 3342 is the N pole.
  • the part of the first sub-magnet 3321 close to the first upper splint 3311 can also be an S pole
  • the part of the first sub-magnet 3321 close to the first lower splint 3341 can also be an N pole
  • the second sub-magnet The part of 3322 close to the second upper clamping plate 3312 is the N pole
  • the part of the second sub magnet 3322 close to the second lower clamping plate 3342 is the S pole.
  • the first part can be installed in the first slot 3123 of the frame body 312 by bonding
  • the second part can be installed in the second slot 3124 of the frame body 312 by bonding.
  • first locking slot 3123 and the second locking slot 3124 mainly play a limiting role on the first part and the second part.
  • the magnetic circuit assembly 33 in this embodiment has two magnetic circuits (i.e. the first part and the second part), and the magnetic circuit assembly 33 and the voice coil 323 form a magnetic circuit + voice coil + magnetic circuit in the horizontal direction. Double magnetic circuit structure.
  • the speaker 30 in this embodiment simplifies the magnetic circuit system in the width direction and compresses the size in the width direction, so that it can adapt to narrower-width Product form.
  • the material of the upper splint 331 and the lower splint 334 can also be a magnetically permeable material to enhance the overall magnetic field strength of the magnetic steel, so that the size of the magnetic steel 332 under the same magnetic field strength can be smaller, which is beneficial to the overall Miniaturization of the speaker 30 .
  • connection manner between the first sub-magnet 3321 and the first upper clamping plate 3311 and the first lower clamping plate 3342 may also be other connection manners except bonding.
  • the materials of the upper clamping plate 331 and the lower clamping plate 334 may not be magnetically permeable materials. The present application does not limit the connection methods and materials of the magnetic steel 332 , the upper splint 331 and the lower splint 334 .
  • the magnetic circuit assembly 33 may only include magnetic steel, excluding the upper clamping plate and the lower clamping plate.
  • the magnetic circuit assembly may also include a magnetic steel 332 and one of the upper clamping plate 331 or the lower clamping plate 334 .
  • FIG. 11 is a structural schematic diagram of the vibration assembly 32 of the speaker 30 shown in FIG. 6 in some embodiments.
  • FIG. 12 is a schematic cross-sectional structure diagram of the loudspeaker 30 shown in FIG. 6 along the direction C-C.
  • the voice coil 323 may include a first side portion 3231 and a second side portion 3232 that are opposite to each other.
  • the voice coil 323 is vertically arranged relative to the first diaphragm 321 and the second diaphragm 322, so that the size of the voice coil 323 in the width direction of the speaker 30 is smaller, which is conducive to the miniaturization of the speaker in width, and is more suitable. Equipped with long strip products, for example, when the speaker in this embodiment is applied to the existing relatively thick point reading pen, the width of the point reading pen can be effectively reduced, making the size of the point reading pen closer to that of a conventional signature the size of the pen.
  • the number of voice coils 323 of the vibrating component 32 may be two.
  • the magnetic gap 333 extends along the length direction of the speaker 30 , and two voice coils 323 are horizontally arranged in the magnetic gap 333 along the length direction of the speaker 30 , and the shapes of the two voice coils 323 are identical.
  • the length direction of the loudspeaker is the Y-axis direction in FIG. 12 .
  • the first side portions 3231 of the two voice coils 323 are both connected to the first diaphragm 321
  • the second side portions 3232 of the two voice coils 323 are both connected to the second diaphragm 322 .
  • the two voice coils 323 , the first diaphragm 321 and the second diaphragm 322 form a vibrating whole.
  • the voice coil 323 is electrified, the two voice coils 323 are subjected to Lorentz force in the same direction, and both push the first diaphragm 321 and the second diaphragm 322 to move back and forth.
  • the horizontally arranged double voice coil design can make full use of the space in the length direction of the loudspeaker 30 .
  • the excessively long aspect ratio of the voice coil 323 during winding will lead to a decrease in its dimensional accuracy, which will cause the voice coil 323 to be stressed during the vibration process. Unbalanced, resulting in polarization.
  • the double voice coil design can be combined with the actual length of the speaker 30 to design a plurality of voice coils 323 with a more suitable aspect ratio to form a vibration whole, improve the stability of the vibration component 32 during the vibration process, and improve the yield of the voice coil 323 .
  • the number of voice coils 323 of the vibrating assembly 32 can be one or more, the multiple voice coils 323 are separated from the magnetic gap 333 , and the shapes of the multiple voice coils 323 can be completely the same or different.
  • the present application does not limit the specific quantity and shape of the voice coil 323 .
  • the edges of the first diaphragm 321 and the second diaphragm 322 may also include a ring portion, and the ring portion adopts a semi-circular design to increase the displacement in the vibration direction.
  • the ring portion adopts an elliptical design
  • the first diaphragm 321 / the second diaphragm 322 adopts a material with a high elastic modulus, and the like.
  • the first diaphragm 321 or the second diaphragm 322 may not include a ring portion.
  • the present application does not limit the shapes of the first diaphragm 321 and the second diaphragm 322 .
  • the vibrating assembly 32 can also include a spherical top 324, and the number of the spherical tops 324 can be two, and the two spherical tops 324 respectively cover the first diaphragm 321 and the second diaphragm 322 near the sound.
  • the surface on one side of the ring 323 is used to increase the rigidity of the first diaphragm 321 and the second diaphragm 322 .
  • the dome 324 is an additional part of the vibrating assembly 32 .
  • the two domes 324 can also cover the surfaces of the first diaphragm 321 and the second diaphragm 322 away from the voice coil 323 respectively.
  • the dome 324 can also only cover the surface of one of the first diaphragm 321 or the second diaphragm 321 to increase rigidity, for example, covering the first diaphragm 321 close to or away from the voice coil 323 surface on one side.
  • FIG. 13 is a schematic cross-sectional structure diagram of another embodiment of the loudspeaker 30 shown in FIG. 6 in the C-C direction.
  • the vibrating assembly 32 may also include a first connector 325 and a second connector 326 .
  • the first connecting piece 325 and the second connecting piece 326 have the same shape, and the material can be hard material, such as plastic, metal and so on.
  • One side of the first connecting member 325 is connected to the first diaphragm 321 , and the other side of the first connecting member 325 away from the first diaphragm 321 is connected to the first side portions 3231 of the two voice coils 323 .
  • One side of the second connecting member 326 is connected to the second diaphragm 322 , and the other side of the second connecting member 326 away from the second diaphragm 322 is connected to the second side portion 3232 of the voice coil 323 . That is to say, the two voice coils 323 are respectively connected to the first diaphragm 321 and the second diaphragm 322 through the first connecting member 325 and the second connecting member 326, so that the voice coil 323 is located at the best force-bearing position of the magnetic gap , to ensure that the voice coil 323 is under the best force.
  • the two voice coils 323 are respectively connected to the first diaphragm 321 and the second diaphragm 322 through the first connector 325 and the second connector 326 to form a vibrating whole, which prevents the two voice coils 323 from moving together due to Errors in the manufacturing process lead to incomplete movement of the two voice coils 323 , resulting in unbalanced forces on the left and right sides of the diaphragm and affecting the vibration stability of the vibrating assembly 32 .
  • first connecting piece 325 and the second connecting piece 326 respectively connect the two voice coils 323 and the corresponding diaphragms, which increases the rigidity between the voice coils 323 and the diaphragms, and improves the vibration stability of the vibrating assembly 32 .
  • connecting parts are arranged on both sides of the voice coil 323, which ensures the structural symmetry of the vibrating assembly 32 relative to the two sides of the voice coil 323, so that the vibrating assembly 32 vibrates up and down.
  • the symmetry of stiffness further improves the vibration stability of the vibrating assembly 32 .
  • the vibrating assembly 32 may only be provided with one connecting piece, one connecting piece is connected between the voice coil and the first diaphragm, or one connecting piece is connected between the voice coil and the second diaphragm.
  • the present application does not limit the specific number and shape of the connectors.
  • the shapes of the first connecting member 325 and the second connecting member 326 may also be different.
  • FIG. 14 is a schematic cross-sectional structure diagram of another embodiment of the loudspeaker 30 in the C-C direction shown in FIG. 6 .
  • the vibrating assembly 32 may further include a support member 327 .
  • the number of support members 327 can be two, and the two support members 327 are respectively arranged inside the two voice coils 323 of the vibrating assembly 32, and one end is connected to the first side part 3231, and the other end is connected to the second side part 3232, so as to support the between the first side 3231 and the second side 3232 of the voice coil 323 .
  • the number of support members may be one or more, or multiple support members may be provided in one voice coil.
  • the voice coil 323 is a hollow structure, when the voice coil 323 is energized, the Lorentz force cuts the magnetic field line and pushes the first diaphragm 321 and the second diaphragm 322 to vibrate, the voice coil 323 Deformation is likely to occur in the vibration direction (the first direction), which affects the vibration stability of the vibration assembly 32 and reduces the working performance of the vibration assembly 32 .
  • the rigidity of the voice coil 323 itself is improved, and the deformation phenomenon of the voice coil 323 in the first direction during the vibration process is improved, thereby reducing the deformation band caused by the vibration process.
  • the resulting loss of performance improves the working efficiency of the speaker 30 .
  • the voice coil 323 can also be wound around the support member 327 to enhance the rigidity of the voice coil 323 itself and improve deformation.
  • the material of the support member 327 can be a hard material, such as metal, liquid crystal polymer (Liquid Crystal Polymer, LPC) and other materials, and the application does not limit the material of the support member 327 and the connection method between the support member 327 and the voice coil 323.
  • FIG. 15 is a schematic structural diagram of another embodiment of the speaker 30 shown in FIG. 6 .
  • FIG. 16A is a schematic cross-sectional structure diagram of the loudspeaker 30 shown in FIG. 15 along the D-D direction.
  • FIG. 17 is a schematic cross-sectional structure diagram of the loudspeaker 30 shown in FIG. 15 along the E-E direction.
  • the frame body 312 can also include a first frame 3126 and a second frame 3127 , the first frame 3126 and the second frame 3127 are both hollow structures with openings on both sides. The first frame 3126 and the second frame 3127 are stacked and connected to form the frame body 312 .
  • the openings on both sides of the first frame 3126 are the first openings 3122
  • the openings on both sides of the second frame 3127 are the second openings 3123.
  • the first diaphragm 321 covers the first opening 3122 of the first frame 3126 facing away from the second frame 3127
  • the upper cover 313 fixes the first diaphragm 321 to the first frame 3126
  • the second diaphragm 322 covers the
  • the second frame 3127 faces away from the second opening 3123 of the first frame 3126
  • the lower cover 314 fixes the second diaphragm 322 to the second frame 3127 .
  • the above components are all fixed by bonding.
  • the above-mentioned components may also be connected by clamping, welding, bolting and other connection methods.
  • the loudspeaker 30 of the present application provides the first frame 3126 and the second frame 3127 and connects them to form the frame body 312 , which facilitates the assembly of the magnetic circuit assembly 33 and other internal components of the speaker 30 .
  • the first frame 3126 can also include a first stopper 60, the first stopper 60 is set on the inner wall of the first frame 3126, and the second frame 3127 can also include a second The limiting block 70 , the second limiting block 70 is disposed on the inner wall of the second basin frame 3127 and is opposite to the first limiting block 60 .
  • the magnetic circuit assembly 33 is fixed inside the frame body 312.
  • the magnetic circuit assembly 33 can be limited inside the frame body 312 by the first limit block 60 and the second limit block 70, so that the magnetic circuit assembly 33 is stably fixed. in frame 312 .
  • the first frame 3126 may not include the first limit block
  • the second frame 3127 may not include the second limit block
  • the magnetic circuit assembly 33 may also be fixed by bonding or bolts.
  • the connection method is fixed on the frame body 312 , and the application does not limit the connection method between the magnetic circuit assembly 33 and the frame body 312 .
  • the frame body 312 may also include other limiting structures except the first limit block and the second limit block.
  • the limit magnetic circuit assembly 33 is fixed on the frame body 312 .
  • an extension section 3128 is further provided on the first basin frame 3126 .
  • there are two extension sections 3128 and the two extension sections 3128 are arranged on one side of the first frame 3126 at intervals.
  • the two extensions 3128 are used to carry other components of the speaker 30 .
  • the number of extension sections 3128 may also be one or more.
  • no extension section may be provided on the first frame 3126 .
  • the vibrating assembly 32 also includes connecting lines.
  • the connection circuit is a flexible printed circuit (Flexible Printed Circuit, FPC) 41.
  • the flexible circuit board 41 has a ring structure.
  • the flexible circuit board 41 includes an inner side and an outer side. The inner side is electrically connected to the voice coil 323 , and part of the outer side is fixed to the connection between the first frame 3126 and the second frame 3127 by bonding. That is to say, the flexible circuit board 41 is sandwiched between the first frame 3126 and the second frame 3127 to facilitate the assembly of the flexible circuit board 41 .
  • the present application improves the electrical stability of the speaker 30 by setting the flexible circuit board 41 to electrically connect the circuit board 40 of the electronic device 1000 .
  • the flexible circuit board 41 also includes two extensions 42, the two extensions 42 cover the surface of the first frame 3126 and the two extensions 3128 facing the second frame 3127, and the two extensions 42 are used for It is electrically connected to the circuit board 40 of the electronic device 1000 .
  • FIG. 18 is a structural schematic diagram of an embodiment of the connecting line of the vibrating assembly 32 of the speaker 30 shown in FIG. 15 .
  • the connecting lines may also be wires.
  • copper wires 43 are printed on the surface of the first vibrating membrane 321 as a line lead-out solution instead of a flexible circuit board, thereby reducing the vibration quality of the vibrating component 32 and improving the vibrating performance of the vibrating component 32 .
  • FIG. 19 is a schematic cross-sectional structure diagram of another embodiment of the speaker 30 shown in FIG. 6 along the B-B direction.
  • the speaker 30 in this embodiment is substantially the same as the speaker 30 shown in FIG. 6 , and the same parts will not be repeated here.
  • a magnetic fluid 335 may also be provided in the magnetic gap 333 of the magnetic circuit assembly 33 in this embodiment.
  • the magnetic fluid 335 is a functional material that has both liquid fluidity and solid magnetic material magnetism. When the magnetic fluid 335 is at rest, there is no magnetic attraction. When an external magnetic field is applied, the ferrofluid 335 exhibits magnetism. Therefore, when the magnetic fluid 335 is filled in the magnetic gap 333 , since the magnetic steel 332 generates a magnetic field, the magnetic fluid 335 will be absorbed in the magnetic gap 333 without dripping.
  • the voice coil 323 when the voice coil 323 is energized and under the action of the Lorentz force, it moves along the direction perpendicular to the first diaphragm 321 (that is, the first direction) to cut the magnetic induction line, the sound
  • the coil 323 may also vibrate in a non-first direction, and generate displacement or inclination in a non-first direction, and the voice coil 323 may collide with the magnet 332 during the vibration.
  • the magnetic fluid 335 can extend the voice coil 323 into the magnetic gap 333. Partially wrapped.
  • the magnetic fluid 335 has a limiting effect on the displacement or inclination of the voice coil 323 in the non-first direction, reducing the vibration of the voice coil 323 in the non-first direction.
  • the magnetic gap is designed to be wide enough, which is not conducive to the miniaturization of the entire loudspeaker.
  • the problem of collision is improved by filling the magnetic gap 333 with the magnetic fluid 335 . Therefore, in terms of the design of the speaker 30 , the width of the magnetic gap 333 can be further reduced, the strength of the magnetic field can be increased, and the working efficiency of the speaker 30 can be improved.
  • the magnetic gap 333 is reduced, which improves the overall integration of the loudspeaker 30 and is beneficial to the miniaturization of the whole loudspeaker 30 .
  • FIG. 20 is a schematic structural diagram of another embodiment of the speaker 30 shown in FIG. 6 .
  • FIG. 21 is an exploded schematic view of a part of the structure of the speaker 30 shown in FIG. 20 .
  • FIG. 22 is a schematic cross-sectional structure diagram of the speaker 30 shown in FIG. 20 along the F-F direction.
  • the speaker 30 may include a casing 31 , a vibrating component 32 and a magnetic circuit component 33 .
  • the casing 31 is a hollow structure with two sides open and has an inner cavity 311
  • the magnetic circuit assembly 33 is disposed in the inner cavity 311 .
  • the magnetic circuit assembly 33 has a magnetic gap 333.
  • the vibrating assembly 32 may include a first diaphragm 321, a second diaphragm 322 and a voice coil 323.
  • the edge of the first diaphragm 321 is connected to the opening on one side of the housing 31, and the second An edge of the vibrating membrane 322 is connected to an opening on the other side of the housing 31 facing away from the first vibrating membrane 321 .
  • Edges of the first vibrating membrane 321 and the second vibrating membrane 322 are fixed to the casing 31 by bonding to seal the inner cavity 311 .
  • the voice coil 323 is located in the magnetic gap 333 , and its two sides are respectively connected to the first diaphragm 321 and the second diaphragm 322 .
  • the voice coil 323 When the voice coil 323 is energized, under the action of the magnetic field force, the voice coil 323 generates a Lorentz force in the first direction and cuts the magnetic induction line along this direction, and pushes the first diaphragm 321 and the second diaphragm 322 do reciprocating motion together along this direction. That is to say, when the voice coil 323 is energized, the voice coil 323 , the first diaphragm 321 and the second diaphragm 322 move in the same direction as a whole.
  • the vibrating assembly 32 includes two voice coils 323 , and the two voice coils 323 are arranged horizontally and spaced apart in the magnetic gap 333 of the magnetic circuit assembly 33 .
  • the voice coil 323 includes a first end face 3234 and a second end face 3235 facing away from each other. Both the first end face 3234 and the second end face 3235 are perpendicular to the central axis of the voice coil 323, that is, the plane on which the voice coil 323 is wound is the same as the first end face 3234 and the second end face 3235.
  • the second end surfaces 3235 are parallel.
  • the first end faces 3234 of the two voice coils 323 are both connected to the first diaphragm 321 , and the second end faces 3235 of the two voice coils 323 are both connected to the second diaphragm 322 . That is to say, the two voice coils 323 are arranged parallel to the first diaphragm 321 .
  • the first end surface 3234 is located in the magnetic gap 333 , and the second end surface 3235 is located outside the magnetic gap 333 , so that the second end surface 3235 is connected to the second diaphragm 322 .
  • the speaker 30 in this embodiment arranges the voice coil 323 parallel to the first diaphragm 321, the speaker 30 can make full use of the space in the horizontal direction and reduce the thickness of the speaker 30, so that it can be adapted to mobile phones such as , tablet and other electronic devices with ultra-thin body design.
  • the housing 31 may further include an upper cover and a lower cover.
  • the first diaphragm 321 covers the opening on one side of the casing 31 , and the upper cover plate fixes the first diaphragm 321 to the casing 31 .
  • the second diaphragm 322 covers the opening of the casing 31 away from the first diaphragm 321 , and the lower cover plate fixes the second diaphragm 322 to the casing 31 .
  • the present application does not limit the connection manner of the first diaphragm 321 , the second diaphragm 322 and the casing 31 .
  • FIG. 23 is a schematic structural diagram of the magnetic circuit assembly 33 of the speaker 30 shown in FIG. 20 .
  • the magnetic circuit assembly 33 may include a first magnetic circuit assembly 34 , a second magnetic circuit assembly 35 and a connecting plate 36 .
  • the first magnetic circuit assembly 34 and the second magnetic circuit assembly 35 are fixed on the connecting plate 36, and the connecting plate 36 is fixed inside the casing 31, and the first magnetic circuit assembly 34 and the second magnetic circuit assembly 35 are horizontally spaced along the length direction of the speaker 30 arranged in the inner cavity 311 .
  • the first magnetic circuit assembly 34 and the second magnetic circuit assembly 35 are respectively fixed on the connecting plate 36 by bonding. It can be understood that the first magnetic circuit assembly 34 and the second magnetic circuit assembly 35 are indirectly fixed inside the casing 31 through the connecting plate 36 .
  • the connecting plate 36 can be fixed inside the housing 31 by bonding.
  • the connecting plate 36 can also be fixed on the inside of the housing 31 by inlaying, screwing, clamping, welding, etc. Inside the casing 31 .
  • the first magnetic circuit assembly 34 and the second magnetic circuit assembly 35 can also be fixed on the connecting plate 36 by bonding, clipping, screwing, etc. 31 and the connection methods of the first magnetic circuit assembly 34, the second magnetic circuit assembly 35 and the connecting plate are limited.
  • the magnetic circuit assembly 33 further includes an escape hole 361 .
  • the escape hole 361 may be provided on the connecting plate 36 , for example, the avoiding hole 361 is provided on the connecting plate 36 and penetrates through the surfaces of both sides of the connecting plate 36 .
  • the avoidance hole 361 includes a middle avoidance hole 362 and two edge escape holes 363 located on the left and right sides of the middle avoidance hole 362 .
  • the middle escape hole 362 is disposed at the connecting plate 36 corresponding to the space between the two voice coils 323 , that is, the center of the middle avoidance hole 362 is located at the center of the space between the two voice coils 323 .
  • the middle escape hole 362 is located above the distance between the two voice coils 323 .
  • the two edge escape holes 363 are respectively located on a side of the first magnetic circuit assembly 34 away from the second magnetic circuit assembly 35 and a side of the second magnetic circuit assembly 35 away from the first magnetic circuit assembly 34 .
  • first magnetic circuit assembly 34 and the second magnetic circuit assembly 35 are the same, and the following will take the first magnetic circuit assembly 34 as an example for specific description.
  • the first magnetic circuit assembly 34 includes a first magnetic conductive plate 341 and a first magnetic steel 342 .
  • the first magnetic conductive plate 341 is connected to the surface of one side of the first magnetic steel 342 , and the other surface of the first magnetic steel 342 away from the first magnetic conductive plate 341 is fixed to the connecting plate 36 . That is to say, the first magnetic steel 342 is sandwiched between the first magnetic conductive plate 341 and the connecting plate 36 .
  • the first magnetic steel 342 can be fixed on the connection plate 36 by bonding, clipping, screwing, etc.
  • the first magnetic plate 341 can be connected by bonding, clipping, screwing, etc. It is fixed on the first magnetic steel 342 , and the application does not limit the connection method between the above components.
  • the material of the first magnetic plate 341 can also be a magnetic material, so as to enhance the overall magnetic field strength of the first magnetic circuit assembly 34, so that the size of the first magnetic steel 342 under the same magnetic field strength can be smaller The small size is beneficial to the miniaturization of the entire loudspeaker 30 .
  • the first magnetic circuit assembly 34 may not include the first magnetic conductive plate.
  • the first magnet 342 may include a center magnet 3314 and edge magnets 3315 disposed on both sides of the center magnet 3314 .
  • the central magnetic steel 3314 and the two edge magnetic steels 3315 are spaced apart to form a first magnetic gap 3331 , and the first magnetic gap 3331 communicates with the corresponding middle avoidance hole 362 and edge avoidance hole 363 .
  • One of the voice coils 323 of the vibrating assembly 32 is disposed in the first magnetic gap 3331 , so that the voice coil 323 realizes the movement of cutting magnetic lines of induction in the first direction after being energized.
  • the present application does not limit the specific structure and shape of the first magnetic steel 342 .
  • the first magnetically conductive plate 341 includes a middle magnetically conductive plate 342 and edge magnetically conductive plates 343 disposed on two sides of the middle magnetically conductive plate 342 .
  • the middle magnetic plate 342 is fixed on the surface of the central magnetic steel 3314 facing away from the connection plate 36
  • the two edge magnetic plates 343 are respectively fixed on the surfaces of the two edge magnetic steel 3315 facing away from the connecting plate 36 .
  • the material of the connecting plate 36 can also be a magnetically conductive material, that is to say, the first magnetic steel 342 is sandwiched between two Between the two magnetically permeable materials, the two magnetically permeable materials act together on the first magnetic steel 342, so that the magnetic field strength of the first magnetic steel 342 increases, and the size of the first magnetic steel 342 under the same magnetic field strength can be made smaller.
  • the small size is beneficial to the miniaturization of the entire loudspeaker 30 .
  • the second magnetic circuit assembly 35 may further include a second magnetic steel 351 and a second magnetic permeable plate 352 .
  • the second magnetic steel 351 is provided with a second magnetic gap 3332 , and the second magnetic gap 3332 communicates with the corresponding middle avoidance hole 362 and edge avoidance hole 363 .
  • the other voice coil 323 of the vibrating assembly 32 is disposed in the second magnetic gap 3332 , so that the voice coil 323 realizes the movement of cutting magnetic lines of induction in the first direction after being energized.
  • first magnetic gap 3331 and the second magnetic gap 3332 of the magnetic circuit assembly 33 may also be filled with a magnetic fluid 335 .
  • one of the first magnetic gap 3331 and the second magnetic gap 3332 may be filled with a magnetic fluid 335 .
  • the number of voice coils can also be multiple, correspondingly, the number of magnetic gaps is also multiple, multiple magnetic gaps are arranged at intervals along the length direction of the loudspeaker, multiple voice coils One-to-one correspondence is located in a plurality of magnetic gaps.
  • FIG. 24 is a schematic structural diagram of the third connecting member 37 of the speaker 30 shown in FIG. 20 .
  • the vibrating assembly 32 may also include a third connecting member 37 .
  • the number of the third connecting elements 37 is two, and the two third connecting elements 37 are correspondingly disposed between the first diaphragm 321 and the two voice coils 323 . That is to say, one of the third connecting parts 37 is disposed between one of the voice coils 323 and the first diaphragm 321 , and the other third connecting part 37 is disposed between the other voice coil 323 and the first diaphragm 321 .
  • One end of the third connecting member 37 is connected to the first diaphragm 321 , and the other end extends to the magnetic gap 333 and connects to the first end surface 3234 .
  • the third connecting member 37 includes an adhering portion 371 and an extending portion 372 .
  • the bonding portion 371 includes a mounting side, and there are two extending portions 372 , and the two extending portions 372 are connected to opposite ends of the mounting side.
  • the fitting part 371 and the two extension parts 372 are integrally formed to ensure the strength of the third connecting part 37 .
  • fitting part 371 and the two extension parts 372 can also be fixed through connection.
  • the number of extensions 372 can also be one or more.
  • the fitting part 371 of one of the third connecting parts 37 is connected to the first diaphragm 321, and the two extension parts 372 pass through the edge avoidance hole 363 and the middle avoidance hole 362 respectively, and are connected to the first diaphragm 323 of the voice coil 323. Both ends of the end face 3234 .
  • the connection method between the other third connecting member 37 and the first diaphragm 321 and the other voice coil 323 is the same as the connection method described above, which will not be repeated here. That is to say, the voice coil 323 , the third connecting member 37 , the first diaphragm 321 and the second diaphragm 322 together form a vibrating whole.
  • the voice coil 323 When the voice coil 323 is energized and moves to cut the magnetic field lines, on the one hand, it pushes the second diaphragm 322 to move back and forth; Back and forth motion in the same direction.
  • the voice coil 323 can pass through
  • the third connecting piece 37 passes through the magnetic circuit assembly 33 and connects with the first diaphragm 321 to realize that the voice coil 323 is connected between the first diaphragm 321 and the second diaphragm 322, so that the first diaphragm 321, the second diaphragm 322 and voice coil 323 form a voice coil-double-diaphragm structure, and have consistency during the movement process, which ensures the symmetry of the vibration stiffness of the vibration assembly 32 up and down, improves the vibration stability of the entire vibration assembly 32, and can more effectively improve
  • the polarization phenomenon improves the vibration balance of the vibrating component 32 under the condition of large amplitude, and avoids generating noise caused by touching the magnetic circuit component, so that the loudspeaker can reach the expected amplitude setting value in actual
  • the voice coil-dual-diaphragm designed speaker 30 can achieve a larger amplitude on the basis of miniaturization and obtain more
  • the high loudness makes the loudness of speakers used in small electronic devices such as wristbands and reading pens not subject to space constraints, improving user experience.
  • the speaker 30 of the present application can achieve a larger amplitude setting value and obtain higher loudness.
  • the two extension parts 372 are respectively connected to both ends of the first end surface 3234 of the voice coil 323, so that the connection between the voice coil 323 and the third connecting member 37 is more stable.
  • the vibration stability of the vibration component 32 is improved.
  • the bonding portion 371 of the third connecting member 37 is a hollow ring structure, which is the same as the structure of the second end surface 3235 of the voice coil 323, so that the bonding portion 371 and the first diaphragm 321
  • the bonding area of the second end surface 3235 and the second diaphragm 322 is the same, so that the bonding area of the whole formed by the third connecting member 37 and the voice coil 323 and the first diaphragm 321 and the second diaphragm 322 is the same, that is,
  • the connection stiffness on both sides of the whole body is the same, which improves the vibration stability in the vibrating assembly 32 .
  • the two extensions 372 of the third connecting member 37 have the same shape as the portion of the voice coil 323 that it contacts, so as to increase the connecting area between the extensions 372 and the voice coil 323 and ensure a stable connection between the extensions 372 and the voice coil 323 .
  • the extending portion 372 is also arc-shaped correspondingly.
  • the number of the third connecting piece 37 can also be one or more, and the shapes of the bonding portion 371 and the extension portion 372 can also be in other styles. The style is limited.
  • FIG. 25A is a specific schematic diagram of the loudspeaker 30 shown in FIG. 6 realizing far-field noise cancellation.
  • the first diaphragm 321 and the second diaphragm 322 may also be arranged symmetrically with respect to the magnetic circuit assembly 33 . Since the first diaphragm 321 and the second diaphragm 322 are driven by the same voice coil 323 and are arranged symmetrically with respect to the magnetic circuit assembly 33, the sound waves emitted by the first diaphragm 321 and the second diaphragm 322 are equal in magnitude and opposite in phase (i.e. The phase difference is 180°). That is to say, the speaker 30 at this time is a dipole speaker and can form a dipole sound field.
  • the speaker 30 When the speaker 30 emits sound, two sounds with opposite phases are respectively emitted from the first diaphragm 321 and the second diaphragm 322 and transmitted to the outside of the speaker 30 . Specifically, the sound emitted from the first diaphragm 321 passes through the first channel 1228 from the first sound hole 13 to the outside of the temple 12, and the sound emitted from the second diaphragm 322 passes through the second channel 1229 from the second sound hole 14.
  • the outgoing temple 12 is external.
  • the diaphragm can have a larger diaphragm and provide greater loudness, so that the wearer can obtain a better experience of loudness in the ear and improve User experience.
  • FIG. 26 is a schematic structural diagram of another electronic device 1000 provided in this application.
  • the electronic device 1000 in the embodiment shown in FIG. 26 is specifically described by taking a mobile phone as an example.
  • the electronic device 1000 may include a casing 100, a display module 200, an external speaker 300 (also called a speaker), a non-external speaker 400 (also called an earpiece), a motherboard 500, a processor 600, and a memory 700 and battery 800.
  • the casing 100 includes a frame 1001 and a rear cover 1002 , and the frame 1001 is connected to an edge of the rear cover 1002 .
  • the frame 1001 and the rear cover 1002 may be integrally formed, or may be assembled to form an integral structure.
  • FIG. 27 is a schematic cross-sectional structure diagram of the electronic device 1000 shown in FIG. 26 along the G-G direction.
  • the housing 100 is provided with a speaker hole 1003 and an installation space 1004, and the number of the speaker hole 1003 can be one or more. Exemplarily, there are multiple speaker holes 1003 , and the plurality of speaker holes 1003 are disposed on the frame 1001 .
  • the speaker hole 1003 connects the inside of the electronic device 1000 with the outside of the electronic device 1000 .
  • the installation space 1004 is disposed inside the frame 1001 .
  • the installation space 1004 also includes a sound hole, which is disposed on a side wall of the installation space 1004 and communicates with the sound hole 1003 .
  • the speaker 30 is fixed in the installation space 1004, and the installation space 1004 is divided to form a first chamber 1006 and a second chamber 1007, and the first chamber 1006 communicates with the sound outlet.
  • the display module 200 includes a cover plate and a display panel.
  • the cover plate is fixed on the housing 100 , for example, the cover plate is fixed on a side of the frame 1001 away from the rear cover 1002 .
  • the display panel is fixed on the inner surface of the cover plate facing the rear cover 1002 .
  • the cover is used to protect the display panel.
  • the cover plate is provided with a telephone hole 2001 .
  • the receiving hole 2001 is a pupil penetrating through the cover plate.
  • the projection of the display panel on the cover plate is staggered from the receiver hole 2001 .
  • the display panel is used to display images, videos, etc., and the display panel may also integrate a touch function.
  • the display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active matrix organic light emitting diode or an active matrix organic light emitting diode (active-matrix organic light emitting diode, AMOLED), flexible light-emitting diode (flex light-emitting diode, FLED), Miniled, MicroLed, Micro-oLed, quantum dot light emitting diodes (quantum dot light emitting diodes, QLED), etc.
  • LCD liquid crystal display
  • OLED organic light-emitting diode
  • AMOLED active matrix organic light emitting diode
  • FLED flexible light-emitting diode
  • Miniled MicroLed, Micro-oLed
  • quantum dot light emitting diodes quantum dot light emitting diodes (quantum dot light emitting diodes, QLED), etc.
  • Both the loudspeaker 300 and the loudspeaker 400 are located in the installation space 1004 and between the display module 200 and the rear cover 1002 .
  • the sound emitted by the external speaker 300 can be transmitted to the outside of the electronic device 1000 through the sound outlet, so as to realize the sound playing function of the electronic device 1000 .
  • the sound emitted by the non-external loudspeaker 400 is transmitted to the outside of the electronic device 1000 through the phone hole 2001 , so as to realize the sound playing function of the electronic device 1000 .
  • the external speaker 300 and/or the non-external speaker 400 may adopt the speaker 30 described in the subsequent embodiments.
  • "A and/or B" includes "A", "B” and "A and B".
  • the motherboard 500 is located inside the casing 100 , and the processor 600 , memory 700 and other various circuit devices are integrated on the motherboard 500 .
  • the processor 600 may include one or more processing units, for example: the processor 600 may include an application processor 600 (application processor, AP), a modem processor, a graphics processing unit 600 (graphics processing unit, GPU), an image signal Processor 600 (image signal processor, ISP), controller, video codec, digital signal processor (digital signal processor, DSP), baseband processor, and/or neural network processor (neural-network processing unit, NPU )wait. Wherein, different processing units may be independent devices, or may be integrated in one or more processors 600 .
  • the processor 600 can generate an operation control signal according to the instruction operation code and the timing signal, and complete the control of fetching and executing the instruction.
  • the processor 600 may also be provided with an internal memory 700 for storing instructions and data.
  • the memory 700 in the processor 600 may be a cache memory 700 .
  • the memory 700 may store instructions or data used by the processor 600 or frequently used. If the processor 600 needs to use the instruction or data, it can be called directly from the memory 700 . Repeated access is avoided, and the waiting time of the processor 600 is reduced, thereby improving the efficiency of the system.
  • processor 600 may include one or more interfaces.
  • the interface may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous transmitter (universal asynchronous receiver/transmitter, UART) interface, mobile industry processor interface (mobile industry processor interface, MIPI), general-purpose input and output (general-purpose input/output, GPIO) interface, subscriber identity module (subscriber identity module, SIM) interface, and /or universal serial bus (universal serial bus, USB) interface, etc.
  • the processor 600 may be connected to modules such as a touch sensor, a wireless communication module, a display, and a camera through at least one of the above interfaces.
  • Memory 700 may be used to store computer-executable program code, including instructions.
  • the memory 700 may include an area for storing programs and an area for storing data.
  • the storage program area can store an operating system, at least one application program required by a function (such as a camera function, a video function, etc.) and the like.
  • the storage data area can store data created during the use of the electronic device 1000 (such as image data, video data, etc.) and the like.
  • the memory 700 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one magnetic disk storage device, flash memory device, universal flash storage (universal flash storage, UFS) and the like.
  • Processor 600 executes various functional methods or data processing of electronic device 1000 by running instructions stored in memory 700 and/or instructions stored in memory 700 disposed in processor 600, for example, making external loudspeaker 300 emit sound, so that the non-external loudspeaker 400 collects sound and the like.
  • the battery 800 is used for powering the electronic device 1000 .
  • An audio module 300 for processing audio signals can also be integrated on the motherboard 500, and the audio module 300 can include an audio signal transmitting chip 301 and a power amplifier 302.
  • the audio signal transmitting chip 301 is used for transmitting audio signals.
  • the audio signal transmitting chip 301 is an independent chip. It can be understood that, by setting an independent chip to independently operate the function of transmitting the audio signal, the transmission efficiency of the audio signal is improved.
  • the function of transmitting the audio signal may also be integrated on the central processing unit 600 (central processing unit, CPU).
  • CPU central processing unit
  • the interior of the electronic device 1000 can save the occupied space of one chip, thereby improving the utilization rate of the internal space of the electronic device 1000 .
  • the function of transmitting audio signals can also be integrated on other chips, such as the battery management chip 800 .
  • one end of the power amplifier 302 is electrically connected to the audio signal transmitting chip 301 , and the other end is electrically connected to the external speaker 300 .
  • the audio signal transmitting chip 301 transmits an audio signal
  • the audio signal is transmitted to the power amplifier 302
  • the power amplifier 302 processes the audio signal, and transmits the processed audio signal to the external speaker 300 .
  • the external speaker 300 emits sound to the outside of the electronic device 1000 according to the audio signal.
  • the electronic device 1000 may also include one or more functional modules such as an antenna module, a mobile communication module, a sensor module, a motor, and a camera module.
  • the antenna module is used to transmit and receive electromagnetic wave signals, and the antenna module may include multiple antennas, and each antenna may be used to cover a single or multiple communication frequency bands. Different antennas can also be multiplexed to improve the utilization of the antennas.
  • the mobile communication module can provide wireless communication solutions including 2G/3G/4G/5G applied on the electronic device 1000 .
  • the sensor module may include one or more of a pressure sensor, a gyroscope sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity light sensor, a fingerprint sensor, a temperature sensor, a touch sensor or an ambient light sensor.
  • the motor can generate a vibrating prompt.
  • the motor can be used for incoming call vibration prompts, and can also be used for touch vibration feedback.
  • the camera module is used to collect template images and the like.
  • FIG. 28 is a structural schematic diagram of another embodiment of the speaker 30 shown in FIG. 20 .
  • FIG. 29 is an enlarged schematic view of a partial cross-sectional structure of another embodiment of the electronic device 1000 shown in FIG. 27 .
  • the loudspeaker 30 in this embodiment is substantially the same as the loudspeaker 30 shown in FIG. And it communicates with the inner cavity 311 of the speaker 30 and the second cavity 1007 of the installation space 1004 . That is to say, the opening 50 draws the air inside the speaker 30 into the second cavity 1007, so that the volume of the air inside the speaker 30 increases, so that the speaker 30 can obtain greater amplitude and higher loudness under the same space conditions. . It can be understood that, in this embodiment, the opening 50 is formed on the side wall of the speaker 30 to cooperate with the structure of the electronic device 1000 itself, and the inner cavity can be expanded without increasing the size of the speaker 30 to obtain a more High loudness improves user experience.
  • the two diaphragms of the loudspeaker 30 vibrate in the same direction, and the inner cavity 311 of the loudspeaker 30 itself is not compressed, which is an ineffective cavity.
  • the opening 50 is formed on the side wall of the speaker 30, so that the inner cavity 311 of the speaker 30 communicates with the second cavity 1007, so that the inner cavity 311 becomes an effective cavity, which can participate in air compression and effectively improve the loudness.
  • the speakers mentioned in the above embodiments may all be provided with openings on the side walls.
  • the scheme of matching the opening with the installation space of the electronic device is applicable to the external loudspeaker, but not to the earpiece.
  • the speaker installed in the installation space of the electronic device may also be the improved speaker in any one of the above embodiments.

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Abstract

本申请提供一种扬声器及电子设备。扬声器（30）包括壳体（31）、振动组件（32）和磁路组件（33），壳体（31）具有内腔（311），磁路组件（33）设于内腔（311），磁路组件（33）具有磁间隙（333），振动组件（32）包括第一振膜（321）、第二振膜（322）和音圈（323），第一振膜（321）和第二振膜（322）分别位于磁路组件（33）相背的两侧，第一振膜（321）和第二振膜（322）的周缘连接于壳体（31），音圈（323）位于磁间隙（333）内，且音圈（323）相背的两侧分别连接第一振膜（321）和第二振膜（322）。本申请的扬声器及电子设备在小型化的基础上响度大。

Description

扬声器及电子设备
本申请要求于2021年10月27日提交中国专利局、申请号为202111258521.3、申请名称为“扬声器及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及扬声器技术领域，特别涉及一种扬声器及电子设备。
背景技术
扬声器作为一种常用的电声换能器件，广泛应用于各类电子设备(如手机、智能眼镜等终端)中。随着穿戴类、点读笔等新形态电子设备的诞生，及手机等电子设备尺寸的缩小，可提供给扬声器的空间也进一步缩小，扬声器只能做得更小，导致扬声器向外辐射发声的有效面积减小，从而影响扬声器的响度。如何在有限的有效辐射面积条件下，提升扬声器的响度成为研究方向。
发明内容
本申请实施例提供一种扬声器，及包括该扬声器的电子设备。本申请提供的扬声器及电子设备在小型化的基础上响度大。
第一方面，提供了一种扬声器。扬声器包括壳体、振动组件和磁路组件。壳体具有内腔，磁路组件设于内腔，磁路组件具有磁间隙。振动组件包括第一振膜、第二振膜和音圈，第一振膜和第二振膜分别位于磁路组件相背的两侧，第一振膜和第二振膜的周缘连接于壳体，音圈位于所述磁间隙内，且音圈相背的两侧分别连接至第一振膜和第二振膜。
可以理解的是，音圈位于第一振膜和第二振膜之间，且穿过磁路组件的磁间隙并连接两个振膜。当音圈通电时受磁场力的作用，音圈将产生垂直于第一振膜平面方向上的洛伦兹力并沿该方向做切割磁感线运动，且推动第一振膜和第二振膜一起沿该方向做往返运动。也就是说，当音圈通电时，音圈、第一振膜和第二振膜将作为一个整体一起同向运动。
可以理解的是，扬声器在加工和组装过程中存在一定的偏差，因此，振膜在运动过程中会发生一定的左右偏转或者倾斜等现象(即出现偏振现象)。且，这种偏振现象会随着振膜振幅的增大而愈加明显。当振膜在运动过程中出现偏振现象时，有可能会触碰到磁路组件，发生擦碰并发出一定杂音。杂音的产生会使振膜在实际工作时达不到预期的振幅设定值，影响扬声器发声的响度。
本申请的扬声器通过将音圈设置在第一振膜和第二振膜之间且连接第一振膜和第二振膜，使三者形成一个运动整体，保证了第一振膜、第二振膜和音圈在运动过程中的一致性，保证了振动组件上下振动刚度的对称性，并提升了整个振动组件的振动稳定性，能更有效地改善偏振现象，提升振动组件在大振幅条件下的振动平衡性，避免碰到磁路组件而产生杂音，使得扬声器在实际工作中能够达到预期的振幅设定值。由于扬声器的响度由振动面积和振幅决定，也就是说，在同等有效辐射面积的条件下，本申请的扬声器可以在小型化的基础上达到更大的振幅，获得更高的响度，使得应用于手环、点读笔等小型电子设备中的扬声器的响度不受空间约束，提高用户体验。
一种可能的实现方式中，音圈包括相背设置的第一侧部和第二侧部，第一侧部和第二侧部均与音圈的中心轴平行，第一侧部连接第一振膜，第二侧部连接第二振膜。
可以理解的是，音圈相对于第一振膜和第二振膜垂直设置在二者之间，且连接第一振膜和第二振膜，从而音圈在扬声器的宽度方向上的尺寸更小，有利于扬声器在宽度上的小型化， 更加适配长条形的产品，如点读笔、自拍杆等电子设备。
一种可能的实现方式中，振动组件还包括第一连接件和第二连接件，第一连接件连接第一侧部和第一振膜，第二连接件连接第二侧部和第二振膜。其中，第一连接件和第二连接件完全相同，其材料可以为硬质材料，如塑料、金属等。可以理解的是，音圈通过第一连接件和第二连接件间接连接至第一振膜和第二振膜，以使音圈位于磁间隙的最佳受力位置，保证音圈受力最佳。同时还使得三者形成一个振动整体，提升了振动组件整体的振动刚度，保证了振动组件整体的振动稳定性。且在音圈的两侧均设置连接件(第一连接件和第二连接件)，使得振动组件相对音圈两侧的结构对称，保证了振动组件上下振动刚度的对称性，进一步提升了振动组件的振动稳定性。
一种可能的实现方式中，振动组件还包括支撑件，支撑件设于音圈内部，且一端连接第一侧部，另一端连接第二侧部，以支撑在第一侧部和第二侧部之间。由于音圈为中空结构，在运动过程中容易发生形变并影响振动稳定性，本申请通过在音圈内部设置支撑件，保证了音圈的刚度，避免其在运动过程中发生形变，保证了振动组件的振动稳定性。
一种可能的实现方式中，磁路组件包括第一部分和第二部分，第一部分和第二部分均具有磁性，第一部分与第二部分相对间隔设置，第一部分和第二部分之间形成磁间隙。可以理解的是，第一部分和第二部分相对的两个面的磁性相反，通过将磁路组件的第一部分和第二部分间隔设置，以形成磁间隙，以便音圈能够设置于第一部分和第二部分之间，使得音圈在通电时能够受到磁场力的作用产生洛伦兹力并作切割磁感线的运动。
一种可能的实现方式中，音圈包括相背设置的第一端面和第二端面，第一端面和第二端面均与音圈的中心轴垂直，第一端面连接第一振膜，第二端面连接第二振膜。可以理解的是，音圈相对于第一振膜和第二振膜平行设置于二者之间，且连接第一振膜和第二振膜，使得扬声器能够充分利用水平方向的空间，降低扬声器的厚度，使其能够适配于如手机、平板等机身超薄设计的电子设备。
一种可能的实现方式中，第一端面位于磁间隙内，第二端面位于磁间隙外部，以便于第二端面连接第二振膜。
一种可能的实现方式中，振动组件还包括第三连接件，第三连接件一端连接第一振膜，另一端延伸至磁间隙并连接第一端面。可以理解的是，通过在音圈与第一振膜之间设置第三连接件，以使音圈能够通过第三连接件贯穿磁路组件与第一振膜连接，以实现音圈连接在第一振膜和第二振膜之间，使得第一振膜、第二振膜和音圈形成振动整体，并在运动过程中具有一致性，提升了振动组件的刚度，同时保证了振动组件上下振动刚度的对称性，提升了整个振动组件的振动稳定性，保证了振动组件上下振动刚度的对称性，提升了整个振动组件的振动稳定性，能更有效地改善偏振现象，提升振动组件在大振幅条件下的振动平衡性，避免碰到磁路组件而产生杂音，使得扬声器在实际工作中能够达到预期的振幅设定值。由于扬声器的响度由振动面积和振幅决定，也就是说，在同等有效辐射面积的条件下，音圈-双振膜设计的扬声器可以在小型化的基础上达到更大的振幅，获得更高的响度，使得应用于手环、点读笔等小型电子设备中的扬声器的响度不受空间约束，提高用户体验。
一种可能的实现方式中，所述磁路组件包括连接板、第一磁路组件和避让孔，所述第一磁路组件固定于所述连接板，所述连接板固定于所述壳体，所述第一磁路组件排布形成所述磁间隙，所述避让孔设于所述连接板并连通所述磁间隙，所述第三连接件的另一端贯穿所述避让孔延伸至所述磁间隙。可以理解的是，通过在磁路组件中设置避让孔，使得第三连接件的一端在连接第一振膜的同时，另一端能够穿过避让孔与进入磁间隙与音圈连接，使得音圈 能够连接在第一振膜和第二振膜之间。
一种可能的实现方式中，第三连接件包括连接的贴合部和延伸部，贴合部远离所述延伸部的一侧连接第一振膜，延伸部穿过避让孔连接第一侧面第一端面，贴合部包括安装侧，延伸部的数量为两个，两个延伸部连接于安装侧的相对两端。本实现方式中的延伸部为两个，两个延伸部分别连接至音圈的第一端面的两端，使得音圈与第三连接件之间连接更稳固，提高振动组件的振动稳定性。
一种可能的实现方式中，第三连接件的贴合部为中空环状结构，该结构与音圈的第二端面的结构相同，从而贴合部与第一振膜的贴合面积和第二端面与第二振膜的贴合面积相同，从而第三连接件和音圈构成的整体与第一振膜和第二振膜的贴合面积均相同，即该整体两侧的连接刚度相同，提高了振动组件中的振动稳定性。
一种可能的实现方式中，第三连接件的两个延伸部的形状与其接触的音圈部分的形状相同，以增加延伸部与音圈的连接面积，保证延伸部与音圈连接稳固。
一种可能的实现方式中，磁路组件还包括磁液，磁液填充于磁间隙内并包裹至少部分音圈。可以理解的是，磁液为一种既具有液体流动性又具有固体磁性材料磁性的一种功能材料。当磁液处于静态时无磁性吸引力。当外加磁场作用时，磁液表现出磁性。因此，将磁液填充于磁间隙中时，由于磁路组件产生了磁场，因此磁液将吸附于磁间隙中而不会滴落。
本申请通过在磁间隙中填充磁液，由于磁液具有液体的流动性，当音圈设于磁间隙中时，磁液可以将音圈伸入的部分包裹住。当音圈在振动过程中产生非运动方向上的振动时，磁液对音圈在非运动方向上的位移或者倾斜的具有限制作用，避免了音圈碰撞磁路组件。同时，由于磁液改善了音圈碰撞磁路组件的问题，因此本申请的扬声器的磁间隙可以设置更小，有利于整个扬声器的小型化。
一种可能的实现方式中，音圈的数量为多个，多个音圈沿扬声器的长度方向排列设置。
可以理解的是，本申请提供的扬声器在尺寸上可以根据产品器件的具体形态，通过增设音圈使得扬声器的尺寸更适配该产品，并在有限的器件空间中获得相当的性能。且，音圈绕线过长时的长宽比会导致其尺寸精度的下降，将一个音圈更改为多个水平排列的音圈壳体改善音圈的良率，节省成本。
一种可能的实现方式中，磁间隙沿扬声器的长度方向延伸，多个音圈间隔设于磁间隙中；或者，扬声器包括多个磁间隙，多个磁间隙沿扬声器的长度方向间隔设置，多个音圈一一对应的位于多个磁间隙中。通过将磁间隙沿扬声器的长度方向排布，以使扬声器在有限的宽度空间中获得相当的性能。
一种可能的实现方式中，振动组件还包括连接线路，连接线路设于第一振膜或第二振膜靠近音圈一侧的表面，连接线路电连接音圈。可以理解的是，通过在振动组件中设置连接线路，以实现音圈与扬声器外部电气元件间的电连接。
一种可能的实现方式中，连接线路为柔性电路板，相比传统扬声器通过音圈引出线路与电子设备的电路板进行电连接的方式，本申请通过设置柔性电路板电连接电子设备的电路板，提高了扬声器的电学稳定性。
一种可能的实现方式中，连接线路为导线。通过在第一振膜表面打印铜线来用作线路引出方案，代替柔性电路板，从而降低振动组件的振动质量，提升振动组件的振动性能。
一种可能的实现方式中，第一振膜和第二振膜相对磁路组件对称设置。
可以理解的是，当第一振膜和第二振膜相对磁路组件对称设置时，由于第一振膜和第二振膜由同一音圈驱动，因此第一振膜和第二振膜向扬声器外发出的声波等大且相位相反(即 相位差为180°)。也就是说，此时的扬声器为偶极子扬声器，可以形成偶极子声场。当扬声器发声时，两个相位相反的声音分别从第一振膜和第二振膜发出并传递到扬声器外部。根据偶极子原理，两个声波会在远场相互抵消，形成消音区域，实现远场消声，有效提高电子设备的远场私密性，改善了扬声器的漏音问题。
第二方面，提供了一种电子设备，包括外壳和上述的扬声器，扬声器收容于外壳内部。具有上述扬声器的电子设备在小型化的基础上响度更大。
一种可能的实现方式中，外壳包括安装空间和与安装空间连通的出声孔，扬声器安装于安装空间并将安装空间分隔形成第一腔和第二腔，第一腔与出声孔连通，扬声器的壳体还包括开孔，开孔设于壳体侧壁，开孔连通内腔和第二腔。
可以理解的是，开孔将扬声器内部的空气引出至第二腔，使得扬声器内部的空气体积增大，使得扬声器在同等空间条件下获得更大的振幅，获得更高的响度。
附图说明
为了更清楚地说明本申请实施例或背景技术中的技术方案，下面将对本申请实施例或背景技术中所需要使用的附图进行说明。
图1是本申请实施例提供的一种电子设备的结构示意图；
图2是图1所示电子设备的镜腿在一些实施例中的结构示意图；
图3是图2所示的镜腿在一些实施例中的结构示意图；
图4是图2所示的镜腿的分解结构示意图；
图5是图2所示的镜腿在A-A方向的剖面结构示意图；
图6是本申请提供的扬声器在一些实施例中的结构示意图；
图7是图6所示的扬声器的分解结构示意图；
图8是图6所示扬声器在B-B方向的剖面结构示意图；
图9是图6所示的扬声器的上盖板在一些实施例中的结构示意图；
图10是图6所示的扬声器的磁路组件在一些实施例中的结构示意图；
图11是图6所示的扬声器的振动组件在一些实施例中的结构示意图；
图12是图6所示扬声器在C-C方向的剖面结构示意图；
图13是图6所示扬声器在C-C方向的另一种实施方式的剖面结构示意图；
图14是图6所示扬声器在C-C方向的另一种实施方式的剖面结构示意图；
图15是图6所示的扬声器的另一种实施例的结构示意图；
图16A是图15所示扬声器在D-D方向上的剖面结构示意图；
图16B是图15所示扬声器的部分结构示意图；
图17是图15所示扬声器在E-E方向上的剖面结构示意图；
图18是图15所示扬声器振动组件的连接线路的一种实施例的结构示意图；
图19是图6所示扬声器在B-B方向上的另一种实施例的剖面结构示意图；
图20是图6所示的扬声器的另一种实施例的结构示意图；
图21是图20所示的扬声器的部分结构分解示意图；
图22是图20所示扬声器在F-F方向上的剖面结构示意图；
图23是图20所示的扬声器的磁路组件的结构示意图；
图24是图20所示的扬声器的第三连接件的结构示意图；
图25A是图6所示的扬声器实现远场消声的具体示意图；
图25B是图6所所示的扬声器发出的声波的示意图；
图26是本申请提供的另一种电子设备的结构示意图；
图27是图26所示电子设备在G-G方向上的剖面结构示意图；
图28是图20所示的扬声器的另一种实施例的结构示意图；
图29是图27所示电子设备的另一种实施例中的部分剖面结构放大示意图。
具体实施方式
下面结合本申请实施例中的附图对本申请实施例进行描述。
在本申请实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“连接”应做广义理解，例如，“连接”可以是可拆卸地连接，也可以是不可拆卸地连接；可以是直接连接，也可以通过中间媒介间接连接。其中，“固定连接”是指彼此连接且连接后的相对位置关系不变。“转动连接”是指彼此连接且连接后能够相对转动。“滑动连接”是指彼此连接且连接后能够相对滑动。本申请实施例中所提到的方位用语，例如，“上”、“下”、“左”、“右”、“内”、“外”等，仅是参考附图的方向，因此，使用的方位用语是为了更好、更清楚地说明及理解本申请实施例，而不是指示或暗指所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请实施例的限制。“多个”是指至少两个。
在本申请实施例中，术语“第一”、“第二”、“第三”、“第四”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”、“第三”、“第四”的特征可以明示或者隐含地包括一个或者更多个该特征。
在本申请实施例中，“和/或”，仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
在本说明书中描述的参考“一个实施例”或“一些实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。由此，在本说明书中的不同之处出现的语句“在一个实施例中”、“在一些实施例中”、“在其他一些实施例中”、“在另外一些实施例中”等不是必然都参考相同的实施例，而是意味着“一个或多个但不是所有的实施例”，除非是以其他方式另外特别强调。术语“包括”、“包含”、“具有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
可以理解的是，此处所描述的具体实施例仅仅用于解释相关实施例，而非对该实施例的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与实施例相关的部分。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互结合。
下面将参考附图并结合实施例来详细说明本申请。
请参阅图1，图1是本申请实施例提供的一种电子设备1000的结构示意图。
电子设备1000可以为点读笔、自拍杆、手环、手机、智能手表、增强现实(augmented reality，AR)眼镜、AR头盔或虚拟现实(virtual reality，VR)眼镜等需要利用扬声器输出音频的电子设备1000。本申请以电子设备1000是AR眼镜为例进行具体说明。
本实施例中，电子设备1000包括镜架10、显示器件20、扬声器30和电路板40。显示器件20、扬声器30和电路板40均安装于镜架10。显示器件20和扬声器30均电连接至电路板40，电路板40用于控制显示器件20显示及控制扬声器30发声。
镜架10包括镜框11以及与镜框11连接的镜腿12。其中，镜腿12有两个，两个镜腿12连接于镜框11的相对两端。需要说明的是，在其他实施例中，镜架10也可以包括镜框11和 与镜框11连接的固定带，本申请对此不作具体限定。
镜框11可以包括两个框体111及连接于两个框体111之间的横梁112。两个框体111内部均设有容纳腔，用以收容电子设备1000的电子元器件。横梁112与两个框体111一体成型，以简化镜框11的成型工艺，增加镜框11的整体强度。其中，镜框11的材料包括且不限于金属、塑料、树脂或天然材料等。应当理解的是，镜框11不仅限于图1所示的全框型镜框，也可以为半框型或无框型。
本实施例中，显示器件20的数量为两个，两个显示器件20的结构相同。具体的，两个显示器件20、分别安装于镜框11的两个框体111。电子设备1000穿戴于用户头部时，一个显示器件20对应于用户的左眼，另一个显示器件20对应于用户的右眼，此时用户的双眼可以通过两个显示器件20观看虚拟场景或者真实场景。需要说明的是，在其他实施例中，两个显示器件20的结构也可以不同，或者，两个显示器件20的数量也可以是一个或者多个，本申请对此不作具体限定。
本实施例中，显示器件20安装于框体111，并与电路板40电连接。本实施例中，电路板40可以安装于镜腿12内部电路板40的数量可以为两个，两个电路板40分别位于两个镜腿12中，并分别与其对应的显示器件20电连接。当然，在其他实施方式中，电路板40的数量还可以为一个，位于其中一个镜腿12中。
当然，在其他实施例中的一种实施场景中，电路板40还可以安装于框体111。或者安装于框体111的容纳腔。
两个镜腿12转动连接于镜框11的相对两端。具体的，两个镜腿12分别转动连接于镜框11的两个框体111。在电子设备1000处于展开状态(如图1所示)时，两个镜腿12通过相对镜框11转动至彼此相对，此时电子设备1000的两个镜腿12可分别架设于用户的两个耳朵上，横梁112架设于用户的鼻梁上，以穿戴于用户的头部。在电子设备1000处于折叠状态时，两个镜腿12通过相对镜框11转动，至彼此至少部分地重叠且收容于镜框11的内侧，此时电子设备1000可收纳起来。
需要说明的是，本申请提及电子设备1000时所采用的“内侧”、“外侧”等方位用词主要依据电子设备1000被用户佩戴于头部时的方位进行阐述。电子设备1000被用户佩戴时，以靠近用户头部为内侧，以远离用户头部为外侧，其并不形成电子设备1000与其他场景中的方位的限定。
可以理解的是，在其他实施例中，两个镜腿12可分别固定连接于两个框体111，或者，两个镜腿12可与镜框11一体成型，即电子设备1000始终处于展开状态，本申请对此不作具体限定。
可以理解的是，本实施例中的两个镜腿12结构相同，下文以其中一个镜腿12为例对镜腿12的结构进行介绍。当然，在其他实施例中，两个镜腿12的结构也可以不相同。
请参阅图2和图3，图2是图1所示电子设备1000的镜腿12在一些实施例中的结构示意图。图3是图2所示的镜腿12在一些实施例中的结构示意图。
镜腿12可以包括连接段121、中间段122及挂耳段123。连接段121、中间段122及挂耳段123依次连接。连接段121远离中间段122的一侧可以与对应的框体111转动连接，挂耳段123用于将镜腿12佩戴在用户耳朵上方。中间段122设有收容腔及连通收容腔的发声孔1223，扬声器30安装于收容腔内，扬声器30发出的声音可以通过发声孔1223传出至收容腔外部，被用户的耳朵接收。即，镜腿12相当于电子设备1000用于收容扬声器30的外壳。
本实施例中，如图2和图3，中间段122可以相对朝向下凸出，凸出部分靠近用户外耳 道，使得发声孔1223可以更靠近用户耳朵，扬声器30发出的声音通过发声孔1223传出后直接进入用户的外耳道，用户能够快速听到扬声器30发出的声音。当然，在其他实施例中，中间段122还可以不向下凸出。
请参阅图4和图5，图4是图2所示的镜腿12的分解结构示意图；图5是图2所示的镜腿12在A-A方向的部分剖面结构示意图。
在一些实施例中，中间段122可以包括承载体1221和盖板1222。承载体1221包括凹槽1224，盖板1222盖于凹槽1224的开口，以与凹槽1224共同围设形成收容腔1225。本实施例中，承载体1221和盖板1222共同围设形成收容腔1225。也就是说，收容腔1225由两个部件构成，以方便扬声器30及其他的部件安装于收容腔1225内。盖板1222可以可拆卸地连接于凹槽1224的开口，以便于对收容腔1225内的部件进行维修。当然，在其他一些实施例中，盖板1222也可以不可拆卸地固定于凹槽1224的开口。
承载体1221还可以包括限位槽1226和定位槽1227。限位槽1226设于凹槽1224的开口处，盖板1222安装于限位槽1226内。定位槽1227形成于凹槽1224的底壁，扬声器30安装于定位槽1226。可以理解的是，限位槽1227一方面用于安装盖板1222，另一方面还用于限位盖板1222，使得盖板1222更稳固地安装于限位槽1227。同样的，定位槽1226一方面用于安装扬声器30，另一方面还用于限位扬声器30，使得扬声器30更稳固地安装于定位槽1226。
可以理解的是，在其他实施例中，承载体1221还可以不包括限位槽和定位槽，盖板1222可以直接固定至凹槽1224的开口。扬声器30可以直接固定于收容腔1225的腔壁。
当扬声器30安装于定位槽1226时，扬声器30将收容腔1225分隔形成两个独立的通道。其中，位于扬声器30上方的通道为第一通道1228，位于扬声器30下方的通道为第二通道1229。发声孔1223包括第一发声孔13和第二发声孔14。第一发声孔13设于盖板1222并连通第一通道1228，第二发声孔14设置于承载体1221背向盖板1222的一侧，并连通第二通道1229。两个发声孔出声方向相反。当然，在其他实施例中，两个发声孔的出声方向还可以呈夹角。
本实施例中，第二发声孔14设置在中间段122靠近用户耳朵的一侧，更有利于扬声器30的声音输出到用户耳朵，提升电子设备1000的视听功能体验。
本实施例中，扬声器30的数量为两个，两个扬声器30分别设于与其对应的镜腿12的收容腔1225内。具体的，当用户佩戴电子设备1000时，收容腔1225可以位于用户耳朵前上方，当扬声器30发出声音时，用户耳朵能够更清晰直观地听到声音。当然，在其他实施例中，扬声器30还可以设于其他位置，例如，连接段121，挂耳段123，或者框体111等其他位置。
当用户佩戴AR眼镜时，虚拟现实画面可以通过显示器件20传输至用户双眼，扬声器30发出的声音能够经发声孔输至电子设备1000外部并被用户听见，以实现电子设备1000的视听功能。
可以理解的是，本实施例中，设于两个镜腿12的扬声器30结构相同。当然，其他实施例中，设于两个镜腿12的扬声器30的结构还可以不同。
电路板40集成了处理器、存储器以及其他各类电路器件。显示器件2020及扬声器30耦合处理器。处理器可以包括一个或多个处理单元，例如：处理器可以包括应用处理器(application processor，AP)，调制解调处理器，图形处理器(graphics processing unit，GPU)，图像信号处理器(image signal processor，ISP)，控制器，视频编解码器，数字信号处理器(digital signal processor，DSP)，基带处理器，和/或神经网络处理器(neural-network processing unit，NPU)等。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器中。
处理器可以根据指令操作码和时序信号，产生操作控制信号，完成提取指令和执行指令 的控制。
处理器中还可以设置内部存储器，用于存储指令和数据。在一些实施例中，处理器中的存储器可以为高速缓冲存储器。该存储器可以保存处理器用过或使用频率较高的指令或数据。如果处理器需要使用该指令或数据，可从该存储器中直接调用。避免了重复存取，减少了处理器的等待时间，因而提高了系统的效率。
在一些实施例中，处理器可以包括一个或多个接口。接口可以包括集成电路(inter-integrated circuit，I2C)接口，集成电路内置音频(inter-integrated circuit sound，I2S)接口，脉冲编码调制(pulse code modulation，PCM)接口，通用异步收发传输器(universal asynchronous receiver/transmitter，UART)接口，移动产业处理器接口(mobile industry processor interface，MIPI)，通用输入输出(general-purpose input/output，GPIO)接口，用户标识模块(subscriber identity module，SIM)接口，和/或通用串行总线(universal serial bus，USB)接口等。处理器可以通过以上至少一种接口连接触摸传感器、无线通信模块、显示器、摄像头等模块。
存储器可以用于存储计算机可执行程序代码，该可执行程序代码包括指令。存储器可以包括存储程序区和存储数据区。其中，存储程序区可存储操作系统，至少一个功能所需的应用程序(比如拍照功能，录像功能等)等。存储数据区可存储电子设备1000使用过程中所创建的数据(比如图像数据，视频数据等)等。此外，存储器可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件，闪存器件，通用闪存存储器(universal flash storage，UFS)等。
处理器通过运行存储在存储器的指令，和/或存储在设置于处理器中的存储器的指令，执行电子设备1000的各种功能方法或数据处理，例如，使显示器件20呈现虚拟现实画面，使扬声器30发出声音等。
可以理解的是，本实施例中安装于收容腔1225中的扬声器30具有多种不同的实施例，下文具体介绍扬声器30的一些实施例。
一种实施例中，请参阅图6、图7和图8，图6是本申请提供的扬声器30在一些实施例中的结构示意图。图7是图6所示的扬声器30的分解结构示意图。图8是图6所示扬声器30在B-B方向的剖面结构示意图。其中，如图8，扬声器30的宽度方向为X轴方向，扬声器30的长度方向为Y轴方向，扬声器30的厚度方向为Z轴方向。
扬声器30可以包括壳体31、振动组件32和磁路组件33。壳体31具有一内腔311，磁路组件33设于内腔311。所述磁路组件33具有磁间隙333，振动组件32包括第一振膜321、第二振膜322和音圈323，第一振膜321和第二振膜322分别位于磁路组件33相背的两侧，也可以理解为，第二振膜322、磁路组件33和第一振膜321在扬声器30的Z轴方向依次层叠设置。第一振膜321和第二振膜322的周缘连接于壳体31，音圈323位于所述磁间隙333内，且音圈232相背的两侧分别连接第一振膜321和第二振膜322。
需要说明的是，第一振膜321(或第二振膜322)的周缘可以全部与壳体31连接，也可以部分与壳体31连接。
可以理解的是，当音圈323通电时，受磁场力的作用，音圈323产生平行于第一方向的洛伦兹力并沿该方向作切割磁感线的运动，且推动第一振膜321和第二振膜322一起沿该方向做往返运动。其中，第一方向为垂直于第一振膜321和第二振膜322的方向。也就是说，当音圈323通电时，音圈323、第一振膜321和第二振膜322作为一个整体一起同向运动，且第一振膜321和第二振膜322均发声。
可以理解的是，扬声器在加工和组装过程中存在一定的偏差，因此，振膜在运动过程中 会发生一定的左右偏转或者倾斜等现象(即出现偏振现象)。且，这种偏振现象会随着振膜振幅的增大而愈加明显。当振膜在运动过程中出现偏振现象时，有可能会触碰到磁路组件，发生擦碰并发出一定杂音。杂音的产生会使振膜在实际工作时达不到预期的振幅设定值，影响扬声器发声的响度。
而本实施例中的扬声器30，将两个振膜(即第一振膜321和第二振膜322)分别设于磁路组件33的两侧，音圈323设于磁路组件33的磁间隙333且两侧分别连接第一振膜321和第二振膜322。通过将音圈和两个振膜结合的音圈-双振膜设计，使得第一振膜321、第二振膜322和音圈323在运动过程中具有一致性，保证了振动组件32上下振动刚度的对称性，提升了整个振动组件32的振动稳定性，能更有效地改善偏振现象，提升振动组件32在大振幅条件下的振动平衡性，避免碰到磁路组件而产生杂音，使得扬声器在实际工作中能够达到预期的振幅设定值。由于扬声器30的响度由振动面积和振幅决定，也就是说，在同等有效辐射面积的条件下，音圈-双振膜设计的扬声器30可以在小型化的基础上达到更大的振幅，获得更高的响度，使得应用于手环、点读笔等小型电子设备中的扬声器的响度不受空间约束，提高用户体验。
同时，由于音圈-双振膜设计提升了振动组件32的振动的稳定性，从而本申请的扬声器可以达到更大的振幅设定值，获得更高的响度。
另外，本申请第一振膜321和第二振膜322分别位于磁路组件33相背的两侧，相比于将振膜设于磁路组件的外围，能有效提高扬声器的振动面积，提高扬声器在有限空间内的利用率，获得更高的响度。
在一些实施例中，如图6和图7所示，壳体31为大致呈长方形的柱体。壳体31包括框体312、上盖板313和下盖板314。框体312为两侧开口的中空结构。其中，框体312的两个开口分别为第一开口3122和第二开口3123，第一振膜321覆盖于框体312的第一开口3122，上盖板313将第一振膜321固定于框体312。第二振膜322覆盖于框体312的第二开口3123，下盖板314将第二振膜322固定于框体312。也就是说，第一振膜321和第二振膜322分别覆盖于框体312的相背的两侧，以密封内腔311。
可以理解的是，壳体31由三个部分组成(即框体312、上盖板313和下盖板314)，以便将第一振膜321和第二振膜322固定于框体312上，方便扬声器30的组装。在其他实施例中，壳体31的形状还可以为圆柱体、方形柱体或者异形体等。
本实施例中，如图8所示，框体312还可以包括第一卡槽3123和第二卡槽3124，第一卡槽3123和第二卡槽3124分别设置在框体312内部沿长度方向上相对的两侧壁上。磁路组件33固定于框体312内部，磁路组件33可以通过第一卡槽3123和第二卡槽3124限位在框体312内部，以使磁路组件33稳定的固定于框体312。
当然，在其他实施例中，框体312还可以不包括第一卡槽和第二卡槽，磁路组件33还可以通过粘接，螺栓固定等连接方式固定于框体312上，本申请不对磁路组件33与框体312的连接方式做限定。或者，框体312还可以包括除第一卡槽和第二卡槽以外的其他限位结构限位磁路组件33固定于框体312。
在其他实施例的一种实施场景中，框体312的材料还可以为导热材料。可以理解的是，扬声器30的内腔为密封的空间，由于音圈323运动时会发出热量，使得扬声器30的内腔压强发生变化，影响工作性能，通过使用导热材料来制作框体312，可以有效平衡扬声器30内部的压强，减小压强变化对扬声器30工作性能的影响。
可以理解的是，现有的扬声器中，由于扬声器内部压强会随着振膜的运动而改变，因此 需要在壳体上打孔，用以泄压，平衡内外气压。但壳体的开孔设计，会使得扬声器内部容易引入杂质、水汽和汗液等，从而引起磁路组件中磁铁的腐蚀，导致扬声器性能失效。因此，部分扬声器会通过在内部增设防尘网等器件来防止杂质或水汽的进入，导致扬声器的制作成本上升。
而本实施例中的扬声器30，由于采用的音圈-双振膜设计，两个振膜(即第一振膜321和第二振膜322)由同一音圈323连接并进行同向运动，因此扬声器30内部不会因为振膜的运动而产生气压变化。且，由于音圈323发热导致的压强变化实际较小，因此仅通过使用导热材料制作框体312即可满足扬声器30的内部的泄压需求，避免了在壳体31上开孔而导致杂质和水汽的进入，在提升扬声器30本身防尘能力的同时，有效节省了防护成本。
当然，在其他实施例的另一种实施场景中，框体312的材料还可以不为导热材料，还可以用导热凝胶等导热材料涂覆在框体312表面形成导热涂层来将扬声器内部的热量导出，对扬声器的内部进行泄压。
在其他实施例的又一种实施场景中，框体312还可以通过仅开微孔对扬声器30内部气压进行疏导，由于微孔孔径很小，对防尘影响较低，能够同时满足防尘和散热需求。一些实施方式中，微孔的孔壁可以是平直的。另一些实施例中，微孔的孔壁还可以是弯曲的，更够有效阻挡杂质、水汽等进入到扬声器的内腔中。
本实施例中，上盖板313与下盖板314的结构相同，下文以上盖板313为例进行具体说明。
请一并参阅图8和图9，图9是图6所示扬声器30的上盖板313在一些实施例中的结构示意图。
本实施例中，上盖板313可以包括中间部分和围设于中间部分外周的边缘部分。边缘部分固定于第一振膜321背向框体312的一侧，以将第一振膜321固定至框体312。中间部分为镂空结构3131，用以避让第一振膜321，便于第一振膜321振动。
本实施例中，上盖板313还可以包括避让槽3132，避让槽3132设于边缘部分朝向第一振膜321的表面，且与镂空结构3131连通。避让槽3132用于避让第一振膜321，便于第一振膜321振动。
在其他实施例的一种实施场景中，上盖板313还可以不包括避让槽，边缘部分的宽度还可以做的足够窄以避免妨碍第一振膜的振动。
在其他实施例的一种实施场景中，壳体31还可以仅包括框体312，也就是说，壳体31可以不包括上盖板和下盖板，第一振膜321和第二振膜322可以分别通过粘接直接固定于框体312。
可以理解的是，第二振膜322与下盖板314的连接方式与第一振膜321与上盖板313的连接方式相同，此处不再赘述。
请参阅图10，图10是图6所示的扬声器30的磁路组件33在一些实施例中的结构示意图。
磁路组件33可以包括上夹板331、磁钢332和下夹板334。本实施例中，上夹板331固定于磁钢332的一侧，下夹板334固定于磁钢332背向上夹板331的一侧，也就是说，上夹板331和下夹板334分别设于磁钢332相背的两侧。上夹板331和下夹板334可以分别通过粘接的方式固定于磁钢332相背的两侧。
其中，上夹板331包括间隔设置的第一上夹板3311第二上夹板3312，磁钢332包括间隔设置的第一子磁钢3321和第二子磁钢3322，下夹板334包括间隔设置的第一下夹板3341 和第二下夹板3342，第一上夹板3311和第一下夹板3341分别固定于第一子磁钢3321相背的两侧，第二上夹板3312和第二下夹板3342分别固定于第二子磁钢3322相背的两侧。
可以理解的是，上夹板331的第一上夹板3311、磁钢332的第一子磁钢3321和下夹板334的第一下夹板3341共同形成磁路组件33的第一部分。上夹板331的第二上夹板3312、磁钢332的第二子磁钢3322和下夹板334的第二下夹板3342共同形成磁路组件33的第二部分。第一部分和第二部分均安装于框体312内部，且第一部分和第二部分相对间隔设置，第一部分和第二部分之间形成磁间隙333。
其中，第一部分和第二部分均具有磁性，且第一部分和第二部分相对的两个表面磁性相反。也就是，第一子磁钢3321和第二子磁钢3322相对的两个面的磁性相反。示例的，第一子磁钢3321靠近第一上夹板3311的部分为N极，第一子磁钢3321靠近第一下夹板3341的部分为S极，对应的，第二子磁钢3322靠近第二上夹板3312的部分为S极，第二子磁钢3322靠近第二下夹板3342的部分为N极。当然，第一子磁钢3321靠近第一上夹板3311的部分也可以为S极，第一子磁钢3321靠近第一下夹板3341的部分也可以为N极，对应的，第二子磁钢3322靠近第二上夹板3312的部分为N极，第二子磁钢3322靠近第二下夹板3342的部分为S极。
其中，第一部分可以通过粘接的方式安装于框体312的第一卡槽3123内，第二部分可以通过粘接的方式安装于框体312的第二卡槽3124内。可以理解的是，第一卡槽3123和第二卡槽3124主要对第一部分和第二部分起限位作用。
可以理解的是，本实施例中的磁路组件33有两个磁路(即第一部分和第二部分)，磁路组件33和音圈323形成了水平方向上磁路+音圈+磁路的双磁路结构。相较于现有的扬声器中的三磁路或五磁路结构，本实施例中的扬声器30在宽度方向上通过简化磁路系统压缩了宽度方向上的尺寸，从而可以适配宽度较窄的产品形态。
在一些实施方式中，上夹板331和下夹板334的材料还可以为导磁材料，以增强磁钢的整体磁场强度，使得同等磁场强度条件下的磁钢332的尺寸可以更小，有利于整个扬声器30的小型化。
当然，在其他实施例中，第一子磁钢3321与第一上夹板3311和第一下夹板3342之间的连接方式还可以是除粘接以外的其他连接的方式。或者，上夹板331和下夹板334的材料还可以不为导磁材料。本申请不对上述磁钢332、上夹板331和下夹板334的连接方式及材料做限定。
在其他实施例的一种实施场景中，磁路组件33还可以仅包括磁钢，不包括上夹板和下夹板。或者，磁路组件还可以包括磁钢332且包括上夹板331或下夹板334中的一者。
请一并参阅图11和图12，图11是图6所示扬声器30的振动组件32在一些实施例中的结构示意图。图12是图6所示扬声器30在C-C方向的剖面结构示意图。
本实施例中，音圈323可以包括相背设置的第一侧部3231和第二侧部3232，可以理解的是，当音圈323通电时，电流环绕的通过第一侧部3231、第二侧部3232、第一侧部3231、第二侧部3232…。第一侧部3231和第二侧部3232均与音圈323的中心轴平行，第一侧部3231连接第一振膜321，第二侧部3232连接第二振膜322。也就是说，音圈323相对第一振膜321和第二振膜322垂直设置，从而音圈323在扬声器30的宽度方向上的尺寸更小，有利于扬声器在宽度上的小型化，更加适配长条形的产品，例如，当本实施例中的扬声器应用于现有的较为粗大的点读笔时，可以有效减少点读笔的宽度，使得点读笔的大小更趋近于常规签字笔的大小。
本实施例中，振动组件32的音圈323数量可以为两个。磁间隙333沿扬声器30的长度方向延伸，两个音圈323沿扬声器30的长度方向水平间隔排列设置于磁间隙333中，且两个音圈323的形状完全相同。其中，扬声器的长度方向为图12的Y轴方向。两个音圈323的第一侧部3231均连接第一振膜321，两个音圈323的第二侧部3232均连接第二振膜322。也就是说，两个音圈323、第一振膜321和第二振膜322形成一个振动整体。当音圈323通电时，两个音圈323均受到同一方向上的洛伦兹力，并均推动第一振膜321和第二振膜322做往返运动。
可以理解的是，水平排列的双音圈设计可以充分利用扬声器30长度方向上的空间。且相同长度方向空间的条件下，只设置一个音圈323时，由于音圈323在绕线时过长的长宽比会导致其尺寸精度的下降，会使得音圈323在振动过程中受力不平衡，产生偏振现象。而双音圈设计可以结合扬声器30的实际长度设计长宽比更为合适的多个音圈323组成振动整体，提高振动组件32在振动过程中的稳定性，改善音圈323的良率。
当然，在其他实施例中，振动组件32的音圈323数量还可以为一个或者多个，多个音圈323间隔与磁间隙333中，多个音圈323的形状可以完全相同也可以不同。本申请不对音圈323的具体数量和形状做限定。
本实施例中，如图11，第一振膜321和第二振膜322的边缘还可以包括折环部，折环部采用半圆弧设计，用于提升振动方向的位移，实际使用中，可以使用其他提升位移的有效手段，例如折环部采用椭圆形设计，或者第一振膜321/第二振膜322采用高弹性模量的材料等。当然，在其他实施例中，第一振膜321或第二振膜322还可以不包括折环部。本申请不对第一振膜321和第二振膜322的形状进行限制。
本实施例中，如图12，振动组件32还可以包括球顶324，球顶324的数量可以为两个，两个球顶324分别覆盖于第一振膜321和第二振膜322靠近音圈323一侧的表面，以增加第一振膜321和第二振膜322的刚度，可以理解的是，球顶324为振动组件32的附加件。当然，两个球顶324还可以分别覆盖于第一振膜321和第二振膜322远离音圈323一侧的表面。
在其他实施例中，球顶324还可以仅覆盖于第一振膜321或第二振膜321中的一者的表面以增加刚度，例如，覆盖于第一振膜321靠近或远离音圈323一侧的表面。
请参阅图13，图13是图6所示扬声器30在C-C方向的另一种实施方式的剖面结构示意图。
本实施例的结构与图12所示的实施例的结构大致相同，相同部分不再赘述，不同的是，本实施例中，振动组件32还可以包括第一连接件325和第二连接件326。第一连接件325和第二连接件326形状相同，且材料可以为硬质材料，如塑料，金属等。第一连接件325的一侧连接第一振膜321，第一连接件325远离第一振膜321的另一侧连接两个音圈323的第一侧部3231。第二连接件326的一侧连接第二振膜322，第二连接件326远离第二振膜322的另一侧连接音圈323的第二侧部3232。也就是说，两个音圈323通过第一连接件325和第二连接件326分别与第一振膜321和第二振膜322连接，以使音圈323位于磁间隙的最佳受力位置，保证音圈323受力最佳。
同时，两个音圈323通过第一连接件325和第二连接件326分别与第一振膜321和第二振膜322连接，形成一个振动整体，避免两个音圈323一起运动时，由于制程上的误差导致两个音圈323的运动不能完全一致，使得振膜左右受力不平衡，影响振动组件32的振动平稳性。且，第一连接件325和第二连接件326分别连接两个音圈323和对应的振膜，增加了音圈323与振膜之间的刚度，提升了振动组件32的振动稳定性。
另外，在音圈323的两侧均设置连接件(第一连接件325或第二连接件326)，保证了振动组件32相对音圈323两侧的结构对称性，以使振动组件32上下振动刚度的对称，进一步提升了振动组件32的振动稳定性。
当然，在其他实施例中，振动组件32还可以仅设置一个连接件，一个连接件连接在音圈和第一振膜之间，或者一个连接件连接在音圈和第二振膜之间。本申请不对连接件的具体数量和形状做限定。在其他实施例的另一种实施场景中，第一连接件325和第二连接件326的形状还可以不相同。
请参阅图14，图14是图6示扬声器30在C-C方向的另一种实施方式的剖面结构示意图。
本实施例的结构与图13所示的实施例的结构大致相同，相同部分不再赘述，不同的是，本实施例中，振动组件32还可以包括支撑件327。支撑件327的数量可以为两个，两个支撑件327分别设于振动组件32的两个音圈323内部，且一端连接第一侧部3231，另一端连接第二侧部3232，以支撑在音圈323的第一侧部3231和第二侧部3232之间。当然，在其他实施例中，支撑件的数量可以为一个也可以为多个，或者一个音圈内还可以设置多个支撑件。
可以理解的是，由于音圈323是中空结构，当音圈323通电后随着洛伦兹力作切割磁感线的运动并推动第一振膜321和第二振膜322振动时，音圈323在振动方向(第一方向)容易产生形变，影响振动组件32的振动稳定性，降低振动组件32的工作性能。本实施例中，通过在音圈323内部设置支撑件327，从而提升音圈323自身的刚度，改善音圈323在振动过程中在第一方向上的形变现象，从而降低振动过程中因形变带来的性能损耗，提升扬声器30的工作效率。
在其他实施例的一种实施场景中，音圈323还可以环绕支撑件327绕制，以增强音圈323自身的刚度，改善变形。支撑件327的材料可以为硬质材料，如金属，液晶高分子(Liquid Crystal Polymer，LPC)等材料，本申请不对支撑件327的材料以及支撑件327与音圈323的连接方式做限定。
请一并参阅图15、图16A和图17，图15是图6所示的扬声器30的另一种实施例的结构示意图。图16A是图15所示扬声器30在D-D方向上的剖面结构示意图。图17是图15所示扬声器30在E-E方向上的剖面结构示意图。
本实施例的结构与图14所示的实施例的结构大致相同，相同部分不再赘述，不同的是，本实施例中，框体312还可以包括第一盆架3126和第二盆架3127，第一盆架3126和第二盆架3127均为两侧开口的中空结构。第一盆架3126和第二盆架3127层叠连接形成框体312。
在一些实施方式中，第一盆架3126两侧的开口均为第一开口3122，第二盆架3127两侧的开口均为第二开口3123，当第一盆架3126与第二盆架3127层叠连接时，第一盆架3126的其中一个第一开口3122与第二盆架3127的其中一个第二开口3123对接，以使第一盆架3126和第二盆架3127围设的空间连通。
第一振膜321覆盖于第一盆架3126背向第二盆架3127的第一开口3122，上盖板313将第一振膜321固定于第一盆架3126，第二振膜322覆盖于第二盆架3127背向第一盆架3126的第二开口3123，下盖板314将第二振膜322固定于第二盆架3127。本实施例中，上述部件之间均通过粘接的方式固定。当然，在其他实施例中，上述部件还可以通过卡接、焊接、螺栓固定等其他连接方式进行连接。
可以理解的是，本申请的扬声器30通过设置第一盆架3126和第二盆架3127，并将二者连接形成框体312，便于磁路组件33及其他扬声器30内部部件的组装。
本实施例中，如图16A，第一盆架3126还可以包括第一限位块60，第一限位块60设于 第一盆架3126的内壁，第二盆架3127还可以包括第二限位块70，第二限位块70设于第二盆架3127内壁并与第一限位块60相对设置。磁路组件33固定于框体312内部，示例的，磁路组件33可以通过第一限位块60和第二限位块70限位在框体312内部，以使磁路组件33稳定的固定于框体312。
当然，在其他实施例中，第一盆架3126还可以不包括第一限位块，第二盆架3127还可以不包括第二限位块，磁路组件33还可以通过粘接，螺栓固定等连接方式固定于框体312上，本申请不对磁路组件33与框体312的连接方式做限定。或者，框体312还可以包括除第一限位块和第二限位块以外的其他限位结构限位磁路组件33固定于框体312。
本实施例中，如图15，第一盆架3126上还设有延伸段3128。本实施例中，延伸段3128有两个，两个延伸段3128间隔设置在第一盆架3126的一侧。两个延伸段3128用于承载扬声器30的其他部件。当然，在其他实施例中，延伸段3128的数量还可以为一个或多个。或者，第一盆架3126上也可以不设置延伸段。
如图16A和图16B，振动组件32还包括连接线路。本实施例中，连接线路为柔性电路板(Flexible Printed Circuit，FPC)41。柔性电路板41为环状结构，柔性电路板41包括内侧和外侧，内侧电连接音圈323，部分外侧通过粘接的方式固定于第一盆架3126和第二盆架3127的连接处。也就是说，柔性电路板41夹设于第一盆架3126和第二盆架3127之间，便于柔性电路板41的组装。相比传统扬声器通过音圈引出线路与电子设备的电路板进行电连接的方式，本申请通过设置柔性电路板41电连接电子设备1000的电路板40，提高了扬声器30的电学稳定性。
柔性电路板41还包括两个伸长段42，两个伸长段42覆盖于第一盆架3126两个延伸段3128面向第二盆架3127一侧的表面，两个伸长段42用于和电子设备1000的电路板40进行电连接。请参阅图18，图18是图15所示扬声器30振动组件32的连接线路的一种实施例的结构示意图。
本实施例中，连接线路还可以为导线。在一些实施例中，通过在第一振膜321表面打印铜线43来用作线路引出方案，代替柔性电路板，从而降低振动组件32的振动质量，提升振动组件32的振动性能。当然，在其他实施例的另一种实施场景中，还可以通过在第一振膜321上蚀刻线路用作线路引出的方案，或者，连接线路设置在第二振膜322上，本申请不对线路引出方案做限定。
请参阅图19，图19是图6所示扬声器30在B-B方向上的另一种实施例的剖面结构示意图。
本实施例中的扬声器30与图6所示扬声器30大致相同，相同部分不再赘述。不同的是，本实施例中的磁路组件33的磁间隙333中还可以设有磁液335。具体的，磁液335为一种既具有液体流动性又具有固体磁性材料磁性的一种功能材料。当磁液335处于静态时无磁性吸引力。当外加磁场作用时，磁液335表现出磁性。因此，将磁液335填充于磁间隙333中时，由于磁钢332产生了磁场，因此磁液335将吸附于磁间隙333中而不会滴落。
在振动组件32的振动过程中，当音圈323通电后并在洛伦兹力的作用下沿垂直于第一振膜321的方向(即第一方向)做切割磁感线的运动时，音圈323还会产生非第一方向上的振动，并产生非第一方向上的位移或者倾斜，可能出现音圈323在振动过程中碰撞磁钢332的现象。
而本实施例中，通过在磁间隙333处填充磁液335，由于磁液335具有液体的流动性，当音圈323设于磁间隙333中时，磁液335可以将音圈323伸入的部分包裹住。当音圈323 在振动过程中产生非第一方向上的振动时，磁液335对音圈323在非第一方向上的位移或者倾斜的具有限制作用，减小音圈323在非第一方向上的位移或者倾斜，且由于磁液335的流动性，磁液335对音圈323的限制不会影响音圈323的运动，使得音圈323在振动过程中振动更加平稳，避免碰撞磁钢332，加强了振动组件32的振动稳定性。
另一方面，现有的扬声器设计为了避免出现音圈碰撞磁钢的现象，磁间隙会设计得足够宽，不利于整个扬声器的小型化。而本实施例通过在磁间隙333中填充磁液335来改善碰撞的问题，因此在扬声器30的设计方面，可以进一步缩小磁间隙333的宽度，提升磁场的强度，提高扬声器30的工作效率。同时，磁间隙333缩小，提高了扬声器30整体的集成度，有利于整个扬声器30的小型化。
请一并参阅图20、图21和图22，图20是图6所示的扬声器30的另一种实施例的结构示意图。图21是图20所示的扬声器30的部分结构分解示意图。图22是图20所示扬声器30在F-F方向上的剖面结构示意图。
本实施例中，扬声器30可以包括壳体31、振动组件32和磁路组件33。壳体31为两侧开口的中空结构且具有一内腔311，磁路组件33设于内腔311。所述磁路组件33具有磁间隙333，振动组件32可以包括第一振膜321、第二振膜322和音圈323，第一振膜321的边缘连接于壳体31一侧的开口，第二振膜322的边缘连接于壳体31背向第一振膜321另一侧的开口。第一振膜321和第二振膜322的边缘均通过粘接的方式固定于壳体31，以密封内腔311。音圈323位于所述磁间隙333内，其两侧分别连接第一振膜321和第二振膜322。
当音圈323通电时，受磁场力的作用，音圈323产生第一方向上的洛伦兹力并沿该方向作切割磁感线的运动，且推动第一振膜321和第二振膜322一起沿该方向做往返运动。也就是说，当音圈323通电时，音圈323、第一振膜321和第二振膜322作为一个整体一起同向运动。
本实施例中，振动组件32包括两个音圈323，两个音圈323分别水平排列间隔设置在磁路组件33的磁间隙333中。音圈323包括背向设置的第一端面3234和第二端面3235，第一端面3234和第二端面3235均与音圈323的中心轴垂直，即音圈323缠绕的平面与第一端面3234和第二端面3235平行。两个音圈323的第一端面3234均连接第一振膜321，两个音圈323的第二端面3235均连接第二振膜322。也就是说，两个音圈323均平行于第一振膜321设置。
第一端面3234位于磁间隙333中，第二端面3235位于磁间隙333外部，以便于第二端面3235连接第二振膜322。
可以理解的是，本实施例中的扬声器30由于将音圈323平行于第一振膜321设置，使得扬声器30能够充分利用水平方向的空间，降低扬声器30的厚度，使得能够适配于如手机、平板等机身超薄设计的电子设备。
在其他实施例的一种实施场景中，壳体31还可以包括上盖板和下盖板。第一振膜321覆盖于壳体31一侧的开口，上盖板将第一振膜321固定于壳体31。第二振膜322覆盖于壳体31远离第一振膜321一侧的开口，下盖板将第二振膜322固定于壳体31。本申请不对第一振膜321、第二振膜322与壳体31的连接方式做限定。
请一并参阅图21和图23，图23是图20所示的扬声器30的磁路组件33的结构示意图。
本实施例中，磁路组件33可以包括第一磁路组件34、第二磁路组件35和连接板36。第一磁路组件34和第二磁路组件35固定于连接板36，连接板36固定于壳体31内部，第一磁路组件34和第二磁路组件35沿扬声器30的长度方向水平间隔排列设置于内腔311。第一磁 路组件34和第二磁路组件35分别通过粘接的方式固定于连接板36上。可以理解的是，第一磁路组件34和第二磁路组件35通过连接板36间接固定于壳体31内部。
在一些实施例中，连接板36可以通过粘接的方式固定于壳体31内部，当然，在其他实施例中，连接板36还可以通过镶嵌、螺接、卡接、焊接等连接方式固定于壳体31内部。在另一些实施例中，第一磁路组件34和第二磁路组件35还可以通过粘接、卡接、螺接等连接方式固定于连接板36上，本申请不对连接板36与壳体31及第一磁路组件34、第二磁路组件35与连接板的连接方式做限定。
本实施例中，磁路组件33还包括避让孔361。本实施例中，避让孔361可以设于连接板36，示例的，避让孔361设于连接板36并贯通连接板36两侧的表面。避让孔361包括中间避让孔362和位于中间避让孔362左右两侧的两个边缘避让孔363。在一些实施例中，中间避让孔362设于连接板36对应两个音圈323的间隔处，即中间避让孔362的中心位于两个音圈323间隔处的中心。也就是说，中间避让孔362位于两个音圈323间隔处的上方。两个边缘避让孔363分别位于第一磁路组件34远离第二磁路组件35的一侧及第二磁路组件35远离第一磁路组件34的一侧。
本实施例中，第一磁路组件34和第二磁路组件35的结构相同，下文以第一磁路组件34为例进行具体说明。
第一磁路组件34包括第一导磁板341和第一磁钢342。第一导磁板341连接于第一磁钢342一侧的表面，第一磁钢342远离第一导磁板341的另一侧表面固定于连接板36。也就是说，第一磁钢342夹设于第一导磁板341和连接板36之间。在一些实施例中，第一磁钢342可以通过粘接、卡接、螺接等连接方式固定于连接板36上，第一导磁板341可以通过粘接、卡接、螺接等连接方式固定于第一磁钢342，本申请不对上述部件之间的连接方式做限定。
在一些实施例中，第一导磁板341的材料还可以为导磁材料，以增强第一磁路组件34的整体磁场强度，使得同等磁场强度条件下的第一磁钢342的尺寸可以更小，有利于整个扬声器30的小型化。当然，在其他实施例中，第一磁路组件34还可以不包括第一导磁板。
本实施例中，第一磁钢342可以包括中心磁钢3314和设于中心磁钢3314两侧的边缘磁钢3315。中心磁钢3314和两个边缘磁钢3315分别间隔设置形成第一磁间隙3331，第一磁间隙3331与对应的中间避让孔362和边缘避让孔363连通。振动组件32的其中一个音圈323设于第一磁间隙3331，使得音圈323在通电后实现第一方向上的切割磁感线运动。本申请不对第一磁钢342的具体结构和形状做限制。
第一导磁板341包括中间导磁板342和设于中间导磁板342两侧的边缘导磁板343。中间导磁板342固定于中心磁钢3314背向连接板36的表面，两个边缘导磁板343分别固定于两个边缘磁钢3315背向连接板36一侧的表面。
在一些实施方式的一种实施场景中，为了进一步加强磁场的强度，提高扬声器30的工作效率，连接板36的材料也可以为导磁材料，也就是说，第一磁钢342夹设于两个导磁材料之间，两个导磁材料共同作用于第一磁钢342，使得第一磁钢342的磁场强度增大，同等磁场强度条件下的第一磁钢342的尺寸可以做得更小，有利于整个扬声器30的小型化。
如图23，第二磁路组件35还可以包括第二磁钢351和第二导磁板352。可以理解的是，第二磁钢351和第二导磁板352的结构及与连接板36的组装方式分别与第一磁钢342和第一导磁板341的结构及与连接板36的组装方式相同，不再赘述。第二磁钢351设有第二磁间隙3332，第二磁间隙3332与对应的中间避让孔362和边缘避让孔363连通。振动组件32的另一音圈323设于第二磁间隙3332中，使得该音圈323在通电后实现第一方向上的切割磁感线 运动。
在其他实施例的另一种实施场景中，磁路组件33的第一磁间隙3331和第二磁间隙3332中还可以填充有磁液335。或者，第一磁间隙3331和第二磁间隙3332还可以二者之一填充有磁液335。
在其他实施例的另一种实施场景中，音圈的数量还可以为多个，对应的，磁间隙的数量也为多个，多个磁间隙沿扬声器的长度方向间隔设置，多个音圈一一对应的位于多个磁间隙中。
请一并参阅图21、图22和图24，图24是图20所示的扬声器30的第三连接件37的结构示意图。
振动组件32还可以包括第三连接件37。本实施例中，第三连接件37的数量为两个，两个第三连接件37分别对应设于第一振膜321与两个音圈323之间。也就是说，其中一个第三连接件37设于其中一个音圈323与第一振膜321之间，另一个第三连接件37设于另一个音圈323与第一振膜321之间。第三连接件37一端连接第一振膜321，另一端延伸至磁间隙333并连接第一端面3234。第三连接件37包括贴合部371和延伸部372。本实施例中，贴合部371包括安装侧，延伸部372的数量为两个，两个延伸部372连接于安装侧的相对两端。本实施例中，贴合部371和两个延伸部372为一体成型结构，以保证第三连接件37的强度。
当然，在其他实施例中，贴合部371和两个延伸部372还可以通过连接固定。延伸部372的数量还可以为一个或多个。
示例的，其中一个第三连接件37的贴合部371连接第一振膜321，两个延伸部372分别对应穿过边缘避让孔363和中间避让孔362，并连接至音圈323的第一端面3234的两端。另一个第三连接件37与第一振膜321及另一个音圈323的连接方式与上述连接方式相同，不再赘述。也就是说，音圈323、第三连接件37、第一振膜321和第二振膜322共同组成了一个振动整体。当音圈323通电并作切割磁感线运动时，一方面推动第二振膜322做往返运动，另一方面通过推动第三连接件37进而推动第一振膜321与第二振膜322做同向的往返运动。
通过在音圈323与第一振膜321之间设置第三连接件37，及在磁路组件33的连接板36上设置与第三连接件37配合的避让孔，以使音圈323能够通过第三连接件37贯穿磁路组件33与第一振膜321连接，以实现音圈323连接在第一振膜321和第二振膜322之间，使得第一振膜321、第二振膜322和音圈323形成音圈-双振膜结构，并在运动过程中具有一致性，保证了振动组件32上下振动刚度的对称性，提升了整个振动组件32的振动稳定性，能更有效地改善偏振现象，提升振动组件32在大振幅条件下的振动平衡性，避免碰到磁路组件而产生杂音，使得扬声器在实际工作中能够达到预期的振幅设定值。由于扬声器30的响度由振动面积和振幅决定，也就是说，在同等有效辐射面积的条件下，音圈-双振膜设计的扬声器30可以在小型化的基础上达到更大的振幅，获得更高的响度，使得应用于手环、点读笔等小型电子设备中的扬声器的响度不受空间约束，提高用户体验。
同时，由于音圈-双振膜设计提升了振动组件32的振动的稳定性，从而本申请的扬声器30可以达到更大的振幅设定值，获得更高的响度。
且，本实施例中的延伸部372为两个，两个延伸部372分别连接至音圈323的第一端面3234的两端，使得音圈323与第三连接件37之间连接更稳固，提高振动组件32的振动稳定性。
本实施例中，第三连接件37的贴合部371为中空环状结构，该结构与音圈323的第二端面3235的结构相同，从而贴合部371与第一振膜321的贴合面积和第二端面3235与第二振 膜322的贴合面积相同，从而第三连接件37和音圈323构成的整体与第一振膜321和第二振膜322的贴合面积均相同，即该整体两侧的连接刚度相同，提高了振动组件32中的振动稳定性。
第三连接件37的两个延伸部372与其接触的音圈323部分的形状相同，以增加延伸部372与音圈323的连接面积，保证延伸部372与音圈323连接稳固。举例来说，当音圈323两端为圆弧状，延伸部372也对应为圆弧状。
当然，在其他实施例中，第三连接件37的数量还可以为一个或者多个，贴合部371和延伸部372的形状也可以为其他样式，本申请不对第三连接件37的数量及样式做限定。
请一并参阅图5和图25A，图25A是图6所示的扬声器30实现远场消声的具体示意图。
本实施例中，第一振膜321和第二振膜322还可以相对磁路组件33对称设置。由于第一振膜321和第二振膜322由同一音圈323驱动，且相对磁路组件33对称设置，因此第一振膜321和第二振膜322发出的声波等大且相位相反(即相位差为180°)。也就是说，此时的扬声器30为偶极子扬声器，可以形成偶极子声场。
当扬声器30发声时，两个相位相反的声音分别从第一振膜321和第二振膜322发出并传递到扬声器30外部。具体的，从第一振膜321发出的声音经过第一通道1228从第一发声孔13传出镜腿12外部，从第二振膜322发出的声音经过第二通道1229从第二发声孔14传出镜腿12外部。
如图25A，在第一振膜321和第二振膜322的周围具有“8”字指向性特性。根据偶极子原理，使人耳处于有效听音区域，保证第一振膜321和第二振膜322具有较低的响度就能满足佩戴者听感需求。如图25B，当声音传递到远处，两个等幅反相位的声波(图25B中声波一和声波二)会在远场相互抵消，形成消音区域，实现远场消声，有效提高电子设备1000的远场私密性。同时，由于本实施例中的扬声器30为音圈-双振膜设计，使得振膜可以有更大的振膜，提供更大的响度，使佩戴者可以获得更优的耳内响度体验，提升用户的使用体验。
请参阅图26，图26是本申请提供的另一种电子设备1000的结构示意图。
图26所示实施例的电子设备1000以手机为例进行具体说明。
本实施例中，电子设备1000可以包括外壳100、显示模组200、外放扬声器300(也称为喇叭)、非外放扬声器400(也称为听筒)、主板500、处理器600、存储器700以及电池800。
外壳100包括边框1001和后盖1002，边框1001连接后盖1002的边缘。边框1001与后盖1002可以是一体成型结构，也可以通过组装方式形成一体式结构。
请一并参阅图26和图27，图27是图26所示电子设备1000在G-G方向上的剖面结构示意图。
外壳100设有扬声孔1003和安装空间1004，扬声孔1003的数量可以为一个或多个。示例性的，扬声孔1003的数量为多个，多个扬声孔1003设于边框1001。扬声孔1003连通电子设备1000的内部与电子设备1000的外部。安装空间1004设于边框1001内侧。安装空间1004还包括出声孔，出声孔设于安装空间1004侧壁且与扬声孔1003连通。扬声器30固定于安装空间1004，并将安装空间1004分隔形成第一腔1006和第二腔1007，第一腔1006与出声孔连通。
显示模组200包括盖板和显示面板。盖板固定于外壳100，例如盖板固定于边框1001远离后盖1002的一侧。显示面板固定于盖板朝向后盖1002的内表面。盖板用于保护显示面板。盖板设有受话孔2001。示例性的，受话孔2001为贯穿盖板的瞳孔。显示面板在盖板上的投影与受话孔2001错开设置。
显示面板用于显示图像、视频等，显示面板还可以集成触摸功能。显示面板可以采用液晶显示屏(liquid crystal display，LCD)，有机发光二极管(organic light-emitting diode，OLED)，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light emitting diode，AMOLED)，柔性发光二极管(flex light-emitting diode，FLED)，Miniled，MicroLed，Micro-oLed，量子点发光二极管(quantum dot light emitting diodes，QLED)等。
外放扬声器300及非外放扬声器400均位于安装空间1004，且位于显示模组200与后盖1002之间。外放扬声器300发出的声音能够经出声孔传输至电子设备1000的外部，以实现电子设备1000的声音播放功能。非外放扬声器400发出的声音经受话孔2001传输至电子设备1000的外部，以实现电子设备1000的声音播放功能。外放扬声器300和/或非外放扬声器400可以采用后续实施例描述的扬声器30。在本申请中，“A和/或B”包括“A”、“B”以及“A和B”三种情况。
主板500位于外壳100内侧，主板500上集成了处理器600、存储器700以及其他各类电路器件。处理器600可以包括一个或多个处理单元，例如：处理器600可以包括应用处理器600(application processor，AP)，调制解调处理器，图形处理器600(graphics processing unit，GPU)，图像信号处理器600(image signal processor，ISP)，控制器，视频编解码器，数字信号处理器(digital signal processor，DSP)，基带处理器，和/或神经网络处理器(neural-network processing unit，NPU)等。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器600中。
处理器600可以根据指令操作码和时序信号，产生操作控制信号，完成提取指令和执行指令的控制。
处理器600还可以设置内部存储器700，用于存储指令和数据。在一些实施例中，处理器600中的存储器700可以为高速缓冲存储器700。该存储器700可以保存处理器600用过或使用频率较高的指令或数据。如果处理器600需要使用该指令或数据，可从该存储器700中直接调用。避免了重复存取，减少了处理器600的等待时间，因而提高了系统的效率。
在一些实施例中，处理器600可以包括一个或多个接口。接口可以包括集成电路(inter-integrated circuit，I2C)接口，集成电路内置音频(inter-integrated circuit sound，I2S)接口，脉冲编码调制(pulse code modulation，PCM)接口，通用异步收发传输器(universal asynchronous receiver/transmitter，UART)接口，移动产业处理器接口(mobile industry processor interface，MIPI)，通用输入输出(general-purpose input/output，GPIO)接口，用户标识模块(subscriber identity module，SIM)接口，和/或通用串行总线(universal serial bus，USB)接口等。处理器600可以通过以上至少一种接口连接触摸传感器、无线通信模块、显示器、摄像头等模块。
存储器700可以用于存储计算机可执行程序代码，该可执行程序代码包括指令。存储器700可以包括存储程序区和存储数据区。其中，存储程序区可存储操作系统，至少一个功能所需的应用程序(比如拍照功能，录像功能等)等。存储数据区可存储电子设备1000使用过程中所创建的数据(比如图像数据，视频数据等)等。此外，存储器700可以包括高速随机存取存储器，还可以包括非易失性存储器，例如至少一个磁盘存储器件，闪存器件，通用闪存存储器(universal flash storage，UFS)等。
处理器600通过运行存储在存储器700的指令，和/或存储在设置于处理器600中的存储器700的指令，执行电子设备1000的各种功能方法或数据处理，例如，使外放扬声器300发出声音，使非外放扬声器400采集声音等。电池800用于为电子设备1000供电。
主板500上还可以集成用于处理音频信号的音频模块300，音频模块300可以包括音频 信号发射芯片301和功率放大器302。
音频信号发射芯片301用于发射音频信号。音频信号发射芯片301为一独立的芯片。可以理解的是，通过设置一独立的芯片来独立运行发射音频信号的功能，从而提高音频信号的传输效率。
当然，在其他实施方式中，发射音频信号的功能也可以集成在中央处理器600(central processing unit，CPU)上。此时，因为CPU具有发射音频信号的功能，所以电子设备1000的内部可以节省一个芯片的占用空间，从而提高电子设备1000的内部空间的利用率。此外，发射音频信号的功能也可以集成在其他芯片上，例如电池800管理芯片。
此外，功率放大器302的一端电连接于音频信号发射芯片301，另一端电连接于外放扬声器300。当音频信号发射芯片301发射音频信号时，音频信号传输至功率放大器302，功率放大器302对音频信号进行处理，并将处理后的音频信号传输至外放扬声器300。外放扬声器300根据音频信号向电子设备1000的外部发出声音。
电子设备1000还可以包括天线模组、移动通信模组、传感器模组、马达、摄像模组等功能模组中的一者或多者。天线模组用于发射和接收电磁波信号，天线模组可以包括多个天线，每个天线可用于覆盖单个或多个通信频带。不同的天线还可以复用，以提高天线的利用率。移动通信模组可以提供应用在电子设备1000上的包括2G/3G/4G/5G等无线通信的解决方案。
传感器模组可以包括压力传感器、陀螺仪传感器、气压传感器、磁传感器、加速度传感器、距离传感器、接近光传感器、指纹传感器、温度传感器、触摸传感器或环境光传感器的一者或多者。马达可以产生振动提示。马达可以用于来电振动提示，也可以用于触摸振动反馈。摄像模组用于采集模板图像等等。
请一并参阅图28和图29，图28是图20所示的扬声器30的另一种实施例的结构示意图。图29是图27所示电子设备1000的另一种实施例中的部分剖面结构放大示意图。
本实施例中的扬声器30与图20所示的扬声器30大致相同，不同的是，本实施例中扬声器30的壳体31还包括开孔50，开孔50设于壳体31的侧壁，且连通扬声器30的内腔311和安装空间1004的第二腔1007。也就是说，开孔50将扬声器30内部的空气引出至第二腔1007中，使得扬声器30内部的空气体积增大，使得扬声器30在同等空间条件下获得更大的振幅，获得更高的响度。可以理解的是，本实施例通过在扬声器30的侧壁形成开孔50，使其与电子设备1000本身上的结构配合，在不增大扬声器30的尺寸的基础上可以扩充内腔，得到更高的响度，提高用户体验。
可以理解的是，扬声器30的两个振膜同向振动，扬声器30的内腔311本身没有压缩，为无效腔体。本申请通过在扬声器30的侧壁形成开孔50，使得扬声器30的内腔311与第二腔1007连通，使得内腔311部分变成有效腔体，能够参与空气压缩，有效提高响度。当然，在其他实施例的一种实施场景中，上述实施例中提及的扬声器均可以在侧壁设置开孔。一般的，当扬声器的侧壁开孔，使开孔与电子设备的安装空间配和的方案适用于外放扬声器，不适用于听筒。当然，也可以应用于听筒。在其他实施例的另一种实施场景中，设置于电子设备安装空间中的扬声器还可以是上述实施例中的任意一个实施例提高的扬声器。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合，不同实施例中的特征任意组合也在本申请的保护范围内，也就是说，上述描述的多个实施例还可根据实际需要任意组合。
需要说明的是，上述所有附图均为本申请示例性的图示，并不代表产品实际大小。且附图中部件之间的尺寸比例关系也不作为对本申请实际产品的限定。
以上，仅为本申请的部分实施例和实施方式，本申请的保护范围不局限于此，任何熟知本领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (16)

  1. 一种扬声器，其特征在于，所述扬声器包括壳体、振动组件和磁路组件；
    所述壳体具有内腔；
    所述磁路组件设于所述内腔，所述磁路组件具有磁间隙；
    所述振动组件包括第一振膜、第二振膜和音圈，所述第一振膜和所述第二振膜分别位于所述磁路组件相背的两侧，所述第一振膜和所述第二振膜的周缘连接于所述壳体，所述音圈位于所述磁间隙内，且所述音圈相背的两侧分别连接至所述第一振膜和所述第二振膜。
  2. 根据权利要求1所述的扬声器，其特征在于，所述音圈包括相背设置的第一侧部和第二侧部，所述第一侧部和所述第二侧部均与所述音圈的中心轴的平行，所述第一侧部连接所述第一振膜，所述第二侧部连接所述第二振膜。
  3. 根据权利要求2所述的扬声器，其特征在于，所述振动组件还包括第一连接件和第二连接件，所述第一连接件连接所述第一侧部和所述第一振膜，所述第二连接件连接所述第二侧部和所述第二振膜。
  4. 根据权利要求2或3所述的扬声器，其特征在于，所述振动组件还包括支撑件，所述支撑件设于所述音圈内部，且一端连接所述第一侧部，另一端连接所述第二侧部。
  5. 根据权利要求2或3所述的扬声器，其特征在于，所述磁路组件包括第一部分和第二部分，所述第一部分和所述第二部分均具有磁性，所述第一部分与所述第二部分相对间隔设置，所述第一部分和第二部分之间形成所述磁间隙。
  6. 根据权利要求1所述的扬声器，其特征在于，所述音圈包括相背设置的第一端面和第二端面，所述第一端面和所述第二端面均与所述音圈的中心轴垂直，所述第一端面连接所述第一振膜，所述第二端面连接所述第二振膜。
  7. 根据权利要求6所述的扬声器，其特征在于，所述第一端面位于所述磁间隙内，所述第二端面位于所述磁间隙外部。
  8. 根据权利要求6或7所述的扬声器，其特征在于，所述振动组件还包括第三连接件，所述第三连接件一端连接所述第一振膜，另一端延伸至所述磁间隙并连接所述第一端面。
  9. 根据权利要求8所述的扬声器，其特征在于，所述磁路组件包括连接板、第一磁路组件和避让孔，所述第一磁路组件固定于所述连接板，所述连接板固定于所述壳体，所述第一磁路组件排布形成所述磁间隙，所述避让孔设于所述连接板并连通所述磁间隙，所述第三连接件的另一端贯穿所述避让孔延伸至所述磁间隙。
  10. 根据权利要求1至9中任意一项所述的扬声器，其特征在于，所述磁路组件还包括磁液，所述磁液填充于所述磁间隙内并包裹至少部分所述音圈。
  11. 根据权利要求1至10中任意一项所述的扬声器，其特征在于，所述音圈的数量为多个，多个所述音圈沿所述扬声器的长度方向排列设置。
  12. 根据权利要求11所述的扬声器，其特征在于，所述磁间隙沿所述扬声器的长度方向延伸，多个所述音圈间隔设于所述磁间隙中；或者，所述扬声器包括多个磁间隙，多个磁间隙沿所述扬声器的长度方向间隔设置，多个所述音圈一一对应的位于多个所述磁间隙中。
  13. 根据权利要求1至12中任意一项所述的扬声器，其特征在于，所述振动组件还包括连接线路，所述连接线路设于所述第一振膜或所述第二振膜靠近所述音圈一侧的表面，所述连接线路电连接所述音圈。
  14. 根据权利要求1至13中任意一项所述的扬声器，其特征在于，所述第一振膜和所述第二振膜相对所述磁路组件对称设置。
  15. 一种电子设备，其特征在于，所述电子设备包括外壳和权利要求1至14任意一项所述的扬声器，所述扬声器收容于所述外壳内部。
  16. 根据权利要求15所述的电子设备，其特征在于，所述外壳包括安装空间和与所述安装空间连通的出声孔，所述扬声器安装于所述安装空间并将所述安装空间分隔形成第一腔和第二腔，所述第一腔与所述出声孔连通，所述扬声器的所述壳体还包括开孔，所述开孔设于所述壳体侧壁，所述开孔连通所述内腔和所述第二腔。
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