WO2023030764A1 - Procédé d'assemblage de composants pour former un ensemble de dispositifs de terrain d'automatisation de processus - Google Patents

Procédé d'assemblage de composants pour former un ensemble de dispositifs de terrain d'automatisation de processus Download PDF

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Publication number
WO2023030764A1
WO2023030764A1 PCT/EP2022/070953 EP2022070953W WO2023030764A1 WO 2023030764 A1 WO2023030764 A1 WO 2023030764A1 EP 2022070953 W EP2022070953 W EP 2022070953W WO 2023030764 A1 WO2023030764 A1 WO 2023030764A1
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WO
WIPO (PCT)
Prior art keywords
component
joining
coating
membrane
pressure
Prior art date
Application number
PCT/EP2022/070953
Other languages
German (de)
English (en)
Inventor
Dietmar Leuthner
Sergey Lopatin
Igor Getman
Original Assignee
Endress+Hauser SE+Co. KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Endress+Hauser SE+Co. KG filed Critical Endress+Hauser SE+Co. KG
Publication of WO2023030764A1 publication Critical patent/WO2023030764A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/002—Soldering by means of induction heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/008—Soldering within a furnace
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/06—Means for preventing overload or deleterious influence of the measured medium on the measuring device or vice versa
    • G01L19/0627—Protection against aggressive medium in general
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0044—Constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0076—Transmitting or indicating the displacement of flexible diaphragms using photoelectric means
    • G01L9/0077—Transmitting or indicating the displacement of flexible diaphragms using photoelectric means for measuring reflected light

Definitions

  • the invention relates to a method for joining a first component to a second component to form an assembly of a field device in automation technology and an assembly of a field device in automation technology.
  • Field devices are often used in process automation, which are used to record and/or influence process variables.
  • Sensors are used to measure and/or monitor process variables, which can be integrated, for example, in level measuring devices, flow meters, pressure measuring devices, temperature measuring devices, analytical measuring devices, such as pH measuring devices, conductivity measuring devices and others, which can be integrated with the corresponding process variables such as level, flow rate, pressure, temperature, analytical measured variables such as conductivity and pH value or other process variables.
  • Actuators e.g. valves or pumps, are used to influence process variables, via which, for example, the flow of a medium, e.g. a fluid, in a pipeline or a fill level or a composition of a medium in a container can be changed. All devices that are used close to the process and that provide or process process-relevant information are referred to as field devices.
  • a diaphragm seal can have a diaphragm seal body with a flange and a thin metallic isolating diaphragm bonded to the diaphragm seal body and flange, respectively, which is in contact with the process.
  • the process pressure of a medium is transferred via an inert liquid to a measuring cell for determining a measured pressure value. If the diaphragm seal is used to measure the pressure in an aggressive medium, at least the separating diaphragm must be made of a corrosion-resistant material.
  • Such corrosion-resistant materials are, for example, high-alloy quality steels such as chromium-nickel steels such as 316L, nickel-based alloys such as Alloy C, or multi-phase alloys such as duplex steel.
  • high-alloy quality steels such as chromium-nickel steels such as 316L, nickel-based alloys such as Alloy C, or multi-phase alloys such as duplex steel.
  • the diaphragm seal body or the flange is often made of a different material, e.g. for reasons of cost or because the other material is easier to handle for the purpose of manufacturing the diaphragm seal body.
  • the process diaphragm is conventionally joined by hard soldering or by means of an active hard solder.
  • Typical temperatures occurring during brazing are above the melting point of the solder, for example at temperatures above 800°C.
  • the use of a brazing process to connect the components can be problematic due to the high temperatures that occur, because at these temperatures massive stresses can form at the joint during the joining process for components made of materials with different thermal expansion coefficients. It can even happen that the components deform plastically.
  • a critical threshold which is e.g. 280 °C for duplex steel, a change in the microscopic structure can occur, resulting in a change in the material properties, e.g. corrosion resistance or mechanical properties.
  • the invention is based on the object of specifying a manufacturing method for a corrosion-resistant assembly of a field device for process automation, which allows a tight and durable joint between two components of the assembly, and at the same time the corrosion resistance and mechanical properties of the components not or at least only in for use of the assembly in a negligible way.
  • the invention also includes an assembly of a field device for process automation, produced in particular by the method according to the invention.
  • Advantageous configurations are specified in the dependent claims.
  • Diffusion soldering is a technology that has so far been used in the field of chip-substrate connection in electronics manufacturing.
  • a layer of solder e.g. made of tin or SnCu solder, is used in the joining zones of the components to be joined.
  • interdiffusion processes occur between the solder layer and the components to be joined in the joining area, which lead to the formation of a liquid phase, possibly with a widening of the soldering gap, and subsequent isothermal solidification with the formation of an alloy or intermetallic compound in the joining area, which creates a material connection , pressure-tight connection between the components causes.
  • the diffusion soldering process which is suitable for the small dimensions of a chip-substrate connection, is also suitable for connecting two components to produce an assembly of a field device for process automation technology, with a layer comprising at least one silver layer being used in the joining area , in order to create the desired pressure-tight connection in the joining area.
  • connection of the first component to the second component by diffusion soldering can further include the following steps:
  • the temperature of the first and the second component does not rise above 700° C., preferably not above 500° C., during the heating of the first and second component, at least in the joining area.
  • a lower temperature limit of the temperature profile can be 250 to 280°C.
  • the temperature profile can be a heating of the joint to a substantially constant joint temperature in the range between 250 ° C and 700° C., preferably between 250° C. and 500° C. over a period of several hours, for example between 5 and 15 hours, in particular between 10 and 15 hours.
  • the lower the selected joining temperature the longer the time interval during which the joining temperature is kept at a constant value.
  • the joining area is heated to a temperature between 250 and 300 °C and the temperature kept constant over a period of 10 to 15 hours. Exercising pressure on the joining area by clamping the first and second components against one another helps to achieve a joint with few defects even at such relatively low joining temperatures, resulting in the desired pressure tightness and stability.
  • the process may further include the following steps:
  • first coating to the first component
  • second coating to the second component
  • the first and/or the second coating being applied by means of chemical or electrochemical deposition, by means of gas phase deposition, e.g. sputtering, by means of a thermal spraying process or by means of a powder coating process.
  • the first and the second coating can be designed in such a way that the at least one silver layer forms the uppermost, final layer of the coating.
  • the two silver layers are connected to one another by interdiffusion.
  • the first and/or the second coating can have at least one adhesion promoter layer which is arranged between the silver layer and the surface of the first or the second component serving as the base for the coating.
  • the adhesion promoter layer can include a gold layer which, in an advantageous embodiment, lies directly below the silver layer.
  • Such an adhesion promoter layer is advantageous, for example, when the silver layer is applied by a galvanic process. If the silver layer is applied by sputtering, there is no need for an adhesion promoter layer.
  • the surface of the first or second component can be prepared, e.g. by removing a first and the second component present oxide layer. This can be done, for example, chemically or by sputtering or laser ablation.
  • the clamping of the first and the second component against each other can include the following steps: - Arranging an auxiliary body made of a material whose coefficient of thermal expansion, in particular more than 20%, is greater than the coefficient of thermal expansion of a material from which the first component is formed and/or a material from which the second component is formed on one of the side of the first component facing away from the first joining zone of the first component, and
  • the auxiliary body can be made of aluminum or an aluminum alloy, for example. This is advantageous if the first and/or the second component is made of a corrosion-resistant material such as tantalum, a nickel-based alloy such as Hastelloy, a carbon steel, an austenitic steel or a duplex steel.
  • a corrosion-resistant material such as tantalum, a nickel-based alloy such as Hastelloy, a carbon steel, an austenitic steel or a duplex steel.
  • the thermal expansion of the auxiliary body causes a significant increase in pressure in the joining area between the first and second component clamped together with the auxiliary body during the joining process.
  • a pressure-tight, materially bonded connection is created in the joint area.
  • the pressure exerted on the joint in the joint area by the clamping device and the auxiliary body at a working temperature between 250° C. and 500° C. can be between 10 MPa and 50 MPa during diffusion soldering.
  • the first coating and/or the second coating can have a layer which is arranged over the silver layer and comprises a multiplicity of silver particles.
  • This layer can be a porous silver layer or a layer formed from a silver paste.
  • the additional layer can be used to compensate for unevenness in the two adjacent joining zones in order to obtain a pressure-tight, materially bonded connection in the joining area.
  • the first coating and/or the second coating can have a tin layer arranged over the silver layer.
  • the joining temperature during diffusion soldering can be further reduced, e.g. to 150 to 300 °C.
  • This variant of the process is particularly suitable for joining materials with very different coefficients of thermal expansion.
  • the tin layer can be formed by a tin foil arranged on the silver layer.
  • the first component and/or the second component can be formed from one of the following materials: a chromium-nickel steel, in particular 316L, a nickel-based alloy, e.g AlloyC, a multi-phase alloy, eg duplex steel, tantalum, a brass alloy, a bronze alloy or a ceramic, eg A ⁇ Os ceramic.
  • the components can be, for example, components of a sensor that comes into contact with the medium, or components of a sensor housing or a transmitter housing of a field device for process automation.
  • the field device for process automation is a pressure gauge
  • the first component can be a membrane, e.g. a measuring membrane or a separating membrane
  • the second component can be a base body carrying the membrane, e.g. a sensor body or a diaphragm seal body or a flange.
  • the invention also includes an assembly of a field device for process automation produced by the method described above.
  • An assembly of a field device for process automation according to the invention comprises a first component made of a first material and a second component made of a second material connected in a pressure-tight manner to the first component, with a second component being formed between the first and the second component Joining area silver, a silver alloy or an intermetallic compound of silver and other components, in particular tin, is formed.
  • the first and second materials can be the same or different materials. In particular, the materials mentioned above in connection with the description of the method come into consideration. If the material of the first or second component is duplex steel, it has an intact microscopic structure that shows unchanged stability and corrosion resistance.
  • the invention also includes a pressure gauge with the assembly described above. As mentioned, this assembly can be manufactured according to the method described above.
  • the first component of the assembly can be a membrane, in particular a measuring membrane and/or a separating membrane, made from a first material and the second component can be a base body, in particular a sensor body or a pressure transmitter body, made from a second material.
  • the base body can have at least one depression provided for the measuring membrane in the form of a membrane bed and a first connecting region which surrounds the membrane bed on all sides and in which the membrane is accommodated, with the membrane being arranged centrally above the membrane bed and having an edge region which forms the second connection area, is joined in a pressure-tight manner to the first connection area of the base body, which is formed on all sides around the membrane bed, so that the first and the second connection area form the joining area between the first and the second component.
  • this joining area can include silver, an alloy containing silver or an intermetallic silver compound, in particular a silver-tin compound.
  • FIG. 1a shows a schematic longitudinal section illustration of two components of an assembly for a field device of process automation technology according to a first exemplary embodiment
  • FIG. 1b shows a schematic longitudinal section representation of the two components according to the first exemplary embodiment together with an auxiliary body clamped in a clamping device for diffusion soldering;
  • 1c shows a schematic longitudinal section representation of the assembly formed from the two components
  • FIG. 2 shows a schematic longitudinal section illustration of two components of an assembly, which are joined by means of diffusion soldering, according to a second exemplary embodiment
  • FIG. 3 shows a schematic longitudinal section illustration of two components of an assembly, which are joined by means of diffusion soldering, according to a third exemplary embodiment
  • FIG. 4 shows a schematic longitudinal section representation of a process connection in the form of a
  • the subassembly is a subassembly of a pressure measuring device composed of a base body and a membrane.
  • the components 1, 2 shown in the figures are rotationally symmetrical in the present examples; the sectional view shows a longitudinal sectional view along a sectional plane in which an (imaginary) axis of cylinder symmetry of the components 1, 2 runs.
  • the first component 1 is a membrane made of a corrosion-resistant material, for example duplex steel.
  • the membrane can also be made of another corrosion-resistant material or a special material that has chemical or mechanical properties that are advantageous in some other way for a specific application, such as tantalum, titanium, nickel, or a nickel-based alloy such as Hastelloy, Inconel, Alloy 400, or Monel other alloys containing nickel, carbon steel, austenitic or martensitic rusting steel, a copper alloy, such as bronze or brass, or a silver alloy, eg with a copper content.
  • the second component 2 is a base body, which consists of a different material than the first component 1 in the present example.
  • the second component can also consist of the same material as the first component 1 .
  • the base body can, for example, consist of a high-alloy quality steel, such as a chromium-nickel steel, in particular 316L. However, it can also be made of duplex steel or one of the other special materials mentioned above.
  • the base body is designed in such a way that after the membrane has been joined to the base body, a chamber is created between the membrane and the base body. For this purpose, a membrane bed can be prepared in the base body as a depression on one side of the base body.
  • the assembly can serve as a sensor assembly of a pressure sensor.
  • the membrane forms a measuring membrane of the sensor, which is intended for direct contact with a process medium.
  • a measured pressure value can be determined on the basis of the deflection of the measuring membrane.
  • the membrane can separate an oil-filled chamber formed in the base body, in which a pressure sensor element is located, from a process whose pressure is to be measured.
  • the membrane deflection can be measured capacitively or optically (interferometrically).
  • the membrane has a separating and measuring function at the same time.
  • the assembly serves as a pressure transmitter group of a pressure measuring device.
  • the membrane forms a separating membrane intended for contact with the process medium.
  • the base body is a pressure transmitter body with a through opening 3, one end of which is arranged in the depression forming the membrane bed and the other end of which is arranged on the side of the pressure transmitter body opposite the depression.
  • This through-opening 3 is used for the hydraulic connection of the chamber formed between the separating membrane and the pressure transmitter body and a pressure sensor, which is usually separate from the pressure transmitter and is used to record measured pressure values.
  • a method for joining the first component 1 to the second component 2 is described below with reference to FIGS. 1a to c.
  • the first component 1 is provided with a coating 5 in a first joining zone 4, here a circumferential annular surface area, which has at least one layer of silver.
  • the silver layer is the top layer of the coating.
  • the second component 2 is provided with a coating 7 in a second joining zone 6, which has at least one top layer made of silver.
  • the second joining zone 6 here forms a circumferential annular surface area of the second component 2.
  • the coating can formed by means of galvanic deposition, but also by deposition from the vapor phase, eg sputtering or CVD or PVD, or by another coating method.
  • the coating can have further layers, for example adhesion promoters, for example a gold layer which can be 0.05 to 1 ⁇ m thick.
  • the silver layers can have a thickness between 1 and 50 ⁇ m.
  • the coating can in each case consist exclusively of the silver layers or of the silver layers and the gold layer arranged underneath.
  • the first 1 and the second component 2 are placed against one another with their joining areas, as shown in FIG. 1b.
  • the components 1 , 2 placed against one another are clamped in a clamping device 9 together with an auxiliary body 8 made of a material which has a considerably greater coefficient of thermal expansion than the first 1 and the second component 2 .
  • Aluminum for example, can be used as the material for the auxiliary body 8 .
  • the auxiliary body is an aluminum disk with a thickness between 0.1 and 10 mm, which is used once or several times.
  • the clamped components 1 , 2 are now joined to one another by diffusion soldering, in that the components 1 , 2 are heated to a predetermined processing temperature at least in a joining area containing the two joining zones. This can be done, for example, in an oven or by inductive heating. At the same time, a pressure of 10 MPa to 50 MPa is exerted on the stack of first component 1 , second component 2 and auxiliary body 8 by the clamping device during diffusion soldering.
  • the temperature in the joining area can be between 280 and 300 °C over a period of a few hours, e.g. 10 to 15 hours.
  • the silver layers of the coatings 5, 7 do not melt at the specified temperatures and pressures.
  • the auxiliary body 8 expands relatively more than the first component 1 and the second component 2 and thus homogeneously increases the pressure exerted on the joint during the diffusion soldering. This serves to compensate for unevenness on the surfaces of the two components 1, 2 that lie against one another during the joining process. In this way, a full-surface, all-round integral connection is formed, so that the result is that the joint is completely pressure-tight and diffusion-tight.
  • 1c shows the subassembly 12 obtained from the components 1, 2 after the diffusion soldering.
  • the assembly 12 forms a pressure transmitter with the second component 2 as the pressure transmitter body and the first component 1 as the separating membrane.
  • a chamber 11 which is delimited by the rear side of the separating membrane and the membrane bed formed in the pressure transmitter body and is filled with a transmission liquid when the pressure transmitter is in operation.
  • the transfer liquid also fills the passage opening 3, via which the chamber 11 communicates with a pressure sensor that can be arranged remotely from the pressure transmitter.
  • a pressure acting on the separating diaphragm is transmitted through the transmission liquid to the pressure sensor, which produces a corresponding pressure measurement signal representative of the pressure acting on the separating diaphragm.
  • first component 1 Between the separating membrane attached to the diaphragm seal body (first component 1) and the diaphragm seal body (second component 2), there is a narrow transition area 10 in which pure silver or, in the event that one or both components 1, 2 are formed from a copper alloy are, a silver-copper alloy is present.
  • a connection is only formed during the diffusion soldering process described above, so that the finished assembly 12 also differs structurally from assemblies that are produced by joining two components using other methods such as conventional brazing or welding.
  • components made of special materials whose properties can change when heated to higher temperatures due to changes in the microscopic structure of the material can be joined without sacrificing the stability, corrosion resistance and functionality of the assembly formed in this way.
  • a variant of the diffusion soldering method described above is shown schematically as a second embodiment.
  • the first component 1 and the second component 2 which can be designed in the same way as described in the exemplary embodiment described with reference to FIGS. 1a-c, also have a coating 5, 7, each of which comprises at least one uppermost silver layer.
  • a further layer 13 made of tin is applied to the silver layer of the coating 7 of the second component 2 .
  • This layer 13 can be formed, for example, by a tin foil placed on the silver layer of the coating 7 .
  • the additional tin layer 13 makes it possible to work with diffusion soldering at temperatures below 300 °C, since already at 150 to 200 °C the formation of a liquid solder phase and isothermal solidification with the formation of an intermetallic silver-tin compound in the joint area through diffusion in to a sufficient degree to achieve a material connection between the two components 1 , 2 .
  • an auxiliary body can be used in order to increase the pressure exerted on the joining area.
  • this is not absolutely necessary when using the additional tin layer 13.
  • an intermediate layer is found in a transition zone between the first component 1 and the second component 2, in which the intermetallic silver-tin compound is present.
  • first component 1 and the second component 2 which can be designed in the same way as in the first exemplary embodiment described with reference to FIGS. 1a to 1c, also have a coating 5, 7, each of which comprises at least one silver layer.
  • a further layer 14 made of a silver paste or of porous silver is applied to the silver layer of the coating of the second component 2 . This additional layer is used to compensate for unevenness in the surfaces of the components 1, 2 that are in contact with one another during the actual joining by diffusion soldering, and thus to produce a circumferential pressure-tight connection between the components.
  • the assembly to be produced has a separating membrane as the first component 1 and a process connection body with a process connection, eg a flange 15 , as the second component 2 .
  • a process connection eg a flange 15
  • Such configurations are also referred to as a flange assembly.
  • the flange 15 can have a ring of holes so that it can be fastened to a corresponding process connection point, for example to a tank or another container or a pipeline, by means of screws.
  • a person skilled in the art is familiar with a large number of alternative process connections and fastening means which can be used in this exemplary embodiment.
  • the process connection body can be configured quite analogously to the pressure transmitter body described above with reference to FIGS. 1a to 1c.
  • the first component 1 and the second component 2 each have a joining zone 4, 6 which is intended to be placed against one another and bonded to one another by diffusion soldering.
  • the components 1, 2 are each provided with a coating on their surface areas belonging to the joining zones, each of which has at least one silver layer. The joining process can be carried out according to the method according to one of the exemplary embodiments described above.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention se rapporte à un procédé d'assemblage d'un premier composant (1) avec un second composant (2) pour former un ensemble (12) d'un dispositif de terrain d'automatisation de processus, comprenant les étapes consistant : - à placer une première zone d'articulation (4) du premier composant (1) contre une seconde zone d'assemblage (6) du second composant (2), le premier composant (1) présentant un premier revêtement (5), qui comprend au moins une couche d'argent, dans la première zone d'assemblage (4), et le second composant (2) présentant un second revêtement (7), qui comprend au moins une couche d'argent, dans la seconde zone d'assemblage (6) ; et - à relier le premier composant (1) au second composant (2) dans une zone d'assemblage contenant les zones d'assemblage (4, 6) placées l'une contre l'autre par soudage par diffusion de telle sorte que le premier (1) et le second composant (2) sont reliés l'un à l'autre de manière étanche à la pression dans la zone d'assemblage.
PCT/EP2022/070953 2021-08-31 2022-07-26 Procédé d'assemblage de composants pour former un ensemble de dispositifs de terrain d'automatisation de processus WO2023030764A1 (fr)

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DE102021122572.8 2021-08-31
DE102021122572.8A DE102021122572A1 (de) 2021-08-31 2021-08-31 Verfahren zum Fügen von Komponenten zur Bildung einer Baugruppe eines Feldgerätes der Prozessautomatisierung

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DE102019134595A1 (de) * 2019-12-16 2021-06-17 Endress+Hauser SE+Co. KG Fügen von zwei Bauteilen eines Feldgeräts der Prozess- und Automatisierungstechnik

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