WO2023029915A1 - 通道模组和植入式神经刺激器 - Google Patents

通道模组和植入式神经刺激器 Download PDF

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Publication number
WO2023029915A1
WO2023029915A1 PCT/CN2022/111441 CN2022111441W WO2023029915A1 WO 2023029915 A1 WO2023029915 A1 WO 2023029915A1 CN 2022111441 W CN2022111441 W CN 2022111441W WO 2023029915 A1 WO2023029915 A1 WO 2023029915A1
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WO
WIPO (PCT)
Prior art keywords
channel
feedthrough
upper cover
metallization
area
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PCT/CN2022/111441
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English (en)
French (fr)
Inventor
吴国良
章海涛
朱为然
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苏州景昱医疗器械有限公司
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Application filed by 苏州景昱医疗器械有限公司 filed Critical 苏州景昱医疗器械有限公司
Publication of WO2023029915A1 publication Critical patent/WO2023029915A1/zh

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00—Electrotherapy; Circuits therefor
    • A61N1/18—Applying electric currents by contact electrodes
    • A61N1/32—Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36—Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/3605—Implantable neurostimulators for stimulating central or peripheral nerve system
    • A61N1/36125—Details of circuitry or electric components

Definitions

  • the present application relates to the technical field of medical equipment, for example, to a channel module and an implanted neurostimulator.
  • a traditional implantable neurostimulator includes a housing, a feedthrough provided on the housing with leads, and a head connector connected to the feedthrough, wherein the electrical connection between the head connector and the main board inside the housing It is connected through the lead wire of the feed-through part.
  • the lead wire of the feed-through part and the channel connection block are welded together by laser welding.
  • the channel connection block In order to ensure the bending strength of the lead wire, it is necessary to give the lead wire enough space, and in order to facilitate welding, the channel connection block Also have enough volume. In actual operation, this connection method has the problems of large volume and inconvenient welding operation.
  • the purpose of this application is to provide a channel module to solve the problems of large volume and inconvenient welding of implantable neurostimulators.
  • the application provides a channel module, including: a channel upper cover, the channel upper cover is an insulating member, and the channel upper cover is provided with a first metallization area; a channel lower cover, the channel lower cover and the feedthrough
  • the upper cover of the channel is buckled on the lower cover of the channel to form a channel; the lower cover of the channel and the feedthrough are both insulators, and the feedthrough is provided with a second A metallization area; the first metallization area is connected to the second metallization area through a gold wire to conduct the feedthrough and the upper cover of the channel.
  • each axial groove is provided with a plurality of radial grooves, and each of the channel upper covers
  • the bottom of each radial groove is provided with a first through hole, and the first metalized area communicates with the inner and outer sides of the upper cover of the channel through the first through hole.
  • the second metallization area and the first metallization area are prepared by electroplating, photolithography or printing.
  • the feedthrough, the channel upper cover, and the channel lower cover are all made of ceramic material or polyetheretherketone (PEEK) material.
  • PEEK polyetheretherketone
  • the two ends of the gold wire are respectively welded to the feedthrough and the upper cover of the channel through a binding process.
  • water seal rings are provided at the ends of the channel upper cover and the channel lower cover to seal the channel.
  • the present application also provides an implantable neural stimulator, comprising: a housing in which a printed circuit board assembly (PCBA) circuit board and a battery are arranged; a feedthrough connected to and sealing the housing; a channel module, the channel module is detachably connected to the feedthrough; the feedthrough is provided with a second metallized area, and the channel module A first metallization area is provided, and the second metallization area and the first metallization area are connected and conducted through gold wires.
  • PCBA printed circuit board assembly
  • the feedthrough includes: a bottom plate, the bottom surface of which is fixed on the housing and seals the housing, and two rows of second longitudinal through holes are opened on the bottom plate; the vertical plate, the The vertical plate is vertically arranged on the top surface of the bottom plate and is located between the two rows of longitudinal second through holes and forms the feedthrough of T-shaped cross-section, and a row of longitudinal third through holes is set on the vertical plate.
  • a through hole, the second metallization region is provided between the second through hole and the third through hole to connect the second through hole and the third through hole.
  • the feedthrough is welded and fixed to the housing by laser welding.
  • epoxy glue is filled between the channel module and the feedthrough, and the gold wire is sealed and isolated in the epoxy glue.
  • Fig. 1 is a schematic structural diagram of a channel module of the present application
  • Fig. 2 is a schematic structural view of the outside of the channel upper cover and the first metallized region in the present application;
  • FIG. 3 is a schematic structural view of a feedthrough and a second metallization region in the present application
  • Fig. 4 is a schematic diagram of the inner structure of the passage upper cover in the present application.
  • Fig. 5 is a schematic structural view of the passage lower cover and the water seal ring in the present application.
  • Fig. 6 is a schematic structural diagram of an implantable neurostimulator provided in the present application.
  • connection should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components.
  • connection can be a fixed connection, a detachable connection, or an integrated ; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, and it can be the internal communication of two components or the interaction relationship between two components.
  • a first feature being "on” or “under” a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them.
  • “above”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
  • “Below”, “beneath” and “under” the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
  • a channel module of the present application includes a channel upper cover 1 and a channel lower cover 2, and the channel lower cover 2 and the feedthrough 3 are detachably connected; the channel lower cover 2 and the feedthrough 3 are insulating parts, and the feedthrough
  • the second metallization area 31 is provided on the through part 3; the channel upper cover 1 is an insulating part, and the channel upper cover 1 is buckled on the channel lower cover 2 to form a channel; the channel upper cover 1 is provided with a first metallization area 11, the second A metallization area 11 is connected to a second metallization area 31 through a gold wire 4 to conduct the feedthrough 3 and the channel cover 1 .
  • FIG. 1 it is a schematic diagram of the connection position relationship between the channel lower cover 2 and the feedthrough 3.
  • the channel lower cover 2 is detachably connected to the feedthrough 3. Install. After the channel lower cover 2 is connected to the feedthrough 3, the channel upper cover 1 is placed on the channel lower cover 2 to form a channel, and materials such as insulating resin are poured on the outside of the channel upper cover 1 to realize sealing and isolation.
  • the second metallization area 31 and the first metallization area 11 meet the conduction requirements
  • the design does not take up extra space, the pattern is easy to make, avoids the traditional lead method, and greatly saves the connection space between the feedthrough 3 and the upper channel cover 1, which is beneficial to realize a smaller channel upper cover 1 and channel lower cover 2, and it is convenient to set more conduction channels in the channel module of the same volume.
  • the channel module with eight channels in the related art replacing the channel module in the embodiment of the cost, at least twelve channels can be set, It can be seen that the present application has obvious advantages in reducing the volume of the channel module or utilizing space.
  • a channel module of the present application by setting the second metallization area 31 on the feedthrough 3, setting the first metallization area 11 on the channel cover 1, and connecting the second metallization area 31 and the second metallization area 31 through the gold wire 4
  • a metallized area 11 can realize the conduction between the feedthrough 3 and the upper cover 1 of the channel, the connection is convenient and fast, the traditional lead method is omitted, the space of the channel module is greatly saved, and the limited space is realized. More channels can be set inside.
  • each axial groove 12 is respectively arranged on the inner side of the passage upper cover 1 and the passage lower cover 2, and each axial groove 12 is provided with a plurality of radial grooves 13, each of the passage upper cover 1
  • the bottom of each radial groove 13 is provided with a first through hole 14, and the first metallized area 11 communicates with the inner and outer sides of the upper cover 1 through the first through hole 14.
  • two axial grooves 12 are arranged in the length direction of the channel upper cover 1, and a plurality of radial grooves 13 are arranged at intervals in each axial groove 12.
  • a plurality of radial grooves 13 in the axial groove 12 are provided in one-to-one correspondence, and a spring is arranged in each radial groove 13, and the spring can be compressed when the channel upper cover 1 and the channel lower cover 2 are fastened, so that The spring is in conduction with the upper cover 1 of the channel.
  • Each axial groove 12 and each radial groove 13 are arc-shaped grooves, and the first through hole 14 at the bottom of each radial groove 13, as shown in Figure 2, passes through the inside and outside of the channel upper cover 1 body
  • the first through hole 14 can generally be set as a stepped hole, that is, the diameter of the hole end of the first through hole 14 facing the outer surface of the channel upper cover 1 is larger than the hole diameter of the hole end facing the inner surface, which is convenient for processing and setting the first metallization area 11. It should be noted that, as shown in FIG.
  • each first through hole 14 communicates with the inner and outer sides of the upper cover 1 through the first metallized area 11, and the first metallized area 11 is opposite to the Each first through hole 14 is a relatively independent area. It can be understood that the channel cover 1 and the feedthrough 3 adopt an insulating material body, which is convenient for processing different shapes of the first metallization area 11 or the second metallization area 11 on the insulating material body. area 31.
  • the second metallization region 31 and the first metallization region 11 are prepared by electroplating or photolithography.
  • the second metallization region 31 and the first metallization region 11 in this application are both metallization patterns processed on the insulating material body, through the metallization pattern, there is no need to use wires, which reduces the preparation of wire routing. Leave space and simplify the conduction connection.
  • the second metallization region 31 and the first metallization region 11 are connected by the gold wire 4 , the connection position and connection method are more flexible, the operability is enhanced, the technical difficulty for realizing the connection is reduced, and the assembly efficiency is facilitated.
  • the patterning methods of the second metallization region 31 and the first metallization region 11 are not limited to electroplating or photolithography, and other patterning methods such as printing methods can also be used, which will not be listed one by one in this embodiment.
  • the feedthrough 3 , the channel upper cover 1 and the channel lower cover 2 are all made of ceramic material or PEEK material.
  • Ceramic parts and PEEK materials have higher bulk density and are better insulating materials, which are only used as optional materials here, and are not limited to these two insulating materials in practice.
  • the two ends of the gold wire 4 are respectively welded to the feedthrough 3 and the channel cover 1 through a bonding process.
  • the channel upper cover 1 and the channel lower cover 2 are buckled first and the spring is clamped, and then the two ends of the gold wire 4 are respectively welded on the feedthrough 3 and the channel upper cover 1 through the binding process to realize the conduction. Pass.
  • the surface of the channel cover 1 and the feedthrough 3 is filled with epoxy glue, which can seal and fix the gold wire 4, improve the connection strength of the gold wire 4, and ensure the isolation effect.
  • a water seal ring 5 is provided at the ends of the channel upper cover 1 and the channel lower cover 2 to seal the channel.
  • the water seal ring 5 is located at one end of the channel, which can respectively seal the end gaps of the two axial grooves 12 between the channel upper cover 1 and the channel lower cover 2, so as to ensure the internal sealing of the channel module .
  • the embodiment of the present application also provides an implantable neural stimulator, which is applied to the channel module provided in Embodiment 1, including: a housing 6, in which a PCBA circuit board and a battery are arranged; a feedthrough 3, a feedthrough Part 3 is connected to the housing 6 and seals the housing 6; the channel module is detachably connected to the feedthrough 3; the feedthrough 3 is provided with a second metallization area 31, and the channel module is provided with a first The metallization area 11 , the second metallization area 31 and the first metallization area 11 are connected and conducted through the gold wire 4 .
  • the channel module is detachably connected to the feedthrough 3 through the channel lower cover 2, and the gold wire 4 adopts the binding process, and the two The second metallization area 31 and the first metallization area 11 are respectively welded to realize the conduction between the feedthrough 3 and the upper cover 1 of the channel.
  • the wires used are less, which saves the wire layout space and is conducive to the production of smaller volume space. Implantable neurostimulators improve effective space utilization.
  • the feedthrough 3 includes a bottom plate 32 and a vertical plate 33.
  • the bottom surface of the bottom plate 32 is fixed on the housing 6 and seals the housing 6.
  • Two rows of longitudinal second through holes 321 are opened on the bottom plate 32, and the vertical plate 33 is vertical.
  • a row of longitudinal third through holes 331 is set on the vertical plate 33, the second through holes 321 and
  • the second metallization region 31 is disposed between the third via holes 331 to connect the second via hole 321 and the third via hole 331 .
  • the positions of the second through hole 321 and the third through hole 331 are set in one-to-one correspondence, so as to design the connected second metallization area 31, the area shown in the rectangular line frame in Figure 3 is the processed second metallization area.
  • Metallized region 31, the second metallized region 31 penetrates the bottom surface and the top surface of the bottom plate 32 through the second through hole 321, penetrates the two sides of the vertical plate 33 through the third through hole 331, and can realize the second through hole 321 and the third
  • the one-to-one corresponding conduction between the through holes 331 changes the connection of the wires in the related art to the connection of the metallization pattern, which saves wiring space and connection space, and is soldered to the corresponding second metallization area 31 and the corresponding second metallization area 31 through the gold wire 4
  • the first metallization region 11 facilitates the design and conduction of more channels.
  • the feedthrough 3 and the housing 6 are fixed by laser welding.
  • the welding method has high connection strength and good conduction performance.
  • epoxy glue is filled between the channel module and the feedthrough 3, and the gold wire 4 is sealed and isolated in the epoxy glue.
  • epoxy glue can also maintain the shape of the implanted neurostimulator to a certain extent and play a good supporting role.
  • An implantable neurostimulator provided by the present application adopts a feedthrough with a second metallization area and a channel upper cover with a first metallization area, and connects the second metallization area and the first metal area with a gold wire.
  • the optimized area saves the traditional way of printing lines, so an implantable neurostimulator with a smaller volume can be made and the effective space utilization rate can be improved.

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Abstract

公开了一种通道模组和植入式神经刺激器，通道模组包括通道上盖，通道上盖设有第一金属化区域；通道下盖，通道下盖与馈通件可拆卸式连接，通道上盖扣设在通道下盖以形成通道；馈通件上设有第二金属化区域；第一金属化区域与第二金属化区域通过金线连接以导通馈通件和通道上盖。

Description

通道模组和植入式神经刺激器
本申请要求在2021年09月03日提交中国专利局、申请号为202111033205.6的中国专利申请的优先权，该申请的全部内容通过引用结合在本申请中。
技术领域
本申请涉及医疗设备技术领域，例如涉及一种通道模组和植入式神经刺激器。
背景技术
传统的植入式神经刺激器包括外壳、设置在外壳上的具有引线的馈通件，以及与馈通件导通的头部连接器，其中，头部连接器与外壳内的主板的电连接是通过馈通件的引线连接，馈通件的引线和通道连接块通过激光焊接的方式焊接在一起，为了保证引线的弯折强度，需要给引线足够的空间，并且为了便于焊接，通道连接块也要有足够的体积。这种连接方式在实际操作中，存在体积大和不方便焊接操作的问题。
申请内容
本申请的目的在于提供一种通道模组，以解决植入式神经刺激器存在的体积空间大和不便焊接的问题。
本申请提供一种通道模组，包括：通道上盖，所述通道上盖为绝缘件，所述通道上盖设有第一金属化区域；通道下盖，所述通道下盖与馈通件之间可拆卸式连接，所述通道上盖扣设在所述通道下盖以形成通道；所述通道下盖和所述馈通件均为绝缘件，所述馈通件上设有第二金属化区域；所述第一金属化区域与所述第二金属化区域通过金线连接以导通所述馈通件和所述通道上盖。
可选地，所述通道上盖和所述通道下盖的内侧分别对应设置两个轴向凹槽，每个轴向凹槽内设有多个径向凹槽，所述通道上盖的每个径向凹槽的底部设有第一通孔，所述第一金属化区域通过所述第一通孔连通所述通道上盖的内外两侧。
可选地，所述第二金属化区域和所述第一金属化区域通过电镀、光刻或印刷方式制备得到。
可选地，所述馈通件、所述通道上盖和所述通道下盖均采用陶瓷材料或聚醚醚酮(Polyetheretherketone，PEEK)材料。
可选地，所述金线的两端通过绑定工艺，分别焊接在所述馈通件和所述通道上盖上。
可选地，所述通道上盖和所述通道下盖的端部设有水封环以密封所述通道。
本申请还提供一种植入式神经刺激器，包括：壳体，所述壳体内设有印刷电路板装配(Printed Circuit Board Assembly，PCBA)电路板和电池；馈通件，所述馈通件连接于所述壳体并密封所述壳体；通道模组，所述通道模组可拆卸式连接于所述馈通件；所述馈通件设有第二金属化区域，所述通道模组设有第一金属化区域，所述第二金属化区域和所述第一金属化区域之间通过金线连接和导通。
可选地，所述馈通件包括：底板，所述底板的底面固定于所述壳体上并密封所述壳体，所述底板上开设两排纵向的第二通孔；立板，所述立板垂直设于所述底板的顶面且位于所述两排纵向的第二通孔之间并形成T型截面的所述馈通件，所述立板上开设一排纵向的第三通孔，所述第二通孔和所述第三通孔之间设置所述第二金属化区域以导通所述第二通孔和所述第三通孔。
可选地，所述馈通件与所述壳体之间采用激光焊方式焊接固定。
可选地，所述通道模组与所述馈通件之间注满环氧胶，所述金线密封隔绝在所述环氧胶内。
附图说明
图1是本申请的一种通道模组的结构示意图；
图2是本申请中通道上盖的外侧和第一金属化区域的结构示意图；
图3是本申请中馈通件和第二金属化区域的结构示意图；
图4是本申请中通道上盖的内侧结构示意图；
图5是本申请中通道下盖和水封环的结构示意图；
图6是本申请提供的一种植入式神经刺激器的结构示意图。
图中：
1.通道上盖；11.第一金属化区域；12.轴向凹槽；13.径向凹槽；14.第一通孔；2.通道下盖；3.馈通件；31.第二金属化区域；32.底板；321.第二通孔；33.立板；331.第三通孔；4.金线；5.水封环；6.壳体。
具体实施方式
下面结合附图和实施例对本申请进行说明。可以理解的是，此处所描述的 实施例仅仅用于解释本申请，而非对本申请的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与本申请相关部分的结构。
在本申请的描述中，除非另有明确的规定和限定，术语“相连”、“连接”、“固定”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以视情况理解上述术语在本申请中的含义。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
在本实施例的描述中，术语“上”、“下”、“左”、“右”等方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述和简化操作，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅仅用于在描述上加以区分，并没有特殊的含义。术语“多个”应该理解为两个以上。
实施例一：
本申请首先提供一种通道模组，如图1所示，本申请提供的通道模组应用于植入式神经刺激器，在现有植入式神经刺激器的基础上，改进了通道模组的结构和连接方式。本申请的一种通道模组包括通道上盖1和通道下盖2，通道下盖2与馈通件3之间可拆卸式连接；通道下盖2和馈通件3均为绝缘件，馈通件3上设有第二金属化区域31；通道上盖1为绝缘件，通道上盖1扣设在通道下盖2以形成通道；通道上盖1设有第一金属化区域11，第一金属化区域11与第二金属化区域31通过金线4连接以导通馈通件3和通道上盖1。
如图1所示为通道下盖2与馈通件3之间的连接位置关系示意图，通道下盖2可拆卸式连接于馈通件3，本实施例采用卡接的连接方式，便于实现快速安装。当通道下盖2与馈通件3连接后，通道上盖1盖设在通道下盖2上并形成通道后，在通道上盖1的外侧浇筑绝缘树脂等材料实现密封和隔离。本实施例中，通过在通道上盖1设置第一金属化区域11，在馈通件3上设置第二金属化区域31，第二金属化区域31和第一金属化区域11按照导通需求进行设计，不 占用额外空间，图案制作方便，避免了传统的引线方式，大大节省了馈通件3和通道上盖1之间的连接空间，利于实现更小的通道上盖1和通道下盖2，以及便于在相同体积的通道模组内设置更多的导通通道，对于相关技术中具有八通道的通道模组，替换成本实施例中的通道模组，至少可以设置十二个通道，可以看出，本申请在通道模组体积的减小或空间的利用上的优势非常明显。
本申请的一种通道模组，通过在馈通件3上设置第二金属化区域31，在通道上盖1设置第一金属化区域11，通过金线4连通第二金属化区域31和第一金属化区域11便可以实现馈通件3与通道上盖1之间的导通，连接方便快速，省去了传统的引线方式，大大节约了通道模组的空间，实现了在有限的空间内可以设置更多的通道。
可选地，通道上盖1和通道下盖2的内侧分别对应设置两个轴向凹槽12，每个轴向凹槽12内设有多个径向凹槽13，通道上盖1的每个径向凹槽13的底部设有第一通孔14，第一金属化区域11通过第一通孔14连通通道上盖1的内外两侧。
如图4所示，以通道上盖1为例，通道上盖1的长度方向设置两个轴向凹槽12，每个轴向凹槽12内间隔设置多个径向凹槽13，两个轴向凹槽12内的多个径向凹槽13一一对应设置，每个径向凹槽13内都设置一个弹簧，当通道上盖1和通道下盖2扣合时能够压缩弹簧，使得弹簧与通道上盖1导通。每个轴向凹槽12和每个径向凹槽13均为圆弧型槽，每个径向凹槽13的底部第一通孔14如图2所示，贯通通道上盖1本体的内外两侧，一般第一通孔14可以设置为阶梯孔，即第一通孔14的朝向通道上盖1外侧面的孔端孔径大于朝向内侧面的孔端的孔径，便于加工设置第一金属化区域11。需要说明的是，如图2所示第一金属化区域11，每个第一通孔14分别通过第一金属化区域11连通通道上盖1的内外两侧且第一金属化区域11相对于每一个第一通孔14是相对独立的区域，可以理解，通道上盖1和馈通件3采用绝缘材料本体，便于在绝缘材料本体上加工不同形状的第一金属化区域11或第二金属化区域31。
可选地，第二金属化区域31和第一金属化区域11通过电镀或光刻方式制备得到。
可以理解，本申请中第二金属化区域31和第一金属化区域11均是加工在绝缘材料本体上的金属化图案，通过金属化的图案，不需要采用导线，减少了导线走线的预留空间，并且简化了导通连接方式。通过金线4连接第二金属化区域31和第一金属化区域11，连接位置和连接方式更加灵活，可操作性增强，对于实现连接的技术难度降低，便于提高组装效率。第二金属化区域31和第一金属化区域11的图案加工方式，不限于电镀或光刻的方式，也可以采用其他图 案制作方式如印刷方法，本实施例中不再一一列举。
可选地，馈通件3、通道上盖1和通道下盖2均采用陶瓷材料或PEEK材料。
陶瓷件和PEEK材料具有较高的体积密度，是较好的绝缘材料，此处仅是作为可选材料，实际中并不局限于这两种绝缘材料。
可选地，金线4的两端通过绑定工艺，分别焊接在馈通件3和通道上盖1上。
在操作时，首先将通道上盖1和通道下盖2扣设并夹设弹簧，然后通过绑定工艺将金线4的两端分别焊接在馈通件3和通道上盖1上以实现导通。金线4绑定完成后，在通道上盖1与馈通件3的表面注满环氧胶，可以密封和固定金线4，提高金线4的连接强度，以及确保隔离效果。
可选地，通道上盖1和通道下盖2的端部设有水封环5以密封通道。
如图5所示，水封环5设于通道的一端，能够分别密封通道上盖1和通道下盖2之间两个轴向凹槽12的端部间隙，确保通道模组的内部密封性。
实施例二：
本申请实施例还提供一种植入式神经刺激器，应用于实施例一提供的通道模组，包括：壳体6，壳体6内设有PCBA电路板和电池；馈通件3，馈通件3连接于壳体6并密封壳体6；通道模组，通道模组可拆卸式连接于馈通件3；馈通件3设有第二金属化区域31，通道模组设有第一金属化区域11，第二金属化区域31和第一金属化区域11之间通过金线4连接和导通。
如图6和图1所示，采用本申请的上述实施例一提供的通道模组，通道模组通过通道下盖2可拆卸式连接于馈通件3，金线4采用绑定工艺，两端分别焊接第二金属化区域31和第一金属化区域11，实现馈通件3和通道上盖1的导通，所采用的导线少，节约了导线布置空间，利于制作更小体积空间的植入式神经刺激器，提高有效空间利用率。
可选地，馈通件3包括底板32和立板33，底板32的底面固定于壳体6上并密封壳体6，底板32上开设两排纵向的第二通孔321，立板33垂直设于底板32的顶面且位于两排第二通孔321之间并形成T型截面的馈通件3，立板33上开设一排纵向的第三通孔331，第二通孔321和第三通孔331之间设置第二金属化区域31以导通第二通孔321和第三通孔331。
如图3所示，第二通孔321和第三通孔331的位置一一对应设置，以便设计连通的第二金属化区域31，如图3矩形线框所示区域为加工的第二金属化区域31，第二金属化区域31通过第二通孔321贯通底板32的底面和顶面，通过 第三通孔331贯通立板33的两侧面，并能够实现第二通孔321和第三通孔331之间的一一对应导通，将相关技术中的导线连通，改为金属化图案连通，节省布线空间和连接空间，通过金线4焊接于相对应的第二金属化区域31和第一金属化区域11，利于实现更多通道的设计和导通。
可选地，馈通件3与壳体6之间采用激光焊方式焊接固定。焊接方式的连接强度高，导通性能好。
可选地，通道模组与馈通件3之间注满环氧胶，金线4密封隔绝在环氧胶内。
环氧胶除了具有较好的隔离绝缘效果，还可以在一定程度上维持植入式神经刺激器的外形，起到良好的支撑作用。
本申请提供的一种植入式神经刺激器，通过采用具有第二金属化区域的馈通件，以及具有第一金属化区域的通道上盖，采用金线连通第二金属化区域和第一金属化区域，省去了传统的印线方式，因此可以制作更小体积空间的植入式神经刺激器，提高有效空间利用率。

Claims (10)

  1. 一种通道模组，包括：
    通道上盖(1)，所述通道上盖(1)为绝缘件，所述通道上盖(1)设有第一金属化区域(11)；
    通道下盖(2)，所述通道下盖(2)与馈通件(3)之间可拆卸式连接，所述通道上盖(1)扣设在所述通道下盖(2)以形成通道；所述通道下盖(2)和所述馈通件(3)均为绝缘件，所述馈通件(3)上设有第二金属化区域(31)；所述第一金属化区域(11)与所述第二金属化区域(31)通过金线(4)连接以导通所述馈通件(3)和所述通道上盖(1)。
  2. 根据权利要求1所述的通道模组，其中，所述通道上盖(1)和所述通道下盖(2)的内侧分别对应设置两个轴向凹槽(12)，每个轴向凹槽(12)内设有多个径向凹槽(13)，所述通道上盖(1)的每个径向凹槽(13)的底部设有第一通孔(14)，所述第一金属化区域(11)通过所述第一通孔(14)连通所述通道上盖(1)的内外两侧。
  3. 根据权利要求1所述的通道模组，其中，所述第二金属化区域(31)和所述第一金属化区域(11)通过电镀、光刻或印刷的方式制备得到。
  4. 根据权利要求1所述的通道模组，其中，所述馈通件(3)、所述通道上盖(1)和所述通道下盖(2)均采用陶瓷材料或聚醚醚酮(Polyetheretherketone，PEEK)材料。
  5. 根据权利要求1所述的通道模组，其中，所述金线(4)的两端通过绑定工艺，分别焊接在所述馈通件(3)和所述通道上盖(1)上。
  6. 根据权利要求1所述的通道模组，其中，所述通道上盖(1)和所述通道下盖(2)的端部设有水封环(5)以密封所述通道。
  7. 一种植入式神经刺激器，包括：
    壳体(6)，所述壳体(6)内设有印刷电路板装配(Printed Circuit Board Assembly，PCBA)电路板和电池；
    馈通件(3)，所述馈通件(3)连接于所述壳体(6)并密封所述壳体(6)；
    通道模组，所述通道模组可拆卸式连接于所述馈通件(3)；所述馈通件(3)设有第二金属化区域(31)，所述通道模组设有第一金属化区域(11)，所述第二金属化区域(31)和所述第一金属化区域(11)之间通过金线(4)连接和导通。
  8. 根据权利要求7所述的植入式神经刺激器，其中，所述馈通件(3)包括：
    底板(32)，所述底板(32)的底面固定于所述壳体(6)上并密封所述壳 体(6)，所述底板(32)上开设两排纵向的第二通孔(321)；
    立板(33)，所述立板(33)垂直设于所述底板(32)的顶面且位于所述两排纵向的第二通孔(321)之间并形成T型截面的所述馈通件(3)，所述立板(33)上开设一排纵向的第三通孔(331)，所述第二通孔(321)和所述第三通孔(331)之间设置所述第二金属化区域(31)以导通所述第二通孔(321)和所述第三通孔(331)。
  9. 根据权利要求7所述的植入式神经刺激器，其中，所述馈通件(3)与所述壳体(6)之间采用激光焊方式焊接固定。
  10. 根据权利要求1所述的植入式神经刺激器，其中，所述通道模组与所述馈通件(3)之间注满环氧胶，所述金线(4)密封隔绝在所述环氧胶内。
PCT/CN2022/111441 2021-09-03 2022-08-10 通道模组和植入式神经刺激器 WO2023029915A1 (zh)

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