WO2023066038A1

WO2023066038A1 - Dielectric filter and communication device

Info

Publication number: WO2023066038A1
Application number: PCT/CN2022/123940
Authority: WO
Inventors: 袁本贵; 夏磊
Original assignee: 华为技术有限公司
Priority date: 2021-10-22
Filing date: 2022-10-09
Publication date: 2023-04-27
Also published as: CN116014391A

Abstract

The present application discloses a dielectric filter and a communication device, effectively reducing loss of the dielectric filter. The dielectric filter comprises a dielectric block, a dielectric layer, and a metal layer. In the dielectric filter, the dielectric constant of the dielectric layer is less than that of the dielectric block, at least one surface of the dielectric block is covered with the dielectric layer, and the surface of the dielectric layer and surfaces of the dielectric block not covered with the dielectric layer are covered with the metal layer.

Description

A dielectric filter and communication device

This application claims the priority of the Chinese patent application with the application number CN202111234366.1 and the title of the invention "A Dielectric Filter and Communication Equipment" filed on October 22, 2021, the entire contents of which are incorporated by reference in this application .

technical field

The embodiment of the present application relates to the technical field of communication, and in particular to a dielectric filter and a communication device.

Background technique

With the increasing development of wireless communication technologies, communication devices (eg, base stations, etc.) in a wireless communication architecture are distributed more and more densely, and the size of communication devices is required to be smaller and smaller. In the 5th generation mobile networks (5G) multiple-input multiple output (MIMO) scenario, due to the dramatic increase in the number of transmission channels, the number of filters also increases accordingly. Therefore, the volume requirement of the filter is relatively high. The dielectric filter in communication equipment, due to the high dielectric constant of the dielectric material, can realize the miniaturization of the filter size, and has the advantages of easy production and low cost. It has been widely used in 5G base station products. However, the volume of the dielectric filter is greatly reduced compared with the previous metal cavity filter. According to the basic electromagnetic theory, the loss will increase correspondingly when the volume is reduced. Therefore, it is particularly urgent to reduce the loss of dielectric filters.

In the existing technical solution of the dielectric filter, metallization is directly performed on the surface of the dielectric block to form a metal layer. When the electromagnetic wave in the dielectric block reaches the metal layer, it will produce total reflection, and then form a current on the surface of the metal layer. However, the metal layer is a non-ideal conductor, and the current formed on the surface of the metal layer will cause loss, which will lead to a large loss of the dielectric filter.

Therefore, how to reduce the loss of the dielectric filter has become an urgent problem to be solved.

Contents of the invention

Embodiments of the present application provide a dielectric filter and communication equipment, which effectively reduce the loss of the dielectric filter.

In a first aspect, the embodiment of the present application provides a dielectric filter. The dielectric filter includes a dielectric block, a dielectric layer and a metal layer. In this dielectric filter, the dielectric constant of the dielectric layer is smaller than that of the dielectric block. Moreover, at least one surface of the dielectric block is covered by a dielectric layer, and the surface of the dielectric layer and the surface of the dielectric block not covered by the dielectric layer are covered by the metal layer. It should be noted that the material of the described dielectric block may be a dielectric material with a relatively high dielectric constant and low loss, such as ceramics. The material of the described metal layer may be metal materials such as silver, copper, aluminum, titanium, tin or gold. Through the above method, since the dielectric constant of the dielectric block is different from the dielectric constant and wave impedance of the dielectric layer, the electromagnetic waves propagating from the dielectric block will reflect part of the electromagnetic waves after reaching the dielectric layer in turn, so that the energy can be gradually absorbed. Reflected back, less energy finally reaches the metal layer, making the loss of current forming the surface of the metal layer smaller, thereby effectively reducing the loss of the dielectric filter.

In some possible implementation manners, the dielectric layer includes N layers, the K dielectric layer of the N dielectric layers covers the first surface of the dielectric block, and the P dielectric layer of the N dielectric layers covers the first surface of the dielectric block. The second surface of the dielectric block, the first surface is different from the second surface, the first surface and the second surface are one or more of the at least one surface, and N is a positive integer , K, P≤N. In this example, the dielectric block may have one or more surfaces, and the first surface may be covered with K dielectric layers, and the K dielectric layers may be overlapped and covered. Similarly, the second surface can be covered with a P-layer dielectric layer, and the P-layer dielectric layer can also be overlapped and covered. The loss of the dielectric filter can be reduced to varying degrees by stacking the same or different number of dielectric layers on different surfaces of the dielectric block.

In some possible implementation manners, the dielectric constants of each of the N dielectric layers are the same; or, the dielectric constants of each of the N dielectric layers may also be different.

In some possible implementation manners, the aforementioned K may be the same as P, or K may also be different from P. That is to say, the number of dielectric layers covering the first surface of the dielectric block may be the same as or different from the number of dielectric layers covering the second surface of the dielectric block.

In some possible implementation manners, the material of the dielectric block includes ceramics.

In some possible implementation manners, the material of the dielectric filter includes silicon oxide, boron oxide, calcium oxide and/or aluminum oxide.

In some possible implementation manners, the surface of the dielectric block includes at least one hole and/or at least one groove.

In some possible implementation manners, the surface of the dielectric block does not include holes and/or grooves.

In a second aspect, the embodiment of the present application provides a communication device. The communication device includes the first aspect and the dielectric filter that may be implemented in any one of the first aspect. The described dielectric filter can be applied in the transceiver channel in the communication system, and connected in the radio frequency front-end filter circuit of the transceiver channel in the communication system, so as to realize the frequency selection of the transceiver signal. It should be noted that the described communication equipment may be a base station, satellite communication equipment, or terminal equipment that can be used for 4G communication, 5G communication, or equipment such as a base station, satellite communication equipment, or terminal equipment that can be used for 6G communication in the future. No limit.

It can be seen from the above technical solutions that the embodiments of the present application have the following advantages:

In the embodiment of the present application, since the dielectric constant of the dielectric block is greater than that of the dielectric layer, the dielectric constant of the dielectric block is different from the dielectric constant and wave impedance of the dielectric layer. Then the dielectric layer is attached to the surface of the dielectric block, and the metal layer is attached to the surface of the dielectric layer, so that the electromagnetic wave propagating from the dielectric block will reflect part of the electromagnetic wave after reaching the dielectric layer, so that the energy can be gradually reflected back. In the end, the energy reaching the metal layer is less, so that the loss of the current forming the surface of the metal layer is smaller, thereby effectively reducing the loss of the dielectric filter.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Apparently, the drawings in the following description are only some embodiments of the present application.

Fig. 1 is the structural representation of the dielectric filter in the existing scheme;

FIG. 2A is a schematic cross-sectional view of a dielectric filter provided in an embodiment of the present application;

FIG. 2B is another schematic cross-sectional view of the dielectric filter provided by the embodiment of the present application;

FIG. 3A is another schematic cross-sectional view of a dielectric filter provided by an embodiment of the present application;

FIG. 3B is another schematic cross-sectional view of the dielectric filter provided by the embodiment of the present application;

FIG. 4A is another schematic cross-sectional view of a dielectric filter provided by an embodiment of the present application;

FIG. 4B is another schematic cross-sectional view of the dielectric filter provided by the embodiment of the present application;

FIG. 5A is a schematic diagram of a form of a dielectric filter provided in an embodiment of the present application;

FIG. 5B is a schematic diagram of another form of the dielectric filter provided by the embodiment of the present application;

FIG. 5C is a schematic diagram of another form of the dielectric filter provided by the embodiment of the present application;

FIG. 6 is a schematic diagram of a communication device provided by an embodiment of the present application.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some, not all, embodiments of the application. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present application and the above drawings are used to distinguish similar objects, and not necessarily Used to describe a specific sequence or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances such that the embodiments of the application described herein, for example, can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion. In this application, "at least one" means one or more, and "multiple" means two or more. "And/or" describes the association relationship of associated objects, indicating that there may be three types of relationships, for example, A and/or B, which can mean: A exists alone, A and B exist simultaneously, and B exists alone, where A, B can be singular or plural. The character "/" generally indicates that the contextual objects are an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one item (piece) of a, b or c can represent: a, b, c, a and b, a and c, b and c or a and b and c, wherein a, b and c can be It can be single or multiple. It should be noted that "at least one item (item)" can also be interpreted as "one item (item) or multiple items (item)".

Dielectric filters in communication equipment have been widely used in 5G communication technology due to their high dielectric constant, small size, easy production, and low cost. However, the volume of the dielectric filter is greatly reduced compared with the previous metal cavity filter. According to the basic electromagnetic theory, the loss will increase correspondingly when the volume is reduced. Therefore, it is particularly urgent to reduce the loss of dielectric filters.

FIG. 1 is a schematic structural diagram of a dielectric filter in an existing solution. As shown in FIG. 1 , metallization is directly performed on the surface of the dielectric block 101 to form a metal layer 102 . In this way, when the electromagnetic wave in the dielectric block 101 reaches the metal layer 102 , it will be totally reflected, and then a current will be formed on the surface of the metal layer 102 . However, the metal layer 102 is a non-ideal conductor, and the current formed on the surface of the metal layer 102 will cause loss, which further leads to a large loss of the dielectric filter 10 .

Based on this, in order to solve the above-mentioned problem of high loss of the dielectric filter 10, the present application provides a dielectric filter. The described dielectric filter 10 can be applied in communication equipment, and the communication equipment can be used in 4G, 5G communication or future communication systems such as sixth generation mobile networks (6th generation mobile networks, 6G). The described dielectric filter 10 may include but not limited to ceramic dielectric filters and the like. In practical applications, the dielectric filter 10 may also be other filters capable of performing frequency selection on signals sent and received by the antenna, which will not be specifically described in this application.

FIG. 2A is a schematic cross-sectional view of a dielectric filter provided by an embodiment of the present application.

As shown in FIG. 2A , the dielectric filter 10 includes a dielectric block 101 , a dielectric layer 103 and a metal layer 102 . The dielectric constant of the dielectric layer 103 is smaller than the dielectric constant of the dielectric block 101; wherein, at least one surface of the dielectric block 101 is covered by the dielectric layer 103, and the surface of the dielectric layer 103 and the surface not covered by the dielectric layer The surface of the dielectric block 101 covered by the dielectric layer 103 is covered by the metal layer 102 .

In this example, at least one surface of the described dielectric block 101 is covered by the dielectric layer 103, it can be understood that the dielectric layer 103 covers at least one surface of the dielectric block 101, and may not cover one or more of the dielectric block 101. Multiple surfaces, that is, the dielectric layer 103 must cover at least one surface of the dielectric block 101 . For example, if the dielectric block 101 is similar to the shape of a cuboid and has 6 surfaces, the dielectric layer 103 can only cover one surface of the dielectric block 101, or only cover two surfaces or 3 surfaces of the dielectric block 101. or, the dielectric layer 103 can completely cover the surface of the dielectric block 101, that is, cover the 6 surfaces of the dielectric block 101. The specific number of surfaces of the dielectric block 101 covered by the dielectric layer 103 may depend on the situation, and is not limited in this embodiment of the present application.

It should be noted that the above-mentioned FIG. 2A only shows a schematic diagram in which two surfaces of the dielectric block are covered by the dielectric layer. In practical applications, the schematic diagram of all surfaces of the dielectric block being fully covered by the dielectric layer can also be understood with reference to FIG. 2B .

In addition, the metal layer can cover the surface of the dielectric layer 103 and cover the surface of the dielectric block 101 not covered by the dielectric layer 103 .

In the embodiment of the present application, since the dielectric constant of the dielectric layer 103 is smaller than the dielectric constant of the dielectric block 101, when the dielectric constant of the dielectric block 101 is different from the dielectric constant and wave impedance of the dielectric layer 103, from The electromagnetic wave propagating in the dielectric block 101 will reflect part of the electromagnetic wave after reaching the dielectric layer 103, so that the energy can be gradually reflected back, then the energy reaching the metal layer 102 is less at last, so that the loss of the current forming the surface of the metal layer 102 Smaller, thereby effectively reducing the loss of the dielectric filter.

FIG. 3A is another schematic cross-sectional view of the dielectric filter provided by the embodiment of the present application.

In order to facilitate understanding of the dielectric filter, on the basis of the dielectric filter shown in FIG. 2A above, as shown in FIG. 3A, the dielectric layer includes N layers, and K layers of dielectric layers in the N layers of dielectric layers cover the The first surface of the dielectric block, the P layer of the dielectric layer in the N layer covers the second surface of the dielectric block, the first surface is different from the second surface, and the first surface The second surface is one or more of at least one surface of the dielectric block, N is a positive integer, K, P≤N.

In this example, the described first surface may be one or more of at least one surface of the dielectric block. For example, when the dielectric block has a shape similar to a cuboid and has 6 surfaces, the first surface can be the upper surface, or it can also be composed of two surfaces, the upper surface and the left surface, and so on. No specific limitation is made in this application. Similarly, the described second surface may be one or more of at least one surface of the dielectric block. For example, the second surface may be the lower surface of the dielectric block, or may also be composed of the lower surface and the surface of the front view, etc., which is not specifically limited in this application.

The K dielectric layer in the described N dielectric layer 103 covers the first surface of the dielectric block 101, which can be understood as the first dielectric layer 103K1 in the K dielectric layer 103 covers the first surface of the dielectric block 101 Then the second dielectric layer 103K2 covers the outer surface of the first dielectric layer 103K1, the third dielectric layer covers the outer surface of the second dielectric layer 103K2, and so on until the Kth dielectric layer 103KK Covering the outer surface of the dielectric layer of the K-1th layer. Moreover, the outer surface of the Kth dielectric layer 103KK can be covered by the metal layer 102 . And the dielectric constant of each dielectric layer 103 in the K dielectric layers 103 is smaller than the dielectric constant of the dielectric block 101 .

Similarly, the P layer dielectric layer in the described N layer dielectric layer 103 covers the second surface of the dielectric block 101. It can be understood that the first layer of dielectric layer 103P1 in the P layer dielectric layer 103 covers the dielectric block 101. On the outside of the second surface, the second dielectric layer 103P2 covers the outer surface of the first dielectric layer 103P1, the third dielectric layer covers the outer surface of the second dielectric layer 103P2, and so on until the Pth layer The dielectric layer 103PP covers the outer surface of the P-1th dielectric layer. Moreover, the outer surface of the Pth dielectric layer 103PP can be covered by the metal layer 102 . And the dielectric constant of each of the P dielectric layers 103 is smaller than the dielectric constant of the dielectric block 101 .

It should be understood that the above-mentioned FIG. 3A only shows that the first surface (for example: the left side surface) of the dielectric block is covered by the K layer dielectric layer, and the second surface (for example: the right side surface) is covered by the P layer dielectric layer. schematic diagram. In practical application, the schematic diagram of all the surfaces of the dielectric block being fully covered by the dielectric layer can also be understood by referring to FIG. 3B .

It should be noted that K and P described above may be the same or different, and are not specifically limited in this embodiment of the present application. In the embodiment of the present application, only K and P are not the same as an example for illustration.

After the electromagnetic wave in the dielectric block 101 propagates from the first surface of the dielectric block 101 to the junction with the first dielectric layer 103K1, due to the dielectric constant of the dielectric block 101 and the dielectric constant of the first dielectric layer 103K1 and The wave impedance is different, a part of the electromagnetic wave is reflected at the junction of the dielectric block 101 and the first layer of dielectric layer 103K1, so that part of the energy is reflected back; and another part of the electromagnetic wave will propagate to the first layer of dielectric layer 103K1, so that another part of the energy can be After passing through the first dielectric layer 103K1 and propagating to the junction of the first dielectric layer 103K1 and the second dielectric layer 103K2, a part of the energy is reflected back, while the rest of the energy passes through the second dielectric layer 103K2 Finally, it reaches the junction between the second dielectric layer 103K2 and the third dielectric layer. By analogy, until the energy passes through the K-1th dielectric layer and reaches the junction between the K-1th dielectric layer and the K-th dielectric layer 103KK, part of the energy will be reflected back, and the remaining part of the energy After passing through the Kth dielectric layer 103KK, it reaches the metal layer 102 and undergoes total reflection in the metal layer 102 . Similarly, the propagation of electromagnetic waves in the second surface of the dielectric block 101 can also be similar to the way of propagating in the first surface, and the energy passes through the P-1th dielectric layer and reaches the P-1th dielectric layer and the first dielectric layer. After the junction between the P-layer dielectric layers 103PP, part of the energy will be reflected back, and the remaining part of the energy will pass through the P-th dielectric layer 103PP, reach the metal layer 102, and fully generate in the metal layer 102 reflection. In this way, after the electromagnetic waves propagating from the dielectric block 101 reach each dielectric layer 103 in turn, part of the electromagnetic waves will be reflected, so that the energy can be gradually reflected back, and then the energy reaching the metal layer 102 at last, compared with the previous figure The traditional solution described in 1 is less, so that the loss of the current forming the surface of the metal layer 102 is smaller, thereby effectively reducing the loss of the dielectric filter 10 .

It should be noted that the outer surface of the described Kth dielectric layer 103KK can be covered by the metal layer 102, and it can also be understood as that the outer surface of the Kth dielectric layer 103KK is attached to the outer surface of the Kth dielectric layer 103KK by means of electroplating, printing, welding or spraying. The upper metal layer 102 . Similarly, the described outer surface of the P-th dielectric layer 103PP can be covered by the metal layer 102, and it can also be understood that the outer surface of the P-th dielectric layer 103PP is covered by electroplating, printing, welding or spraying. The upper metal layer 102 . The metal layer 102 can confine electromagnetic waves in the dielectric block 101 to prevent leakage of electromagnetic signals. The material of the metal layer 102 described may include but not limited to metal materials such as silver, copper, aluminum, titanium, tin or gold.

In some other examples, the dielectric constants of each of the N dielectric layers 103 may be the same or different, which is not limited here. In other words, the dielectric constant between each of the N dielectric layers 103 is not limited. For example, in the case where the K dielectric layer 103 covers the first surface of the dielectric block 101, the dielectric constant of the first dielectric layer 103K1 may be greater than the dielectric constant of the second dielectric layer 103K2, or may be less than or equal to The dielectric constant of the second dielectric layer 103K2; or, the dielectric constant of the third dielectric layer may also be greater than the dielectric constant of the second dielectric layer 103K2, etc., which are not limited here. As long as the dielectric constant of each of the N dielectric layers 103 is smaller than the dielectric constant of the dielectric block 101. For the situation that the P-layer dielectric layer 103 covers the second surface of the dielectric block 101, it can also be understood with reference to the above-mentioned situation that the K-layer dielectric layer 103 covers the first surface of the dielectric block 101, and details are not repeated here.

For example, FIG. 4A shows another schematic cross-sectional view of the dielectric filter provided by the embodiment of the present application. As shown in FIG. 4A , when N=1 and K=P=1, the dielectric filter 10 may include a dielectric block 101 , a dielectric layer 103 and a metal layer 102 . The dielectric constant of the dielectric layer 103 is smaller than that of the dielectric block 101 . Moreover, the dielectric layer 103 is attached to the outer surface of the dielectric block 101 , and the metal layer 102 is attached to the outer surface of the dielectric layer 103 . After the electromagnetic wave of the dielectric block 101 propagates from the dielectric block 101 to the junction with the dielectric layer 103, because the dielectric constant of the dielectric block 101 and the dielectric constant and wave impedance of the dielectric layer 103 are different, a part of the electromagnetic wave is between the dielectric block 101 and the dielectric layer 103. Reflection occurs at the junction of the dielectric layer 103, so that a part of the energy is reflected back; another part of the electromagnetic wave will propagate to the dielectric layer 103, and this other part of the energy can pass through the dielectric layer 103 and propagate to the metal layer 102, and Total reflection occurs in the metal layer 102 . In this way, the electromagnetic wave propagating from the dielectric block 101 will be reflected after reaching the dielectric layer 103, so that part of the energy can be gradually reflected back, then the energy that finally reaches the metal layer 102, compared with the traditional solution described in Figure 1 Less, so that the loss of the current forming the surface of the metal layer 102 is smaller, thereby effectively reducing the loss of the dielectric filter 10 .

You can also refer to FIG. 4B , which is another schematic cross-sectional view of the dielectric filter provided by the embodiment of the present application. As shown in FIG. 4B , when N=2, K=1, and P=2, the dielectric filter 10 may include a dielectric block 101 , two dielectric layers 103 and a metal layer 102 .

Wherein, on the first surface of the dielectric block 101 , the dielectric layer 103 may include a first dielectric layer 103K1 , and the first dielectric layer 103K1 is attached to the outside of the first surface of the dielectric block 101 . In the second surface of the dielectric block 101, the dielectric layer 103 may include a first dielectric layer 103P1 and a second dielectric layer 103P2, and the first dielectric layer 103P1 is attached to the outside of the second surface of the dielectric block 101 , the second dielectric layer 103P2 is attached to the outer surface of the first dielectric layer 103P1. Furthermore, the metal layer 102 is attached to the outer surface of the first dielectric layer 103K1 and the outer surface of the second dielectric layer 1032 .

It should be noted that the dielectric constant of the first dielectric layer 103K1 , the dielectric constants of the first dielectric layer 103P1 and the second dielectric layer 103P2 are all smaller than the dielectric constant of the dielectric block 101 .

After the electromagnetic wave in the dielectric block 101 propagates from the first surface of the dielectric block 101 to the junction with the first dielectric layer 103K1, due to the dielectric constant of the dielectric block 101 and the dielectric constant and wave of the first dielectric layer 103K1 Impedances are different, a part of the electromagnetic wave is reflected at the junction of the dielectric block 101 and the first dielectric layer 103K1, so that part of the energy is reflected back, and the other part passes through the first dielectric layer 103K1, reaches the metal layer 102, and is Total reflection occurs in the metal layer 102 . Similarly, after the electromagnetic wave propagates from the second surface of the dielectric block 101 to the junction with the first dielectric layer 103P1, due to the dielectric constant of the dielectric block 101 and the dielectric constant and wave impedance of the first dielectric layer 103P1 are different , a part of the electromagnetic wave is reflected at the junction of the dielectric block 101 and the first dielectric layer 103P1, so that part of the energy is reflected back, while another part of the electromagnetic wave can pass through the first dielectric layer 103P1 and propagate to the first dielectric layer 103P1 After the junction with the second dielectric layer 103P2, part of the energy is reflected back, and the remaining part of the energy passes through the second dielectric layer 103P2, reaches the metal layer 102, and undergoes total reflection in the metal layer 102 . In this way, the electromagnetic wave propagating from the dielectric block 101 will be reflected after arriving at each dielectric layer 103 in turn, so that the energy can be gradually reflected back, and then the energy reaching the metal layer 102 at last, compared with the above described in FIG. 1 There are fewer traditional solutions, so that the loss of the current forming the surface of the metal layer 102 is smaller, thereby effectively reducing the loss of the dielectric filter 10 .

Similarly, in practical applications, three dielectric layers 103 , four dielectric layers 103 , etc. may also be superimposed on the surface of the dielectric block 101 , which are not specifically limited in this embodiment of the present application.

It should be noted that the above-mentioned dielectric filter 10 shown in FIGS. 2A-4B only describes the structure of the dielectric filter 10 from the perspective of section. Referring to FIG. 5A , it is a schematic diagram of a form of the dielectric filter 10 provided by the embodiment of the present application. It can be seen from FIG. 5A that, on the basis of any one of the dielectric filters 10 described above in FIGS. 2A-4B , the surface of the dielectric block 101 may include at least one hole and/or at least one groove. The described at least one hole or at least one groove may be symmetrically distributed based on the dielectric block 101 .

In some other examples, the surface of the dielectric block 101 can also be a flat plane, that is, the holes and/or grooves shown in FIG. 5A are not included. For details, refer to the dielectric filter 10 shown in FIGS. 5B to 5C. Another morphological schematic diagram for understanding. It can be seen from FIG. 5B that the surface of the dielectric block 101 has neither holes nor grooves. And it can be seen from FIG. 5C that the surface of the dielectric block 101 has no holes.

In addition, in FIG. 5A to FIG. 5C , only the shape of the dielectric block 101 is a cuboid as an example for illustration. In practical applications, the shape of the dielectric block 101 can also be a three-dimensional shape such as a cube, a cylinder, and an ellipse cylinder, which is convenient for processing and assembling. Of course, in practical applications, the dielectric block 101 can also be in other shapes, such as cylinders, trapezoids, etc. The specific shapes are not limited in this application. The shapes of the holes described can include but are not limited to circles, squares, Rhombus etc. The shape of the groove described may also include but not limited to a cross groove, a straight groove, a rectangular groove, etc., which are not limited here. In addition, the number of holes or grooves is not limited in the embodiment of the present application.

It should be noted that the material of the dielectric block 101 described above may be a dielectric material with a high dielectric constant and low loss, such as ceramics, which will not be described here.

In addition, the material of the described dielectric filter 10 may include materials such as silicon oxide, boron oxide, calcium oxide and/or aluminum oxide. In practical application, the material of the dielectric filter 10 can also be other materials with low dielectric constant, low loss and temperature coefficient close to zero, which can provide better dielectric properties for the dielectric filter 10 .

FIG. 6 is a schematic diagram of a communication device provided by an embodiment of the present application. As shown in FIG. 6 , the communication device may include a dielectric filter 10 . Wherein, the dielectric filter 10 can be coupled with the antenna, and is used for frequency selection of the antenna's sending and receiving signals. It should be noted that the dielectric filter 10 in FIG. 6 can be understood with reference to the dielectric filter 10 described in FIGS. 2A-5C , and its structure and working principle will not be repeated here.

The described communication devices may include, but are not limited to, devices such as base stations or terminals that can be used for 5G communications, and may also be devices such as base stations, satellite communication devices, or terminals that can be used for 6G communications in the future. The terminals described may in turn include, but are not limited to, foldable electronic devices, tablet computers, desktop computers, laptop computers, handheld computers, notebook computers, ultra-mobile personal computers (UMPC), netbooks, cellular Telephone, personal digital assistant (PDA), augmented reality (augmented reality, AR) device, virtual reality (virtual reality, VR) device, artificial intelligence (artificial intelligence, AI) device, wearable device, vehicle-mounted device , smart home equipment, or at least one of smart city equipment, without specific limitation.

Those skilled in the art can clearly understand that for the convenience and brevity of the description, the specific working process of the above-described system, device and unit can refer to the corresponding process in the foregoing method embodiment, which will not be repeated here.

The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still apply to the foregoing embodiments Modifications are made to the recorded technical solutions, or equivalent replacements are made to some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

A dielectric filter, characterized in that the dielectric filter includes a dielectric block, a dielectric layer and a metal layer; the dielectric constant of the dielectric layer is smaller than the dielectric constant of the dielectric block;

Wherein, at least one surface of the dielectric block is covered by the dielectric layer, and the surface of the dielectric layer and the surface of the dielectric block not covered by the dielectric layer are covered by the metal layer.
The dielectric filter according to claim 1, wherein the dielectric layer comprises N layers, K layers of dielectric layers in the N layers of dielectric layers cover the first surface of the dielectric block, and the N layers of the dielectric layer The P-layer dielectric layer in the dielectric layer covers the second surface of the dielectric block, the first surface is different from the second surface, and the first surface and the second surface are the One or more of at least one surface, N is a positive integer, K, P≤N.
The dielectric filter according to claim 2, wherein the dielectric constants of each of the N dielectric layers are the same.
The dielectric filter according to claim 2, wherein the dielectric constants of each of the N dielectric layers are different.
The dielectric filter according to any one of claims 2-4, characterized in that K and P are the same; or K and P are different.
The dielectric filter according to any one of claims 1-5, characterized in that, the material of the dielectric block is ceramics.
The dielectric filter according to any one of claims 1-6, characterized in that, the material of the dielectric filter includes silicon oxide, boron oxide, calcium oxide and/or aluminum oxide.
The dielectric filter according to any one of claims 1-7, wherein the surface of the dielectric block comprises at least one hole and/or at least one groove.
The dielectric filter according to any one of claims 1-7, wherein the surface of the dielectric block does not include holes and/or grooves.
A communication device, characterized in that the communication device comprises the dielectric filter according to any one of claims 1-9.