WO2023032991A1 - Heater and hair iron - Google Patents

Heater and hair iron Download PDF

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Publication number
WO2023032991A1
WO2023032991A1 PCT/JP2022/032628 JP2022032628W WO2023032991A1 WO 2023032991 A1 WO2023032991 A1 WO 2023032991A1 JP 2022032628 W JP2022032628 W JP 2022032628W WO 2023032991 A1 WO2023032991 A1 WO 2023032991A1
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WIPO (PCT)
Prior art keywords
resistor
heater
ceramic body
bimetal switch
heater according
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PCT/JP2022/032628
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French (fr)
Japanese (ja)
Inventor
昭 津川
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京セラ株式会社
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Publication of WO2023032991A1 publication Critical patent/WO2023032991A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating

Definitions

  • the disclosed embodiments relate to heaters and curling irons.
  • a heater having a heating resistor inside a ceramic body is conventionally known. Such heaters are used, for example, in electric heating appliances such as hair irons.
  • a heater includes a ceramic body, a heating resistor, and a bimetal switch.
  • the ceramic body has a first side and a second side opposite the first side.
  • the heating resistor is located inside the ceramic body and has a first resistor and a second resistor.
  • a bimetal switch is positioned between the first resistor and the second resistor.
  • FIG. 1 is a perspective view showing a heater according to an embodiment
  • FIG. FIG. 2 is an exploded perspective view showing an example of a heater according to the embodiment
  • FIG. 5 is an enlarged view of area B shown in FIG.
  • FIG. 6 is a cross-sectional view showing another example of the heater according to the embodiment.
  • FIG. 7 is a perspective view showing another example of the heater according to the embodiment; 8 is a sectional view of the heater shown in FIG. 7.
  • FIG. 11 is a cross-sectional view showing another example of the heater according to the embodiment
  • FIG. 12 is a perspective view showing another example of the heater according to the embodiment
  • 13 is a sectional view of the heater shown in FIG. 12.
  • FIG. FIG. 14 is a plan view showing another example of the heater according to the embodiment
  • FIG. 15 is a plan view showing another example of the heater according to the embodiment;
  • Such a heater may be used, for example, with a fuse that cuts off current when the temperature rises abnormally.
  • a fuse that has been de-energized cannot be reused and needs to be replaced, it is desired to improve user convenience.
  • the fuse detection speed follows the heater temperature rise speed when the heater temperature rises rapidly, when the heat transfer around the heater is poor, when the heater heats up locally, etc. There was a risk that the heater would overheat due to the fuse detecting the temperature at a low level.
  • FIG. 1 is a perspective view showing a heater according to an embodiment
  • the heater 1 includes a bimetal switch 10, a first substrate 20, a second substrate 30, a heating resistor 31, and a pair of lead wires 40.
  • the heater 1 is configured such that the energization state of the heating resistor 31 electrically connected to the pair of lead wires 40 can be switched by the bimetal switch 10 located on the first surface 1a which is the surface of the heater 1. is.
  • Such a heater 1 is used for applications such as a hair iron, for example.
  • FIG. 1 shows a three-dimensional orthogonal coordinate system including the Z-axis extending along the thickness direction of the heater 1 .
  • Such an orthogonal coordinate system is also shown in other drawings used in the description below.
  • FIG. 2 is an exploded perspective view showing an example of the heater according to the embodiment.
  • FIG. 3 is a plan view showing the heater according to the embodiment. 4 is a cross-sectional view taken along the line AA shown in FIG. 3.
  • FIG. 3 is a plan view showing the heater according to the embodiment. 4 is a cross-sectional view taken along the line AA shown in FIG. 3.
  • the bimetal switch 10 has a fixed portion 13 and bimetal portions 11 and 12 .
  • the fixed part 13 is fixed to the surface of the heater 1 .
  • the fixing portion 13 can be made of heat-resistant material such as phenol resin, polyphenylene sulfide resin, or ceramic material such as alumina.
  • the fixed portion 13 may be fixed to the first surface 1a of the heater 1 by, for example, a bonding material.
  • the bimetal parts 11 and 12 are plate-like members, for example, and are laminates in which two types of metal materials having different coefficients of thermal expansion are superimposed.
  • the laminate may have, for example, a high-expansion layer containing a small amount of Cr, Mn, Mg, etc. in an alloy of iron and nickel, and a low-expansion layer made of Invar.
  • the bimetal parts 11 and 12 are deformed so that the contacts with the pads 21 and 22 described later are separated. As a result, the bimetal parts 11 and 12 cancel the energization of the heating resistor 31 through the lead wire 40 . Also, the bimetal parts 11 and 12 are deformed so as to come into contact with the pads 21 and 22, for example, when the temperature of the bimetal switch 10 drops below a predetermined temperature. As a result, the bimetal parts 11 and 12 restart the energization of the heating resistor 31 . That is, the bimetal parts 11 and 12 repeat contact and separation with the pads 21 and 22 in response to the temperature change of the heater 1 .
  • the contact point is slightly displaced due to the difference in thermal expansion. Even so, the stress due to the difference in thermal expansion is difficult to concentrate. Therefore, even if the heater 1 is used for a long period of time, the contacts between the bimetal parts 11 and 12 and the pads 21 and 22 are unlikely to be broken, and the detection sensitivity is unlikely to be lowered.
  • the first substrate 20 has a ceramic body 201 , pads 21 and 22 , vias 23 and 24 and recesses 25 .
  • the ceramic body 201 is a flat member having a first surface 20a and a second surface 20b.
  • the first surface 20a is located on the surface of the heater 1 and also serves as the first surface 1a (see FIG. 1).
  • the second surface 20 b is located on the opposite side of the first surface 20 a and faces the second substrate 30 .
  • the material of the ceramic body 201 is, for example, insulating ceramics.
  • As the material of the ceramic body 201 for example, oxide ceramics, nitride ceramics, carbide ceramics, or the like can be used. Specifically, alumina ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, or the like can be used as the material of the ceramic body 201 .
  • the pads 21 and 22 are located on the first surface 20a of the ceramic body 201.
  • the pads 21 and 22 are positioned so as to overlap the vias 23 and 24 in plan view.
  • Pads 21 and 22 are portions with which bimetal portions 11 and 12 of bimetal switch 10 are in contact.
  • the spacing and size of the pads 21 and 22 are set according to the shape of the bimetal switch 10, for example.
  • a metallic material such as tungsten can be used as tungsten.
  • the vias 23 and 24 extend in the thickness direction of the first substrate 20 and are positioned so that one end thereof is exposed on the second surface 20b. The other ends of vias 23 and 24 are electrically connected to pads 21 and 22 .
  • the vias 23,24 may have the same material as the pads 21,22, for example.
  • Vias 23 and 24 may also contain, for example, molybdenum, copper, silver, nickel, or the like.
  • the concave portion 25 is positioned so as to be in contact with the end surface 20c positioned at one end in the length direction of the ceramic body 201 .
  • the recess 25 is open so as to penetrate the first surface 20 a and the second surface 20 b of the first substrate 20 .
  • a lead wire 40 fixed with a bonding material is accommodated in the recess 25 .
  • the second substrate 30 has a ceramic body 301, a heating resistor 31, terminals 31a and 31b, and a conductor 32.
  • the ceramic body 301 is a flat member having a first surface 30a and a second surface 30b.
  • the first surface 30 a faces the first substrate 20 .
  • the second surface 20b is located on the opposite side of the first surface 30a and also serves as the second surface 1b of the heater 1 (see FIG. 8).
  • the ceramic bodies 201 and 301 may be collectively referred to as the ceramic body 2 .
  • the heating resistor 31 is positioned on the ceramic body 301 .
  • the heating resistor 31 is a member that generates heat when current flows.
  • the heat generating resistor 31 forms a heat generating region 35 on the other end side (X-axis negative direction side) of the heater 1 in the length direction.
  • Heating resistor 31 may include a high resistance conductor including, for example, tungsten, molybdenum, and the like.
  • the heating resistor 31 has a first resistor 311 and a second resistor 312 .
  • the first resistor 311 has one end connected to the terminal 31 a and the other end connected to the first conductor 32 a of the conductor 32 .
  • the second resistor 312 has one end connected to the terminal 31 b and the other end connected to the second conductor 32 b of the conductor 32 .
  • the shapes of the first resistor 311 and the second resistor 312 are not limited to those shown in the drawings, and can be changed as appropriate according to the heat generation characteristics required of the heater 1, for example.
  • the terminals 31a and 31b are positioned directly below the vias 23 and 24 and are electrically connected to the vias 23 and 24.
  • the material of the terminals 31a and 31b may be the same as that of the heating resistor 31, for example.
  • the conductor 32 is electrically connected to the heating resistor 31.
  • the conductor 32 has a first conductor 32a and a second conductor 32b.
  • the first conductor 32a is connected to the first resistor 311 and connected to the first lead 41 of the lead wire 40 via a bonding material.
  • the second conductor 32b is connected to the second resistor 312 and is connected to the second lead 42 of the lead wire 40 via a bonding material.
  • the conductor 32 is positioned so as to overlap the recess 25 in plan view.
  • the conductor 32 may be, for example, a metal material containing tungsten, molybdenum, or the like, or plated with a metal material such as nickel.
  • the material of the conductor 32 may be the same as that of the heating resistor 31, or may be different.
  • As a bonding material for bonding the conductor 32 and the lead wire 40 for example, solder or brazing material such as silver solder can be used.
  • the lead wire 40 is, for example, a wire containing a metal material such as nickel, iron, or a nickel-based heat-resistant alloy.
  • the lead wire 40 is drawn out of the heater 1 from the recess 25 .
  • the cross section of the lead wire 40 may be circular, elliptical, or rectangular, for example.
  • the outer diameter of the lead wire 40 may be, for example, 0.5-2.0 mm.
  • the lead wire 40 has a first lead 41 and a second lead 42 .
  • the first lead 41 is connected to the first resistor 311 .
  • the second lead 42 is connected to the second resistor 312 .
  • the first lead 41 and the second lead 42 are electrically connected to an external power supply.
  • FIG. FIG. 5 is an enlarged view of area B shown in FIG.
  • pads 21 and 22 may be located directly above vias 23 and 24, respectively. Since the vias 23 and 24 have higher thermal conductivity than the ceramic body 2, the excessive temperature rise inside the heater 1 is likely to be reflected. If the pads 21 and 22, which are the contacts of the bimetal switch 10, are positioned directly above the vias 23 and 24, for example, responsiveness to excessive temperature rise is enhanced.
  • the pads 21 and 22 may protrude from the first surface 20a toward the bimetal parts 11 and 12 of the bimetal switch 10, respectively. As a result, even if the ceramic body 2 is deformed due to thermal expansion, the pads 21 and 22 are positioned higher than the first surface 20a, thereby ensuring conduction except when an excessive temperature rise is detected. easier.
  • the bimetal portion 12 of the bimetal switch 10 may have a contact portion 12a projecting toward the pad 22.
  • the pad 22 may have a concave receiving portion 22a for receiving the contact portion 12a.
  • FIG. 6 is a cross-sectional view showing another example of the heater according to the embodiment.
  • the pad 22 may have a first layer 221 located on the first surface 20a (see FIG. 4) and a second layer 222 located on the first layer 221. good.
  • the hardness of the second layer 222 may be lower than that of the first layer 221 .
  • the second layer 222 may have a recessed receiving portion 22a for receiving the contact portion 12a.
  • the material of the first layer 221 may be tungsten, for example.
  • the material of the second layer 222 may be nickel, tin-nickel alloy, gold-nickel alloy, for example.
  • the pad 22 may be laminated with three or more layers.
  • the bimetal portion 12 and the pad 22 of the bimetal switch 10 have been described as an example, but the bimetal portion 11 and the pad 21 may be configured in the same manner.
  • the heater 1 may further include a holding member 50.
  • the clamping member 50 has clamping pieces 51 and 52 .
  • the clamping piece 51 has a first portion 51a, a second portion 51b, and a third portion 51c.
  • the first portion 51a is in contact with the fixing portion 13 of the bimetal switch 10 so as to press it toward the first substrate 20 side.
  • the third portion 51 c is in contact with the second substrate 30 so as to press the second surface 1 b of the heater 1 .
  • the second portion 51b is positioned between the first portion 51a and the third portion 51c and faces the side surface 1c of the heater 1 .
  • the second portion 51b may be in contact with or separated from the side surface 1c.
  • the clamping piece 52 has a first portion 52a, a second portion 52b, and a third portion 52c.
  • the first portion 52a is in contact with the fixing portion 13 so as to press it toward the first substrate 20 side.
  • the third portion 52c is in contact with the second substrate 30 so as to press the second surface 1b of the heater 1.
  • the second portion 52b is positioned between the first portion 52a and the third portion 52c and faces the side surface 1d of the heater 1. As shown in FIG.
  • the second portion 52b may be in contact with or separated from the side surface 1d.
  • the material of the holding member 50 may be stainless steel, for example.
  • the holding member 50 may fix the bimetal switch 10 by, for example, holding the bimetal switch 10 and the ceramic body 2 together.
  • the bimetal switch 10 and the ceramic body 2 are integrally sandwiched, the bimetal switch 10 can be easily fixed directly to the first surface 1a of the ceramic body 2 without using a bonding material. This makes it difficult for heat to dissipate via the bonding material, making it easier to detect an excessive temperature rise.
  • the holding member 50 may be fixed to the first surface 1a via a bonding material, for example.
  • FIG. 9 is a perspective view showing another example of the heater according to the embodiment. 10 is a cross-sectional view of the heater shown in FIG. 9.
  • FIG. 9 and 10 the holding member 50 shown in FIG. 8 may be configured to cover the first substrate 20 and the second substrate 30 entirely.
  • the holding member 50 may have a first portion 50a, a second portion 50b, a third portion 50c, a fourth portion 50d, and a fifth portion 50e.
  • the first portion 50a and the fifth portion 50e located at both ends of the clamping member 50 press the fixing portion 13 of the bimetal switch 10 toward the first substrate 20 side.
  • the third portion 50 c is in contact with the second substrate 30 so as to press the second surface 1 b of the heater 1 .
  • the second portion 50b is positioned between the first portion 50a and the third portion 50c and faces the side surface 1c of the heater 1.
  • the fourth portion 50d is positioned between the third portion 50c and the fifth portion 50e and faces the side surface 1d of the heater 1.
  • the second portion 50b and the fourth portion 50d may be in contact with or separated from the side surfaces 1c and 1d, respectively.
  • the holding member 50 shown in FIGS. 9 and 10 may function as a case that accommodates the ceramic body 2 and the bimetal switch 10. As a result, even if the contact points between the bimetal switch 10 and the pads 21 and 22 are displaced due to differences in thermal expansion at various parts in the heater 1, stress is not applied to the bimetal switch 10, and durability is improved. do. Further, since the bimetal switch 10 detects an excessive temperature rise inside the clamping member 50 as a case, for example, detection accuracy is improved.
  • FIG. 11 is a cross-sectional view showing another example of the heater according to the embodiment. As shown in FIG. 11, a pressing member 60 positioned above the bimetal switch 10 shown in FIG. 10 may be further provided.
  • the material of the pressing member 60 may be, for example, a heat-resistant material, such as a resin such as phenol resin or polyphenylene sulfide resin. Also, the material of the pressing member 60 may be a ceramic material such as alumina. The material of the pressing member 60 may also be a metal material such as nickel, iron, or a nickel-based heat-resistant alloy.
  • the clamping member 50 may, for example, indirectly press the bimetal switch 10 via the pressing member 60 without contacting it. This improves the durability of the bimetal switch 10 .
  • FIG. 12 is a perspective view showing another example of the heater according to the embodiment.
  • 13 is a sectional view of the heater shown in FIG. 12.
  • the pressing member 60 that presses the bimetal switch 10 may have a width in the Y-axis direction larger than that of the fixed portion 13 .
  • the pressing member 60 may have a first region 61 that contacts the fixed portion 13 of the bimetal switch 10 and a second region 62 that does not contact the fixed portion 13 .
  • the first portion 50 a and the fifth portion 50 e of the holding member 50 may be positioned so as to contact the second region 62 of the pressing member 60 .
  • the pressing member 60 can be flexed like a spring to fix the bimetal switch 10 . Therefore, the durability of the bimetal switch 10 is improved.
  • FIG. 14 is a plan view showing another example of the heater according to the embodiment. 14, the illustration of the bimetal switch 10 and the first substrate 20 is omitted.
  • the heater 1 may further include a temperature measuring resistor 33 and a conductor 34.
  • the temperature measuring resistor 33 is located on the first surface 30a of the second substrate 30.
  • the temperature measuring resistor 33 is arranged side by side with the first resistor 311 and the second resistor 312 .
  • the resistance temperature detector 33 is connected to lead wires 43 and 44 via a conductor 34 .
  • the conductor 34 has a first conductor 34a and a second conductor 34b.
  • the first conductor 34a and the second conductor 34b are positioned with a predetermined gap between the first conductor 32a and the second conductor 32b.
  • the temperature measuring resistor 33 has one end connected to the first conductor 34a and the other end connected to the second conductor 34b.
  • the first conductor 34 a is connected to the lead wire 43 and the second conductor 34 b is connected to the lead wire 44 .
  • the temperature measuring resistor 33 may be a temperature sensor for controlling the internal temperature of the heater 1, for example.
  • the material of the temperature sensing resistor 33 may be, for example, a high-resistance conductor containing tungsten, molybdenum, or platinum.
  • the temperature sensing resistor 33 can detect the temperature of the entire heater 1 and control the temperature of the heater 1 . For example, by detecting excessive temperature rise with the bimetal switch 10 while performing temperature control with the temperature measuring resistor 33, user convenience is improved.
  • FIG. 15 is a plan view showing another example of the heater according to the embodiment. As shown in FIG. 15, a resistance temperature detector 33 may be positioned in a terminal-to-terminal region 31c between terminals 31a and 31b of the heater 1 shown in FIG.
  • the temperature measuring resistor 33 may have an inter-terminal portion 33a positioned in the inter-terminal region 31c.
  • the inter-terminal portion 33a may be repeatedly bent so as to extend along the second direction along the Y-axis direction intersecting the X-axis with respect to the first direction along the X-axis.
  • the temperature sensing resistor 33 may have a cross-sectional area of the inter-terminal portion 33a smaller than the cross-sectional area of the portion other than the inter-terminal portion 33a. As a result, the accuracy of detection by the resistance temperature detector 33 is improved immediately below the bimetal switch 10 .
  • the heater 1 includes the ceramic body 2, the heating resistor 31, and the bimetal switch 10.
  • the ceramic body 2 has a first side 1a and a second side 1b opposite the first side 1a.
  • the heating resistor 31 is positioned inside the ceramic body 2 and has a first resistor 311 and a second resistor 322 .
  • the bimetal switch 10 is positioned between the first resistor 311 and the second resistor 312 and switches the energization state to the heating resistor 31 . Thereby, user convenience can be improved.
  • the hair iron according to the embodiment includes the heater 1 described above.
  • the heater 1 is less likely to overheat and can be stably used for a long period of time, so that, for example, it is possible to provide an excellent curling iron that does not damage the hair.

Abstract

This heater comprises a ceramic body, a heat generation resistor, and a bimetal switch. The ceramic body has: a first surface; and a second surface located opposite to the first surface. The heat generation resistor is located inside the ceramic body, and has a first resistor and a second resistor. The bimetal switch is located between the first resistor and the second resistor.

Description

ヒータおよびヘアアイロンheater and curling iron
　開示の実施形態は、ヒータおよびヘアアイロンに関する。 The disclosed embodiments relate to heaters and curling irons.
　従来、セラミック体の内部に発熱抵抗体を有するヒータが知られている。このようなヒータは、例えばヘアアイロンなどの電熱器具に利用される。 A heater having a heating resistor inside a ceramic body is conventionally known. Such heaters are used, for example, in electric heating appliances such as hair irons.
特開２００９－２４５７２９号公報JP 2009-245729 A
　実施形態の一態様に係るヒータは、セラミック体と、発熱抵抗体と、バイメタルスイッチとを備える。セラミック体は、第１面および前記第１面の反対に位置する第２面を有している。発熱抵抗体は、前記セラミック体の内部に位置し、第１抵抗体および第２抵抗体を有している。バイメタルスイッチは、前記第１抵抗体と前記第２抵抗体との間に位置している。 A heater according to one aspect of an embodiment includes a ceramic body, a heating resistor, and a bimetal switch. The ceramic body has a first side and a second side opposite the first side. The heating resistor is located inside the ceramic body and has a first resistor and a second resistor. A bimetal switch is positioned between the first resistor and the second resistor.
図１は、実施形態に係るヒータを示す斜視図である。1 is a perspective view showing a heater according to an embodiment; FIG. 図２は、実施形態に係るヒータの一例を示す分解斜視図である。FIG. 2 is an exploded perspective view showing an example of a heater according to the embodiment; 図３は、実施形態に係るヒータを示す平面図である。FIG. 3 is a plan view showing the heater according to the embodiment. 図４は、図３に示すＡ－Ａ線の断面図である。4 is a cross-sectional view taken along the line AA shown in FIG. 3. FIG. 図５は、図４に示す領域Ｂの拡大図である。FIG. 5 is an enlarged view of area B shown in FIG. 図６は、実施形態係るヒータの別の一例を示す断面図である。FIG. 6 is a cross-sectional view showing another example of the heater according to the embodiment. 図７は、実施形態に係るヒータの別の一例を示す斜視図である。FIG. 7 is a perspective view showing another example of the heater according to the embodiment; 図８は、図７に示すヒータの断面図である。8 is a sectional view of the heater shown in FIG. 7. FIG. 図９は、実施形態に係るヒータの別の一例を示す斜視図である。FIG. 9 is a perspective view showing another example of the heater according to the embodiment; 図１０は、図９に示すヒータの断面図である。10 is a cross-sectional view of the heater shown in FIG. 9. FIG. 図１１は、実施形態に係るヒータの別の一例を示す断面図である。FIG. 11 is a cross-sectional view showing another example of the heater according to the embodiment; 図１２は、実施形態に係るヒータの別の一例を示す斜視図である。FIG. 12 is a perspective view showing another example of the heater according to the embodiment; 図１３は、図１２に示すヒータの断面図である。13 is a sectional view of the heater shown in FIG. 12. FIG. 図１４は、実施形態に係るヒータの別の一例を示す平面図である。FIG. 14 is a plan view showing another example of the heater according to the embodiment; 図１５は、実施形態に係るヒータの別の一例を示す平面図である。FIG. 15 is a plan view showing another example of the heater according to the embodiment;
　かかるヒータは、例えば、異常昇温時に通電を遮断させるヒューズとともに用いられる場合がある。しかしながら、通電を遮断したヒューズは再利用できず、交換する必要があることから、ユーザの利便性向上が望まれている。 Such a heater may be used, for example, with a fuse that cuts off current when the temperature rises abnormally. However, since a fuse that has been de-energized cannot be reused and needs to be replaced, it is desired to improve user convenience.
　さらには、ヒータ表面にヒューズを接触するように搭載した場合において、ヒータとの接触が悪い場合には、温度が低めに検知されてヒータが過昇温するおそれがあった。また、精度よく接触させた場合でも、ヒータが急速に昇温した場合、ヒータ周囲の熱引きが悪い場合、ヒータが局所的に加熱した場合などにヒューズの検知速度がヒータの昇温速度に追随できずにヒューズが温度を低めに検知することで、ヒータが過昇温するおそれがあった。 Furthermore, when the fuse is mounted in contact with the surface of the heater, if the contact with the heater is poor, the temperature may be detected as low and the heater may overheat. In addition, even when contact is made with good precision, the fuse detection speed follows the heater temperature rise speed when the heater temperature rises rapidly, when the heat transfer around the heater is poor, when the heater heats up locally, etc. There was a risk that the heater would overheat due to the fuse detecting the temperature at a low level.
　そこで、ユーザの利便性を向上することができるヒータおよびヘアアイロンの提供が期待されている。 Therefore, the provision of heaters and curling irons that can improve user convenience is expected.
　以下、添付図面を参照して、本願の開示するヒータおよびヘアアイロンの実施形態について説明する。なお、以下に示す実施形態により本開示が限定されるものではない。また、図面は模式的なものであり、各要素の寸法の関係、各要素の比率などは、現実と異なる場合があることに留意する必要がある。 Hereinafter, embodiments of a heater and a hair iron disclosed in the present application will be described with reference to the accompanying drawings. It should be noted that the present disclosure is not limited by the embodiments shown below. Also, it should be noted that the drawings are schematic, and the relationship of dimensions of each element, the ratio of each element, and the like may differ from reality.
＜実施形態＞
　最初に、実施形態に係るヒータについて、図１～図５を参照しながら説明する。図１は、実施形態に係るヒータを示す斜視図である。 <Embodiment>
First, a heater according to an embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a perspective view showing a heater according to an embodiment; FIG.
　図１に示すように、実施形態に係るヒータ１は、バイメタルスイッチ１０と、第１基板２０と、第２基板３０と、発熱抵抗体３１と、一対のリード線４０とを備える。ヒータ１は、一対のリード線４０と電気的に接続された発熱抵抗体３１への通電状態を、ヒータ１の表面である第１面１ａに位置するバイメタルスイッチ１０によって切り替え可能に構成されたものである。かかるヒータ１は、例えば、ヘアアイロンなどの用途に用いられる。 As shown in FIG. 1, the heater 1 according to the embodiment includes a bimetal switch 10, a first substrate 20, a second substrate 30, a heating resistor 31, and a pair of lead wires 40. The heater 1 is configured such that the energization state of the heating resistor 31 electrically connected to the pair of lead wires 40 can be switched by the bimetal switch 10 located on the first surface 1a which is the surface of the heater 1. is. Such a heater 1 is used for applications such as a hair iron, for example.
　なお、説明を分かりやすくするために、図１には、ヒータ１の厚み方向に沿って延びるＺ軸を含む３次元の直交座標系を図示している。かかる直交座標系は、後出の説明に用いる他の図面でも示している。 In order to make the explanation easier to understand, FIG. 1 shows a three-dimensional orthogonal coordinate system including the Z-axis extending along the thickness direction of the heater 1 . Such an orthogonal coordinate system is also shown in other drawings used in the description below.
　図２は、実施形態に係るヒータの一例を示す分解斜視図である。図３は、実施形態に係るヒータを示す平面図である。図４は、図３に示すＡ－Ａ線の断面図である。 FIG. 2 is an exploded perspective view showing an example of the heater according to the embodiment. FIG. 3 is a plan view showing the heater according to the embodiment. 4 is a cross-sectional view taken along the line AA shown in FIG. 3. FIG.
　バイメタルスイッチ１０は、固定部１３と、バイメタル部１１，１２とを有する。固定部１３は、ヒータ１の表面に固定される。固定部１３は、耐熱性を有する材料、例えば、フェノール樹脂、ポリフェニレンサルファイド樹脂またはアルミナ等のセラミック材料などを使用できる。固定部１３は、例えば接合材によりヒータ１の第１面１ａに固定されてもよい。 The bimetal switch 10 has a fixed portion 13 and bimetal portions 11 and 12 . The fixed part 13 is fixed to the surface of the heater 1 . The fixing portion 13 can be made of heat-resistant material such as phenol resin, polyphenylene sulfide resin, or ceramic material such as alumina. The fixed portion 13 may be fixed to the first surface 1a of the heater 1 by, for example, a bonding material.
　バイメタル部１１，１２は、例えば、板状部材であり、熱膨張率の異なる二種類の金属材料を重ね合わせた積層体である。積層体は、例えば、鉄とニッケルの合金に、少量のＣｒ、Ｍｎ、Ｍｇなどを含む高膨張層と、インバーからなる低膨張層とを有してもよい。 The bimetal parts 11 and 12 are plate-like members, for example, and are laminates in which two types of metal materials having different coefficients of thermal expansion are superimposed. The laminate may have, for example, a high-expansion layer containing a small amount of Cr, Mn, Mg, etc. in an alloy of iron and nickel, and a low-expansion layer made of Invar.
　バイメタル部１１，１２は、例えば、バイメタルスイッチ１０が所定温度以上になると、後述するパッド２１，２２との接点が離れるように変形する。これにより、バイメタル部１１，１２は、リード線４０を介した発熱抵抗体３１への通電を解除させる。また、バイメタル部１１，１２は、例えば、バイメタルスイッチ１０が所定温度以下になると、パッド２１，２２と接触するように変形する。これにより、バイメタル部１１，１２は、発熱抵抗体３１への通電を再開させる。すなわち、バイメタル部１１，１２は、ヒータ１の温度変化に応答し、パッド２１，２２との接離を繰り返す。 For example, when the temperature of the bimetal switch 10 reaches or exceeds a predetermined temperature, the bimetal parts 11 and 12 are deformed so that the contacts with the pads 21 and 22 described later are separated. As a result, the bimetal parts 11 and 12 cancel the energization of the heating resistor 31 through the lead wire 40 . Also, the bimetal parts 11 and 12 are deformed so as to come into contact with the pads 21 and 22, for example, when the temperature of the bimetal switch 10 drops below a predetermined temperature. As a result, the bimetal parts 11 and 12 restart the energization of the heating resistor 31 . That is, the bimetal parts 11 and 12 repeat contact and separation with the pads 21 and 22 in response to the temperature change of the heater 1 .
　例えば、バイメタル部１１，１２とパッド２１，２２とが接触して導通している状態において、ヒータ１が温度上昇に伴って熱膨張した場合には、熱膨張差でわずかに接点がずれた場合であっても、熱膨張差による応力は集中しにくい。そのため、ヒータ１を長期間使用してもバイメタル部１１，１２とパッド２１，２２との接点は壊れにくく、検知感度が低下しにくい。 For example, when the heater 1 thermally expands due to a rise in temperature in a state where the bimetal parts 11 and 12 and the pads 21 and 22 are in contact with each other and are electrically connected to each other, the contact point is slightly displaced due to the difference in thermal expansion. Even so, the stress due to the difference in thermal expansion is difficult to concentrate. Therefore, even if the heater 1 is used for a long period of time, the contacts between the bimetal parts 11 and 12 and the pads 21 and 22 are unlikely to be broken, and the detection sensitivity is unlikely to be lowered.
　第１基板２０は、セラミック体２０１と、パッド２１，２２と、ビア２３，２４と、凹部２５とを有する。セラミック体２０１は、第１面２０ａおよび第２面２０ｂを有する平板状の部材である。第１面２０ａは、ヒータ１の表面に位置しており、第１面１ａ（図１参照）を兼ねている。第２面２０ｂは、第１面２０ａとは反対側に位置し、第２基板３０と向かい合っている。 The first substrate 20 has a ceramic body 201 , pads 21 and 22 , vias 23 and 24 and recesses 25 . The ceramic body 201 is a flat member having a first surface 20a and a second surface 20b. The first surface 20a is located on the surface of the heater 1 and also serves as the first surface 1a (see FIG. 1). The second surface 20 b is located on the opposite side of the first surface 20 a and faces the second substrate 30 .
　セラミック体２０１の材料は、例えば、絶縁性を有するセラミックスである。セラミック体２０１の材料としては、例えば、酸化物セラミックス、窒化物セラミックスまたは炭化物セラミックス等を使用することができる。具体的には、アルミナ質セラミックス、窒化珪素質セラミックス、窒化アルミニウム質セラミックス、炭化珪素質セラミックス等をセラミック体２０１の材料として用いることができる。 The material of the ceramic body 201 is, for example, insulating ceramics. As the material of the ceramic body 201, for example, oxide ceramics, nitride ceramics, carbide ceramics, or the like can be used. Specifically, alumina ceramics, silicon nitride ceramics, aluminum nitride ceramics, silicon carbide ceramics, or the like can be used as the material of the ceramic body 201 .
　パッド２１，２２は、セラミック体２０１の第１面２０ａ上に位置している。パッド２１，２２は、平面視でビア２３，２４と重なるように位置している。パッド２１，２２は、バイメタルスイッチ１０のバイメタル部１１，１２が接する部分である。パッド２１，２２の間隔およびサイズは、例えば、バイメタルスイッチ１０の形状等に応じて設定される。パッド２１，２２の材料としては、例えば、タングステンなどの金属材料を使用することができる。 The pads 21 and 22 are located on the first surface 20a of the ceramic body 201. The pads 21 and 22 are positioned so as to overlap the vias 23 and 24 in plan view. Pads 21 and 22 are portions with which bimetal portions 11 and 12 of bimetal switch 10 are in contact. The spacing and size of the pads 21 and 22 are set according to the shape of the bimetal switch 10, for example. As a material for the pads 21 and 22, for example, a metallic material such as tungsten can be used.
　ビア２３，２４は、第１基板２０の厚み方向に延び、一端が第２面２０ｂに露出するように位置している。ビア２３，２４の他端は、パッド２１，２２と電気的に接続されている。 The vias 23 and 24 extend in the thickness direction of the first substrate 20 and are positioned so that one end thereof is exposed on the second surface 20b. The other ends of vias 23 and 24 are electrically connected to pads 21 and 22 .
　ビア２３，２４は、例えば、パッド２１，２２と同じ材料を有してもよい。また、ビア２３，２４は、例えば、モリブデン、銅、銀、ニッケルなどを含有してもよい。 The vias 23,24 may have the same material as the pads 21,22, for example. Vias 23 and 24 may also contain, for example, molybdenum, copper, silver, nickel, or the like.
　凹部２５は、セラミック体２０１の長さ方向の一端に位置する端面２０ｃに接するように位置している。凹部２５は、第１基板２０の第１面２０ａおよび第２面２０ｂを貫通するように開口している。凹部２５には、接合材で固定されたリード線４０が収容される。 The concave portion 25 is positioned so as to be in contact with the end surface 20c positioned at one end in the length direction of the ceramic body 201 . The recess 25 is open so as to penetrate the first surface 20 a and the second surface 20 b of the first substrate 20 . A lead wire 40 fixed with a bonding material is accommodated in the recess 25 .
　第２基板３０は、セラミック体３０１と、発熱抵抗体３１と、端子３１ａ，３１ｂと、導体３２とを有する。セラミック体３０１は、第１面３０ａおよび第２面３０ｂを有する平板状の部材である。第１面３０ａは、第１基板２０と向かい合っている。第２面２０ｂは、第１面３０ａとは反対側に位置し、ヒータ１の第２面１ｂ（図８参照）を兼ねている。以下、セラミック体２０１，３０１を総称して、セラミック体２と称する場合がある。 The second substrate 30 has a ceramic body 301, a heating resistor 31, terminals 31a and 31b, and a conductor 32. The ceramic body 301 is a flat member having a first surface 30a and a second surface 30b. The first surface 30 a faces the first substrate 20 . The second surface 20b is located on the opposite side of the first surface 30a and also serves as the second surface 1b of the heater 1 (see FIG. 8). Hereinafter, the ceramic bodies 201 and 301 may be collectively referred to as the ceramic body 2 .
　発熱抵抗体３１は、セラミック体３０１の上に位置している。発熱抵抗体３１は、電流が流れることによって発熱する部材である。発熱抵抗体３１は、ヒータ１の長さ方向の他端側（Ｘ軸負方向側）に発熱領域３５を形成する。発熱抵抗体３１は、例えば、タングステン、モリブデンなどを含む高抵抗の導体を含んでよい。 The heating resistor 31 is positioned on the ceramic body 301 . The heating resistor 31 is a member that generates heat when current flows. The heat generating resistor 31 forms a heat generating region 35 on the other end side (X-axis negative direction side) of the heater 1 in the length direction. Heating resistor 31 may include a high resistance conductor including, for example, tungsten, molybdenum, and the like.
　発熱抵抗体３１は、第１抵抗体３１１と第２抵抗体３１２とを有する。第１抵抗体３１１は、一端が端子３１ａに接続され、他端が導体３２の第１導体３２ａに接続されている。第２抵抗体３１２は、一端が端子３１ｂに接続され、他端が導体３２の第２導体３２ｂに接続されている。なお、第１抵抗体３１１および第２抵抗体３１２の形状は、図示したものに限られず、例えば、ヒータ１に要求される発熱特性に応じて適宜変更することができる。 The heating resistor 31 has a first resistor 311 and a second resistor 312 . The first resistor 311 has one end connected to the terminal 31 a and the other end connected to the first conductor 32 a of the conductor 32 . The second resistor 312 has one end connected to the terminal 31 b and the other end connected to the second conductor 32 b of the conductor 32 . The shapes of the first resistor 311 and the second resistor 312 are not limited to those shown in the drawings, and can be changed as appropriate according to the heat generation characteristics required of the heater 1, for example.
　端子３１ａ，３１ｂは、ビア２３，２４の直下に位置しており、ビア２３，２４と電気的に接続されている。端子３１ａ，３１ｂの材料は、例えば、発熱抵抗体３１と同じであってもよい。 The terminals 31a and 31b are positioned directly below the vias 23 and 24 and are electrically connected to the vias 23 and 24. The material of the terminals 31a and 31b may be the same as that of the heating resistor 31, for example.
　導体３２は、発熱抵抗体３１と電気的に接続されている。導体３２は、第１導体３２ａと第２導体３２ｂとを有する。第１導体３２ａは、第１抵抗体３１１に接続され、接合材を介してリード線４０の第１リード４１に接続されている。第２導体３２ｂは、第２抵抗体３１２に接続され、接合材を介してリード線４０の第２リード４２に接続されている。導体３２は、平面視で凹部２５と重なるように位置している。導体３２は、例えば、タングステン、モリブデンなどを含む金属材料、さらにニッケルなどの金属材料をメッキしたものであってよい。導体３２の材料は、発熱抵抗体３１と同じであってもよく、異なってもよい。なお、導体３２とリード線４０とを接合する接合材としては、例えば、はんだまたは銀ろう等のろう材を用いることができる。 The conductor 32 is electrically connected to the heating resistor 31. The conductor 32 has a first conductor 32a and a second conductor 32b. The first conductor 32a is connected to the first resistor 311 and connected to the first lead 41 of the lead wire 40 via a bonding material. The second conductor 32b is connected to the second resistor 312 and is connected to the second lead 42 of the lead wire 40 via a bonding material. The conductor 32 is positioned so as to overlap the recess 25 in plan view. The conductor 32 may be, for example, a metal material containing tungsten, molybdenum, or the like, or plated with a metal material such as nickel. The material of the conductor 32 may be the same as that of the heating resistor 31, or may be different. As a bonding material for bonding the conductor 32 and the lead wire 40, for example, solder or brazing material such as silver solder can be used.
　リード線４０は、例えば、ニッケル、鉄またはニッケル系耐熱合金等の金属材料を含む線材である。リード線４０は、凹部２５からヒータ１の外部に引き出されている。リード線４０の断面は、例えば円形状であってもよく、楕円形状、矩形状であってもよい。リード線４０の外径は、例えば０．５～２．０ｍｍであってもよい。 The lead wire 40 is, for example, a wire containing a metal material such as nickel, iron, or a nickel-based heat-resistant alloy. The lead wire 40 is drawn out of the heater 1 from the recess 25 . The cross section of the lead wire 40 may be circular, elliptical, or rectangular, for example. The outer diameter of the lead wire 40 may be, for example, 0.5-2.0 mm.
　リード線４０は、第１リード４１と第２リード４２とを有する。第１リード４１は、第１抵抗体３１１に接続されている。第２リード４２は、第２抵抗体３１２に接続されている。第１リード４１および第２リード４２は、外部電源に電気的に接続される。 The lead wire 40 has a first lead 41 and a second lead 42 . The first lead 41 is connected to the first resistor 311 . The second lead 42 is connected to the second resistor 312 . The first lead 41 and the second lead 42 are electrically connected to an external power supply.
　次に、図４～図５を用いて、実施形態に係るヒータ１についてさらに説明する。図５は、図４に示す領域Ｂの拡大図である。 Next, the heater 1 according to the embodiment will be further described with reference to FIGS. 4 and 5. FIG. FIG. 5 is an enlarged view of area B shown in FIG.
　図４に示すように、パッド２１，２２は、ビア２３，２４の直上にそれぞれ位置していてもよい。ビア２３，２４は、セラミック体２よりも熱伝導性が高いことから、ヒータ１内部の過昇温が反映されやすい。かかるビア２３，２４の直上にバイメタルスイッチ１０の接点であるパッド２１，２２が位置していると、例えば、過昇温に対する応答性が高くなる。 As shown in FIG. 4, pads 21 and 22 may be located directly above vias 23 and 24, respectively. Since the vias 23 and 24 have higher thermal conductivity than the ceramic body 2, the excessive temperature rise inside the heater 1 is likely to be reflected. If the pads 21 and 22, which are the contacts of the bimetal switch 10, are positioned directly above the vias 23 and 24, for example, responsiveness to excessive temperature rise is enhanced.
　また、パッド２１，２２は、第１面２０ａからバイメタルスイッチ１０のバイメタル部１１，１２側に向けてそれぞれ突出していてもよい。これにより、セラミック体２が熱膨張により変形した場合であっても、パッド２１，２２が第１面２０ａよりも高い位置にあることで、過昇温を検知した場合を除いて導通が確保しやすくなる。 Also, the pads 21 and 22 may protrude from the first surface 20a toward the bimetal parts 11 and 12 of the bimetal switch 10, respectively. As a result, even if the ceramic body 2 is deformed due to thermal expansion, the pads 21 and 22 are positioned higher than the first surface 20a, thereby ensuring conduction except when an excessive temperature rise is detected. easier.
　また、図５に示すように、バイメタルスイッチ１０のバイメタル部１２は、パッド２２に向かうように突出する接点部１２ａを有してもよい。また、パッド２２は、接点部１２ａを受ける凹状の受け部２２ａを有してもよい。これにより、バイメタル部１２とパッド２２との接触面積が増大することから、例えばセラミック体２が熱膨張により変形した場合であっても、過昇温を検知した場合を除いて導通が確保しやすくなる。 Further, as shown in FIG. 5, the bimetal portion 12 of the bimetal switch 10 may have a contact portion 12a projecting toward the pad 22. Also, the pad 22 may have a concave receiving portion 22a for receiving the contact portion 12a. As a result, the contact area between the bimetal portion 12 and the pad 22 is increased, so even if the ceramic body 2 is deformed due to thermal expansion, for example, it is easy to ensure continuity except when an excessive temperature rise is detected. Become.
＜別の実施形態＞
　図６は、実施形態に係るヒータの別の一例を示す断面図である。図６に示すように、パッド２２は、第１面２０ａ（図４参照）の上に位置する第１層２２１と、第１層２２１の上に位置する第２層２２２とを有してもよい。 <Another embodiment>
FIG. 6 is a cross-sectional view showing another example of the heater according to the embodiment. As shown in FIG. 6, the pad 22 may have a first layer 221 located on the first surface 20a (see FIG. 4) and a second layer 222 located on the first layer 221. good.
　第２層２２２は、第１層２２１よりも硬度が小さくてもよい。第２層２２２は、接点部１２ａを受ける凹状の受け部２２ａを有してもよい。これにより、バイメタル部１２がパッド２２に圧接されることで接触面積の増大が期待できることから、例えばセラミック体２が熱膨張により変形した場合であっても、過昇温を検知した場合を除いて導通が確保しやすくなる。 The hardness of the second layer 222 may be lower than that of the first layer 221 . The second layer 222 may have a recessed receiving portion 22a for receiving the contact portion 12a. As a result, since the bimetal portion 12 is pressed against the pad 22, an increase in the contact area can be expected. It becomes easier to ensure continuity.
　ここで、第１層２２１の材料は、例えば、タングステンであってもよい。また、第２層２２２の材料は、例えば、ニッケル、錫－ニッケル合金、金－ニッケル合金であってもよい。また、パッド２２は、３層以上が積層されていてもよい。 Here, the material of the first layer 221 may be tungsten, for example. Also, the material of the second layer 222 may be nickel, tin-nickel alloy, gold-nickel alloy, for example. Moreover, the pad 22 may be laminated with three or more layers.
　なお、図５、図６では、バイメタルスイッチ１０のバイメタル部１２とパッド２２を例に挙げて説明したが、バイメタル部１１とパッド２１についても、同様に構成されてもよい。 5 and 6, the bimetal portion 12 and the pad 22 of the bimetal switch 10 have been described as an example, but the bimetal portion 11 and the pad 21 may be configured in the same manner.
　図７は、実施形態に係るヒータの別の一例を示す斜視図である。図８は、図７に示すヒータの断面図である。 FIG. 7 is a perspective view showing another example of the heater according to the embodiment. 8 is a sectional view of the heater shown in FIG. 7. FIG.
　図７および図８に示すように、ヒータ１は、挟持部材５０をさらに備えてもよい。 As shown in FIGS. 7 and 8, the heater 1 may further include a holding member 50.
　挟持部材５０は、挟持部片５１，５２を有する。挟持部片５１は、第１部分５１ａと、第２部分５１ｂと、第３部分５１ｃとを有する。第１部分５１ａは、バイメタルスイッチ１０の固定部１３を第１基板２０側に押圧するように接している。第３部分５１ｃは、ヒータ１の第２面１ｂを押圧するように第２基板３０に接している。第２部分５１ｂは、第１部分５１ａと第３部分５１ｃとの間に位置しており、ヒータ１の側面１ｃと向かい合って位置している。第２部分５１ｂは、側面１ｃと接していてもよく、離れていてもよい。 The clamping member 50 has clamping pieces 51 and 52 . The clamping piece 51 has a first portion 51a, a second portion 51b, and a third portion 51c. The first portion 51a is in contact with the fixing portion 13 of the bimetal switch 10 so as to press it toward the first substrate 20 side. The third portion 51 c is in contact with the second substrate 30 so as to press the second surface 1 b of the heater 1 . The second portion 51b is positioned between the first portion 51a and the third portion 51c and faces the side surface 1c of the heater 1 . The second portion 51b may be in contact with or separated from the side surface 1c.
　挟持部片５２は、第１部分５２ａと、第２部分５２ｂと、第３部分５２ｃとを有する。第１部分５２ａは、固定部１３を第１基板２０側に押圧するように接している。第３部分５２ｃは、ヒータ１の第２面１ｂを押圧するように第２基板３０に接している。第２部分５２ｂは、第１部分５２ａと第３部分５２ｃとの間に位置しており、ヒータ１の側面１ｄと向かい合って位置している。第２部分５２ｂは、側面１ｄと接していてもよく、離れていてもよい。 The clamping piece 52 has a first portion 52a, a second portion 52b, and a third portion 52c. The first portion 52a is in contact with the fixing portion 13 so as to press it toward the first substrate 20 side. The third portion 52c is in contact with the second substrate 30 so as to press the second surface 1b of the heater 1. As shown in FIG. The second portion 52b is positioned between the first portion 52a and the third portion 52c and faces the side surface 1d of the heater 1. As shown in FIG. The second portion 52b may be in contact with or separated from the side surface 1d.
　挟持部材５０の材料は、例えば、ステンレス鋼であってもよい。挟持部材５０は、例えば、バイメタルスイッチ１０とセラミック体２とを一体に挟み込むことでバイメタルスイッチ１０を固定してもよい。バイメタルスイッチ１０とセラミック体２とを一体に挟み込むと、例えば接合材を介することなく、バイメタルスイッチ１０をセラミック体２の第１面１ａに直接固定しやすくなる。これにより、接合材を介した熱の散逸が生じにくくなることから、過昇温を検知しやすくなる。なお、挟持部材５０は、例えば接合材を介して第１面１ａに固定されてもよい。 The material of the holding member 50 may be stainless steel, for example. The holding member 50 may fix the bimetal switch 10 by, for example, holding the bimetal switch 10 and the ceramic body 2 together. When the bimetal switch 10 and the ceramic body 2 are integrally sandwiched, the bimetal switch 10 can be easily fixed directly to the first surface 1a of the ceramic body 2 without using a bonding material. This makes it difficult for heat to dissipate via the bonding material, making it easier to detect an excessive temperature rise. The holding member 50 may be fixed to the first surface 1a via a bonding material, for example.
　図９は、実施形態に係るヒータの別の一例を示す斜視図である。図１０は、図９に示すヒータの断面図である。図９および図１０に示すように、図８に示す挟持部材５０は、第１基板２０および第２基板３０の全体を覆うように構成されてもよい。 FIG. 9 is a perspective view showing another example of the heater according to the embodiment. 10 is a cross-sectional view of the heater shown in FIG. 9. FIG. As shown in FIGS. 9 and 10, the holding member 50 shown in FIG. 8 may be configured to cover the first substrate 20 and the second substrate 30 entirely.
　挟持部材５０は、第１部分５０ａと、第２部分５０ｂと、第３部分５０ｃと、第４部分５０ｄと、第５部分５０ｅとを有してもよい。挟持部材５０の両端に位置する第１部分５０ａおよび第５部分５０ｅはそれぞれ、バイメタルスイッチ１０の固定部１３を第１基板２０側に押圧している。第３部分５０ｃは、ヒータ１の第２面１ｂを押圧するように第２基板３０に接している。第２部分５０ｂは、第１部分５０ａと第３部分５０ｃとの間に位置しており、ヒータ１の側面１ｃと向かい合って位置している。第４部分５０ｄは、第３部分５０ｃと第５部分５０ｅとの間に位置しており、ヒータ１の側面１ｄと向かい合って位置している。第２部分５０ｂおよび第４部分５０ｄはそれぞれ、側面１ｃ，１ｄと接していてもよく、離れていてもよい。 The holding member 50 may have a first portion 50a, a second portion 50b, a third portion 50c, a fourth portion 50d, and a fifth portion 50e. The first portion 50a and the fifth portion 50e located at both ends of the clamping member 50 press the fixing portion 13 of the bimetal switch 10 toward the first substrate 20 side. The third portion 50 c is in contact with the second substrate 30 so as to press the second surface 1 b of the heater 1 . The second portion 50b is positioned between the first portion 50a and the third portion 50c and faces the side surface 1c of the heater 1. As shown in FIG. The fourth portion 50d is positioned between the third portion 50c and the fifth portion 50e and faces the side surface 1d of the heater 1. As shown in FIG. The second portion 50b and the fourth portion 50d may be in contact with or separated from the side surfaces 1c and 1d, respectively.
　図９および図１０に示す挟持部材５０は、セラミック体２およびバイメタルスイッチ１０を収容するケースとして機能してもよい。これにより、例えば、ヒータ１内の各部位における熱膨張差によってバイメタルスイッチ１０とパッド２１，２２との接点がずれた場合であっても、バイメタルスイッチ１０には応力がかからないため、耐久性が向上する。また、バイメタルスイッチ１０は、ケースとしての挟持部材５０の内部における過昇温の検知になることから、例えば、検知精度が向上する。 The holding member 50 shown in FIGS. 9 and 10 may function as a case that accommodates the ceramic body 2 and the bimetal switch 10. As a result, even if the contact points between the bimetal switch 10 and the pads 21 and 22 are displaced due to differences in thermal expansion at various parts in the heater 1, stress is not applied to the bimetal switch 10, and durability is improved. do. Further, since the bimetal switch 10 detects an excessive temperature rise inside the clamping member 50 as a case, for example, detection accuracy is improved.
　図１１は、実施形態に係るヒータの別の一例を示す断面図である。図１１に示すように、図１０に示すバイメタルスイッチ１０の上に位置する押圧部材６０をさらに備えてもよい。 FIG. 11 is a cross-sectional view showing another example of the heater according to the embodiment. As shown in FIG. 11, a pressing member 60 positioned above the bimetal switch 10 shown in FIG. 10 may be further provided.
　押圧部材６０の材料は、例えば、耐熱性を有する材料であってもよく、例えば、フェノール樹脂、ポリフェニレンサルファイド樹脂などの樹脂であってもよい。また、押圧部材６０の材料は、アルミナ等のセラミック材料であってもよい。押圧部材６０の材料は、さらにはニッケル、鉄またはニッケル系耐熱合金等の金属材料などであってもよい。挟持部材５０は、例えば、バイメタルスイッチ１０には接触せず、押圧部材６０を介して間接的に押圧してもよい。これにより、バイメタルスイッチ１０の耐久性が向上する。 The material of the pressing member 60 may be, for example, a heat-resistant material, such as a resin such as phenol resin or polyphenylene sulfide resin. Also, the material of the pressing member 60 may be a ceramic material such as alumina. The material of the pressing member 60 may also be a metal material such as nickel, iron, or a nickel-based heat-resistant alloy. The clamping member 50 may, for example, indirectly press the bimetal switch 10 via the pressing member 60 without contacting it. This improves the durability of the bimetal switch 10 .
　図１２は、実施形態に係るヒータの別の一例を示す斜視図である。図１３は、図１２に示すヒータの断面図である。図１２および図１３に示すようにバイメタルスイッチ１０を押圧する押圧部材６０は、Ｙ軸方向の幅が固定部１３よりも大きくてもよい。 FIG. 12 is a perspective view showing another example of the heater according to the embodiment. 13 is a sectional view of the heater shown in FIG. 12. FIG. As shown in FIGS. 12 and 13 , the pressing member 60 that presses the bimetal switch 10 may have a width in the Y-axis direction larger than that of the fixed portion 13 .
　押圧部材６０は、バイメタルスイッチ１０の固定部１３に接する第１領域６１と、固定部１３に接していない第２領域６２とを有してもよい。挟持部材５０の第１部分５０ａおよび第５部分５０ｅは、押圧部材６０のうち、第２領域６２に接するように位置してもよい。これにより、例えばセラミック体２が熱膨張により変形した場合であっても、押圧部材６０がばねのようにたわみながらバイメタルスイッチ１０を固定することができる。このため、バイメタルスイッチ１０の耐久性が向上する。 The pressing member 60 may have a first region 61 that contacts the fixed portion 13 of the bimetal switch 10 and a second region 62 that does not contact the fixed portion 13 . The first portion 50 a and the fifth portion 50 e of the holding member 50 may be positioned so as to contact the second region 62 of the pressing member 60 . As a result, even if the ceramic body 2 is deformed due to thermal expansion, the pressing member 60 can be flexed like a spring to fix the bimetal switch 10 . Therefore, the durability of the bimetal switch 10 is improved.
　図１４は、実施形態に係るヒータの別の一例を示す平面図である。なお、図１４では、バイメタルスイッチ１０および第１基板２０の図示を省略している。 FIG. 14 is a plan view showing another example of the heater according to the embodiment. 14, the illustration of the bimetal switch 10 and the first substrate 20 is omitted.
　図１４に示すように、ヒータ１は、測温抵抗体３３と導体３４とをさらに備えてもよい。 As shown in FIG. 14, the heater 1 may further include a temperature measuring resistor 33 and a conductor 34.
　測温抵抗体３３は、第２基板３０の第１面３０ａ上に位置している。測温抵抗体３３は、第１抵抗体３１１および第２抵抗体３１２と並ぶように配列されている。測温抵抗体３３は、導体３４を介してリード線４３，４４に接続されている。 The temperature measuring resistor 33 is located on the first surface 30a of the second substrate 30. The temperature measuring resistor 33 is arranged side by side with the first resistor 311 and the second resistor 312 . The resistance temperature detector 33 is connected to lead wires 43 and 44 via a conductor 34 .
　導体３４は、第１導体３４ａと第２導体３４ｂとを有している。第１導体３４ａおよび第２導体３４ｂは、第１導体３２ａと第２導体３２ｂとの間に、所定の間隔を設けて位置している。測温抵抗体３３は、一端が第１導体３４ａに接続され、他端が第２導体３４ｂに接続されている。第１導体３４ａは、リード線４３に接続され、第２導体３４ｂは、リード線４４に接続されている。 The conductor 34 has a first conductor 34a and a second conductor 34b. The first conductor 34a and the second conductor 34b are positioned with a predetermined gap between the first conductor 32a and the second conductor 32b. The temperature measuring resistor 33 has one end connected to the first conductor 34a and the other end connected to the second conductor 34b. The first conductor 34 a is connected to the lead wire 43 and the second conductor 34 b is connected to the lead wire 44 .
　測温抵抗体３３は、例えば、ヒータ１の内部温度を制御するための温度センサであってもよい。測温抵抗体３３の材料は、例えば、タングステン、モリブデンなどを含む高抵抗の導体や、白金であってもよい。測温抵抗体３３は、ヒータ１全体の温度を検知して、ヒータ１の温度制御を行うことができる。例えば、測温抵抗体３３で温度制御を行いつつ、バイメタルスイッチ１０で過昇温を検知することにより、ユーザの利便性が向上する。 The temperature measuring resistor 33 may be a temperature sensor for controlling the internal temperature of the heater 1, for example. The material of the temperature sensing resistor 33 may be, for example, a high-resistance conductor containing tungsten, molybdenum, or platinum. The temperature sensing resistor 33 can detect the temperature of the entire heater 1 and control the temperature of the heater 1 . For example, by detecting excessive temperature rise with the bimetal switch 10 while performing temperature control with the temperature measuring resistor 33, user convenience is improved.
　図１５は、実施形態に係るヒータの別の一例を示す平面図である。図１５に示すように、図１４に示すヒータ１が有する端子３１ａ，３１ｂの間の端子間領域３１ｃに測温抵抗体３３が位置してもよい。 FIG. 15 is a plan view showing another example of the heater according to the embodiment. As shown in FIG. 15, a resistance temperature detector 33 may be positioned in a terminal-to-terminal region 31c between terminals 31a and 31b of the heater 1 shown in FIG.
　測温抵抗体３３は、端子間領域３１ｃに位置する端子間部３３ａを有してもよい。端子間部３３ａは、Ｘ軸に沿う第１方向に対し、Ｘ軸に交差するＹ軸方向に沿う第２方向に沿って延びるように繰り返し折り曲げられていてもよい。これにより、バイメタルスイッチ１０の直下に、測温抵抗体３３が位置することとなることから、測温抵抗体３３による検知精度が向上する。 The temperature measuring resistor 33 may have an inter-terminal portion 33a positioned in the inter-terminal region 31c. The inter-terminal portion 33a may be repeatedly bent so as to extend along the second direction along the Y-axis direction intersecting the X-axis with respect to the first direction along the X-axis. As a result, since the temperature measuring resistor 33 is positioned directly below the bimetal switch 10, the detection accuracy of the temperature measuring resistor 33 is improved.
　また、測温抵抗体３３は、端子間部３３ａの断面積が、端子間部３３ａ以外の部分の断面積よりも小さくてもよい。これにより、バイメタルスイッチ１０の直下において、測温抵抗体３３による検知精度が向上する。 In addition, the temperature sensing resistor 33 may have a cross-sectional area of the inter-terminal portion 33a smaller than the cross-sectional area of the portion other than the inter-terminal portion 33a. As a result, the accuracy of detection by the resistance temperature detector 33 is improved immediately below the bimetal switch 10 .
　以上のように、実施形態に係るヒータ１は、セラミック体２と、発熱抵抗体３１と、バイメタルスイッチ１０とを備える。セラミック体２は、第１面１ａおよび第１面１ａの反対に位置する第２面１ｂを有する。発熱抵抗体３１は、セラミック体２の内部に位置し、第１抵抗体３１１および第２抵抗体３２２を有する。バイメタルスイッチ１０は、第１抵抗体３１１と第２抵抗体３１２との間に位置し、発熱抵抗体３１への通電状態を切り替える。これにより、ユーザの利便性を向上することができる。 As described above, the heater 1 according to the embodiment includes the ceramic body 2, the heating resistor 31, and the bimetal switch 10. The ceramic body 2 has a first side 1a and a second side 1b opposite the first side 1a. The heating resistor 31 is positioned inside the ceramic body 2 and has a first resistor 311 and a second resistor 322 . The bimetal switch 10 is positioned between the first resistor 311 and the second resistor 312 and switches the energization state to the heating resistor 31 . Thereby, user convenience can be improved.
　また、実施形態に係るヘアアイロンは、上記に記載のヒータ１を備える。これにより、ヒータ１が過昇温しにくく、長期間安定して使用することができることから、例えば、髪を痛めることのない優れたヘアアイロンを提供することができる。 Also, the hair iron according to the embodiment includes the heater 1 described above. As a result, the heater 1 is less likely to overheat and can be stably used for a long period of time, so that, for example, it is possible to provide an excellent curling iron that does not damage the hair.
　さらなる効果や他の態様は、当業者によって容易に導き出すことができる。このため、本開示のより広範な態様は、以上のように表しかつ記述した特定の詳細および代表的な実施形態に限定されるものではない。したがって、添付の請求の範囲およびその均等物によって定義される総括的な発明の概念の精神または範囲から逸脱することなく、様々な変更が可能である。 Further effects and other aspects can be easily derived by those skilled in the art. Therefore, the broader aspects of the disclosure are not limited to the specific details and representative embodiments so represented and described. Accordingly, various changes may be made without departing from the spirit or scope of the general inventive concept defined by the appended claims and equivalents thereof.
　　１　ヒータ
　　２　セラミック体
　１０　バイメタルスイッチ
　２０　第１基板
　２１，２２　パッド
　２３，２４　ビア
　３０　第２基板
　３１　発熱抵抗体
　４０　リード線
　５０　挟持部材
　６０　押圧部材 Reference Signs List 1 heater 2 ceramic body 10 bimetal switch 20 first substrate 21, 22 pads 23, 24 via 30 second substrate 31 heating resistor 40 lead wire 50 holding member 60 pressing member

Claims (12)

  1. 　セラミック体と、
    　発熱抵抗体と、
    　バイメタルスイッチと
    　を備え、
    　前記セラミック体は、第１面および前記第１面の反対に位置する第２面を有しており、
    　前記発熱抵抗体は、前記セラミック体の内部に位置し、第１抵抗体および第２抵抗体を有しており、
    　前記バイメタルスイッチは、前記第１抵抗体と前記第２抵抗体との間に位置している
    　ヒータ。     a ceramic body;
    a heating resistor;
    with bimetal switch and
    the ceramic body has a first side and a second side opposite the first side;
    The heating resistor is located inside the ceramic body and has a first resistor and a second resistor,
    The said bimetal switch is located between the said 1st resistor and the said 2nd resistor. Heater.
  2. 　前記セラミック体の前記第１面上に位置し、ビアを介して前記第１抵抗体および前記第２抵抗体と電気的に接続される一対のパッドを有し、
    　前記バイメタルスイッチは、前記一対のパッドのそれぞれに接離可能に位置している
    　請求項１に記載のヒータ。     a pair of pads located on the first surface of the ceramic body and electrically connected to the first resistor and the second resistor via vias;
    The heater according to claim 1, wherein the bimetal switch is positioned so as to be able to contact and separate from each of the pair of pads.
  3. 　前記パッドは、前記セラミック体の前記第１面から突出している
    　請求項２に記載のヒータ。     3. The heater according to claim 2, wherein said pad protrudes from said first surface of said ceramic body.
  4. 　前記パッドは、前記セラミック体の上に位置する第１層と、前記第１層の上に位置し、前記第１層よりも硬度が小さい第２層とを有する
    　請求項２または３に記載のヒータ。     4. The pad according to claim 2, wherein the pad has a first layer positioned on the ceramic body, and a second layer positioned on the first layer and having a lower hardness than the first layer. heater.
  5. 　前記バイメタルスイッチは、前記パッドに向かうように突出する接点部を有し、
    　前記パッドは、前記接点部を受ける凹状の受け部を有する
    　請求項２～４のいずれか１つに記載のヒータ。     The bimetal switch has a contact portion projecting toward the pad,
    The heater according to any one of claims 2 to 4, wherein the pad has a concave receiving portion that receives the contact portion.
  6. 　前記バイメタルスイッチが位置する前記セラミック体の前記第１面とは反対側に位置する前記セラミック体の前記第２面と前記バイメタルスイッチとを挟む挟持部材をさらに備える
    　請求項１～５のいずれか１つに記載のヒータ。     6. The device according to any one of claims 1 to 5, further comprising a clamping member that clamps the bimetal switch and the second surface of the ceramic body located opposite to the first surface of the ceramic body on which the bimetal switch is located. heater according to one.
  7. 　前記挟持部材は、前記セラミック体および前記バイメタルスイッチを収容している
    　請求項６に記載のヒータ。     The heater according to claim 6, wherein the clamping member accommodates the ceramic body and the bimetal switch.
  8. 　前記バイメタルスイッチを挟んで前記第１面と向かい合う押圧部材をさらに備え、
    　前記押圧部材は、前記バイメタルスイッチに接する第１領域と、前記挟持部材に接しており、前記バイメタルスイッチに接していない第２領域とを有する
    　請求項６または７に記載のヒータ。     further comprising a pressing member facing the first surface with the bimetal switch interposed therebetween;
    The heater according to claim 6 or 7, wherein the pressing member has a first region in contact with the bimetal switch and a second region in contact with the clamping member and not in contact with the bimetal switch.
  9. 　前記第１抵抗体および前記第２抵抗体と並ぶように前記セラミック体の内部に位置する測温抵抗体をさらに備える
    　請求項１～８のいずれか１つに記載のヒータ。     The heater according to any one of claims 1 to 8, further comprising a temperature measuring resistor positioned inside the ceramic body so as to be aligned with the first resistor and the second resistor.
  10. 　前記測温抵抗体は、第１方向に並ぶ前記第１抵抗体および前記第２抵抗体の端子間に位置し、前記第１方向に交差する第２方向に沿って延びるように繰り返し折り曲げられる端子間部を有する
    　請求項９に記載のヒータ。     The temperature-measuring resistor is located between terminals of the first resistor and the second resistor arranged in a first direction, and is repeatedly bent so as to extend along a second direction crossing the first direction. 10. The heater of claim 9, having an interspace.
  11. 　前記測温抵抗体は、前記端子間部の断面積が、前記端子間部以外の部分の断面積よりも小さい
    　請求項１０に記載のヒータ。     11. The heater according to claim 10, wherein the resistance temperature detector has a cross-sectional area of the inter-terminal portion smaller than a cross-sectional area of a portion other than the inter-terminal portion.
  12. 　請求項１～１１のいずれか１つに記載のヒータを備えるヘアアイロン。 A hair iron comprising the heater according to any one of claims 1 to 11.
PCT/JP2022/032628 2021-08-31 2022-08-30 Heater and hair iron WO2023032991A1 (en)

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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684584A (en) * 1992-09-01 1994-03-25 Canon Inc Heater
JPH10189228A (en) * 1996-12-27 1998-07-21 Ngk Spark Plug Co Ltd Ceramic heater unit
JP2000181264A (en) * 1998-12-17 2000-06-30 Arai Pump Mfg Co Ltd Energizing method for fixing device and fixing device
JP2001102159A (en) * 1999-07-27 2001-04-13 Toto Ltd Metal heater for heating water, hot water supplier using it, and hygienic cleaner with it
JP2005317233A (en) * 2004-04-27 2005-11-10 Kyocera Corp Ceramic heater and manufacturing method of the same
WO2016009489A1 (en) * 2014-07-14 2016-01-21 三菱電機株式会社 Warm air device
KR20180026978A (en) * 2016-09-05 2018-03-14 엘지전자 주식회사 Defrosting device and refrigerator having the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0684584A (en) * 1992-09-01 1994-03-25 Canon Inc Heater
JPH10189228A (en) * 1996-12-27 1998-07-21 Ngk Spark Plug Co Ltd Ceramic heater unit
JP2000181264A (en) * 1998-12-17 2000-06-30 Arai Pump Mfg Co Ltd Energizing method for fixing device and fixing device
JP2001102159A (en) * 1999-07-27 2001-04-13 Toto Ltd Metal heater for heating water, hot water supplier using it, and hygienic cleaner with it
JP2005317233A (en) * 2004-04-27 2005-11-10 Kyocera Corp Ceramic heater and manufacturing method of the same
WO2016009489A1 (en) * 2014-07-14 2016-01-21 三菱電機株式会社 Warm air device
KR20180026978A (en) * 2016-09-05 2018-03-14 엘지전자 주식회사 Defrosting device and refrigerator having the same

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