WO2023019554A1 - 一种多频超声换能器及具有其的超声成像系统、方法 - Google Patents

一种多频超声换能器及具有其的超声成像系统、方法 Download PDF

Info

Publication number
WO2023019554A1
WO2023019554A1 PCT/CN2021/113793 CN2021113793W WO2023019554A1 WO 2023019554 A1 WO2023019554 A1 WO 2023019554A1 CN 2021113793 W CN2021113793 W CN 2021113793W WO 2023019554 A1 WO2023019554 A1 WO 2023019554A1
Authority
WO
WIPO (PCT)
Prior art keywords
transducer assembly
transducer
frequency
ultrasonic
electrode surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/113793
Other languages
English (en)
French (fr)
Inventor
邱维宝
伍伟昌
张志强
潘东文
郑海荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Insightsonics Co Ltd
Shenzhen Institute of Advanced Technology of CAS
Original Assignee
Shenzhen Insightsonics Co Ltd
Shenzhen Institute of Advanced Technology of CAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Insightsonics Co Ltd, Shenzhen Institute of Advanced Technology of CAS filed Critical Shenzhen Insightsonics Co Ltd
Priority to PCT/CN2021/113793 priority Critical patent/WO2023019554A1/zh
Publication of WO2023019554A1 publication Critical patent/WO2023019554A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves

Definitions

  • the invention relates to the technical field of ultrasonic transducers, in particular to a multi-frequency ultrasonic transducer and an ultrasonic imaging system and method thereof.
  • Ultrasound imaging is widely used in medical diagnosis and industrial testing, and has the advantages of non-destructive, non-radiation, convenience and low cost.
  • An ultrasonic transducer is a device that can convert electrical excitation signals into ultrasonic signals and convert the reflected ultrasonic signals into electrical signals. It is a key component of ultrasonic imaging equipment. The performance of ultrasonic transducer directly determines the quality of ultrasonic imaging.
  • Ultrasonic transducers are mainly divided into single array element ultrasonic transducers and array ultrasonic transducers. Due to the convenience of imaging, the current ultrasonic imaging equipment in the medical and industrial fields mainly uses array ultrasonic transducers.
  • ultrasound acoustic signals are directed towards the detection area, and corresponding reflected echo signals are detected.
  • the characteristics of the echo signal such as amplitude, phase shift, Doppler shift, power, etc., are analyzed and quantized into pixel data which is used to create an image of the flow or to represent the flow.
  • the received ultrasound echo signal is in the same frequency range as the transmitted ultrasound signal.
  • Another way to perform ultrasound imaging is to apply an ultrasound signal to the region of interest at one frequency and capture and analyze the received echo signal at another frequency (such as one or more harmonics of the transmitted ultrasound signal) .
  • the frequency of the harmonics is 3-5 times that of the transmitted signal.
  • Contrast agents are usually liquid or lipid-encased microbubbles sized to resonate at specific transmitted ultrasound frequencies. Exposure to ultrasound in the body at the resonant frequency of the microbubbles causes the bubbles to collapse and generate nonlinear ultrasound echoes at frequencies much higher than the applied ultrasound.
  • nonlinear microbubbles can be designed to resonate at 1-6 MHz, but produce echo signals in the 10-30 MHz range. High-frequency echo signals allow the generation and study of detailed images of tissue structures such as the microvasculature surrounding tumors in clinical or preclinical settings.
  • the most conventional way to perform dual-frequency imaging is to use a mechanically scanned single-element transducer with confocal low-frequency and high-frequency transducer elements. While such transducers work well, faster scans can be performed using transducer arrays that can be electronically controlled. Such transducers typically have a low frequency transducer array and a high frequency transducer array aligned with each other. One problem with dual frequency transducers is aligning the low frequency and high frequency arrays. In a 30MHz high-frequency phased array, the element size (eg, 1/2 ⁇ or smaller) is about 25 microns. At 50MHz, the component size is about 15 microns.
  • the process required to align the array typically involves making minor adjustments to the position of the high-frequency and low-frequency transducers on a wet bench, followed by gluing them together when the best match is found. This is time consuming and expensive.
  • the technology discussed in this article involves an improved dual-frequency transducer that is easier and less expensive to manufacture.
  • the side-by-side multi-frequency ultrasonic transducers either have a complex mechanical structure that increases the difficulty of processing and reduces the reliability of the equipment, or multiple transducers only have a fixed angle, resulting in the need to manually move the focal point.
  • the position of the transducer is complicated to operate and the accuracy is low.
  • the present invention proposes a variable-focus multi-frequency ultrasonic transducer and an ultrasonic imaging system and method thereof.
  • the multi-frequency ultrasonic transducer includes a first transducer assembly and a second transducer assembly, the frequency of the second transducer assembly is lower than the frequency of the first transducer assembly, each Each of the first transducer components and each of the second transducer components include a stacked backing layer, a piezoelectric layer and a matching layer, and the second transducer components are arranged on the first Both sides or surroundings of the transducer assembly; it also includes an integrated acoustic lens, and the integrated acoustic lens is simultaneously laminated on the front side of the matching layer of the first transducer assembly and the matching layer of the second transducer assembly
  • the front side of the layer; multiple transducers are arranged side by side or in a circle, without overlapping structure, which eliminates the influence between the first transducer assembly and the second transducer assembly, and can simultaneously perform multi-band high-quality ultrasound imaging , a multimodal imaging modality for superharmonic imaging and elastography.
  • the flexible circuit board is electrically connected to the piezoelectric layer;
  • the piezoelectric layer includes a ground electrode surface and a signal electrode surface, the ground electrode surface and the signal electrode surface have electrodes respectively, and the The electrodes on the signal electrode surface are cut to make the piezoelectric layer form a plurality of piezoelectric array elements.
  • the integrated structural design of the acoustic lens simplifies the preparation process and difficulty of the equipment, and improves the integration and consistency of the equipment.
  • the array design of the piezoelectric layer provides the transducer with the ability to focus electronically, making the focus position of the transducer variable in two dimensions, which greatly improves the focusing efficiency and focusing range of the transducer.
  • the array elements on the ground electrode surface are arranged in a one-dimensional line array; or, the array elements on the ground electrode surface are arranged in a two-dimensional array.
  • the integrated acoustic lens has ultrasonic focusing characteristics, and is used to focus the ultrasonic waves of different frequencies emitted by the first transducer assembly and the second transducer assembly on a predetermined single target point or Multiple preset targets. Further, the physical parameters of the one-piece acoustic lens are variable, and the one-piece acoustic lens with different physical parameters transmits the different frequencies emitted by the first transducer assembly and the second transducer assembly The ultrasonic waves in the first direction are focused at the same depth in the first direction; or, the integrated acoustic lens with different physical parameters sends out the first transducer assembly and the second transducer assembly Ultrasonic waves of different frequencies are focused at different depths in the first direction.
  • the shape of the integral acoustic lens is concave or convex.
  • the array design of the piezoelectric layer and the presence of the integrated acoustic lens enable the first transducer assembly and the second transducer assembly to simultaneously realize the focusing functions of variable electronic focusing and physical focusing of the acoustic lens. Improve the accuracy of target location and image resolution.
  • the second transducer assembly is arranged on the left and right sides of the first transducer assembly, and the ultrasonic waves emitted by the second transducer assembly are focused along the first direction; the second transducer assembly
  • the focal point formed by the ultrasonic waves emitted by the two transducer components passing through the integrated acoustic lens is on the center line of the first transducer component, or in the left and right regions of the ultrasonic waves of the first transducer component .
  • the second transducer assembly is arranged on the left and right sides of the first transducer assembly, and both the second transducer assembly and the first transducer assembly emit ultrasonic waves along the first transducer assembly. direction focusing; the ultrasonic waves emitted by the second transducer assembly and the ultrasonic waves emitted by the first transducer assembly pass through the integrated acoustic lens, and the focal points formed after passing through the integrated acoustic lens coincide in the first direction, or, in Different locations on the centerline of the first transducer assembly.
  • the flexible circuit board covers the entire surface of the piezoelectric layer; or, additional connection areas are reserved on both sides of the piezoelectric layer, and the flexible circuit board covers the surface of the connection area.
  • the flexible circuit board covers the surface of the connection area, and the piezoelectric layer is in direct contact with the backing layer, which can achieve better sound absorption effect.
  • the flexible circuit board is connected to one or more sides of the piezoelectric layer.
  • the present invention also provides a method for manufacturing a multi-frequency ultrasonic transducer, which is used to manufacture the above-mentioned multi-frequency ultrasonic transducer.
  • the manufacturing of the multi-frequency ultrasonic transducer includes:
  • Making the piezoelectric layer including: sputtering electrodes on the ground electrode surface of the piezoelectric layer and sputtering electrodes on the signal electrode surface;
  • the second transducer assembly Arrange and fix the second transducer assembly on both sides or around the first transducer assembly, and stack an integrated acoustic lens on the front side of the matching layer of the first transducer assembly and the second transducer assembly at the same time.
  • the front side of the matching layer of the transducer assembly, the integrated acoustic lens is attached and fixed to the matching layer of the first transducer assembly and the matching layer of the second transducer assembly.
  • the “sputtering electrodes on the ground electrode surface of the piezoelectric layer” also includes: cutting on the ground electrode surface according to the preset number and spacing of the array elements of the piezoelectric layer, and cutting The formed kerf is filled with acoustic decoupling material;
  • the “sputtering the electrode on the signal electrode surface” it also includes: cutting the electrode on the signal electrode surface according to the gap between the array elements on the ground electrode surface.
  • the present invention also provides an ultrasonic imaging system, the above-mentioned multi-frequency ultrasonic transducer of the ultrasonic imaging system,
  • It also includes a control unit, configured to generate focus adjustment signals for the first transducer assembly and the second transducer assembly along the second direction, so that the multi-frequency ultrasonic transducer can realize the focus adjustment along the second direction. Focusing with variable focus position in direction;
  • the integrated acoustic lens enables focusing of the first transducer assembly and the second transducer assembly along a first direction
  • the first direction intersects or is perpendicular to the second direction.
  • control unit adjusts the electronic beamforming of the excitation system of the multi-frequency transducer.
  • An imaging method of the above-mentioned ultrasonic imaging system includes:
  • the first imaging mode through the structural characteristics of the integrated acoustic lens, the focusing of the first transducer assembly and the second transducer assembly along the first direction on a preset single target point is realized , adjust the focus positions of the first transducer assembly and the second transducer assembly along the second direction, so that the focus positions of the first transducer assembly and the second transducer assembly along the
  • the focus position in the second direction is also the preset single target point, the frequency of the first transducer assembly and the frequency of the second transducer assembly are controlled, and multi-frequency is performed on the single target point.
  • the second imaging mode through the structural characteristics of the integrated acoustic lens and the frequency of the first transducer assembly and the frequency of the second transducer assembly, the first transducer
  • the assembly and the second transducer assembly focus on a plurality of target points at different positions and depths on the same section or on different sections, and perform synchronous imaging on each target point.
  • the multi-frequency ultrasonic transducer of the present invention has the following beneficial effects: a plurality of transducers are arranged side by side or in a circle, without overlapping structures, eliminating the need for the first transducer assembly and the second transducer assembly
  • the impact between multi-band high-quality ultrasound imaging, super-harmonic imaging and multi-modal imaging modes of elastography can be performed simultaneously.
  • the array design of the piezoelectric layer provides the transducer with the ability to focus electronically, making the focus position of the transducer variable in two dimensions, which greatly improves the focusing efficiency and focusing range of the transducer.
  • the array design of the piezoelectric layer and the simultaneous presence of the acoustic lens enable the first transducer assembly and the second transducer assembly to achieve electronic focusing and physical focusing at the same time, greatly improving the accuracy of the target position and image resolution.
  • the multi-frequency ultrasonic transducer is suitable for array ultrasonic transducers in all working frequency ranges, and has no built-in mechanical structure, simple process, high reliability, and strong operability.
  • the integrated structural design of the acoustic lens simplifies the installation of equipment. The preparation process and difficulty have improved the integration and consistency of the equipment.
  • the ultrasonic imaging system using the multi-frequency transducer can realize multiple imaging modes by controlling the first transducer assembly and the second transducer assembly.
  • Fig. 1 is the structural representation of multi-frequency ultrasonic transducer of the present invention
  • Fig. 2 is the overall structure schematic diagram of multi-frequency ultrasonic transducer of the present invention.
  • Figure 3a is a schematic diagram of the longitudinal variable electronic focus of the multi-frequency ultrasonic transducer of the present invention.
  • Figure 3b is a schematic diagram of the lateral physical focus of the multi-frequency ultrasonic transducer of the present invention.
  • Figure 4a is a schematic diagram of the multi-frequency synchronous imaging mode of the multi-frequency ultrasonic transducer of the present invention
  • Fig. 4b is a schematic diagram of synchronous imaging of targets at different depths simultaneously by the multi-frequency ultrasonic transducer of the present invention
  • Figure 5a is a schematic diagram of the low-frequency excitation high-frequency receiving mode of the multi-frequency ultrasonic transducer of the present invention.
  • Figure 5b is a schematic diagram of the multi-frequency ultrasonic transducer of the present invention performing superharmonic shaping and elastography on targets at different depths;
  • Fig. 6 is another structural schematic diagram of the multi-frequency ultrasonic transducer of the present invention.
  • 1-first transducer assembly 2-second transducer assembly; 3-backing layer; 4-flexible circuit board; 5-piezoelectric layer; 6-matching layer; 7-integrated acoustic lens.
  • the invention provides a variable-focus multi-frequency ultrasonic transducer and an ultrasonic imaging system and method thereof.
  • the multi-frequency ultrasonic transducer of the present invention includes a first transducer assembly and a second transducer assembly, and the second transducer assembly includes two or more transducers, the number of which can be specifically two or three one, four or more.
  • the first transducer assembly is centered, and the second transducer assembly is arranged on both sides or around the first transducer assembly, specifically, the second transducer assembly is arranged on both sides or three sides of the first transducer assembly , or arranged around the first transducer assembly.
  • the frequency of the second transducer assembly is lower than the frequency of the first transducer assembly.
  • the frequency of the second transducer assembly is 1-5 MHz; the frequency of the first transducer assembly is 5-30 MHz. Therefore, in the present invention, the transducer of the first transducer assembly forms a relatively high-frequency unit in the multi-frequency ultrasonic transducer, and the transducer of the second transducer assembly forms a multi-frequency ultrasonic transducer Low frequency unit with relatively low frequency in the amplifier.
  • Each first transducer assembly and each second transducer assembly includes a backing layer, a piezoelectric layer, and a matching layer that are stacked.
  • the multi-frequency ultrasonic transducer also includes an integrated acoustic lens, and the integrated acoustic lens is laminated on the front side of the matching layer of the first transducer assembly and the front side of the matching layer of the second transducer assembly at the same time.
  • the second transducer assembly is used for outputting acoustic signals
  • the first transducer assembly is used for receiving acoustic signals.
  • Multiple transducers are integrated using a non-overlapping structure to avoid mutual interference between transducers.
  • the first transducer assembly 1 of this dual frequency transducer comprises a high frequency unit and the second transducer assembly 2 comprises two low frequency units;
  • the type of the first transducer assembly 1 can be It is a linear array or an area array transducer, and can be a phased array or a non-phased array transducer.
  • Each transducer includes a backing layer 3 , a flexible circuit board 4 , a piezoelectric layer 5 and a matching layer 6 , wherein the backing layer 3 , the piezoelectric layer 5 and the matching layer 6 are stacked in sequence.
  • the two low-frequency units of the second transducer assembly 2 are arranged side by side in parallel on both sides of the first transducer assembly 1, and the first transducer assembly 1 and the second transducer assembly 2 of the dual-frequency transducer
  • the matching layer 6 is on the same plane, and all transducers are connected by an integrated acoustic lens 7, which is simultaneously stacked on the front side of the matching layer 6 of the first transducer assembly 1 and two second transducers The front side of the matching layer 6 of the device assembly 2.
  • the surface size of the integrated acoustic lens 7 is consistent with the size of the matching layer 6 formed after the arrangement of the dual-frequency transducers.
  • the direction perpendicular to the surface of the piezoelectric layer 5 is defined as the first direction, and the integrated acoustic lens 7 has a focusing characteristic, which is used to transmit the difference between the first transducer assembly 1 and the second transducer assembly 2 along the first direction.
  • the frequency of ultrasound is focused on a single target or multiple preset targets.
  • the physical parameters of the integrated acoustic lens 7 are variable, and the integrated acoustic lens 7 with different physical parameters can focus the ultrasonic waves emitted by the multi-frequency transducer at the same depth in the first direction, or make the ultrasonic waves emitted by the multi-frequency transducer Different depths in the first direction of ultrasound.
  • the shape of the integrated acoustic lens 7 can be concave or convex
  • the number of matching layer 6 is one or more layers
  • the preparation process of matching layer 6 and backing layer 3 includes methods such as direct bonding, casting, centrifugal and vapor deposition.
  • the integrated structural design of the acoustic lens simplifies the preparation process and difficulty of the equipment, and improves the integration and consistency of the equipment.
  • a plurality of transducers are arranged side by side or in a circle, without overlapping structure, and the influence between the first transducer assembly 1 and the second transducer assembly 2 is eliminated.
  • the direction perpendicular to the section of the multi-frequency ultrasonic transducer as shown in Figure 1 as the second direction
  • the first direction crosses or is perpendicular to the second direction
  • the focus position of the multi-frequency transducer is variable in the second direction
  • the direction parallel to the surface of the piezoelectric layer 5 is defined as the third direction
  • the variable physical parameters of the integrated acoustic lens 7 can also enable the multi-frequency transducer to focus on different positions in the third direction.
  • the piezoelectric layer 5 includes a ground electrode surface arranged on one side surface and a signal electrode surface arranged on the other side surface.
  • the ground electrode surface and the signal electrode surface respectively have electrodes, and the electrodes on the signal electrode surface are cut to form a piezoelectric layer.
  • Multiple piezoelectric array elements are arranged on the surface of the ground electrode, the array elements are arranged in an array structure, and the gaps between the array elements are filled with acoustic decoupling materials, specifically, it can be a one-dimensional linear array or a two-dimensional array; The gap between the array elements is cut, so that the electrical signals between the array elements are independent of each other.
  • the array design of the piezoelectric layer 5 provides the transducer with the capability of electronic focusing, making the focus position of the transducer variable in two dimensions, and greatly improving the focusing efficiency and focusing range of the transducer. Furthermore, the array design of the piezoelectric layer 5 and the presence of the integrated acoustic lens 7 enable the first transducer assembly 1 and the second transducer assembly 2 to simultaneously realize variable electronic focusing and As shown in Figure 3b, the focusing function of the acoustic lens physically focuses in two directions, which greatly improves the accuracy of the target position and the resolution of the image.
  • the material of the piezoelectric layer 5 may be a traditional piezoelectric material, or a 1-3 composite piezoelectric material or a 2-2 composite piezoelectric material.
  • the flexible circuit board 4 is used to realize the electrical interconnection between the piezoelectric layer 5 and the external circuit, including several electrode leads and two ground wires, and the wires in the flexible circuit board 4 correspond to each element of the piezoelectric layer 5 one by one Fitting, the width of each wire is smaller than the array element width.
  • the flexible circuit board 4 may lead out the array element leads from one side, or lead out the array element leads through interspersed leads from both sides.
  • the element spacing of the first transducer assembly 1 is too small, and the wiring density on one side is too high. It is preferable to adopt the method of interspersed wiring on both sides, which is specifically embodied in wiring every other array element on one side.
  • the lead wires of two adjacent array elements are led out from both sides respectively, and the positions of the two lead wires differ from each other by an array element pitch in a direction perpendicular to the array element lead wires.
  • the flexible circuit board 4 may lead the array element leads out from one side, two sides or four sides.
  • the flexible circuit board 4 When the flexible circuit board 4 is connected to the piezoelectric layer 5, it can directly cover the entire surface of the piezoelectric layer 5, and will be located between the piezoelectric layer 5 and the backing layer 3; The connection area is cut out on a flexible circuit board 4 to connect the electrical signal of the array element with the flexible circuit board 4, so that the flexible circuit board 4 only covers the surface of the connection area on the piezoelectric layer 5.
  • the electrical layer 5 can directly contact the backing layer 3 to obtain better sound absorption effect.
  • multiple flexible circuit boards 4 may be used on both sides of the piezoelectric layer 5 to connect the flexible circuit board 4 to the array element for electrical signals by reserving a small section of additional connection area on both sides of the array element, so that The piezoelectric layer 5 can be in direct contact with the backing layer 3 . Since the first transducer assembly 1 is sensitive to signal interference and attenuation, it is preferable to adopt the form of hollowing out the middle of the flexible circuit board 4 or connect two flexible circuit boards 4 to the piezoelectric layer 5 to obtain better absorption. sound effects.
  • the flexible circuit board 4 covers the surface of the signal electrode surface, and is bonded to the signal electrode surface with epoxy resin according to the one-to-one correspondence relationship between wires and array elements.
  • the position of the focal point of the multi-frequency transducer formed by setting the second transducer assembly 2 on the left and right sides of the first transducer assembly 1 has certain rules:
  • the second transducer assemblies 2 on both sides of the first transducer assembly 1 are respectively the first low-frequency unit and the second low-frequency unit.
  • the ultrasonic waves emitted by the first low-frequency unit and the second low-frequency unit are focused along the first direction through the integrated acoustic lens 7 .
  • the focal point formed by the ultrasonic waves emitted by the first low-frequency unit and the second low-frequency unit after passing through the integrated acoustic lens 7 is on the center line of the first transducer assembly 1, or in the ultrasonic action area of the first transducer assembly 1 Inside.
  • the ultrasonic waves will be focused along the first direction through the integrated acoustic lens 7 .
  • the first low-frequency unit, the second low-frequency unit and the ultrasonic waves emitted by the first transducer assembly 1 pass through the one-piece acoustic lens 7. Different positions on the centerline in the direction.
  • the ultra-harmonic imaging and elastography modes of low-frequency excitation and high-frequency imaging can be performed simultaneously, as well as the interference-free synchronous high-quality ultrasound of multi-band transducers. Imaging mode, with multi-modal imaging characteristics.
  • the multi-band transducer uses confocal characteristics to perform multi-frequency synchronous imaging on a single target point to improve the imaging quality; as shown in Figure 4b, it uses multi-frequency characteristics to image different Simultaneous imaging of the position and depth of the target to enhance the imaging range and imaging efficiency of the transducer; as shown in Figure 5a, the ultra-harmonic imaging and elastography of low-frequency signal excitation and high-frequency signal reception for the same focused target position ; as shown in Figure 5b, it is to perform synchronous low-frequency excitation and high-frequency imaging on target positions at different depths, or use a pair of high-frequency units and low-frequency units to perform synchronous superharmonic imaging/elastic imaging on the same target position and use Another transducer performs fundamental imaging or guidance.
  • the present invention is applicable to array ultrasonic transducers in all frequency ranges.
  • This embodiment only provides a specific structure of a dual-frequency transducer.
  • those skilled in the art can use multiple transducers according to the The two transducer assemblies 2 are arranged around the first transducer assembly 1 or the second transducer assembly 2 and the first transducer assembly 1 are arranged side by side to form a multi-frequency ultrasonic transducer.
  • the quantity of the second transducer assembly 2 is not limited.
  • This embodiment provides a method for manufacturing a dual-frequency ultrasonic transducer composed of a first transducer assembly 1 and second transducer assemblies 2 on both sides as shown in Figure 6, specifically comprising the following steps:
  • the two sides of the piezoelectric sheet are ground flat, and the thickness is greater than the first preset thickness.
  • the number of array elements and the array element spacing of the first transducer assembly 1 and the second transducer assembly 2 are different. surface for cutting.
  • the material of the piezoelectric layer 5 is ceramics.
  • a matching layer 6 with a prepared composition is deposited by centrifugation, and after drying and solidification, the thickness is ground to a second preset thickness, and the piezoelectric layer 5 and the first matching layer 6 are laminated.
  • the total thickness of the layer sample is then continue to deposit the second matching layer 6 on the first matching layer 6 by centrifugation, and grind the second matching layer 6 to a second predetermined thickness after drying and solidifying.
  • the laminated sample is turned over with the signal electrode facing up, and the piezoelectric sheet is ground to a first preset thickness and polished.
  • the surface electrode is shallowly cut along the slit of the one-dimensional linear array on the ground electrode surface of the piezoelectric layer 5, so that the electrical signals between the array elements are independent of each other.
  • the piezoelectric layer 5 is electrically connected to the flexible circuit board 4, and the circuit of the piezoelectric layer 5 is drawn out:
  • the flexible circuit board 4 includes several electrode leads and two ground wires, and the wires in the circuit board can be attached to each array element one by one, and the width of each wire is smaller than the array element width.
  • the flexible circuit board 4 covers the surface of the signal electrode surface and leads out the piezoelectric layer 5 circuit. Specifically, the flexible circuit board leads the array element leads of the second transducer assembly 2 from one side; the first transducer assembly 1 is due to The spacing between the array elements is too small, and the density of the leads on one side is too high, so the interspersed leads on both sides are adopted, and the leads are performed every other array element on one side.
  • the lead wires of two adjacent array elements are led out from both sides respectively, and the positions of the two lead wires are different from each other by one array element pitch in the direction perpendicular to the array element lead wires.
  • the flexible circuit board 4 of the second transducer assembly 2 directly covers the entire signal electrode surface; the middle of the flexible circuit board 4 of the first transducer assembly 1 is hollowed out, and the electric signal of the array element relies on An additional connection area is reserved on the side for connection with the flexible circuit board 4 .
  • the flexible circuit board 4 is bonded to the surface of the signal electrode according to the one-to-one correspondence relationship between wires and array elements. Specifically, epoxy resin can be used for bonding.
  • the materials of the backing layer 3 are evenly mixed, centrifuged, solidified, and polished to the required size, and the prepared backing block is pasted on the flexible circuit board 4 by using a jig to form a backing layer. lining3.
  • the backing layer 4 is superimposed on the surface of the signal electrode. For example, when a small additional connection area is reserved on the piezoelectric layer 5 to connect with the flexible circuit board 4 , the backing layer 4 is in direct contact with the surface of the signal electrode.
  • the preparation of the integrated acoustic lens 7 includes two methods: the first method is to adopt independent processing, use TPX material or cure the epoxy resin and process it to the preset size and concave curvature of the lens, and process the thickness to be slightly thicker than the third preset
  • the thickness is set, and the shape is a flat cuboid with one side being a plane and the other side being an inner arch. Place the arched side on a convex mold with the same curvature and size to fully fit and fix it, polish the flat surface, and polish the integrated acoustic lens 7 to a third preset thickness.
  • the surface size of the integrated acoustic lens 7 is consistent with the size formed after the arrangement of the dual-frequency transducers.
  • the second transducer assembly 2 includes two low-frequency units, and the two low-frequency units are arranged in parallel and side by side on both sides of the first transducer assembly 1, and the insulating adhesive is used to replace the two low-frequency units.
  • the dual-frequency transducer is bonded to the side of the transducer to ensure that one side of the matching layer 6 of the dual-frequency transducer is flat.
  • the prepared acoustic lens is bonded and fixed to the matching layer 6 of the transducer with epoxy resin through a jig.
  • the preparation method of method 2 is pouring method. Firstly, the transducers are arranged and combined, and the transducers are bonded with an insulating adhesive to ensure that the second matching layer 6 of the dual-frequency transducer is on the same plane.
  • the two low-frequency units of the second transducer assembly 2 are arranged side by side in parallel on both sides of the first transducer assembly 1, and the dual-frequency transducer is bonded through the side of the transducer. combine.
  • a gap is formed between the transducer and the mold. The shape and size of the gap is the shape and thickness required by the lens, and then pour the fluid epoxy resin into the gap, and remove the excess burrs after curing.
  • the finished above-mentioned samples are put into an insulating casing for packaging, and the flexible circuit board 4 is connected to an external circuit through a standard interface.
  • This embodiment provides a method for quickly producing a transducer that meets the requirements of the present invention, and some of the steps can be adjusted, such as processing the piezoelectric sheet first, and sputtering electrodes on the ground electrode surface and the signal electrode surface respectively, Then the piezoelectric layer 5 is electrically connected to the flexible circuit board 4 , and then the matching layer 6 is superimposed on the ground electrode surface.
  • the manufacture of a dual-frequency transducer is taken as an example. Combining the structure of the multi-frequency ultrasonic transducer of the present invention and the process of this embodiment, those skilled in the art can make more transducers to combine into multi-frequency ultrasonic transducers. transducer.
  • This embodiment provides an ultrasonic imaging system, including the multi-frequency ultrasonic transducer described in Embodiment 1.
  • the integrated acoustic lens 7 can realize focusing of the first transducer assembly 1 and the second transducer assembly 2 along the first direction.
  • the change of the focus position of the ultrasonic waves of different frequencies emitted by the first transducer assembly 1 and the second transducer assembly 2 along the first direction can be realized by adjusting the physical parameters of the integrated acoustic lens 7, and the focus positions are located in the same direction in the first direction. Different positions in depth, or different depths in the first direction. Adjusting the physical parameters of the integrated acoustic lens 7 can also focus the ultrasonic waves of different frequencies emitted by the first transducer assembly 1 and the second transducer assembly 2 on different positions in the third direction.
  • the ultrasonic imaging system is also provided with a control unit for generating focus adjustment signals for the first transducer assembly 1 and the second transducer assembly 2 along the second direction, so that the multi-frequency ultrasonic transducer can realize the focus along the second direction.
  • the orientation of the focus position is variable for focusing.
  • the control unit adjusts the work of the excitation system of the multi-frequency transducer to adjust the electronic beam synthesis, and the change of the focus position in the second direction is realized by adjusting the electronic beam synthesis (that is, the electronic phased array delay of the array).
  • the ultrasonic imaging system of the present embodiment controls the focus position of the first transducer assembly 1 and the second transducer assembly 2, and controls the first transducer assembly 1 and the second transducer assembly 2 to perform Imaging, capable of a variety of imaging modes, including:
  • the first imaging mode through the structural characteristics of the integrated acoustic lens 7, the first transducer assembly 1 and the second transducer assembly 2 can be focused on a preset single target point along the first direction, adjusting 1
  • the focal positions of the first transducer assembly and the second transducer assembly 2 along the second direction make the focal positions of the first transducer assembly 1 and the second transducer assembly 2 along the second direction also be the above-mentioned
  • a single target point is preset, the frequency of the first transducer assembly 1 and the frequency of the second transducer assembly 2 are controlled, and multi-frequency synchronous imaging is performed on the single target point.
  • the second imaging mode through the structural characteristics of the integral acoustic lens 7 and controlling the frequency of the first transducer assembly 1 and the frequency of the second transducer assembly 2, the first transducer assembly 1 and the second transducer assembly
  • the detector assembly 2 focuses on multiple target points at different positions and depths on the same section or on different sections, and performs synchronous imaging on each target point.
  • the present invention provides a method of arranging the second transducer assembly around the first transducer assembly, and an integrated acoustic lens is laminated on the first transducer assembly to the second transducer assembly at the same time.
  • the multi-frequency ultrasonic transducer on the front side of the matching layer has no overlapping structure, and the influence between the first transducer component and the second transducer component is eliminated. Since the transducers do not affect each other, multi-modal imaging modes of multi-band high-quality ultrasound imaging, super-harmonic imaging and elastography can be performed simultaneously.
  • the array design of the piezoelectric layer provides the transducer with the ability to focus electronically, making the focus position of the transducer variable in two dimensions, which greatly improves the focusing efficiency and focusing range of the transducer. Furthermore, the array design of the piezoelectric layer and the simultaneous presence of the acoustic lens enable the first transducer assembly and the second transducer assembly to achieve electronic focusing and physical focusing at the same time, greatly improving the accuracy of the target position and image resolution.
  • the multi-frequency ultrasonic transducer is suitable for array ultrasonic transducers in all working frequency ranges, and has no built-in mechanical structure, simple process, high reliability, and strong operability.
  • the integrated structural design of the acoustic lens simplifies the installation of equipment. The preparation process and difficulty have improved the integration and consistency of the equipment.
  • the ultrasonic imaging system using the multi-frequency transducer can realize multiple imaging modes by controlling the first transducer assembly and the second transducer assembly.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

一种多频超声换能器及具有其的超声成像系统、方法，多频换能器包括第一换能器组件（1）和第二换能器组件（2），第二换能器组件（2）的频率低于第一换能器组件（1）的频率，每个第一换能器组件（1）、每个第二换能器组件（2）均包括层叠设置的背衬层（3）、压电层（5）和匹配层（6），第二换能器组件（2）排列在第一换能器组件（1）的两侧或周围；还包括一体式声透镜（7），一体式声透镜（7）同时层叠在第一换能器组件（1）的匹配层（6）前侧和第二换能器组件（2）的匹配层（6）前侧；还包括柔性电路板（4），柔性电路板（4）电性连接压电层（5）；压电层（5）包括地电极面和信号电极面，地电极面和信号电极面分别具有电极，且信号电极面的电极割开使压电层（5）形成多个压电阵元。

Description

一种多频超声换能器及具有其的超声成像系统、方法 技术领域
本发明涉及超声换能器技术领域，尤其涉及一种多频超声换能器及具有其的超声成像系统、方法。
背景技术
超声成像广泛应用于医疗诊断和工业检测等领域，具有无损、无辐射、便捷以及成本低等优势。超声换能器是能将电激励信号转换成超声信号又能将反射回来的超声信号转换成电信号的器件，是超声成像设备的关键部件。超声换能器的性能直接决定了超声成像的质量。超声换能器主要分为单阵元超声换能器和阵列超声换能器。由于成像的方便性，目前医疗和工业领域的超声成像设备主要使用的是阵列超声换能器。
在常规的超声成像中，超音波声学信号被引向探测区域，并且相应的反射回波信号被检测到。分析回波信号的特征，例如振幅，相移，多普勒频移，功率等，并将其量化为像素数据，这些像素数据用于创建流的图像或表示流。利用常规的单换能器超声成像，所接收的超声回波信号与所发送的超声信号在相同的频率范围内。
执行超声成像的另一种方法是将超声信号以一个频率施加到感兴趣的区域，并以另一频率(例如所发射超声信号的一个或多个谐波)捕获和分析接收到的回波信号。通常，谐波的频率是发射信号的3-5倍。谐波成像的一种特定用途是使用造影剂对组织成像。造影剂通常是液体或脂质包裹的微泡，其大小可在特定的透射超声波频率下产生共振。在微气泡的共振频率下暴露于体内的超声波会导致气泡破裂，并产生频率比所施加的超声波高得多的非线性超声波回波。例如，可以将非线性微气泡设计为在1-6MHz处谐振，但会产生10-30MHz范围内的回波信号。高频回波信号允许产生和研究组织结构的详细图像，例如在临床或临床前环境中围绕肿瘤的微脉管系统。
执行双频成像的最常规方式是使用具有共焦低频和高频换能器元件的机械扫描单元件换能器。尽管此类换能器工作良好，但可以使用可以电子控制的换能器阵列执行更快的扫描。这样的换能器通常具有彼此对准的低频换能器阵列和高频换能器阵列。双频换能器的一个问题是对齐低频和高频阵列。在30MHz高频相控阵中，元件尺寸(例如1/2λ或更小)约为25微米。在50MHz时，元件尺寸约为15微米。对齐阵列所需的过程通常需要对高频和低频换能器在潮湿工作台上的位置进行微调整，然后在找到最佳匹配时将它们粘合在一起。这既费时又昂贵。本文讨论的技术涉及一种更容易制造和制造成本更低的改进的双频换能器。
现有多频超声换能器的制作方法大多数是将低频换能器放置在高频换能器的后方形成叠加式结构,此种方法由于高频换能器的遮挡,使得后方的低频换能器所发射的声波信号被极大的干扰,影响声学信号的输出。对于前端的高频换能器,由于无法在后端添加背衬层,多余的声信号无法被很好的吸收,压电层的单次震荡时间也无法及时被缩短,将导致带宽的严重下降,从而影响成像的分辨率以及带宽。而并排式多频超声换能器或是拥有复杂的机械结构导致加工难度的提升和设备的可靠性下降,又或是多个换能器只拥有固定的角 度,导致焦点的变动需靠手动移动换能器的位置,操作复杂,精确度低。
综上所述，现有的多频超声换能器大多都是共焦点固定的双频共聚焦换能器，其仅能够通过手动移动换能器的位置来实现共焦点的变化操作复杂，精准度低，并且将高频换能器叠放在低频换能器的前面时，由于高频换能器的遮挡，会对低频换能器发出声波的传播造成影响，降低低频换能器的性能。而在实际应用中，往往需要能够精确控制超声换能器的焦点才能满足使用需求，如肿瘤消融和超声给药等治疗过程中，需要精确控制共焦点，以免健康的组织细胞被破坏造成内出血或其他负面症状。因此，现有的超声换能器在实际应用中的局限性极大。
发明内容
有鉴于此，为了克服上述现有技术的缺陷，本发明提出了一种可变焦的多频超声换能器及具有其的超声成像系统、方法。
具体地，所述多频超声换能器包括第一换能器组件和第二换能器组件，所述第二换能器组件的频率低于所述第一换能器组件的频率，每个所述第一换能器组件、每个所述第二换能器组件均包括层叠设置的背衬层、压电层和匹配层，所述第二换能器组件排列在所述第一换能器组件的两侧或四周；还包括一体式声透镜，所述一体式声透镜同时层叠在所述第一换能器组件的匹配层前侧和所述第二换能器组件的匹配层前侧；多个换能器成并排或环绕型排列,无叠加结构，消除了第一换能器组件和第二换能器组件之间的影响，可同时进行多频段的高质量超声成像,超谐波成像和弹性成像的多模态成像模式。
还包括柔性电路板，所述柔性电路板电性连接所述压电层；所述压电层包括地电极面和信号电极面，所述地电极面和信号电极面分别具有电极，且所述信号电极面的电极割开使所述压电层形成多个压电阵元。声透镜的一体化结构式设计简化了设备的制备流程与难度，提高了设备的整合性与一致性。压电层的阵列式设计为换能器提供了电子聚焦的能力，使得换能器在两个维度上的焦点位置可变，大幅提升了换能器的聚焦效率和聚焦范围。
具体地，所述地电极面的阵元一维线阵排列；或，所述地电极面的阵元二维面阵排列。
所述一体式声透镜具有超声聚焦特性，用于沿第一方向将所述第一换能器组件和所述第二换能器组件发出的不同频率的超声波聚焦于预设单体靶点或多个预设靶点。进一步，所述一体式声透镜的物理参数可变，具有不同的所述物理参数的所述一体式声透镜将所述第一换能器组件和所述第二换能器组件发出的不同频率的超声波聚焦在所述第一方向上的同一深度；或，具有不同的所述物理参数的所述一体式声透镜将所述第一换能器组件和所述第二换能器组件发出的不同频率的超声波聚焦在所述第一方向上的不同深度。
所述一体式声透镜的形状为凹型或凸型。压电层的阵列式设计和一体式声透镜的同时存在，使得第一换能器组件和第二换能器组件可以同时实现可变电子聚焦和声透镜物理聚焦两个方向的聚焦功能，大幅提升对靶点位置的准确度和图像的分辨率。
在一些实施例中，所述第二换能器组件排列在所述第一换能器组件的左右两侧，所述第二换能器组件发出超声波沿所述第一方向聚焦；所述第二换能器组件发出的超声波通过所述一体式声透镜后形成的聚焦焦点在所述第一换能器组件的中心线上，或者，在所述第一换能器组件的超声波左右区域内。
或者，所述第二换能器组件排列在所述第一换能器组件的左右两侧，所述第二换能器组件和所述第一换能器组件均发出超声波沿所述第一方向聚焦；所述第二换能器组件发出的超声波和所述第一换能器组件发出的超声波通过所述一体式声透镜后形成的聚焦焦点在所述第一方向上重合，或，在所述第一换能器组件的中心线上的不同位置。
所述柔性电路板覆盖所述压电层的整个表面；或，所述压电层两侧预留额外的连接区域，所述柔性电路板覆盖所述连接区域的表面。优选地，所述柔性电路板覆盖所述连接区域的表面，所述压电层与所述背衬层直接接触，能够实现更好的吸声效果。所述柔性电路板连接所述压电层的一侧或多侧。
本发明还提供了一种多频超声换能器的制作方法，用于制作上述多频超声换能器，所述多频超声换能器的制作包括：
制作压电层，包括：在压电层的地电极面上溅射电极和在信号电极面上溅射电极；
将所述压电层与柔性电路板电性连接，在所述压电层的所述地电极面的一侧叠加制作匹配层，所述信号电极面一侧叠加制作背衬层；
将第二换能器组件在第一换能器组件的两边或四周排列固定，将一块一体式声透镜同时层叠在所述第一换能器组件的匹配层前侧和所述第二换能器组件的匹配层前侧，所述一体式声透镜与所述第一换能器组件的匹配层和所述第二换能器组件的匹配层贴合固定。
所述“在压电层的地电极面上溅射电极”之前还包括：根据预设的所述压电层的阵元的数量和阵元的间距在所述地电极面上切割，在切割形成的切缝中填入声学去耦材料；
所述“在信号电极面上溅射电极”之后还包括：按照所述地电极面的所述阵元之间的间隙切开所述信号电极面的电极。
本发明还提供了一种超声成像系统，所述超声成像系统上述多频超声换能器，
还包括控制单元，用于产生对所述第一换能器组件和所述第二换能器组件的沿第二方向的聚焦调节信号，使所述多频超声换能器能实现沿第二方向的焦点位置可变的聚焦；
所述一体式声透镜实现对所述第一换能器组件和所述第二换能器组件的沿第一方向的聚焦；
其中，所述第一方向与所述第二方向交叉或垂直。
具体地，所述控制单元调节所述多频换能器的激励系统的电子波束合成。
一种上述超声成像系统的成像方法包括：
通过对所述第一换能器组件和所述第二换能器组件的焦点位置的控制，以及对所述第一换能器组件的频率和所述第二换能器组件的控制，实现至少一种以下成像模式：
第一种成像模式：通过所述一体式声透镜的结构特性实现对所述第一换能器组件和所述第二换能器组件的沿第一方向的聚焦于一预设单体靶点，调节所述第一换能器组件和所述第二换能器组件的沿第二方向的焦点位置，使所述所述第一换能器组件和所述第二换能器组件的沿第二方向的焦点位置也为所述预设单体靶点，控制所述第一换能器组件的频率和所述第二换能器组件的频率,对所述单体靶点进行多频同步成像；
第二种成像模式：通过所述一体式声透镜的结构特性以及所述控制所述第一换能器组件的频率和所述第二换能器组件的频率，使所述第一换能器组件和所述第二换能器组件聚焦于同一截面或不同截面上多个不同位置和深度的靶点，对各靶点进行同步成像。
综上所述，本发明的多频超声换能器具有以下有益效果：多个换能器成并排或环绕型排列,无叠加结构，消除了第一换能器组件和第二换能器组件之间的影响，可同时进行多频段的高质量超声成像,超谐波成像和弹性成像的多模态成像模式。压电层的阵列式设计为换能器提供了电子聚焦的能力，使得换能器在两个维度上的焦点位置可变，大幅提升了换能器的聚焦效率和聚焦范围。进一步，压电层的阵列式设计和声学透镜的同时存在，使得第一换能器组件和第二换能器组件可以同时实现电子聚焦和物理聚焦，大幅提升对靶点位置的准确度和图像的分辨率。该多频超声换能器可适用于所有工作频率范围的阵列超声换能器，且无内置机械结构,工艺简单，可靠性高，可操作性强，声透镜的一体化结构式设计简化了设备的制备流程与难度，提高了设备的整合性与一致性。应用该多频换能器的超声成像系统通过对第一换能器组件和第二换能器组件的控制能够实现多种成像模式。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明的多频超声换能器的结构示意图；
图2为本发明的多频超声换能器的整体结构示意图；
图3a为本发明的多频超声换能器的纵向可变电子聚焦的示意图；
图3b为本发明的多频超声换能器的横向物理聚焦的示意图；
图4a为本发明的多频超声换能器的多频同步成像模式的示意图；
图4b为本发明的多频超声换能器同时进行不同深度靶点的同步成像的示意图；
图5a为本发明的多频超声换能器的低频激励高频接收模式的示意图；
图5b为本发明的多频超声换能器对不同深度的靶点进行超谐波成型和弹性成像的示意图；
图6为本发明的多频超声换能器的另一结构示意图。
附图标记：
1-第一换能器组件；2-第二换能器组件；3-背衬层；4-柔性电路板；5-压电层；6-匹配层；7-一体式声透镜。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
本发明提供了一种可变焦的多频超声换能器及具有其的超声成像系统、方法。本发明的多频超声换能器，包括第一换能器组件和第二换能器组件，第二换能器组件包括两个及 以上的换能器，其数量具体可以是两个、三个、四个或是更多。第一换能器组件居中，第二换能器组件排列在第一换能器组件的两侧或周围，具体为第二换能器组件排列在第一换能器组件的两侧或三侧，或排列在第一换能器组件的四周。其中，第二换能器组件的频率低于第一换能器组件的频率。可以是第二换能器组件的频率为1-5MHz；第一换能器组件的频率为5-30MHz。因此，在本发明中，第一换能器组件的换能器形成多频超声换能器中频率相对较高的高频单元，第二换能器组件的换能器形成多频超声换能器中频率相对较低的低频单元。
每个第一换能器组件和每个第二换能器组件均包括层叠设置的背衬层、压电层和匹配层。该多频超声换能器还包括一体式声透镜，一体声透镜同时层叠在第一换能器组件的匹配层前侧和第二换能器组件的匹配层前侧。第二换能器组件用于进行声学信号的输出，第一换能器组件用于声学信号的接收。对多个换能器采用非叠加式结构进行整合，避免换能器之间的相互干扰。
实施例1
本实施例提供了一种双频换能器的具体结构。参见图1和图2，该双频换能器的第一换能器组件1包括一个高频单元和第二换能器组件2包括两个低频单元；第一换能器组件1的类型可以是线阵或面阵换能器,可以是相控阵或非相控阵换能器。每个换能器包括背衬层3、柔性电路板4、压电层5和匹配层6，其中，背衬层3、压电层5和匹配层6依次层叠排列。第二换能器组件2的两个低频单元平行并排设置在紧靠第一换能器组件1的两侧，双频换能器的第一换能器组件1和第二换能器组件2的匹配层6在同一平面上，所有换能器由一块一体式声透镜7连接，一体式声透镜7同时层叠在第一换能器组件1的匹配层6前侧和两个第二换能器组件2的匹配层6前侧。一体式声透镜7的表面尺寸与双频换能器排列之后形成的匹配层6大小一致。
定义与压电层5的表面垂直的方向为第一方向，一体式声透镜7具有聚焦特性，用于沿第一方向将第一换能器组件1和第二换能器组件2发出的不同频率的超声波聚焦于单体靶点或多个预设靶点。一体式声透镜7的物理参数可变，具有不同的物理参数的一体式声透镜7使多频换能器发出的超声波聚焦在第一方向上的同一深度，或使多频换能器发出的超声波第一方向上的不同深度。其中，一体式声透镜7的形状可以是凹型或者凸型，匹配层6数量为一层或多层，匹配层6和背衬层3制备工艺包括直接粘接，铸造，离心以及气相沉积等方法。声透镜的一体化结构式设计简化了设备的制备流程与难度，提高了设备的整合性与一致性。多个换能器成并排或环绕型排列,无叠加结构，消除了第一换能器组件1和第二换能器组件2之间的影响。
定义垂直于如图1所示的多频超声换能器的截面的方向为第二方向，第一方向与第二方向交叉或垂直，多频换能器的焦点位置在第二方向上可变。定义与压电层5的表面平行的方向为第三方向，一体式声透镜7的物理参数可变还可以使多频换能器能够聚焦于第三方向上的不同位置。
压电层5包括设置在一侧表面的地电极面和设置在另一侧表面的信号电极面，地电极面和信号电极面分别具有电极，且信号电极面的电极割开使压电层形成多个压电阵元。具体地，在地电极面体现为阵元呈阵列结构排列，阵元间隙中填充有声学去耦材料，具体地 可以是一维线阵或二维面阵；信号电极面表面的电极按照地电极面的阵元间隙切开，使得阵元之间的电信号彼此独立。压电层5的阵列式设计为换能器提供了电子聚焦的能力，使得换能器在两个维度上的焦点位置可变，大幅提升了换能器的聚焦效率和聚焦范围。进一步，压电层5的阵列式设计和一体式声透镜7的同时存在，使得第一换能器组件1和第二换能器组件2可以同时实现如图3a所示的可变电子聚焦和如图3b所示的声透镜物理聚焦两个方向的聚焦功能，大幅提升对靶点位置的准确度和图像的分辨率。可选地，压电层5的材料可以是传统压电材料，也可以是1-3复合压电材料或者2-2复合压电材料。
柔性电路板4用于实现压电层5与外部电路的电气互连，包括若干个电极引线和2个地线，柔性电路板4中的导线与压电层5的每个阵元一一对应贴合，每根导线宽度小于阵元宽度。压电层5的阵元为一维阵列结构时，柔性电路板4可以是将阵元引线从单侧引出，也可以是从两侧穿插式引线将阵元引线引出。第一换能器组件1的阵元间距过小，单侧引线密度太大，优选地采用两侧穿插式引线的方式，具体体现为在单侧每间隔一个阵元进行一次引线。相邻两个阵元的引线分别从两侧引出，两条引线在垂直于阵元引线的方向上互相相差一个阵元间距的位置。若压电层5的阵元为二维阵列结构，柔性电路板4可以是将阵元引线从一侧或两侧或四侧将阵元引线引出。
柔性电路板4与压电层5进行连接时可以是直接覆盖住压电层5的整个表面，将位于压电层5与背衬层3中间；也可以是在阵元两侧预留小段额外的连接区域，在一块柔性电路板4上裁切出镂空区域，用于将阵元电性信号与柔性电路板4连接，使柔性电路板4仅覆盖压电层5上的连接区域表面，压电层5能够直接接触背衬层3以获得更好的吸声效果。在一些实施例中，也可以是在压电层5两侧分别采用多块柔性电路板4通过阵元两侧预留小段额外的连接区域将柔性电路板4与阵元电性信号连接，使压电层5能够与背衬层3直接接触。由于第一换能器组件1对信号的干扰和衰减敏感，优选地，采用将柔性电路板4中间挖空的形式或采用两块柔性电路板4与压电层5连接以获得更好的吸声效果。在本实施例中，柔性电路板4覆盖在信号电极面表面，与信号电极面按照导线与阵元一一对应的关系用环氧树脂进行粘合。
将第二换能器组件2设置在第一换能器组件1左右两侧的多频换能器的形成的聚焦焦点的位置具有一定规律：
如本实施例所述的双频换能器，第一换能器组件1两侧的第二换能器组件2分别为第一低频单元和第二低频单元。第一低频单元和第二低频单元发出的超声波通过一体式声透镜7沿第一方向聚焦。第一低频单元和第二低频单元发出的超声波通过一体式声透镜7后形成的聚焦焦点在第一换能器组件1的中心线上，或者，在第一换能器组件1的超声波作用区域内。
若第一低频单元、第二低频单元和第一换能器组件1均向外发射超声波，超声波通过一体式声透镜7沿第一方向聚焦。第一低频单元、第二低频单元和第一换能器组件1发出的超声波通过一体式声透镜7后形成的聚焦焦点在第一方向上重合，或在第一换能器组件1在第一方向上的中心线上的不同位置。
本实施例的双频换能器由于换能器之间互不影响，可以同时进行低频激励高频成像的超谐波成像和弹性成像模式,以及多频段换能器的无干扰同步高质量超声成像模式,具备 多模态成像特性。例如,如图4a所示多频段的换能器利用共聚焦特性对单体靶点进行多频同步成像从而提升成像质量；如图4b所示为用多频特性对同一截面或不同截面上不同位置和深度的靶点进行同步成像,增强换能器的成像范围和成像效率；如图5a所示为对同一聚焦靶点位置进行低频信号激励和高频信号接收的超谐波成像和弹性成像；如图5b所示为对不同深度的靶点位置进行同步低频激励和高频成像,或使用一对高频单元和低频单元对同一靶点位置进行同步超谐波成像/弹性成像并同时利用另一个换能器进行基波成像或引导。
本发明适用于所有频率范围的阵列超声换能器，本实施例仅提供了一种双频换能器的具体结构，按照本发明的原理，本领域技术人员可以将多个换能器按照第二换能器组件2环绕第一换能器组件1排列或第二换能器组件2与第一换能器组件1并排排列的形式组合成多频超声换能器。其中，第二换能器组件2的数量不受限制。
实施例2
本实施例提供了如图6所示的由一个第一换能器组件1和两侧的第二换能器组件2组成的双频超声换能器的制作方法，具体包括以下步骤：
在压电层5的地电极面制作一维线阵式的阵元，溅射地电极面的电极：
将压电片两面磨平，厚度大于第一预设厚度。根据预设的阵元数量和阵元间距在地电极面上进行一维方向的切割，切割深度大于最终预计深度，但不切穿压电片。在切缝中填入绝缘环氧树脂作为声学去耦材料，待环氧树脂干燥固化后将表面多余的环氧树脂磨去，直至露出压电材料的表面，再对其进行抛光处理，得到一维线阵式压电层5。在地电极面的表面溅射上电极，记下样品厚度。具体的，第一换能器组件1和第二换能器组件2的阵元数量和阵元间距不同，对不同的换能器分别根据其各自的阵元数量和阵元间距在压电片表面进行切割。在本实施例中，压电层5的材料是陶瓷。
在压电层5的地电极面上叠加制作匹配层6，溅射信号电极面的电极：
在地电极面上利用离心的方法沉积一层调制好组分的匹配层6，干燥凝固后将其厚度磨至第二预设厚度，并记下压电层5和第一层匹配层6叠层样品总厚度。之后在第一层匹配层6上继续利用离心的方法沉积第二层匹配层6，干燥凝固后将第二匹配层6的厚度磨至第二预设厚度。将叠层样品翻面，信号电极面朝上，将压电片磨至第一预设厚度并抛光。在信号电极面的表面溅射上电极后再沿压电层5地电极面上的一维线阵的切缝浅浅的切开表面的电极，使得阵元之间的电信号彼此独立。
压电层5与柔性电路板4电性连接，将压电层5电路引出：
按照第二换能器组件2和第一换能器组件1不同的阵元间距和数量定制相应的柔性电路板4，根据阵元尺寸、数目以及排布方式，设计柔性电路板4的线路设计图，其中，柔性电路板4包含若干个电极引线和2个地线，且电路板中的导线能与每个阵元一一对应贴合，每根导线宽度要小于阵元宽度。
柔性电路板4覆盖在信号电极面的表面上引出压电层5电路，具体地，柔性线路板将第二换能器组件2的阵元引线从单侧引出；第一换能器组件1由于阵元间距过小，单侧引线的密度太大，故采取两侧穿插式引线，在单侧表现为每间隔一个阵元进行一次引线。相邻两个阵元的引线分别从两侧引出，两条引线在垂直于阵元引线的方向上互相相差一个阵 元间距的位置。在一些实施例中，第二换能器组件2的柔性电路板4直接覆盖住整个信号电极面；第一换能器组件1的柔性电路板4中间挖空，阵元电学信号依靠阵元两侧预留额外的连接区域与柔性电路板4进行连接。将柔性电路板4与信号电极面按照导线与阵元一一对应的关系进行粘合。具体地，可以采用环氧树脂进行粘合。
制作背衬层3：
按照一定的配比关系将背衬层3的材料混合均匀并离心、固化，并打磨平整至所需尺寸，使用夹具将制作好的背衬块通过环氧树脂粘贴至柔性电路板4上形成背衬层3。在一些实施例中，背衬层4叠加在信号电极面上，如压电层5上预留小段额外的连接区域与柔性电路板4连接时，背衬层4与信号电极面直接接触。
制作一体式声透镜7，整合双频换能器：
一体式声透镜7的制备包括两种方式：方式一为采取独立加工，使用TPX材料或将环氧树脂固化后加工至透镜预设的大小和内凹曲率，厚度加工至略厚于第三预设厚度，外形为一面为平面另一面为内拱形的扁长方体。将拱形一面放置在具有相同曲率和尺寸但为凸起的模具上完全贴合和固定，对平整的表面进行打磨，将一体式声透镜7打磨至第三预设厚度。一体式声透镜7的表面尺寸与双频换能器排列之后形成的大小一致。在本实施例中，将第二换能器组件2包括两个低频单元，将两个低频单元平行并排设置在紧靠第一换能器组件1的两侧，使用绝缘的粘合剂通过换能器的侧面将双频换能器进行粘合，保证双频换能器匹配层6一面的平整。接着将制备好的声透镜通过夹具用环氧树脂与换能器的匹配层6面进行贴合与固定。
方式二的制备方式为浇筑式，先将换能器排列组合，使用绝缘的粘合剂对换能器进行粘合，保证双频换能器第二匹配层6在同一平面上。在本实施例中，将第二换能器组件2的两个低频单元平行并排设置在紧靠第一换能器组件1的两侧，通过换能器的侧面将双频换能器进行粘合。将连接固定好的换能器，放入一种特殊定制的模具中，该模具具有与所需透镜一样的曲率但为凸起形状，换能器放入后在换能器和模具中间形成一层空隙，该空隙的形状尺寸即为透镜所需的形状和厚度，再将流动性的环氧树脂灌入空隙，固化后清除多余毛刺。
将制作完成的上述样品装入绝缘外壳中进行封装，柔性电路板4通过标准接口于外部电路相连接。
本实施例提供的是一种能够快速的制作符合本发明要求的换能器方法，其部分步骤可以调整，例如先加工压电片，并分别在地电极面和信号电极面上溅射电极，然后在将压电层5与柔性电路板4电性连接，再在地电极面上叠加制作匹配层6。
本实施例中以双频换能器的制作为例，结合本发明的多频超声换能器结构和本实施例的流程，本领域技术人员可以制作更多的换能器组合成多频超声换能器。
实施例3
本实施例提供了一种超声成像系统，包括实施例1所述的多频超声换能器。
一体式声透镜7能够实现对第一换能器组件1和第二换能器组件2的沿第一方向的聚焦。第一换能器组件1和第二换能器组件2发出的不同频率的超声波沿第一方向的聚焦位置的变化可通过一体式声透镜7的物理参数调整实现，聚焦位置位于第一方向同一深度的 不同位置，或位于第一方向上的不同深度。调整一体式声透镜7的物理参数也可以将第一换能器组件1和第二换能器组件2发出的不同频率的超声波聚焦于第三方向上的不同位置。超声成像系统还设置有控制单元，用于产生对第一换能器组件1和第二换能器组件2的沿第二方向的聚焦调节信号，使多频超声换能器能实现沿第二方向的焦点位置可变的聚焦。具体地，控制单元调节多频换能器的激励系统的工作，能够调整电子波束合成，第二方向聚焦位置的变化通过对电子波束合成(即阵列的电子相控阵延时)进行调整实现。
本实施例的超声成像系统通过对第一换能器组件1和第二换能器组件2的焦点位置的控制，以及对第一换能器组件1和第二换能器组件2的控制进行成像，能够实现多种成像模式，具体包括：
第一种成像模式：通过一体式声透镜7的结构特性实现对第一换能器组件1和第二换能器组件2的沿第一方向的聚焦于一预设单体靶点，调节1第一换能器组件和第二换能器组件2的沿第二方向的焦点位置，使第一换能器组件1和第二换能器组件2的沿第二方向的焦点位置也为上述预设单体靶点，控制第一换能器组件1的频率和第二换能器组件2的频率,对单体靶点进行多频同步成像。
第二种成像模式：通过一体式声透镜7的结构特性以及控制第一换能器组件1的频率和第二换能器组件2的频率，使第一换能器组件1和第二换能器组件2聚焦于同一截面或不同截面上多个不同位置和深度的靶点，对各靶点进行同步成像。
综上所述，本发明提供了一种将第二换能器组件排列在第一换能器组件的周围，一个一体式声透镜同时层叠在第一换能器组件给第二换能器组件的匹配层前侧的多频超声换能器，该多频超声换能器无叠加结构，消除了第一换能器组件和第二换能器组件之间的影响。由于换能器之间互不影响,可同时进行多频段的高质量超声成像,超谐波成像和弹性成像的多模态成像模式。压电层的阵列式设计为换能器提供了电子聚焦的能力，使得换能器在两个维度上的焦点位置可变，大幅提升了换能器的聚焦效率和聚焦范围。进一步，压电层的阵列式设计和声学透镜的同时存在，使得第一换能器组件和第二换能器组件可以同时实现电子聚焦和物理聚焦，大幅提升对靶点位置的准确度和图像的分辨率。该多频超声换能器可适用于所有工作频率范围的阵列超声换能器，且无内置机械结构,工艺简单，可靠性高，可操作性强，声透镜的一体化结构式设计简化了设备的制备流程与难度，提高了设备的整合性与一致性。应用该多频换能器的超声成像系统通过对第一换能器组件和第二换能器组件的控制能够实现多种成像模式。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，除了以上实施例以外，还可以具有不同的变形例，以上实施例的技术特征可以相互组合，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (11)

  1. 一种多频超声换能器，其特征在于，包括第一换能器组件和第二换能器组件，所述第二换能器组件的频率低于所述第一换能器组件的频率，每个所述第一换能器组件、每个所述第二换能器组件均包括层叠设置的背衬层、压电层和匹配层，所述第二换能器组件排列在所述第一换能器组件的两侧或周围；
    还包括一体式声透镜，所述一体式声透镜同时层叠在所述第一换能器组件的匹配层前侧和所述第二换能器组件的匹配层前侧；
    还包括柔性电路板，所述柔性电路板电性连接所述压电层；
    所述压电层包括地电极面和信号电极面，所述地电极面和信号电极面分别具有电极，且所述信号电极面的电极割开使所述压电层形成多个压电阵元。
  2. 根据权利要求1所述的多频超声换能器，其特征在于，所述一体式声透镜具有超声聚焦特性，用于沿第一方向将所述第一换能器组件和所述第二换能器组件发出的不同频率的超声波聚焦于预设单体靶点或多个预设靶点。
  3. 根据权利要求2所述的多频超声换能器，其特征在于，所述一体式声透镜的物理参数可变，具有不同的所述物理参数的所述一体式声透镜将所述第一换能器组件和所述第二换能器组件发出的不同频率的超声波聚焦在所述第一方向上的同一深度；
    或，具有不同的所述物理参数的所述一体式声透镜将所述第一换能器组件和所述第二换能器组件发出的不同频率的超声波聚焦在所述第一方向上的不同深度。
  4. 根据权利要求1所述的多频超声换能器，其特征在于，所述第二换能器组件排列在所述第一换能器组件的左右两侧，所述第二换能器组件发出超声波沿所述第一方向聚焦；
    所述第二换能器组件发出的超声波通过所述一体式声透镜后形成的聚焦焦点在所述第一换能器组件的中心线上，或者，在所述第一换能器组件的超声波左右区域内。
  5. 根据权利要求1所述的多频超声换能器，其特征在于，所述第二换能器组件排列在所述第一换能器组件的左右两侧，所述第二换能器组件和所述第一换能器组件均发出超声波沿所述第一方向聚焦；
    所述第二换能器组件发出的超声波和所述第一换能器组件发出的超声波通过所述一体式声透镜后形成的聚焦焦点在所述第一方向上重合，或，在所述第一换能器组件的中心线上的不同位置。
  6. 根据权利要求1所述的多频超声换能器，其特征在于，所述柔性电路板覆盖所述压电层的整个表面；
    或，所述柔性电路板连接所述压电层的一侧或多侧；
    优选地，所述压电层两侧预留额外的连接区域，所述柔性电路板覆盖所述连接区域的表面。
  7. 一种多频超声换能器的制作方法，用于制作权利要求1-7任一项所述的多频超声换能器，其特征在于，所述多频超声换能器的制作包括：
    制作压电层，包括：在压电层的地电极面上溅射电极和在信号电极面上溅射电极；
    将所述压电层与柔性电路板电性连接，在所述压电层的所述地电极面的一侧叠加制作匹配层，所述信号电极面一侧叠加制作背衬层；
    将第二换能器组件在第一换能器组件的两边或四周排列固定，将一块一体式声透镜同时层叠在所述第一换能器组件的匹配层前侧和所述第二换能器组件的匹配层前侧，所述一体式声透镜与所述第一换能器组件的匹配层和所述第二换能器组件的匹配层贴合固定。
  8. 根据权利要求7所述的多频超声换能器的制作方法，其特征在于，所述“在压电层的地电极面上溅射电极”之前还包括：根据预设的所述压电层的阵元的数量和阵元的间距在所述地电极面上切割，在切割形成的切缝中填入声学去耦材料；
    所述“在信号电极面上溅射电极”之后还包括：按照所述地电极面的所述阵元之间的间隙切开所述信号电极面的电极。
  9. 一种超声成像系统，其特征在于，包括权利要求1-6中任一项所述的多频超声换能器，
    还包括控制单元，用于产生对所述第一换能器组件和所述第二换能器组件的沿第二方向的聚焦调节信号，使所述多频超声换能器能实现沿第二方向的焦点位置可变的聚焦；
    所述一体式声透镜实现对所述第一换能器组件和所述第二换能器组件的沿第一方向的聚焦；
    其中，所述第一方向与所述第二方向交叉或垂直。
  10. 根据权利要求9所述的超声成像系统，其特征在于，所述控制单元调节所述多频换能器的激励系统的电子波束合成。
  11. 一种如权利要求9或10所述的超声成像系统的成像方法，其特征在于，
    通过对所述第一换能器组件和所述第二换能器组件的焦点位置的控制，以及对所述第一换能器组件的频率和所述第二换能器组件的控制，实现至少一种以下成像模式：
    第一种成像模式：通过所述一体式声透镜的结构特性实现对所述第一换能器组件和所述第二换能器组件的沿第一方向的聚焦于一预设单体靶点，调节所述第一换能器组件和所述第二换能器组件的沿第二方向的焦点位置，使所述所述第一换能器组件和所述第二换能器组件的沿第二方向的焦点位置也为所述预设单体靶点，控制所述第一换能器组件的频率和所述第二换能器组件的频率，对所述单体靶点进行多频同步成像；
    第二种成像模式：通过所述一体式声透镜的结构特性以及所述控制所述第一换能器组件的频率和所述第二换能器组件的频率，使所述第一换能器组件和所述第二换能器组件聚焦于同一截面或不同截面上多个不同位置和深度的靶点，对各靶点进行同步成像。
PCT/CN2021/113793 2021-08-20 2021-08-20 一种多频超声换能器及具有其的超声成像系统、方法 Ceased WO2023019554A1 (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/113793 WO2023019554A1 (zh) 2021-08-20 2021-08-20 一种多频超声换能器及具有其的超声成像系统、方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/113793 WO2023019554A1 (zh) 2021-08-20 2021-08-20 一种多频超声换能器及具有其的超声成像系统、方法

Publications (1)

Publication Number Publication Date
WO2023019554A1 true WO2023019554A1 (zh) 2023-02-23

Family

ID=85239380

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/113793 Ceased WO2023019554A1 (zh) 2021-08-20 2021-08-20 一种多频超声换能器及具有其的超声成像系统、方法

Country Status (1)

Country Link
WO (1) WO2023019554A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116531025A (zh) * 2023-05-12 2023-08-04 济南康寿鑫医疗科技有限公司 一种调制增强的适形心脏可穿戴超声探头及诊断设备
WO2026082182A1 (zh) * 2024-10-17 2026-04-23 深圳迈瑞生物医疗电子股份有限公司 医用超声探头、声头模块及超声设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204044114U (zh) * 2014-07-16 2014-12-24 浙江省交通规划设计研究院 一种环形超声阵列换能器
KR20170032704A (ko) * 2015-09-15 2017-03-23 이일권 다중 주파수 전송 구조의 피부 개선 초음파 디바이스 및 그의 제어 방법
CN109530194A (zh) * 2018-10-18 2019-03-29 天津大学 一种多电极cmut单元及多频式电容微机械超声换能器
CN110448332A (zh) * 2019-09-12 2019-11-15 深圳市索诺瑞科技有限公司 一种通用型的超声换能器
CN111250376A (zh) * 2020-01-15 2020-06-09 江苏英特神斯科技有限公司 一种多频自聚焦微机械超声换能器
CN113042347A (zh) * 2021-03-10 2021-06-29 深圳欢影医疗科技有限公司 一种阵列超声换能器

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204044114U (zh) * 2014-07-16 2014-12-24 浙江省交通规划设计研究院 一种环形超声阵列换能器
KR20170032704A (ko) * 2015-09-15 2017-03-23 이일권 다중 주파수 전송 구조의 피부 개선 초음파 디바이스 및 그의 제어 방법
CN109530194A (zh) * 2018-10-18 2019-03-29 天津大学 一种多电极cmut单元及多频式电容微机械超声换能器
CN110448332A (zh) * 2019-09-12 2019-11-15 深圳市索诺瑞科技有限公司 一种通用型的超声换能器
CN111250376A (zh) * 2020-01-15 2020-06-09 江苏英特神斯科技有限公司 一种多频自聚焦微机械超声换能器
CN113042347A (zh) * 2021-03-10 2021-06-29 深圳欢影医疗科技有限公司 一种阵列超声换能器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116531025A (zh) * 2023-05-12 2023-08-04 济南康寿鑫医疗科技有限公司 一种调制增强的适形心脏可穿戴超声探头及诊断设备
WO2026082182A1 (zh) * 2024-10-17 2026-04-23 深圳迈瑞生物医疗电子股份有限公司 医用超声探头、声头模块及超声设备

Similar Documents

Publication Publication Date Title
JP3478874B2 (ja) 超音波フェーズドアレイ変換器及びその製造方法
JP7666793B2 (ja) デュアル周波数超音波トランスデューサ
CN107398415B (zh) 超声换能器和制造超声换能器的方法
US8182428B2 (en) Dual frequency band ultrasound transducer arrays
US5792058A (en) Broadband phased array transducer with wide bandwidth, high sensitivity and reduced cross-talk and method for manufacture thereof
US5651365A (en) Phased array transducer design and method for manufacture thereof
US8836203B2 (en) Signal return for ultrasonic transducers
CN113042347B (zh) 一种阵列超声换能器
US20070035204A1 (en) Dual frequency band ultrasound transducer arrays
KR101354604B1 (ko) 초음파 프로브 및 그 제조방법
EP2268419A1 (en) Multiple frequency band acoustic transducer arrays
KR101354605B1 (ko) 초음파 프로브 및 그 제조방법
KR101435011B1 (ko) 초음파 프로브 및 그 제조방법
JP3288815B2 (ja) ２次元アレイ超音波プローブ
WO2023019554A1 (zh) 一种多频超声换能器及具有其的超声成像系统、方法
CN100418481C (zh) 具有多个压电元件的压电传感器
CN105640590B (zh) 超声探头和制造超声探头的方法
CN113643677B (zh) 一种多频超声换能器及具有其的超声成像系统、方法
CN216212320U (zh) 一种多频超声换能器及具有其的超声成像系统
CN110681558B (zh) 一维线阵压电元件的制备方法、二维面阵超声换能器
US10568606B2 (en) Ultrasonic probe and method of manufacturing the same
KR20150073056A (ko) 초음파 진단장치 및 초음파 진단장치의 제조방법
CN112022204A (zh) 一种新型抗干扰并联式叠层医用超声换能器及其制备方法
JPH07303299A (ja) 超音波探触子
JPH071920Y2 (ja) 超音波トランスデューサ

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21953795

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21953795

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 21953795

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 25/09/2024)