WO2023029585A1 - 一种热保护型的瞬态电压抑制器 - Google Patents

一种热保护型的瞬态电压抑制器 Download PDF

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Publication number
WO2023029585A1
WO2023029585A1 PCT/CN2022/092832 CN2022092832W WO2023029585A1 WO 2023029585 A1 WO2023029585 A1 WO 2023029585A1 CN 2022092832 W CN2022092832 W CN 2022092832W WO 2023029585 A1 WO2023029585 A1 WO 2023029585A1
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electrode
pin
pin electrode
area
transient voltage
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PCT/CN2022/092832
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English (en)
French (fr)
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罗禄全
张祥贵
汤跃聪
江建国
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厦门赛尔特电子有限公司
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Priority to KR1020247006941A priority Critical patent/KR20240036697A/ko
Publication of WO2023029585A1 publication Critical patent/WO2023029585A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers

Definitions

  • the present disclosure relates to the technical field of overvoltage protection, in particular to a thermal protection type transient voltage suppressor.
  • Transient Voltage Suppressor for short, is an overvoltage protection device, which is mainly used to discharge surge current and accurately clamp voltage.
  • the start-up speed of the thermal protection of the existing thermal protection transient voltage suppressor in the failure state is not fast enough, especially the high breaking capacity requirement, for example, the current reaches 150A, which often leads to arcing during the thermal protection process, and in severe cases may cause the product to catch fire. damage the equipment.
  • the single on-board soldering method is common in the market.
  • the pin electrodes are inserted into the PCB for soldering, and the soldering cannot be completed through reflow soldering together with the SMT device. Second wave soldering is required, which affects the production efficiency of customers.
  • the melting point of the heat-protected fusible alloy is usually 140-220°C, which is much lower than the temperature of 260-280°C in the high-temperature section of reflow soldering, it is easy to cause product failure during the soldering process.
  • this application adds a thermal protection booster device to the transient voltage suppressor, which is intended to increase the start-up speed of thermal protection, and provides a surface mount welding method, as well as shells, pins
  • the heat-resistant design makes the low-temperature solder joints not affected by the high-temperature zone of reflow soldering.
  • a thermally protected transient voltage suppressor comprising a housing, a cover plate, a TVS component and pin electrodes, the housing and the cover plate are snapped together to form a chamber, and the TVS component and pin electrodes are accommodated in the chamber ;
  • the TVS assembly includes an inner frame and a TVS chip accommodated in the inner frame; the lead electrode extends out of the cavity and a surface mount area is provided on the protruding part for surface mount welding.
  • the lead electrode includes a straight-shaped main body and a bent part connected to the main body, and the bent part includes a multifunctional area, a surface mount area perpendicular to the multifunctional area, and a guide
  • the fixed function area leads to a step between the fixed function area and the surface mount area.
  • the housing and the cover plate are provided with holes corresponding to the pin electrodes, the bent parts of the pin electrodes protrude from the cavity, and the multi-functional area, the surface mount area and the guiding and fixing functional area are exposed outside the cavity.
  • the cover plate is provided with a cavity corresponding to the pin electrode, and the guiding and fixing functional area of the pin electrode is embedded in the cavity of the cover plate.
  • At least one heat-resistant through hole is provided on the pin electrode.
  • the cross-sectional area of the lead electrode is 0.1mm 2 -5mm 2
  • the soldering area of the surface mount part is 1mm 2 -75mm 2
  • the thickness of the lead electrode is 0.2-1.5mm.
  • the TVS assembly also includes a reed electrode and a thermal protection booster, the reed electrode is provided with a notch, and the thermal protection booster is arranged in the notch of the reed electrode, wherein the thermal protection booster includes a slider and an elastic member, one end of the elastic member is connected to the inner frame, and the other end is connected to the slider, and the slider is acted by the elastic force of the elastic member to make the reed electrode quickly release and pop up.
  • the elastic member is a compression spring
  • one end of the compression spring leans against the inner frame
  • the slider is provided with a hole for receiving the other end of the compression spring
  • the slider is supported by the compression spring. Push, push the reed electrode to pop up the quick release.
  • the elastic member is a tension spring
  • the slider is provided with a boss
  • the inner frame is provided with a boss
  • one end of the tension spring is hooked on the boss of the slider
  • the other end is hooked on the On the boss of the inner frame, the slider receives the pulling force of the extension spring, so that the reed electrode quickly releases and pops up.
  • the lead electrodes include a first lead electrode, a second lead electrode, a third lead electrode and a fourth lead electrode, and the outer edges of the first lead electrode and the fourth lead electrode aligned, the outer edges of the second pin electrode and the third pin electrode are aligned.
  • the pin electrodes include a first pin electrode, a second pin electrode, a third pin electrode and a fourth pin electrode, and the extension line of the outer edge of the first pin electrode is connected to the fourth pin electrode.
  • the extension lines of the inner edges of the pin electrodes There is a gap between the extension lines of the inner edges of the pin electrodes, and there is a gap between the extension lines of the outer edges of the second pin electrodes and the extension lines of the inner edges of the third pin electrodes.
  • the beneficial effect of the present disclosure is that: the casing and the cover plate form a cavity, and only holes are left for the lead electrodes to pass through, so as to avoid the melting and disconnection of the fusible alloy caused by the circulation of hot air during the reflow soldering process; one of the lead electrodes Or multiple heat-resistant vias can be used to prevent heat transfer from the surface mount area to the eutectic alloy point.
  • the pin electrodes are provided with guiding and fixing functional areas, surface mount areas and multi-functional areas.
  • the guiding and fixing functional areas are embedded in the cavity to stabilize and ensure the consistency of each surface mount area.
  • the surface mount area is used for surface mount Mounting and welding, the multi-functional area can be used to detect whether the surface mount area is weak or full of tin through CCD and other methods. At the same time, the multi-functional area can also be used as a side welding area, which can be selected for different welding needs.
  • the thermal protection booster device composed of the slider and the elastic member helps the reed electrode to quickly trip and bounce, and the slider slides to block the arc and avoid fire.
  • FIG. 1 is an exploded view of a transient voltage suppressor according to one embodiment of the present disclosure
  • Fig. 2 is a schematic diagram of a thermal protection booster device installed in an inner frame according to an embodiment of the present disclosure
  • FIG. 3 is a schematic perspective view of a thermal protection booster device and a reed electrode according to an embodiment of the present disclosure
  • FIG. 4 is a perspective view of a lead electrode according to an embodiment of the present disclosure.
  • FIG. 5 is a schematic perspective view of a transient voltage suppressor with a housing removed according to an embodiment of the present disclosure
  • FIG. 6 is a perspective view of a cover plate according to one embodiment of the present disclosure.
  • FIG. 7 is a top view and A-A cross-sectional view of a transient voltage suppressor with the housing removed according to an embodiment of the present disclosure
  • Fig. 8 is a partial enlarged view of the cross-sectional view in Fig. 7;
  • FIG. 9 is a perspective view of a transient voltage suppressor according to one embodiment of the present disclosure.
  • FIG. 10 is an exploded view of a transient voltage suppressor according to another embodiment of the present disclosure.
  • Fig. 11 is a schematic diagram of a thermal protection booster device installed in an inner frame according to another embodiment of the present disclosure.
  • FIG. 12 is a schematic diagram of a second TVS chip according to another embodiment of the present disclosure.
  • FIG. 13 is a schematic perspective view of a transient voltage suppressor with a shell removed according to another embodiment of the present disclosure
  • FIG. 14 is a bottom view of a transient voltage suppressor according to another embodiment of the present disclosure.
  • 15 is a schematic diagram of a transient voltage suppressor according to the present disclosure.
  • this embodiment discloses a structure of a thermal protection type transient voltage suppressor, including a housing 11, a first inner frame 12, a first reed electrode 13, a first TVS chip 14, a second TVS chip 15, second reed electrode 16, second inner frame 17, first lead electrode 18, second lead electrode 19, cover plate 20, third lead electrode 21, fourth lead electrode 22, the first A spring 24 , a second spring 25 , a first slider 26 and a second slider 27 .
  • first inner frame 12 is provided with an upwardly opening accommodating groove for accommodating the first TVS chip 14, and the other side of the first inner frame 12 is provided with a downwardly opening half groove for accommodating the first thermal Protect the booster device and the first reed electrode 13, the second inner frame 17 is set opposite to the first inner frame, and one side of the second inner frame is provided with an accommodating groove with an opening downward for accommodating the second TVS chip 15 , the other side of the second inner frame 17 is provided with a half groove with an upward opening for accommodating the second thermal protection booster and the second reed electrode 16 .
  • the first reed electrode 13 includes a first end 131 and a second end 132, the first TVS chip 14 and the first end 131 of the first reed electrode 13 are welded by a fusible alloy to form a first thermal Tripping device: one end of the first spring 24 is against the first inner frame 12, and the other end is built in the first slider 26.
  • the first spring 24 and the first slider 26 constitute a first thermal protection booster device, and the first thermal protection The booster is placed in the notch between the first end 131 and the second end 132 of the first reed electrode 13 .
  • the second reed electrode 16 includes a first end and a second end, and the second TVS chip 15 is welded to the first end of the second reed electrode 16 through a fusible alloy to form a second thermal tripping device.
  • One end of the spring 25 is against the second inner frame 17, and the other end is built in the second slider 27.
  • the second spring 25 and the second slider 27 form a second thermal protection booster, which is placed on the second thermal protection booster.
  • the first thermal protection assisting device and the second thermal protection assisting device are installed symmetrically about the center. There may be 1-2 first springs 24 and 1-2 second springs 25 .
  • the first slider 26 When tripping, the first slider 26 receives the thrust of the first spring 24 to push the first reed electrode 13 to pop up quickly, and the first slider 26 slides and cuts off the arc to avoid fire.
  • the second slider 27 receives the thrust of the second spring 25 to push the second reed electrode 16 to pop up quickly, and the second slider 27 slides and blocks the arc to avoid fire.
  • the first lead electrode 18 of the present disclosure includes a substantially straight main body and a bent portion connected to the main body.
  • the bent portion is provided with a multifunctional area 181 and a multifunctional area in sequence.
  • 181 is perpendicular to the surface mounting area 182 and the guide fixing function area 183 , and a step is formed between the guide fixing function area 183 and the surface mounting area 182 .
  • the second pin electrode 19 is provided with a multifunctional area 191, a surface mount area 192 and a guide fixed function area 193;
  • the third lead electrode 21 is provided with a multifunctional area 211, a surface mount area 212 and a guide The fixed function area 213 ;
  • the fourth pin electrode 22 is provided with a multifunctional area 221 , a surface mount area 222 and a guiding fixed function area 223 .
  • a number of through holes are opened on the pin electrode to prevent heat from being transferred to the eutectic alloy point in the surface mount area.
  • the cover plate 20 is provided with a first cavity 201, a second cavity 202, a third cavity (not visible in the figure) and a fourth cavity (not visible in the figure),
  • the guiding and fixing function area 183 of the first lead electrode 18 is embedded in the first cavity 201 of the cover plate 20; the guiding and fixing function area 193 of the second lead electrode 19 is embedded in the second cavity 202 of the cover plate 20; the third The guiding and fixing functional area 213 of the pin electrode 21 is embedded in the third cavity of the cover plate 20; the guiding and fixing functional area 223 of the fourth pin electrode 22 is embedded in the cavity of the cover plate 20, thereby fixing each pin electrode, and Ensure that the planes of the surface mount areas 182, 192, 212, 222 are consistent.
  • the shell 11 is fastened with the cover plate 20 to form a cavity, and the cavity has holes corresponding to the lead electrodes for the first lead electrode 18, the second lead electrode 19, the third lead electrode 21 and the fourth lead electrode 22. Lead out of the cavity to avoid the circulation of hot air during the reflow soldering process, which will cause the melting and disconnection of the fusible alloy. As shown in FIG. 7 , an air gap of 0.1-1.5 mm is left between the shell 11 and the pin electrodes in the cavity to prevent the heat absorbed by the shell from being directly transferred to the pin electrodes and then to the eutectic alloy solder joints. As shown in FIG.
  • the multifunctional areas 181 , 191 , 211 , 221 and the surface mount areas 182 , 192 , 212 , 222 of the four pin electrodes are all exposed outside the cavity, which is convenient for surface mount soldering.
  • the third lead electrode 21 and the fourth lead electrode 22 are drawn out of the cavity for testing purposes, in another embodiment, the third lead electrode 21 and the fourth lead electrode 22 are not drawn out to the Outside the chamber.
  • the multi-functional areas 181, 191, 211, 221 can be used to detect whether the surface mount areas 182, 192, 212, 222 are soldered or have too much tin by means of CCD; at the same time, they can also be used as side soldering areas for different soldering Demand selection.
  • One or several through holes are opened on the pin electrode to prevent the transfer of heat to the eutectic alloy point in the surface mounting area.
  • the first lead electrode 18 , the second lead electrode 19 , the third lead electrode 21 and the fourth lead electrode 22 are flat, with a cross-sectional area of 0.1 mm 2 -5 mm 2 , The welding area is 1mm2-75mm2 ; the thickness of the electrode is 0.2-1.5mm.
  • the first lead electrode 18 , the second lead electrode 19 , the third lead electrode 21 and the fourth lead electrode 22 are mutually different structures.
  • the first pin electrode 18 and the second pin electrode 19 may have the same structure or different structures; the third pin electrode 21 and the fourth pin electrode 22 may have the same structure or are different structures.
  • the first pin electrode 18 , the second pin electrode 19 , the third pin electrode 21 and the fourth pin electrode 22 may have the same structure.
  • this embodiment discloses another structure of a thermal protection type transient voltage suppressor, and the similarities with Embodiment 1 will not be repeated here. 10-11, the first inner frame 12 of this embodiment is provided with a first buckle 121, and the second inner frame 17 is provided with a second buckle 171. When installed, the first buckle 121 and the second inner frame 17 The notches on the first inner frame 12 are engaged with each other, and the second buckle 171 is engaged with the notches on the first inner frame 12 .
  • the first inner frame and the second inner frame adopt the same structure, taking the second inner frame shown in the figure as an example, the second inner frame is provided with a recess 172, and the first reed electrode 13 is added For the pop-up space, correspondingly, the first inner frame is also provided with a recess to increase the space for the second reed electrode 16 to pop up.
  • the first reed electrode and the second reed electrode adopt the same structure. Taking the second reed electrode 16 shown in the figure as an example, the second reed electrode 16 is provided with a reed buckle 162 and a second inner Frame 17 is fixed, prevents reed from running up and down, left and right.
  • the first thermal protection assisting device and the second thermal protection assisting device have adopted the same structure, taking the second thermal protection assisting device shown in Figure 11 as an example, the spring 25 of the second thermal protection assisting device is an extension spring, with Respectively hook the protruding post on the slider and the boss of the second inner frame 17, similarly, the spring 24 of the first thermal protection boosting device is also a tension spring.
  • the first TVS chip 14 and the second TVS chip 15 adopt the same structure.
  • the electrode can be one piece, or it can be formed by connecting multiple pieces.
  • the slot width of the notch is 0.3 mm.
  • the groove width of the notch is 10mm.
  • the cover plate 20 is further provided with a limiting block 203 for limiting the inner frame.
  • the first inner frame 12 is also provided with a limiting protrusion 122, which is used for interlocking and limiting the first inner frame 12 and the second inner frame 17.
  • the second inner frame 17 has the same structure as the first inner frame 12, and will not be repeated here. .
  • the third lead electrode 21 and the fourth lead electrode 22 are located outside the extension line of the outer edge of the first lead electrode 18 and the second lead electrode 19, and the outer edge of the first lead electrode 18 is connected to the second lead electrode.
  • a gap D is formed between the inner edges of the four-pin electrodes 22, and a gap D is formed between the outer edges of the second lead electrodes 19 and the inner edges of the third lead electrodes 21.
  • the gap D can be greater than zero, preferably 0.5mm ⁇ 30mm.
  • the first pin electrode 18, the second pin electrode 19, the third pin electrode 21, and the fourth pin electrode 22 all have corresponding pad positions. If you rotate the product 180 degrees to place the product for welding, you can immediately identify the position If it is placed incorrectly (it cannot be soldered at this time, and there is no conduction), it will play a fool-proof role.

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Abstract

本公开提供一种热保护型的瞬态电压抑制器，包括外壳、盖板、TVS组件和引脚电极，所述外壳与盖板扣合形成容腔，所述容腔内容纳有TVS组件及引脚电极；所述TVS组件包括内框架以及容纳在内框架中的TVS芯片；引脚电极伸出容腔外部并在伸出的部分设有表面贴装区域，用于表面贴装焊接。本公开的有益效果在于提升了热保护的启动速度，并且提供一种表面贴装焊接方式，以及外壳、引脚的阻热设计，使低温焊点不受回流焊高温区的影响。

Description

一种热保护型的瞬态电压抑制器
相关申请的交叉引用
本公开要求在2021年08月31日提交中国专利局、申请号为202122084102.4、名称为“一种热保护型的瞬态电压抑制器”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及过电压保护技术领域，尤其涉及一种热保护型的瞬态电压抑制器。
背景技术
瞬态电压抑制器(Transient Voltage Suppressor)简称TVS，是一种过电压保护装置，其主要用于泄放浪涌电流和准确钳制电压。
现有的热保护瞬态电压抑制器在失效状态下的热保护的启动速度不够快，尤其分断能力要求较高，比如电流达到150A，时常导致热保护过程产生电弧，严重者可能造成产品起火，损伤设备。目前市面上常见的是单一的板载焊接方式，引脚电极插入PCB焊接，不能与贴片器件一同通过回流焊完成焊接，需要进行二次波峰焊焊接，影响客户的生产效率。此外，由于热保护的易熔合金的熔点通常在140-220℃，远低于回流焊高温段260-280℃的温度，容易在焊接过程中导致产品失效。
概述
鉴于现有技术的上述不足，本申请为瞬态电压抑制器增加设置了一种热保护助力装置，意在提升热保护的启动速度，并且提供一种表面贴装焊接方式，以及外壳、引脚的阻热设计使低温焊点不受回流焊高温区的影响。
为了实现上述目的，本公开采用以下技术方案：
一种热保护型的瞬态电压抑制器，包括外壳、盖板、TVS组件和引脚电极，所述外壳与盖板扣合形成容腔，所述容腔内容纳有TVS组件及引脚电极；所述TVS组件包括内框架以及容纳在内框架中的TVS芯片；引脚电极伸出容腔外部并在伸出的部分设有表面贴装区域，用于表面贴装焊接。
可选地，所述引脚电极包括直板状的主体部以及与主体部相连接的折弯部，所述折弯部依次包括多功能区域、与多功能区域相垂直的表面贴装区域和导向固定功能区域，导向固定功能区域与表面贴装区域之间形成台阶。
可选地，所述外壳与盖板上开设有对应引脚电极的孔洞，引脚电极的折弯部从所述孔洞伸出容腔，多功能区域、表面贴装区域和导向固定功能区域暴露在容腔外。
可选地，所述盖板上设有对应引脚电极的型腔，所述引脚电极的导向固定功能区域嵌入所述盖板的型腔内。
可选地，所述引脚电极上设有至少一个阻热通孔。
可选地，外壳与容腔内的引脚电极的主体部之间留有0.1-1.5mm的空气间隙。
可选地，引脚电极的横截面积为0.1mm 2～5mm 2，表面贴装部的焊接面积为1mm 2～75mm 2，引脚电极的厚度为0.2-1.5mm。
可选地，所述TVS组件还包括簧片电极和热保护助力装置，所述簧片电极设有凹口，热保护助力装置设置在簧片电极的凹口中，其中热保护助力装置包括滑块和弹性件，所述弹性件一端与内框架连接，另一端与滑块连接，滑块受到弹性件的弹性力作用，使簧片电极快速脱扣弹起。
可选地，所述弹性件为压簧，所述压簧的一端抵靠在内框架上，所述滑块设有孔，用于容纳所述压簧的另一端，滑块受到压簧的推力，推动簧片电极快速脱扣弹起。
可选地，所述弹性件为拉簧，所述滑块上设有凸柱，所述内框架上设有凸台，所述拉簧一端勾在滑块的凸柱上，另一端勾在内框架的凸台上，滑块收到拉簧的拉力，使簧片电极快速脱扣弹起。
可选地，所述引脚电极包括第一引脚电极、第二引脚电极、第三引脚电极和第四引脚电极，所述第一引脚电极和第四引脚电极的外边缘对齐，所述第二引脚电极和第三引脚电极的外边缘对齐。
可选地，所述引脚电极包括第一引脚电极、第二引脚电极、第三引脚电极和第四引脚电极，所述第一引脚电极的外边缘的延长线与第四引脚电极的内边缘的延长线之间存在间隙，所述第二引脚电极的外边缘的延长线与第三引脚电极的内边缘的延长线之间存在间隙。
本公开的有益效果在于：外壳与盖板形成容腔，仅留孔洞让引脚电极穿过，避免在回流焊接过程中的热空气流通引发易熔合金的融化断开；引脚电极上的一个或多个阻热通孔可以用于阻止表面贴装区域的热量向易熔合金点传递。外壳与容腔内的引脚电极间留有0.1-1.5mm空气间隙，避免外壳吸收的热量直接传递到易熔合金焊点。引脚电极设有导向固定功能区域、表面贴装区域和多功能区域，导向固定功能区域嵌入型腔中从而稳固及确保各个表面贴装区域各平面的一致性，表面贴装区域用于表面贴装焊接，多功能区域可便于通过CCD等方式检测表面贴装区域是否虚焊或多锡，同时多功能区域还可作为侧边焊接区域功能，可供不同焊接需求选择。滑块与弹性件构成的热保护助力装置有助于簧片电极快速脱扣弹起并且滑块滑动遮断电弧，避免产生起火。
附图简述
图1为根据本公开一个实施例的瞬态电压抑制器的爆炸视图；
图2为根据本公开一个实施例的热保护助力装置安装在内框架里的示意图；
图3为根据本公开一个实施例的热保护助力装置及簧片电极的立体示意图；
图4为根据本公开一个实施例的一个引脚电极的立体图；
图5为根据本公开一个实施例移除外壳的瞬态电压抑制器的立体示意图；
图6为根据本公开一个实施的盖板的立体图；
图7为根据本公开一个实施例的移除外壳的瞬态电压抑制器的俯视图及其A-A剖视图；
图8为图7中剖视图的局部放大图；
图9为根据本公开一个实施例的瞬态电压抑制器的立体图；
图10为根据本公开另一个实施例的瞬态电压抑制器的爆炸视图；
图11为根据本公开另一个实施例的热保护助力装置安装在内框架里的示意图；
图12为根据本公开另一个实施例的第二TVS芯片的示意图；
图13为根据本公开另一个实施例移除外壳的瞬态电压抑制器的立体示意图；
图14为根据本公开另一个实施例的瞬态电压抑制器的底面视图；
图15为根据本公开的瞬态电压抑制器的原理图。
11      外壳
12      第一内框架
121     第一卡扣
122     限位凸起
13      第一簧片电极
131     第一端
132     第二端
14      第一TVS芯片
15      第二TVS芯片
151     第一电极
152     第二电极
153     缺口
16      第二簧片电极
161     簧片卡扣
17      第二内框架
171     第二卡扣
172     凹陷
18      第一引脚电极
181     第一引脚电极的多功能区域
182     第一引脚电极的表面贴装区域
183     第一引脚电极的导向固定功能区域
19      第二引脚电极
191     第二引脚电极的多功能区域
192     第二引脚电极的表面贴装区域
193     第二引脚电极的导向固定功能区域
20      盖板
201     第一型腔
202     第二型腔
203     限位块
21      第三引脚电极
211     第三引脚电极的多功能区域
212     第三引脚电极的表面贴装区域
213     第三引脚电极的导向固定功能区域
22      第四引脚电极
221     第四引脚电极的多功能区域
222     第四引脚电极的表面贴装区域
223     第四引脚电极的导向固定功能区域
24      第一弹簧
25      第二弹簧
26      第一滑块
27      第二滑块
详细描述
为了能够更清楚地理解本公开的上述目的、特征和优点，下面结合附图和具体实施方式对本公开进行详细描述。需要说明的是，在不冲突的情况下，本公开的实施方式及实施方式中的特征可以相互组合。在下面的描述中阐述了很多具体细节以便于充分理解本公开，所描述的实施方式仅仅是本公开一部分实施方式，而不是全部的实施方式。基于本公开中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本公开保护的范围。
实施例一
如图1所示，本实施例公开了一种热保护型的瞬态电压抑制器的结构，包括外壳11、第一内框架12、第一簧片电极13、第一TVS芯片14、第二TVS芯片15、第二簧片电极16、第二内框架17、第一引脚电极18、第二引脚电极19、盖板20、第三引脚电极21、第四引脚电极22、第一弹簧24、第二弹簧25、第一滑块26和第二滑块27。第一内框架12的一侧设有开口向上的容置槽，用于容纳第一TVS芯片14，第一内框架12的另一侧设有开口向下的半槽，用于容纳第一热保护助力装置及第一簧片电极13，第二内框架17与第一内框架反向设置，第二内框架的一侧设有开口向下的容置槽，用于容纳第二TVS芯片15，第二内框架17的另一侧设有开口向上的半槽，用于容纳第二热保护助力装置及第二簧片电极16。
参见图2-3，第一簧片电极13包括第一端131和第二端132，第一TVS芯片14和第一簧片电极13的第一端131通过易熔合金焊接，形成第一热脱扣装置；第一弹簧24一端抵靠第一内框架12，另一端内置于第一滑块26中，第一弹簧24与第一滑块26构成第一热保护助力装置，第一热保护助力装置置于第一簧片电极13的第一端131与第二端132之间的凹口中。同样地，第二簧片电极16包括第一端和第二端，第二TVS芯片15与第二簧片电极16的第一端通过易熔合金焊接，形成第二热脱扣装置，第二弹簧25一端抵靠第二内框架17，另一端内置于第二滑块27中，第二弹簧25与第二滑块27构成第二热保护助力装置，第 二热保护助力装置置于第二簧片电极16的第一端与第二端之间的凹口中；第一热保护助力装置与所述第二热保护助力装置呈中心对称安装。第一弹簧24可以是1～2个，第二弹簧25可以是1～2个。在脱扣时，第一滑块26接收到第一弹簧24的推力，推动第一簧片电极13快速脱扣弹起，第一滑块26滑动并遮断电弧，避免起火现象产生。同理，在脱扣时，第二滑块27接收到第二弹簧25的推力，推动第二簧片电极16快速脱扣弹起，第二滑块27滑动并遮断电弧，避免起火现象产生。
如图4-9所示，本公开的第一引脚电极18包括大体直板状的主体部和与主体部相连接的折弯部，折弯部依次设有多功能区域181、与多功能区域181相垂直的表面贴装区域182和导向固定功能区域183，导向固定功能区域183与表面贴装区域182之间形成台阶。同样地，第二引脚电极19上设置有多功能区域191，表面贴装区域192和导向固定功能区域193；第三引脚电极21上设置有多功能区域211，表面贴装区域212和导向固定功能区域213；第四引脚电极22上设置有多功能区域221，表面贴装区域222和导向固定功能区域223。引脚电极上开有若干通孔，用于阻止表面贴装区域的热量相易熔合金点传递。
与四个引脚电极相对应地，盖板20上设有第一型腔201、第二型腔202、第三型腔(图中不可见)和第四型腔(图中不可见)，第一引脚电极18的导向固定功能区域183嵌入盖板20的第一型腔201内；第二引脚电极19的导向固定功能区域193嵌入盖板20的第二型腔202内；第三引脚电极21的导向固定功能区域213嵌入盖板20的第三型腔内；第四引脚电极22的导向固定功能区域223嵌入盖板20的型腔内，从而固定各个引脚电极，并确保表面贴装区域182、192、212、222各平面的一致性。外壳11与盖板20扣合形成容腔，容腔留有对应引脚电极的孔洞供第一引脚电极18、第二引脚电极19、第三引脚电极21和第四引脚电极22引出到容腔外，避免在回流焊接过程中的热空气流通，引发易熔合金的融化断开。如图7所示，外壳11与容腔内的引脚电极间留有0.1-1.5mm的空气间隙，避免外壳吸收的热量直接传递到引脚电极再传递到易熔合金焊点。如图9 所示，四个引脚电极的多功能区域181、191、211、221、表面贴装区域182、192、212、222均暴露在容腔外，便于表面贴装焊接。其中第三引脚电极21和第四引脚电极22引出到容腔外是供测试用的，在另外的实施例中，第三引脚电极21和第四引脚电极22根据需求不引出到容腔外。多功能区域181、191、211、221可便于通过CCD等方式检测表面贴装区域182、192、212、222是否虚焊或多锡；同时，还可作为侧边焊接区域功能，可供不同焊接需求选择。在引脚电极上开有一个或数个通孔，用于阻止表面贴装区域的热量相易熔合金点传递。
在优选的实施例中，第一引脚电极18、第二引脚电极19、第三引脚电极21和第四引脚电极22为扁平状，其横截面积为0.1mm 2～5mm 2，焊接面积为1mm2～75mm 2；电极的厚度为0.2-1.5mm。本实施例中，第一引脚电极18、第二引脚电极19、第三引脚电极21和第四引脚电极22是互为不同的结构。在另外的实施例中，第一引脚电极18和第二引脚电极19可以是相同结构也可以是不同结构；第三引脚电极21和第四引脚电极22可以是相同结构，也可以是不同结构。在另外的实施例中，第一引脚电极18，第二引脚电极19，第三引脚电极21和第四引脚电极22可以是相同结构。
实施例二
如图10所示，本实施例公开了另一种热保护型的瞬态电压抑制器的结构，与实施例一相同之处不再赘述。参见图10-图11，本实施例的第一内框架12设有第一卡扣121，第二内框架17设有第二卡扣171，安装时第一卡扣121与第二内框架17上的槽口相扣合，第二卡扣171与第一内框架12上的槽口相扣合。在本实施例中，第一内框架和第二内框架采用相同的结构，以图中示出的第二内框架为例，第二内框架上设有凹陷172，增加第一簧片电极13弹起的空间，相应地，第一内框架上同样设有凹陷，增加第二簧片电极16弹起的空间。第一簧片电极和第二簧片电极采用了相同的结构，以图中示出的第二簧片电极16为例，第二簧片电极16上设有簧片卡扣162与第二内框架17固定，防止簧片上下左右跑位。第一热保护助力装置与第二热保护助力装置采用了相同的结构，以图11中示出 的第二热保护助力装置为例，第二热保护助力装置的弹簧25为拉簧，两端分别勾住滑块上的凸柱和第二内框架17的凸台，同样地，第一热保护助力装置的弹簧24也为拉簧。
第一TVS芯片14和第二TVS芯片15采用相同的结构，参见图12，以示出的第二TVS芯片为例说明：第二TVS芯片15包括第一电极151和第二电极152，第一电极可以是一件一体式的，也可以是多件通过连接而成。第一电极151上有一凸台，凸台上设有缺口153，缺口153用于降低热应力的聚集。在其他实施例中，可以没有缺口。在其他实施例中，可选地，有1～8个缺口。在本实施例中，缺口的槽宽为0.3mm。在另外的实施例中，缺口的槽宽为10mm。第一TVS芯片的结构不再赘述。
参见图13，盖板20还设有限位块203，用于对内框架进行限位。第一内框架12还设有限位凸起122，用于第一内框架12与第二内框架17互卡限位，第二内框架17与第一内框架12结构相同，在此不再赘述。
参见图14，第三引脚电极21和第四引脚电极22位于第一引脚电极18和第二引脚电极19外边缘的延长线之外，第一引脚电极18的外边缘与第四引脚电极22的内边缘之间形成间隙D，第二引脚电极19的外边缘与第三引脚电极21的内边缘之间形成间隙D，间隙D大于零即可，优选在0.5mm～30mm之间。第一引脚电极18、第二引脚电极19、第三引脚电极21和第四引脚电极22客户端均有对应的焊盘位置，如果旋转180度放置产品焊接，可以立刻识别出位置放置错误(此时焊接不上，不导通)，起到防呆作用。
以上所述，仅是本公开的较佳实施例而已，并非对本公开作任何形式上的限制，故凡是未脱离本公开技术方案内容，依据本公开的技术实质对以上实施例所作的任何修改、等同变化与修饰,均仍属于本公开技术方案的范围内。

Claims (10)

  1. 一种热保护型的瞬态电压抑制器，包括外壳、盖板、TVS组件和引脚电极，所述外壳与盖板扣合形成容腔，所述容腔内容纳有TVS组件及引脚电极；所述TVS组件包括内框架以及容纳在内框架中的TVS芯片；引脚电极伸出容腔外部并在伸出的部分设有表面贴装区域，用于表面贴装焊接。
  2. 根据权利要求1所述的瞬态电压抑制器，其特征在于，所述引脚电极包括直板状的主体部以及与主体部相连接的折弯部，所述折弯部依次包括多功能区域、与多功能区域相垂直的表面贴装区域和导向固定功能区域，导向固定功能区域与表面贴装区域之间形成台阶。
  3. 根据权利要求2所述的瞬态电压抑制器，其特征在于，所述外壳与盖板上开设有对应引脚电极的孔洞，引脚电极的折弯部从所述孔洞伸出容腔，多功能区域、表面贴装区域和导向固定功能区域暴露在容腔外。
  4. 根据权利要求2或3所述的瞬态电压抑制器，其特征在于，所述盖板上设有对应引脚电极的型腔，所述引脚电极的导向固定功能区域嵌入所述盖板的型腔内。
  5. 根据权利要求1所述的瞬态电压抑制器，其特征在于，所述引脚电极上设有至少一个阻热通孔。
  6. 根据权利要求1所述的瞬态电压抑制器，其特征在于，外壳与容腔内的引脚电极的主体部之间留有0.1-1.5mm的空气间隙。
  7. 根据权利要求1或6所述的瞬态电压抑制器，其特征在于，引脚电极的横截面积为0.1mm 2～5mm 2，表面贴装部的焊接面积为1mm 2～75mm 2，引脚电极的厚度为0.2-1.5mm。
  8. 根据权利要求1所述的瞬态电压抑制器，其特征在于，所述TVS组件还包括簧片电极和热保护助力装置，所述簧片电极设有凹口，热保护助力装置设置在簧片电极的凹口中，其中热保护助力装置包括滑块和弹性件，所述弹性件一端与内框架连接，另一端与滑块连接，滑块受到弹性件的弹性力作用，使簧片电极 快速脱扣弹起。
  9. 根据权利要求1所述的瞬态电压抑制器，其特征在于，所述引脚电极包括第一引脚电极、第二引脚电极、第三引脚电极和第四引脚电极，所述第一引脚电极和第四引脚电极的外边缘对齐，所述第二引脚电极和第三引脚电极的外边缘对齐。
  10. 根据权利要求1所述的瞬态电压抑制器，其特征在于，所述引脚电极包括第一引脚电极、第二引脚电极、第三引脚电极和第四引脚电极，所述第一引脚电极的外边缘的延长线与第四引脚电极的内边缘的延长线之间存在间隙，所述第二引脚电极的外边缘的延长线与第三引脚电极的内边缘的延长线之间存在间隙。
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