WO2023050363A1 - Dispositif électronique et véhicule - Google Patents

Dispositif électronique et véhicule Download PDF

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Publication number
WO2023050363A1
WO2023050363A1 PCT/CN2021/122323 CN2021122323W WO2023050363A1 WO 2023050363 A1 WO2023050363 A1 WO 2023050363A1 CN 2021122323 W CN2021122323 W CN 2021122323W WO 2023050363 A1 WO2023050363 A1 WO 2023050363A1
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WO
WIPO (PCT)
Prior art keywords
chamber
electronic device
heat
circuit board
housing
Prior art date
Application number
PCT/CN2021/122323
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English (en)
Chinese (zh)
Inventor
万军平
崔培华
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN202180046269.1A priority Critical patent/CN116210354A/zh
Priority to PCT/CN2021/122323 priority patent/WO2023050363A1/fr
Publication of WO2023050363A1 publication Critical patent/WO2023050363A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present application relates to the field of vehicles, in particular to an electronic device and a vehicle.
  • a cooling plate is installed on the circuit board of the computing device, and a solid heat dissipation material is arranged on the cooling plate at a position corresponding to the heat dissipation part of the circuit board, and the solid heat dissipation material is bonded to the heat dissipation part.
  • the cooling plate is filled with cooling water, so that the heat of the circuit board is transferred to the cooling water in the cooling plate through the solid heat dissipation material, so as to realize the heat dissipation of the circuit board.
  • the embodiments of the present application provide an electronic device and a vehicle, which have low requirements on assembly accuracy and are compatible with multiple types and high-density components to be dissipated.
  • the first aspect of the present application provides an electronic device, including: a circuit board; a first chamber, the circuit board is accommodated in the first chamber and filled with a first heat-conducting liquid, and a heat dissipation device, the heat dissipation device is used to pass through the first The thermal fluid dissipates heat from the circuit board.
  • filling the first chamber with the first heat-conducting liquid can transfer the heat on the circuit board to the first heat-conducting liquid, which is compatible with various types of circuit boards;
  • the heat dissipation device is used to dissipate heat from the circuit board through the first heat-conducting liquid, thereby improving heat dissipation efficiency and adapting to high-power circuit boards.
  • the heat dissipation device includes: a second housing, a second chamber is arranged in the second housing, the second chamber is filled with a second heat transfer liquid, and the second housing is in contact with the first chamber .
  • the second heat transfer liquid in the second housing can dissipate heat from the first heat transfer liquid, thereby improving the heat dissipation effect.
  • the first chamber is located in the first housing
  • the heat dissipation device may further include an air cooling unit
  • the air cooling unit includes: a fan located on the first housing and a driving source connected to the fan, The fan is used for cooling the first housing.
  • the first heat transfer liquid can be dissipated by air cooling, thereby improving the heat dissipation effect on the circuit board.
  • the first chamber is located in the first housing, and a sealing ring is provided between the first housing and the second housing to make the first chamber airtight.
  • the first housing and the second housing are detachably connected, which can facilitate the maintenance and updating of the circuit board, and is suitable for the vehicle control device.
  • the second casing includes multiple second casings, and the multiple second casings form the first chamber.
  • the sealing ring includes a first sealing ring and a second sealing ring, the cross section of the first sealing ring is O-shaped; the cross section of the second sealing ring is zigzag.
  • the O-shaped section of the first sealing ring is easy to process, and the zigzag section of the second sealing ring can effectively prevent the first heat transfer liquid from overflowing, and can withstand greater pressure, improve the sealing effect, and adapt to the vibration in the vehicle scene .
  • the second sealing ring is closer to the first chamber than the first sealing ring.
  • the zigzag cross section of the second sealing ring can effectively prevent the first heat transfer liquid from overflowing between the first sealing ring and the second sealing ring, thereby preventing the overflowing heat transfer liquid from contaminating the first sealing ring and reducing the sealing effect.
  • first sealing ring and the second sealing ring may also have other cross-sectional shapes, the first sealing ring is closer to the first chamber than the second sealing ring, and the first sealing ring and the second sealing ring
  • the cross-sections of the rings can all be O-shaped or zigzag-shaped.
  • heat exchange fins are provided on the surface of the second housing facing the first chamber.
  • the second housing is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet communicate with the second chamber.
  • the second heat transfer liquid can flow in the second chamber, thereby improving the heat dissipation effect.
  • a liquid injection port which communicates with the first chamber and is used for injecting the first heat transfer liquid into the first chamber.
  • the injection and dumping of the first heat transfer liquid can be facilitated, and the upgrade or maintenance of the circuit board can be facilitated.
  • the liquid injection port is disposed on the second housing.
  • the liquid injection port protrudes relative to a side of the second housing away from the first chamber.
  • the liquid level of the first heat transfer liquid can be conveniently controlled, and when the liquid level of the first heat transfer liquid is located at the protruding part of the liquid injection port, the circuit board can be completely submerged in the first heat transfer liquid.
  • the first heat transfer liquid is fluorinated liquid or mineral oil
  • the second heat transfer liquid is water
  • the electronic device is used in a control unit of the vehicle.
  • multiple chips are arranged on the circuit board.
  • a pinch plate is further arranged on the circuit board, and the pinch plate is used for installing the CPU.
  • it further includes: a thermally conductive solid disposed on a surface of the first chamber.
  • the heat-conducting solid is attached to the chip, so as to realize the heat dissipation of the chip.
  • a second aspect of the present application provides a vehicle, including: the electronic device provided in the first aspect of the present application and any possible implementation thereof.
  • the electronic device provided by this application can be adapted to the vehicle-mounted scene, ensuring the heat dissipation effect of the vehicle-mounted electronic device (controller) under vibration; the assembly accuracy is not high, and workers are not required to align the solid heat dissipation material according to the position, size and height of the chip , to improve assembly efficiency; it can avoid the dislocation of solid heat dissipation materials caused by vehicle vibration and the poor bonding between solid heat dissipation materials and circuit boards, improve the heat dissipation effect, and reduce the inconvenience caused by maintenance; in addition, through the wind
  • the circuit board is dissipated by means of cold or water cooling through the first heat-conducting liquid, which can improve heat dissipation efficiency and adapt to more types of circuit boards.
  • FIG. 1 is a schematic diagram of an application scenario of an electronic device provided by an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application.
  • Fig. 4A is a cross-sectional view of an electronic device provided by an embodiment of the present application.
  • Fig. 4B is a cross-sectional view of an electronic device provided by another embodiment of the present application.
  • FIG. 5 is a cross-sectional view of an electronic device provided by another embodiment of the present application.
  • Fig. 6 is a cross-sectional view of an electronic device provided by another embodiment of the present application.
  • FIG. 7 is a cross-sectional view of an electronic device provided by another embodiment of the present application.
  • Fig. 8 is a cross-sectional view of an electronic device provided by another embodiment of the present application.
  • Fig. 9 is a cross-sectional view of a second casing of an electronic device provided by an embodiment of the present application.
  • FIG. 1 is a schematic diagram of an application scenario of an electronic device provided by an embodiment of the present application.
  • the electronic device provided by the embodiment of the present application can be applied to various controllers of the vehicle 100, for example, it can be applied to the vehicle-mounted computing platform 101, which can also be called a mobile data center (Mobile Data Center, MDC), Controllers such as a cockpit domain controller 103 (Cabin domain controller, CDC) and a vehicle controller 102 (Vehicle control unit, VCU).
  • MDC Mobile Data Center
  • Controllers such as a cockpit domain controller 103 (Cabin domain controller, CDC) and a vehicle controller 102 (Vehicle control unit, VCU).
  • MDC Mobile Data Center
  • Controllers such as a cockpit domain controller 103 (Cabin domain controller, CDC) and a vehicle controller 102 (Vehicle control unit, VCU).
  • VCU vehicle control unit
  • the electronic device provided in the embodiment of the present application can also be applied to controllers of vehicles such as trains
  • FIG. 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • the first chamber 1 accommodates the circuit board 30 and is filled with the first heat transfer liquid 3 .
  • the heat dissipation device 200 is used for dissipating heat from the circuit board 30 through the first heat conduction liquid 3 .
  • the circuit board 30 can be a printed circuit board (Printed Circuit Board, PCB), ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, printed circuit board, aluminum substrate, high Frequency board, thick copper board, etc.
  • one or more chips 31, 32, 33 can be arranged on one or both sides of the circuit board 30, and the chips 31, 32, 33 can be central processing units (central processing unit, CPU), Graphics processing unit (graphic processing unit, GPU), neural network processor (neural network processing unit, NPU), digital signal processing unit (Digital Signal Process, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA) One or a combination of etc.
  • These chips 31, 32, 33 can have different sizes and heights, and are distributed in different positions of the circuit board 30.
  • the chips 33 can also be installed on the circuit board 30 through the pinch plate 70, so as to facilitate the replacement of the chips 33 due to later upgrades.
  • Fig. 3-Fig. It can be composed of a plurality of (two schematically drawn in FIG. 5 ) second housings 20; as shown in FIG. 8, the first chamber 1 can also be composed of a third housing 81 and a fourth housing 82; of course , The first chamber can also be formed by an integrally formed airtight casing (not shown in the figure).
  • the heat sink 200 can be configured as a second shell 20 filled with the second heat transfer liquid 4; as shown in FIG. 8, the heat sink 200 can also be configured It is the third casing 81 and the air cooling unit 90 arranged on the third casing 81 .
  • the second heat conducting liquid may be water
  • the first heat conducting liquid may be fluorinated liquid or mineral oil.
  • a sealing ring is provided between the first housing 10 and the second housing 20 to seal the first chamber 1 .
  • the sealing ring includes a first sealing ring 51 and a second sealing ring 52 .
  • the first sealing ring 51 is located in the first groove 11 of the first housing 10
  • the second sealing ring 52 is located in the second groove 12 of the first housing 10 .
  • the first sealing ring 51 may be an O-ring with an O-shaped cross section
  • the second sealing ring 52 may be a toothed sealing ring.
  • the first groove 11 and the second groove 12 may also be provided on the second housing 20 , or grooves may be provided on both the first housing 10 and the second housing 20 .
  • FIG. 3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application.
  • an electronic device provided by an embodiment of the present application includes: a first housing 10 , a second housing 20 and a circuit board 30 .
  • the first housing 10 and the second housing 20 together form a first chamber 1, and the first chamber 1 accommodates a circuit board 30 and a first heat transfer liquid 3 (see FIG. 4A ).
  • the first heat transfer liquid 3 may be a non-conductive non-aqueous fluid, for example, the first heat transfer liquid 3 may be a fluorinated liquid or mineral oil.
  • the circuit board 30 can be well cooled without having to provide a solid heat dissipation material between the circuit board 30 and the first and second housings 10, 20, thereby suppressing the complexity of assembly caused by installing and adjusting the solid heat dissipation material, Makes the assembly process simple.
  • the same set of first and second shells 10, 20 can be used to install multiple different types of circuit boards 30, wherein multiple circuit boards 30 can also be placed in the first chamber 1, thereby reducing manufacturing costs.
  • one or more chips 31, 32 can be arranged on one side or both sides of the circuit board 30, as mentioned above, the chips 31, 32 can be respectively CPU, GPU, NPU, DSP, FPGA, etc. One or a combination etc. These chips 31 , 32 may have different sizes and heights, and are distributed at different positions on the circuit board. In the examples shown in FIGS. 3-6 , the chips 31 are directly mounted on the circuit board 30 . In the example shown in FIG. 7 , the chip 33 is mounted on the circuit board 30 through a pinch plate 70 , so as to facilitate the replacement of the chip 33 after upgrading.
  • the first housing 10 may have a first opening 13 , a groove and a first mounting portion 14 .
  • the first casing 10 is in the shape of a cuboid box with a first opening 13 on one side.
  • the second housing 20 is installed on the first housing 10 to close the first opening 13 , thereby constituting the first chamber 1 together with the first housing 10 .
  • the circuit board 30 is installed in the first chamber 1 .
  • the side of the circuit board 30 on which the chips 31 , 32 are installed may be in the same direction as the opening of the first opening 13 , that is, facing the second housing 20 .
  • the groove is formed on the edge of the first opening 13, and surrounds the first opening 13 in a ring shape, and is used to accommodate the sealing ring, so that the first chamber 1 is a closed chamber, preventing the first heat transfer liquid 3 from the first chamber 1 Outflow.
  • the groove may include: a first groove 11 and a second groove 12, the first groove 11 and the second groove 12 are formed on the edge of the first opening 13 and surround the first opening 13 in a ring shape,
  • the sealing rings 51 and 52 are respectively used to install, so that the first chamber 1 is an airtight chamber, preventing the first heat transfer liquid 3 from flowing out of the first chamber 1 .
  • the second groove 12 is closer to the first chamber 1 than the first groove 11 , that is to say, the first groove 11 is located at the periphery of the second groove 12 .
  • the first groove 11 can accommodate the first sealing ring 51
  • the second groove 12 can accommodate the second sealing ring 52 .
  • the first sealing ring 51 may be an O-ring with an O-shaped cross section
  • the second sealing ring 52 may be a toothed sealing ring.
  • the part in contact with the second housing 20 has a zigzag or triangular shape.
  • first groove 11 and the second groove 12 may also be provided on the second housing 20 , or grooves may be provided on both the first housing 10 and the second housing 20 .
  • the setting of the sealing ring realizes the sealing between the first housing 10 and the second housing 20, avoiding the overflow of the first heat transfer liquid 3, the O-shaped section of the first sealing ring is convenient for processing, and the zigzag shape of the second sealing ring 52 The section can effectively prevent the first heat transfer liquid 3 from overflowing, and can withstand greater pressure, improve the sealing effect, and adapt to the vibration in the vehicle scene.
  • the first mounting portion 14 may be located outside the first opening 13 and protrude outward relative to the first housing 10 for fixing the second housing 20 .
  • the first installation portion 14 is arranged on both sides of the first housing 10 , but the application is not limited thereto, and the first installation portion 14 can also be arranged on the four sides of the first housing 10 superior.
  • Fasteners can be used to fix the first housing 10 and the second housing 20 together, and there can be holes for fasteners on the first mounting part 14.
  • the holes for fasteners can be threaded holes for using screws.
  • the first case 10 and the second case 20 are fixed. This fixing method between the first housing 10 and the second housing 20 can facilitate the replacement and maintenance of the circuit board 30 and the upgrading of chips on the circuit board, and is especially suitable for controllers in the field of automatic driving and intelligent driving. Iterative updates.
  • the second housing 20 may have a second chamber 2 .
  • the second housing 20 is in the shape of a cuboid box with a cavity (ie, the second chamber 2 , see FIG. 4A and FIG. 9 ).
  • the second chamber 2 is located in the second housing 20, and a plurality of liquid guide walls 26 may be arranged in the second chamber 2, so as to facilitate the path formed by the second heat transfer liquid 4 along the liquid guide walls 26. Flow in the second chamber 2 to improve cooling efficiency.
  • the second chamber 2 may be filled with a second heat transfer liquid 4 (see FIG. 4A ).
  • the second heat transfer liquid may be water.
  • the second housing 20 may further include: a liquid inlet 23 and a liquid outlet 22 .
  • the liquid inlet 23 and the liquid outlet 22 communicate with the second chamber 2 and are used for introducing and exporting the second heat transfer liquid respectively.
  • the liquid inlet 23 and the liquid outlet 22 are arranged on one side of the cuboid, but this application does not limit it, and the liquid inlet 23 and the liquid outlet 22 can also be arranged at any position.
  • the liquid inlet 23 and the liquid outlet 22 can respectively communicate with a heat transfer liquid driving source (such as a water pump), so that the second heat transfer liquid circulates in the second chamber 2 .
  • the second heat transfer liquid flowing out of the second chamber 2 dissipates heat in a radiator not shown, and then flows back into the second chamber 2 .
  • the second housing 20 may further include a second mounting portion 24.
  • the second mounting portion 24 may also be disposed around the second housing 20 , for example, disposed on four sides respectively.
  • Fastener holes may also be provided on the second mounting part 24, for example, the fastener holes may be threaded holes, then the first mounting part 14 and the second mounting part 24 may be fixed together by screws.
  • the second housing 20 may further include a first heat transfer liquid injection port 21 .
  • the first heat transfer liquid injection port 21 communicates with the first chamber 1 for injecting the first heat transfer liquid 3 into the first chamber 1 .
  • the first heat transfer liquid injection port 21 may pass through the second housing 20 along the Y direction or at a certain angle inclined along the Y direction, and protrude relative to the second housing in the Y direction.
  • the first heat transfer liquid injection port 21 can also be arranged on the side wall of the first casing 10, that is, the side wall of the first casing protrudes outward (X direction) and extends toward the second The casing (Y direction) extends to form a first heat transfer liquid injection port 21 .
  • the height of the first heat transfer liquid injection port 21 may be flush with the outer surface of the second casing, or may be higher than the outer surface of the second casing as shown in FIG. 4B .
  • the first heat transfer liquid injection port 21 may also be jointly formed by the first housing 10 and the second housing 20 .
  • the first heat transfer liquid 3 is injected into the first chamber 1 through the first heat transfer liquid injection port 21 until the first heat transfer liquid 3 has the same
  • the first liquid surface 35 (refer to the bold dotted line in FIG. 4B ) in contact with the second housing and the second liquid surface 34 (refer to the solid line in FIG. 4B ) which is lower than the opening of the first heat transfer liquid injection port 21 .
  • the length direction of the plane where the first housing 10 is located is the X direction
  • the width direction of the plane where the first housing 10 is located is the Z direction
  • the height direction of the plane where the first housing 10 is located is the Y direction
  • the direction perpendicular to the plane where the first casing 10 is located is the Y direction
  • the Y direction is also a direction perpendicular to the board surface of the circuit board 30 .
  • heat exchanging fins 60 may also be provided on the surface of the second housing 20 facing the first chamber 1 , and the heat exchanging fins 60 may be directed toward the second housing 20 .
  • the protruding sheet metal sheet is used to increase the contact area between the second shell 20 and the first heat transfer liquid 1 , so as to improve the heat dissipation efficiency.
  • FIG. 5 is a cross-sectional view of an electronic device provided by another embodiment of the present application.
  • the first housing 10 may also have a second opening 15 , which is applicable to the case of having multiple second housings 20 .
  • the second opening 15 is opposite to the first opening 13 .
  • a groove for accommodating a sealing ring is provided around the edge of the second opening 15 .
  • the grooves include a third groove 16 and a fourth groove 17 .
  • the third groove 16 and the fourth groove 17 are similar to the first groove 11 and the second groove 12, and are used to accommodate sealing rings, and the third groove can be used to accommodate O-shaped seals with an O-shaped cross section.
  • the fourth groove 17 can be used to accommodate a saw-tooth seal ring with a saw-tooth cross section.
  • the structures of the O-ring seal and the saw-tooth seal ring are the same as those in the foregoing embodiments, and for the sake of brevity, details are not repeated here.
  • the two second shells 20 respectively cover the first opening 13 and the second opening 15 , and are fixed to the first shell 10 , thereby constituting the first chamber 1 together with the first shell 10 .
  • the method of fixing the plurality of second shells 20 to the first shell 10 is the same as the above-mentioned embodiments, and the second mounting part and the first mounting part can be fixed together by screws, and for the sake of brief introduction, details are omitted here.
  • the chips on both sides of the circuit board 30 can dissipate heat through the second housing 20 .
  • heat exchange fins 60 may be provided on the surface of one or two second shells 20 facing the first chamber 1 according to the situation, or no heat exchange fins 60 may be provided.
  • FIG. 7 is a cross-sectional view of an electronic device provided by another embodiment of the present application.
  • the electronic device may further include a pinch plate 70 .
  • the pinch plate 70 is used for installing the chip 33 so as to replace the chip 33 due to the later upgrade of the chip 33 .
  • the pinch plate 70 includes a first support portion 71, a second support portion 72 and a mounting portion 73.
  • the first support portion 71 and the second support portion 72 are located on the circuit board 30, and the mounting portion 73 is supported by the first support portion 71 and the second support portion.
  • the chip 33 is supported by the mounting portion 72 , and the chip 33 is mounted on the mounting portion 73 .
  • the electronic device may further include a solid heat conducting part 40 , which is also referred to as a heat conducting solid in this application.
  • the solid heat conduction part 40 is located on the surface of the second housing 20 facing the first chamber 1 and corresponds to the position of the chip 31 of the circuit board 30 .
  • the solid heat conduction part 40 is attached to the chip 31 for dissipating heat from the chip 31 .
  • the solid heat conduction part 40 can be a thermal interface material (Thermal Interface Materials, TIM), and the thermal interface material can include, for example, one or more of the following: silicone grease, silica gel, heat dissipation gasket, phase change material, phase change metal sheet heat conduction glue.
  • the whole circuit board 30 is accommodated in the first chamber 1, however, as other embodiments, it is also possible that a part of the circuit board 30 is immersed in the first heat transfer liquid 3, and the parts not immersed in the heat transfer liquid
  • the electronic components arranged on other parts can dissipate heat by contacting the second housing 20 with the same heat-conducting material as the solid heat-conducting part 40 .
  • the electronic device may include: a circuit board 30 and a plurality of second housings 20 .
  • the difference from the above embodiments is that the first chamber 1 is formed by two second housings 20 .
  • the second housing can be in the shape of a cuboid box with a third opening, and the edge of the third opening is annularly provided with a groove and a sealing ring similar to the above-mentioned embodiment.
  • the first chamber 1 is formed by combining the third openings of the two cuboids, and the first chamber is sealed by a sealing ring.
  • the second chamber of the second housing may be located in the side walls of the cuboid, for example, as shown in FIG. 6 , may be located in all the side walls.
  • the second chamber can also be located only in the side walls parallel to the circuit board.
  • the electronic device provided by the embodiment of the present application may include: a circuit board 30 , a third housing 81 , a fourth housing 82 and an air cooling unit 90 .
  • the structure of the fourth housing 82 is the same as that of the first housing 10 of the above-mentioned embodiment.
  • the fourth housing 82 can be a cuboid with a cavity (i.e. the first chamber 1), and one side thereof is not closed (i.e. the first opening 13 ).
  • the first opening 13 communicates with the first chamber 1 for installing the circuit board 30 and the third housing 81 .
  • the side of the circuit board 30 on which the chips are installed may be in the same direction as the opening direction of the first opening 13 .
  • the edge of the first opening 13 can be provided with grooves for accommodating the sealing ring, and there can be one or more grooves.
  • the grooves include the first groove and the first groove.
  • the second grooves are respectively used for installing sealing rings, so that the first chamber 1 can be sealed by the third housing 81 through the sealing rings, preventing the first heat transfer liquid 3 from flowing out of the first chamber 1 .
  • the sealing ring reference may be made to the above-mentioned embodiments, and for the sake of brevity, details are not repeated here.
  • the third housing 81 and the fourth housing 82 together form the inner first chamber 1 for containing the first heat transfer liquid 3 and the circuit board 30 .
  • the third housing 81 is provided with a first heat transfer liquid inlet 25, and the first heat transfer liquid inlet 25 communicates with the first chamber 1 for injecting the first heat transfer liquid into the first chamber 1.
  • the air cooling unit 90 may include a fan 91 and a driving source. The fan 91 may be located on the outer surface of the third housing 81 for cooling the circuit board 30 through the first heat transfer liquid 3 .
  • the electronic device improved by the above-mentioned embodiments of the present application can ensure the heat dissipation effect of the vehicle-mounted electronic device (also known as the controller) under the condition of vibration; the assembly accuracy is not high, the assembly method is simple and fast, and there is no need for workers to check the position of the chip.
  • size and height are aligned with the solid cooling block to improve assembly efficiency; reduce the dislocation of the solid cooling material caused by vehicle vibration and poor bonding between the solid cooling material and the circuit board, ensure the cooling effect, and reduce the inconvenience caused by maintenance;
  • cooling the circuit board through the first heat-conducting liquid through air cooling or water cooling can improve heat dissipation efficiency and adapt to more types of circuit boards.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente demande concerne un dispositif électronique comprenant une carte de circuit imprimé (30) pourvue d'une puce (31). La carte de circuit imprimé (30) est logée dans une première chambre (1), et la première chambre (1) est également remplie à l'intérieur d'un premier liquide thermoconducteur (3), la carte de circuit imprimé (30) étant immergée dans le premier liquide thermoconducteur (3), et la chaleur de la carte de circuit imprimé étant facilement évacuée par le premier liquide thermoconducteur (3). Ainsi, par rapport au procédé de dissipation de chaleur consistant à faire adhérer un matériau solide de dissipation de chaleur sur une carte de circuit imprimé, il n'est pas nécessaire d'exécuter une opération d'alignement des positions du matériau solide de dissipation de chaleur et d'une puce ; par conséquent, le processus d'assemblage est simple et les exigences de précision de l'assemblage sont faibles, la désolidarisation du matériau solide de dissipation de chaleur causée par les vibrations du véhicule est évitée, et l'effet de dissipation de chaleur est assuré.
PCT/CN2021/122323 2021-09-30 2021-09-30 Dispositif électronique et véhicule WO2023050363A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202180046269.1A CN116210354A (zh) 2021-09-30 2021-09-30 一种电子装置和车辆
PCT/CN2021/122323 WO2023050363A1 (fr) 2021-09-30 2021-09-30 Dispositif électronique et véhicule

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Application Number Priority Date Filing Date Title
PCT/CN2021/122323 WO2023050363A1 (fr) 2021-09-30 2021-09-30 Dispositif électronique et véhicule

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WO2023050363A1 true WO2023050363A1 (fr) 2023-04-06

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