WO2023027661A1 - Dissipateur thermique composite hybride de nouvelle génération ayant une forme de mousse métallique monolithique - Google Patents

Dissipateur thermique composite hybride de nouvelle génération ayant une forme de mousse métallique monolithique Download PDF

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Publication number
WO2023027661A1
WO2023027661A1 PCT/TR2022/050678 TR2022050678W WO2023027661A1 WO 2023027661 A1 WO2023027661 A1 WO 2023027661A1 TR 2022050678 W TR2022050678 W TR 2022050678W WO 2023027661 A1 WO2023027661 A1 WO 2023027661A1
Authority
WO
WIPO (PCT)
Prior art keywords
range
graphene
heat sink
copper
fin
Prior art date
Application number
PCT/TR2022/050678
Other languages
English (en)
Inventor
Mevlut GURBUZ
Bilal SUNGUR
Original Assignee
Ondokuz Mayis Universitesi Rektorlugu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from TR2021/013440 external-priority patent/TR2021013440A1/tr
Application filed by Ondokuz Mayis Universitesi Rektorlugu filed Critical Ondokuz Mayis Universitesi Rektorlugu
Publication of WO2023027661A1 publication Critical patent/WO2023027661A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials

Definitions

  • the present invention relates to a monolithic heat sink with fins in the form of hybrid composite foam and comprising aluminum alloy (encompassing all alloys from 1XXX- 9XXX), graphene, and copper together.
  • the present invention can be used as a heat sink in many areas such as led chips for electronic devices, electronic packaging systems, electronic coolers, and thermoelectric systems.
  • Heat sinks which are the subject of the invention, are used in electronic systems required in defense industry, aviation, automotive, telecommunication, computer technologies and biomedical devices.
  • liquid heat sinks are used in these systems, as in a study by Lu et al., systems have high liquid-solid interface area and relatively high heat transfer, but have disadvantages such as liquid infiltration, high pumping power requirement [1 ], in the study of Hsieh et al., on the other hand, the rate of heat removal is low in air convective cooling [2], and when phase change materials are used, it causes low thermal conductivity, which prolongs the energy charge/discharge periods under isothermal environment.
  • the flat graphite particles are stacked by using the graphene aggregates as a binder so that the basal surfaces of the graphite particles are overlapped with one another, and the graphene aggregates comprise deposits of monolayer or multilayer graphene.
  • the material described here has no application on the heat sink.
  • EP3530618A1 the dispersion effect occurs since the composite produced by stacking graphene graphite structures on top of each other is printed in powder form. Also, this material is likely to heat up fast and cool down quickly.
  • the present invention relates to a monolithic heat sink with fins in the form of hybrid composite foam and comprising aluminum alloy (encompassing all alloys from 1XXX- 9XXX), graphene, and copper together.
  • the first object of the present invention is to increase the interactive surface area of the porous structures inside the fins, and thereby increasing the convective heat transfer and performance by means of the fact that the heat sink has fins in the form of foam and said heat sink is produced as monolithic.
  • Another object of the present invention is to increase the convection and thermal conductivity by means of being a hybrid form comprising graphene and copper together.
  • the thermal conductivity of graphene and copper (graphene: >4000 W/mK, copper: 400 W/mK) is quite high, and both increase the conductive heat transfer.
  • graphene and copper are made into a high-density base for fast and efficient heat transfer, and the heat conduction increases due to both the distribution and the dense form of the product according to the present invention.
  • Another object of the present invention is to increase the heat transfer even more by using the cylindrical and plate form in the structure, other than the powder form of graphene and copper.
  • Another object of the present invention is to adjust the pore sizes at the desired levels by means of the use of hybrid form foams in the heat sinks, and thus eliminating the disadvantages in the prior art such that too high or low pore size causes flow and thermal resistance problems, heat transfer problems, and therefore efficiency losses; thereby increasing the cooling efficiency.
  • Another object of the present invention is to provide convenience in use in miniaturized electronic devices by means of the monolithic production of the heat sink.
  • the fins are combined with adhesion technology, however, this reduces the performance since it causes thermal resistance.
  • the problem of thermal resistance and performance degradation is also prevented by means of the monolithic foam produced with the present invention.
  • Monolithic heat sinks with fins in the form of hybrid composite foam comprising the graphene-copper structure together, which is the subject of the invention, have higher thermal conductivity (>250 W/mK), higher heat removal and cooling capacity compared to prior art.
  • heat sinks in the form of hybrid composite that comprise graphene-copper, that have fins in the form of monolithic foam independent of pore size, and fin gaps of which can be controlled, are produced without requiring noncomposite foam additives for heat sinks with fins. Fin gaps are produced at the desired range during production.
  • NaCI (salt) spherical spacer or titanium hydride is used in the present invention to obtain pores.
  • these salt granules which are 1 -5 mm in size, are dry grinded in the mill, and they can be turned to the desired size due to friction, or they can be used by purchasing the desired size of salt in the market.
  • the composite produced by stacking graphene graphite structures on top of each other creates a dispersion effect since it is printed in powder form, while the fact that the invention is a monolithic product and graphene and copper are used in dense form and in bulk form, minimizes the losses due to the dispersion.
  • the prior art employs rapid heating and cooling, the performance of the heat sink is increased by means of the controlled heating and cooling in the present invention.
  • Heat sinks that are produced as monolithic, having high thermal conductivity, high heat absorption and cooling capacity, high heat transfer and performance, that works with high efficiency, fin gaps of which can be controlled are provided by means of the present invention.
  • Figure 1 illustrates a hybrid composite heat sink in the form of monolithic metal foam.
  • Dense cell wall a diameter of copper in cylindrical form b: width of graphene in plate form k: length of graphene in plate form
  • the present invention relates to a monolithic heat sink with fins in the form of hybrid composite foam and comprising aluminum alloy (encompassing all alloys from 1XXX- 9XXX), graphene, and copper together.
  • Heat sink comprising aluminum alloys, graphene, and copper structure (encompassing all alloys between 1XXX-9XXX) that is the subject of the present invention comprises two layers as dense layer and porous layer.
  • the aluminum alloy is randomly mixed with graphene and copper in the dense base microstructure (2).
  • the first layer of the product that is the subject of the invention is in dense form (density between 90-100%), and dense base width (13) and dense base length (14) are in the range of 20-200 mm, and dense base height (8) is in the range of 2-15 mm.
  • the size of the dense base (1 ) should be suitable for the area to be cooled. It is aimed that the heat transfer by conduction is high in the dense base (1 ) and thus, the heat transfer is increased. Therefore, a preference is made with a density of 90-100%. By means of the high density in the dense base (1 ), the heat transmission of the heat sink of the present invention increases.
  • the dense base (1 ) is in the form of a hybrid composite comprising aluminum alloy-copper-graphene together.
  • the dense base microstructure (2) comprises copper in cylindrical form (3) and graphene in plate form (4).
  • copper and graphene are used in powder form, since the particle size is very small, heat conduction is reduced due to the dispersion effect, and in addition, the small size causes thermal losses in the transfer to the other grain.
  • the heat transfer is continuous, and the negativities caused by the dispersion effect are minimized. Heat transfer is increased by using the plate form of graphene and the cylindrical form of copper in the structure.
  • the length (I) of copper in cylindrical form is in the range of 10 pm -10 mm, and the diameter (a) of copper in cylindrical form is in the range of 10 pm - 5 mm.
  • the change and increase in size enhance the efficiency in terms of conducting heat transfer in large-sized products and applications.
  • the use of copper in cylindrical form instead of powder has a positive effect on heat conduction.
  • the thickness (t) of graphene in plate form may be in the range of 5 nm - 5 mm
  • the length of graphene in plate form (k) may be in the range of 10 pm - 15 mm
  • the width (b) of graphene in plate form may be in the range of 10 pm - 15 mm, i.e., in different proportions depending on the desired size.
  • the maximum dimensions that can be included in the composite structure are given.
  • the change and increase in size enhance the efficiency in terms of conducting heat transfer in large-sized products and applications.
  • the increase in the size of graphene plates provides a great advantage due to the high thermal conductivity of graphene.
  • the second layer of the product that is the subject of the present invention is in foam form (7), wherein it comprises foamed fins (5) comprising aluminum alloy-copper- graphene together with porosity varying between 50-90%.
  • the reason why the porosity is given in this range is that the product to be produced here is desired to have different thermal properties in different applications. To control this, the amount of pore should be changed. Therefore, foamed fins (5) with porosity varying between 50-90% are produced.
  • Fin height (9) can be produced in the range of 10-100 mm
  • the fin length (10) can be produced in the range of 20-200 mm
  • the fin width (11 ) can be produced in the range of 1 -20 mm. An optimum size should be found when determining the fin dimensions.
  • Increasing the fin height and length is positive in terms of conduction transfer, but it does not contribute to heat transfer after a certain height.
  • Increasing the fin width increases the transfer by convection. However, this effect also disappears after a certain size.
  • the number of foamed fins (5) can be produced between 1-30 pieces.
  • the fin microstructure (6) is in foam form (7), and the pore size can be produced in the range of 10 pm - 5 mm. A pore size that is too small will increase the conduction transfer but decrease the convective transfer. It will also cause pressure losses.
  • the cell wall comprises aluminum alloy, cylindrical copper (3) and graphene in plate form (4), with a similar microstructure and composition to the dense base (1 ).
  • the main material of the fin namely its matrix, is aluminum alloy. These alloy fins are in the form of hybrid foamed composite comprising copper-graphene reinforcement together. Copper and graphene are the reinforcing elements here and are included as composite builders in the aluminum alloy, which is the main matrix.
  • the length (I) of copper in cylindrical form is between 10 pm - 10 mm, and the diameter (a) of copper in cylindrical form is between 10 pm - 5 mm.
  • the thickness (t) of graphene in plate form may be in the range of 5 nm - 5 mm
  • the length of graphene in plate form (k) may be in the range of 10 pm - 15 mm
  • the width (b) of graphene in plate form may be in the range of 10 pm - 15 mm, i.e. in different proportions depending on the desired size.
  • the distance between the fins (12) can be produced in the range of 0-20 mm.
  • the production method of the product that is the subject of the present invention is used with casting method and powder metallurgy methods.
  • powder metallurgy method Aluminum alloy powders in powder form, graphene plate, and cylindrical copper are fed in the mold for the production of dense base (1 ); then Organic (polystyrene ball, urea, etc.) and inorganic (NaCI) aluminum alloy powder comprising spacer is fed and a load of 100-1000 MPa is applied under the press, depending on the alloy type, and it is shaped as raw in desired dimensions according to the dense base height (8), fin height (9), fin length (10), dense base width (13) and dense base length (14).
  • the shaped monolithic blocks are shielded in vacuum and argon atmosphere between 400-660°C for 1 -10 hours.
  • foam is formed since the organics are removed with temperature
  • salt the outer part is sanded after sintering and the salt is removed by boiling a solid block in boiling water.
  • the bottom part is a dense base (1 ) and the upper part, the foamed fin (5), is produced in the form of a monolithic hybrid composite in the form of foam. Fins in the dimensions mentioned above are produced by wire cutting method.
  • space-forming and foaming materials such as salt and titanium hydride are used.
  • alloys given above are melted at 850°C in an inert argon atmosphere, then, graphene (4) in plate form and copper (3) additive in cylindrical form are added to the melt in the proportions and dimensions given above, according to the desired dimensions.
  • Titanium hydride or NaCI is added after homogeneous mixing by means of a mixer.
  • titanium hydride addition after melting and adding composite builder, the temperature is lowered to 450-600°C depending on the type of alloy, and titanium hydride is added and mixed with a mixer.
  • the alloys given above will be melted at 850°C in an inert argon atmosphere, then graphene and cylindrical copper additive in plate form will be added to the melt in the ratios and dimensions given above. Then, the temperature will be reduced to between 500-800°C depending on the alloy type and NaCI will be added. At these temperatures, after homogeneous mixing with the mixer, it will be kept in the oven for 1 -30 minutes, and due to the precipitation of the metal, the dense part will form, and the part comprising NaCI will form on this part. Thus, a monolithic block with a dense lower part and NaCI on the upper part will be produced. This block will be processed by grinding and sanding.
  • the processed monolithic block will be boiled in boiling water and the salt in the upper layer will be removed, and a monolithic block with a dense lower part and foam upper part will be produced.
  • This block will be retreated with wire cutting and the fins in the desired dimensions given above will be formed by wire cutting.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

La présente invention concerne un dissipateur thermique monolithique avec des ailettes sous la forme d'une mousse composite hybride et comprenant un alliage d'aluminium (englobant tous les alliages de 1XXX -9XXX), de graphène et de cuivre ensemble. La présente invention peut être utilisée en tant que dissipateur thermique dans de nombreuses zones telles que des puces à diodes électroluminescentes pour des dispositifs électroniques, des systèmes d'encapsulation électroniques, des refroidisseurs électroniques et des systèmes thermoélectriques. Les dissipateurs thermiques, qui font l'objet de l'invention, sont utilisés dans des systèmes électroniques requis dans l'industrie de la défense, l'aviation, l'automobile, les télécommunications, les technologies informatiques et les dispositifs biomédicaux.
PCT/TR2022/050678 2021-08-25 2022-06-29 Dissipateur thermique composite hybride de nouvelle génération ayant une forme de mousse métallique monolithique WO2023027661A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TR2021013440 2021-08-25
TR2021/013440 TR2021013440A1 (tr) 2021-08-25 Yekpare metal köpük formunda yeni nesil hibrit kompozit yapılı ısı alıcı.

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WO2023027661A1 true WO2023027661A1 (fr) 2023-03-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117337007A (zh) * 2023-11-14 2024-01-02 惠州市福凯科技有限公司 一种石墨烯散热器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3034292A1 (fr) * 2013-08-12 2016-06-22 Seiji Kagawa Film de dissipation de chaleur, et procédé ainsi que dispositif de fabrication de celui-ci
US20170115074A1 (en) * 2015-10-27 2017-04-27 Chang Chun Petrochemical Co., Ltd. Heat-dissipating copper foil and graphene composite
EP3530618A1 (fr) * 2016-10-19 2019-08-28 Incubation Alliance, Inc. Matériau complexe de graphite/graphène, corps de collecte de chaleur, corps de transfert de chaleur, corps de rayonnement thermique et système de rayonnement thermique
WO2020235491A1 (fr) * 2019-05-17 2020-11-26 三菱マテリアル株式会社 Élément de transfert de chaleur composite et procédé de fabrication d'un élément de transfert de chaleur composite

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3034292A1 (fr) * 2013-08-12 2016-06-22 Seiji Kagawa Film de dissipation de chaleur, et procédé ainsi que dispositif de fabrication de celui-ci
US20170115074A1 (en) * 2015-10-27 2017-04-27 Chang Chun Petrochemical Co., Ltd. Heat-dissipating copper foil and graphene composite
EP3530618A1 (fr) * 2016-10-19 2019-08-28 Incubation Alliance, Inc. Matériau complexe de graphite/graphène, corps de collecte de chaleur, corps de transfert de chaleur, corps de rayonnement thermique et système de rayonnement thermique
WO2020235491A1 (fr) * 2019-05-17 2020-11-26 三菱マテリアル株式会社 Élément de transfert de chaleur composite et procédé de fabrication d'un élément de transfert de chaleur composite

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117337007A (zh) * 2023-11-14 2024-01-02 惠州市福凯科技有限公司 一种石墨烯散热器
CN117337007B (zh) * 2023-11-14 2024-04-02 惠州市福凯科技有限公司 一种石墨烯散热器及其制备方法

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