WO2023037799A1

WO2023037799A1 - High-frequency module

Info

Publication number: WO2023037799A1
Application number: PCT/JP2022/029828
Authority: WO
Inventors: 直樹郷地
Original assignee: 株式会社村田製作所
Priority date: 2021-09-08
Filing date: 2022-08-03
Publication date: 2023-03-16

Abstract

A high-frequency module (100) that comprises a dielectric substrate (10), a coating resin (20), an electronic component (21) that is installed via a plurality of bumps (40), and a plurality of conductor pillars (30). The plurality of conductor pillars (30) include a signal conductor pillar (31a) that is adjacent to the electronic component (21) and conducts a high-frequency signal and ground conductor pillars (32) that are adjacent to the signal conductor pillar (31a). The plurality of bumps (40) include ground bumps (41) that are connected to the ground conductor pillars (32). As seen from the direction orthogonal to the xy plane, the circle (R) that has its center (C) at the center axis of the signal conductor pillar (31a) and has a radius that is the distance from the center to the furthest point (P) on ground conductor pillar (32z) overlaps at least a portion of the ground bump (41a) that is closest to the signal conductor pillar (31a).

Description

high frequency module

The present invention relates to high frequency modules.

As a high frequency module in which a patch antenna for wireless communication and a high frequency circuit component are integrated, the patch antenna is arranged on the first main surface side of the dielectric substrate, and the patch antenna is arranged on the side opposite to the first main surface of the dielectric substrate. A configuration in which high-frequency elements (that is, high-frequency circuit components) are mounted on two main surfaces has been proposed (see Patent Document 1, for example). Further, the ground terminal provided on the second main surface side, when viewed from the direction perpendicular to the first main surface of the dielectric substrate, is oriented in the polarization direction of the high-frequency signal radiated or received by the patch antenna. It is positioned between the conductor post and the first side of the dielectric substrate closest to the signal conductor post. As a result, the ground terminal serves as a shield, and the isolation between the plurality of patch antennas and the signal conductor poles can be improved.

WO2018/173750

However, in the conventional configuration described above, if the high-frequency module is miniaturized, the characteristic impedance of the signal conductor column may deviate, resulting in deterioration of signal quality. Such a problem is particularly conspicuous in millimeter waves or the like in which high-frequency signals flow through the signal conductor posts.

The present invention is intended to solve the above problems, and aims to reduce the size of the high frequency module while suppressing the deviation of the characteristic impedance of the signal conductor column.

To achieve the above object, a high frequency module according to one aspect of the present invention includes a dielectric substrate, a coating resin provided on a first main surface of the dielectric substrate, a first An electronic component mounted on a main surface via a plurality of bumps, and a plurality of conductor columns arranged on the dielectric substrate through a coating resin in the thickness direction of the dielectric substrate. The plurality of conductor pillars includes a first signal conductor pillar adjacent to the electronic component and through which a high-frequency signal flows; one or more ground conductor pillars adjacent to the first signal conductor pillar and set to a ground potential; have The plurality of bumps has one or more ground bumps connected to one or more ground conductor posts. Assuming that the ground bump closest to the first signal conductor column among the one or more ground bumps is the first ground bump, when viewed from the direction perpendicular to the first main surface, the central axis of the first signal conductor column is the center, A circle whose radius is the distance from the center to the farthest point of the one or more ground conductor columns overlaps at least a portion of the first ground bump.

A high-frequency module according to another aspect of the present invention includes a dielectric substrate, a coating resin provided on a first main surface of the dielectric substrate, and a plurality of and a plurality of conductor columns arranged on the dielectric substrate through the coating resin in the thickness direction of the dielectric substrate. The plurality of conductor pillars includes a first signal conductor pillar adjacent to the electronic component and through which a high-frequency signal flows; one or more ground conductor pillars adjacent to the first signal conductor pillar and set to a ground potential; have The plurality of bumps has a signal bump connected to the first signal conductor post and one or more ground bumps connected to one or more ground conductor posts. Assuming that the ground bump closest to the first signal conductor column among the one or more ground bumps is the first ground bump, the distance between the first signal conductor column and the first ground bump when viewed from the direction perpendicular to the first main surface is The distance is less than the distance between the first signal conductor post and the signal bump.

In the high-frequency module according to one aspect of the present invention, the characteristic impedance of the signal conductor column arranged adjacent to the electronic component is adjusted not only by the ground conductor column but also by the ground bump on which the electronic component is mounted. Therefore, it is possible to reduce the size of the high-frequency module while suppressing the deviation of the characteristic impedance of the signal conductor column.

FIG. 1 is an external perspective view of a high frequency module according to Embodiment 1. FIG. 2A and 2B are a plan view and a cross-sectional view of a high-frequency module according to Embodiment 1. FIG. 3 is a first partial plan view of the high-frequency module according to Embodiment 1. FIG. FIG. 4 is a second partial plan view of the high-frequency module according to Embodiment 1. FIG. 5 is a third partial plan view of the high-frequency module according to Embodiment 1. FIG. 6 is a plan view of a high-frequency module according to Modification 1 of Embodiment 1. FIG. 7A and 7B are a plan view and a cross-sectional view of a high-frequency module according to Modification 2 of Embodiment 1. FIG. FIG. 8 is a partial plan view of a high frequency module according to Embodiment 2. FIG. FIG. 9 is a partial plan view of a high frequency module according to Embodiment 3. FIG. FIG. 10 is a partial plan view of a high frequency module according to Embodiment 4. FIG. 11A and 11B are a plan view and a cross-sectional view of a high-frequency module according to Embodiment 5. FIG. 12 is a cross-sectional view showing a modification of the high-frequency module according to Embodiment 1. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the embodiments described below are all comprehensive or specific examples. Numerical values, shapes, materials, constituent elements, arrangement of constituent elements, connection forms, and the like shown in the following embodiments are examples, and are not intended to limit the present invention. Among the constituent elements in the following embodiments, constituent elements not described in independent claims will be described as optional constituent elements. Also, the sizes, or size ratios, of components shown in the drawings are not necessarily exact. Moreover, in each figure, the same code|symbol is attached|subjected with respect to substantially the same structure, and the overlapping description may be abbreviate|omitted or simplified.

(Embodiment 1)
1 to 5 are diagrams showing the structure of a high frequency module 100 according to Embodiment 1. FIG. Specifically, FIG. 1 is an external perspective view of a high-frequency module 100 according to Embodiment 1. FIG. 2A and 2B are a plan view and a cross-sectional view of the high-frequency module 100 according to the first embodiment. More specifically, (a) of FIG. 2 is a cross-sectional view, and (b) of FIG. 2 is a cross-sectional view taken along line IIb-IIb of (a) of FIG. 2 is a plan view of the high-frequency module 100 viewed from the upper surface side (z-axis plus side in the drawing). FIG. FIG. 3 is a first partial plan view of the high frequency module 100 according to Embodiment 1. FIG. FIG. 4 is a second partial plan view of the high frequency module 100 according to the first embodiment. FIG. 5 is a third partial plan view of the high frequency module 100 according to the first embodiment. Although FIGS. 3 to 5 show the same arrangement, the figures are shown separately because the method of expressing the arrangement is different.

Hereinafter, the thickness direction of the high-frequency module 100 will be described as the z-axis direction, and the directions perpendicular to the z-axis direction and mutually orthogonal to each other will be described as the x-axis direction and the y-axis direction, respectively. ) side. However, in actual use, the thickness direction of the high-frequency module 100 may not be the vertical direction, so the upper surface side of the high-frequency module 100 is not limited to the upward direction. Further, in the present embodiment, the high-frequency module 100 and the electronic component described later have a substantially rectangular flat plate shape, and the x-axis direction and the y-axis direction are parallel to two adjacent side surfaces of the high-frequency module 100 and the electronic component. is the direction. The shape of the high-frequency module 100 is not limited to this, and may be, for example, a substantially circular flat plate shape. .

In addition, in FIG. 2(a), strictly speaking, for the sake of simplicity, there are cases where constituent elements on different cross sections are shown in the same drawing, or where illustration of constituent elements on the same cross section is omitted. be.

As shown in FIG. 1, the high frequency module 100 includes a dielectric substrate 10 and a coating resin 20 provided on the dielectric substrate 10. As shown in FIG. Moreover, as shown in FIG. 2, the high frequency module 100 includes an electronic component 21 and a plurality of conductor posts 30 including a signal conductor post 31 and a ground conductor post 32 . Electronic component 21 is mounted on dielectric substrate 10 via a plurality of bumps 40 including ground bumps 41 and signal bumps 42 . In this embodiment, the plurality of conductor posts 30 further includes dummy conductor posts 33 .

Each member constituting the high-frequency module 100 will be specifically described below with reference to FIG.

The dielectric substrate 10 is made of a dielectric material. In this embodiment, the dielectric substrate 10 has a substantially rectangular flat plate shape having an upper surface 10a and a lower surface 10b, and is, for example, a multi-layer substrate formed by laminating a plurality of dielectric layers. Note that the dielectric substrate 10 is not limited to this, and may have, for example, a substantially circular flat plate shape, or may be a single-layer substrate.

The dielectric substrate 10 has connection terminals 11 , wirings 12 , and interlayer connection conductors 13 . The connection terminals 11 and the wirings 12 are conductor patterns, and the interlayer connection conductors 13 are conductors connected to the connection terminals 11 and the wirings 12 . The connection terminal 11 is connected to the signal conductor column 31 and the ground conductor column 32 , and the wiring 12 is connected to the connection terminal 11 via the interlayer connection conductor 13 .

The wiring 12 may be arranged in the inner layer of the dielectric substrate 10, or may be arranged on the upper surface 10a or the lower surface 10b of the dielectric substrate 10. FIG. That is, the interlayer connection conductor 13 is not an essential component.

As such a dielectric substrate 10, for example, a low temperature co-fired ceramics (LTCC) substrate, a printed circuit board, or the like is used.

The coating resin 20 is provided on the lower surface 10b, which is an example of the first main surface of the dielectric substrate 10, and is made of a resin that seals the electronic component 21. In this embodiment, the coating resin 20 is provided on the lower surface 10b of the dielectric substrate 10, and includes four side surfaces that are flush with the side surfaces of the dielectric substrate 10 and one surface that is substantially parallel to the lower surface 10b of the dielectric substrate 10. It has two lower surfaces and is provided on the entire lower surface 10b of the dielectric substrate 10 . That is, in the present embodiment, electronic component 21 and multiple conductor posts 30 are embedded in coating resin 20 . In other words, the electronic component 21 , the plurality of conductor columns 30 and the plurality of bumps 40 are covered with the coating resin 20 except for the lower surfaces of the plurality of conductor columns 30 .

Although the material of such coating resin 20 is not particularly limited, for example, epoxy or polyimide resin is used.

The shape of the coating resin 20 is not limited to the above, and may have a side surface located inside or outside the side surface of the dielectric substrate 10, or may have a stepped lower surface. Moreover, the coating resin 20 may not be in direct contact with the lower surface 10b of the dielectric substrate 10, and an insulating film or the like may be provided between the lower surface 10b and the lower surface 10b.

The electronic component 21 is located inside the coating resin 20 and mounted on the lower surface 10b of the dielectric substrate 10. The electronic component 21 is a circuit component electrically connected to other electronic components and the like, and is, for example, a power amplifier that amplifies and outputs an input high frequency signal. Electronic component 21 is mounted on bottom surface 10b of dielectric substrate 10 via a plurality of bumps 40 .

In the present embodiment, the electronic component 21 has through conductors 22 that pass through the electronic component 21 and are connected to ground bumps 41, which will be described later. Although the material of the penetrating conductor 22 is not particularly limited, for example, copper or the like with high conductivity (ie, low resistance) is used. Note that the electronic component 21 does not have to have the penetrating conductor 22 . The shape of the through conductor 22 is not particularly limited. As shown in FIG. 21 may be divided into a plurality of conductors such that the upper surface 21a and the lower surface 21b of 21 are electrically connected.

Further, the high-frequency module 100 is positioned inside the coating resin 20, and among the surfaces of the electronic component 21, the surface opposite to the surface (the upper surface 21a in FIG. 2) on which the plurality of bumps 40 are arranged (the upper surface 21a in FIG. It further has a connection conductor 23 arranged on the lower surface 21 b ) and connected to the through conductor 22 . Note that the high-frequency module 100 may not have the connection conductor 23 .

The plurality of conductor pillars 30 includes signal conductor pillars 31 , ground conductor pillars 32 and dummy conductor pillars 33 . The plurality of conductor columns 30 penetrate the coating resin 20 in the thickness direction of the dielectric substrate 10 and are arranged in a matrix on the dielectric substrate 10 around the electronic component 21 .

The signal conductor column 31 is a conductor that transmits a signal such as a control signal or a high frequency signal between the electronic component 21 and the mother board or the like on which the high frequency module 100 is mounted. The signal conductor post 31 is electrically connected to the electronic component 21 via the wiring 12 of the dielectric substrate 10 and the signal bump 42 on which the electronic component 21 is mounted. The ground conductor pillar 32 is a conductor set to a ground potential. The ground conductor post 32 is electrically connected to the electronic component 21 via the wiring 12 of the dielectric substrate 10 and the ground bump 41a on which the electronic component 21 is mounted. The ground conductor pillars 32 may be electrically connected to the ground bumps 41a by mounting the high-frequency module 100 on a mother board or the like. The dummy conductor post 33 is a conductor for ensuring mechanical connection strength when mounting the high frequency module 100 on a mother board or the like, and is an independent conductor that is not electrically connected to others in the high frequency module 100 .

Even if each conductor column 30 is not numbered in the drawing, if the hatching is the same as that of the numbered conductor column, it indicates the same type of conductor column.

In the present embodiment, a plurality of signal conductor columns 31, ground conductor columns 32, and dummy conductor columns 33 are all provided, but the number of each is not particularly limited, and may be one or more.

Although the material of the plurality of conductor columns 30 is not particularly limited, for example, copper with high conductivity is used. Moreover, in the present embodiment, the plurality of conductor columns 30 are configured in a columnar shape, but the shape and dimensions are not particularly limited. For example, the plurality of conductor pillars 30 may have a prismatic shape, or a tapered shape with a substantially circular or substantially rectangular cross section, or some of the conductor pillars 30 may be thinner than the other conductor pillars 30 .

The upper end of each conductor column 30 may be embedded in the dielectric substrate 10, or may not be in direct contact with the lower surface 10b of the dielectric substrate 10. 10b.

The plurality of bumps 40 are, as described above, a conductive bonding material for mounting the electronic component 21 on the lower surface 10b of the dielectric substrate 10, such as solder. The plurality of bumps 40 includes a ground bump 41 set to a ground potential, and a signal bump 42 connected to the signal conductor pillar 31 via the wiring 12 and through which a high frequency signal flows. The cross section of each bump 40 is not limited to a circular shape, and may be, for example, an elliptical shape.

The high-frequency module 100 configured as described above is, for example, an amplification module that amplifies and outputs an input high-frequency signal. Specifically, a high-frequency signal input to the high-frequency module 100 is input to the electronic component 21 via a certain signal conductor post 31 . A high-frequency signal amplified by the electronic component 21 is output from the high-frequency module 100 via another signal conductor column 31 .

In such a high-frequency module 100, the frequency of the high-frequency signal flowing through the signal conductor column 31 is several hundred MHz band or higher, and may be in the millimeter wave band. Therefore, in order to suppress the deterioration of signal quality, it is necessary to suppress the deviation of the characteristic impedance of the signal conductor column 31 through which the high frequency signal flows. In particular, from the viewpoint of matching with the input impedance or output impedance of the electronic component 21, it is important to suppress the deviation of the characteristic impedance at the end of the signal conductor column 31 on the dielectric substrate 10 side.

As a configuration for suppressing the deviation of the characteristic impedance of the signal conductor column 31, for example, a configuration in which a plurality of ground conductor columns 32 are arranged so as to surround the signal conductor column 31 is conceivable. However, such a configuration requires a space for arranging a large number of conductor columns, which hinders miniaturization of the high-frequency module.

Therefore, in the present embodiment, in order to reduce the size of the high-frequency module 100 while suppressing the deviation of the characteristic impedance of the signal conductor column 31, the signal conductor column 31 arranged adjacent to the electronic component 21 is provided with a ground conductor. The characteristic impedance is adjusted using not only the pillar 32 but also the ground bump 41 on which the electronic component 21 is mounted.

Hereinafter, the signal conductor column 31 through which the high-frequency signal flows will be particularly referred to as the signal conductor column 31a, and the details thereof will be described with reference to FIGS. 3 and 4. FIG.

As shown in FIG. 3, the electronic component 21 in the present embodiment has a side S1 parallel to the y-axis and sides S2 and S4 parallel to the x-axis when viewed from the direction perpendicular to the xy plane.

As shown in FIG. 3, when viewed perpendicularly to the xy plane, the central axis of the signal conductor column 31a is the center C, and the ground conductor column 32 arranged adjacent to the signal conductor column 31a from the center C is the farthest from the center C. A circle R whose radius is the distance to the point P overlaps at least a portion of the ground bump 41 .

In FIG. 3, as the ground conductor pillars 32 adjacent to the signal conductor pillar 31a, a ground conductor pillar 32a located on the y-axis plus side, a ground conductor pillar 32b located on the y-axis minus side, and a ground conductor pillar 32b located on the x-axis minus side are shown. A column 32c and a ground conductor column 32z positioned obliquely on the negative side of the x-axis and the positive side of the y-axis are arranged. Here, the farthest point P from the center C is the end of the ground conductor pillar 32z farthest from the center C among the four ground conductor pillars 32a to 32c, 32z arranged adjacent to the signal conductor pillar 31a. It is part.

In this embodiment, the circle R overlaps the entire ground bump 41, and in FIG. overlaps with

As described above, with respect to the signal conductor column 31a arranged adjacent to the electronic component 21, the ground bump 41 is arranged at a position overlapping the circle R including the ground conductor column 32z with the signal conductor column 31a as the center. , the characteristic impedance is adjusted not only by the ground conductor pillars 32z but also by the ground bumps 41 on which the electronic component 21 is mounted. Therefore, miniaturization of the high-frequency module 100 can be achieved while suppressing the deviation of the characteristic impedance of the signal conductor column 31a.

The signal conductor pillar 31a and the ground bump 41a respectively correspond to the "first signal conductor pillar" and the "first ground bump" in the present disclosure.

Moreover, the circle R only needs to overlap at least a part of the ground bump 41a arranged closest to the signal conductor post 31a. At the same time, miniaturization of the high-frequency module 100 is achieved. However, as in the present embodiment, by overlapping the entire ground bump 41a with the circle R, it is possible to further suppress the deviation of the characteristic impedance of the signal conductor column 31a.

Further, according to the present embodiment, as shown in FIG. 3, the ground bump 41a is positioned between the signal conductor post 31a and the signal conductor post 31a among the sides S1, S2, and S4 of the electronic component 21 when viewed from the direction perpendicular to the xy plane. It may be arranged on the nearest side S1. As a result, the ground bump 41a is arranged at a position closer to the signal conductor column 31a, so that the deviation of the characteristic impedance of the signal conductor column 31a is further suppressed.

Also, according to the present embodiment, as shown in FIG. 3, another ground bump 41b is arranged adjacent to the ground bump 41a. In other words, no signal bump 42 is arranged between the ground bumps 41a and 41b. This makes it easier to adjust the characteristic impedance of the signal conductor column 31a, thereby further suppressing the deviation of the characteristic impedance of the signal conductor column 31a. Note that the ground bump 41b corresponds to the "second ground bump" in the present disclosure.

Further, according to the present embodiment, as shown in FIG. 3, the

ground conductor columns

32a and 32b are arranged so that the signal conductor column 31a is positioned between them. In other words, the

ground conductor pillars

32a and 32b and the signal conductor pillar 31a overlap when viewed in a direction parallel to the y-axis in which the

ground conductor pillars

32a and 32b are arranged. By arranging the

ground conductor pillars

32a and 32b so as to sandwich the signal conductor pillar 31a in this way, it becomes easier to adjust the characteristic impedance of the signal conductor pillar 31a. is further suppressed. The

ground conductor pillars

32a and 32b respectively correspond to the "first ground conductor pillar" and the "second ground conductor pillar" in the present disclosure.

Here, when viewed in a direction parallel to the direction in which the

ground conductor pillars

32a and 32b are arranged, the entire signal conductor pillar 31a may overlap the

ground conductor pillars

32a and 32b. Part of it does not have to overlap with the

ground conductor columns

32a and 32b.

Further, according to the present embodiment, as shown in FIG. 3, the ground bump 41a and the ground conductor column 32c are arranged so that the signal conductor column 31a is positioned between them. In other words, the ground conductor pillar 32c and the ground bump 41a may overlap with the signal conductor pillar 31a when viewed in a direction parallel to the x-axis in which the ground conductor pillar 32c and the ground bump 41a are arranged. By arranging the ground conductor column 32c and the ground bump 41a so as to sandwich the signal conductor column 31a in this way, it becomes easier to adjust the characteristic impedance of the signal conductor column 31a. is further suppressed. Note that the ground conductor pillar 32c corresponds to the "third ground conductor pillar" in the present disclosure.

Here, when viewed in a direction parallel to the direction in which the ground conductor pillar 32c and the ground bump 41a are arranged, the entire signal conductor pillar 31a may overlap the ground conductor pillar 32c and the ground bump 41a. may not overlap with the ground conductor posts 32a and 32b.

Further, according to the present embodiment, as shown in FIG. 3, when viewed from the direction perpendicular to the xy plane, the

ground conductor pillars

32a and 32b extend along the side S1 of the electronic component 21 in a direction parallel to the y-axis. , the signal conductor post 31a is positioned between them. The ground conductor pillar 32c is arranged adjacent to the signal conductor pillar 31a in the direction parallel to the y-axis orthogonal to the side S1 of the electronic component 21. As shown in FIG. The ground conductor pillar 32z is arranged adjacent to the signal conductor pillar 31a in a direction different from the x-axis and the y-axis. Thus, by arranging the plurality of ground conductor columns 32a to 32c and 32z so as to surround the signal conductor column 31a, it becomes easier to adjust the characteristic impedance of the signal conductor column 31a. It is possible to further suppress the deviation of the characteristic impedance. Note that the x-axis direction and the y-axis direction correspond to the "first direction" and the "second direction" in the present disclosure, respectively, and the direction different from the x-axis and the y-axis when viewed from a direction perpendicular to the xy plane is It corresponds to the "third direction" in the present disclosure. Also, the signal conductor column 31z corresponds to the "fourth ground conductor column" in the present disclosure.

Further, according to the present embodiment, the ground bumps 41a and 41b are arranged on the side S1 closest to the signal conductor column 31a of the electronic component 21 when viewed from the direction perpendicular to the xy plane. As a result, the two adjacent ground bumps 41a and 41b are arranged at positions closer to the signal conductor post 31a, which makes it easier to adjust the characteristic impedance of the signal conductor post 31a. Impedance deviation is further suppressed.

Further, according to the present embodiment, as shown in FIG. 4, the signal conductor post 31 has a signal conductor post 31b through which a high-frequency signal different from that of the signal conductor post 31a flows. At least one ground conductor pillar 32 (ground conductor pillar 32b in FIG. 4) is arranged between the signal conductor pillar 31a and the signal conductor pillar 31b. Thereby, it is possible to ensure the isolation of the two types of high-frequency signals. The signal conductor pole 31b corresponds to the "second signal conductor pole" in the present disclosure.

Further, according to the present embodiment, as shown in FIG. 5, it has a signal bump 42a which is the signal bump 42 connected to the signal conductor post 31a. When viewed from the direction perpendicular to the xy plane, the distance A1 between the signal conductor post 31a and the nearest ground bump 41a is smaller than the distance A2 between the signal conductor post 31a and the signal bump 42a.

As described above, for the signal conductor post 31a arranged adjacent to the electronic component 21, the ground bump 41 is arranged closer than the signal bump 42a connected to the signal conductor post 31a. The characteristic impedance is adjusted not only by the ground conductor columns 32a to 32c and 32z arranged adjacent to 31a, but also by the ground bumps 41 on which the electronic component 21 is mounted. Therefore, miniaturization of the high-frequency module 100 can be achieved while suppressing the deviation of the characteristic impedance of the signal conductor column 31a.

Further, according to the present embodiment, the electronic component 21 penetrates through the electronic component 21 to establish the positional relationship between the signal conductor column 31a and the ground conductor column 32 as shown in FIGS. It has through conductors 22 connected to bumps 41 . As a result, the penetrating conductor 22 connected to the ground potential faces the signal conductor column 31a, so that the characteristics of the signal conductor column 31a can be obtained not only at the end of the signal conductor column 31a on the dielectric substrate 10 side but also over a wide range. Impedance deviation can be suppressed.

Further, according to the present embodiment, the connection conductor 23 connected to the through conductor 22 is further provided in order to establish the positional relationship with the signal conductor column 31a and the ground conductor column 32 as shown in FIGS. . As a result, the through conductor 22 and the connection conductor 23 connected to the ground potential are opposed to the signal conductor column 31a, thereby suppressing the deviation of the characteristic impedance over the entire signal conductor column 31a.

(Modification 1 of Embodiment 1)
FIG. 6 is a plan view of a high-frequency module 101 according to Modification 1 of Embodiment 1. FIG. The high frequency module 101 differs from the high frequency module 100 in the arrangement of the plurality of conductor columns 30 . Specifically, as shown in FIG. 6, the plurality of conductor columns 30 may be arranged in a zigzag pattern.

(Modification 2 of Embodiment 1)
7A and 7B are a plan view and a cross-sectional view of a high-frequency module 102 according to Modification 2 of Embodiment 1. FIG. The high-frequency module 102 differs from the high-frequency module 100 in the arrangement of the plurality of conductor columns 30 . Specifically, as shown in FIG. 7 , the plurality of conductor columns 30 may be arranged in only one row around the electronic component 21 .

(Embodiment 2)
FIG. 8 is a partial plan view of the high frequency module 103 according to the second embodiment.

The high-frequency module 103 differs from the high-frequency module 100 in that it has ground bumps 41z instead of the ground bumps 41a.

The ground bump 41z has a major axis B1 and a minor axis B2 with different lengths as viewed from the direction perpendicular to the xy plane, as shown in FIG. In other words, the ground bump 41z has an elliptical cross section, not a perfect circle, when viewed from the direction perpendicular to the xy plane. Long axis B<b>1 extends along side S<b>1 of electronic component 21 .

As a result, the area of the ground bump 41z facing the signal conductor column 31a is increased, so the effect on the characteristic impedance of the signal conductor column 31a is increased. Therefore, even if it is difficult to dispose the ground bump 41z close to the signal conductor column 31a, it is possible to suppress the deviation of the characteristic impedance of the signal conductor column 31a.

Note that the ground bump 41 different from the ground bump 41z may also have an elliptical cross section when viewed from the direction perpendicular to the xy plane.

(Embodiment 3)
FIG. 9 is a partial plan view of high frequency module 104 according to the third embodiment.

The high frequency module 104 differs from the high frequency module 100 in the distance between the signal conductor post 31a and other members.

In this embodiment, if the distance between the signal conductor post 31a and the ground conductor post 32c is A3, and the distance between the signal conductor post 31a and the ground bump 41a is A4, then A3 is larger than A4.

The bumps 40 on which the electronic components 21 are mounted are often smaller in size than the conductor posts 30 penetrating the coating resin 20 . Therefore, by arranging the ground bump 41a at a position closer to the signal conductor pillar 31a than the ground conductor pillar 32c, the strength of the electromagnetic field coupling with the signal conductor pillar 31a can be brought closer between the ground conductor pillar 32c and the ground bump 41a. can be done. As a result, variations in ground strength around the signal conductor post 31a are reduced, so that high-frequency signal loss can be reduced.

The ground bump 41a may be arranged at a position closer to the signal conductor pillar 31a than the ground conductor pillar 32, not only to the ground conductor pillar 32c, but also to other ground conductor pillars 32 adjacent to the signal conductor pillar 31a. .

(Embodiment 4)
FIG. 10 is a partial plan view of high frequency module 105 according to the fourth embodiment.

The high frequency module 105 differs from the high frequency module 100 in the distance between the signal conductor column 31a and the ground bump 41a.

When viewed from the direction perpendicular to the xy plane, the distance between the signal conductor post 31a and the ground bump 41a is A5, and the maximum diameter of the signal conductor post 31a is A6, A5 is smaller than A6.

As a result, the effect of the ground bump 41a on the characteristic impedance of the signal conductor column 31a can be increased, so that the deviation of the characteristic impedance of the signal conductor column 31a can be further suppressed.

(Embodiment 5)
The high-frequency module described so far can be applied to an antenna module having an antenna. Embodiment 5 describes a high-frequency module applied to an antenna module. 11A and 11B are a plan view and a cross-sectional view of a high-frequency module 106 according to Embodiment 5. FIG.

The high frequency module 106 differs from the high frequency module 100 in that it has an antenna 50 .

The high-frequency module 106 is an antenna module having an antenna 50 on the top surface 10a side of the dielectric substrate 10 . Antenna 50 includes multiple patch antennas 51 that radiate or receive high frequency signals. The electronic component 21 is, for example, an RFIC (Radio-Frequency Integrated Circuit) electrically connected to a plurality of patch antennas 51, and up-converts a high-frequency signal input via the signal conductor pole 31 into a plurality of patch antennas. 51 radiates to the outside.

According to such a high-frequency module 106, it is suitable as a low-loss and compact antenna module, especially for a millimeter wave band.

(Modification)
FIG. 12 is a cross-sectional view showing a modification of the high frequency module 100 according to the first embodiment. In a modified example, electronic component 21 is shielded by conductive member 60 . Conductive member 60 is electrically connected to ground bump 41 . Furthermore, the conductive member 60 is connected to a conductive heat dissipation member 70 . Regarding other configurations, the modified example has the same configuration as the high-frequency module 100 shown in FIG. According to the modification, the ground around the signal conductor column 31 can be further stabilized.

(Other embodiments)
Although the high-frequency modules according to the embodiments and modifications of the present invention have been described above, the present invention is not limited to the above-described embodiments and modifications thereof. Another embodiment realized by combining arbitrary constituent elements in the above embodiment, and a modification obtained by applying various modifications that a person skilled in the art can think of without departing from the scope of the present invention to the above embodiment Examples and various devices incorporating the high-frequency module of the present disclosure are also included in the present invention.

Also, in the above description, the high-frequency module has the coating resin 20, and the plurality of conductor columns 30 pass through the coating resin 20. However, the high-frequency module may not have the coating resin 20, and the plurality of conductor columns 30 are pattern electrodes provided on the second main surface side (for example, on the second main surface) of the dielectric substrate 10. It may be an electrode. A high-frequency module configured in this way can be mounted on a mother board or the like having a cavity structure by means of a plurality of conductor posts 30 .

In addition, in the description of the above embodiment and its modifications, the present invention does not limit the arrangement position, arrangement, type, number, etc. of conductor posts other than the specific conductor posts with reference numerals. The present invention also includes modifications that can be made by those skilled in the art without departing from the gist of the present invention.

10 Dielectric substrate 11 Connection terminal 12 Wiring 13 Interlayer connection conductor 20 Coating resin 21

Electronic components

10a,

21a Upper surface

10b, 21b Lower surface 22 Through conductor 23 Connection conductor 30

Conductor column

31, 31a, 31b

Signal conductor column

32, 32a, 32b, 32c, 32z ground conductor post 33 dummy conductor post 40

bumps

41, 41a, 41b ground bump 42 signal bump 50 antenna 51 patch antenna 60 conductive member 70

heat dissipation member

100, 101, 102, 103, 104, 105, 106 high frequency module

Claims

a dielectric substrate;
a coating resin provided on the first main surface of the dielectric substrate;
an electronic component located inside the coating resin and mounted on the first main surface via a plurality of bumps;
a plurality of conductor columns arranged on the dielectric substrate through the coating resin in the thickness direction of the dielectric substrate;
with
The plurality of conductor pillars includes a first signal conductor pillar adjacent to the electronic component and through which a high-frequency signal flows, and one or more ground conductors adjacent to the first signal conductor pillar and set to a ground potential. having a pillar and
The plurality of bumps have one or more ground bumps connected to the one or more ground conductor posts,
If the ground bump closest to the first signal conductor column among the one or more ground bumps is the first ground bump,
When viewed in a direction perpendicular to the first main surface, a circle centered on the central axis of the first signal conductor pillar and having a radius equal to the distance from the center to the farthest point of the one or more ground conductor pillars is , overlaps at least a portion of the first ground bump;
high frequency module.
When viewed from a direction perpendicular to the first main surface, the circle overlaps the entire first ground bump.
The high frequency module according to claim 1.
When viewed from a direction perpendicular to the first main surface, the first ground bump is arranged on a side of the electronic component that is closest to the first signal conductor column,
The high frequency module according to claim 1 or 2.
The one or more ground conductor pillars have a first ground conductor pillar and a second ground conductor pillar arranged such that the first signal conductor pillar is positioned therebetween.
The high frequency module according to any one of claims 1 to 3.
The one or more ground conductor pillars are arranged such that the first signal conductor pillar is positioned between the one or more ground conductor pillars and one of the one or more ground bumps. having a third ground conductor post,
The high frequency module according to any one of claims 1 to 4.
When viewed from a direction perpendicular to the first main surface, the one or more ground conductor columns are
A first ground conductor pillar and a second ground conductor pillar arranged such that the first signal conductor pillar is positioned between them in a first direction along a side of the electronic component that is closest to the first signal conductor pillar. a ground conductor post;
a third ground conductor pole arranged adjacent to the first signal conductor pole in a second direction orthogonal to the first direction;
a fourth ground conductor post arranged adjacent to the first signal conductor post in a third direction different from the first direction and the second direction;
The high frequency module according to any one of claims 1 to 3.
The electronic component has one or more through conductors penetrating the electronic component and connected to the one or more ground bumps.
The high frequency module according to any one of claims 1 to 6.
further comprising a connection conductor located inside the coating resin, arranged on a surface of the electronic component opposite to the surface on which the plurality of bumps are arranged, and connected to the through conductor;
The high frequency module according to claim 7.
The one or more ground bumps further have a second ground bump adjacent to the first ground bump,
The high frequency module according to any one of claims 1 to 8.
When viewed from a direction perpendicular to the first main surface, the first ground bump and the second ground bump are arranged on the side closest to the first signal conductor column among the sides of the electronic component,
The high frequency module according to claim 9.
When viewed from a direction perpendicular to the first main surface, the distance between the first signal conductor column and the one or more ground conductor columns is greater than the distance between the first signal conductor column and the first ground bump,
The high frequency module according to any one of claims 1 to 9.
further comprising a second signal conductor pole through which a high-frequency signal different from that of the first signal conductor pole flows;
at least one of the one or more ground conductor pillars is arranged to be positioned between the first signal conductor pillar and the second signal conductor pillar;
The radio frequency module according to any one of claims 1 to 11.
When viewed from a direction perpendicular to the first main surface, the distance between the first signal conductor post and the first ground bump is smaller than the maximum diameter of the first signal conductor post.
The radio frequency module according to any one of claims 1 to 12.
further comprising an antenna including a plurality of patch antennas arranged on the side of the second main surface opposite to the first main surface and for radiating or receiving high frequency signals;
the electronic component is electrically connected to the plurality of patch antennas;
A high frequency module according to any one of claims 1 to 13.
a dielectric substrate;
a coating resin provided on the first main surface of the dielectric substrate;
an electronic component located inside the coating resin and mounted on the first main surface via a plurality of bumps;
a plurality of conductor columns arranged on the dielectric substrate through the coating resin in the thickness direction of the dielectric substrate;
with
The plurality of conductor pillars includes a first signal conductor pillar adjacent to the electronic component and through which a high-frequency signal flows, and one or more ground conductors adjacent to the first signal conductor pillar and set to a ground potential. having a pillar and
The plurality of bumps has a signal bump connected to the first signal conductor pillar and one or more ground bumps connected to the one or more ground conductor pillars,
If the ground bump closest to the first signal conductor column among the one or more ground bumps is the first ground bump,
When viewed from a direction perpendicular to the first main surface, the distance between the first signal conductor post and the first ground bump is smaller than the distance between the first signal conductor post and the signal bump.
high frequency module.