WO2023046041A1

WO2023046041A1 - Carrier, semiconductor chamber, and semiconductor process apparatus

Info

Publication number: WO2023046041A1
Application number: PCT/CN2022/120707
Authority: WO
Inventors: 赵磊
Original assignee: 北京北方华创微电子装备有限公司
Priority date: 2021-09-27
Filing date: 2022-09-23
Publication date: 2023-03-30
Also published as: TWI813453B; CN113871337B; CN113871337A; TW202314947A

Abstract

Disclosed in the present application are a carrier, a semiconductor chamber, and a semiconductor process apparatus. The carrier is used for carrying a wafer in the semiconductor chamber, and the carrier comprises a support column, a carrier body and a leveling device, wherein a positioning protrusion is arranged at one end of the support column; the levelling device comprises a first adjustment ring, the first adjustment ring being positioned and arranged on the positioning protrusion in a sleeving manner, first inclined surfaces being arranged on a ring outer side wall of the first adjustment ring, a radial spacing between the first inclined surfaces in an axis direction being decreased towards a direction away from the support column, and the first adjustment ring being provided with a first deformation notch; the carrier body is used for carrying a wafer, is provided with a through avoidance hole, and is arranged on the first adjustment ring in a sleeving manner by means of the avoidance hole, and a hole wall of the avoidance hole is provided with second inclined surfaces matching the first inclined surfaces; and the leveling device further comprises an adjustment assembly, the adjustment assembly being used for applying a driving force to the first adjustment ring. By means of the solution, the problems of wafer contamination and insufficient leveling accuracy being present when a carrier is leveled by means of a leveling screw in the related art can be solved.

Description

Carriers, semiconductor chambers and semiconductor process equipment

technical field

The present application relates to the technical field of semiconductor manufacturing, and in particular to a bracket, a semiconductor chamber and semiconductor process equipment.

Background technique

In the process of semiconductor manufacturing, wafers (that is, wafers) need to be transported between various chambers in the transport system, and specific processing procedures (such as cooling, degassing, pre-cleaning, deposition, etc.) are performed in different chambers. wait). Wherein, the cooling chamber is used as a transition chamber for the transfer operation, and in order to reliably place the wafer in the cooling chamber, it is necessary to provide a bracket specially used for carrying the wafer.

In the related art, the bracket is fixedly connected to the top surface of the lifting shaft through fastening screws, and the two are also provided with a plurality of evenly distributed leveling screws at the joint, so that when the levelness of the bracket is out of compliance Leveling screws provide leveling to ensure that the wafer is level when placed in the carrier.

However, since the leveling screw is in point contact with the top surface of the lifting shaft due to its uneven surface, during the process of leveling the bracket, the leveling screw will scratch the lifting shaft while turning and generate particles, which will pollute the cooling system. The process environment of the chamber will cause pollution to the wafer; at the same time, after the top surface of the lifting shaft is scratched for a long time, the leveling accuracy of the leveling screw will also deteriorate.

Contents of the invention

The present application discloses a bracket, a semiconductor chamber and semiconductor process equipment to solve the problems of wafer contamination and insufficient leveling accuracy existing in the related art when the bracket is leveled by leveling screws.

In order to solve the above problems, the application adopts the following technical solutions:

In a first aspect, the present application provides a bracket for carrying a wafer in a semiconductor chamber, the bracket includes a support column, a bracket body and a leveling device, wherein:

One end of the support column is provided with a positioning protrusion;

The leveling device includes a first adjusting ring, and the positioning of the first adjusting ring is sleeved on the positioning protrusion. The outer wall of the ring of the first adjusting ring is provided with a first slope, and the first slope is aligned with the positioning protrusion. The radial spacing between the axes of the first adjustment ring decreases gradually in the direction away from the support column; the first adjustment ring has a first deformation gap;

The bracket body is used to carry the wafer, and the bracket body is provided with a through avoidance hole, and the bracket body is sleeved on the first adjustment ring through the avoidance hole, and the hole of the avoidance hole The wall is provided with a second slope that cooperates with the first slope;

The leveling device also includes an adjustment assembly, which is used to apply a driving force to the first adjustment ring, so that part of the edge of the first adjustment ring is deformed away from the positioning protrusion, and the jacking up The bracket body.

In a second aspect, the present application provides a semiconductor chamber, the semiconductor chamber includes a cavity and the bracket according to the first aspect of the application, and the bracket is disposed in the cavity.

In a third aspect, the present application provides a semiconductor process equipment, which includes a manipulator and the semiconductor chamber described in the second aspect of the application, the manipulator is used to transfer the wafer into the semiconductor chamber, or transfer the wafer from the The wafer is transferred out of the semiconductor chamber.

The technical solution adopted in this application can achieve the following beneficial effects:

In the bracket disclosed in the present application, since the first adjustment ring has a first deformation notch, it can have a certain deformation ability, and a first slope is provided on the ring outer wall of the first adjustment ring, and the bracket body is in the avoidance hole. The wall of the hole is provided with a second slope that matches the first slope. When it is detected that the bracket body is tilted towards one side, a driving force can be applied to the first adjustment ring through the adjustment assembly, so that the first adjustment ring is positioned on the bracket. The edge of the lower side of the body is deformed away from the positioning protrusion, and based on the cooperation between the first slope and the second slope, the lower side of the bracket body will be lifted up so that the bracket body as a whole tends to be horizontal.

Compared with the related technology, the bracket disclosed in the present application realizes the leveling operation through the surface contact between the first slope and the second slope, and there is no scratch between the first adjustment ring and the bracket body, which not only can Avoid particle contamination of the wafer, and ensure that the bracket can maintain high leveling accuracy after long-term use.

Description of drawings

The drawings described here are used to provide a further understanding of the application and constitute a part of the application. The schematic embodiments and descriptions of the application are used to explain the application and do not constitute an improper limitation to the application.

In the attached picture:

FIG. 1 is a schematic structural diagram of semiconductor process equipment disclosed in an embodiment of the present application;

Fig. 2 is a schematic structural view of the bracket disclosed in the embodiment of the present application when the bracket body is in a tilted state;

Fig. 3 is a partial enlarged view about A in Fig. 2;

Fig. 4 is a schematic structural view of the bracket disclosed in the embodiment of the present application after the bracket body is leveled;

Fig. 5 is a partial enlarged view about B in Fig. 4;

Fig. 6 is a top view of the bracket disclosed in the embodiment of the present application;

Fig. 7 is an axonometric view of the connecting beam disclosed in the embodiment of the present application;

Fig. 8 is a schematic diagram of the cooperation relationship between the first adjustment ring and the second adjustment ring disclosed in the embodiment of the present application;

Fig. 9 is a schematic structural diagram of the first adjustment ring disclosed in the embodiment of the present application;

Fig. 10 is a schematic structural diagram of the second adjustment ring disclosed in the embodiment of the present application.

Detailed ways

In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

The technical solutions disclosed in various embodiments of the present application will be described in detail below with reference to the accompanying drawings.

In order to solve the problems of wafer contamination and insufficient leveling accuracy existing in the bracket in the related art when the bracket is leveled by leveling screws, embodiments of the present application provide a bracket, a semiconductor chamber, and semiconductor process equipment.

The semiconductor process equipment is used to process the wafer (ie, wafer) in the semiconductor manufacturing process. The embodiment of the present application does not limit the specific type of the semiconductor process equipment, but the type can be reflected by the specific process link of the application. No matter what process of semiconductor manufacturing is performed, the wafers to be processed need to be transported.

As shown in FIG. 1 , the semiconductor process equipment may include a front-end transfer chamber C1 , a cooling chamber C2 , a vacuum transfer chamber C3 , at least one process chamber and a manipulator M. Among them, both the cooling chamber C2 and the process chamber are connected with the vacuum transfer chamber C3, and are arranged along the circumferential direction of the vacuum transfer chamber C3. At the same time, the cooling chamber C2 is also connected with the front transfer chamber C1; the manipulator M is divided into Atmospheric manipulator and vacuum manipulator, the manipulator M shown in Figure 1 is the vacuum manipulator.

Meanwhile, the specific type of the process chamber is not limited, and the specific type may reflect the type of semiconductor process equipment. In the embodiment shown in FIG. 1, the semiconductor process equipment includes a plurality of process chambers, which are respectively a degassing chamber C4, a pre-cleaning chamber C5, and a plurality of deposition chambers C6, so that the semiconductor process equipment is equipped with multiple process chambers. ability.

In a specific operation process, the wafers to be processed are transferred by the atmospheric manipulator of the front-end transfer chamber C1 to the cooling chamber C2. At this time, the cooling chamber C2 is in an atmospheric state and the wafers are not cooled. After the cooling chamber C2 is evacuated from the atmospheric state to a vacuum, the wafer is transported into the process chamber by the vacuum robot in the vacuum transfer chamber C3. It should be understood that the cooling chamber C2 and the vacuum transfer chamber C3 are transition transfer chambers, in which the wafers are not processed, and the wafers need to be processed in a process chamber configured with a process environment.

When performing process treatment, the wafer is first transferred to the degassing chamber C4 for the degassing process; then, the degassed wafer is transferred to the pre-cleaning chamber C5 by the vacuum manipulator for the pre-cleaning process; next, the The pre-cleaned wafers are transported to the deposition chamber C6 by the vacuum manipulator for the deposition process; finally, the deposited wafers are transported to the cooling chamber C2 by the vacuum manipulator for cooling. The final wafers are transferred to the front-end transfer chamber C1. So far, the entire process flow has been completed.

Since the cooling chamber C2 is used as a transitional transfer chamber, wafers need to be reliably and safely placed therein, therefore, the cooling chamber C2 is provided with brackets dedicated to carrying wafers. In the related art, the bracket is fixedly connected to the top surface of the lifting shaft through fastening screws, and the two are also provided with a plurality of evenly distributed leveling screws at the joint, so that when the levelness of the bracket is out of compliance Leveling screws provide leveling to ensure that the wafer is level when placed in the carrier. During specific leveling, after it is detected that the bracket is inclined towards one side, the lower side of the bracket can be gradually tilted up by tightening the leveling screw on the lower side of the bracket, so that the bracket gradually becomes horizontal.

Due to the point contact between the leveling screw and the top surface of the lifting shaft, during the process of leveling the bracket, the leveling screw will scratch the lifting shaft and generate particles, which will pollute the process environment of the cooling chamber C2, which will Contaminate the wafer 40; at the same time, after the top surface of the lifting shaft is scratched for a long time, the leveling accuracy of the leveling screw will also deteriorate.

Based on this, in view of the problems of wafer contamination and insufficient leveling accuracy of the bracket when it is leveled by leveling screws, the embodiment of the present application specifically solves the problem by providing an improved bracket, which is used in the semiconductor cavity Indoor wafer carrier.

As shown in FIGS. 2 to 10 , the bracket of the embodiment of the present application includes a support column 100 , a bracket body 200 and a leveling device 300 .

Wherein, the support column 100 is the basic component of the bracket, which is arranged in the cavity 10 of the process chamber, and is used to support the bracket body 200 and the leveling device 300 . One end of the support column 100 is provided with a positioning protrusion 110, and the support column 100 is positioned and matched with the bracket body 200 and the leveling device 300 through the positioning protrusion 110.

The bracket body 200 is the main body of the bracket, and the bracket body 200 is used to carry the wafer 40 , that is, the bracket carries the wafer 40 through the bracket body 200 .

The leveling device 300 is a functional component of the bracket, which is used to level the bracket body 200, so that the level of the bracket body 200 is compliant and ensures that the level of the wafer 40 placed on the bracket body 200 meets the requirements. . When the levelness of the bracket body 200 is detected, it can be realized by an electronic test piece. When the electronic test piece is placed on the bracket body 200, the height value of each direction relative to the center will be displayed on the display screen. Comparing the data in all directions can determine whether the levelness of the bracket body 200 is compliant.

Specifically, the leveling device 300 includes a first adjustment ring 310, the first adjustment ring 310 is positioned and sleeved on the positioning protrusion 110, and the outer wall of the first adjustment ring 310 is provided with a first inclined surface 311, and the first inclined surface 311 and the second The radial spacing between the axes of an adjustment ring 310 decreases toward the direction away from the support column 100, that is, the first slope 311 is inclined toward the inner ring of the first adjustment ring 310, and the first adjustment ring 310 has a first deformation notch 312, As shown in Figure 9. The bracket body 200 is provided with a through avoidance hole 211, the bracket body 200 is sleeved on the first adjustment ring 310 through the avoidance hole 211, and the hole wall of the avoidance hole 211 is provided with a second slope 212 matched with the first slope 311, As shown in Figure 7; the first inclined surface 311 is matched with the second inclined surface 212, which means that the two are fitted together to achieve surface-to-surface contact, specifically, the shapes of the two are compatible, and the original state The angle of inclination is the same.

The leveling device 300 also includes an adjustment assembly 320, the adjustment assembly 320 is used to apply a driving force to the first adjustment ring 310, so that part of the edge of the first adjustment ring 310 is deformed away from the positioning protrusion 110, and the jacking bracket body 200 is lifted. .

It should be understood that, since the first bevel 311 is inclined towards the inside of the first adjusting ring 310, and the second bevel 212 cooperates with the first bevel 311, in this case, in the height direction of the bracket, the first bevel 311 It is located at the lower side of the second slope 212 . Since the first adjustment ring 310 has a first deformation notch 312, when the first adjustment ring 310 is stressed, it can have a certain deformation capacity. At the same time, since the adjustment component 320 can deform the part of the edge of the first adjustment ring 310 away from the positioning protrusion 110 after applying the driving force to the first adjustment ring 310, that is to say, this part of the edge of the first adjustment ring 310 is adjusted Under the action of the driving force applied by the assembly 320, it is stretched radially from the inside to the outside (the above-mentioned first deformation gap 312 expands), so that the first inclined surface 311 is pushed against the second inclined surface 212, and the driving force of the adjustment assembly 320 In the process of continuous increase, due to the surface characteristics of the first inclined surface 311 and the second inclined surface 212, there will be relative movement between the two, and this part of the edge of the first adjustment ring 310 will move its corresponding bracket body 200 One side of the bracket body 200 is lifted up, which is specifically shown as the side of the bracket body 200 is upturned. Based on the above structural features, the bracket body 200 can be leveled.

As shown in FIGS. 2 and 3 , when it is detected that the bracket body 200 is tilted toward one side, that is, when the bracket body 200 has a situation where one side is high and the other side is low, the first adjustment ring 310 can be adjusted by the adjustment component 320 . The area on the lower side of the bracket body 200 applies a driving force, so that the edge of this area of the first adjustment ring 310 is deformed away from the positioning protrusion 110 , so that the first slope 311 corresponding to the edge of this area will push against the second slope 212 As a result, the lower side of the bracket body 200 is lifted up, see FIG. 4 and FIG. 5 for details. In the process of continuously increasing the driving force of the adjustment assembly 320 , the first adjustment ring 310 will continuously lift the lower side of the bracket body 200 up until the bracket body 200 tends to be horizontal and then stop the leveling operation.

It should be noted that the levelness of the bracket body 200 in Figures 2 to 5 is only for schematic reference, and the difference between the two states of the bracket in Figures 2 and 3 and Figures 4 and 5 is mainly to reflect the The bracket of the embodiment has the function of leveling the bracket body 200 to ensure that the levelness of the wafer 40 meets requirements.

As can be seen from the above description, in the bracket disclosed in the embodiment of the present application, since the first adjustment ring 310 has a first deformation notch 312, it can have a certain deformation ability, and the ring outer wall of the first adjustment ring 310 is combined with a The first inclined surface 311, the bracket body 200 is provided with the second inclined surface 212 matched with the first inclined surface 311 on the hole wall of the avoidance hole 211. A driving force is applied to the first adjustment ring 310, so that the edge of the first adjustment ring 310 located on the lower side of the bracket body 200 is deformed away from the positioning protrusion 110, and based on the cooperation between the first slope 311 and the second slope 212, the bracket body 200 The lower side of the bracket body 200 will be lifted up so that the whole bracket body 200 tends to be horizontal.

Compared with the related technology, the bracket disclosed in the embodiment of the present application realizes the leveling operation through surface contact between the first slope 311 and the second slope 212 , and there is no gap between the first adjustment ring 310 and the bracket body 200 . This will not only avoid particle contamination of the wafer, but also ensure that the bracket can maintain a high leveling accuracy after long-term use.

In an optional solution, as shown in FIG. 3 , FIG. 5 and FIG. 6 , the adjustment assembly 320 of the embodiment of the present application may include a pressing member 321 and a plurality of fastening elements 322 , and the pressing member 321 is fastened by a plurality of fastening elements. The element 322 is connected to the bracket body 200, and a plurality of fastening elements 322 are arranged along the circumferential direction of the pressing part 321; Located between the inner ring side wall of the first adjustment ring 310 and the outer peripheral wall of the positioning protrusion 110; the annular engagement structure is provided with a third slope 321b1, the radial distance between the third slope 321b1 and the axis of the positioning protrusion 110 Incremental toward the direction away from the support column 100, that is, towards the outer slope of the first adjustment ring 310; the pressing piece 321 is configured to push against the first inclined surface 321b1 when the fastening element 322 fastens the pressing piece 321 An adjusting ring 310.

In the embodiment of the present application, the fastening element 322 may be a threaded fastener such as a bolt, a screw, or other types of fasteners such as a pin. The embodiment of the present application does not limit the number of fastening elements 322. As shown in FIG. 1, 6 and other quantities.

Based on the surface characteristics of the third inclined surface 321b1, it can guide at least a part of the annular engagement structure to extend between the first adjustment ring 310 and the positioning protrusion 110; when the pressing member 321 is fastened by the fastening element 322, As the fastening force increases, the distance between the pressing member 321 and the bracket body 200 gradually decreases, and the portion of the ring-shaped engagement structure extending between the first adjustment ring 310 and the positioning protrusion 110 will gradually increase. The first Under the pushing action of the ring-shaped engagement structure of the adjusting ring 310 , the edge of the area corresponding to the fastening element 322 on the first adjusting ring 310 will be deformed and the bracket body 200 will be lifted up. Therefore, when the bracket body 200 is tilted, which side of the bracket body 200 is relatively lower can realize the leveling operation by fastening the fastening element 322 on the corresponding side.

It should be noted that the ring-shaped engaging structure is hollow inside, and it can be sleeved on the positioning protrusion 110 to avoid the positioning protrusion 110, which can avoid interference between the two. The pressing member 321 can also be positioned through the ring-shaped engaging structure The protrusions 110 are positioned and matched to improve the connection reliability inside the bracket.

Further, as shown in Fig. 3, Fig. 5 and Fig. 8-10, the ring inner wall of the first adjustment ring 310 in the embodiment of the present application may be provided with a fourth slope 313, and the fourth slope 313 is in line with the third slope 321b1. Matching, that is, the two are in contact, specifically, the shape of the fourth slope 313 and the third slope 321b1 are compatible, and the angle of inclination in the original state is consistent, that is, the fourth slope 313 and the third slope 321b1 are both facing the first slope 313 An adjustment ring 310 is inclined outside the ring. Under this structural layout, the third inclined surface 321b1 and the fourth inclined surface 313 are attached to each other, and when the annular connecting structure pushes against the first adjustment ring 310 through the third inclined surface 321b1, the third inclined surface 321b1 and the fourth inclined surface 313 are also realized. Surface-to-surface contact, which can prevent the first adjustment ring 310 from being scratched, and has a certain protective effect on the first adjustment ring 310 and the ring-shaped joint structure; It is easier to generate relative movement between the two, which can improve the sensitivity of the deformation of the first adjusting ring 310, thereby facilitating the smooth implementation of the leveling operation.

In this embodiment of the present application, the specific structure of the pressing member 321 is not limited. For example, as shown in FIG. 3 , FIG. 5 , FIG. 8 and FIG. The fixed body 321a is connected to the bracket body 200 through a plurality of fastening elements 322, and the plurality of fastening elements 322 are arranged along the circumferential direction of the fixed body 321a; the above-mentioned annular engagement structure is a second adjustment ring separately provided from the fixed body 321a 321b, that is to say, the pressing member 321 can be a split structure, the above-mentioned ring-shaped engaging structure can be used as a part of the split structure, and the fixing body 321a is the other part. Of course, the embodiment of the present application is not limited thereto. In practical applications, the pressing member 321 may also be an integrated structure, that is, the above-mentioned ring-shaped engaging structure and the fixing body 321a are integrally formed.

The above-mentioned second adjustment ring 321b abuts against the fixed main body 321a in the axial direction of the positioning protrusion 110; The outer wall of the second adjustment ring 321b is provided with the above-mentioned third slope 321b1, and the second adjustment ring 321b has a second deformation notch 321b2; the bottom of the fixed body 321a abuts against the top of the second adjustment ring 321b.

Specifically, the fixing body 321a is the main part of the pressing member 321, and its bottom abuts against the top of the second adjustment ring 321b, so as to compress and fix the second adjustment ring 321b on the first adjustment ring 310 and the positioning protrusion 110. between. Since the second adjustment ring 321b has the second deformation notch 321b2, when the second adjustment ring 321b is stressed, it can have a certain deformation ability. It should be noted that, in combination with the foregoing, the second adjustment ring 321b in the embodiment of the present application belongs to the ring-shaped connecting structure.

When the fixed body 321a is fastened by the fastening element 322, as the fastening force increases, the distance between the fixed body 321a and the bracket body 200 gradually decreases, and the fixed body 321a will push against the second adjusting ring 321b to further extend into the Between the first adjustment ring 310 and the positioning protrusion 110, the first adjustment ring 310 is pushed against by the second adjustment ring 321b, and the edge of the area corresponding to the adjusted fastening element 322 on the first adjustment ring 310 will be produce deformation and lift the bracket body 200; at the same time, due to the existence of the second deformation gap 321b2, when the fixed body 321a pushes against the second adjustment ring 321b and further extends into the process between the first adjustment ring 310 and the positioning protrusion 110 , the second adjustment ring 321b will push against the first adjustment ring 310 through the third slope 321b1, based on Newton's third law, the first adjustment ring 310 will also push against the second adjustment ring 321b to deform (the second deformation gap 321b2 shrinks) , and make the second adjustment ring 321b clamp the positioning protrusion 110, thereby improving the connection reliability inside the bracket.

In this embodiment of the present application, the specific shapes of the first deformation notch 312 and the second deformation notch 321b2 are not limited, and they may be regular shapes such as rectangular notches, trapezoidal notches, or irregular shapes such as corrugated notches.

Further, as shown in FIG. 3 and FIG. 5 , the fixed body 321a of the embodiment of the present application may include an annular positioning portion 321a1, and the annular positioning portion 321a1 is arranged in the avoidance hole 211, and the fixed main body 321a communicates with the annular positioning portion 321a1. The avoidance hole 211 is positioned and matched, and the fixing body 321a abuts against the second adjustment ring 321b through the annular positioning portion 321a1. Under this structural layout, the ring-shaped positioning part 321a1 and the second adjustment ring 321b together constitute the aforementioned ring-shaped joint structure; the ring-shaped positioning part 321a1 extends into the avoidance hole 211 to realize positioning cooperation with the avoidance hole 211, which can lift Reliability of the connection inside the bracket: the fixing body 321 a presses and fixes the second adjustment ring 321 b between the first adjustment ring 310 and the positioning protrusion 110 through the annular positioning portion 321 a 1 . In another embodiment, the second adjustment ring 321b may extend beyond the avoidance hole 211, and the fixing body 321a may abut against the second adjustment ring 321b directly through its end surface.

In an optional solution, as shown in FIG. 8 , the second deformation notch 321b2 of the embodiment of the present application may be disposed on a side of the second adjustment ring 321b away from the first deformation notch 312 . It should be noted that, in the bracket of the embodiment of the present application, when the second adjustment ring 321b is deformed, its two free ends on both sides of the second deformation notch 321b2 will be tightened; when the first adjustment ring 310 is deformed , the two free ends on both sides of the first deformation notch 312 will be stretched apart, if the first deformation notch 312 coincides with the second deformation notch 321b2, the second deformation notch 321b2 will weaken the push to the first adjustment ring 310 due to contraction The expansion of the first deformation notch 312 will also weaken the pushing effect on the second adjustment ring 321b, which is equivalent to reducing the sensitivity of the deformation of the first adjustment ring 310 and the second adjustment ring 321b, and may even lead to It is difficult to achieve leveling operation. Under such a structural layout, when the first adjusting ring 310 and the second adjusting ring 321b are under pressure, the deformation regions of the two can be prevented from overlapping together, so that the first adjusting ring 310 and the second adjusting ring 321b can deform smoothly, Thus, it is ensured that the leveling function of the bracket is realized.

In an optional solution, as shown in Figure 2 and Figure 4, the bracket body 200 of the embodiment of the present application may include a connected connecting beam 210 and a frame body 220, one end of the connecting beam 210 is provided with an avoidance hole 211, and the frame The body 220 includes at least one first slot 221 and at least one second slot 222 arranged at intervals along its height direction, wherein the first slot 221 is used to carry the wafer 40 to be processed, and the second slot 222 is used to carry Wafer 40 after processing.

It should be understood that, since the frame body 220 of the embodiment of the present application includes two slots, it is possible to place the wafer 40 to be processed on the first slot 221 during the transfer of the wafer 40, and place the wafer 40 on the second slot Position 222 holds processed wafer 40 . In this case, the wafer 40 to be processed and the processed wafer 40 are on two independent transmission lines, and the two will not interfere with each other, thereby improving the transmission efficiency and increasing the production capacity.

The embodiment of the present application does not limit the specific number of the first slot 221 and the second slot 222. In the case that the number of the first slot 221 and the second slot 222 is multiple, the number of slots placed on the bracket can be increased. The number of wafers 40 can improve process efficiency.

As shown in Figure 2, based on the aforementioned bracket, the embodiment of the present application also provides a semiconductor chamber, which includes a cavity 10 and the bracket mentioned in any of the aforementioned solutions, so that the semiconductor chamber Having the beneficial effect of the bracket in any of the foregoing solutions will not be repeated here. The bracket is disposed in the cavity 10 .

In the embodiment of the present application, there may be various types of process chambers, such as cooling chambers, loading chambers (that is, Load Lock, LL for short), and the like.

As shown in FIG. 2 , in the embodiment where the process chamber is a cooling chamber, the semiconductor chamber may also include a cooling seat 20 and a lifting mechanism 30, the cooling seat 20 is arranged in the cavity 10, the lifting mechanism 30 and the support column 100 connection, the lifting mechanism 30 is used to drive the bracket to move up and down; the bracket body 200 includes at least one first slot 221 and at least one second slot 222 arranged at intervals along its height direction, the first slot 221 is used to carry the The processed wafer 40, the second slot 222 is used to carry the processed wafer 40; the bracket body 200 is also provided with an escape area 223 corresponding to the second slot 222, and the escape area 223 is used for at least part of the cooling seat 20 pass.

It should be understood that, under such a structural layout, the semiconductor chamber is used to cool down the processed wafer 40 to prevent the wafer 40 from being rapidly oxidized after being exposed to the atmosphere and affecting the process quality. After the processed wafer 40 is placed in the second slot 222, the bracket can be driven down by the lifting mechanism 30, so that the bracket body 200 and the cooling seat 20 move relatively until the cooling base 20 passes through the avoidance area 223 and The wafer 40 is held up, so that the wafer 40 is placed on the cooling seat 20 , and then the temperature of the wafer 40 can be lowered.

In the embodiment of the present application, there are various types of the lifting mechanism 30, such as a linear motor, a hydraulic telescopic mechanism, a pneumatic telescopic mechanism, and the like.

In order to facilitate the smooth extension of the cooling seat 20 into the avoidance area 223, the cooling seat 20 can include a bearing platform 21 arranged on its top. The overall size of the bearing platform 21 is preset to pass through the avoidance area 223. Wafer 40. A cooling flow channel may be provided in the cooling base 20 , and the heat of the wafer 40 is absorbed by passing a cooling medium into the cooling flow channel, and the heat is taken away by the cooling medium in the cooling flow channel.

Based on the aforementioned process chamber, the embodiment of the present application also provides a semiconductor process equipment, which includes a manipulator and the semiconductor chamber of any of the aforementioned schemes, so that the semiconductor process equipment has the beneficial effects of the semiconductor chamber of any of the aforementioned schemes. effect, which will not be repeated here. The manipulator is used to transfer the wafer 40 into the semiconductor chamber, or transfer the wafer 40 out of the semiconductor chamber.

Exemplarily, the semiconductor chamber is a cooling chamber.

In combination with the foregoing, the embodiments of the present application do not limit the specific type of semiconductor process equipment, but the type can be reflected by the specific process link of the application.

The above-mentioned embodiments of this application focus on the differences between the various embodiments. As long as the different optimization features of the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, here No longer.

The above descriptions are only examples of the present application, and are not intended to limit the present application. For those skilled in the art, various modifications and changes may occur in this application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims

A bracket for carrying a wafer in a semiconductor chamber, characterized in that the bracket includes a support column, a bracket body and a leveling device, wherein:

One end of the support column is provided with a positioning protrusion;

The leveling device includes a first adjusting ring, and the positioning of the first adjusting ring is sleeved on the positioning protrusion. The outer wall of the ring of the first adjusting ring is provided with a first slope, and the first slope is aligned with the positioning protrusion. The radial spacing between the axes of the first adjustment ring decreases gradually in the direction away from the support column; the first adjustment ring has a first deformation gap;

The bracket body is used to carry the wafer, and the bracket body is provided with a through avoidance hole, and the bracket body is sleeved on the first adjustment ring through the avoidance hole, and the hole of the avoidance hole The wall is provided with a second slope that cooperates with the first slope;

The leveling device also includes an adjustment assembly, which is used to apply a driving force to the first adjustment ring, so that part of the edge of the first adjustment ring is deformed away from the positioning protrusion, and the jacking up The bracket body.
The bracket according to claim 1, wherein the adjustment assembly comprises a pressing member and a plurality of fastening elements, the pressing member is connected to the bracket body through the plurality of fastening elements, The plurality of fastening elements are arranged along the circumferential direction of the pressing member; the pressing member includes a ring-shaped engagement structure sleeved on the positioning protrusion, at least a part of the ring-shaped engagement structure is located on the Between the inner ring side wall of the first adjustment ring and the outer peripheral wall of the positioning protrusion;

The annular engaging structure is provided with a third inclined plane, and the radial distance between the third inclined plane and the axis of the positioning protrusion increases toward the direction away from the support column; the pressing member is configured to When the fastening element fastens the pressing member, it pushes against the first adjusting ring through the third inclined surface.
The bracket according to claim 2, wherein the ring inner wall of the first adjusting ring is provided with a fourth slope, and the third slope cooperates with the fourth slope.
The bracket according to claim 2, wherein the pressing member further comprises a fixing body, the fixing body is connected to the bracket body through the plurality of fastening elements, and the plurality of fastening elements elements are arranged along the circumference of the fixed body;

The annular engagement structure is a second adjustment ring separately provided from the fixed body, and the second adjustment ring abuts against the fixed body in the axial direction of the positioning protrusion; the second At least a part of the adjusting ring is located between the inner ring side wall of the first adjusting ring and the outer peripheral wall of the positioning protrusion; the ring outer wall of the second adjusting ring is provided with the third slope; the first adjusting ring The second adjusting ring has a second deformation notch; the bottom of the fixing body abuts against the top of the second adjusting ring.
The bracket according to claim 4, wherein the fixed main body includes an annular positioning portion, the annular positioning portion is arranged in the escape hole, and the fixed main body communicates with the annular positioning portion The avoidance hole is positioned and fitted, and the fixing body abuts against the second adjustment ring through the ring-shaped positioning portion.
The bracket according to claim 4, wherein the second deformation notch is disposed on a side of the second adjustment ring away from the first deformation notch.
The bracket according to claim 1, wherein the bracket body includes a connected connecting beam and a frame body, one end of the connecting beam is opened with the avoidance hole, and the frame body includes At least one first slot and at least one second slot arranged at intervals in the direction, wherein the first slot is used to carry wafers to be processed, and the second slot is used to carry processed wafers.
A semiconductor chamber, characterized in that the semiconductor chamber comprises a cavity and the bracket according to any one of claims 1 to 7, and the bracket is arranged in the cavity.
The semiconductor chamber according to claim 8, wherein the semiconductor chamber is a cooling chamber, and the semiconductor chamber further comprises a cooling seat and a lifting mechanism, and the cooling seat is arranged in the cavity, so that The lifting mechanism is connected to the support column, and the lifting mechanism is used to drive the lifting movement of the bracket;

The bracket body includes at least one first slot and at least one second slot arranged at intervals along its height direction, the first slot is used to carry wafers to be processed, and the second slot is used to carry Wafers after processing: an avoidance area corresponding to the second slot is provided on the carrier body, and the avoidance area is used for at least part of the cooling seat to pass through.
A semiconductor process equipment, characterized in that it comprises a manipulator and the semiconductor chamber according to claim 8 or 9, the manipulator is used to transfer the wafer into the semiconductor chamber, or transfer the wafer from the semiconductor chamber. out the wafer.