WO2023068046A1 - Metal plate and wiring implement - Google Patents

Metal plate and wiring implement Download PDF

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Publication number
WO2023068046A1
WO2023068046A1 PCT/JP2022/037251 JP2022037251W WO2023068046A1 WO 2023068046 A1 WO2023068046 A1 WO 2023068046A1 JP 2022037251 W JP2022037251 W JP 2022037251W WO 2023068046 A1 WO2023068046 A1 WO 2023068046A1
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WO
WIPO (PCT)
Prior art keywords
metal plate
plate
bottom plate
metal
side walls
Prior art date
Application number
PCT/JP2022/037251
Other languages
French (fr)
Japanese (ja)
Inventor
庸 吉村
英人 多田
久志 熊本
忍 冨田
侑紀 佐藤
三代佳 原
Original Assignee
パナソニックホールディングス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニックホールディングス株式会社 filed Critical パナソニックホールディングス株式会社
Priority to JP2023554438A priority Critical patent/JPWO2023068046A1/ja
Priority to CN202280061644.4A priority patent/CN118019601A/en
Publication of WO2023068046A1 publication Critical patent/WO2023068046A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/20—Deep-drawing
    • B21D22/26—Deep-drawing for making peculiarly, e.g. irregularly, shaped articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D22/00—Shaping without cutting, by stamping, spinning, or deep-drawing
    • B21D22/20—Deep-drawing
    • B21D22/30—Deep-drawing to finish articles formed by deep-drawing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D51/00—Making hollow objects
    • B21D51/16—Making hollow objects characterised by the use of the objects
    • B21D51/18—Making hollow objects characterised by the use of the objects vessels, e.g. tubs, vats, tanks, sinks, or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/02—Die forging; Trimming by making use of special dies ; Punching during forging
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21J—FORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00—Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • B21J5/06—Methods for forging, hammering, or pressing; Special equipment or accessories therefor for performing particular operations
    • B21J5/08—Upsetting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21K—MAKING FORGED OR PRESSED METAL PRODUCTS, e.g. HORSE-SHOES, RIVETS, BOLTS OR WHEELS
    • B21K21/00—Making hollow articles not covered by a single preceding sub-group
    • B21K21/16—Remodelling hollow bodies with respect to the shape of the cross-section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H9/00—Details of switching devices, not covered by groups H01H1/00 - H01H7/00
    • H01H9/02—Bases, casings, or covers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details

Definitions

  • the present disclosure relates to metal plates and wiring devices.
  • a magnesium alloy thin plate material is formed by forging, the thickness of the main part consisting of the bottom part and the peripheral wall part is 1.5 mm or less, and the rising inner corner part and / or outer corner part of the wall part is chamfered.
  • a magnesium alloy forged thin molded body having a radius of 1 mm or less, a wall portion of 30 mm or less in height, and a boss portion having a thickness of 10 times or less of the thickness of the main portion is disclosed.
  • Patent Document 1 discloses a forged compact specialized for magnesium alloys, there is a demand to ensure the strength of the corners of other general metal plates as well.
  • the present disclosure does not specialize in magnesium alloys, and is a metal plate that can suppress the increase in manufacturing costs while ensuring the strength of the corners so that it can be applied to general metal plates.
  • the object is to provide a plate and a wiring device.
  • a metal plate according to an aspect of the present disclosure includes a rectangular bottom plate and a plurality of side walls standing from a peripheral edge of the bottom plate, and formed by two adjacent side walls of the plurality of side walls, or The thickness of the corner formed by one side wall and the bottom plate is 40% or more of the reference thickness of the bottom plate.
  • the wiring device includes a metal plate as a plate that covers the main body so that it can be applied to general metal plates without specializing in magnesium alloys.
  • the strength of the metal plate is ensured so that the metal plate can be applied to general metal plates without specializing in magnesium alloys, and the rise in manufacturing costs can be prevented. can be suppressed.
  • FIG. 2A is a perspective view showing the appearance when looking at the surface of the metal plate according to the embodiment.
  • FIG. 2B is a perspective view showing the appearance when looking at the back surface of the metal plate according to the embodiment.
  • FIG. 3 is a cross-sectional view showing corners of the metal plate taken along line III-III in FIG. 2A.
  • FIG. 4A is a diagram showing a state before pressing a mold when manufacturing a metal plate.
  • FIG. 4B is a diagram showing the state after pressing the mold when manufacturing the metal plate.
  • FIG. 5 is a diagram showing plate thicknesses of a metal plate immediately after forging and a metal plate subjected to secondary processing.
  • FIG. 6 is a diagram showing the thickness of each metal plate of a comparative example.
  • FIG. 7 is a diagram showing the hardness and the like of a metal plate immediately after forging, a metal plate subjected to secondary processing, and a metal plate of a comparative example.
  • each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code
  • expressions such as substantially parallel and rectangular parallelepiped are used.
  • substantially parallel or “rectangular parallelepiped” means not only “perfectly parallel” or “perfectly rectangular parallelepiped”, but also “substantially parallel” or “substantially rectangular parallelepiped”, i.e., including an error of about several percent. also means
  • substantially parallel and “rectangular parallelepiped” mean “parallel” and "straight line” within the range in which the effects of the present disclosure can be achieved. The same is true for expressions using other “abbreviation” and “shape”.
  • the lateral direction of the metal plate is defined as the X-axis direction
  • the longitudinal direction of the metal plate is defined as the Y-axis direction
  • the direction orthogonal to the X-axis direction and the Y-axis direction is the Z-axis direction.
  • direction the left side of FIG. 1 in the X-axis direction is defined as the positive direction side
  • the upper side of FIG. 1 in the Y-axis direction is defined as the positive direction side
  • FIG. 1 is a perspective view showing the appearance of the wiring device 1 according to the embodiment.
  • the wiring device 1 is, for example, a connection device that supplies power to a facility system such as a lighting device and a blower installed in a facility, and cuts off the power supply.
  • the wiring accessories 1 are embedded in structures such as ceilings and walls.
  • the wiring device 1 is, for example, an outlet or a switch.
  • the wiring accessory 1 is formed in a vertically long rectangular parallelepiped shape along the Y-axis direction.
  • the switch body 2 of the wiring device 1 is inserted into the through hole 20a of the metal plate 10 .
  • the metal plate 10 and the switch body 2 are directly or indirectly connected to each other while part of the switch body 2 of the wiring device 1 is exposed from the through hole 20a of the metal plate 10.
  • the wiring device 1 includes a switch body 2 and a metal plate 10.
  • the switch body 2 is a switch device that electrically connects or disconnects an electrically connected electric wire.
  • the switch body 2 is an example of a body.
  • the switch main body 2 is composed of a housing, a pair of terminals, a locking spring, an operation section, a handle 4, and the like.
  • the housing has a rectangular parallelepiped shape elongated along the X-axis direction, and accommodates a pair of terminals, a locking spring, and the like.
  • Each of the pair of terminals is a quick-connect terminal made of a highly conductive metal material.
  • a handle 4 is rotatably arranged on the surface of the operating portion on the Z-axis negative direction side. For example, when the operation portion of the switch body 2 is pushed by the handle 4, the movable contact of one terminal of the pair of terminals and the fixed contact of the other terminal of the pair of terminals come into contact with each other. , can be electrically connected. Further, when the operating portion of the switch body 2 is pushed by the handle 4 again after that, the movable contact of the terminal and the fixed contact of another terminal are separated from each other, so that the switch body 2 can be cut off.
  • the switch body 2 is an opening/closing device that switches the contact between the ON state and the OFF state according to the switching operation of the handle 4 .
  • FIG. 2A is a perspective view showing the appearance of the surface 11a of the metal plate 10 according to the embodiment.
  • FIG. 2B is a perspective view showing the appearance when looking at the back surface 11c of the metal plate 10 according to the embodiment.
  • the metal plate 10 is a rectangular frame attached to a structure.
  • a through hole 20 a for mounting the switch body 2 is formed in the center of the metal plate 10 .
  • the through hole 20a is formed in the central portion of the metal plate 10, but the through hole 20a may not be formed in the central portion of the metal plate 10. good.
  • the metal plate 10 may be a plate that covers the switch body 2 .
  • the metal plate 10 is made of a metal material.
  • a metal material is a material whose main component is metal such as iron, aluminum, or copper.
  • the surface roughness of the metal plate 10 measured by the new JIS measurement method is in the range of 1.0 to 3.0 ( ⁇ m). That is, on the surface 11a of the metal plate 10, a plurality of linear grooves extending along a predetermined direction are formed, or a plurality of circular grooves are formed. Such surface processing of the metal plate 10 is performed by machining. Specifically, the linear grooves extending along a predetermined direction can be formed by subjecting the surface 11a of the metal plate 10 to hairline processing. Also, the circular grooves can be formed by subjecting the surface 11a of the metal plate 10 to vibration processing.
  • the surface 11a of the metal plate 10 is the surface of the metal plate 10 on the Z-axis negative direction side.
  • the surface roughness of the surface 11a of the metal plate 10 subjected to vibration processing is 2.275 ( ⁇ m).
  • an aluminum oxide film is formed on the surface 11a of the metal plate 10 .
  • Such surface processing of the metal plate 10 is performed by chemical processing.
  • the aluminum oxide film can be formed by anodizing the surface 11a of the metal plate 10 .
  • the metal plate 10 has a bottom plate 11 and a plurality of side walls 12 .
  • the bottom plate 11 has a rectangular plate shape.
  • the bottom plate 11 is a rectangular plate elongated along the Y-axis direction.
  • the bottom plate 11 is a flat plate substantially parallel to the XY plane.
  • the plurality of side walls 12 are erected from the peripheral edge portion 11b of the bottom plate 11.
  • the peripheral edge portion 11 b of the bottom plate 11 is the outer peripheral edge of the bottom plate 11 . That is, the plurality of side walls 12 are formed along the peripheral edge portion 11b of the bottom plate 11 and are formed so as to rise along the Z-axis plus direction side. Therefore, the plurality of side walls 12 are arranged so as to surround the back surface 11 c of the bottom plate 11 .
  • the back surface 11c of the bottom plate 11 is the surface of the bottom plate 11 on the Z-axis positive direction side, and is the surface of the metal plate 10 opposite to the front surface 11a of the bottom plate 11 .
  • the bottom plate 11 is rectangular, four side walls 12 are formed on the bottom plate 11 .
  • the four side walls 12 arranged on the peripheral edge portion 11b of the bottom plate 11 are arranged so as to surround the back surface 11c of the metal plate 10 .
  • Such a metal plate 10 has corners 13 a formed by two side walls 12 adjacent to each other or formed by one side wall 12 and the bottom plate 11 .
  • the corner portion 13 a includes a corner portion 13 formed by two adjacent side walls 12 among the plurality of side walls 12 and the bottom plate 11 .
  • Metal plate 10 of the present embodiment has four corners 13 formed by one bottom plate 11 and four side walls 12 .
  • FIG. 3 is a cross-sectional view showing corner 13 of metal plate 10 taken along line III-III in FIG. 2A.
  • the corner portion 13 of the present embodiment is formed by two adjacent side walls 12 among the plurality of side walls 12 and the bottom plate 11.
  • the lower limit of the thickness of the corner portion 13 is 40% or more of the reference thickness of the bottom plate 11 of the metal plate 10 .
  • the plate thickness W1 at the corner portion 13 is set to 40% or more of the reference thickness.
  • the lower limit value may be set to a thickness that is 40% to 50% of the reference thickness.
  • the upper limit of the thickness of the corner portion 13 is less than 85% of the reference thickness of the bottom plate 11 of the metal plate 10 .
  • the side wall 12 of the metal plate 10 has a thickness of 1.108 (mm)
  • the bottom plate 11 has a thickness of 0.988 (mm)
  • the peripheral portion 11b has a thickness of 1.137 (mm)
  • the plate thickness of the corner portion 13 is 0.625 (mm).
  • the plate thicknesses of side wall 12, bottom plate 11, peripheral edge portion 11b, and corner portion 13 of metal plate 10 are examples, and are not limited to the present embodiment.
  • the reference thickness is the plate thickness of the bottom plate 11 .
  • the reference thickness is the thickness at the midpoint between the through hole 20 a and the peripheral edge portion 11 b of the bottom plate 11 .
  • the reference thickness when the through hole 20 a is not formed in the bottom plate 11 is the plate thickness at the central portion of the bottom plate 11 .
  • the reference thickness is 1 (mm).
  • the reference thickness may be an average value of the plate thickness of the bottom plate 11 excluding the peripheral edge portion 11b, the corner portions 13 and the through holes 20a.
  • the plurality of side walls 12 are forged products. That is, the plurality of side walls 12 are forged products that are formed into predetermined shapes by being pressed. Therefore, the plate thickness of the plurality of side walls 12 is thicker than the plate thickness of the bottom plate 11 . Also, when the plurality of side walls 12 are forged, the corners 13 are formed as if they were chamfered. Note that the bottom plate 11 may be a cast product or a forged product.
  • the switch body 2 may be directly connected to the metal plate 10 by a fastening member such as a screw or a fastening mechanism.
  • the metal plate 10 may be indirectly connected to the switch main body 2 via a switch connecting body (not shown). This switch connector can connect the switch body 2 and the metal plate 10 .
  • FIG. 4A is a diagram showing a state before pressing a mold when manufacturing the metal plate 10.
  • FIG. 4B is a diagram showing a state after the mold is pressed when manufacturing the metal plate 10.
  • a base plate consisting of a rectangular base bottom plate 111 and a plurality of base side walls 112 is prepared.
  • This base plate is a metal plate at a stage before forming the metal plate 10 of the present embodiment.
  • the base plate may be molded by die casting or pressing.
  • the base plate may be molded by pouring molten metal into a cavity formed by combining multiple molds and solidifying it.
  • the base plate may be molded by pressing a metal plate-like original plate with a mold such as a rectangular punch.
  • Mold A is arranged below the base plate
  • mold B is arranged on the outer peripheral side of the plurality of base side walls 112 of the base plate
  • mold C is arranged on the inner peripheral side of the plurality of base side walls 112 of the base plate.
  • the mold D presses the base side wall 112 by inserting the mold D into this gap.
  • the base side wall 112 is forged by being pressed by a mold D.
  • the side wall 12 having a thickness greater than that of the base bottom plate 111 and the base side wall 112 is formed.
  • the mold B has an arc-shaped curved portion B1 at a location corresponding to the boundary portion between the base side wall 112 and the base bottom plate 111, when the base side wall 112 is pressed by the mold D, The shape of the curved portion B ⁇ b>1 is transferred to the boundary portion between the base side wall 112 and the base bottom plate 111 . Therefore, when the base side wall 112 is pressed by the die D, forging starts, and the die D pushes the base side wall 112 to the position of the bottom dead center in FIG. A corner portion 13 is formed along with the .
  • the surface 11a side of the metal plate 10 in the peripheral portion 11b is chamfered to C0.5. That is, by forging the plurality of side walls 12, the peripheral portion 11b is given a shape of C0.5.
  • FIGS. 5, 6 and 7 are shown for the measurement results of the metal plates A, B and C immediately after forging, the secondary processed metal plates A1, B1 and C1 and the comparative example metal plates A2, B2 and C2.
  • the metal plates A, B, C and the secondary processed metal plates A1, B1, C1 correspond to the metal plate 10 of this embodiment.
  • the secondary-processed metal plates A1, B1, and C1 are metal plates after being subjected to hairline processing, vibration processing, alumite processing, and the like.
  • FIG. 5 is a diagram showing the plate thicknesses of the metal plates A, B, and C immediately after forging, the metal plates A1, B1, and C1 subjected to secondary processing, and the metal plates A2, B2, and C2 of comparative examples.
  • FIG. 6 is a diagram showing the respective plate thicknesses of metal plates A2, B2, and C2 of a comparative example.
  • FIG. 7 is a diagram showing the hardness and the like of a metal plate immediately after forging, a metal plate subjected to secondary processing, and a metal plate of a comparative example.
  • the plate thicknesses of a peripheral edge portion NO7 near the corner, a boundary portion NO8 between two adjacent sidewalls, another boundary portion NO9 between two adjacent sidewalls, a further peripheral edge portion NO10, and another bottom plate central portion NO11 are illustrated.
  • NO1 to NO11 in the metal plate A immediately after forging are 74.7, 90.4, 90.3, 92.8, 86.6, 90.1, 85.1, 84.8, 97.8 , 89.5 and 80.5 (mm).
  • the above NO1 to NO11 in the metal plate B immediately after forging are 80.0, 91.6, 93.3, 98.0, 93.8, 83.6, 83.2, 88.9, 91 .4, 92.2 and 85.4 (mm).
  • the above NO1 to NO11 in the metal plate C immediately after forging are 75.5, 90.6, 92.8, 94.1, 89.2, 88.9, 87.5, 92.9, 92 .2, 94.3 and 82.5 (mm).
  • the above NO1 to NO11 in the secondary processed metal plate A1 are 79.8, 99.4, 92.4, 102.7, 100.5, 93.6, 93.9, 101.3, 96. 0, 92.1 and 81.7 (mm).
  • the above NO1 to NO11 in the secondary processed metal plate B1 are 75.8, 98.3, 93.0, 93.6, 108.3, 92.5, 92.4, 112.6, 115. 1, 95.6, and 78.8 (mm).
  • the above NO1 to NO11 in the secondary processed metal plate C1 are 82.1, 109.3, 92.1, 100.8, 101.9, 94.8, 92.3, 94.4, 107. 1, 95.1, and 81.4 (mm).
  • the plate at the bottom plate central portion NO1, the peripheral edge NO2, the peripheral edge NO3 near the corner, the peripheral edge NO4 near the corner, the peripheral edge NO5, the peripheral edge NO6, the corner NO7, thickness is exemplified.
  • the above NO1 to NO9 in the metal plate A2 of the comparative example are 35.3, 32.6, 25.1, 33.4, 35.1, 36.3, 230.1, 215.8, 254.9 (mm).
  • the above NO1 to NO9 in the metal plate B2 of the comparative example are 41.1, 36.5, 26.8, 29.1, 29.6, 40.7, 229.5, 204.6, 251.6 (mm).
  • the above NO1 to NO9 in the metal plate C2 of the comparative example are 38.0, 39.5, 28.7, 33.1, 31.4, 43.9, 233.2, 206.2, 250.1 (mm).
  • this measurement result includes an error that occurs in general measurement of plate thickness.
  • the metal plates A, B, and C immediately after forging and the secondary processed metal plates A1, B1, and C1 have smaller variations in thickness than the metal plates A2, B2, and C2 of the comparative examples. was gotten.
  • the base material hardness indicates the average value of the base material surface hardness and the base material back surface hardness.
  • the base material surface hardness indicates the average value of NO1 in FIG.
  • the back surface hardness of the base material indicates the average value of NO11 in FIG.
  • the forged surface hardness indicates the average value of NO2-NO10 in FIG.
  • the base material hardness comparison is calculated by (forging surface hardness - base material hardness)/base material hardness.
  • the maximum-minimum value ratio is [(maximum value among NO1-NO11 in FIG. 5)-(minimum value among NO1-NO11 in FIG. 5)]/(minimum value among NO1-NO11 in FIG. value).
  • the base material hardness indicates the average value of the base material surface hardness and the base material back surface hardness.
  • the base material surface hardness indicates the average value of NO8 in FIG.
  • the back surface hardness of the base material indicates the average value of NO7 in FIG.
  • the forged surface hardness indicates the average value of NO9 in FIG.
  • the base material hardness comparison is calculated by (forging surface hardness - base material hardness)/base material hardness.
  • the maximum/minimum value ratio is [(maximum value of NO7-NO9 in FIG. 6)-(minimum value of NO7-NO9 in FIG. 6)]/(minimum value of NO7-NO9 in FIG. value).
  • the base material hardness of the metal plate immediately after forging is 79.8, the surface hardness of the base material of the metal plate immediately after forging is 76.7, the back surface hardness of the base material of the metal plate immediately after forging is 82.8, and the hardness of the metal plate immediately after forging is The forged surface hardness is 90.6, the base material hardness comparison of the metal plate immediately after forging is 0.1356, and the maximum/minimum value ratio of the metal plate immediately after forging is 0.3119.
  • the secondary processed metal plate has a base material hardness of 79.9, the secondary processed metal plate has a base material surface hardness of 79.2, and the secondary processed metal plate has a base material back surface hardness of 80.6.
  • the forged surface hardness of the fabricated metal plate is 98.6, the base metal hardness comparison of the secondary metal plate is 0.2330, and the maximum/minimum value ratio of the secondary metal plate is 0.5185.
  • the base material hardness of the metal plate of the comparative example is 219.9
  • the base material surface hardness of the metal plate of the comparative example is 208.9
  • the base material back surface hardness of the metal plate of the comparative example is 230.9
  • the hardness of the metal plate of the comparative example is The forged surface hardness is 252.2
  • the base material hardness comparison of the metal plate of the comparative example is 0.1469
  • the maximum/minimum value ratio of the metal plate of the comparative example is 0.2458.
  • the forged sidewalls 12 and corners 13 are harder than the non-forged bottom plate 11 than the metal plate of the comparative example. The result is that it is enhanced.
  • the metal plate 10 of the present embodiment includes a rectangular bottom plate 11 and a plurality of side walls 12 erected from the peripheral edge portion 11 b of the bottom plate 11 .
  • the thickness of the corner portion 13 formed by two adjacent side walls 12 among the plurality of side walls 12 or formed by one side wall 12 and the bottom plate 11 is the reference thickness of the bottom plate 11 of the metal plate 10. is 40 or more for
  • the plate thickness of the corner portion 13 is at least 40% or more of the reference thickness of the bottom plate 11 of the metal plate 10, the strength of the metal plate 10 can be ensured.
  • bottom plate 11 and the plurality of side walls 12 can be formed, there is no need to cut the formed product as in the prior art, and time is spent in manufacturing the metal plate 10, which reduces the manufacturing cost. It becomes difficult to grow.
  • the metal plate 10 can be applied to a general metal plate without specializing in a magnesium alloy, while ensuring the strength of the metal plate 10, and suppressing an increase in manufacturing costs. can.
  • the wiring device 1 of the present embodiment includes a metal plate 10 as a plate that covers the main body.
  • This wiring device 1 also has the same effects as described above.
  • the plate thickness at the corners 13 is less than 85% of the reference thickness of the bottom plate 11 of the metal plate 10 .
  • the strength of the corners 13 of the metal plate 10 can be ensured.
  • the plurality of side walls 12 are forged products.
  • the strength of the plurality of side walls 12 can be ensured. Therefore, even if a worker accidentally drops the metal plate 10 when attaching the metal plate 10 to a building, for example, the metal plate 10 is less likely to be deformed.
  • the plurality of sidewalls 12 can be formed by forging, there is no need to machine the formed product as in the prior art, which reduces manufacturing costs by spending time in manufacturing the metal plate 10. It is difficult to grow. That is, with this metal plate 10, it is possible to suppress an increase in manufacturing costs.
  • the surface roughness of the metal plate 10 measured by the new JIS measurement method is in the range of 1.0 to 3.0 ( ⁇ m).
  • a desired pattern can be formed on the surface 11 a of the metal plate 10 .
  • the surface 11a of the metal plate 10 is formed with a plurality of linear grooves extending along a predetermined direction, or formed with a plurality of circular grooves. ing.
  • a plurality of linear patterns, a plurality of circular patterns, and the like can be formed on the surface 11a of the metal plate 10, so that the metal plate 10 can be improved in appearance.
  • an aluminum oxide film is formed on the surface 11a of the metal plate 10 .
  • the aluminum oxide film formed on the surface 11a of the metal plate 10 can provide the metal plate 10 with excellent corrosion resistance and wear resistance.
  • 1 wiring device 2 switch main body (main body) REFERENCE SIGNS LIST 10 metal plate 11 bottom plate 11a surface 11b peripheral portion 12 side wall 13, 13a corner portion

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Forging (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

This metal plate (10) comprises a rectangular base plate (11) and a plurality of side walls (12) rising from a peripheral edge portion (11b) of the base plate (11). The plate thickness of a corner portion (13) formed by two adjacent side walls (12) among the plurality of side walls (12) or formed by one side wall (12) and the base plate (11) is greater than or equal to 40% of a reference thickness of the base plate (11).

Description

金属プレート及び配線器具Metal plates and wiring devices
　本開示は、金属プレート及び配線器具に関する。 The present disclosure relates to metal plates and wiring devices.
　特許文献１には、マグネシウム合金製薄板素材を鍛造で成形してなり、底部及び周壁部からなる主要部肉厚が１．５ｍｍ以下、壁部の立ち上がり内側角部及び／又は外側角部の面取り又は半径が１ｍｍ以下、壁部が高さ３０ｍｍ以下、主要部肉厚の１０倍以下のボス部を有するマグネシウム合金製鍛造薄肉成形体が開示されている。 In Patent Document 1, a magnesium alloy thin plate material is formed by forging, the thickness of the main part consisting of the bottom part and the peripheral wall part is 1.5 mm or less, and the rising inner corner part and / or outer corner part of the wall part is chamfered. Alternatively, a magnesium alloy forged thin molded body having a radius of 1 mm or less, a wall portion of 30 mm or less in height, and a boss portion having a thickness of 10 times or less of the thickness of the main portion is disclosed.
特開２００１－１７０７３４号公報Japanese Patent Application Laid-Open No. 2001-170734
　しかしながら、特許文献１はマグネシウム合金に特化した鍛造成形体が開示されているが、他の一般的な金属プレートにおいても、角部の強度を確保したいという要望がある。 However, although Patent Document 1 discloses a forged compact specialized for magnesium alloys, there is a demand to ensure the strength of the corners of other general metal plates as well.
　また、一方で、その様な一般的な金属プレートにおける板厚を変更する場合、形成品を切削加工することが考えられる。この場合、製造に時間が費やされ、製造コストが増大することがある。 On the other hand, when changing the plate thickness of such a general metal plate, it is conceivable to cut the formed product. In this case, manufacturing time is consumed and manufacturing costs may increase.
　そこで、本開示は、マグネシウム合金に特化することなく、一般的な金属プレートにも適用可能となるように、角部の強度を確保しつつ、製造コストの高騰化を抑制することができる金属プレート及び配線器具を提供することを目的とする。 Therefore, the present disclosure does not specialize in magnesium alloys, and is a metal plate that can suppress the increase in manufacturing costs while ensuring the strength of the corners so that it can be applied to general metal plates. The object is to provide a plate and a wiring device.
　本開示の一態様に係る金属プレートは、矩形状の底板と、前記底板の周縁部より立設する複数の側壁とを備え、前記複数の側壁のうちの隣り合う２つの側壁で形成される又は１つの前記側壁と前記底板とで形成される角部における板厚は、前記底板の基準厚みに対して４０％以上である。 A metal plate according to an aspect of the present disclosure includes a rectangular bottom plate and a plurality of side walls standing from a peripheral edge of the bottom plate, and formed by two adjacent side walls of the plurality of side walls, or The thickness of the corner formed by one side wall and the bottom plate is 40% or more of the reference thickness of the bottom plate.
　また、本開示の一態様に係る配線器具は、マグネシウム合金に特化することなく、一般的な金属プレートにも適用可能となるように、金属プレートを、本体をカバーするプレートとして備える。 In addition, the wiring device according to one aspect of the present disclosure includes a metal plate as a plate that covers the main body so that it can be applied to general metal plates without specializing in magnesium alloys.
　本開示の金属プレート及び配線器具によれば、マグネシウム合金に特化することなく、一般的な金属プレートにも適用可能となるように、金属プレートの強度を確保しつつ、製造コストの高騰化を抑制することができる。 According to the metal plate and wiring device of the present disclosure, the strength of the metal plate is ensured so that the metal plate can be applied to general metal plates without specializing in magnesium alloys, and the rise in manufacturing costs can be prevented. can be suppressed.
図１は、実施の形態に係る配線器具の外観を示す斜視図である。 Drawing 1 is a perspective view showing the appearance of the wiring accessories concerning an embodiment. 図２Ａは、実施の形態に係る金属プレートの表面を見た場合の外観を示す斜視図である。FIG. 2A is a perspective view showing the appearance when looking at the surface of the metal plate according to the embodiment. 図２Ｂは、実施の形態に係る金属プレートの裏面を見た場合の外観を示す斜視図である。FIG. 2B is a perspective view showing the appearance when looking at the back surface of the metal plate according to the embodiment. 図３は、図２ＡのＩＩＩ－ＩＩＩ線における金属プレートの角部を示す断面図である。FIG. 3 is a cross-sectional view showing corners of the metal plate taken along line III-III in FIG. 2A. 図４Ａは、金属プレートを製造するときに、金型を押し付ける前の状態を示す図である。FIG. 4A is a diagram showing a state before pressing a mold when manufacturing a metal plate. 図４Ｂは、金属プレートを製造するときに、金型を押し付けた後の状態を示す図である。FIG. 4B is a diagram showing the state after pressing the mold when manufacturing the metal plate. 図５は、鍛造直後の金属プレート及び二次加工した金属プレートのそれぞれの板厚を示す図である。FIG. 5 is a diagram showing plate thicknesses of a metal plate immediately after forging and a metal plate subjected to secondary processing. 図６は、比較例の金属プレートのそれぞれの板厚を示す図である。FIG. 6 is a diagram showing the thickness of each metal plate of a comparative example. 図７は、鍛造直後の金属プレート、二次加工した金属プレート及び比較例の金属プレートの硬度等を示す図である。FIG. 7 is a diagram showing the hardness and the like of a metal plate immediately after forging, a metal plate subjected to secondary processing, and a metal plate of a comparative example.
　なお、以下で説明する実施の形態は、いずれも包括的又は具体的な例を示すものである。以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置位置及び接続形態、ステップ、ステップの順序などは、一例であり、本開示を限定する主旨ではない。また、以下の実施の形態における構成要素のうち、独立請求項に記載されていない構成要素については、任意の構成要素として説明される。 It should be noted that the embodiments described below are all comprehensive or specific examples. Numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps, order of steps, and the like shown in the following embodiments are examples, and are not intended to limit the present disclosure. Further, among the constituent elements in the following embodiments, constituent elements not described in independent claims will be described as optional constituent elements.
　また、各図は、模式図であり、必ずしも厳密に図示されたものではない。また、各図において、同じ構成部材については同じ符号を付している。また、以下の実施の形態において、略平行、直方体状等の表現を用いている。例えば、略平行、直方体状は、完全に平行、完全に直方体状であることを意味するだけでなく、実質的に平行、実質的に直方体状である、すなわち、例えば数％程度の誤差を含むことも意味する。また、略平行、直方体状は、本開示による効果を奏し得る範囲において平行、直線という意味である。他の「略」、「状」を用いた表現についても同様である。 In addition, each figure is a schematic diagram and is not necessarily strictly illustrated. Moreover, in each figure, the same code|symbol is attached|subjected about the same component. In the following embodiments, expressions such as substantially parallel and rectangular parallelepiped are used. For example, "substantially parallel" or "rectangular parallelepiped" means not only "perfectly parallel" or "perfectly rectangular parallelepiped", but also "substantially parallel" or "substantially rectangular parallelepiped", i.e., including an error of about several percent. also means In addition, "substantially parallel" and "rectangular parallelepiped" mean "parallel" and "straight line" within the range in which the effects of the present disclosure can be achieved. The same is true for expressions using other "abbreviation" and "shape".
　また、以下の実施の形態では、金属プレートの短手方向をＸ軸方向と規定し、金属プレートの長手方向をＹ軸方向と規定し、Ｘ軸方向及びＹ軸方向と直交する方向をＺ軸方向と規定する。また、Ｘ軸方向において図１の左側をプラス方向側と規定し、Ｙ軸方向において図１の上側をプラス方向側と規定し、Ｚ軸方向において図１のスイッチを押圧する方向側をプラス方向側と規定する。 Further, in the following embodiments, the lateral direction of the metal plate is defined as the X-axis direction, the longitudinal direction of the metal plate is defined as the Y-axis direction, and the direction orthogonal to the X-axis direction and the Y-axis direction is the Z-axis direction. Define direction. In addition, the left side of FIG. 1 in the X-axis direction is defined as the positive direction side, the upper side of FIG. 1 in the Y-axis direction is defined as the positive direction side, and the direction of pressing the switch in FIG. side and stipulate.
　以下、実施の形態について、図面を参照しながら具体的に説明する。 Hereinafter, embodiments will be specifically described with reference to the drawings.
　（実施の形態）
　＜構成：配線器具１＞
　まず、配線器具１の構成について、説明する。 (Embodiment)
<Configuration: Wiring device 1>
First, the structure of the wiring accessories 1 is demonstrated.
　図１は、実施の形態に係る配線器具１の外観を示す斜視図である。 FIG. 1 is a perspective view showing the appearance of the wiring device 1 according to the embodiment.
　図１に示すように、配線器具１は、例えば、施設に設置される照明装置、送風装置等の設備システムに電力を供給したり、供給する電力を遮断したりする接続機器である。配線器具１は、天井、壁等の造営物に埋め込み設置される。配線器具１は、例えば、コンセント又はスイッチである。配線器具１は、Ｙ軸方向に沿って縦長の直方体状に形成されている。 As shown in FIG. 1, the wiring device 1 is, for example, a connection device that supplies power to a facility system such as a lighting device and a blower installed in a facility, and cuts off the power supply. The wiring accessories 1 are embedded in structures such as ceilings and walls. The wiring device 1 is, for example, an outlet or a switch. The wiring accessory 1 is formed in a vertically long rectangular parallelepiped shape along the Y-axis direction.
　配線器具１は、造営物に埋め込み設置される際に、配線器具１のスイッチ本体２が金属プレート１０の貫通孔２０ａに挿入された状態となる。つまり、配線器具１では、配線器具１のスイッチ本体２の一部を金属プレート１０の貫通孔２０ａから露出させた状態で、金属プレート１０とスイッチ本体２とが直接的又は間接的に連結されている。 When the wiring device 1 is embedded in a structure, the switch body 2 of the wiring device 1 is inserted into the through hole 20a of the metal plate 10 . In other words, in the wiring device 1, the metal plate 10 and the switch body 2 are directly or indirectly connected to each other while part of the switch body 2 of the wiring device 1 is exposed from the through hole 20a of the metal plate 10. there is
　配線器具１は、スイッチ本体２と、金属プレート１０とを備えている。 The wiring device 1 includes a switch body 2 and a metal plate 10.
　スイッチ本体２は、電気的に接続される電線に対して電気的に接続する、又は、遮断するスイッチ装置である。スイッチ本体２は、本体の一例である。 The switch body 2 is a switch device that electrically connects or disconnects an electrically connected electric wire. The switch body 2 is an example of a body.
　例えば、スイッチ本体２は、筐体、一対の端子、鎖錠ばね、操作部、ハンドル４等で構成されている。筐体は、Ｘ軸方向に沿って長尺な直方体状をなし、一対の端子、鎖錠ばね等を収容している。一対の端子のそれぞれは、導電性に優れた金属材料で形成された速結端子である。鎖錠ばねは、電線を端子に押し付けることで、端子と電線とを電気的に接続させる接続状態に変位したり、電線を端子に押し付けることが解除されると、電線を端子から引き抜けるような解除状態に変位したりする。操作部は、スイッチ本体２のＺ軸マイナス方向側の面に取り付けられている。また、操作部のＺ軸マイナス方向側の面には、ハンドル４が回動自在に配置されている。スイッチ本体２は、例えば、操作部がハンドル４によって押操作されると、一対の端子のうちの一方の端子の可動接点と一対の端子のうちの他方の端子の固定接点とが接触することで、電気的に接続することができる。また、スイッチ本体２は、その後もう一度、操作部がハンドル４によって押操作されると、端子の可動接点と別の端子の固定接点とが離れることで遮断することができる。つまり、ハンドル４の押操作に応じて、スイッチ本体２に内蔵される上述の接点のオン状態及びオフ状態が切り替わることで、照明装置等の機器と商用交流電源等の電源とのオン状態及びオフ状態が切り替えられる。つまり、スイッチ本体２は、ハンドル４の切り替え操作に応じて接点のオン状態及びオフ状態を切り替える開閉装置である。 For example, the switch main body 2 is composed of a housing, a pair of terminals, a locking spring, an operation section, a handle 4, and the like. The housing has a rectangular parallelepiped shape elongated along the X-axis direction, and accommodates a pair of terminals, a locking spring, and the like. Each of the pair of terminals is a quick-connect terminal made of a highly conductive metal material. By pressing the wire against the terminal, the locking spring displaces the terminal and the wire into a connected state, or when the pressing of the wire against the terminal is released, the wire is pulled out from the terminal. Transform into a state. The operating portion is attached to the surface of the switch body 2 on the negative side of the Z-axis. A handle 4 is rotatably arranged on the surface of the operating portion on the Z-axis negative direction side. For example, when the operation portion of the switch body 2 is pushed by the handle 4, the movable contact of one terminal of the pair of terminals and the fixed contact of the other terminal of the pair of terminals come into contact with each other. , can be electrically connected. Further, when the operating portion of the switch body 2 is pushed by the handle 4 again after that, the movable contact of the terminal and the fixed contact of another terminal are separated from each other, so that the switch body 2 can be cut off. In other words, by switching between the ON state and the OFF state of the above-described contacts built in the switch body 2 according to the pressing operation of the handle 4, the ON state and the OFF state of the equipment such as the lighting device and the power supply such as the commercial AC power supply are switched. state can be switched. In other words, the switch body 2 is an opening/closing device that switches the contact between the ON state and the OFF state according to the switching operation of the handle 4 .
　図２Ａは、実施の形態に係る金属プレート１０の表面１１ａを見た場合の外観を示す斜視図である。図２Ｂは、実施の形態に係る金属プレート１０の裏面１１ｃを見た場合の外観を示す斜視図である。 FIG. 2A is a perspective view showing the appearance of the surface 11a of the metal plate 10 according to the embodiment. FIG. 2B is a perspective view showing the appearance when looking at the back surface 11c of the metal plate 10 according to the embodiment.
　図１、図２Ａ及び図２Ｂに示すように、金属プレート１０は、造営物に取り付けられる、矩形状の枠体である。金属プレート１０の中央部には、スイッチ本体２を取り付けるための貫通孔２０ａが形成されている。なお、本実施の形態では、金属プレート１０の中央部に貫通孔２０ａが形成されている場合を例示しているが、金属プレート１０の中央部には、貫通孔２０ａが形成されていなくてもよい。この場合、金属プレート１０は、スイッチ本体２をカバーするプレートであってもよい。 　As shown in Figures 1, 2A and 2B, the metal plate 10 is a rectangular frame attached to a structure. A through hole 20 a for mounting the switch body 2 is formed in the center of the metal plate 10 . In this embodiment, the through hole 20a is formed in the central portion of the metal plate 10, but the through hole 20a may not be formed in the central portion of the metal plate 10. good. In this case, the metal plate 10 may be a plate that covers the switch body 2 .
　また、金属プレート１０は、金属材料で構成されている。例えば、金属材料は、鉄、アルミニウム、銅等の金属を主成分とする材料である。 Also, the metal plate 10 is made of a metal material. For example, a metal material is a material whose main component is metal such as iron, aluminum, or copper.
　また、新ＪＩＳ測定法で測定された当該金属プレート１０の表面粗さは、１．０～３．０（μｍ）の範囲である。つまり、金属プレート１０の表面１１ａには、所定の方向に沿って延びる直線状の溝が複数形成されている、又は、円形状の溝が複数形成されている。このような金属プレート１０の表面加工は、機械加工によって行われる。具体的には、所定の方向に沿って延びる直線状の溝は、金属プレート１０の表面１１ａにヘアライン加工を施すことで形成することができる。また、円形状の溝は、金属プレート１０の表面１１ａにバイブレーション加工を施すことで形成することができる。ここで、金属プレート１０の表面１１ａとは、金属プレート１０におけるＺ軸マイナス方向側の面である。本実施の形態において、バイブレーション加工を施した金属プレート１０の表面１１ａにおける表面粗さは、２．２７５（μｍ）である。 Also, the surface roughness of the metal plate 10 measured by the new JIS measurement method is in the range of 1.0 to 3.0 (μm). That is, on the surface 11a of the metal plate 10, a plurality of linear grooves extending along a predetermined direction are formed, or a plurality of circular grooves are formed. Such surface processing of the metal plate 10 is performed by machining. Specifically, the linear grooves extending along a predetermined direction can be formed by subjecting the surface 11a of the metal plate 10 to hairline processing. Also, the circular grooves can be formed by subjecting the surface 11a of the metal plate 10 to vibration processing. Here, the surface 11a of the metal plate 10 is the surface of the metal plate 10 on the Z-axis negative direction side. In the present embodiment, the surface roughness of the surface 11a of the metal plate 10 subjected to vibration processing is 2.275 (μm).
　また、金属プレート１０の表面１１ａには、酸化アルミニウム膜が形成されている。このような金属プレート１０の表面加工は、薬液加工によって行われる。具体的には、酸化アルミニウム膜は、金属プレート１０の表面１１ａにアルマイト加工を施すことで形成することができる。 Also, an aluminum oxide film is formed on the surface 11a of the metal plate 10 . Such surface processing of the metal plate 10 is performed by chemical processing. Specifically, the aluminum oxide film can be formed by anodizing the surface 11a of the metal plate 10 .
　また、金属プレート１０は、底板１１と、複数の側壁１２とを備えている。 Also, the metal plate 10 has a bottom plate 11 and a plurality of side walls 12 .
　底板１１は、矩形状の板状である。本実施の形態では、底板１１は、Ｙ軸方向に沿って長尺な矩形状の板である。また、底板１１は、Ｘ－Ｙ平面に対して略平行な平板である。 The bottom plate 11 has a rectangular plate shape. In this embodiment, the bottom plate 11 is a rectangular plate elongated along the Y-axis direction. Also, the bottom plate 11 is a flat plate substantially parallel to the XY plane.
　複数の側壁１２は、底板１１の周縁部１１ｂより立設している。ここで、底板１１の周縁部１１ｂは、底板１１の外周端縁である。つまり、複数の側壁１２は、底板１１の周縁部１１ｂに沿って形成され、かつ、Ｚ軸プラス方向側に沿って立ち上がるように形成されている。このため、複数の側壁１２は、底板１１の裏面１１ｃの周囲を囲むように配置されている。ここで、底板１１の裏面１１ｃは、底板１１におけるＺ軸プラス方向側の面であり、金属プレート１０における底板１１の表面１１ａと反対側の面である。 The plurality of side walls 12 are erected from the peripheral edge portion 11b of the bottom plate 11. Here, the peripheral edge portion 11 b of the bottom plate 11 is the outer peripheral edge of the bottom plate 11 . That is, the plurality of side walls 12 are formed along the peripheral edge portion 11b of the bottom plate 11 and are formed so as to rise along the Z-axis plus direction side. Therefore, the plurality of side walls 12 are arranged so as to surround the back surface 11 c of the bottom plate 11 . Here, the back surface 11c of the bottom plate 11 is the surface of the bottom plate 11 on the Z-axis positive direction side, and is the surface of the metal plate 10 opposite to the front surface 11a of the bottom plate 11 .
　本実施の形態では、底板１１は矩形状であるため、４つの側壁１２が底板１１に形成されている。このため、底板１１の周縁部１１ｂに配置された４つの側壁１２は、金属プレート１０の裏面１１ｃを囲むように配置されている。 In this embodiment, since the bottom plate 11 is rectangular, four side walls 12 are formed on the bottom plate 11 . For this reason, the four side walls 12 arranged on the peripheral edge portion 11b of the bottom plate 11 are arranged so as to surround the back surface 11c of the metal plate 10 .
　このような、金属プレート１０は、隣り合う２つの側壁１２で形成される又は１つの側壁１２と底板１１とで形成される角部１３ａを有する。角部１３ａは、複数の側壁１２のうちの隣り合う２つの側壁１２と底板１１とで形成される角部１３を含んでいる。本実施の形態の金属プレート１０には、１枚の底板１１と４枚の側壁１２とによって、４つの角部１３が形成されている。 Such a metal plate 10 has corners 13 a formed by two side walls 12 adjacent to each other or formed by one side wall 12 and the bottom plate 11 . The corner portion 13 a includes a corner portion 13 formed by two adjacent side walls 12 among the plurality of side walls 12 and the bottom plate 11 . Metal plate 10 of the present embodiment has four corners 13 formed by one bottom plate 11 and four side walls 12 .
　角部１３について、さらに図３を用いて説明する。図３は、図２ＡのＩＩＩ－ＩＩＩ線における金属プレート１０の角部１３を示す断面図である。 The corner portion 13 will be further described with reference to FIG. FIG. 3 is a cross-sectional view showing corner 13 of metal plate 10 taken along line III-III in FIG. 2A.
　図２Ａ、図２Ｂ及び図３に示すように、本実施の形態の角部１３は、複数の側壁１２のうちの隣り合う２つの側壁１２と底板１１とで形成される。角部１３における板厚の下限値は、当該金属プレート１０における底板１１の基準厚みに対して４０％以上である。例えば、角部１３における板厚Ｗ１は、基準厚みに対して４０％以上に設定されている。なお、下限値は、基準厚みに対して４０％～５０％の厚みに設定されていてもよい。また、角部１３における板厚の上限値は、当該金属プレート１０における底板１１の基準厚みに対して８５％未満である。 As shown in FIGS. 2A, 2B and 3, the corner portion 13 of the present embodiment is formed by two adjacent side walls 12 among the plurality of side walls 12 and the bottom plate 11. As shown in FIGS. The lower limit of the thickness of the corner portion 13 is 40% or more of the reference thickness of the bottom plate 11 of the metal plate 10 . For example, the plate thickness W1 at the corner portion 13 is set to 40% or more of the reference thickness. Note that the lower limit value may be set to a thickness that is 40% to 50% of the reference thickness. Also, the upper limit of the thickness of the corner portion 13 is less than 85% of the reference thickness of the bottom plate 11 of the metal plate 10 .
　本実施の形態において、金属プレート１０における側壁１２の板厚は１．１０８（ｍｍ）、底板１１の板厚は０．９８８（ｍｍ）、周縁部１１ｂの板厚は１．１３７（ｍｍ）、角部１３の板厚は０．６２５（ｍｍ）である。金属プレート１０における側壁１２、底板１１、周縁部１１ｂ、角部１３の板厚は一例であり、本実施の形態に限定されない。 In the present embodiment, the side wall 12 of the metal plate 10 has a thickness of 1.108 (mm), the bottom plate 11 has a thickness of 0.988 (mm), the peripheral portion 11b has a thickness of 1.137 (mm), The plate thickness of the corner portion 13 is 0.625 (mm). The plate thicknesses of side wall 12, bottom plate 11, peripheral edge portion 11b, and corner portion 13 of metal plate 10 are examples, and are not limited to the present embodiment.
　ここで、基準厚みとは、底板１１における板厚である。具体的には、底板１１に貫通孔２０ａが形成されている場合の基準厚みは、貫通孔２０ａと底板１１の周縁部１１ｂとの間の中点における板厚である。また、底板１１に貫通孔２０ａが形成されていない場合の基準厚みは、底板１１の中央部における板厚である。本実施の形態では、例えば、基準厚みは、１（ｍｍ）である。また、基準厚みは、周縁部１１ｂ、角部１３及び貫通孔２０ａを除いた底板１１における板厚の平均値であってもよい。 Here, the reference thickness is the plate thickness of the bottom plate 11 . Specifically, when the bottom plate 11 has the through hole 20 a , the reference thickness is the thickness at the midpoint between the through hole 20 a and the peripheral edge portion 11 b of the bottom plate 11 . Moreover, the reference thickness when the through hole 20 a is not formed in the bottom plate 11 is the plate thickness at the central portion of the bottom plate 11 . In this embodiment, for example, the reference thickness is 1 (mm). Further, the reference thickness may be an average value of the plate thickness of the bottom plate 11 excluding the peripheral edge portion 11b, the corner portions 13 and the through holes 20a.
　また、複数の側壁１２は、鍛造品である。つまり、複数の側壁１２は、押圧されることで所定の形状に形成された鍛造品である。このため、複数の側壁１２の板厚は、底板１１の板厚よりも厚くなる。また、複数の側壁１２は、鍛造するとき、角部１３は、面取りされたように形成される。なお、底板１１は、鋳造品であってもよく、鍛造品であってもよい。 Also, the plurality of side walls 12 are forged products. That is, the plurality of side walls 12 are forged products that are formed into predetermined shapes by being pressed. Therefore, the plate thickness of the plurality of side walls 12 is thicker than the plate thickness of the bottom plate 11 . Also, when the plurality of side walls 12 are forged, the corners 13 are formed as if they were chamfered. Note that the bottom plate 11 may be a cast product or a forged product.
　また、金属プレート１０には、ネジ等の締結部材又は締結機構によって、スイッチ本体２が直接的に連結されていてもよい。また、金属プレート１０には、図示しないスイッチ連結体を介してスイッチ本体２と間接的に連結されていてもよい。このスイッチ連結体は、スイッチ本体２と金属プレート１０とを連結することができる。 Also, the switch body 2 may be directly connected to the metal plate 10 by a fastening member such as a screw or a fastening mechanism. Also, the metal plate 10 may be indirectly connected to the switch main body 2 via a switch connecting body (not shown). This switch connector can connect the switch body 2 and the metal plate 10 .
　＜製造方法＞
　次に、金属プレート１０の製造方法について、図４Ａ及び図４Ｂを用いて説明する。 <Manufacturing method>
Next, a method for manufacturing the metal plate 10 will be described with reference to FIGS. 4A and 4B.
　図４Ａは、金属プレート１０を製造するときに、金型を押し付ける前の状態を示す図である。図４Ｂは、金属プレート１０を製造するときに、金型を押し付けた後の状態を示す図である。 FIG. 4A is a diagram showing a state before pressing a mold when manufacturing the metal plate 10. FIG. FIG. 4B is a diagram showing a state after the mold is pressed when manufacturing the metal plate 10. FIG.
　まず、図４Ａに示すように、矩形状のベース底板１１１と複数のベース側壁１１２とからなるベースプレートを用意する。このベースプレートは、本実施の形態の金属プレート１０を形成する前の段階の金属製のプレートである。例えば、ベースプレートは、ダイキャスト又はプレス加工により成型してもよい。 First, as shown in FIG. 4A, a base plate consisting of a rectangular base bottom plate 111 and a plurality of base side walls 112 is prepared. This base plate is a metal plate at a stage before forming the metal plate 10 of the present embodiment. For example, the base plate may be molded by die casting or pressing.
　具体的には、ベースプレートは、複数の金型を組み合わせることで形成したキャビティ内に溶融金属を流し込んで、固化することで成型してもよい。また、ベースプレートは、方形状のパンチ等の金型によって金属製の平板状の原板をプレスすることで成型されてもよい。 Specifically, the base plate may be molded by pouring molten metal into a cavity formed by combining multiple molds and solidifying it. Alternatively, the base plate may be molded by pressing a metal plate-like original plate with a mold such as a rectangular punch.
　次に、金型Ａ、Ｂ、Ｃ、Ｄによって形成された空洞にベースプレートを配置する。金型Ａはベースプレートの下側に配置され、金型Ｂはベースプレートの複数のベース側壁１１２の外周側に配置され、金型Ｃはベースプレートの複数のベース側壁１１２の内周側に配置される。このとき、金型Ｃと金型Ｂとの間には、隙間が形成されており、ベース側壁１１２の端部が露出している。 Next, place the base plate in the cavity formed by the molds A, B, C, and D. Mold A is arranged below the base plate, mold B is arranged on the outer peripheral side of the plurality of base side walls 112 of the base plate, and mold C is arranged on the inner peripheral side of the plurality of base side walls 112 of the base plate. At this time, a gap is formed between the mold C and the mold B, and the end of the base side wall 112 is exposed.
　図４Ｂに示すように、この隙間に金型Ｄを投入することで、金型Ｄは、ベース側壁１１２を加圧する。ベース側壁１１２は、金型Ｄによって加圧されることで、鍛造される。ベース側壁１１２が金型Ｄによって鍛造されることで、ベース底板１１１及びベース側壁１１２よりも板厚の増した側壁１２が形成される。 As shown in FIG. 4B, the mold D presses the base side wall 112 by inserting the mold D into this gap. The base side wall 112 is forged by being pressed by a mold D. By forging the base side wall 112 with the die D, the side wall 12 having a thickness greater than that of the base bottom plate 111 and the base side wall 112 is formed.
　また、金型Ｂはベース側壁１１２とベース底板１１１との境界部分に対応する個所に円弧状の湾曲部Ｂ１を有しているため、金型Ｄによってベース側壁１１２が加圧される際に、湾曲部Ｂ１の形状がベース側壁１１２とベース底板１１１との境界部分に転写される。このため、金型Ｄによってベース側壁１１２が加圧されれば、鍛造が始まり、金型Ｄが図４Ｂの下死点の位置までベース側壁１１２を押し込まれることで、鍛造された複数の側壁１２とともに角部１３が形成される。 Further, since the mold B has an arc-shaped curved portion B1 at a location corresponding to the boundary portion between the base side wall 112 and the base bottom plate 111, when the base side wall 112 is pressed by the mold D, The shape of the curved portion B<b>1 is transferred to the boundary portion between the base side wall 112 and the base bottom plate 111 . Therefore, when the base side wall 112 is pressed by the die D, forging starts, and the die D pushes the base side wall 112 to the position of the bottom dead center in FIG. A corner portion 13 is formed along with the .
　また、周縁部１１ｂにおける金属プレート１０の表面１１ａ側は、Ｃ０．５の面取りがされる。つまり、複数の側壁１２が鍛造されることで、周縁部１１ｂにＣ０．５の形状が付与される。 In addition, the surface 11a side of the metal plate 10 in the peripheral portion 11b is chamfered to C0.5. That is, by forging the plurality of side walls 12, the peripheral portion 11b is given a shape of C0.5.
　＜測定結果＞
　次に、鍛造直後の金属プレートＡ、Ｂ、Ｃ、二次加工した金属プレートＡ１、Ｂ１、Ｃ１及び比較例の金属プレートＡ２、Ｂ２、Ｃ２の測定結果について、図５、図６、図７を用いて説明する。金属プレートＡ、Ｂ、Ｃ、二次加工した金属プレートＡ１、Ｂ１、Ｃ１は、本実施の形態の金属プレート１０に相当する。また、二次加工した金属プレートＡ１、Ｂ１、Ｃ１は、ヘアライン加工、バイブレーション加工及びアルマイト加工等を施した後の金属プレートである。 <Measurement result>
Next, FIGS. 5, 6 and 7 are shown for the measurement results of the metal plates A, B and C immediately after forging, the secondary processed metal plates A1, B1 and C1 and the comparative example metal plates A2, B2 and C2. will be used for explanation. The metal plates A, B, C and the secondary processed metal plates A1, B1, C1 correspond to the metal plate 10 of this embodiment. Further, the secondary-processed metal plates A1, B1, and C1 are metal plates after being subjected to hairline processing, vibration processing, alumite processing, and the like.
　図５は、鍛造直後の金属プレートＡ、Ｂ、Ｃ、二次加工した金属プレートＡ１、Ｂ１、Ｃ１及び比較例の金属プレートＡ２、Ｂ２、Ｃ２のそれぞれの板厚を示す図である。図６は、比較例の金属プレートＡ２、Ｂ２、Ｃ２のそれぞれの板厚を示す図である。図７は、鍛造直後の金属プレート、二次加工した金属プレート及び比較例の金属プレートの硬度等を示す図である。 FIG. 5 is a diagram showing the plate thicknesses of the metal plates A, B, and C immediately after forging, the metal plates A1, B1, and C1 subjected to secondary processing, and the metal plates A2, B2, and C2 of comparative examples. FIG. 6 is a diagram showing the respective plate thicknesses of metal plates A2, B2, and C2 of a comparative example. FIG. 7 is a diagram showing the hardness and the like of a metal plate immediately after forging, a metal plate subjected to secondary processing, and a metal plate of a comparative example.
　図５では、底板中央部分ＮＯ１、角部近傍の周縁部ＮＯ２、周縁部ＮＯ３、別の角部近傍の周縁部ＮＯ４、別の角部近傍の周縁部ＮＯ５、別の周縁部ＮＯ６、さらに別の角部近傍の周縁部ＮＯ７、隣り合う２つの側壁の境界部分ＮＯ８、別の隣り合う２つの側壁の境界部分ＮＯ９、さらに別の周縁部ＮＯ１０、別の底板中央部分ＮＯ１１における板厚を例示している。鍛造直後の金属プレートＡにおける、上述のＮＯ１～ＮＯ１１は、７４．７、９０．４、９０．３、９２．８、８６．６、９０．１、８５．１、８４．８、９７．８、８９．５、８０．５（ｍｍ）となった。また、鍛造直後の金属プレートＢにおける、上述のＮＯ１～ＮＯ１１は、８０．０、９１．６、９３．３、９８．０、９３．８、８３．６、８３．２、８８．９、９１．４、９２．２、８５．４（ｍｍ）となった。また、鍛造直後の金属プレートＣにおける、上述のＮＯ１～ＮＯ１１は、７５．５、９０．６、９２．８、９４．１、８９．２、８８．９、８７．５、９２．９、９２．２、９４．３、８２．５（ｍｍ）となった。二次加工した金属プレートＡ１における、上述のＮＯ１～ＮＯ１１は、７９．８、９９．４、９２．４、１０２．７、１００．５、９３．６、９３．９、１０１．３、９６．０、９２.１、８１．７（ｍｍ）となった。二次加工した金属プレートＢ１における、上述のＮＯ１～ＮＯ１１は、７５．８、９８．３、９３．０、９３．６、１０８．３、９２．５、９２．４、１１２．６、１１５．１、９５．６、７８．８（ｍｍ）となった。二次加工した金属プレートＣ１における、上述のＮＯ１～ＮＯ１１は、８２．１、１０９．３、９２．１、１００．８、１０１．９、９４．８、９２．３、９４．４、１０７．１、９５．１、８１．４（ｍｍ）となった。 In FIG. 5, the bottom plate center portion NO1, the peripheral edge NO2 near the corner, the peripheral edge NO3, the peripheral edge NO4 near another corner, the peripheral edge NO5 near the corner, another peripheral edge NO6, and further The plate thicknesses of a peripheral edge portion NO7 near the corner, a boundary portion NO8 between two adjacent sidewalls, another boundary portion NO9 between two adjacent sidewalls, a further peripheral edge portion NO10, and another bottom plate central portion NO11 are illustrated. there is The above NO1 to NO11 in the metal plate A immediately after forging are 74.7, 90.4, 90.3, 92.8, 86.6, 90.1, 85.1, 84.8, 97.8 , 89.5 and 80.5 (mm). In addition, the above NO1 to NO11 in the metal plate B immediately after forging are 80.0, 91.6, 93.3, 98.0, 93.8, 83.6, 83.2, 88.9, 91 .4, 92.2 and 85.4 (mm). In addition, the above NO1 to NO11 in the metal plate C immediately after forging are 75.5, 90.6, 92.8, 94.1, 89.2, 88.9, 87.5, 92.9, 92 .2, 94.3 and 82.5 (mm). The above NO1 to NO11 in the secondary processed metal plate A1 are 79.8, 99.4, 92.4, 102.7, 100.5, 93.6, 93.9, 101.3, 96. 0, 92.1 and 81.7 (mm). The above NO1 to NO11 in the secondary processed metal plate B1 are 75.8, 98.3, 93.0, 93.6, 108.3, 92.5, 92.4, 112.6, 115. 1, 95.6, and 78.8 (mm). The above NO1 to NO11 in the secondary processed metal plate C1 are 82.1, 109.3, 92.1, 100.8, 101.9, 94.8, 92.3, 94.4, 107. 1, 95.1, and 81.4 (mm).
　図６では、底板中央部分ＮＯ１、周縁部ＮＯ２、角部近傍の周縁部ＮＯ３、別の角部近傍の周縁部ＮＯ４、別の周縁部ＮＯ５、さらに別の周縁部ＮＯ６、角部ＮＯ７、における板厚を例示している。 In FIG. 6, the plate at the bottom plate central portion NO1, the peripheral edge NO2, the peripheral edge NO3 near the corner, the peripheral edge NO4 near the corner, the peripheral edge NO5, the peripheral edge NO6, the corner NO7, thickness is exemplified.
　比較例の金属プレートＡ２における、上述のＮＯ１～ＮＯ９は、３５．３、３２．６、２５．１、３３．４、３５．１、３６．３、２３０．１、２１５．８、２５４．９（ｍｍ）となった。比較例の金属プレートＢ２における、上述のＮＯ１～ＮＯ９は、４１．１、３６．５、２６．８、２９．１、２９．６、４０．７、２２９．５、２０４．６、２５１．６（ｍｍ）となった。比較例の金属プレートＣ２における、上述のＮＯ１～ＮＯ９は、３８．０、３９．５、２８．７、３３．１、３１．４、４３．９、２３３．２、２０６．２、２５０．１（ｍｍ）となった。 The above NO1 to NO9 in the metal plate A2 of the comparative example are 35.3, 32.6, 25.1, 33.4, 35.1, 36.3, 230.1, 215.8, 254.9 (mm). The above NO1 to NO9 in the metal plate B2 of the comparative example are 41.1, 36.5, 26.8, 29.1, 29.6, 40.7, 229.5, 204.6, 251.6 (mm). The above NO1 to NO9 in the metal plate C2 of the comparative example are 38.0, 39.5, 28.7, 33.1, 31.4, 43.9, 233.2, 206.2, 250.1 (mm).
　なお、本測定結果は、板厚の一般的な測定で生じる誤差を含むものである。 It should be noted that this measurement result includes an error that occurs in general measurement of plate thickness.
　このように、鍛造直後の金属プレートＡ、Ｂ、Ｃ、及び、二次加工した金属プレートＡ１、Ｂ１、Ｃ１は、比較例の金属プレートＡ２、Ｂ２、Ｃ２よりも板厚のバラツキが小さいという結果が得られた。 As described above, the metal plates A, B, and C immediately after forging and the secondary processed metal plates A1, B1, and C1 have smaller variations in thickness than the metal plates A2, B2, and C2 of the comparative examples. was gotten.
　図７では、鍛造直後の金属プレート、二次加工した金属プレート、及び、比較例の金属プレートにおける、母材硬度、母材表面硬度、母材裏面硬度、鍛造面硬度、母材硬度比較、最大最小値比を示している。 In FIG. 7, the comparison of base material hardness, base material surface hardness, base material back surface hardness, forged surface hardness, base material hardness, and maximum It shows the minimum value ratio.
　ここで、鍛造直後の金属プレート、及び、二次加工した金属プレートにおいて、母材硬度は、母材表面硬度及び母材裏面硬度の平均値を示している。同様に、母材表面硬度は、図５のＮＯ１の平均値を示している。同様に、母材裏面硬度は、図５のＮＯ１１の平均値を示している。同様に、鍛造面硬度は、図５のＮＯ２－ＮＯ１０の平均値を示している。同様に、母材硬度比較は、（鍛造面硬度－母材硬度）／母材硬度によって算出される。同様に、最大最小値比は、［（図５のＮＯ１－ＮＯ１１のうちの最大値）－（図５のＮＯ１－ＮＯ１１のうちの最小値）］／（図５のＮＯ１－ＮＯ１１のうちの最小値）によって算出される。 Here, in the metal plate immediately after forging and the metal plate subjected to secondary processing, the base material hardness indicates the average value of the base material surface hardness and the base material back surface hardness. Similarly, the base material surface hardness indicates the average value of NO1 in FIG. Similarly, the back surface hardness of the base material indicates the average value of NO11 in FIG. Similarly, the forged surface hardness indicates the average value of NO2-NO10 in FIG. Similarly, the base material hardness comparison is calculated by (forging surface hardness - base material hardness)/base material hardness. Similarly, the maximum-minimum value ratio is [(maximum value among NO1-NO11 in FIG. 5)-(minimum value among NO1-NO11 in FIG. 5)]/(minimum value among NO1-NO11 in FIG. value).
　比較例の金属プレートにおいて、母材硬度は、母材表面硬度及び母材裏面硬度の平均値を示している。同様に、母材表面硬度は、図６のＮＯ８の平均値を示している。同様に、母材裏面硬度は、図６のＮＯ７の平均値を示している。同様に、鍛造面硬度は、図６のＮＯ９の平均値を示している。同様に、母材硬度比較は、（鍛造面硬度－母材硬度）／母材硬度によって算出される。同様に、最大最小値比は、［（図６のＮＯ７－ＮＯ９のうちの最大値）－（図６のＮＯ７－ＮＯ９のうちの最小値）］／（図６のＮＯ７－ＮＯ９のうちの最小値）によって算出される。 　In the metal plate of the comparative example, the base material hardness indicates the average value of the base material surface hardness and the base material back surface hardness. Similarly, the base material surface hardness indicates the average value of NO8 in FIG. Similarly, the back surface hardness of the base material indicates the average value of NO7 in FIG. Similarly, the forged surface hardness indicates the average value of NO9 in FIG. Similarly, the base material hardness comparison is calculated by (forging surface hardness - base material hardness)/base material hardness. Similarly, the maximum/minimum value ratio is [(maximum value of NO7-NO9 in FIG. 6)-(minimum value of NO7-NO9 in FIG. 6)]/(minimum value of NO7-NO9 in FIG. value).
　鍛造直後の金属プレートの母材硬度は７９．８、鍛造直後の金属プレートの母材表面硬度は７６．７、鍛造直後の金属プレートの母材裏面硬度は８２．８、鍛造直後の金属プレートの鍛造面硬度は９０．６、鍛造直後の金属プレートの母材硬度比較は０．１３５６、鍛造直後の金属プレートの最大最小値比は０．３１１９である。 The base material hardness of the metal plate immediately after forging is 79.8, the surface hardness of the base material of the metal plate immediately after forging is 76.7, the back surface hardness of the base material of the metal plate immediately after forging is 82.8, and the hardness of the metal plate immediately after forging is The forged surface hardness is 90.6, the base material hardness comparison of the metal plate immediately after forging is 0.1356, and the maximum/minimum value ratio of the metal plate immediately after forging is 0.3119.
　二次加工した金属プレートの母材硬度は７９．９、二次加工した金属プレートの母材表面硬度は７９．２、二次加工した金属プレートの母材裏面硬度は８０．６、二次加工した金属プレートの鍛造面硬度は９８．６、二次加工した金属プレートの母材硬度比較は０．２３３０、二次加工した金属プレートの最大最小値比は０．５１８５である。 The secondary processed metal plate has a base material hardness of 79.9, the secondary processed metal plate has a base material surface hardness of 79.2, and the secondary processed metal plate has a base material back surface hardness of 80.6. The forged surface hardness of the fabricated metal plate is 98.6, the base metal hardness comparison of the secondary metal plate is 0.2330, and the maximum/minimum value ratio of the secondary metal plate is 0.5185.
　比較例の金属プレートの母材硬度は２１９．９、比較例の金属プレートの母材表面硬度は２０８．９、比較例の金属プレートの母材裏面硬度は２３０．９、比較例の金属プレートの鍛造面硬度は２５２．２、比較例の金属プレートの母材硬度比較は０．１４６９、比較例の金属プレートの最大最小値比は０．２４５８である。 The base material hardness of the metal plate of the comparative example is 219.9, the base material surface hardness of the metal plate of the comparative example is 208.9, the base material back surface hardness of the metal plate of the comparative example is 230.9, and the hardness of the metal plate of the comparative example is The forged surface hardness is 252.2, the base material hardness comparison of the metal plate of the comparative example is 0.1469, and the maximum/minimum value ratio of the metal plate of the comparative example is 0.2458.
　なお、本測定結果は、ビッカース硬さ等の一般的な測定で生じる誤差を含むものである。 It should be noted that this measurement result includes errors that occur in general measurements such as Vickers hardness.
　このように、鍛造直後の金属プレート、及び、二次加工した金属プレートでは、比較例の金属プレートよりも、鍛造された側壁１２及び角部１３の方が鍛造されていない底板１１よりも硬度が高められているという結果が得られた。 Thus, in the metal plate immediately after forging and the metal plate subjected to secondary processing, the forged sidewalls 12 and corners 13 are harder than the non-forged bottom plate 11 than the metal plate of the comparative example. The result is that it is enhanced.
　＜作用効果＞
　次に、本実施の形態における金属プレート１０及び配線器具１の作用効果について説明する。 <Effect>
Next, the effect of the metal plate 10 and the wiring accessories 1 in this Embodiment is demonstrated.
　上述したように、本実施の形態の金属プレート１０は、矩形状の底板１１と、底板１１の周縁部１１ｂより立設する複数の側壁１２とを備える。そして、複数の側壁１２のうちの隣り合う２つの側壁１２で形成される又は１つの側壁１２と底板１１とで形成される角部１３における板厚は、当該金属プレート１０における底板１１の基準厚みに対して４０以上である。 As described above, the metal plate 10 of the present embodiment includes a rectangular bottom plate 11 and a plurality of side walls 12 erected from the peripheral edge portion 11 b of the bottom plate 11 . The thickness of the corner portion 13 formed by two adjacent side walls 12 among the plurality of side walls 12 or formed by one side wall 12 and the bottom plate 11 is the reference thickness of the bottom plate 11 of the metal plate 10. is 40 or more for
　これによれば、角部１３の板厚は少なくとも金属プレート１０における底板１１の基準厚みに対して４０％以上であるため、金属プレート１０における強度を確保することができる。 According to this, since the plate thickness of the corner portion 13 is at least 40% or more of the reference thickness of the bottom plate 11 of the metal plate 10, the strength of the metal plate 10 can be ensured.
　また、底板１１と複数の側壁１２とを形成することができるため、従来技術の様に形成品を切削加工しなくてもよく、金属プレート１０の製造に時間が費やされることで、製造コストが増大するということが生じ難くなる。 In addition, since the bottom plate 11 and the plurality of side walls 12 can be formed, there is no need to cut the formed product as in the prior art, and time is spent in manufacturing the metal plate 10, which reduces the manufacturing cost. It becomes difficult to grow.
　したがって、金属プレート１０では、マグネシウム合金に特化することなく、一般的な金属プレートにも適用可能となるように、金属プレート１０の強度を確保しつつ、製造コストの高騰化を抑制することができる。 Therefore, the metal plate 10 can be applied to a general metal plate without specializing in a magnesium alloy, while ensuring the strength of the metal plate 10, and suppressing an increase in manufacturing costs. can.
　また、本実施の形態の配線器具１は、金属プレート１０を、本体をカバーするプレートとして備える。 Also, the wiring device 1 of the present embodiment includes a metal plate 10 as a plate that covers the main body.
　この配線器具１においても、上述と同様の作用効果を奏する。 This wiring device 1 also has the same effects as described above.
　また、本実施の形態の金属プレート１０において、角部１３における板厚は、当該金属プレート１０における底板１１の基準厚みに対して８５％未満である。 Also, in the metal plate 10 of the present embodiment, the plate thickness at the corners 13 is less than 85% of the reference thickness of the bottom plate 11 of the metal plate 10 .
　これによれば、金属プレート１０における角部１３の強度を確保することができる。 According to this, the strength of the corners 13 of the metal plate 10 can be ensured.
　また、本実施の形態の金属プレート１０において、複数の側壁１２は、鍛造品である。 Also, in the metal plate 10 of the present embodiment, the plurality of side walls 12 are forged products.
　これによれば、複数の側壁１２における強度を確保することができる。このため、例えば作業者が金属プレート１０を造営物に取付ける際に、不意に金属プレート１０を落としたとしても、金属プレート１０が変形し難くなる。 According to this, the strength of the plurality of side walls 12 can be ensured. Therefore, even if a worker accidentally drops the metal plate 10 when attaching the metal plate 10 to a building, for example, the metal plate 10 is less likely to be deformed.
　また、複数の側壁１２を鍛造可能によって形成することができるため、従来技術のように、形成品を切削加工する必要もないため、金属プレート１０の製造に時間が費やされることで、製造コストが増大することが生じ難い。つまり、この金属プレート１０では、製造コストの高騰化を抑制することができる。 In addition, since the plurality of sidewalls 12 can be formed by forging, there is no need to machine the formed product as in the prior art, which reduces manufacturing costs by spending time in manufacturing the metal plate 10. It is difficult to grow. That is, with this metal plate 10, it is possible to suppress an increase in manufacturing costs.
　また、本実施の形態の金属プレート１０において、新ＪＩＳ測定法で測定された当該金属プレート１０の表面粗さは、１．０～３．０（μｍ）の範囲である。 Also, in the metal plate 10 of the present embodiment, the surface roughness of the metal plate 10 measured by the new JIS measurement method is in the range of 1.0 to 3.0 (μm).
　これによれば、金属プレート１０の表面１１ａにおいて、所望の模様を形成することができる。 According to this, a desired pattern can be formed on the surface 11 a of the metal plate 10 .
　また、本実施の形態の金属プレート１０において、当該金属プレート１０の表面１１ａには、所定の方向に沿って延びる直線状の溝が複数形成されている、又は、円形状の溝が複数形成されている。 In the metal plate 10 of the present embodiment, the surface 11a of the metal plate 10 is formed with a plurality of linear grooves extending along a predetermined direction, or formed with a plurality of circular grooves. ing.
　これによれば、金属プレート１０の表面１１ａにおいて、複数の直線状の模様、複数の円形状の模様等を形成することができるため、金属プレート１０の見栄えを良くすることができる。 According to this, a plurality of linear patterns, a plurality of circular patterns, and the like can be formed on the surface 11a of the metal plate 10, so that the metal plate 10 can be improved in appearance.
　また、本実施の形態の金属プレート１０において、当該金属プレート１０の表面１１ａには、酸化アルミニウム膜が形成されている。 Also, in the metal plate 10 of the present embodiment, an aluminum oxide film is formed on the surface 11a of the metal plate 10 .
　これによれば、金属プレート１０の表面１１ａに形成された酸化アルミニウム膜によって、耐腐食性及び耐摩耗性に優れた金属プレート１０を提供することができる。 According to this, the aluminum oxide film formed on the surface 11a of the metal plate 10 can provide the metal plate 10 with excellent corrosion resistance and wear resistance.
　（その他の変形例）
　以上、本開示に係る金属プレート及び配線器具について、上記各実施の形態に基づいて説明したが、本開示は、これらの実施の形態に限定されるものではない。本開示の趣旨を逸脱しない限り、当業者が思い付く各種変形を実施の形態に施したものも、本開示の範囲内に含まれてもよい。 (Other modifications)
As described above, the metal plate and the wiring device according to the present disclosure have been described based on the above embodiments, but the present disclosure is not limited to these embodiments. As long as they do not deviate from the gist of the present disclosure, various modifications that can be conceived by those skilled in the art may also be included within the scope of the present disclosure.
　なお、上記の各実施の形態に対して当業者が思い付く各種変形を施して得られる形態や、本開示の趣旨を逸脱しない範囲で各実施の形態における構成要素及び機能を任意に組み合わせることで実現される形態も本開示に含まれる。 It should be noted that any form obtained by applying various modifications that a person skilled in the art can come up with to the above-described embodiments, or by arbitrarily combining the constituent elements and functions in each embodiment without departing from the scope of the present disclosure. Any form is also included in the present disclosure.
　１　配線器具
　２　スイッチ本体（本体）
　１０　金属プレート
　１１　底板
　１１ａ　表面
　１１ｂ　周縁部
　１２　側壁
　１３、１３ａ　角部 1 wiring device 2 switch main body (main body)
REFERENCE SIGNS LIST 10 metal plate 11 bottom plate 11a surface 11b peripheral portion 12 side wall 13, 13a corner portion

Claims (7)

  1. 　矩形状の底板と、
    　前記底板の周縁部より立設する複数の側壁とを備え、
    　前記複数の側壁のうちの隣り合う２つの側壁で形成される又は１つの前記側壁と前記底板とで形成される角部における板厚は、前記底板の基準厚みに対して４０％以上である
    　金属プレート。     a rectangular bottom plate;
    and a plurality of side walls erected from the peripheral edge of the bottom plate,
    A plate thickness at a corner portion formed by two adjacent side walls among the plurality of side walls or formed by one side wall and the bottom plate is 40% or more of the reference thickness of the bottom plate. plate.
  2. 　前記角部における板厚は、前記底板の基準厚みに対して８５％未満である
    　請求項１に記載の金属プレート。     2. The metal plate according to claim 1, wherein the plate thickness at the corner portion is less than 85% of the reference thickness of the bottom plate.
  3. 　前記複数の側壁は、鍛造品である
    　請求項１又は２に記載の金属プレート。     3. The metal plate of claim 1 or 2, wherein the plurality of side walls are forgings.
  4. 　新ＪＩＳ測定法で測定された当該金属プレートの表面粗さは、１．０～３．０（μｍ）の範囲である
    　請求項１～３のいずれか１項に記載の金属プレート。     The metal plate according to any one of claims 1 to 3, wherein the surface roughness of the metal plate measured by the new JIS measurement method is in the range of 1.0 to 3.0 (μm).
  5. 　当該金属プレートの表面には、所定の方向に沿って延びる直線状の溝が複数形成されている、又は、円形状の溝が複数形成されている
    　請求項１～４のいずれか１項に記載の金属プレート。     5. The surface of the metal plate is formed with a plurality of linear grooves extending along a predetermined direction, or a plurality of circular grooves is formed, according to any one of claims 1-4. metal plate.
  6. 　当該金属プレートの表面には、酸化アルミニウム膜が形成されている
    　請求項１～５のいずれか１項に記載の金属プレート。     The metal plate according to any one of claims 1 to 5, wherein an aluminum oxide film is formed on the surface of the metal plate.
  7. 　請求項１～６のいずれか１項に記載の金属プレートを、本体をカバーするプレートとして備える
    　配線器具。     A wiring device comprising the metal plate according to any one of claims 1 to 6 as a plate covering a main body.
PCT/JP2022/037251 2021-10-20 2022-10-05 Metal plate and wiring implement WO2023068046A1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262639A (en) * 1984-06-09 1985-12-26 株式会社根本製作所 Manufacture of molded shape using aluminum or aluminum alloyas base material
JPH06218442A (en) * 1993-01-27 1994-08-09 Yutaka Giken Co Ltd Pressing method for expanding thickness
JP2004148354A (en) * 2002-10-30 2004-05-27 Tokai Rika Co Ltd Metallic formed body having hairline and method for manufacturing the formed body
JP2014221493A (en) * 2014-09-02 2014-11-27 住友電気工業株式会社 Press body

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262639A (en) * 1984-06-09 1985-12-26 株式会社根本製作所 Manufacture of molded shape using aluminum or aluminum alloyas base material
JPH06218442A (en) * 1993-01-27 1994-08-09 Yutaka Giken Co Ltd Pressing method for expanding thickness
JP2004148354A (en) * 2002-10-30 2004-05-27 Tokai Rika Co Ltd Metallic formed body having hairline and method for manufacturing the formed body
JP2014221493A (en) * 2014-09-02 2014-11-27 住友電気工業株式会社 Press body

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