WO2023038065A1 - Bending system and mold disposition method - Google Patents

Abstract

A control device (100) moves lower mold replacement units (50L, 50R) that are holding lower molds (14) in the right-left direction and positions the lower molds (14) at a target location in a mold holder (30). When moving the lower mold replacement units (50L, 50R) toward the target location, the control device (100) brings the lower mold replacement units (50L, 50R) to a temporary halt at a location different from the target location, then moves the lower mold replacement units (50L, 50R) again, and brings the lower mold replacement units (50L, 50R) to a stop at the target location.

Description

Bending system and mold placement method

The present disclosure relates to a bending system and a mold arrangement method.

A bending system includes a press brake that bends a workpiece, and the press brake has a table extending in the left-right direction and a die holder that is provided on the table and holds the die. ing. The bending system also includes a die rack that is disposed laterally to the left and right sides of the press brake and stores a plurality of dies. The mold rack has a plurality of stockers holding molds, and any selected stocker can be positioned at a replacement position for mold replacement. The bending system includes a die change unit that moves the die between the die holder and the stocker positioned at the replacement position to position the die at the target position of the die holder (Patent Reference 1).

Japanese Patent No. 5947861

When positioning the mold at the target position of the mold holder, a moving body such as a mold changing unit moves leftward or rightward toward the target position, and the moving body stops according to the target position. At this time, the die is positioned with respect to the die holder by stopping the moving body, but the position of the die may deviate from the target position.

One aspect of the present disclosure includes a press brake in which a mold is arranged in a mold holder provided on a table extending in the left-right direction, and a mold holding member that holds the mold, and the rear surface side of the table or the A moving body provided on the front side so as to be movable in the horizontal direction, and a control device that moves the moving body holding the mold in the horizontal direction to position the mold at a target position of the mold holder When moving the moving body toward the target position, the control device temporarily stops the moving body at a position different from the target position, then moves the moving body again, and stops the moving body according to the target position. Bending system.

According to one aspect of the present disclosure, the moving body that has moved in the horizontal direction temporarily stops before stopping according to the target position. Then, the moving body resumes movement and stops according to the target position. By restarting the movement after the temporary stop and stopping at the target position, it is possible to eliminate the factors that cause the positional deviation of the mold.

According to one aspect of the present disclosure, when the mold is positioned in the mold holder by the moving body, it is possible to suppress the position of the mold from deviating from the target position.

FIG. 1 is a front view schematically showing the configuration of the bending system according to the first embodiment. 2 is a right side view schematically showing the configuration of the bending system shown in FIG. 1. FIG. FIG. 3 is a diagram showing an example of mold setup set in the lower mold holder. FIG. 4 is an explanatory diagram of the process of positioning the mold stage on the lower mold holder. FIG. 5 is an explanatory diagram of the process of positioning the die stage on the lower die holder. FIG. 6 is a diagram for explaining the changeover of mold setup. FIG. 7 is an explanatory diagram of the process of positioning the mold stage on the lower mold holder. FIG. 8A is an explanatory diagram showing the concept of occurrence of mold misalignment assumed in the second embodiment. FIG. 8B is an explanatory diagram showing the concept of occurrence of mold misalignment assumed in the second embodiment. FIG. 8C is an explanatory diagram showing the concept of occurrence of mold misalignment assumed in the second embodiment. FIG. 9 is an explanatory diagram of the process of positioning the lower die stage on the lower die holder. FIG. 10 is an explanatory diagram of the process of positioning the mold stage on the lower mold holder.

A bending system according to this embodiment and a method of arranging split molds will be described below with reference to the drawings.

(First embodiment)
FIG. 1 is a front view schematically showing the configuration of the bending system according to the first embodiment. 2 is a right side view schematically showing the configuration of the bending system shown in FIG. 1. FIG. A bending system 10 according to the present embodiment will be described with reference to FIGS. 1 and 2. FIG. In the following description, directions are defined as left-right direction, front-back direction, and up-down direction. The left-right direction and the front-rear direction correspond to two orthogonal directions in the horizontal direction, and the up-down direction corresponds to the vertical direction. However, these directions are used for convenience only to describe the configuration of the bending system.

The bending system 10 holds molds (lower mold 14, upper It includes a press brake 16 on which the mold 12) is arranged, and mold holding members (lower mold holding members 64L, 64R, upper mold holding members 88L, 88R) that hold the molds. The mold changing units (lower mold changing units 50L, 50R, upper mold changing units 74L, 74R) provided movably in the direction and the mold changing units holding the molds are moved in the left-right direction to and a control device 100 that positions the mold at the target position of the holder. When moving the mold exchange unit toward the target position, the control device 100 temporarily stops the mold exchange unit at a position different from the target position, and then moves the mold exchange unit again to perform mold exchange. Stop the unit according to the target position.

In the above description, "the position of the mold before positioning" refers to the position where the mold existed immediately before it was positioned to the target position by the mold changing unit. In other words, the “position of the mold before positioning” refers to the position where the mold changing unit holds the mold to be moved in order to move it to the target position.

Next, the details of the bending system 10 will be described. The bending system 10 is a system for bending a plate-like workpiece W such as sheet metal. The bending system 10 includes a press brake 16 , left and right lower die changing units 50 L and 50 R, left and right upper die changing units 74 L and 74 R, and a control device 100 .

The press brake 16 bends the workpiece W through the cooperation of the upper mold 12, which is an upper mold such as a punch, and the lower mold 14, which is a lower mold such as a die.

The press brake 16 has a body frame 18. The body frame 18 has left and right side plates 20 which are spaced apart in the left-right direction and opposed to each other. A lower table 24 extending in the horizontal direction is provided on the lower portion of the body frame 18 , and an upper table 26 extending in the horizontal direction is provided on the upper portion of the body frame 18 . The upper table 26 is configured to be vertically movable. Above each side plate 20, a hydraulic cylinder 28 is provided as a vertical movement actuator for moving the upper table 26 in the vertical direction with respect to the body frame 18. As shown in FIG. Instead of configuring the upper table 26 to be vertically movable, the lower table 24 may be configured to be vertically movable. A servomotor may be used instead of the hydraulic cylinder 28 for the vertical movement actuator.

A lower die holder 30 that detachably holds the lower die 14 is provided on the upper side of the lower table 24 . For example, the lower mold holder 30 is configured to extend continuously in the left-right direction. A holder groove 30g for inserting a shank portion (base portion) 140 of the lower mold 14 is formed in the lower mold holder 30 along the left-right direction. The lower die holder 30 has a clamp mechanism 32 that fixes the lower die 14 to the lower table 24 .

An upper die holder 34 that detachably holds the upper die 12 is provided on the lower side of the upper table 26 . For example, although the upper mold holder 34 is configured to continuously extend in the left-right direction, it may be configured to intermittently extend in the left-right direction at appropriate intervals. A holder groove 34g for inserting the shank portion (base portion) 120 of the upper mold 12 is formed in the upper mold holder 34 along the left-right direction. The upper die holder 34 has a clamping mechanism 36 that fixes the upper die 12 to the upper table 26 .

A through-hole 141 is provided in the center of the lower mold 14 in the left-right direction (width direction) to penetrate along the front-rear direction. The position of the insertion hole 141 in the lower mold 14 attached to the lower mold holder 30 is specified as a position corresponding to half the mold width from the position of one of the left and right end surfaces of the lower mold 14 as a reference. be able to. Further, similarly to the lower mold 14, the upper mold 12 is also provided with an insertion hole 121 penetrating in the front-rear direction.

In the bending system 10, a die rack 42 for storing a plurality of lower dies 14 and a plurality of upper dies 12 is provided adjacent to the left-right side of the press brake 16, which is the right side in this embodiment. It is

The mold rack 42 has a plurality of lower stockers each holding one or more lower dies 14, and the plurality of lower stockers are arranged side by side in the front-rear direction. The plurality of lower stockers are configured to be movable in the vertical direction and the front-rear direction by a stocker moving mechanism. The stocker moving mechanism can select an arbitrary lower stocker from among the plurality of lower stockers and move the selected lower stocker in the vertical direction and the front-rear direction to position it at the lower mold replacement position. The replacement position for the lower mold is set at a position adjacent to the lower mold holder 30 in the left-right direction.

Also, the mold rack 42 has a plurality of upper stockers each holding one or more upper molds 12 . The configuration of each upper stocker is similar to that of the lower stocker.

The left and right lower mold exchange units 50L and 50R exchange the lower mold 14 between the lower mold holder 30 and the mold rack 42. Specifically, the left and right lower mold exchanging units 50L and 50R move the lower mold 14 between the lower mold holder 30 and the lower stocker positioned at the exchange position for the lower mold, and move the lower mold in the lower mold holder 30. 14 positioning, etc. The left and right lower mold exchanging units 50L and 50R correspond to left and right moving units (moving bodies) provided corresponding to the lower mold 14 .

The left and right lower die exchange units 50L and 50R are provided on the rear surface side of the lower table 24. A lower guide 48 extending in the left-right direction is provided on the rear surface side of the lower die holder 30 . Each of the lower mold exchanging units 50L, 50R is configured to be movable in the left-right direction via the lower guide 48. As shown in FIG.

The left and right lower mold replacement units 50L and 50R are configured independently of each other and can operate independently. Since the configurations of the left and right lower mold replacing units 50L and 50R correspond to each other, the configuration will be described below using the right lower mold replacing unit 50R as an example. Although FIG. 2 shows the configuration of the right lower mold exchanging unit 50R, for reference, the corresponding configuration in the left lower mold exchanging unit 50L is indicated by parenthesized reference numerals.

The lower mold exchanging unit 50R moves in the left-right direction by being driven by a servomotor 52R as an actuator for left-right movement. The servomotor 52R has an encoder 54R as a position detector for detecting the lateral position of the lower mold exchanging unit 50R.

The lower mold exchanging unit 50R has a lower unit main body 56R provided movably in the horizontal direction on the lower guide 48, and a lower support member 58R provided movably in the front-rear and vertical directions on the lower unit main body 56R. are doing. The lower support member 58R moves in the front-rear direction with respect to the lower unit main body 56R by driving the first air cylinder 60R as an actuator for front-rear movement. The lower support member 58R moves vertically with respect to the lower unit main body 56R by driving the second air cylinder 62R, which is an actuator for vertical movement.

The lower mold exchanging unit 50R has a lower mold holding member 64R provided movably in the front-rear direction on the lower support member 58R. The lower mold holding member 64R is moved in the front-rear direction with respect to the lower support member 58R by driving the third air cylinder 66R as an actuator for front-rear movement. The lower die holding member 64R is configured to be insertable into the insertion hole 141 of the lower die 14 .

The left and right lower die exchange units 50L and 50R move and position the lower die 14 in the lower die holder 30. Each lower die exchange unit 50L, 50R advances lower support members 58L, 58R and lower die holding members 64L, 64R to insert the lower die holding members 64L, 64R into the insertion holes 141 of the lower die 14. , the lower mold 14 can be held.

With the lower mold holding members 64L and 64R holding the lower mold 14, the lower mold 14 can be moved in the horizontal direction by moving the lower mold replacement units 50L and 50R in the horizontal direction. Then, the lower mold 14 can be positioned at the target position of the lower mold holder 30 by stopping the lower mold exchanging units 50L and 50R at predetermined positions.

The left and right lower mold exchanging units 50L and 50R can move and position the lower mold 14 independently. In addition, the left and right lower mold exchanging units 50L and 50R hold the lower molds 14 positioned at the left and right ends of the plurality of lower molds 14, respectively, and sandwich the central lower mold 14 between the lower molds 14 at both the left and right ends. , the movement and positioning of a plurality of lower molds 14 can be performed collectively.

When moving and positioning the lower mold 14, there may be a sufficient gap on the left or right side of the target lower mold 14. In this case, the lower mold holding members 64L and 64R are brought into contact with one of the left and right end surfaces of the lower mold 14 without being inserted into the insertion holes 141, and the end surface is pushed in the left-right direction. , the lower mold 14 may be moved. In this way, the form in which the lower mold holding members 64L and 64R hold the lower mold 14 is not limited to the method of inserting the lower mold holding members 64L and 64R into the insertion holes 141 .

The left and right upper mold exchange units 74L and 74R move the upper mold 12 between the upper mold holder 34 and the upper stocker positioned at the upper mold exchange position, position the upper mold 12 in the upper mold holder 34, and so on. conduct. The left and right upper mold exchanging units 74L and 74R correspond to moving bodies provided corresponding to the upper mold 12, respectively.

The configuration of the right upper die replacement unit 74R corresponds to the configuration of the right lower die replacement unit 50R described above. Similarly, the configuration of the left upper mold replacing unit 74L corresponds to the configuration of the above-described left lower mold replacing unit 50L. That is, the upper guide 72, the servomotor 76R (76L), the encoder 78R (78L), the upper unit body 80R (80L), the upper support member 82R (82L), the first air cylinder 84R in the upper die exchange unit 74R (74L) (84L), the second air cylinder 86R (86L), the upper mold holding member 88R (88L), and the third air cylinder 90R (90L) are the lower guide 48 and the servomotor 52R in the lower mold exchanging unit 50R (50L). (52L), encoder 54R (54L), lower unit body 56R (56L), lower support member 58R (58L), first air cylinder 60R (60L), second air cylinder 62R (62L), lower die holding member 64R ( 64L), and the third air cylinder 66R (66L). Although FIG. 2 shows the configuration of the right upper mold replacing unit 74R, for reference, the configuration of the left upper mold replacing unit 74L is indicated by parenthesized reference numerals.

The control device 100 is a device that controls the operation of the bending system 10 . The control device 100 is, for example, a computer such as an NC (Numerical Control) device. A computer is mainly composed of a hardware processor such as a CPU (Central Processing Unit), a memory, and various interfaces. The memory and various interfaces are connected to the hardware processor via buses.

A predetermined computer program is installed on the computer. A hardware processor executes a computer program, so that the computer executes a plurality of functions of control device 100 .

The control device 100 controls the operation of the press brake 16 based on the machining program. Further, the control device 100 controls the operations of the left and right lower mold changing units 50L and 50R and the left and right upper mold changing units 74L and 74R based on the mold changing program and setup data. By this control, the movement of the upper mold 12 and the lower mold 14, the arrangement of the upper mold 12 and the lower mold 14 in the upper mold holder 34 and the lower mold holder 30, and the like are performed. The memory of the control device 100 stores a machining program, a mold change program, and setup data.

The setup data is data that indicates mold setup. The setup data includes information such as the setup number, mold layout, and parts to be processed. The mold layout includes the mold numbers of the molds that make up each stage, the length of the molds in the width direction, the target positions of the molds in the mold holders, and the like.

Here, the die setup refers to the die holders (upper die holder 34 and lower die holder 30) of the press brake 16 among the plurality of dies (upper die 12 and lower die 14) owned by the bending system 10. One or more die stages (upper die stage and lower die stage) placed at the same time. A mold stage included in the mold setup is composed of one mold or a group of molds in which a plurality of molds are combined in the left-right direction. When one mold stage is composed of a mold group in which a plurality of molds are combined, these molds are continuously arranged in the horizontal direction so that there are no gaps between the molds.

Below, in the bending system 10 according to the present embodiment, the left and right lower die replacement units 50L and 50R and the left and right upper die replacement units 74L and 74R are used to set up the lower die holder 30 and the upper die holder 34. The operation to be set will be explained. In the following description, the operation of setting the mold setup corresponding to the lower mold 14 to the lower mold holder 30 will be described by taking the operation of the left and right lower mold exchanging units 50L and 50R as an example. Of course, the same applies to the operation of setting the mold setup corresponding to the upper mold 12 to the upper mold holder 34 using the left and right upper mold replacement units 74L and 74R.

The control device 100 arranges each lower die stage that constitutes the mold setup at the target position of the lower die holder 30 by controlling the positions of the lower die exchange units 50L and 50R. Specifically, the control device 100 controls the servo motors 52L and 52R that drive the left and right lower mold exchanging units 50L and 50R, respectively, and controls the lateral position of the left and right lower mold exchanging units 50L and 50R. In position control, the control device 100 controls the left and right lower mold exchanging units 50L, 50R and the left and right lower mold exchanging units 50L, 50R based on the detection signals supplied from the encoders 54L, 54R for detecting the rotation speeds of the servomotors 52L, 52R. The positions of the lower molds 14 held by 50L and 50R can be recognized. By performing position control, the control device 100 moves the left and right lower mold replacing units 50L and 50R in the left direction or the right direction, or stops the left and right lower mold replacing units 50L and 50R at predetermined positions in the left and right direction. You can let By moving and stopping the left and right lower mold exchanging units 50L and 50R in the horizontal direction, the lower mold stage can be positioned at the target position of the lower mold holder 30 (positioning process).

In the positioning process of this embodiment, the target position is in the right direction (first direction) with respect to the position of the lower mold 14 before positioning, and the target position is in the left direction with respect to the position of the lower mold 14 before positioning. The operation differs depending on whether it is in the (second direction) or not. Specifically, when the target position is in the right direction (first direction) with respect to the position of the lower mold 14 before positioning, the control device 100 moves the left and right lower mold exchanging units 50L and 50R until the target position is passed. After moving rightward and temporarily stopping the left and right lower mold replacing units 50L and 50R according to the reversal position positioned rightward from the target position, the left and right lower mold replacing units 50L and 50R are moved rightward. A first process is performed in which the left and right lower mold exchanging units 50L and 50R are moved in the opposite direction to the left and stopped according to the target position. Further, when the target position is leftward with respect to the position of the lower mold 14 before positioning, the control device 100 moves the left and right lower mold exchanging units 50L, 50R leftward, and then sets the target position. A second process is performed to stop the left and right lower mold exchanging units 50L and 50R according to the target position without passing by.

In the bending system 10, the mold rack 42 is arranged adjacent to the press brake 16 in the right direction. Since the lower mold 14 placed on the lower mold holder 30 is transferred from the mold rack 42, the left and right lower mold exchanging units 50L and 50R mainly move leftward. Therefore, the control device 100 positions the lower mold stage using the movement in the left direction as a reference for operation. Then, the control device 100 selects the second process in the case of the movement in the left direction, which is the reference of the movement, and selects the first process in the case of the movement in the right direction, which is the side opposite to the reference of the movement. I am planning to

FIG. 3 is a diagram showing an example of mold setup set in the lower mold holder. 4 and 5 are explanatory diagrams of the process of positioning the lower die stage on the lower die holder. A process (positioning process) for positioning a plurality of lower die stages constituting mold setup on the lower die holder 30 will be described below with reference to FIGS. 3 to 5 .

Fig. 3 shows three lower mold stages as an example of mold setup. The first stage is arranged at the first target position Pt1 of the lower die holder 30, and is positioned in the rightmost direction among the three lower die stages. The first stage, which is a combination of three lower dies 14f, 14g, and 14h, is configured such that the lower dies 14f, 14g, and 14h are lined up without any gap toward the right. The second stage is arranged at the second target position Pt2 and positioned in the center of the three lower die stages. The second stage, which is a combination of the three lower dies 14c, 14d, and 14e, is configured such that the lower dies 14c, 14d, and 14e are lined up without any gap toward the right. The third stage is located at the third target position Pt3, and is positioned furthest to the left among the three lower die stages. The third stage, which is a combination of the two lower dies 14a and 14b, is configured such that the lower dies 14a and 14b are lined up without a gap toward the right.

The positioning of the first stage is performed so that the left end of the first stage, that is, the left end surface of the lower die 14f, is aligned with the first target position Pt1. Similarly, the positioning of the second stage is performed so that the left end of the second stage, that is, the left end surface of the lower die 14c, is aligned with the second target position Pt2. The positioning of the third stage is performed so that the left end of the third stage, that is, the left end surface of the lower die 14a, is aligned with the third target position Pt3.

First, when the eight lower molds 14a to 14h necessary for mold setup are taken out from the mold rack 42 and placed at the lower mold exchange positions, the control device 100 controls the left and right lower mold exchange units 50L and 50R to It holds eight lower molds 14a to 14h. Then, the control device 100 collectively performs the positioning of the third stage located on the leftmost side and the transfer of the first and second stages to the lower die holder 30 . At this time, the third target position Pt3 is in the left direction with respect to the two lower dies 14a to 14b before positioning.

In step a1 in FIG. 4, the control device 100 moves the left and right lower mold replacing units 50L and 50R in the left direction, and then stops the left and right lower mold replacing units 50L and 50R according to the third target position Pt3. (Second processing). As a result, the two lower molds 14a and 14b forming the third stage are positioned at the third target position Pt3. At the same time, the three lower molds 14f to 14h constituting the first stage and the three lower molds 14c to 14e constituting the second stage are placed in a state adjacent to the two lower molds 14a and 14b. 30.

In step a2 of FIG. 4, the control device 100 holds the three lower molds 14f to 14h corresponding to the first stage by the left and right lower mold exchange units 50L and 50R. At this time, the first target position Pt1 is in the right direction with respect to the three lower dies 14f to 14h before positioning. The control device 100 moves the left and right lower mold exchanging units 50L, 50R rightward to move the three lower molds 14f to 14h toward the first target position Pt1.

In step a3 of FIG. 4, the control device 100 moves the left and right lower mold replacement units 50L, 50R rightward until they pass the first target position Pt1 (first process). Then, the control device 100 temporarily stops the left and right lower mold exchanging units 50L and 50R according to the first reversing position Psa1 (first process). The first reversal position Psa1 is set at a position where the three lower dies 14f to 14h (specifically, the left end surface of the leftmost lower die 14f) are moved rightward from the first target position Pt1 by a reference distance Ls. .

In step a4 of FIG. 5, the control device 100 moves the left and right lower mold exchanging units 50L, 50R in the opposite direction to the right while holding the three lower dies 14f to 14h with the left and right lower mold exchanging units 50L, 50R. turn left. The control device 100 moves the left and right lower mold replacing units 50L, 50R leftward, and stops the left and right lower mold replacing units 50L, 50R according to the first target position Pt1 (first processing). As a result, the three lower dies 14f to 14h forming the first stage are positioned at the first target position Pt1.

The process (first process) of temporarily stopping the left and right lower mold replacement units 50L and 50R after passing the first target position Pt1 and changing the direction to the left suppresses the effects of lost motion and backlash. done for Therefore, the reference distance Ls can suppress the effects of lost motion and backlash while the left and right lower mold replacement units 50L and 50R move leftward from the first reversal position Psa1 to the first target position Pt1. Optimal values are preset for this purpose. However, if the reference distance Ls becomes longer, the movement time of the left and right lower mold exchanging units 50L and 50R becomes longer and the time required for the first process becomes longer. Therefore, it is preferable to set the reference distance Ls within a necessary range.

Next, the control device 100 positions the three lower molds 14c to 14e corresponding to the second stage using the left and right lower mold exchange units 50L and 50R. Since the second target position Pt2 is in the right direction with respect to the three lower molds 14c to 14e before positioning, the control device 100 moves the left and right lower mold exchanging units 50L and 50R to the right until the second target position Pt2 is passed. You have to move in that direction.

At step a5 in FIG. 5, the control device 100 determines whether or not there is an existing mold that already exists in the lower mold holder 30 in the interference range Ri. The interference range Ri is defined by the three lower dies 14c to 14e (specifically Technically, it refers to the range in which the right end surface of the right end lower die 14e moves.

In the example shown in FIG. 5, three lower molds 14f to 14h corresponding to the first stage correspond to existing molds. When determining that the three lower dies 14f to 14h are within the interference range Ri, the control device 100 performs retraction processing to move the three lower dies 14f to 14h rightward from the interference range Ri. The three lower dies 14f to 14h that have undergone the retraction process are again positioned with respect to the first target position Pt1 after the positioning of the three lower dies 14c to 14e, which will be described later, is completed.

When determining that the three lower dies 14f to 14h are not within the interference range Ri, the control device 100 positions the three lower dies 14c to 14e corresponding to the second stage without performing the retraction process. At step a6 in FIG. 5, the control device 100 holds the three lower molds 14c to 14e by the left and right lower mold exchanging units 50L and 50R.

At step a7 in FIG. 5, the control device 100 moves the left and right lower mold replacement units 50L and 50R rightward until they pass the second target position Pt2 (first process). Then, the control device 100 temporarily stops the left and right lower mold exchanging units 50L and 50R according to the second reversing position Psa2 (first process). The second reversal position Psa2 is set at a position where the three lower dies 14c to 14e have moved by a reference distance Ls after passing the second target position Pt2.

In step a8 of FIG. 5, the control device 100 rotates the left and right lower mold exchanging units 50L, 50R in the opposite direction to the right while holding the three lower dies 14c to 14e with the left and right lower mold exchanging units 50L, 50R. turn left. The control device 100 moves the left and right lower mold replacing units 50L, 50R leftward, and stops the left and right lower mold replacing units 50L, 50R according to the second target position Pt2 (first process). As a result, the three lower dies 14c to 14e forming the second stage are positioned at the second target position Pt2.

Through the series of operations described above, the three lower mold stages corresponding to the mold setup are arranged on the lower mold holder 30 .

In the explanation shown in FIGS. 3 to 5, the left and right lower mold exchanging units 50L and 50R move the lower molds 14a to 14h along the holder grooves 30g of the lower mold holder 30. FIG. However, after removing the lower mold 14 from the lower mold holder 30 , the lower mold 14 may be moved in the left-right direction on the front side or the rear surface side of the lower mold holder 30 .

Fig. 6 is a diagram for explaining the changeover of mold setup. FIG. 7 is an explanatory diagram of the process of positioning the mold stage on the lower mold holder. In the following, the operation of moving the lower mold 14 with the lower mold 14 removed from the lower mold holder 30 will be described by exemplifying the process of arranging the lower mold stage on the lower mold holder 30 along with the mold setup change. explain.

In the following description, the operation of changing the mold setup shown in the upper part of FIG. 6 to the mold setup shown in the lower part of FIG. 6 will be taken as an example. The mold set-up shown in the upper part of FIG. 6 includes a first stage including five lower dies 14a to 14e, and a second stage located to the right of the first stage and including three lower dies 14f to 14h. consists of On the other hand, in the mold set-up shown in the lower part of FIG. 6, the lower mold 14a located at the left end in the above-described first stage is removed from the first stage, and the third stage by this one lower mold 14a is the first stage. It is arranged at a fourth target position Pt4 between the second stage.

Referring to FIG. 7, using the left lower mold exchanging unit 50L, the lower mold 14a in the first stage before changeover (upper stage in FIG. 6) is positioned on the lower mold holder 30 as a new third stage. explain. The third stage may be positioned by using the right lower mold exchanging unit 50R instead of the left lower mold exchanging unit 50L.

In step b1 of FIG. 7, the control device 100 holds the lower mold 14a by the lower mold exchanging unit 50L. Then, the control device 100 removes the lower mold 14a from the holder groove 30g of the lower mold holder 30 by, for example, moving the lower mold exchanging unit 50L upward.

In step b2 of FIG. 7, the control device 100 moves the lower mold replacement unit 50L rearward (upper side of the paper surface) to move the lower mold 14a to the rear surface side of the lower mold holder 30. Note that FIG. 7 schematically shows the operation of the lower mold exchanging unit 50L, and depicts a state in which the entire lower mold exchanging unit 50L is moving. However, in reality, the lower die holding member 64L and the lower support member 58L move rearward, so that the lower die 14a is moved to the rear surface side of the lower die holder 30. FIG.

In FIG. 7, the fourth target position Pt4 is in the right direction with respect to the lower die 14a before positioning. The control device 100 moves the lower mold replacing unit 50L rightward until it passes the fourth target position Pt4 (first process). The control device 100 temporarily stops the lower mold exchanging unit 50L according to the fourth reversing position Psa4 (first process). The fourth reversal position Psa4 is set at a position where the lower die 14a moves rightward from the fourth target position Pt4 by a reference distance Ls.

The control device 100 changes the direction of the lower mold exchanging unit 50L leftward, which is opposite to the rightward direction, while holding the lower mold 14a with the lower mold exchanging unit 50L. The control device 100 moves the left and right lower mold replacing units 50L and 50R leftward, and stops the lower mold replacing unit 50L according to the fourth target position Pt4 (first process). Thereby, the lower die 14a is temporarily positioned with respect to the fourth target position Pt4.

In (c) of FIG. 7 , the control device 100 moves the lower die replacement unit 50L forward (downward in the plane of the drawing) to move the lower die 14 a above the lower die holder 30 . Then, the control device 100 attaches the lower mold 14a to the lower mold holder 30 by moving the lower mold exchanging unit 50L downward. Thereby, the lower die 14a is positioned at the fourth target position Pt4.

Through the series of operations described above, the three lower mold stages corresponding to the mold setup are arranged on the lower mold holder 30 .

It should be noted that the above description of the operation is an example, and various changes can be made to the operation. When the fourth target position Pt4 is in the right direction with respect to the lower die 14a before positioning, it is temporarily stopped after passing the fourth target position Pt4 and moved leftward (first processing ) should be included. For example, after temporarily stopping the lower die replacing unit 50L in accordance with the fourth reversing position Psa4, the control device 100 moves the lower die replacing unit 50L forward and downward to open the holder groove of the lower die holder 30. Lower die 14a may be inserted into 30g. Finally, the control device 100 may move the lower mold 14a leftward along the holder groove 30g of the lower mold holder 30, and then stop the lower mold exchanging unit 50L at the fourth target position Pt4. It is possible (first processing).

As described above, in the bending system 10 of the present embodiment, the die changing units (lower die changing units 50L, 50R, upper die changing units 74L, 74R) headed for the target position do not directly stop at the target position. , and after temporarily stopping at a position different from the target position, it resumes movement and stops at the target position. By resuming the movement from the temporary stop and stopping at the target position, it is possible to eliminate the cause of positional deviation of the molds (lower mold 14, upper mold 12). As a result, when the mold is positioned at the target position of the mold holder by the mold changing unit, it is possible to prevent the position of the mold from deviating from the target position.

Specifically, in the bending system 10 of the present embodiment, when the target position is to the right with respect to the position of the die before positioning, the control device 100 moves the die changing unit to the right. , the mold changing unit is temporarily stopped according to the reversal position positioned to the right of the target position, then the mold changing unit is moved in the opposite direction to the left, and the mold changing unit is moved to the target position according to the target position. A first process of stopping is performed. Further, when the target position is to the left of the position of the mold before positioning, the control device 100 moves the mold changing unit to the left without passing the target position. is stopped according to the target position.

According to this configuration, when the target position is to the right with respect to the position of the mold before positioning, the control device 100 moves the mold changing unit to the right and then stops it at the target position. Instead, it temporarily stops after passing the target position. After moving the mold changing unit leftward, the control device 100 stops the mold changing unit according to the target position. The control device 100 is not limited to the case where the die position before positioning is on the left side of the target position, and even when the die position before positioning is on the right side of the target position, The die exchange unit before stopping is moved leftward. Even if the target position is the same, the lost motion of the drive mechanism, backlash, etc. will have an effect. When the mold is positioned, the position of the mold may vary. However, according to the configuration of this embodiment, the moving direction of the mold changing unit when positioning the mold is unified to the left direction. As a result, effects such as lost motion and backlash of the drive mechanism can be suppressed. Therefore, when the mold is positioned in the mold holder by the mold changing unit, it is possible to prevent the position of the mold from deviating from the target position.

In this way, it is possible to improve the mold positioning accuracy when arranging the mold. As a result, the positional relationship between the back gauge and the mold, the upper and lower molds, and the work W and the mold can be aligned. Therefore, the present invention can be useful in bending using a bending robot, bending that requires high processing accuracy, and bending that involves changeover of mold setup.

In the present embodiment, the reversal position is set at a position that is moved rightward from the target position by a reference distance Ls. According to this configuration, when the mold exchanging unit returns to the target position in the left direction, it moves only a necessary distance. As a result, the mold exchanging unit can be made to reach the target position while suppressing the effects of lost motion and backlash.

In this embodiment, the control device 100 determines whether or not there is an existing mold in the interference range Ri in which the mold moves when the mold exchange unit is moved rightward from the target position to the reversing position. are doing. According to this configuration, it is possible to determine whether or not the mold will interfere with the existing mold before it reaches the reversal position after passing the target position.

In this embodiment, when the existing mold is in the interference range Ri, the control device 100 performs the first process after performing the evacuation process of moving the existing mold to the right. According to this configuration, by performing the retraction process, it is possible to suppress the mold to be positioned from interfering with the existing mold.

In this embodiment, the control device 100 moves the mold in the left-right direction between the holder grooves of the mold holders (lower mold holder 30, upper mold holder 34). According to this configuration, the mold can be moved along the mold holder.

In this embodiment, the control device 100 removes the mold from the mold holder, and then moves the mold in the left-right direction on the front side or the rear side of the mold holder. According to this configuration, the mold can be moved on the front side or the rear side of the mold holder.

In this embodiment, the control device 100 moves the mold exchange unit left and right while the mold holding members (lower mold holding members 64L, 64R, upper mold holding members 88L, 88R) are inserted into the insertion holes of the molds. By moving in the direction, the mold is moved in the left-right direction. According to this configuration, the mold can be appropriately held and moved by the moving body.

In this embodiment, the control device 100 may move the mold in the left-right direction by pressing the end faces of the mold in the left-right direction with the mold holding member. According to this configuration, the mold can be appropriately held and moved by the mold changing unit.

In this embodiment, the bending system 10 further includes a mold rack 42 that is provided adjacent to the press brake 16 in the right direction and that accommodates a plurality of molds that can be attached to the mold holder. there is The control device 100 controls the operation of the mold exchange unit to exchange molds between the mold holder and the mold rack 42 . According to this configuration, the mold positioned in the mold holder is moved from the mold rack 42 to the mold holder, so that the movement is mainly from right to left. Therefore, by setting the leftward direction (second direction) as a reference for the moving direction of the mold changing unit when positioning the mold, it is possible to minimize unnecessary movement associated with positioning. Note that the reference of the moving direction of the mold exchanging unit is not limited to the left direction, and may be the right direction.

(Second embodiment)
A bending system according to the second embodiment will be described below. The bending system according to the second embodiment differs from the bending system according to the first embodiment in the operation contents of the positioning process by the mold exchanging unit. In the following description, the operation of setting the mold setup corresponding to the lower mold 14 to the lower mold holder 30 will be described by taking the operation of the left and right lower mold exchanging units 50L and 50R as an example. Of course, the same applies to the operation of setting the mold setup corresponding to the upper mold 12 to the upper mold holder 34 using the left and right upper mold replacement units 74L and 74R.

FIGS. 8A to 8C are explanatory diagrams showing the concept of occurrence of mold misalignment assumed in the second embodiment. In the following description, it is assumed that the left and right lower mold exchanging units 50L, 50R place a mold stage combining four lower molds 14a, 14b, 14c, 14d at the first target position Pt1. This first target position Pt1 is in the left direction with respect to the four lower dies 14a to 14d before positioning.

When the left and right lower mold replacing units 50L and 50R start moving toward the first target position Pt1 and the left and right lower mold replacing units 50L and 50R accelerate, the four lower molds 14a to 14d move in the direction opposite to the moving direction. (rightward) inertial force. The magnitude of the inertial force received by the four lower dies 14a-14d is proportional to the mass and acceleration of the lower dies 14a-14d. The inertial force received by the four lower molds 14a to 14d acts as a force that pushes the left and right lower mold exchanging units 50L and 50R in the direction opposite to the moving direction. For this reason, as shown in FIG. 8B, the mechanical portions of the left and right lower mold exchanging units 50L and 50R are bent in the direction opposite to the moving direction. Note that FIG. 8B depicts a state in which the lower mold holding members 64L and 64R are bent in order to simply express the phenomenon. However, this mechanical deflection is caused by the mechanical parts of the left and right lower mold exchanging units 50L, 50R.

When the left and right lower mold exchanging units 50L, 50R reach the target speed, the left and right lower mold exchanging units 50L, 50R move at a constant speed according to the target speed. When the left and right lower mold exchanging units 50L and 50R decelerate as they approach the first target position Pt1, the four lower molds 14a to 14d receive inertial force in the movement direction (leftward direction). The magnitude of the inertial force received by the four lower dies 14a-14d is proportional to the mass and deceleration of the lower dies 14a-14d. The inertial force received by the four lower molds 14a to 14d serves as a force that pushes the left and right lower mold exchanging units 50L and 50R in the moving direction. For this reason, the mechanical parts of the left and right lower mold exchanging units 50L and 50R are flexed in the moving direction.

As shown in FIG. 8C, when the left and right lower mold exchanging units 50L and 50R stop according to the first target position Pt1, the inertial force applied to the four lower dies 14a to 14d disappears, and the left and right lower mold exchanging units 50L, The power to push 50R is gone. The flexure generated in the mechanical parts of the left and right lower mold exchanging units 50L, 50R tries to return to its original state by elasticity. Deflection is not completely eliminated. Therefore, the four lower dies 14a to 14d are displaced from the first target position Pt1.

In the present embodiment, when moving the left and right lower mold exchanging units 50L and 50R toward the first target position Pt1, the controller 100 moves the lower mold 14 from the first target position Pt1 toward the position of the lower mold 14 before positioning. After temporarily stopping the left and right lower mold exchanging units 50L and 50R according to the temporary position located on the near side, the left and right lower mold exchanging units 50L and 50R are moved in the same direction as the moving direction before the temporary stop. The lower mold 14 is moved from the position of the lower mold 14 to the temporary position at an acceleration and deceleration smaller than those when moving to the temporary position, and the left and right lower mold exchanging units 50L and 50R are stopped according to the first target position Pt1. This control eliminates the influence of displacement of the lower die 14 due to mechanical deflection during deceleration.

A method of positioning the lower die stage, which is a combination of the four lower dies 14a to 14d, at the first target position Pt1 by the left and right lower die exchanging units 50L and 50R will be described below with reference to FIG. 8A. FIG. 9 is an explanatory diagram of the process of positioning the lower die stage on the lower die holder.

The control device 100 moves the left and right lower mold replacement units 50L and 50R leftward toward the first target position Pt1.

In step c1 of FIG. 9, the control device 100 controls the left and right lower mold exchanging units 50L according to the first temporary position Psb1 which is closer to the front side than the first target position Pt1 when viewed from the positions of the four lower molds 14a to 14d. Temporarily stop 50R.

The control device 100 monitors the detection signals supplied from the encoders 54L, 54R provided in the left and right lower mold replacement units 50L, 50R. However, the mechanical deflection of the left and right lower mold replacement units 50L, 50R cannot be detected. Therefore, the accuracy of the stop positions of the left and right lower mold exchanging units 50L and 50R is guaranteed. On the other hand, the four lower dies 14a to 14d are temporarily stopped at positions past the first temporary position Psb1.

Of the left and right lower mold replacing units 50L and 50R, the control device 100 moves only the left lower mold replacing unit 50L in the moving direction to the left, and moves the left lower mold replacing unit 50L to the first target position Pt1. stop accordingly. The control device 100 moves the left lower mold exchanging unit 50L at an acceleration and deceleration that are smaller than the acceleration and deceleration when moving from the pre-positioning position to the first provisional position Psb1.

At this time, the mechanical deflection of the left lower mold exchanging unit 50L is eliminated by the left lower mold exchanging unit 50L moving leftward and catching up with the lower mold 14a. In addition, since the acceleration and deceleration during the movement of the left lower mold exchanging unit 50L from the first provisional position Psb1 to the first target position Pt1 are small, the inertial force received by the lower mold 14a becomes small, and the left lower mold exchange is performed. The force that pushes the unit 50L also decreases. Therefore, it is possible to suppress the occurrence of new mechanical deflection. As a result, the leftmost lower mold 14a is accurately positioned with respect to the first target position Pt1.

In step c3 of FIG. 9, the control device 100 moves the right lower mold replacing unit 50R leftward and stops the right lower mold replacing unit 50R according to the first target position Pt1. The control device 100 moves the right lower mold exchanging unit 50R at an acceleration and deceleration that are smaller than the acceleration and deceleration when moving from the position before positioning to the first provisional position Psb1. At this time, like the left lower mold replacing unit 50L, the right lower mold replacing unit 50R moves leftward, thereby eliminating the mechanical deflection. In addition, since the acceleration and deceleration during the movement of the right lower mold exchanging unit 50R are small, the inertial force received by the remaining lower dies 14b to 14d is small, and the force pushing the right lower mold exchanging unit 50R is also small. . Therefore, it is possible to suppress the occurrence of new mechanical deflection. As a result, the remaining lower molds 14b to 14d are also accurately positioned with respect to the first target position Pt1.

The distance from the first provisional position Psb1 to the first target position Pt1 is such that when the left and right lower mold replacement units 50L and 50R are temporarily stopped at the first provisional position Psb1, the leftmost lower mold 14a is positioned at the first target position Pt1. and eliminate the mechanical deflection while the left and right lower mold exchanging units 50L, 50R move from the first provisional position Psb1 to the first target position Pt1. A value is preset. However, since the acceleration and deceleration during the movement of the left and right lower mold replacement units 50L, 50R from the first provisional position Psb1 to the first target position Pt1 are small, the distance from the first provisional position Psb1 to the first target position Pt1 is becomes longer, the time required to move the left and right lower mold exchanging units 50L and 50R becomes longer. Therefore, it is preferable to set the distance from the first provisional position Psb1 to the first target position Pt1 within a necessary range.

As described above, in the present embodiment, the control device 100 moves the mold changing units (upper mold changing units 74L, 74R, lower mold changing units 50L, 50R) toward the target position. After temporarily stopping the mold changing unit according to the temporary position located on the side, move the mold changing unit from the position of the mold before positioning to the temporary position in the same direction as the moving direction before the temporary stop. The mold exchanging unit is stopped according to the target position.

According to this configuration, after temporarily stopping at the provisional position, the mold exchange unit is moved from the provisional position to the target position with small acceleration and deceleration. Therefore, mechanical deflection of the mold changing unit can be eliminated while moving from the provisional position to the target position. Further, it is possible to suppress the occurrence of new mechanical deflection between the provisional position and the target position. As a result, when the mold is positioned in the mold holder by the mold changing unit, it is possible to prevent the position of the mold from deviating from the target position.

The "low acceleration and deceleration" in the present embodiment refer to acceleration and deceleration such that the inertial force applied to the mold is reduced and the force that pushes the mold exchange unit is also reduced. That is, the "small acceleration and deceleration" can also be rephrased as small acceleration and deceleration at which the die exchange unit does not mechanically bend, and furthermore, small acceleration and deceleration at which the die does not cause misalignment.

In addition, in this embodiment, the distance from the provisional position to the target position is longer than the positional deviation distance from the provisional position that occurs in the mold that has moved from the position of the mold before positioning to the provisional position.

According to this configuration, it is possible to eliminate the mechanical deflection of the mold exchange unit while moving from the provisional position to the target position. Therefore, it is possible to prevent the position of the mold from deviating from the target position.

In this embodiment, the mold exchanging unit includes left and right mold exchanging units (moving units) that move independently in the left-right direction. The left and right mold exchanging units hold the molds positioned at both left and right ends of the plurality of molds, thereby moving the plurality of molds collectively.

When moving multiple molds at once, the mass of the entire mold increases according to the number of molds. For this reason, the influence of positional deviation due to mechanical deflection is significant. In this respect, according to the configuration of the present embodiment, the influence of positional displacement of the mold due to mechanical deflection can be eliminated. Even when a plurality of molds are moved collectively, it is possible to prevent the positions of the molds from deviating from the target positions.

Further, in the present embodiment, the control device 100 temporarily stops the left and right mold replacing units according to the temporary position, and then moves one of the left and right mold replacing units closer to the target position. One of the left and right mold exchanging units is moved first, and one of the mold exchanging units is stopped according to the target position. are stopped accordingly.

　The load on the mold exchange unit during movement constantly fluctuates due to changes in mechanical resistance and friction. Therefore, when the left and right mold exchange units move at the same time, even if the left and right mold exchange units move by the same command distance, the distance between the left and right mold exchange units during movement is not strictly constant. , always fluctuates. At this time, if the distance between the left and right mold exchange units becomes narrower than a certain amount, a force acts to push them against each other, preventing the elimination of the mechanical deflection. In this respect, such a problem can be solved by separately moving the mold exchanging units as in the present embodiment.

However, it is not always necessary to move the left and right mold exchange units separately. It is also possible to move the left and right mold exchange units at the same time.

The positioning process shown in the second embodiment may be used in combination with the positioning process shown in the first embodiment. The positioning process according to the second embodiment and the positioning process combined with the positioning process according to the first embodiment will be described with reference to FIG. In the following description, premised on the mold setup shown in FIGS. 4 and 5, a situation in which the three lower dies 14f to 14h corresponding to the first stage are positioned at the first target position Pt1 will be taken as an example. FIG. 10 is an explanatory diagram of the process of positioning the mold stage on the lower mold holder.

The process a2 in FIG. 10 is the same as the process a2 in FIG. In this step a2, the control device 100 holds the three lower molds 14f to 14h corresponding to the first stage by the left and right lower mold exchanging units 50L and 50R. At this time, the first target position Pt1 is in the right direction with respect to the three lower dies 14f to 14h before positioning. The control device 100 moves the left and right lower mold exchanging units 50L, 50R rightward to move the three lower molds 14f to 14h toward the first target position Pt1.

The process a3 in FIG. 10 is the same as the process a3 in FIG. In step a3, the control device 100 moves the left and right lower mold replacement units 50L and 50R rightward until they pass the first target position Pt1 (first process). Then, the control device 100 temporarily stops the left and right lower mold exchanging units 50L and 50R according to the first reversing position Psa1 (first process). When the left and right lower mold exchanging units 50L and 50R are temporarily stopped, the mechanical parts of the left and right lower mold exchanging units 50L and 50R are bent in the movement direction.

In step a41 of FIG. 10, the control device 100 changes the direction of the left and right lower mold exchanging units 50L, 50R to the left direction opposite to the right direction. Then, the control device 100 moves the left and right lower mold replacement units 50L and 50R leftward. While the left and right lower mold exchanging units 50L, 50R are accelerated leftward, the mechanical portions of the left and right lower mold exchanging units 50L, 50R continue to flex in the direction opposite to the moving direction.

Next, the control device 100 temporarily stops the left and right lower mold exchanging units 50L and 50R (second 1 processing). When the left and right lower mold exchanging units 50L, 50R are temporarily stopped, the bending of the mechanical parts of the left and right lower mold exchanging units 50L, 50R changes in the moving direction.

The control device 100 monitors the detection signals supplied from the encoders 54L, 54R provided in the left and right lower mold replacement units 50L, 50R. However, the mechanical deflection of the left and right lower mold replacement units 50L, 50R cannot be detected. Therefore, the accuracy of the stop positions of the left and right lower mold exchanging units 50L and 50R is guaranteed. However, the three lower dies 14f to 14h are positioned past the first provisional position Psb1.

In step a42 of FIG. 10, the control device 100 moves leftward the left lower mold replacing unit 50L in the moving direction among the left and right lower mold replacing units 50L and 50R, and moves the left lower mold replacing unit 50L leftward. is stopped according to the first target position Pt1. The control device 100 moves the left lower mold exchanging unit 50L at an acceleration and deceleration that are smaller than the acceleration and deceleration when moving from the first reversal position Psa1 to the first temporary position Psb1. At this time, the mechanical deflection of the left lower mold exchanging unit 50L is eliminated by the left lower mold exchanging unit 50L moving leftward and catching up with the lower mold 14f. Further, since the acceleration and deceleration during the movement of the left lower mold exchanging unit 50L from the first provisional position Psb1 to the first target position Pt1 are small, no new mechanical deflection occurs. As a result, the leftmost lower die 14f is accurately positioned with respect to the first target position Pt1.

At step a43 in FIG. 10, the control device 100 moves the right lower mold replacing unit 50R leftward and stops the right lower mold replacing unit 50R according to the first target position Pt1. The control device 100 moves the right lower mold exchanging unit 50R at an acceleration and deceleration that are smaller than the acceleration and deceleration when moving from the first reversal position Psa1 to the first temporary position Psb1. At this time, the mechanical deflection of the right lower mold exchanging unit 50R is eliminated by the right lower mold exchanging unit 50R moving leftward and catching up with the lower mold 14h. Further, since the acceleration and deceleration during the movement of the right lower mold exchanging unit 50R are small, no new mechanical deflection occurs. Thereby, the remaining lower molds 14g and 14h are also accurately positioned with respect to the first target position Pt1.

As described above, in this embodiment, when the target position is to the right with respect to the position of the mold before positioning, the control device 100 moves the mold changing unit to the right until it passes the target position. After the mold exchanging unit is stopped according to the reversal position positioned to the right of the position, the mold exchanging unit is moved to the left. Then, the control device 100 stops the mold exchanging unit according to the temporary position located on the front side of the target position when viewed from the reversing position where the mold is temporarily stopped, and then moves the mold exchanging unit to the left. A first process is performed to move the mold exchanging unit from the reverse position to the temporary position at an acceleration and deceleration that are smaller than the acceleration and deceleration when moving from the reversal position to the temporary position, and to stop the mold exchanging unit according to the target position.

With this configuration, it is possible to suppress the effects of lost motion, backlash, etc. of the drive mechanism, and to eliminate the effects of misalignment of the mold due to mechanical deflection during deceleration. Thereby, the mold can be accurately positioned with respect to the target position.

Although the positioning process of the three lower dies 14f to 14h corresponding to the first stage has been described in FIG. 10, the positioning process of the three lower dies 14c to 14e corresponding to the second stage is the same.

In addition, the method of arranging the mold for arranging the mold in the mold holder described in the present embodiment has the same idea as the positioning processing by the bending system described above, and has the same effects as the bending system. ing.

In the above-described embodiment, the lower mold changing units 50L and 50R and the upper mold changing units 74L and 74R, which are mold changing units, are exemplified as moving bodies. However, the mobile object is not limited to this. Further, in the above-described embodiment, the left and right lower mold exchanging units 50L, 50R and the left and right upper mold exchanging units 74L, 74R are provided on the rear side of the lower table 24 and the upper table 26, but the lower table 24 and the upper table 26 are provided on the rear surface side. It may be provided on the front side of the upper table 26 .

Although the present embodiment has been described as above, it should not be understood that the statements and drawings forming part of this disclosure limit this embodiment. From this embodiment, various alternative embodiments, implementations and operational techniques will become apparent to those skilled in the art.

The disclosure of the present application relates to the subject matter described in Japanese Patent Application No. 2021-147960 filed on September 10, 2021 and Japanese Patent Application No. 2022-140616 filed on September 5, 2022. The entire disclosure of is hereby incorporated by reference.

Claims (16)

1. a press brake in which the mold is arranged in a mold holder provided on a table extending in the left-right direction;
   a moving body including a mold holding member for holding the mold and provided movably in the left-right direction on the rear surface side or the front surface side of the table;
   a control device that moves the movable body holding the mold in the left-right direction to position the mold at a target position of the mold holder;
   The control device is
   When moving the moving body toward the target position, after temporarily stopping the moving body at a position different from the target position, the moving body is moved again, and the moving body is moved according to the target position. Bending system that stops at
2. When the target position is in a first direction, which is one of left and right directions, with respect to the position of the mold before positioning,
   The control device is
   moving the moving body in the first direction until it passes the target position;
   After temporarily stopping the moving body according to a reversal position located in the first direction relative to the target position, moving the moving body in a second direction opposite to the first direction;
   performing a first process of stopping the moving body according to the target position;
   When the target position is in the second direction with respect to the mold position before the positioning,
   The control device is
   2. The bending system according to claim 1, further comprising: after moving the moving body in the second direction, performing a second process of stopping the moving body according to the target position without passing the target position.
3. 3. The bending system according to claim 2, wherein the reversal position is set at a position shifted from the target position by a reference distance in the first direction.
4. The control device is
   Whether or not there is an existing mold already existing in the mold holder in an interference range in which the mold moves when the movable body is moved from the target position to the reversal position in the first direction. The bending system of claim 3, wherein the bending system determines:
5. When judging that the existing mold is in the interference range,
   The control device is
   5. The bending system according to claim 4, wherein the first process is performed after performing a retraction process of moving the existing mold toward the first direction beyond the interference range.
6. The control device is
   When moving the moving body toward the target position, after temporarily stopping the moving body in accordance with a temporary position located on the front side of the target position, move the moving body in the moving direction before the temporary stop. and in the same direction, with an acceleration and deceleration that are smaller than the acceleration and deceleration when moving from the position of the mold before positioning to the temporary position, and stop the moving body according to the target position The bending system according to claim 1.
7. 7. The distance from the provisional position to the target position is longer than the positional deviation distance from the provisional position that occurs in the die that has moved from the position of the die before positioning to the provisional position. bending system.
8. When the target position is in a first direction, which is one of left and right directions, with respect to the position of the mold before positioning,
   The control device is
   moving the moving body in the first direction until it passes the target position;
   after stopping the moving body in accordance with a reversal position located in the first direction relative to the target position, moving the moving body in a second direction opposite to the first direction;
   After stopping the moving body according to the temporary position located on the front side of the target position when viewed from the reversing position where the mold is temporarily stopped, moving the moving body in the second direction, move at an acceleration and deceleration that are smaller than the acceleration and deceleration when moving from the reverse position to the temporary position;
   7. The bending system according to claim 6, wherein a first process is performed to stop the moving body according to the target position.
9. The moving body includes left and right moving units that move independently in the left and right direction,
   The left and right moving units are
   The bending system according to claim 6 or 8, wherein the plurality of dies are moved collectively by holding the dies positioned at both left and right ends of the plurality of dies.
10. The control device is
    After temporarily stopping the left and right moving units according to the temporary position,
    moving one of the left and right moving units closer to the target position first, and stopping the one moving unit according to the target position;
    10. The method according to claim 9, wherein after the one moving unit is stopped according to the target position, the other moving unit of the left and right moving units is moved, and the other moving unit is stopped according to the target position. bending system.
11. The control device is
    7. The bending system according to any one of claims 1, 2, and 6, wherein the mold is moved in the lateral direction between holder grooves for inserting the mold in the mold holder.
12. The control device is
    The bending process according to any one of claims 1, 2, and 6, wherein the mold is removed from the mold holder, and then the mold is moved in the left-right direction on the front side or the rear side of the mold holder. system.
13. The control device is
    3. The mold is moved in the horizontal direction by moving the moving body in the horizontal direction while the mold holding member is inserted into the insertion hole provided in the mold, and 6. The bending system according to any one of claims 6.
14. The control device is
    7. The bending system according to any one of claims 1, 2, and 6, wherein the die is moved in the lateral direction by pressing the lateral end face of the die with the die holding member.
15. further comprising a mold rack provided adjacent to the press brake in the first direction and accommodating a plurality of the molds attachable to the mold holder;
    The control device is
    9. The bending system according to claim 2, wherein the movement of the movable body is controlled to exchange the molds between the mold holder and the mold rack.
16. A method of arranging a mold in which a mold is arranged in a mold holder provided on a table using a moving body movably provided on the rear or front side of a table extending in the left-right direction in a press brake ,
    moving the movable body holding the mold in the left-right direction toward a target position of the mold holder;
    After temporarily stopping the moving body at a position different from the target position, moving the moving body again;
    A method of arranging a mold, wherein the moving body is stopped according to the target position.

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