WO2023046320A1 - Kartenförmiger datenträger und verfahren zum lösen einer klebeverbindung für einen kartenförmigen datenträger - Google Patents
Kartenförmiger datenträger und verfahren zum lösen einer klebeverbindung für einen kartenförmigen datenträger Download PDFInfo
- Publication number
- WO2023046320A1 WO2023046320A1 PCT/EP2022/025441 EP2022025441W WO2023046320A1 WO 2023046320 A1 WO2023046320 A1 WO 2023046320A1 EP 2022025441 W EP2022025441 W EP 2022025441W WO 2023046320 A1 WO2023046320 A1 WO 2023046320A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- card
- adhesive
- card body
- data carrier
- chip module
- Prior art date
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 134
- 239000000853 adhesive Substances 0.000 title claims abstract description 132
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000010410 layer Substances 0.000 claims description 53
- 239000002346 layers by function Substances 0.000 claims description 19
- 239000000126 substance Substances 0.000 claims description 16
- 230000005540 biological transmission Effects 0.000 claims description 10
- 238000004090 dissolution Methods 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 8
- 150000003839 salts Chemical class 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000004064 recycling Methods 0.000 description 20
- 239000000463 material Substances 0.000 description 10
- 239000003292 glue Substances 0.000 description 4
- 244000043261 Hevea brasiliensis Species 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 3
- 230000001939 inductive effect Effects 0.000 description 3
- 229920003052 natural elastomer Polymers 0.000 description 3
- 229920001194 natural rubber Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000005672 electromagnetic field Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000002354 daily effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 239000011796 hollow space material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/305—Associated digital information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/328—Diffraction gratings; Holograms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/369—Magnetised or magnetisable materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/40—Manufacture
- B42D25/45—Associating two or more layers
- B42D25/465—Associating two or more layers using chemicals or adhesives
- B42D25/47—Associating two or more layers using chemicals or adhesives using adhesives
Definitions
- the present invention relates to a card-shaped data carrier and a method for releasing an adhesive connection for a card-shaped data carrier.
- the individual components are difficult to separate from one another due to the robust adhesive connections.
- smart cards are made of different materials, particularly recyclable and non-recyclable materials, it is important to disassemble the smart card into its individual components after the expiration date for the recycling process.
- the smart cards are processed with a cutting tool or punching tool or laser cutters to separate the individual components, but not completely it can be ensured that the individual components can be separated cleanly and completely. This can sometimes complicate the recycling process. From an environmentally friendly perspective, however, the recycling of smart cards, in particular smart cards made of plastic, is becoming increasingly important.
- the object of the present invention is therefore to specify a card-shaped data carrier, in particular a smart card, in which the individual components can be easily separated from one another for an efficient and simplified recycling process. Furthermore, it is the object of the present invention to specify a method for releasing an adhesive connection for a card-shaped data carrier.
- a card-shaped data carrier in particular a smart card
- a electronic chip module with at least one chip and a contact structure and a card body with an arrangement area for accommodating the chip module, the chip module being arranged in the arrangement area of the card body and being connected to the card body by means of at least one adhesive, the adhesive used to separate the connection between the chip module and the card body is designed to be thermolytically and/or chemically dissolvable in a predetermined temperature range.
- the chip module includes at least one chip and one contact structure.
- Data transfer can be established between the smart card and a reader.
- the chip is preferably connected to contacts of the contact structure via wires.
- the number, size and position of the contacts can be defined by international standards so that the function of the smart card can be ensured in every reader.
- additional components can be provided for the chip module, such as a capacitor or an antenna (as a coil) for capacitive or inductive contactless data transmission.
- a contactless smart card can communicate with a reader through electromagnetic waves, where the smart card can function similar to a transceiver.
- electromagnetic waves emitted by the reading device generate an oscillating electromagnetic field which, for example, generates an oscillating electrical voltage in the coil or antenna of the chip module, as a result of which the chip can be supplied with current.
- the voltage fluctuations can be captured as a signal and converted into data in the chip.
- This data can in turn be processed in the chip and translated into changes in the electromagnetic field be implemented, which in turn can be picked up by the reader and converted into data.
- the chip module can therefore enable contact-based and/or contactless data transmission.
- the adhesive is designed to be thermolytically dissolvable in a predetermined temperature range.
- the chemical structure of the adhesive can be irreversibly changed so that it loses its adhesive properties.
- the binding forces of the adhesive are released and the connection between the chip module and the card body is thus severed.
- the term "thermolytic” refers in particular to a temperature change, such as a temperature increase or a temperature decrease in a specified temperature range.
- the adhesive according to the invention can be used to connect different components of the smart card to one another.
- the same adhesive in particular the same adhesive material, can also be used to hologram and/or a magnetic stripe to the card body.
- the same adhesive can be used several times to connect the different components of the smart card.
- different adhesive materials can be used to connect Connection of the individual components are used, but each adhesive material has the property of in one given temperature range has thermolytic and / or chemical dissolution.
- the invention has the advantage that the connection of the individual components, for example the chip module and the card body, can be easily and completely separated due to the dissolution of the adhesive. This simplifies the recycling process of the smart card in particular, since the individual components are cleanly separated from one another and can be efficiently recycled depending on the material composition.
- the chip module can be separated from the card body in a particularly simple manner, and there is no need for laborious cutting out or punching out of the chip module, with any residues of the adhesive.
- polymer adhesives can preferably be used which do not have too high a temperature stability.
- polyurethane adhesives are conceivable.
- the use of natural rubber as an adhesive would also be conceivable.
- a temperature range is provided in which the stability of the adhesive connection is not jeopardized in everyday use of the smart card.
- the adhesive does not have too high a temperature resistance at very high or very low temperatures.
- Examples of conceivable adhesives for this would be natural rubber with temperature resistance up to about +65°C, or acrylate adhesives with a temperature resistance between approximately -15°C and +60°C.
- the smart card is subjected to a temperature treatment in a predetermined temperature range in a recycling device, whereby the adhesive dissolves and the individual components of the smart card can be sorted and further processed for the individual material-dependent recycling process.
- the adhesive is designed to be chemically dissolvable using a chemical and/or acid and/or salt water.
- the adhesive can be dissolved using a solvent or a lye.
- the use of natural rubber as an adhesive is conceivable, which only has a limited resistance to chemicals or solvents.
- an adhesive that is designed to be dissolvable using an uncommon chemical can preferably be used in order to ensure the safe use of the smart card in daily use. More preferably, a chemical is used to dissolve the adhesive that does not have any harmful environmental effects, so that the recycling process is not adversely affected by the use of the chemical.
- the smart card is subjected to a chemical treatment with an acid in a recycling device, which dissolves the adhesive and the individual components of the smart card can be sorted and further processed for the individual material-dependent recycling process.
- the acid is sprayed onto the smart card, or the smart card is immersed in the acid.
- the adhesive is biodegradable. In particular, this increases the efficiency of the recycling process and represents a very environmentally friendly use.
- a hollow space can be produced as a recess in the card body, for example by milling.
- the chip module can then be glued into this cavity with the adhesive and stored protected in the card body.
- the design of the recess in the card body is particularly suitable for smart cards with contact-based data transmission.
- the chip module can be partially or completely embedded in the adhesive and glued or arranged in the recess of the card body by means of the adhesive.
- the adhesive is arranged, in particular completely, between the chip module and the card body.
- the card-shaped data carrier also includes a magnetic stripe which is arranged on a surface of the card body, the magnetic stripe being connected to the card body by means of the adhesive.
- the adhesive is arranged between the magnetic stripe and the surface of the card body, with the adhesive extending at least partially, in particular completely, along the magnetic stripe.
- the card-shaped data carrier also comprises at least one hologram which is arranged on a surface of the card body, the hologram being connected to the card body by means of the adhesive.
- the adhesive is arranged between the hologram and the surface of the card body.
- the card body can be formed from at least two layers, the layers being connected to one another by means of the adhesive.
- the adhesive is located between the layers.
- a multiplicity of layers can preferably also be provided for the card body, with the adhesive for connecting the layers being arranged between the individual layers in each case.
- Certain functions in the card body can advantageously be realized by means of the layers, it being possible for the layers to be in the form of design layers or transparent cover layers, etc., for example.
- the layers can be easily and completely separated from one another by the adhesive.
- the adhesive extends at least partially, in particular completely, along the layers.
- the adhesive extends the entire length of the layers to increase adhesion or bonding between the layers.
- the card body has at least one antenna for contactless data transmission.
- the antenna can preferably be designed as a coil for inductive contactless data transmission, which is coupled to the chip.
- the antenna can be integrated in a layer of the card body.
- the coil is integrated into the adhesive.
- a method for releasing an adhesive connection for a card-shaped data carrier in particular for a smart card, which comprises an electronic chip module with at least one chip and a contact structure and a card body with an arrangement area for accommodating the chip module, the The chip module is arranged in the arrangement area of the card body and is connected to the card body by means of at least one adhesive, the method comprising the following steps:
- the method according to the invention has the same advantages as have been explained with regard to the card-shaped data body according to the invention.
- FIG. 1 shows a sectional view of a card-shaped data carrier according to an embodiment of the invention
- FIG. 2 shows a sectional view of a card-shaped data carrier according to a further exemplary embodiment of the invention
- FIG. 3 shows a plan view of a card-shaped data carrier according to a third exemplary embodiment of the invention
- FIG. 4 shows a sectional view of a card-shaped data carrier according to a fourth exemplary embodiment of the invention.
- FIG. 5 shows a schematic view of a method according to the invention for releasing an adhesive bond.
- FIG. 1 shows a sectional view of a card-shaped data carrier 10 according to an embodiment of the invention.
- the card-shaped data carrier 10 in particular a smart card, comprises an electronic chip module 12 and a card body 11 with an arrangement area 16 for receiving the chip module 12.
- the card body 11 is preferably formed from a plastic material.
- the chip module 12 has a chip (not shown) and a contact structure. In this way, contact-based data transmission can be established between the smart card and a reading device.
- the chip is preferably connected via wires to the contacts Set contact structure in connection, the contacts are defined by international standards.
- the chip module 12 is arranged in the arrangement area 16 of the card body and is connected to the card body 11 by means of an adhesive 21 .
- the adhesive 21 is designed to be thermolytically and/or chemically soluble in a predetermined temperature range in order to separate the connection between the chip module 12 and the card body 11 .
- the arrangement area 16 is formed as a recess 17, in particular a milled cavity, in the card body 11, the chip module 12 being arranged in the recess 17 and being connected to the card body 11 by means of the adhesive 21.
- the chip module 12 is partially embedded in the adhesive 21 from two sides.
- the adhesive 21 is arranged between the chip module 12 and the card body 11 .
- the card-shaped data carrier 10 comprises a magnetic stripe 14 which is arranged on a lower surface, in particular on a rear side, of the card body 11, the magnetic stripe 14 being connected to the card body 11 by means of a second adhesive 22.
- the second adhesive 22 is arranged between the magnetic stripe 14 and the surface of the card body 11, with the second adhesive 22 extending completely along the magnetic stripe 14.
- the second adhesive is designed to be thermolytically and/or chemically soluble in a predetermined temperature range, analogous to the first adhesive 21 for separating the connection between the magnetic strip 14 and the card body 11 .
- the second adhesive 22 and the first adhesive 21 are the same.
- the card-shaped data carrier 10 comprises a hologram 13 which is arranged on an upper surface of the card body 11, in particular on a front side of the card body 11, the hologram 13 being connected to the card body 11 by means of a third adhesive 23.
- the third adhesive 23 is arranged between the hologram 13 and the surface of the card body 11 .
- the third adhesive 23 is analogous to the first adhesive 21 for separating the connection between the hologram 13 and the card body 11 formed thermolytically and / or chemically dissolvable in a predetermined temperature range.
- the third adhesive 23 and the first adhesive 21 are the same.
- FIG. 2 shows a sectional view of a card-shaped data carrier 10 according to a further embodiment of the invention.
- the card-shaped data carrier 10 in particular a smart card, comprises an electronic chip module (not shown for the sake of clarity) with at least one chip and a contact structure and a card body 11 with an arrangement area (not shown) for accommodating the chip module.
- the chip module is arranged in the arrangement area of the card body 11 and is connected to the card body 11 by means of at least one adhesive.
- the adhesive for separating the connection between the chip module and the card body is designed to be thermolytically and/or chemically soluble in a predetermined temperature range.
- the card body 11 is formed from five layers, namely a first layer 11a, a second layer 11b, a third layer 11c, a fourth layer 11d and a fifth layer 11e.
- the layers 11a, b, c, d, e are each connected to one another by means of an adhesive.
- a first adhesive 21 is arranged between the first layer 11a and the second layer 11b, with the first adhesive 21 extending along the entire length of the layers 11a, b.
- a second adhesive 22 is arranged between the second layer 11b and the third layer 11c, which extends between the entire length of the layers 11b, c.
- a third adhesive 23 is arranged between the third layer 11c and the fourth layer 11d, which adhesive extends between the entire length of the layers 11c, d. Furthermore, there is a fourth adhesive 24 between the fourth layer 11d and the fifth layer lle arranged, which extends between the entire length of the layers lld, e.
- the adhesives 21, 22, 23, 24 are the same and can be dissolved thermolytically and/or chemically in a predetermined temperature range.
- the layers 11a, b, c, d, e are designed as plastic layers.
- a hologram 13 is arranged on the first layer 11a, which can be regarded as a design layer by way of example.
- a magnetic stripe 14 is arranged on the fifth layer Ile.
- An antenna 15 is integrated in the middle layer 11c, for example.
- the antenna 15 is formed, for example, as a coil and is illustrated by the circles.
- the antenna 15 is coupled to the chip module (not shown), with the antenna 15 being able to enable inductive, contactless data transmission.
- the antenna 15 runs along the edges of the third layer 11c as the middle layer. Due to the connection of the layers 11a, b, c, d, e by means of the dissolvable adhesives 21, 22, 23, 24, the layers 11a, b, c, d, e can be easily and completely separated from one another. This allows the recycling process to be carried out efficiently and easily.
- FIG. 3 shows a top view of a card-shaped data carrier 10, in particular a smart card, according to a third exemplary embodiment of the invention.
- the card-shaped data carrier 10 comprises an electronic chip module 12 and a card body 11 with an arrangement area 16 for receiving the chip module 12, the chip module 12 being arranged in the arrangement area 16 of the card body 11 and by means of at least one adhesive, not shown is connected to the card body 11.
- the arrangement area 16 can be designed as a recess 17, in particular a milled cavity, in the card body 11, the chip module 12 being arranged in the recess 17 and being connected to the card body 11 by means of the adhesive.
- the adhesive is designed to be thermolytically and/or chemically soluble in a predetermined temperature range.
- the chip module 12 according to FIG. 3 is designed as a functional module and includes a chip (not shown), a contact structure (not shown) and other components (not shown), such as a hologram and an antenna. Consequently, both contact-based and contactless data transmission can be made possible by means of the functional module.
- the recycling process can be further simplified by designing the chip module 12 as a functional module, since it is only necessary to separate the functional module from the card body 11 . This can be done by dissolving the adhesive, as a result of which the functional module and the card body 11 can be separated easily and completely. Alternatively, it is also conceivable that the functional module can be separated from the card body 11 by a stamping process and can be recycled separately.
- FIG. 4 shows a sectional view of a card-shaped data carrier 10 according to a fourth embodiment of the invention.
- the card-shaped data carrier 10 in particular a smart card, comprises an electronic chip module 12 with a chip 12a and a contact structure, not shown, and a card body 11 with an arrangement area 16 for accommodating the chip module 12.
- the chip module 12 is arranged in the arrangement area 16 of the card body 11, the arrangement area 16 being designed as a surface of the card body 11.
- the chip module 12 is connected to the card body 11 by means of an adhesive 21 .
- the adhesive 21 is arranged between the chip module 12 and the surface of the card body 11 .
- the adhesive 21 is designed to be thermolytically and/or chemically soluble in a predetermined temperature range in order to separate the connection between the chip module 12 and the card body 11 .
- the chip module 12 is embodied as a functional layer, the functional layer being arranged completely on the surface as an arrangement area 16 of the card body 11, the functional layer being connected to the card body 11 by means of the adhesive 21.
- the functional layer also includes an antenna 15 and a hologram 13.
- the hologram 13 is arranged, for example, on a surface of the functional layer.
- the chip 12a is arranged on the surface of the functional layer opposite the hologram 13, in particular the underside.
- the chip 12a is integrated into the adhesive 21 and is therefore stored in a protected manner.
- the antenna 15 is integrated into the adhesive 21, for example, and is coupled to the chip 12a for contactless data transmission in a manner that is not shown.
- FIG. 5 shows a schematic view of a method according to the invention for releasing an adhesive connection for a card-shaped Data carrier, in particular for a smart card, which comprises an electronic chip module with at least one chip and a contact structure and a card body with an arrangement area for accommodating the chip module, the chip module being arranged in the arrangement area of the card body and connected to the card body by means of at least one adhesive is, the method comprising the following steps:
- Further components of the card-shaped data carrier such as a hologram or a magnetic stripe, can preferably be connected to the card body by means of the adhesive and thus dissolved thermolytically in a predetermined temperature range or chemically.
- the adhesive By dissolving the adhesive, the individual components of the card-shaped data carrier can be easily and completely separated from one another.
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- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102021004810.5A DE102021004810A1 (de) | 2021-09-23 | 2021-09-23 | Kartenförmiger Datenträger und Verfahren zum Lösen einer Klebeverbindung für einen kartenförmigen Datenträger |
DE102021004810.5 | 2021-09-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2023046320A1 true WO2023046320A1 (de) | 2023-03-30 |
Family
ID=83506237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2022/025441 WO2023046320A1 (de) | 2021-09-23 | 2022-09-22 | Kartenförmiger datenträger und verfahren zum lösen einer klebeverbindung für einen kartenförmigen datenträger |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102021004810A1 (de) |
WO (1) | WO2023046320A1 (de) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012014112A1 (fr) * | 2010-07-30 | 2012-02-02 | Arjowiggins Security | Carte multicouche comportant une couche externe fibreuse |
US20180281503A1 (en) * | 2017-02-02 | 2018-10-04 | Jonny B. Vu | Methods for placing an emv chip onto a metal card |
EP3736738A1 (de) * | 2018-01-05 | 2020-11-11 | Nitta Corporation | Ic-etikett |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008027771A1 (de) | 2008-06-11 | 2009-12-17 | Giesecke & Devrient Gmbh | Verfahren zum Einbauen eines Chipmoduls in einen Chipkartenkörper |
DE102009014343A1 (de) | 2009-03-21 | 2010-09-23 | Deutsche Telekom Ag | Verfahren zum Herstellen einer eine kontaktlose und eine kontaktbehaftete Schnittstelle aufweisenden Chipkarte |
DE102010036057A1 (de) | 2010-09-01 | 2012-03-01 | Giesecke & Devrient Gmbh | Chipmodul mit Kennzeichnung |
-
2021
- 2021-09-23 DE DE102021004810.5A patent/DE102021004810A1/de active Pending
-
2022
- 2022-09-22 WO PCT/EP2022/025441 patent/WO2023046320A1/de active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012014112A1 (fr) * | 2010-07-30 | 2012-02-02 | Arjowiggins Security | Carte multicouche comportant une couche externe fibreuse |
US20180281503A1 (en) * | 2017-02-02 | 2018-10-04 | Jonny B. Vu | Methods for placing an emv chip onto a metal card |
EP3736738A1 (de) * | 2018-01-05 | 2020-11-11 | Nitta Corporation | Ic-etikett |
Also Published As
Publication number | Publication date |
---|---|
DE102021004810A1 (de) | 2023-03-23 |
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