WO2023029945A1 - Appareil de projection laser - Google Patents

Appareil de projection laser Download PDF

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Publication number
WO2023029945A1
WO2023029945A1 PCT/CN2022/112060 CN2022112060W WO2023029945A1 WO 2023029945 A1 WO2023029945 A1 WO 2023029945A1 CN 2022112060 W CN2022112060 W CN 2022112060W WO 2023029945 A1 WO2023029945 A1 WO 2023029945A1
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WO
WIPO (PCT)
Prior art keywords
light
fluorescent
laser
heat
reflective
Prior art date
Application number
PCT/CN2022/112060
Other languages
English (en)
Chinese (zh)
Inventor
张勇
田有良
Original Assignee
青岛海信激光显示股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202111016185.1A external-priority patent/CN113671780A/zh
Priority claimed from CN202111016358.XA external-priority patent/CN113671781B/zh
Priority claimed from CN202111013838.0A external-priority patent/CN113671776B/zh
Application filed by 青岛海信激光显示股份有限公司 filed Critical 青岛海信激光显示股份有限公司
Priority to CN202280052555.3A priority Critical patent/CN117795417A/zh
Publication of WO2023029945A1 publication Critical patent/WO2023029945A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/16—Cooling; Preventing overheating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B21/00—Projectors or projection-type viewers; Accessories therefor
    • G03B21/14—Details
    • G03B21/20—Lamp housings

Definitions

  • the present disclosure relates to the technical field of projection display, in particular to a laser projection device.
  • the light source components of laser projection equipment include lasers and fluorescent wheels.
  • the laser is configured to emit a laser beam
  • the fluorescent wheel is configured to transmit the laser beam or emit a fluorescent beam with a color different from the laser beam under excitation of the laser beam, so that the light source assembly can provide beams of different colors.
  • the laser projection equipment includes: a light source assembly, an optical machine and a lens.
  • the light source assembly is configured to provide an illumination beam; the optical machine is configured to modulate the illumination beam with an image signal to obtain a projection beam; the lens is configured to project the projection beam into an image.
  • the light source assembly includes: a heat conduction substrate, a package casing, a first light emitting chip, a fluorescent part and a light path guiding assembly.
  • the packaging case is connected to the heat-conducting substrate and includes a light outlet. The light outlet is located on a side of the package housing away from the heat-conducting substrate.
  • the first light-emitting chip is located in the packaging case and connected to the heat-conducting substrate, and is configured to emit a first laser beam.
  • the fluorescent part is located in the packaging case and connected to the heat conducting substrate.
  • the fluorescent part is located on the light-emitting side of the first light-emitting chip, and is configured to emit a fluorescent beam to the light-emitting port under the excitation of at least part of the light in the first laser beam.
  • the optical path guide assembly is located in the package housing and is configured to guide the first laser beam to the fluorescent part. At least part of the light in the fluorescent light beam is emitted from the light outlet along a direction away from the thermally conductive substrate to form at least part of the light in the illumination light beam.
  • FIG. 1 is one of structural diagrams of a laser projection device according to some embodiments
  • FIG. 2 is a timing diagram of a light source assembly in a laser projection device according to some embodiments
  • FIG. 3 is a diagram of an optical path in a laser projection device according to some embodiments.
  • FIG. 4 is a structural diagram of a digital micromirror device according to some embodiments.
  • Fig. 5 is the position figure that a tiny mirror mirror swings in the digital micromirror device among Fig. 4;
  • Fig. 6 is a working principle diagram of a tiny mirror according to some embodiments.
  • FIG. 7 is the second structural diagram of a laser projection device according to some embodiments.
  • Fig. 8 is one of the structural diagrams of a light source assembly in the related art
  • Fig. 9 is the second structural diagram of a light source assembly in the related art.
  • FIG. 10 is a structural diagram of a fluorescent wheel in the related art.
  • Figure 11 is one of the structural diagrams of a light source assembly according to some embodiments.
  • Fig. 12 is the second structural diagram of a light source assembly according to some embodiments.
  • Figure 13 is a block diagram of a color filter assembly according to some embodiments.
  • Figure 14 is one of the structural diagrams of a light emitting device according to some embodiments.
  • 15 is a structural diagram of a fluorescent part according to some embodiments.
  • Fig. 16 is the second structural diagram of a light emitting device according to some embodiments.
  • Fig. 17 is a partial light path diagram of the light emitting device in Fig. 16;
  • Fig. 18 is the third structural diagram of a light emitting device according to some embodiments.
  • Fig. 19 is the fourth structural diagram of a light emitting device according to some embodiments.
  • Fig. 20 is the fifth structural diagram of a light emitting device according to some embodiments.
  • Fig. 21 is a structural diagram of the light combining part in the light emitting device in Fig. 20;
  • Fig. 22 is the sixth structural diagram of a light emitting device according to some embodiments.
  • Fig. 23 is the seventh structural diagram of a light emitting device according to some embodiments.
  • Fig. 24 is the eighth structural diagram of a light emitting device according to some embodiments.
  • Fig. 25 is a ninth structural diagram of a light emitting device according to some embodiments.
  • Light source assembly 1 laser 100; integrated base 101; light-emitting device 10; heat-conducting substrate 11; 131; the first reflective surface 1311; the first bottom surface 1312; the second reflective part 132; the second reflective surface 1321; the second bottom surface 1322; Transparent film 1333; second anti-reflection film 1334; support seat 134; support surface 1341; fourth bottom surface 1342; converging lens 135; fifth bottom surface 135a; first curved surface 135b; second curved surface 135c; A; the center point C of the first curved surface; the normal line L; the side surface 1343 of the support base; the first light-emitting chip 14; the first laser beam S1; the second laser beam S2; the fluorescent part 15; the fluorescent layer 151; The first chip base 171; the second chip base 172; the optical device 18; the second light-emitting chip 19; Color chip 303; drive unit 304; collimator lens 400; uniform light assembly 500;
  • Optical machine 20 Diffusion sheet 2; First lens assembly 3; Fly eye lens group 4; First fly eye lens 41; Second fly eye lens 42; Second lens assembly 5; Digital micromirror device 6; Part 602; Prism assembly 7;
  • first and second are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality” means two or more.
  • connection When describing some embodiments, the expression “connected” and its derivatives may be used. For example, the term “connected” may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. The embodiments disclosed herein are not necessarily limited by the context herein.
  • parallel As used herein, “parallel”, “perpendicular”, and “equal” include the stated situation and the situation similar to the stated situation, the range of the similar situation is within the acceptable deviation range, wherein the The acceptable deviation ranges are as determined by one of ordinary skill in the art taking into account the measurement in question and errors associated with measurement of the particular quantity (ie, limitations of the measurement system).
  • “parallel” includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; Deviation within 5°.
  • “Equal” includes absolute equality and approximate equality, where the difference between the two that may be equal is less than or equal to 5% of either within acceptable tolerances for approximate equality, for example.
  • the laser projection device 1000 includes a light source assembly 1 , an optical engine 20 , and a lens 30 .
  • the light source assembly 1 is configured to provide an illumination beam.
  • the optical machine 20 is configured to use an image signal to modulate the illumination beam provided by the light source assembly 1 to obtain a projection beam.
  • the lens 30 is configured to project the projection light beam on a screen or a wall to form an image.
  • the light source assembly 1, the optical engine 20 and the lens 30 are sequentially connected along the beam propagation direction.
  • one end of the optical machine 20 is connected to the light source assembly 1 , and the light source assembly 1 and the optical machine 20 are arranged along the outgoing direction of the illumination beam of the laser projection device 1000 (refer to the direction M in FIG. 1 ).
  • the other end of the optical machine 20 is connected to the lens 30, and the optical machine 20 and the lens 30 are arranged along the outgoing direction of the projection beam of the laser projection device 1000 (refer to the direction N in FIG. 1 ).
  • the emission direction M of the illumination light beam of the laser projection device 1000 is substantially perpendicular to the emission direction N of the projection light beam of the laser projection device 1000 .
  • Such setting can make the structural arrangement of the laser projection device 1000 reasonable, and avoid the optical path of the laser projection device 1000 in a certain direction (for example, direction M or direction N) from being too long.
  • the light source assembly 1 can sequentially provide three primary color lights (other color lights can also be added on the basis of the three primary color lights). In some other embodiments, the light source assembly 1 can output three primary colors of light at the same time, so as to continuously emit white light.
  • the light source assembly 1 includes a light emitting device, which can emit light of at least one color, such as blue laser.
  • the light source assembly 1 may sequentially output blue, red and green lighting beams.
  • the light source assembly 1 outputs blue laser light in the first time period T1, outputs red laser light in the second time period T2, and outputs green laser light in the third time period T3.
  • the time for the light source assembly 1 to complete a round of sequential output of the primary color light beams is one cycle of the output of the primary color light beams from the light source assembly 1 .
  • the display period of one frame of target image is equal to one cycle of the primary color beam output by the light source assembly 1, which is equal to the first time period The sum of T1, the second time period T2 and the third time period T3.
  • T1 the first time period
  • T2 the second time period
  • T3 the third time period
  • the optical machine 20 includes a digital micromirror device 6 .
  • the digital micromirror device 6 is located at the light output side of the light source assembly 1 , and is configured to use image signals to modulate the illumination beam provided by the light source assembly 1 , and reflect the modulated projection beam to the lens 30 . Since the digital micromirror device 6 can control the projected light beam to display different colors and brightness for different pixels of the image to be displayed to finally form an optical image, the digital micromirror device 6 is also called a light modulation device (or light valve). In addition, according to the number of digital micromirror devices 6 used in the optical machine 20, the optical machine 20 can be divided into a single-chip system, a two-chip system or a three-chip system. For example, only one digital micromirror device 6 is used in the optical machine 20 shown in FIG.
  • the optical machine 20 can be called a single-chip system.
  • the optical machine 20 can be called a three-chip system.
  • the light source assembly 1 can output three primary colors of light at the same time, so as to continuously emit white light.
  • the light modulation device can include many types, such as Liquid Crystal On Silicon (LCOS), Liquid Crystal Display (LCD) or Digital Micromirror Device (Digital Micromirror Device). , DMD). Since in some embodiments of the present disclosure, the optical machine 20 shown in FIG. 3 applies a digital light processing (Digital Light Processing, DLP) projection architecture, therefore, the light modulation device in some embodiments of the present disclosure is a DMD.
  • LCOS Liquid Crystal On Silicon
  • LCD Liquid Crystal Display
  • DMD Digital Micromirror Device
  • the digital micromirror device 6 includes thousands of tiny reflective mirrors 601 that can be individually driven to rotate, and these tiny reflective mirrors 601 are arranged in an array, and each tiny reflective mirror 601 corresponds to of a pixel.
  • each tiny mirror 601 is equivalent to a digital switch, which can swing within the range of ⁇ 12° or ⁇ 17° under the action of external force.
  • FIG. 5 takes an example in which each tiny reflective mirror 601 can swing within a range of ⁇ 12° for illustration.
  • the light reflected by the tiny mirror 601 at a negative deflection angle is called OFF light.
  • the OFF light is ineffective light, which is usually absorbed by the housing of the optical machine 20 or the light absorbing component 602 .
  • the light reflected by the tiny reflector 601 at a positive deflection angle is called ON light.
  • the ON light is an effective light beam that is irradiated by the tiny reflective lens 601 on the surface of the digital micromirror device 6 to receive the illumination beam, and enters the lens 30 through a positive deflection angle, and is used for projection imaging.
  • the open state of the micro-reflector 601 is the state where the micro-reflector 601 is and can be maintained when the illumination beam emitted by the light source assembly 1 is reflected by the micro-reflector 601 and can enter the lens 30, that is, the micro-reflector 601 is at a positive deflection angle. status.
  • the closed state of the tiny reflective mirror 601 is the state where the tiny reflective mirror 601 is and can be maintained when the illumination light beam emitted by the light source assembly 1 is reflected by the tiny reflective mirror 601 and does not enter the lens 30, that is, the tiny reflective mirror 601 is in a negative deflection angle status.
  • the tiny mirror 601 with a deflection angle of ⁇ 12° when the tiny mirror 601 is at +12°, it is in the on state, and when it is at -12°, it is in the off state.
  • the tiny mirror 601 with a deflection angle of ⁇ 17° when the tiny mirror 601 is at +17°, it is in the on state, and when it is at -17°, it is in the off state.
  • the image signal After the image signal is processed, it is converted into digital codes such as 0 and 1, and these digital codes can drive the tiny mirror 601 to swing.
  • the tiny mirrors 601 will switch between the on state and the off state at least once, so as to realize a frame of image according to the duration of the tiny mirrors 601 in the on state and the off state respectively.
  • the gray scale of each pixel in . For example, when a pixel has 256 gray scales from 0 to 255, the tiny reflective mirror 601 corresponding to the pixel with the gray scale of 0 is in the off state during the entire display period of the frame of image, and the micro mirror 601 corresponding to the pixel with the gray scale of 255 is in the off state.
  • the corresponding tiny reflective mirror 601 is in the on state during the entire display period of a frame of image, and the tiny reflective mirror 601 corresponding to the pixel with a gray scale of 127 is in the on state half of the time in the display period of a frame of image, and the other half is in the on state. Time is off. Therefore, by controlling the state of each tiny mirror 601 in the display period of a frame image and the maintenance time of each state in the digital micromirror device 6 through the image signal, the brightness (gray gray) of the corresponding pixel of the tiny mirror 601 can be controlled. order), so as to modulate the illumination beam projected to the digital micromirror device 6 .
  • the optical machine 20 further includes a diffuser 2 , a first lens assembly 3 , a fly lens assembly 4 , a second lens assembly 5 and a prism assembly 7 . It should be noted that the optical machine 20 may also include fewer or more components than those shown in FIG. 3 , which is not limited in the present disclosure.
  • the diffusion sheet 2 is located on the light emitting side of the light source assembly 1 and is configured to diffuse the illumination beam from the light source assembly 1 .
  • the first lens assembly 3 is located on the light emitting side of the diffusion sheet 2 and is configured to converge the illumination beam diffused by the diffusion sheet 2 .
  • the fly lens group 4 is located on the light emitting side of the first lens assembly 3 and is configured to homogenize the illumination beam converged by the first lens assembly 3 .
  • the second lens assembly 5 is located on the light emitting side of the fly lens group 4 and is configured to transmit the illumination beam homogenized by the fly lens group 4 to the prism assembly 7 .
  • the prism assembly 7 reflects the illumination beam to the digital micromirror device 6 .
  • the fly eye lens set 4 includes a first fly eye lens 41 and a second fly eye lens 42 oppositely arranged.
  • the light incident surface of the first fly-eye lens 41 and the light-emitting surface of the second fly-eye lens 42 include tiny lenses arranged in an array.
  • the illuminating light beam converged by the first lens assembly 3 is converged into multiple thin beams (that is, light beams with smaller spots) by different tiny lenses on the light incident surface of the first fly-eye lens 41, and Focuses on the center of each minute lens of the second fly-eye lens 42 .
  • the multiple tiny lenses on the light emitting surface of the second fly-eye lens 42 can diverge the multiple thin beams, so that the multiple thin beams become multiple wide beams (ie, beams with larger spots). Since the light spots of the multiple wide beams overlap with each other, after the illumination beams pass through the first fly-eye lens 41 and the second fly-eye lens 42, the uniformity and illumination brightness are improved.
  • the lens 30 includes a combination of multiple lenses, which are usually divided into groups, such as three-stage front group, middle group and rear group, or two-stage front group and rear group.
  • the front group is the lens group close to the light-emitting side of the laser projection device 1000 (that is, the side of the lens 30 in the direction N away from the optical machine 20 in FIG.
  • the lens 30 is a lens group on the side close to the optical engine 20 in the direction N).
  • the lens 30 may be a zoom lens, or a fixed focus adjustable focus lens, or a fixed focus lens.
  • some embodiments of the present disclosure mainly take the laser projection device 1000 adopting a DLP projection architecture, and the light modulation device in the optical machine 20 is a digital micromirror device 6 as an example for exemplary illustration.
  • the light modulation device in the optical machine 20 is a digital micromirror device 6 as an example for exemplary illustration.
  • a light source assembly of a laser projection device includes multicolor laser devices, that is, a red laser device 0011 , a green laser device 0012 and a blue laser device 0013 .
  • the red laser device 0011, the green laser device 0012 and the blue laser device 0013 can work at the same time.
  • the multicolor laser device outputs three primary colors at the same time; the red laser device 0011, the green laser device 0012 and the blue laser device 0013 can also be divided into At this time, the multi-color laser device sequentially outputs three primary colors of light.
  • the light source assembly also includes an optical path assembly 003 , a color filter wheel 004 and a light focusing assembly 005 .
  • the condensing component 005 is configured to condense the three primary color lights output by the multicolor laser device simultaneously or in time division.
  • the optical path component 003 is configured to guide the three primary colors light converged by the light concentrating component 005 to the color filter wheel 004 .
  • the color filter wheel 004 includes a red color filter, a green color filter and a blue color filter, and a color filter of one color can filter a light beam of that color.
  • red light and blue light in the three primary color lights cannot pass through the red color filter, and the three primary color lights After the primary color light is filtered, only red light remains.
  • the red laser device can withstand a lower working temperature and is more easily damaged, the reliability of the above-mentioned light source assembly is poor.
  • laser devices of three colors need to be installed in the above-mentioned light source assembly at the same time, which is relatively difficult and expensive to manufacture.
  • the light source assembly of the laser projection device includes a single-color laser device (for example, a plurality of blue laser devices 0013) or a two-color laser device (for example, a green laser device 0012 and a blue laser device 0013) device 0013).
  • the light source component can output one primary color light, or output two primary color lights simultaneously or time-sharing.
  • the light source assembly including a monochromatic laser device, and the monochromatic laser device is a blue laser device 0013 as an example
  • the light source assembly also includes a fluorescent wheel 002
  • the optical path assembly 003 includes a first optical path assembly 0031 and a second optical path assembly 0032 .
  • the first optical path component 0031 is configured to focus and collimate the blue laser light converged by the light focusing component 005 and guide it to the fluorescent wheel 002 .
  • the fluorescent wheel 002 includes a transmission area 0021 , a red fluorescent area 0022 , a green fluorescent area 0023 , a fluorescent wheel substrate 0024 and a fluorescent wheel driving part 0025 .
  • the red fluorescent area 0022 is provided with red fluorescent paint, which can generate red fluorescence under the excitation of blue laser;
  • the green fluorescent area 0023 is provided with green fluorescent paint, which can generate green fluorescence under the excitation of blue laser.
  • the red fluorescent paint and the green fluorescent paint are bonded on the fluorescent wheel substrate 0024 through colloid.
  • the fluorescent wheel drive unit 0025 can drive the fluorescent wheel 002 to rotate, so that the position where the blue laser light is irradiated on the fluorescent wheel 002 changes.
  • the fluorescent wheel 002 transmits the blue laser and guides the blue laser to the second optical path assembly 0032, and the second optical path assembly 0032 guides the blue laser to the color filter wheel 004 .
  • the fluorescent wheel 002 When the blue laser is irradiated on the red fluorescent area 0022 or the green fluorescent area 0023, the fluorescent wheel 002 generates red fluorescent light or green fluorescent light, and reflects the red fluorescent light or the green fluorescent light to the first optical path assembly 0031, and the first optical path assembly 0031 The red fluorescence or the green fluorescence is directed to the color filter wheel 004 .
  • the fluorescent wheel 002 will continue to receive high-energy laser irradiation from multiple laser devices. In this way, the operating temperature of the area irradiated by the laser on the fluorescent wheel 002 will rise sharply.
  • the possibility of the excited electrons in the fluorescent paint returning to the ground state through non-radiative decay (that is, the possibility of de-excitation of the fluorescent paint) will increase, resulting in the fluorescent wheel 002
  • the working temperature of the fluorescent wheel 002 is too high (for example, 70 degrees Celsius)
  • the colloid between the fluorescent paint and the fluorescent wheel substrate 0024 will melt at high temperature, causing the fluorescent paint to fall off, and the fluorescent wheel 002 is not working properly, and the reliability of the light source components is still not high.
  • the fluorescent wheel 002 will not be damaged under the continuous irradiation of laser light emitted by less laser devices (for example, one laser device). However, if the number of laser devices in the light source assembly is reduced to achieve a fixed installation of the fluorescent wheel 002 and ensure the normal operation of the fluorescent wheel 002, the brightness of the illumination beam provided by the light source assembly will be reduced, thereby reducing the projection of the laser projection device. The display effect of the image.
  • the inventors of the present disclosure have found through research that: due to the unreasonable installation position of the fluorescent wheel 002 in the light source assembly, the fluorescent wheel 002 needs to withstand the laser irradiation of multiple laser devices when it is fixedly installed. Therefore, it is hindered to realize the miniaturization design of the fluorescent wheel 002 in the light source assembly under the premise of taking into account the reliability and the display effect of the projected image.
  • the embodiment of the present disclosure provides the light source assembly 1 as shown in FIG. 11 , FIG. 12 and FIG. 13 .
  • the light source assembly 1 may include: a laser 100 , an optical path shaping assembly 200 and a color filter assembly 300 .
  • the laser 100 is configured to provide an illumination beam;
  • the optical path shaping component 200 is configured to shrink and homogenize the illumination beam provided by the laser 100, so that the spot of the illumination beam becomes smaller and the energy is uniform;
  • the color filter assembly 300 is configured as The illumination light beam from the optical path shaping component 200 is color-filtered to sequentially output three primary colors (ie, red, green, blue) light. It should be noted that the structure of the laser 100 will be described below.
  • the color filter assembly 300 may include a green color filter 301 , a blue color filter 302 , a red color filter 303 and a driving part 304 .
  • the driving unit 304 is configured to drive the color filter assembly 300 to rotate, so that the illumination light beam emitted by the laser 100 is filtered by color filters of different colors during a display period of one frame of target image.
  • the color filter assembly 300 rotates to the position where the red color filter 303 covers the light spots of the three primary colors of light, Beams of other colors except the red light beam in the three primary colors are blocked, while the red light beam passes through the red color filter 303 and transmits the color filter assembly 300 .
  • the light source assembly 1 further includes a collimating lens 400 .
  • the collimator lens 400 is located at the light exit side of the light path shaping assembly 200 and is configured to converge the illumination beam from the light path shaping assembly 200 .
  • the light source assembly 1 further includes a uniform light assembly 500 .
  • the dodging component 500 is located at the light output side of the color filter component 300 and is configured to evenly light the illumination beam filtered by the color filter component 300 .
  • the dodging component 500 can be a fly-eye lens or a light pipe.
  • the structure of the dodging component 500 can refer to the structure of the above-mentioned fly lens group 4 , which will not be repeated here.
  • the light homogenizing component 500 is a light pipe
  • the light pipe may be a tubular device spliced by four planar reflection sheets, that is, a hollow light pipe. The light beam is reflected multiple times inside the light guide to achieve uniform light effect.
  • the uniform light assembly 500 may also adopt a solid light pipe.
  • the light inlet and the light outlet of the light pipe are rectangles with the same shape and area. Beam homogenization and spot optimization.
  • the uniform light assembly 500 when the uniform light assembly 500 is a light guide, the light source assembly 1 includes a light guide, and the light guide 20 may not be provided with a light guide; when the uniform light assembly 500 is other components except the light guide, the light The machine 20 also includes the above-mentioned light guide for receiving the illumination beam from the light source assembly 1 .
  • the laser 100 includes: an integrated base 101 and a plurality of light emitting devices 10 arrayed on the integrated base 101 .
  • the material of the integrated base 101 may be a heat-conducting material such as a single metal, an alloy material, silicon carbide, aluminum nitride, or heat-conducting ceramics.
  • the integrated base 101 can provide structural support, heat dissipation and electrical connection for multiple light emitting devices 10 .
  • FIG. 11 and FIG. 12 are illustrative illustrations that the light source assembly 1 includes one laser 100 as an example, and the present disclosure does not limit the number of lasers 100 included in the laser projection device 1000 .
  • the laser projection apparatus 1000 may include two lasers 100 or three lasers 100 .
  • the light source assembly 1 includes multiple lasers 100 , the brightness of the illumination light beam provided by the light source assembly 1 can be increased, thereby improving the display effect of the laser projection device 1000 .
  • the structure of the light emitting device 10 will be exemplarily described below mainly with reference to FIG. 14 and FIG. 15 .
  • the light-emitting device 10 includes: a heat-conducting substrate 11 , a packaging case 12 , an optical path guiding component 13 , a first light-emitting chip 14 and a fluorescent part 15 .
  • the encapsulation case 12 is connected to the heat conduction substrate 11 , and the side of the encapsulation case 12 away from the heat conduction substrate 11 includes a light outlet 121 .
  • the first light-emitting chip 14 is located in the packaging case 12 and connected to the heat-conducting substrate 11 , and is configured to emit a first laser beam.
  • the fluorescent part 15 is located in the package housing 12 and connected to the heat-conducting substrate 11.
  • the fluorescent part 15 is located on the light-emitting side of the first light-emitting chip 14, and is configured to emit light to the light-emitting side under the excitation of at least part of the light in the first laser beam.
  • Port 121 emits a fluorescent beam.
  • the light path guide assembly 13 is located in the package housing 12 and is configured to guide the first laser beam to the fluorescent part 15 .
  • At least part of the light in the fluorescent light beam exits from the light outlet 121 along a direction away from the heat-conducting substrate 11 to form at least part of the light in the illumination light beam, and is directed to the light machine 20 .
  • the laser projection device 1000 provided by the embodiment of the present disclosure divides the fluorescent wheel in the related art into a plurality of fluorescent parts 15 and then arranges them in the packaging casing 12 of the light emitting device 10, so that the fluorescent part 15 only needs to bear one light emitting device
  • the laser irradiation in 10 reduces the energy of the laser light transmitted to the fluorescent part 15, thereby reducing the probability of damage such as local burning and fire of the fluorescent part 15, and improving the reliability of the light source assembly. Therefore, on the premise of ensuring reliability, the reduction of components in the light source assembly 1 (for example, the fluorescent wheel driving circuit, the fluorescent wheel driving part 0025, etc.) is realized, and the miniaturization design requirement of the laser projection device 1000 is met.
  • the fluorescent part 15 is arranged on the heat-conducting substrate 11, so that the heat generated by the first laser beam hitting the fluorescent part 15 can be quickly transferred to the entire heat-conducting substrate 11, so that the fluorescent part 15 can quickly dissipate heat, so that The working temperature of the fluorescent part 15 is relatively low, which avoids the problem that the fluorescence excitation efficiency of the fluorescent part 15 decreases due to the high working temperature, and improves the fluorescence excitation efficiency of the fluorescent part 15 .
  • the first light emitting chip 14 includes a semiconductor light emitting element.
  • the semiconductor light emitting element can emit a blue first laser beam. It should be noted that the first light-emitting chip 14 in the embodiment of the present disclosure may also emit first laser beams of other colors, which is not limited in this embodiment of the present disclosure.
  • the energy of the first laser beam irradiated by the first light-emitting chip 14 to the fluorescent portion 15 is less than or equal to 20W. In this way, the energy of the first laser beam received by the fluorescent part 15 is small, which can avoid the problem of excessively high working temperature of the fluorescent part 15 and is beneficial to reduce the probability of damage to the fluorescent part 15 .
  • the energy of the first laser beam irradiated by the first light-emitting chip 14 to the fluorescent part 15 may be higher. Since the fluorescent part 15 in the embodiment of the present disclosure dissipates heat quickly, even if the energy of the first laser beam irradiated to the fluorescent part 15 is high, the fluorescent part 15 can maintain a high fluorescence excitation efficiency.
  • the fluorescent part 15 includes a fluorescent layer 151 connected to the thermally conductive substrate 11 .
  • the fluorescent layer 151 can be excited to generate fluorescent light under the irradiation of the first laser beam.
  • the fluorescent layer 151 may include fluorescent materials of different colors. Exemplarily, when the phosphor layer 151 includes yellow yttrium aluminum garnet phosphor, the phosphor layer 151 may be excited to generate yellow fluorescence under the irradiation of the first laser beam.
  • the phosphor layer 151 may be connected to the heat-conducting substrate 11 by means of mechanical fixing, bonding, welding or high-temperature sintering.
  • the side of the fluorescent layer 151 close to the heat-conducting substrate 11 further includes a metal coating for welding.
  • the fluorescent portion 15 further includes an optical anti-reflection film 152 connected to the fluorescent layer 151 and located on a side of the fluorescent layer 151 away from the thermally conductive substrate 11 .
  • an optical anti-reflection film 152 connected to the fluorescent layer 151 and located on a side of the fluorescent layer 151 away from the thermally conductive substrate 11 .
  • the illumination beam emitted from the light emitting device 10 to the light machine 20 may only include the fluorescent beam emitted from the light outlet 121 .
  • the fluorescent part 15 emits a fluorescent light beam under the excitation of all the first laser beams transmitted to the fluorescent part 15 .
  • the light source assembly 1 may also include a monochromatic light emitting device that only emits laser light.
  • the fluorescent light beam emitted from the light outlet 121 is yellow fluorescent light
  • the laser light emitted by the monochromatic light emitting device is blue laser light, so the illuminating light beam emitted from the light source assembly 1 to the optical machine 20 is a mixed light beam of yellow fluorescent light and blue laser light. , that is, a white beam.
  • the illumination light beam emitted from the light emitting device 10 to the light machine 20 also includes at least part of the first laser light beam.
  • the fluorescent part 15 is configured to emit a fluorescent beam under the excitation of a part of the first laser beam emitted by the first light-emitting chip 14 and transmit another part of the first laser beam.
  • the area of the thermally conductive substrate 11 that is in contact with the fluorescent portion 15 includes a reflective area.
  • At least part of the other part of the light is reflected toward the light outlet 121 .
  • at least a part of the other part of the light is emitted from the light outlet 121 along a direction away from the thermally conductive substrate 11 to form an illumination beam together with at least a part of the fluorescent light, and is directed to the light machine 20 .
  • the first laser beam emitted by the first light-emitting chip 14 of a light-emitting device 10 is blue laser light
  • the fluorescence emitted by the fluorescent part 15 after being excited is yellow fluorescence
  • the light outlet 121 of the light-emitting device 10 The light beam is a mixed light beam of the yellow fluorescent light emitted by the fluorescent part 15 and the blue laser light reflected by the reflective area.
  • the fluorescence excitation ratio of the fluorescent part 15 is related to the thickness of the fluorescent part 15 .
  • the reflective area of the thermally conductive substrate 11 may be a diffuse reflective material layer or a metal reflective layer.
  • the reflective area can evenly light the reflected light beam.
  • the reflection area is a metal reflection layer, the reflection rate of the reflection area to the light beam is higher.
  • the material of the metal reflective layer may be aluminum or silver. It should be noted that when the thermally conductive substrate 11 itself has the function of reflecting light, the entire thermally conductive substrate 11 is a reflection area.
  • optical path guide assembly 13 The structure of the optical path guide assembly 13 will be described exemplarily below mainly with reference to FIG. 16 to FIG. 25 .
  • the light path guiding assembly 13 includes a first reflection part 131 and a second reflection part 132 . At this time, the first laser beam emitted by the first light-emitting chip 14 is reflected by the first reflective part 131 and the second reflective part 132 in sequence, and reaches the fluorescent part 15 .
  • the packaging case 12 further includes: a side plate 122 and a packaging board 123 .
  • a side of the side plate 122 close to the heat-conducting substrate 11 is connected to the heat-conducting substrate 11 , and a side away from the heat-conducting substrate 11 is connected to the packaging board 123 .
  • the light outlet 121 is located on the packaging board 123 .
  • the encapsulation case 12 is configured to protect various components located therein, such as the above-mentioned first light emitting chip 14 and the fluorescent part 15 .
  • the first reflective portion 131 is located in the packaging case 12 and connected to the thermally conductive substrate 11 , and the first reflective portion 131 is located between the first light-emitting chip 14 and the fluorescent portion 15 .
  • the second reflector 132 is located in the packaging case 12 and connected to the packaging case 12 .
  • the second reflector 132 is connected to a side of the package board 123 of the package case 12 that is close to the heat-conducting substrate 11 .
  • the first reflection part 131 is configured to guide the first laser beam emitted by the first light-emitting chip 14 to the second reflection part 132
  • the second reflection part 132 is configured to guide the first laser beam from the first reflection part 131 to the fluorescent part.
  • the fluorescent part 15 is configured to emit the fluorescent light beam to the light outlet 121 under the excitation of at least part of the first laser beam from the second reflective part 132 .
  • the first reflective part 131 has a first reflective surface 1311 on the side close to the first light-emitting chip 14
  • the second reflective part 132 has a second reflective surface 1321 on the side close to the fluorescent part 15 .
  • the first reflective surface 1311 and the second reflective surface 1321 may be flat reflective surfaces or curved reflective surfaces.
  • At least one of the first reflective surface 1311 of the first reflective part 131 and the second reflective surface 1321 of the second reflective part 132 is a curved reflective surface configured to converge
  • the first laser beam emitted by the first light-emitting chip 14, and the transmission direction of the first laser beam emitted by the first light-emitting chip 14 is changed to reduce the degree of diffusion of the first laser beam during transmission, so that the fluorescent part 15 receives
  • the spot of the first laser beam received is smaller and the energy is more concentrated, so as to ensure that the fluorescent part 15 has a higher fluorescence excitation efficiency.
  • the first reflective surface 1311 of the first reflective part 131 and the second reflective surface 1321 of the second reflective part 132 are parabolic reflective surfaces.
  • the first center point A1 of the light-emitting surface of the first light-emitting chip 14 coincides with the first focal point A2 of the first reflective surface 1311
  • multiple divergent beams of the first laser beams emitted by the first light-emitting chip 14 After the light is reflected by the first reflective surface 1311, it becomes a plurality of beams parallel to each other.
  • the second focal point A3 of the second reflective surface 1321 coincides with a point on the surface of the fluorescent part 15 (for example, the second central point A4 in FIG.
  • the multiple beams reflected by the first reflective surface 1311 are parallel to each other. After being reflected by the second reflective surface 1321 , the light converges on the surface of the fluorescent part 15 . In this way, the light spot of the first laser beam received by the fluorescent part 15 is smaller and the energy is more concentrated, so that the fluorescent excitation efficiency of the fluorescent part 15 is higher.
  • the first reflective portion 131 also has a first bottom surface 1312 , and the first bottom surface 1312 is connected to the heat-conducting substrate 11 .
  • the first bottom surface 1312 and the heat-conducting substrate 11 can be soldered and connected by plating a metal film layer on the first bottom surface 1312 .
  • the second reflection part 132 also has a second bottom surface 1322 , and the second bottom surface 1322 is connected to the packaging case 12 .
  • the second bottom surface 1322 can be connected to the packaging case 12 in the same manner as the first bottom surface 1312 , which will not be repeated here.
  • the first reflective part 131 includes a first curved reflector and a first fixing structure.
  • the function of the first curved reflector is the same as that of the above-mentioned first reflective surface 1311 , and the first fixing structure is configured to connect the first curved reflector to the heat-conducting substrate 11 .
  • the second reflector 132 includes a second curved reflector and a second fixing structure. The function of the second curved reflector is the same as that of the above-mentioned second reflective surface 1321 , and the second fixing structure is configured to connect the second curved reflector to the packaging case 12 .
  • the light emitting device 10 includes two first light emitting chips 14, two first reflective parts 131 and two second reflective parts 132, and the two first light emitting chips 14 are respectively Located on both sides of the fluorescent portion 15 , the two first reflective portions 131 are respectively located on both sides of the fluorescent portion 15 , and the two second reflective portions 132 are respectively located on both sides of the fluorescent portion 15 .
  • the intensity of the laser light irradiated on the fluorescent part 15 is higher, and the number of molecules excited by the laser light in the fluorescent part 15 is larger, so that the intensity of the generated fluorescent light beam is higher, and the brightness of the light beam emitted by the light emitting device 10 is higher.
  • two first light emitting chips 14, two first reflective parts 131 and two second reflective parts 132 may be arranged symmetrically.
  • the difference between the light path guide assembly 13 in FIGS. 19 to 21 and the light path guide assembly 13 in FIGS. 16 to 18 is that the light path guide assembly 13 includes a light combiner 133 .
  • the optical path guide assembly 13 only needs to reflect the first laser beam emitted by the first light-emitting chip 14 once to guide the first laser beam to the fluorescent part 15 .
  • the light-combining portion 133 is located in the packaging case 12 and connected to the heat-conducting substrate 11 .
  • the first light-emitting chip 14 and the light-combining portion 133 are respectively located on opposite sides of the fluorescent portion 15 , and the side of the light-combining portion 133 close to the fluorescent portion 15 has a reflective surface 1331 .
  • the reflective surface 1331 is configured to guide the first laser beam emitted by the first light-emitting chip 14 to the fluorescent part 15 , and guide at least part of the fluorescent beam emitted by the fluorescent part 15 to the light outlet 121 .
  • the light emitting device 10 only emits fluorescent light beams.
  • the reflective surface 1331 is a dichroic film.
  • the dichroic film is capable of reflecting light with a wavelength within a first wavelength range and transmitting light with a wavelength within a second wavelength range.
  • the dichroic film can reflect the blue light beam and transmit the yellow light beam.
  • the light emitting device 10 further includes a second light emitting chip 19 .
  • the second light-emitting chip 19 is located in the packaging case 12 and connected to the heat-conducting substrate 11 , and is located on a side of the light-combining portion 133 away from the fluorescent portion 15 .
  • the second light-emitting chip 19 is configured to emit a second laser beam, and the light combiner 133 is also configured to reflect at least part of the second laser beam to the light outlet 121 .
  • the fluorescent light emitted by the excited fluorescent part 15 is yellow fluorescent light
  • the second laser beam is blue laser light
  • the light emitting device 10 may emit white light beam.
  • the illumination beam of the light emitting device 10 may also include the first laser beam that is transmitted by the fluorescent part 15 and then reflected to the light outlet 121 by the reflection area of the thermally conductive substrate 11 , which is not limited in this disclosure. .
  • first light-emitting chip 14 and the second light-emitting chip 19 in the embodiment of the present disclosure may output laser beams at the same time, or may output laser beams in time division, which is not limited in the present disclosure.
  • the side connected to the heat-conducting substrate 11 is the third bottom surface 1332
  • the side with the reflective surface 1331 is the plane 1330
  • the plane 1330 and the third bottom surface 1332 The first angle ⁇ between them is an obtuse angle.
  • the light-combining portion 133 can be fixed on the heat-conducting substrate 11 through the third bottom surface 1332 .
  • the third bottom surface 1332 of the light-combining part 133 may be coated with a metal film layer, which is used for soldering connection with the heat-conducting substrate 11 to fix the light-combining part 133 .
  • the side of the light-combining portion 133 provided with the reflective surface 1331 may also be a curved surface, which is not limited in the present disclosure.
  • the orthographic projection of the fluorescent part 15 on the heat-conducting substrate 11 is located within the orthographic projection of the reflective surface 1331 on the heat-conducting substrate 11 .
  • the first laser beam emitted by the first light-emitting chip 14 can be guided to the fluorescent part 15 more by the reflective surface 1331
  • the fluorescent beam emitted by the fluorescent part 15 can be guided to the light outlet 121 by the reflective surface 1331 more.
  • the optical axis of the first laser beam S1 emitted by the first light-emitting chip 14 and the optical axis of the second laser beam S2 emitted by the second light-emitting chip 19 are parallel to the third bottom surface 1332 .
  • the first included angle ⁇ is 135 degrees
  • the included angle between the optical axis of the first laser beam S1 and the optical axis of the second laser beam S2 and the plane 1330 is 45 degrees.
  • the optical axis of the first laser beam S1 and the optical axis of the second laser beam S2 can be made perpendicular to the optical axis of the fluorescent beam emitted by the fluorescent part 15, so that the light beam (for example, fluorescent beam) in the light emitting device 10
  • the short optical path makes the structure of the light emitting device 10 relatively compact, which facilitates the miniaturization design of the light emitting device 10 .
  • the color of the light beam emitted by the light emitting device 10 in this embodiment can be realized by adjusting the light intensity of the first laser beam S1 and the light intensity of the second laser beam S2.
  • the light intensity of the first laser beam S1 is greater than the light intensity of the second laser beam S2
  • the light beam emitted by the light emitting device 10 contains relatively more fluorescent light beams and relatively less second laser light beams S2; or
  • the light intensity of the first laser beam S1 is less than or equal to the light intensity of the second laser beam S2
  • the light beam emitted by the light emitting device 10 contains relatively less fluorescent light beams and relatively more second laser light beams S2.
  • the side of the light-combining portion 133 facing the second light-emitting chip 19 has a first anti-reflection film 1333 .
  • the first anti-reflection coating 1333 can reduce the part of the second laser beam S2 reflected by the light combiner 133 , so that the second laser beam S2 is more guided to the light outlet 121 .
  • the side of the light-combining portion 133 facing the second light-emitting chip 19 has a plurality of diffusion microstructures.
  • the plurality of diffusion microstructures may be a plurality of micro-protrusion structures or a plurality of micro-depression structures, and the plurality of diffusion microstructures may homogenize the second laser beam S2.
  • the side of the light-combining portion 133 away from the heat-conducting substrate 11 has a second anti-reflection film 1334 .
  • the second anti-reflection film 1334 can reduce the reflected portion of the fluorescent light beam entering the light combining portion 133 and the second laser beam S2.
  • optical path guide assembly 13 includes a support seat 134 .
  • the optical path guide assembly 13 does not need to reflect the first laser beam at least once to guide the first laser beam to the fluorescent part 15, but changes the emission angle of the first light-emitting chip 14 so that the first laser beam can directly Reach the fluorescent part 15.
  • the support seat 134 is located in the packaging case 12 and connected to the heat-conducting substrate 11 .
  • the support base 134 has a support surface 1341 on the side close to the fluorescent portion 15
  • the support base 134 has a fourth bottom surface 1342 on the side close to the heat conduction substrate 11
  • Angle ⁇ is an acute angle.
  • the first light-emitting chip 14 is located on the supporting surface 1341 of the supporting seat 134 .
  • the first laser beam emitted by the first light-emitting chip 14 can directly reach the fluorescent part 15 .
  • the light emitting device 10 further includes a converging lens 135 . At this time, the first laser beam emitted by the first light-emitting chip 14 reaches the fluorescent part 15 after passing through the converging lens 135 .
  • the converging lens 135 is located on the support surface 1341 , and is located on a side of the first light-emitting chip 14 close to the fluorescent portion 15 .
  • the converging lens 135 is configured to converge the first laser beam emitted by the first light-emitting chip 14 onto the fluorescent part 15 .
  • the light passing through the converging lens 135 can be condensed and collimated by the converging lens 135. Therefore, setting the converging lens 135 can reduce the degree of diffusion of the first laser beam during transmission, so that the fluorescence excitation efficiency of the fluorescent part 15 is higher. .
  • the embodiment of the present disclosure does not limit the number of the above-mentioned converging lenses 135 , for example, the light emitting device 10 includes one, two or three converging lenses 135 .
  • the light emitting device 10 includes a converging lens 135 including a fifth bottom surface 135a, and the converging lens 135 is connected to the supporting surface 1341 through the fifth bottom surface 135a.
  • a converging lens 135 including a fifth bottom surface 135a
  • the converging lens 135 is connected to the supporting surface 1341 through the fifth bottom surface 135a.
  • at least one of the end surface of the converging lens 135 near the end of the first light emitting chip 14 and the end surface of the end far away from the first light emitting chip 14 has a curved surface.
  • the curved surface may be a spherical curved surface or an aspheric curved surface.
  • the end surface of the converging lens 135 close to the first light-emitting chip 14 is a first plane, and the end surface of the end far away from the first light-emitting chip 14 has a first curved surface 135b.
  • the first curved surface 135b protrudes toward a side close to the fluorescent portion 15 .
  • the converging lens 135 may be called a single convex lens.
  • the end surface of the converging lens 135 close to the first light-emitting chip 14 has the second curved surface 135c, and the end surface of the end far away from the first light-emitting chip 14 has the above-mentioned first curved surface 135b.
  • the second curved surface 135c protrudes toward a side close to the first light emitting chip 14 .
  • the converging lens 135 may be called a biconvex lens. Compared with the single-convex lens, when the converging lens 135 is a double-convex lens, the light spot formed by converging the first laser beam on the fluorescent part 15 is smaller, and the converging effect is better.
  • the optical axis A of the first laser beam emitted by the first light-emitting chip 14 is collinear with the normal line L at the center point C of the first curved surface 135 b of the converging lens 135 .
  • the spot of the first laser beam converged by the converging lens 135 can be made smaller and the energy more concentrated, thereby ensuring that the fluorescent part 15 has a higher fluorescence excitation efficiency.
  • the light-emitting device 10 includes two support seats 134 and two first light-emitting chips 14, the two support seats 134 are respectively located on both sides of the fluorescent part 15, and the two first light-emitting chips 14 The chips 14 are respectively located on the supporting surfaces 1341 of the two supporting bases 134 .
  • the intensity of the laser light irradiated on the fluorescent part 15 is higher, and the number of molecules excited by the laser light in the fluorescent part 15 is larger, so that the intensity of the generated fluorescent light beam is higher, and the brightness of the light beam emitted by the light emitting device 10 is higher.
  • the support base 134 is made of thermally conductive material (eg, metal material or ceramic material), and the support base 134 also has a support base side 1343 , and the support base side 1343 is in contact with the packaging case 12 . In this way, the heat generated by the first light emitting chip 14 can also be conducted to the packaging case 12 through the support base 134 , thereby improving the heat dissipation efficiency of the first light emitting chip 14 .
  • the light emitting device 10 further includes a first chip base 171 .
  • the first chip base 171 is located on the heat conduction substrate 11 , and the side of the first chip base 171 away from the heat conduction substrate 11 is connected to the first light emitting chip 14 .
  • the chip base 17 can increase the distance between the first light-emitting chip 14 and the heat-conducting substrate 11 , avoiding the problem of local overheating of the heat-conducting substrate 11 caused by the direct contact of the light-emitting chip 14 with the heat-conducting substrate 11 .
  • the heat generated by the light-emitting chip 14 can be conducted to the heat-conducting substrate 11 through the chip base 17 , so as to ensure the heat dissipation efficiency of the light-emitting chip 14 .
  • the first chip base 171 is connected to the heat-conducting substrate 11 through the supporting seat 134 .
  • the light emitting device 10 further includes a second chip base 172 .
  • the second chip base 172 is located on the supporting base 134 , and the side of the second chip base 172 away from the supporting base 134 is connected to the second light-emitting chip 19 .
  • the function of the second chip base 172 is similar to that of the first chip base 171 , which will not be repeated here.
  • connection method between the above-mentioned converging lens 135 and the support surface 1341, and the connection method between the first chip base 171 or the second chip base 172 and the heat-conducting substrate 11 or the support base 134 can be colloid bonding, mechanical fixing, Sintering silver sintering, welding or bonding, etc.
  • the thermally conductive substrate 11 , the packaging case 12 , the first chip base 171 and the second chip base 172 may be made of thermally conductive materials.
  • the material of the thermally conductive substrate 11 may include simple metal, alloy material, silicon carbide, aluminum nitride, ceramic material or glass body and the like.
  • the material of the packaging case 12 may include metal material or ceramic material.
  • the material of the first chip base 171 and the second chip base 172 may be silicon carbide, aluminum nitride or silicon. In this way, it is beneficial to the overall heat dissipation of the light emitting device 10 .
  • the lighting device 10 further includes an optical device 18 .
  • the optical device 18 is connected to the package housing 12 and located at the light outlet 121 .
  • the optical device 18 is configured to collimate, converge and/or homogenize the light beam at the light outlet 121 .
  • the optical device 18 includes at least one of a fly-eye lens, an aspheric lens, a Fresnel lens, and a spherical mirror.
  • the optical device 18 is a fly-eye lens
  • the optical device 18 is configured to homogenize the light beam at the light outlet 121 .
  • the light emitting device 10 further includes a driving circuit and a pin 111 .
  • the driving circuit is configured to provide a driving current
  • the pin 111 is configured to deliver the driving current to the light emitting chip 14 .
  • the fluorescent part 15 in the light emitting device 10 provided by the embodiment of the present disclosure, by arranging the fluorescent part 15 in the package casing 12, the fluorescent part 15 only needs to withstand the laser irradiation in one light emitting device 10, reducing the transmission to the fluorescent light.
  • the laser energy of the part 15 reduces the probability of the fluorescent part 15 being partially scorched, ignited, etc., and improves the reliability of the light source assembly. Therefore, on the premise of ensuring the reliability, the components in the light source assembly 1 are reduced, and the miniaturization design requirement of the laser projection device 1000 is met.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Projection Apparatus (AREA)

Abstract

L'invention concerne un appareil de projection laser (1000) associé au domaine de la technologie d'affichage. Un appareil de projection laser (1000) comprend : un ensemble source de lumière (1), une machine optique (20) et une lentille (30). Dans l'ensemble source de lumière (1), un boîtier d'encapsulation (12) est relié à un substrat thermoconducteur (11) et comprend une sortie de lumière (121). La sortie de lumière (121) est située sur le côté du boîtier d'encapsulation (12) qui est le plus éloigné du substrat thermoconducteur (11). Une première puce électroluminescente (14) est disposée dans le boîtier d'encapsulation (12) et connectée au substrat thermoconducteur (11), et elle est conçue pour émettre un premier faisceau laser. Une partie fluorescente (15) est disposée dans le boîtier d'encapsulation (12) et reliée au substrat thermoconducteur (11). La partie fluorescente (15) est disposée au niveau d'un côté d'émission de lumière de la première puce électroluminescente (14) et elle est conçue pour émettre, sous les effets d'au moins une partie de la lumière dans le premier faisceau laser, un faisceau fluorescent vers la sortie de lumière (121). Un ensemble de guidage de trajet optique (13) est disposé dans le boîtier d'encapsulation (12) et conçu pour guider le premier faisceau laser vers la partie fluorescente (15). Au moins une partie de la lumière dans le faisceau fluorescent est émise à partir de la sortie de lumière (121) dans une direction s'éloignant du substrat thermoconducteur (11), de manière à former au moins une partie de la lumière en un faisceau d'éclairage.
PCT/CN2022/112060 2021-08-31 2022-08-12 Appareil de projection laser WO2023029945A1 (fr)

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CN202111016185.1 2021-08-31
CN202111013838.0 2021-08-31
CN202111013838.0A CN113671776B (zh) 2021-08-31 2021-08-31 发光单元、光源系统和激光投影设备
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