WO2023042261A1 - Expanding device and expanding method - Google Patents

Expanding device and expanding method Download PDF

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Publication number
WO2023042261A1
WO2023042261A1 PCT/JP2021/033739 JP2021033739W WO2023042261A1 WO 2023042261 A1 WO2023042261 A1 WO 2023042261A1 JP 2021033739 W JP2021033739 W JP 2021033739W WO 2023042261 A1 WO2023042261 A1 WO 2023042261A1
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WO
WIPO (PCT)
Prior art keywords
sheet member
wafer
ring
expanding
section
Prior art date
Application number
PCT/JP2021/033739
Other languages
French (fr)
Japanese (ja)
Inventor
芳邦 鈴木
Original Assignee
ヤマハ発動機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ヤマハ発動機株式会社 filed Critical ヤマハ発動機株式会社
Priority to PCT/JP2021/033739 priority Critical patent/WO2023042261A1/en
Priority to CN202180101113.9A priority patent/CN117716470A/en
Priority to KR1020247001665A priority patent/KR20240021304A/en
Priority to JP2023547968A priority patent/JPWO2023042261A1/ja
Priority to TW111104884A priority patent/TWI824409B/en
Publication of WO2023042261A1 publication Critical patent/WO2023042261A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H01L2221/68336—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

Definitions

  • the present invention relates to an expanding device and an expanding method, and more particularly to an expanding device and an expanding method having an ultraviolet irradiation section that reduces the adhesive force of a sheet member to which a wafer is attached.
  • an ultraviolet irradiation unit that reduces the adhesive force of the sheet member to which the wafer is attached, and a heat-shrinkable heat-shrinkable wafer that can be divided along the dividing line is attached. and an expanding section for expanding the sheet member and dividing the wafer along the dividing line.
  • the ultraviolet irradiation section irradiates the sheet member with ultraviolet rays to reduce the adhesion of the sheet member, and then the expanding section expands the sheet member.
  • JP-A-2018-050010 it is necessary to heat and shrink the slack of the portion of the sheet member around the wafer caused by the expansion by the expanding unit.
  • a heat shrink portion is provided for heating and shrinking the sheet member.
  • the ultraviolet irradiation unit irradiates the sheet member with ultraviolet rays to reduce the adhesive force of the sheet member, and then the sheet member is expanded by the expanding unit. After the member is expanded, the sheet member is heated by the heat shrink section to shrink the slack of the portion of the sheet member around the wafer. Therefore, it is necessary to sequentially perform the step of irradiating the sheet member with ultraviolet rays, the step of expanding the sheet member, and the step of heating and contracting the sheet member, making it difficult to suppress an increase in processing time. is. Therefore, it is desired to suppress an increase in the processing time for expanding, heat-shrinking, and reducing the adhesive force of the sheet member to which the wafer is attached.
  • the present invention has been made to solve the above problems, and one object of the present invention is to reduce the expansion, heat shrinkage, and adhesive force of a sheet member to which a wafer is attached. To provide an expanding device and an expanding method capable of suppressing an increase in .
  • An expanding device expands a heat-shrinkable sheet member having elasticity to which a dividable wafer is attached along a dividing line, and divides the wafer along the dividing line.
  • a heat shrink unit that heats and shrinks slack in the portion of the sheet member around the wafer caused by the expansion by the expanding unit; and when the sheet member is heated by the heat shrink unit, the sheet member and an ultraviolet irradiating part that irradiates ultraviolet rays to reduce the adhesive force of the sheet member.
  • the sheet member when the sheet member is heated by the heat shrink portion, the sheet member is simultaneously irradiated with ultraviolet rays to reduce the adhesion of the sheet member.
  • the adhesive force of the sheet member can be reduced by the ultraviolet irradiation section while the slack of the sheet member around the wafer is heated and shrunk by the heat shrink section.
  • the processing time can be reduced as compared with the case where the contraction processing of the sheet member by the heat shrink portion and the processing for reducing the adhesive strength of the sheet member by the ultraviolet irradiation portion are performed in order.
  • the expanding device preferably further includes an ultraviolet shielding section disposed so as to cover one side of the sheet member and shielding ultraviolet rays emitted from the ultraviolet irradiation section, wherein the ultraviolet irradiation section covers the sheet member. from the other side of the sheet member. According to this structure, it is possible to suppress the leakage of the ultraviolet rays irradiated from the ultraviolet irradiation section to the outside by the ultraviolet shielding section.
  • the ultraviolet shielding part preferably includes a side surface portion formed annularly so as to surround the wafer of the sheet member, and a bottom surface portion connected to the side surface portion opposite to the sheet member.
  • the sheet member when the sheet member is irradiated with ultraviolet rays by the ultraviolet irradiation section, the sheet member is in contact with the other side of the sheet member to support the sheet member and surround the ultraviolet irradiation section. and a support ring formed of a material that blocks ultraviolet light.
  • the support ring that supports the sheet member can shield the ultraviolet rays emitted from the ultraviolet irradiation section to the surroundings. Therefore, the member that supports the sheet member and the member that shields the ultraviolet rays are provided separately. Compared to the case, the number of parts can be reduced, and the device configuration can be simplified.
  • the ultraviolet shielding portion and the support ring hold the sheet member so as to sandwich the sheet member when the sheet member is irradiated with ultraviolet rays by the ultraviolet irradiation portion and when the sheet member is shrunk by the heat shrink portion in parallel.
  • the expansion of the sheet member at the portion where the wafer is placed is maintained.
  • the expansion of the sheet member at the portion where the wafer is placed can be maintained by the ultraviolet shielding portion that shields the ultraviolet rays irradiated by the ultraviolet irradiation portion when the sheet member is shrunk by the heat shrink portion. Therefore, the number of parts can be reduced and the configuration of the device can be simplified as compared with the case where a member for maintaining the expansion of the seat member is separately provided.
  • the ultraviolet irradiation section is preferably configured to be movable between an ultraviolet irradiation position and a retracted position arranged along a direction intersecting the surface of the sheet member.
  • the ultraviolet irradiation section performs ultraviolet irradiation treatment for reducing the adhesive force of the sheet member within a working time for heating and shrinking the sheet member by the heat shrink section.
  • the intensity of the irradiated ultraviolet light is adjusted so that it ends.
  • An expanding method includes expanding a heat-shrinkable sheet member having a dividable wafer attached along a dividing line and having elasticity, dividing the wafer along the dividing line, After that, the slack of the sheet member around the wafer caused by the expansion of the sheet member is shrunk by heating, and when the sheet member is shrunk by heating, the sheet member is irradiated with ultraviolet rays in parallel. , to reduce the adhesive force of the sheet member.
  • the sheet member when the sheet member is heated and shrunk, the sheet member is simultaneously irradiated with ultraviolet rays to reduce the adhesion of the sheet member.
  • the adhesive force of the sheet member can be reduced by irradiating the ultraviolet rays while the slack of the sheet member around the wafer is heated and contracted.
  • the processing time can be reduced as compared with the case where the contraction treatment of the sheet member and the treatment for reducing the adhesive force of the sheet member by irradiation with ultraviolet rays are performed in order.
  • FIG. 1 is a plan view of an expanding device according to one embodiment
  • FIG. 1 is a side view of an expanding device according to one embodiment
  • FIG. FIG. 4 is a plan view of a wafer ring structure of an expanding device according to one embodiment
  • 4 is a cross-sectional view taken along line 101-101 of FIG. 3
  • FIG. FIG. 4 is a bottom view of a debris cleaner of an expanding device according to one embodiment
  • FIG. 4 is a bottom view of the heat shrink portion of the expanding device according to one embodiment
  • 4 is a block diagram showing a control configuration of an expanding device according to one embodiment
  • FIG. 4 is a flow chart showing semiconductor chip manufacturing processing of the expanding device according to one embodiment.
  • FIG. 4 is a side view showing a state in which the sheet member of the expanding device according to one embodiment is expanded.
  • FIG. 10 is a side view of the wafer ring structure, debris cleaner, and expanding ring of the expanding device according to one embodiment;
  • FIG. 4 is a side view showing a state before the sheet member of the expanding device according to one embodiment is heat-shrinked;
  • FIG. 4 is a side view showing a state in which the sheet member of the expanding device according to the embodiment is heat-shrinked.
  • FIG. 4 is a flow chart showing extraction processing of the expanding device according to one embodiment.
  • 4 is a flow chart showing transfer processing of the expanding device according to one embodiment.
  • 4 is a flow chart showing the expanding process of the expanding device according to one embodiment.
  • FIG. 18 is a flow chart following the flow chart of FIG. 17;
  • FIG. 4 is a flow chart showing a heat shrink process of an expanding device according to one embodiment.
  • FIG. 20 is a flow chart following the flow chart of FIG. 19;
  • FIG. 4 is a flow chart showing processing for accommodating an expanding device according to one embodiment.
  • FIG. 1 The configuration of an expanding device 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 21.
  • FIG. 1 The configuration of an expanding device 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 21.
  • expanding apparatus 100 is configured to divide wafer 210 to form a plurality of semiconductor chips. Further, the expanding device 100 is configured to form sufficient gaps between the plurality of semiconductor chips.
  • a modified layer is formed in advance on the wafer 210 by irradiating the wafer 210 with a laser beam having a wavelength that is transmissive to the wafer 210 along the division lines (street).
  • the modified layer refers to cracks, voids, etc. formed inside the wafer 210 by the laser.
  • stealth dicing A method of forming a modified layer on the wafer 210 in this manner is called stealth dicing.
  • the expanding device 100 by expanding the sheet member 220, the wafer 210 is divided along the modified layer. Further, by expanding the sheet member 220 in the expanding device 100, the gaps between the plurality of semiconductor chips that are divided and formed are widened.
  • the expanding device 100 includes a base plate 1 , a cassette section 2 , a lift-up hand section 3 , a suction hand section 4 , a base 5 , an expanding section 6 , a cool air supply section 7 , a cooling unit 8 , and a fragment cleaner 9 . , a heat shrink portion 10 , and an ultraviolet irradiation portion 11 .
  • the horizontal direction in which the cassette portion 2 and the heat shrink portion 10 are arranged is the X direction
  • the cassette portion 2 side in the X direction is the X1 direction
  • the heat shrink portion 10 side in the X direction is the X2 direction.
  • the direction orthogonal to the X direction is the Y direction
  • the Y1 direction is the cassette portion 2 side of the Y directions
  • the Y2 direction is the opposite direction to the Y1 direction.
  • the vertical direction is the Z direction
  • the upward direction is the Z1 direction
  • the downward direction is the Z2 direction.
  • the base plate 1 is a base on which the cassette section 2 and the suction hand section 4 are installed.
  • the base plate 1 has a rectangular shape elongated in the Y direction in plan view.
  • the cassette section 2 is configured to accommodate a plurality (five) of wafer ring structures 200 .
  • the wafer ring structure 200 has a wafer 210, a sheet member 220, and a ring-shaped member 230, as shown in FIGS.
  • the wafer 210 is a circular thin plate made of a crystal of a semiconductor material that is used as a material for semiconductor integrated circuits. Inside the wafer 210, as described above, a modified layer is formed by modifying the inside along the dividing line. That is, the wafer 210 is configured to be split along the split lines.
  • the sheet member 220 is an elastic adhesive tape. An adhesive layer is provided on the upper surface 220a of the sheet member 220 .
  • the wafer 210 is attached to the adhesive layer of the sheet member 220 .
  • the ring-shaped member 230 is a ring-shaped metal frame in plan view. A notch 240 and a notch 250 are formed in the outer surface 230 a of the ring-shaped member 230 .
  • the ring-shaped member 230 is attached to the adhesive layer of the sheet member 220 while surrounding the wafer 210 .
  • the cassette section 2 includes a Z-direction moving mechanism 21, a wafer cassette 22, and a pair of mounting sections 23.
  • the Z-direction moving mechanism 21 is configured to move the wafer cassette 22 in the Z-direction using a motor 21a as a drive source.
  • the Z-direction moving mechanism 21 also has a mounting table 21b that supports the wafer cassette 22 from below.
  • the wafer cassette 22 is manually supplied and mounted on the mounting table 21b.
  • the wafer cassette 22 has an accommodation space capable of accommodating a plurality of wafer ring structures 200 .
  • a plurality of (five) pairs of mounting portions 23 are arranged inside the wafer cassette 22 .
  • a ring-shaped member 230 of the wafer ring structure 200 is mounted on the pair of mounting portions 23 from the Z1 direction side.
  • One of the pair of mounting portions 23 protrudes in the X2 direction from the inner surface of the wafer cassette 22 in the X1 direction.
  • the other of the pair of mounting portions 23 protrudes in the X1 direction from the inner surface of the wafer cassette 22 in the X2 direction.
  • the lift-up hand section 3 is configured to be able to take out the wafer ring structure 200 from the cassette section 2 . Further, the lift-up hand section 3 is configured so that the wafer ring structure 200 can be accommodated in the cassette section 2 .
  • the lift-up hand section 3 includes a Y-direction movement mechanism 31 and a lift-up hand 32 .
  • the Y-direction moving mechanism 31 is configured to move the lift-up hand 32 in the Y-direction using a motor 31a as a drive source.
  • the lift-up hand 32 is configured to support the ring-shaped member 230 of the wafer ring structure 200 from the Z2 direction side.
  • the suction hand unit 4 is configured to suction the ring-shaped member 230 of the wafer ring structure 200 from the Z1 direction side.
  • the suction hand unit 4 includes an X-direction movement mechanism 41 , a Z-direction movement mechanism 42 and a suction hand 43 .
  • the X-direction moving mechanism 41 is configured to move the suction hand 43 in the X direction using a motor 41a as a drive source.
  • the Z-direction moving mechanism 42 is configured to move the suction hand 43 in the Z-direction using a motor 42a as a drive source.
  • the suction hand 43 is configured to support the ring-shaped member 230 of the wafer ring structure 200 from the Z1 direction side.
  • the base 5 is a base on which the expanding section 6, the cooling unit 8 and the ultraviolet irradiation section 11 are installed.
  • the base 5 has a rectangular shape elongated in the Y direction in plan view.
  • the upper end surface of the base 5 on the Z1 direction side is arranged on the Z1 direction side of the upper end surface of the base plate 1 on the Z1 direction side.
  • the expanding section 6 is configured to expand the sheet member 220 of the wafer ring structure 200 to divide the wafer 210 along the dividing line.
  • the expanding section 6 includes a Z-direction moving mechanism 61 , a Y-direction moving mechanism 62 , a clamp section 63 and an expanding ring 64 .
  • the Z-direction moving mechanism 61 is configured to move the clamp portion 63 in the Z-direction using a motor 61a as a drive source.
  • the Y-direction moving mechanism 62 is configured to move the Z-direction moving mechanism 61, the clamp portion 63 and the expand ring 64 in the Y direction using a motor 62a as a drive source.
  • the expand ring 64 is an example of the "support ring" in the claims.
  • the clamp part 63 is configured to grip the ring-shaped member 230 of the wafer ring structure 200 .
  • the clamp portion 63 has a lower grip portion 63a and an upper grip portion 63b.
  • the lower grip portion 63a supports the ring-shaped member 230 from the Z2 direction side.
  • the upper gripping portion 63b presses the ring-shaped member 230 supported by the lower gripping portion 63a from the Z1 direction side.
  • the ring-shaped member 230 is gripped by the lower gripping portion 63a and the upper gripping portion 63b.
  • the expand ring 64 is configured to expand the sheet member 220 by supporting the sheet member 220 from the Z2 direction side.
  • the expand ring 64 has a ring shape in plan view.
  • the cool air supply unit 7 is configured to supply cold air to the sheet member 220 from the Z1 direction side when the sheet member 220 is expanded by the expanding unit 6 .
  • the cool air supply unit 7 has a plurality of nozzles 71 .
  • the nozzle 71 has a cool air supply port 71a (see FIG. 5) through which cool air supplied from a cool air supply source (not shown) flows out.
  • a nozzle 71 is attached to the debris cleaner 9 .
  • a cold source is a chiller for generating cold.
  • the cool air supply source supplies air cooled by, for example, a cooling device provided with a heat pump or the like. Such cold air supply is mounted on the base 5 .
  • a cool air supply source and each of the plurality of nozzles 71 are connected by a hose (not shown).
  • the cooling unit 8 is configured to cool the sheet member 220 from the Z2 direction side when the sheet member 220 is expanded by the expanding section 6 .
  • the cooling unit 8 includes a cooling member 81 having a cooling body 81 a and a Peltier element 81 b, and a cylinder 82 .
  • the cooling body 81a is made of a member having a large heat capacity and a high thermal conductivity.
  • the cooling body 81a is made of metal such as aluminum.
  • the Peltier element 81b is configured to cool the cooling body 81a. Note that the cooling body 81a is not limited to aluminum, and may be another member having a large heat capacity and a high thermal conductivity.
  • the cooling unit 8 is configured to be movable in the Z direction by means of a cylinder 82. Thereby, the cooling unit 8 can move to a position in contact with the sheet member 220 and a position away from the sheet member 220 .
  • the fragment cleaner 9 is configured to suck fragments of the wafer 210 and the like when the sheet member 220 is expanded by the expanding section 6 .
  • the fragment cleaner 9 includes a ring-shaped member 91 and a plurality of suction ports 92.
  • the ring-shaped member 91 is a member having a ring shape when viewed from the Z1 direction side.
  • the plurality of suction ports 92 are openings for sucking fragments of the wafer 210 and the like.
  • a plurality of suction ports 92 are formed on the lower surface of the ring-shaped member 91 on the Z2 direction side.
  • the debris cleaner 9 is configured to be movable in the Z direction by means of a cylinder (not shown). As a result, the fragment cleaner 9 can move to a position close to the wafer 210 and to a position where the suction hand 43 moving in the X direction can be avoided.
  • the heat shrink section 10 is configured to shrink the sheet member 220 expanded by the expanding section 6 by heating while maintaining the gaps between the plurality of semiconductor chips.
  • the heat shrink section 10 includes a Z-direction moving mechanism 110, a heating ring 111, an intake ring 112, and an expansion maintaining ring 113.
  • the Z-direction moving mechanism 110 is configured to move the heating ring 111 and the suction ring 112 in the Z direction using a motor 110a as a drive source.
  • the extension retaining ring 113 is an example of the "ultraviolet shielding part" in the claims.
  • the heating ring 111 has a ring shape in plan view.
  • the heating ring 111 also has a sheathed heater that heats the sheet member 220 .
  • the intake ring 112 is configured integrally with the heating ring 111 .
  • the intake ring 112 has a ring shape in plan view.
  • a plurality of intake ports 112a are formed in the lower surface of the intake ring 112 on the Z2 direction side.
  • the expansion maintaining ring 113 is configured to hold down the sheet member 220 from the Z1 direction side so that the sheet member 220 near the wafer 210 does not shrink due to heating by the heating ring 111 .
  • the expansion maintaining ring 113 has a ring shape in plan view.
  • the expansion retaining ring 113 is configured to be movable in the Z direction by a cylinder (not shown). This allows the expansion retaining ring 113 to move to a position holding the seat member 220 and a position away from the seat member 220 .
  • the ultraviolet irradiation unit 11 is configured to irradiate the sheet member 220 with ultraviolet rays in order to reduce the adhesive strength of the adhesive layer of the sheet member 220 .
  • the ultraviolet irradiation section 11 has an ultraviolet light.
  • the expanding device 100 includes a first control unit 12, a second control unit 13, a third control unit 14, a fourth control unit 15, a fifth control unit 16, an expansion control calculation A unit 17 , a handling control calculation unit 18 , and a storage unit 19 are provided.
  • the first control section 12 is configured to control the heat shrink section 10 .
  • the first control unit 12 includes a CPU (Central Processing Unit) and a storage unit having ROM (Read Only Memory) and RAM (Random Access Memory).
  • the first control unit 12 may include, as a storage unit, an HDD (Hard Disk Drive) that retains stored information even after the voltage is cut off. Also, the HDD may be provided in common to the first control section 12 , the second control section 13 , the third control section 14 , the fourth control section 15 and the fifth control section 16 .
  • an HDD Hard Disk Drive
  • the second control section 13 is configured to control the cool air supply section 7 , the cooling unit 8 and the debris cleaner 9 .
  • the second control unit 13 includes a CPU and a storage unit having ROM, RAM, and the like.
  • the third control section 14 is configured to control the expanding section 6 .
  • the third control unit 14 includes a CPU and a storage unit having ROM, RAM, and the like. Note that the second control unit 13 and the third control unit 14 may include, as a storage unit, an HDD or the like that retains stored information even after the voltage is cut off.
  • the fourth control section 15 is configured to control the cassette section 2 and the lift-up hand section 3.
  • the fourth control unit 15 includes a CPU and a storage unit having ROM, RAM, and the like.
  • the fifth control section 16 is configured to control the suction hand section 4 .
  • the fifth control unit 16 includes a CPU and a storage unit having ROM, RAM, and the like. Note that the fourth control unit 15 and the fifth control unit 16 may include, as a storage unit, an HDD or the like that retains stored information even after the voltage is cut off.
  • the expansion control calculation unit 17 is configured to perform calculations related to expansion processing of the sheet member 220 based on the processing results of the first control unit 12, the second control unit 13 and the third control unit 14.
  • the expansion control calculation unit 17 includes a CPU and a storage unit having ROM, RAM, and the like.
  • the handling control calculation unit 18 is configured to perform calculations related to the process of moving the wafer ring structure 200 based on the processing results of the fourth control unit 15 and the fifth control unit 16 .
  • the handling control calculation unit 18 includes a CPU and a storage unit having ROM, RAM, and the like.
  • a program for operating the expanding device 100 is stored in the storage unit 19 .
  • the storage unit 19 includes ROM, RAM, and the like.
  • step S1 the wafer ring structure 200 is taken out from the cassette section 2. That is, after the wafer ring structure 200 housed in the cassette section 2 is supported by the lift-up hand 32, the lift-up hand 32 is moved in the Y2 direction by the Y-direction moving mechanism 31, whereby the wafer ring structure 200 is removed from the cassette section 2. Structure 200 is retrieved.
  • step S ⁇ b>2 the wafer ring structure 200 is transferred to the expanding section 6 by the suction hand 43 . That is, the wafer ring structure 200 taken out from the cassette section 2 is moved in the X2 direction by the X-direction moving mechanism 41 while being sucked by the suction hand 43 . The wafer ring structure 200 that has moved in the X2 direction is transferred from the suction hand 43 to the clamp section 63 and then gripped by the clamp section 63 .
  • step S3 the sheet member 220 is expanded by the expanding section 6.
  • the sheet member 220 of the wafer ring structure 200 gripped by the clamp portion 63 is cooled by the cooling unit 8 .
  • the sheet member 220 is cooled by the cold air supply unit 7 .
  • the wafer ring structure 200 cooled to a predetermined temperature is lowered by the Z-direction moving mechanism 61 while being gripped by the clamp portion 63 .
  • the sheet member 220 is expanded by the expand ring 64 to divide the wafer 210 along the dividing line. At this time, the wafer 210 is divided while suctioning the fragments by the fragment cleaner 9 .
  • step S4 while maintaining the expanded state of the sheet member 220, the expanded portion 6 is moved to the Z2 direction side of the heat shrink portion 10. That is, after the wafer 210 is divided, the wafer ring structure 200 with the sheet member 220 expanded is moved in the Y1 direction by the Y-direction moving mechanism 62 .
  • step S5 the sheet member 220 is heated by the heat shrink section 10 to be shrunk.
  • the wafer ring structure 200 moved in the Y1 direction is heated by the heating ring 111 while being sandwiched between the expansion retaining ring 113 and the expand ring 64 .
  • suction by the suction ring 112 and irradiation of ultraviolet rays by the ultraviolet irradiation unit 11 are performed.
  • step S6 the expanding section 6 is returned to its original position. That is, the wafer ring structure 200 with the contracted sheet member 220 is moved in the Y2 direction by the Y-direction moving mechanism 31 .
  • step S ⁇ b>7 the wafer ring structure 200 is transferred from the expanding section 6 to the lift-up hand section 3 by the suction hand 43 , is moved in the X1 direction by the X-direction moving mechanism 41 , and is transferred to the lift-up hand 32 .
  • step S ⁇ b>8 the wafer ring structure 200 is accommodated in the cassette section 2 .
  • the wafer ring structure 200 supported by the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 , so that the wafer ring structure 200 is housed in the cassette section 2 .
  • the processing performed on one wafer ring structure 200 is completed.
  • composition related to expansion and heat shrink 1 and 9-14, the configuration for expansion and heat shrink will be described in detail.
  • the expanding section 6 is configured to expand a stretchable heat-shrinkable sheet member 220 at a first position P1.
  • the Y-direction moving mechanism 62 moves from the first position P1 to a second position P2, which is horizontally (Y1 direction) away from the first position P1 in plan view, in a state in which the sheet member 220 is expanded by the expanding section 6.
  • the Z-direction moving mechanism 61 of the expanding section 6, the clamping section 63 and the expanding ring 64 are configured to move in the horizontal direction (Y1 direction).
  • the heat shrink section 10 is configured to heat and shrink (heat shrink) the slack of the portion 220b of the sheet member 220 around the wafer 210 caused by the expansion by the expanding section 6 at the second position P2. It is
  • the expanding section 6 is configured such that when the sheet member 220 is expanded, the clamping section 63 grips the ring-shaped member 230 in the vertical direction (Z direction).
  • the upper gripping portion 63b of the clamping portion 63 is composed of a plurality (four) of slide moving bodies 63ba arranged so as to surround the wafer ring structure 200.
  • the plurality of slide moving bodies 63ba are configured to horizontally slide toward the wafer 210 side when gripping the ring-shaped member 230.
  • the lower gripping portion 63a of the clamping portion 63 rises in the Z1 direction toward the upper gripping portion 63b (plurality of sliding moving bodies 63ba) that slides toward the wafer 210 by the driving force of a cylinder such as an air cylinder. is configured to As a result, the ring-shaped member 230 is gripped and fixed between the upper gripping portion 63b and the lower gripping portion 63a of the clamp portion 63. As shown in FIG.
  • the clamp part 63 is moved toward the expand ring 64 by the driving force of the motor 61a of the Z-direction moving mechanism 61 while gripping the ring-shaped member 230 between the upper grip part 63b and the lower grip part 63a. It is configured to descend in the Z2 direction. As a result, the sheet member 220 is pressed against the expand ring 64 and the sheet member 220 is expanded.
  • the expand ring 64 is arranged on the Z2 direction side with respect to the sheet member 220 .
  • the expand ring 64 is arranged horizontally between the wafer 210 and the ring-shaped member 230 .
  • the expand ring 64 is formed in a circular ring so as to surround the wafer 210 .
  • the first position P1 which is the expanded position, on the Z1 direction side with respect to the wafer ring structure 200, there is a fragment cleaner 9 that sucks and removes scattered matter generated from the wafer ring structure 200 due to the expansion of the sheet member 220.
  • Scattered matter is, for example, fragments of wafer 210 or the like.
  • the die attach film may become a scattering object.
  • the fragments of the wafer 210 are small in the vicinity of the outer edge 210a (see FIG. 12) of the wafer 210, the position of the wafer 210 becomes unstable when the sheet member 220 is expanded, and the fragments are likely to be scattered.
  • the fragment cleaner 9 is configured to suck and remove the scattered matter by the negative pressure supplied from the negative pressure generator.
  • the suction port 92 of the debris cleaner 9 is arranged to face the outer edge 210a of the circular ring-shaped wafer 210 when the debris (such as wafer 210 fragments and die attach film fragments) is sucked. , is formed in a circular ring.
  • the circular ring-shaped suction port 92 is composed of a plurality of circular suction ports 92 arranged at predetermined intervals in a circular ring.
  • the debris cleaner 9 is configured to suck scattered matter away from the center of the wafer 210 by means of a circular suction port 92 .
  • the fragment cleaner 9 has a first position P1, which is an expanded position, by the driving force of a cylinder such as an air cylinder. It is configured to be movable in the vertical direction (Z direction) between the positions.
  • the lower position is the position near the wafer 210 .
  • the upper position is a retreat position where the suction hand 43 moving in the X direction can be avoided.
  • the fragment cleaner 9 is configured to descend in the Z2 direction from the upper position to the lower position when expanding the sheet member 220 . Further, the fragment cleaner 9 is configured to start the suction operation before pressing the sheet member 220 against the expand ring 64 and continue the suction operation at least until the pressing of the sheet member 220 against the expand ring 64 is completed. .
  • a cool air supply section 7 and a cooling unit 8 for cooling the sheet member 220 when the sheet member 220 is expanded by the expanding section 6 are arranged at the first position P1, which is the expanding position.
  • the cool air supply unit 7 is provided integrally with the fragment cleaner 9 on the Z1 direction side with respect to the wafer ring structure 200 . Therefore, at the first position P1, the cool air supply unit 7 moves vertically (in the Z direction) integrally with the fragment cleaner 9 between a lower position where cool air is supplied and an upper position where no cool air is supplied. configured as possible.
  • the cool air supply unit 7 is configured to descend in the Z2 direction from the upper position to the lower position when the sheet member 220 is expanded.
  • the cool air supply unit 7 is configured to start the cool air supply operation before pressing the sheet member 220 against the expand ring 64 and continue the cool air supply operation at least until the sheet member 220 is completely pressed against the expand ring 64. ing.
  • the cooling unit 8 is arranged on the Z2 direction side with respect to the wafer ring structure 200 . At the first position P1, the cooling unit 8 is moved vertically ( Z direction). The cooling unit 8 is configured to rise in the Z1 direction from the lower position to the upper position when the sheet member 220 is expanded. The cooling unit 8 is also configured to initiate and complete the cooling operation before pressing the sheet member 220 against the expand ring 64 . Also, the cooling unit 8 is configured to retract to the lower position before pressing the sheet member 220 against the expand ring 64 .
  • the Y-direction moving mechanism 62 maintains the expanded state of the sheet member 220 by the expanding section 6,
  • the expanding portion 6 (the Z-direction moving mechanism 61, the clamp portion 63 and the expanding ring 64) is moved in the Y1 direction from the first position P1 where the sheet member 220 is expanded to the second position P2 where the sheet member 220 is heat-shrinked. configured to move.
  • the Y-direction moving mechanism 62 moves independently of the fragment cleaner 9, the cool air supply unit 7 and the cooling unit 8 without moving the fragment cleaner 9, the cool air supply unit 7 and the cooling unit 8 from the first position P1.
  • the expanding portion 6 is moved in the Y1 direction from the first position P1 to the second position P2.
  • the fragment cleaner 9 and the cool air supply section 7 are retracted to the upper position, and the cooling unit 8 is retracted to the lower position.
  • the Y-direction moving mechanism 62 further has a mounting portion 62b and a rail portion 62c in addition to the motor 62a.
  • the mounting portion 62b is configured such that the Z-direction moving mechanism 61, the clamp portion 63 and the expand ring 64 are mounted on the upper surface thereof. Further, the mounting portion 62b is formed in a substantially rectangular plate shape in plan view.
  • the mounting portion 62b is movably provided on the rail portion 62c.
  • a pair of rail portions 62c are provided spaced apart in the X direction. The pair of rail portions 62c are provided to extend in the Y direction between the first position P1 and the second position P2.
  • the Y-direction moving mechanism 62 moves the mounting portion 62b in the Y direction along the pair of rail portions 62c by the driving force of the motor 62a, thereby moving the Z-direction moving mechanism 61, the clamp portion 63 and the expand ring 64. It is configured to be movable in the Y direction between the first position P1 and the second position P2.
  • the mounting portion 62b is provided with a hole portion 62ba passing through the mounting portion 62b in the vertical direction (Z direction).
  • the hole portion 62ba is formed in a circular shape in plan view.
  • the hole portion 62ba has a size that allows the cooling unit 8 to pass therethrough at the first position P1. Thereby, it is possible to move the cooling unit 8 between the upper position and the lower position via the hole 62ba.
  • the hole 62ba has a size that allows the ultraviolet irradiation section 11 to pass therethrough at the second position P2. Thereby, it is possible to move the ultraviolet irradiation section 11 between the upper position and the lower position via the hole 62ba.
  • the hole portion 62ba is provided inside the expand ring 64 .
  • the cooling unit 8 and the ultraviolet irradiation section 11 are configured to move inside the expand ring 64 through the hole 62ba.
  • the heat shrink portion 10 is arranged on the Z1 direction side of the expanded portion 6 moved by the Y direction movement mechanism 62 at the second position P2, which is the heat shrink position. Further, the heating ring 111 and the suction ring 112 of the heat shrink portion 10 are driven by the driving force of the motor 110a of the Z-direction moving mechanism 110 to move the sheet member 220 to the upper position where the sheet member 220 is not heated and the sheet member 220 to be heated.
  • the expansion maintaining ring 113 of the heat shrink portion 10 is moved between the upper position not pressing the sheet member 220 and the lower position pressing the sheet member 220 at the second position P2 by the driving force of a cylinder such as an air cylinder.
  • a cylinder such as an air cylinder.
  • the upper position is a retracted position where the expanding portion 6 and the wafer ring structure 200 moving in the Y1 direction can be avoided.
  • the lower position is a position near the sheet member 220 .
  • the heat shrink portion 10 (the heating ring 111, the suction ring 112, and the expansion maintaining ring 113) is configured to descend in the Z2 direction from the upper position to the lower position when heat shrinking the sheet member 220.
  • the up-down mechanism (Z-direction moving mechanism 110) for the heating ring 111 and the suction ring 112 and the up-down mechanism (cylinder) for the extension maintaining ring 113 are separate mechanisms. Therefore, the heating ring 111, the suction ring 112, and the expansion retaining ring 113 can move up and down independently of each other.
  • the expansion maintaining ring 113 is configured to sandwich the sheet member 220 in the vertical direction (Z direction) with the expanding ring 64 .
  • the expansion maintaining ring 113 is configured to maintain the expanded state of the portion of the sheet member 220 corresponding to the wafer 210 .
  • the heating ring 111 heats the portion 220b of the sheet member 220 around the wafer 210 (the outside of the expansion maintaining ring 113) by the sheathed heater, which is a heating mechanism. part).
  • the intake ring 112 is configured to intake gas generated from the sheet member 220 due to the heating while the sheet member 220 is heated by the heating ring 111 .
  • the ultraviolet irradiation unit 11 irradiates the sheet member 220 with ultraviolet rays in parallel with heating the sheet member 220 by the heat shrink unit 10, thereby It is configured to reduce the adhesion of member 220 .
  • the ultraviolet irradiation section 11 for irradiating the sheet member 220 with ultraviolet rays when the sheet member 220 is heat-shrinked by the heat-shrink section 10 is arranged at the second position P2, which is the heat-shrink position.
  • the sheet member 220 when the sheet member 220 is heated and shrunk, the sheet member 220 is simultaneously irradiated with ultraviolet rays to reduce the adhesive strength of the sheet member 220 .
  • the ultraviolet irradiation unit 11 is arranged on the Z2 direction side with respect to the wafer ring structure 200 .
  • the ultraviolet irradiation section 11 is configured to be movable between an ultraviolet irradiation position P3 and a retracted position P4 arranged along a direction (Z direction) intersecting the surface of the sheet member 220 .
  • the ultraviolet irradiation unit 11 is driven by the driving force of a cylinder 121 such as an air cylinder. , and the retracted position (see FIG. 13).
  • the ultraviolet irradiation section 11 is configured to rise in the Z1 direction from a lower retracted position P4 to an upper ultraviolet irradiation position P3.
  • the Y-direction moving mechanism 62 moves from the second position P2 where heat shrinking is performed to the first position P1 where expansion is performed to expand the expanding portion 6 (Z
  • the direction moving mechanism 61, the clamp portion 63 and the expand ring 64) are configured to move in the Y2 direction.
  • the Y-direction moving mechanism 62 moves from the second position P2 independently of the heat shrink portion 10 and the ultraviolet irradiation portion 11 without moving the heat shrink portion 10 and the ultraviolet irradiation portion 11 from the second position P2. It is configured to move the expanding portion 6 in the Y2 direction to the first position P1.
  • the heat shrink portion 10 is retracted to the upper position
  • the ultraviolet irradiation portion 11 is retracted to the lower retracted position P4.
  • the expansion maintaining ring 113 is in circumferential contact with the periphery of the wafer 210 on one side (the Z1 direction side) of the sheet member 220 , and together with the expand ring 64 , the sheet is compressed.
  • the pinching and holding of the member 220 maintains the expansion of the sheet member 220 where the wafer 210 is placed.
  • the expansion maintaining ring 113 and the expand ring 64 sandwich the sheet member 220 when the sheet member 220 is contracted by the heat shrink section 10 in parallel with the ultraviolet irradiation of the sheet member 220 by the ultraviolet irradiation section 11 . It is configured to maintain expansion of the sheet member 220 in the portion where the wafer 210 is placed by holding such a position.
  • the extension maintaining ring 113 is arranged so as to cover one side (Z1 direction side) of the sheet member 220 and is configured to shield the ultraviolet rays irradiated from the ultraviolet irradiation section 11 . Further, the ultraviolet irradiation section 11 is configured to irradiate the sheet member 220 with ultraviolet rays from the other side (Z2 direction side) of the sheet member 220 .
  • the expansion retaining ring 113 includes a bottom portion 113a and side portions 113b.
  • the bottom portion 113a is arranged to cover the upper side (Z1 direction side).
  • the side portion 113b is formed in an annular shape so as to surround the wafer 210 of the sheet member 220 .
  • the bottom surface portion 113a is connected to the side surface portion 113b on the side opposite to the sheet member 220 (Z1 direction side).
  • the bottom portion 113a is formed in a circular shape.
  • the expansion maintenance ring 113 is made of a member that blocks ultraviolet rays.
  • the expansion retention ring 113 is made of colored resin.
  • the expansion retaining ring 113 is made of metal such as stainless steel or aluminum.
  • the expand ring 64 abuts against the other side (Z2 direction side) of the sheet member 220 to support the sheet member 220 and surround the ultraviolet irradiation section 11 . are placed in That is, as shown in FIG. 14 , the ultraviolet irradiation section 11 is surrounded by the expand ring 64 when arranged at the ultraviolet irradiation position P3. Also, the expand ring 64 is made of a material that blocks ultraviolet rays. The expand ring 64 is made of metal such as stainless steel or aluminum. Alternatively, the expand ring 64 is made of colored resin.
  • the ultraviolet irradiation unit 11 emits ultraviolet rays so that the ultraviolet irradiation process for reducing the adhesive force of the sheet member 220 is completed within the working time when the sheet member 220 is heated and shrunk by the heat shrink unit 10 . intensity is adjusted.
  • the ultraviolet irradiation unit 11 is set so that the intensity of the ultraviolet rays to be irradiated is increased when the ultraviolet irradiation time is shortened.
  • the ultraviolet irradiation unit 11 is set so that the intensity of the ultraviolet rays to be irradiated becomes smaller when the ultraviolet irradiation time is lengthened.
  • the cassette unit 2 is arranged at a position different from the first position P1 and the second position P2 in plan view.
  • the lift-up hand section 3 is arranged at a position different from the first position P1 and the second position P2 in plan view.
  • the direction (Y2 direction) in which the lift-up hand section 3 takes out the wafer ring structure 200 from the cassette section 2 is substantially parallel to the direction (Y1 direction) in which the Y-direction moving mechanism 62 moves the expanding section 6 .
  • the insertion/extraction direction (Y direction) of the wafer ring structure 200 by the lift-up hand portion 3 and the moving direction (Y direction) of the expanding portion 6 by the Y direction moving mechanism 62 are substantially parallel to each other.
  • the cassette part 2 is arranged side by side with the second position P2, which is the heat shrink position, in the X direction.
  • the take-out position of the wafer ring structure 200 by the lift-up hand section 3 is arranged in the X direction side by side with the first position P1, which is the expanded position.
  • the extraction process is a process performed in step S1 in the semiconductor chip manufacturing process.
  • step S101 it is determined whether or not the lift-up hand 32 of the lift-up hand section 3 is free. If the lift-up hand 32 is not free, the takeout process is terminated. If the lift-up hand 32 is free, the process proceeds to step S102.
  • step S102 it is determined whether or not the lift-up hand 32 exists within the wafer cassette 22 of the cassette section 2. If the lift-up hand 32 does not exist within the wafer cassette 22, the process proceeds to step S104. Also, when the lift-up hand 32 exists in the wafer cassette 22, the process proceeds to step S103.
  • step S103 the lift-up hand 32 is moved from inside the wafer cassette 22 to outside the wafer cassette 22 by the Y-direction moving mechanism 31 in the Y2 direction.
  • step S ⁇ b>104 the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the lift-up hand 32 can take out the wafer ring structure 200 to be taken out from the wafer cassette 22 .
  • the upper surface of the lift-up hand 32 is positioned slightly above the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out in the wafer cassette 22 in the Z2 direction.
  • the wafer cassette 22 is moved in the Z direction by the Z direction moving mechanism 21 .
  • step S105 the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 so as to be positioned right below the ring-shaped member 230 of the wafer ring structure 200 to be taken out in the wafer cassette 22.
  • step S ⁇ b>106 the wafer ring structure 200 to be taken out from the wafer cassette 22 is transferred to the lift-up hand 32 .
  • step S106 the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out from the wafer cassette 22 is lifted slightly by the lift-up hand 32 from the upper surfaces of the pair of mounting portions 23.
  • the wafer cassette 22 is moved in the Z2 direction by the Z-direction moving mechanism 21 .
  • step S107 the lift-up hand 32 is moved in the Y2 direction by the Y-direction movement mechanism 31 while the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out is supported by the upper surface of the lift-up hand 32. .
  • the wafer ring structure 200 to be taken out is taken out from the wafer cassette 22 by the lift-up hand 32 .
  • the extraction process is terminated.
  • Transfer processing in the expanding device 100 will be described with reference to FIG. 16 .
  • the transfer process is a process performed in step S2 or S7 in the semiconductor chip manufacturing process.
  • step S201 the suction hand 43 of the suction hand unit 4 is lifted by the Z-direction moving mechanism 42. As shown in FIG. 16, in step S201, the suction hand 43 of the suction hand unit 4 is lifted by the Z-direction moving mechanism 42. As shown in FIG.
  • step S ⁇ b>202 the suction hand 43 is moved above the wafer ring structure 200 by the X-direction moving mechanism 41 .
  • the suction hand 43 is moved above the wafer ring structure 200 supported by the lift-up hand 32 .
  • the suction hand 43 is moved above the wafer ring structure 200 supported by the expanding section 6 .
  • step S ⁇ b>203 the suction hand 43 is lowered toward the wafer ring structure 200 by the Z-direction moving mechanism 42 .
  • step S204 the suction hand 43 sucks the ring-shaped member 230 of the wafer ring structure 200 by the negative pressure supplied from the negative pressure generator.
  • step S205 the suction hand 43 is lifted by the Z-direction moving mechanism 42.
  • step S206 the suction hand 43 is moved above the transfer destination by the X-direction moving mechanism 41. Specifically, in the case of step S2 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the expanding section 6 at the first position P1. Further, in the case of step S ⁇ b>7 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the lift-up hand 32 .
  • step S207 the suction hand 43 is lowered by the Z-direction moving mechanism 42 toward the transfer destination (expanding section 6 or lift-up hand 32).
  • step S208 the suction of the ring-shaped member 230 of the wafer ring structure 200 by the suction hand 43 is released. This completes the transfer of the wafer ring structure 200 to the transfer destination. Then, the transfer process is terminated.
  • the expanding process in the expanding device 100 will be described with reference to FIGS. 17 and 18.
  • FIG. The expanding process is a process performed in step S3 in the semiconductor chip manufacturing process.
  • the expanding process is performed at the first position P1.
  • the suction hand 43 is lifted by the Z-direction moving mechanism 42 in step S301.
  • the ring-shaped member 230 of the wafer ring structure 200 is supported by the lower holding portion 63a of the clamp portion 63. As shown in FIG. 17, the suction hand 43 is lifted by the Z-direction moving mechanism 42 in step S301.
  • the ring-shaped member 230 of the wafer ring structure 200 is supported by the lower holding portion 63a of the clamp portion 63. As shown in FIG.
  • step S302 the plurality of sliding moving bodies 63ba of the upper gripping portion 63b are horizontally slid toward the wafer 210 side.
  • step S303 while supporting the ring-shaped member 230 of the wafer ring structure 200, the lower grip part 63a is raised. Thereby, the ring-shaped member 230 is gripped and fixed between the upper gripping portion 63b and the lower gripping portion 63a.
  • step S304 the fragment cleaner 9 is lowered toward the wafer ring structure 200 by the cylinder together with the cool air supply unit 7.
  • step S305 it is determined whether cooling by supplying cool air to the sheet member 220 by the cool air supply unit 7 is necessary. If cooling by supply of cool air to the sheet member 220 by the cool air supply unit 7 is required, the process proceeds to step S305a. Then, in step S305a, supply of cool air to the sheet member 220 by the cool air supply unit 7 is started. Then, the process proceeds to step S306. If cooling by supplying cool air to the sheet member 220 by the cool air supply unit 7 is not necessary, the process proceeds to step S306 without performing the process of step S305a.
  • step S306 it is determined whether cooling of the sheet member 220 by the cooling unit 8 is necessary. If the sheet member 220 needs to be cooled by the cooling unit 8, the process proceeds to step S307. Then, in step S307, in addition to the cooling of the sheet member 220 by the cool air supply unit 7, the cooling of the sheet member 220 by the cooling unit 8 is performed. Then, the process proceeds to step S308. If the sheet member 220 does not need to be cooled by the cooling unit 8, the process proceeds to step S308 without performing the process of step S307.
  • step S308 the suction of the scattered matter by the fragment cleaner 9 is started.
  • step S309 the clamp portion 63 is rapidly lowered by the Z-direction moving mechanism 61 to press the sheet member 220 against the expand ring 64, thereby expanding the sheet member 220.
  • the wafer 210 on the sheet member 220 is divided into a plurality of matrix-shaped semiconductor chips, and the gaps between the plurality of semiconductor chips are widened.
  • the clamp portion 63 is lowered from the expansion start position to the expansion completion position.
  • step S310 supply of cold air to the sheet member 220 by the cool air supply unit 7 is stopped. If it is determined in step 305 that cooling by supplying cool air to the sheet member 220 by the cool air supply unit 7 is not necessary, the process proceeds to step S311 without performing the processing of step S310.
  • step S311 the suction of the scattered matter by the fragment cleaner 9 is stopped.
  • step S312 the fragment cleaner 9 is lifted by the cylinder together with the cool air supply unit 7. Then, the expanding process ends. Then, while maintaining the expanded state of the sheet member 220, the expanding portion 6 (the Z-direction moving mechanism 61, the clamping portion 63 and the expanding ring 64) is moved from the first position P1 to the second position P2 by the Y-direction moving mechanism 62. be moved.
  • the heat shrink process in the expanding device 100 will be described with reference to FIGS. 19 and 20.
  • FIG. The heat shrink process is a process performed in step S5 in the semiconductor chip manufacturing process.
  • step S401 the ultraviolet irradiation unit 11 is raised by the cylinder 121.
  • step S402 the extension maintaining ring 113 is lowered by the cylinder. Thereby, the sheet member 220 is sandwiched between the expansion maintaining ring 113 and the expanding ring 64 .
  • step S403 the heating ring 111 and the suction ring 112 are lowered by the Z-direction moving mechanism 110.
  • the up-down mechanism (Z-direction moving mechanism 110) for the heating ring 111 and the suction ring 112 and the up-down mechanism (cylinder) for the extension maintaining ring 113 are separate mechanisms.
  • step S404 intake by the intake ring 112 is started.
  • step S405 heating of the sheet member 220 by the heating ring 111 and irradiation of the sheet member 220 by the ultraviolet irradiation unit 11 with ultraviolet rays are started.
  • the slack of the portion 220b of the sheet member 220 surrounding the wafer 210 is contracted and removed.
  • the irradiation of the ultraviolet rays to the sheet member 220 by the ultraviolet irradiation unit 11 reduces the adhesive force of the adhesive layer of the sheet member 220 .
  • step S406 it is determined whether or not the heating time of the sheet member 220 by the heating ring 111 has reached the set time. If the heating time of the sheet member 220 by the heating ring 111 has not reached the set time, the process of step S406 is repeated. If the heating time of the sheet member 220 by the heating ring 111 reaches the set time, the process proceeds to step S407.
  • step S407 the heating of the sheet member 220 by the heating ring 111 is stopped.
  • step S408 the clamp part 63 is raised at a low speed by the Z-direction moving mechanism 61.
  • step S409 it is determined whether or not the clamp portion 63 has risen to the expansion start position. If the clamp portion 63 has not risen to the expansion start position, the process of step S409 is repeated. Further, when the clamp portion 63 is raised to the expansion start position, the process proceeds to step S410.
  • steps S406 to S409 an example in which heating of the sheet member 220 by the heating ring 111 and lifting of the clamping portion 63 by the Z-direction moving mechanism 61 are performed at once was shown. is not limited to For example, the heating of the sheet member 220 by the heating ring 111 and the lifting of the clamping portion 63 by the Z-direction moving mechanism 61 may be performed in multiple steps. That is, the clamping portion 63 may be raised to the expansion start position while repeating the heating of the sheet member 220 by the heating ring 111 and the raising of the clamping portion 63 by the Z-direction moving mechanism 61 .
  • step S410 the intake by the intake ring 112 and the irradiation of the ultraviolet rays to the sheet member 220 by the ultraviolet irradiation unit 11 are stopped.
  • step S411 the heating ring 111 and the intake ring 112 are lifted by the Z-direction moving mechanism 110.
  • step S412 the expansion retaining ring 113 is lifted by the cylinder.
  • step S413 the ultraviolet irradiation section 11 is lowered by the cylinder 121. Then, the heat shrink process is terminated. Then, the Y-direction moving mechanism 62 moves the expanding portion 6 (the Z-direction moving mechanism 61, the clamp portion 63 and the expanding ring 64) from the second position P2 to the first position P1. Then, the wafer ring structure 200 that has been expanded and heat-shrinked is transferred from the expanding section 6 at the first position P ⁇ b>1 to the lift-up hand 32 by the suction hand 43 .
  • the accommodation process in the expanding device 100 will be described with reference to FIG. 21 .
  • the accommodation process is a process performed in step S8 in the semiconductor chip manufacturing process.
  • step S501 it is determined whether or not the lift-up hand 32 of the lift-up hand unit 3 is free. If the lift-up hand 32 is not free, the accommodation process is terminated. If the lift-up hand 32 is vacant, the process proceeds to step S502.
  • step S502 it is determined whether or not the lift-up hand 32 exists within the wafer cassette 22 of the cassette section 2. If the lift-up hand 32 does not exist within the wafer cassette 22, the process proceeds to step S504. Also, if the lift-up hand 32 exists in the wafer cassette 22, the process proceeds to step S503.
  • step S503 the lift-up hand 32 is moved from inside the wafer cassette 22 to outside the wafer cassette 22 by the Y-direction moving mechanism 31 in the Y2 direction.
  • step S504 the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the wafer ring structure 200 to be accommodated on the lift-up hand 32 can be accommodated in the wafer cassette 22.
  • the ring-shaped member of the wafer ring structure 200 to be accommodated on the lift-up hand 32 is placed slightly above the upper surfaces of the pair of mounting portions 23 in the wafer cassette 22 in the Z1 direction.
  • the wafer cassette 22 is moved in the Z-direction by the Z-direction moving mechanism 21 so that the lower surface of 230 of is positioned.
  • step S505 the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated on the lift-up hand 32 is positioned at the accommodation position in the wafer cassette 22 (directly above the pair of mounting portions 23). Then, the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 .
  • step S506 the wafer ring structure 200 to be accommodated on the lift-up hand 32 is transferred to the pair of placement parts 23 in the wafer cassette 22. Specifically, in step S506, the wafer cassette 22 is moved in the Z1 direction by the Z-direction moving mechanism 21 so that the upper surface of the lift-up hand 32 is slightly below the upper surfaces of the pair of mounting portions 23. be.
  • step S508 the lift-up hand 32 is moved in the Y2 direction by the Y-direction moving mechanism 31 while the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated is supported by the upper surfaces of the pair of mounting portions 23. be done. As a result, the lift-up hand 32 is taken out while the wafer ring structure 200 to be accommodated is accommodated in the wafer cassette 22 . Then, the accommodation process ends.
  • the sheet member 220 when the sheet member 220 is heated by the heat shrink portion 10, the sheet member 220 is irradiated with ultraviolet rays in parallel to reduce the adhesive strength of the sheet member 220. 11 is provided.
  • the adhesive strength of the sheet member 220 can be reduced by the ultraviolet irradiation section 11 while the heat shrink section 10 heats and shrinks the slack of the sheet member 220 around the wafer 210 .
  • the processing time can be reduced as compared with the case where the contraction processing of the sheet member 220 by the heat shrink unit 10 and the processing for reducing the adhesive strength of the sheet member 220 by the ultraviolet irradiation unit 11 are performed in order. .
  • the extension maintaining ring 113 is provided so as to cover one side of the sheet member 220 and shields the ultraviolet rays irradiated from the ultraviolet irradiation section 11.
  • the ultraviolet irradiation section 11 It is configured to irradiate the sheet member 220 with ultraviolet rays from the other side of the sheet member 220 .
  • the extension retention ring 113 can prevent the ultraviolet rays emitted from the ultraviolet irradiation section 11 from leaking to the outside.
  • the expansion maintaining ring 113 is connected to the annular side portion 113b of the sheet member 220 so as to surround the wafer 210 and the side portion opposite to the sheet member 220. and a bottom portion 113a.
  • ultraviolet rays emitted to the side of the sheet member 220 can be blocked by the side portion 113b of the extension maintaining ring 113, and ultraviolet rays emitted in a direction perpendicular to the surface of the sheet member 220 can be blocked by the extension maintaining ring 113. can be shielded by the bottom portion 113a.
  • the sheet member 220 when the sheet member 220 is irradiated with ultraviolet rays by the ultraviolet irradiation section 11, the sheet member 220 is supported by coming into contact with the other side of the sheet member 220, and the ultraviolet irradiation section 11 is supported.
  • An expanding ring 64 is provided surrounding and formed of a material that blocks ultraviolet rays.
  • the expand ring 64 that supports the sheet member 220 can shield the ultraviolet rays emitted from the ultraviolet irradiation section 11 to the surroundings, so that the member that supports the sheet member 220 and the member that shields the ultraviolet rays are provided separately. Compared to the case, the number of parts can be reduced, and the device configuration can be simplified.
  • the expansion maintaining ring 113 and the expand ring 64 irradiate the sheet member 220 with the ultraviolet rays by the ultraviolet irradiation section 11 while the sheet member 220 is held by the heat shrink section 10 in parallel.
  • the expansion of the sheet member 220 at the portion where the wafer 210 is arranged is maintained.
  • the extension maintaining ring 113 that shields the ultraviolet rays irradiated by the ultraviolet irradiation section 11 maintains the expansion of the portion of the sheet member 220 where the wafer 210 is arranged when the sheet member 220 is shrunk by the heat shrink section 10 . Therefore, the number of parts can be reduced and the configuration of the device can be simplified as compared with the case where a member for maintaining the expansion of the sheet member 220 is separately provided.
  • the ultraviolet irradiation section 11 is movable between the ultraviolet irradiation position P3 and the retracted position P4 arranged along the direction intersecting the surface of the sheet member 220. It is configured. As a result, when the sheet member 220 is to be irradiated with ultraviolet rays, the ultraviolet irradiation section 11 is moved to the ultraviolet irradiation position P3, and when the sheet member 220 is not to be irradiated with ultraviolet rays, the ultraviolet irradiation section 11 is moved to the retracted position P4. can be evacuated. Accordingly, when the ultraviolet irradiation unit 11 is retracted, further processing can be performed on the sheet member 220, so that a plurality of types of processing can be performed on the sheet member 220 at the same position.
  • the ultraviolet irradiation unit 11 emits ultraviolet rays that reduce the adhesive force of the sheet member 220 within the working time for heating and shrinking the sheet member 220 by the heat shrink unit 10 .
  • the intensity of the ultraviolet rays to be irradiated is adjusted so that the irradiation process ends.
  • the process of irradiating the ultraviolet rays to reduce the adhesion of the sheet member 220 can be completed while the sheet member 220 is heated and shrunk.
  • the sheet member is heated by the heat shrink portion from one side of the sheet member, and the sheet member is irradiated with ultraviolet rays by the ultraviolet irradiation portion from the other side of the sheet member.
  • the present invention is not limited to this.
  • the sheet member may be heated from the same side by the heat shrink portion and the sheet member may be irradiated with ultraviolet rays by the ultraviolet irradiation portion.
  • the present invention is similar to this.
  • the ultraviolet shielding portion may be provided below the sheet member, and the support ring may be provided above the sheet member. Further, the ultraviolet shielding portion and the support ring may be arranged so as to face each other in the horizontal direction with the sheet member interposed therebetween.
  • the expansion maintenance ring (ultraviolet shielding portion) is formed to have a cylindrical shape
  • the present invention is not limited to this.
  • the ultraviolet shielding portion may be formed in a cylindrical shape having a polygonal cross section.
  • the heating ring of the heat shrink portion heats the entire circumference of the wafer surrounding portion of the sheet member, but the present invention is not limited to this.
  • the heat shrink portion may be configured to sequentially heat the periphery of the wafer portion by portion.
  • the extension maintaining ring that maintains the expansion of the sheet member in the portion where the wafer is placed shields the ultraviolet rays emitted from the ultraviolet irradiation portion.
  • an ultraviolet ray shielding member provided separately from the extension retention ring may be configured to shield the ultraviolet ray emitted from the ultraviolet irradiating section.
  • control processing of the second control unit 13 has been described using a flow-driven flowchart in which processing is performed in order along the processing flow.
  • the present invention is not limited to this.
  • the control processing of the control unit may be performed by event-driven processing that executes processing on an event-by-event basis. In this case, it may be completely event-driven, or a combination of event-driven and flow-driven.

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Abstract

An expanding device (100) comprises: a heat shrinkage unit (10) that heats and shrinks a part of a sheet member (220) around a wafer (210), which has become slack due to expansion by an expanding unit (6); and an ultraviolet ray irradiation unit (11) that, when the heat shrinkage unit heats the sheet member, simultaneously irradiates the sheet member with ultraviolet rays to reduce the adhesion of the sheet member.

Description

エキスパンド装置およびエキスパンド方法Expanding device and expanding method
　この発明は、エキスパンド装置およびエキスパンド方法に関し、特に、ウエハが貼り付けられたシート部材の粘着力を低減させる紫外線照射部を備えるエキスパンド装置およびエキスパンド方法に関する。 The present invention relates to an expanding device and an expanding method, and more particularly to an expanding device and an expanding method having an ultraviolet irradiation section that reduces the adhesive force of a sheet member to which a wafer is attached.
　従来、ウエハが貼り付けられたシート部材の粘着力を低減させる紫外線照射部を備えるエキスパンド装置が知られている。このようなエキスパンド装置は、たとえば、特開２０１８－０５００１０号公報に開示されている。 Conventionally, there has been known an expanding device equipped with an ultraviolet irradiation section that reduces the adhesive force of a sheet member to which a wafer is attached. Such an expanding device is disclosed, for example, in Japanese Unexamined Patent Application Publication No. 2018-050010.
　上記特開２０１８－０５００１０号公報には、ウエハが貼り付けられたシート部材の粘着力を低減させる紫外線照射部と、分割ラインに沿って分割可能なウエハが貼り付けられ伸縮性を有する熱収縮性のシート部材をエキスパンドして、分割ラインに沿ってウエハを分割するエキスパンド部と、を備えるエキスパンド装置が開示されている。このエキスパンド装置では、紫外線照射部によりシート部材に紫外線を照射して、シート部材の粘着力を低減させた後、エキスパンド部によりシート部材をエキスパンドするように構成されている。また、特開２０１８－０５００１０号公報には明記されていないが、エキスパンド部によるエキスパンドにより発生するシート部材のウエハの周囲の部分の弛みを、加熱して収縮させる必要があるため、従来のエキスパンド装置では、シート部材を加熱して収縮させるヒートシュリンク部が設けられている。 In the above-mentioned JP-A-2018-050010, an ultraviolet irradiation unit that reduces the adhesive force of the sheet member to which the wafer is attached, and a heat-shrinkable heat-shrinkable wafer that can be divided along the dividing line is attached. and an expanding section for expanding the sheet member and dividing the wafer along the dividing line. In this expanding device, the ultraviolet irradiation section irradiates the sheet member with ultraviolet rays to reduce the adhesion of the sheet member, and then the expanding section expands the sheet member. In addition, although it is not specified in JP-A-2018-050010, it is necessary to heat and shrink the slack of the portion of the sheet member around the wafer caused by the expansion by the expanding unit. , a heat shrink portion is provided for heating and shrinking the sheet member.
特開２０１８－０５００１０号公報Japanese Patent Application Laid-Open No. 2018-050010
　しかしながら、上記特開２０１８－０５００１０号公報に記載されているような従来のエキスパンド装置では、紫外線照射部によりシート部材に紫外線を照射してシート部材の粘着力を低減させた後、エキスパンド部によりシート部材をエキスパンドし、その後、ヒートシュリンク部によりシート部材を加熱してシート部材のウエハの周囲の部分の弛みを収縮させている。このため、シート部材に紫外線を照射する工程と、シート部材をエキスパンドする工程と、シート部材を加熱して収縮させる工程とを順次行う必要があり、処理時間が増加するのを抑制することが困難である。そこで、ウエハが貼り付けられたシート部材のエキスパンド、加熱収縮および粘着力を低減させる処理の時間が増加するのを抑制することが望まれている。 However, in the conventional expanding device as described in JP-A-2018-050010, the ultraviolet irradiation unit irradiates the sheet member with ultraviolet rays to reduce the adhesive force of the sheet member, and then the sheet member is expanded by the expanding unit. After the member is expanded, the sheet member is heated by the heat shrink section to shrink the slack of the portion of the sheet member around the wafer. Therefore, it is necessary to sequentially perform the step of irradiating the sheet member with ultraviolet rays, the step of expanding the sheet member, and the step of heating and contracting the sheet member, making it difficult to suppress an increase in processing time. is. Therefore, it is desired to suppress an increase in the processing time for expanding, heat-shrinking, and reducing the adhesive force of the sheet member to which the wafer is attached.
　この発明は、上記のような課題を解決するためになされたものであり、この発明の１つの目的は、ウエハが貼り付けられたシート部材のエキスパンド、加熱収縮および粘着力を低減させる処理の時間が増加するのを抑制することが可能なエキスパンド装置およびエキスパンド方法を提供することである。 The present invention has been made to solve the above problems, and one object of the present invention is to reduce the expansion, heat shrinkage, and adhesive force of a sheet member to which a wafer is attached. To provide an expanding device and an expanding method capable of suppressing an increase in .
　この発明の第１の局面によるエキスパンド装置は、分割ラインに沿って分割可能なウエハが貼り付けられ伸縮性を有する熱収縮性のシート部材をエキスパンドして、分割ラインに沿ってウエハを分割するエキスパンド部と、エキスパンド部によるエキスパンドにより発生するシート部材のウエハの周囲の部分の弛みを、加熱して収縮させるヒートシュリンク部と、ヒートシュリンク部によりシート部材を加熱する際に、並行して、シート部材に紫外線を照射して、シート部材の粘着力を低減させる紫外線照射部と、を備える。 An expanding device according to a first aspect of the present invention expands a heat-shrinkable sheet member having elasticity to which a dividable wafer is attached along a dividing line, and divides the wafer along the dividing line. a heat shrink unit that heats and shrinks slack in the portion of the sheet member around the wafer caused by the expansion by the expanding unit; and when the sheet member is heated by the heat shrink unit, the sheet member and an ultraviolet irradiating part that irradiates ultraviolet rays to reduce the adhesive force of the sheet member.
　この発明の第１の局面によるエキスパンド装置では、上記のように、ヒートシュリンク部によりシート部材を加熱する際に、並行して、シート部材に紫外線を照射して、シート部材の粘着力を低減させる紫外線照射部を設ける。これにより、ヒートシュリンク部によりシート部材のウエハの周囲の部分の弛みを加熱して収縮させながら、紫外線照射部によりシート部材の粘着力を低減させることができる。その結果、ヒートシュリンク部によるシート部材の収縮処理と、紫外線照射部によるシート部材の粘着力を低減させる処理とを順番に行う場合に比べて、処理の時間を減少させることができる。これにより、ウエハが貼り付けられたシート部材のエキスパンド、加熱収縮および粘着力を低減させる処理の時間が増加するのを抑制することができる。 In the expanding device according to the first aspect of the present invention, as described above, when the sheet member is heated by the heat shrink portion, the sheet member is simultaneously irradiated with ultraviolet rays to reduce the adhesion of the sheet member. Provide an ultraviolet irradiation unit. As a result, the adhesive force of the sheet member can be reduced by the ultraviolet irradiation section while the slack of the sheet member around the wafer is heated and shrunk by the heat shrink section. As a result, the processing time can be reduced as compared with the case where the contraction processing of the sheet member by the heat shrink portion and the processing for reducing the adhesive strength of the sheet member by the ultraviolet irradiation portion are performed in order. As a result, it is possible to suppress an increase in the processing time for expanding, heat-shrinking, and reducing the adhesive strength of the sheet member to which the wafer is attached.
　上記第１の局面によるエキスパンド装置において、好ましくは、シート部材の一方側を覆うように配置され、紫外線照射部から照射された紫外線を遮蔽する紫外線遮蔽部をさらに備え、紫外線照射部は、シート部材の他方側から、シート部材に紫外線を照射するように構成されている。このように構成すれば、紫外線遮蔽部により紫外線照射部から照射された紫外線が外部に漏れるのを抑制することができる。 The expanding device according to the first aspect preferably further includes an ultraviolet shielding section disposed so as to cover one side of the sheet member and shielding ultraviolet rays emitted from the ultraviolet irradiation section, wherein the ultraviolet irradiation section covers the sheet member. from the other side of the sheet member. According to this structure, it is possible to suppress the leakage of the ultraviolet rays irradiated from the ultraviolet irradiation section to the outside by the ultraviolet shielding section.
　この場合、好ましくは、紫外線遮蔽部は、シート部材のウエハを取り囲むように環状に形成された側面部と、シート部材とは反対側の側面部に接続された底面部とを含む。このように構成すれば、シート部材の側方に出射される紫外線を紫外線遮蔽部の側面部により遮蔽することができるとともに、シート部材の面に垂直な方向に出射される紫外線を紫外線遮蔽部の底面部により遮蔽することができる。これにより、シート部材に照射される紫外線が外部に漏れるのをより確実に抑制することができる。 In this case, the ultraviolet shielding part preferably includes a side surface portion formed annularly so as to surround the wafer of the sheet member, and a bottom surface portion connected to the side surface portion opposite to the sheet member. With this configuration, the ultraviolet rays emitted to the side of the sheet member can be shielded by the side portions of the ultraviolet shielding portion, and the ultraviolet rays emitted in the direction perpendicular to the surface of the sheet member can be shielded by the ultraviolet shielding portion. It can be shielded by the bottom part. As a result, it is possible to more reliably suppress leakage of the ultraviolet rays irradiated to the sheet member to the outside.
　上記紫外線遮蔽部を備える構成のエキスパンド装置において、好ましくは、紫外線照射部によりシート部材に紫外線を照射する際に、シート部材の他方側に当接してシート部材を支持するとともに紫外線照射部を取り囲むように配置され、紫外線を遮蔽する材料により形成された支持リングをさらに備える。このように構成すれば、シート部材を支持する支持リングにより紫外線照射部から周りに出射される紫外線を遮蔽することができるので、シート部材を支持する部材と紫外線を遮蔽する部材とを別個に設ける場合に比べて、部品点数を減少させることができるとともに、装置構成を簡素化することができる。 In the expanding device having the structure including the ultraviolet shielding section, preferably, when the sheet member is irradiated with ultraviolet rays by the ultraviolet irradiation section, the sheet member is in contact with the other side of the sheet member to support the sheet member and surround the ultraviolet irradiation section. and a support ring formed of a material that blocks ultraviolet light. With this configuration, the support ring that supports the sheet member can shield the ultraviolet rays emitted from the ultraviolet irradiation section to the surroundings. Therefore, the member that supports the sheet member and the member that shields the ultraviolet rays are provided separately. Compared to the case, the number of parts can be reduced, and the device configuration can be simplified.
　この場合、好ましくは、紫外線遮蔽部および支持リングは、紫外線照射部によりシート部材に紫外線を照射する際に、並行してヒートシュリンク部によりシート部材を収縮させる際に、シート部材を挟み込むように保持することにより、ウエハが配置される部分のシート部材の拡張を維持するように構成されている。このように構成すれば、紫外線照射部により照射される紫外線を遮蔽する紫外線遮蔽部により、ヒートシュリンク部によりシート部材を収縮させる際にウエハが配置される部分のシート部材の拡張を維持することができるので、シート部材の拡張を維持する部材を別途設ける場合に比べて、部品点数を減少させることができるとともに、装置構成を簡素化することができる。 In this case, preferably, the ultraviolet shielding portion and the support ring hold the sheet member so as to sandwich the sheet member when the sheet member is irradiated with ultraviolet rays by the ultraviolet irradiation portion and when the sheet member is shrunk by the heat shrink portion in parallel. By doing so, the expansion of the sheet member at the portion where the wafer is placed is maintained. According to this structure, the expansion of the sheet member at the portion where the wafer is placed can be maintained by the ultraviolet shielding portion that shields the ultraviolet rays irradiated by the ultraviolet irradiation portion when the sheet member is shrunk by the heat shrink portion. Therefore, the number of parts can be reduced and the configuration of the device can be simplified as compared with the case where a member for maintaining the expansion of the seat member is separately provided.
　上記第１の局面によるエキスパンド装置において、好ましくは、紫外線照射部は、シート部材の面に対して交差する方向に沿って配置された紫外線照射位置と退避位置との間で移動可能に構成されている。このように構成すれば、シート部材に紫外線を照射する場合には、紫外線照射部を紫外線照射位置に移動させて、シート部材に紫外線を照射しない場合には、紫外線照射部を退避位置に退避させることができる。これにより、紫外線照射部を退避させた場合にはシート部材に対してさらに他の処理を行うことができるので、同じ位置のシート部材に対して複数種類の処理を行うことができる。 In the expanding device according to the first aspect, the ultraviolet irradiation section is preferably configured to be movable between an ultraviolet irradiation position and a retracted position arranged along a direction intersecting the surface of the sheet member. there is With this configuration, the ultraviolet irradiation section is moved to the ultraviolet irradiation position when the sheet member is irradiated with ultraviolet rays, and the ultraviolet irradiation section is retracted to the retracted position when the sheet member is not irradiated with ultraviolet rays. be able to. As a result, when the ultraviolet irradiation section is retracted, the sheet member can be subjected to other processing, so that a plurality of types of processing can be performed to the sheet member at the same position.
　上記第１の局面によるエキスパンド装置において、好ましくは、紫外線照射部は、ヒートシュリンク部によりシート部材を加熱して収縮させる際の作業時間内に、シート部材の粘着力を低減させる紫外線の照射処理が終了するように、照射する紫外線の強度が調整されている。このように構成すれば、シート部材を加熱して収縮させる作業内に、紫外線を照射してシート部材の粘着力を低減させる処理を終了させることができるので、紫外線を照射してシート部材の粘着力を低減させる処理の終了を待機する待機時間が発生するのを抑制することができる。その結果、ウエハが貼り付けられたシート部材のエキスパンド、加熱収縮および粘着力を低減させる処理の時間が増加するのを効果的に抑制することができる。 In the expanding device according to the first aspect, preferably, the ultraviolet irradiation section performs ultraviolet irradiation treatment for reducing the adhesive force of the sheet member within a working time for heating and shrinking the sheet member by the heat shrink section. The intensity of the irradiated ultraviolet light is adjusted so that it ends. With this configuration, the process of reducing the adhesion of the sheet member by irradiating the ultraviolet rays can be completed during the work of heating and shrinking the sheet member. It is possible to suppress the occurrence of waiting time for waiting for the end of the force reduction process. As a result, it is possible to effectively suppress an increase in the processing time for expanding, heat-shrinking, and reducing the adhesive force of the sheet member to which the wafer is attached.
　この発明の第２の局面によるエキスパンド方法は、分割ラインに沿って分割可能なウエハが貼り付けられ伸縮性を有する熱収縮性のシート部材をエキスパンドして、分割ラインに沿ってウエハを分割し、その後、シート部材のエキスパンドにより発生するシート部材のウエハの周囲の部分の弛みを、加熱して収縮させ、シート部材を加熱して収縮させる際に、並行して、シート部材に紫外線を照射して、シート部材の粘着力を低減させる。 An expanding method according to a second aspect of the present invention includes expanding a heat-shrinkable sheet member having a dividable wafer attached along a dividing line and having elasticity, dividing the wafer along the dividing line, After that, the slack of the sheet member around the wafer caused by the expansion of the sheet member is shrunk by heating, and when the sheet member is shrunk by heating, the sheet member is irradiated with ultraviolet rays in parallel. , to reduce the adhesive force of the sheet member.
　この発明の第２の局面によるエキスパンド方法では、上記のように、シート部材を加熱して収縮させる際に、並行して、シート部材に紫外線を照射して、シート部材の粘着力を低減させる。これにより、シート部材のウエハの周囲の部分の弛みを加熱して収縮させながら、紫外線の照射によりシート部材の粘着力を低減させることができる。その結果、シート部材の収縮処理と、紫外線の照射によるシート部材の粘着力を低減させる処理とを順番に行う場合に比べて、処理の時間を減少させることができる。これにより、ウエハが貼り付けられたシート部材のエキスパンド、加熱収縮および粘着力を低減させる処理の時間が増加するのを抑制することが可能なエキスパンド方法を提供することができる。 In the expanding method according to the second aspect of the present invention, as described above, when the sheet member is heated and shrunk, the sheet member is simultaneously irradiated with ultraviolet rays to reduce the adhesion of the sheet member. As a result, the adhesive force of the sheet member can be reduced by irradiating the ultraviolet rays while the slack of the sheet member around the wafer is heated and contracted. As a result, the processing time can be reduced as compared with the case where the contraction treatment of the sheet member and the treatment for reducing the adhesive force of the sheet member by irradiation with ultraviolet rays are performed in order. As a result, it is possible to provide an expanding method capable of suppressing an increase in the processing time for expanding, heat shrinking, and reducing the adhesive strength of the sheet member to which the wafer is attached.
　本発明によれば、上記のように、ウエハが貼り付けられたシート部材のエキスパンド、加熱収縮および粘着力を低減させる処理の時間が増加するのを抑制することができる。 According to the present invention, as described above, it is possible to suppress an increase in the processing time for expanding, heat-shrinking, and reducing the adhesive force of the sheet member to which the wafer is attached.
一実施形態によるエキスパンド装置の平面図である。1 is a plan view of an expanding device according to one embodiment; FIG. 一実施形態によるエキスパンド装置の側面図である。1 is a side view of an expanding device according to one embodiment; FIG. 一実施形態によるエキスパンド装置のウエハリング構造の平面図である。FIG. 4 is a plan view of a wafer ring structure of an expanding device according to one embodiment; 図３の１０１－１０１線に沿った断面図である。4 is a cross-sectional view taken along line 101-101 of FIG. 3; FIG. 一実施形態によるエキスパンド装置の破片クリーナの底面図である。FIG. 4 is a bottom view of a debris cleaner of an expanding device according to one embodiment; 一実施形態によるエキスパンド装置のヒートシュリンク部の底面図である。FIG. 4 is a bottom view of the heat shrink portion of the expanding device according to one embodiment; 一実施形態によるエキスパンド装置の制御的な構成を示したブロック図である。4 is a block diagram showing a control configuration of an expanding device according to one embodiment; FIG. 一実施形態によるエキスパンド装置の半導体チップ製造処理を示したフローチャートである。4 is a flow chart showing semiconductor chip manufacturing processing of the expanding device according to one embodiment. 一実施形態によるエキスパンド装置のウエハリング構造をクランプする前の状態を示した側面図である。It is a side view showing a state before clamping the wafer ring structure of the expanding device according to one embodiment. 一実施形態によるエキスパンド装置のウエハリング構造をクランプした状態を示した側面図である。It is a side view showing a state where the wafer ring structure of the expanding device is clamped according to one embodiment. 一実施形態によるエキスパンド装置のシート部材をエキスパンドした状態を示した側面図である。FIG. 4 is a side view showing a state in which the sheet member of the expanding device according to one embodiment is expanded. 一実施形態によるエキスパンド装置のウエハリング構造、破片クリーナ、およびエキスパンドリングを示した側面図である。FIG. 10 is a side view of the wafer ring structure, debris cleaner, and expanding ring of the expanding device according to one embodiment; 一実施形態によるエキスパンド装置のシート部材をヒートシュリンクする前の状態を示した側面図である。FIG. 4 is a side view showing a state before the sheet member of the expanding device according to one embodiment is heat-shrinked; 一実施形態によるエキスパンド装置のシート部材をヒートシュリンクする際の状態を示した側面図である。FIG. 4 is a side view showing a state in which the sheet member of the expanding device according to the embodiment is heat-shrinked. 一実施形態によるエキスパンド装置の取出処理を示したフローチャートである。4 is a flow chart showing extraction processing of the expanding device according to one embodiment. 一実施形態によるエキスパンド装置の移載処理を示したフローチャートである。4 is a flow chart showing transfer processing of the expanding device according to one embodiment. 一実施形態によるエキスパンド装置のエキスパンド処理を示したフローチャートである。4 is a flow chart showing the expanding process of the expanding device according to one embodiment. 図１７のフローチャートの続きのフローチャートである。FIG. 18 is a flow chart following the flow chart of FIG. 17; FIG. 一実施形態によるエキスパンド装置のヒートシュリンク処理を示したフローチャートである。4 is a flow chart showing a heat shrink process of an expanding device according to one embodiment. 図１９のフローチャートの続きのフローチャートである。FIG. 20 is a flow chart following the flow chart of FIG. 19; FIG. 一実施形態によるエキスパンド装置の収容処理を示したフローチャートである。4 is a flow chart showing processing for accommodating an expanding device according to one embodiment.
　以下、本発明を具体化した実施形態を図面に基づいて説明する。 An embodiment embodying the present invention will be described below based on the drawings.
　図１～図２１を参照して、本発明の一実施形態によるエキスパンド装置１００の構成について説明する。 The configuration of an expanding device 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 21. FIG.
（エキスパンド装置の構成）
　図１および図２に示すように、エキスパンド装置１００は、ウエハ２１０を分割して複数の半導体チップを形成するように構成されている。また、エキスパンド装置１００は、複数の半導体チップ同士の間に十分な隙間を形成するように構成されている。ここで、ウエハ２１０には、ウエハ２１０に対して透過性を有する波長のレーザを分割ライン（ストリート）に沿って照射することにより、予め改質層が形成されている。改質層とは、レーザによりウエハ２１０の内部に形成された亀裂およびボイドなどを示す。このように、ウエハ２１０に改質層を形成する手法をステルス式ダイシング加工という。 (Configuration of expanding device)
As shown in FIGS. 1 and 2, expanding apparatus 100 is configured to divide wafer 210 to form a plurality of semiconductor chips. Further, the expanding device 100 is configured to form sufficient gaps between the plurality of semiconductor chips. Here, a modified layer is formed in advance on the wafer 210 by irradiating the wafer 210 with a laser beam having a wavelength that is transmissive to the wafer 210 along the division lines (street). The modified layer refers to cracks, voids, etc. formed inside the wafer 210 by the laser. A method of forming a modified layer on the wafer 210 in this manner is called stealth dicing.
　したがって、エキスパンド装置１００では、シート部材２２０をエキスパンドさせることにより、改質層に沿ってウエハ２１０が分割されることになる。また、エキスパンド装置１００において、シート部材２２０をエキスパンドさせることにより、分割されて形成された複数の半導体チップ同士の隙間が広がることになる。 Therefore, in the expanding device 100, by expanding the sheet member 220, the wafer 210 is divided along the modified layer. Further, by expanding the sheet member 220 in the expanding device 100, the gaps between the plurality of semiconductor chips that are divided and formed are widened.
　エキスパンド装置１００は、ベースプレート１と、カセット部２と、リフトアップハンド部３と、吸着ハンド部４と、ベース５と、エキスパンド部６と、冷気供給部７と、冷却ユニット８と、破片クリーナ９と、ヒートシュリンク部１０と、紫外線照射部１１とを備えている。 The expanding device 100 includes a base plate 1 , a cassette section 2 , a lift-up hand section 3 , a suction hand section 4 , a base 5 , an expanding section 6 , a cool air supply section 7 , a cooling unit 8 , and a fragment cleaner 9 . , a heat shrink portion 10 , and an ultraviolet irradiation portion 11 .
　ここで、水平方向のうちカセット部２と、ヒートシュリンク部１０とが並ぶ方向をＸ方向とし、Ｘ方向のうちカセット部２側をＸ１方向とし、Ｘ方向のうちヒートシュリンク部１０側をＸ２方向とする。また、水平方向のうちＸ方向に直交する方向をＹ方向とし、Ｙ方向のうちカセット部２側をＹ１方向とし、Ｙ１方向とは逆方向をＹ２方向とする。また、上下方向をＺ方向とし、上方向をＺ１方向とし、下方向をＺ２方向とする。 Here, the horizontal direction in which the cassette portion 2 and the heat shrink portion 10 are arranged is the X direction, the cassette portion 2 side in the X direction is the X1 direction, and the heat shrink portion 10 side in the X direction is the X2 direction. and Among the horizontal directions, the direction orthogonal to the X direction is the Y direction, the Y1 direction is the cassette portion 2 side of the Y directions, and the Y2 direction is the opposite direction to the Y1 direction. The vertical direction is the Z direction, the upward direction is the Z1 direction, and the downward direction is the Z2 direction.
〈ベースプレート〉
　ベースプレート１は、カセット部２および吸着ハンド部４が設置される基台である。ベースプレート１は、平面視において、Ｙ方向に長い矩形形状を有している。 <Base plate>
The base plate 1 is a base on which the cassette section 2 and the suction hand section 4 are installed. The base plate 1 has a rectangular shape elongated in the Y direction in plan view.
〈カセット部〉
　カセット部２は、複数（５個）のウエハリング構造２００を収容可能に構成されている。ここで、ウエハリング構造２００は、図３および図４に示すように、ウエハ２１０と、シート部材２２０と、リング状部材２３０とを有している。 <Cassette part>
The cassette section 2 is configured to accommodate a plurality (five) of wafer ring structures 200 . Here, the wafer ring structure 200 has a wafer 210, a sheet member 220, and a ring-shaped member 230, as shown in FIGS.
　ウエハ２１０は、半導体集積回路の材料となる半導体物質の結晶でできた円形の薄い板である。ウエハ２１０の内部には、上記したように、分割ラインに沿って内部を改質させた改質層が形成されている。すなわち、ウエハ２１０は、分割ラインに沿って分割可能に構成されている。シート部材２２０は、伸縮性を有する粘着テープである。シート部材２２０の上面２２０ａには、粘着層が設けられている。シート部材２２０には、粘着層にウエハ２１０が貼り付けられている。リング状部材２３０は、平面視においてリング状の金属製のフレームである。リング状部材２３０の外側面２３０ａには、切り欠き２４０および切り欠き２５０が形成されている。リング状部材２３０は、ウエハ２１０を囲んだ状態でシート部材２２０の粘着層に貼り付けられている。 The wafer 210 is a circular thin plate made of a crystal of a semiconductor material that is used as a material for semiconductor integrated circuits. Inside the wafer 210, as described above, a modified layer is formed by modifying the inside along the dividing line. That is, the wafer 210 is configured to be split along the split lines. The sheet member 220 is an elastic adhesive tape. An adhesive layer is provided on the upper surface 220a of the sheet member 220 . The wafer 210 is attached to the adhesive layer of the sheet member 220 . The ring-shaped member 230 is a ring-shaped metal frame in plan view. A notch 240 and a notch 250 are formed in the outer surface 230 a of the ring-shaped member 230 . The ring-shaped member 230 is attached to the adhesive layer of the sheet member 220 while surrounding the wafer 210 .
　図１および図２に示すように、カセット部２は、Ｚ方向移動機構２１と、ウエハカセット２２と、一対の載置部２３とを含んでいる。Ｚ方向移動機構２１は、モータ２１ａを駆動源としてウエハカセット２２をＺ方向に移動させるように構成されている。また、Ｚ方向移動機構２１は、ウエハカセット２２を下側から支持する載置台２１ｂを有している。載置台２１ｂには、ウエハカセット２２が手作業によって供給および載置される。ウエハカセット２２は、複数のウエハリング構造２００を収容可能な収容空間を有している。一対の載置部２３は、ウエハカセット２２の内側に複数（５個）配置されている。一対の載置部２３には、ウエハリング構造２００のリング状部材２３０がＺ１方向側から載置される。一対の載置部２３の一方は、ウエハカセット２２のＸ１方向側の内側面からＸ２方向側に突出している。一対の載置部２３の他方は、ウエハカセット２２のＸ２方向側の内側面からＸ１方向側に突出している。 　As shown in FIGS. 1 and 2, the cassette section 2 includes a Z-direction moving mechanism 21, a wafer cassette 22, and a pair of mounting sections 23. As shown in FIG. The Z-direction moving mechanism 21 is configured to move the wafer cassette 22 in the Z-direction using a motor 21a as a drive source. The Z-direction moving mechanism 21 also has a mounting table 21b that supports the wafer cassette 22 from below. The wafer cassette 22 is manually supplied and mounted on the mounting table 21b. The wafer cassette 22 has an accommodation space capable of accommodating a plurality of wafer ring structures 200 . A plurality of (five) pairs of mounting portions 23 are arranged inside the wafer cassette 22 . A ring-shaped member 230 of the wafer ring structure 200 is mounted on the pair of mounting portions 23 from the Z1 direction side. One of the pair of mounting portions 23 protrudes in the X2 direction from the inner surface of the wafer cassette 22 in the X1 direction. The other of the pair of mounting portions 23 protrudes in the X1 direction from the inner surface of the wafer cassette 22 in the X2 direction.
〈リフトアップハンド部〉
　リフトアップハンド部３は、カセット部２からウエハリング構造２００を取出可能に構成されている。また、リフトアップハンド部３は、カセット部２にウエハリング構造２００を収容可能に構成されている。 <Lift-up hand section>
The lift-up hand section 3 is configured to be able to take out the wafer ring structure 200 from the cassette section 2 . Further, the lift-up hand section 3 is configured so that the wafer ring structure 200 can be accommodated in the cassette section 2 .
　具体的には、リフトアップハンド部３は、Ｙ方向移動機構３１と、リフトアップハンド３２とを含んでいる。Ｙ方向移動機構３１は、モータ３１ａを駆動源としてリフトアップハンド３２をＹ方向に移動させるように構成されている。リフトアップハンド３２は、ウエハリング構造２００のリング状部材２３０をＺ２方向側から支持するように構成されている。 Specifically, the lift-up hand section 3 includes a Y-direction movement mechanism 31 and a lift-up hand 32 . The Y-direction moving mechanism 31 is configured to move the lift-up hand 32 in the Y-direction using a motor 31a as a drive source. The lift-up hand 32 is configured to support the ring-shaped member 230 of the wafer ring structure 200 from the Z2 direction side.
〈吸着ハンド部〉
　吸着ハンド部４は、ウエハリング構造２００のリング状部材２３０をＺ１方向側から吸着するように構成されている。 <Suction hand part>
The suction hand unit 4 is configured to suction the ring-shaped member 230 of the wafer ring structure 200 from the Z1 direction side.
　具体的には、吸着ハンド部４は、Ｘ方向移動機構４１と、Ｚ方向移動機構４２と、吸着ハンド４３とを含んでいる。Ｘ方向移動機構４１は、モータ４１ａを駆動源として吸着ハンド４３をＸ方向に移動させるように構成されている。Ｚ方向移動機構４２は、モータ４２ａを駆動源として吸着ハンド４３をＺ方向に移動させるように構成されている。吸着ハンド４３は、ウエハリング構造２００のリング状部材２３０をＺ１方向側から支持するように構成されている。 Specifically, the suction hand unit 4 includes an X-direction movement mechanism 41 , a Z-direction movement mechanism 42 and a suction hand 43 . The X-direction moving mechanism 41 is configured to move the suction hand 43 in the X direction using a motor 41a as a drive source. The Z-direction moving mechanism 42 is configured to move the suction hand 43 in the Z-direction using a motor 42a as a drive source. The suction hand 43 is configured to support the ring-shaped member 230 of the wafer ring structure 200 from the Z1 direction side.
〈ベース〉
　ベース５は、エキスパンド部６、冷却ユニット８および紫外線照射部１１が設置される基台である。ベース５は、平面視において、Ｙ方向に長い矩形形状を有している。ベース５のＺ１方向側の上端面は、ベースプレート１のＺ１方向側の上端面よりもＺ１方向側に配置されている。 <base>
The base 5 is a base on which the expanding section 6, the cooling unit 8 and the ultraviolet irradiation section 11 are installed. The base 5 has a rectangular shape elongated in the Y direction in plan view. The upper end surface of the base 5 on the Z1 direction side is arranged on the Z1 direction side of the upper end surface of the base plate 1 on the Z1 direction side.
〈エキスパンド部〉
　エキスパンド部６は、ウエハリング構造２００のシート部材２２０をエキスパンドすることにより、分割ラインに沿ってウエハ２１０を分割するように構成されている。 <Expanding part>
The expanding section 6 is configured to expand the sheet member 220 of the wafer ring structure 200 to divide the wafer 210 along the dividing line.
　具体的には、エキスパンド部６は、Ｚ方向移動機構６１と、Ｙ方向移動機構６２と、クランプ部６３と、エキスパンドリング６４とを含んでいる。Ｚ方向移動機構６１は、モータ６１ａを駆動源としてクランプ部６３をＺ方向に移動させるように構成されている。Ｙ方向移動機構６２は、モータ６２ａを駆動源としてＺ方向移動機構６１、クランプ部６３およびエキスパンドリング６４をＹ方向に移動させるように構成されている。なお、エキスパンドリング６４は、請求の範囲の「支持リング」の一例である。 Specifically, the expanding section 6 includes a Z-direction moving mechanism 61 , a Y-direction moving mechanism 62 , a clamp section 63 and an expanding ring 64 . The Z-direction moving mechanism 61 is configured to move the clamp portion 63 in the Z-direction using a motor 61a as a drive source. The Y-direction moving mechanism 62 is configured to move the Z-direction moving mechanism 61, the clamp portion 63 and the expand ring 64 in the Y direction using a motor 62a as a drive source. The expand ring 64 is an example of the "support ring" in the claims.
　クランプ部６３は、ウエハリング構造２００のリング状部材２３０を把持するように構成されている。クランプ部６３は、下側把持部６３ａと、上側把持部６３ｂとを有している。下側把持部６３ａは、リング状部材２３０をＺ２方向側から支持する。上側把持部６３ｂは、下側把持部６３ａにより支持された状態のリング状部材２３０をＺ１方向側から押さえる。このように、リング状部材２３０は、下側把持部６３ａおよび上側把持部６３ｂにより把持される。 The clamp part 63 is configured to grip the ring-shaped member 230 of the wafer ring structure 200 . The clamp portion 63 has a lower grip portion 63a and an upper grip portion 63b. The lower grip portion 63a supports the ring-shaped member 230 from the Z2 direction side. The upper gripping portion 63b presses the ring-shaped member 230 supported by the lower gripping portion 63a from the Z1 direction side. Thus, the ring-shaped member 230 is gripped by the lower gripping portion 63a and the upper gripping portion 63b.
　エキスパンドリング６４は、シート部材２２０をＺ２方向側から支持することにより、シート部材２２０をエキスパンド（拡張）させるように構成されている。エキスパンドリング６４は、平面視においてリング形状を有している。 The expand ring 64 is configured to expand the sheet member 220 by supporting the sheet member 220 from the Z2 direction side. The expand ring 64 has a ring shape in plan view.
〈冷気供給部〉
　冷気供給部７は、エキスパンド部６によりシート部材２２０をエキスパンドさせる際、シート部材２２０にＺ１方向側から冷気を供給するように構成されている。 <Cold air supply unit>
The cool air supply unit 7 is configured to supply cold air to the sheet member 220 from the Z1 direction side when the sheet member 220 is expanded by the expanding unit 6 .
　具体的には、冷気供給部７は、複数のノズル７１を有している。ノズル７１は、冷気供給源（図示せず）から供給される冷気を流出させる冷気供給口７１ａ（図５参照）を有している。ノズル７１は、破片クリーナ９に取り付けられている。冷気供給源は、冷気を生成するための冷却装置である。冷気供給源は、たとえば、ヒートポンプなどが設けられた冷却装置などにより冷却された空気を供給する。このような冷気供給源は、ベース５に設置される。冷気供給源と、複数のノズル７１の各々とは、ホース（図示せず）により接続されている。 Specifically, the cool air supply unit 7 has a plurality of nozzles 71 . The nozzle 71 has a cool air supply port 71a (see FIG. 5) through which cool air supplied from a cool air supply source (not shown) flows out. A nozzle 71 is attached to the debris cleaner 9 . A cold source is a chiller for generating cold. The cool air supply source supplies air cooled by, for example, a cooling device provided with a heat pump or the like. Such cold air supply is mounted on the base 5 . A cool air supply source and each of the plurality of nozzles 71 are connected by a hose (not shown).
〈冷却ユニット〉
　冷却ユニット８は、エキスパンド部６によりシート部材２２０をエキスパンドさせる際、シート部材２２０をＺ２方向側から冷却するように構成されている。 <Cooling unit>
The cooling unit 8 is configured to cool the sheet member 220 from the Z2 direction side when the sheet member 220 is expanded by the expanding section 6 .
　具体的には、冷却ユニット８は、冷却体８１ａおよびペルチェ素子８１ｂを有する冷却部材８１と、シリンダ８２とを含んでいる。冷却体８１ａは、熱容量が大きく、かつ、熱伝導率が高い部材により構成されている。冷却体８１ａは、アルミニウムなどの金属により形成されている。ペルチェ素子８１ｂは、冷却体８１ａを冷却するように構成されている。なお、冷却体８１ａは、アルミニウムに限定されず、他の熱容量が大きく、かつ、熱伝導率が高い部材であってもよい。 Specifically, the cooling unit 8 includes a cooling member 81 having a cooling body 81 a and a Peltier element 81 b, and a cylinder 82 . The cooling body 81a is made of a member having a large heat capacity and a high thermal conductivity. The cooling body 81a is made of metal such as aluminum. The Peltier element 81b is configured to cool the cooling body 81a. Note that the cooling body 81a is not limited to aluminum, and may be another member having a large heat capacity and a high thermal conductivity.
　冷却ユニット８は、シリンダ８２により、Ｚ方向に移動可能に構成されている。これにより、冷却ユニット８は、シート部材２２０に接触する位置、および、シート部材２２０から離間した位置に移動することが可能である。 The cooling unit 8 is configured to be movable in the Z direction by means of a cylinder 82. Thereby, the cooling unit 8 can move to a position in contact with the sheet member 220 and a position away from the sheet member 220 .
〈破片クリーナ〉
　破片クリーナ９は、エキスパンド部６によりシート部材２２０をエキスパンドさせる際、ウエハ２１０の破片などを吸引するように構成されている。 <Debris Cleaner>
The fragment cleaner 9 is configured to suck fragments of the wafer 210 and the like when the sheet member 220 is expanded by the expanding section 6 .
　図５に示すように、破片クリーナ９は、リング状部材９１と、複数の吸引口９２とを含んでいる。リング状部材９１は、Ｚ１方向側から見て、リング形状を有する部材である。複数の吸引口９２は、ウエハ２１０の破片などを吸引するための開口である。複数の吸引口９２は、リング状部材９１のＺ２方向側の下面に形成されている。 As shown in FIG. 5, the fragment cleaner 9 includes a ring-shaped member 91 and a plurality of suction ports 92. The ring-shaped member 91 is a member having a ring shape when viewed from the Z1 direction side. The plurality of suction ports 92 are openings for sucking fragments of the wafer 210 and the like. A plurality of suction ports 92 are formed on the lower surface of the ring-shaped member 91 on the Z2 direction side.
　図２に示すように、破片クリーナ９は、シリンダ（図示せず）により、Ｚ方向に移動可能に構成されている。これにより、破片クリーナ９は、ウエハ２１０に近接した位置、および、Ｘ方向に移動する吸着ハンド４３を回避可能な位置に移動することが可能である。 As shown in FIG. 2, the debris cleaner 9 is configured to be movable in the Z direction by means of a cylinder (not shown). As a result, the fragment cleaner 9 can move to a position close to the wafer 210 and to a position where the suction hand 43 moving in the X direction can be avoided.
〈ヒートシュリンク部〉
　ヒートシュリンク部１０は、エキスパンド部６によりエキスパンドされたシート部材２２０を、複数の半導体チップ同士の間の隙間を保持した状態で、加熱により収縮させるように構成されている。 <Heat shrink part>
The heat shrink section 10 is configured to shrink the sheet member 220 expanded by the expanding section 6 by heating while maintaining the gaps between the plurality of semiconductor chips.
　図１に示すように、ヒートシュリンク部１０は、Ｚ方向移動機構１１０と、加熱リング１１１と、吸気リング１１２と、拡張維持リング１１３とを含んでいる。Ｚ方向移動機構１１０は、モータ１１０ａを駆動源として加熱リング１１１および吸気リング１１２をＺ方向に移動させるように構成されている。なお、拡張維持リング１１３は、請求の範囲の「紫外線遮蔽部」の一例である。 As shown in FIG. 1, the heat shrink section 10 includes a Z-direction moving mechanism 110, a heating ring 111, an intake ring 112, and an expansion maintaining ring 113. The Z-direction moving mechanism 110 is configured to move the heating ring 111 and the suction ring 112 in the Z direction using a motor 110a as a drive source. The extension retaining ring 113 is an example of the "ultraviolet shielding part" in the claims.
　図６に示すように、加熱リング１１１は、平面視において、リング形状を有している。また、加熱リング１１１は、シート部材２２０を加熱するシーズヒータを有している。吸気リング１１２は、加熱リング１１１と一体的に構成されている。吸気リング１１２は、平面視において、リング形状を有している。吸気リング１１２のＺ２方向側の下面には、複数の吸気口１１２ａが形成されている。拡張維持リング１１３は、加熱リング１１１による加熱によってウエハ２１０付近のシート部材２２０が収縮しないように、シート部材２２０をＺ１方向側から押さえるように構成されている。 As shown in FIG. 6, the heating ring 111 has a ring shape in plan view. The heating ring 111 also has a sheathed heater that heats the sheet member 220 . The intake ring 112 is configured integrally with the heating ring 111 . The intake ring 112 has a ring shape in plan view. A plurality of intake ports 112a are formed in the lower surface of the intake ring 112 on the Z2 direction side. The expansion maintaining ring 113 is configured to hold down the sheet member 220 from the Z1 direction side so that the sheet member 220 near the wafer 210 does not shrink due to heating by the heating ring 111 .
　拡張維持リング１１３は、平面視においてリング形状を有している。拡張維持リング１１３は、シリンダ（図示せず）により、Ｚ方向に移動可能に構成されている。これにより、拡張維持リング１１３は、シート部材２２０を押さえる位置、および、シート部材２２０から離れた位置に移動することが可能である。 The expansion maintaining ring 113 has a ring shape in plan view. The expansion retaining ring 113 is configured to be movable in the Z direction by a cylinder (not shown). This allows the expansion retaining ring 113 to move to a position holding the seat member 220 and a position away from the seat member 220 .
〈紫外線照射部〉
　紫外線照射部１１は、シート部材２２０の粘着層の粘着力を低下させるために、シート部材２２０に紫外線を照射するように構成されている。具体的には、紫外線照射部１１は、紫外線用照明を有している。 <Ultraviolet irradiation part>
The ultraviolet irradiation unit 11 is configured to irradiate the sheet member 220 with ultraviolet rays in order to reduce the adhesive strength of the adhesive layer of the sheet member 220 . Specifically, the ultraviolet irradiation section 11 has an ultraviolet light.
（エキスパンド装置の制御的な構成）
　図７に示すように、エキスパンド装置１００は、第１制御部１２と、第２制御部１３と、第３制御部１４と、第４制御部１５と、第５制御部１６と、エキスパンド制御演算部１７と、ハンドリング制御演算部１８と、記憶部１９とを備えている。 (Controllable configuration of expanding device)
As shown in FIG. 7, the expanding device 100 includes a first control unit 12, a second control unit 13, a third control unit 14, a fourth control unit 15, a fifth control unit 16, an expansion control calculation A unit 17 , a handling control calculation unit 18 , and a storage unit 19 are provided.
　第１制御部１２は、ヒートシュリンク部１０を制御するように構成されている。第１制御部１２は、ＣＰＵ（Ｃｅｎｔｒａｌ　Ｐｒｏｃｅｓｓｉｎｇ　Ｕｎｉｔ）と、ＲＯＭ（Ｒｅａｄ　Ｏｎｌｙ　Ｍｅｍｏｒｙ）およびＲＡＭ（Ｒａｎｄｏｍ　Ａｃｃｅｓｓ　Ｍｅｍｏｒｙ）などを有する記憶部とを含んでいる。なお、第１制御部１２は、記憶部として、電圧遮断後にも記憶された情報が保持されるＨＤＤ（Ｈａｒｄ　Ｄｉｓｋ　Ｄｒｉｖｅ）などを含んでいてもよい。また、ＨＤＤは、第１制御部１２、第２制御部１３、第３制御部１４、第４制御部１５、および、第５制御部１６に対して共通に設けられていてもよい。 The first control section 12 is configured to control the heat shrink section 10 . The first control unit 12 includes a CPU (Central Processing Unit) and a storage unit having ROM (Read Only Memory) and RAM (Random Access Memory). The first control unit 12 may include, as a storage unit, an HDD (Hard Disk Drive) that retains stored information even after the voltage is cut off. Also, the HDD may be provided in common to the first control section 12 , the second control section 13 , the third control section 14 , the fourth control section 15 and the fifth control section 16 .
　第２制御部１３は、冷気供給部７、冷却ユニット８および破片クリーナ９を制御するように構成されている。第２制御部１３は、ＣＰＵと、ＲＯＭおよびＲＡＭなどを有する記憶部とを含んでいる。第３制御部１４は、エキスパンド部６を制御するように構成されている。第３制御部１４は、ＣＰＵと、ＲＯＭおよびＲＡＭなどを有する記憶部とを含んでいる。なお、第２制御部１３および第３制御部１４は、記憶部として、電圧遮断後にも記憶された情報が保持されるＨＤＤなどを含んでいてもよい。 The second control section 13 is configured to control the cool air supply section 7 , the cooling unit 8 and the debris cleaner 9 . The second control unit 13 includes a CPU and a storage unit having ROM, RAM, and the like. The third control section 14 is configured to control the expanding section 6 . The third control unit 14 includes a CPU and a storage unit having ROM, RAM, and the like. Note that the second control unit 13 and the third control unit 14 may include, as a storage unit, an HDD or the like that retains stored information even after the voltage is cut off.
　第４制御部１５は、カセット部２およびリフトアップハンド部３を制御するように構成されている。第４制御部１５は、ＣＰＵと、ＲＯＭおよびＲＡＭなどを有する記憶部とを含んでいる。第５制御部１６は、吸着ハンド部４を制御するように構成されている。第５制御部１６は、ＣＰＵと、ＲＯＭおよびＲＡＭなどを有する記憶部とを含んでいる。なお、第４制御部１５および第５制御部１６は、記憶部として、電圧遮断後にも記憶された情報が保持されるＨＤＤなどを含んでいてもよい。 The fourth control section 15 is configured to control the cassette section 2 and the lift-up hand section 3. The fourth control unit 15 includes a CPU and a storage unit having ROM, RAM, and the like. The fifth control section 16 is configured to control the suction hand section 4 . The fifth control unit 16 includes a CPU and a storage unit having ROM, RAM, and the like. Note that the fourth control unit 15 and the fifth control unit 16 may include, as a storage unit, an HDD or the like that retains stored information even after the voltage is cut off.
　エキスパンド制御演算部１７は、第１制御部１２、第２制御部１３および第３制御部１４の処理結果に基づいて、シート部材２２０のエキスパンド処理に関する演算を行うように構成されている。エキスパンド制御演算部１７は、ＣＰＵと、ＲＯＭおよびＲＡＭなどを有する記憶部とを含んでいる。 The expansion control calculation unit 17 is configured to perform calculations related to expansion processing of the sheet member 220 based on the processing results of the first control unit 12, the second control unit 13 and the third control unit 14. The expansion control calculation unit 17 includes a CPU and a storage unit having ROM, RAM, and the like.
　ハンドリング制御演算部１８は、第４制御部１５および第５制御部１６の処理結果に基づいて、ウエハリング構造２００の移動処理に関する演算を行うように構成されている。ハンドリング制御演算部１８は、ＣＰＵと、ＲＯＭおよびＲＡＭなどを有する記憶部とを含んでいる。 The handling control calculation unit 18 is configured to perform calculations related to the process of moving the wafer ring structure 200 based on the processing results of the fourth control unit 15 and the fifth control unit 16 . The handling control calculation unit 18 includes a CPU and a storage unit having ROM, RAM, and the like.
　記憶部１９は、エキスパンド装置１００を動作させるためのプログラムが記憶されている。記憶部１９は、ＲＯＭおよびＲＡＭなどを含んでいる。 A program for operating the expanding device 100 is stored in the storage unit 19 . The storage unit 19 includes ROM, RAM, and the like.
（エキスパンド装置による半導体チップ製造処理）
　エキスパンド装置１００の全体的な動作について以下に説明する。 (Semiconductor chip manufacturing process using expanding equipment)
The overall operation of the expanding device 100 is described below.
　ステップＳ１において、カセット部２からウエハリング構造２００が取り出される。すなわち、カセット部２内に収容されたウエハリング構造２００をリフトアップハンド３２により支持した後、Ｙ方向移動機構３１によりリフトアップハンド３２がＹ２方向側に移動することによって、カセット部２からウエハリング構造２００が取り出される。ステップＳ２において、吸着ハンド４３によりウエハリング構造２００がエキスパンド部６に移載される。すなわち、カセット部２から取り出されたウエハリング構造２００は、吸着ハンド４３により吸着された状態で、Ｘ方向移動機構４１によりＸ２方向側に移動する。そして、Ｘ２方向側に移動したウエハリング構造２００は、吸着ハンド４３からクランプ部６３に移載された後、クランプ部６３により把持される。 In step S1, the wafer ring structure 200 is taken out from the cassette section 2. That is, after the wafer ring structure 200 housed in the cassette section 2 is supported by the lift-up hand 32, the lift-up hand 32 is moved in the Y2 direction by the Y-direction moving mechanism 31, whereby the wafer ring structure 200 is removed from the cassette section 2. Structure 200 is retrieved. In step S<b>2 , the wafer ring structure 200 is transferred to the expanding section 6 by the suction hand 43 . That is, the wafer ring structure 200 taken out from the cassette section 2 is moved in the X2 direction by the X-direction moving mechanism 41 while being sucked by the suction hand 43 . The wafer ring structure 200 that has moved in the X2 direction is transferred from the suction hand 43 to the clamp section 63 and then gripped by the clamp section 63 .
　ステップＳ３において、エキスパンド部６によりシート部材２２０がエキスパンドされる。この際、クランプ部６３により把持されたウエハリング構造２００のシート部材２２０は、冷却ユニット８により冷却される。また、必要であれば、冷気供給部７によるシート部材２２０の冷却が、行われる。所定温度まで冷却されたウエハリング構造２００は、クランプ部６３により把持された状態で、Ｚ方向移動機構６１により下降する。そして、エキスパンドリング６４によりシート部材２２０がエキスパンドされることによって、ウエハ２１０が分割ラインに沿って分割される。この際、破片クリーナ９による破片の吸引を行いつつ、ウエハ２１０の分割が行われる。 In step S3, the sheet member 220 is expanded by the expanding section 6. At this time, the sheet member 220 of the wafer ring structure 200 gripped by the clamp portion 63 is cooled by the cooling unit 8 . Also, if necessary, the sheet member 220 is cooled by the cold air supply unit 7 . The wafer ring structure 200 cooled to a predetermined temperature is lowered by the Z-direction moving mechanism 61 while being gripped by the clamp portion 63 . Then, the sheet member 220 is expanded by the expand ring 64 to divide the wafer 210 along the dividing line. At this time, the wafer 210 is divided while suctioning the fragments by the fragment cleaner 9 .
　ステップＳ４において、シート部材２２０のエキスパンド状態を維持したまま、エキスパンド部６をヒートシュリンク部１０のＺ２方向側に移動する。すなわち、ウエハ２１０の分割が行われた後、シート部材２２０がエキスパンドされた状態のウエハリング構造２００は、Ｙ方向移動機構６２によりＹ１方向に移動する。ステップＳ５において、ヒートシュリンク部１０によりシート部材２２０を加熱して収縮させる。この際、Ｙ１方向に移動したウエハリング構造２００は、拡張維持リング１１３およびエキスパンドリング６４により挟み込まれた状態で、加熱リング１１１による加熱が行われる。この際、吸気リング１１２による吸気と、紫外線照射部１１による紫外線の照射とが行われる。 In step S4, while maintaining the expanded state of the sheet member 220, the expanded portion 6 is moved to the Z2 direction side of the heat shrink portion 10. That is, after the wafer 210 is divided, the wafer ring structure 200 with the sheet member 220 expanded is moved in the Y1 direction by the Y-direction moving mechanism 62 . In step S5, the sheet member 220 is heated by the heat shrink section 10 to be shrunk. At this time, the wafer ring structure 200 moved in the Y1 direction is heated by the heating ring 111 while being sandwiched between the expansion retaining ring 113 and the expand ring 64 . At this time, suction by the suction ring 112 and irradiation of ultraviolet rays by the ultraviolet irradiation unit 11 are performed.
　ステップＳ６において、エキスパンド部６を元の位置に戻す。すなわち、シート部材２２０を収縮させたウエハリング構造２００は、Ｙ方向移動機構３１によりＹ２方向側に移動する。ステップＳ７において、吸着ハンド４３によりエキスパンド部６からリフトアップハンド部３にウエハリング構造２００が移載された状態で、Ｘ方向移動機構４１によりＸ１方向側に移動し、リフトアップハンド３２に受け渡される。ステップＳ８において、ウエハリング構造２００が、カセット部２に収容される。そして、リフトアップハンド３２により支持されたウエハリング構造２００は、Ｙ方向移動機構３１によってＹ１方向側に移動させることによって、カセット部２にウエハリング構造２００が収容される。これらにより、１枚のウエハリング構造２００に対して行われる処理が完了する。 In step S6, the expanding section 6 is returned to its original position. That is, the wafer ring structure 200 with the contracted sheet member 220 is moved in the Y2 direction by the Y-direction moving mechanism 31 . In step S<b>7 , the wafer ring structure 200 is transferred from the expanding section 6 to the lift-up hand section 3 by the suction hand 43 , is moved in the X1 direction by the X-direction moving mechanism 41 , and is transferred to the lift-up hand 32 . be In step S<b>8 , the wafer ring structure 200 is accommodated in the cassette section 2 . Then, the wafer ring structure 200 supported by the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 , so that the wafer ring structure 200 is housed in the cassette section 2 . By these steps, the processing performed on one wafer ring structure 200 is completed.
（エキスパンドおよびヒートシュリンクに関する構成）
　図１および図９～図１４を参照して、エキスパンドおよびヒートシュリンクに関する構成について詳細に説明する。 (Composition related to expansion and heat shrink)
1 and 9-14, the configuration for expansion and heat shrink will be described in detail.
　図１および図９～図１４に示すように、エキスパンド部６は、伸縮性を有する熱収縮性のシート部材２２０を、第１位置Ｐ１において、エキスパンドするように構成されている。また、Ｙ方向移動機構６２は、エキスパンド部６によりシート部材２２０をエキスパンドした状態で、第１位置Ｐ１から、平面視において第１位置Ｐ１とは水平方向（Ｙ１方向）に離間した第２位置Ｐ２にエキスパンド部６のＺ方向移動機構６１、クランプ部６３およびエキスパンドリング６４を水平方向（Ｙ１方向）に移動させるように構成されている。また、ヒートシュリンク部１０は、エキスパンド部６によるエキスパンドにより発生するシート部材２２０のウエハ２１０の周囲の部分２２０ｂの弛みを、第２位置Ｐ２において、加熱して収縮させる（ヒートシュリンクさせる）ように構成されている。 As shown in FIGS. 1 and 9 to 14, the expanding section 6 is configured to expand a stretchable heat-shrinkable sheet member 220 at a first position P1. Further, the Y-direction moving mechanism 62 moves from the first position P1 to a second position P2, which is horizontally (Y1 direction) away from the first position P1 in plan view, in a state in which the sheet member 220 is expanded by the expanding section 6. In addition, the Z-direction moving mechanism 61 of the expanding section 6, the clamping section 63 and the expanding ring 64 are configured to move in the horizontal direction (Y1 direction). Further, the heat shrink section 10 is configured to heat and shrink (heat shrink) the slack of the portion 220b of the sheet member 220 around the wafer 210 caused by the expansion by the expanding section 6 at the second position P2. It is
〈エキスパンドに関する構成〉
　図９～図１１に示すように、エキスパンド部６は、シート部材２２０をエキスパンドする際、クランプ部６３によりリング状部材２３０を上下方向（Ｚ方向）に把持するように構成されている。具体的には、クランプ部６３の上側把持部６３ｂは、ウエハリング構造２００を囲むように配置された複数（４つ）のスライド移動体６３ｂａにより構成されている。複数のスライド移動体６３ｂａは、リング状部材２３０を把持する際、ウエハ２１０側に向かって水平方向にスライド移動するように構成されている。また、クランプ部６３の下側把持部６３ａは、エアシリンダなどのシリンダの駆動力により、ウエハ２１０側にスライド移動した上側把持部６３ｂ（複数のスライド移動体６３ｂａ）に向かってＺ１方向側に上昇するように構成されている。これにより、クランプ部６３の上側把持部６３ｂと下側把持部６３ａとの間に、リング状部材２３０が把持されて固定される。 <Configuration for expansion>
As shown in FIGS. 9 to 11, the expanding section 6 is configured such that when the sheet member 220 is expanded, the clamping section 63 grips the ring-shaped member 230 in the vertical direction (Z direction). Specifically, the upper gripping portion 63b of the clamping portion 63 is composed of a plurality (four) of slide moving bodies 63ba arranged so as to surround the wafer ring structure 200. As shown in FIG. The plurality of slide moving bodies 63ba are configured to horizontally slide toward the wafer 210 side when gripping the ring-shaped member 230. As shown in FIG. Further, the lower gripping portion 63a of the clamping portion 63 rises in the Z1 direction toward the upper gripping portion 63b (plurality of sliding moving bodies 63ba) that slides toward the wafer 210 by the driving force of a cylinder such as an air cylinder. is configured to As a result, the ring-shaped member 230 is gripped and fixed between the upper gripping portion 63b and the lower gripping portion 63a of the clamp portion 63. As shown in FIG.
　また、クランプ部６３は、上側把持部６３ｂと下側把持部６３ａとの間にリング状部材２３０を把持した状態で、Ｚ方向移動機構６１のモータ６１ａの駆動力により、エキスパンドリング６４に向かってＺ２方向側に下降するように構成されている。これにより、シート部材２２０がエキスパンドリング６４に押し付けられるとともに、シート部材２２０がエキスパンドされる。なお、エキスパンドリング６４は、シート部材２２０に対してＺ２方向側に配置されている。また、エキスパンドリング６４は、水平方向においてウエハ２１０とリング状部材２３０との間に配置されている。また、エキスパンドリング６４は、ウエハ２１０を囲むように円形の環状に形成されている。 Further, the clamp part 63 is moved toward the expand ring 64 by the driving force of the motor 61a of the Z-direction moving mechanism 61 while gripping the ring-shaped member 230 between the upper grip part 63b and the lower grip part 63a. It is configured to descend in the Z2 direction. As a result, the sheet member 220 is pressed against the expand ring 64 and the sheet member 220 is expanded. Note that the expand ring 64 is arranged on the Z2 direction side with respect to the sheet member 220 . Also, the expand ring 64 is arranged horizontally between the wafer 210 and the ring-shaped member 230 . Also, the expand ring 64 is formed in a circular ring so as to surround the wafer 210 .
　エキスパンド位置である第１位置Ｐ１において、ウエハリング構造２００に対してＺ１方向側に、シート部材２２０のエキスパンドに起因してウエハリング構造２００から発生する飛散物を吸引して除去する破片クリーナ９が配置されている。飛散物は、たとえば、ウエハ２１０の破片などである。また、ウエハ２１０とシート部材２２０との間にダイアタッチフィルムが存在する場合、ダイアタッチフィルムが飛散物となる場合もある。また、ウエハ２１０の外縁２１０ａ（図１２参照）の近傍ではウエハ２１０の破片が小さいため、シート部材２２０のエキスパンドの際に位置が不安定となり、飛散物となりやすい。破片クリーナ９は、負圧発生装置から供給される負圧により、飛散物を吸引して除去するように構成されている。 At the first position P1, which is the expanded position, on the Z1 direction side with respect to the wafer ring structure 200, there is a fragment cleaner 9 that sucks and removes scattered matter generated from the wafer ring structure 200 due to the expansion of the sheet member 220. are placed. Scattered matter is, for example, fragments of wafer 210 or the like. Moreover, when a die attach film exists between the wafer 210 and the sheet member 220, the die attach film may become a scattering object. Further, since the fragments of the wafer 210 are small in the vicinity of the outer edge 210a (see FIG. 12) of the wafer 210, the position of the wafer 210 becomes unstable when the sheet member 220 is expanded, and the fragments are likely to be scattered. The fragment cleaner 9 is configured to suck and remove the scattered matter by the negative pressure supplied from the negative pressure generator.
　図５および図１２に示すように、破片クリーナ９の吸引口９２は、飛散物（ウエハ２１０の破片およびダイアタッチフィルムの破片など）の吸引時に円形の環状のウエハ２１０の外縁２１０ａに対向するように、円形の環状に形成されている。具体的には、円形の環状の吸引口９２は、所定の間隔を隔てて円形の環状に配置された複数の吸引口９２により構成されている。破片クリーナ９は、円形の環状の吸引口９２により、ウエハ２１０の中心から離間する方向に、飛散物を吸引するように構成されている。 As shown in FIGS. 5 and 12, the suction port 92 of the debris cleaner 9 is arranged to face the outer edge 210a of the circular ring-shaped wafer 210 when the debris (such as wafer 210 fragments and die attach film fragments) is sucked. , is formed in a circular ring. Specifically, the circular ring-shaped suction port 92 is composed of a plurality of circular suction ports 92 arranged at predetermined intervals in a circular ring. The debris cleaner 9 is configured to suck scattered matter away from the center of the wafer 210 by means of a circular suction port 92 .
　図９～図１１に示すように、破片クリーナ９は、エアシリンダなどのシリンダの駆動力により、エキスパンド位置である第１位置Ｐ１において、飛散物を吸引する下方位置と、飛散物を吸引しない上方位置との間で、上下方向（Ｚ方向）に移動可能に構成されている。下方位置は、ウエハ２１０の近傍の位置である。また、上方位置は、Ｘ方向に移動する吸着ハンド４３を回避可能な退避位置である。破片クリーナ９は、シート部材２２０をエキスパンドする際、上方位置から下方位置まで、Ｚ２方向側に下降するように構成されている。また、破片クリーナ９は、エキスパンドリング６４にシート部材２２０を押し付ける前に吸引動作を開始し、少なくともエキスパンドリング６４にシート部材２２０を押し付けが完了するまで、吸引動作を継続するように構成されている。 As shown in FIGS. 9 to 11, the fragment cleaner 9 has a first position P1, which is an expanded position, by the driving force of a cylinder such as an air cylinder. It is configured to be movable in the vertical direction (Z direction) between the positions. The lower position is the position near the wafer 210 . Also, the upper position is a retreat position where the suction hand 43 moving in the X direction can be avoided. The fragment cleaner 9 is configured to descend in the Z2 direction from the upper position to the lower position when expanding the sheet member 220 . Further, the fragment cleaner 9 is configured to start the suction operation before pressing the sheet member 220 against the expand ring 64 and continue the suction operation at least until the pressing of the sheet member 220 against the expand ring 64 is completed. .
　エキスパンド位置である第１位置Ｐ１に、エキスパンド部６によりシート部材２２０をエキスパンドする際、シート部材２２０を冷却する冷気供給部７および冷却ユニット８が配置されている。冷気供給部７は、ウエハリング構造２００に対してＺ１方向側に、破片クリーナ９と一体的に設けられている。このため、冷気供給部７は、第１位置Ｐ１において、冷気を供給する下方位置と、冷気を供給しない上方位置との間で、破片クリーナ９と一体的に、上下方向（Ｚ方向）に移動可能に構成されている。冷気供給部７は、シート部材２２０をエキスパンドする際、上方位置から下方位置まで、Ｚ２方向側に下降するように構成されている。また、冷気供給部７は、エキスパンドリング６４にシート部材２２０を押し付ける前に冷気供給動作を開始し、少なくともエキスパンドリング６４にシート部材２２０を押し付け切るまで、冷気供給動作を継続し続けるように構成されている。 A cool air supply section 7 and a cooling unit 8 for cooling the sheet member 220 when the sheet member 220 is expanded by the expanding section 6 are arranged at the first position P1, which is the expanding position. The cool air supply unit 7 is provided integrally with the fragment cleaner 9 on the Z1 direction side with respect to the wafer ring structure 200 . Therefore, at the first position P1, the cool air supply unit 7 moves vertically (in the Z direction) integrally with the fragment cleaner 9 between a lower position where cool air is supplied and an upper position where no cool air is supplied. configured as possible. The cool air supply unit 7 is configured to descend in the Z2 direction from the upper position to the lower position when the sheet member 220 is expanded. In addition, the cool air supply unit 7 is configured to start the cool air supply operation before pressing the sheet member 220 against the expand ring 64 and continue the cool air supply operation at least until the sheet member 220 is completely pressed against the expand ring 64. ing.
　また、冷却ユニット８は、ウエハリング構造２００に対してＺ２方向側に配置されている。また、冷却ユニット８は、第１位置Ｐ１において、エアシリンダなどのシリンダ８２の駆動力により、シート部材２２０を冷却する上方位置と、シート部材２２０を冷却しない下方位置との間で、上下方向（Ｚ方向）に移動可能に構成されている。冷却ユニット８は、シート部材２２０をエキスパンドする際、下方位置から上方位置まで、Ｚ１方向側に上昇するように構成されている。また、冷却ユニット８は、エキスパンドリング６４にシート部材２２０を押し付ける前に、冷却動作を開始して完了するように構成されている。また、冷却ユニット８は、エキスパンドリング６４にシート部材２２０を押し付ける前に、下方位置に退避するように構成されている。 Also, the cooling unit 8 is arranged on the Z2 direction side with respect to the wafer ring structure 200 . At the first position P1, the cooling unit 8 is moved vertically ( Z direction). The cooling unit 8 is configured to rise in the Z1 direction from the lower position to the upper position when the sheet member 220 is expanded. The cooling unit 8 is also configured to initiate and complete the cooling operation before pressing the sheet member 220 against the expand ring 64 . Also, the cooling unit 8 is configured to retract to the lower position before pressing the sheet member 220 against the expand ring 64 .
　また、エキスパンド部６によるシート部材２２０のエキスパンド（シート部材２２０のエキスパンドリング６４への押し付け）が完了すると、Ｙ方向移動機構６２は、エキスパンド部６によりシート部材２２０をエキスパンドした状態を維持しつつ、シート部材２２０のエキスパンドを行った第１位置Ｐ１から、シート部材２２０のヒートシュリンクを行う第２位置Ｐ２に、エキスパンド部６（Ｚ方向移動機構６１、クランプ部６３およびエキスパンドリング６４）をＹ１方向に移動させるように構成されている。この際、Ｙ方向移動機構６２は、第１位置Ｐ１から破片クリーナ９、冷気供給部７および冷却ユニット８を移動させることなく、破片クリーナ９、冷気供給部７および冷却ユニット８とは独立して、第１位置Ｐ１から第２位置Ｐ２にエキスパンド部６をＹ１方向に移動させるように構成されている。この際、破片クリーナ９および冷気供給部７は、上方位置に退避されており、冷却ユニット８は、下方位置に退避されている。 Further, when the expansion of the sheet member 220 by the expanding section 6 (pressing of the sheet member 220 against the expanding ring 64) is completed, the Y-direction moving mechanism 62 maintains the expanded state of the sheet member 220 by the expanding section 6, The expanding portion 6 (the Z-direction moving mechanism 61, the clamp portion 63 and the expanding ring 64) is moved in the Y1 direction from the first position P1 where the sheet member 220 is expanded to the second position P2 where the sheet member 220 is heat-shrinked. configured to move. At this time, the Y-direction moving mechanism 62 moves independently of the fragment cleaner 9, the cool air supply unit 7 and the cooling unit 8 without moving the fragment cleaner 9, the cool air supply unit 7 and the cooling unit 8 from the first position P1. , the expanding portion 6 is moved in the Y1 direction from the first position P1 to the second position P2. At this time, the fragment cleaner 9 and the cool air supply section 7 are retracted to the upper position, and the cooling unit 8 is retracted to the lower position.
　Ｙ方向移動機構６２は、モータ６２ａに加えて、載置部６２ｂと、レール部６２ｃとをさらに有している。載置部６２ｂは、Ｚ方向移動機構６１、クランプ部６３およびエキスパンドリング６４が上面に載置されるように構成されている。また、載置部６２ｂは、平面視において略矩形形状のプレート状に形成されている。また、載置部６２ｂは、レール部６２ｃ上に移動可能に設けられている。レール部６２ｃは、Ｘ方向に離間して一対設けられている。一対のレール部６２ｃは、第１位置Ｐ１と第２位置Ｐ２との間で、Ｙ方向に延びるように設けられている。Ｙ方向移動機構６２は、モータ６２ａの駆動力により、一対のレール部６２ｃに沿って載置部６２ｂをＹ方向に移動させることによって、Ｚ方向移動機構６１、クランプ部６３およびエキスパンドリング６４を、第１位置Ｐ１と第２位置Ｐ２との間でＹ方向に移動させることが可能なように構成されている。 The Y-direction moving mechanism 62 further has a mounting portion 62b and a rail portion 62c in addition to the motor 62a. The mounting portion 62b is configured such that the Z-direction moving mechanism 61, the clamp portion 63 and the expand ring 64 are mounted on the upper surface thereof. Further, the mounting portion 62b is formed in a substantially rectangular plate shape in plan view. The mounting portion 62b is movably provided on the rail portion 62c. A pair of rail portions 62c are provided spaced apart in the X direction. The pair of rail portions 62c are provided to extend in the Y direction between the first position P1 and the second position P2. The Y-direction moving mechanism 62 moves the mounting portion 62b in the Y direction along the pair of rail portions 62c by the driving force of the motor 62a, thereby moving the Z-direction moving mechanism 61, the clamp portion 63 and the expand ring 64. It is configured to be movable in the Y direction between the first position P1 and the second position P2.
　また、載置部６２ｂには、上下方向（Ｚ方向）に載置部６２ｂを貫通する孔部６２ｂａが設けられている。孔部６２ｂａは、平面視において、円形状に形成されている。また、孔部６２ｂａは、第１位置Ｐ１において、冷却ユニット８を通過させることが可能な大きさを有している。これにより、孔部６２ｂａを介して冷却ユニット８を上方位置と下方位置との間で移動させることが可能である。また、孔部６２ｂａは、第２位置Ｐ２において、紫外線照射部１１を通過させることが可能な大きさを有している。これにより、孔部６２ｂａを介して紫外線照射部１１を上方位置と下方位置との間で移動させることが可能である。また、孔部６２ｂａは、エキスパンドリング６４の内側に設けられている。冷却ユニット８および紫外線照射部１１は、孔部６２ｂａを介して、エキスパンドリング６４の内側に移動するように構成されている。 Further, the mounting portion 62b is provided with a hole portion 62ba passing through the mounting portion 62b in the vertical direction (Z direction). The hole portion 62ba is formed in a circular shape in plan view. Moreover, the hole portion 62ba has a size that allows the cooling unit 8 to pass therethrough at the first position P1. Thereby, it is possible to move the cooling unit 8 between the upper position and the lower position via the hole 62ba. Moreover, the hole 62ba has a size that allows the ultraviolet irradiation section 11 to pass therethrough at the second position P2. Thereby, it is possible to move the ultraviolet irradiation section 11 between the upper position and the lower position via the hole 62ba. Moreover, the hole portion 62ba is provided inside the expand ring 64 . The cooling unit 8 and the ultraviolet irradiation section 11 are configured to move inside the expand ring 64 through the hole 62ba.
〈ヒートシュリンクに関する構成〉
　図１３および図１４に示すように、ヒートシュリンク部１０は、ヒートシュリンク位置である第２位置Ｐ２において、Ｙ方向移動機構６２により移動したエキスパンド部６のＺ１方向側に配置されている。また、ヒートシュリンク部１０の加熱リング１１１および吸気リング１１２は、Ｚ方向移動機構１１０のモータ１１０ａの駆動力により、第２位置Ｐ２において、シート部材２２０を加熱しない上方位置と、シート部材２２０を加熱する下方位置との間で、上下方向（Ｚ方向）に移動可能に構成されている。また、ヒートシュリンク部１０の拡張維持リング１１３は、エアシリンダなどのシリンダの駆動力により、第２位置Ｐ２において、シート部材２２０を押さえない上方位置と、シート部材２２０を押さえる下方位置との間で、上下方向に移動可能に構成されている。また、上方位置は、Ｙ１方向に移動するエキスパンド部６およびウエハリング構造２００を回避可能な退避位置である。また、下方位置は、シート部材２２０の近傍の位置である。 <Structure related to heat shrink>
As shown in FIGS. 13 and 14, the heat shrink portion 10 is arranged on the Z1 direction side of the expanded portion 6 moved by the Y direction movement mechanism 62 at the second position P2, which is the heat shrink position. Further, the heating ring 111 and the suction ring 112 of the heat shrink portion 10 are driven by the driving force of the motor 110a of the Z-direction moving mechanism 110 to move the sheet member 220 to the upper position where the sheet member 220 is not heated and the sheet member 220 to be heated. It is configured to be movable in the vertical direction (Z direction) between the lower position where the Further, the expansion maintaining ring 113 of the heat shrink portion 10 is moved between the upper position not pressing the sheet member 220 and the lower position pressing the sheet member 220 at the second position P2 by the driving force of a cylinder such as an air cylinder. , is configured to be movable in the vertical direction. Also, the upper position is a retracted position where the expanding portion 6 and the wafer ring structure 200 moving in the Y1 direction can be avoided. Also, the lower position is a position near the sheet member 220 .
　また、ヒートシュリンク部１０（加熱リング１１１、吸気リング１１２および拡張維持リング１１３）は、シート部材２２０をヒートシュリンクする際、上方位置から下方位置まで、Ｚ２方向側に下降するように構成されている。なお、加熱リング１１１および吸気リング１１２用の上下機構（Ｚ方向移動機構１１０）と、拡張維持リング１１３用の上下機構（シリンダ）とは、別々の機構である。このため、加熱リング１１１および吸気リング１１２と、拡張維持リング１１３とは、互いに独立して上下移動可能である。拡張維持リング１１３は、エキスパンドリング６４との間で、上下方向（Ｚ方向）にシート部材２２０を挟み込むように構成されている。これにより、拡張維持リング１１３は、シート部材２２０のウエハ２１０に対応する部分のエキスパンド状態を維持するように構成されている。また、加熱リング１１１は、拡張維持リング１１３でシート部材２２０のエキスパンド状態を維持した状態で、加熱機構であるシーズヒータにより、シート部材２２０のウエハ２１０の周囲の部分２２０ｂ（拡張維持リング１１３の外側の部分）を加熱するように構成されている。また、吸気リング１１２は、加熱リング１１１によるシート部材２２０の加熱の間、加熱に起因してシート部材２２０から発生するガスを吸気するように構成されている。 The heat shrink portion 10 (the heating ring 111, the suction ring 112, and the expansion maintaining ring 113) is configured to descend in the Z2 direction from the upper position to the lower position when heat shrinking the sheet member 220. . The up-down mechanism (Z-direction moving mechanism 110) for the heating ring 111 and the suction ring 112 and the up-down mechanism (cylinder) for the extension maintaining ring 113 are separate mechanisms. Therefore, the heating ring 111, the suction ring 112, and the expansion retaining ring 113 can move up and down independently of each other. The expansion maintaining ring 113 is configured to sandwich the sheet member 220 in the vertical direction (Z direction) with the expanding ring 64 . Thereby, the expansion maintaining ring 113 is configured to maintain the expanded state of the portion of the sheet member 220 corresponding to the wafer 210 . In addition, while the sheet member 220 is maintained in the expanded state by the expansion maintaining ring 113, the heating ring 111 heats the portion 220b of the sheet member 220 around the wafer 210 (the outside of the expansion maintaining ring 113) by the sheathed heater, which is a heating mechanism. part). Further, the intake ring 112 is configured to intake gas generated from the sheet member 220 due to the heating while the sheet member 220 is heated by the heating ring 111 .
　ここで、本実施形態では、図１４に示すように、紫外線照射部１１は、ヒートシュリンク部１０によりシート部材２２０を加熱する際に、並行して、シート部材２２０に紫外線を照射して、シート部材２２０の粘着力を低減させるように構成されている。具体的には、ヒートシュリンク位置である第２位置Ｐ２に、ヒートシュリンク部１０によりシート部材２２０をヒートシュリンクする際、シート部材２２０に紫外線を照射する紫外線照射部１１が配置されている。 Here, in the present embodiment, as shown in FIG. 14, the ultraviolet irradiation unit 11 irradiates the sheet member 220 with ultraviolet rays in parallel with heating the sheet member 220 by the heat shrink unit 10, thereby It is configured to reduce the adhesion of member 220 . Specifically, the ultraviolet irradiation section 11 for irradiating the sheet member 220 with ultraviolet rays when the sheet member 220 is heat-shrinked by the heat-shrink section 10 is arranged at the second position P2, which is the heat-shrink position.
　つまり、シート部材２２０を加熱して収縮させる際に、並行して、シート部材２２０に紫外線を照射して、シート部材２２０の粘着力を低減させる。 That is, when the sheet member 220 is heated and shrunk, the sheet member 220 is simultaneously irradiated with ultraviolet rays to reduce the adhesive strength of the sheet member 220 .
　紫外線照射部１１は、ウエハリング構造２００に対してＺ２方向側に配置されている。また、紫外線照射部１１は、シート部材２２０の面に対して交差する方向（Ｚ方向）に沿って配置された紫外線照射位置Ｐ３と退避位置Ｐ４との間で移動可能に構成されている。具体的には、紫外線照射部１１は、第２位置Ｐ２において、エアシリンダなどのシリンダ１２１の駆動力により、紫外線を照射する上方の紫外線照射位置Ｐ３（図１４参照）と、紫外線を照射しない下方の退避位置（図１３参照）との間で、上下方向（Ｚ方向）に移動可能に構成されている。紫外線照射部１１は、シート部材２２０をヒートシュリンクする際、下方の退避位置Ｐ４から上方の紫外線照射位置Ｐ３まで、Ｚ１方向側に上昇するように構成されている。 The ultraviolet irradiation unit 11 is arranged on the Z2 direction side with respect to the wafer ring structure 200 . In addition, the ultraviolet irradiation section 11 is configured to be movable between an ultraviolet irradiation position P3 and a retracted position P4 arranged along a direction (Z direction) intersecting the surface of the sheet member 220 . Specifically, at the second position P2, the ultraviolet irradiation unit 11 is driven by the driving force of a cylinder 121 such as an air cylinder. , and the retracted position (see FIG. 13). When the sheet member 220 is heat-shrinked, the ultraviolet irradiation section 11 is configured to rise in the Z1 direction from a lower retracted position P4 to an upper ultraviolet irradiation position P3.
　また、ヒートシュリンク部１０によるシート部材２２０のヒートシュリンクが完了すると、Ｙ方向移動機構６２は、ヒートシュリンクを行った第２位置Ｐ２から、エキスパンドを行った第１位置Ｐ１に、エキスパンド部６（Ｚ方向移動機構６１、クランプ部６３およびエキスパンドリング６４）をＹ２方向に移動させるように構成されている。この際、Ｙ方向移動機構６２は、第２位置Ｐ２からヒートシュリンク部１０および紫外線照射部１１を移動させることなく、ヒートシュリンク部１０および紫外線照射部１１とは独立して、第２位置Ｐ２から第１位置Ｐ１にエキスパンド部６をＹ２方向に移動させるように構成されている。この際、ヒートシュリンク部１０は、上方位置に退避されており、紫外線照射部１１は、下方の退避位置Ｐ４に退避されている。 When the heat shrinking of the sheet member 220 by the heat shrinking portion 10 is completed, the Y-direction moving mechanism 62 moves from the second position P2 where heat shrinking is performed to the first position P1 where expansion is performed to expand the expanding portion 6 (Z The direction moving mechanism 61, the clamp portion 63 and the expand ring 64) are configured to move in the Y2 direction. At this time, the Y-direction moving mechanism 62 moves from the second position P2 independently of the heat shrink portion 10 and the ultraviolet irradiation portion 11 without moving the heat shrink portion 10 and the ultraviolet irradiation portion 11 from the second position P2. It is configured to move the expanding portion 6 in the Y2 direction to the first position P1. At this time, the heat shrink portion 10 is retracted to the upper position, and the ultraviolet irradiation portion 11 is retracted to the lower retracted position P4.
　拡張維持リング１１３は、ヒートシュリンク部１０によりシート部材２２０を収縮させる際に、シート部材２２０の一方側（Ｚ１方向側）の面のウエハ２１０周辺に周状に当接して、エキスパンドリング６４とともにシート部材２２０を挟み込んで保持することにより、ウエハ２１０が配置される部分のシート部材２２０の拡張を維持する。 When the sheet member 220 is shrunk by the heat shrink portion 10 , the expansion maintaining ring 113 is in circumferential contact with the periphery of the wafer 210 on one side (the Z1 direction side) of the sheet member 220 , and together with the expand ring 64 , the sheet is compressed. The pinching and holding of the member 220 maintains the expansion of the sheet member 220 where the wafer 210 is placed.
　つまり、拡張維持リング１１３およびエキスパンドリング６４は、紫外線照射部１１によりシート部材２２０に紫外線を照射する際に、並行してヒートシュリンク部１０によりシート部材２２０を収縮させる際に、シート部材２２０を挟み込むように保持することにより、ウエハ２１０が配置される部分のシート部材２２０の拡張を維持するように構成されている。 That is, the expansion maintaining ring 113 and the expand ring 64 sandwich the sheet member 220 when the sheet member 220 is contracted by the heat shrink section 10 in parallel with the ultraviolet irradiation of the sheet member 220 by the ultraviolet irradiation section 11 . It is configured to maintain expansion of the sheet member 220 in the portion where the wafer 210 is placed by holding such a position.
　また、拡張維持リング１１３は、シート部材２２０の一方側（Ｚ１方向側）を覆うように配置され、紫外線照射部１１から照射された紫外線を遮蔽するように構成されている。また、紫外線照射部１１は、シート部材２２０の他方側（Ｚ２方向側）から、シート部材２２０に紫外線を照射するように構成されている。 Further, the extension maintaining ring 113 is arranged so as to cover one side (Z1 direction side) of the sheet member 220 and is configured to shield the ultraviolet rays irradiated from the ultraviolet irradiation section 11 . Further, the ultraviolet irradiation section 11 is configured to irradiate the sheet member 220 with ultraviolet rays from the other side (Z2 direction side) of the sheet member 220 .
　図１４に示すように、拡張維持リング１１３は、底面部１１３ａと、側面部１１３ｂとを含んでいる。底面部１１３ａは、上方側（Ｚ１方向側）を覆うように配置されている。また、側面部１１３ｂは、シート部材２２０のウエハ２１０を取り囲むように環状に形成されている。底面部１１３ａは、シート部材２２０とは反対側（Ｚ１方向側）の側面部１１３ｂに接続されている。底面部１１３ａは、円形形状に形成されている。 As shown in FIG. 14, the expansion retaining ring 113 includes a bottom portion 113a and side portions 113b. The bottom portion 113a is arranged to cover the upper side (Z1 direction side). Moreover, the side portion 113b is formed in an annular shape so as to surround the wafer 210 of the sheet member 220 . The bottom surface portion 113a is connected to the side surface portion 113b on the side opposite to the sheet member 220 (Z1 direction side). The bottom portion 113a is formed in a circular shape.
　また、拡張維持リング１１３は、紫外線を遮蔽する部材により形成されている。たとえば、拡張維持リング１１３は、有色の樹脂により形成されている。または、拡張維持リング１１３は、ステンレス材、アルミニウム材などの金属により形成されている。 In addition, the expansion maintenance ring 113 is made of a member that blocks ultraviolet rays. For example, the expansion retention ring 113 is made of colored resin. Alternatively, the expansion retaining ring 113 is made of metal such as stainless steel or aluminum.
　エキスパンドリング６４は、紫外線照射部１１によりシート部材２２０に紫外線を照射する際に、シート部材２２０の他方側（Ｚ２方向側）に当接してシート部材２２０を支持するとともに紫外線照射部１１を取り囲むように配置されている。つまり、図１４に示すように、紫外線照射部１１は、紫外線照射位置Ｐ３に配置された場合に、エキスパンドリング６４に周囲を取り囲まれる。また、エキスパンドリング６４は、紫外線を遮蔽する材料により形成されている。エキスパンドリング６４は、たとえば、ステンレス材、アルミニウム材などの金属により形成されている。または、エキスパンドリング６４は、有色の樹脂により形成されている。 When the sheet member 220 is irradiated with ultraviolet rays by the ultraviolet irradiation section 11 , the expand ring 64 abuts against the other side (Z2 direction side) of the sheet member 220 to support the sheet member 220 and surround the ultraviolet irradiation section 11 . are placed in That is, as shown in FIG. 14 , the ultraviolet irradiation section 11 is surrounded by the expand ring 64 when arranged at the ultraviolet irradiation position P3. Also, the expand ring 64 is made of a material that blocks ultraviolet rays. The expand ring 64 is made of metal such as stainless steel or aluminum. Alternatively, the expand ring 64 is made of colored resin.
　紫外線照射部１１は、ヒートシュリンク部１０によりシート部材２２０を加熱して収縮させる際の作業時間内に、シート部材２２０の粘着力を低減させる紫外線の照射処理が終了するように、照射する紫外線の強度が調整されている。 The ultraviolet irradiation unit 11 emits ultraviolet rays so that the ultraviolet irradiation process for reducing the adhesive force of the sheet member 220 is completed within the working time when the sheet member 220 is heated and shrunk by the heat shrink unit 10 . intensity is adjusted.
　具体的には、紫外線照射部１１は、紫外線を照射する時間を短くする場合に、照射する紫外線の強度が大きくなるよう設定される。一方、紫外線照射部１１は、紫外線を照射する時間を長くする場合に、照射する紫外線の強度が小さくなるよう設定される。 Specifically, the ultraviolet irradiation unit 11 is set so that the intensity of the ultraviolet rays to be irradiated is increased when the ultraviolet irradiation time is shortened. On the other hand, the ultraviolet irradiation unit 11 is set so that the intensity of the ultraviolet rays to be irradiated becomes smaller when the ultraviolet irradiation time is lengthened.
〈カセット部およびリフトアップハンド部に関する構成〉
　図１に示すように、カセット部２は、平面視において第１位置Ｐ１および第２位置Ｐ２とは異なる位置に配置されている。また、リフトアップハンド部３は、平面視において第１位置Ｐ１および第２位置Ｐ２とは異なる位置に配置されている。また、リフトアップハンド部３がカセット部２からウエハリング構造２００を取り出す方向（Ｙ２方向）は、Ｙ方向移動機構６２がエキスパンド部６を移動させる方向（Ｙ１方向）と略平行である。すなわち、リフトアップハンド部３によるウエハリング構造２００の挿抜方向（Ｙ方向）と、Ｙ方向移動機構６２によるエキスパンド部６の移動方向（Ｙ方向）とは、互いに略平行である。また、カセット部２は、ヒートシュリンク位置である第２位置Ｐ２とＸ方向に並んで配置されている。また、リフトアップハンド部３によるウエハリング構造２００の取出位置は、エキスパンド位置である第１位置Ｐ１とＸ方向に並んで配置されている。 <Structures related to cassette part and lift-up hand part>
As shown in FIG. 1, the cassette unit 2 is arranged at a position different from the first position P1 and the second position P2 in plan view. Further, the lift-up hand section 3 is arranged at a position different from the first position P1 and the second position P2 in plan view. The direction (Y2 direction) in which the lift-up hand section 3 takes out the wafer ring structure 200 from the cassette section 2 is substantially parallel to the direction (Y1 direction) in which the Y-direction moving mechanism 62 moves the expanding section 6 . That is, the insertion/extraction direction (Y direction) of the wafer ring structure 200 by the lift-up hand portion 3 and the moving direction (Y direction) of the expanding portion 6 by the Y direction moving mechanism 62 are substantially parallel to each other. Moreover, the cassette part 2 is arranged side by side with the second position P2, which is the heat shrink position, in the X direction. Further, the take-out position of the wafer ring structure 200 by the lift-up hand section 3 is arranged in the X direction side by side with the first position P1, which is the expanded position.
（取出処理）
　図１５を参照して、エキスパンド装置１００における取出処理について説明する。取出処理は、上記半導体チップ製造処理におけるステップＳ１において行われる処理である。 (Extraction process)
With reference to FIG. 15, the extraction process in the expanding device 100 will be described. The extraction process is a process performed in step S1 in the semiconductor chip manufacturing process.
　図１５に示すように、ステップＳ１０１において、リフトアップハンド部３のリフトアップハンド３２が空いているか否かが判断される。リフトアップハンド３２が空いていない場合、取出処理が終了される。また、リフトアップハンド３２が空いている場合、ステップＳ１０２に進む。 As shown in FIG. 15, in step S101, it is determined whether or not the lift-up hand 32 of the lift-up hand section 3 is free. If the lift-up hand 32 is not free, the takeout process is terminated. If the lift-up hand 32 is free, the process proceeds to step S102.
　そして、ステップＳ１０２において、リフトアップハンド３２がカセット部２のウエハカセット２２内に存在するか否かが判断される。リフトアップハンド３２がウエハカセット２２内に存在しない場合、ステップＳ１０４に進む。また、リフトアップハンド３２がウエハカセット２２内に存在する場合、ステップＳ１０３に進む。 Then, in step S102, it is determined whether or not the lift-up hand 32 exists within the wafer cassette 22 of the cassette section 2. If the lift-up hand 32 does not exist within the wafer cassette 22, the process proceeds to step S104. Also, when the lift-up hand 32 exists in the wafer cassette 22, the process proceeds to step S103.
　そして、ステップＳ１０３において、リフトアップハンド３２が、Ｙ方向移動機構３１により、ウエハカセット２２内からウエハカセット２２外にＹ２方向に移動される。 Then, in step S103, the lift-up hand 32 is moved from inside the wafer cassette 22 to outside the wafer cassette 22 by the Y-direction moving mechanism 31 in the Y2 direction.
　そして、ステップＳ１０４において、リフトアップハンド３２によりウエハカセット２２内の取出対象のウエハリング構造２００を取り出し可能なように、ウエハカセット２２がＺ方向移動機構２１によりＺ方向に移動される。具体的には、ステップＳ１０４では、ウエハカセット２２内の取出対象のウエハリング構造２００のリング状部材の２３０の下面のわずかにＺ２方向側の高さに、リフトアップハンド３２の上面が位置するように、ウエハカセット２２がＺ方向移動機構２１によりＺ方向に移動される。 Then, in step S<b>104 , the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the lift-up hand 32 can take out the wafer ring structure 200 to be taken out from the wafer cassette 22 . Specifically, in step S104, the upper surface of the lift-up hand 32 is positioned slightly above the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out in the wafer cassette 22 in the Z2 direction. Then, the wafer cassette 22 is moved in the Z direction by the Z direction moving mechanism 21 .
　そして、ステップＳ１０５において、ウエハカセット２２内の取出対象のウエハリング構造２００のリング状部材２３０の真下に位置するように、リフトアップハンド３２がＹ方向移動機構３１によりＹ１方向に移動される。 Then, in step S105, the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 so as to be positioned right below the ring-shaped member 230 of the wafer ring structure 200 to be taken out in the wafer cassette 22.
　そして、ステップＳ１０６において、ウエハカセット２２内の取出対象のウエハリング構造２００が、リフトアップハンド３２に受け渡される。具体的には、ステップＳ１０６では、ウエハカセット２２内の取出対象のウエハリング構造２００のリング状部材２３０の下面が、リフトアップハンド３２により一対の載置部２３の上面からわずかに浮き上がるように、ウエハカセット２２がＺ方向移動機構２１によりＺ２方向に移動される。 Then, in step S<b>106 , the wafer ring structure 200 to be taken out from the wafer cassette 22 is transferred to the lift-up hand 32 . Specifically, in step S106, the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out from the wafer cassette 22 is lifted slightly by the lift-up hand 32 from the upper surfaces of the pair of mounting portions 23. The wafer cassette 22 is moved in the Z2 direction by the Z-direction moving mechanism 21 .
　そして、ステップＳ１０７において、リフトアップハンド３２の上面により取出対象のウエハリング構造２００のリング状部材２３０の下面を支持した状態で、リフトアップハンド３２がＹ方向移動機構３１によりＹ２方向に移動される。これにより、取出対象のウエハリング構造２００が、リフトアップハンド３２によりウエハカセット２２内から取り出される。そして、取出処理が終了される。 Then, in step S107, the lift-up hand 32 is moved in the Y2 direction by the Y-direction movement mechanism 31 while the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be taken out is supported by the upper surface of the lift-up hand 32. . As a result, the wafer ring structure 200 to be taken out is taken out from the wafer cassette 22 by the lift-up hand 32 . Then, the extraction process is terminated.
（移載処理）
　図１６を参照して、エキスパンド装置１００における移載処理について説明する。移載処理は、上記半導体チップ製造処理におけるステップＳ２またはＳ７において行われる処理である。 (Transfer processing)
Transfer processing in the expanding device 100 will be described with reference to FIG. 16 . The transfer process is a process performed in step S2 or S7 in the semiconductor chip manufacturing process.
　図１６に示すように、ステップＳ２０１において、吸着ハンド部４の吸着ハンド４３がＺ方向移動機構４２により上昇される。 As shown in FIG. 16, in step S201, the suction hand 43 of the suction hand unit 4 is lifted by the Z-direction moving mechanism 42. As shown in FIG.
　そして、ステップＳ２０２において、吸着ハンド４３がＸ方向移動機構４１によりウエハリング構造２００の上方に移動される。具体的には、上記半導体チップ製造処理におけるステップＳ２の場合、吸着ハンド４３が、リフトアップハンド３２により支持されたウエハリング構造２００の上方に移動される。また、上記半導体チップ製造処理におけるステップＳ７の場合、吸着ハンド４３が、エキスパンド部６により支持されたウエハリング構造２００の上方に移動される。 Then, in step S<b>202 , the suction hand 43 is moved above the wafer ring structure 200 by the X-direction moving mechanism 41 . Specifically, in step S<b>2 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the wafer ring structure 200 supported by the lift-up hand 32 . Further, in the case of step S<b>7 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the wafer ring structure 200 supported by the expanding section 6 .
　そして、ステップＳ２０３において、吸着ハンド４３がＺ方向移動機構４２によりウエハリング構造２００に向かって下降される。 Then, in step S<b>203 , the suction hand 43 is lowered toward the wafer ring structure 200 by the Z-direction moving mechanism 42 .
　そして、ステップＳ２０４において、吸着ハンド４３が負圧発生装置から供給される負圧によりウエハリング構造２００のリング状部材２３０を吸着する。 Then, in step S204, the suction hand 43 sucks the ring-shaped member 230 of the wafer ring structure 200 by the negative pressure supplied from the negative pressure generator.
　そして、ステップＳ２０５において、吸着ハンド４３がＺ方向移動機構４２により上昇される。 Then, in step S205, the suction hand 43 is lifted by the Z-direction moving mechanism 42.
　そして、ステップＳ２０６において、吸着ハンド４３がＸ方向移動機構４１により移載先の上方に移動される。具体的には、上記半導体チップ製造処理におけるステップＳ２の場合、吸着ハンド４３が、第１位置Ｐ１のエキスパンド部６の上方に移動される。また、上記半導体チップ製造処理におけるステップＳ７の場合、吸着ハンド４３が、リフトアップハンド３２の上方に移動される。 Then, in step S206, the suction hand 43 is moved above the transfer destination by the X-direction moving mechanism 41. Specifically, in the case of step S2 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the expanding section 6 at the first position P1. Further, in the case of step S<b>7 in the semiconductor chip manufacturing process, the suction hand 43 is moved above the lift-up hand 32 .
　そして、ステップＳ２０７において、吸着ハンド４３がＺ方向移動機構４２により移載先（エキスパンド部６またはリフトアップハンド３２）に向かって下降される。 Then, in step S207, the suction hand 43 is lowered by the Z-direction moving mechanism 42 toward the transfer destination (expanding section 6 or lift-up hand 32).
　そして、ステップＳ２０８において、吸着ハンド４３によるウエハリング構造２００のリング状部材２３０の吸着が解除される。これにより、ウエハリング構造２００の移載先への移載が完了する。そして、移載処理が終了される。 Then, in step S208, the suction of the ring-shaped member 230 of the wafer ring structure 200 by the suction hand 43 is released. This completes the transfer of the wafer ring structure 200 to the transfer destination. Then, the transfer process is terminated.
（エキスパンド処理）
　図１７および図１８を参照して、エキスパンド装置１００におけるエキスパンド処理について説明する。エキスパンド処理は、上記半導体チップ製造処理におけるステップＳ３において行われる処理である。エキスパンド処理は、第１位置Ｐ１において行われる。 (expanding process)
The expanding process in the expanding device 100 will be described with reference to FIGS. 17 and 18. FIG. The expanding process is a process performed in step S3 in the semiconductor chip manufacturing process. The expanding process is performed at the first position P1.
　図１７に示すように、ステップＳ３０１において、吸着ハンド４３がＺ方向移動機構４２により上昇される。この際、ウエハリング構造２００のリング状部材２３０が、クランプ部６３の下側把持部６３ａにより支持されている。 As shown in FIG. 17, the suction hand 43 is lifted by the Z-direction moving mechanism 42 in step S301. At this time, the ring-shaped member 230 of the wafer ring structure 200 is supported by the lower holding portion 63a of the clamp portion 63. As shown in FIG.
　そして、ステップＳ３０２において、上側把持部６３ｂの複数のスライド移動体６３ｂａがウエハ２１０側に向かって水平方向にスライド移動される。 Then, in step S302, the plurality of sliding moving bodies 63ba of the upper gripping portion 63b are horizontally slid toward the wafer 210 side.
　そして、ステップＳ３０３において、ウエハリング構造２００のリング状部材２３０を支持した状態で、下側把持部６３ａが上昇される。これにより、上側把持部６３ｂと下側把持部６３ａとの間に、リング状部材２３０が把持されて固定される。 Then, in step S303, while supporting the ring-shaped member 230 of the wafer ring structure 200, the lower grip part 63a is raised. Thereby, the ring-shaped member 230 is gripped and fixed between the upper gripping portion 63b and the lower gripping portion 63a.
　そして、ステップＳ３０４において、破片クリーナ９が冷気供給部７と共にシリンダによりウエハリング構造２００に向かって下降される。 Then, in step S304, the fragment cleaner 9 is lowered toward the wafer ring structure 200 by the cylinder together with the cool air supply unit 7.
　そして、ステップＳ３０５において、冷気供給部７によるシート部材２２０への冷気の供給による冷却が必要であるか否かが判断される。冷気供給部７によるシート部材２２０への冷気の供給による冷却が必要である場合、ステップＳ３０５ａに進む。そして、ステップＳ３０５ａにおいて、冷気供給部７によるシート部材２２０への冷気の供給が開始される。そして、ステップＳ３０６に進む。また、冷気供給部７によるシート部材２２０への冷気の供給による冷却が必要ではない場合、ステップＳ３０５ａの処理を行わずに、ステップＳ３０６に進む。 Then, in step S305, it is determined whether cooling by supplying cool air to the sheet member 220 by the cool air supply unit 7 is necessary. If cooling by supply of cool air to the sheet member 220 by the cool air supply unit 7 is required, the process proceeds to step S305a. Then, in step S305a, supply of cool air to the sheet member 220 by the cool air supply unit 7 is started. Then, the process proceeds to step S306. If cooling by supplying cool air to the sheet member 220 by the cool air supply unit 7 is not necessary, the process proceeds to step S306 without performing the process of step S305a.
　そして、ステップＳ３０６において、シート部材２２０の冷却ユニット８による冷却が必要であるか否かが判断される。シート部材２２０の冷却ユニット８による冷却が必要である場合、ステップＳ３０７に進む。そして、ステップＳ３０７において、シート部材２２０の冷気供給部７による冷却に加えて、シート部材２２０の冷却ユニット８による冷却が行われる。そして、ステップＳ３０８に進む。また、シート部材２２０の冷却ユニット８による冷却が必要ではない場合、ステップＳ３０７の処理を行わずに、ステップＳ３０８に進む。 Then, in step S306, it is determined whether cooling of the sheet member 220 by the cooling unit 8 is necessary. If the sheet member 220 needs to be cooled by the cooling unit 8, the process proceeds to step S307. Then, in step S307, in addition to the cooling of the sheet member 220 by the cool air supply unit 7, the cooling of the sheet member 220 by the cooling unit 8 is performed. Then, the process proceeds to step S308. If the sheet member 220 does not need to be cooled by the cooling unit 8, the process proceeds to step S308 without performing the process of step S307.
　そして、図１８に示すように、ステップＳ３０８において、飛散物の破片クリーナ９による吸引が開始される。 Then, as shown in FIG. 18, in step S308, the suction of the scattered matter by the fragment cleaner 9 is started.
　そして、ステップＳ３０９において、クランプ部６３がＺ方向移動機構６１により急速に下降されてシート部材２２０がエキスパンドリング６４に押し付けられることにより、シート部材２２０のエキスパンドが実行される。これにより、シート部材２２０上のウエハ２１０がマトリクス状の複数の半導体チップに分割されるとともに、複数の半導体チップの間の隙間が広げられる。また、ステップＳ３０９では、クランプ部６３がエキスパンド開始位置からエキスパンド完了位置まで下降される。 Then, in step S309, the clamp portion 63 is rapidly lowered by the Z-direction moving mechanism 61 to press the sheet member 220 against the expand ring 64, thereby expanding the sheet member 220. As a result, the wafer 210 on the sheet member 220 is divided into a plurality of matrix-shaped semiconductor chips, and the gaps between the plurality of semiconductor chips are widened. Further, in step S309, the clamp portion 63 is lowered from the expansion start position to the expansion completion position.
　そして、ステップＳ３１０において、冷気供給部７によるシート部材２２０への冷気の供給が停止される。なお、ステップ３０５において、冷気供給部７によるシート部材２２０への冷気の供給による冷却が必要ではないと判断された場合、ステップＳ３１０の処理を行わずに、ステップＳ３１１に進む。 Then, in step S310, supply of cold air to the sheet member 220 by the cool air supply unit 7 is stopped. If it is determined in step 305 that cooling by supplying cool air to the sheet member 220 by the cool air supply unit 7 is not necessary, the process proceeds to step S311 without performing the processing of step S310.
　そして、ステップＳ３１１において、飛散物の破片クリーナ９による吸引が停止される。 Then, in step S311, the suction of the scattered matter by the fragment cleaner 9 is stopped.
　そして、ステップＳ３１２において、破片クリーナ９が冷気供給部７と共にシリンダにより上昇される。そして、エキスパンド処理が終了される。そして、シート部材２２０をエキスパンドした状態を維持しつつ、第１位置Ｐ１から第２位置Ｐ２に、エキスパンド部６（Ｚ方向移動機構６１、クランプ部６３およびエキスパンドリング６４）がＹ方向移動機構６２により移動される。 Then, in step S312, the fragment cleaner 9 is lifted by the cylinder together with the cool air supply unit 7. Then, the expanding process ends. Then, while maintaining the expanded state of the sheet member 220, the expanding portion 6 (the Z-direction moving mechanism 61, the clamping portion 63 and the expanding ring 64) is moved from the first position P1 to the second position P2 by the Y-direction moving mechanism 62. be moved.
（ヒートシュリンク処理）
　図１９および図２０を参照して、エキスパンド装置１００におけるヒートシュリンク処理について説明する。ヒートシュリンク処理は、上記半導体チップ製造処理におけるステップＳ５において行われる処理である。 (Heat shrink treatment)
The heat shrink process in the expanding device 100 will be described with reference to FIGS. 19 and 20. FIG. The heat shrink process is a process performed in step S5 in the semiconductor chip manufacturing process.
　図１９に示すように、ステップＳ４０１において、紫外線照射部１１がシリンダ１２１により上昇される。 As shown in FIG. 19, in step S401, the ultraviolet irradiation unit 11 is raised by the cylinder 121.
　そして、ステップＳ４０２において、拡張維持リング１１３がシリンダにより下降される。これにより、拡張維持リング１１３とエキスパンドリング６４との間にシート部材２２０が挟み込まれる。 Then, in step S402, the extension maintaining ring 113 is lowered by the cylinder. Thereby, the sheet member 220 is sandwiched between the expansion maintaining ring 113 and the expanding ring 64 .
　そして、ステップＳ４０３において、加熱リング１１１と吸気リング１１２とがＺ方向移動機構１１０により下降される。なお、加熱リング１１１および吸気リング１１２用の上下機構（Ｚ方向移動機構１１０）と、拡張維持リング１１３用の上下機構（シリンダ）とは、別々の機構である。 Then, in step S403, the heating ring 111 and the suction ring 112 are lowered by the Z-direction moving mechanism 110. The up-down mechanism (Z-direction moving mechanism 110) for the heating ring 111 and the suction ring 112 and the up-down mechanism (cylinder) for the extension maintaining ring 113 are separate mechanisms.
　そして、ステップＳ４０４において、吸気リング１１２による吸気が開始される。 Then, in step S404, intake by the intake ring 112 is started.
　そして、ステップＳ４０５において、シート部材２２０の加熱リング１１１による加熱と、紫外線の紫外線照射部１１によるシート部材２２０への照射とが開始される。シート部材２２０の加熱リング１１１による加熱により、シート部材２２０のウエハ２１０の周囲の部分２２０ｂの弛みが収縮して除去される。また、紫外線の紫外線照射部１１によるシート部材２２０への照射により、シート部材２２０の粘着層の粘着力が低下される。 Then, in step S405, heating of the sheet member 220 by the heating ring 111 and irradiation of the sheet member 220 by the ultraviolet irradiation unit 11 with ultraviolet rays are started. By heating the sheet member 220 by the heating ring 111, the slack of the portion 220b of the sheet member 220 surrounding the wafer 210 is contracted and removed. Further, the irradiation of the ultraviolet rays to the sheet member 220 by the ultraviolet irradiation unit 11 reduces the adhesive force of the adhesive layer of the sheet member 220 .
　そして、ステップＳ４０６において、シート部材２２０の加熱リング１１１による加熱時間が設定時間に達したか否かが判断される。シート部材２２０の加熱リング１１１による加熱時間が設定時間に達していない場合、ステップＳ４０６の処理が繰り返される。また、シート部材２２０の加熱リング１１１による加熱時間が設定時間に達した場合、ステップＳ４０７に進む。 Then, in step S406, it is determined whether or not the heating time of the sheet member 220 by the heating ring 111 has reached the set time. If the heating time of the sheet member 220 by the heating ring 111 has not reached the set time, the process of step S406 is repeated. If the heating time of the sheet member 220 by the heating ring 111 reaches the set time, the process proceeds to step S407.
　そして、ステップＳ４０７において、シート部材２２０の加熱リング１１１による加熱が停止される。 Then, in step S407, the heating of the sheet member 220 by the heating ring 111 is stopped.
　そして、ステップＳ４０８において、クランプ部６３がＺ方向移動機構６１により低速で上昇される。 Then, in step S408, the clamp part 63 is raised at a low speed by the Z-direction moving mechanism 61.
　そして、ステップＳ４０９において、クランプ部６３がエキスパンド開始位置まで上昇したか否かが判断される。クランプ部６３がエキスパンド開始位置まで上昇していない場合、ステップＳ４０９の処理が繰り返される。また、クランプ部６３がエキスパンド開始位置まで上昇した場合、ステップＳ４１０に進む。 Then, in step S409, it is determined whether or not the clamp portion 63 has risen to the expansion start position. If the clamp portion 63 has not risen to the expansion start position, the process of step S409 is repeated. Further, when the clamp portion 63 is raised to the expansion start position, the process proceeds to step S410.
　なお、ステップＳ４０６～Ｓ４０９の処理では、シート部材２２０の加熱リング１１１による加熱と、クランプ部６３のＺ方向移動機構６１による上昇とを１回で行う例を示したが、ヒートシュリンクの構成はこれには限られない。たとえば、シート部材２２０の加熱リング１１１による加熱と、クランプ部６３のＺ方向移動機構６１による上昇とを複数回に分割して行ってもよい。すなわち、シート部材２２０の加熱リング１１１による加熱と、クランプ部６３のＺ方向移動機構６１による上昇とを繰り返しながら、クランプ部６３がエキスパンド開始位置まで上昇されてもよい。 In the processing of steps S406 to S409, an example in which heating of the sheet member 220 by the heating ring 111 and lifting of the clamping portion 63 by the Z-direction moving mechanism 61 are performed at once was shown. is not limited to For example, the heating of the sheet member 220 by the heating ring 111 and the lifting of the clamping portion 63 by the Z-direction moving mechanism 61 may be performed in multiple steps. That is, the clamping portion 63 may be raised to the expansion start position while repeating the heating of the sheet member 220 by the heating ring 111 and the raising of the clamping portion 63 by the Z-direction moving mechanism 61 .
　そして、ステップＳ４１０において、吸気リング１１２による吸気と、紫外線の紫外線照射部１１によるシート部材２２０への照射とが停止される。 Then, in step S410, the intake by the intake ring 112 and the irradiation of the ultraviolet rays to the sheet member 220 by the ultraviolet irradiation unit 11 are stopped.
　そして、ステップＳ４１１において、加熱リング１１１と吸気リング１１２とがＺ方向移動機構１１０により上昇される。 Then, in step S411, the heating ring 111 and the intake ring 112 are lifted by the Z-direction moving mechanism 110.
　そして、ステップＳ４１２において、拡張維持リング１１３がシリンダにより上昇される。 Then, in step S412, the expansion retaining ring 113 is lifted by the cylinder.
　そして、ステップＳ４１３において、紫外線照射部１１がシリンダ１２１により下降される。そして、ヒートシュリンク処理が終了される。そして、第２位置Ｐ２から第１位置Ｐ１に、エキスパンド部６（Ｚ方向移動機構６１、クランプ部６３およびエキスパンドリング６４）がＹ方向移動機構６２により移動される。そして、第１位置Ｐ１のエキスパンド部６からリフトアップハンド３２に、エキスパンドおよびヒートシュリンクが完了したウエハリング構造２００が、吸着ハンド４３により移載される。 Then, in step S413, the ultraviolet irradiation section 11 is lowered by the cylinder 121. Then, the heat shrink process is terminated. Then, the Y-direction moving mechanism 62 moves the expanding portion 6 (the Z-direction moving mechanism 61, the clamp portion 63 and the expanding ring 64) from the second position P2 to the first position P1. Then, the wafer ring structure 200 that has been expanded and heat-shrinked is transferred from the expanding section 6 at the first position P<b>1 to the lift-up hand 32 by the suction hand 43 .
（収容処理）
　図２１を参照して、エキスパンド装置１００における収容処理について説明する。収容処理は、上記半導体チップ製造処理におけるステップＳ８において行われる処理である。 (Containment processing)
The accommodation process in the expanding device 100 will be described with reference to FIG. 21 . The accommodation process is a process performed in step S8 in the semiconductor chip manufacturing process.
　図２１に示すように、ステップＳ５０１において、リフトアップハンド部３のリフトアップハンド３２が空いているか否かが判断される。リフトアップハンド３２が空いていない場合、収容処理が終了される。また、リフトアップハンド３２が空いている場合、ステップＳ５０２に進む。 As shown in FIG. 21, in step S501, it is determined whether or not the lift-up hand 32 of the lift-up hand unit 3 is free. If the lift-up hand 32 is not free, the accommodation process is terminated. If the lift-up hand 32 is vacant, the process proceeds to step S502.
　そして、ステップＳ５０２において、リフトアップハンド３２がカセット部２のウエハカセット２２内に存在するか否かが判断される。リフトアップハンド３２がウエハカセット２２内に存在しない場合、ステップＳ５０４に進む。また、リフトアップハンド３２がウエハカセット２２内に存在する場合、ステップＳ５０３に進む。 Then, in step S502, it is determined whether or not the lift-up hand 32 exists within the wafer cassette 22 of the cassette section 2. If the lift-up hand 32 does not exist within the wafer cassette 22, the process proceeds to step S504. Also, if the lift-up hand 32 exists in the wafer cassette 22, the process proceeds to step S503.
　そして、ステップＳ５０３において、リフトアップハンド３２が、Ｙ方向移動機構３１により、ウエハカセット２２内からウエハカセット２２外にＹ２方向に移動される。 Then, in step S503, the lift-up hand 32 is moved from inside the wafer cassette 22 to outside the wafer cassette 22 by the Y-direction moving mechanism 31 in the Y2 direction.
　そして、ステップＳ５０４において、ウエハカセット２２にリフトアップハンド３２上の収容対象のウエハリング構造２００を収容可能なように、ウエハカセット２２がＺ方向移動機構２１によりＺ方向に移動される。具体的には、ステップＳ５０４では、ウエハカセット２２内の一対の載置部２３の上面のわずかにＺ１方向側の高さに、リフトアップハンド３２上の収容対象のウエハリング構造２００のリング状部材の２３０の下面が位置するように、ウエハカセット２２がＺ方向移動機構２１によりＺ方向に移動される。 Then, in step S504, the wafer cassette 22 is moved in the Z direction by the Z-direction moving mechanism 21 so that the wafer ring structure 200 to be accommodated on the lift-up hand 32 can be accommodated in the wafer cassette 22. Specifically, in step S504, the ring-shaped member of the wafer ring structure 200 to be accommodated on the lift-up hand 32 is placed slightly above the upper surfaces of the pair of mounting portions 23 in the wafer cassette 22 in the Z1 direction. The wafer cassette 22 is moved in the Z-direction by the Z-direction moving mechanism 21 so that the lower surface of 230 of is positioned.
　そして、ステップＳ５０５において、リフトアップハンド３２上の収容対象のウエハリング構造２００のリング状部材の２３０の下面がウエハカセット２２内の収容位置（一対の載置部２３の真上）に位置するように、リフトアップハンド３２がＹ方向移動機構３１によりＹ１方向に移動される。 Then, in step S505, the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated on the lift-up hand 32 is positioned at the accommodation position in the wafer cassette 22 (directly above the pair of mounting portions 23). Then, the lift-up hand 32 is moved in the Y1 direction by the Y-direction moving mechanism 31 .
　そして、ステップＳ５０６において、リフトアップハンド３２上の収容対象のウエハリング構造２００が、ウエハカセット２２内の一対の載置部２３に受け渡される。具体的には、ステップＳ５０６では、リフトアップハンド３２の上面が、一対の載置部２３の上面よりもわずかに下になるように、ウエハカセット２２がＺ方向移動機構２１によりＺ１方向に移動される。 Then, in step S506, the wafer ring structure 200 to be accommodated on the lift-up hand 32 is transferred to the pair of placement parts 23 in the wafer cassette 22. Specifically, in step S506, the wafer cassette 22 is moved in the Z1 direction by the Z-direction moving mechanism 21 so that the upper surface of the lift-up hand 32 is slightly below the upper surfaces of the pair of mounting portions 23. be.
　そして、ステップＳ５０８において、一対の載置部２３の上面により収容対象のウエハリング構造２００のリング状部材２３０の下面を支持した状態で、リフトアップハンド３２がＹ方向移動機構３１によりＹ２方向に移動される。これにより、収容対象のウエハリング構造２００がウエハカセット２２内に収容された状態で、リフトアップハンド３２が取り出される。そして、収容処理が終了される。 Then, in step S508, the lift-up hand 32 is moved in the Y2 direction by the Y-direction moving mechanism 31 while the lower surface of the ring-shaped member 230 of the wafer ring structure 200 to be accommodated is supported by the upper surfaces of the pair of mounting portions 23. be done. As a result, the lift-up hand 32 is taken out while the wafer ring structure 200 to be accommodated is accommodated in the wafer cassette 22 . Then, the accommodation process ends.
（本実施形態の効果）
　本実施形態では、以下のような効果を得ることができる。 (Effect of this embodiment)
The following effects can be obtained in this embodiment.
　本実施形態では、上記のように、ヒートシュリンク部１０によりシート部材２２０を加熱する際に、並行して、シート部材２２０に紫外線を照射して、シート部材２２０の粘着力を低減させる紫外線照射部１１を設ける。これにより、ヒートシュリンク部１０によりシート部材２２０のウエハ２１０の周囲の部分の弛みを加熱して収縮させながら、紫外線照射部１１によりシート部材２２０の粘着力を低減させることができる。その結果、ヒートシュリンク部１０によるシート部材２２０の収縮処理と、紫外線照射部１１によるシート部材２２０の粘着力を低減させる処理とを順番に行う場合に比べて、処理の時間を減少させることができる。これにより、ウエハ２１０が貼り付けられたシート部材２２０のエキスパンド、加熱収縮および粘着力を低減させる処理の時間が増加するのを抑制することができる。 In the present embodiment, as described above, when the sheet member 220 is heated by the heat shrink portion 10, the sheet member 220 is irradiated with ultraviolet rays in parallel to reduce the adhesive strength of the sheet member 220. 11 is provided. As a result, the adhesive strength of the sheet member 220 can be reduced by the ultraviolet irradiation section 11 while the heat shrink section 10 heats and shrinks the slack of the sheet member 220 around the wafer 210 . As a result, the processing time can be reduced as compared with the case where the contraction processing of the sheet member 220 by the heat shrink unit 10 and the processing for reducing the adhesive strength of the sheet member 220 by the ultraviolet irradiation unit 11 are performed in order. . As a result, it is possible to suppress an increase in the processing time for expanding, heat shrinking, and reducing the adhesive force of the sheet member 220 to which the wafer 210 is attached.
　また、本実施形態では、上記のように、シート部材２２０の一方側を覆うように配置され、紫外線照射部１１から照射された紫外線を遮蔽する拡張維持リング１１３を備え、紫外線照射部１１は、シート部材２２０の他方側から、シート部材２２０に紫外線を照射するように構成されている。これにより、拡張維持リング１１３により紫外線照射部１１から照射された紫外線が外部に漏れるのを抑制することができる。 Further, in the present embodiment, as described above, the extension maintaining ring 113 is provided so as to cover one side of the sheet member 220 and shields the ultraviolet rays irradiated from the ultraviolet irradiation section 11. The ultraviolet irradiation section 11 It is configured to irradiate the sheet member 220 with ultraviolet rays from the other side of the sheet member 220 . As a result, the extension retention ring 113 can prevent the ultraviolet rays emitted from the ultraviolet irradiation section 11 from leaking to the outside.
　また、本実施形態では、上記のように、拡張維持リング１１３は、シート部材２２０のウエハ２１０を取り囲むように環状に形成された側面部１１３ｂと、シート部材２２０とは反対側の側面部に接続された底面部１１３ａとを含む。これにより、シート部材２２０の側方に出射される紫外線を拡張維持リング１１３の側面部１１３ｂにより遮蔽することができるとともに、シート部材２２０の面に垂直な方向に出射される紫外線を拡張維持リング１１３の底面部１１３ａにより遮蔽することができる。これにより、シート部材２２０に照射される紫外線が外部に漏れるのをより確実に抑制することができる。 Further, in the present embodiment, as described above, the expansion maintaining ring 113 is connected to the annular side portion 113b of the sheet member 220 so as to surround the wafer 210 and the side portion opposite to the sheet member 220. and a bottom portion 113a. As a result, ultraviolet rays emitted to the side of the sheet member 220 can be blocked by the side portion 113b of the extension maintaining ring 113, and ultraviolet rays emitted in a direction perpendicular to the surface of the sheet member 220 can be blocked by the extension maintaining ring 113. can be shielded by the bottom portion 113a. As a result, it is possible to more reliably suppress leakage of the ultraviolet rays irradiated to the sheet member 220 to the outside.
　また、本実施形態では、上記のように、紫外線照射部１１によりシート部材２２０に紫外線を照射する際に、シート部材２２０の他方側に当接してシート部材２２０を支持するとともに紫外線照射部１１を取り囲むように配置され、紫外線を遮蔽する材料により形成されたエキスパンドリング６４を備える。これにより、シート部材２２０を支持するエキスパンドリング６４により紫外線照射部１１から周りに出射される紫外線を遮蔽することができるので、シート部材２２０を支持する部材と紫外線を遮蔽する部材とを別個に設ける場合に比べて、部品点数を減少させることができるとともに、装置構成を簡素化することができる。 Further, in the present embodiment, as described above, when the sheet member 220 is irradiated with ultraviolet rays by the ultraviolet irradiation section 11, the sheet member 220 is supported by coming into contact with the other side of the sheet member 220, and the ultraviolet irradiation section 11 is supported. An expanding ring 64 is provided surrounding and formed of a material that blocks ultraviolet rays. As a result, the expand ring 64 that supports the sheet member 220 can shield the ultraviolet rays emitted from the ultraviolet irradiation section 11 to the surroundings, so that the member that supports the sheet member 220 and the member that shields the ultraviolet rays are provided separately. Compared to the case, the number of parts can be reduced, and the device configuration can be simplified.
　また、本実施形態では、上記のように、拡張維持リング１１３およびエキスパンドリング６４は、紫外線照射部１１によりシート部材２２０に紫外線を照射する際に、並行してヒートシュリンク部１０によりシート部材２２０を収縮させる際に、シート部材２２０を挟み込むように保持することにより、ウエハ２１０が配置される部分のシート部材２２０の拡張を維持するように構成されている。これにより、紫外線照射部１１により照射される紫外線を遮蔽する拡張維持リング１１３により、ヒートシュリンク部１０によりシート部材２２０を収縮させる際にウエハ２１０が配置される部分のシート部材２２０の拡張を維持することができるので、シート部材２２０の拡張を維持する部材を別途設ける場合に比べて、部品点数を減少させることができるとともに、装置構成を簡素化することができる。 Further, in the present embodiment, as described above, the expansion maintaining ring 113 and the expand ring 64 irradiate the sheet member 220 with the ultraviolet rays by the ultraviolet irradiation section 11 while the sheet member 220 is held by the heat shrink section 10 in parallel. By holding the sheet member 220 so as to sandwich it when contracted, the expansion of the sheet member 220 at the portion where the wafer 210 is arranged is maintained. As a result, the extension maintaining ring 113 that shields the ultraviolet rays irradiated by the ultraviolet irradiation section 11 maintains the expansion of the portion of the sheet member 220 where the wafer 210 is arranged when the sheet member 220 is shrunk by the heat shrink section 10 . Therefore, the number of parts can be reduced and the configuration of the device can be simplified as compared with the case where a member for maintaining the expansion of the sheet member 220 is separately provided.
　また、本実施形態では、上記のように、紫外線照射部１１は、シート部材２２０の面に対して交差する方向に沿って配置された紫外線照射位置Ｐ３と退避位置Ｐ４との間で移動可能に構成されている。これにより、シート部材２２０に紫外線を照射する場合には、紫外線照射部１１を紫外線照射位置Ｐ３に移動させて、シート部材２２０に紫外線を照射しない場合には、紫外線照射部１１を退避位置Ｐ４に退避させることができる。これにより、紫外線照射部１１を退避させた場合にはシート部材２２０に対してさらに他の処理を行うことができるので、同じ位置のシート部材２２０に対して複数種類の処理を行うことができる。 Further, in the present embodiment, as described above, the ultraviolet irradiation section 11 is movable between the ultraviolet irradiation position P3 and the retracted position P4 arranged along the direction intersecting the surface of the sheet member 220. It is configured. As a result, when the sheet member 220 is to be irradiated with ultraviolet rays, the ultraviolet irradiation section 11 is moved to the ultraviolet irradiation position P3, and when the sheet member 220 is not to be irradiated with ultraviolet rays, the ultraviolet irradiation section 11 is moved to the retracted position P4. can be evacuated. Accordingly, when the ultraviolet irradiation unit 11 is retracted, further processing can be performed on the sheet member 220, so that a plurality of types of processing can be performed on the sheet member 220 at the same position.
　また、本実施形態では、上記のように、紫外線照射部１１は、ヒートシュリンク部１０によりシート部材２２０を加熱して収縮させる際の作業時間内に、シート部材２２０の粘着力を低減させる紫外線の照射処理が終了するように、照射する紫外線の強度が調整されている。これにより、シート部材２２０を加熱して収縮させる作業内に、紫外線を照射してシート部材２２０の粘着力を低減させる処理を終了させることができるので、紫外線を照射してシート部材２２０の粘着力を低減させる処理の終了を待機する待機時間が発生するのを抑制することができる。その結果、ウエハ２１０が貼り付けられたシート部材２２０のエキスパンド、加熱収縮および粘着力を低減させる処理の時間が増加するのを効果的に抑制することができる。 Further, in the present embodiment, as described above, the ultraviolet irradiation unit 11 emits ultraviolet rays that reduce the adhesive force of the sheet member 220 within the working time for heating and shrinking the sheet member 220 by the heat shrink unit 10 . The intensity of the ultraviolet rays to be irradiated is adjusted so that the irradiation process ends. As a result, the process of irradiating the ultraviolet rays to reduce the adhesion of the sheet member 220 can be completed while the sheet member 220 is heated and shrunk. It is possible to suppress the occurrence of a waiting time for waiting for the end of the process for reducing the As a result, the expansion of the sheet member 220 to which the wafer 210 is attached, the heat shrinkage, and the increase in the processing time for reducing the adhesive force can be effectively suppressed.
［変形例］
　なお、今回開示された実施形態は、すべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は、上記した実施形態の説明ではなく請求の範囲によって示され、さらに請求の範囲と均等の意味および範囲内でのすべての変更（変形例）が含まれる。 [Modification]
It should be noted that the embodiments disclosed this time should be considered as examples and not restrictive in all respects. The scope of the present invention is indicated by the scope of the claims rather than the above description of the embodiments, and includes all modifications (modifications) within the scope and meaning equivalent to the scope of the claims.
　たとえば、上記実施形態では、シート部材に対して一方側からヒートシュリンク部によりシート部材を加熱し、シート部材に対して他方側から紫外線照射部によりシート部材に紫外線を照射する構成の例を示したが、本発明はこれに限られない。本発明では、シート部材に対して、同じ側から、ヒートシュリンク部によりシート部材を加熱し、紫外線照射部によりシート部材に紫外線を照射する構成でもよい。 For example, in the above embodiment, the sheet member is heated by the heat shrink portion from one side of the sheet member, and the sheet member is irradiated with ultraviolet rays by the ultraviolet irradiation portion from the other side of the sheet member. However, the present invention is not limited to this. In the present invention, the sheet member may be heated from the same side by the heat shrink portion and the sheet member may be irradiated with ultraviolet rays by the ultraviolet irradiation portion.
　また、上記実施形態では、拡張維持リング（紫外線遮蔽部）がシート部材の上方に設けられ、エキスパンドリング（支持リング）がシート部材の下方に設けられる構成の例を示したが、本発明はこれに限られない。本発明では、紫外線遮蔽部がシート部材の下方に設けられ、支持リングがシート部材の上方に設けられていてもよい。また、紫外線遮蔽部および支持リングは、シート部材を挟んで、水平方向に対向するように配置されていてもよい。 Further, in the above-described embodiment, an example of a configuration in which the expansion maintaining ring (ultraviolet shielding portion) is provided above the sheet member and the expand ring (support ring) is provided below the sheet member is shown, but the present invention is similar to this. is not limited to In the present invention, the ultraviolet shielding portion may be provided below the sheet member, and the support ring may be provided above the sheet member. Further, the ultraviolet shielding portion and the support ring may be arranged so as to face each other in the horizontal direction with the sheet member interposed therebetween.
　また、上記実施形態では、拡張維持リング（紫外線遮蔽部）は、円筒形状を有するように形成されている構成の例を示したが、本発明はこれに限られない。本発明では、紫外線遮蔽部は、断面が多角形形状を有する筒状に形成されていてもよい。 Also, in the above embodiment, an example of a configuration in which the expansion maintenance ring (ultraviolet shielding portion) is formed to have a cylindrical shape is shown, but the present invention is not limited to this. In the present invention, the ultraviolet shielding portion may be formed in a cylindrical shape having a polygonal cross section.
　また、上記実施形態では、ヒートシュリンク部の加熱リングがシート部材のウエハの周囲の部分を全周にわたって加熱する構成の例を示したが、本発明はこれに限られない。本発明では、ヒートシュリンク部は、ウエハの周辺を部分毎に順次加熱する構成でもよい。 Also, in the above embodiment, the heating ring of the heat shrink portion heats the entire circumference of the wafer surrounding portion of the sheet member, but the present invention is not limited to this. In the present invention, the heat shrink portion may be configured to sequentially heat the periphery of the wafer portion by portion.
　また、上記実施形態では、ヒートシュリンク部によるシート部材の加熱収縮の処理時に、ウエハが配置される部分のシート部材の拡張を維持する拡張維持リングにより、紫外線照射部から照射する紫外線を遮蔽する構成の例を示したが、本発明はこれに限られない。本発明では、拡張維持リングとは別途設けた紫外線を遮蔽する部材により紫外線照射部から照射する紫外線を遮蔽する構成であってもよい。 Further, in the above-described embodiment, when the sheet member is thermally shrunk by the heat shrink portion, the extension maintaining ring that maintains the expansion of the sheet member in the portion where the wafer is placed shields the ultraviolet rays emitted from the ultraviolet irradiation portion. , but the present invention is not limited to this. In the present invention, an ultraviolet ray shielding member provided separately from the extension retention ring may be configured to shield the ultraviolet ray emitted from the ultraviolet irradiating section.
　また、上記実施形態では、説明の便宜上、第２制御部１３（制御部）の制御処理を、処理フローに沿って順番に処理を行うフロー駆動型のフローチャートを用いて説明した例について示したが、本発明はこれに限られない。本発明では、制御部の制御処理を、イベント単位で処理を実行するイベント駆動型（イベントドリブン型）の処理により行ってもよい。この場合、完全なイベント駆動型で行ってもよいし、イベント駆動およびフロー駆動を組み合わせて行ってもよい。 Further, in the above-described embodiment, for convenience of explanation, the control processing of the second control unit 13 (control unit) has been described using a flow-driven flowchart in which processing is performed in order along the processing flow. , the present invention is not limited to this. In the present invention, the control processing of the control unit may be performed by event-driven processing that executes processing on an event-by-event basis. In this case, it may be completely event-driven, or a combination of event-driven and flow-driven.
　６　エキスパンド部
　１０　ヒートシュリンク部
　１１　紫外線照射部
　６４　エキスパンドリング（支持リング）
　１００　エキスパンド装置
　１１３　拡張維持リング（紫外線遮蔽部）
　１１３ａ　底面部
　１１３ｂ　側面部
　２１０　ウエハ
　２２０　シート部材 6 expanding section 10 heat shrink section 11 ultraviolet irradiation section 64 expanding ring (support ring)
100 Expanding device 113 Expansion maintaining ring (ultraviolet shielding part)
113a bottom portion 113b side portion 210 wafer 220 sheet member

Claims (8)

  1. 　分割ラインに沿って分割可能なウエハが貼り付けられ伸縮性を有する熱収縮性のシート部材をエキスパンドして、前記分割ラインに沿って前記ウエハを分割するエキスパンド部と、
    　前記エキスパンド部によるエキスパンドにより発生する前記シート部材の前記ウエハの周囲の部分の弛みを、加熱して収縮させるヒートシュリンク部と、
    　前記ヒートシュリンク部により前記シート部材を加熱する際に、並行して、前記シート部材に紫外線を照射して、前記シート部材の粘着力を低減させる紫外線照射部と、を備える、エキスパンド装置。     an expanding section that expands a heat-shrinkable sheet member having stretchability to which a dividable wafer is attached along a dividing line and divides the wafer along the dividing line;
    a heat shrink unit that heats and shrinks slack in the portion of the sheet member surrounding the wafer generated by the expansion by the expanding unit;
    An expanding device, comprising: an ultraviolet irradiating section that irradiates the sheet member with ultraviolet rays to reduce adhesion of the sheet member when the sheet member is heated by the heat shrink section.
  2. 　前記シート部材の一方側を覆うように配置され、前記紫外線照射部から照射された紫外線を遮蔽する紫外線遮蔽部をさらに備え、
    　前記紫外線照射部は、前記シート部材の他方側から、前記シート部材に紫外線を照射するように構成されている、請求項１に記載のエキスパンド装置。     Further comprising an ultraviolet shielding part arranged to cover one side of the sheet member and shielding the ultraviolet rays emitted from the ultraviolet irradiation part,
    2. The expanding device according to claim 1, wherein said ultraviolet irradiation section is configured to irradiate said sheet member with ultraviolet rays from the other side of said sheet member.
  3. 　前記紫外線遮蔽部は、前記シート部材の前記ウエハを取り囲むように環状に形成された側面部と、前記シート部材とは反対側の前記側面部に接続された底面部とを含む、請求項２に記載のエキスパンド装置。 3. The method according to claim 2, wherein the ultraviolet shielding portion includes a side portion of the sheet member formed in an annular shape so as to surround the wafer, and a bottom portion connected to the side portion on the opposite side of the sheet member. The expanding device as described.
  4. 　前記紫外線照射部により前記シート部材に紫外線を照射する際に、前記シート部材の他方側に当接して前記シート部材を支持するとともに前記紫外線照射部を取り囲むように配置され、紫外線を遮蔽する材料により形成された支持リングをさらに備える、請求項２または３に記載のエキスパンド装置。 When the sheet member is irradiated with ultraviolet rays by the ultraviolet irradiation section, the sheet member is in contact with the other side of the sheet member to support the sheet member, and is arranged so as to surround the ultraviolet irradiation section, and is made of a material that blocks ultraviolet rays. 4. An expanding device according to claim 2 or 3, further comprising a formed support ring.
  5. 　前記紫外線遮蔽部および前記支持リングは、前記紫外線照射部により前記シート部材に紫外線を照射する際に、並行して前記ヒートシュリンク部により前記シート部材を収縮させる際に、前記シート部材を挟み込むように保持することにより、前記ウエハが配置される部分の前記シート部材の拡張を維持するように構成されている、請求項４に記載のエキスパンド装置。 The ultraviolet shielding portion and the support ring sandwich the sheet member when the ultraviolet ray irradiation portion irradiates the sheet member with ultraviolet rays and when the sheet member is shrunk by the heat shrink portion in parallel. 5. The expanding device of claim 4, configured to hold to maintain the expansion of the sheet member in the portion where the wafer is placed.
  6. 　前記紫外線照射部は、前記シート部材の面に対して交差する方向に沿って配置された紫外線照射位置と退避位置との間で移動可能に構成されている、請求項１～５のいずれか１項に記載のエキスパンド装置。 6. Any one of claims 1 to 5, wherein the ultraviolet irradiation section is configured to be movable between an ultraviolet irradiation position and a retracted position arranged along a direction intersecting the surface of the sheet member. 3. Expanding device according to paragraph.
  7. 　前記紫外線照射部は、前記ヒートシュリンク部により前記シート部材を加熱して収縮させる際の作業時間内に、前記シート部材の粘着力を低減させる紫外線の照射処理が終了するように、照射する紫外線の強度が調整されている、請求項１～６のいずれか１項に記載のエキスパンド装置。 The ultraviolet irradiation unit emits ultraviolet rays so that the ultraviolet irradiation process for reducing the adhesive strength of the sheet member is completed within the working time when the sheet member is heated and shrunk by the heat shrink unit. The expanding device according to any one of claims 1 to 6, wherein the strength is adjusted.
  8. 　分割ラインに沿って分割可能なウエハが貼り付けられ伸縮性を有する熱収縮性のシート部材をエキスパンドして、前記分割ラインに沿って前記ウエハを分割し、
    　その後、前記シート部材のエキスパンドにより発生する前記シート部材の前記ウエハの周囲の部分の弛みを、加熱して収縮させ、
    　前記シート部材を加熱して収縮させる際に、並行して、前記シート部材に紫外線を照射して、前記シート部材の粘着力を低減させる、エキスパンド方法。     expanding a stretchable heat-shrinkable sheet member to which a dividable wafer is attached along a dividing line to divide the wafer along the dividing line;
    after that, the slack in the portion of the sheet member surrounding the wafer generated by the expansion of the sheet member is heated to contract;
    An expanding method, wherein when the sheet member is shrunk by heating, the sheet member is simultaneously irradiated with ultraviolet rays to reduce the adhesive force of the sheet member.
PCT/JP2021/033739 2021-09-14 2021-09-14 Expanding device and expanding method WO2023042261A1 (en)

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KR1020247001665A KR20240021304A (en) 2021-09-14 2021-09-14 Expand device and expand method
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TW111104884A TWI824409B (en) 2021-09-14 2022-02-10 Extension devices and extension methods

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