WO2023020682A1 - Caloduc pour composants électroniques et dispositif électronique comprenant un caloduc - Google Patents

Caloduc pour composants électroniques et dispositif électronique comprenant un caloduc Download PDF

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Publication number
WO2023020682A1
WO2023020682A1 PCT/EP2021/072782 EP2021072782W WO2023020682A1 WO 2023020682 A1 WO2023020682 A1 WO 2023020682A1 EP 2021072782 W EP2021072782 W EP 2021072782W WO 2023020682 A1 WO2023020682 A1 WO 2023020682A1
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WO
WIPO (PCT)
Prior art keywords
heat pipe
section
layer
capillary structure
condensation
Prior art date
Application number
PCT/EP2021/072782
Other languages
English (en)
Inventor
Andrii Rassamakin
Xing FU
Original Assignee
Huawei Technologies Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co., Ltd. filed Critical Huawei Technologies Co., Ltd.
Priority to CN202180101565.7A priority Critical patent/CN117836583A/zh
Priority to PCT/EP2021/072782 priority patent/WO2023020682A1/fr
Publication of WO2023020682A1 publication Critical patent/WO2023020682A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/30—Safety or protection arrangements; Arrangements for preventing malfunction for preventing vibrations

Definitions

  • HEAT PIPE FOR ELECTRONIC COMPONENTS AND ELECTRONIC DEVICE COMPRISING HEAT PIPE
  • the present disclosure relates generally to the field of electronic devices and, more specifically, to a heat pipe for electronic components, and an electronic device comprising the heat pipe.
  • a heat-conducting device such as a heat pipe, is used to conduct the heat from the electronic devices (or semiconductor devices) to heat sink fins to provide sufficient cooling to electronic components in the electronic devices, and to eliminate the certain drawbacks associated the highly heat-conducting materials (i.e., copper and aluminium).
  • a heat pipe is a two-phase system that includes an elongate body with a heat transfer element and a working fluid capable of being in a liquid phase and a vapor phase.
  • the working fluid evaporates into the vapor phase) causing an increase in pressure.
  • the vapor phase tends from a high-pressure zone towards a lower pressure zone and a low temperature zone.
  • the vapor phase of the working fluid condenses, and the liquid phase of the working fluid returns through the heat transfer element back under the capillary forces produced by the heat transfer element.
  • an overall rate of heat transfer is dramatically in 2-3 orders higher than the thermal conductivity within a solid body with same dimensions made of copper (Cu) or aluminium (Al).
  • rigid heat pipes are used, which may transmit vibrations or thermal expansions back to an evaporation (or evaporator) zone, which is not safe for the electronic device (or the chip).
  • Such rigid heat pipes are not preferred for electronic devices because installing a cooling system based on the conventional rigid heat pipes can damage a cooling component.
  • a rigid capillary wick is provided as the heat transfer element that usually gets destroyed after several bends.
  • another conventional heat pipe that includes multiple separate parts, which results in an increase in the structural complexity (i.e., complex design).
  • multiple separate parts and connection among the separate parts affects overall reliability (e.g., results in leakage of the working fluid) of heat pipes and increases the overall manufacturing and maintenance cost.
  • multiple separate parts in the conventional heat pipe increases the risk of incompatibility with other heat pipe parts, especially chemical activity with water, and as a result the appearing non-condensable gases that affected to thermal performance. Therefore, there exists technical problems of mechanical stability, low thermal performance, high cost, and complexity associated with the conventional heat pipes.
  • the present disclosure provides a heat pipe for electronic components, and an electronic device comprising the heat pipe.
  • the present disclosure provides a solution to the existing problem of low thermal performance, high cost, and complexity associated with the conventional heat pipes.
  • An objective of the present disclosure is to provide a solution that overcomes at least partially the problems encountered in the prior art and provides an improved heat pipe for electronic components that is flexible and manifest improved thermal and mechanical performance, reduced cost, and lesser complexity.
  • the present disclosure provides a heat pipe for electronic components comprising a hollow structure having an evaporation section, a condensation section, and a flexible transport section formed between the evaporation section and the condensation section, wherein a vapor channel is defined through the sections of the hollow structure, and a capillary structure disposed inside the hollow structure wherein the capillary structure is at least partially in direct contact with inner surfaces of the evaporation section and the condensation section and is freely suspended in the flexible transport section.
  • the heat pipe of the present disclosure has a simple design along with an improved heat transfer efficiency.
  • the hollow structure of the heat pipe provides flexible properties to the heat pipe, and the capillary structure disposed inside the hollow structure provides a good thermal contact in the evaporation section and the condensation section.
  • the capillary structure further allows a free movement of the working fluid through the flexible transport section.
  • the capillary structure is beneficial to provide improved thermal performance to the heat pipe and ensure the flatness requirement of the evaporation section and the condensation section.
  • the flexible transport section is in fluid communication with both the evaporation section and the condensation section.
  • the flexible transport section is used for transportation of the working fluid from the condensation section to the evaporation section.
  • the capillary structure comprises at least two layers of sintered discrete metal fibres.
  • the heat pipe achieves significantly improved thermal properties, flexible properties, along with good anti-G (gravity) abilities.
  • At least two layers of the sintered discrete metal fibres further provide a wide range of structural parameters (e.g., an increase in height and width of the capillary structure) to the heat pipe.
  • a first layer of the capillary structure is disposed on bottom surfaces and a second layer is disposed on upper surfaces of the evaporation section and the condensation section.
  • the first layer and the second layer of the capillary structure act as mechanical support elements, so as to support the flatness requirements of the evaporation section and the condensation section.
  • the second layer is disposed on the top of the first layer by sintering process.
  • the capillary structure of the heat pipe ensures an improved mechanical and thermal contact between the first layer and the second layer.
  • the capillary structure further comprises a third layer disposed perpendicularly between the first layer and the second layer.
  • the third layer provides mechanical strength to the heat pipe.
  • the thickness of the capillary structure is selected from values in the range of 0.001 mm to 10 mm.
  • the heat pipe has a role of a heat link between the electronic components and a heat sink.
  • the thickness of the capillary structure in the given range provides a good balance of high heat transfer and low thermal resistance between the electronic component and the heat sink.
  • the hollow structure is made from a single piece of thermally conductive material in which the evaporation section and the condensation section are configured to be flat, and the flexible transport section is corrugated to provide flexibility.
  • the durability of the heat pipe is increased with a reduced cost.
  • the thermally conductive material is one of copper, steel, silver, or their alloys.
  • the heat pipe manifests an improved thermal conductivity.
  • the working fluid is one of water, ethyl alcohol, methyl alcohol, a refrigerant, or a combination thereof.
  • the heat pipe achieves improved reliability under freezing conditions.
  • the capillary structure is connected to the inner surfaces of the evaporation section and the condensation section by sintering process.
  • the capillary structure of the heat pipe ensures an improved mechanical and thermal contact between the inner surfaces of the evaporation section and the condensation section.
  • the heat pipe is vacuum sealed at both ends.
  • the flexible transport section has improved flexibility performance during folding of the heat pipe, and deformation of the flexible transport section near the vapor channel is smaller.
  • the present disclosure provides an electronic device comprising the heat pipe.
  • the electronic device achieves all the advantages and technical effects of the heat pipe of the present disclosure.
  • FIG. 1A is a perspective external view of a heat pipe for electronic components, in accordance with an embodiment of the present disclosure
  • FIG. IB is an enlarged cross-sectional view of a capillary structure of a heat pipe, in accordance with an embodiment of the present disclosure
  • FIG. 1C is a perspective external view of a heat pipe that represents an interconnection between a first layer, a second layer, and a flexible transport section, in accordance with an embodiment of the present disclosure
  • FIG. ID is an enlarged cross-sectional view of a capillary structure of a heat pipe, in accordance with another embodiment of the present disclosure
  • FIG. IE is an enlarged cross-sectional view of a capillary structure of a heat pipe, in accordance with yet another embodiment of the present disclosure.
  • FIG. 2 is a block diagram of an electronic device in accordance with an embodiment of the present disclosure.
  • an underlined number is employed to represent an item over which the underlined number is positioned or an item to which the underlined number is adjacent.
  • a non-underlined number relates to an item identified by a line linking the nonunderlined number to the item.
  • the non-underlined number is used to identify a general item at which the arrow is pointing.
  • FIG. 1A is a perspective external view of a heat pipe for electronic components, in accordance with an embodiment of the present disclosure.
  • a heat pipe 100A for electronic components that includes a hollow structure 102, an evaporation section 104, a condensation section 106, a flexible transport section 108, a vapor channel 110, and a capillary structure 112.
  • the heat pipe 100A of the present disclosure is implemented as part of a cooling system of the electronic components.
  • the electronic components may be any electronic device that may be foldable, including a laptop, a mobile phone, a computer, a tablet, a camera, and the like.
  • a few heat-generating components such as an arithmetic element (or central processing unit or processor) and an integrated circuit are built in a highly dense manner, due to which a heat spot occurs in which temperature increases locally. Consequently, the increasing temperature becomes a limiting factor for the speed of arithmetic operations, further results in reduced durability of the electronic components or the like.
  • the heat pipe 100A as part of the cooling system for the electronic components provides cooling in of the electronic components.
  • the hollow structure 102 is an outer surface of the heat pipe 100A, which is a closed container (sealed at both ends) and filled with a working fluid.
  • the working fluid flows within the hollow structure 102, such as between the evaporation section 104 and the condensation section 106, and through the vapor channel 110 in the vapor state and the capillary structure 112 in the liquid state in a circulating mode, so that heat transfer is ensured.
  • the vapor channel 110 is provided for transfer of the working fluid in its vapor state between the evaporation section 104 and the condensation section 106.
  • the hollow structure 102 includes the evaporation section 104, the condensation section 106, and the flexible transport section 108 through which the hollow structure 102 is configured to transfer heat due to a combination of different processes, such as evaporation and condensation.
  • the hollow structure 102 (or simply referred to as a container) has a pipe-like shape or any other shape suitable for heat transfer in the electronic components.
  • the evaporation section 104 is a flat part of the hollow structure 102.
  • the evaporation section 104 is also referred to as an evaporation zone, a heat load zone, an evaporator, and the like.
  • the condensation section 106 is also a flat part of the hollow structure 102.
  • the condensation section 106 is also referred to as a condensation zone, a heat dissipation zone, a condenser, and the like.
  • the flexible transport section 108 is a corrugated part of the hollow structure 102 so as to provide flexible properties to the heat pipe 100A.
  • the flexible transport section 108 is formed by bellows, such as based on copper (Cu) bellow made from a whole piece of copper tube.
  • the vapor channel 110 is also referred to as an empty space within the hollow structure 102 suitable for transporting a vapor.
  • the capillary structure 112 is configured for transportation of the working fluid with high capillary pressure.
  • the present disclosure provides a heat pipe 100A for electronic components comprising a hollow structure 102 having an evaporation section 104, a condensation section 106, and a flexible transport section 108 formed between the evaporation section 104 and the condensation section 106, wherein a vapor channel 110 is defined through the sections of the hollow structure 102, and a capillary structure 112 disposed inside the hollow structure 102.
  • the capillary structure 112 is at least partially in direct contact with inner surfaces of the evaporation section 104 and the condensation section 106 and is freely suspended in the flexible transport section 108.
  • heat from a heat source e.g., an electronic component, such as an integrated circuit (IC), which is not shown in FIG.1A
  • a heat source e.g., an electronic component, such as an integrated circuit (IC), which is not shown in FIG.1A
  • the working fluid inside the hollow structure 102 vaporises in the evaporation section 104.
  • the vapor is then transported from the evaporation section 104 to the condensation section 106, through the vapor channel 110 (or space), the flexible transport section 108. Thereafter, the vapor state of the working fluid releases latent heat up in the condensation section 106.
  • the vapor is converted back into a liquid state of the working fluid, which is further transported from the condensation section 106 to the evaporation section 104, and through the capillary structure 112 via capillary action (or forces).
  • the capillary structure 112 disposed inside the hollow structure 102 is at least partially in direct contact with inner surfaces of the evaporation section 104 and the condensation section 106. Therefore, the capillary structure 112 (or a sintered wick structure) is configured to provide good thermal contact with the evaporation section 104, the condensation section 106, and the flexible transport section 108.
  • the evaporation section 104 and the condensation section 106 of the heat pipe 100A includes several layers of the capillary structure 112, which has a good mechanical and thermal contact with the hollow structure 102 in the evaporation section 104 and in the condensation section 106.
  • the capillary structure 112 is freely suspended (i.e., no mechanical contact) inside the flexible transport section 108 of the heat pipe 100A, as further shown and described with reference to FIG. 1C.
  • the capillary structure 112 allows a free movement (i.e., without blocked) of the working fluid through the flexible transport section 108.
  • the capillary structure 112 is based on a stair shape, such as with two layers that are beneficial to provide improved thermal performance of the heat pipe 100A and to ensure flatness requirement (e.g., mechanical task) of the evaporation section 104 and the condensation section 106.
  • the heat pipe 100A has a simple design with an easy production process and an improved heat transfer efficiency.
  • the heat pipe 100A of the present disclosure is bendable and not easily deformed by radial deformation as compared to a conventional heat pipe.
  • the flexible transport section 108 is in fluid communication with both the evaporation section 104 and the condensation section 106.
  • the flexible transport section 108 includes one part, which is in fluid communication with both the evaporation section 104 and the condensation section 106. Therefore, the flexible transport section 108 is beneficial for transportation of the working fluid from the evaporation section 104 to the condensation section 106, and vice versa.
  • the thickness of the capillary structure 112 is selected from values in the range of 0.001 mm to 10 mm.
  • the thickness of the capillary structure 112 in the range of 0.001 mm to 10 mm provides a good balance of high heat transfer and low thermal resistance for the heat pipe 100A.
  • the aforementioned thickness ranges are fabricated using present production technologies and hence, reduces the cost of production of the heat pipe 100A.
  • the hollow structure 102 is made from a single piece of thermally conductive material in which the evaporation section 104 and the condensation section 106 are configured to be flat, and the flexible transport section 108 is corrugated to provide flexibility.
  • the hollow structure 102 is formed from a single piece of thermally conductive material. Therefore, the hollow structure 102 increases the reliability of the heat pipe 100A and avoids the requirement of additional solder places between different sections, such as between a flat section and a corrugated section. For example, the hollow structure 102 avoids an additional solder between the evaporation section 104 and the flexible transport section 108, and between the flexible transport section 108 and the condensation section 106. Additionally, the single piece of metal reduces the overall cost of the heat pipe 100A
  • the thermally conductive material is one of copper, steel, silver, or their alloys.
  • the metal is one of copper, steel, silver, or their alloys, thus the hollow structure 102 ensures a high thermal conductivity for the evaporation section 104, the condensation section 106, and the flexible transport section 108, and provides flexible properties to the heat pipe 100A.
  • the heat pipe 100A manifests improved heat transfer properties and is reliable even at a low temperature. In an example, the heat pipe 100A have no significant degradation in the thermal performance.
  • the capillary structure 112 is connected to the inner surfaces of the evaporation section 104 and the condensation section 106 by sintering process.
  • the capillary structure 112, the evaporation section 104, and the condensation section 106 are heated up to a certain temperature, such as without melting them.
  • the capillary structure 112 of the heat pipe 100A ensures an improved mechanical and thermal contact between the inner surfaces of the evaporation section 104 and the condensation section 106.
  • the heat pipe 100A is vacuum sealed at both ends. Therefore, the flexible transport section 108 provides an improved flexibility performance during folding of the heat pipe 100A, and deformation of the flexible transport section 108 near the vapor channel 110 is smaller as compared to the conventional heat pipe. Therefore, the heat pipe 100A has a simple design along with an easy production process and an improved heat transfer efficiency.
  • the hollow structure 102 is formed as a unitary structure from a whole piece of copper tube, to avoid soldering or any sort of additional joints resulting in an increased reliability of the heat pipe 100A.
  • the flexible transport section 108 is also made from copper bellow, which provides flexibility and resilience to the heat pipe 100A.
  • the capillary structure 112 disposed inside the hollow structure 102 provides good thermal contact with the evaporation section 104, the condensation section 106, and the transported working fluid.
  • the capillary structure 112 further allows easy transportation of the working fluid in its different phases through various sections of the heat pipe 100A.
  • the capillary structure 112 is also provides improved thermal performance to the heat pipe 100A and ensure the flatness requirement of the evaporation section 104 and the condensation section 106.
  • FIG. IB is an enlarged cross-sectional view of a capillary structure of a heat pipe, in accordance with an embodiment of the present disclosure.
  • FIG. IB is described in conjunction with elements from FIG. 1A.
  • FIG. IB there is shown an enlarged cross section view of a capillary structure (e.g., the capillary structure 112 of FIG.1 A) of a heat pipe 100B that includes a first layer 114, and a second layer 116.
  • the heat pipe 100B further includes the hollow structure 102, and the vapor channel 110.
  • the first layer 114 and the second layer 116 are two different layers of the capillary structure 112.
  • the capillary structure 112 comprises at least two layers of sintered discrete metal fibres. Therefore, at least two layers of the capillary structure 112 are configured to form a staircase shaped wick design, which ensure thermal as well as the mechanical performance of the heat pipe 100B.
  • the heat pipe 100B achieves significantly improved thermal parameters, flexible properties, along with improved good anti-G (gravity) abilities.
  • having two layers of the sintered discrete metal fibres instead of one layer provides more options to choose and adjust appropriate structural parameters for both layers (e.g., the structural parameters, such as height and width of the capillary structure 112, may be increased) for the heat pipe 100B to improve the overall thermal performance.
  • a first layer 114 of the capillary structure 112 is disposed on bottom surfaces and a second layer 116 is disposed on upper surfaces of the evaporation section 104 and condensation section 106.
  • each of the evaporation section 104 and the condensation section 106 includes a bottom surface, and an upper surface respectively.
  • the first layer 114 of the capillary structure 112 is disposed on the bottom surface of the evaporation section 104, and similarly on the bottom surface of the condensation section 106.
  • the second layer 116 of the capillary structure 112 is disposed on the upper surface of the evaporation section 104, and similarly on the upper surface of the condensation section 106. Therefore, the first layer 114 and the second layer 116 of the capillary structure 112 act as mechanical support elements to support the flatness requirement (e.g., avoids the formation of bends) of the evaporation section 104 and the condensation section 106.
  • the second layer 116 is disposed on the top of the first layer 114 by sintering process.
  • the second layer 116 is disposed on the top of the first layer 114, so as to provide a stair shape to the capillary structure (e.g., the capillary structure 112 of FIG. 1A).
  • one of the first layer 114 or the second layer 116 of the stair shape ensures the thermal performance of the heat pipe 100B, and another layer of the stair shape support the flatness requirements for the evaporation section 104 and the condensation section 106 of the heat pipe 100B.
  • the sintering process (or method) ensures an improved mechanical and thermal contact between the first layer 114 and the second layer 116.
  • the working fluid is one of water, ethyl alcohol, methyl alcohol, a refrigerant, or a combination thereof.
  • the capillary structure 112 includes layers of sintered discrete metal fibres.
  • FIG. 1C is a perspective external view of a heat pipe that represents an interconnection between a first layer, a second layer and a flexible transport section, in accordance with an embodiment of the present disclosure.
  • FIG. 1C is described in conjunction with elements from FIGs. 1A, and IB.
  • FIG.1C there is shown a perspective external view of a heat pipe 100C, which represents an interconnection between the first layer 114, the second layer 116, and the flexible transport section 108.
  • the capillary structure 112 (of FIG. 1 A) comprises at least two layers, such as the first layer 114 and the second layer 116, that is arranged on the top of the first layer 114.
  • the capillary structure 112 comprising the first layer 114 and the second layer 116 is freely suspended (i.e., no mechanical contact) inside the flexible transport section 108 of the heat pipe 100C, as shown in FIG. 1C. Therefore, the capillary structure 112 allows easy transportation (i.e., without blocked) of the working fluid in its different phases the liquid state of the working fluid) through the flexible transport section 108.
  • FIG. ID is an enlarged cross-sectional view of a capillary structure of a heat pipe, in accordance with another embodiment of the present disclosure.
  • FIG. ID is described in conjunction with elements from FIGs. 1A, IB, and 1C.
  • FIG. ID there is shown an enlarged cross-sectional view of a capillary structure (e.g., the capillary structure 112 of FIG. 1A) of a heat pipe 100D that includes a third layer 118, the hollow structure 102, the flexible transport section 108, the first layer 114, and the second layer 116.
  • the third layer 118 is similar to the first layer 114 and the second layer 116.
  • the capillary structure 112 further comprises a third layer 118 disposed perpendicularly between the first layer 114 and the second layer 116.
  • the first layer 114 of the capillary structure 112 (of FIG. 1 A) is disposed on a bottom surface of the evaporation section 104 and similarly on a bottom surface of the condensation section 106.
  • the second layer 116 of the capillary structure 112 is disposed on an upper surface of the evaporation section 104 and similarly on an upper surface of the condensation section 106.
  • the second layer 116 is not disposed directly on the first layer 114, but the third layer 118 of the capillary structure 112 is disposed perpendicularly in-between the first layer 114 and the second layer 116.
  • the third layer 118 results in an increased height of the capillary structure 112, such as with a resulted height of 3.0 mm, and a resulted width of 11.5 mm. Therefore, the third layer 118 provides a wide range of structural parameters (i.e., an increased height and width of the capillary structure 112) to the heat pipe 100D, which are beneficial to provide thermal efficiency as well as mechanical support to the heat pipe 100D.
  • FIG. IE is an enlarged cross-sectional view of a capillary structure of a heat pipe, in accordance with another embodiment of the present disclosure.
  • FIG. IE is described in conjunction with elements from FIGs. 1A, IB, 1C, and ID.
  • FIG. IE there is shown an enlarged cross-sectional view of a capillary structure (e.g., the capillary structure 112 of FIG. 1A) of a heat pipe 100E that includes a fourth layer 120, the hollow structure 102, the flexible transport section 108, the first layer 114, the second layer 116, and the third layer 118.
  • the fourth layer 120 is similar to the third layer 118.
  • the capillary structure (e.g., the capillary structure 112 of FIG. 1A) of the heat pipe 100E includes the fourth layer 120 along with the third layer 118, such as the fourth layer 120 and the third layer 118 are disposed perpendicularly between the first layer 114 and the second layer 116.
  • the fourth layer 120 is with same dimensions as that of the third layer 118.
  • each of the fourth layer 120 and the third layer 118 provides mechanical support as well as a wide range of structural parameters (i.e., an increased height and width of the capillary structure 112) to the heat pipe 100E, which are beneficial to further improve thermal efficiency of the heat pipe 100E.
  • FIG. 2 is a block diagram of an electronic device, in accordance with an embodiment of the present disclosure.
  • FIG. 2 is described in conjunction with elements from FIG. 1A.
  • FIG. 2 there is shown a block diagram 200 of an electronic device 202 that includes one of the heat pipes 100A, 100B, 100C, 100D, and 100E.
  • the electronic device 202 referred herein comprises (i.e., incorporates) the heat pipe 100A.
  • the electronic device 202 may also be referred to as an electronic device that comprises different components (or electronic components) such as a passive component or an active component, a semiconductor, an interconnect, a contact pad, a transistor, a diode, a lightemitting diode, and the like, which are connected to form integrated circuits to perform a task.
  • the electronic device 202 may include but is not limited to a laptop, a mobile phone, a desktop computer, a smartphone, a mobile tablet, a camera, a printer, a radio, and the like.
  • the electronic device 202 may be a foldable device that may be folded during operation. Different components of the electronic device 202 generate heat, thus the electronic device 202 requires a cooling system to improve reliability and prevent premature failure of the electronic device 202.
  • the present disclosure provides an electronic device 202 comprising the heat pipe 100A.
  • the heat pipe 100A (of FIG. 1A) acts as a part of a cooling system for the electronic device 202.
  • the heat pipe 100A is placed near a heat-generating component of the electronic device 202 to conducts heat from the electronic device 202 to maintain a low temperature on the electronic device 202.
  • the electronic device 202 is foldable, thus the heat pipe 100A can bend along with the electronic device 202 and does not break when the electronic device 202 is folded.
  • the heat pipe 100A provides effective heat transfer even in a folded state of the electronic device 202.
  • the heat pipe 100A with the hollow structure 102 further provides balanced flexibility, lifetime, and vibration damping to the electronic device 202.
  • the electronic device 202 may include one of the heat pipe 100B, 100C, 100D, and 100E (ofFIGs. 1B-1E, respectively).

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Un caloduc pour composants électroniques comporte une structure creuse présentant une section d'évaporation, une section de condensation et une section de transport flexible formée entre la section d'évaporation et la section de condensation, un canal de vapeur étant défini à travers les sections de la structure creuse. Le caloduc comporte en outre une structure capillaire disposée à l'intérieur de la structure creuse, la structure capillaire étant au moins partiellement en contact direct avec des surfaces internes de la section d'évaporation et de la section de condensation et étant librement suspendue dans la section de transport flexible. Le caloduc comporte une conception simple ainsi qu'une efficacité de transfert de chaleur améliorée et une performance thermique améliorée. Le caloduc assure en outre l'exigence de planéité de la section d'évaporation et de la section de condensation.
PCT/EP2021/072782 2021-08-17 2021-08-17 Caloduc pour composants électroniques et dispositif électronique comprenant un caloduc WO2023020682A1 (fr)

Priority Applications (2)

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CN202180101565.7A CN117836583A (zh) 2021-08-17 2021-08-17 用于电子组件的热管及包括热管的电子设备
PCT/EP2021/072782 WO2023020682A1 (fr) 2021-08-17 2021-08-17 Caloduc pour composants électroniques et dispositif électronique comprenant un caloduc

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63126778U (fr) * 1987-02-13 1988-08-18
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
JP2007147226A (ja) * 2005-11-30 2007-06-14 Matsushita Electric Ind Co Ltd フレキシブルヒートパイプおよびその製造方法
EP2861928A1 (fr) * 2012-07-18 2015-04-22 Airbus Defence and Space SAS Dispositif de contrôle thermique
US20180031329A1 (en) * 2016-07-26 2018-02-01 Chaun-Choung Technology Corp. Heat dissipating device
CN111829378A (zh) * 2020-06-03 2020-10-27 广州大学 一种多段铰链式柔性热管

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63126778U (fr) * 1987-02-13 1988-08-18
US20060196640A1 (en) * 2004-12-01 2006-09-07 Convergence Technologies Limited Vapor chamber with boiling-enhanced multi-wick structure
JP2007147226A (ja) * 2005-11-30 2007-06-14 Matsushita Electric Ind Co Ltd フレキシブルヒートパイプおよびその製造方法
EP2861928A1 (fr) * 2012-07-18 2015-04-22 Airbus Defence and Space SAS Dispositif de contrôle thermique
US20180031329A1 (en) * 2016-07-26 2018-02-01 Chaun-Choung Technology Corp. Heat dissipating device
CN111829378A (zh) * 2020-06-03 2020-10-27 广州大学 一种多段铰链式柔性热管

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