WO2023035403A1

WO2023035403A1 - Coating device, and apparatus and method for coating semiconductor structure with colloid

Info

Publication number: WO2023035403A1
Application number: PCT/CN2021/130545
Authority: WO
Inventors: 何东东
Original assignee: 长鑫存储技术有限公司
Priority date: 2021-09-10
Filing date: 2021-11-15
Publication date: 2023-03-16
Also published as: CN115780198A

Abstract

A coating device, and an apparatus and method for coating a semiconductor structure with a colloid, which relate to the technical field of semiconductors. The coating device comprises a rack (1) and a coating assembly (2), wherein the coating assembly (2) comprises a pipe body (21) for accommodating a protective liquid, and a pressure adjuster (22); the pipe body (21) is arranged on the rack (1); the pipe body (21) is configured to move relative to the rack (1); one end of the pipe body (21) has a liquid outlet; and the pressure adjuster (22) communicates with an inner cavity of the pipe body (21) to push the protective liquid to flow out from the liquid outlet. By using the device, the apparatus and the method, the protective liquid in the pipe body can be accurately coated on a region of a fixed point position of the semiconductor structure, operation thereof is easy, and the success rate, the treatment efficiency and the product yield of coating can be effectively improved.

Description

Coating device, device and method for coating colloids on semiconductor structures

This disclosure is based on the Chinese patent application with the application number 202111060788.1, the application date is September 10, 2021, and the application name is "coating device, equipment and method for coating colloids on semiconductor structures", and requires the Chinese patent Priority of the application, the entire content of the Chinese patent application is hereby incorporated by reference into this disclosure.

technical field

The present disclosure relates to, but is not limited to, a coating device, equipment and method for coating colloids on semiconductor structures.

Background technique

Semiconductor manufacturing is an extremely complex process. Throughout the semiconductor manufacturing process, various tests are required on the manufactured products to determine whether the manufactured products meet the design requirements, thereby ensuring the quality of semiconductor products.

EM (Electron Microscope, electron microscope) is a common tool for detecting and analyzing semiconductor devices and thin film materials. It can be used to detect the required information such as the shape, size, and characteristics of the sample. Commonly used EM includes TEM (Transmission Electron Microscope, transmission electron microscope, referred to as transmission electron microscope) and SEM (Scanning Electron Microscope, scanning electron microscope, referred to as scanning electron microscope).

Among them, before using TEM for sample detection, it will be determined what kind of pretreatment the TEM sample needs to perform according to the sample structure size, sample material, and sample position. The materials of TEM samples include metallic materials and non-metallic materials. Metal samples can be directly deposited on the focused ion beam microscope (Focused Ion Beam, referred to as FIB) machine platform protective layer. Non-metallic TEM samples include both hard and soft materials. Among them, hard materials (such as silicon nitride, silicon oxide, etc.) can directly deposit protective layers on the FIB machine, but soft materials (such as low-K materials, spin-coated carbon materials, etc.) cannot directly deposit protective layers on the FIB machine. Therefore, it is necessary to cover a layer of protective glue on the surface of such soft materials to play a supporting role.

At present, the protective glue is generally covered on such soft materials by manual coating. Non-fixed-point positions on samples of soft materials can be completed directly by manual glue coating, and when such samples need to be coated with protective glue at fixed-point positions, the manual coating method will lead to relatively large coating errors. Large, the defect rate of the product is high, and the efficiency of manual coating is low.

Contents of the invention

The following is an overview of the subject matter described in detail in this disclosure. This summary is not intended to limit the scope of the claims.

The present disclosure provides a coating device, a device and a method for coating colloid on a semiconductor structure.

A first aspect of an embodiment of the present disclosure provides a coating device, comprising:

frame;

A coating assembly, the coating assembly includes a pipe body and a pressure regulator for containing the protection liquid, the pipe body is arranged on the frame, and the pipe body is set to move relative to the frame , one end of the tube body has a liquid outlet, and the pressure regulator communicates with the inner cavity of the tube body to push the protection liquid to flow out from the liquid outlet.

According to some embodiments of the present disclosure, the pressure regulator includes a first pressure suction pipe, the first pressure suction pipe communicates with the pipe body through a first connecting pipe, and the first pressure suction pipe is used to adjust the pressure in the pipe body. pressure.

According to some embodiments of the present disclosure, the pressure regulator further includes a liquid storage tank and a quantitative adjustment member, and the quantitative adjustment member is arranged on the fluid passage between the first pressure suction pipe and the liquid storage tank, so The quantitative adjustment member is used to adjust the flow rate of the protection liquid discharged from the liquid storage tank, and to quantitatively discharge the protection liquid.

According to some embodiments of the present disclosure, the pressure regulator includes a second pressure suction pipe sleeved on the pipe body for adjusting the pressure in the pipe body.

According to some embodiments of the present disclosure, the frame includes a base and a support rod, the support rod is disposed on the base, the pipe body is disposed on the support rod, and the pipe body is relative to the support The rod slides.

According to some embodiments of the present disclosure, the support rod includes a connected first section and a second section, and the first section is connected to the base;

The pipe body is arranged on the second section through an adjustment assembly.

According to some embodiments of the present disclosure, grooves are provided on the second section;

The adjusting assembly includes a connecting piece, a transmission piece and an adjusting piece, the transmission piece is installed in the groove, the connecting piece is respectively connected with the transmission piece and the pipe body, and the connecting piece is set to follow The transmission member moves, the pipe body is configured to be able to rotate relative to the connecting member, and the connecting member is arranged at an end of the transmission member away from the first section;

The adjustment member is connected with the transmission member, and the adjustment member rotates under the action of an external force to drive the transmission member to move along the groove.

According to some embodiments of the present disclosure, the transmission member includes a transmission rack, the adjustment member includes a transmission gear, and the transmission rack is engaged with the transmission gear;

or,

The transmission member includes a chain, and the adjustment member includes a sprocket.

According to some embodiments of the present disclosure, the tube body includes a needle tube and a fixing rod, the liquid outlet is arranged at one end of the needle tube, and the other end of the needle tube is sealingly connected with the fixing rod, and the pressure The regulator runs through the fixing rod and communicates with the needle tube.

According to some embodiments of the present disclosure, the cross-sectional diameter of the liquid outlet is 10 nm˜500 nm.

According to some embodiments of the present disclosure, a heater is attached to the needle tube.

A second aspect of an embodiment of the present disclosure provides a device for coating a semiconductor structure with colloid, including:

a support platform, the support platform has a bearing surface, and the bearing surface is used to carry a sample, wherein the sample includes a region to be coated;

an observation assembly, the observation assembly is arranged at the edge of the support table;

And the coating device according to the first aspect, the coating device is used for coating the area to be coated.

According to some embodiments of the present disclosure, the viewing assembly includes a microscope.

A third aspect of the embodiments of the present disclosure provides a method for coating a semiconductor structure with colloid, which is applied to the equipment for coating a semiconductor structure with colloid as described in the second aspect, including the following steps:

placing the sample with the area to be coated on the bearing surface of the support table of the device;

Obtaining the location of the area to be coated using a viewing assembly of the device;

moving the coating device of the equipment so that the liquid outlet of the tube body of the coating device is located at a first position above the area to be coated;

Controlling the operation of the pressure regulator in the coating device, so that the protective liquid in the pipe body drops to the area to be coated through the liquid outlet.

According to some embodiments of the present disclosure, the method further includes:

moving the coating device, adjusting the distance between the liquid outlet and the area to be coated, so that the liquid outlet is located at a second position above the area to be coated;

Wherein, the vertical distance between the first position and the area to be coated is larger than the vertical distance between the second position and the area to be coated.

Other aspects will be apparent to others upon reading and understanding the drawings and detailed description.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and, together with the description, serve to explain principles of the embodiments of the disclosure. In the drawings, like reference numerals are used to denote like elements. The drawings in the following description are some, but not all, embodiments of the present disclosure. Those skilled in the art can obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic diagram of an apparatus for coating colloid on a semiconductor structure according to an exemplary embodiment.

Fig. 2 is a schematic diagram of a coating device according to an exemplary embodiment.

Fig. 3 is a schematic diagram of a coating device according to an exemplary embodiment.

Fig. 4 is a flowchart showing a method for coating colloid on a semiconductor structure according to an exemplary embodiment.

Fig. 5 is a flow chart of a method for coating colloid on a semiconductor structure according to an exemplary embodiment.

Reference signs:

1. Rack; 2. Coating components;

3. Adjustment components; 10. Support table;

11. Base; 12. Support rod;

20. Observation component; 21. Tube body;

22. Pressure regulator; 23. First connecting pipe;

24. The second connecting pipe; 25. Sealing ring;

31. Connecting parts; 32. Transmission parts;

33. Regulator; 101. Bearing surface;

102. Sample; 121. The first paragraph;

122, the second section; 211, the liquid outlet;

212, needle tube; 213, fixed rod;

221. The first pressure suction pipe; 222. Liquid storage tank;

223, quantitative adjustment piece; 224, the second pressure suction pipe;

1021, area to be coated; 1221, groove;

P1, the first position; P2, the second position.

Detailed ways

In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions in the disclosed embodiments will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments It is a part of the embodiments of the present disclosure, but not all of them. Based on the embodiments in the present disclosure, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present disclosure. It should be noted that, in the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined arbitrarily with each other.

In the manufacturing process of semiconductor structures, before using TEM for sample detection, the pretreatment of TEM samples will be determined according to the sample structure size, sample material, and sample position. The materials of TEM samples include metallic materials and non-metallic materials. Metal samples can be directly deposited on the focused ion beam microscope (Focused Ion Beam, referred to as FIB) machine platform protective layer. Non-metallic TEM samples include both hard and soft materials. Among them, hard materials (such as silicon nitride, silicon oxide, etc.) can directly deposit protective layers on the FIB machine, but soft materials (such as low-K materials, spin-coated carbon materials, etc.) cannot directly deposit protective layers on the FIB machine. Therefore, it is necessary to cover a layer of protective glue on the surface of such soft materials to play a supporting role.

In the coating device, equipment and method for coating colloids for semiconductor structures provided by the embodiments of the present disclosure, through the cooperation of the tube body that can move relative to the frame and the pressure regulator, the pressure regulator pushes the The protective liquid flows out, so that the protective liquid in the tube can be accurately coated on the fixed-point area of the semiconductor structure, the operation is simple, and the success rate of coating, processing efficiency and product yield can be effectively improved.

An exemplary embodiment of the present disclosure provides a coating device, as shown in FIG. 1 , which is a schematic diagram of a device for coating a semiconductor structure with colloid according to an exemplary embodiment. Fig. 2 is a schematic diagram of a coating device according to an exemplary embodiment. Fig. 3 is a schematic diagram of a coating device according to an exemplary embodiment. The coating device and the equipment for coating colloid on semiconductor structures will be introduced below with reference to FIGS. 1-3 .

As shown in FIGS. 1 to 3 , an exemplary embodiment of the present disclosure provides a coating device, which includes: a frame 1 and a coating assembly 2 .

The frame 1 is used to provide a mounting body for the coating assembly 2 or other components. In some embodiments, the rack 1 may adopt an integral structure, such as an inverted T-beam or I-beam structure. Wherein, the coating assembly 2 can be arranged at any position on the frame 1, as long as there is a predetermined distance between the coating assembly 2 and the horizontal surface, so that the TEM sample to be coated can be placed on the inclined surface of the coating assembly 2. Below or directly below, it is convenient for the coating component 2 to perform the coating operation on the TEM sample to be coated.

The coating assembly 2 includes a tube body 21, and the inside of the tube body 21 is configured as a hollow cavity, which is used to store the protection liquid. Wherein, the protective solution is in liquid form, and the protective solution is applied to the surface of the TEM sample to form a protective adhesive layer. The protective solution may include one or more of UV glue, silicone resin, epoxy resin and silicone rubber, so that the surface layer of the TEM sample composed of soft materials forms a surface layer on the surface of the TEM sample after the protective solution is coated The protective adhesive layer can provide effective support for TEM samples.

One end of the tube body 21 has a liquid outlet 211 for the protection liquid to flow out, and the liquid outlet 211 communicates with the inner cavity, and the other end of the tube body 21 may have a liquid inlet communicated with the inner cavity. The pipe body 21 can be arranged at any position on the frame 1 , and at the same time, the pipe body 21 is arranged to be movable relative to the frame 1 . It should be noted that the pipe body 21 can be rotatably connected to the frame 1, and can also perform linear reciprocating motion along the frame 1 in the vertical direction, horizontal direction or any inclined direction, so that the liquid outlet 211 of the pipe body 21 It can be quickly adjusted to the fixed-point position of the TEM sample to be coated.

The coating assembly 2 also includes a pressure regulator 22 , one end of the pressure regulator 22 communicates with the inner cavity of the tube body 21 . It should be noted that the end of the pressure regulator 21 can be connected to the liquid inlet of the pipe body 21, or it can be connected to any position of the pipe body 21 and communicated with the inner cavity, wherein the liquid inlet can be used for Inject protective fluid into the lumen. Through the pressure regulator 22 , the protection liquid in the inner cavity can be quickly and stably flowed out from the liquid outlet 211 .

In this embodiment, through the adjustment of the relative movement between the tube body and the frame, the liquid outlet of the tube body can be quickly adjusted to the fixed position of the TEM sample to be coated, and then the pressure regulator is pushed to make the liquid outlet in the tube body The protective liquid can be accurately coated on the fixed-point area of the semiconductor structure, and the glue coating operation on the surface of the TEM sample of soft materials is completed. The operation is simple, and the success rate, processing efficiency and product yield of TEM sample coating are effectively improved. .

As shown in FIG. 2 , in some embodiments, the pressure regulator 22 includes a first pressure suction tube 221 . The first pressure suction pipe 221 communicates with the pipe body 21 through the first connecting pipe 23, that is, one end of the first connecting pipe 23 communicates with the first pressure suction pipe 211, and the other end of the first connecting pipe 23 can be connected with any position of the pipe body 21. It is connected and communicated with the inner cavity, and can also be directly communicated with the liquid inlet of the tube body 21 . Wherein, when the first connecting pipe 23 is connected to the liquid inlet of the pipe body 21, a sealing ring or gasket is provided at the connection position between the first connecting pipe 23 and the liquid inlet to ensure that the first connecting pipe 23 and the pipe body 21, the sealing between the two is convenient for the first pressure suction pipe 221 to adjust the pressure in the pipe body 21. In this embodiment, on the one hand, the first pressure suction tube 211 can push the protection liquid in the inner cavity of the tube body 21 to flow out from the liquid outlet 211 by squeezing; The liquid port 211 sucks into the inner cavity of the tube body 21 . Through the first pressure suction tube 221, the protective liquid in the inner cavity of the tube body 21 can be conveniently controlled, and the movement of the tube body 21 on the frame 1 can be coordinated, so that the protective liquid can be accurately coated on the fixed-point position of the TEM sample , simple operation, high coating success rate.

Continuing to refer to FIG. 2 , in some embodiments, the pressure regulator 22 further includes a liquid storage tank 222 and a quantitative adjustment member 223 . The liquid storage tank 222 can be used to store the protection liquid, and at the same time, the liquid storage tank 222 can communicate with the other end of the first pressure suction pipe 221 through the second connecting pipe 24, so that the protection liquid can be sucked out from the liquid storage tank 222 through the first pressure suction pipe 221 , and push the protective solution into the lumen of the tube body 21 . The quantitative adjustment member 223 is arranged on the fluid passage between the first pressure suction pipe 221 and the liquid storage tank 222, that is, on the second connecting pipe 24, and the quantitative adjustment member 223 is configured to adjust the flow rate of the protection liquid discharged from the liquid storage tank 222 , and the protection liquid is quantitatively discharged from the liquid storage tank 222. In this embodiment, the quantitative adjustment member 223 can be a quantitative syringe or a quantitative syringe pump. Cooperating with the liquid storage tank 222 and the first pressure suction pipe 221 through the quantitative adjustment member 223, quantitative protective liquid coating can be carried out on the fixed position of the TEM sample, thereby effectively improving the success rate and coating efficiency of the coating, thereby improving the product quality. yield.

In some embodiments, as shown in FIG. 3 , the pressure regulator 22 may further include a second pressure suction pipe 224 . Wherein, one end of the second pressure suction pipe 224 is sleeved on one end of the liquid inlet on the pipe body 21, and the second pressure suction pipe 224 is used to adjust the pressure in the inner chamber of the pipe body 21, so as to facilitate the liquid in the inner chamber of the pipe body 21. Drainage or suction of protective fluid. In this embodiment, the second pressure suction tube 224 is sheathed on the tube body 21 , which facilitates assembly and disassembly of the device and is easy to operate. It should be noted that a sealing ring or gasket is provided at the connection position between the second pressure suction pipe 224 and the pipe body 21 to ensure the tightness between the second pressure suction pipe 224 and the pipe body 21, so that the second pressure suction pipe 224 regulates the pressure in the pipe body 21 .

As shown in FIGS. 1 and 2 , in some embodiments, the frame 1 includes a base 11 and a support rod 12 . The base 11 is used to provide an installation body for the support rod 12 and ensure the stability of the support rod 12 . The projection shape of the base 11 on the horizontal plane includes circle, ellipse, regular polygon, etc., and the shape of the longitudinal section of the base 11 perpendicular to the horizontal plane includes square, trapezoid, etc.

The support rod 12 can be vertically arranged on the base 11, or can be arranged obliquely on the base 11 along a predetermined angle. Both the support rod 12 and the base 11 can be fixedly connected or initially movably connected. The pipe body 21 is disposed on the support rod 12 , and the pipe body 21 can slide relative to the support rod 12 . It should be noted that the tube body 21 can reciprocate in a straight line along the vertical direction along the support rod 12, so as to quickly align the liquid outlet 211 of the tube body 21 with the fixed position of the TEM sample. In some embodiments, the pipe body 21 can make a linear reciprocating motion in the vertical direction along the support rod 12, or can make a linear reciprocating motion in the horizontal direction along the support rod 12, so that the liquid outlet of the pipe body 21 can be quickly controlled. 211 relative location in space.

As shown in FIG. 3 , in this embodiment, the support rod 12 includes a first segment 121 and a second segment 122 connected. The lower end of the first section 121 is fixedly connected with the base 11 , and the second section 122 is provided with a groove 1221 .

The pipe body 21 is disposed on the second section 122 through the adjustment assembly 3 . Wherein, the adjustment assembly 3 includes a connecting member 31 , a transmission member 32 and an adjusting member 33 . The transmission part 32 is installed in the groove 1221 , and the transmission part 32 can move up and down relative to the groove 1221 , and the connecting part 31 is respectively connected with the transmission part 32 and the pipe body 21 . Wherein, the connecting piece 31 is set to move with the transmission piece 32, and the connecting piece 31 is arranged on the end of the transmission piece 32 away from the first section 121, so as to ensure that there is enough space between the liquid outlet 211 of the tube body 21 and the TEM sample. Adjust the distance. In some embodiments, the connecting member 31 includes a sleeve, which is sleeved on the second section 122 and can slide along the axial extension direction of the second section 122. A positioning rod is arranged on the sleeve, and the positioning rod moves along the The sleeve is extended in the radial direction, and one end of the positioning rod is screwed into the sleeve, and the end of the positioning rod can abut against the groove 1221, so as to adjust the relative position of the pipe body 21 on the second section 122. Location.

In this embodiment, the tube body 21 is also configured to be able to rotate relative to the connecting piece 31 , so as to facilitate adjustment of the relative distance between the liquid outlet 211 of the tube body 21 and the fixed-point position of the TEM sample.

The adjustment member 33 is connected to the transmission member 32 , wherein the adjustment member 33 can rotate relative to each other under the action of an external force, so as to drive the transmission member 32 to move in the groove 1221 .

In some embodiments, the transmission member 32 includes a transmission rack, which is detachably connected in the groove 1221, while the connecting member 31 is fixedly connected or clamped on the transmission rack, and the adjustment member 33 includes a transmission gear. The transmission gear is engaged with the transmission rack. It should be noted that the transmission gear is provided with an adjustment knob, and the transmission gear drives the transmission rack to move in the groove 1221 by rotating and tightening, and then drives the pipe body 21 connected to the connecting piece 31 to move along the axis of the second section 122. The linear reciprocating motion is performed in the extending direction, and the structure is simple and easy to operate.

In other embodiments, the transmission member 32 includes a chain. Wherein, the chain can be an endless chain, and the two ends of the endless chain are arranged in the groove 1221 through two transmission sprockets, and meanwhile, the connecting piece 31 can be fixedly connected to one side of the chain. In this embodiment, the adjusting member 33 includes a sprocket. It should be noted that the sprocket can be rotatably connected to the preset position on the second segment 122 and connected with the chain drive, or it can be one of the two drive sprockets fixed to the chain. A handle or a runner can be arranged on the sprocket, and the handle or runner can be rotated by an external force to drive the chain to rotate in the groove 1221, so that the pipe body 21 connected to the connecting piece 31 can move along the axial direction of the second section 122. Linear reciprocating motion is performed in the extension direction, and the structure is simple and easy to operate.

As shown in FIG. 3 , in some embodiments, the tube body 21 includes a needle tube 212 and a fixing rod 213 . The liquid outlet 211 is arranged on one end of the needle tube 212, and the other end of the needle tube 212 and the fixing rod 213 can be sealed and connected through the sealing ring 25. One end of the pressure regulator 22 passes through the fixing rod 213 and communicates with one end of the needle tube 212 , so that the pressure in the needle tube 212 is adjusted through the pressure regulator 22 . The needle tube 212 can be a transparent glass tube with a tapered structure, which is convenient for observing the state of the protective liquid in the inner cavity of the needle tube 212 . Wherein, the cross-sectional diameter of the liquid outlet 211 is 10nm-500nm, and the size of the cross-sectional diameter of the liquid outlet 211 can be flexibly selected according to the type or viscosity of the selected protection liquid. In this embodiment, the cross-sectional diameter of the liquid outlet 211 is 100 nm.

In some embodiments, in order to facilitate the control of the fluidity of the protective liquid in the inner cavity of the tube body 21 and facilitate the flow of the protective liquid from the liquid outlet 211, a heater (not shown in the figure) can be attached to the tube body 21 .

As shown in FIG. 1 , an exemplary embodiment of the present disclosure provides an apparatus for coating a semiconductor structure with colloid. The equipment for coating colloid includes: a supporting platform 10 , an observation assembly 20 , and the frame 1 and the coating assembly 2 set on the frame 1 as in the above embodiment.

Wherein, the support platform 10 has a bearing surface 101 for bearing a sample 102 , that is, a TEM sample, and the sample 102 includes a region 1021 to be coated. In this embodiment, the supporting platform 10 may be a placing stage of a microscope.

The observation assembly 20 is arranged at the edge of the support table 10 for observing the area to be coated on the sample 102 . In this embodiment, observation assembly 20 includes a microscope.

In this embodiment, the TEM sample is placed on the bearing surface of the support table, and then the area to be coated of the sample (ie, the fixed-point position of the TEM sample) is positioned by a microscope, the rack is moved, and the tube body in the coating assembly is controlled. The liquid outlet of the tube is facing the area to be coated, and the operation adjustment component controls the relative distance between the liquid outlet and the area to be coated, and then the protective liquid in the tube flows out from the liquid outlet through the pressure regulator to complete the waiting for the sample. The positioning glue coating process of the coated area forms a layer of protective glue on the surface of the sample, and then performs subsequent processing on the sample. The equipment in this embodiment has a simple structure, is easy to operate, and can effectively improve the success rate of coating, processing efficiency and product yield.

As shown in FIG. 4 , an exemplary embodiment of the present disclosure provides a method for coating a semiconductor structure with colloid, and the method is applied to the device for coating a semiconductor structure with colloid in the above embodiments. Wherein, the method for coating the colloid for the semiconductor structure of the present embodiment includes the following steps:

S100: placing the sample with the area to be coated on the bearing surface of the support table of the equipment.

S200: Obtain the position of the area to be coated by using the observation component of the device.

S300: Move the coating device of the equipment so that the liquid outlet of the pipe body of the coating device is located at a first position above the area to be coated.

S400: Control the operation of the pressure regulator in the coating device, so that the protective liquid in the pipe body drops to the area to be coated through the liquid outlet.

Wherein, as shown in FIG. 5 , in step S200 , the area to be coated 1021 of the sample 102 is aligned through a microscope, and then the area to be coated 1021 is observed through a high power lens of the microscope.

Continuing to refer to FIG. 5 , in step S300, slowly move the frame 1, and when the liquid outlet 211 of the pipe body 21 is located at the first position P1 above the area 1021 to be coated, adjust the liquid outlet 211 and the area to be coated by adjusting the component 3. The distance between the coating areas 1021 is such that the liquid outlet 211 is located at the second position P2 above the area to be coated 1021, wherein the vertical distance between the first position P1 and the area to be coated 1021 is greater than the vertical distance between the second position P2 and the area to be coated. Vertical distance between areas 1021 to be coated. After the liquid outlet 211 moves to the second position P2, the pressure regulator 22 is controlled to work, so that the protective liquid in the tube body 21 drops from the liquid outlet 211 to the area 1021 to be coated. It should be noted that the second position P2 can be the vertical length when a drop of protective liquid drops, that is, when a drop of protective liquid drips out from the liquid outlet 211 but does not drop, the control tube body 21 slowly moves downward, and waits until When the bottom of the protection liquid is in contact with the area to be coated 1021, the downward movement of the tube body 21 is stopped, and then the protection liquid is adsorbed on the area to be coated 1021 through the adhesion of the protection liquid, thereby completing the TEM sample. Locate the gluing process.

In the method of coating colloid for semiconductor structures in this embodiment, the control process is simple and convenient, and the fixed-point position of the TEM sample can be accurately positioned. Compared with the manual positioning and coating method, the error accuracy of manual coating is increased from 2um to 20nm, In addition, the pretreatment time of manual glue coating has been increased from 30 minutes to 5 minutes, which greatly reduces the positioning error, effectively improves the coating success rate and processing efficiency of the fixed-point position of the TEM sample of soft materials, and then improves the product quality of the semiconductor structure. Rate

Each embodiment or implementation manner in this specification is described in a progressive manner, each embodiment focuses on the differences from other embodiments, and the same and similar parts of each embodiment can be referred to each other.

In the description of this specification, descriptions with reference to the terms "embodiments", "exemplary embodiments", "some implementations", "exemplary implementations", "examples" and the like mean that the descriptions are described in conjunction with the implementations or examples. A specific feature, structure, material, or characteristic is included in at least one embodiment or example of the present disclosure.

In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

In the description of the present disclosure, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation are therefore not to be construed as limitations on the present disclosure.

It can be understood that the terms "first", "second" and the like used in the present disclosure can be used to describe various structures in the present disclosure, but these structures are not limited by these terms. These terms are only used to distinguish one structure from another.

In one or more drawings, like elements are indicated with like reference numerals. For the sake of clarity, various parts in the drawings are not drawn to scale. Also, some well-known parts may not be shown. For simplicity, the structure obtained after several steps can be described in one figure. In the following, many specific details of the present disclosure, such as structures, materials, dimensions, processing techniques and techniques of devices, are described for a clearer understanding of the present disclosure. However, as will be understood by those skilled in the art, the present disclosure may be practiced without these specific details.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still Modifications are made to the technical solutions described in the foregoing embodiments, or equivalent replacements are made to some or all of the technical features; these modifications or replacements do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the various embodiments of the present invention.

Industrial Applicability

In the coating device, the equipment and method for coating colloids for semiconductor structures in the embodiments of the present disclosure, the protective liquid in the tube can be accurately adjusted through the cooperation of the tube body that can move relative to the frame and the pressure regulator. Coating on the fixed-point area of the semiconductor structure, the operation is simple, and the success rate of coating, processing efficiency and product yield can be effectively improved.

Claims

A coating device comprising:

frame;

A coating assembly, the coating assembly includes a pipe body and a pressure regulator for containing the protection liquid, the pipe body is arranged on the frame, and the pipe body is set to move relative to the frame , one end of the tube body has a liquid outlet, and the pressure regulator communicates with the inner cavity of the tube body to push the protection liquid to flow out from the liquid outlet.
The coating device according to claim 1, wherein the pressure regulator comprises a first pressure suction pipe, the first pressure suction pipe communicates with the pipe body through a first connecting pipe, and the first pressure suction pipe is used for Regulating the pressure inside the tube.
The coating device according to claim 2, wherein the pressure regulator further comprises a liquid storage tank and a quantitative adjustment member, and the quantitative adjustment member is arranged between the first pressure suction pipe and the liquid storage tank On the fluid path, the quantitative adjustment member is used to adjust the flow rate of the protection liquid discharged from the liquid storage tank, and discharge the protection liquid quantitatively.
The coating device according to claim 1, wherein the pressure regulator comprises a second pressure suction pipe sleeved on the pipe body for adjusting the pressure in the pipe body.
The coating device according to claim 1, wherein the frame comprises a base and a support rod, the support rod is arranged on the base, the pipe body is arranged on the support rod, and the pipe body slide relative to the support rod.
The coating device according to claim 5, wherein the support rod comprises a first section connected to a second section, the first section connected to the base;

The pipe body is arranged on the second section through an adjustment assembly.
The coating device according to claim 6, wherein grooves are provided on the second section;

The adjusting assembly includes a connecting piece, a transmission piece and an adjusting piece, the transmission piece is installed in the groove, the connecting piece is respectively connected with the transmission piece and the pipe body, and the connecting piece is set to follow The transmission member moves, the pipe body is configured to be able to rotate relative to the connecting member, and the connecting member is arranged at an end of the transmission member away from the first section;

The adjustment member is connected with the transmission member, and the adjustment member rotates under the action of an external force to drive the transmission member to move along the groove.
The coating device according to claim 7, wherein the transmission member includes a transmission rack, the adjustment member includes a transmission gear, and the transmission rack is engaged with the transmission gear;

or,

The transmission member includes a chain, and the adjustment member includes a sprocket.
The coating device according to any one of claims 1-8, wherein the tube body comprises a needle tube and a fixing rod, the liquid outlet is arranged at one end of the needle tube, and the other end of the needle tube is connected to the other end of the needle tube. The fixing rod is sealed and connected, and the pressure regulator passes through the fixing rod and communicates with the needle tube.
The coating device according to claim 9, wherein the cross-sectional diameter of the liquid outlet is 10 nm˜500 nm.
The coating device according to claim 10, wherein a heater is attached to the needle tube.
An apparatus for coating a semiconductor structure with colloid, comprising:

a support platform, the support platform has a bearing surface, and the bearing surface is used to carry a sample, wherein the sample includes a region to be coated;

an observation assembly, the observation assembly is arranged at the edge of the support table;

And the coating device according to any one of claims 1-11, which is used for coating the area to be coated.
13. The apparatus for colloidally coating semiconductor structures of claim 12, wherein the observation component comprises a microscope.
A method for coating a colloid for a semiconductor structure, applied to the equipment for coating a colloid for a semiconductor structure as claimed in claim 12 or 13, comprising the following steps:

placing the sample with the area to be coated on the bearing surface of the support table of the device;

Obtaining the location of the area to be coated using a viewing assembly of the device;

moving the coating device of the equipment so that the liquid outlet of the tube body of the coating device is located at a first position above the area to be coated;

Controlling the operation of the pressure regulator in the coating device, so that the protective liquid in the pipe body drops to the area to be coated through the liquid outlet.
The method for coating a colloid on a semiconductor structure according to claim 14, wherein said method further comprises:

moving the coating device, adjusting the distance between the liquid outlet and the area to be coated, so that the liquid outlet is located at a second position above the area to be coated;

Wherein, the vertical distance between the first position and the area to be coated is larger than the vertical distance between the second position and the area to be coated.