WO2023019779A1

WO2023019779A1 - Circuit board and manufacturing method therefor, and printing device

Info

Publication number: WO2023019779A1
Application number: PCT/CN2021/131613
Authority: WO
Inventors: 朱文杰; 尹涛
Original assignee: 北京梦之墨科技有限公司
Priority date: 2021-08-16
Filing date: 2021-11-19
Publication date: 2023-02-23
Also published as: CN113692126A

Abstract

The present application relates to the technical field of electronic circuit manufacturing. Disclosed are a circuit board and a manufacturing method therefor, and a printing device. The manufacturing method for a circuit board comprises: forming a basic circuit layer on a target substrate according to a target circuit pattern; and performing delineation along a pattern of the basic circuit layer by using a first conductive paste, so as to form a circuit functional layer on the whole/local surface of the basic circuit layer, wherein the circuit functional layer at least comprises a welding section or a reinforcing section. In the embodiments of the present application, a first conductive paste is applied to a basic circuit layer by means of delineation. In comparison with silk-screen printing, there are no plate-making requirements, thereby meeting the requirement of a user for personalized and rapid manufacturing; in addition, the cost is also lower.

Description

A kind of circuit board and its manufacturing method, printing equipment

This application claims the priority of the Chinese patent application with the application number 202110935627.6 and the application name "a circuit board and its manufacturing method and printing equipment" submitted to the China Patent Office on August 16, 2021, the entire contents of which are incorporated by reference in this application.

technical field

The application belongs to the technical field of electronic circuit preparation, and in particular relates to a circuit board, a manufacturing method thereof, and a printing device.

Background technique

The names of circuit boards are: circuit board, PCB board, aluminum substrate, high frequency board, PCB, ultra-thin circuit board, ultra-thin circuit board, printed copper etching technology circuit board, etc. The circuit board makes the circuit miniaturized and intuitive, and plays an important role in mass production of fixed circuits and optimizing the layout of electrical appliances.

The tinning process is a conventional process for circuit board production at present, and it is suitable for soldering and patching processes such as reflow soldering. At present, the tinning process mainly uses screen printing and a customized screen to achieve the tinning of the target pad. This process requires customization The screen version cannot meet the rapid production of personalized circuit boards. On the other hand, the demand for high frequency and high current is also an urgent problem to be solved.

application content

In view of this, an object of this application is to propose a circuit board production method to solve the problem of rapid production of personalized circuit boards in the prior art.

In some illustrative embodiments, the circuit board manufacturing method includes: forming a basic circuit layer on a target substrate according to a target circuit pattern; using a first conductive paste to draw along the pattern of the basic circuit layer, in the A functional circuit layer is formed on the entire/partial surface of the basic circuit layer; wherein, the functional circuit layer includes at least a welding section or a reinforcing section.

In some optional embodiments, the forming the basic circuit layer on the target substrate according to the target circuit pattern specifically includes: according to the target circuit pattern, using a second conductive paste different from the first conductive paste on the A base circuit layer is formed on the target substrate.

In some optional embodiments, the process of using the second conductive paste to form the basic circuit layer on the target substrate further includes: curing the second conductive paste on the target substrate to form the Basic circuit layer.

In some optional embodiments, after forming the circuit function layer on the entire/partial surface of the basic circuit layer, it also includes: performing a high-temperature treatment on the circuit function layer to enhance the connection between the circuit function layer and the base circuit layer. Bond strength between circuit layers.

In some optional embodiments, the circuit function layer includes a welding section located on the pad area of the basic circuit layer.

In some optional embodiments, before performing high-temperature treatment on the circuit function layer, it also includes: mounting electronic components on the soldering section; after the high-temperature treatment, realizing the fixing of the electronic components .

In some optional embodiments, the circuit function layer includes the reinforcement section; the reinforcement section is located on the high current-carrying line on the basic circuit layer.

In some optional embodiments, the high current-carrying lines include lines in the basic circuit layer whose line width is greater than a set threshold.

In some optional embodiments, the drawing along the pattern of the basic circuit layer with the first conductive paste to form a circuit function layer on the entire/partial surface of the basic circuit layer specifically includes: using extrusion The output printing head lays the first conductive paste on the entire/partial surface of the basic circuit layer.

In some optional embodiments, the first conductive paste is solder paste.

Another purpose of the present application is to propose a circuit board to solve the problems existing in the prior art.

In some demonstrative embodiments, the circuit board can be fabricated by any one of the circuit fabrication methods described above.

Another object of the present application is to provide a printing device for implementing any one of the methods for manufacturing a circuit board described above.

Compared with the prior art, the present application has the following advantages:

In the embodiment of this application, the first conductive paste is applied on the basic circuit layer by using the drawing method. Compared with screen printing, there is no need for plate making, which meets the user's personalized and rapid production needs, and at the same time, the cost lower.

Description of drawings

FIG. 1 is a flow chart of circuit board fabrication in the embodiment of the present application.

Detailed ways

The following description and the accompanying drawings sufficiently illustrate specific embodiments of the application to enable those skilled in the art to practice them. Other embodiments may incorporate structural, logical, electrical, process, and other changes. The examples merely represent possible variations. Individual components and functions are optional unless explicitly required, and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the present application includes the full scope of the claims, and all available equivalents of the claims. These embodiments of the application may be referred to herein individually or collectively by the term "application", which is for convenience only and is not intended to automatically limit that application if in fact more than one application is disclosed The scope is any single application or application concept.

It should be noted that the technical features in the embodiments of the present application may be combined with each other without conflict.

The embodiment of the present application discloses a circuit board manufacturing method, specifically, as shown in Figure 1, Figure 1 is a flow chart of the circuit board manufacturing in the embodiment of the application; the circuit board manufacturing method includes:

Step S1, forming a basic circuit layer on the target substrate according to the target circuit pattern;

Step S2, using the first conductive paste to draw along the pattern of the basic circuit layer, forming a circuit function layer on the entire/partial surface of the basic circuit layer;

Wherein, the circuit function layer includes at least a welding section or a reinforcing section.

The target substrates in the embodiments of this application are not limited to hard substrates, flexible substrates, stretchable substrates, etc., hard substrates are not limited to FR4, CEM1, 22F, CEM3, PVC, glass, wood, etc., flexible substrates The material is not limited to PI, PET, PE, TPU, TPV, woven fabric, etc., and the stretchable substrate is not limited to silica gel, elastic woven fabric, stretchable film, etc.

The molding material of the basic circuit layer in the embodiment of the present application is not limited to copper foil, aluminum foil, silver-based conductive ink, carbon-based conductive ink, graphene-based conductive ink, liquid metal paste, and the like. The molding process is not limited to one or any combination of chemical etching, laser etching, screen printing, pad printing, direct writing printing, spray printing, and direct paste.

The role of the circuit function layer in the embodiment of the present application is not limited to enhancing the welding performance of the circuit (or part), enhancing the high current passing performance of the circuit (or part), and enhancing the high frequency signal passing performance of the circuit (or part). Wherein, the first conductive paste can be selected from the conductive paste on the market that meets the above-mentioned enhancement requirements. Preferably, the first conductive paste in the embodiment of the present application can be selected from solder paste, which can meet the requirements of welding, high current, high frequency signal, etc. at the same time.

In the embodiment of the present application, the first conductive paste is used to describe the pattern along the basic circuit layer, which can be described along the target line of the basic circuit layer by using a direct-write print head, a spray print head, or an extrusion print head , so as to cover the first conductive paste on the target circuit to form a functional circuit layer. Preferably, in the embodiment of the present application, an extrusion print head is selected to discharge the first conductive paste. Compared with a direct-write print head, it does not contact the basic circuit layer, so it does not cause the foundation The mechanical wear between the circuit layer and the print head, compared with the spray print head, it can meet the discharge of more viscous conductive paste, the selectivity of the conductive paste is lower, and the scope of application is wider .

Wherein, in the process of drawing and discharging the printing head along the pattern of the basic circuit layer, the movement of the printing head is realized by relying on the 3-axis linkage mechanism, so as to realize the patterned drawing. Among them, in some embodiments, the specific circuit can be described by identifying the specific circuit in the target circuit pattern; in other embodiments, it can also be described by identifying the specific characteristics of the basic circuit layer formed on the target substrate , find out the lines in the basic circuit layer that meet the above characteristics and draw them.

In some embodiments, forming the basic circuit layer on the target substrate according to the target circuit pattern in step S1 specifically includes: using a second conductive paste different from the first conductive paste on the target substrate according to the target circuit pattern. A basic circuit layer is formed on the substrate. In this embodiment, the basic circuit layer can be formed on the target substrate by means of screen printing, spraying, extrusion, pad printing, printing, etc. Compared with etching technology, the efficiency is higher, the cost is lower, and it is also It is more in line with the production needs of small batches and personalized circuits. Preferably, the formation of the basic circuit layer is realized by using the second printing head of the second conductive paste, that is, the second printing head using the second conductive paste can complete the production of the basic circuit layer, and then by using the second printing head of the first conductive paste A printing head completes the forming of the circuit function layer above the basic circuit layer. The first print head and the second print head can use the same driving principle, relying on a set of 3-axis linkage mechanism to complete the movement of the print head.

Further, the first print head and the second print head are detachably assembled with the 3-axis linkage mechanism. When making the basic circuit layer, the production of the basic circuit layer is completed by assembling the second print head in the manufacturing device, and then Disassemble the second print head and replace the first print head to complete the production of the circuit function layer.

In some embodiments, the second conductive paste in the embodiment of the present application is selected from conductive silver paste, conductive aluminum paste, conductive copper paste, etc., and the paste contains resin and additives, so it is described on the second conductive paste Before the first conductive paste, it may further include: curing the second conductive paste on the target substrate to form the basic circuit layer, so as to make the structure of the second conductive paste more stable. In some other embodiments, the curing of the second conductive paste is not limited to high-temperature sintering, and can also be cured by light or natural curing, which can be selected according to the type of resin in the paste. In this embodiment, the structural stability of the cured basic circuit layer is strong. During the laying of the first conductive paste, the extrusion deviation of the basic circuit layer will not be caused, and the stability of the first conductive paste can also be ensured. Laying thickness.

In some embodiments, after the basic circuit layer is formed according to the target circuit pattern by the second print head using the second conductive paste, since curing treatment is required, if the production platform does not have the corresponding curing function, it will pass Take out the completed basic circuit layer and transfer it to the corresponding functional equipment to complete its curing treatment. After completion, take it back and place it on the production platform. Since the base material will move during this process, mark points (or positioning holes) for positioning are provided on the base material. The current position parameters of the base material are determined by CCD image recognition technology, and the target pattern and the current base material are completed. The alignment process of the position of the material, and then based on the target circuit pattern, the circuit function layer is formed on the entire/partial surface of the basic circuit layer by the first print head using the first conductive paste.

In some embodiments, after forming the functional circuit layer on the entire/partial surface of the basic circuit layer, it further includes: performing a high-temperature treatment on the functional circuit layer to increase the distance between the functional circuit layer and the basic circuit layer. the bonding strength between them. In this embodiment, when solder paste is selected as the first conductive paste, the flux in the solder paste can be effectively removed by high temperature treatment, thereby forming a stable tin layer attached to the basic circuit layer, and the tin layer can be combined with A good bond is formed between the base circuit layers.

Preferably, the circuit function layer in the embodiment of the present application includes a soldering section located on the pad area of the basic circuit layer; wherein, the pad area refers to the area where the circuit is used to connect and fix electronic components.

Preferably, in some embodiments, before performing high-temperature treatment on the circuit function layer, it also includes: mounting electronic components on the soldering section; after the high-temperature treatment, realizing the fixing of the electronic components . Through this embodiment, the current effect of reflow soldering can be achieved, thereby completing the soldering of electronic components, and this step can be processed synchronously with the high-temperature treatment for removing flux.

In some embodiments, the circuit function layer includes the reinforcement section; the reinforcement section is located on the high current-carrying line on the basic circuit layer. Among them, the high current-carrying line refers to the area that needs to pass a large current during circuit design, and the high current-carrying performance is ensured by forming a reinforcing section (such as a tin layer) on the line.

Wherein, the high current-carrying lines include lines in the basic circuit layer whose line width is greater than a set threshold. The setting threshold can be selected according to the specific design parameters of the circuit. In some embodiments, the thickness of each line in the basic circuit layer can be identified. When the line width is greater than the set threshold line, it is judged to be a high current-carrying line. The line, that is, the line is reinforced through step S2.

The embodiment of the present application also proposes a printing device, which can implement the above-mentioned method for manufacturing a circuit board. Wherein, the printing device includes: a workbench, a three-axis linkage mechanism erected on the workbench, and a first print head and a second print head; wherein, the first print head and the second print head are in the Exercise above the workbench. The workbench is used to carry the substrate. Preferably, the first print head and the second print head are not assembled on the three-axis linkage mechanism at the same time, and are combined with the three-axis linkage mechanism by disassembling and replacing, thereby reducing the system complexity of the printing device and reducing the equipment cost.

The discharge principle of the first print head and the second print head in the embodiment of the present application is the same, and the ink discharge of the slurry can be completed through extrusion. The extrusion principle of the print head can be through air pressure, hydraulic pressure, mechanical pressure, etc. Preferably, the print head in the embodiment of the application squeezes the slurry in the print head through mechanical transmission. Compared with air pressure and hydraulic pressure As far as the ink is concerned, the extrusion deformation of the mechanical part itself can be almost ignored, so it can achieve a high ink output control accuracy.

Another object of the present application is to provide a circuit board, which can be produced by the above circuit board production method and/or printing equipment. Wherein, the circuit board includes: a substrate, a basic circuit layer attached to the substrate, and an integral/partial circuit function layer attached to the basic circuit layer.

Preferably, the basic circuit layer is formed by the second conductive paste, and the circuit function layer is formed by the first conductive paste; wherein, the second conductive paste can be a conductive silver paste, and the first conductive paste can be a solder paste.

The functional circuit layer may include a welding section and/or a reinforcing section; the welding section is located above the welding area of the basic circuit layer for soldering and fixing of electronic components; the reinforcing section is located on the high current-carrying circuit of the basic circuit layer On top of that, it is used to enhance the performance of the line through large current/high frequency signals.

Those skilled in the art should also understand that various illustrative logical blocks, modules, circuits and algorithm steps described in conjunction with the embodiments herein may be implemented as electronic hardware, computer software or a combination thereof. To clearly illustrate this interchangeability of hardware and software, various illustrative components, blocks, modules, circuits, and steps have been described above generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present disclosure.

Claims

A circuit board manufacturing method, characterized in that, comprising:

forming a basic circuit layer on the target substrate according to the target circuit pattern;

Use the first conductive paste to trace along the pattern of the basic circuit layer, and form a circuit function layer on the entire/partial surface of the basic circuit layer;

Wherein, the circuit function layer includes at least a welding section or a reinforcing section.
The circuit board manufacturing method according to claim 1, wherein said forming a basic circuit layer on the target substrate according to the target circuit pattern specifically comprises:

According to the target circuit pattern, a basic circuit layer is formed on the target substrate by using a second conductive paste different from the first conductive paste.
The circuit board manufacturing method according to claim 2, characterized in that, in the process of forming the basic circuit layer on the target substrate using the second conductive paste, further comprising:

curing the second conductive paste on the target substrate to form the basic circuit layer.
The circuit board manufacturing method according to claim 1, further comprising:

Performing high temperature treatment on the functional circuit layer to improve the bonding strength between the functional circuit layer and the basic circuit layer.
The method for manufacturing a circuit board according to claim 4, wherein the circuit function layer includes a welding section located above the pad area of the basic circuit layer;

Before performing high-temperature treatment on the circuit function layer, it also includes: mounting electronic components on the welding section;

After the high temperature treatment, the electronic components are fixed.
The circuit board manufacturing method according to claim 1, wherein the circuit function layer includes the reinforcing section;

The reinforcing section is located on the high-current-carrying lines on the basic circuit layer; the high-current-carrying lines include lines in the basic circuit layer whose line width is greater than a set threshold.
The circuit board manufacturing method according to claim 1, characterized in that, the first conductive paste is used to draw along the pattern of the basic circuit layer to form circuit functions on the entire/partial surface of the basic circuit layer layers, including:

Laying the first conductive paste on the entire/partial surface of the basic circuit layer by using an extrusion printing head.
The method for manufacturing a circuit board according to claim 1, wherein the first conductive paste is solder paste.
A circuit board, characterized in that it is produced by the circuit production method described in any one of claims 1-8.
A printing device, characterized in that it is used to implement the circuit manufacturing method described in any one of claims 1-8.