WO2023032356A1

WO2023032356A1 - Electronic device and method for manufacturing electronic device

Info

Publication number: WO2023032356A1
Application number: PCT/JP2022/019695
Authority: WO
Inventors: 憲英下原
Original assignee: 富士フイルム株式会社
Priority date: 2021-09-02
Filing date: 2022-05-09
Publication date: 2023-03-09
Also published as: TW202315509A

Abstract

Provided are an electronic device and a method for manufacturing the electronic device, the electronic device comprising a wiring substrate, an electronic component disposed on the wiring substrate, a ground electrode, an insulating layer provided on the electronic component, and a conductive layer that is provided on at least a portion on the insulating layer and on the ground electrode and that is a cured film of an ink for forming a conductive layer, wherein: the thickness of the insulating layer is at least 200 μm; and when the thickness of the conductive layer provided on the insulating layer provided on the surface of the electronic component positioned highest from the surface of the wiring substrate on which the electronic component is disposed is defined as T1, and the thickness of the conductive layer provided on the ground electrode is defined as T2, T2 is greater than T1.

Description

ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURING METHOD

The present disclosure relates to electronic devices and methods of manufacturing electronic devices.

　Electronic components must be shielded so that they are not interfered with by electromagnetic waves from other electronic devices, and are generally covered with a shield can. Shield cans have the problems of being thick and heavy and having a small degree of freedom in design, and there is a demand for a technology to replace the shield cans.

For example, Japanese Patent Application Laid-Open No. 2017-179361 discloses a wiring board having a mounting surface, an electronic board including an electronic component mounted on the mounting surface of the wiring board, an insulating layer and a conductive layer, and an insulating layer is laminated on the electronic component side and includes an electromagnetic wave shielding layer covering the surface of the electronic component, and a ground member that is in contact with the conductive layer of the electromagnetic wave shielding layer to ground the conductive layer.

In some cases, when an insulating layer and a conductive layer are provided in this order on an electronic substrate, both electromagnetic wave shielding properties and durability are required.

The present disclosure has been made in view of such circumstances, and according to one embodiment of the present invention, a method for manufacturing an electronic device with excellent electromagnetic shielding properties and durability is provided.

The present disclosure includes the following aspects.
<1>
a wiring board;
electronic components arranged on a wiring board;
a ground electrode;
an insulating layer provided on the electronic component;
A conductive layer that is provided on the insulating layer and at least part of the ground electrode and is a cured film of the ink for forming the conductive layer,
The thickness of the insulating layer is 200 μm or more,
Let T1 be the thickness of the conductive layer provided on the insulating layer provided on the surface of the electronic component that is positioned highest with respect to the surface of the wiring board on which the electronic component is arranged. 1. An electronic device, wherein T2 is thicker than T1, where T2 is the thickness of a conductive layer provided on a ground electrode.
<2>
The electronic device according to <1>, wherein the insulating layer contains an acrylic resin or an epoxy resin.
<3>
The electronic device according to <1> or <2>, wherein T2 is at least twice as large as T1.
<4>
The electronic device according to any one of <1> to <3>, wherein the conductive layer forming ink contains a metal complex or a metal salt.
<5>
The electronic device according to any one of <1> to <4>, wherein the ground electrode has a height of 150 μm or less with respect to the surface of the wiring board on which the electronic components are arranged.
<6>
The electronic device according to any one of <1> to <5>, wherein T1 is less than 10 μm.
<7>
preparing an electronic substrate including a wiring substrate, electronic components arranged on the wiring substrate, and a ground electrode;
forming an insulating layer having a thickness of 200 μm or more on the electronic component;
applying the conductive layer forming ink to at least part of the insulating layer and the ground electrode to form a conductive layer, which is a cured film of the conductive layer forming ink;
Let T1 be the thickness of the conductive layer provided on the insulating layer provided on the surface of the electronic component that is positioned highest with respect to the surface of the wiring board on which the electronic component is arranged. 3. A method of manufacturing an electronic device, wherein T2 is thicker than T1, where T2 is the thickness of the conductive layer provided on the ground electrode.

According to one embodiment of the present invention, an electronic device with excellent electromagnetic shielding properties and durability and a method for manufacturing the electronic device are provided.

FIG. 1 is a schematic plan view of an electronic device. FIG. 2 is a cross-sectional view taken along line AA of FIG. FIG. 3A is a schematic plan view of an electronic substrate prepared in a preparation step. FIG. 3B is a cross-sectional view taken along line BB of FIG. 3A. FIG. 4A is a diagram showing an example of an application region of the insulating layer forming ink. FIG. 4B is a cross-sectional view taken along line BB of FIG. 3A, showing a state in which an insulating layer is formed. FIG. 5A is a diagram showing an example of a region where the conductive layer forming ink is applied. FIG. 5B is a diagram showing an example of a region where the conductive layer forming ink is applied. FIG. 5C is a cross-sectional view taken along line BB of FIG. 3A showing a state in which a conductive layer is formed.

The electronic device and the method for manufacturing the electronic device of the present disclosure will be described in detail below.

In this specification, the numerical range indicated using "to" means a range including the numerical values before and after "to" as the minimum and maximum values, respectively.
In the numerical ranges described stepwise in this specification, the upper limit or lower limit described in a certain numerical range may be replaced with the upper limit or lower limit of another numerical range described stepwise. Moreover, in the numerical ranges described in this specification, the upper limit or lower limit described in a certain numerical range may be replaced with the values shown in the examples.

As used herein, the amount of each component in the composition refers to the total amount of the multiple substances present in the composition when there are multiple substances corresponding to each component in the composition, unless otherwise specified. means
In the present specification, a combination of two or more preferred aspects is a more preferred aspect.
In this specification, the term "process" includes not only an independent process but also a process that cannot be clearly distinguished from other processes, as long as the intended purpose of the process is achieved. be

As used herein, "image" means film in general, and "image recording" means formation of an image (that is, film). The concept of "image" in this specification also includes a solid image.

In this specification, the "upper surface" means the surface on which the electronic components are arranged on the wiring board.

[Electronic device]
The electronic device of the present disclosure includes a wiring board, an electronic component arranged on the wiring board, a ground electrode, an insulating layer provided on the electronic component, and at least one of the insulating layer and the ground electrode. and a conductive layer that is a cured film of the ink for forming a conductive layer, the thickness of the insulating layer is 200 μm or more, and the electronic component of the wiring board is arranged on the surface of the electronic component. T1 is the thickness of the conductive layer provided on the insulating layer provided on the highest surface with respect to the surface on the side where the T2 is thicker than T1.

Conventionally, when an electronic device is exposed to a high-temperature environment, peeling may occur at the interface between the ground electrode and the conductive layer. It is considered that this is due to the deterioration of adhesion due to the difference between the metal forming the ground electrode and the metal forming the conductive layer.

In addition, there is a method of increasing the thickness of the insulating layer in order to improve the electromagnetic wave shielding properties. However, when the thickness of the insulating layer is as thick as 200 μm or more, there is a tendency that durability tends to decrease due to a decrease in adhesion.

On the other hand, in the electronic device of the present disclosure, on the insulating layer provided on the surface of the electronic component that is the highest with respect to the surface of the wiring board on which the electronic component is arranged, When the thickness of the conductive layer provided is T1 and the thickness of the conductive layer provided on the ground electrode is T2, T2 is thicker than T1, so the thickness of the insulating layer is 200 μm or more. Even so, the strength at the interface between the ground electrode and the conductive layer is increased, resulting in excellent durability. Therefore, both electromagnetic wave shielding properties and durability were achieved.

On the other hand, Japanese Patent Application Laid-Open No. 2017-179361 does not describe providing a conductive layer on at least part of the insulating layer and the ground electrode using a conductive layer forming ink. The electronic element described in Japanese Patent Laying-Open No. 2017-179361 differs from the electronic device of the present disclosure in the lamination state of the insulating layer, the conductive layer, and the ground electrode, and durability has not been studied.

An example of an electronic device according to an embodiment of the present disclosure will be described below with reference to the drawings. However, the electronic device according to the embodiment of the present disclosure is not limited to the following example.

In the following description, substantially the same elements (for example, parts or portions) may be given the same reference numerals and redundant descriptions may be omitted.

FIG. 1 is a schematic plan view of an electronic device. FIG. 2 is a cross-sectional view taken along line AA of FIG.

As shown in FIGS. 1 and 2, the electronic board 100 includes a wiring board 11, electronic components 12 (12A and 12B) arranged on the wiring board 11, a ground electrode 13, and a and a conductive layer 32 provided on at least part of the insulating layer 31 and the ground electrode 13 .

A wiring board is a board with wiring on at least one of the board and the inside of the board.

Examples of substrates constituting the wiring substrate 11 include glass epoxy substrates, ceramic substrates, polyimide substrates, and polyethylene terephthalate substrates. The substrate may have a single layer structure or a multilayer structure.

The wiring (not shown) provided on the wiring board 11 is preferably copper wiring. For example, one end of the wiring is connected to an external power supply and the other end is connected to a terminal of the electronic component 12 .

The electronic components 12 include, for example, semiconductor chips, capacitors, and transistors. The number of electronic components 12 arranged on wiring board 11 is not particularly limited. FIG. 1 shows an example in which four electronic components 12A and one electronic component 12B are arranged.

The ground electrode 13 is an electrode to which a ground (GND) potential is applied. In FIG. 1, the ground electrode 13 surrounds the

electronic components

12A and 12B and is formed in a discontinuous frame shape in plan view, but the position and shape of the ground electrode are not limited to this. For example, the ground electrode may be formed in a continuous frame shape in plan view, or may be formed between the electronic component 12A and the electronic component 12B.

Further, in FIG. 1, the ground electrode 13 is formed such that a portion of the ground electrode 13 in the thickness direction is embedded in the wiring board 11, but the ground electrode in the present disclosure is limited to this example. not. For example, the ground electrode may be formed on the surface of the wiring board 11 instead of being embedded in the wiring board 11 . Also, the ground electrode may be formed as a pattern penetrating the wiring board 11 .

The height of the ground electrode 13 is preferably 150 μm or less, more preferably 120 μm or less, based on the surface of the wiring board on which the electronic components are arranged. Although the lower limit of the height is not particularly limited, it is, for example, 30 μm.

The insulating layer 31 is preferably a cured film of the ink for forming the insulating layer, and from the viewpoint of curability and mechanical strength, contains a polymer of a radically polymerizable monomer, or a polymer or crosslinked body of a cyclic ether compound. is preferred, and it preferably contains an acrylic resin or an epoxy resin. The details of the insulating layer forming ink will be described later.

The conductive layer 32 is a cured film of ink for forming a conductive layer. The details of the conductive layer forming ink will be described later.

(Relationship between T1 and T2)
In the electronic device of the present disclosure, the insulation provided on the surface of the electronic component that is the highest with respect to the surface of the wiring board on which the electronic component is arranged (that is, the upper surface of the wiring board) Let T1 be the thickness of the conductive layer provided on the layer, and T2 be the thickness of the conductive layer provided on the ground electrode. As for the relationship between T1 and T2, T2 is thicker than T1. Since T2 is thicker than T1, the strength at the interface between the ground electrode and the conductive layer is increased, and the adhesion between the ground electrode and the conductive layer is excellent.

T1 is defined as follows.
Among the surfaces of the electronic components arranged on the wiring board, the surface positioned highest with respect to the upper surface of the wiring board is specified. As shown in FIG. 2, in the electronic device 100, the surface of the electronic component 12B is positioned higher than the surface of the electronic component 12A with the upper surface of the wiring board 11 as a reference. Therefore, in the electronic device 100, T1 is the thickness of the conductive layer 32 provided on the insulating layer 31 provided on the electronic component 12B. Specifically, the thickness from the upper surface of the insulating layer 31 provided on the electronic component 12B to the upper surface of the conductive layer 32 is defined as T1.
T2 is defined as follows.
A position where the maximum thickness exists in the thickness of the conductive layer provided on the ground electrode is specified. Normally, the conductive layer is formed thickest on the end of the ground electrode on the side where the electronic components are arranged. As shown in FIG. 2, in the electronic device 100, the thickness from the surface of the ground electrode 13 to the surface 321 of the conductive layer 32 is T2.

T1 and T2 are measured based on an optical micrograph or an electron micrograph taken of a cross section of the electronic device. Moreover, T1 and T2 can be measured using a laser microscope. As a laser microscope, for example, "VK-X1000" manufactured by Keyence Corporation can be used.

From the viewpoint of further improving the adhesion between the ground electrode and the conductive layer, T2 is preferably at least twice as large as T1, more preferably at least 2.5 times. The upper limit of the ratio of T2 to T1 is not particularly limited, and is, for example, 10 times.

From the viewpoint of cost and productivity, T1 is preferably 20 μm or less, more preferably less than 10 μm. From the viewpoint of electromagnetic wave shielding properties, T1 is preferably 0.2 μm or more, more preferably 0.5 μm or more.

From the viewpoint of productivity, T2 is preferably 100 μm or less, and preferably 50 μm or less. From the viewpoint of conductivity and durability, T2 is preferably 0.5 μm or more, more preferably 1 μm or more.

In the electronic device of the present disclosure, the insulating layer has a thickness of 200 μm or more. At least a portion of the insulating layer may have a thickness of 200 μm or more. The upper limit of the thickness of the insulating layer is not particularly limited, and is, for example, 2000 μm. When the insulating layer is 200 μm or more, in addition to ensuring sufficient insulation even on electronic components, it is easy to form a conductive layer on the insulating layer using the ink for forming a conductive layer, so the electromagnetic wave shielding property is improved. . From the viewpoint of insulation and ease of forming the conductive layer, the thickness of the insulating layer is preferably 600 μm or more.

Here, the thickness of the insulating layer is the height (that is, the height of the highest point) when the mounting surface of the wiring board (for example, the mounting surface 11S in FIG. 3B) is used as a reference.
The thickness of the insulating layer is measured based on an optical micrograph or electron micrograph of a cross section of the electronic device.

The thickness of the insulating layer can also be measured by the following method.

Using a laser microscope, measure the shape of the electronic board before the insulating layer is formed, and measure the height of the wiring board and mounted electronic components before the insulating layer is formed. Subsequently, the shape of the electronic substrate after the insulating layer is formed is measured using a laser microscope, and the heights of the wiring substrate and the electronic component after the insulating layer is formed are measured. By measuring the height before forming the insulating layer and after forming the insulating layer, the thickness of the insulating layer can be calculated. The maximum thickness among the calculated thicknesses of the insulating layer was taken as the thickness of the insulating layer. As a laser microscope, for example, "VK-X1000" manufactured by Keyence Corporation can be used.

[Method for manufacturing electronic device]
A method for manufacturing an electronic device according to the present disclosure includes a step of preparing an electronic substrate including a wiring board, electronic components arranged on the wiring board, and a ground electrode (hereinafter also referred to as a “preparing step”); A step of forming an insulating layer with a thickness of 200 μm or more on the electronic component (hereinafter also referred to as an “insulating layer forming step”), and forming a conductive layer on at least a portion of the insulating layer and the ground electrode and a step of applying an ink for forming a conductive layer to form a conductive layer, which is a cured film of the ink for forming a conductive layer (hereinafter also referred to as a “conductive layer forming step”).
Let T1 be the thickness of the conductive layer provided on the insulating layer provided on the surface of the electronic component that is positioned highest with respect to the surface of the wiring board on which the electronic component is arranged. , where T2 is the thickness of the conductive layer provided on the ground electrode, T2 is thicker than T1.

An example of a method for manufacturing an electronic device according to an embodiment of the present disclosure will be described below with reference to the drawings. However, the method for manufacturing an electronic device according to an embodiment of the present disclosure is not limited to the following example.

<Preparation process>
An example of the preparation process will be described below with reference to FIGS. 3A and 3B.

FIG. 3A is a schematic plan view of an electronic substrate prepared in the preparation process. FIG. 3B is a cross-sectional view taken along line BB of FIG. 3A.

As shown in FIGS. 3A and 3B, in the preparation step, an electronic substrate 10 including a wiring substrate 11, electronic components 12 (12A and 12B) arranged on the wiring substrate 11, and a ground electrode 13 is prepared. do.

The preparation process may be a process of simply preparing the prefabricated electronic board 10 or a process of manufacturing the electronic board 10 .

A known manufacturing method can be referred to for the manufacturing method of the electronic substrate 10 .

Examples of the electronic board 10 include flexible printed boards, rigid printed boards, and rigid flexible boards.

The details of the wiring board 11, the electronic component 12, and the ground electrode 13 are as described above.

<Insulating layer forming process>
An example of the insulating layer forming process will be described below with reference to FIGS. 4A and 4B.

FIG. 4A is a diagram showing an example of a region where the insulating layer forming ink is applied. FIG. 4B is a cross-sectional view taken along line BB of FIG. 3A, showing a state in which an insulating layer is formed.

The insulating layer forming step is preferably a step of applying an insulating layer forming ink and irradiating an active energy ray to form an insulating layer, which is a cured film of the insulating layer forming ink. After applying the ink for forming the insulating layer, the insulating layer 31 covering the

electronic components

12A and 12B is formed as shown in FIG. 3B by irradiating the active energy ray.

The steps of applying the ink for forming the insulating layer and irradiating the active energy ray are preferably repeated. By repeating the above steps, the thickness of the cured film of the ink for forming the insulating layer can be increased.

The region to which the insulating layer forming ink is applied (insulating layer forming ink applying region) is preferably set so that the insulating layer is in contact with the ground electrode. In FIG. 4A, the application area 21 of the insulating layer forming ink is the same as the area surrounded by the ground electrode 13 (hereinafter also referred to as "ground area") that does not include the ground electrode 13 top. Thereby, as shown in FIG. 4B, the wall surface of the ground electrode 13 on the side of the ground area is in contact with the insulating layer 31 .

In this example, the area 21 is set as the application area of the ink for forming the insulating layer, but it is not limited to this example.

For example, the position and shape (planar shape and height) of the ground electrode 13 and the electronic component 12 arranged on the wiring board 11 are read in advance, and based on the read data, the application region of the ink for forming the insulating layer, It is preferable to set the number of times of application of the insulating layer forming ink.

(Ink for forming insulating layer)
In the present disclosure, the ink for forming an insulating layer means an ink for forming an insulating layer. Insulating property means the property that the volume resistivity is 10 ¹⁰ Ωcm or more.

The ink for forming the insulating layer is preferably active energy ray-curable ink.

The insulating layer forming ink preferably contains a polymerizable monomer and a polymerization initiator.

-Polymerizable Monomer-

A polymerizable monomer is a monomer that has at least one polymerizable group in one molecule. The polymerizable group in the polymerizable monomer may be a cationically polymerizable group or a radically polymerizable group. Moreover, the radically polymerizable group is preferably an ethylenically unsaturated group from the viewpoint of curability. From the viewpoint of curability, the cationic polymerizable group is preferably a group containing at least one of an oxirane ring and an oxetane ring.

In the present disclosure, a monomer refers to a compound having a molecular weight of 1000 or less. The molecular weight can be calculated from the type and number of atoms that constitute the compound.

The polymerizable monomer may be a monofunctional polymerizable monomer having one polymerizable group, or may be a polyfunctional polymerizable monomer having two or more polymerizable groups.

The monofunctional polymerizable monomer is not particularly limited as long as it has one polymerizable group.

-Radical polymerizable monomer-
From the viewpoint of curability, the radically polymerizable monomer is preferably a monofunctional ethylenically unsaturated monomer.

Examples of monofunctional ethylenically unsaturated monomers include monofunctional (meth)acrylates, monofunctional (meth)acrylamides, monofunctional aromatic vinyl compounds, monofunctional vinyl ethers and monofunctional N-vinyl compounds.

Examples of monofunctional (meth)acrylates include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, n-butyl (meth)acrylate, hexyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. , tert-octyl (meth)acrylate, isoamyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, cyclohexyl (meth)acrylate acrylates, 4-n-butylcyclohexyl (meth)acrylate, 4-tert-butylcyclohexyl (meth)acrylate, bornyl (meth)acrylate, isobornyl (meth)acrylate, 2-ethylhexyl diglycol (meth)acrylate, butoxyethyl ( meth) acrylate, 2-chloroethyl (meth) acrylate, 4-bromobutyl (meth) acrylate, cyanoethyl (meth) acrylate, benzyl (meth) acrylate, butoxymethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, 2- (2-Methoxyethoxy)ethyl (meth)acrylate, 2-(2-butoxyethoxy)ethyl (meth)acrylate, 2,2,2-tetrafluoroethyl (meth)acrylate, 1H,1H,2H,2H-perfluoro Decyl (meth)acrylate, 4-butylphenyl (meth)acrylate, phenyl (meth)acrylate, 2,4,5-tetramethylphenyl (meth)acrylate, 4-chlorophenyl (meth)acrylate, 2-phenoxymethyl (meth)acrylate acrylates, 2-phenoxyethyl (meth)acrylate, glycidyl (meth)acrylate, glycidyloxybutyl (meth)acrylate, glycidyloxyethyl (meth)acrylate, glycidyloxypropyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, 2 - hydroxyethyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate ) acrylate, cyclic trimethylolpropane formal (meth)acrylate, phenylglycidyl ether (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, dimethylaminopropyl (meth)acrylate, diethylaminopropyl (meth)acrylate, trimethoxysilylpropyl (meth)acrylate, trimethylsilylpropyl (meth)acrylate , polyethylene oxide monomethyl ether (meth)acrylate, polyethylene oxide (meth)acrylate, polyethylene oxide monoalkyl ether (meth)acrylate, dipropylene glycol (meth)acrylate, polypropylene oxide monoalkyl ether (meth)acrylate, 2-methacryloyloxyethyl Succinic acid, 2-methacryloyloxyhexahydrophthalic acid, 2-methacryloyloxyethyl-2-hydroxypropyl phthalate, ethoxydiethylene glycol (meth)acrylate, butoxydiethyleneglycol (meth)acrylate, trifluoroethyl (meth)acrylate, perfluorooctylethyl (Meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, ethylene oxide (EO) modified phenol (meth) acrylate, EO modified cresol (meth) acrylate, EO modified nonylphenol (meth) acrylate, propylene oxide (PO) Modified nonylphenol (meth) acrylate, EO-modified 2-ethylhexyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, dicyclopentanyl (meth) acrylate, (3-ethyl- 3-oxetanylmethyl) (meth)acrylate, phenoxyethylene glycol (meth)acrylate, 2-carboxyethyl (meth)acrylate, and 2-(meth)acryloyloxyethyl succinate.

Among them, from the viewpoint of improving heat resistance, the monofunctional (meth)acrylate is preferably a monofunctional (meth)acrylate having an aromatic ring or an aliphatic ring, such as isobornyl (meth)acrylate, 4-tert-butylcyclohexyl (Meth)acrylate, dicyclopentenyl (meth)acrylate, or dicyclopentanyl (meth)acrylate is more preferred.

Examples of monofunctional (meth)acrylamides include (meth)acrylamide, N-methyl(meth)acrylamide, N-ethyl(meth)acrylamide, N-propyl(meth)acrylamide, Nn-butyl(meth)acrylamide, Nt-butyl (meth)acrylamide, N-butoxymethyl (meth)acrylamide, N-isopropyl (meth)acrylamide, N-methylol (meth)acrylamide, N,N-dimethyl (meth)acrylamide, N,N-diethyl (meth)acrylamide and (meth)acryloylmorpholine.

Examples of monofunctional aromatic vinyl compounds include styrene, dimethylstyrene, trimethylstyrene, isopropylstyrene, chloromethylstyrene, methoxystyrene, acetoxystyrene, chlorostyrene, dichlorostyrene, bromostyrene, vinylbenzoic acid methyl ester, 3-methyl Styrene, 4-methylstyrene, 3-ethylstyrene, 4-ethylstyrene, 3-propylstyrene, 4-propylstyrene, 3-butylstyrene, 4-butylstyrene, 3-hexylstyrene, 4-hexylstyrene, 3-octyl Styrene, 4-octylstyrene, 3-(2-ethylhexyl)styrene, 4-(2-ethylhexyl)styrene, allylstyrene, isopropenylstyrene, butenylstyrene, octenylstyrene, 4-t-butoxycarbonylstyrene and 4- t-butoxystyrene can be mentioned.

Monofunctional vinyl ethers include, for example, methyl vinyl ether, ethyl vinyl ether, propyl vinyl ether, n-butyl vinyl ether, t-butyl vinyl ether, 2-ethylhexyl vinyl ether, n-nonyl vinyl ether, lauryl vinyl ether, cyclohexyl vinyl ether, cyclohexylmethyl vinyl ether, 4-methyl Cyclohexyl methyl vinyl ether, benzyl vinyl ether, dicyclopentenyl vinyl ether, 2-dicyclopentenoxyethyl vinyl ether, methoxyethyl vinyl ether, ethoxyethyl vinyl ether, butoxyethyl vinyl ether, methoxyethoxyethyl vinyl ether, ethoxyethoxyethyl vinyl ether, methoxypolyethylene glycol vinyl ether, tetrahydro Furfuryl vinyl ether, 2-hydroxyethyl vinyl ether, 2-hydroxypropyl vinyl ether, 4-hydroxybutyl vinyl ether, 4-hydroxymethylcyclohexylmethyl vinyl ether, diethylene glycol monovinyl ether, polyethylene glycol vinyl ether, chloroethyl vinyl ether, chlorobutyl vinyl ether, chloroethoxyethyl vinyl ether , phenylethyl vinyl ether and phenoxypolyethylene glycol vinyl ether.

Examples of monofunctional N-vinyl compounds include N-vinyl-ε-caprolactam and N-vinylpyrrolidone.

The polyfunctional polymerizable monomer is not particularly limited as long as it has two or more polymerizable groups. From the viewpoint of curability, the polyfunctional polymerizable monomer is preferably a polyfunctional radically polymerizable monomer, more preferably a polyfunctional ethylenically unsaturated monomer.

Examples of polyfunctional ethylenically unsaturated monomers include polyfunctional (meth)acrylate compounds and polyfunctional vinyl ethers.

Examples of polyfunctional (meth)acrylates include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, and propylene glycol di(meth)acrylate. , dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, butylene glycol di(meth)acrylate, tetraethylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate ) acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, heptanediol di(meth)acrylate, EO-modified neopentyl glycol di(meth)acrylate, PO-modified neopentyl glycol di(meth)acrylate, EO-modified hexanediol di(meth)acrylate, PO-modified hexanediol di(meth)acrylate, octanediol di(meth)acrylate, nonanediol di(meth)acrylate, decanediol di(meth)acrylate (Meth)acrylate, dodecanediol di(meth)acrylate, glycerin di(meth)acrylate, pentaerythritol di(meth)acrylate, ethylene glycol diglycidyl ether di(meth)acrylate, diethylene glycol diglycidyl ether di(meth)acrylate, tri Cyclodecane dimethanol di(meth)acrylate, trimethylolethane tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolpropane EO adduct tri(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra (meth)acrylate, dipentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, tri(meth)acryloyloxyethoxytrimethylolpropane, glycerin polyglycidyl ether poly(meth) ) acrylates and tris(2-acryloyloxyethyl) isocyanurate.

Polyfunctional vinyl ethers include, for example, 1,4-butanediol divinyl ether, ethylene glycol divinyl ether, diethylene glycol divinyl ether, triethylene glycol divinyl ether, polyethylene glycol divinyl ether, propylene glycol divinyl ether, butylene glycol divinyl ether, hexanediol divinyl ether, Vinyl ether, 1,4-cyclohexanedimethanol divinyl ether, bisphenol A alkylene oxide divinyl ether, bisphenol F alkylene oxide divinyl ether, trimethylolethane trivinyl ether, trimethylolpropane trivinyl ether, ditrimethylolpropane tetravinyl ether, glycerin trivinyl ether, pentaerythritol Tetravinyl ether, dipentaerythritol pentavinyl ether, dipentaerythritol hexavinyl ether, EO-added trimethylolpropane trivinyl ether, PO-added trimethylolpropane trivinyl ether, EO-added ditrimethylolpropane tetravinyl ether, PO-added ditrimethylolpropane tetravinyl ether, EO-added penta Erythritol tetravinyl ether, PO-added pentaerythritol tetravinyl ether, EO-added dipentaerythritol hexavinyl ether and PO-added dipentaerythritol hexavinyl ether can be mentioned.

Above all, from the viewpoint of curability, the polyfunctional polymerizable monomer is preferably a monomer having 3 to 11 carbon atoms in the portion other than the (meth)acryloyl group. Specific examples of the monomer having 3 to 11 carbon atoms in the portion other than the (meth)acryloyl group include 1,6-hexanediol di(meth)acrylate, dipropylene glycol di(meth)acrylate, and PO-modified neopentyl glycol. di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 3-methyl-1,5-pentanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate (EO chain n=4), or 1,10-Decanediol di(meth)acrylate is more preferred.

As the cationic polymerizable monomer, compounds having an oxirane ring (also referred to as an "epoxy ring") (also referred to as an "oxirane compound" or an "epoxy compound") and compounds having an oxetane ring (also referred to as an "oxetane compound ”, and known cationic polymerizable monomers such as vinyl ether compounds can be used without particular limitation.
The cationic polymerizable monomer is not particularly limited as long as it is a compound that initiates a polymerization reaction by a cationic polymerization initiating species generated from a photocationic polymerization initiator described later and cures, and various known photocationic polymerizable monomers. Cationically polymerizable monomers can be used.
Examples of cationic polymerizable monomers include JP-A-6-9714, JP-A-2001-31892, JP-A-2001-40068, JP-A-2001-55507, JP-A-2001-310938, JP-A-2001-310937, JP-A-2001- Epoxy compounds, vinyl ether compounds, oxetane compounds and the like described in publications such as No. 220526 can be mentioned.
Further, as cationic polymerizable monomers, for example, cationic polymerization photocurable resins are known. For example, it is disclosed in Japanese Unexamined Patent Publication No. 6-43633 and Japanese Unexamined Patent Publication No. 8-324137.

Epoxy compounds include aromatic epoxides, alicyclic epoxides, aliphatic epoxides, and the like.
Aromatic epoxides include di- or polyglycidyl ethers prepared by reacting polyhydric phenols having at least one aromatic nucleus or their alkylene oxide adducts with epichlorohydrin.
Examples of aromatic epoxides include di- or polyglycidyl ethers of bisphenol A or its alkylene oxide adducts, di- or polyglycidyl ethers of hydrogenated bisphenol A or its alkylene oxide adducts, and novolac type epoxy resins. Examples of the alkylene oxide include ethylene oxide and propylene oxide.

The alicyclic epoxide is cyclohexene, which is obtained by epoxidizing a compound having at least one cycloalkane ring such as cyclohexene ring or cyclopentene ring with a suitable oxidizing agent such as hydrogen peroxide or peracid. Oxide or cyclopentene oxide containing compounds are preferably mentioned.
Aliphatic epoxides include di- or polyglycidyl ethers of aliphatic polyhydric alcohols or their alkylene oxide adducts. - diglycidyl ether of alkylene glycol such as diglycidyl ether of hexanediol, polyglycidyl ether of polyhydric alcohol such as di- or triglycidyl ether of glycerin or its alkylene oxide adduct, diglycidyl of polyethylene glycol or its alkylene oxide adduct Ethers, diglycidyl ethers of polyalkylene glycols represented by diglycidyl ethers of polypropylene glycol or its alkylene oxide adducts, and the like can be mentioned.
Examples of the alkylene oxide include ethylene oxide and propylene oxide.

The monofunctional and polyfunctional epoxy compounds are exemplified in detail below.
Examples of monofunctional epoxy compounds include phenyl glycidyl ether, p-tert-butylphenyl glycidyl ether, butyl glycidyl ether, 2-ethylhexyl glycidyl ether, allyl glycidyl ether, 1,2-butylene oxide, and 1,3-butadiene. monooxide, 1,2-epoxidedecane, epichlorohydrin, 1,2-epoxydecane, styrene oxide, cyclohexene oxide, 3-methacryloyloxymethylcyclohexene oxide, 3-acryloyloxymethylcyclohexene oxide, 3-vinylcyclohexene oxide, 4-vinylcyclohexene oxide and the like.

Examples of polyfunctional epoxy compounds include bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, bisphenol S diglycidyl ether, brominated bisphenol A diglycidyl ether, brominated bisphenol F diglycidyl ether, brominated bisphenol S diglycidyl ether. glycidyl ether, epoxy novolak resin, hydrogenated bisphenol A diglycidyl ether, hydrogenated bisphenol F diglycidyl ether, hydrogenated bisphenol S diglycidyl ether, 3,4-epoxycyclohexylmethyl-3′,4′-epoxycyclohexane carboxylate, 2-(3,4-epoxycyclohexyl-5,5-spiro-3,4-epoxy)cyclohexane-meta-dioxane, bis(3,4-epoxycyclohexylmethyl)adipate, bis(3,4-epoxy-6- methylcyclohexylmethyl)adipate, 3,4-epoxy-6-methylcyclohexyl-3',4'-epoxy-6'-methylcyclohexanecarboxylate, methylenebis(3,4-epoxycyclohexane), dicyclopentadiene diepoxide, ethylene Di(3,4-epoxycyclohexylmethyl) ether of glycol, ethylenebis(3,4-epoxycyclohexanecarboxylate), dioctyl epoxyhexahydrophthalate, di-2-ethylhexyl epoxyhexahydrophthalate, 1,4-butane diol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycerin triglycidyl ether, trimethylolpropane triglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ethers, 1,13-tetradecadiene dioxide, limonene dioxide, 1,2,7,8-diepoxyoctane, 1,2,5,6-diepoxycyclooctane and the like.

Among epoxy compounds, aromatic epoxides and alicyclic epoxides are preferred from the viewpoint of excellent curing speed, and alicyclic epoxides are particularly preferred.

The oxetane compound refers to a compound having at least one oxetane ring, and any known oxetane compound as described in JP-A-2001-220526, JP-A-2001-310937, and JP-A-2003-341217. You can choose to use it.
As the compound having an oxetane ring, a compound having 1 to 4 oxetane rings in its structure is preferable. By using such a compound, it is possible to easily maintain the viscosity of the ink composition within a range of good handling properties, and to obtain high adhesion of the cured ink composition to the recording medium. can be done.

Examples of compounds having 1 to 2 oxetane rings in the molecule include compounds represented by the following formulas (1) to (3).

In formulas (1) to (3), R ^a1 represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, a fluoroalkyl group having 1 to 6 carbon atoms, an allyl group, an aryl group, a furyl group, or a thienyl group. .
When two R ^a1 are present in the molecule, they may be the same or different.
Examples of the alkyl group include methyl group, ethyl group, propyl group, and butyl group. Preferred examples of the fluoroalkyl group include those in which one of the hydrogen atoms in these alkyl groups is substituted with a fluorine atom.
R ^a2 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 2 to 6 carbon atoms, a group having an aromatic ring, an alkylcarbonyl group having 2 to 6 carbon atoms, or 2 to 6 carbon atoms. represents an alkoxycarbonyl group and an N-alkylcarbamoyl group having 2 to 6 carbon atoms. Examples of the alkyl group include methyl group, ethyl group, propyl group, butyl group, etc. Examples of the alkenyl group include 1-propenyl group, 2-propenyl group, 2-methyl-1-propenyl group, 2-methyl-2 -propenyl group, 1-butenyl group, 2-butenyl group, 3-butenyl group and the like, and examples of groups having an aromatic ring include a phenyl group, a benzyl group, a fluorobenzyl group, a methoxybenzyl group, a phenoxyethyl group and the like. mentioned. Examples of the alkylcarbonyl group include an ethylcarbonyl group, a propylcarbonyl group and a butylcarbonyl group; examples of the alkoxycarbonyl group include an ethoxycarbonyl group, a propoxycarbonyl group and a butoxycarbonyl group; examples of the N-alkylcarbamoyl group include Ethylcarbamoyl group, propylcarbamoyl group, butylcarbamoyl group, pentylcarbamoyl group and the like.
R ^a2 may have a substituent, and examples of the substituent include 1 to 6 alkyl groups and fluorine atoms.

R ^a3 is a linear or branched alkylene group, a linear or branched poly(alkyleneoxy) group, a linear or branched unsaturated hydrocarbon group, a carbonyl group or an alkylene group containing a carbonyl group, a carboxy group represents an alkylene group containing, an alkylene group containing a carbamoyl group, or the groups shown below. Examples of the alkylene group include an ethylene group, a propylene group and a butylene group, and examples of the poly(alkyleneoxy) group include a poly(ethyleneoxy) group and a poly(propyleneoxy) group. A propenylene group, a methylpropenylene group, a butenylene group etc. are mentioned as an unsaturated hydrocarbon group.

Examples of the compound represented by formula (1) include 3-ethyl-3-hydroxymethyloxetane (OXT-101: manufactured by Toagosei Co., Ltd.), 3-ethyl-3-(2-ethylhexyloxymethyl)oxetane ( OXT-212: manufactured by Toagosei Co., Ltd.) and 3-ethyl-3-phenoxymethyloxetane (OXT-211: manufactured by Toagosei Co., Ltd.).
Examples of the compound represented by formula (2) include 1,4-bis[(3-ethyl-3-oxetanylmethoxy)methyl]benzene (OXT-121: manufactured by Toagosei Co., Ltd.).
Examples of the compound represented by formula (3) include bis(3-ethyl-3-oxetanylmethyl)ether (OXT-221: manufactured by Toagosei Co., Ltd.).

For compounds having an oxetane ring, paragraphs 0021 to 0084 of JP-A-2003-341217, JP-A-2004-91556, and paragraphs 0022-0058 of JP-A-2004-91556 may be referred to.

Examples of preferred cationic polymerizable monomers are listed below.

Examples of cationic polymerizable monomers include vinyl ether compounds. Specific examples of the vinyl ether compound are as described above.

As the vinyl ether compound, a divinyl ether compound or a trivinyl ether compound is preferable from the viewpoint of curability, adhesion with a recording medium, surface hardness of a formed image, etc., and a divinyl ether compound is particularly preferable.

The content of the polymerizable monomer is preferably 10% by mass to 98% by mass, more preferably 50% by mass to 98% by mass, relative to the total amount of the insulating layer forming ink.

-Polymerization initiator-
The insulating layer forming ink contains a polymerization initiator for the purpose of curing the polymerizable monomer. A suitable polymerization initiator can be selected from radical polymerization initiators and cationic polymerization initiators depending on the type of polymerizable monomer. Examples of polymerization initiators include oxime compounds, alkylphenone compounds, acylphosphine compounds, aromatic onium salt compounds, organic peroxides, thio compounds, hexaarylbisimidazole compounds, borate compounds, azinium compounds, titanocene compounds, active esters. compounds, compounds with carbon-halogen bonds, and alkylamines.

The radical polymerization initiator contained in the insulating layer forming ink is at least one selected from the group consisting of an oxime compound, an alkylphenone compound, and a titanocene compound, from the viewpoint of further improving conductivity. more preferably an alkylphenone compound, and more preferably at least one selected from the group consisting of α-aminoalkylphenone compounds and benzylketal alkylphenones.

The cationic polymerization initiator is preferably a photoacid generator.
Examples of photoacid generators include chemically amplified photoresists and compounds used for photocationic polymerization (Organic Electronics Materials Research Group, "Organic Materials for Imaging", Bunshin Publishing (1993), 187- (see page 192). Among them, the photoacid generator is preferably an aromatic onium salt compound, preferably an onium salt compound such as a diazonium salt, a phosphonium salt, a sulfonium salt or an iodonium salt, more preferably a sulfonium salt or an iodonium salt.

The content of the polymerization initiator is preferably 0.5% by mass to 20% by mass, more preferably 2% by mass to 10% by mass, relative to the total amount of the insulating layer forming ink.

In the present disclosure, the insulating layer forming ink may contain components other than the polymerization initiator and the polymerizable monomer. Other ingredients include chain transfer agents, polymerization inhibitors, sensitizers, surfactants and additives.

-Chain transfer agent-
The insulating protective layer forming ink may contain at least one chain transfer agent.
From the viewpoint of improving the reactivity of the photopolymerization reaction, the chain transfer agent is preferably a polyfunctional thiol.

Examples of polyfunctional thiols include aliphatic thiols such as hexane-1,6-dithiol, decane-1,10-dithiol, dimercaptodiethyl ether, dimercaptodiethyl sulfide, xylylene dimercaptan, 4,4'- Aromatic thiols such as dimercaptodiphenyl sulfide and 1,4-benzenedithiol;
Ethylene Glycol Bis (Mercaptoacetate), Polyethylene Glycol Bis (Mercaptoacetate), Propylene Glycol Bis (Mercaptoacetate), Glycerin Tris (Mercaptoacetate), Trimethylolethane Tris (Mercaptoacetate), Trimethylolpropane Tris (Mercaptoacetate), Penta poly(mercaptoacetate) of polyhydric alcohols such as erythritol tetrakis (mercaptoacetate), dipentaerythritol hexakis (mercaptoacetate);
Ethylene glycol bis(3-mercaptopropionate), polyethylene glycol bis(3-mercaptopropionate), propylene glycol bis(3-mercaptopropionate), glycerol bis(3-mercaptopropionate), trimethylolethane Polyvalent tris (mercaptopropionate), trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), dipentaerythritol hexakis (3-mercaptopropionate), etc. alcohol poly(3-mercaptopropionate); and
1,4-bis(3-mercaptobutyryloxy)butane, 1,3,5-tris(3-mercaptobutyloxyethyl)-1,3,5-triazine-2,4,6(1H,3H,5H )-trione, and poly(mercaptobutyrate) such as pentaerythritol tetrakis(3-mercaptobutyrate).

-Polymerization inhibitor-
The insulating layer forming ink may contain at least one polymerization inhibitor.
Polymerization inhibitors include p-methoxyphenol, quinones (e.g., hydroquinone, benzoquinone, methoxybenzoquinone, etc.), phenothiazine, catechols, alkylphenols (e.g., dibutylhydroxytoluene (BHT), etc.), alkylbisphenols, dimethyldithiocarbamine. zinc acid, copper dimethyldithiocarbamate, copper dibutyldithiocarbamate, copper salicylate, thiodipropionates, mercaptobenzimidazole, phosphites, 2,2,6,6-tetramethylpiperidine-1-oxyl (TEMPO), 2,2,6,6-tetramethyl-4-hydroxypiperidine-1-oxyl (TEMPOL), and tris(N-nitroso-N-phenylhydroxylamine) aluminum salt (also known as Cupferron Al).

Among them, the polymerization inhibitor is preferably at least one selected from p-methoxyphenol, catechols, quinones, alkylphenols, TEMPO, TEMPOL, and tris(N-nitroso-N-phenylhydroxylamine) aluminum salt, and p -Methoxyphenol, hydroquinone, benzoquinone, BHT, TEMPO, TEMPOL, and tris(N-nitroso-N-phenylhydroxylamine) aluminum salt is more preferred.

When the insulating layer forming ink contains a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.01% by mass to 2.0% by mass, more preferably 0.02% by mass to 1.0% by mass, based on the total amount of the ink. 0 mass % is more preferred, and 0.03 mass % to 0.5 mass % is particularly preferred.

- Sensitizer -
The insulating layer forming ink may contain at least one sensitizer.

Examples of sensitizers include polynuclear aromatic compounds (e.g., pyrene, perylene, triphenylene, and 2-ethyl-9,10-dimethoxyanthracene), xanthene compounds (e.g., fluorescein, eosin, erythrosine, rhodamine B, and Rose Bengal), cyanine compounds (e.g., thiacarbocyanine and oxacarbocyanine), merocyanine compounds (e.g., merocyanine and carbomerocyanine), thiazine compounds (e.g., thionine, methylene blue, and toluidine blue), acridine compounds compounds (e.g., acridine orange, chloroflavin, and acriflavin), anthraquinones (e.g., anthraquinone), squalium compounds (e.g., squalium), coumarin compounds (e.g., 7-diethylamino-4-methylcoumarin), thioxanthone compounds (eg, isopropylthioxanthone), and thiochromanone-based compounds (eg, thiochromanone). Among them, the sensitizer is preferably a thioxanthone compound.

When the insulating layer-forming ink contains a sensitizer, the content of the sensitizer is not particularly limited, but is 1.0% by mass to 15.0% by mass with respect to the total amount of the insulating layer-forming ink. is preferred, and 1.5% by mass to 5.0% by mass is more preferred.

-Surfactant-
The insulating layer forming ink may contain at least one surfactant.

Examples of surfactants include those described in JP-A-62-173463 and JP-A-62-183457. Examples of surfactants include anionic surfactants such as dialkylsulfosuccinates, alkylnaphthalenesulfonates, and fatty acid salts; polyoxyethylene alkyl ethers, polyoxyethylene alkyl allyl ethers, acetylene glycol, polyoxyethylene • Nonionic surfactants such as polyoxypropylene block copolymers; and cationic surfactants such as alkylamine salts and quaternary ammonium salts. Further, the surfactant may be a fluorosurfactant or a silicone surfactant.

-Organic solvent-
The insulating layer forming ink may contain at least one organic solvent.

Examples of organic solvents include (poly)alkylene glycols such as ethylene glycol monoethyl ether, diethylene glycol monoethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether (PGME), dipropylene glycol monomethyl ether, and tripropylene glycol monomethyl ether. monoalkyl ethers;
(poly)alkylene glycol dialkyl ethers such as ethylene glycol dibutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, dipropylene glycol diethyl ether, tetraethylene glycol dimethyl ether;
(poly)alkylene glycol acetates such as diethylene glycol acetate;
(poly)alkylene glycol diacetates such as ethylene glycol diacetate and propylene glycol diacetate;
(poly)alkylene glycol monoalkyl ether acetates such as ethylene glycol monobutyl ether acetate and propylene glycol monomethyl ether acetate; ketones such as methyl ethyl ketone and cyclohexanone;
Lactones such as γ-butyrolactone;
Esters such as ethyl acetate, propyl acetate, butyl acetate, 3-methoxybutyl acetate (MBA), methyl propionate, ethyl propionate;
cyclic ethers such as tetrahydrofuran and dioxane; and amides such as dimethylformamide and dimethylacetamide.

When the insulating layer forming ink contains an organic solvent, the content of the organic solvent is preferably 70% by mass or less, more preferably 50% by mass or less, relative to the total amount of the insulating layer forming ink. preferable. The lower limit of the content of the organic solvent is not particularly limited. The content of the organic solvent may be 0% by mass.

(Additive)
The insulating layer-forming ink may contain additives such as a co-sensitizer, an ultraviolet absorber, an antioxidant, an anti-fading agent, and a basic compound, if necessary.

(physical properties)
The pH of the insulating layer-forming ink is preferably 7 to 10, more preferably 7.5 to 9.5, from the viewpoint of improving ejection stability when applied by an inkjet recording method. The pH is measured at 25° C. using a pH meter, for example, using a pH meter manufactured by DKK Toa (model number “HM-31”).

The viscosity of the insulating layer forming ink is preferably 0.5 mPa·s to 60 mPa·s, more preferably 2 mPa·s to 40 mPa·s. Viscosity is measured at 25° C. using a viscometer, for example, using a TV-22 viscometer manufactured by Toki Sangyo Co., Ltd.

The surface tension of the insulating layer forming ink is preferably 60 mN/m or less, more preferably 20 mN/m to 50 mN/m, even more preferably 25 mN/m to 45 mN/m. The surface tension is measured at 25° C. using a surface tensiometer, for example, by a plate method using an automatic surface tensiometer manufactured by Kyowa Interface Science Co., Ltd. (product name “CBVP-Z”).

(Applying Ink for Insulating Layer Formation)
The method of applying the insulating layer forming ink is not particularly limited, and examples thereof include known methods such as a coating method and an inkjet recording method. Above all, it is preferable to apply the ink for forming the insulating layer using an ink jet recording method from the viewpoint of reducing the thickness of the insulating layer formed by applying a small amount of ink in one application.

Inkjet recording methods include a charge control method that uses electrostatic attraction to eject ink, a drop-on-demand method (pressure pulse method) that uses the vibration pressure of a piezo element, and an acoustic beam that converts an electrical signal into an acoustic beam that irradiates the ink. Either an acoustic inkjet method in which ink is ejected using radiation pressure, or a thermal inkjet (bubble jet (registered trademark)) method in which ink is heated to form bubbles and the pressure generated is used. .

As an ink jet recording method, in particular, the method described in Japanese Patent Laid-Open No. 59936/1989 causes a sudden change in volume of the ink under the action of thermal energy, and the acting force due to this change in state causes the ink to be ejected from the nozzle. It is possible to effectively use an ink jet recording method for discharging.

As for the inkjet recording method, the method described in paragraphs 0093 to 0105 of JP-A-2003-306623 can also be referred to.

As an inkjet head used in the inkjet recording method, a short serial head is used, and a shuttle scan method in which recording is performed while scanning the head in the width direction of the electronic substrate, and a recording element corresponding to the entire side of the electronic substrate. and a line system using arrayed line heads.

The droplet volume of the insulating layer forming ink ejected from the inkjet head is preferably 1 pL (picoliter) to 100 pL, more preferably 3 pL to 80 pL, and even more preferably 3 pL to 20 pL.

(Irradiation of active energy rays)
In the insulating layer forming step, the active energy ray is applied after applying the insulating layer forming ink.

Examples of active energy rays include ultraviolet rays, visible rays, and electron beams, and among them, ultraviolet rays (hereinafter also referred to as "UV") are preferred.

The peak wavelength of ultraviolet rays is preferably 200 nm to 405 nm, more preferably 250 nm to 400 nm, even more preferably 300 nm to 400 nm.

From the viewpoint of further suppressing the outflow of the insulating layer forming ink, the illuminance at the time of irradiation with the active energy ray is preferably 1 W/cm ² or more, more preferably 10 W/cm ² or more. Although the upper limit of the illuminance is not particularly limited, it is, for example, 100 W/cm ² .

The exposure amount in the irradiation of active energy rays is preferably 100 mJ/cm ² to 10000 mJ/cm ² , more preferably 300 mJ/cm ² to 5000 mJ/cm ² . When the application of the ink for forming the insulating layer and the irradiation of the active energy ray are regarded as one cycle, the amount of exposure here means the amount of exposure of the active energy ray in one cycle.

Mercury lamps, gas lasers, and solid-state lasers are mainly used as light sources for ultraviolet irradiation, and mercury lamps, metal halide lamps, and ultraviolet fluorescent lamps are widely known. UV-LEDs (light-emitting diodes) and UV-LDs (laser diodes) are small, have a long life, are highly efficient, and are low-cost, and are expected to serve as light sources for ultraviolet irradiation. Among them, the light source for ultraviolet irradiation is preferably a metal halide lamp, a high-pressure mercury lamp, a medium-pressure mercury lamp, a low-pressure mercury lamp, or a UV-LED.

<Conductive layer forming step>
In the conductive layer forming step, a conductive layer forming ink is applied onto the insulating layer and at least part of the ground electrode.

An example of the conductive layer forming process will be described below with reference to FIGS. 5A, 5B, and 5C.

FIGS. 5A and 5B are diagrams showing an example of areas where the conductive layer forming ink is applied. FIG. 5C is a cross-sectional view taken along line BB of FIG. 3A, showing a state in which a conductive layer is formed.

By applying the conductive layer forming ink to the insulating layer 31 and at least part of the ground electrode 13, as shown in FIG. A conductive layer 32 is formed on the portion.

The step of applying the ink for forming the conductive layer is preferably repeated. By repeating the above steps, the thickness of the cured film of the ink for forming the conductive layer can be increased.

The region to which the conductive layer forming ink is applied (the conductive layer forming ink applying region) is set on the insulating layer 31 and at least part of the ground electrode 13 .

According to the electronic device manufacturing method of the present disclosure, an electronic device in which T2 is thicker than T1 is obtained. As a method for making T2 thicker than T1, the following methods are preferably mentioned.

First, as a first step, as shown in FIG. 5A, the conductive layer forming ink is applied to the region 22A. The area 22A is substantially the same as the area covering the ground electrode and the ground area.

By applying the conductive layer forming ink, a cured film of the conductive layer forming ink is formed on the insulating layer 31 .

The first step is preferably repeated. By repeating the first step, the thickness of the cured film of the conductive layer forming ink on the insulating layer 31 can be increased, and T1 can be adjusted.

Next, as a second step, as shown in FIG. 5B, a conductive layer forming ink is applied to the region 22B. A region 22B is a region where a ground electrode is arranged. In this example, the area 22B is an area in which ground electrodes arranged discontinuously are regarded as a continuous frame.

By applying the conductive layer forming ink, a cured film of the conductive layer forming ink is formed on the ground electrode 13 .

The second step is preferably repeated. By repeating the second step, the thickness of the cured film of the conductive layer forming ink on the ground electrode 13 can be increased, and T2 can be adjusted.

In the first step and the second step, T1 and T2 can be adjusted by appropriately adjusting the amount of application of the ink for forming the conductive layer and the number of times of application.

In this example, the

regions

22A and 22B are set as the conductive layer forming ink application regions, but the present invention is not limited to this example.

The

areas

22A and 22B can be appropriately set according to the positions and shapes of the electronic components 12 and the ground electrodes 13 arranged on the wiring board 11.

(Applying ink for forming conductive layer)
The method of applying the ink for forming the conductive layer is not particularly limited, and examples thereof include known methods such as a coating method and an inkjet recording method. Above all, it is preferable to apply the ink for forming the conductive layer by an inkjet recording method, from the viewpoint that the thickness of the conductive layer formed by ejecting a small amount of droplets in one application can be reduced.

Preferred aspects of the inkjet recording method are the same as the preferred aspects of the inkjet recording method in applying the ink for forming the insulating layer.

It is preferable to preheat the electronic substrate on which the insulating layer is formed before applying the ink for forming the conductive layer. The temperature of the electronic substrate when applying the conductive layer forming ink is preferably 20°C to 120°C, more preferably 40°C to 100°C.

(Ink for forming conductive layer)
In the present disclosure, the ink for forming a conductive layer means an ink for forming a conductive layer. Electrical conductivity means the property of having a volume resistivity of less than 10 ⁸ Ωcm.

The ink for forming the conductive layer is an ink containing metal particles (hereinafter also referred to as "metal particle ink"), an ink containing a metal complex (hereinafter also referred to as "metal complex ink"), or an ink containing a metal salt (hereinafter also referred to as "metal complex ink"). , also referred to as “metal salt ink”), and more preferably metal complex ink or metal salt ink.

From the viewpoint of improving the electromagnetic wave shielding property, the ink for forming the conductive layer preferably contains silver, more preferably an ink containing a silver salt or an ink containing a silver complex.

<<Metal particle ink>>
Metal particle ink is, for example, an ink composition in which metal particles are dispersed in a dispersion medium.

-metal particles-
Examples of the metal that constitutes the metal particles include particles of base metals and noble metals. Base metals include, for example, nickel, titanium, cobalt, copper, chromium, manganese, iron, zirconium, tin, tungsten, molybdenum, and vanadium. Noble metals include, for example, gold, silver, platinum, palladium, iridium, osmium, ruthenium, rhodium, rhenium, and alloys containing these metals. Among them, from the viewpoint of conductivity, the metal constituting the metal particles preferably contains at least one selected from the group consisting of silver, gold, platinum, nickel, palladium and copper, and more preferably contains silver. .

Although the average particle size of the metal particles is not particularly limited, it is preferably 10 nm to 500 nm, more preferably 10 nm to 200 nm. When the average particle size is within the above range, the firing temperature of the metal particles is lowered, and the process suitability for producing the conductive ink film is enhanced. In particular, when the metal particle ink is applied by a spray method or an inkjet recording method, there is a tendency that the ejection property is improved, and the pattern formability and the uniformity of the film thickness of the conductive ink film are improved. The average particle diameter here means the average value of the primary particle diameters of the metal particles (average primary particle diameter).

The average particle size of metal particles is measured by a laser diffraction/scattering method. The average particle size of the metal particles is, for example, a value calculated as the average value of the values obtained by measuring the 50% volume cumulative diameter (D50) three times and using a laser diffraction/scattering particle size distribution analyzer. (product name “LA-960”, manufactured by HORIBA, Ltd.).

In addition, the metal particle ink may contain metal particles having an average particle size of 500 nm or more, if necessary. When metal particles having an average particle size of 500 nm or more are contained, the conductive ink film can be bonded by melting point depression of the nanometer-sized metal particles around the micrometer-sized metal particles.

The content of the metal particles in the metal particle ink is preferably 10% by mass to 90% by mass, more preferably 20% by mass to 50% by mass, relative to the total amount of the metal particle ink. When the content of the metal particles is 10% by mass or more, the surface resistivity is further lowered. When the content of the metal particles is 90% by mass or less, the jettability is improved when the metal particle ink is applied by an inkjet recording method.

In addition to the metal particles, the metal particle ink may contain, for example, a dispersant, a resin, a dispersion medium, a thickener, and a surface tension adjuster.

- Dispersant -
The metal particle ink may contain a dispersant adhering to at least part of the surface of the metal particles. The dispersant, together with the metal particles, substantially constitutes the metal colloid particles. The dispersant has the effect of coating the metal particles to improve the dispersibility of the metal particles and to prevent aggregation. The dispersant is preferably an organic compound capable of forming colloidal metal particles. From the viewpoint of conductivity and dispersion stability, the dispersant is preferably an amine, carboxylic acid, alcohol, or resin dispersant.

The number of dispersants contained in the metal particle ink may be one, or two or more.

Amines include, for example, saturated or unsaturated aliphatic amines. Among them, the amine is preferably an aliphatic amine having 4 to 8 carbon atoms. The aliphatic amine having 4 to 8 carbon atoms may be linear or branched, and may have a ring structure.

Examples of aliphatic amines include butylamine, n-pentylamine, isopentylamine, hexylamine, 2-ethylhexylamine, and octylamine.

Amines having an alicyclic structure include cycloalkylamines such as cyclopentylamine and cyclohexylamine.

Aniline can be mentioned as an aromatic amine.

The amine may have functional groups other than amino groups. Functional groups other than amino groups include, for example, hydroxy groups, carboxy groups, alkoxy groups, carbonyl groups, ester groups, and mercapto groups.

Carboxylic acids include, for example, formic acid, oxalic acid, acetic acid, hexanoic acid, acrylic acid, octylic acid, oleic acid, thianoic acid, ricinoleic acid, gallic acid, and salicylic acid. A carboxy group that is part of a carboxylic acid may form a salt with a metal ion. The number of metal ions that form a salt may be one, or two or more.

The carboxylic acid may have functional groups other than the carboxy group. Functional groups other than carboxy groups include, for example, amino groups, hydroxy groups, alkoxy groups, carbonyl groups, ester groups, and mercapto groups.

Examples of alcohol include terpene alcohol, allyl alcohol, and oleyl alcohol. Alcohol is easily coordinated to the surface of the metal particles and can suppress aggregation of the metal particles.

The resin dispersant includes, for example, a dispersant that has a nonionic group as a hydrophilic group and is uniformly soluble in a solvent. Examples of resin dispersants include polyvinylpyrrolidone, polyethylene glycol, polyethylene glycol-polypropylene glycol copolymer, polyvinyl alcohol, polyallylamine, and polyvinyl alcohol-polyvinyl acetate copolymer. The weight-average molecular weight of the resin dispersant is preferably 1,000 to 50,000, more preferably 1,000 to 30,000.

The content of the dispersant in the metal particle ink is preferably 0.5% by mass to 50% by mass, more preferably 1% by mass to 30% by mass, relative to the total amount of the metal particle ink. .

-dispersion medium-
The metal particle ink preferably contains a dispersion medium. The type of dispersion medium is not particularly limited, and examples thereof include hydrocarbons, alcohols, and water.

The dispersion medium contained in the metal particle ink may be of one type, or may be of two or more types. The dispersion medium contained in the metal particle ink is preferably volatile. The boiling point of the dispersion medium is preferably 50°C to 250°C, more preferably 70°C to 220°C, even more preferably 80°C to 200°C. When the boiling point of the dispersion medium is 50° C. to 250° C., there is a tendency that both the stability and the sinterability of the metal particle ink can be achieved.

Hydrocarbons include aliphatic hydrocarbons and aromatic hydrocarbons.

Examples of aliphatic hydrocarbons include saturated aliphatic hydrocarbons such as tetradecane, octadecane, heptamethylnonane, tetramethylpentadecane, hexane, heptane, octane, nonane, decane, tridecane, methylpentane, normal paraffin and isoparaffin, or unsaturated hydrocarbons. Aliphatic hydrocarbons are mentioned.

Aromatic hydrocarbons include, for example, toluene and xylene.

Alcohols include aliphatic alcohols and alicyclic alcohols. When alcohol is used as the dispersing medium, the dispersing agent is preferably an amine or carboxylic acid.

Examples of aliphatic alcohols include heptanol, octanol (eg, 1-octanol, 2-octanol, 3-octanol, etc.), decanol (eg, 1-decanol, etc.), lauryl alcohol, tetradecyl alcohol, cetyl alcohol, 2- C6-20 aliphatic alcohols which may contain an ether bond in the saturated or unsaturated chain, such as ethyl-1-hexanol, octadecyl alcohol, hexadecenol and oleyl alcohol.

Alicyclic alcohols include, for example, cycloalkanols such as cyclohexanol; terpineol (including α, β, γ isomers, or any mixture thereof), terpene alcohols such as dihydroterpineol; dihydroterpineol, myrtenol, Sobrerol, menthol, carveol, perillyl alcohol, pinocarveol, sobrerol, and verbenol.

The dispersion medium may be water. From the viewpoint of adjusting physical properties such as viscosity, surface tension and volatility, the dispersion medium may be a mixed solvent of water and other solvents. Another solvent that is mixed with water is preferably an alcohol. The alcohol used in combination with water is preferably an alcohol miscible with water and having a boiling point of 130° C. or less. Alcohols include, for example, 1-propanol, 2-propanol, 1-butanol, 2-butanol, tert-butanol, 1-pentanol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, and propylene. Glycol monomethyl ether is mentioned.

The content of the dispersion medium in the metal particle ink is preferably 1% by mass to 50% by mass with respect to the total amount of the metal particle ink. If the content of the dispersion medium is 1% by mass to 50% by mass, sufficient conductivity as a conductive ink can be obtained. The content of the dispersion medium is more preferably 10% by mass to 45% by mass, and even more preferably 20% by mass to 40% by mass.

-resin-
The metal particle ink may contain resin. Examples of resins include polyesters, polyurethanes, melamine resins, acrylic resins, styrenic resins, polyethers, and terpene resins.

The number of resins contained in the metal particle ink may be one, or two or more.

The content of the resin in the metal particle ink is preferably 0.1% by mass to 5% by mass with respect to the total amount of the metal particle ink.

- Thickener -
The metal particle ink may contain a thickening agent. Examples of thickeners include clay minerals such as clay, bentonite and hectorite; cellulose derivatives such as methylcellulose, carboxymethylcellulose, hydroxyethylcellulose, hydroxypropylcellulose and hydroxypropylmethylcellulose; and polysaccharides such as xanthan gum and guar gum. be done.

The number of thickeners contained in the metal particle ink may be one, or two or more.

The content of the thickener in the metal particle ink is preferably 0.1% by mass to 5% by mass with respect to the total amount of the metal particle ink.

-Surfactant-
The metal particle ink may contain a surfactant. When the metal particle ink contains a surfactant, a uniform conductive ink film is easily formed.

The surfactant may be an anionic surfactant, a cationic surfactant, or a nonionic surfactant. Among them, the surfactant is preferably a fluorosurfactant from the viewpoint that the surface tension can be adjusted with a small content. Further, the surfactant is preferably a compound having a boiling point of over 250°C.

The viscosity of the metal particle ink is not particularly limited, and may be from 0.01 Pa·s to 5000 Pa·s, preferably from 0.1 Pa·s to 100 Pa·s. When the metal particle ink is applied by a spray method or an inkjet recording method, the viscosity of the metal particle ink is preferably 1 mPa·s to 100 mPa·s, more preferably 2 mPa·s to 50 mPa·s. , 3 mPa·s to 30 mPa·s.

The viscosity of the metal particle ink is a value measured at 25°C using a viscometer. Viscosity is measured using, for example, a VISCOMETER TV-22 viscometer (manufactured by Toki Sangyo Co., Ltd.).

The surface tension of the metal particle ink is not particularly limited, and is preferably 20 mN/m to 45 mN/m, more preferably 25 mN/m to 40 mN/m.
Surface tension is a value measured at 25°C using a surface tensiometer.

　The surface tension of the metal particle ink is measured using, for example, DY-700 (manufactured by Kyowa Interface Science Co., Ltd.).

-Method for producing metal particles-
The metal particles may be commercially available products or may be produced by known methods. Methods for producing metal particles include, for example, a wet reduction method, a vapor phase method, and a plasma method. As a preferred method for producing metal particles, there is a wet reduction method capable of producing metal particles having an average particle size of 200 nm or less with a narrow particle size distribution. A method for producing metal particles by a wet reduction method includes, for example, a step of mixing a metal salt and a reducing agent described in JP-A-2017-37761, WO-2014-57633, etc. to obtain a complexation reaction solution; heating the complexing reaction solution to reduce the metal ions in the complexing reaction solution to obtain a slurry of metal nanoparticles.

In the production of the metal particle ink, heat treatment may be performed in order to adjust the content of each component contained in the metal particle ink within a predetermined range. The heat treatment may be performed under reduced pressure or under normal pressure. Moreover, when performing under a normal pressure, you may carry out in air|atmosphere, and you may carry out in inert gas atmosphere.

<<Metal Complex Ink>>
A metal complex ink is, for example, an ink composition in which a metal complex is dissolved in a solvent.

-Metal complex-
Examples of metals constituting metal complexes include silver, copper, gold, aluminum, magnesium, tungsten, molybdenum, zinc, nickel, iron, platinum, tin, copper, and lead. Among them, from the viewpoint of conductivity, the metal constituting the metal complex preferably contains at least one selected from the group consisting of silver, gold, platinum, nickel, palladium and copper, and more preferably contains silver. .

The content of the metal contained in the metal complex ink is preferably 1% by mass to 40% by mass, more preferably 5% by mass to 30% by mass, in terms of metal element, with respect to the total amount of the metal complex ink. Preferably, it is more preferably 7% by mass to 20% by mass.

A metal complex is obtained, for example, by reacting a metal salt with a complexing agent. A method for producing a metal complex includes, for example, a method in which a metal salt and a complexing agent are added to a solvent and the mixture is stirred for a predetermined period of time. The stirring method is not particularly limited, and can be appropriately selected from known methods such as a method of stirring using a stirrer, a stirring blade or a mixer, and a method of applying ultrasonic waves.

Metal salts include metal oxides, thiocyanates, sulfides, chlorides, cyanides, cyanates, carbonates, acetates, nitrates, nitrites, sulfates, phosphates, perchlorates, Tetrafluoroborates, acetylacetonate complexes, and carboxylates.

From the viewpoint of conductivity and storage stability, the metal salt is preferably a carboxylate. The carboxylic acid forming the carboxylic acid salt is preferably at least one selected from the group consisting of carboxylic acids having 1 to 20 carbon atoms, more preferably carboxylic acids having 1 to 16 carbon atoms, and carbon Fatty acids with numbers 2 to 12 are more preferred. The fatty acid may be linear or branched, and may have a substituent.

Examples of linear fatty acids include formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, caprylic acid, pelargonic acid, capric acid, undecanoic acid, lauric acid, myristic acid, palmitic acid, stearic acid, palmitoleic acid, Oleic acid, linoleic acid, and linolenic acid.

Examples of branched fatty acids include isobutyric acid, isovaleric acid, 2-ethylhexanoic acid, neodecanoic acid, pivalic acid, 2-methylpentanoic acid, 3-methylpentanoic acid, 4-methylpentanoic acid, and 2,2-dimethylbutane. acids, 2,3-dimethylbutanoic acid, 3,3-dimethylbutanoic acid, and 2-ethylbutanoic acid.

Examples of substituted carboxylic acids include hexafluoroacetylacetone acid, glycolic acid, lactic acid, 3-hydroxybutyric acid, 2-methyl-3-hydroxybutyric acid, 3-methoxybutyric acid, and acetoacetic acid.

Polyfunctional carboxylic acids include oxalic acid, succinic acid, glutaric acid, malonic acid, acetonedicarboxylic acid, 3-hydroxyglutaric acid, 2-methyl-3-hydroxyglutaric acid, and 2,2,4,4-hydroxyglutaric acid. , and citric acid.

Among them, the metal salt is preferably an alkyl carboxylate having 2 to 12 carbon atoms, an oxalate, or an acetoacetate, and more preferably an alkyl carboxylic acid having 2 to 12 carbon atoms.

Complexing agents include amines, ammonium carbamate compounds, ammonium carbonate compounds, and ammonium bicarbonate compounds. Above all, from the viewpoint of conductivity and stability of the metal complex, the complexing agent preferably contains at least one selected from the group consisting of amines, ammonium carbamate compounds, and ammonium carbonate compounds.

The metal complex has a structure derived from a complexing agent, and is a metal complex having a structure derived from at least one selected from the group consisting of amines, ammonium carbamate compounds, and ammonium carbonate compounds. is preferred.

Amines that are complexing agents include, for example, ammonia, primary amines, secondary amines, tertiary amines, and polyamines.

Examples of primary amines having linear alkyl groups include methylamine, ethylamine, n-propylamine, n-butylamine, n-pentylamine, n-hexylamine, n-heptylamine and n-octylamine. , n-nonylamine, n-decylamine, undecylamine, n-dodecylamine, n-tridecylamine, n-tetradecylamine, n-pentadecylamine, n-hexadecylamine, n-heptadecylamine, and n - Octadecylamine.

Examples of primary amines having branched alkyl groups include isopropylamine, sec-butylamine, tert-butylamine, isopentylamine, 2-ethylhexylamine, and tert-octylamine.

Examples of primary amines having an alicyclic structure include cyclopentylamine, cyclohexylamine, and dicyclohexylamine.

Examples of primary amines having a hydroxyalkyl group include ethanolamine, diethanolamine, triethanolamine, N-methylethanolamine, propanolamine, isopropanolamine, dipropanolamine, diisopropanolamine, tripropanolamine, and triisopropanol. Amines are mentioned.

Examples of primary amines having an aromatic ring include benzylamine, N,N-dimethylbenzylamine, phenylamine, diphenylamine, triphenylamine, aniline, N,N-dimethylaniline, N,N-dimethyl-p- Toluidine, 4-aminopyridine, and 4-dimethylaminopyridine.

Examples of secondary amines include dimethylamine, diethylamine, dipropylamine, dibutylamine, diphenylamine, dicyclopentylamine, methylbutylamine, diethanolamine, N-methylethanolamine, dipropanolamine, and diisopropanolamine.

Tertiary amines include, for example, trimethylamine, triethylamine, tripropylamine, triethanolamine, tripropanolamine and triisopropanolamine, triphenylamine, N,N-dimethylaniline, N,N-dimethyl-p-toluidine , and 4-dimethylaminopyridine.

Examples of polyamines include ethylenediamine, 1,2-diaminopropane, 1,3-diaminopropane, diethylenetriamine, triethylenetetramine, tetramethylenepentamine, hexamethylenediamine, tetraethylenepentamine, and combinations thereof.

The amine is preferably an alkylamine, preferably an alkylamine having 2 to 12 carbon atoms, more preferably a primary alkylamine having 2 to 8 carbon atoms.

The number of amines constituting the metal complex may be one, or two or more.

When the metal salt and the amine are reacted, the molar ratio of the amine to the metal salt is preferably 1 to 15 times, more preferably 1.5 to 6 times. When the above ratio is within the above range, the complex formation reaction is completed and a transparent solution is obtained.

Ammonium carbamate compounds as complexing agents include ammonium carbamate, methylammonium methylcarbamate, ethylammonium ethylcarbamate, 1-propylammonium 1-propylcarbamate, isopropylammonium isopropylcarbamate, butylammonium butylcarbamate, isobutylammonium isobutylcarbamate, amyl ammonium amyl carbamate, hexylammonium hexyl carbamate, heptylammonium heptyl carbamate, octylammonium octyl carbamate, 2-ethylhexylammonium 2-ethylhexyl carbamate, nonyl ammonium nonyl carbamate, and decyl ammonium decyl carbamate.

Ammonium carbonate-based compounds as complexing agents include ammonium carbonate, methylammonium carbonate, ethylammonium carbonate, 1-propylammonium carbonate, isopropylammonium carbonate, butylammonium carbonate, isobutylammonium carbonate, amylammonium carbonate, hexylammonium carbonate, and heptyl. Ammonium carbonate, octylammonium carbonate, 2-ethylhexylammonium carbonate, nonyl ammonium carbonate, and decylammonium carbonate.

Ammonium bicarbonate-based compounds as complexing agents include ammonium bicarbonate, methylammonium bicarbonate, ethylammonium bicarbonate, 1-propylammonium bicarbonate, isopropylammonium bicarbonate, butylammonium bicarbonate, isobutylammonium bicarbonate, amyl Ammonium bicarbonate, hexylammonium bicarbonate, heptyl ammonium bicarbonate, octylammonium bicarbonate, 2-ethylhexylammonium bicarbonate, nonyl ammonium bicarbonate, and decylammonium bicarbonate.

When reacting a metal salt with an ammonium carbamate-based compound, an ammonium carbonate-based compound, or an ammonium bicarbonate-based compound, the amount of the ammonium carbamate-based compound, the ammonium carbonate-based compound, or the ammonium bicarbonate-based compound relative to the molar amount of the metal salt. The molar ratio is preferably 0.01 to 1, more preferably 0.05 to 0.6.

The content of the metal complex in the metal complex ink is preferably 10% by mass to 90% by mass, more preferably 10% by mass to 40% by mass, relative to the total amount of the metal complex ink. When the content of the metal complex is 10% by mass or more, the surface resistivity is further lowered. When the content of the metal complex is 90% by mass or less, the jettability is improved when the metal particle ink is applied by an inkjet recording method.

-solvent-
The metal complex ink preferably contains a solvent. The solvent is not particularly limited as long as it can dissolve the components contained in the metal complex ink such as the metal complex. From the viewpoint of ease of production, the solvent preferably has a boiling point of 30°C to 300°C, more preferably 50°C to 200°C, and more preferably 50°C to 150°C.

The content of the solvent in the metal complex ink is such that the concentration of the metal ion relative to the metal complex (the amount of metal present as free ions per 1 g of the metal complex) is 0.01 mmol/g to 3.6 mmol/g. is preferred, and 0.05 mmol/g to 2 mmol/g is more preferred. When the metal ion concentration is within the above range, the metal complex ink has excellent fluidity and conductivity.

Examples of solvents include hydrocarbons, cyclic hydrocarbons, aromatic hydrocarbons, carbamates, alkenes, amides, ethers, esters, alcohols, thiols, thioethers, phosphines, and water. The number of solvents contained in the metal complex ink may be one, or two or more.

The hydrocarbon is preferably a linear or branched hydrocarbon having 6 to 20 carbon atoms. Hydrocarbons include, for example, pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane, hexadecane, octadecane, nonadecane and icosane.

The cyclic hydrocarbon is preferably a cyclic hydrocarbon having 6 to 20 carbon atoms. Cyclic hydrocarbons can include, for example, cyclohexane, cycloheptane, cyclooctane, cyclononane, cyclodecane, and decalin.

Aromatic hydrocarbons include, for example, benzene, toluene, xylene, and tetralin.

The ether may be any of straight-chain ether, branched-chain ether, and cyclic ether. Ethers include, for example, diethyl ether, dipropyl ether, dibutyl ether, methyl-t-butyl ether, tetrahydrofuran, tetrahydropyran, dihydropyran, and 1,4-dioxane.

The alcohol may be any of primary alcohol, secondary alcohol, and tertiary alcohol.

Examples of alcohols include ethanol, 1-propanol, 2-propanol, 1-methoxy-2-propanol, 1-butanol, 2-butanol, 1-pentanol, 2-pentanol, 3-pentanol and 1-hexanol. , 2-hexanol, 3-hexanol, 1-octanol, 2-octanol, 3-octanol, tetrahydrofurfuryl alcohol, cyclopentanol, terpineol, decanol, isodecyl alcohol, lauryl alcohol, isolauryl alcohol, myristyl alcohol, isomyristyl alcohol, cetyl alcohol (cetanol), isocetyl alcohol, stearyl alcohol, isostearyl alcohol, oleyl alcohol, isoleyl alcohol, linolyl alcohol, isolinolyl alcohol, palmityl alcohol, isopalmityl alcohol, eicosyl alcohol, and iso Aicosyl alcohols can be mentioned.

Ketones include, for example, acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone.

Examples of esters include methyl acetate, ethyl acetate, isopropyl acetate, butyl acetate, isobutyl acetate, sec-butyl acetate, methoxybutyl acetate, ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol. monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether acetate, dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monoethyl ether acetate, Propylene glycol monobutyl ether acetate, and 3-methoxybutyl acetate.

-Reducing agent-
The metal complex ink may contain a reducing agent. When the metal complex ink contains a reducing agent, the reduction of the metal complex to the metal is promoted.

Examples of reducing agents include metal borohydride, aluminum hydride, amines, alcohols, aldehydes, organic acids, reducing sugars, sugar alcohols, sodium sulfite, hydrazine compounds, dextrin, hydroquinone, hydroxylamine, ethylene glycol, and glutathione. , and oxime compounds.

The reducing agent may be an oxime compound described in JP 2014-516463. Examples of oxime compounds include acetone oxime, cyclohexanone oxime, 2-butanone oxime, 2,3-butanedione monoxime, dimethylglyoxime, methylacetoacetate monoxime, methylpyruvate monoxime, benzaldehyde oxime, and 1-indanone. oximes, 2-adamantanone oxime, 2-methylbenzamide oxime, 3-methylbenzamide oxime, 4-methylbenzamide oxime, 3-aminobenzamide oxime, 4-aminobenzamide oxime, acetophenone oxime, benzamide oxime, and pinacolone oxime .

The number of reducing agents contained in the metal complex ink may be one, or two or more.

The content of the reducing agent in the metal complex ink is not particularly limited. more preferably 1% by mass to 5% by mass.

-resin-
The metal complex ink may contain resin. When the metal complex ink contains a resin, the adhesion of the metal complex ink to the electronic substrate is improved.

Examples of resins include polyester, polyethylene, polypropylene, polyacetal, polyolefin, polycarbonate, polyamide, fluorine resin, silicone resin, ethyl cellulose, hydroxyethyl cellulose, rosin, acrylic resin, polyvinyl chloride, polysulfone, polyvinylpyrrolidone, polyvinyl alcohol, polyvinyl-based Resins, polyacrylonitrile, polysulfides, polyamideimides, polyethers, polyarylates, polyetheretherketones, polyurethanes, epoxy resins, vinyl ester resins, phenolic resins, melamine resins, and urea resins.

The number of resins contained in the metal complex ink may be one, or two or more.

-Additive-
The metal complex ink further contains an inorganic salt, an organic salt, an inorganic oxide such as silica; Additives such as agents, surfactants, plasticizers, curing agents, thickeners, and silane coupling agents may be contained. The total content of additives in the metal complex ink is preferably 20% by mass or less with respect to the total amount of the metal complex ink.

The viscosity of the metal complex ink is not particularly limited, and may be 0.001 Pa·s to 5000 Pa·s, preferably 0.001 Pa·s to 100 Pa·s. When the metal complex ink is applied by a spray method or an inkjet recording method, the viscosity of the metal complex ink is preferably 1 mPa·s to 100 mPa·s, more preferably 2 mPa·s to 50 mPa·s. , 3 mPa·s to 30 mPa·s.

The viscosity of the metal complex ink is a value measured at 25°C using a viscometer. Viscosity is measured using, for example, a VISCOMETER TV-22 viscometer (manufactured by Toki Sangyo Co., Ltd.).

The surface tension of the metal complex ink is not particularly limited, and is preferably 20 mN/m to 45 mN/m, more preferably 25 mN/m to 35 mN/m. Surface tension is a value measured at 25°C using a surface tensiometer.

　The surface tension of the metal complex ink is measured using, for example, DY-700 (manufactured by Kyowa Interface Science Co., Ltd.).

<<metal salt ink>>
A metal salt ink is, for example, an ink composition in which a metal salt is dissolved in a solvent.

-metal salt-
Examples of metals constituting metal salts include silver, copper, gold, aluminum, magnesium, tungsten, molybdenum, zinc, nickel, iron, platinum, tin, copper, and lead. Among them, from the viewpoint of conductivity, the metal constituting the metal salt preferably contains at least one selected from the group consisting of silver, gold, platinum, nickel, palladium and copper, and more preferably contains silver. .

The content of the metal contained in the metal salt ink is preferably 1% by mass to 40% by mass, more preferably 5% by mass to 30% by mass, in terms of metal element, relative to the total amount of the metal salt ink. Preferably, it is more preferably 7% by mass to 20% by mass.

The content of the metal salt in the metal salt ink is preferably 10% by mass to 90% by mass, more preferably 10% by mass to 60% by mass, relative to the total amount of the metal salt ink. When the content of the metal salt is 10% by mass or more, the surface resistivity is further lowered. When the content of the metal salt is 90% by mass or less, the jettability is improved when the metal particle ink is applied by a spray method or an inkjet recording method.

As the metal salt, a metal salt similar to the metal salt used in the metal complex ink can be used. Among them, the metal salt is preferably a carboxylate. As the carboxylic acid forming the carboxylate, an alkyl carboxylate having 6 to 12 carbon atoms or acetoacetic acid is preferable, and an alkyl carboxylate having 6 to 12 carbon atoms is more preferable. Carboxylate may combine 2 or more types.

The metal salt may be a commercially available product or may be produced by a known method. A silver salt is manufactured by the following method, for example.

First, in an organic solvent such as ethanol, add a silver compound (for example, silver acetate) as a source of silver, and formic acid or a fatty acid having 1 to 30 carbon atoms in an amount equivalent to the molar equivalent of the silver compound. The mixture is stirred for a predetermined time using an ultrasonic stirrer, and the precipitate formed is washed with ethanol and decanted. All these steps can be performed at room temperature (25°C). The mixing ratio of the silver compound to the formic acid or the fatty acid having 1 to 30 carbon atoms is preferably 1:2 to 2:1, more preferably 1:1 in terms of molar ratio.

The metal salt ink may contain solvents, reducing agents, resins, and additives. Preferred aspects of the reducing agent, resin, and additive are the same as the solvent, reducing agent, resin, and additive that may be contained in the metal complex ink.

-solvent-
The metal salt ink preferably contains a solvent.
The type of solvent is not particularly limited as long as it can dissolve the metal salt contained in the metal salt ink.
The boiling point of the solvent is preferably 30°C to 300°C, more preferably 50°C to 300°C, and even more preferably 50°C to 250°C, from the viewpoint of ease of production.

The content of the solvent in the metal salt ink is such that the concentration of metal ions relative to the metal salt (amount of metal present as free ions per 1 g of metal salt) is 0.01 mmol/g to 3.6 mmol/g. is preferred, and 0.05 mmol/g to 2.6 mmol/g is more preferred. When the metal ion concentration is within the above range, the metal salt ink has excellent fluidity and electromagnetic wave shielding properties can be obtained.

Solvents include, for example, hydrocarbons, cyclic hydrocarbons, aromatic hydrocarbons, carbamates, alkenes, amides, ethers, esters, alcohols, thiols, thioethers, phosphines, and water.
The number of solvents contained in the metal salt ink may be one, or two or more.

The solvent preferably contains an aromatic hydrocarbon.
Examples of aromatic hydrocarbons include benzene, toluene, xylene, ethylbenzene, propylbenzene, isopropylbenzene, butylbenzene, isobutylbenzene, t-butylbenzene, trimethylbenzene, pentylbenzene, hexylbenzene, tetralin, benzyl alcohol, phenol, Cresol, methyl benzoate, ethyl benzoate, propyl benzoate, and butyl benzoate.
From the viewpoint of compatibility with other components, the number of aromatic rings in the aromatic hydrocarbon is preferably one or two, more preferably one.
The boiling point of the aromatic hydrocarbon is preferably 50°C to 300°C, more preferably 60°C to 250°C, even more preferably 80°C to 200°C, from the viewpoint of ease of production.

The solvent may contain aromatic hydrocarbons and hydrocarbons other than aromatic hydrocarbons.
Hydrocarbons other than aromatic hydrocarbons include linear hydrocarbons having 6 to 20 carbon atoms, branched hydrocarbons having 6 to 20 carbon atoms, and alicyclic hydrocarbons having 6 to 20 carbon atoms.
Examples of hydrocarbons other than aromatic hydrocarbons include pentane, hexane, heptane, octane, nonane, decane, undecane, dodecane, tridecane, tetradecane, pentadecane, hexadecane, octadecane, nonadecane, decalin, cyclohexane, cycloheptane, and cyclooctane. , cyclononane, cyclodecane, decene, terpene compounds and icosane.
Hydrocarbons other than aromatic hydrocarbons preferably contain unsaturated bonds.
Hydrocarbons other than aromatic hydrocarbons containing unsaturated bonds include terpene compounds.
Terpene compounds are classified into, for example, hemiterpenes, monoterpenes, sesquiterpenes, diterpenes, sesterterpenes, triterpenes, sesqualterpenes, and tetraterpenes, depending on the number of isoprene units that constitute the terpene compounds.
The terpene compound as the solvent may be any of the above, but monoterpene is preferred.
Examples of monoterpenes include pinene (α-pinene, β-pinene), terpineol (α-terpineol, β-terpineol, γ-terpineol), myrcene, camphene, limonene (d-limonene, l-limonene, dipentene), Ocimene (α-Ocimene, β-Ocimene), Alloocimene, Phellandrene (α-Phellandrene, β-Phellandrene), Terpinene (α-Terpinene, γ-Terpinene), Terpinolene (α-Terpinolene, β-Terpinolene, γ- terpinolene, δ-terpinolene), 1,8-cineole, 1,4-cineol, sabinene, paramentadiene, carene (δ-3-carene).
The monoterpene is preferably a cyclic monoterpene, more preferably pinene, terpineol, or carene.

The viscosity of the metal salt ink is not particularly limited, and may be 0.001 Pa·s to 5000 Pa·s, preferably 0.001 Pa·s to 100 Pa·s. When the metal salt ink is applied by a spray method or an inkjet recording method, the viscosity of the metal salt ink is preferably 1 mPa·s to 100 mPa·s, more preferably 2 mPa·s to 50 mPa·s. , 3 mPa·s to 30 mPa·s.

The viscosity of the metal salt ink is a value measured at 25°C using a viscometer. Viscosity is measured using, for example, a VISCOMETER TV-22 viscometer (manufactured by Toki Sangyo Co., Ltd.).

The surface tension of the metal salt ink is not particularly limited, and is preferably 20 mN/m to 45 mN/m, more preferably 25 mN/m to 35 mN/m. Surface tension is a value measured at 25°C using a surface tensiometer.

　The surface tension of the metal salt ink is measured using, for example, DY-700 (manufactured by Kyowa Interface Science Co., Ltd.).

(Formation of conductive layer)
After applying the conductive layer forming ink onto the insulating layer, it is preferable to cure the conductive layer forming ink using heat or light.

When curing with heat, the baking temperature is preferably 250° C. or less and the baking time is preferably 1 to 120 minutes. When the firing temperature and firing time are within the above ranges, damage to the electronic substrate is suppressed.

The firing temperature is more preferably 80°C to 250°C, more preferably 100°C to 200°C. Further, the firing time is more preferably 1 minute to 60 minutes.

The firing method is not particularly limited, and can be carried out by a commonly known method.

The time from the end of application of the ink for forming the conductive layer to the start of firing is preferably 60 seconds or less. Although the lower limit of the time is not particularly limited, it is, for example, 20 seconds. Conductivity improves that the said time is 60 seconds or less.

It should be noted that "the time at which the application of the conductive ink is completed" refers to the time at which all the ink droplets of the conductive layer forming ink have landed on the insulating layer.

When curing with light, examples of light include ultraviolet rays and infrared rays.

The exposure amount in light irradiation is preferably 100 mJ/cm ² to 10000 mJ/cm ² , more preferably 500 mJ/cm ² to 7500 mJ/cm ² .

Hereinafter, the present disclosure will be described more specifically with reference to examples, but the present disclosure is not limited to the following examples as long as it does not exceed the gist thereof.

First, an insulating layer forming ink and a conductive layer forming ink were prepared.

<Preparation of insulating layer forming ink 1>
2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)-butan-1-one (product name "Omnirad 379", IGM Resins B.V.) was added to a 300 mL resin beaker. company) 4.0 g, 2-isopropylthioxanthone (product name "SPEEDCURE ITX", LAMBSON) 2.0 g, phenoxyethyl acrylate (manufactured by FUJIFILM Wako Pure Chemical Industries, Ltd.) 34.0 g, N-vinylcaprolactam 22. 0 g, 30.0 g of 1,6-hexanediol diacrylate, and 8.0 g of trimethylolpropane triacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) were added, and a mixer (product name "L4R", manufactured by Silverson) was used. and stirred at 25° C. and 5000 rpm for 20 minutes to obtain an insulating layer forming ink.

<Preparation of insulating layer forming ink 2>
In a 300 mL resin beaker, 3-ethyl-3 {[(3-ethyloxetan-3-yl) methoxy] methyl} oxetane (product name "OXT-221", manufactured by Toagosei Co., Ltd.) 50.0 g, 3', 4′-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate (product name “Celoxide 2021P”, manufactured by Daicel) 15.0 g, limonene dioxide (product name “Celoxide 3000”, manufactured by Daicel) 28.0 g, 7.0 g of a triarylsulfonium hexafluorophosphate mixture (manufactured by Sigma-Aldrich) was added, and a mixer (product name "L4R", manufactured by Silverson) was used at 25° C. and 5000 rpm for 20 minutes. After stirring for 1 minute, Ink 2 for forming an insulating layer was obtained.

<Preparation of conductive layer forming ink 1>
6.08 g of isobutylammonium carbonate and 15.0 g of isopropyl alcohol were added and dissolved in a 50 mL three-necked flask. Next, 2.0 g of silver oxide was added and reacted at room temperature for 2 hours to obtain a uniform solution. Furthermore, 0.3 g of 2-hydroxy-2-methylpropylamine was added and stirred to obtain a solution containing a silver complex. This solution was filtered using a PTFE (polytetrafluoroethylene) membrane filter with a pore size of 0.45 μm to obtain Ink 1 for forming a conductive layer.

<Preparation of conductive layer forming ink 2>
40 g of silver neodecanoate was added to a 200 mL three-necked flask. 30.0 g of trimethylbenzene and 30.0 g of terpineol were added thereto and stirred to obtain a solution containing a silver salt. The resulting solution was filtered using a PTFE (polytetrafluoroethylene) membrane filter with a pore size of 0.45 μm to obtain Ink 2 for forming a conductive layer.

<Preparation of electronic board>
(Electronic board A)
The shield can and frame of the Quectel LTE module were removed. After removing the solder of the metal wiring on the substrate where the shield can and the frame were joined, the flux was removed using a printed circuit board flux cleaning agent (product name “goot BS-W20B”) to obtain a substrate A. A plurality of electronic components and a discontinuous frame-shaped ground electrode are formed on the electronic substrate A so as to surround the plurality of electronic components.
In the electronic substrate A, the width of the ground electrode was 0.5 mm, and the area surrounded by the ground electrode was 25.5 mm×21.5 mm.
The height of the ground electrode was 100 μm with respect to the surface of the wiring board on which the electronic components were arranged.

(Electronic board B)
The insulating layer forming ink was filled in an ink cartridge (for 10 picoliters) for an inkjet recording apparatus (product name “DMP-2850”, manufactured by FUJIFILM DIMATIX). Image recording conditions were a resolution of 1270 dpi (dots per inch) and a droplet ejection volume of 10 picoliters per dot. On the ground electrode of the electronic substrate A, an electronic substrate B was obtained by repeating the cycle of applying the ink for forming an insulating layer to an outer region having a width of 200 μm and irradiating with ultraviolet rays twice.
The ultraviolet irradiation was performed using an ultraviolet irradiation device (product name “UV spot cure OmniCure S2000”, manufactured by Lumen Dynamics) installed next to the inkjet head.
In the electronic substrate B, the width of the ground electrode not covered with the insulating layer was 300 μm.

(Electronic board C)
An electronic substrate C was prepared in the same manner as the electronic substrate B, except that the ink for forming an insulating layer was applied to the outer region of 300 μm in width on the ground electrode.
In the electronic substrate C, the width of the ground electrode not covered with the insulating layer was 200 μm.

[Examples 1 to 10, Comparative Examples 1 and 3]
-Formation of insulating layer-
The insulating layer forming ink 1 was filled in an ink cartridge (for 10 picoliters) of an inkjet recording apparatus (product name “DMP-2850”, manufactured by FUJIFILM DIMATIX). Image recording conditions were a resolution of 1270 dpi (dots per inch) and a droplet ejection volume of 10 picoliters per dot.
Image data of the same area (25.5 mm×21.5 mm) as the ground area surrounded by the ground electrodes on the electronic substrate was prepared. Using this image data, the cycle of applying the ink for forming the insulating layer and irradiating with ultraviolet rays was repeated until the thickness of the insulating layer reached the value shown in Table 1.
The ultraviolet irradiation was performed using an ultraviolet irradiation device (product name “UV spot cure OmniCure S2000”, manufactured by Lumen Dynamics) installed next to the inkjet head. The illuminance of the ultraviolet rays was set to 8 W/cm ² , and the irradiation amount was set to 0.8 J/cm ² per time by irradiating for 0.1 second per time. In addition, the time from the application of the insulating layer forming ink to the start of irradiation with ultraviolet rays was set to 0.3 seconds.

-Formation of conductive layer-
The conductive layer forming ink 1 was filled in an ink cartridge (for 10 picoliters) of an inkjet recording apparatus (product name “DMP-2850”, manufactured by FUJIFILM DIMATIX). Image recording conditions were a resolution of 1270 dpi (dots per inch) and a droplet ejection volume of 10 picoliters per dot. The electronic substrate on which the insulating layer was formed was preliminarily heated to 60°C.
Image data of a region (26.5 mm×22.5 mm) covering the ground electrode and the insulating layer on the electronic substrate was prepared. A cycle of applying the conductive layer forming ink using this image data and heating at 180° C. for 60 minutes using an oven was repeated until T1 reached the values shown in Tables 1 and 2.
Further, image data of a region (a frame with an outer size of 26.5 mm×22.5 mm and a width of 0.5 mm) covering the ground electrode on the electronic substrate was prepared. The cycle of applying the conductive layer forming ink using this image data and heating at 180 ° C. for 60 minutes using an oven is repeated until T2 reaches the values shown in Tables 1 and 2, and the electronic device got

[Example 11]
Image data of an area (25.4 mm×21.4 mm) smaller than the ground area surrounded by the ground electrode on the electronic substrate was prepared so that a gap of 50 μm was formed between the ground electrode and the insulating layer. Using this image data, an electronic device was obtained in the same manner as in Example 4, except that the insulating layer forming ink was applied.

[Example 12]
An electronic device was obtained in the same manner as in Example 4, except that the following points were changed.
An electronic substrate B was used instead of the electronic substrate A.
Image data of a region (26.1 mm×22.1 mm) covering the ground electrode and the insulating layer on the electronic substrate was prepared. A cycle of applying the conductive layer forming ink using this image data and heating at 180° C. for 60 minutes using an oven was repeated until T1 reached the value shown in Table 2.
In addition, image data of a region (a frame having an outer dimension of 26.1 mm×22.1 mm and a width of 300 μm) covering the ground electrode on the electronic substrate was prepared. A cycle of applying the conductive layer forming ink using this image data and heating at 180° C. for 60 minutes using an oven was repeated until T2 reached the value shown in Table 2, thereby obtaining an electronic device. .

[Example 13]
An electronic device was obtained in the same manner as in Example 4, except that the following points were changed.
An electronic substrate C was used instead of the electronic substrate A.
Image data of a region (25.9 cm×21.9 cm) covering the ground electrode and the insulating layer on the electronic substrate was prepared. A cycle of applying the conductive layer forming ink using this image data and heating at 180° C. for 60 minutes using an oven was repeated until T1 reached the value shown in Table 2.
In addition, image data of a region (25.9 cm×21.9 mm, 200 μm wide frame) covering the ground electrode on the electronic substrate was prepared. A cycle of applying the conductive layer forming ink using this image data and heating at 180° C. for 60 minutes using an oven was repeated until T2 reached the value shown in Table 2, thereby obtaining an electronic device. .

[Example 14]
An electronic device was obtained in the same manner as in Example 6, except that the insulating layer forming ink 2 was used instead of the insulating layer forming ink 1 in forming the insulating layer.

[Example 15]
An electronic device was obtained in the same manner as in Example 6 except that the conductive layer forming ink 2 was used instead of the conductive layer forming ink 1 in forming the conductive layer.

[Comparative Example 2]
An electronic device was obtained in the same manner as in Example 1, except that the following points were changed.
Image data of a region (26.5 mm×22.5 mm) covering the ground electrode and the insulating layer on the electronic substrate was prepared. A cycle of applying the conductive layer forming ink using this image data and heating at 180° C. for 60 minutes using an oven was repeated until T2 reached the value shown in Table 2.
Also, image data of the same area (25.5 mm×21.5 mm) as the area surrounded by the ground electrode on the electronic substrate was prepared. A cycle of applying the conductive layer forming ink using this image data and heating at 180° C. for 60 minutes using an oven was repeated until T1 reached the value shown in Table 2, thereby obtaining an electronic device. .

Using the fabricated electronic device, the durability and electromagnetic wave shielding properties after the heat resistance test were evaluated.

<Durability>
Using the obtained electronic substrate, a cycle test between -30° C. and 90° C. was performed for 200 cycles. After the cycle test, changes in appearance of the conductive layer and the insulating layer were observed. Durability was evaluated based on appearance change. Evaluation criteria are as follows.
5: No change in appearance.
4: Deformation could not be confirmed visually, but was confirmed by microscopic observation.
3: No cracking or peeling, but deformation was visually observed.
2: Slight cracking and peeling were observed.
1: Significant cracking and peeling were observed.

<Electromagnetic shielding>
Using the obtained electronic substrate, a cycle test between -30° C. and 90° C. was performed for 200 cycles. After the cycle test, the obtained electronic substrate was allowed to communicate with the LTE BAND 13, and near magnetic field measurement was performed at a frequency of 777 MHz using a near magnetic field measuring device (product name: "SmartScan550", manufactured by API). The noise suppression level (unit: dB) was measured, and the electromagnetic wave shielding properties were evaluated based on the noise suppression level. Evaluation criteria are as follows.
A: The noise suppression level is -40 dB or less.
B: The noise suppression level is more than -40 dB and less than or equal to -30 dB.
C: The noise suppression level is -30, more than B and -20 dB or less.
D: The noise suppression level is greater than -20 dB.
E: The electromagnetic wave shielding property could not be evaluated because cracking and peeling were remarkable after the cycle test.

As shown in Tables 1 and 2, in Examples 1 to 15, the thickness of the wiring board, the electronic components arranged on the wiring board, the ground electrode, and the electronic components was 200 μm. The above insulating layer and a conductive layer that is provided on at least a part of the insulating layer and the ground electrode and is a cured film of the conductive layer forming ink, and T2 is thicker than T1, It was found to be excellent in durability.

On the other hand, in Comparative Example 1, T1 and T2 have the same thickness, and in Comparative Example 2, T1 is thicker than T2, so it was found that the electromagnetic wave shielding property was inferior.

In Comparative Example 3, since the thickness of the insulating layer was less than 200 μm, a short circuit occurred between the conductive layer and the components on the electronic substrate, and the electronic device did not function properly.

In Example 4, since T2 is at least twice as large as T1, it was found to be superior to Example 2 in electromagnetic shielding properties.

In Example 8, since T1 is less than 10 μm, compared to Example 9, it was found to be superior in durability and electromagnetic wave shielding properties.

The disclosure of Japanese Patent Application No. 2021-143243 filed on September 2, 2021 is incorporated herein by reference in its entirety. In addition, all publications, patent applications and technical standards mentioned herein are to the same extent as if each individual publication, patent application and technical standard were specifically and individually noted to be incorporated by reference. , incorporated herein by reference.

Claims

a wiring board;
an electronic component arranged on the wiring board;
a ground electrode;
an insulating layer provided on the electronic component;
A conductive layer provided on the insulating layer and on at least a part of the ground electrode and being a cured film of a conductive layer forming ink,
The insulating layer has a thickness of 200 μm or more,
The thickness of the conductive layer provided on the insulating layer provided on the surface of the electronic component that is positioned highest with respect to the surface of the wiring board on which the electronic component is arranged, among the surfaces of the electronic component is T1, and the thickness of the conductive layer provided on the ground electrode is T2, T2 is thicker than T1.
The electronic device according to claim 1, wherein the insulating layer contains acrylic resin or epoxy resin.
The electronic device according to claim 1 or claim 2, wherein the T2 is twice or more the T1.
The electronic device according to any one of claims 1 to 3, wherein the conductive layer forming ink contains a metal complex or a metal salt.
The electronic device according to any one of claims 1 to 4, wherein the ground electrode has a height of 150 µm or less with respect to the surface of the wiring board on which the electronic component is arranged.
The electronic device according to any one of claims 1 to 5, wherein said T1 is less than 10 µm.
preparing an electronic substrate comprising a wiring substrate, electronic components arranged on the wiring substrate, and a ground electrode;
forming an insulating layer having a thickness of 200 μm or more on the electronic component;
applying a conductive layer forming ink to at least part of the insulating layer and the ground electrode to form a conductive layer that is a cured film of the conductive layer forming ink;
The thickness of the conductive layer provided on the insulating layer provided on the surface of the electronic component that is the highest with respect to the surface of the wiring board on which the electronic component is arranged. is T1, and the thickness of the conductive layer provided on the ground electrode is T2, T2 is thicker than T1.