WO2023017737A1 - Probe device - Google Patents

Probe device Download PDF

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Publication number
WO2023017737A1
WO2023017737A1 PCT/JP2022/028987 JP2022028987W WO2023017737A1 WO 2023017737 A1 WO2023017737 A1 WO 2023017737A1 JP 2022028987 W JP2022028987 W JP 2022028987W WO 2023017737 A1 WO2023017737 A1 WO 2023017737A1
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WO
WIPO (PCT)
Prior art keywords
rib
circuit board
case
sub
ribs
Prior art date
Application number
PCT/JP2022/028987
Other languages
French (fr)
Japanese (ja)
Inventor
大樹 保科
裕介 安部
大輔 池田
Original Assignee
日置電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2022102450A external-priority patent/JP2023025673A/en
Application filed by 日置電機株式会社 filed Critical 日置電機株式会社
Publication of WO2023017737A1 publication Critical patent/WO2023017737A1/en

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/04Voltage dividers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00Arrangements for measuring currents or voltages or for indicating presence or sign thereof

Definitions

  • the present invention relates to a probe device, for example, to a probe device that drops a voltage input from a primary side, outputs it to a measuring device on the secondary side, and causes the measuring device to detect the voltage.
  • a probe device for example, there is a DC high voltage differential probe (hereinafter simply referred to as a "differential probe") that measures the battery voltage of electric vehicles and the like.
  • a junction box is provided between the probe and the output cable in this type of differential probe.
  • the high voltage of the battery, etc. on the primary side that is input via the probe is dropped to a low voltage by the relay box, and then output to the measuring device on the secondary side via the output cable to obtain the voltage. can be measured.
  • Creepage distance is the shortest distance along the surface of a solid insulating material between two conductive parts.
  • Spatial distance is the shortest distance in space between two conductive parts.
  • the present invention has been made in view of the above-mentioned problems, and aims to provide a probe device that can be made even more compact than before.
  • the other case has the insertion rib
  • the one case has a support rib group consisting of a plurality of ribs for supporting the back surface of the circuit board on which the resistance element is not installed. is preferred.
  • each rib of the group of insertion ribs has a supporting piece that abuts against the circuit board without being inserted into the plurality of slits, and the circuit board is connected to the group of insertion ribs. It is preferable that it is sandwiched between the support piece and the support rib group of the one case.
  • the insertion rib group is arranged at a position of the other case that does not come into contact with the plurality of resistor elements installed in the wave shape.
  • the support rib group supports the circuit board from the rear surface at a position facing the plurality of resistance elements without facing the insertion rib group.
  • each rib of the support rib group preferably supports the back surface of the circuit board so as to fill the spatial distance between the plurality of resistance elements, similarly to the insertion rib group.
  • FIG. 1 is a perspective view showing the overall configuration of a probe device according to one embodiment of the present invention
  • FIG. 1 is an exploded perspective view showing the configuration of a probe device according to one embodiment of the present invention
  • FIG. 1 is a perspective view showing a configuration of a circuit board housed in a relay box of a probe device according to one embodiment of the present invention
  • FIG. 4 is a perspective view showing the configuration of an upper case that forms a relay box of the probe device according to one embodiment of the present invention
  • FIG. 4 is a plan view showing the configuration of an upper case that forms a junction box of the probe device according to one embodiment of the present invention
  • FIG. 1 is a perspective view showing the overall configuration of a probe device according to one embodiment of the present invention
  • FIG. 1 is an exploded perspective view showing the configuration of a probe device according to one embodiment of the present invention
  • FIG. 1 is a perspective view showing a configuration of a circuit board housed in a relay box of a probe device according to one embodiment of the present invention
  • FIG. 4 is a perspective view showing the configuration of a lower case that forms a junction box of the probe device according to one embodiment of the present invention
  • FIG. 4 is a plan view showing the configuration of a lower case that forms a relay box of the probe device according to one embodiment of the present invention
  • FIG. 3 is a perspective view showing the configuration of a circuit board, insertion ribs, and support ribs accommodated in a junction box of a probe device according to an embodiment of the present invention
  • 4A and 4B are a perspective view (A) and a vertical cross-sectional view (B) for explaining the spatial distance when there is no insertion rib of the upper case according to the embodiment of the present invention
  • FIG. 5 is a vertical cross-sectional perspective view for explaining a spatial distance when an insertion rib of an upper case according to an embodiment of the present invention exists
  • FIG. 4A is a perspective view (A) and a vertical cross-sectional view (B) for explaining the case where the spatial distance between a plurality of resistor elements is lengthened by the insertion rib of the upper case and the support rib of the lower case according to the embodiment of the present invention; is.
  • a probe device (1) includes input terminals (130, 140) to which input probes are connected, and output terminals (112, 122) to be connected to a predetermined measuring device. ), and a relay box (200) for reducing the voltage input through the input terminals (130, 140) to a predetermined voltage level and then outputting the voltage from the output terminals (112, 122) to the measuring device.
  • the relay box (200) is arranged between one case (250), the other case (230), and the one case (250) and the other case (230), and has a plurality of Slits (M1, S1 to S6, E1 to E4) are formed, and a plurality of resistor elements (R1 to R14, R15 to R28) arranged in a wave shape on a circuit board (210), the one case (250) or the other case (230), or the one case (250) and the other case (230) provided in an intermediate member between the plurality of slits (M1, S1 to S6, E1 to E4), and an insertion rib group (RB1, RB2) consisting of a plurality of ribs respectively inserted.
  • M1, S1 to S6, E1 to E4 a plurality of resistor elements
  • the other case (230) has the insertion rib group (RB1, RB2), and the one case (250) is provided with the resistance elements (R1 to R14, R15 to R28). It is preferable to have a support rib group (LB1, LB2) consisting of a plurality of ribs for supporting the back surface (210u) of the circuit board (210) which is not attached.
  • each rib of the insertion rib group (RB1, RB2) is brought into contact with the circuit board (210) without being inserted into the plurality of slits (M1, S1 to S6, E1 to E4).
  • the circuit board (210) is connected between the support pieces of the insertion rib group (RB1, RB2) and the support rib group (LB1, LB2) of the one case (250). It is preferably sandwiched between them.
  • the insertion rib group (RB1, RB2) is the other case (230) that does not come into contact with the plurality of resistor elements (R1 to R14, R15 to R28) installed in the wave shape. is preferably arranged at the position of
  • the support rib group (LB1, LB2) does not face the insertion rib group (RB1, RB2) and faces the plurality of resistance elements (R1 to R14, R15 to R28). It is preferable to support the position of the circuit board (210) from the back surface.
  • each rib of the support rib group (LB1, LB2), like the insertion ribs (RB1, RB2), has a spatial distance between the plurality of resistor elements (R1 to R14, R15 to R28). It is preferable to support the back surface of the circuit board (210) so as to satisfy
  • FIG. 1 is a perspective view showing the overall configuration of a probe device according to one embodiment of the present invention.
  • FIG. 2 is an exploded perspective view showing the configuration of the probe device according to one embodiment of the present invention.
  • FIG. 3 is a perspective view showing the configuration of a circuit board housed in a junction box of a probe device according to an embodiment of the invention.
  • FIG. 4 is a perspective view showing the configuration of an upper case forming a relay box of the probe device according to one embodiment of the present invention.
  • FIG. 5 is a plan view showing the configuration of an upper case that forms a junction box of the probe device according to one embodiment of the present invention.
  • FIG. 6 is a perspective view showing the configuration of a lower case that forms a junction box of the probe device according to one embodiment of the present invention.
  • FIG. 1 is a perspective view showing the overall configuration of a probe device according to one embodiment of the present invention.
  • FIG. 2 is an exploded perspective view showing the configuration of the probe device according to one embodiment of the present invention
  • FIG. 7 is a plan view showing the configuration of a lower case that forms a junction box of the probe device according to one embodiment of the present invention.
  • FIG. 8 is a perspective view showing the configuration of a circuit board, insertion ribs, and support ribs housed in a junction box of a probe device according to an embodiment of the present invention.
  • 9A and 9B are a perspective view (A) and a vertical cross-sectional view (B) for explaining the spatial distance when there is no insertion rib of the upper case according to the embodiment of the present invention.
  • FIG. 10 is a vertical cross-sectional perspective view for explaining the spatial distance when there is an insertion rib of the upper case according to one embodiment of the present invention.
  • 11A and 11B are a perspective view (A) and a vertical cross section for explaining the case where the spatial distance between a plurality of resistor elements is lengthened by the insertion rib of the upper case and the support rib of the lower case according to one embodiment of the present invention. It is a figure (B).
  • the arrow a direction is one side
  • the arrow b direction is the other side
  • the arrow ab direction is the longitudinal direction.
  • a direction perpendicular to the longitudinal direction (arrow ab direction) is defined as a lateral direction.
  • the direction of arrow c is upward or upward
  • the direction of arrow d is downward or downward.
  • “upward” or “downward” does not necessarily match the vertical direction of the gravitational direction, and is a direction set for convenience of explanation. Therefore, the vertical direction may be reversed.
  • the probe device 1 As shown in FIGS. 1 and 2, the probe device 1 according to the embodiment of the present invention has two input terminals 130 and 140 connected to two input probes (not shown) on the other side (direction of arrow b). It has a relay box 200 provided.
  • the two input terminals 130 and 140 are terminals connected to measure the voltage (for example, 1000 V or higher) of a battery or the like on the primary side via two input probes (not shown).
  • the junction box 200 has, on one side (in the direction of arrow a), a positive output cable 110 with a probe terminal 111 attached to its tip, and a negative output cable 120 and 2 with a probe terminal 121 attached to its tip. It has two connection terminals 112 , 122 connected to one output cable 110 , 120 .
  • the two output cables 110, 120 of the relay box 200 are connected to the measuring device on the secondary side.
  • the measuring device receives and measures the high voltage input from the battery to the junction box 200 of the probe device 1 as a low voltage after voltage drop to a predetermined level via the output cables 110 and 120 .
  • the junction box 200 is composed of a circuit board 210 housed inside, an upper case 230 for housing the circuit board 210, and a lower case 250. As shown in FIG. A box case 270 that accommodates the circuit board 210 is formed by integrally attaching the upper case 230 and the lower case 250 . That is, junction box 200 is composed of box case 270 and circuit board 210 .
  • the circuit board 210 is a thin printed wiring board that is rectangular in plan view, and has a shorter length L1 in the longitudinal direction (arrow ab direction) than the conventional one.
  • the circuit board 210 has terminals 211 and 212 electrically connected to the output terminals 112 and 122 at one end (in the direction of the arrow a).
  • the circuit board 210 is connected to terminals 211 and 212 and has a wave shape (for example, a pulse wave shape) with sharp edges from one side (direction of arrow a) to the other side (direction of arrow b) along the longitudinal direction (direction of arrow ab). ) on the positive electrode side and a conductive pattern 214 on the negative electrode side.
  • the conductor patterns 213 and 214 may have various shapes such as a bellows shape, a wave shape with no sharp edges, a zigzag shape, and the like. I don't mind.
  • the conductor patterns 213 and 214 are composed of a plurality of longitudinal direction (arrow ab direction) portions (hereinafter referred to as “longitudinal direction portions”) 213L (213L1 to 213L5) and a plurality of longitudinal direction (arrow ab directions) perpendicular to the longitudinal direction (arrow ab direction). (hereinafter referred to as "transverse direction portion”) 213S and 213S are alternately connected to form a wavy shape. However, in FIG. 2, most of the width direction portion 213S is hidden due to the presence of resistance elements R1 to R14, which will be described later.
  • resistive elements R1 to R3 are installed in series in the first transverse direction portion 213S counted from one side (direction of arrow a). These resistive elements R1, R2, and R3 are electrically connected to each other through the lateral direction portion 213S of the conductor pattern 213. As shown in FIG.
  • the resistive elements R4 to R6 are installed in the next second lateral portion 213S.
  • the resistor elements R7 to R9 are arranged in the next third lateral portion 213S following the resistor element R6.
  • the resistive elements R10 to R12 are installed in the next fourth transverse direction portion 213S, and following the resistive element R12, the last fifth transverse direction portion 213S. are provided with resistance elements R13 and R14.
  • the resistance element R1 is connected to the terminal 211 and the longitudinal portion 213L1 of the conductor pattern 213. Also, the resistive element R3 and the resistive element R4 are electrically connected by the longitudinal portion 213L2 of the conductor pattern 213. As shown in FIG.
  • the longitudinal portions 213L3, 213L4, and 213L5 of the conductor pattern 213 are electrically connected to each other.
  • resistance element R14 is connected to the terminal 215 via the lateral direction portion 213S of the conductor pattern 213.
  • Terminal 215 of circuit board 210 is connected to input terminal 130 ( FIG. 1 ) of junction box 200 .
  • the resistance elements R1 to R14 are connected in series along the longitudinal portion 213L and the lateral portion 213S of the conductor pattern 213 in a wavy shape.
  • the resistance elements R1 to R14 are hereinafter referred to as a first resistance element group GR1.
  • the circuit board 210 can be made much shorter in length L1 in the longitudinal direction (arrow ab direction) than in the conventional art.
  • the conductor pattern 214 is the same as the conductor pattern 213, and three resistance elements R15 to R17 are installed in series in the first transverse direction portion 214S. They are electrically connected to each other via the lateral portion 214S.
  • resistive elements R18 to R20 are installed in the second transverse direction portion 214S following the resistive element R17, and resistive elements R18 to R20 are installed in the third transverse direction portion 214S following the resistive element R20.
  • 214S are provided with resistance elements R21 to R23.
  • resistive elements R24 to R26 are provided in the next fourth transverse direction portion 214S, and resistive elements R24 to R26 are provided in the last transverse direction portion 214S following the resistive element R26.
  • R27 and R28 are installed.
  • the resistance element R15 is connected to the terminal 212 by the longitudinal portion 214L1 of the conductor pattern 214. Also, the resistive element R17 and the resistive element R18 are electrically connected by a longitudinal portion 214L2 of the conductor pattern 214. As shown in FIG.
  • the longitudinal direction portions 214L3, 214L4, and 214L5 of the conductor pattern 214 are electrically connected to each other.
  • resistance element R28 is connected to the terminal 216 via the lateral direction portion 214S of the conductor pattern 214.
  • Terminal 216 of circuit board 210 is connected to input terminal 140 ( FIG. 1 ) of junction box 200 .
  • the resistance elements R15 to R28 are also connected in series in a wave shape along the conductor pattern 214 in the same manner as the resistance elements R1 to R14.
  • the resistance elements R15 to R28 are hereinafter referred to as a second resistance element group GR2.
  • the resistor elements R15 to R28 are all arranged and connected in series on a single straight line as in the related art. Overall length is shorter. As a result, the circuit board 210 can further reduce the length L1 in the longitudinal direction (arrow ab direction) by the first resistance element group GR1 and the second resistance element group GR2 compared to the conventional case.
  • the circuit board 210 includes a first resistance element group GR1 composed of resistance elements R1 to R14 connected via a conductor pattern 213, and a second resistance element group composed of resistance elements R15 to R28 connected via a conductor pattern 214. It has a main slit M1 extending along the longitudinal direction (arrow ab direction) so as to separate it from GR2 in the lateral direction.
  • the main slit M1 has a predetermined width and a predetermined length extending from the end surface 210e on the other side (direction of arrow b) to the end surface 210f on one side (direction of arrow a) along the longitudinal direction (direction of arrow ab) for a predetermined length. is the slit. However, the main slit M1 does not reach the end face 210f on one side of the circuit board 210 (in the direction of the arrow a).
  • circuit board 210 has sub-slits S1 and S4 extending from one end of the main slit M1 (in the direction of the arrow a) to both sides in the short direction perpendicular to the longitudinal direction (the direction of the arrow ab). .
  • Each of the sub-slits S1 and S4 extends in the lateral direction by a predetermined length, but the length does not reach the longitudinal portion 213L1 of the conductor pattern 213 and the longitudinal portion 214L1 of the conductor pattern 214. have.
  • the main slit M1 and the sub-slits S1 and S4 communicate with each other.
  • the circuit board 210 has sub-slits S2 and S5 at positions separated by a predetermined distance from the sub-slits S1 and S4 to the other side (in the direction of the arrow b).
  • the sub-slit S2 and the sub-slit S1 are arranged so as to sandwich the resistance elements S1 to S3 and the resistance elements S4 to S6.
  • the sub-slit S2 is parallel to the sub-slit S1 and has the same length, and does not reach the longitudinal portion 213L3 of the conductor pattern 213. As shown in FIG.
  • the sub-slit S2 communicates with the main slit M1.
  • the sub-slit S5 and the sub-slit S4 are arranged so as to sandwich the resistance elements S15 to S17 and the resistance elements S18 to S20.
  • the sub-slit S5 is parallel to the sub-slit S4 and has the same length, and does not reach the longitudinal portion 214L3 of the conductor pattern 214.
  • FIG. The sub-slit S5 communicates with the main slit M1.
  • the circuit board 210 has sub-slits S3 and S6 at positions separated from the sub-slits S2 and S5 by a predetermined distance to the other side (in the direction of the arrow b).
  • the sub-slit S3 and the sub-slit S2 are arranged so as to sandwich the resistance elements S7 to S9 and the resistance elements S10 to S12.
  • the sub-slit S3 is parallel to the sub-slits S1 and S2 and has the same length, and does not reach the longitudinal portion 213L5 of the conductor pattern 213 .
  • the sub-slit S3 communicates with the main slit M1.
  • the sub-slit S6 and the sub-slit S5 are arranged so as to sandwich the resistance elements S21 to S23 and the resistance elements S24 to S26.
  • the sub-slit S6 is parallel to the sub-slits S4 and S5 and has the same length, and does not reach the longitudinal portion 214L5 of the conductor pattern 214.
  • FIG. The sub-slit S6 communicates with the main slit M1.
  • the sub-slits S1 to S3 have the same basic configuration, the same width and the same length in the transverse direction, and are arranged parallel to each other. Further, the sub-slits S4 to S6 have the same basic configuration, have the same width and the same length in the transverse direction, and are arranged parallel to each other.
  • the sub-slit S1 and the sub-slit S4 are linearly connected via the main slit M1 in the lateral direction of the circuit board 210 .
  • the sub-slits S2 and S3 and the sub-slits S5 and S6 are also linearly connected in the lateral direction of the circuit board 210 via the main slit M1. That is, the main slit M1, the sub-slits S1 to S3, and the sub-slits S4 to S6 communicate with each other while crossing each other.
  • the edge slit E1 consists of a cut having a length that does not reach the longitudinal portion 213L2 of the conductor pattern 213, and is arranged between the sub-slit S1 and the sub-slit S2.
  • the circuit board 210 between the row of the resistance elements R7 to R9 and the row of the resistance elements R10 to R12 in the first resistance element group GR1, from the side end surface 210c toward the main slit M1. It has an extending edge slit E2.
  • the edge slit E2 is a cut having a length not reaching the longitudinal portion 213L4 of the conductor pattern 213, and is arranged between the sub-slit S2 and the sub-slit S3.
  • the edge slit E3 consists of a cut having a length that does not reach the longitudinal portion 214L2 of the conductor pattern 214, and is arranged between the sub-slit S4 and the sub-slit S5.
  • the edge slit E4 consists of a cut having a length that does not reach the longitudinal portion 214L4 of the conductor pattern 214, and is arranged between the sub-slit S5 and the sub-slit S6.
  • the upper case 230 of the box case 270 has an internal space capable of accommodating the circuit board 210 when combined with the lower case 250, and is made of an insulating material such as resin. It is a shaped case body.
  • FIGS. 3 and 4 show the configuration of the inner portion formed on the rear surface 230u of the upper case 230 forming the box case 270.
  • the upper case 230 includes a first insertion rib group RB1 made up of a plurality of ribs that are insertably provided corresponding to the main slit M1, the sub-slits S1 to S3, and the edge slits E1 and E2 of the circuit board 210, respectively; It has a second inserting rib group RB2 composed of a plurality of ribs which are insertably provided corresponding to the slit M1, the sub-slits S4 to S6, and the edge slits E3 and E4, respectively.
  • the first insertion rib group RB1 includes a main rib mr1 inserted into the main slit M1 of the circuit board 210, sub-ribs sr1 to sr3 respectively inserted into the sub-slits S1 to S3 of the circuit board 210, edge slits E1 of the circuit board 210, It has edge ribs er1 and er2 which are inserted respectively against E2.
  • the main rib mr1 of the first insertion rib group RB1 is, of the frame rib WR1 formed in a substantially U-shaped frame as a whole, facing the main slit M1 of the circuit board 210 and extending along the longitudinal direction (arrow ab direction). It is an elongated linear rib portion.
  • the main rib mr1 is arranged substantially in the central portion of the upper case 230 .
  • the main rib mr1 has a length slightly shorter than the main slit M1 in the longitudinal direction (arrow ab direction), and is integrated with the sub-rib sr1 at one end (arrow a direction).
  • the sub-rib sr1 is a rib that faces the sub-slit S1 of the circuit board 210 and extends linearly along the lateral direction perpendicular to the longitudinal direction (arrow ab direction).
  • the sub-rib sr2 is a rib that faces the sub-slit S2 of the circuit board 210 and extends along the lateral direction orthogonal to the longitudinal direction (arrow ab direction), and has the same length as the sub-rib sr1.
  • the sub-rib sr3 is also a rib that extends linearly along the lateral direction orthogonal to the longitudinal direction (arrow ab direction) facing the sub-slit S3 of the circuit board 210, and has the same length as the sub-ribs sr1 and sr2. have.
  • the sub-ribs sr1 to sr3 are provided with the same spacing from each other.
  • the sub-rib sr1 and the sub-rib sr2 are in a positional relationship such that the resistance elements R1 to R3 and the resistance elements R4 to R6 of the first resistance element group GR1 can be arranged therebetween.
  • the sub-rib sr2 and the sub-rib sr3 are in a positional relationship such that the resistance elements R7 to R9 and the resistance elements R10 to R12 of the first resistance element group GR1 can be arranged between them.
  • the edge ribs er1 and er2 face the edge slits E1 and E2 of the circuit board 210 and extend linearly from the outer side of the frame rib WR1 toward the main rib mr1 along the lateral direction perpendicular to the longitudinal direction (arrow ab direction). It is a rib that extends to The edge ribs er1 and er2 are formed integrally with the frame rib WR1.
  • the edge rib er1 is arranged midway between the sub-rib sr1 and the sub-rib sr2 in the longitudinal direction (arrow ab direction).
  • the edge rib er2 is arranged midway between the sub-rib sr2 and the sub-rib sr3 in the longitudinal direction (arrow ab direction). That is, the sub-ribs sr1 to sr3 and the edge ribs er1 and er2 are alternately arranged in the longitudinal direction (arrow ab direction).
  • a main rib mr1 (not shown in FIG. 8), sub-ribs sr1 to sr3, and edge ribs er1 and er2 are arranged between the upper case 230 and the lower case 250. It is inserted into the main slit M1 (not shown in FIG. 8), the sub-slits S1 to S3, and the edge slits E1 and E2 of the substrate 210, but has a height that does not reach the lower case 250.
  • the main rib mr1 is integrally formed with a plurality of support pieces ss11 to ss13 slightly protruding in the lateral direction orthogonal to the longitudinal direction (arrow ab direction).
  • the support pieces ss11 to ss13 are alternately arranged with the sub-ribs sr1 to sr3 in the longitudinal direction (arrow ab direction).
  • the support pieces ss11 and ss12 are arranged so as to face the edge ribs er1 and er2 in the lateral direction orthogonal to the longitudinal direction (ab direction).
  • the support pieces ss11 to ss13 only protrude short in the transverse direction from the main rib mr1, and particularly in the support pieces ss11 and ss12, a predetermined gap is formed between the edge rib er1 and the edge rib er2 in the transverse direction. ing. That is, longitudinal portions 213L2 and 213L4 of the conductor pattern 213 of the circuit board 210 are positioned between the supporting pieces ss11 and ss12 of the main rib mr1 and the edge ribs er1 and er2, respectively.
  • These support pieces ss11 to ss13 are lower in height than the main rib mr1, and have end surfaces ss11t to ss13t (FIG. 5), which are surfaces that support the circuit board 210 from above by coming into contact with the circuit board 210. are doing.
  • two supports are formed so as to face each other on one side (arrow a direction) and the other side (arrow b direction) in the longitudinal direction (arrow ab direction).
  • Pieces pp11 and pp12, support pieces pp21 and pp22, and support pieces pp31 and pp32 are formed, respectively.
  • the support pieces pp11, pp21, and pp31 are not shown because they are behind the sub-ribs sr1 to sr3.
  • support pieces pp11 and pp12, support pieces pp21 and pp22, and support pieces pp31 and pp32 are also lower in height than the sub-ribs sr1 to sr3, and are in contact with the circuit board 210 to support the circuit board 210 from above.
  • the end faces pp11t, pp21t, and pp31t are not shown because they are behind the sub-ribs sr1 to sr3.
  • edge ribs er1 and er2 as well, two supports are formed so as to face each other on one side (arrow a direction) and the other side (arrow b direction) in the longitudinal direction (arrow ab direction).
  • Pieces qq11 and qq12 and support pieces qq21 and qq22 are formed respectively.
  • These support pieces qq11 and qq12 and support pieces qq21 and qq22 are also lower in height than the edge ribs er1 and er2, and are surfaces that come into contact with the circuit board 210 and support the circuit board 210 from above. It has end faces qq11t, qq12t and end faces qq21t, qq22t (FIG. 5).
  • end faces pp31t, pp32t, and end faces qq11t, qq12t and end faces qq21t, qq22t of the supporting pieces qq11, qq12, supporting pieces qq21, qq22 of the edge ribs er1, er2 are all the same height, and the circuit board 210 It is a surface to be abutted with.
  • all these end faces are collectively referred to as a first support piece end face group RB1t.
  • the second insertion rib group RB2 consists of a plurality of ribs that are symmetrical with the first insertion rib group RB1 about the center line X along the longitudinal direction (arrow ab direction). That is, the second insertion rib group RB2 includes a main rib mr2 inserted into the main slit M1 of the circuit board 210, sub-ribs sr4 to sr6 respectively inserted into the sub-slits S4 to S6 of the circuit board 210, and edge slits of the circuit board 210. It has edge ribs er3 and er4 that are inserted into E4 and E5, respectively.
  • the main rib mr2 of the second insertion rib group RB2 extends along the longitudinal direction (arrow ab direction) facing the main slit M1 of the circuit board 210 among the frame ribs WR2 formed in a substantially U-shaped frame as a whole. It is an elongated rib portion.
  • the main rib mr2 is arranged substantially in the central portion of the upper case 230.
  • the main rib mr2 is provided at a position adjacent to the main rib mr1 of the first insertion rib group RB1 with a slight gap therebetween, and is formed to have the same length as the main rib mr1 in parallel.
  • both the main rib mr1 and the main rib mr2 are inserted into the main slit M1 of the circuit board 210.
  • the gap between the main rib mr1 and the main rib mr2 is a distance that allows a center rib cr1 of the lower case 250, which will be described later, to be inserted.
  • the main rib mr2 has a length slightly shorter than the main slit M1 of the circuit board 210, and is integrated with the sub-rib sr4 at one end (in the direction of the arrow a).
  • the sub-rib sr4 is a rib that faces the sub-slit S4 of the circuit board 210 and extends along the lateral direction orthogonal to the longitudinal direction (arrow ab direction).
  • the sub-rib sr5 is a rib that faces the sub-slit S5 of the circuit board 210 and extends along the lateral direction orthogonal to the longitudinal direction (arrow ab direction), and has the same length as the sub-rib sr4.
  • the sub-rib sr6 is also a rib extending along the lateral direction perpendicular to the longitudinal direction (arrow ab direction) facing the sub-slit S3 of the circuit board 210, and has the same length as the sub-ribs sr4 and sr5. there is
  • the sub-ribs sr4 to sr6 are provided with the same spacing from each other.
  • the sub-rib sr4 and the sub-rib sr5 are in a positional relationship such that the resistance elements R15 to R173 and the resistance elements R18 to R20 of the circuit board 210 can be arranged therebetween.
  • the sub-rib sr5 and the sub-rib sr6 are in a positional relationship such that the resistance elements R21 to R23 and the resistance elements R24 to R26 of the circuit board 210 can be arranged therebetween.
  • the edge ribs er3 and er4 face the edge slits E3 and E4 of the circuit board 210 and extend linearly from the outer side of the frame rib WR2 toward the main rib mr2 along the lateral direction perpendicular to the longitudinal direction (arrow ab direction). It is a rib that extends to the The edge ribs er3 and er4 are formed integrally with the frame rib WR2.
  • the edge rib er3 is arranged midway between the sub-ribs sr4 and sr5 in the longitudinal direction (arrow ab direction).
  • the edge rib er4 is arranged midway between the sub-rib sr5 and the sub-rib sr6 in the longitudinal direction (arrow ab direction). That is, the sub-ribs sr4 to sr6 and the edge ribs er3 and er4 are alternately arranged in the longitudinal direction (arrow ab direction).
  • the main rib mr2, the sub-ribs sr4 to sr6, and the edge ribs er3 and er4 also correspond to the main slit M1, the sub-slits S4 to S6, and the edge slit E3 of the circuit board 210 arranged between the upper case 230 and the lower case 250. , E 4 , but has a height that does not reach the lower case 250 .
  • main rib mr2 is integrally formed with a plurality of supporting pieces ss21 to ss23 that slightly protrude in the lateral direction perpendicular to the longitudinal direction (arrow ab direction), similarly to the main rib mr1.
  • the support pieces ss21 to ss23 are alternately arranged with the sub-ribs sr1 to sr3 in the longitudinal direction (arrow ab direction).
  • the support pieces s21 and ss22 are arranged so as to face the edge ribs er3 and er4 in the lateral direction perpendicular to the longitudinal direction (ab direction).
  • the support pieces ss21 to ss23 only protrude short in the lateral direction, and in particular, the support pieces ss21 and ss22 are provided with a predetermined gap from the edge ribs er1 and er2. That is, longitudinal portions 214L2 and 214L4 of the conductor pattern 214 are positioned between the supporting pieces ss21 and ss22 of the main rib mr2 and the edge ribs er1 and er2, respectively.
  • These support pieces ss21 to ss23 have end faces ss21t to ss23t that are lower than the height of the main rib mr2 and that are surfaces that contact the circuit board 210 and support the circuit board 210 from above.
  • two supports are formed so as to face each other on one side (arrow a direction) and the other side (arrow b direction) in the longitudinal direction (arrow ab direction).
  • Pieces pp41 and pp42, support pieces pp51 and pp52, and support pieces pp61 and pp62 are formed, respectively.
  • the support pieces pp41, pp51, and pp61 are not shown because they are behind the sub-ribs sr1 to sr3.
  • support pieces pp41 and pp42, support pieces pp51 and pp52, and support pieces pp61 and pp62 are also lower than the height of the sub-ribs sr4 to sr6, and are in contact with the circuit board 210 to support the circuit board 210 from above.
  • the end faces pp41t, pp51t, and pp61t are not shown because they are behind the sub-ribs sr1 to sr3.
  • edge ribs er3 and er4 as well, two supports are formed so as to face each other on one side (arrow a direction) and the other side (arrow b direction) in the longitudinal direction (arrow ab direction).
  • Pieces qq31 and qq32 and support pieces qq41 and qq42 are formed respectively.
  • the support pieces qq31, qq32, and the support pieces qq41, qq42 are also lower in height than the edge ribs er3, er4, and end surfaces qq31t are surfaces that are in contact with the circuit board 210 and support the circuit board 210 from above. , qq32t, and end faces qq41t, qq42t (FIG. 5).
  • end surfaces ss21t to ss23t of the support pieces ss21 to ss23 of the main rib mr2 the end surfaces pp41t, pp42t, and the end surfaces pp51t, pp52t of the support pieces pp41, pp42, support pieces p51, pp52, and support pieces pp61, pp62 of the sub-ribs sr4 to sr6, respectively.
  • end faces pp61t, pp62t, support pieces qq31, qq32, end faces qq31t, qq32t, and end faces qq41t, qq42t of the support pieces qq31, qq32, support pieces qq41, qq42 of the edge ribs er3, er4 are all of the same height and are in contact with the circuit board 210. It is an aspect that Hereinafter, all these end faces are collectively referred to as a second support piece end face group RB2t.
  • the lower case 250 of the box case 270 is made of an insulating material such as resin having an internal space capable of accommodating the circuit board 210 when combined with the upper case 230. It is a rectangular case body.
  • FIGS. 6 and 7 show the configuration of the inner portion formed on the rear surface 250u of the lower case 250 forming the box case 270.
  • the lower case 250 has a center rib cr1, and a first support rib group LB1 and a second support rib group LB2 each made up of a plurality of ribs.
  • the center rib cr1 of the lower case 250 faces the main slit M1 of the circuit board 210 and the main ribs mr1 and mr2 of the upper case 230 among the frame ribs WR3 formed in a substantially U-shaped frame as a whole. , rib portions extending linearly along the longitudinal direction (arrow ab direction).
  • the center rib cr1 of the lower case 250 has the same length as the main ribs mr1 and mr2 of the upper case 230.
  • the center rib cr1 is located between the main rib mr1 and the main rib mr2 of the upper case 230 inserted into the main slit M1 of the circuit board 210 when the upper case 230 and the lower case 250 are combined with the circuit board 210 accommodated. It has a width and height that allows it to be inserted into a
  • the center rib cr1 is formed higher than each rib of the first supporting rib group LB1 and the second supporting rib group LB2 so as to be able to be inserted between the main rib mr1 and the main rib mr2 of the upper case 230. .
  • the first support rib group LB1 consists of a plurality of ribs provided at positions facing the conductor pattern 213 of the circuit board 210 and the first resistance element group GR1, and has a height lower than that of the center rib cr1.
  • the second support rib group LB2 is composed of a plurality of ribs provided at positions facing the conductor pattern 214 of the circuit board 210 and the second resistor element group GR2, and has a height lower than that of the center rib cr1. There is All of the ribs in the first supporting rib group LB1 and the second supporting rib group LB2 have the same height.
  • the first support rib group LB1 of the lower case 250 has longitudinal ribs nr31 to nr35 provided at positions facing the longitudinal portions 213L1 to 213L5 of the conductor pattern 213 of the circuit board 210, respectively.
  • the longitudinal ribs nr31 to nr35 have the same length as the longitudinal portions 213L1 to 213L5 of the conductor pattern 213. These longitudinal ribs nr31 to nr35 form an upper end face (hereinafter referred to as "upper end face") that supports the back surface of the circuit board 210 (that is, the face on the side where the resistor elements R1 to R28 are not installed) from below. .) nr31t to nr35t (FIG. 7).
  • the first support rib group LB1 faces the resistance elements R1 to R3, the resistance elements R4 to R6, the resistance elements R7 to R9, the resistance elements R10 to R12, and the resistance elements R13 to R14 of the first resistance element group GR1. It has ribs rr31 to rr35 provided at the position of the circuit board 210 and supporting the back surface of the circuit board 210 from below (hereinafter referred to as "resistor element supporting ribs"). These resistive element supporting ribs rr31 to rr35 also have upper end surfaces rr31t to rr35t (FIG. 7) that support the resistive elements R1 to R14 from below the circuit board 210. As shown in FIG.
  • resistance element supporting ribs rr31 to rr35 not only face the resistance elements R1 to R3, R4 to R6, R7 to R9, R10 to R12, R13 to R14 of the first resistance element group GR1, but also extend to the center rib cr1. It has a length in the lateral direction that extends.
  • the longitudinal ribs nr31 to nr35 and the resistance element support ribs rr31 to rr35 are integrally formed, and the resistance element support ribs rr31 to rr35 and the center rib cr1 are integrally formed.
  • the longitudinal rib nr31 is also formed integrally with a circuit element support rib rr310 provided on the circuit board 210 at a position facing the circuit element group 310 on which various circuit elements are mounted.
  • the upper end surfaces nr31t to nr35t of the longitudinal ribs nr31 to nr35 in the first support rib group LB1 and the upper end surfaces rr31t to rr35t of the resistor element support ribs rr31 to rr35 are collectively referred to as a first support rib end surface group LB1t.
  • the second support rib group LB2 of the lower case 250 is similar to the first support rib group LB1, and the longitudinal rib nr41 provided at positions facing the longitudinal portions 214L1 to 214L5 of the conductor pattern 214 of the circuit board 210, respectively. to nr45.
  • the longitudinal ribs nr41 to nr45 have the same length as the longitudinal portions 214L1 to 214L5 of the conductor pattern 214 on the circuit board 210.
  • These longitudinal ribs nr41 to nr45 have upper end surfaces nr41t to nr45t (FIG. 7) that support the back surface of the circuit board 210 from below.
  • the second support rib group LB2 faces the resistance elements R15 to R17, the resistance elements R18 to R20, the resistance elements R21 to R23, the resistance elements R24 to R26, and the resistance elements R27 to R28 of the second resistance element group GR2. It has resistance element supporting ribs rr41 to rr45 which are provided at positions and support these resistance elements from below the circuit board 210 . These resistive element support ribs rr41 to rr45 also have upper end surfaces rr41t to rr45t (FIG. 7) that support the circuit board 210 from below.
  • resistance element support ribs rr41 to rr45 not only face the resistance elements R15 to R17, R18 to R20, R21 to R23, R24 to R26, R27 to R28 of the second resistance element group GR2, but also extend to the center rib cr1. It has a length in the lateral direction that extends.
  • the second support rib group LB2 includes integrally formed longitudinal ribs nr41 to nr45 and resistance element support ribs rr41 to rr45, and integrally formed resistance element support ribs rr41 to rr45 and a center rib cr1.
  • the longitudinal rib nr41 is also formed integrally with a circuit element support rib rr320 provided on the circuit board 210 at a position facing the circuit element group 320 on which various circuit elements are mounted.
  • the upper end surfaces nr41t to nr45t of the longitudinal ribs nr41 to nr45 in the second support rib group LB2 and the upper end surfaces rr41t to rr45t of the resistor element support ribs rr41 to rr45 are collectively referred to as a second support rib end surface group LB2t.
  • the center rib cr1 of the lower case 250 is inserted into the main slit M1 of the circuit board 210 and is also inserted into the gap between the main rib mr1 and the main rib mr2 of the upper case 230.
  • the position of the circuit board 210 in the lateral direction is restricted with respect to the upper case 230 and the lower case 250 .
  • the sub-ribs sr1 to sr6 and the edge ribs er1 to er4 of the upper case 230 are inserted into the sub-slits S1 to S6 and the edge slits E1 to E4 of the circuit board 210.
  • the position of the lower case 250 in the longitudinal direction (arrow ab direction) and the lateral direction is more firmly regulated.
  • the circuit board 210 is supported from below by the first support rib end surface group LB1t and the second support rib end surface group LB2t of the lower case 250 .
  • the circuit board 210 is pressed from above by the first support piece end surface group RB1t and the second support piece end surface group RB2t of the upper case 230 .
  • circuit board 210 is located between the first support piece end surface group RB1t and the second support piece end surface group RB2t of the upper case 230 and the first support rib end surface group LB1t and the second support rib end surface group LB2t of the lower case 250. sandwiched between.
  • the relay box 200 has a plurality of slits (the main slit M1, the sub-slits S1 to S6, and the edge slits E1 to E4) formed in the circuit board 210, the circuit board 210 is positioned in the upper case.
  • the circuit board is sandwiched from above and below by the first support piece end surface group RB1t and the second support piece end surface group RB2t of the lower case 250 and the first support rib end surface group LB1t and the second support rib end surface group LB2t of the lower case 250. It is possible to suppress deformation of the substrate 210 due to lack of strength.
  • the circuit board 210 is not bent or the like. can also be suppressed.
  • a first insertion rib group RB1 (main rib mr1, sub-ribs sr1 to sr3 and edge ribs er1 and er2) is provided inside the upper case 230. Even if the creepage distance between the resistance elements R1 and R12 adjacent to each other is satisfied, for example, the spatial distance between the resistance elements R1 and R12 as indicated by the solid line arrows is unable to meet.
  • the junction box 200 has an internal space 270S of the box case 270 partitioned in the longitudinal direction (arrow ab direction) by sub-ribs sr1 to sr3 and edge ribs er1 and er2 of the upper case 230, for example. ing.
  • the junction box 200 can satisfy the creepage distance and the clearance defined in the international standard IEC61010-031.
  • the box case 270 of the relay box 200 only the first insertion rib group RB1 and the second insertion rib group RB2 provided on the inner side of the upper case 230 provide a specified spatial distance. Even if it is not possible to satisfy the spatial distance, the presence of the first supporting rib group LB1 and the second supporting rib group LB2 provided inside the lower case 250 as shown in FIG. 11 can further extend the spatial distance. can.
  • the spatial distance between the resistance element R1 and the resistance element R7 extends from the space above the circuit board 210 on which the resistance element R1 is installed to the space below the circuit board 210. , then over the edge rib er1, through the gap between the circuit board 210 and the resistor element supporting rib rr42, over the sub-rib sr2 and leading to the resistor element R7 in the space above the circuit board 210 (broken line).
  • the presence of the resistive element supporting rib rr42 of the lower case 250 can further extend the spatial distance between the resistive element R1 and the resistive element R7. .
  • the spatial distance between the resistor element R7 and the resistor element R12 is the edge slit E2 and the edge rib er2 from the upper space of the circuit board 210 on which the resistor element R7 is mounted. to the space below the circuit board 210 through the gap between the resistor element R12 and the edge rib er2. is the length (solid line) leading to
  • the spatial distance defined by the existence of the edge rib er2 of the upper case 230 can be satisfied.
  • a plurality of resistance elements R1 to R14 and R15 to R28 are arranged in a wave shape on the circuit board 210, so that the longitudinal direction of the circuit board 210 is
  • the length L1 in the direction of the arrow ab
  • the overall size can be reduced.
  • the main slit M1, the sub-slits S1 to S6, and the edge slits E1 to E4 provided on the circuit board 210 are connected to the first insertion rib group RB1 and the second insertion rib group RB1 of the upper case 230.
  • the circuit board 210 is pressed from above by the first support piece end surface group RB1t and the second support piece end surface group RB2t of the upper case 230, and the first support rib end surface group LB1t of the lower case 250 and The circuit board 210 was supported from below by the second support rib end face group LB2t.
  • the circuit board 210 is sandwiched between the upper case 230 and the lower case 250, so that the circuit board 210 can be firmly held and deformation can be prevented.
  • the junction box 200 since the plurality of resistive elements R1 to R14 and R15 to R28 are arranged along the conductor patterns 213 and 214 in a wavy shape, there is a possibility that the specified spatial distance for the operating voltage between the resistive elements may not be satisfied. occur.
  • the box case 270 of the junction box 200 the first insertion rib group RB1 and the second insertion rib group RB2 of the upper case 230 and the first support rib group LB1 and the second support rib group LB2 of the lower case 250 can satisfy the spatial distance between all resistive elements.
  • the present invention is not limited to this. If only one of them can satisfy the spatial distance between the resistive elements, either the first insertion rib group RB1 or the second insertion rib group RB2 or the first support rib group LB1 or the second support rib group LB2 can be used. Only one of them may satisfy the spatial distance between the resistance elements.
  • the upper case 230 is provided with the first insertion rib group RB1 and the second insertion rib group RB2 each including a plurality of ribs inserted into the slits of the circuit board 210
  • the lower case 250 is provided with the first supporting rib group LB1 and the second supporting rib group LB2 for supporting the circuit board 210 from below, but the present invention is not limited to this.
  • the support rib group LB1 and the second support rib group LB2 may be provided, and the lower case 250 may be provided with the first insertion rib group RB1 and the second insertion rib group RB2.
  • a plate-shaped intermediate member interposed between the upper case 230 and the lower case 250 is provided with a first insertion rib group RB1 and a second insertion rib group RB2.
  • the intermediate member may be placed between the circuit board 210 and the lower case 250 to be inserted into each slit of the circuit board 210 .
  • the upper case 230 is provided with the first insertion rib group RB1 and the second insertion rib group RB2, which are formed of a plurality of ribs inserted into the slits of the circuit board 210, and the lower case A case in which the first support rib group LB1 and the second support rib group LB2 for supporting the circuit board 210 from below are provided on 250 has been described.
  • the present invention is not limited to this.
  • a lower case 250 that does not have the first support rib group LB1 and the second support rib group LB2 is used, or an upper case 230 that does not have the first insertion rib group RB1 and the second insertion rib group RB2 is used.
  • the present invention is not limited to this, and the relay box 200 A male plug may be installed so as to protrude from the output terminals 112, 122 of the measuring device, and the male plug may be directly connected to the input terminal of the measuring device.

Abstract

This invention provides a probe device that can be made to be significantly more compact than the prior art. This probe device comprises an input cable that is connected to a probe terminal, an output terminal that is connected to a prescribed measurement device, and a relay box that reduces a voltage input via the probe terminal to a prescribed voltage level and then outputs the voltage from the output terminal to the measurement device. The relay box comprises: one case; another case; a circuit board that is disposed between the one case and other case, has a plurality of slits formed thereon, and has a plurality of resistance elements placed thereon in a wave shape so as to pass through the plurality of slits; and an insertion rib group comprising a plurality of ribs that are provided on the one case, the other case, or an intermediate member between the one case and other case and are respectively inserted into the plurality of slits on the circuit board so as to maintain a spatial distance between the plurality of resistance elements.

Description

プローブ装置Probe device
 本発明は、プローブ装置に関し、例えば、一次側から入力された電圧を降下させた後に2次側の測定装置へ出力し、当該測定装置によって電圧を検出させるプローブ装置に関する。 The present invention relates to a probe device, for example, to a probe device that drops a voltage input from a primary side, outputs it to a measuring device on the secondary side, and causes the measuring device to detect the voltage.
 従来、プローブ装置としては、例えば、電気自動車等のバッテリ電圧等を測定する直流高電圧差動プローブ(以下、これを単に「差動プローブ」と呼ぶ。)というものがある。この種の差動プローブにおいては、プローブと出力ケーブルとの間に中継ボックスが設けられている。 Conventionally, as a probe device, for example, there is a DC high voltage differential probe (hereinafter simply referred to as a "differential probe") that measures the battery voltage of electric vehicles and the like. A junction box is provided between the probe and the output cable in this type of differential probe.
 差動プローブは、プローブを介して入力した1次側のバッテリ等の高電圧を中継ボックスにより低電圧に電圧降下させた後に出力ケーブルを介して2次側の測定装置へ出力することにより電圧を測定させることができる。 In the differential probe, the high voltage of the battery, etc. on the primary side that is input via the probe is dropped to a low voltage by the relay box, and then output to the measuring device on the secondary side via the output cable to obtain the voltage. can be measured.
 この中継ボックスと似たような機能を有する電源電圧検出装置がある(例えば、特許文献1参照。)。この電源電圧検出装置では、電圧調整回路における複数のチップ抵抗により直流電源の電圧を分圧して電圧降下させた後に電子制御ユニットに出力し、当該電子制御ユニットにより雰囲気温度を考慮した適正な電源電圧を検出している。 There is a power supply voltage detection device that has a function similar to this relay box (see Patent Document 1, for example). In this power supply voltage detection device, the voltage of the DC power supply is divided by a plurality of chip resistors in the voltage adjustment circuit, the voltage is lowered, and then output to the electronic control unit. is detected.
 この特許文献1に開示された電源電圧検出装置においては、複数のチップ抵抗を直列に接続し、かつ、作動する電圧に対して十分な沿面距離を確保するために複数のチップ抵抗が直列に接続されている。 In the power supply voltage detection device disclosed in Patent Document 1, a plurality of chip resistors are connected in series, and a plurality of chip resistors are connected in series to ensure a sufficient creepage distance with respect to the operating voltage. It is
 ここで、チップ抵抗を直列に接続する場合における抵抗間の距離に関しては、国際規格IEC61010-031に定められた沿面距離および空間距離を満たして絶縁性を確保する必要がある。沿面距離とは、2つの導電性部分間の個体絶縁材料の表面に沿った最短距離である。空間距離とは、2つの導電性部分間の空間における最短距離である。 Here, regarding the distance between resistors when connecting chip resistors in series, it is necessary to ensure insulation by satisfying the creepage distance and clearance distance specified in the international standard IEC61010-031. Creepage distance is the shortest distance along the surface of a solid insulating material between two conductive parts. Spatial distance is the shortest distance in space between two conductive parts.
特開2019-49476号公報JP 2019-49476 A
 しかしながら、特許文献1に開示された電源電圧検出装置においては、十分な沿面距離を確保するために複数のチップ抵抗が直列に接続されているため、長手方向のサイズが大きくなり、小型化することは困難であるという問題があった。 However, in the power supply voltage detection device disclosed in Patent Document 1, since a plurality of chip resistors are connected in series to ensure a sufficient creepage distance, the size in the longitudinal direction becomes large, and miniaturization is difficult. was difficult.
 本発明は、上述した課題に鑑みてなされたものであり、従来に比して一段と小型化し得るプローブ装置を提供することを目的とする。 The present invention has been made in view of the above-mentioned problems, and aims to provide a probe device that can be made even more compact than before.
 本発明のプローブ装置においては、プローブ端子が接続される入力ケーブルと、所定の測定装置と接続される出力端子と、前記プローブ端子を介して入力される電圧を所定の電圧レベルに低下させた後に前記出力端子から前記測定装置へ出力する中継ボックスとを備え、前記中継ボックスは、一方のケースと、他方のケースと、前記一方のケースと前記他方のケースとの間に配置され、複数のスリットが形成されていると共に、前記複数のスリットの間を通過するように複数の抵抗素子が波形状に設置された回路基板と、前記一方のケースまたは前記他方のケースあるいは前記一方のケースと前記他方のケースとの間の中間部材に設けられ、前記複数の抵抗素子の間の空間距離を満たすように前記回路基板の前記複数のスリットにそれぞれ差し込まれる複数のリブからなる差込リブ群とを有する。 In the probe apparatus of the present invention, an input cable to which a probe terminal is connected, an output terminal connected to a predetermined measuring apparatus, and a voltage input through the probe terminal is lowered to a predetermined voltage level, and then a relay box for outputting from the output terminal to the measuring device, the relay box being disposed between one case, the other case, and the one case and the other case, and having a plurality of slits; is formed, and a plurality of resistor elements are installed in a wave shape so as to pass between the plurality of slits; and the one case or the other case or the one case and the other an insertion rib group comprising a plurality of ribs provided in an intermediate member between the case and the plurality of ribs respectively inserted into the plurality of slits of the circuit board so as to satisfy the spatial distances between the plurality of resistor elements. .
 本発明において、前記他方のケースは、前記差込リブを有し、前記一方のケースは、前記抵抗素子が設置されていない前記回路基板の裏面を支持する複数のリブからなる支持リブ群を有することが好ましい。 In the present invention, the other case has the insertion rib, and the one case has a support rib group consisting of a plurality of ribs for supporting the back surface of the circuit board on which the resistance element is not installed. is preferred.
 本発明において、前記差込リブ群の各リブには、前記複数のスリットに差し込まれることなく前記回路基板に当接される支持片をそれぞれ有し、前記回路基板は、前記差込リブ群の前記支持片と前記一方のケースの前記支持リブ群との間で挟持されていることが好ましい。 In the present invention, each rib of the group of insertion ribs has a supporting piece that abuts against the circuit board without being inserted into the plurality of slits, and the circuit board is connected to the group of insertion ribs. It is preferable that it is sandwiched between the support piece and the support rib group of the one case.
 本発明において、前記差込リブ群は、前記波形状に設置された前記複数の抵抗素子と接触することのない前記他方のケースの位置に配置されていることが好ましい。 In the present invention, it is preferable that the insertion rib group is arranged at a position of the other case that does not come into contact with the plurality of resistor elements installed in the wave shape.
 本発明において、前記支持リブ群は、前記差込リブ群と対向することなく、かつ、前記複数の抵抗素子と対向した前記回路基板の位置を前記裏面から支持することが好ましい。 In the present invention, it is preferable that the support rib group supports the circuit board from the rear surface at a position facing the plurality of resistance elements without facing the insertion rib group.
 本発明において、前記支持リブ群の各リブは、前記差込リブ群と同様に、前記複数の抵抗素子の間の空間距離を満たすように前記回路基板の前記裏面を支持することが好ましい。 In the present invention, each rib of the support rib group preferably supports the back surface of the circuit board so as to fill the spatial distance between the plurality of resistance elements, similarly to the insertion rib group.
 本発明によれば、従来に比して一段と小型化し得たプローブ装置を提供することができる。 According to the present invention, it is possible to provide a probe device that is much more compact than conventional ones.
本発明の一実施の形態に係るプローブ装置の全体構成を示す斜視図である。1 is a perspective view showing the overall configuration of a probe device according to one embodiment of the present invention; FIG. 本発明の一実施の形態に係るプローブ装置の構成を示す分解斜視図である。1 is an exploded perspective view showing the configuration of a probe device according to one embodiment of the present invention; FIG. 本発明の一実施の形態に係るプローブ装置の中継ボックスに収納された回路基板の構成を示す斜視図である。1 is a perspective view showing a configuration of a circuit board housed in a relay box of a probe device according to one embodiment of the present invention; FIG. 本発明の一実施の形態に係るプローブ装置の中継ボックスを形成する上ケースの構成を示す斜視図である。FIG. 4 is a perspective view showing the configuration of an upper case that forms a relay box of the probe device according to one embodiment of the present invention; 本発明の一実施の形態に係るプローブ装置の中継ボックスを形成する上ケースの構成を示す平面図である。FIG. 4 is a plan view showing the configuration of an upper case that forms a junction box of the probe device according to one embodiment of the present invention; 本発明の一実施の形態に係るプローブ装置の中継ボックスを形成する下ケースの構成を示す斜視図である。FIG. 4 is a perspective view showing the configuration of a lower case that forms a junction box of the probe device according to one embodiment of the present invention; 本発明の一実施の形態に係るプローブ装置の中継ボックスを形成する下ケースの構成を示す平面図である。FIG. 4 is a plan view showing the configuration of a lower case that forms a relay box of the probe device according to one embodiment of the present invention; 本発明の一実施の形態に係るプローブ装置の中継ボックスに収納された回路基板と差込リブ、支持リブの構成を示す斜視図である。FIG. 3 is a perspective view showing the configuration of a circuit board, insertion ribs, and support ribs accommodated in a junction box of a probe device according to an embodiment of the present invention; 本発明の一実施の形態に係る上ケースの差込リブが存在しない場合の空間距離の説明に供する斜視図(A)および縦断面図(B)である。4A and 4B are a perspective view (A) and a vertical cross-sectional view (B) for explaining the spatial distance when there is no insertion rib of the upper case according to the embodiment of the present invention; FIG. 本発明の一実施の形態に係る上ケースの差込リブが存在する場合の空間距離の説明に供する縦断面斜視図である。FIG. 5 is a vertical cross-sectional perspective view for explaining a spatial distance when an insertion rib of an upper case according to an embodiment of the present invention exists; 本発明の一実施の形態に係る上ケースの差込リブおよび下ケースの支持リブによって複数の抵抗素子間における空間距離を長くした際の説明に供する斜視図(A)および縦断面図(B)である。FIG. 4A is a perspective view (A) and a vertical cross-sectional view (B) for explaining the case where the spatial distance between a plurality of resistor elements is lengthened by the insertion rib of the upper case and the support rib of the lower case according to the embodiment of the present invention; is.
1.実施の形態の概要
 先ず、本願において開示される発明の代表的な実施の形態について概要を説明する。なお、以下の説明では、一例として、発明の構成要素に対応する図面上の参照符号を、括弧を付して記載している。
1. Outline of Embodiment First, an outline of a representative embodiment of the invention disclosed in the present application will be described. In the following description, as an example, reference numerals on the drawings corresponding to constituent elements of the invention are described with parentheses.
 〔1〕本発明の代表的な実施の形態に係るプローブ装置(1)は、入力プローブが接続される入力端子(130、140)と、所定の測定装置と接続される出力端子(112、122)と、前記入力端子(130、140)を介して入力される電圧を所定の電圧レベルに低下させた後に前記出力端子(112、122)から前記測定装置へ出力する中継ボックス(200)とを備え、前記中継ボックス(200)は、一方のケース(250)と、他方のケース(230)と、前記一方のケース(250)と前記他方のケース(230)との間に配置され、複数のスリット(M1、S1乃至S6、E1乃至E4)が形成されていると共に、前記複数のスリット(M1、S1乃至S6、E1乃至E4)の間を通過するように複数の抵抗素子(R1乃至R14、R15乃至R28)が波形状に設置された回路基板(210)と、前記一方のケース(250)または前記他方のケース(230)あるいは前記一方のケース(250)と前記他方のケース(230)との間の中間部材に設けられ、前記複数の抵抗素子(R1乃至R14、R15乃至R28)の間の空間距離を満たすように前記回路基板(210)の前記複数のスリット(M1、S1乃至S6、E1乃至E4)にそれぞれ差し込まれる複数のリブからなる差込リブ群(RB1、RB2)とを有する。 [1] A probe device (1) according to a representative embodiment of the present invention includes input terminals (130, 140) to which input probes are connected, and output terminals (112, 122) to be connected to a predetermined measuring device. ), and a relay box (200) for reducing the voltage input through the input terminals (130, 140) to a predetermined voltage level and then outputting the voltage from the output terminals (112, 122) to the measuring device. The relay box (200) is arranged between one case (250), the other case (230), and the one case (250) and the other case (230), and has a plurality of Slits (M1, S1 to S6, E1 to E4) are formed, and a plurality of resistor elements (R1 to R14, R15 to R28) arranged in a wave shape on a circuit board (210), the one case (250) or the other case (230), or the one case (250) and the other case (230) provided in an intermediate member between the plurality of slits (M1, S1 to S6, E1 to E4), and an insertion rib group (RB1, RB2) consisting of a plurality of ribs respectively inserted.
 本発明において、前記他方のケース(230)は、前記差込リブ群(RB1、RB2)を有し、前記一方のケース(250)は、前記抵抗素子(R1乃至R14、R15乃至R28)が設置されていない前記回路基板(210)の裏面(210u)を支持する複数のリブからなる支持リブ群(LB1、LB2)を有することが好ましい。 In the present invention, the other case (230) has the insertion rib group (RB1, RB2), and the one case (250) is provided with the resistance elements (R1 to R14, R15 to R28). It is preferable to have a support rib group (LB1, LB2) consisting of a plurality of ribs for supporting the back surface (210u) of the circuit board (210) which is not attached.
 本発明において、前記差込リブ群(RB1、RB2)の各リブには、前記複数のスリット(M1、S1乃至S6、E1乃至E4)に差し込まれることなく前記回路基板(210)に当接される支持片をそれぞれ有し、前記回路基板(210)は、前記差込リブ群(RB1、RB2)の前記支持片と前記一方のケース(250)の前記支持リブ群(LB1、LB2)との間で挟持されていることが好ましい。 In the present invention, each rib of the insertion rib group (RB1, RB2) is brought into contact with the circuit board (210) without being inserted into the plurality of slits (M1, S1 to S6, E1 to E4). The circuit board (210) is connected between the support pieces of the insertion rib group (RB1, RB2) and the support rib group (LB1, LB2) of the one case (250). It is preferably sandwiched between them.
 本発明において、前記差込リブ群(RB1、RB2)は、前記波形状に設置された前記複数の抵抗素子(R1乃至R14、R15乃至R28)と接触することのない前記他方のケース(230)の位置に配置されていることが好ましい。 In the present invention, the insertion rib group (RB1, RB2) is the other case (230) that does not come into contact with the plurality of resistor elements (R1 to R14, R15 to R28) installed in the wave shape. is preferably arranged at the position of
 本発明において、前記支持リブ群(LB1、LB2)は、前記差込リブ群(RB1、RB2)と対向することなく、かつ、前記複数の抵抗素子(R1乃至R14、R15乃至R28)と対向した前記回路基板(210)の位置を前記裏面から支持することが好ましい。 In the present invention, the support rib group (LB1, LB2) does not face the insertion rib group (RB1, RB2) and faces the plurality of resistance elements (R1 to R14, R15 to R28). It is preferable to support the position of the circuit board (210) from the back surface.
 本発明において、前記支持リブ群(LB1、LB2)の各リブは、前記差込リブ(RB1、RB2)と同様に、前記複数の抵抗素子(R1乃至R14、R15乃至R28)の間の空間距離を満たすように前記回路基板(210)の前記裏面を支持することが好ましい。 In the present invention, each rib of the support rib group (LB1, LB2), like the insertion ribs (RB1, RB2), has a spatial distance between the plurality of resistor elements (R1 to R14, R15 to R28). It is preferable to support the back surface of the circuit board (210) so as to satisfy
2.実施の形態の具体例
 以下、本発明の一実施の形態の具体例について図を参照して説明する。なお、以下の説明において、各実施の形態において共通する構成要素には同一の参照符号を付し、繰り返しの説明を省略する。
2. Specific Example of Embodiment Hereinafter, a specific example of one embodiment of the present invention will be described with reference to the drawings. In the following description, constituent elements common to each embodiment are denoted by the same reference numerals, and repeated descriptions are omitted.
 図1は、本発明の一実施の形態に係るプローブ装置の全体構成を示す斜視図である。図2は、本発明の一実施の形態に係るプローブ装置の構成を示す分解斜視図である。図3は、本発明の一実施の形態に係るプローブ装置の中継ボックスに収納された回路基板の構成を示す斜視図である。図4は、本発明の一実施の形態に係るプローブ装置の中継ボックスを形成する上ケースの構成を示す斜視図である。図5は、本発明の一実施の形態に係るプローブ装置の中継ボックスを形成する上ケースの構成を示す平面図である。図6は、本発明の一実施の形態に係るプローブ装置の中継ボックスを形成する下ケースの構成を示す斜視図である。図7は、本発明の一実施の形態に係るプローブ装置の中継ボックスを形成する下ケースの構成を示す平面図である。図8は、本発明の一実施の形態に係るプローブ装置の中継ボックスに収納された回路基板と差込リブ、支持リブの構成を示す斜視図である。図9は、本発明の一実施の形態に係る上ケースの差込リブが存在しない場合の空間距離の説明に供する斜視図(A)および縦断面図(B)である。図10は、本発明の一実施の形態に係る上ケースの差込リブが存在する場合の空間距離の説明に供する縦断面斜視図である。図11は、本発明の一実施の形態に係る上ケースの差込リブおよび下ケースの支持リブによって複数の抵抗素子間における空間距離を長くした際の説明に供する斜視図(A)および縦断面図(B)である。 FIG. 1 is a perspective view showing the overall configuration of a probe device according to one embodiment of the present invention. FIG. 2 is an exploded perspective view showing the configuration of the probe device according to one embodiment of the present invention. FIG. 3 is a perspective view showing the configuration of a circuit board housed in a junction box of a probe device according to an embodiment of the invention. FIG. 4 is a perspective view showing the configuration of an upper case forming a relay box of the probe device according to one embodiment of the present invention. FIG. 5 is a plan view showing the configuration of an upper case that forms a junction box of the probe device according to one embodiment of the present invention. FIG. 6 is a perspective view showing the configuration of a lower case that forms a junction box of the probe device according to one embodiment of the present invention. FIG. 7 is a plan view showing the configuration of a lower case that forms a junction box of the probe device according to one embodiment of the present invention. FIG. 8 is a perspective view showing the configuration of a circuit board, insertion ribs, and support ribs housed in a junction box of a probe device according to an embodiment of the present invention. 9A and 9B are a perspective view (A) and a vertical cross-sectional view (B) for explaining the spatial distance when there is no insertion rib of the upper case according to the embodiment of the present invention. FIG. 10 is a vertical cross-sectional perspective view for explaining the spatial distance when there is an insertion rib of the upper case according to one embodiment of the present invention. 11A and 11B are a perspective view (A) and a vertical cross section for explaining the case where the spatial distance between a plurality of resistor elements is lengthened by the insertion rib of the upper case and the support rib of the lower case according to one embodiment of the present invention. It is a figure (B).
 なお、図において、矢印a方向を一方側とし、矢印b方向を他方側とし、矢印ab方向を長手方向とする。この長手方向(矢印ab方向)と直交する方向を短手方向とする。また、矢印c方向を上方または上側とし、矢印d方向を下方または下側とする。ただし、上方または下方は重力方向の上下方向とは必ずしも一致しておらず、説明の便宜上設定した方向である。したがって、上下方向が逆であっても構わない。 In the figure, the arrow a direction is one side, the arrow b direction is the other side, and the arrow ab direction is the longitudinal direction. A direction perpendicular to the longitudinal direction (arrow ab direction) is defined as a lateral direction. The direction of arrow c is upward or upward, and the direction of arrow d is downward or downward. However, "upward" or "downward" does not necessarily match the vertical direction of the gravitational direction, and is a direction set for convenience of explanation. Therefore, the vertical direction may be reversed.
<プローブ装置の全体構成>
 図1および図2に示すように、本発明の一実施の形態におけるプローブ装置1は、他方側(矢印b方向)において図示しない2本の入力プローブと接続される2つの入力端子130、140が設けられた中継ボックス200を備えている。2つの入力端子130、140は、2本の入力プローブ(図示せず)を介して1次側のバッテリ等の電圧(例えば1000V以上)を測定するために接続される端子である。
<Overall Configuration of Probe Device>
As shown in FIGS. 1 and 2, the probe device 1 according to the embodiment of the present invention has two input terminals 130 and 140 connected to two input probes (not shown) on the other side (direction of arrow b). It has a relay box 200 provided. The two input terminals 130 and 140 are terminals connected to measure the voltage (for example, 1000 V or higher) of a battery or the like on the primary side via two input probes (not shown).
 中継ボックス200は、その一方側(矢印a方向)において、先端にプローブ端子111が取り付けられた正極側の出力ケーブル110、および、先端にプローブ端子121が取り付けられた負極側の出力ケーブル120、2つの出力ケーブル110、120と接続された2つの接続端子112、122を有している。 The junction box 200 has, on one side (in the direction of arrow a), a positive output cable 110 with a probe terminal 111 attached to its tip, and a negative output cable 120 and 2 with a probe terminal 121 attached to its tip. It has two connection terminals 112 , 122 connected to one output cable 110 , 120 .
 中継ボックス200の2つの出力ケーブル110、120は、2次側の測定装置に接続される。測定装置は、プローブ装置1の中継ボックス200がバッテリから入力された高電圧を所定レベルに電圧降下した後の低電圧として出力ケーブル110、120経由で受け取り測定する。 The two output cables 110, 120 of the relay box 200 are connected to the measuring device on the secondary side. The measuring device receives and measures the high voltage input from the battery to the junction box 200 of the probe device 1 as a low voltage after voltage drop to a predetermined level via the output cables 110 and 120 .
<中継ボックス>
 中継ボックス200は、内部に収納される回路基板210、その回路基板210を収納するための上ケース230、および、下ケース250によって構成されている。上ケース230および下ケース250が一体に取り付けられることにより回路基板210を収容するボックスケース270が形成される。すなわち中継ボックス200は、ボックスケース270および回路基板210からなる。
<Relay box>
The junction box 200 is composed of a circuit board 210 housed inside, an upper case 230 for housing the circuit board 210, and a lower case 250. As shown in FIG. A box case 270 that accommodates the circuit board 210 is formed by integrally attaching the upper case 230 and the lower case 250 . That is, junction box 200 is composed of box case 270 and circuit board 210 .
<回路基板>
 図3に示すように、回路基板210は、平面視矩形状の薄板状のプリント配線基板であって、従来に比して長手方向(矢印ab方向)の長さL1が短くなっている。回路基板210は、出力端子112、122と電気的に接続される端子211、212を一方側(矢印a方向)の端部に有している。
<Circuit board>
As shown in FIG. 3, the circuit board 210 is a thin printed wiring board that is rectangular in plan view, and has a shorter length L1 in the longitudinal direction (arrow ab direction) than the conventional one. The circuit board 210 has terminals 211 and 212 electrically connected to the output terminals 112 and 122 at one end (in the direction of the arrow a).
 回路基板210は、端子211、212と接続され、長手方向(矢印ab方向)に沿って一方側(矢印a方向)から他方側(矢印b方向)までエッジの立った波形状(例えばパルス波形状)にそれぞれ延びる正極側の導体パターン213、および、負極側の導体パターン214を有している。ここで、導体パターン213、214の形状としては、蛇腹形状、エッジの立たない波形状や、ジグザグ形状等、その他種々の形状を取り得るが、要するに、波形状であれば、その細かい形状は特に問わない。 The circuit board 210 is connected to terminals 211 and 212 and has a wave shape (for example, a pulse wave shape) with sharp edges from one side (direction of arrow a) to the other side (direction of arrow b) along the longitudinal direction (direction of arrow ab). ) on the positive electrode side and a conductive pattern 214 on the negative electrode side. Here, the conductor patterns 213 and 214 may have various shapes such as a bellows shape, a wave shape with no sharp edges, a zigzag shape, and the like. I don't mind.
 導体パターン213、214は、複数の長手方向(矢印ab方向)の部分(以下、「長手方向部分」と言う。)213L(213L1乃至213L5)と、当該長手方向(矢印ab方向)と直交する複数の短手方向の部分(以下、「短手方向部分」と言う。)213Sと、が交互に繋がった波形状を有している。ただし、図2において、短手方向部分213Sについては後述する抵抗素子R1乃至R14の存在によって殆どが隠れている。 The conductor patterns 213 and 214 are composed of a plurality of longitudinal direction (arrow ab direction) portions (hereinafter referred to as “longitudinal direction portions”) 213L (213L1 to 213L5) and a plurality of longitudinal direction (arrow ab directions) perpendicular to the longitudinal direction (arrow ab direction). (hereinafter referred to as "transverse direction portion") 213S and 213S are alternately connected to form a wavy shape. However, in FIG. 2, most of the width direction portion 213S is hidden due to the presence of resistance elements R1 to R14, which will be described later.
 導体パターン213においては、一方側(矢印a方向)から数えて最初の短手方向部分213Sに3個の抵抗素子R1乃至R3が直列に設置されている。これらの抵抗素子R1、R2、R3は導体パターン213の短手方向部分213Sを介して互いに電気的に接続されている。 In the conductor pattern 213, three resistive elements R1 to R3 are installed in series in the first transverse direction portion 213S counted from one side (direction of arrow a). These resistive elements R1, R2, and R3 are electrically connected to each other through the lateral direction portion 213S of the conductor pattern 213. As shown in FIG.
 同様に、導体パターン213においては、抵抗素子R3に続いて次の2番目の短手方向部分213Sに抵抗素子R4乃至R6が設置されている。そして導体パターン213においては、抵抗素子R6に続いて次の3番目の短手方向部分213Sに抵抗素子R7乃至R9が配置されている。 Similarly, in the conductor pattern 213, following the resistive element R3, the resistive elements R4 to R6 are installed in the next second lateral portion 213S. In the conductor pattern 213, the resistor elements R7 to R9 are arranged in the next third lateral portion 213S following the resistor element R6.
 さらに、導体パターン213においては、抵抗素子R9に続いて次の4番目の短手方向部分213Sに抵抗素子R10乃至R12が設置され、抵抗素子R12に続いて最後の5番目の短手方向部分213Sに抵抗素子R13、R14が設置されている。 Furthermore, in the conductor pattern 213, following the resistive element R9, the resistive elements R10 to R12 are installed in the next fourth transverse direction portion 213S, and following the resistive element R12, the last fifth transverse direction portion 213S. are provided with resistance elements R13 and R14.
 なお、抵抗素子R1は、端子211と導体パターン213の長手方向部分213L1によって接続されている。また、抵抗素子R3と抵抗素子R4は、導体パターン213の長手方向部分213L2によって電気的に接続されている。 The resistance element R1 is connected to the terminal 211 and the longitudinal portion 213L1 of the conductor pattern 213. Also, the resistive element R3 and the resistive element R4 are electrically connected by the longitudinal portion 213L2 of the conductor pattern 213. As shown in FIG.
 同様に、抵抗素子R6と抵抗素子R7との間、抵抗素子R9と抵抗素子R10との間、抵抗素子R12と抵抗素子R13との間においても導体パターン213の長手方向部分213L3、213L4、213L5によってそれぞれ電気的に接続されている。 Similarly, between the resistor element R6 and the resistor element R7, between the resistor element R9 and the resistor element R10, and between the resistor element R12 and the resistor element R13, the longitudinal portions 213L3, 213L4, and 213L5 of the conductor pattern 213 They are electrically connected to each other.
 なお、抵抗素子R14は、導体パターン213の短手方向部分213Sを介して端子215と接続されている。回路基板210の端子215は、中継ボックス200の入力端子130(図1)と接続されている。 Note that the resistance element R14 is connected to the terminal 215 via the lateral direction portion 213S of the conductor pattern 213. Terminal 215 of circuit board 210 is connected to input terminal 130 ( FIG. 1 ) of junction box 200 .
 このように抵抗素子R1乃至R14は、導体パターン213の長手方向部分213Lおよび短手方向部分213Sに沿って波形状に直列に接続されている。以下、抵抗素子R1乃至R14を第1抵抗素子群GR1と称する。 In this manner, the resistor elements R1 to R14 are connected in series along the longitudinal portion 213L and the lateral portion 213S of the conductor pattern 213 in a wavy shape. The resistance elements R1 to R14 are hereinafter referred to as a first resistance element group GR1.
 第1抵抗素子群GR1では、抵抗素子R1乃至R14が従来のように全て1本の直線上に直列に配置されて接続される構成に比べて、波形状に接続されているためその全長が一段と短くなっている。これにより回路基板210は、長手方向(矢印ab方向)の長さL1を従来に比して一段と短くすることができる。 In the first resistance element group GR1, compared to the conventional structure in which all the resistance elements R1 to R14 are arranged and connected in series on a single straight line, since they are connected in a wave shape, the entire length is further increased. It's getting shorter. As a result, the circuit board 210 can be made much shorter in length L1 in the longitudinal direction (arrow ab direction) than in the conventional art.
 導体パターン214においても、導体パターン213と同様であり、最初の短手方向部分214Sに3個の抵抗素子R15乃至R17が直列に設置され、これらの抵抗素子R15、R16、R17が導体パターン214の短手方向部分214Sを介して互いに電気的に接続されている。 The conductor pattern 214 is the same as the conductor pattern 213, and three resistance elements R15 to R17 are installed in series in the first transverse direction portion 214S. They are electrically connected to each other via the lateral portion 214S.
 同様に、導体パターン214においては、抵抗素子R17に続いて次の2番目の短手方向部分214Sに抵抗素子R18乃至R20が設置され、抵抗素子R20に続いて次の3番目の短手方向部分214Sに抵抗素子R21乃至R23が設置されている。また、導体パターン214では、抵抗素子R23に続いて次の4番目の短手方向部分214Sに抵抗素子R24乃至R26が設置され、抵抗素子R26に続いて最後の短手方向部分214Sには抵抗素子R27、R28が設置されている。 Similarly, in the conductor pattern 214, resistive elements R18 to R20 are installed in the second transverse direction portion 214S following the resistive element R17, and resistive elements R18 to R20 are installed in the third transverse direction portion 214S following the resistive element R20. 214S are provided with resistance elements R21 to R23. Further, in the conductor pattern 214, following the resistive element R23, resistive elements R24 to R26 are provided in the next fourth transverse direction portion 214S, and resistive elements R24 to R26 are provided in the last transverse direction portion 214S following the resistive element R26. R27 and R28 are installed.
 なお、抵抗素子R15は、端子212と導体パターン214の長手方向部分214L1によって接続されている。また、抵抗素子R17と抵抗素子R18は導体パターン214の長手方向部分214L2によって電気的に接続されている。 The resistance element R15 is connected to the terminal 212 by the longitudinal portion 214L1 of the conductor pattern 214. Also, the resistive element R17 and the resistive element R18 are electrically connected by a longitudinal portion 214L2 of the conductor pattern 214. As shown in FIG.
 同様に、抵抗素子R20と抵抗素子R21との間、抵抗素子R23と抵抗素子R24との間、抵抗素子R26と抵抗素子R27との間においても導体パターン214の長手方向部分214L3、214L4、214L5によってそれぞれ電気的に接続されている。 Similarly, between the resistor element R20 and the resistor element R21, between the resistor element R23 and the resistor element R24, and between the resistor element R26 and the resistor element R27, the longitudinal direction portions 214L3, 214L4, and 214L5 of the conductor pattern 214 They are electrically connected to each other.
 なお、抵抗素子R28は、導体パターン214の短手方向部分214Sを介して端子216と接続されている。回路基板210の端子216は、中継ボックス200の入力端子140(図1)と接続されている。 Note that the resistance element R28 is connected to the terminal 216 via the lateral direction portion 214S of the conductor pattern 214. Terminal 216 of circuit board 210 is connected to input terminal 140 ( FIG. 1 ) of junction box 200 .
 このように抵抗素子R15乃至R28についても、抵抗素子R1乃至R14と同様に、導体パターン214に沿って波形状に直列に接続されている。以下、抵抗素子R15乃至R28を第2抵抗素子群GR2と称する。 In this manner, the resistance elements R15 to R28 are also connected in series in a wave shape along the conductor pattern 214 in the same manner as the resistance elements R1 to R14. The resistance elements R15 to R28 are hereinafter referred to as a second resistance element group GR2.
 第2抵抗素子群GR2においても、抵抗素子R15乃至R28が従来のように全て1本の直線上に直列に配置されて接続される構成に比べて、波形状に直列に接続されているためその全長が一段と短くなっている。これにより回路基板210は、第1抵抗素子群GR1および第2抵抗素子群GR2によって長手方向(矢印ab方向)の長さL1を従来に比して一段と短くすることができる。 In the second resistor element group GR2 as well, the resistor elements R15 to R28 are all arranged and connected in series on a single straight line as in the related art. Overall length is shorter. As a result, the circuit board 210 can further reduce the length L1 in the longitudinal direction (arrow ab direction) by the first resistance element group GR1 and the second resistance element group GR2 compared to the conventional case.
 回路基板210は、導体パターン213を介して接続された抵抗素子R1乃至R14からなる第1抵抗素子群GR1と、導体パターン214を介して接続された抵抗素子R15乃至R28からなる第2抵抗素子群GR2とを短手方向において隔てるように長手方向(矢印ab方向)に沿って延びるメインスリットM1を有している。 The circuit board 210 includes a first resistance element group GR1 composed of resistance elements R1 to R14 connected via a conductor pattern 213, and a second resistance element group composed of resistance elements R15 to R28 connected via a conductor pattern 214. It has a main slit M1 extending along the longitudinal direction (arrow ab direction) so as to separate it from GR2 in the lateral direction.
 このメインスリットM1は、他方側(矢印b方向)の端面210eから一方側(矢印a方向)の端面210fへ長手方向(矢印ab方向)に沿って所定の長さだけ延びる所定幅および所定長さのスリットである。ただし、メインスリットM1は回路基板210の一方側(矢印a方向)の端面210fにまでは到達していない。 The main slit M1 has a predetermined width and a predetermined length extending from the end surface 210e on the other side (direction of arrow b) to the end surface 210f on one side (direction of arrow a) along the longitudinal direction (direction of arrow ab) for a predetermined length. is the slit. However, the main slit M1 does not reach the end face 210f on one side of the circuit board 210 (in the direction of the arrow a).
 また回路基板210は、メインスリットM1の一方側(矢印a方向)の終端部から長手方向(矢印ab方向)とは直交する短手方向の両側へそれぞれ延びるサブスリットS1、S4を有している。 In addition, the circuit board 210 has sub-slits S1 and S4 extending from one end of the main slit M1 (in the direction of the arrow a) to both sides in the short direction perpendicular to the longitudinal direction (the direction of the arrow ab). .
 サブスリットS1、S4は、それぞれ短手方向へ所定の長さだけ延びているが、導体パターン213の長手方向部分213L1および導体パターン214の長手方向部分214L1にまでは到達していない程度の長さを有している。メインスリットM1とサブスリットS1、S4とは互いに連通している。 Each of the sub-slits S1 and S4 extends in the lateral direction by a predetermined length, but the length does not reach the longitudinal portion 213L1 of the conductor pattern 213 and the longitudinal portion 214L1 of the conductor pattern 214. have. The main slit M1 and the sub-slits S1 and S4 communicate with each other.
 さらに回路基板210は、サブスリットS1、S4から他方側(矢印b方向)へ所定の距離だけ離れた位置にサブスリットS2、S5を有している。サブスリットS2は、サブスリットS1との間に、抵抗素子S1乃至S3および抵抗素子S4乃至S6を挟み込むように配置されている。サブスリットS2は、サブスリットS1と平行かつ同じ長さであり、導体パターン213の長手方向部分213L3にまでは到達していない。サブスリットS2はメインスリットM1と連通している。 Further, the circuit board 210 has sub-slits S2 and S5 at positions separated by a predetermined distance from the sub-slits S1 and S4 to the other side (in the direction of the arrow b). The sub-slit S2 and the sub-slit S1 are arranged so as to sandwich the resistance elements S1 to S3 and the resistance elements S4 to S6. The sub-slit S2 is parallel to the sub-slit S1 and has the same length, and does not reach the longitudinal portion 213L3 of the conductor pattern 213. As shown in FIG. The sub-slit S2 communicates with the main slit M1.
 サブスリットS5は、サブスリットS4との間に、抵抗素子S15乃至S17および抵抗素子S18乃至S20を挟み込むように配置されている。サブスリットS5は、サブスリットS4と平行かつ同じ長さであり、導体パターン214の長手方向部分214L3にまでは到達していない。サブスリットS5はメインスリットM1と連通している。 The sub-slit S5 and the sub-slit S4 are arranged so as to sandwich the resistance elements S15 to S17 and the resistance elements S18 to S20. The sub-slit S5 is parallel to the sub-slit S4 and has the same length, and does not reach the longitudinal portion 214L3 of the conductor pattern 214. FIG. The sub-slit S5 communicates with the main slit M1.
 同様に、回路基板210は、サブスリットS2、S5から他方側(矢印b方向)へ更に所定の距離だけ離れた位置にサブスリットS3、S6を有している。サブスリットS3は、サブスリットS2との間に、抵抗素子S7乃至S9および抵抗素子S10乃至S12を挟み込むように配置されている。サブスリットS3は、サブスリットS1、S2と平行かつ同じ長さであり、導体パターン213の長手方向部分213L5にまでは到達していない。サブスリットS3は、メインスリットM1と連通している。 Similarly, the circuit board 210 has sub-slits S3 and S6 at positions separated from the sub-slits S2 and S5 by a predetermined distance to the other side (in the direction of the arrow b). The sub-slit S3 and the sub-slit S2 are arranged so as to sandwich the resistance elements S7 to S9 and the resistance elements S10 to S12. The sub-slit S3 is parallel to the sub-slits S1 and S2 and has the same length, and does not reach the longitudinal portion 213L5 of the conductor pattern 213 . The sub-slit S3 communicates with the main slit M1.
 サブスリットS6は、サブスリットS5との間に、抵抗素子S21乃至S23および抵抗素子S24乃至S26を挟み込むように配置されている。サブスリットS6は、サブスリットS4、S5と平行かつ同じ長さであり、導体パターン214の長手方向部分214L5にまでは到達していない。サブスリットS6は、メインスリットM1と連通している。 The sub-slit S6 and the sub-slit S5 are arranged so as to sandwich the resistance elements S21 to S23 and the resistance elements S24 to S26. The sub-slit S6 is parallel to the sub-slits S4 and S5 and has the same length, and does not reach the longitudinal portion 214L5 of the conductor pattern 214. FIG. The sub-slit S6 communicates with the main slit M1.
 このように、サブスリットS1乃至S3は、基本的な構成が同じであり、その幅や短手方向の長さについても全て同じであり、互いに平行に配置されている。また、サブスリットS4乃至S6についても、基本的な構成が同じであり、その幅や短手方向の長さについても全て同じであり、互いに平行に配置されている。 In this way, the sub-slits S1 to S3 have the same basic configuration, the same width and the same length in the transverse direction, and are arranged parallel to each other. Further, the sub-slits S4 to S6 have the same basic configuration, have the same width and the same length in the transverse direction, and are arranged parallel to each other.
 サブスリットS1およびサブスリットS4は、回路基板210の短手方向においてメインスリットM1を介して直線状に繋がっている。サブスリットS2、S3およびサブスリットS5、S6についても回路基板210の短手方向においてメインスリットM1を介して直線状に繋がっている。つまり、メインスリットM1とサブスリットS1乃至S3およびサブスリットS4乃至S6とは互いに交差した状態で連通している。 The sub-slit S1 and the sub-slit S4 are linearly connected via the main slit M1 in the lateral direction of the circuit board 210 . The sub-slits S2 and S3 and the sub-slits S5 and S6 are also linearly connected in the lateral direction of the circuit board 210 via the main slit M1. That is, the main slit M1, the sub-slits S1 to S3, and the sub-slits S4 to S6 communicate with each other while crossing each other.
 また、回路基板210においては、第1抵抗素子群GR1のうち抵抗素子R1乃至R3の列と、抵抗素子R4乃至R6の列との間であって、側端面210cからメインスリットM1に向かって延びるスリット(以下、これを「エッジスリット」と言う。)E1を有している。エッジスリットE1は、導体パターン213の長手方向部分213L2に到達しない程度の長さの切込からなり、サブスリットS1とサブスリットS2との間に配置されている。 Further, in the circuit board 210, between the row of the resistance elements R1 to R3 and the row of the resistance elements R4 to R6 in the first resistance element group GR1, the line extending from the side end surface 210c toward the main slit M1. It has a slit (hereinafter referred to as an "edge slit") E1. The edge slit E1 consists of a cut having a length that does not reach the longitudinal portion 213L2 of the conductor pattern 213, and is arranged between the sub-slit S1 and the sub-slit S2.
 同様に、回路基板210においては、第1抵抗素子群GR1のうち抵抗素子R7乃至R9の列と、抵抗素子R10乃至R12の列との間であって、側端面210cからメインスリットM1に向かって延びるエッジスリットE2を有している。エッジスリットE2は、導体パターン213の長手方向部分213L4に到達しない程度の長さの切込からなり、サブスリットS2とサブスリットS3との間に配置されている。 Similarly, in the circuit board 210, between the row of the resistance elements R7 to R9 and the row of the resistance elements R10 to R12 in the first resistance element group GR1, from the side end surface 210c toward the main slit M1. It has an extending edge slit E2. The edge slit E2 is a cut having a length not reaching the longitudinal portion 213L4 of the conductor pattern 213, and is arranged between the sub-slit S2 and the sub-slit S3.
 このように回路基板210では、メインスリットM1、サブスリットS1乃至S3、および、エッジスリットE1、E2の存在により、回路基板210上に波形状の導体パターン213を印刷するための基板部分が残されている。 Thus, in the circuit board 210, due to the existence of the main slit M1, the sub-slits S1 to S3, and the edge slits E1 and E2, a board portion for printing the wave-shaped conductor pattern 213 on the circuit board 210 is left. ing.
 同様に、回路基板210においては、第2抵抗素子群GR2のうち抵抗素子R15乃至R17の列と、抵抗素子R18乃至R20の列との間であって、側端面210dからメインスリットM1に向かって延びるエッジスリットE3を有している。エッジスリットE3は、導体パターン214の長手方向部分214L2に到達しない程度の長さの切込からなり、サブスリットS4とサブスリットS5との間に配置されている。 Similarly, in the circuit board 210, between the row of the resistance elements R15 to R17 and the row of the resistance elements R18 to R20 in the second resistance element group GR2, from the side end surface 210d toward the main slit M1. It has an extending edge slit E3. The edge slit E3 consists of a cut having a length that does not reach the longitudinal portion 214L2 of the conductor pattern 214, and is arranged between the sub-slit S4 and the sub-slit S5.
 さらに、回路基板210においては、第2抵抗素子群GR2のうち抵抗素子R21乃至R23の列と、抵抗素子R24乃至R26の列との間であって、側端面210dからメインスリットM1に向かって延びるエッジスリットE4を有している。エッジスリットE4は、導体パターン214の長手方向部分214L4に到達しない程度の長さの切込からなり、サブスリットS5とサブスリットS6との間に配置されている。 Furthermore, in the circuit board 210, between the row of the resistance elements R21 to R23 and the row of the resistance elements R24 to R26 in the second resistance element group GR2, the line extending from the side end surface 210d toward the main slit M1. It has an edge slit E4. The edge slit E4 consists of a cut having a length that does not reach the longitudinal portion 214L4 of the conductor pattern 214, and is arranged between the sub-slit S5 and the sub-slit S6.
 このように回路基板210では、メインスリットM1、サブスリットS4乃至S6、および、エッジスリットE3、E4の存在により、回路基板210上に波形状の導体パターン214を印刷するための基板部分が残されている。 Thus, in the circuit board 210, due to the presence of the main slit M1, the sub-slits S4 to S6, and the edge slits E3 and E4, a board portion for printing the wave-shaped conductor pattern 214 on the circuit board 210 is left. ing.
<上ケース>
 図4及び図5に示すように、ボックスケース270の上ケース230は、下ケース250と組み合わされた場合に回路基板210を収容可能な内部空間を有する、絶縁性材料の例えば樹脂等からなる矩形状のケース体である。特に、図3および図4は、ボックスケース270を形成する上ケース230の裏面230uに形成された内側部分の構成が表示されている状態である。
<Upper case>
As shown in FIGS. 4 and 5, the upper case 230 of the box case 270 has an internal space capable of accommodating the circuit board 210 when combined with the lower case 250, and is made of an insulating material such as resin. It is a shaped case body. In particular, FIGS. 3 and 4 show the configuration of the inner portion formed on the rear surface 230u of the upper case 230 forming the box case 270. FIG.
 上ケース230は、回路基板210のメインスリットM1、サブスリットS1乃至S3、エッジスリットE1、E2にそれぞれ対応して差し込み可能に設けられた複数のリブからなる第1差込リブ群RB1と、メインスリットM1、サブスリットS4乃至S6、エッジスリットE3、E4にそれぞれ対応して差し込み可能に設けられた複数のリブからなる第2差込リブ群RB2とを有している。 The upper case 230 includes a first insertion rib group RB1 made up of a plurality of ribs that are insertably provided corresponding to the main slit M1, the sub-slits S1 to S3, and the edge slits E1 and E2 of the circuit board 210, respectively; It has a second inserting rib group RB2 composed of a plurality of ribs which are insertably provided corresponding to the slit M1, the sub-slits S4 to S6, and the edge slits E3 and E4, respectively.
 第1差込リブ群RB1は、回路基板210のメインスリットM1に差し込まれるメインリブmr1と、回路基板210のサブスリットS1乃至S3にそれぞれ差し込まれるサブリブsr1乃至sr3と、回路基板210のエッジスリットE1、E2に対してそれぞれ差し込まれるエッジリブer1、er2とを有している。 The first insertion rib group RB1 includes a main rib mr1 inserted into the main slit M1 of the circuit board 210, sub-ribs sr1 to sr3 respectively inserted into the sub-slits S1 to S3 of the circuit board 210, edge slits E1 of the circuit board 210, It has edge ribs er1 and er2 which are inserted respectively against E2.
 第1差込リブ群RB1のメインリブmr1は、全体として略U字枠状に形成された枠リブWR1のうち、回路基板210のメインスリットM1に対向して長手方向(矢印ab方向)に沿って延びた直線状のリブ部分である。 The main rib mr1 of the first insertion rib group RB1 is, of the frame rib WR1 formed in a substantially U-shaped frame as a whole, facing the main slit M1 of the circuit board 210 and extending along the longitudinal direction (arrow ab direction). It is an elongated linear rib portion.
 メインリブmr1は、上ケース230のほぼ中央部分に配置されている。メインリブmr1は、長手方向(矢印ab方向)においてメインスリットM1よりも僅かに短い長さを有しており、一方側(矢印a方向)の端部においてサブリブsr1と一体化されている。 The main rib mr1 is arranged substantially in the central portion of the upper case 230 . The main rib mr1 has a length slightly shorter than the main slit M1 in the longitudinal direction (arrow ab direction), and is integrated with the sub-rib sr1 at one end (arrow a direction).
 サブリブsr1は、回路基板210のサブスリットS1に対向して長手方向(矢印ab方向)と直交する短手方向に沿って直線状に延びたリブである。サブリブsr2は、回路基板210のサブスリットS2に対向して長手方向(矢印ab方向)と直交する短手方向に沿って延びたリブであり、サブリブsr1と同じ長さを有している。 The sub-rib sr1 is a rib that faces the sub-slit S1 of the circuit board 210 and extends linearly along the lateral direction perpendicular to the longitudinal direction (arrow ab direction). The sub-rib sr2 is a rib that faces the sub-slit S2 of the circuit board 210 and extends along the lateral direction orthogonal to the longitudinal direction (arrow ab direction), and has the same length as the sub-rib sr1.
 サブリブsr3についても、回路基板210のサブスリットS3に対向して長手方向(矢印ab方向)と直交する短手方向に沿って直線状に延びたリブであり、サブリブsr1、sr2と同じ長さを有している。 The sub-rib sr3 is also a rib that extends linearly along the lateral direction orthogonal to the longitudinal direction (arrow ab direction) facing the sub-slit S3 of the circuit board 210, and has the same length as the sub-ribs sr1 and sr2. have.
 サブリブsr1乃至sr3は、お互いに同じ間隔を空けて設けられている。サブリブsr1およびサブリブsr2は、両者の間に第1抵抗素子群GR1の抵抗素子R1乃至R3および抵抗素子R4乃至R6を配置可能な位置関係にある。また、サブリブsr2とサブリブsr3は、両者の間に第1抵抗素子群GR1の抵抗素子R7乃至R9および抵抗素子R10乃至R12を配置可能な位置関係にある。 The sub-ribs sr1 to sr3 are provided with the same spacing from each other. The sub-rib sr1 and the sub-rib sr2 are in a positional relationship such that the resistance elements R1 to R3 and the resistance elements R4 to R6 of the first resistance element group GR1 can be arranged therebetween. Further, the sub-rib sr2 and the sub-rib sr3 are in a positional relationship such that the resistance elements R7 to R9 and the resistance elements R10 to R12 of the first resistance element group GR1 can be arranged between them.
 エッジリブer1、er2は、回路基板210のエッジスリットE1、E2に対向して長手方向(矢印ab方向)と直交する短手方向に沿い、枠リブWR1の外側方向からメインリブmr1へそれぞれ向かって直線状に延びたリブである。エッジリブer1、er2は、枠リブWR1と一体に形成されている。 The edge ribs er1 and er2 face the edge slits E1 and E2 of the circuit board 210 and extend linearly from the outer side of the frame rib WR1 toward the main rib mr1 along the lateral direction perpendicular to the longitudinal direction (arrow ab direction). It is a rib that extends to The edge ribs er1 and er2 are formed integrally with the frame rib WR1.
 エッジリブer1は、長手方向(矢印ab方向)においてサブリブsr1とサブリブsr2との中間に配置されている。エッジリブer2は、長手方向(矢印ab方向)においてサブリブsr2とサブリブsr3との中間に配置されている。つまり、サブリブsr1乃至sr3とエッジリブer1、er2とは長手方向(矢印ab方向)において交互に配置されている。 The edge rib er1 is arranged midway between the sub-rib sr1 and the sub-rib sr2 in the longitudinal direction (arrow ab direction). The edge rib er2 is arranged midway between the sub-rib sr2 and the sub-rib sr3 in the longitudinal direction (arrow ab direction). That is, the sub-ribs sr1 to sr3 and the edge ribs er1 and er2 are alternately arranged in the longitudinal direction (arrow ab direction).
 なお、図8に示すように、メインリブmr1(図8においては図示されていない)、サブリブsr1乃至sr3、および、エッジリブer1、er2は、上ケース230と下ケース250との間に配置された回路基板210のメインスリットM1(図8においては図示されていない)、サブスリットS1乃至S3、エッジスリットE1、E2に差し込まれるが、下ケース250にまで到達しない程度の高さを有している。 As shown in FIG. 8, a main rib mr1 (not shown in FIG. 8), sub-ribs sr1 to sr3, and edge ribs er1 and er2 are arranged between the upper case 230 and the lower case 250. It is inserted into the main slit M1 (not shown in FIG. 8), the sub-slits S1 to S3, and the edge slits E1 and E2 of the substrate 210, but has a height that does not reach the lower case 250.
 また、メインリブmr1には、長手方向(矢印ab方向)とは直交する短手方向へ僅かに突出した複数の支持片ss11乃至ss13が一体に形成されている。支持片ss11乃至ss13は、長手方向(矢印ab方向)においてサブリブsr1乃至sr3と交互に配置されている。また、支持片ss11、ss12は、長手方向(ab方向)とは直交する短手方向においてエッジリブer1、er2と対向するように配置されている。 Also, the main rib mr1 is integrally formed with a plurality of support pieces ss11 to ss13 slightly protruding in the lateral direction orthogonal to the longitudinal direction (arrow ab direction). The support pieces ss11 to ss13 are alternately arranged with the sub-ribs sr1 to sr3 in the longitudinal direction (arrow ab direction). Further, the support pieces ss11 and ss12 are arranged so as to face the edge ribs er1 and er2 in the lateral direction orthogonal to the longitudinal direction (ab direction).
 支持片ss11乃至ss13は、メインリブmr1から短手方向へ短く突出しているだけであり、特に支持片ss11およびss12については、短手方向においてエッジリブer1とエッジリブer2との間に所定の間隔が形成されている。すなわち、メインリブmr1の支持片ss11、ss12と、エッジリブer1、er2との間には、回路基板210の導体パターン213の長手方向部分213L2、213L4がそれぞれ位置付けられることになる。 The support pieces ss11 to ss13 only protrude short in the transverse direction from the main rib mr1, and particularly in the support pieces ss11 and ss12, a predetermined gap is formed between the edge rib er1 and the edge rib er2 in the transverse direction. ing. That is, longitudinal portions 213L2 and 213L4 of the conductor pattern 213 of the circuit board 210 are positioned between the supporting pieces ss11 and ss12 of the main rib mr1 and the edge ribs er1 and er2, respectively.
 これらの支持片ss11乃至ss13は、その高さがメインリブmr1よりも低く、回路基板210と当接されて当該回路基板210を上方から支持する面である端面ss11t乃至ss13t(図5)をそれぞれ有している。 These support pieces ss11 to ss13 are lower in height than the main rib mr1, and have end surfaces ss11t to ss13t (FIG. 5), which are surfaces that support the circuit board 210 from above by coming into contact with the circuit board 210. are doing.
 サブリブsr1乃至sr3においては、長手方向(矢印ab方向)における一方側(矢印a方向)の側面および他方側(矢印b方向)の側面に対して、互いに背向するように形成された2つの支持片pp11、pp12、支持片pp21、pp22、支持片pp31、pp32がそれぞれ形成されている。ただし、図4においては、支持片pp11、pp21、pp31についてはサブリブsr1乃至sr3の陰にあるため表示されていない。 In the sub-ribs sr1 to sr3, two supports are formed so as to face each other on one side (arrow a direction) and the other side (arrow b direction) in the longitudinal direction (arrow ab direction). Pieces pp11 and pp12, support pieces pp21 and pp22, and support pieces pp31 and pp32 are formed, respectively. However, in FIG. 4, the support pieces pp11, pp21, and pp31 are not shown because they are behind the sub-ribs sr1 to sr3.
 これらの支持片pp11、pp12、支持片pp21、pp22、支持片pp31、pp32においても、その高さがサブリブsr1乃至sr3よりも低く、回路基板210と当接されて当該回路基板210を上方から支持する面である端面pp11t、pp12t、端面pp21t、pp22t、端面pp31t、pp32tを有している。ただし、図4においては、端面pp11t、pp21t、pp31tについてもサブリブsr1乃至sr3の陰にあるため表示されていない。 These support pieces pp11 and pp12, support pieces pp21 and pp22, and support pieces pp31 and pp32 are also lower in height than the sub-ribs sr1 to sr3, and are in contact with the circuit board 210 to support the circuit board 210 from above. end faces pp11t, pp12t, end faces pp21t, pp22t, end faces pp31t, pp32t, which are faces to be connected. However, in FIG. 4, the end faces pp11t, pp21t, and pp31t are not shown because they are behind the sub-ribs sr1 to sr3.
 エッジリブer1およびer2においても、長手方向(矢印ab方向)における一方側(矢印a方向)の側面および他方側(矢印b方向)の側面に対して、互いに背向するように形成された2つの支持片qq11、qq12、支持片qq21、qq22がそれぞれ形成されている。 In the edge ribs er1 and er2 as well, two supports are formed so as to face each other on one side (arrow a direction) and the other side (arrow b direction) in the longitudinal direction (arrow ab direction). Pieces qq11 and qq12 and support pieces qq21 and qq22 are formed respectively.
 これらの支持片qq11、qq12、および、支持片qq21、qq22においても、その高さがエッジリブer1、er2よりも低く、回路基板210と当接されて当該回路基板210を上方から支持する面である端面qq11t、qq12t、および、端面qq21t、qq22t(図5)を有している。 These support pieces qq11 and qq12 and support pieces qq21 and qq22 are also lower in height than the edge ribs er1 and er2, and are surfaces that come into contact with the circuit board 210 and support the circuit board 210 from above. It has end faces qq11t, qq12t and end faces qq21t, qq22t (FIG. 5).
 なお、メインリブmr1における支持片ss11乃至ss13の端面ss11t乃至ss13t、サブリブsr1乃至sr3におけるそれぞれの支持片pp11、pp12、支持片pp21、pp22、支持片pp31、pp32の端面pp11t、pp12t、端面pp21t、pp22t、端面pp31t、pp32t、および、エッジリブer1、er2におけるそれぞれの支持片qq11、qq12、支持片qq21、qq22の端面qq11t、qq12t、および、端面qq21t、qq22tは、全て同じ高さであり、回路基板210と当接される面である。以下、これら全ての端面を第1支持片端面群RB1tと以下総称する。 Note that the end faces ss11t to ss13t of the support pieces ss11 to ss13 of the main rib mr1, the end faces pp11t, pp12t, and the end faces pp21t, pp22t of the support pieces pp11, pp12, support pieces pp21, pp22, and support pieces pp31, pp32 of the sub-ribs sr1 to sr3, respectively. , end faces pp31t, pp32t, and end faces qq11t, qq12t and end faces qq21t, qq22t of the supporting pieces qq11, qq12, supporting pieces qq21, qq22 of the edge ribs er1, er2 are all the same height, and the circuit board 210 It is a surface to be abutted with. Hereinafter, all these end faces are collectively referred to as a first support piece end face group RB1t.
 第2差込リブ群RB2は、長手方向(矢印ab方向)に沿う中心線Xを中心とした第1差込リブ群RB1と線対称となる複数のリブからなる。すなわち、第2差込リブ群RB2は、回路基板210のメインスリットM1に差し込まれるメインリブmr2と、回路基板210のサブスリットS4乃至S6にそれぞれ差し込まれるサブリブsr4乃至sr6と、回路基板210のエッジスリットE4、E5に対してそれぞれ差し込まれるエッジリブer3、er4とを有している。 The second insertion rib group RB2 consists of a plurality of ribs that are symmetrical with the first insertion rib group RB1 about the center line X along the longitudinal direction (arrow ab direction). That is, the second insertion rib group RB2 includes a main rib mr2 inserted into the main slit M1 of the circuit board 210, sub-ribs sr4 to sr6 respectively inserted into the sub-slits S4 to S6 of the circuit board 210, and edge slits of the circuit board 210. It has edge ribs er3 and er4 that are inserted into E4 and E5, respectively.
 第2差込リブ群RB2のメインリブmr2は、全体として略U字枠状に形成された枠リブWR2のうち、回路基板210のメインスリットM1に対向して長手方向(矢印ab方向)に沿って延びたリブ部分である。 The main rib mr2 of the second insertion rib group RB2 extends along the longitudinal direction (arrow ab direction) facing the main slit M1 of the circuit board 210 among the frame ribs WR2 formed in a substantially U-shaped frame as a whole. It is an elongated rib portion.
 メインリブmr2は、上ケース230のほぼ中央部分に配置されている。メインリブmr2は、第1差込リブ群RB1のメインリブmr1と僅かな隙間を介して隣接した位置に設けられ、当該メインリブmr1と平行した状態で同じ長さに形成されている。 The main rib mr2 is arranged substantially in the central portion of the upper case 230. The main rib mr2 is provided at a position adjacent to the main rib mr1 of the first insertion rib group RB1 with a slight gap therebetween, and is formed to have the same length as the main rib mr1 in parallel.
 すなわち、メインリブmr1およびメインリブmr2は、双方ともに回路基板210のメインスリットM1に差し込まれる。ここで、メインリブmr1とメインリブmr2との間の隙間は、後述する下ケース250のセンターリブcr1が差し込まれることを可能とする距離となっている。 That is, both the main rib mr1 and the main rib mr2 are inserted into the main slit M1 of the circuit board 210. Here, the gap between the main rib mr1 and the main rib mr2 is a distance that allows a center rib cr1 of the lower case 250, which will be described later, to be inserted.
 なお、メインリブmr2は、回路基板210のメインスリットM1よりも僅かに短い長さを有しており、一方側(矢印a方向)の端部においてサブリブsr4と一体化されている。 The main rib mr2 has a length slightly shorter than the main slit M1 of the circuit board 210, and is integrated with the sub-rib sr4 at one end (in the direction of the arrow a).
 サブリブsr4は、回路基板210のサブスリットS4に対向して長手方向(矢印ab方向)と直交する短手方向に沿って延びたリブである。サブリブsr5は、回路基板210のサブスリットS5に対向して長手方向(矢印ab方向)と直交する短手方向に沿って延びたリブであり、サブリブsr4と同じ長さを有している。 The sub-rib sr4 is a rib that faces the sub-slit S4 of the circuit board 210 and extends along the lateral direction orthogonal to the longitudinal direction (arrow ab direction). The sub-rib sr5 is a rib that faces the sub-slit S5 of the circuit board 210 and extends along the lateral direction orthogonal to the longitudinal direction (arrow ab direction), and has the same length as the sub-rib sr4.
 サブリブsr6についても、回路基板210のサブスリットS3に対向して長手方向(矢印ab方向)と直交する短手方向に沿って延びたリブであり、サブリブsr4、sr5と同じ長さを有している。 The sub-rib sr6 is also a rib extending along the lateral direction perpendicular to the longitudinal direction (arrow ab direction) facing the sub-slit S3 of the circuit board 210, and has the same length as the sub-ribs sr4 and sr5. there is
 サブリブsr4乃至sr6は、お互いに同じ間隔を空けて設けられている。サブリブsr4およびサブリブsr5は、両者の間に回路基板210の抵抗素子R15乃至R173および抵抗素子R18乃至R20を配置可能な位置関係にある。また、サブリブsr5とサブリブsr6は、両者の間に回路基板210の抵抗素子R21乃至R23および抵抗素子R24乃至R26を配置可能な位置関係にある。 The sub-ribs sr4 to sr6 are provided with the same spacing from each other. The sub-rib sr4 and the sub-rib sr5 are in a positional relationship such that the resistance elements R15 to R173 and the resistance elements R18 to R20 of the circuit board 210 can be arranged therebetween. Further, the sub-rib sr5 and the sub-rib sr6 are in a positional relationship such that the resistance elements R21 to R23 and the resistance elements R24 to R26 of the circuit board 210 can be arranged therebetween.
 エッジリブer3およびer4は、回路基板210のエッジスリットE3およびE4に対向して長手方向(矢印ab方向)と直交する短手方向に沿い、枠リブWR2の外側方向からメインリブmr2へそれぞれ向かって直線状に延びたリブである。エッジリブer3、er4は、枠リブWR2と一体に形成されている。 The edge ribs er3 and er4 face the edge slits E3 and E4 of the circuit board 210 and extend linearly from the outer side of the frame rib WR2 toward the main rib mr2 along the lateral direction perpendicular to the longitudinal direction (arrow ab direction). It is a rib that extends to the The edge ribs er3 and er4 are formed integrally with the frame rib WR2.
 エッジリブer3は、長手方向(矢印ab方向)においてサブリブsr4とサブリブsr5との中間に配置されている。エッジリブer4は、長手方向(矢印ab方向)においてサブリブsr5とサブリブsr6との中間に配置されている。つまり、サブリブsr4乃至sr6とエッジリブer3、er4とは長手方向(矢印ab方向)において交互に配置されている。 The edge rib er3 is arranged midway between the sub-ribs sr4 and sr5 in the longitudinal direction (arrow ab direction). The edge rib er4 is arranged midway between the sub-rib sr5 and the sub-rib sr6 in the longitudinal direction (arrow ab direction). That is, the sub-ribs sr4 to sr6 and the edge ribs er3 and er4 are alternately arranged in the longitudinal direction (arrow ab direction).
 なお、メインリブmr2、サブリブsr4乃至sr6、および、エッジリブer3、er4についても、上ケース230と下ケース250との間に配置された回路基板210のメインスリットM1、サブスリットS4乃至S6、エッジスリットE3、E4に差し込まれるが、下ケース250にまで到達しない程度の高さを有している。 Note that the main rib mr2, the sub-ribs sr4 to sr6, and the edge ribs er3 and er4 also correspond to the main slit M1, the sub-slits S4 to S6, and the edge slit E3 of the circuit board 210 arranged between the upper case 230 and the lower case 250. , E 4 , but has a height that does not reach the lower case 250 .
 また、メインリブmr2には、メインリブmr1と同様に、長手方向(矢印ab方向)とは直交する短手方向へ僅かに突出した複数の支持片ss21乃至ss23が一体に形成されている。 Also, the main rib mr2 is integrally formed with a plurality of supporting pieces ss21 to ss23 that slightly protrude in the lateral direction perpendicular to the longitudinal direction (arrow ab direction), similarly to the main rib mr1.
 支持片ss21乃至ss23は、長手方向(矢印ab方向)においてサブリブsr1乃至sr3と交互に配置されている。また、支持片s21、ss22は、長手方向(ab方向)とは直交する短手方向においてエッジリブer3、er4と対向するように配置されている。 The support pieces ss21 to ss23 are alternately arranged with the sub-ribs sr1 to sr3 in the longitudinal direction (arrow ab direction). The support pieces s21 and ss22 are arranged so as to face the edge ribs er3 and er4 in the lateral direction perpendicular to the longitudinal direction (ab direction).
 支持片ss21乃至ss23は、短手方向へ短く突出しているだけであり、特に支持片ss21、ss22についてはエッジリブer1、er2との間に所定の間隔が形成されている。すなわち、メインリブmr2の支持片ss21、ss22と、エッジリブer1、er2との間には、導体パターン214の長手方向部分214L2、214L4がそれぞれ位置付けられることになる。 The support pieces ss21 to ss23 only protrude short in the lateral direction, and in particular, the support pieces ss21 and ss22 are provided with a predetermined gap from the edge ribs er1 and er2. That is, longitudinal portions 214L2 and 214L4 of the conductor pattern 214 are positioned between the supporting pieces ss21 and ss22 of the main rib mr2 and the edge ribs er1 and er2, respectively.
 これらの支持片ss21乃至ss23は、メインリブmr2の高さよりも低く、回路基板210と当接されて当該回路基板210を上方から支持する面である端面ss21t乃至ss23tを有している。 These support pieces ss21 to ss23 have end faces ss21t to ss23t that are lower than the height of the main rib mr2 and that are surfaces that contact the circuit board 210 and support the circuit board 210 from above.
 サブリブsr4乃至sr6においては、長手方向(矢印ab方向)における一方側(矢印a方向)の側面および他方側(矢印b方向)の側面に対して、互いに背向するように形成された2つの支持片pp41、pp42、支持片pp51、pp52、支持片pp61、pp62がそれぞれ形成されている。ただし、図4においては、支持片pp41、pp51、pp61についてはサブリブsr1乃至sr3の陰にあるため表示されていない。 In the sub-ribs sr4 to sr6, two supports are formed so as to face each other on one side (arrow a direction) and the other side (arrow b direction) in the longitudinal direction (arrow ab direction). Pieces pp41 and pp42, support pieces pp51 and pp52, and support pieces pp61 and pp62 are formed, respectively. However, in FIG. 4, the support pieces pp41, pp51, and pp61 are not shown because they are behind the sub-ribs sr1 to sr3.
 これらの支持片pp41、pp42、支持片pp51、pp52、支持片pp61、pp62においても、サブリブsr4乃至sr6の高さよりも低く、回路基板210と当接されて当該回路基板210を上方から支持する面である端面pp41t、pp42t、端面pp51t、pp52t、端面pp61t、pp62tを有している。ただし、図4においては、端面pp41t、pp51t、pp61tについてもサブリブsr1乃至sr3の陰にあるため表示されていない。 These support pieces pp41 and pp42, support pieces pp51 and pp52, and support pieces pp61 and pp62 are also lower than the height of the sub-ribs sr4 to sr6, and are in contact with the circuit board 210 to support the circuit board 210 from above. end faces pp41t, pp42t, end faces pp51t, pp52t, and end faces pp61t, pp62t. However, in FIG. 4, the end faces pp41t, pp51t, and pp61t are not shown because they are behind the sub-ribs sr1 to sr3.
 エッジリブer3、er4においても、長手方向(矢印ab方向)における一方側(矢印a方向)の側面および他方側(矢印b方向)の側面に対して、互いに背向するように形成された2つの支持片qq31、qq32、支持片qq41、qq42がそれぞれ形成されている。 In the edge ribs er3 and er4 as well, two supports are formed so as to face each other on one side (arrow a direction) and the other side (arrow b direction) in the longitudinal direction (arrow ab direction). Pieces qq31 and qq32 and support pieces qq41 and qq42 are formed respectively.
 これらの支持片qq31、qq32、支持片qq41、qq42においても、その高さがエッジリブer3、er4よりも低く、回路基板210と当接されて当該回路基板210を上方から支持する面である端面qq31t、qq32t、端面qq41t、qq42t(図5)を有している。 The support pieces qq31, qq32, and the support pieces qq41, qq42 are also lower in height than the edge ribs er3, er4, and end surfaces qq31t are surfaces that are in contact with the circuit board 210 and support the circuit board 210 from above. , qq32t, and end faces qq41t, qq42t (FIG. 5).
 なお、メインリブmr2における支持片ss21乃至ss23の端面ss21t乃至ss23t、サブリブsr4乃至sr6におけるそれぞれの支持片pp41、pp42、支持片p51、pp52、支持片pp61、pp62の端面pp41t、pp42t、端面pp51t、pp52t、端面pp61t、pp62t、エッジリブer3、er4におけるそれぞれの支持片qq31、qq32、支持片qq41、qq42の端面qq31t、qq32t、端面qq41t、qq42tは、全て同じ高さであり、回路基板210と当接される面である。以下、これら全ての端面を第2支持片端面群RB2tと以下総称する。 Note that the end surfaces ss21t to ss23t of the support pieces ss21 to ss23 of the main rib mr2, the end surfaces pp41t, pp42t, and the end surfaces pp51t, pp52t of the support pieces pp41, pp42, support pieces p51, pp52, and support pieces pp61, pp62 of the sub-ribs sr4 to sr6, respectively. , end faces pp61t, pp62t, support pieces qq31, qq32, end faces qq31t, qq32t, and end faces qq41t, qq42t of the support pieces qq31, qq32, support pieces qq41, qq42 of the edge ribs er3, er4 are all of the same height and are in contact with the circuit board 210. It is an aspect that Hereinafter, all these end faces are collectively referred to as a second support piece end face group RB2t.
<下ケース>
 続いて、図6および図7に示すように、ボックスケース270の下ケース250は、上ケース230と組み合わされた場合に回路基板210を収容可能な内部空間を有する絶縁性材料の例えば樹脂等からなる矩形状のケース体である。特に、図6および図7は、ボックスケース270を形成する下ケース250の裏面250uに形成された内側部分の構成が表示されている状態である。
<Lower case>
Subsequently, as shown in FIGS. 6 and 7, the lower case 250 of the box case 270 is made of an insulating material such as resin having an internal space capable of accommodating the circuit board 210 when combined with the upper case 230. It is a rectangular case body. In particular, FIGS. 6 and 7 show the configuration of the inner portion formed on the rear surface 250u of the lower case 250 forming the box case 270. FIG.
 下ケース250は、センターリブcr1と、複数のリブからなる第1支持リブ群LB1および第2支持リブ群LB2とを有している。下ケース250のセンターリブcr1は、全体として略U字枠状に形成された枠リブWR3のうち、回路基板210のメインスリットM1に対向すると共に、上ケース230のメインリブmr1およびメインリブmr2と対向し、長手方向(矢印ab方向)に沿って直線状に延びるリブ部分である。 The lower case 250 has a center rib cr1, and a first support rib group LB1 and a second support rib group LB2 each made up of a plurality of ribs. The center rib cr1 of the lower case 250 faces the main slit M1 of the circuit board 210 and the main ribs mr1 and mr2 of the upper case 230 among the frame ribs WR3 formed in a substantially U-shaped frame as a whole. , rib portions extending linearly along the longitudinal direction (arrow ab direction).
 下ケース250のセンターリブcr1は、上ケース230のメインリブmr1およびメインリブmr2と同じ長さを有している。センターリブcr1は、回路基板210を収納した状態で上ケース230と下ケース250とが組み合わされたとき、回路基板210のメインスリットM1に差し込まれた上ケース230のメインリブmr1とメインリブmr2との間に差し込まれることが可能な程度の幅および高さを有している。 The center rib cr1 of the lower case 250 has the same length as the main ribs mr1 and mr2 of the upper case 230. The center rib cr1 is located between the main rib mr1 and the main rib mr2 of the upper case 230 inserted into the main slit M1 of the circuit board 210 when the upper case 230 and the lower case 250 are combined with the circuit board 210 accommodated. It has a width and height that allows it to be inserted into a
 センターリブcr1は、上ケース230のメインリブmr1とメインリブmr2との間に差し込まれることを可能にするため、第1支持リブ群LB1および第2支持リブ群LB2の各リブよりも高く形成されている。 The center rib cr1 is formed higher than each rib of the first supporting rib group LB1 and the second supporting rib group LB2 so as to be able to be inserted between the main rib mr1 and the main rib mr2 of the upper case 230. .
 第1支持リブ群LB1は、回路基板210の導体パターン213および第1抵抗素子群GR1と対向した位置に設けられた複数のリブからなり、センターリブcr1よりも低い高さを有している。 The first support rib group LB1 consists of a plurality of ribs provided at positions facing the conductor pattern 213 of the circuit board 210 and the first resistance element group GR1, and has a height lower than that of the center rib cr1.
 また、第2支持リブ群LB2は、回路基板210の導体パターン214および第2抵抗素子群GR2と対向した位置に設けられた複数のリブからなり、センターリブcr1よりも低い高さを有している。第1支持リブ群LB1および第2支持リブ群LB2における複数のリブは全て同じ高さを有している。 The second support rib group LB2 is composed of a plurality of ribs provided at positions facing the conductor pattern 214 of the circuit board 210 and the second resistor element group GR2, and has a height lower than that of the center rib cr1. there is All of the ribs in the first supporting rib group LB1 and the second supporting rib group LB2 have the same height.
 下ケース250の第1支持リブ群LB1は、回路基板210の導体パターン213の長手方向部分213L1乃至213L5とそれぞれ対向した位置に設けられた長手方向リブnr31乃至nr35を有している。 The first support rib group LB1 of the lower case 250 has longitudinal ribs nr31 to nr35 provided at positions facing the longitudinal portions 213L1 to 213L5 of the conductor pattern 213 of the circuit board 210, respectively.
 すなわち、長手方向リブnr31乃至nr35は、導体パターン213の長手方向部分213L1乃至213L5と同じ長さを有している。これらの長手方向リブnr31乃至nr35は、回路基板210の裏面(すなわち抵抗素子R1乃至R28が設置されていない側の面)を下方から支持する上側の端面(以下、これを「上端面」と言う。)nr31t乃至nr35t(図7)を有している。 That is, the longitudinal ribs nr31 to nr35 have the same length as the longitudinal portions 213L1 to 213L5 of the conductor pattern 213. These longitudinal ribs nr31 to nr35 form an upper end face (hereinafter referred to as "upper end face") that supports the back surface of the circuit board 210 (that is, the face on the side where the resistor elements R1 to R28 are not installed) from below. .) nr31t to nr35t (FIG. 7).
 また、第1支持リブ群LB1は、第1抵抗素子群GR1の抵抗素子R1乃至R3、抵抗素子R4乃至R6、抵抗素子R7乃至R9、抵抗素子R10乃至R12、抵抗素子R13乃至R14とそれぞれ対向した回路基板210の位置に設けられ、当該回路基板210の裏面を下方から支持するリブ(以下、これを「抵抗素子支持リブ」と言う。)rr31乃至rr35を有している。これらの抵抗素子支持リブrr31乃至rr35についても、抵抗素子R1乃至R14を回路基板210の下方から支持する上端面rr31t乃至rr35t(図7)を有している。 The first support rib group LB1 faces the resistance elements R1 to R3, the resistance elements R4 to R6, the resistance elements R7 to R9, the resistance elements R10 to R12, and the resistance elements R13 to R14 of the first resistance element group GR1. It has ribs rr31 to rr35 provided at the position of the circuit board 210 and supporting the back surface of the circuit board 210 from below (hereinafter referred to as "resistor element supporting ribs"). These resistive element supporting ribs rr31 to rr35 also have upper end surfaces rr31t to rr35t (FIG. 7) that support the resistive elements R1 to R14 from below the circuit board 210. As shown in FIG.
 これらの抵抗素子支持リブrr31乃至rr35は、第1抵抗素子群GR1の抵抗素子R1乃至R3、R4乃至R6、R7乃至R9、R10乃至R12、R13乃至R14と対向するだけではなく、センターリブcr1まで延びる短手方向の長さを有している。 These resistance element supporting ribs rr31 to rr35 not only face the resistance elements R1 to R3, R4 to R6, R7 to R9, R10 to R12, R13 to R14 of the first resistance element group GR1, but also extend to the center rib cr1. It has a length in the lateral direction that extends.
 すなわち第1支持リブ群LB1では、長手方向リブnr31乃至nr35と抵抗素子支持リブrr31乃至rr35とが一体に形成されると共に、抵抗素子支持リブrr31乃至rr35とセンターリブcr1とが一体に形成されている。なお、長手方向リブnr31については、回路基板210において種々の回路素子が搭載された回路素子群310と対向した位置に設けられた回路素子支持リブrr310に対しても一体に形成されている。 That is, in the first support rib group LB1, the longitudinal ribs nr31 to nr35 and the resistance element support ribs rr31 to rr35 are integrally formed, and the resistance element support ribs rr31 to rr35 and the center rib cr1 are integrally formed. there is The longitudinal rib nr31 is also formed integrally with a circuit element support rib rr310 provided on the circuit board 210 at a position facing the circuit element group 310 on which various circuit elements are mounted.
 なお、第1支持リブ群LB1における長手方向リブnr31乃至nr35の上端面nr31t乃至nr35t、および、抵抗素子支持リブrr31乃至rr35の上端面rr31t乃至rr35tを、第1支持リブ端面群LB1tと総称する。 The upper end surfaces nr31t to nr35t of the longitudinal ribs nr31 to nr35 in the first support rib group LB1 and the upper end surfaces rr31t to rr35t of the resistor element support ribs rr31 to rr35 are collectively referred to as a first support rib end surface group LB1t.
 下ケース250の第2支持リブ群LB2についても第1支持リブ群LB1と同様であり、回路基板210の導体パターン214の長手方向部分214L1乃至214L5とそれぞれ対向した位置に設けられた長手方向リブnr41乃至nr45を有している。 The second support rib group LB2 of the lower case 250 is similar to the first support rib group LB1, and the longitudinal rib nr41 provided at positions facing the longitudinal portions 214L1 to 214L5 of the conductor pattern 214 of the circuit board 210, respectively. to nr45.
 すなわち、長手方向リブnr41乃至nr45は、回路基板210における導体パターン214の長手方向部分214L1乃至214L5と同じ長さを有している。これらの長手方向リブnr41乃至nr45は、回路基板210の裏面を下方から支持する上側の上端面nr41t乃至nr45t(図7)を有している。 That is, the longitudinal ribs nr41 to nr45 have the same length as the longitudinal portions 214L1 to 214L5 of the conductor pattern 214 on the circuit board 210. These longitudinal ribs nr41 to nr45 have upper end surfaces nr41t to nr45t (FIG. 7) that support the back surface of the circuit board 210 from below.
 また、第2支持リブ群LB2は、第2抵抗素子群GR2の抵抗素子R15乃至R17、抵抗素子R18乃至R20、抵抗素子R21乃至R23、抵抗素子R24乃至R26、抵抗素子R27乃至R28とそれぞれ対向した位置に設けられ、これらの抵抗素子を回路基板210の下方から支持する抵抗素子支持リブrr41乃至rr45を有している。これらの抵抗素子支持リブrr41乃至rr45についても、回路基板210を下方から支持する上端面rr41t乃至rr45t(図7)を有している。 In addition, the second support rib group LB2 faces the resistance elements R15 to R17, the resistance elements R18 to R20, the resistance elements R21 to R23, the resistance elements R24 to R26, and the resistance elements R27 to R28 of the second resistance element group GR2. It has resistance element supporting ribs rr41 to rr45 which are provided at positions and support these resistance elements from below the circuit board 210 . These resistive element support ribs rr41 to rr45 also have upper end surfaces rr41t to rr45t (FIG. 7) that support the circuit board 210 from below.
 これらの抵抗素子支持リブrr41乃至rr45は、第2抵抗素子群GR2の抵抗素子R15乃至R17、R18乃至R20、R21乃至R23、R24乃至R26、R27乃至R28と対向するだけではなく、センターリブcr1まで延びる短手方向の長さを有している。 These resistance element support ribs rr41 to rr45 not only face the resistance elements R15 to R17, R18 to R20, R21 to R23, R24 to R26, R27 to R28 of the second resistance element group GR2, but also extend to the center rib cr1. It has a length in the lateral direction that extends.
 すなわち第2支持リブ群LB2は、長手方向リブnr41乃至nr45と抵抗素子支持リブrr41乃至rr45とが一体に形成されると共に、抵抗素子支持リブrr41乃至rr45とセンターリブcr1とが一体に形成されている。なお、長手方向リブnr41については、回路基板210において種々の回路素子が搭載された回路素子群320と対向した位置に設けられた回路素子支持リブrr320に対しても一体に形成されている。 That is, the second support rib group LB2 includes integrally formed longitudinal ribs nr41 to nr45 and resistance element support ribs rr41 to rr45, and integrally formed resistance element support ribs rr41 to rr45 and a center rib cr1. there is The longitudinal rib nr41 is also formed integrally with a circuit element support rib rr320 provided on the circuit board 210 at a position facing the circuit element group 320 on which various circuit elements are mounted.
 なお、第2支持リブ群LB2における長手方向リブnr41乃至nr45の上端面nr41t乃至nr45t、および、抵抗素子支持リブrr41乃至rr45の上端面rr41t乃至rr45tを、第2支持リブ端面群LB2tと総称する。 The upper end surfaces nr41t to nr45t of the longitudinal ribs nr41 to nr45 in the second support rib group LB2 and the upper end surfaces rr41t to rr45t of the resistor element support ribs rr41 to rr45 are collectively referred to as a second support rib end surface group LB2t.
<作用および効果>
 以上の構成において、プローブ装置1では、上ケース230と下ケース250との間に回路基板210を挟み付けるように組み合わせて取り付けることによりボックスケース270が形成されると、当該ボックスケース270の内部空間270Sに回路基板210が収容される。
<Action and effect>
In the above configuration, in the probe device 1, when the box case 270 is formed by attaching the circuit board 210 between the upper case 230 and the lower case 250 so as to sandwich the circuit board 210, the inner space of the box case 270 is formed. The circuit board 210 is accommodated in 270S.
 このとき下ケース250のセンターリブcr1は、回路基板210のメインスリットM1に差し込まれると共に、上ケース230のメインリブmr1とメインリブmr2との間の隙間に対しても差し込まれた状態となる。これにより、回路基板210は、上ケース230および下ケース250に対して短手方向の位置が規制された状態となる。 At this time, the center rib cr1 of the lower case 250 is inserted into the main slit M1 of the circuit board 210 and is also inserted into the gap between the main rib mr1 and the main rib mr2 of the upper case 230. As a result, the position of the circuit board 210 in the lateral direction is restricted with respect to the upper case 230 and the lower case 250 .
 また、このとき、上ケース230のサブリブsr1乃至sr6、エッジリブer1乃至er4は、回路基板210のサブスリットS1乃至S6、エッジスリットE1乃至E4に差し込まれているため、回路基板210は、上ケース230および下ケース250に対して長手方向(矢印ab方向)および短手方向の位置が一段と強固に規制された状態となる。 At this time, the sub-ribs sr1 to sr6 and the edge ribs er1 to er4 of the upper case 230 are inserted into the sub-slits S1 to S6 and the edge slits E1 to E4 of the circuit board 210. In addition, the position of the lower case 250 in the longitudinal direction (arrow ab direction) and the lateral direction is more firmly regulated.
 また、この状態において、回路基板210は下ケース250の第1支持リブ端面群LB1tおよび第2支持リブ端面群LB2tによって下方から支持される。同時に、回路基板210は、上ケース230の第1支持片端面群RB1tおよび第2支持片端面群RB2tによって上方から押し付けられる。 Also, in this state, the circuit board 210 is supported from below by the first support rib end surface group LB1t and the second support rib end surface group LB2t of the lower case 250 . At the same time, the circuit board 210 is pressed from above by the first support piece end surface group RB1t and the second support piece end surface group RB2t of the upper case 230 .
 すなわち、回路基板210は、上ケース230の第1支持片端面群RB1tおよび第2支持片端面群RB2tと、下ケース250の第1支持リブ端面群LB1tおよび第2支持リブ端面群LB2tとの間に挟み付けられる。 That is, the circuit board 210 is located between the first support piece end surface group RB1t and the second support piece end surface group RB2t of the upper case 230 and the first support rib end surface group LB1t and the second support rib end surface group LB2t of the lower case 250. sandwiched between.
 これにより、中継ボックス200は、回路基板210に複数のスリット(メインスリットM1、サブスリットS1乃至S6、およびエッジスリットE1乃至E4)が形成されているにも拘わらず、当該回路基板210が上ケース230の第1支持片端面群RB1tおよび第2支持片端面群RB2tと、下ケース250の第1支持リブ端面群LB1tおよび第2支持リブ端面群LB2tとによって上下から挟み付けられることにより、回路基板210の基板強度が不足して変形してしまうことを抑制することができる。 As a result, although the relay box 200 has a plurality of slits (the main slit M1, the sub-slits S1 to S6, and the edge slits E1 to E4) formed in the circuit board 210, the circuit board 210 is positioned in the upper case. The circuit board is sandwiched from above and below by the first support piece end surface group RB1t and the second support piece end surface group RB2t of the lower case 250 and the first support rib end surface group LB1t and the second support rib end surface group LB2t of the lower case 250. It is possible to suppress deformation of the substrate 210 due to lack of strength.
 同時に、中継ボックス200においては、上ケース230のサブリブsr1乃至sr6およびエッジリブer1乃至er4が回路基板210のサブスリットS1乃至S6およびエッジスリットE1乃至E4に差し込まれているため、回路基板210の撓み等を抑制することもできる。 At the same time, in the junction box 200, since the sub-ribs sr1 to sr6 and the edge ribs er1 to er4 of the upper case 230 are inserted into the sub-slits S1 to S6 and the edge slits E1 to E4 of the circuit board 210, the circuit board 210 is not bent or the like. can also be suppressed.
 また、中継ボックス200では、図9(A)および(B)に示すように、上ケース230の内側に第1差込リブ群RB1(メインリブmr1、サブリブsr1乃至sr3およびエッジリブer1、er2)が設けられていない場合、例えば互いに隣接する抵抗素子R1と抵抗素子R12との間の沿面距離を満たしていた場合であっても、実線矢印で示すように抵抗素子R1と抵抗素子R12の空間距離については満たすことができない。 9A and 9B, in the relay box 200, a first insertion rib group RB1 (main rib mr1, sub-ribs sr1 to sr3 and edge ribs er1 and er2) is provided inside the upper case 230. Even if the creepage distance between the resistance elements R1 and R12 adjacent to each other is satisfied, for example, the spatial distance between the resistance elements R1 and R12 as indicated by the solid line arrows is unable to meet.
 しかしながら、中継ボックス200は、図10に示すように、例えば上ケース230のサブリブsr1乃至sr3、および、エッジリブer1、er2によって、ボックスケース270の内部空間270Sが長手方向(矢印ab方向)に仕切られている。 However, as shown in FIG. 10, the junction box 200 has an internal space 270S of the box case 270 partitioned in the longitudinal direction (arrow ab direction) by sub-ribs sr1 to sr3 and edge ribs er1 and er2 of the upper case 230, for example. ing.
 これにより、抵抗素子R1と抵抗素子R12との空間距離は、上ケース230に第1差込リブ群RB1が設けられていない場合に比べて、エッジリブer1、サブリブsr2、エッジリブer2の存在によって実線で示すように延ばされることになる。かくして、中継ボックス200では、国際規格IEC61010-031に定められた沿面距離および空間距離を満たすことが可能となる。 As a result, the spatial distance between the resistive element R1 and the resistive element R12 is shown by the solid line due to the existence of the edge rib er1, the sub-rib sr2, and the edge rib er2 compared to the case where the upper case 230 is not provided with the first insertion rib group RB1. It will be extended as shown. Thus, the junction box 200 can satisfy the creepage distance and the clearance defined in the international standard IEC61010-031.
 また、図10に示したように、中継ボックス200のボックスケース270において、上ケース230の内側に設けられた第1差込リブ群RB1、第2差込リブ群RB2だけでは規定の空間距離を満たすことが出来ない場合であっても、図11に示すように、下ケース250の内側に設けた第1支持リブ群LB1、第2支持リブ群LB2の存在によって、更に空間距離を延ばすことができる。 Further, as shown in FIG. 10, in the box case 270 of the relay box 200, only the first insertion rib group RB1 and the second insertion rib group RB2 provided on the inner side of the upper case 230 provide a specified spatial distance. Even if it is not possible to satisfy the spatial distance, the presence of the first supporting rib group LB1 and the second supporting rib group LB2 provided inside the lower case 250 as shown in FIG. 11 can further extend the spatial distance. can.
 具体的には、図11(A)に示すように、上ケース230の第1差込リブ群RB1におけるエッジリブer1、サブリブsr2、エッジリブer2に加えて、下ケース250の第1支持リブ群LB1における抵抗素子支持リブrr42、rr43の存在によって、抵抗素子R1と抵抗素子R12との空間距離が太実線で示すように更に延びることになる。 Specifically, as shown in FIG. 11A, in addition to edge rib er1, sub-rib sr2, and edge rib er2 in first insertion rib group RB1 of upper case 230, Due to the presence of the resistive element supporting ribs rr42 and rr43, the spatial distance between the resistive element R1 and the resistive element R12 is further extended as indicated by the thick solid line.
 また、図11(B)に示すように、例えば抵抗素子R1と抵抗素子R7との間の空間距離は、抵抗素子R1が設置された回路基板210の上方空間から回路基板210の下方空間へ行き、その後、エッジリブer1を超えて、回路基板210と抵抗素子支持リブrr42との隙間を通り、サブリブsr2を超えて回路基板210の上方空間の抵抗素子R7へと通じる長さ(破線)である。 Also, as shown in FIG. 11B, for example, the spatial distance between the resistance element R1 and the resistance element R7 extends from the space above the circuit board 210 on which the resistance element R1 is installed to the space below the circuit board 210. , then over the edge rib er1, through the gap between the circuit board 210 and the resistor element supporting rib rr42, over the sub-rib sr2 and leading to the resistor element R7 in the space above the circuit board 210 (broken line).
 このように、上ケース230のエッジリブer1、サブリブsr2、エッジリブer2に加えて、下ケース250の抵抗素子支持リブrr42の存在によって、抵抗素子R1と抵抗素子R7との空間距離を更に延ばすことができる。 Thus, in addition to the edge rib er1, the sub-rib sr2, and the edge rib er2 of the upper case 230, the presence of the resistive element supporting rib rr42 of the lower case 250 can further extend the spatial distance between the resistive element R1 and the resistive element R7. .
 ちなみに、図11(B)に示すように、例えば抵抗素子R7と抵抗素子R12との間の空間距離は、抵抗素子R7が載置された回路基板210の上方空間からエッジスリットE2とエッジリブer2との隙間を通って回路基板210の下方空間へ行き、その後、エッジリブer2を跨ぐように超え、再度、エッジスリットE2とエッジリブer2との隙間を通って回路基板210の上方空間へ戻って抵抗素子R12へと通じる長さ(実線)である。このように、隣接する抵抗素子R7と抵抗素子R12との間であっても、上ケース230のエッジリブer2の存在によって規定された空間距離を満たすことができる。 Incidentally, as shown in FIG. 11B, for example, the spatial distance between the resistor element R7 and the resistor element R12 is the edge slit E2 and the edge rib er2 from the upper space of the circuit board 210 on which the resistor element R7 is mounted. to the space below the circuit board 210 through the gap between the resistor element R12 and the edge rib er2. is the length (solid line) leading to Thus, even between the adjacent resistance elements R7 and R12, the spatial distance defined by the existence of the edge rib er2 of the upper case 230 can be satisfied.
 以上の構成によれば、プローブ装置1の中継ボックス200においては、回路基板210に対して例えば複数の抵抗素子R1乃至R14、R15乃至R28を波形状に設置したことにより当該回路基板210の長手方向(矢印ab方向)の長さL1を従来に比して一段と短縮し、全体として小型化することができる。 According to the above configuration, in the junction box 200 of the probe apparatus 1, for example, a plurality of resistance elements R1 to R14 and R15 to R28 are arranged in a wave shape on the circuit board 210, so that the longitudinal direction of the circuit board 210 is The length L1 (in the direction of the arrow ab) can be further shortened compared to the conventional art, and the overall size can be reduced.
 また、プローブ装置1の中継ボックス200では、回路基板210に設けられたメインスリットM1、サブスリットS1乃至S6、エッジスリットE1乃至E4に対して上ケース230の第1差込リブ群RB1、第2差込リブ群RB2を差し込ませると共に、上ケース230の第1支持片端面群RB1tおよび第2支持片端面群RB2tによって回路基板210を上方から押し付け、下ケース250の第1支持リブ端面群LB1tおよび第2支持リブ端面群LB2tによって回路基板210を下方から支持した。 Further, in the relay box 200 of the probe apparatus 1, the main slit M1, the sub-slits S1 to S6, and the edge slits E1 to E4 provided on the circuit board 210 are connected to the first insertion rib group RB1 and the second insertion rib group RB1 of the upper case 230. While inserting the insertion rib group RB2, the circuit board 210 is pressed from above by the first support piece end surface group RB1t and the second support piece end surface group RB2t of the upper case 230, and the first support rib end surface group LB1t of the lower case 250 and The circuit board 210 was supported from below by the second support rib end face group LB2t.
 これにより中継ボックス200では、上ケース230および下ケース250によって回路基板210を挟持することになるので、当該回路基板210を強固に保持し、かつ、変形を防止することができる。 As a result, in the relay box 200, the circuit board 210 is sandwiched between the upper case 230 and the lower case 250, so that the circuit board 210 can be firmly held and deformation can be prevented.
 さらに、中継ボックス200では、複数の抵抗素子R1乃至R14、R15乃至R28を導体パターン213、214に沿って波形状に設置したことにより抵抗素子間の動作電圧に対する規定の空間距離を満たさなくなるおそれが生じる。しかしながら、中継ボックス200のボックスケース270では、上ケース230の第1差込リブ群RB1、第2差込リブ群RB2、および、下ケース250の第1支持リブ群LB1、第2支持リブ群LB2の存在によって、全ての抵抗素子間の空間距離を満たすことができる。 Furthermore, in the junction box 200, since the plurality of resistive elements R1 to R14 and R15 to R28 are arranged along the conductor patterns 213 and 214 in a wavy shape, there is a possibility that the specified spatial distance for the operating voltage between the resistive elements may not be satisfied. occur. However, in the box case 270 of the junction box 200, the first insertion rib group RB1 and the second insertion rib group RB2 of the upper case 230 and the first support rib group LB1 and the second support rib group LB2 of the lower case 250 can satisfy the spatial distance between all resistive elements.
 ≪実施の形態の拡張≫
 以上、本願発明者らによってなされた発明を実施の形態に基づいて具体的に説明したが、本発明はそれに限定されるものではなく、その要旨を逸脱しない範囲において種々変更可能であることは言うまでもない。
<<Expansion of Embodiment>>
Although the invention made by the inventors of the present application has been specifically described above based on the embodiments, it goes without saying that the present invention is not limited thereto, and various modifications can be made without departing from the gist of the invention. stomach.
 例えば、上記実施の形態では、中継ボックス200のボックスケース270において、上ケース230の第1差込リブ群RB1、第2差込リブ群RB2と、下ケース250の第1支持リブ群LB1、第2支持リブ群LB2の双方によって抵抗素子間の空間距離を満たすようにした場合について述べた。しかしながら、本発明はこれに限らず、上ケース230の第1差込リブ群RB1、第2差込リブ群RB2、もしくは、下ケース250の第1支持リブ群LB1、第2支持リブ群LB2の何れか一方だけで抵抗素子間の空間距離を満たすことができるのであれば、第1差込リブ群RB1、第2差込リブ群RB2または第1支持リブ群LB1、第2支持リブ群LB2の何れか一方だけで抵抗素子間の空間距離を満たすようにしてもよい。 For example, in the above embodiment, in the box case 270 of the junction box 200, the first insertion rib group RB1 and the second insertion rib group RB2 of the upper case 230, the first support rib group LB1 of the lower case 250, the second A case has been described in which both of the two support rib groups LB2 satisfy the spatial distance between the resistance elements. However, the present invention is not limited to this. If only one of them can satisfy the spatial distance between the resistive elements, either the first insertion rib group RB1 or the second insertion rib group RB2 or the first support rib group LB1 or the second support rib group LB2 can be used. Only one of them may satisfy the spatial distance between the resistance elements.
 また、上述した実施の形態においては、上ケース230に対して回路基板210の各スリットに差し込まれる複数のリブからなる第1差込リブ群RB1、第2差込リブ群RB2を設け、下ケース250に回路基板210を下方から支持する第1支持リブ群LB1、第2支持リブ群LB2を設けるようにした場合について述べたが、本発明はこれに限らず、上ケース230に対して第1支持リブ群LB1、第2支持リブ群LB2を設け、下ケース250に第1差込リブ群RB1、第2差込リブ群RB2を設けるようにしてもよい。また、上ケース230および下ケース250の間に介在する板状の中間部材に第1差込リブ群RB1、第2差込リブ群RB2を設け、この中間部材を上ケース230と回路基板210との間に配置したり、この中間部材を回路基板210と下ケース250との間に配置することにより、回路基板210の各スリットに差し込まれるようにしてもよい。 Further, in the above-described embodiment, the upper case 230 is provided with the first insertion rib group RB1 and the second insertion rib group RB2 each including a plurality of ribs inserted into the slits of the circuit board 210, and the lower case 250 is provided with the first supporting rib group LB1 and the second supporting rib group LB2 for supporting the circuit board 210 from below, but the present invention is not limited to this. The support rib group LB1 and the second support rib group LB2 may be provided, and the lower case 250 may be provided with the first insertion rib group RB1 and the second insertion rib group RB2. A plate-shaped intermediate member interposed between the upper case 230 and the lower case 250 is provided with a first insertion rib group RB1 and a second insertion rib group RB2. Alternatively, the intermediate member may be placed between the circuit board 210 and the lower case 250 to be inserted into each slit of the circuit board 210 .
 さらに、上述した実施の形態においては、上ケース230に対して回路基板210の各スリットに差し込まれる複数のリブからなる第1差込リブ群RB1、第2差込リブ群RB2を設け、下ケース250に回路基板210を下方から支持する第1支持リブ群LB1、第2支持リブ群LB2を設けるようにした場合について述べた。しかしながら、本発明はこれに限らず、上ケース230の第1差込リブ群RB1、第2差込リブ群RB2、または、下ケース250の第1支持リブ群LB1、第2支持リブ群LB2の何れか一方だけで複数の抵抗素子R1乃至R14、R15乃至R28間のそれぞれの空間距離を満たすことができれば、第1差込リブ群RB1、第2差込リブ群RB2を有する上ケース230と、第1支持リブ群LB1、第2支持リブ群LB2を有さない下ケース250を用いたり、その逆の第1差込リブ群RB1、第2差込リブ群RB2を有さない上ケース230と、第1支持リブ群LB1、第2支持リブ群LB2を有する下ケース250を用いるようにしてもよい。 Furthermore, in the above-described embodiment, the upper case 230 is provided with the first insertion rib group RB1 and the second insertion rib group RB2, which are formed of a plurality of ribs inserted into the slits of the circuit board 210, and the lower case A case in which the first support rib group LB1 and the second support rib group LB2 for supporting the circuit board 210 from below are provided on 250 has been described. However, the present invention is not limited to this. an upper case 230 having a first insertion rib group RB1 and a second insertion rib group RB2 if only one of them can satisfy the spatial distances between the plurality of resistor elements R1 to R14 and R15 to R28; A lower case 250 that does not have the first support rib group LB1 and the second support rib group LB2 is used, or an upper case 230 that does not have the first insertion rib group RB1 and the second insertion rib group RB2 is used. , the first supporting rib group LB1 and the second supporting rib group LB2.
 さらに、上述した実施の形態においては、1枚の回路基板210を用いるようにした場合について述べたが、本発明はこれに限らず、第1抵抗素子群GR1と第2抵抗素子群GR2がそれぞれ別に設けられた2枚の回路基板を用いるようにしてもよい。 Furthermore, in the above-described embodiment, a case where one circuit board 210 is used has been described, but the present invention is not limited to this, and the first resistance element group GR1 and the second resistance element group GR2 are respectively Two circuit boards provided separately may be used.
 さらに、上述した実施の形態においては、出力端子112、122から出力ケーブル110、120を介して測定装置に接続されるようにした場合について述べたが、本発明はこれに限らず、中継ボックス200の出力端子112、122からオス型プラグが突出するように設置され、測定装置の入力端子にオス型プラグが直接接続されるようにしてもよい。 Furthermore, in the above-described embodiment, the case where the output terminals 112 and 122 are connected to the measuring device via the output cables 110 and 120 has been described, but the present invention is not limited to this, and the relay box 200 A male plug may be installed so as to protrude from the output terminals 112, 122 of the measuring device, and the male plug may be directly connected to the input terminal of the measuring device.
 1…プローブ装置、110、120…出力ケーブル、112、122…出力端子、200…中継ボックス、111、121…プローブ端子、130、140…入力端子、210…回路基板、230…上ケース(他方のケース)、250…下ケース(一方のケース)、270…ボックスケース、213、214…導体パターン、R1乃至R28…抵抗素子、GR1…第1抵抗素子群、GR2…第2抵抗素子群、M1…メインスリット、S1乃至S6…サブスリット、E1乃至E4…エッジスリット、RB1…第1差込リブ群、RB2…第2差込リブ群、mr1、mr2…メインリブ、sr1乃至sr6…サブリブ、er1乃至er4…エッジリブ、WR1乃至WR3…枠リブ、RB1t…第1支持片端面群、RB2t…第2支持片端面群、cr1…センターリブ、LB1…第1支持リブ群、LB2…第2支持リブ群、nr31乃至nr35…長手方向リブ、rr31乃至rr35、rr41乃至rr45…抵抗素子支持リブ、抵抗素子支持。 DESCRIPTION OF SYMBOLS 1... Probe apparatus, 110, 120... Output cable, 112, 122... Output terminal, 200... Junction box, 111, 121... Probe terminal, 130, 140... Input terminal, 210... Circuit board, 230... Upper case (the other case), 250...lower case (one case), 270...box case, 213, 214...conductor patterns, R1 to R28...resistive elements, GR1...first resistor element group, GR2...second resistor element group, M1... Main slit S1 to S6 Sub-slit E1 to E4 Edge slit RB1 First insertion rib group RB2 Second insertion rib group mr1, mr2 Main rib sr1 to sr6 Sub-rib er1 to er4 Edge rib WR1 to WR3 Frame rib RB1t First support piece end face group RB2t Second support piece end face group cr1 Center rib LB1 First support rib group LB2 Second support rib group nr31 to nr35...longitudinal ribs, rr31 to rr35, rr41 to rr45...resistor element support ribs, resistor element support.

Claims (6)

  1.  プローブ端子が接続される入力ケーブルと、
     所定の測定装置と接続される出力端子と、
     前記プローブ端子を介して入力される電圧を所定の電圧レベルに低下させた後に前記出力端子から前記測定装置へ出力する中継ボックスと
     を備え、
     前記中継ボックスは、
     一方のケースと、
     他方のケースと、
     前記一方のケースと前記他方のケースとの間に配置され、複数のスリットが形成されていると共に、前記複数のスリットの間を通過するように複数の抵抗素子が波形状に設置された回路基板と、
     前記一方のケースまたは前記他方のケースあるいは前記一方のケースと前記他方のケースとの間の中間部材に設けられ、前記複数の抵抗素子の間の空間距離を満たすように前記回路基板の前記複数のスリットにそれぞれ差し込まれる複数のリブからなる差込リブ群と
     を有することを特徴とするプローブ装置。
    an input cable to which the probe terminal is connected;
    an output terminal connected to a predetermined measuring device;
    a relay box that reduces the voltage input through the probe terminal to a predetermined voltage level and then outputs the voltage from the output terminal to the measuring device,
    The relay box is
    one case and
    the other case and
    A circuit board disposed between the one case and the other case, formed with a plurality of slits, and having a plurality of resistor elements arranged in a wave shape so as to pass through the plurality of slits. and,
    provided in the one case, the other case, or an intermediate member between the one case and the other case, the plurality of resistance elements of the circuit board so as to satisfy the spatial distance between the plurality of resistance elements; A probe device comprising: an insertion rib group comprising a plurality of ribs each inserted into a slit.
  2.  前記他方のケースは、前記差込リブ群を有し、
     前記一方のケースは、前記抵抗素子が搭載されていない前記回路基板の裏面を支持する複数のリブからなる支持リブ群を有する
     請求項1に記載のプローブ装置。
    The other case has the insertion rib group,
    2. The probe device according to claim 1, wherein said one case has a support rib group consisting of a plurality of ribs for supporting the back surface of said circuit board on which said resistance element is not mounted.
  3.  前記差込リブ群の各リブには、前記複数のスリットに差し込まれることなく前記回路基板に当接される支持片をそれぞれ有し、
     前記回路基板は、前記差込リブ群の前記支持片と前記一方のケースの前記支持リブ群との間で挟持されている
     ことを特徴とする請求項2に記載のプローブ装置。
    each rib of the insertion rib group has a support piece that contacts the circuit board without being inserted into the plurality of slits;
    3. The probe device according to claim 2, wherein the circuit board is sandwiched between the support piece of the insertion rib group and the support rib group of the one case.
  4.  前記差込リブ群は、前記波形状に設置された前記複数の抵抗素子と接触することのない前記他方のケースの位置に配置されている
     請求項2または3に記載のプローブ装置。
    4. The probe apparatus according to claim 2, wherein said insertion rib group is arranged at a position of said other case that does not come into contact with said plurality of resistor elements arranged in said wave shape.
  5.  前記支持リブ群は、前記差込リブ群と対向することなく、かつ、前記複数の抵抗素子と対向した前記回路基板の位置を前記裏面から支持する
     請求項2または3に記載のプローブ装置。
    4. The probe device according to claim 2, wherein the support rib group supports a position of the circuit board facing the plurality of resistance elements from the back surface without facing the insertion rib group.
  6.  前記支持リブ群の各リブは、前記差込リブ群と同様に、前記複数の抵抗素子の間の空間距離を満たすように前記回路基板の前記裏面を支持する
     請求項5に記載のプローブ装置。
    6. The probe apparatus according to claim 5, wherein each rib of said support rib group supports said back surface of said circuit board so as to fill a spatial distance between said plurality of resistive elements, like said insertion rib group.
PCT/JP2022/028987 2021-08-10 2022-07-27 Probe device WO2023017737A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5034043U (en) * 1973-07-26 1975-04-12
JP2011064559A (en) * 2009-09-17 2011-03-31 Hitachi Automotive Systems Ltd Voltage detection apparatus and power conversion apparatus using the same
JP2012117929A (en) * 2010-12-01 2012-06-21 Mitsubishi Electric Corp Voltage detection device
EP2492697A1 (en) * 2011-02-25 2012-08-29 Abb Ag Resistive voltage divider with improved phase accuracy
JP2019049476A (en) * 2017-09-11 2019-03-28 トヨタ自動車株式会社 Power source voltage detector
US20200182910A1 (en) * 2018-12-07 2020-06-11 Abb Schweiz Ag Line post sensor

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5034043U (en) * 1973-07-26 1975-04-12
JP2011064559A (en) * 2009-09-17 2011-03-31 Hitachi Automotive Systems Ltd Voltage detection apparatus and power conversion apparatus using the same
JP2012117929A (en) * 2010-12-01 2012-06-21 Mitsubishi Electric Corp Voltage detection device
EP2492697A1 (en) * 2011-02-25 2012-08-29 Abb Ag Resistive voltage divider with improved phase accuracy
JP2019049476A (en) * 2017-09-11 2019-03-28 トヨタ自動車株式会社 Power source voltage detector
US20200182910A1 (en) * 2018-12-07 2020-06-11 Abb Schweiz Ag Line post sensor

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