WO2023050363A1

WO2023050363A1 - Electronic device and vehicle

Info

Publication number: WO2023050363A1
Application number: PCT/CN2021/122323
Authority: WO
Inventors: 万军平; 崔培华
Original assignee: 华为技术有限公司
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2023-04-06
Also published as: CN116210354A

Abstract

The present application provides an electronic device, comprising a circuit board (30) provided with a chip (31). The circuit board (30) is accommodated in a first chamber (1), and the first chamber (1) is also internally filled with a first heat-conducting liquid (3), the circuit board (30) being immersed in the first heat-conducting liquid (3), and the heat of the circuit board being easily carried away by the first heat-conducting liquid (3). As such, compared to the heat dissipation method of adhering a solid heat dissipation material onto a circuit board, there is no need to execute the operation of aligning the positions of the solid heat dissipation material and a chip; therefore, the assembly process is simple and assembly precision requirements are low, dislocation of the solid heat dissipation material caused by vehicle vibration is avoided, and the heat dissipation effect is ensured.

Description

An electronic device and vehicle

technical field

The present application relates to the field of vehicles, in particular to an electronic device and a vehicle.

Background technique

When a computing device performs calculations and processes, it generates heat. In order to prevent the computing speed from being reduced due to an overheating of the computing device, it is necessary to dissipate heat from the computing device.

At present, a cooling plate is installed on the circuit board of the computing device, and a solid heat dissipation material is arranged on the cooling plate at a position corresponding to the heat dissipation part of the circuit board, and the solid heat dissipation material is bonded to the heat dissipation part. The cooling plate is filled with cooling water, so that the heat of the circuit board is transferred to the cooling water in the cooling plate through the solid heat dissipation material, so as to realize the heat dissipation of the circuit board.

Since different types of computing devices have different types of circuit boards and require different heat dissipation parts, this heat dissipation method requires high assembly precision and is difficult to be compatible with different types of computing devices.

Contents of the invention

In view of the above problems, the embodiments of the present application provide an electronic device and a vehicle, which have low requirements on assembly accuracy and are compatible with multiple types and high-density components to be dissipated.

The first aspect of the present application provides an electronic device, including: a circuit board; a first chamber, the circuit board is accommodated in the first chamber and filled with a first heat-conducting liquid, and a heat dissipation device, the heat dissipation device is used to pass through the first The thermal fluid dissipates heat from the circuit board.

Through the above arrangement, filling the first chamber with the first heat-conducting liquid can transfer the heat on the circuit board to the first heat-conducting liquid, which is compatible with various types of circuit boards;

Avoid the alignment operation of the solid heat dissipation material and the heat dissipation components of the circuit board, the assembly process is simple, and the assembly accuracy is not high;

Avoid the dislocation of solid heat dissipation materials and poor bonding between solid heat dissipation materials and circuit boards caused by vehicle vibration;

The heat dissipation device is used to dissipate heat from the circuit board through the first heat-conducting liquid, thereby improving heat dissipation efficiency and adapting to high-power circuit boards.

In a possible implementation manner, the heat dissipation device includes: a second housing, a second chamber is arranged in the second housing, the second chamber is filled with a second heat transfer liquid, and the second housing is in contact with the first chamber .

Through the above configuration, the second heat transfer liquid in the second housing can dissipate heat from the first heat transfer liquid, thereby improving the heat dissipation effect.

In a possible implementation manner, the first chamber is located in the first housing, and the heat dissipation device may further include an air cooling unit, and the air cooling unit includes: a fan located on the first housing and a driving source connected to the fan, The fan is used for cooling the first housing.

Through the above arrangement, the first heat transfer liquid can be dissipated by air cooling, thereby improving the heat dissipation effect on the circuit board.

In a possible implementation manner, the first chamber is located in the first housing, and a sealing ring is provided between the first housing and the second housing to make the first chamber airtight.

Through the above arrangement, the sealing between the first shell and the second shell is realized, preventing the heat transfer fluid from overflowing.

In a possible implementation manner, the first housing and the second housing are detachably connected, which can facilitate the maintenance and updating of the circuit board, and is suitable for the vehicle control device.

In a possible implementation manner, the second casing includes multiple second casings, and the multiple second casings form the first chamber.

Through the above arrangement, the heat dissipation efficiency is improved, and the structure of the first chamber formed by the plurality of second housings is simpler.

In a possible implementation manner, the sealing ring includes a first sealing ring and a second sealing ring, the cross section of the first sealing ring is O-shaped; the cross section of the second sealing ring is zigzag.

Through the above settings, the O-shaped section of the first sealing ring is easy to process, and the zigzag section of the second sealing ring can effectively prevent the first heat transfer liquid from overflowing, and can withstand greater pressure, improve the sealing effect, and adapt to the vibration in the vehicle scene .

In a possible implementation manner, the second sealing ring is closer to the first chamber than the first sealing ring.

Through the above arrangement, the zigzag cross section of the second sealing ring can effectively prevent the first heat transfer liquid from overflowing between the first sealing ring and the second sealing ring, thereby preventing the overflowing heat transfer liquid from contaminating the first sealing ring and reducing the sealing effect.

In a possible implementation manner, the first sealing ring and the second sealing ring may also have other cross-sectional shapes, the first sealing ring is closer to the first chamber than the second sealing ring, and the first sealing ring and the second sealing ring The cross-sections of the rings can all be O-shaped or zigzag-shaped.

In a possible implementation manner, heat exchange fins are provided on the surface of the second housing facing the first chamber.

Through the above arrangement, it is possible to increase the contact area of the second casing with the first heat transfer liquid in the first chamber, thereby improving the heat dissipation effect.

In a possible implementation manner, the second housing is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet communicate with the second chamber.

Through the above arrangement, the second heat transfer liquid can flow in the second chamber, thereby improving the heat dissipation effect.

In a possible implementation manner, it further includes: a liquid injection port, which communicates with the first chamber and is used for injecting the first heat transfer liquid into the first chamber.

Through the above arrangement, the injection and dumping of the first heat transfer liquid can be facilitated, and the upgrade or maintenance of the circuit board can be facilitated.

In a possible implementation manner, the liquid injection port is disposed on the second housing.

In a possible implementation manner, the liquid injection port protrudes relative to a side of the second housing away from the first chamber.

Through the above arrangement, the liquid level of the first heat transfer liquid can be conveniently controlled, and when the liquid level of the first heat transfer liquid is located at the protruding part of the liquid injection port, the circuit board can be completely submerged in the first heat transfer liquid.

In a possible implementation manner, the first heat transfer liquid is fluorinated liquid or mineral oil, and the second heat transfer liquid is water.

Through the above arrangement, uniform heat dissipation of the circuit board can be realized, and the heat dissipation effect can be improved.

In one possible implementation, the electronic device is used in a control unit of the vehicle.

In a possible implementation manner, multiple chips are arranged on the circuit board.

In a possible implementation manner, a pinch plate is further arranged on the circuit board, and the pinch plate is used for installing the CPU.

Through the above arrangement, various circuit board structures can be realized.

In a possible implementation manner, it further includes: a thermally conductive solid disposed on a surface of the first chamber. The heat-conducting solid is attached to the chip, so as to realize the heat dissipation of the chip.

Through the above configuration, various heat dissipation methods can be realized to meet the heat dissipation requirements of different chips.

A second aspect of the present application provides a vehicle, including: the electronic device provided in the first aspect of the present application and any possible implementation thereof.

The electronic device provided by this application can be adapted to the vehicle-mounted scene, ensuring the heat dissipation effect of the vehicle-mounted electronic device (controller) under vibration; the assembly accuracy is not high, and workers are not required to align the solid heat dissipation material according to the position, size and height of the chip , to improve assembly efficiency; it can avoid the dislocation of solid heat dissipation materials caused by vehicle vibration and the poor bonding between solid heat dissipation materials and circuit boards, improve the heat dissipation effect, and reduce the inconvenience caused by maintenance; in addition, through the wind The circuit board is dissipated by means of cold or water cooling through the first heat-conducting liquid, which can improve heat dissipation efficiency and adapt to more types of circuit boards.

Description of drawings

The various features of the present invention and the relationship between the various features are further described below with reference to the accompanying drawings. The drawings are exemplary, some features are not shown to scale, and in some drawings, features customary in the field to which the application pertains and are not necessary for the application may be omitted, or additionally shown for the The application is not an essential feature, and the combination of the various features shown in the drawings is not intended to limit the application. In addition, in the whole specification, the content indicated by the same reference numeral is also the same. The specific accompanying drawings are explained as follows:

FIG. 1 is a schematic diagram of an application scenario of an electronic device provided by an embodiment of the present application;

FIG. 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

FIG. 3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application;

Fig. 4A is a cross-sectional view of an electronic device provided by an embodiment of the present application;

Fig. 4B is a cross-sectional view of an electronic device provided by another embodiment of the present application;

5 is a cross-sectional view of an electronic device provided by another embodiment of the present application;

Fig. 6 is a cross-sectional view of an electronic device provided by another embodiment of the present application;

7 is a cross-sectional view of an electronic device provided by another embodiment of the present application;

Fig. 8 is a cross-sectional view of an electronic device provided by another embodiment of the present application;

Fig. 9 is a cross-sectional view of a second casing of an electronic device provided by an embodiment of the present application.

Detailed ways

FIG. 1 is a schematic diagram of an application scenario of an electronic device provided by an embodiment of the present application. As shown in Figure 1, the electronic device provided by the embodiment of the present application can be applied to various controllers of the vehicle 100, for example, it can be applied to the vehicle-mounted computing platform 101, which can also be called a mobile data center (Mobile Data Center, MDC), Controllers such as a cockpit domain controller 103 (Cabin domain controller, CDC) and a vehicle controller 102 (Vehicle control unit, VCU). These controllers can be installed, for example, in the passenger seat of the vehicle, the trunk of the vehicle, and the like. The electronic device provided in the embodiment of the present application can also be applied to controllers of vehicles such as trains and airplanes. The electronic device provided by the present application is compatible with various types of circuit boards, can be used in a bumpy and vibrating environment, has a simple assembly process, and does not require high assembly accuracy.

FIG. 2 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. As shown in FIG. The first chamber 1 accommodates the circuit board 30 and is filled with the first heat transfer liquid 3 . The heat dissipation device 200 is used for dissipating heat from the circuit board 30 through the first heat conduction liquid 3 .

In some embodiments, the circuit board 30 can be a printed circuit board (Printed Circuit Board, PCB), ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, printed circuit board, aluminum substrate, high Frequency board, thick copper board, etc. As shown in Fig. 3-Fig. 8, one or

more chips

31, 32, 33 can be arranged on one or both sides of the circuit board 30, and the

chips

31, 32, 33 can be central processing units (central processing unit, CPU), Graphics processing unit (graphic processing unit, GPU), neural network processor (neural network processing unit, NPU), digital signal processing unit (Digital Signal Process, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA) One or a combination of etc. These

chips

31, 32, 33 can have different sizes and heights, and are distributed in different positions of the circuit board 30. The chips 33 can also be installed on the circuit board 30 through the pinch plate 70, so as to facilitate the replacement of the chips 33 due to later upgrades.

In some embodiments, as shown in Fig. 3-Fig. It can be composed of a plurality of (two schematically drawn in FIG. 5 ) second housings 20; as shown in FIG. 8, the first chamber 1 can also be composed of a third housing 81 and a fourth housing 82; of course , The first chamber can also be formed by an integrally formed airtight casing (not shown in the figure).

In some embodiments, as shown in FIG. 3-FIG. 7 and FIG. 9, the heat sink 200 can be configured as a second shell 20 filled with the second heat transfer liquid 4; as shown in FIG. 8, the heat sink 200 can also be configured It is the third casing 81 and the air cooling unit 90 arranged on the third casing 81 . Wherein, the second heat conducting liquid may be water, and the first heat conducting liquid may be fluorinated liquid or mineral oil.

In some embodiments, a sealing ring is provided between the first housing 10 and the second housing 20 to seal the first chamber 1 . Wherein, there may be one or more sealing rings. In the examples shown in FIGS. 3-8 , the sealing ring includes a first sealing ring 51 and a second sealing ring 52 . The first sealing ring 51 is located in the first groove 11 of the first housing 10 , and the second sealing ring 52 is located in the second groove 12 of the first housing 10 . Optionally, as shown in FIG. 4A , the first sealing ring 51 may be an O-ring with an O-shaped cross section, and the second sealing ring 52 may be a toothed sealing ring. It should be noted that the first groove 11 and the second groove 12 may also be provided on the second housing 20 , or grooves may be provided on both the first housing 10 and the second housing 20 .

FIG. 3 is a schematic diagram of an exploded structure of an electronic device provided by an embodiment of the present application. As shown in FIG. 3 , an electronic device provided by an embodiment of the present application includes: a first housing 10 , a second housing 20 and a circuit board 30 . The first housing 10 and the second housing 20 together form a first chamber 1, and the first chamber 1 accommodates a circuit board 30 and a first heat transfer liquid 3 (see FIG. 4A ). The first heat transfer liquid 3 may be a non-conductive non-aqueous fluid, for example, the first heat transfer liquid 3 may be a fluorinated liquid or mineral oil. Fill the first chamber 1 with the first heat-conducting liquid 3, so that the circuit board 30 is immersed in the first heat-conducting liquid 3, the heat on the circuit board 30 can be transferred to the first heat-conducting liquid 3, thereby reducing the temperature of the circuit board 30 . In this way, the circuit board 30 can be well cooled without having to provide a solid heat dissipation material between the circuit board 30 and the first and

second housings

10, 20, thereby suppressing the complexity of assembly caused by installing and adjusting the solid heat dissipation material, Makes the assembly process simple. In addition, the same set of first and

second shells

10, 20 can be used to install multiple different types of circuit boards 30, wherein multiple circuit boards 30 can also be placed in the first chamber 1, thereby reducing manufacturing costs.

As shown in Figure 3, one or

more chips

31, 32 can be arranged on one side or both sides of the circuit board 30, as mentioned above, the

chips

31, 32 can be respectively CPU, GPU, NPU, DSP, FPGA, etc. One or a combination etc. These

chips

31 , 32 may have different sizes and heights, and are distributed at different positions on the circuit board. In the examples shown in FIGS. 3-6 , the chips 31 are directly mounted on the circuit board 30 . In the example shown in FIG. 7 , the chip 33 is mounted on the circuit board 30 through a pinch plate 70 , so as to facilitate the replacement of the chip 33 after upgrading.

As shown in FIG. 3 , the first housing 10 may have a first opening 13 , a groove and a first mounting portion 14 . In the example shown in FIG. 3 , the first casing 10 is in the shape of a cuboid box with a first opening 13 on one side. The second housing 20 is installed on the first housing 10 to close the first opening 13 , thereby constituting the first chamber 1 together with the first housing 10 . The circuit board 30 is installed in the first chamber 1 . The side of the circuit board 30 on which the

chips

31 , 32 are installed may be in the same direction as the opening of the first opening 13 , that is, facing the second housing 20 . The groove is formed on the edge of the first opening 13, and surrounds the first opening 13 in a ring shape, and is used to accommodate the sealing ring, so that the first chamber 1 is a closed chamber, preventing the first heat transfer liquid 3 from the first chamber 1 Outflow.

Optionally, the groove may include: a first groove 11 and a second groove 12, the first groove 11 and the second groove 12 are formed on the edge of the first opening 13 and surround the first opening 13 in a ring shape, The sealing rings 51 and 52 are respectively used to install, so that the first chamber 1 is an airtight chamber, preventing the first heat transfer liquid 3 from flowing out of the first chamber 1 .

Optionally, the second groove 12 is closer to the first chamber 1 than the first groove 11 , that is to say, the first groove 11 is located at the periphery of the second groove 12 . The first groove 11 can accommodate the first sealing ring 51 , and the second groove 12 can accommodate the second sealing ring 52 . Optionally, as shown in FIG. 4A, the first sealing ring 51 may be an O-ring with an O-shaped cross section, and the second sealing ring 52 may be a toothed sealing ring. In this embodiment, viewed from the cross section, The part in contact with the second housing 20 has a zigzag or triangular shape. It should be noted that the first groove 11 and the second groove 12 may also be provided on the second housing 20 , or grooves may be provided on both the first housing 10 and the second housing 20 . The setting of the sealing ring realizes the sealing between the first housing 10 and the second housing 20, avoiding the overflow of the first heat transfer liquid 3, the O-shaped section of the first sealing ring is convenient for processing, and the zigzag shape of the second sealing ring 52 The section can effectively prevent the first heat transfer liquid 3 from overflowing, and can withstand greater pressure, improve the sealing effect, and adapt to the vibration in the vehicle scene.

As shown in FIG. 3 , the first mounting portion 14 may be located outside the first opening 13 and protrude outward relative to the first housing 10 for fixing the second housing 20 . In the example shown in FIG. 3 , the first installation portion 14 is arranged on both sides of the first housing 10 , but the application is not limited thereto, and the first installation portion 14 can also be arranged on the four sides of the first housing 10 superior. Fasteners can be used to fix the first housing 10 and the second housing 20 together, and there can be holes for fasteners on the first mounting part 14. For example, the holes for fasteners can be threaded holes for using screws. The first case 10 and the second case 20 are fixed. This fixing method between the first housing 10 and the second housing 20 can facilitate the replacement and maintenance of the circuit board 30 and the upgrading of chips on the circuit board, and is especially suitable for controllers in the field of automatic driving and intelligent driving. Iterative updates.

As shown in FIGS. 3 and 9 , the second housing 20 may have a second chamber 2 . In the example shown in FIG. 3 , the second housing 20 is in the shape of a cuboid box with a cavity (ie, the second chamber 2 , see FIG. 4A and FIG. 9 ). As shown in FIG. 9, the second chamber 2 is located in the second housing 20, and a plurality of liquid guide walls 26 may be arranged in the second chamber 2, so as to facilitate the path formed by the second heat transfer liquid 4 along the liquid guide walls 26. Flow in the second chamber 2 to improve cooling efficiency. The second chamber 2 may be filled with a second heat transfer liquid 4 (see FIG. 4A ). The second heat transfer liquid may be water. Optionally, the second housing 20 may further include: a liquid inlet 23 and a liquid outlet 22 . The liquid inlet 23 and the liquid outlet 22 communicate with the second chamber 2 and are used for introducing and exporting the second heat transfer liquid respectively. In the example shown in FIG. 3 , the liquid inlet 23 and the liquid outlet 22 are arranged on one side of the cuboid, but this application does not limit it, and the liquid inlet 23 and the liquid outlet 22 can also be arranged at any position. The liquid inlet 23 and the liquid outlet 22 can respectively communicate with a heat transfer liquid driving source (such as a water pump), so that the second heat transfer liquid circulates in the second chamber 2 . The second heat transfer liquid flowing out of the second chamber 2 dissipates heat in a radiator not shown, and then flows back into the second chamber 2 .

Optionally, the second housing 20 may further include a second mounting portion 24. In the example shown in FIG. correspond. Of course, the present application is not limited thereto, and the second mounting portion 24 may also be disposed around the second housing 20 , for example, disposed on four sides respectively. When the second casing 20 is installed on the first casing 10, the second casing 20 covers the first opening 13, and the second mounting portion 24 of the second casing 20 can be fixed together with the first mounting portion 14. Fastener holes may also be provided on the second mounting part 24, for example, the fastener holes may be threaded holes, then the first mounting part 14 and the second mounting part 24 may be fixed together by screws.

Optionally, the second housing 20 may further include a first heat transfer liquid injection port 21 . The first heat transfer liquid injection port 21 communicates with the first chamber 1 for injecting the first heat transfer liquid 3 into the first chamber 1 . As shown in FIG. 4A , the first heat transfer liquid injection port 21 may pass through the second housing 20 along the Y direction or at a certain angle inclined along the Y direction, and protrude relative to the second housing in the Y direction. As shown in FIG. 4B, the first heat transfer liquid injection port 21 can also be arranged on the side wall of the first casing 10, that is, the side wall of the first casing protrudes outward (X direction) and extends toward the second The casing (Y direction) extends to form a first heat transfer liquid injection port 21 . The height of the first heat transfer liquid injection port 21 may be flush with the outer surface of the second casing, or may be higher than the outer surface of the second casing as shown in FIG. 4B . Of course, the first heat transfer liquid injection port 21 may also be jointly formed by the first housing 10 and the second housing 20 . In the state where the second housing 20 and the first housing 10 are fixed together, the first heat transfer liquid 3 is injected into the first chamber 1 through the first heat transfer liquid injection port 21 until the first heat transfer liquid 3 has the same The first liquid surface 35 (refer to the bold dotted line in FIG. 4B ) in contact with the second housing and the second liquid surface 34 (refer to the solid line in FIG. 4B ) which is lower than the opening of the first heat transfer liquid injection port 21 . In this embodiment, the length direction of the plane where the first housing 10 is located is the X direction, the width direction of the plane where the first housing 10 is located is the Z direction, and the height direction of the plane where the first housing 10 is located is the Y direction , it can also be said that the direction perpendicular to the plane where the first casing 10 is located is the Y direction, and at the same time, the Y direction is also a direction perpendicular to the board surface of the circuit board 30 .

In some embodiments, as shown in FIG. 4A , heat exchanging fins 60 may also be provided on the surface of the second housing 20 facing the first chamber 1 , and the heat exchanging fins 60 may be directed toward the second housing 20 . The protruding sheet metal sheet is used to increase the contact area between the second shell 20 and the first heat transfer liquid 1 , so as to improve the heat dissipation efficiency.

FIG. 5 is a cross-sectional view of an electronic device provided by another embodiment of the present application. In this embodiment, as shown in FIG. 5 , the first housing 10 may also have a second opening 15 , which is applicable to the case of having multiple second housings 20 . The second opening 15 is opposite to the first opening 13 . A groove for accommodating a sealing ring is provided around the edge of the second opening 15 . In the example shown in FIG. 5 , optionally, the grooves include a third groove 16 and a fourth groove 17 . The third groove 16 and the fourth groove 17 are similar to the first groove 11 and the second groove 12, and are used to accommodate sealing rings, and the third groove can be used to accommodate O-shaped seals with an O-shaped cross section. O-ring, the fourth groove 17 can be used to accommodate a saw-tooth seal ring with a saw-tooth cross section. The structures of the O-ring seal and the saw-tooth seal ring are the same as those in the foregoing embodiments, and for the sake of brevity, details are not repeated here.

As shown in FIG. 5 , the two second shells 20 respectively cover the first opening 13 and the second opening 15 , and are fixed to the first shell 10 , thereby constituting the first chamber 1 together with the first shell 10 . The method of fixing the plurality of second shells 20 to the first shell 10 is the same as the above-mentioned embodiments, and the second mounting part and the first mounting part can be fixed together by screws, and for the sake of brief introduction, details are omitted here. When chips are mounted on both sides of the circuit board 30 , the chips on both sides of the circuit board 30 can dissipate heat through the second housing 20 . In the embodiment shown in FIG. 5 , heat exchange fins 60 may be provided on the surface of one or two second shells 20 facing the first chamber 1 according to the situation, or no heat exchange fins 60 may be provided.

FIG. 7 is a cross-sectional view of an electronic device provided by another embodiment of the present application. In this embodiment, as shown in FIG. 7 , the electronic device may further include a pinch plate 70 . The pinch plate 70 is used for installing the chip 33 so as to replace the chip 33 due to the later upgrade of the chip 33 . The pinch plate 70 includes a first support portion 71, a second support portion 72 and a mounting portion 73. The first support portion 71 and the second support portion 72 are located on the circuit board 30, and the mounting portion 73 is supported by the first support portion 71 and the second support portion. The chip 33 is supported by the mounting portion 72 , and the chip 33 is mounted on the mounting portion 73 .

In some embodiments, as shown in FIG. 3 and FIG. 6 , the electronic device may further include a solid heat conducting part 40 , which is also referred to as a heat conducting solid in this application. The solid heat conduction part 40 is located on the surface of the second housing 20 facing the first chamber 1 and corresponds to the position of the chip 31 of the circuit board 30 . The solid heat conduction part 40 is attached to the chip 31 for dissipating heat from the chip 31 . Wherein, the solid heat conduction part 40 can be a thermal interface material (Thermal Interface Materials, TIM), and the thermal interface material can include, for example, one or more of the following: silicone grease, silica gel, heat dissipation gasket, phase change material, phase change metal sheet heat conduction glue. In the embodiment described above, the whole circuit board 30 is accommodated in the first chamber 1, however, as other embodiments, it is also possible that a part of the circuit board 30 is immersed in the first heat transfer liquid 3, and the parts not immersed in the heat transfer liquid The electronic components arranged on other parts can dissipate heat by contacting the second housing 20 with the same heat-conducting material as the solid heat-conducting part 40 .

In another embodiment, as shown in FIG. 6 , the electronic device may include: a circuit board 30 and a plurality of second housings 20 . The difference from the above embodiments is that the first chamber 1 is formed by two second housings 20 . The second housing can be in the shape of a cuboid box with a third opening, and the edge of the third opening is annularly provided with a groove and a sealing ring similar to the above-mentioned embodiment. When the two second housings 20 are fixed together, The first chamber 1 is formed by combining the third openings of the two cuboids, and the first chamber is sealed by a sealing ring. The second chamber of the second housing may be located in the side walls of the cuboid, for example, as shown in FIG. 6 , may be located in all the side walls. The second chamber can also be located only in the side walls parallel to the circuit board.

In another embodiment, as shown in FIG. 8 , the electronic device provided by the embodiment of the present application may include: a circuit board 30 , a third housing 81 , a fourth housing 82 and an air cooling unit 90 . The structure of the fourth housing 82 is the same as that of the first housing 10 of the above-mentioned embodiment. The fourth housing 82 can be a cuboid with a cavity (i.e. the first chamber 1), and one side thereof is not closed (i.e. the first opening 13 ). The first opening 13 communicates with the first chamber 1 for installing the circuit board 30 and the third housing 81 . The side of the circuit board 30 on which the chips are installed may be in the same direction as the opening direction of the first opening 13 . Similar to the foregoing embodiments, the edge of the first opening 13 can be provided with grooves for accommodating the sealing ring, and there can be one or more grooves. In the example shown in FIG. 8 , the grooves include the first groove and the first groove. The second grooves are respectively used for installing sealing rings, so that the first chamber 1 can be sealed by the third housing 81 through the sealing rings, preventing the first heat transfer liquid 3 from flowing out of the first chamber 1 . For the description about the sealing ring, reference may be made to the above-mentioned embodiments, and for the sake of brevity, details are not repeated here.

The third housing 81 and the fourth housing 82 together form the inner first chamber 1 for containing the first heat transfer liquid 3 and the circuit board 30 . Same as the above embodiment, the third housing 81 is provided with a first heat transfer liquid inlet 25, and the first heat transfer liquid inlet 25 communicates with the first chamber 1 for injecting the first heat transfer liquid into the first chamber 1. Heat transfer liquid 3. The air cooling unit 90 may include a fan 91 and a driving source. The fan 91 may be located on the outer surface of the third housing 81 for cooling the circuit board 30 through the first heat transfer liquid 3 .

The electronic device improved by the above-mentioned embodiments of the present application can ensure the heat dissipation effect of the vehicle-mounted electronic device (also known as the controller) under the condition of vibration; the assembly accuracy is not high, the assembly method is simple and fast, and there is no need for workers to check the position of the chip. , size and height are aligned with the solid cooling block to improve assembly efficiency; reduce the dislocation of the solid cooling material caused by vehicle vibration and poor bonding between the solid cooling material and the circuit board, ensure the cooling effect, and reduce the inconvenience caused by maintenance; In addition, cooling the circuit board through the first heat-conducting liquid through air cooling or water cooling can improve heat dissipation efficiency and adapt to more types of circuit boards.

The words "first, second, third, etc." and similar terms in the description and claims are only used to distinguish similar objects, and do not represent a specific ordering of objects. It is understandable that they can be interchanged where allowed The specific order or sequence is such that the embodiments of the application described herein can be practiced in other sequences than those illustrated or described herein.

Reference in this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, appearances of the phrases "in one embodiment" or "in an embodiment" in various places in this specification do not necessarily all refer to the same embodiment, but may. Furthermore, the particular features, structures or characteristics may be combined in any suitable manner, as would be apparent to one of ordinary skill in the art from this disclosure, in one or more embodiments.

Note that the above are only preferred embodiments and technical principles used in this application. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present application has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention, all of which belong to protection scope of the present invention.

Claims

An electronic device, characterized in that: comprising:

circuit board;

a first chamber, the first chamber accommodates the circuit board and is filled with a first heat-conducting liquid; and

The heat dissipation device is used for dissipating heat from the circuit board through the first heat conducting liquid.
The electronic device according to claim 1, wherein the heat dissipation device comprises: a second housing, a second chamber is arranged in the second housing, and the second chamber is filled with a second heat-conducting liquid , the second housing is in contact with the first chamber.
The electronic device according to claim 2, wherein the first chamber is located in the first casing, and a sealing ring is provided between the first casing and the second casing so that the first A chamber is sealed.
The electronic device according to claim 2, wherein the second casing comprises a plurality of second casings, and the plurality of second casings constitute the first chamber.
The electronic device according to claim 3, wherein the sealing ring comprises a first sealing ring and a second sealing ring,

The cross-section of the first sealing ring is O-shaped;

The cross section of the second sealing ring is zigzag.
The electronic device according to claim 5, wherein the second sealing ring is closer to the first chamber than the first sealing ring.
The electronic device according to any one of claims 3-6, characterized in that, a surface of the second casing facing the first chamber is provided with heat exchanging fins.
The electronic device according to any one of claims 2-7, wherein the second housing is provided with a liquid inlet and a liquid outlet, and the liquid inlet and the liquid outlet are the same The second chamber communicates.
The electronic device according to any one of claims 2-8, further comprising:

A liquid injection port, the liquid injection port communicates with the first chamber, and is used for injecting the first heat transfer liquid into the first chamber.
The electronic device according to claim 9, wherein the liquid injection port is disposed on the second housing.
The electronic device according to any one of claims 2-10, wherein the first heat-conducting liquid is fluorinated liquid or mineral oil, and the second heat-conducting liquid is water.
The electronic device according to any one of claims 1-11, characterized in that the electronic device is used in a control unit of a vehicle.
The electronic device according to any one of claims 1-12, wherein a plurality of chips are arranged on the circuit board.
The electronic device according to any one of claims 1-13, wherein a pinch plate is further arranged on the circuit board, and the pinch plate is used for installing a CPU.
The electronic device according to any one of claims 1-14, further comprising: a thermally conductive solid disposed on a surface of the first chamber.
A vehicle, characterized by comprising: the electronic device according to any one of claims 1-15.