WO2023050506A1 - 一种高频三电平dcdc变流器模块及装配方法 - Google Patents

一种高频三电平dcdc变流器模块及装配方法 Download PDF

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Publication number
WO2023050506A1
WO2023050506A1 PCT/CN2021/126441 CN2021126441W WO2023050506A1 WO 2023050506 A1 WO2023050506 A1 WO 2023050506A1 CN 2021126441 W CN2021126441 W CN 2021126441W WO 2023050506 A1 WO2023050506 A1 WO 2023050506A1
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WO
WIPO (PCT)
Prior art keywords
capacitor
converter module
frequency
capacitor unit
dcdc converter
Prior art date
Application number
PCT/CN2021/126441
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English (en)
French (fr)
Inventor
饶沛南
周帅
宋森
易滔
赵清良
耿志东
谢伟
颜旭
杨浩
张云瀚
Original Assignee
株洲中车时代电气股份有限公司
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Publication of WO2023050506A1 publication Critical patent/WO2023050506A1/zh

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00—Details of apparatus for conversion
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M3/00—Conversion of dc power input into dc power output
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure

Definitions

  • the present application relates to the technical field of auxiliary converters, in particular to a high-frequency three-level DCDC converter module and an assembly method.
  • auxiliary converters as an important power supply unit for trains, have been continuously upgraded, and the original bulky converters have gradually been replaced by small and efficient converters.
  • researchers have adopted various methods such as new materials, new devices, and new circuit topology combinations to achieve the goal of high power density of the auxiliary converter.
  • this application proposes a high-frequency three-level DCDC converter module and an assembly method, and designs the structural layout of the converter module to realize modular assembly of functional units and improve Assembly efficiency.
  • the present application proposes a high-frequency three-level DCDC converter module, which includes a radiator, and semiconductor devices are installed on the surface of the radiator, and are sequentially arranged in a direction perpendicular to and away from the surface where the semiconductor devices are located.
  • Composite busbars, capacitor components and control components are provided;
  • the composite busbar is covered above the semiconductor device, and the capacitor component includes a capacitor bracket for installing capacitors, the bottom of the capacitor bracket is fixed to the heat sink and the top supports the control component.
  • the capacitor assembly includes a chopping capacitor unit and an LLC capacitor unit arranged adjacently, and the chopping capacitor unit and the LLC capacitor unit are both included in a plane perpendicular to the surface of the heat sink A plurality of capacitors are evenly distributed, and the capacitors are electrically connected to the composite busbar.
  • the composite busbar is a bent structure, which includes a first part covering above the semiconductor device and a bent second part located outside the chopper capacitor unit, the first part and The second part is electrically connected to the LLC capacitor unit and the chopper capacitor unit respectively.
  • the positive and negative poles of the capacitors in the chopping capacitor unit are located at the same end, and the electrode ends where the positive and negative poles of the plurality of capacitors of the chopping capacitor unit are facing the same direction and toward the second part.
  • the capacitor bracket includes a first capacitor bracket corresponding to the chopper capacitor unit, the first capacitor bracket includes two oppositely arranged support parts, and the support parts include two pillars and set a support plate between the two pillars, the bottom of the pillar is fixed to the radiator;
  • the capacitor in the chopping capacitor unit is clamped between the two supporting plates.
  • the electrode end where the positive and negative poles of the capacitor in the chopping capacitor unit are located is accommodated in the installation opening on one of the support plates, and the other end is connected to the other end of the support plate by bolts. screw holes.
  • the installation opening has a limiting structure that prevents the electrode end from slipping out of the installation opening, the limiting structure is a stepped structure along the inner side of the installation opening, and the electrode end abuts against the installation opening.
  • the stepped structure is a stepped structure along the inner side of the installation opening, and the electrode end abuts against the installation opening.
  • the capacitor bracket includes a second capacitor bracket corresponding to the LLC capacitor unit, the second capacitor bracket includes two support beams up and down, and the capacitor in the LLC capacitor unit is clamped in a lying posture.
  • the first part of the composite busbar is held between the two supporting beams and its two ends are respectively connected to the composite busbar through copper bars.
  • the circumferential outermost surface of the capacitor in the LLC capacitor unit has a flexible buffer layer, and the buffer layer can be deformed to realize that the capacitor in the LLC capacitor unit is placed on the second capacitor support. fine-tuning of the assembly position on the
  • the heat sink has a heat dissipation structure on the surface opposite to the surface where the semiconductor device is located, and the heat dissipation structure includes a plurality of needle-shaped heat dissipation fins.
  • the heat dissipation structure has a dense area where the heat dissipation fins are densely distributed and a sparse area where the heat dissipation fins are sparsely distributed;
  • the dense area and the sparse area correspond to a relatively high heat generation area and a relatively low heat generation area; and/or the sparse area is close to the cooling medium input port, and the dense area is far away from the cooling medium input port.
  • control assembly includes a mounting board and a control unit disposed on the mounting board, the mounting board is fixed on the top of the capacitor bracket, and the control unit is electrically connected to the semiconductor device.
  • it further includes a sliding part arranged on the side of the converter module, the two ends of the sliding part are respectively fixed to the edge of the radiator and the control assembly, and the outer surface thereof is a smooth plane.
  • the composite busbar has a connection hole for connecting the heat sink, and the connection hole can be matched with a fastener to fix the heat sink.
  • the present application proposes an assembly method applied to the above-mentioned converter module, including the following steps:
  • the steps before step S40, the steps also include:
  • step S40 the step further includes:
  • the high-frequency three-level DCDC converter module and assembly method provided by the present application have at least the following beneficial effects:
  • a high-frequency three-level DCDC converter module and assembly method of the present application adopts a layered layout structure that is sequentially superimposed along the direction perpendicular to the surface of the radiator. Different functional units are distributed on different levels, with clear layers. Interference between each other is reduced; and the modularization of functional units can be realized, which greatly improves the success rate of one-time assembly, facilitates the operation of the production line, and improves production efficiency.
  • Fig. 1 shows the overall structure schematic diagram of the converter module of the present application
  • Fig. 2 has shown the structure diagram of the compound busbar of the converter module of the present application
  • Fig. 3 has shown the structure diagram of the chopper capacitor unit of the converter module of the present application
  • Fig. 4 shows the structural representation of the LLC capacitor unit of the converter module of the present application
  • FIG. 5 shows a schematic structural view of the side where the heat dissipation structure of the radiator of the converter module of the present application is located;
  • FIG. 6 shows a schematic structural view of the side where the semiconductor device of the radiator of the converter module of the present application is located
  • Fig. 7 shows a schematic structural diagram of the sliding parts of the converter module of the present application.
  • the embodiment of the present application provides a high-frequency three-level DCDC converter module, including a radiator 10, and a semiconductor device 12 is installed on the surface of the radiator 10, and is arranged in sequence along a direction vertical and away from the surface where the semiconductor device 12 is located There are composite busbars 20, capacitor components 30 and control components 40;
  • the composite busbar 20 covers the semiconductor device 12 , the capacitor assembly 30 includes a capacitor support 31 for mounting the capacitor 32 , the bottom of the capacitor support 31 is fixed to the radiator 10 and the top supports the control assembly 40 .
  • the DCDC converter module of the present application adopts a multi-layer stacked layout structure and is assembled with this structure.
  • the heat sink 10 is used as the base of the module assembly structure, and a plurality of semiconductor devices 12 are evenly distributed on the surface of the heat sink 10.
  • the composite busbar 20 covers the semiconductor devices 12, and the capacitor assembly 30 is located above the composite busbar 20 as a whole.
  • the bottom of the capacitor bracket 31 of the component 30 is staggered from the composite busbar 20 and fixed to the radiator 10.
  • the top of the capacitor 32 is supported and fixedly connected to the control component 40.
  • the capacitor 32 of the capacitor component 30 is installed on the capacitor bracket 31 and located on the composite busbar 20. and the area between the control assembly 40.
  • a multi-layer stacked layout structure in which the control component 40 , the capacitor component 30 , the composite busbar 20 , the semiconductor device 12 and the heat sink 10 are stacked in sequence is formed.
  • the DCDC converter module of the present application adopts a layered layout structure stacked in sequence along the direction perpendicular to the surface of the radiator 10, each layer structure includes only one corresponding functional unit, and different functional units are distributed On different levels, the levels are clear, the mutual interference is reduced, and the modularization of functional units can be realized.
  • you only need to assemble the functional sub-modules corresponding to the corresponding functional units in sequence according to the superposition sequence of the layered structure which greatly improves the one-time assembly success rate, facilitates production line operation, improves production efficiency, and eliminates the The difficulty of assembly caused by the change of personnel is convenient for subsequent installation, disassembly and maintenance.
  • the capacitor assembly 30 includes a chopper capacitor unit 310 and an LLC capacitor unit 320 arranged adjacently. A plurality of capacitors 32 , the capacitors 32 are electrically connected to the composite busbar 20 .
  • the capacitor assembly 30 includes chopper capacitor units 310 and LLC capacitor units 320 adjacent to the left and right on the same level. Since the space in the plane corresponding to the surface of the radiator 10 is limited, The capacitors 32 in the chopping capacitor unit 310 and the LLC capacitor unit 320 are arranged to be evenly distributed in a plane perpendicular to the surface of the radiator 10; There is a multi-layer structure in the plane of the surface of the heat sink 10 , and each layer structure also includes a plurality of capacitors 32 , so as to expand the assembly space in a direction perpendicular to the surface of the heat sink 10 .
  • the chopper capacitor unit 310 and the LLC capacitor unit 320 in the capacitor assembly 30 adopt a left-right layout, and a plurality of capacitors 32 of the corresponding capacitor unit are combined with a left-right layout and a top-bottom layout, thereby improving the utilization rate of the space as a whole and making the module layout
  • the structure is more reasonable and compact, and the miniaturization of the module is realized.
  • the capacitors 32 in the chopper capacitor unit 310 and the LLC capacitor unit 320 are all columnar structures, and their electrodes are usually located at the ends of the columnar structures. In terms of layout, for the convenience of connection, the capacitor 32 is placed horizontally relative to the radiator 10 , that is, the axis of the capacitor 32 is parallel to the surface of the radiator 10 .
  • the composite busbar 20 is a bent structure, which includes a first part 21 covering the semiconductor device 12 and a second part 22 outside the chopper capacitor unit 310 after being bent, the first part 21 and the second The part 22 is electrically connected to the LLC capacitor unit 320 and the chopper capacitor unit 310 respectively.
  • the composite busbar 20 includes a first part 21 and a second part 22 that are relatively bent, and the first part 21 covers the semiconductor device 12 and electrically connects the semiconductor device 12 and the LLC capacitor unit
  • the capacitor 32 in 320; the second part 22 is located outside the chopper capacitor unit 310 after being bent relative to the first part 21 (that is, the side of the entire converter module), and the capacitor 32 in the chopper capacitor unit 310 can be directly connected to the second Part 22.
  • bus bar structure is arranged in this way is to facilitate the connection with the capacitor assembly 30 , especially for the multiple capacitors 32 in the chopping capacitor unit 310 that have a multi-layer structure in a plane perpendicular to the surface of the heat sink 10 .
  • the positive and negative poles of the capacitors 32 in the chopping capacitor unit 310 are located at the same end, and the electrode ends where the positive and negative poles of the multiple capacitors 32 of the chopping capacitor unit 310 are facing the same direction and facing the second part 22 .
  • the electrode end where the positive and negative poles of the capacitor 32 in the chopper capacitor unit 310 are located faces the second part 22 of the composite busbar 20, and when the converter module is assembled , the electrode terminal of the capacitor 32 in the chopper capacitor unit 310 can directly contact and electrically connect the second part 22 of the composite busbar 20, so that the direct connection eliminates the intermediate electrical connection structure and shortens the circuit.
  • the electrode structure of the capacitor 32 in the LLC capacitor unit 320 is different from the capacitor 32 of the chopper capacitor unit 310, and the capacitors 32 in the LLC capacitor unit 320 are respectively located at both ends, which is why the capacitor 32 in the LLC capacitor unit 320 A lying posture relative to the first part 21 of the composite busbar 20 should be adopted, so as to facilitate the connection of the positive and negative electrodes at both ends to the composite busbar 20 .
  • an additional copper bar 321 is required to extend from the end of the capacitor 32 in the LLC capacitor unit 320 to the first portion 21 of the composite bus bar 20 , so as to be electrically connected to each other.
  • the capacitor bracket 31 includes a first capacitor bracket 311 corresponding to the chopper capacitor unit 310, the first capacitor bracket 311 includes two oppositely arranged support portions, the support portion includes two pillars 3111 and two pillars 3111 are arranged Between the support plate 3112, the bottom of the pillar 3111 is fixed to the radiator 10;
  • the capacitor 32 in the chopper capacitor unit 310 is sandwiched between two support plates 3112 .
  • the capacitor 32 of the chopper capacitor unit 310 is actually clamped between the two supports of the first capacitor bracket 311, that is, it is clamped between the two supports. Between the two support plates 3112 of the section.
  • the purpose of such setting is to adjust the distance between the two supporting parts according to the size of the capacitor 32 when assembling the chopper capacitor unit 310 sub-module before the overall assembly of the converter module, so as to match the capacitor of the corresponding size 32.
  • the bottom of the pillar 3111 staggers the semiconductor device 12 and the composite busbar 20 and is fixedly connected to the mounting holes on the edge of the radiator 10. There may be multiple mounting holes on the edge of the radiator 10 and there may be different distances between two adjacent mounting holes. In this way, several common capacitors 32 of different sizes are matched.
  • the number of capacitors in the LLC capacitor unit 320 in the converter module is generally small, and usually its capacitors will only form a single-layer distribution structure in a plane perpendicular to the surface of the heat sink 10, that is, all capacitors are distributed in the surrounding In the same horizontal plane as shown in Figure 1.
  • the capacitor 32 of the LLC capacitor unit 320 may have the same multi-layer distribution structure as the capacitor 32 of the chopper capacitor unit 310 .
  • the positive poles or negative poles of all capacitors 32 of the chopper capacitor unit 310 are located on the same side, so the connection between the electrodes of the capacitors 32 and the composite busbar 20 is still achieved by setting copper bars 321 at both ends. electrical connection.
  • the positive and negative poles of the capacitor 32 in the chopper capacitor unit 310 are accommodated in the installation opening 3113 on one of the support plates 3112, and the other end is connected to the other support plate 3112 by bolts 3115 screw holes.
  • the electrode end of the capacitor 32 in the chopper capacitor unit 310 corresponds to an installation port 3113 on a support plate 3112, and the positive and negative electrodes on the power supply terminal of the installation port 3113 are electrically connected Composite busbar 20; and the other end of the capacitor 32 in the chopper capacitor unit 310 is connected to the screw hole of another support plate 3112 through a bolt 3115, so that the position of the capacitor 32 along its axial direction can be slightly adjusted by the cooperation of the screw hole of the bolt 3115
  • the matching structure of the screw hole of the bolt 3115 can also be replaced by the matching structure of the bolt 3115, the through hole plus a nut.
  • the installation opening 3113 has a limiting structure that prevents the electrode terminal from falling out of the installation opening 3113.
  • the limiting structure is a stepped structure along the inner side of the installation opening 3113, and the electrode terminal abuts against the stepped structure.
  • the limit structure is to open a ring groove on the inner surface of the support plate 3112 along the edge of the installation port 3113, the ring groove forms a stepped structure relative to the edge of the installation port 3113, and the end of the capacitor 32 abuts against the stepped structure , actually the end of the capacitor 32 fits in the ring groove, and the diameter of the installation opening 3113 is actually smaller than the diameter of the end of the capacitor 32 .
  • the capacitor bracket 31 includes a second capacitor bracket 312 corresponding to the LLC capacitor unit 320, the second capacitor bracket 312 includes two support beams up and down, and the capacitor 32 in the LLC capacitor unit 320 is clamped in a lying posture.
  • the first part 21 of the composite busbar 20 is connected between the two supporting beams and at both ends thereof through copper bars 321 .
  • the chopper capacitor unit 310 and the LLC capacitor unit 320 respectively correspond to a separate capacitor bracket 31 . Since the positive and negative poles of the capacitor 32 of the LLC capacitor unit 320 are respectively located at both ends, and are respectively connected to the composite busbar 20 through the copper row 321, the connection structure itself with the composite busbar 20 has certain stability, and its corresponding first
  • the second capacitor bracket 312 can only be clamped between the upper and lower support beams at the middle of the capacitor supporting the LLC capacitor unit 320 , that is, the middle of the second capacitor bracket 312 , as shown in FIGS. 1 and 4 .
  • the outermost surface of the circumference of the capacitor 32 in the LLC capacitor unit 320 has a flexible buffer layer, and the buffer layer can be deformed to realize the fine adjustment of the assembly position of the capacitor 32 in the LLC capacitor unit 320 on the second capacitor bracket 312 .
  • the heat sink 10 has a heat dissipation structure 11 on the surface opposite to the surface where the semiconductor device 12 is located, and the heat dissipation structure 11 includes a plurality of needle-shaped heat dissipation fins.
  • the heat dissipation structure 11 has a dense area 112 where the heat dissipation fins are densely distributed and a sparse area 111 where the heat dissipation fins are sparsely distributed;
  • the dense area 112 and the sparse area 111 respectively correspond to a relatively high heat generation area and a relatively low heat generation area; and/or the sparse area 111 is close to the cooling medium input port, and the dense area 112 is far away from the cooling medium input port.
  • the heat sink 10 realizes the heat dissipation of the module through the heat exchange between the heat dissipation fins and the cooling medium.
  • the heat generation of the module it is respectively set for the relatively high heat generation area and the relatively low heat generation area
  • the dense area 112 and the sparse area 111 are designed to dissipate heat in a targeted manner to improve heat dissipation efficiency.
  • the dense area 112 and the sparse area 111 can be alternately distributed, but in general, the sparse area 111 is close to the cooling medium input port, and the dense area 112 is far away from the cooling medium input port, because the temperature of the cooling medium near the cooling medium input port The lowest heat transfer temperature difference is the largest.
  • the heat dissipation fins are relatively sparse and can meet the heat dissipation requirements.
  • the cooling medium away from the cooling medium input port has already carried out a certain degree of heat exchange, its temperature has increased, and the temperature difference of heat exchange has decreased. It is necessary to increase the heat exchange area to ensure the heat dissipation effect, so the heat dissipation fins are set For intensive, to increase the heat transfer area.
  • control assembly 40 includes a mounting board 41 and a control unit 42 disposed on the mounting board 41 , the mounting board 41 is fixed on the top of the capacitor bracket 31 , and the control unit 42 is electrically connected to the semiconductor device 12 .
  • the mounting plate 41 is fixed on the top of the capacitor bracket 31, which can be fixedly connected to the two capacitor brackets 31 corresponding to the chopper capacitor unit 310 and the LLC capacitor unit 320 at the same time, or can only be fixed
  • the first capacitor bracket 311 corresponding to the chopper capacitor unit 310 is connected.
  • the mounting plate 41 is fixedly connected to the top of the support plate 3112 of the first capacitor bracket 311, and the top of the support plate 3112 is bent to form a connecting portion.
  • the connecting portion has a connection hole, and the mounting plate 41 is provided with The bolts are inserted into the connecting holes to realize fixed connection.
  • the control unit 42 of the converter module is closer to each functional unit inside the module, its electrical connection line is shorter, and its anti-interference performance is strong.
  • the two side edges of the mounting plate 41 are bent to the same side to form a positioning part, and there is a gap for positioning on the positioning part; when assembling, the top of the support plate 3112 is correspondingly snapped into the gap to realize the positioning of the mounting plate. 41, and then the bolts of the mounting plate 41 can be accurately inserted into the corresponding connection holes at the top of the support plate 3112.
  • a handle 3114 is connected between the tops of the pillars 3111 corresponding to the two supporting parts of the first capacitor bracket 311 , and the handle 3114 is convenient for personnel to carry the converter module.
  • the converter module of the present application is provided with a side plate 50 on the other side relative to the side where the second part 22 of the composite busbar 20 is located, and the side plate 50 is also supported on the radiator 10 and the control panel.
  • a certain supporting function is provided between the components 40 .
  • the side plate 50 is also provided with a plurality of cooling holes to enhance heat dissipation; the terminal of the composite busbar 20 is also located on one side of the side plate 50, and the side plate 50 has a gap for the terminal to protrude from.
  • the radiator 10 is used as the base of the module, and the mounting plate 41 of the control assembly 40 is used as the top plate of the module (the size of the top plate is equivalent to the surface area of the radiator 10),
  • the second part 22 of the composite busbar 20 (the top of the second part 22 is in contact with the inner surface of the mounting plate 41) and the corresponding side plates 50 constitute the baffles on both sides of the module, and the pillars 3111 of the capacitor bracket 31 constitute the module
  • the converter module of the present application when installed into the electrical cabinet after assembly, it is installed with the side where the side plate 50 is located facing upwards, because the terminals of the composite busbar 20 are located on this side, that is, the installed The wiring terminals of the converter module face up, which is convenient for wiring operations.
  • the upward facing of the side plate 50 can also prevent dust and other foreign objects in the external environment from falling into the interior of the converter module to a certain extent.
  • it further includes a sliding part 60 disposed on the side of the converter module, the two ends of the sliding part 60 are fixed to the edges of the radiator 10 and the control assembly 40 respectively, and the outer surface thereof is a smooth plane.
  • the converter module can be slid in one direction during the disassembly and assembly process in the electrical cabinet.
  • the converter module is installed with the side where the side plate 50 is located upward in the electrical cabinet, its sliding fit structure with the electrical cabinet is arranged on the other side opposite to the side plate 50 (the first side of the composite busbar 20 The side where the two parts 22 are located), specifically by setting the sliding part 60 with a smooth surface to cooperate with the track in the electrical cabinet.
  • the whole of sliding member 60 is plate-shaped, and its two ends connect radiator 10 and the edge of mounting plate 41 of control assembly 40 respectively, the quantity of sliding member 60 can be set according to the situation, in the present embodiment parallel Two slide members 60 are provided.
  • the composite busbar 20 has a connecting hole 23 for connecting the radiator 10 , and the connecting hole 23 can be fitted with a fastener to fix the radiator 10 .
  • connection structure of the composite busbar is limited, and the converter module is often accompanied by a certain level of vibration in the use scenarios such as trains, so it is necessary to strengthen the connection structure of the composite busbar. strength.
  • connection holes there are multiple connection holes on the composite busbar, and the connection holes are actually located on the first part of the composite busbar, which can cooperate with bolts and other fasteners to make the composite busbar and radiator fixedly connected, so that The strength of the connecting structure of the composite busbar can be improved, thereby improving the stability of the overall structure of the converter module in a vibration environment.
  • Embodiments of the present application provide an assembly method for the above-mentioned high-frequency three-level DCDC converter module, including the following steps:
  • FIG. 1 of the accompanying drawings The fixed connection between the above components adopts detachable connection structures such as bolts, which is convenient for disassembly, inspection and maintenance.
  • the above installation sequence is only the approximate sequence of module assembly.
  • the specific sequence can also be adjusted adaptively, but the relative position relationship and connection relationship between the components are different. Change.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Dc-Dc Converters (AREA)

Abstract

一种高频三电平DCDC变流器模块及装配方法，该变流器模块包括散热器（10），所述散热器（10）的表面上安装有半导体器件（12），沿垂直且远离所述半导体器件（12）所在表面的方向依次设置有复合母排（20）、电容组件（30）以及控制组件（40）；所述复合母排（20）覆盖在所述半导体器件（12）上方，所述电容组件（30）包括用于安装电容器（32）的电容支架（31），所述电容支架（31）的底部固定于所述散热器（10）且其顶部支撑所述控制组件（40）。该高频三电平DCDC变流器模块采用沿垂直于散热器（10）表面的方向依次叠加的分层布局结构，不同的功能单元分布于不同的层级上，层次分明，减少相互之间的干涉；并且能够实现功能单元的模块化，大大提升了一次性的装配成功率，便于生产线操作，提升了生产效率。

Description

一种高频三电平DCDC变流器模块及装配方法
相关申请的交叉引用
本申请要求享有于2021年9月29日提交的中国专利申请CN202111154501.1的优先权，上述申请的全部内容通过引用并入本文中。
技术领域
本申请涉及辅助变流器技术领域，特别地涉及一种高频三电平DCDC变流器模块及装配方法。
背景技术
随着我国轨道交通行业的快速发展，辅助变流器作为列车的重要供电单元一直在不断升级，原先笨重的变流装置逐渐被小型高效的变流器所取代。为了实现变流器的高性能、高效率、高功率密度，研究人员通过采用新材料、新器件和新的电路拓扑组合等各种方式来实现辅助变流器高功率密度的目标。
但是，目前针对变流器模块的结构布局方面的研究较为欠缺，现有变流器模块大多采用平面二维布局结构，各个功能单元基本布局在一个平面内，占用面积大、空间利用率小且不利于整合安装；同时难以实现各个功能单元的模块化装配，各个功能单元的装配较为复杂，装配效率低。
发明内容
针对上述现有技术中的问题，本申请提出了一种高频三电平DCDC变流器模块及装配方法，针对变流器模块的结构布局进行设计，以实现功能单元的模块化装配，提高装配效率。
第一方面，本申请提出了一种高频三电平DCDC变流器模块，包括散热器，所述散热器的表面上安装有半导体器件，沿垂直且远离所述半导体器件所在表面的方向依次设置有复合母排、电容组件以及控制组件；
所述复合母排覆盖在所述半导体器件上方，所述电容组件包括用于安装电容器的电容支架，所述电容支架的底部固定于所述散热器且其顶部支撑所述控制组件。
在一个实施方式中，所述电容组件包括相邻设置的斩波电容单元与LLC电容单元，所述斩波电容单元与所述LLC电容单元中均包括在垂直于所述散热器 表面的平面内均布的多个电容器，所述电容器电连接所述复合母排。
在一个实施方式中，所述复合母排为弯折结构，其包括覆盖在所述半导体器件上方的第一部分以及弯折后位于所述斩波电容单元的外侧第二部分，所述第一部分与所述第二部分分别电连接所述LLC电容单元与所述斩波电容单元。
在一个实施方式中，所述斩波电容单元中的电容器为正负极位于同一端，且所述斩波电容单元的多个电容器的正负极所在的电极端朝向相同且朝向所述第二部分。
在一个实施方式中，所述电容支架包括对应所述斩波电容单元的第一电容支架，所述第一电容支架包括两个相对设置的支撑部，所述支撑部包括两个支柱以及设置所述两个支柱之间的支撑板，所述支柱底部固定于所述散热器；
其中，所述斩波电容单元中的电容器夹持于两个所述支撑板之间。
在一个实施方式中，所述斩波电容单元中的电容器的正负极共同所在的电极端容纳于其中一个所述支撑板上的安装口中，另一端通过螺栓连接另一个所述支撑板上的螺孔。
在一个实施方式中，所述安装口中具有防止所述电极端脱出所述安装口的限位结构，限位结构为所述安装口口沿内侧的台阶状结构，所述电极端抵接于所述台阶状结构。
在一个实施方式中，所述电容支架包括对应所述LLC电容单元的第二电容支架，所述第二电容支架包括上下两个支撑梁，所述LLC电容单元中的电容器以卧置的姿态夹持于所述两个支撑梁之间且其两端分别通过铜排连接所述复合母排的第一部分。
在一个实施方式中，所述LLC电容单元中的电容器的圆周最外层表面具有柔性的缓冲层，所述缓冲层能够形变，以实现所述LLC电容单元中的电容器在所述第二电容支架上的装配位置的微调。
在一个实施方式中，所述散热器的相对于所述半导体器件所在表面的另一侧表面上具有散热结构，所述散热结构包括多个针状的散热翅片。
在一个实施方式中，所述散热结构中具有所述散热翅片密集分布的密集区与所述散热翅片稀疏分布的稀疏区；
其中，所述密集区与所述稀疏区分别对应相对高发热区域与相对低发热区域；和/或所述稀疏区靠近冷却介质输入口，所述密集区远离冷却介质输入口。
在一个实施方式中，所述控制组件包括安装板与设置在安装板上的控制单元， 所述安装板固定于所述电容支架的顶部，所述控制单元电连接所述半导体器件。
在一个实施方式中，还包括设置在变流器模块侧面的滑动部件，所述滑动部件的两端分别固定于所述散热器与所述控制组件的边缘，其外侧面为光滑平面。
在一个实施方式中，所述复合母排上具有用于连接所述散热器的连接孔，所述连接孔能够配合紧固件以固定连接所述散热器。
上述技术特征可以各种适合的方式组合或由等效的技术特征来替代，只要能够达到本申请的目的。
第二方面，本申请提出了一种应用于上述变流器模块的装配方法，包括以下步骤：
S10：将半导体器件安装至散热器上的对应位置；
S20：安装复合母排，使所述复合母排的相应的部分覆盖并连接所述半导体器件；
S30：安装电容组件，将装配有电容器的电容支架安装在复合母排的上方，所述电容支架的底部与复合母排错开并固定连接所述散热器；
S40：安装控制组件，将所述控制组件安装在所述电容组件的上方，所述控制组件与所述电容支架的顶部固定连接。
在一个实施方式中，步骤S40之前，还包括步骤：
S31：安装侧板，所述侧板位于所述变流器模块的侧面，其底部与顶部分别固定连接于所述散热器以及所述控制组件的边缘。
在一个实施方式中，步骤S40之后，还包括步骤：
S50：安装滑动部件，所述滑动部件位于所述变流器模块的侧面且与所述侧板相对，所述滑动部件光滑的一侧表面朝外，其的两端分别固定连接于所述散热器与所述控制组件的边缘。
本申请提供的一种高频三电平DCDC变流器模块及装配方法，与现有技术相比，至少具备有以下有益效果：
本申请的一种高频三电平DCDC变流器模块及装配方法，采用沿垂直于散热器表面的方向依次叠加的分层布局结构，不同的功能单元分布于不同的层级上，层次分明，减少相互之间的干涉；并且能够实现功能单元的模块化，大大提升了一次性的装配成功率，便于生产线操作，提升了生产效率。
附图说明
在下文中将基于实施例并参考附图来对本申请进行更详细的描述。其中：
图1显示了本申请的变流器模块的整体结构示意图；
图2显示了本申请的变流器模块的复合母排的结构示意图；
图3显示了本申请的变流器模块的斩波电容单元的结构示意图；
图4显示了本申请的变流器模块的LLC电容单元的结构示意图；
图5显示了本申请的变流器模块的散热器的散热结构所在一侧的结构示意图；
图6显示了本申请的变流器模块的散热器的半导体器件所在一侧的结构示意图；
图7显示了本申请的变流器模块的滑动部件的结构示意图。
在附图中，相同的部件使用相同的附图标记。附图并未按照实际的比例。
附图标记：
10-散热器，11-散热结构，111-稀疏区，112-密集区，12-半导体器件，20-复合母排，21-第一部分，22-第二部分，23-连接孔，30-电容组件，31-电容支架，32-电容器，310-斩波电容单元，311-第一电容支架，3111-支柱，3112-支撑板，3113-安装口，3114-提手，3115-螺栓，312-第二电容支架，320-LLC电容单元，321-铜排，40-控制组件，41-安装板，42-控制单元，50-侧板，60-滑动部件。
具体实施方式
下面将结合附图对本申请作进一步说明。
本申请的实施例提供了一种高频三电平DCDC变流器模块，包括散热器10，散热器10的表面上安装有半导体器件12，沿垂直且远离半导体器件12所在表面的方向依次设置有复合母排20、电容组件30以及控制组件40；
复合母排20覆盖在半导体器件12上方，电容组件30包括用于安装电容器32的电容支架31，电容支架31的底部固定于散热器10且其顶部支撑控制组件40。
具体地，如附图图1所示，本申请的DCDC变流器模块采用多层堆叠的布局结构并以此结构进行装配。其中，散热器10作为模块装配结构的基座，散热器10表面上均布多个半导体器件12，复合母排20覆盖在半导体器件12上，电容组件30整体位于复合母排20的上方，电容组件30的电容支架31的底部错开复合母排20并固定于散热器10，电容器32的顶部支撑并固定连接控制组件40，电容组件30的电容器32安装于电容支架31上并位于复合母排20与控制组件 40之间的区域。最终，形成控制组件40、电容组件30、复合母排20、半导体器件12以及散热器10依次叠加的多层堆叠的布局结构。
参照附图图1，本申请的DCDC变流器模块采用沿垂直于散热器10表面的方向依次叠加的分层布局结构，每一层结构均只包括一个相应的功能单元，不同的功能单元分布于不同的层级上，层次分明，减少相互之间的干涉，并且能够实现功能单元的模块化。装配时，只需按照分层结构的叠加顺序，将相应功能单元对应的功能子模块依次进行装配即可，大大提升了一次性的装配成功率，便于生产线操作，提升了生产效率，杜绝了由于人员的变化带来的装配困难的问题，便于后续的安装、拆卸和维护。
在一个实施例中，电容组件30包括相邻设置的斩波电容单元310与LLC电容单元320，斩波电容单元310与LLC电容单元320中均包括在垂直于散热器10表面的平面内均布的多个电容器32，电容器32电连接复合母排20。
具体地，如附图图1与图3所示，电容组件30包括在同一层级上左右相邻的斩波电容单元310与LLC电容单元320，由于散热器10表面对应的平面内的空间有限，斩波电容单元310与LLC电容单元320中的电容器32设置为在垂直于散热器10表面的平面内均布；尤其是电容器32数量较多的斩波电容单元310，其多个电容器32在垂直于散热器10表面的平面内具有多层结构，每层结构也包括多个电容器32，以此在垂直于散热器10表面的方向上进行装配空间的拓展。
因此，电容组件30中的斩波电容单元310与LLC电容单元320采用左右布局，而相应电容单元的多个电容器32则结合左右布局与上下布局，进而整体提高了空间的利用率，使模块布局结构更合理、更紧凑，实现模块的小型化。
需要说明的是，斩波电容单元310与LLC电容单元320中的电容器32均为柱状结构，其电极通常位于柱状结构的端部，故基于采用在垂直于散热器10表面的平面内均布的布局方式，为了连接的便利性，电容器32相对于散热器10采用卧置的方式，即电容器32的轴线平行于散热器10的表面。
在一个实施例中，复合母排20为弯折结构，其包括覆盖在半导体器件12上方的第一部分21以及弯折后位于斩波电容单元310的外侧第二部分22，第一部分21与第二部分22分别电连接LLC电容单元320与斩波电容单元310。
具体地，如附图图1与图2所示，复合母排20包括相对弯折的第一部分21与第二部分22，第一部分21覆盖在半导体器件12并电连接半导体器件12与LLC电容单元320中的电容器32；第二部分22相对第一部分21弯折后位于斩 波电容单元310的外侧(即整个变流器模块的侧面)，斩波电容单元310中的电容器32可以直接连接第二部分22。母排结构之所以要这样设置，目的就是为了便于与电容组件30之间的连接，尤其是针对斩波电容单元310中垂直于散热器10表面的平面内具有多层结构的多个电容器32。
在一个实施例中，斩波电容单元310中的电容器32为正负极位于同一端，且斩波电容单元310的多个电容器32的正负极所在的电极端朝向相同且朝向第二部分22。
具体地，如附图图1与图3所示，斩波电容单元310中的电容器32的正负极所在的电极端朝向复合母排20的第二部分22，并且在变流器模块装配时，斩波电容单元310中的电容器32的电极端能够直接接触并电连接复合母排20的第二部分22，这样直接连接就免去了中间的电连接结构，缩短了回路。
此外，LLC电容单元320中的电容器32的电极结构不同于斩波电容单元310的电容器32，LLC电容单元320中的电容器32的分别位于两端，这也就是为何LLC电容单元320中的电容器32要采用相对复合母排20的第一部分21的卧置姿态，这样才便于两端的正负极与复合母排20进行连接。装配时，需要额外的铜排321来由LLC电容单元320中的电容器32的端部延伸至复合母排20的第一部分21，以此相互电连接。
在一个实施例中，电容支架31包括对应斩波电容单元310的第一电容支架311，第一电容支架311包括两个相对设置的支撑部，支撑部包括两个支柱3111以及设置两个支柱3111之间的支撑板3112，支柱3111底部固定于散热器10；
其中，斩波电容单元310中的电容器32夹持于两个支撑板3112之间。
具体地，如附图图1与图3所示，斩波电容单元310的电容器32实际上是被夹持在第一电容支架311的两个支撑部之间，即被夹持在两个支撑部的两个支撑板3112之间。这样设置的目的在于，在变流器模块的整体装配前，进行斩波电容单元310子模块的装配时，可以根据电容器32的尺寸调整两个支撑部之间的距离，以匹配相应尺寸的电容器32。
支柱3111底部错开半导体器件12与复合母排20并与散热器10边缘的装配孔固定连接，散热器10边缘的装配孔可以设置多个且相邻两个装配孔之间可以具有不同的间距，以此匹配常见的几种不同尺寸的电容器32。
需要说明的是，变流器模块中的LLC电容单元320的电容器一般数量较少，通常其的电容器在垂直于散热器10表面的平面内只会形成单层分布结构，即所 有电容器分布于附图图1所示的同一水平面内。但是，根据LLC电容单元320的电容器32的容量规格以及变流器模块的功率的不同，也可能LLC电容单元320的电容器32是与斩波电容单元310的电容器32一样的多层分布结构。不管是单层结构还是多层结构，斩波电容单元310的所有电容器32的正极或负极均位于同一侧，那么依然通过在两端设置铜排321来实现电容器32的电极与复合母排20的电连接。
在一个实施例中，斩波电容单元310中的电容器32的正负极共同所在的电极端容纳于其中一个支撑板3112上的安装口3113中，另一端通过螺栓3115连接另一个支撑板3112上的螺孔。
具体地，如附图图1与图3所示，斩波电容单元310中的电容器32的电极端对应一个支撑板3112上的安装口3113，该安装口3113供电极端上的正负电极电连接复合母排20；而斩波电容单元310中的电容器32的另一端通过螺栓3115连接另一个支撑板3112的螺孔，这样可以利用螺栓3115螺孔的配合略微调整电容器32沿其轴线方向的位置；螺栓3115螺孔的配合结构也可以采用螺栓3115、通孔外加螺母的配合结构来替代。
原因在于，即便是同一规格的电容器32，由于生产批次以及加工精度的差异，其轴向的长度也可能存在一定的误差，即有长有短。而在装配时必须保证所有电容器32的电极端位于同一平面内，这样才能保证所有的电容器32的电极端都能够与复合母排20稳定连接，此时就可以通过螺栓3115螺孔的连接结构来调整使得所有电容器32的电极端位于同一平面内。而调整后的电容器32相对电极端的另一端可能参差不齐，此时可以在电容器32端部相对于支撑板3112之间的缝隙中设置弹性的垫片，以此保证电容器32端部结构的稳定性。
在一个实施例中，安装口3113中具有防止电极端脱出安装口3113的限位结构，限位结构为安装口3113口沿内侧的台阶状结构，电极端抵接于台阶状结构。
具体地，限位结构是沿安装口3113的口沿在支撑板3112内侧表面上开设环槽，环槽相对于安装口3113的口沿形成台阶状结构，电容器32的端部抵接台阶状结构，实际上电容器32的端部配合于环槽中，安装口3113的口径实际小于电容器32端部的直径。
在一个实施例中，电容支架31包括对应LLC电容单元320的第二电容支架312，第二电容支架312包括上下两个支撑梁，LLC电容单元320中的电容器32以卧置的姿态夹持于两个支撑梁之间且其两端分别通过铜排321连接复合母排 20的第一部分21。
具体地，斩波电容单元310与LLC电容单元320分别对应单独的电容支架31。由于LLC电容单元320的电容器32的正负极分别位于两端，并且分别通过铜排321连接复合母排20，因此其与复合母排20的连接结构本身具备一定的稳定性，其对应的第二电容支架312可以仅在支撑LLC电容单元320的电容器的中部位置，即第二电容支架312的中被夹持于上下两个支撑梁之间，如附图图1与图4所示。
LLC电容单元320的电容器32与复合母排20连接的铜排321的结构如附图图4所示，铜排321整体呈T字形，将相邻两个电容器32的同一端并联后连接复合母排20的第一部分21。
优选地，LLC电容单元320中的电容器32的圆周最外层表面具有柔性的缓冲层，缓冲层能够形变，以实现LLC电容单元320中的电容器32在第二电容支架312上的装配位置的微调。
在一个实施例中，散热器10的相对于半导体器件12所在表面的另一侧表面上具有散热结构11，散热结构11包括多个针状的散热翅片。
优选地，散热结构11中具有散热翅片密集分布的密集区112与散热翅片稀疏分布的稀疏区111；
其中，密集区112与稀疏区111分别对应相对高发热区域与相对低发热区域；和/或稀疏区111靠近冷却介质输入口，密集区112远离冷却介质输入口。
具体地，如附图图5所示，散热器10通过散热翅片与冷却介质之间的换热来实现模块的散热，参照模块的发热情况，对于相对高发热区域与相对低发热区域分别设置密集区112与稀疏区111，以针对性散热，提高散热效率。
此外，密集区112与稀疏区111可以相互交错分布，但总的来说，稀疏区111靠近冷却介质输入口，密集区112远离冷却介质输入口，因为靠近冷却介质输入口处的冷却介质的温度最低，换热的温差最大，此时散热翅片相对稀疏也能够满足散热需求。而远离冷却介质输入口处的冷却介质已经进行了一定程度的换热，其温度有所升高，换热的温差减小，需要增大换热面积来保证散热效果，因此将散热翅片设置为密集，以增大换热面积。
在一个实施例中，控制组件40包括安装板41与设置在安装板41上的控制单元42，安装板41固定于电容支架31的顶部，控制单元42电连接半导体器件12。
具体地，如附图图1所示，安装板41固定在电容支架31的顶部，可以是同时固定连接斩波电容单元310与LLC电容单元320所对应的两个电容支架31，也可以只是固定连接斩波电容单元310所对应的第一电容支架311。参照附图图1所示，安装板41与第一电容支架311的支撑板3112的顶部固定连接，支撑板3112的顶部弯折后形成连接部，连接部上具有连接孔，安装板41上设置螺栓穿入连接孔，实现固定连接。变流器模块自带的控制单元42距离模块内部的各个功能单元的距离更近，其电连接线路更短，抗干扰性强。
进一步地，参照附图图1，安装板41的两侧边缘向同一侧弯折形成定位部，定位部上具有用于定位的缺口；装配时，支撑板3112顶部对应卡入缺口，实现安装板41的定位，而后可以准确的将安装板41的螺栓穿入支撑板3112顶部对应的连接孔中。
此外，第一电容支架311的两个支撑部对应的支柱3111的顶部之间连接有提手3114，该提手3114便于人员搬运变流器模块。
在一个实施例中，本申请的变流器模块在相对于复合母排20的第二部分22所在一侧的另一侧设置有侧板50，该侧板50也支撑在散热器10与控制组件40之间，提供一定的支撑作用。保证变流器模块整体结构的可靠性。同时，侧板50上也开设有多个散热孔，加强散热；复合母排20的接线端子也问位于侧板50一侧，侧板50上具有供接线端子伸出的缺口。
参照附图图1，对于本申请的变流器模块整体来将，散热器10作为模块的底座，控制组件40的安装板41作为模块的顶板(顶板大小与散热器10表面面积大小相当)，复合母排20的第二部分22(第二部分22的顶部与安装板41的内侧表面接触)和与其对应的侧板50构成模块的两侧面的挡板，电容支架31的的支柱3111构成模块另外一个方向上的两侧面的支撑结构，进而整个模块成相对封闭的立方体结构，结构更为紧凑，更加小型化。
进一步地，本申请的变流器模块在装配后安装至电气柜中时，是以侧板50所在的一面朝上进行安装，因为复合母排20的接线端子位于这一面，即安装后的变流器模块的接线端子朝上，便于接线操作。此外，侧板50朝上也可以一定程度上阻挡外部环境中的灰尘以及其他异物落入变流器模块内部。
在一个实施例中，还包括设置在变流器模块侧面的滑动部件60，滑动部件60的两端分别固定于散热器10与控制组件40的边缘，其外侧面为光滑平面。
具体地，使变流器模块在电气柜内的拆装过程中能够沿一个方向滑动，这样 做的目的在于：一是为了便于在一定范围内调整变流器模块的安装位置，以适应电气柜中的安装布局；二是由于变流器模块的重量较大，在安装时利用滑动可以相对电气柜滑进滑出，便于安装操作。由于变流器模块在电气柜中是以侧板50所在的一面朝上进行安装，故其与电气柜的滑动配合结构设置于与侧板50相对的另一侧(复合母排20的第二部分22所在的一面)，具体是通过设置表面光滑的滑动部件60配合电气柜中的轨道。参照附图图7，滑动部件60的整体呈板状，其两端分别连接散热器10与控制组件40的安装板41的边缘，滑动部件60的数量可以视情况设置，本实施例中并列地设置两个滑动部件60。
在一个实施例中，复合母排20上具有用于连接散热器10的连接孔23，连接孔23能够配合紧固件以固定连接散热器10。
具体地，复合母排与半导体器件以及电容组件之间的电连接结构的强度有限，而变流器模块在列车等使用场景中常常伴随一定强度的振动，因此需要加强复合母排的连接结构的强度。如附图图2所示，复合母排上有多个连接孔，连接孔实际位于复合母排的第一部分上，其能够配合螺栓等紧固件来使复合母排与散热器固定连接，这样就能够提高复合母排的连接结构的强度，进而提高变流器模块整体结构在振动环境下的稳定性。
本申请的实施例提供上述的高频三电平DCDC变流器模块的装配方法，包括以下步骤：
S10：将半导体器件安装至散热器上的对应位置；
S20：以预定姿态安装复合母排，使复合母排的第一部分覆盖半导体器件，复合母排的第二部分位于预定一侧；
S30：以预定布局安装电容组件，将事先与对应的电容支架装配好的电容单元(斩波电容单元与LLC电容单元)安装在对应位置(电容支架的底部固定连接散热器)，电容器的电极端分别电连接于复合母排的对应位置；
S31：在与复合母排的第二部分相对的一侧安装侧板，侧板的底部固定连接于散热器的边缘，其顶部与电容支架的位于同一水平面上；
S40：安装控制组件，控制组件覆盖在电容组件上，控制组件的安装板与电容支架的顶部固定连接且其边缘与侧板的顶部固定连接；
S50：安装滑动部件，滑动部件安装在复合母排的第二部分的外侧，与侧板相对，滑动部件光滑一侧的表面朝外，滑动部件的两端分别固定连接散热器与安装板的边缘。
需要说明的是，装配完毕后的变流器模块的结构如附图图1所示。以上各个组件之间的固定连接方式采用螺栓等可拆卸连接结构，便于拆装检修、维护。同时，以上安装顺序仅为模块装配的大致顺序，根据个组件之间的连接结构、连接关系的不同，也可以适应性的调整具体的顺序，但各个组件之间的相对位置关系以及连接关系不变。
在本申请的描述中，需要理解的是，术语“上”、“下”、“底”、“顶”、“前”、“后”、“内”、“外”、“左”、“右”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
虽然在本文中参照了特定的实施方式来描述本申请，但是应该理解的是，这些实施例仅仅是本申请的原理和应用的示例。因此应该理解的是，可以对示例性的实施例进行许多修改，并且可以设计出其他的布置，只要不偏离所附权利要求所限定的本申请的精神和范围。应该理解的是，可以通过不同于原始权利要求所描述的方式来结合不同的从属权利要求和本文中的特征。还可以理解的是，结合单独实施例所描述的特征可以使用在其他实施例中。

Claims (17)

  1. 一种高频三电平DCDC变流器模块，其特征在于，包括散热器，所述散热器的表面上安装有半导体器件，沿垂直且远离所述半导体器件所在表面的方向依次设置有复合母排、电容组件以及控制组件；
    所述复合母排覆盖在所述半导体器件上方，所述电容组件包括用于安装电容器的电容支架，所述电容支架的底部固定于所述散热器且其顶部支撑所述控制组件。
  2. 根据权利要求1所述的高频三电平DCDC变流器模块，其特征在于，所述电容组件包括相邻设置的斩波电容单元与LLC电容单元，所述斩波电容单元与所述LLC电容单元中均包括在垂直于所述散热器表面的平面内均布的多个电容器，所述电容器电连接所述复合母排。
  3. 根据权利要求2所述的高频三电平DCDC变流器模块，其特征在于，所述复合母排为弯折结构，其包括覆盖在所述半导体器件上方的第一部分以及弯折后位于所述斩波电容单元的外侧第二部分，所述第一部分与所述第二部分分别电连接所述LLC电容单元与所述斩波电容单元。
  4. 根据权利要求3所述的高频三电平DCDC变流器模块，其特征在于，所述斩波电容单元中的电容器为正负极位于同一端，且所述斩波电容单元的多个电容器的正负极所在的电极端朝向相同且朝向所述第二部分。
  5. 根据权利要求2至4任一项所述的高频三电平DCDC变流器模块，其特征在于，所述电容支架包括对应所述斩波电容单元的第一电容支架，所述第一电容支架包括两个相对设置的支撑部，所述支撑部包括两个支柱以及设置所述两个支柱之间的支撑板，所述支柱底部固定于所述散热器；
    其中，所述斩波电容单元中的电容器夹持于两个所述支撑板之间。
  6. 根据权利要求5所述的高频三电平DCDC变流器模块，其特征在于，所述斩波电容单元中的电容器的正负极共同所在的电极端容纳于其中一个所述支撑板上的安装口中，另一端通过螺栓连接另一个所述支撑板上的螺孔。
  7. 根据权利要求6所述的高频三电平DCDC变流器模块，其特征在于，所述安装口中具有防止所述电极端脱出所述安装口的限位结构，限位结构为所述安装口口沿内侧的台阶状结构，所述电极端抵接于所述台阶状结构。
  8. 根据权利要求2至4任一项所述的高频三电平DCDC变流器模块，其特征在于，所述电容支架包括对应所述LLC电容单元的第二电容支架，所述第二电 容支架包括上下两个支撑梁，所述LLC电容单元中的电容器以卧置的姿态夹持于所述两个支撑梁之间且其两端分别通过铜排连接所述复合母排的第一部分。
  9. 根据权利要求8所述的高频三电平DCDC变流器模块，其特征在于，所述LLC电容单元中的电容器的圆周最外层表面具有柔性的缓冲层，所述缓冲层能够形变，以实现所述LLC电容单元中的电容器在所述第二电容支架上的装配位置的微调。
  10. 根据权利要求1至4任一项所述的高频三电平DCDC变流器模块，其特征在于，所述散热器的相对于所述半导体器件所在表面的另一侧表面上具有散热结构，所述散热结构包括多个针状的散热翅片。
  11. 根据权利要求10所述的高频三电平DCDC变流器模块，其特征在于，所述散热结构中具有所述散热翅片密集分布的密集区与所述散热翅片稀疏分布的稀疏区；
    其中，所述密集区与所述稀疏区分别对应相对高发热区域与相对低发热区域；和/或所述稀疏区靠近冷却介质输入口，所述密集区远离冷却介质输入口。
  12. 根据权利要求1至4任一项所述的高频三电平DCDC变流器模块，其特征在于，所述控制组件包括安装板与设置在安装板上的控制单元，所述安装板固定于所述电容支架的顶部，所述控制单元电连接所述半导体器件。
  13. 根据权利要求1至4任一项所述的高频三电平DCDC变流器模块，其特征在于，还包括设置在变流器模块侧面的滑动部件，所述滑动部件的两端分别固定于所述散热器与所述控制组件的边缘，其外侧面为光滑平面。
  14. 根据权利要求1至4任一项所述的高频三电平DCDC变流器模块，其特征在于，所述复合母排上具有用于连接所述散热器的连接孔，所述连接孔能够配合紧固件以固定连接所述散热器。
  15. 一种应用于如权利要求1至14任一项所述的变流器模块的装配方法，其特征在于，包括以下步骤：
    S10：将半导体器件安装至散热器上的对应位置；
    S20：安装复合母排，使所述复合母排的相应的部分覆盖并连接所述半导体器件；
    S30：安装电容组件，将装配有电容器的电容支架安装在复合母排的上方，所述电容支架的底部与复合母排错开并固定连接所述散热器；
    S40：安装控制组件，将所述控制组件安装在所述电容组件的上方，所述控 制组件与所述电容支架的顶部固定连接。
  16. 根据权利要求15所述的装配方法，其特征在于，步骤S40之前，还包括步骤：
    S31：安装侧板，所述侧板位于所述变流器模块的侧面，其底部与顶部分别固定连接于所述散热器以及所述控制组件的边缘。
  17. 根据权利要求16所述的装配方法，其特征在于，步骤S40之后，还包括步骤：
    S50：安装滑动部件，所述滑动部件位于所述变流器模块的侧面且与所述侧板相对，所述滑动部件光滑的一侧表面朝外，其的两端分别固定连接于所述散热器与所述控制组件的边缘。
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