WO2023036611A1

WO2023036611A1 - Hob apparatus

Info

Publication number: WO2023036611A1
Application number: PCT/EP2022/073550
Authority: WO
Inventors: Alejandro DEL CUETO BELCHI; Jorge Felices Betran; Manuel Fernandez Martinez; Carlos Franco Gutierrez; Jose Miguel Gil Narvion; Pablo Jesus Hernandez Blasco; Eduardo Imaz Martinez; Paul Muresan; Jose Manuel Palacios Gasos; Alberto Perez Bosque; Diego Puyal Puente; Javier SERRANO TRULLEN
Original assignee: BSH Hausgeräte GmbH
Priority date: 2021-09-07
Filing date: 2022-08-24
Publication date: 2023-03-16

Abstract

The invention proceeds from a hob apparatus (10a; 10b), in particular induction hob apparatus, having a plurality of printed circuit boards (12a), on each of which at least one sensor unit (14a; 14b) for detecting a sensor signal and an electronic signal processing unit (16a; 16b) for further processing and/or evaluation of the sensor signal are collectively arranged. To improve efficiency, it is proposed that the hob apparatus (10a; 10b) comprise at least one data line (18a; 18b) that connects at least one of the printed circuit boards (12a; 12b) to at least one other of the printed circuit boards (12a; 12b) and is provided for the interchange of data between at least two of the signal processing units (16a; 16b).

Description

hob device

The invention relates to a hob device according to the preamble of claim 1 and a method for operating a hob device according to the preamble of claim 12.

Hobs with sensors, which are provided, for example, for detecting cookware or a temperature, are already known from the prior art. In some known configurations, a sensor is arranged on a circuit board. A signal detected by the sensor is forwarded from the circuit board by means of electrical contacts, for example via a circuit board connector, to a unit arranged outside the circuit board, for example a microprocessor, and then processed and evaluated there. The disadvantage of such solutions is that a circuit board connector with a large number of electrical contacts is required to forward the signal detected by the sensor, which results in considerable additional costs. Solutions are therefore also known from the prior art in which a sensor for detecting a sensor signal and a microprocessor for evaluating the sensor signal are arranged on a common printed circuit board, so that the evaluated sensor signals, which have smaller amounts of data than the raw data, are subsequently forwarded to a central control unit, which means that less expensive circuit board connectors can be used due to the lower data volumes. The disadvantage here, however, is that in the case of a plurality of printed circuit boards, each with one sensor and one microprocessor each, a large number of data lines are required in order to connect the printed circuit boards to the central control unit or a central data line. In this case, too, there are additional costs and/or additional outlay in production, and the efficiency of such hobs is therefore severely restricted.

The object of the invention consists in particular, but not limited thereto, in providing a generic device with improved properties in terms of efficiency. The object is achieved according to the invention by the features of claims 1 and 12, while advantageous configurations and developments of the invention can be found in the dependent claims. The invention is based on a hob device, in particular an induction hob device, with a plurality of printed circuit boards on which at least one sensor unit for detecting a sensor signal and an electronic signal processing unit for further processing and/or evaluating the sensor signal are jointly arranged.

It is proposed that the hob device has at least one data line, which connects at least one of the printed circuit boards to at least one other printed circuit board and is provided for exchanging data between at least two of the signal processing units.

Such a configuration can advantageously provide a hob device with improved properties in terms of efficiency. A particularly efficient evaluation of sensor signals can advantageously be achieved. In addition, a particularly high degree of flexibility can advantageously be achieved, since any number of printed circuit boards can be combined particularly easily to form an individual sensor layout for a specific hob. Furthermore, a hob device can advantageously be provided which is particularly robust against failures of individual signal processing units, since in the event of a failure a sensor signal can be further processed and/or evaluated on a further signal processing unit on another of the printed circuit boards. Furthermore, a susceptibility to errors can advantageously be reduced in that further processing and/or evaluation of individual sensor signals can be carried out by a number of the signal processing units and thus checked. Furthermore, efficiency can advantageously be increased in that free computing capacities of individual signal processing units can be used for other tasks, while no further processing and/or evaluation of sensor signals takes place. A particularly fast, reliable and efficient signal processing can thus be achieved by the hob device according to the invention.

A “cooktop device”, in particular an “induction cooktop device”, should be understood to mean at least a part, in particular a subassembly, of a cooktop, in particular an induction cooktop. The hob device could, for example, have at least one support plate, in particular at least one hob plate, which could be provided, for example, for setting up cookware, in particular for the purpose of heating the cookware. the cooking Field device, in particular the induction hob device, can also include the entire hob, in particular the entire induction hob. The hob device is preferably designed as an induction hob device. Alternatively, however, it would also be conceivable for the hob device to be part of another type of hob, for example a glass ceramic hob or the like.

The hob device preferably has a heating unit with a plurality of heating elements. A “heating unit” should be understood to mean a unit which has a plurality of at least two heating elements, with at least one of the heating elements providing energy to at least one object, for example a cooking utensil, in at least one operating state. The heating elements of the heating unit could, for example, be in the form of a thermal radiation heating element for a glass-ceramic hob and, in the operating state, provide energy in the form of thermal radiation to the object. The heating unit is preferably designed as an induction heating unit and has at least one heating element, which is designed as an induction heating element. The heating element designed as an induction heating element is intended to provide energy to the object in the operating state in the form of an alternating electromagnetic field, advantageously for the purpose of inductive energy transmission. The heating unit advantageously has at least three, particularly advantageously at least four, preferably at least eight and particularly preferably a large number of heating elements. The heating elements of the heating unit can be distributed, for example distributed in a matrix. The heating elements are preferably arranged underneath a hob plate, for example a glass ceramic plate, the hob device and/or the hob having the hob device. In the present document, position designations such as “below” or “above” refer to an assembled state of the hob plate, unless this is explicitly described otherwise.

The hob device has a plurality of at least two, in particular at least three, advantageously at least four, preferably at least five and particularly preferably at least six printed circuit boards, and could have any number of more than six printed circuit boards. At least one sensor unit and at least one signal processing unit are arranged on each of the printed circuit boards. It would be conceivable for more than one sensor unit to be arranged on at least one of the printed circuit boards is. In addition, it would also be conceivable for more than one signal processing unit to be arranged on at least one of the printed circuit boards. Exactly one signal processing unit is preferably arranged on each of the printed circuit boards. At least one of the printed circuit boards, in particular each of the printed circuit boards, could be designed as a rigid printed circuit board. Preferably, at least one of the printed circuit boards, particularly preferably each of the printed circuit boards, is flexible at least in sections and has at least one flexible section and/or partial area, in particular at least one bending area, which is flexible at least at times without experiencing structural damage. Preferably, the flexible section and/or flexible section of the printed circuit board that is flexible in sections has a modulus of elasticity of at least 3.0 GPa, particularly preferably at least 4.5 GPa. At least one of the circuit boards, particularly preferably each of the circuit boards, is preferably designed as a rigid-flex circuit board. The circuit board designed as a rigid-flex circuit board could, for example, be made from a combination of flexible sub-layers, for example polyimide foils, and rigid sub-layers, for example layers made of a composite material made of epoxy resin and glass fibers, by pressing and various areas produced, for example, by means of deep milling of different thickness and flexibility. Alternatively, it would be conceivable that at least one of the printed circuit boards, in particular each of the printed circuit boards, is designed as a semi-flexible printed circuit board. The printed circuit board designed as a semi-flexible printed circuit board could be formed, for example, from a stack of layers, from several so-called prepregs, which has at least one partial area tapered to a few layers, for example by milling or by using prepunched prepregs. The tapered sub-area could be provided with a permanently flexible lacquer layer and in particular form at least the bending area of the printed circuit board. At least one of the printed circuit boards, particularly preferably each of the printed circuit boards, preferably has at least one bending area. A “flexible area” should be understood to mean a sub-area which is bendable and/or curved. Depending on the design of the printed circuit board, the bending area can be bent a few times for example for assembly and then permanently bent or alternatively also permanently bent. A signal processing area of the printed circuit board, on which the signal processing unit is arranged, and a sensor area of the printed circuit board, on which the at least one sensor unit is arranged, are preferably separated from one another by the bending area. A “sensor unit” should be understood to mean a unit which has at least one sensor element for detecting the sensor signal, at least one electrical input for activation and at least one signal output for outputting the sensor signal to the signal processing unit. The sensor element and/or further sensor elements of the sensor unit could be, for example, a capacitive sensor and/or a resistive sensor, for example a resistance thermometer (Resistance Temperature Detector, RTD) and/or a temperature-dependent resistor (NTC thermistor) and/or or as an ultrasonic sensor and/or as a piezoelectric sensor and/or as a mechanical sensor and/or as a photodiode and/or the like. The at least one sensor element is preferably designed as an inductive sensor and comprises at least one induction coil. The sensor signal is preferably an electrical signal in the form of an electrical voltage and/or an electrical current, in particular in the form of an electrical alternating voltage and/or an electrical alternating current, at the input and/or at the signal output of the sensor unit rests and / or falls and / or flows. The sensor unit can have a multiplicity of sensor elements which are each provided for detecting at least one sensor signal. The sensor signal is preferably provided for determining an operating state variable in an operating state of the hob device. The operating state variable could be, without being limited to this, for example a temperature of a hob plate and/or the presence and/or a degree of coverage of one or more heating elements of the heating unit and/or a shape and/or a size and/or an electrical and/or electromagnetic parameter, for example an electrical resistance and/or an inductance, of an object, in particular a cooking utensil, to which the heating unit provides energy in the operating state.

A “signal processing unit” is to be understood as an electronic unit which, for the further processing and/or evaluation of the sensor signal, comprises at least one electronic semiconductor component, preferably at least one semiconductor chip designed as a microcontroller (pController, pC, MCU). The further processing carried out by the signal processing unit in an operating state of the hob device goes beyond simply forwarding the sensor signal to a further unit, in particular to a control unit, and includes at least one Conversion of the sensor signal from an analogue signal form to a digital signal form. The evaluation of the sensor signal preferably includes the determination of the operating state variable. The signal processing unit can have at least one serial interface, which is provided for forwarding the sensor signal, in particular for subsequent evaluation of the sensor signal, to further units, for example a control unit, in digital signal form.

A “data line” should be understood to mean a physical transmission medium, for example a cable, in particular a data cable, a wire, an optical waveguide or the like, for exchanging data, in particular for data transmission, between at least two of the signal processing units. The data line could be provided for a unidirectional exchange of data between at least two of the signal processing units. The data line is preferably provided for a bidirectional exchange of data between at least two of the signal processing units. The data line is preferably designed as a shielded electrical data cable.

In this document, numerals such as "first" and "second" preceding certain terms are used only to distinguish objects and/or to associate objects with one another and do not imply a total number present and/or ranking of objects. In particular, a "second object" does not necessarily imply the existence of a "first object".

“Provided” is intended to mean specifically programmed, designed and/or equipped. The fact that an object is provided for a specific function should be understood to mean that the object fulfills and/or executes this specific function in at least one application and/or operating state.

It is also proposed that the data line connects each of the printed circuit boards to each additional printed circuit board. As a result, an exchange of data between all signal processing units can advantageously be achieved with particularly simple means. In addition, flexibility can be increased in that individual sensor signals can be further processed and/or evaluated by one or more of the signal processing units. In addition, a particularly reliable cooktop Device are provided. If each of the printed circuit boards is connected to each other of the printed circuit boards via the data line, a sensor signal can be further processed and/or evaluated by another of the signal processing units, for example in the event of a fault and/or defect in one of the signal processing units.

In an alternative advantageous embodiment, it is proposed that each of the printed circuit boards is connected to exactly one other printed circuit board in each case via a respective data line. Such a configuration can advantageously further improve efficiency. In contrast to a data line, which connects each of the printed circuit boards to each of the other printed circuit boards, in which case data can only be exchanged between exactly two signal processing units at a specific point in time, data can advantageously be transmitted simultaneously between different signal processing units if each of the printed circuit boards is connected via a respective data line to exactly one other of the printed circuit boards. Printed circuit boards arranged adjacent to one another are preferably connected to one another via a data line in each case.

In addition, it is proposed that the hob device has a control unit which is intended to use data sets from all signal processing units to control at least one further unit. Such a configuration can advantageously further improve efficiency. In particular, efficient and needs-based control of the at least one further unit can be achieved. A “control unit” should be understood to mean an electronic unit which is provided for controlling and/or regulating at least one unit of the hob device and/or of a hob comprising the hob device. Preferably, the control unit comprises an arithmetic unit and, in particular, in addition to the arithmetic unit, a memory unit with a control and/or regulation program stored therein, which is intended to be executed by the arithmetic unit. The further unit can be a heating unit, for example. For example, the control unit could contain the data records of all signal processing units, which contain, for example, the presence of cooking utensil placed above a heating element of the heating unit and/or a degree of coverage of the heating element by the cooking utensil and/or a temperature of the hob plate and/or the cooking utensil. ten can be used to control the heating unit and control individual heating elements based on the data sets, for example switching them on or off or regulating a heating output provided by the respective heating elements. Alternatively or additionally, it would also be conceivable, for example, for the further unit to be an output unit of the hob device and/or of a hob having the hob device for outputting information to a user. The control unit could use the data sets of all signal processing units, for example, to have temperature information, for example a temperature of the hob plate and/or cooking utensil, output by the output unit. The data sets of all signal processing units could be evaluated sensor signals of all sensor units, without being limited thereto. It is also conceivable that the data records include a sensor signal from a single sensor unit or multiple sensor signals from multiple sensor units, which are further processed by the respective signal processing units, for example converted from analog to digital, but not evaluated, with the control unit being able to be provided for this (these) sensor signal (e) evaluate.

Furthermore, it is proposed that the control unit is connected to at least one of the printed circuit boards to receive the data sets of all signal processing units. As a result, the data sets of all signal processing units can advantageously be received efficiently by the control unit. The control unit is preferably connected to at least one of the printed circuit boards via at least one, preferably exactly one, further data line for receiving the data sets of all signal processing units.

To receive the data sets, the control unit could be connected to several of the circuit boards, in particular to each of the circuit boards, via a separate data line. In a particularly preferred embodiment, however, it is proposed that the control unit is connected to exactly one of the printed circuit boards for receiving the data sets of all signal processing units. As a result, efficiency can advantageously be increased further. The control unit is preferably connected to exactly one of the printed circuit boards via precisely one further data line in order to receive the data sets of all signal processing units. It is also proposed that at least one of the signal processing units, which is arranged on one of the printed circuit boards, further disseminates and/or evaluates at least one sensor signal in an operating state, which was detected by a sensor unit, which is arranged on another of the printed circuit boards. Such a configuration can advantageously further improve efficiency. In addition, operational reliability can advantageously be increased since, in the event of a failure of an individual signal processing unit, a sensor signal can be further processed and/or evaluated by a signal processing unit which is arranged on another of the printed circuit boards. It is conceivable that each of the signal processing units, which is arranged on one of the printed circuit boards, further disseminates and/or evaluates at least one sensor signal in an operating state, which was detected by a sensor unit, which is arranged on another of the printed circuit boards. For example, in the operating state, each sensor signal could be further processed and/or evaluated by at least two, in particular by each, of the signal processing units, as a result of which a susceptibility to errors in the signal evaluation can be reduced, preferably minimized. It is also conceivable that in the operating state at least one of the sensor signals is processed and/or evaluated partly by a signal processing unit, which is arranged on one of the printed circuit boards, and partly by one of the signal processing units, which is arranged on another of the printed circuit boards, whereby in particular very fast signal processing and/or signal evaluation can be achieved.

In addition, it is proposed that at least two of the printed circuit boards form a common sensor group. As a result, efficiency can advantageously be further improved. It would be conceivable that all printed circuit boards form a common sensor group. At least two of the circuit boards preferably form a sensor group and at least two more of the circuit boards form at least one more sensor group. At least two printed circuit boards arranged adjacent to one another preferably form a common sensor group. The printed circuit boards are preferably divided into common sensor groups based on at least one functional feature, for example based on a cooking area that belongs together.

Furthermore, it is proposed that a signal processing unit, which is arranged on one of the printed circuit boards of the sensor group, is provided to all within the Sensor group further processed and / or to merge sensor signals evaluated into a common data set and forward. Such a configuration can advantageously further improve efficiency. The signal processing unit, which is arranged on one of the printed circuit boards of the sensor group, is preferably intended to combine all sensor signals that are further processed and/or evaluated within the sensor group into the common data set and to a further signal processing unit, which is arranged on a further printed circuit board of a further sensor unit. or forwarded to the control unit. The signal processing unit, which is arranged on the printed circuit board that is connected to the control unit, is preferably provided for collecting all common data sets from all sensor groups and forwarding them to the control unit. It is also conceivable that the signal processing unit, which is arranged on the printed circuit board that is connected to the control unit, is provided to combine all common data sets of all sensor groups into one overall data set and to forward them to the control unit.

In addition, it is proposed that the hob device has a heating unit with a plurality of heating elements, with each of the heating elements being assigned at least one of the sensor units. In this way, a particularly precise detection can advantageously be achieved. In particular, at least one sensor signal detected by at least one of the sensor units can be assigned to each of the heating units. A particularly efficient and reliable operation of the hob device can thus advantageously be achieved. Exactly one of the sensor units could be assigned to each of the heating units. It is also conceivable for at least one of the heating elements, in particular each of the heating elements, to be assigned a plurality of sensor units. In this way, a detection accuracy can advantageously be increased. It is also conceivable that at least one of the sensor units is assigned to several of the heating units.

The invention also relates to a hob with a hob device according to one of the configurations described above. Such a hob is distinguished in particular by its advantageous properties with regard to efficiency, in particular efficient manufacture and efficient operation. The hob is preferably designed as an induction hob. The invention is also based on a method for operating a hob device, in particular according to one of the configurations described above, with a plurality of printed circuit boards, on each of which a sensor unit for detecting a sensor signal and an electronic signal processing unit for further processing and/or evaluating the sensor signal are jointly arranged are.

It is proposed that in an operating state data is exchanged between at least two of the signal processing units via at least one data line. A particularly efficient and reliable operation of the hob device can be achieved by such a method. The exchange and/or processing and/or evaluation of the data is preferably carried out using at least one algorithm. The algorithm could be, for example, an algorithm for distributed calculation and structuring, which is referred to as "distributed clustering and computation algorithm", in which data, for example sensor signals, for example using a cooking utensil to be detected, are structured by first any signal processing unit queries one or more sensor signals from further signal processing units which are arranged on adjacent printed circuit boards. This process is then carried out incrementally for all signal processing units that are arranged on circuit boards that are adjacent to one another, until a position of the cooking utensil to be detected has been identified. It would also be conceivable for the algorithm to be a consensus or bidding algorithm, with all sensor signals being transmitted to all signal processing units via the data line and further processing and/or evaluation of all sensor signals being carried out by all signal processing units and a result is then selected according to a predefined criterion, for example the most votes, the highest certainty or the shortest calculation time. It would also be conceivable for the algorithm to be an algorithm for geometric calculation, with each signal processing unit processing and/or evaluating the sensor signal that was detected by the sensor unit on the same printed circuit board, and the data precalculated in this way then being processed by one of the signal processing units for a sensor group or for the entire cooktop is merged into a common data set. The hob device should not be limited to the application and embodiment described above. In particular, the hob device can have a number of individual elements, components and units that differs from the number specified here in order to fulfill a function described herein.

Further advantages result from the following description of the drawings. Exemplary embodiments of the invention are shown in the drawing. The drawing, the description and the claims contain numerous features in combination. The person skilled in the art will expediently also consider the features individually and combine them into further meaningful combinations.

Show it:

1 shows a hob with a hob device in a schematic representation,

2 shows a schematic representation of a plurality of printed circuit boards of the hob device, which are connected to one another via a data line,

3 shows a schematic process flow diagram to illustrate a process for operating the hob device,

4 shows a further embodiment of a hob with a hob device in a schematic representation and

5 shows a schematic representation of a plurality of printed circuit boards of the hob device of the exemplary embodiment in FIG.

FIG. 1 shows a hob 32a in a schematic plan view. The hob 32a is designed as an induction hob. The hob 32a has a mounting plate 34a.

The mounting plate 34a is provided for mounting cookware (not shown) for the purpose of heating.

The hob 32a has a hob device 10a. The hob device 10a is designed as an induction hob device.

The hob device 10a includes a heating unit 28a with a plurality of heating elements 30a. The heating unit 28a is designed as an induction heating unit and the heating elements 30a are designed as induction heating elements for the inductive heating of cooking harness trained. In the present case, the heating unit 28a has a plurality of a total of ten heating elements 30a. Alternatively, however, heating units 28a with a larger number of heating elements 30a or with a smaller number of at least two heating elements 30a would also be conceivable.

The hob device 10a includes a plurality of printed circuit boards 12a. In the present case, the hob device 10a has a plurality of a total of six printed circuit boards 12a. Alternatively, however, a larger number of printed circuit boards 12a or a smaller number of at least two printed circuit boards 12a would also be conceivable.

At least one sensor unit 14a for detecting a sensor signal (not shown) and at least one electronic signal processing unit 16a for further processing and/or evaluating the sensor signal are arranged together on each of the printed circuit boards 12a. In the present case, exactly one sensor unit 14a and exactly one signal processing unit 16a are arranged on each of the printed circuit boards 12a.

At least one of the sensor units 14a is assigned to each of the heating elements 30a of the heating unit 28a. In the present case, a first sensor unit 14a1, which is arranged on a first printed circuit board 12a1 of the plurality of printed circuit boards 12a, is associated with a first heating element 30a1 and a third heating element 30a3 of the plurality of heating elements 30a of the heating unit 28a. A second sensor unit 14a2, which is arranged on a second circuit board 12a2 of the plurality of circuit boards 12a, is associated with a second heating element 30a2 and a fourth heating element 30a4 of the plurality of heating elements 30a of the heating unit 28a. A third sensor unit 14a3, which is arranged on a third printed circuit board 12a3 of the plurality of printed circuit boards 12a, is associated with a fifth heating element 30a5 of the plurality of heating elements 30a of the heating unit 28a. A fourth sensor unit 14a4, which is arranged on a fourth printed circuit board 12a4 of the plurality of printed circuit boards 12a, is associated with a sixth heating element 30a6 of the plurality of heating elements 30a of the heating unit 28a. A fifth sensor unit 14a5, which is arranged on a fifth circuit board 12a5 of the plurality of circuit boards 12a, is associated with a seventh heating element 30a7 and a ninth heating element 30a9 of the plurality of heating elements 30a of the heating unit 28a. A sixth sensor unit 14a6, which is arranged on a sixth circuit board 12a6 of the plurality of circuit boards 12a, is associated with an eighth heating element 30a8 and a tenth heating element 30a10 of the plurality of heating elements 30a of the heating unit 28a. The pre- The assignment between the sensor units 14a and the heating elements 30a described in detail is purely exemplary and other assignments would also be conceivable, in particular depending on a total number of printed circuit boards 12a, a total number of sensor units 14a arranged on them and a total number of heating elements 30a of the heating unit 28a.

In the present case, the sensor units 14a, which are each arranged on one of the printed circuit boards 12a, are each provided for detecting cookware. Alternatively or additionally, however, it would also be conceivable for one or more of the sensor units 14a to be provided for detecting further parameters relating to the hob 32a, for example a temperature of the hob plate 34a and/or a temperature of cooking utensils placed on the hob plate 34a.

When the hob device 10a is in an operating state, each of the signal processing units 16a uses at least one sensor signal to determine the presence and/or the degree of coverage of a cooking utensil (not shown) placed on a hob plate 34a of the hob 32a. In the operating state, for example, a first signal processing unit 16a1, which is arranged on the first printed circuit board 12a1 of the plurality of printed circuit boards 12a, processes at least one sensor signal that was detected by the first sensor unit 14a1 and evaluates the presence and/or degree of coverage of the first Heating element 30a1 and/or the third heating element 30a3 through cookware placed on the hob plate 34a of the hob 32a.

The hob device 10a has a control unit 20a. The control unit 20a is intended to use data sets from all the signal processing units 14a to control at least one further unit 42a. In the present case, the control unit 20a for controlling the heating unit 28a is provided as a further unit 42a. In the operating state, the control unit 20a controls the heating unit 28a based on the data sets of all signal processing units 16a. For example, in the operating state, the control unit 20a controls individual heating elements 30a of the heating unit 28a based on the presence and/or degree of coverage of the respective heating elements 30a by cookware placed above the heating elements 30a on the hob plate 34a. The presence of cookware and/or the degree of coverage by cookware are contained in the data records of the signal processing units 16a. FIG. 2 shows the plurality of circuit boards 12a, with the respective sensor units 14a and signal processing units 16a arranged thereon, in a schematic representation. The hob device 10a has at least one data line 18a, which connects at least one of the printed circuit boards 12a to at least one of the other printed circuit boards 12a. The data line 18a is provided for an exchange of data between at least two of the signal processing units 16a. In the present case, the data line 18a connects each of the printed circuit boards 12a to each other of the printed circuit boards 12a. For example, the data line 18a connects the first printed circuit board 12a to the second printed circuit board 12a2, to the third printed circuit board 12a3, to the fourth printed circuit board 12a4, to the fifth printed circuit board 12a5 and to the sixth printed circuit board 12a6. In the operating state, an exchange of data between all signal processing units 16a is thus possible. For example, a first signal processing unit 16a1, which is arranged on the first printed circuit board 12a1, in the data operating state, for example at least one processed and/or evaluated sensor signal, could be connected to a second signal processing unit 16a2, which is arranged on the second printed circuit board 12a2 of the plurality of printed circuit boards. exchange via the data line 18a.

At least one of the signal processing units 16a, which is arranged on one of the printed circuit boards 12a, processes at least one sensor signal in the operating state, which was detected by a sensor unit 14a, which is arranged on one of the other printed circuit boards 12a, and/or evaluates this sensor signal out of. For example, it is conceivable that in the operating state a sensor signal, which was detected by the first sensor unit 14a1, is transmitted via the data line 18a to the second signal processing unit 16a2 and is further processed and/or evaluated by the latter.

The control unit 20a is connected to at least one of the printed circuit boards 12a to receive data sets from all signal processing units 16a. The control unit 20a could be individually connected to each of the printed circuit boards 12a in order to receive the data sets of all the signal processing units 16a. In the present case, however, the control unit 20a is connected to exactly one of the printed circuit boards 12a in order to receive the data sets of all the signal processing units 16a. In the present exemplary embodiment, the control unit 20a is connected to the sixth printed circuit board 12a6 of the plurality of printed circuit boards 12a, specifically via a further data line 36a. FIG. 3 shows a schematic process flow diagram to illustrate a process for operating the hob device 10a. In the method, when the hob device 10a is in the operating state, data is exchanged between at least two of the signal processing units 16a via the at least one data line 18a. The method includes at least two method steps 38a, 40a. In a first method step 38a of the method, at least one sensor signal is detected by at least one of the sensor units 14a and further processed and/or evaluated by at least one of the signal processing units 16a. In a second method step 40a of the method, data, for example at least one data set, which contains a sensor signal further processed and/or evaluated by one of the signal processing units 16a, is exchanged between at least two of the signal processing units 16a.

In the figures 4 and 5 another embodiment of the invention is shown. The following descriptions are essentially limited to the differences between the exemplary embodiments, with reference being made to the description of the exemplary embodiment in FIGS. 1 to 3 with regard to components, features and functions that remain the same. To distinguish between the exemplary embodiments, the letter a in the reference numbers of the exemplary embodiment in FIGS. 1 to 3 has been replaced by the letter b in the reference numbers of the exemplary embodiment in FIGS. With regard to components with the same designation, in particular with regard to components with the same reference numbers, reference can in principle also be made to the drawings and/or the description of the exemplary embodiment in FIGS.

FIG. 4 shows a further exemplary embodiment of a hob 32b with a hob device 10b in a schematic representation.

The hob device 10b includes a heating unit 28b with a plurality of heating elements 30b. The heating unit 28b is designed as an induction heating unit and the heating elements 30b are designed as induction heating elements for the inductive heating of cookware (not shown). In the present case, the heating unit 28b has a plurality of a total of ten heating elements 30b. Alternatively, however, heating units 28b with a larger number of heating elements 30b or with a smaller number of at least two heating elements 30b would also be conceivable. The hob device 10b includes a plurality of printed circuit boards 12b. In the present case, the hob device 10b has a plurality of a total of six printed circuit boards 12b. Alternatively, however, a larger number of printed circuit boards 12b or a smaller number of at least two printed circuit boards 12a would also be conceivable.

At least one sensor unit 14b for detecting a sensor signal (not shown) and at least one electronic signal processing unit 16b for further processing and/or evaluating the sensor signal are arranged together on each of the printed circuit boards 12b. In the present case, exactly one sensor unit 14b and exactly one signal processing unit 16b are arranged on each of the printed circuit boards 12b.

The hob device 10b has a control unit 20b. The control unit 20b is intended to use data sets from all signal processing units 14b to control at least one further unit 42b. In the present case, the control unit 20b for controlling the heating unit 28b is provided as a further unit 42b. In an operating state of the hob device 10b, the control unit 20b controls the heating unit 28b based on the data sets of all signal processing units 16b.

At least two of the circuit boards 12b form a common sensor group 22b, 24b, 26b. In the present case, a first printed circuit board 12b1 and a second printed circuit board 12b1 of the plurality of printed circuit boards jointly form a first sensor group 22b. A third printed circuit board 12b3 and a fourth printed circuit board 12b4 of the plurality of printed circuit boards 12b jointly form a second sensor group 24b. A fifth printed circuit board 12b5 and a sixth printed circuit board 12b6 of the plurality of printed circuit boards 12b jointly form a third sensor group 26b.

FIG. 5 shows the plurality of circuit boards 12b, with the respective sensor units 14b and signal processing units 16b arranged thereon, in a schematic representation. The hob device 10b has at least one data line 18b, which connects at least one of the printed circuit boards 12b to at least one of the other printed circuit boards 12b. In contrast to the previous exemplary embodiment of the hob device 10a, the hob device 10b has a plurality of data lines 18b. Each of the printed circuit boards 12b of the hob device 10b is connected via a respective data line 18b to precisely one further printed circuit board 12b. In the present case, the first printed circuit board 12b1 is connected to the second printed circuit board via a first data line 18b1 12b2 connected. The second printed circuit board 12b2 is connected to the third printed circuit board 12b3 via a second data line 18b2. The third printed circuit board 12b3 is connected to the fourth printed circuit board 12b4 via a third data line 18b3. The fourth printed circuit board 12b4 is connected to the fifth printed circuit board 12b5 via a fourth data line 18b4. The fifth circuit board 12b5 is connected to the sixth circuit board 12b6 via a fifth data line 18b5. In the present case, each of the data lines 18b connects precisely one of the printed circuit boards 12b to precisely one further printed circuit board 12b. A direct exchange of data between at least two of the signal processing units 16b can therefore only take place between signal processing units 16b which are arranged on circuit boards 12b adjacent to one another. For example, a direct exchange of data between a first signal processing unit 16b1, which is arranged on the first printed circuit board 12b1, and a second signal processing unit 16b2, which is arranged on the second printed circuit board 12b2, is possible via the first data line 18b1. An exchange of data between signal processing units 16b, which are not arranged on printed circuit boards 12b adjacent to one another, can take place indirectly via at least one further signal processing unit 16b. For example, data can be exchanged between the first signal processing unit 16b1 and a third signal processing unit 16b3, which is arranged on the third circuit board 12b3, indirectly via the second signal processing unit 16b2, in that a data record is sent from the first signal processing unit 16b1 initially via the first data line 18b1 to the second signal processing unit 16b2 and then from the second signal processing unit 16b2 via the second data line 18b2 to the third signal processing unit 16b3.

To receive the data sets of all signal processing units 16b, the control unit 20b is connected to at least one of the circuit boards 12b, in this case to exactly one of the circuit boards 12b, specifically to the sixth circuit board 12b6 of the plurality of circuit boards 12b, via a further data line 36b.

A signal processing unit 16b, which is arranged on one of the printed circuit boards 12b of one of the sensor groups 22b, 24b, 26b (see FIG. 4), is provided to combine all sensor signals further processed and/or evaluated within the respective sensor group 22b, 24b, 26b into a common Merge and forward dataset. Here is the second signal processing unit 16b2, which is on the second printed circuit board 12b2, is intended to combine all sensor signals further processed and/or evaluated within the first sensor group 22b into a common data set and to forward them via the second data line 18b2 to the third signal processing unit 16b3, which is arranged on the third printed circuit board 12b3. In the operating state, the first signal processing unit 16b1 therefore initially forwards a processed and/or evaluated sensor signal, which was detected by a first sensor unit 14b1, via the first data line 18b1 to the second signal processing unit 16b2. The second signal processing unit 16b2 combines the further processed and/or evaluated sensor signal received from the first signal processing unit 16a1 with a further processed and/or evaluated sensor signal, which was detected by a second sensor unit 14b2, to form a first common data set of the first sensor group 22b and transfers this the second data line 18b2 to the third signal processing unit 16b3. In the operating state, the third signal processing unit 16b3 forwards the first common data set of the first sensor group 22b to a fourth signal processing unit 16b4, which is arranged on the fourth printed circuit board 12b4. The fourth signal processing unit 16b4 is intended to combine all sensor signals further processed and/or evaluated within the second sensor group 24b into a common data set and to forward them to a fifth signal processing unit 16b5, which is arranged on the fifth printed circuit board 12b5. In the operating state, the third signal processing unit 16b3 therefore first forwards a processed and/or evaluated sensor signal, which was detected by a third sensor unit 14b3, via the third data line 18b3 to the fourth signal processing unit 16b4. The fourth signal processing unit 16b4 combines the further processed and/or evaluated sensor signal received from the third signal processing unit 16b3 with a further processed and/or evaluated sensor signal, which was detected by a fourth sensor unit 14b4, to form a second common data set of the second sensor group 24b and combines this with the first common data set of the first sensor group 22b via the fourth data line 18b4 to the fifth signal processing unit 16b5. In the operating state, the fifth signal processing unit 16b5 forwards the first common data set of the first sensor group 22b and the second common data set of the second sensor group 24b to a sixth signal processing unit 16b6, which is arranged on the sixth printed circuit board 12b6. The sixth Signal processing unit 16b6 is provided to combine all sensor signals further processed and/or evaluated within third sensor group 26b into a common data set and forward them to control unit 20b. In the operating state, the fifth signal processing unit 16b5 therefore first forwards a further processed and/or evaluated sensor signal, which was detected by a fifth sensor unit 14b5, via the fifth data line 18b5 to the sixth signal processing unit 16b6. The sixth signal processing unit 16b6 combines the further processed and/or evaluated sensor signal received from the fifth signal processing unit 16b5 with a further processed and/or evaluated sensor signal, which was detected by a sixth sensor unit 14b6, to form a third common data set of the third sensor group 26b and forwards it this together with the first common data set of the first sensor group 22b and the second common data set of the second sensor group 24b via the further data line 36b to the control unit. In the operating state, the control unit 20b controls the heating unit 28b based on the data sets of the sensor groups 22b, 24b, 26b, which indicate, for example, the presence of cooking utensils displayed above individual heating elements 30b on a hob plate 34b of the hob 32b and/or a degree of coverage of individual heating elements 30b may include through the cookware.

Reference sign

10 hob device

12 circuit board

14 sensor unit

16 signal processing unit

18 data line

20 control unit

22 sensor group

24 sensor group

26 sensor group

28 heating unit

30 heating element

32 hob

34 hob plate

36 more data line

38 first step

40 second process step

42 more unit

Claims

22

Claims Hob device (10a; 10b), in particular induction hob device, with a plurality of printed circuit boards (12a), on each of which at least one sensor unit (14a; 14b) for detecting a sensor signal and an electronic signal processing unit (16a; 16b) for further processing and/or evaluation of the sensor signal are arranged together, characterized by at least one data line (18a; 18b) which connects at least one of the circuit boards (12a; 12b) to at least one other of the circuit boards (12a; 12b) and for an exchange of data between at least two of the signal processing units (16a; 16b) is provided. Hob device (10a) according to claim 1, characterized in that the data line (18a) connects each of the printed circuit boards (12a) to each other of the printed circuit boards (12a). Hob device (10b) according to Claim 1, characterized in that each of the printed circuit boards (12b) is connected via a respective data line (18b) to exactly one further printed circuit board (12b). Hob device (10a; 10b) according to one of the preceding claims, characterized by a control unit (20a; 20b) which is provided to use data records from all signal processing units (16a; 16b) to control at least one further unit (42a; 42b). Hob device (10a; 10b) according to Claim 4, characterized in that the control unit (20a, 20b) is connected to at least one of the printed circuit boards (12a; 12b) to receive the data sets of all signal processing units (16a; 16b). 6. Hob device (10a; 10b) according to claim 5, characterized in that the control unit (20a; 20b) is connected to exactly one of the printed circuit boards (12a; 12b) to receive the data sets of all signal processing units (16a; 16b).

7. Hob device (10a; 10b) according to any one of the preceding claims, characterized in that at least one of the signal processing units (16a; 16b), which is arranged on one of the printed circuit boards (12a; 12b), further disseminates at least one sensor signal in an operating state and/or or evaluates which was detected by a sensor unit (14a; 14b) which is arranged on another of the printed circuit boards (12a; 12b).

8. Hob device (10b) according to one of the preceding claims, characterized in that at least two of the printed circuit boards (12b) form a common sensor group (22b, 24b, 26b).

9. Hob device (10b) according to Claim 8, characterized in that a signal processing unit (16b), which is arranged on one of the printed circuit boards (12b) of the sensor group (22b, 24b, 26b), is provided for all within the sensor group (22b , 24b, 26b) further processed and/or evaluated sensor signals to a common data record and to forward it.

10. Hob device (10a; 10b) according to one of the preceding claims, characterized by a heating unit (28a; 28b) with a plurality of heating elements (30a; 30b), each of the heating elements (30a; 30b) having at least one of the sensor units (14a; 14b) is assigned.

11. hob (32a; 32b) with a hob device (10a; 10b) according to any one of the preceding claims. Method for operating a hob device (10a; 10b), in particular according to one of Claims 1 to 11, having a plurality of printed circuit boards (12a; 12b), on each of which a sensor unit (14a; 14b) for detecting a sensor signal and an electronic signal processing unit ( 16a; 16b) are arranged together for further processing and/or evaluation of the sensor signal, characterized in that in an operating state data is exchanged between at least two of the signal processing units (16a; 16b) via at least one data line (18a; 18b).