WO2023060853A1 - Heat dissipation device, heat dissipation structure parameter determination method and apparatus, device, and medium - Google Patents

Abstract

Disclosed are a heat dissipation device, a heat dissipation structure parameter determination method and apparatus, a device, and a medium. The heat dissipation device is disposed inside a housing of an electronic device, and comprises a heat-conducting casing and at least one heat dissipation fin. The heat-conducting casing comprises a heat dissipation surface and a heat-absorbing surface. The side of the heat-conducting casing close to the housing is the heat dissipation surface. The heat dissipation surface is configured to fix at least one heat dissipation fin and transfer heat to the at least one heat dissipation fin and to the external environment. The side of the heat-conducting casing away from the housing is the heat-absorbing surface. The heat-absorbing surface is configured to fix a target heat dissipation device of the electronic device and transfer heat from the target heat dissipation device. At least one heat dissipation fin is fixed on the heat dissipation surface according to heat dissipation structure parameters, and is configured to transfer heat to the heat conduction casing and the external environment.

Description

Method, device, equipment, and medium for determining heat dissipation equipment and heat dissipation structure parameters

This application claims priority to a Chinese patent application with application number 202111198434.3 filed with the China Patent Office on October 14, 2021, the entire contents of which are incorporated herein by reference.

technical field

The present application relates to the field of computer technology, for example, to methods, devices, equipment, and media for determining parameters of heat dissipation equipment and heat dissipation structures.

Background technique

The development of many types of electronic equipment in modern society is changing with each passing day, and the functions of electronic equipment are becoming more and more powerful. In order to meet the high power requirements of some electronic equipment, higher requirements are put forward for the heat dissipation capacity of the equipment. For example, security cameras, due to the characteristics of their outdoor use, airtightness is a must-have requirement for the equipment, and direct sunlight will cause the temperature of the shell to increase rapidly, and the heating of the equipment will affect the use of the device and restrict the development of technology.

In related technologies, the method to solve the heat dissipation problem of high-power electronic equipment is to add fans and supporting electronic control systems. However, this method is highly dependent on the fan, and once the fan fails, the device components are easily burned. Moreover, for electronic equipment in a sealed state, the hot air flow circulates inside the equipment and dissipates heat through the surface of the housing. The heat dissipation efficiency is very low, and it is difficult to achieve thermal balance. It is not conducive to using software to analyze and simulate the heat dissipation effect, and data analysis cannot be performed. It can only be measured through prototype experiments, which affects development efficiency and reliability and increases development costs.

Contents of the invention

The present application provides a method, device, device, and medium for determining heat dissipation equipment and heat dissipation structure parameters, so as to realize data analysis of heat dissipation effects, improve heat dissipation performance, development efficiency and reliability of electronic equipment, and save development costs.

The present application provides a heat dissipation device, which is arranged inside the outer cover of the electronic device, including: a thermally conductive shell and at least one heat dissipation fin; wherein,

The heat-conducting shell includes a heat-dissipating surface and a heat-absorbing surface, wherein the side of the heat-conducting shell close to the outer cover is the heat-dissipating surface, and the heat-dissipating surface is configured to fix the at least one heat-dissipating fin and communicate with the at least one heat-dissipating fin. The at least one cooling fin and the external environment conduct heat transfer; the side of the heat-conducting shell away from the outer cover is the heat-absorbing surface, and the heat-absorbing surface is configured to fix the target heat-dissipating device of the electronic device and communicate with it The target heat dissipation device performs heat transfer;

At least one of the heat dissipation fins is fixed on the heat dissipation surface according to the heat dissipation structure parameters, and is configured to conduct heat transfer with the heat conductive shell and the external environment.

The present application also provides a method for determining heat dissipation structural parameters, which is used to determine the heat dissipation structural parameters of the above heat dissipation equipment, including:

Obtaining structural parameters of the housing of the electronic device, and determining at least two groups of heat dissipation structural parameters according to the structural parameters of the housing; wherein, the structural parameters of heat dissipation are used to describe the heat dissipation device;

Generate a target structure model corresponding to each set of heat dissipation structure parameters according to each set of heat dissipation structure parameters, the heat dissipation device, the housing of the electronic device, and the structure parameters of the housing;

Conduct thermal simulation analysis according to each target structure model to obtain heat dissipation effect data;

According to the heat dissipation effect data corresponding to each target structure model, the heat dissipation structure parameter corresponding to the target structure model satisfying the heat dissipation effect condition is determined as the target heat dissipation structure parameter.

The present application also provides a device for determining heat dissipation structure parameters, including:

The parameter acquisition module is configured to acquire the structure parameters of the housing of the electronic device, and determine at least two groups of heat dissipation structure parameters according to the structure parameters of the housing; wherein, the heat dissipation structure parameters are used to describe the heat dissipation device;

The model generating module is configured to generate a target structure model corresponding to each group of heat dissipation structure parameters according to each group of heat dissipation structure parameters, the heat dissipation device, the housing of the electronic device, and the structure parameters of the housing;

The simulation analysis module is set to perform thermal simulation analysis according to each target structure model to obtain heat dissipation effect data;

The parameter determination module is configured to determine the heat dissipation structure parameters corresponding to the target structure models satisfying the heat dissipation effect conditions as the target heat dissipation structure parameters according to the heat dissipation effect data corresponding to each target structure model.

The present application also provides a kind of computer equipment, and described computer equipment comprises:

one or more processors;

a storage device configured to store one or more programs;

When the one or more programs are executed by the one or more processors, the one or more processors are made to implement the above method for determining heat dissipation structure parameters.

The present application also provides a computer storage medium, on which a computer program is stored, and when the program is executed by a processor, the above-mentioned method for determining heat dissipation structure parameters is realized.

Description of drawings

FIG. 1 is a schematic structural diagram of a heat dissipation device provided in Embodiment 1 of the present application;

FIG. 2 is a schematic cross-sectional structural diagram of an electronic device equipped with a heat dissipation device provided in Embodiment 1 of the present application;

FIG. 3 is a schematic diagram of a heat dissipation device deployed in a security camera provided in Embodiment 1 of the present application;

FIG. 4 is a schematic diagram of a security camera housing provided with a cooling device provided in Embodiment 1 of the present application;

FIG. 5 is a flow chart of a method for determining heat dissipation structure parameters provided in Embodiment 2 of the present application;

FIG. 6 is a schematic diagram of a target structure model of a security camera housing provided with a cooling device provided in Embodiment 2 of the present application;

FIG. 7 is a schematic diagram of a software interface for generating a target structure model provided in Embodiment 2 of the present application;

FIG. 8 is a schematic diagram of a software interface for mesh division processing provided in Embodiment 2 of the present application;

FIG. 9 is a schematic cross-sectional view of a thermal simulation analysis provided in Embodiment 2 of the present application;

FIG. 10 is a heat distribution diagram of a target structure model provided in Embodiment 2 of the present application;

Fig. 11 is a heat distribution diagram of another target structure model provided in Embodiment 2 of the present application;

Fig. 12 is a heat distribution diagram of another target structure model provided in Embodiment 2 of the present application;

FIG. 13 is a heat distribution diagram of another target structure model provided in Embodiment 2 of the present application;

FIG. 14 is a heat distribution diagram of another target structure model provided in Embodiment 2 of the present application;

Fig. 15 is a heat distribution diagram of another target structure model provided in Embodiment 2 of the present application;

Fig. 16 is a heat distribution diagram of another target structure model provided in Embodiment 2 of the present application;

FIG. 17 is a schematic structural diagram of a heat dissipation structure parameter determination device provided in Embodiment 3 of the present application;

FIG. 18 is a schematic structural diagram of a computer device provided in Embodiment 4 of the present application.

Detailed ways

The application will be described below in conjunction with the accompanying drawings and embodiments. The specific embodiments described herein are for illustration of the application only.

For ease of description, only parts relevant to the present application are shown in the drawings. Before discussing the exemplary embodiments, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flow diagrams depict operations (or steps) as sequential processing, many of the operations may be performed in parallel, concurrently, or simultaneously. Additionally, the order of multiple operations can be rearranged. The process may be terminated when its operations are complete, but may also have additional steps not included in the figure. The processing may correspond to a method, function, procedure, subroutine, subroutine, or the like.

Embodiment one

FIG. 1 is a schematic structural diagram of a heat dissipation device provided in Embodiment 1 of the present application. The heat dissipation device provided in this embodiment is applicable to heat dissipation of electronic equipment, and generally can be arranged inside the housing of the electronic equipment. Wherein, the electronic device may be any electronic device that generates heat during operation and needs to dissipate heat, for example, it may be a security camera. The housing of the electronic equipment may be a housing adjacent to components that generate heat during operation of the electronic equipment.

As shown in FIG. 1 , the heat dissipation device includes: a thermally conductive shell 110 and at least one heat dissipation fin 120 .

The heat-conducting shell 110 includes a heat-dissipating surface 1101 and a heat-absorbing surface 1102. The side of the heat-conducting shell 110 close to the outer cover is a heat-dissipating surface 1101. The heat-dissipating surface 1101 is configured to fix at least one heat-dissipating fin 120 and communicate with at least one heat-dissipating fin 120 and the outside world. The environment conducts heat transfer; the side of the heat-conductive shell 110 away from the outer cover is a heat-absorbing surface 1102 , and the heat-absorbing surface 1102 is set to fix the target heat dissipation device of the electronic device and conduct heat transfer with the target heat dissipation device. At least one heat dissipation fin 120 is fixed on the heat dissipation surface 1101 according to the heat dissipation structure parameter determined according to the method for determining the heat dissipation structure parameter, and configured to conduct heat transfer with the thermally conductive shell 110 and the external environment.

The thermally conductive shell 110 may be a sheet-like structure made of any thermally conductive material. It is deployed on the inner side of the electronic equipment cover, the heat dissipation surface 1101 may have a certain distance from the inner surface of the cover, and the space formed by the distance between the two surfaces is set to accommodate at least one heat dissipation fin 120 fixed on the heat dissipation surface 1101 . The heat-absorbing surface 1102 is set to fix the target heat dissipation device of the electronic device. The target heat dissipation device may include any device in the electronic device that generates heat during operation, which may be determined according to the electronic device, and is not limited here. Exemplarily, FIG. 2 is a schematic cross-sectional structural diagram of an electronic device configured with a heat dissipation device provided in Embodiment 1 of the present application. During the working process of the electronic device, the thermally conductive shell 110 can transfer heat with the target heat dissipation device through the heat absorption surface 1102, and absorb the heat generated by the target heat dissipation device, so that the target heat dissipation device can realize its own heat dissipation. Exemplarily, for a security camera with a heating power of 70W, a 65W heat-generating device can be fixed on the heat-absorbing surface 1102 so that 65W of heat can be dissipated through the heat-conductive shell 110 .

The heat dissipation fins 120 may be sheet-like structures made of any heat-conductive material, and the number may be one or more, which are fixed on the heat dissipation surface 1101 . After the heat generated by the target heat dissipation device is transferred to the heat-conducting shell 110 through the heat-absorbing surface 1102, the heat-conducting shell 110 can transfer the heat to the heat-dissipating fin 120 and the external environment through the heat-dissipating surface 1101, so that the heat-dissipating fin 120 absorbs heat The heat transferred by the surface 1101 can also transfer heat to the external environment through its own surface, so as to reduce the heat of the heat dissipation device itself, so as to continue to absorb the heat produced by the target heat dissipation device, and complete the heat dissipation of the electronic equipment.

The characteristics of the cooling fins 120 can be determined according to the parameters of the cooling structure. The heat dissipation structure parameters may be data used to describe the heat dissipation fins 120, and may be determined according to a method for determining heat dissipation structure parameters. The heat dissipation structure parameter determination method may be the heat dissipation structure parameter determination method provided in the embodiment of the present application, and the heat dissipation effect of multiple heat dissipation device structures may be determined by obtaining the characteristics of different heat dissipation fins 120, and the heat dissipation device whose heat dissipation effect meets the requirements may be determined. structure, so as to determine the characteristics of the heat dissipation fins 120 of the structure, and obtain the heat dissipation structure parameters adopted by the characteristics, the steps of which will not be repeated here. Optionally, the heat dissipation structure parameters may include the number of fins of the heat dissipation fins 120 , the pitch of the fins, and the thickness of the fins, and may also include the fin height of the heat dissipation fins 120 . Wherein, the fin thickness may be the dimension data of each heat dissipation fin in its distribution direction, and the fin height may be the dimension data of each heat dissipation fin in a direction perpendicular to the thickness.

The technical features not described in the embodiment of the heat dissipation device can be set according to the conventional selection of the manufacturing process, or can be adaptively selected and set according to the electronic equipment that needs heat dissipation, and will not affect the solution provided by the embodiment of the present application. For example, the heat conduction shell 110 and the heat dissipation fins 120 can be made of the same or different heat conduction materials, and the heat conduction shell 110 and the heat dissipation fins 120 can be made independently and fixedly connected, or they can be made as a whole As another example, the heat dissipation device may be disposed inside the electronic device cover in any feasible manner, which is not limited in this embodiment.

Exemplarily, FIG. 3 is a schematic diagram of a heat dissipation device deployed on a security camera provided in Embodiment 1 of the present application, and FIG. 4 is a schematic diagram of a security camera housing provided with a heat dissipation device provided in Embodiment 1 of the present application. In an example, as shown in FIGS. 3 and 4 , the heat dissipation device provided by the embodiment of the present application may be deployed in a security camera and configured to dissipate heat from the security camera. The housing for the security camera includes a channeled bottom housing and an arched sunshade. The middle shell is the heat dissipation device, which is arranged inside the sunshade and has the same arch shape as the sunshade, so as to increase the area of its heat absorbing surface and heat dissipation surface and the number of heat dissipation fins fixed on it. After the security camera is assembled, 65W of its heat dissipation power of 70W can be fixed on the heat-absorbing surface of the middle cover, so that heat dissipation can be realized through the middle cover. The thermal simulation analysis result of the whole machine shows that the temperature of the device rises by about 30 degrees , to achieve the allowable thermal balance, and the analysis results that the error between the actual measured temperature and the actual measured temperature can be obtained within 3% through thermal simulation analysis.

The embodiment of the present application provides a heat dissipation device, by fixing the heat dissipation device inside the outer cover of the electronic device that needs heat dissipation, the heat dissipation device includes a heat conduction shell and at least one heat dissipation fin, and the heat dissipation fin is fixed on the heat conduction shell close to the device The heat dissipation surface of the outer cover, at the same time, the target heat dissipation device of the electronic device is fixed on the heat absorption surface of the equipment cover of the principle of heat conduction shell, so that the heat conduction shell can transfer heat with the target heat dissipation device through the heat absorption surface, and absorb the heat generated by the target heat dissipation device. At the same time, the heat is transferred through the heat dissipation surface, the heat dissipation fins and the external environment, so that the absorbed heat can be dissipated to the external environment in real time and efficiently through part of the heat dissipation surface and heat dissipation fins, and the structure of the heat dissipation device can be passed through the heat dissipation structure parameters. The determination method is determined to realize the data analysis of heat dissipation effect, improve the heat dissipation performance, development efficiency and reliability of electronic equipment, and save development cost.

Embodiment two

Fig. 5 is a flow chart of a method for determining heat dissipation structure parameters provided in Embodiment 2 of the present application. This embodiment is applicable to the situation where the heat dissipation structure parameters of heat dissipation equipment are determined according to the heat dissipation effect. The structural parameter determination device can be implemented by means of software and/or hardware, and can generally be integrated into computer equipment. Correspondingly, as shown in Figure 5, the method includes:

S210. Acquire the structure parameters of the housing of the electronic device, and determine at least two groups of heat dissipation structure parameters according to the structure parameters of the housing.

The heat dissipation structure parameters are used to describe heat dissipation equipment. The heat dissipation device may be the heat dissipation device provided in the embodiment of the present application, which is arranged inside the outer cover of the electronic device, includes a heat conduction shell and heat dissipation fins, and can dissipate heat from the electronic device through the heat conduction shell and heat dissipation fins, and its structure is here I won't go into details. The electronic device may be any electronic device equipped with a cooling device, for example, it may be a security camera. The housing structure parameter may be data describing the shape of the housing of the electronic device.

Since the cooling device needs to be deployed inside the housing of the electronic device, it is necessary to determine the structural features of the cooling device according to the shape of the housing of the electronic device, and the shape of the housing can be determined by obtaining the structural parameters of the housing of the electronic device. The content of the structural parameters of the housing can be determined according to the shape of the housing, the deployment method of the heat dissipation device, and the content of the heat dissipation structural parameters that need to be determined. For example, it can include the size data of each dimension of the housing, etc., which is not limited here. The method for obtaining the structure parameter of the cover can be determined according to the content of the structure parameter of the cover, and is not limited here.

By acquiring the structural parameters of the electronic device's housing, the structural characteristics of the heat dissipation device deployed on the electronic device can be determined, so as to determine at least two groups of heat dissipation structural parameters that meet the structural characteristics. The heat dissipation structure parameters may include parameters corresponding to features that affect the heat dissipation effect of the heat dissipation device and can be set differently. The content may be preset according to needs, and is not limited here. Optionally, the parameters corresponding to the features that have no effect on the heat dissipation effect of the heat dissipation device or can only be fixed can be preset as fixed values in the heat dissipation structure parameters, or not included in the heat dissipation structure parameters. Do limited.

In an optional embodiment of the present application, the heat dissipation structure parameters may include: number of fins, fin spacing and fin thickness; the determination of at least two groups of heat dissipation structure parameters according to the housing structure parameters may include : Obtain the housing size parameters in the fin distribution direction from the housing structure parameters; acquire the at least two groups of heat dissipation structure parameters according to the housing size parameters, so that all the cooling fins of the heat dissipation device described by each group of heat dissipation structure parameters The sheets are all distributed within the coverage of the outer cover.

The number of fins may be data describing the number of heat dissipation fins in the heat dissipation device. The fin spacing may be data describing the distance between adjacent heat dissipation fins in the distribution direction of the heat dissipation fins. The fin thickness may be data describing the size of each heat dissipation fin in the distribution direction of the heat dissipation fins. The distribution direction of the fins may be a direction parallel to the housing of the electronic equipment, and the cooling fins may be arranged and fixed along this direction. A housing size parameter may be data describing the size of the housing.

The number of fins, the pitch of the fins and the thickness of the fins can all affect the heat dissipation effect of the heat dissipation device. In order to determine the number of fins, fin spacing and fin thickness that can be set, the housing size parameters in the direction of fin distribution can be obtained from the housing structure parameters, then all cooling fins can be distributed within the range of the housing size parameters , can determine at least two groups of fin numbers, fin spacing and fin thickness according to the size parameters of the housing, so that the heat dissipation fins described by the number of fins, fin spacing and fin thickness of each group can be distributed on the cover of the housing within range.

In an optional embodiment of the present application, the heat dissipation structure parameters may also include: fin height; determining at least two groups of heat dissipation structure parameters according to the housing structure parameters may also include: The parameters determine the surface separation distance between the heat dissipation device and the outer cover; determine the fin height in each group of heat dissipation structure parameters according to the surface separation distance, so that all heat dissipation fins described by the fin height are evenly distributed Between the heat dissipation device and the outer cover.

The fin height may be data describing the dimension of each cooling fin in a direction perpendicular to the thickness of the fin. The surface separation distance may be data describing the separation distance between the heat dissipation surface of the heat dissipation device and the inner surface of the housing.

According to the structure parameters of the housing, the shape and size of the housing of the electronic device can be determined, and then the form that the heat dissipation device can be deployed inside the housing can be determined, so as to determine the distance between the heat dissipation surface of the thermally conductive shell of the heat dissipation device and the inner side of the housing. , then the space formed by the distance between the planes can accommodate cooling fins. Therefore, the height characteristics of the heat dissipation fins can be determined according to the distance between surfaces, so that the heat dissipation fins can be distributed between the heat dissipation device and the outer cover.

The heat dissipation structure parameters may also include the fin angle, which is used to describe the angle between the heat dissipation fins fixed on the heat conduction shell of the heat dissipation device and the heat dissipation surface of the heat conduction shell, which can match the height of the fins, so that the fins Each cooling fin described in height may be distributed between the cooling device and the housing at the fin angle.

S220. Generate a target structure model corresponding to each set of heat dissipation structure parameters, according to each set of heat dissipation structure parameters, the heat dissipation device, the housing of the electronic device, and the structure parameters of the housing.

The target structure model may be an image model used for thermal simulation analysis of the heat dissipation effect of the heat dissipation device, and may be used to describe the shape of the heat dissipation device and the electronic device cover when the heat dissipation device is deployed on the electronic device.

The shape of the heat dissipation device can be determined according to the heat dissipation structure parameters and the heat dissipation equipment, and the shape of the electronic equipment cover can be determined according to the structure parameters of the housing and the electronic equipment, so that the shape obtained by deploying the heat dissipation device on the electronic equipment can be determined, and an image describing the shape can be generated model, as the target structure model.

In an optional embodiment of the present application, the target structure corresponding to each set of heat dissipation structure parameters is generated according to each set of heat dissipation structure parameters, the heat dissipation device, the housing of the electronic device, and the structure parameters of the housing The model may include: determining the shape of a structural model according to the heat dissipation device and the housing of the electronic device; performing simplified constraint processing on the shape of the structural model according to each set of heat dissipation structural parameters and the structural parameters of the housing, to obtain the target structure model.

The shape of the structural model may be shape data whose contour direction is the same as the shape of the cooling device deployed on the electronic equipment cover. The simplified constraint processing may be an operation to set the dimensions of the structural model shape.

According to the heat dissipation equipment and the outer cover of the electronic equipment, the outline trend of the target structure model can be determined, and the shape of the structure model can be obtained. The shape of the structure model can be simplified and constrained according to the heat dissipation structure parameters and the structure parameters of the enclosure, so as to obtain the target structure model that satisfies the description of the heat dissipation structure parameters and the enclosure structure parameters, and the target structure model can describe the deployment of heat dissipation equipment described by the heat dissipation structure parameters The shape obtained in the state of the electronic equipment can be used to calculate the heat dissipation structure parameters and the outer cover structure parameters, so as to conduct thermal simulation analysis on the heat dissipation effect of the heat dissipation equipment on the electronic equipment.

Simplify and constrain the shape of the structure model according to the heat dissipation structure parameters and the structure parameters of the cover, and approximate the smaller values in the structure parameters of the cover, so as to simplify the target structure model, for example, its radian and chamfer can be adjusted simplify.

S230. Perform thermal simulation analysis according to each target structure model to obtain heat dissipation effect data.

The thermal simulation analysis may be an operation of obtaining heat at each position of the target structure model. The heat dissipation effect data may be data used to describe the heat dissipation effect of the heat dissipation device on the electronic equipment.

Thermal simulation analysis can be carried out according to the target structure model, then the heat of each position in the target structure model can be obtained, and the heat inside and outside the cover of the electronic device described by the target structure model can be determined according to the heat of each position The distribution of heat, according to the distribution, the heat dissipation effect of the heat dissipation device on the electronic equipment can be determined, and the heat dissipation effect data can be obtained.

In an optional embodiment of the present application, the performing thermal simulation analysis according to each target structure model to obtain heat dissipation effect data may include: performing mesh division processing on each target structure model to obtain multiple grids Grid division area; thermal simulation analysis is carried out according to each grid division area, and the heat distribution image of each target structure model is obtained; the heat variation range of each target structure model is obtained according to the heat distribution image, and the The heat variation range is determined as the heat dissipation effect data.

The meshing process may be an operation of dividing the target structure model into a plurality of graphic regions. The mesh division area may be a plurality of graphic areas of the target structure model after mesh division processing. The heat distribution image may be a graph describing the heat of each position of the target structure model. The heat variation range may be the difference between the highest heat and the lowest heat at each position of the target structure model.

By meshing the target structure model, thermal simulation analysis can be performed on each mesh division area obtained, thereby generating the heat distribution image of the target structure model. The division method of the mesh division process can be determined according to the shape and size of the target structure model, which is not limited here. According to the heat distribution image, the heat of each position of the target structure model can be determined, and the heat variation range can be obtained according to the heat difference between the highest heat position and the lowest heat position. Therefore, the range of heat change can reflect whether the heat in the position that needs to be dissipated in the electronic device is dissipated to the position with lower heat, and the range of heat change can be used as the data of heat dissipation effect. The larger the value, the worse the heat dissipation effect.

S240. According to the heat dissipation effect data corresponding to each target structure model, determine the heat dissipation structure parameter corresponding to the target structure model satisfying the heat dissipation effect condition as the target heat dissipation structure parameter.

The heat dissipation effect condition may be a condition to be satisfied by the heat dissipation effect data corresponding to the heat dissipation effect satisfying the heat dissipation requirement, and may be predetermined as required. The target heat dissipation structure parameter may be a heat dissipation structure parameter adopted by the heat dissipation device whose heat dissipation effect of the electronic device meets the heat dissipation requirement.

The cooling effect condition can be predetermined according to needs, and can be used to filter the cooling effect data. If the heat dissipation effect data of any target structure model satisfies the heat dissipation effect condition, it can be explained that the heat dissipation effect of the heat dissipation device corresponding to the target structure model on the electronic equipment meets the heat dissipation requirements, then the heat dissipation structure parameters adopted by the target structure model are obtained as the target The parameters of the heat dissipation structure, so that the heat dissipation equipment obtained according to the target heat dissipation structure can realize the heat dissipation of the electronic equipment that meets the requirements.

If the current at least two target structure models cannot meet the heat dissipation effect conditions, one or more sets of new heat dissipation structure parameters can be determined by using the method for determining heat dissipation structure parameters provided in the embodiment of the present application, and the corresponding heat dissipation effect data can be obtained, until The target structure model that satisfies the heat dissipation effect conditions is obtained, and the heat dissipation structure parameters adopted by the target structure model are determined as the target heat dissipation structure parameters.

In an optional embodiment of the present application, according to the heat dissipation effect data corresponding to each target structure model, determining the heat dissipation structure parameter corresponding to the target structure model satisfying the heat dissipation effect condition as the target heat dissipation structure parameter may include: The thermal variation ranges of at least two target structure models are compared, and the thermal dissipation structure parameter corresponding to the target structural model with a smaller thermal variation range is determined as the target thermal dissipation structural parameter.

Obtaining and comparing the thermal variation ranges of at least two target structure models can determine the size relationship between the thermal variation ranges of at least two target structural models, and the smaller the thermal variation range, it means that heat dissipation is required in the target structural model The lower the heat at the position and/or the higher the heat at the lowest heat position, it can be explained that the more heat that needs to be dissipated from the heat dissipation position to the lower heat position, the better the heat dissipation effect. Therefore, among the at least two target structure models, the heat dissipation structure parameter corresponding to the target structure model with a smaller thermal variation range is determined as the target heat dissipation structure parameter.

Exemplarily, taking the above-mentioned security sensor equipped with heat dissipation device provided in the embodiment of the present application as an example, FIG. 6 is a schematic diagram of a target structure model of a security camera housing provided with a heat dissipation device provided in Embodiment 2 of the application. As shown in Figure 6, the target structure model is based on the bottom shell of the security sensor, the sunshade cover and the heat dissipation device as the middle cover, by establishing a three-dimensional model and drawing according to the size of each part, including simplifying its radian and chamfering, Make the bottom case a rectangular frame and remove the upper cover, and model the shape of the middle cover, simplify its radian shape, and layout and model the cooling fins, edit the spacing, quantity, and Height, and according to the height of the structure and the size constraints of the production process, the optional different spacing, quantity, and height are arranged and combined to obtain multiple sets of heat dissipation structure parameters. FIG. 7 is a schematic diagram of a software interface for generating a target structure model provided in Embodiment 2 of the present application.

FIG. 8 is a schematic diagram of a software interface for mesh division processing provided by an embodiment of the present application. As shown in Figure 8, after simplification and similarity processing, the mesh division effect of the model can meet the better simulation requirements, the number of mesh units can be 118668, and the maximum mesh ratio is 16. Then thermal simulation analysis can be carried out. For each group of heat dissipation structure models, the method of controlling variables can be used to compare the heat dissipation effect data. FIG. 9 is a schematic cross-sectional view of a thermal simulation analysis provided in Embodiment 2 of the present application, and FIGS. 10-16 are heat distribution diagrams of the target structure model provided in Embodiment 2 of the present application. As shown in Figure 10-16, the change parameters in the heat dissipation structure parameters adopted by the target structure model include 10 fins in the middle and 11 fins on both sides; 11 fins in the middle and 11 fins in both sides; The number of fins is 12, the number of fins on both sides is 11; the number of fins in the middle is 13, the number of fins on both sides is 11; the number of fins in the middle is 11, the number of fins on both sides is 10; the number of fins in the middle is 11, and the number of fins on both sides is 12; The number of fins in the middle is 11, and the number of fins on both sides is 13. Table 1 is the recorded data of the thermal simulation analysis provided by the embodiment of the present application. As shown in Table 1, by comparing and considering the characteristics of the manufacturing process, the height of the middle fin is 20mm, the number of fins is 11, the fin spacing is 7mm, and the fins on both sides are When the fin height is 10mm, the number of fins is 11, and the fin spacing is 7.4mm, the heat dissipation effect is better.

Table 1

The embodiment of the present application provides a method for determining heat dissipation structure parameters. By obtaining the structure parameters of the outer cover of the electronic device, and determining at least two groups of heat dissipation structure parameters according to the structure parameters of the outer cover, according to each group of heat dissipation structure parameters, heat dissipation equipment, and the outer cover of the electronic device and the structure parameters of the outer cover to generate the target structure model, conduct thermal simulation analysis according to each target structure model, and obtain the heat dissipation effect data, and according to the heat dissipation effect data corresponding to each target structure model, the heat dissipation corresponding to the target structure model that meets the heat dissipation effect conditions The structural parameters are determined as the target heat dissipation structural parameters, and the heat dissipation structural parameters of the heat dissipation equipment can be determined through the data analysis of the heat dissipation effect, so that the heat generated by the absorbed electronic equipment can be dissipated to the external environment in real time and efficiently, and the heat dissipation performance of the electronic equipment can be improved. Development efficiency and reliability, saving development costs.

Embodiment three

Fig. 17 is a schematic structural diagram of a heat dissipation structure parameter determination device provided in Embodiment 3 of the present application. As shown in Fig. 17, the device includes: a parameter acquisition module 310, a model generation module 320, a simulation analysis module 330 and a parameter determination module 340.

The parameter acquisition module 310 is configured to acquire the structural parameters of the housing of the electronic device, and determine at least two groups of heat dissipation structural parameters according to the structural parameters of the housing; wherein the structural parameters of the heat dissipation are used for the heat dissipation device described.

The model generating module 320 is configured to generate a target structure model corresponding to each set of heat dissipation structural parameters, according to each set of heat dissipation structural parameters, the heat dissipation device, the housing of the electronic device, and the structural parameters of the housing.

The simulation analysis module 330 is configured to perform thermal simulation analysis according to each target structure model to obtain heat dissipation effect data.

The parameter determination module 340 is configured to determine, according to the heat dissipation effect data corresponding to each target structure model, the heat dissipation structure parameter corresponding to the target structure model satisfying the heat dissipation effect condition as the target heat dissipation structure parameter.

In an optional implementation of the embodiment of the present application, the heat dissipation structure parameters may include: the number of fins, the spacing between fins and the thickness of fins; the parameter acquisition module 310 is configured to: acquire from the structure parameters of the housing The size parameter of the outer cover in the fin distribution direction; the at least two sets of heat dissipation structure parameters are obtained according to the size parameters of the outer cover, so that all the heat dissipation fins of the heat dissipation device described by each set of heat dissipation structure parameters are distributed on the cover of the outer cover within range.

In an optional implementation manner of the embodiment of the present application, the heat dissipation structure parameters may also include: fin height; the parameter acquisition module 310 is further configured to: determine the heat dissipation device and the The surface separation distance between the outer covers; the fin height in each group of heat dissipation structure parameters is determined according to the surface separation distance, so that all the heat dissipation fins described by the fin height are distributed between the heat dissipation device and the outer cover between.

In an optional implementation of the embodiment of the present application, the model generation module 320 is configured to: determine the shape of the structural model according to the heat dissipation device and the housing of the electronic device; Structural parameters perform simplified constraint processing on the shape of the structural model to obtain the target structural model.

In an optional implementation of the embodiment of the present application, the simulation analysis module 330 is configured to: perform grid division processing on each target structure model to obtain multiple grid division areas; divide each grid area according to Perform thermal simulation analysis to obtain a heat distribution image of each target structure model; obtain the heat variation range of each target structure model according to the heat distribution image, and determine the heat variation range as the heat dissipation effect data .

In an optional implementation of the embodiment of the present application, the parameter determination module 340 is configured to: compare the heat variation ranges of at least two target structure models, and compare the heat dissipation structure corresponding to the target structure model with a smaller heat variation range The parameters are determined as the target heat dissipation structure parameters.

The above-mentioned device can execute the method for determining heat dissipation structure parameters provided in any embodiment of the present application, and has corresponding functional modules and effects for performing the method for determining heat dissipation structure parameters.

The embodiment of the present application provides a device for determining heat dissipation structure parameters. By obtaining the structure parameters of the outer cover of the electronic equipment, and determining at least two sets of heat dissipation structure parameters according to the structure parameters of the outer cover, according to each set of heat dissipation structure parameters, heat dissipation equipment, and the outer cover of the electronic equipment and the structure parameters of the outer cover to generate the target structure model, conduct thermal simulation analysis according to each target structure model, and obtain the heat dissipation effect data, and according to the heat dissipation effect data corresponding to each target structure model, the heat dissipation corresponding to the target structure model that meets the heat dissipation effect conditions The structural parameters are determined as the target heat dissipation structural parameters, and the heat dissipation structural parameters of the heat dissipation equipment can be determined through the data analysis of the heat dissipation effect, so that the heat generated by the absorbed electronic equipment can be dissipated to the external environment in real time and efficiently, and the heat dissipation performance of the electronic equipment can be improved. Development efficiency and reliability, saving development costs.

Embodiment Four

FIG. 18 is a schematic structural diagram of a computer device provided in Embodiment 4 of the present application. FIG. 18 shows a block diagram of an exemplary computer device 12 suitable for implementing embodiments of the present application. The computer device 12 shown in FIG. 18 is only an example, and should not limit the functions and scope of use of this embodiment of the present application.

As shown in FIG. 18, computer device 12 takes the form of a general-purpose computing device. Components of computer device 12 may include, but are not limited to, one or more processors 16, memory 28, bus 18 connecting various system components including memory 28 and processor 16.

Bus 18 represents one or more of several types of bus structures, including a memory bus or memory controller, a peripheral bus, an accelerated graphics port, a processor, or a local bus using any of a variety of bus structures. For example, these architectures include but are not limited to Industry Standard Architecture (Industry Standard Architecture, ISA) bus, Micro Channel Architecture (Micro Channel Architecture, MAC) bus, Enhanced ISA bus, Video Electronics Standards Association (Video Electronics Standards Association, VESA) local bus and peripheral component interconnect (Peripheral Component Interconnect, PCI) bus.

Computer device 12 includes a variety of computer system readable media. These media can be any available media that can be accessed by computer device 12 and include both volatile and nonvolatile media, removable and non-removable media.

Memory 28 may include computer system readable media in the form of volatile memory, such as Random Access Memory (RAM) 30 and/or cache memory 32 . Computer device 12 may include other removable/non-removable, volatile/nonvolatile computer system storage media. By way of example only, storage system 34 may be used to read and write to non-removable, non-volatile magnetic media (not shown in FIG. 18, commonly referred to as a "hard drive"). Although not shown in FIG. 18, a disk drive for reading and writing to a removable non-volatile disk (such as a "floppy disk") may be provided, as well as a disk drive for a removable non-volatile disk (such as a Compact Disk ROM (Compact Disk). Disc Read-Only Memory, CD-ROM), Digital Versatile Disc Read-Only Memory (DVD-ROM) or other optical media) CD-ROM drive. In these cases, each drive may be connected to bus 18 via one or more data media interfaces. The memory 28 may include at least one program product having a set (eg, at least one) of program modules configured to perform the functions of the embodiments of the present application.

A program/utility 40 having a set (at least one) of program modules 42 may be stored, for example, in memory 28, such program modules 42 including but not limited to an operating system, one or more application programs, other program modules, and program data , each or a combination of these examples may include implementations of network environments. The program modules 42 generally perform the functions and/or methods of the embodiments described herein.

The computer device 12 may also communicate with one or more external devices 14 (e.g., a keyboard, pointing device, display 24, etc.), and with one or more devices that enable a user to interact with the computer device 12, and/or with Any device (eg, network card, modem, etc.) that enables the computing device 12 to communicate with one or more other computing devices. Such communication may occur through input/output (I/O) interface 22 . Moreover, the computer device 12 can also communicate with one or more networks (such as a local area network (Local Area Network, LAN), a wide area network (Wide Area Network, WAN) and/or a public network, such as the Internet) through the network adapter 20. As shown, network adapter 20 communicates with other modules of computer device 12 via bus 18 . It should be appreciated that although not shown in FIG. 18 , other hardware and/or software modules may be used in conjunction with computer device 12, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, independent disk redundant Arrays (Redundant Arrays of Independent Disks,) RAID systems, tape drives, and data backup storage systems, etc.

The processor 16 executes a variety of functional applications and data processing by running the program stored in the memory 28, and realizes the method for determining the heat dissipation structure parameters provided in the embodiment of the present application: obtain the structure parameters of the electronic device's cover, and according to the cover Structural parameters determine at least two groups of heat dissipation structural parameters; wherein, the heat dissipation structural parameters are used to describe the heat dissipation equipment; according to each group of heat dissipation structural parameters, the heat dissipation equipment, the housing of the electronic device, and the structural parameters of the housing, generate The target structure model corresponding to each group of heat dissipation structure parameters; thermal simulation analysis is performed according to each target structure model to obtain heat dissipation effect data; according to the heat dissipation effect data corresponding to each target structure model, the target structure model that satisfies the heat dissipation effect condition The corresponding heat dissipation structure parameters are determined as target heat dissipation structure parameters.

Embodiment five

Embodiment 5 of the present application provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the method for determining the parameters of the heat dissipation structure provided in the embodiment of the present application is realized: obtaining the housing structure of the electronic device parameters, and determine at least two groups of heat dissipation structure parameters according to the structure parameters of the housing; wherein, the heat dissipation structure parameters are used for the heat dissipation equipment described; according to each group of heat dissipation structure parameters, the heat dissipation equipment, the housing of the electronic equipment and The structure parameters of the outer cover are used to generate a target structure model corresponding to each group of heat dissipation structure parameters; thermal simulation analysis is performed according to each target structure model to obtain heat dissipation effect data; according to the heat dissipation effect data corresponding to each target structure model, it will satisfy The heat dissipation structure parameters corresponding to the target structure model of the heat dissipation effect condition are determined as the target heat dissipation structure parameters.

Any combination of one or more computer readable medium(s) may be utilized. The computer readable medium may be a computer readable signal medium or a computer readable storage medium. A computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or device, or any combination thereof. Examples (non-exhaustive list) of computer readable storage media include: electrical connection with one or more conductors, portable computer disk, hard disk, RAM, ROM, Erasable Programmable Read-Only Memory (Erasable Programmable Read-Only Memory) Memory, EPROM or flash memory), optical fiber, CD-ROM, optical storage device, magnetic storage device, or any suitable combination of the above. In this document, a computer-readable storage medium may be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

A computer readable signal medium may include a data signal carrying computer readable program code in baseband or as part of a carrier wave. Such propagated data signals may take many forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the foregoing. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device. .

The program code contained on the computer readable medium may be transmitted by any appropriate medium, including but not limited to wireless, wire, optical cable, radio frequency (Radio Frequency, RF), etc., or any suitable combination of the above.

Computer program codes for performing the operations of the present application may be written in one or more programming languages or combinations thereof, including object-oriented programming languages such as Java, Smalltalk, C++, and conventional Procedural Programming Language - such as "C" or a similar programming language. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer or entirely on the remote computer or computing device. Where a remote computer is involved, the remote computer can be connected to the user computer through any kind of network, including a LAN or WAN, or it can be connected to an external computer (for example via the Internet using an Internet service provider).

Claims (10)

1. A heat dissipation device, which is arranged inside the outer cover of the electronic device, includes: a thermally conductive shell and at least one heat dissipation fin; wherein,

   The heat-conducting shell includes a heat-dissipating surface and a heat-absorbing surface, wherein the side of the heat-conducting shell close to the outer cover is the heat-dissipating surface, and the heat-dissipating surface is configured to fix the at least one heat-dissipating fin and communicate with the at least one heat-dissipating fin. The at least one cooling fin and the external environment conduct heat transfer; the side of the heat-conducting shell away from the outer cover is the heat-absorbing surface, and the heat-absorbing surface is configured to fix the target heat-dissipating device of the electronic device and communicate with it The target heat dissipation device performs heat transfer;

   The at least one heat dissipation fin is fixed on the heat dissipation surface according to the heat dissipation structure parameters, and is configured to conduct heat transfer with the heat conductive shell and the external environment.
2. A method for determining heat dissipation structure parameters, used for determining the heat dissipation structure parameters of the heat dissipation device according to claim 1, comprising:

   Obtaining structural parameters of the housing of the electronic device, and determining at least two groups of heat dissipation structural parameters according to the structural parameters of the housing; wherein, the structural parameters of heat dissipation are used to describe the heat dissipation device;

   Generate a target structure model corresponding to each set of heat dissipation structure parameters according to each set of heat dissipation structure parameters, the heat dissipation device, the housing of the electronic device, and the structure parameters of the housing;

   Conduct thermal simulation analysis according to each target structure model to obtain heat dissipation effect data;

   According to the heat dissipation effect data corresponding to each target structure model, the heat dissipation structure parameter corresponding to the target structure model satisfying the heat dissipation effect condition is determined as the target heat dissipation structure parameter.
3. The method according to claim 2, wherein the heat dissipation structure parameters include: the number of fins, the pitch between fins and the thickness of fins;

   The determining at least two groups of heat dissipation structural parameters according to the structural parameters of the housing includes:

   Obtaining the size parameters of the cover in the direction of fin distribution from the structure parameters of the cover;

   The at least two groups of heat dissipation structure parameters are obtained according to the size parameters of the housing, so that all the heat dissipation fins of the heat dissipation device described by each group of heat dissipation structure parameters are distributed within the coverage of the housing.
4. The method according to claim 3, wherein the heat dissipation structure parameters further include: fin height;

   The determining at least two groups of heat dissipation structural parameters according to the structural parameters of the housing also includes:

   determining the surface separation distance between the heat dissipation device and the outer cover according to the structural parameters of the outer cover;

   The fin height in each group of heat dissipation structural parameters is determined according to the surface separation distance, so that all heat dissipation fins described by the fin height are distributed between the heat dissipation device and the outer cover.
5. The method according to claim 2, wherein the target structure corresponding to each group of heat dissipation structure parameters is generated according to each group of heat dissipation structure parameters, the heat dissipation device, the housing of the electronic device, and the housing structure parameters models, including:

   determining the shape of the structural model according to the heat dissipation device and the housing of the electronic device;

   Simplifying and constraining the shape of the structural model according to each set of heat dissipation structural parameters and the structural parameters of the housing to obtain the target structural model.
6. The method according to claim 2, wherein said performing thermal simulation analysis according to each target structure model to obtain heat dissipation effect data, comprising:

   performing meshing processing on each target structure model to obtain a plurality of meshing regions;

   performing thermal simulation analysis according to each grid division area to obtain a heat distribution image of each target structure model;

   The heat variation range of each target structure model is acquired according to the heat distribution image, and the heat variation range is determined as the heat dissipation effect data.
7. The method according to claim 6, wherein, according to the heat dissipation effect data corresponding to each target structure model, determining the heat dissipation structure parameter corresponding to the target structure model satisfying the heat dissipation effect condition as the target heat dissipation structure parameter includes:

   The thermal variation ranges of at least two target structure models are compared, and the thermal dissipation structure parameter corresponding to the target structural model with the smallest thermal variation range is determined as the target thermal dissipation structural parameter.
8. A device for determining heat dissipation structure parameters, comprising:

   The parameter acquisition module is configured to acquire the structure parameters of the housing of the electronic device, and determine at least two groups of heat dissipation structure parameters according to the structure parameters of the housing; wherein, the heat dissipation structure parameters are used to describe the heat dissipation device;

   The model generating module is configured to generate a target structure model corresponding to each group of heat dissipation structure parameters according to each group of heat dissipation structure parameters, the heat dissipation device, the housing of the electronic device, and the structure parameters of the housing;

   The simulation analysis module is set to perform thermal simulation analysis according to each target structure model to obtain heat dissipation effect data;

   The parameter determination module is configured to determine the heat dissipation structure parameters corresponding to the target structure models satisfying the heat dissipation effect conditions as the target heat dissipation structure parameters according to the heat dissipation effect data corresponding to each target structure model.
9. A computer device comprising:

   at least one processor;

   a storage device configured to store at least one program;

   When the at least one program is executed by the at least one processor, the at least one processor is made to implement the method for determining heat dissipation structure parameters according to any one of claims 2-7.
10. A computer storage medium storing a computer program, wherein when the program is executed by a processor, the method for determining heat dissipation structure parameters according to any one of claims 2-7 is implemented.

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