JP7156804B2 - Electronic component module - Google Patents

Description

The present invention relates to an electronic component module in which various components are mounted on a circuit board.

2. Description of the Related Art Conventionally, electronic component modules in which various electronic components are mounted on circuit components have been proposed (see Patent Documents 1 to 3, for example). For example, one conventional electronic component module is provided for purposes such as power distribution in a relay box used in automobiles, and includes a plurality of connectors to which wire harnesses are connected, various fuses, various relays, and the like. is configured to be integrally mounted on a circuit board (see, for example, Patent Document 1).

JP 2013-085473 A JP 2012-120318 A JP 2013-102626 A

Electronic component modules used for power distribution and the like described above often use large-capacity relays so as to be able to handle large currents. Since a relay with a large capacity generally has a large size, the relay occupies a large area on the circuit board. Therefore, as the number of relays and other electronic components increases as power component modules become more multi-functional and have higher loads, the circuit board itself tends to increase in size in order to secure a wider mountable area. . However, since the size of the place where an electronic component module is mounted (for example, the relay box described above) is usually limited, it is desirable to make the electronic component module as small as possible.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component module that can be miniaturized while ensuring a wide mounting area.

In order to achieve the above objects, an electronic component module according to the present invention is characterized by the following (1) and (2).
(1)
a first circuit board provided with components for power distribution;
a second circuit board which is stacked with a gap with respect to the first circuit board and provided with one or more relays facing the first circuit board;
a first connector portion provided on the first circuit board so as to face the second circuit board and connected to the component;
a second connector section provided on the second circuit board so as to face the first circuit board and connected to the one or more relays;
An electronic component module comprising
When the first connector portion and the second connector portion are in a connected state, a gap having a predetermined height is defined between the one or more relays and the board surface of the first circuit board. configured to
One or more electronic components are provided at locations corresponding to the voids of the first circuit board ,
The plurality of relays are spaced apart in the width direction parallel to the board surface of the second circuit board, and arranged in two directions along the front-rear direction parallel to the board surface of the second circuit board and orthogonal to the width direction. arranged in rows on the second circuit board;
The plurality of second connector portions are arranged on the second circuit board so as to line up in one row along the front-rear direction at positions in the width direction between the plurality of relays arranged in two rows,
The plurality of components are arranged on the first circuit board so as to be arranged in two rows along the front-rear direction at intervals in the width direction,
The plurality of first connector portions are arranged in one row along the front-rear direction at positions in the width direction between the plurality of parts arranged in two rows, and the first connectors in the width direction. arranged on the first circuit board such that gaps extending in two rows in the front-rear direction are formed on both sides of the first connector portion in the width direction between the portion and the component;
When the first connector portion and the second connector portion are in a connected state, the plurality of relays arranged in two rows enter the gaps extending in two rows, respectively.
Must be an electronic component module.
(2)
In the electronic component module according to (1) above,
When in the connected state, the relay and the component are arranged adjacent to each other in the width direction parallel to the board surface of the first circuit board;
Must be an electronic component module.

According to the electronic component module having the configuration (1) above, the first circuit board provided with components for power distribution (for example, a connector to which a wire harness is connected, etc.) and the second circuit board provided with a relay are provided. It is prepared separately, and the first circuit board and the second circuit board are connected via the first connector portion and the second connector portion. Further, in this connected state, a gap of a predetermined height is defined between the relay and the substrate surface of the first circuit board, and another electronic component is provided at a location corresponding to this gap on the first circuit board. be. Therefore, it is possible to expand the area where electronic components can be mounted while avoiding an increase in the size of the circuit board.

Furthermore, relays are generally mounted by soldering relay terminals (so-called legs) to through-holes on the circuit board. The shape will be different. On the other hand, according to the electronic component module having the above configuration, the second circuit board on which the relays are provided is separate from the first circuit board. Only the circuit shape of the second circuit board may be changed without changing the circuit shape. Therefore, design changes of the electronic component module can be facilitated compared to conventional electronic component modules.

According to the electronic component module having the configuration (2) above, when the first circuit board and the second circuit board are in the connected state, the relay and the power distribution are arranged in the direction parallel to the board surface of the first circuit board. (for example, a connector or the like to which a wire harness is connected) are arranged so as to be adjacent to each other. In other words, the relay is arranged near the board surface of the first circuit board while avoiding the components mounted on the first circuit board. Therefore, an increase in size can be suppressed also in the thickness direction of the electronic component module.

According to the present invention, it is possible to provide an electronic component module that can be miniaturized while ensuring a wide mountable area.

The present invention has been briefly described above. Furthermore, the details of the present invention will be further clarified by reading the following detailed description of the invention (hereinafter referred to as "embodiment") with reference to the accompanying drawings. .

FIG. 1(a) is a front perspective view of a sub-board constituting an electronic component module according to an embodiment of the present invention, and FIG. 1(b) is a rear perspective view of the sub-board. FIG. 2 is a perspective view showing how the sub-board is assembled to the main board that constitutes the electronic component module according to the embodiment of the present invention. FIG. 3(a) is a perspective view of an electronic component module in which a sub-board is attached to a main board, and FIG. 3(b) is a plan view of the electronic component module. 4(a) is a cross-sectional view taken along the line AA of FIG. 3(b), and FIG. 4(b) is an enlarged view of a portion B of FIG. 4(a).

<Embodiment>
An electronic component module 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 4. FIG. As shown in FIGS. 2 and 3, the electronic component module 1 is configured such that the front surface of the flat plate-shaped sub-board 10 and the front surface of the flat plate-shaped main substrate 20 face each other with a gap therebetween. The sub-board 10 is laminated on 20 . The electronic component module 1 is typically installed in a power distribution box (for example, a relay box) used in automobiles and the like.

Hereinafter, for convenience of explanation, "front-rear direction", "width direction", "front", and "rear" are defined as shown in FIGS. The front-rear direction and the width direction are orthogonal to each other. The front-rear direction and the width direction are perpendicular to the thickness directions of the main board 20 and the sub-board 10 .

As shown in FIG. 1, the sub-board 10 is a rectangular plate-like circuit board, and a plate-like bus bar (not shown) is insert-molded therein. A plurality of relays 11 and a plurality of male connector portions 12 are mounted on the front surface of the sub-board 10 .

Each of the relays 11 is fixed so as to be electrically connected to (a bus bar of) the sub-board 10 by inserting and soldering a plurality of pins 11a extending from the relay 11 into the through-holes of the sub-board 10. there is In this example, a plurality (six) of relays 11 are arranged in two rows along the front-rear direction at both edges in the width direction of the front surface of the sub-board 10 .

Each of the male connector portions 12 is composed of a plurality of male terminals protruding in the plate thickness direction from the front surface of (the busbar of) the sub-board 10 . Male connector portion 12 is electrically connected to relay 11 via a bus bar. In this example, a plurality (two) of male connector portions 12 are arranged in a row along the front-rear direction at the center of the width direction of the front surface of the sub-board 10 (the plurality of relays 11 arranged in two rows). adjacent and sandwiched).

Further, in this example, a plurality of arc-extinguishing resistors 13 are mounted on the front surface of the sub-board 10 at positions adjacent to the relays 11 . A plurality of arc-extinguishing resistors 13 are also electrically connected to the relay 11 and the male connector portion 12 via bus bars.

As shown in FIG. 2, the main board 20 is a rectangular plate-shaped circuit board that is larger than the sub-board 10 . A plurality of connector connection portions 21 , a plurality of fuse connection portions 22 , and a plurality of female connector portions 23 are mounted on the front surface of the main substrate 20 .

Each of the connector connection portions 21 is typically a connector part to which a connector (not shown) provided at the end of a wire harness routed in an automobile or the like is connected. In this example, a plurality of connector connection portions 21 are arranged in two rows along the front-rear direction at both edges in the width direction of the front surface of the main board 20 .

Each of the fuse connection portions 22 is a connector component to which various fuses are connected to protect various electrical components mounted in an automobile or the like from excessive current. In this example, a plurality of fuse connection portions 22 are arranged in a line along the width direction at the rear edge portion of the front surface of the main substrate 20 .

Each of the female connector portions 23 is composed of a housing that accommodates a plurality of female terminals (not shown) protruding from the front surface of the main substrate 20 in the plate thickness direction. In this example, a plurality (two) of female connector portions 23 are arranged in a row along the front-rear direction at the central portion in the width direction of the front surface of the main board 20 . As a result, between the female connector portion 23 and the connector connection portion 21 in the width direction, gaps R extending in two rows in the front-rear direction are formed on both sides in the width direction of the female connector portion 23 .

The connector connection portion 21, the fuse connection portion 22, and the female connector portion 23 mounted on the main board 20 are electrically connected to each other via an electric circuit (not shown) built in the main board 20. there is

As shown in FIG. 2, the sub-board 10 and the main board 20 configured as described above are aligned with each other in the front-rear directions and face each other with their front surfaces facing each other. The connector portion 12 (male terminal) and the female connector portion 23 (female terminal) of the main substrate 20 are assembled together so as to be fitted and connected, thereby forming the electronic component module 1 as shown in FIG. . Thereby, the sub-board 10 and the main board 20 are electrically connected via the male connector portion 12 and the female connector portion 23 .

As shown in FIGS. 3 and 4 , in the electronic component module 1 in which the sub-board 10 is assembled to the main board 20 , the plurality of relays 11 arranged in two rows on the sub-board 10 are arranged in gaps extending in two rows on the main board 20 . The sub-board 10 and the main board 20 are stacked in parallel with each other with a gap in the plate thickness direction in a state of entering the R. As shown in FIG. The distance between the sub-board 10 and the main board 20 in the plate thickness direction is such that the front surface of the sub-board 10 near the base of the male connector portion 12 (male terminal) is the projecting end surface of the housing of the female connector portion 23 of the main board 20. It is specified by abutting on

By inserting the plurality of relays 11 into the gap R in this manner, the relays 11 and the connector connecting portion 21 are arranged adjacent to each other in the width direction. 4 because the distance in the plate thickness direction between the sub-board 10 and the main board 20 defined as described above is larger than the protrusion height of the relay 11 (from the front surface of the sub-board 10). (Particularly, as shown in FIG. 4(b)), between the projecting end surface 11b of the relay 11 and the front surface 20a of the main substrate 20, a gap S is defined in the plate thickness direction.

As described above, according to the electronic component module 1 according to the embodiment of the present invention, the main board 20 provided with the connector connection portion 21 and the fuse connection portion 22 and the sub-board 10 provided with the relay 11 are separately prepared. , the main board 20 and the sub board 10 are connected via the male connector portion 12 and the female connector portion 23 . Furthermore, in the connected state in which the main board 20 and the sub-board 10 are connected in this manner, a gap S having a predetermined height is defined between the projecting end surface 11b of the relay 11 and the front surface 20a of the main board 20. . Therefore, it is possible to provide other electronic components at a location corresponding to the gap S on the main board 20 as required. Therefore, it is possible to expand the area where electronic components can be mounted while avoiding an increase in the size of the main substrate 20 .

Furthermore, since the sub-board 10 on which the relays 11 are provided is provided separately from the main board 20, the circuit of the sub-board 10 can be used without changing the circuit design of the main board 20 even if the specifications of the automobile or the like are different. Only the design has to be changed. Therefore, it becomes easy to change the design of the electronic component module 1 .

Furthermore, when the main board 20 and the sub-board 10 are in a connected state, the relay 11 and the connector connecting portion 21 are arranged adjacent to each other in the direction (width direction) parallel to the front surface of the main board 20. be. In other words, the relay 11 is arranged near the front surface of the main substrate 20 while avoiding the connector connection portion 21 mounted on the main substrate 20 . Therefore, it is possible to avoid increasing the size of the electronic component module in the thickness direction of the main board 20 and the sub-board 10 as well.

<Other forms>
The present invention is not limited to the above-described embodiments, and various modifications can be adopted within the scope of the present invention. For example, the present invention is not limited to the above-described embodiments, and can be modified, improved, etc. as appropriate. In addition, the material, shape, size, number, location, etc. of each component in the above-described embodiment are arbitrary and not limited as long as the present invention can be achieved.

For example, in the above-described embodiment, no other electronic component is provided in the portion corresponding to the gap S of the main board 20 . On the other hand, various electronic components may be mounted on the main substrate 20 at locations corresponding to the gaps S. FIG. According to this, various electronic components can be mounted while avoiding an increase in the size of the main board 20 . In addition, when the electronic component mounted in the space S is a component that can be mounted on one side without using a through hole, various electronic components can also be mounted on the back side of the portion corresponding to the space S of the main board 20 .

Furthermore, in the above embodiment, a plurality of relays 11 are mounted on the front surface of the sub-board 10 . On the other hand, a single relay 11 may be mounted on the front surface of the sub-board 10 . Similarly, a plurality of connector connection portions 21 and a plurality of fuse connection portions 22 are mounted on the front surface of the main board 20 . On the other hand, a single connector connection portion 21 or a single fuse connection portion 22 may be mounted on the front surface of the main board 20 .

Furthermore, in the above-described embodiment, a plurality of male connector portions 12 are mounted on the front surface of the sub-board 10, and a plurality of female connector portions 23 connectable to the plurality of male connector portions 12 are mounted on the front surface of the main substrate 20. Implemented. On the other hand, a single male connector portion 12 is mounted on the front surface of the sub-board 10, and a single female connector portion 23 connectable to the single male connector portion 12 is mounted on the front surface of the main substrate 20. May be implemented.

Furthermore, in the above embodiment, the male connector portion 12 is mounted on the sub-board 10 side, and the female connector portion 23 is mounted on the main board 20 side. Alternatively, the female connector may be mounted on the sub-board 10 side and the male connector may be mounted on the main board 20 side.

Here, the characteristics of the embodiment of the electric board module 1 according to the present invention described above are briefly summarized in (1) to (3) below.
(1)
a first circuit board (20) provided with components (21) for power distribution;
A second circuit board (10) which is stacked with a gap with respect to the first circuit board (20) and provided with one or more relays (11) facing the first circuit board (20). When,
a first connector portion (23) provided on the first circuit board (20) facing the second circuit board (10) and connected to the component (21);
a second connector portion (12) provided on the second circuit board (10) facing the first circuit board (20) and connected to the one or more relays (11);
An electronic component module (1) comprising
When the first connector part (23) and the second connector part (12) are in a connected state, the one or more relays (11) and the board surface (20) of the first circuit board (20) 20a) is defined with a gap (S) of predetermined height between
Electronic component module.
(2)
In the electronic component module (1) according to (1) above,
When in the connected state, the one or more relays (11) and the component (21) are arranged adjacent to each other in a direction parallel to the board surface of the first circuit board (20). Ru
Electronic component module.
(3)
In the electronic component module (1) according to (1) or (2) above,
One or more electronic components are provided at locations corresponding to the gaps (S) of the first circuit board (20),
Electronic component module.

1 electronic component module 10 sub-board (second circuit board)
11 relay 12 male connector part (second connector part)
20 Main board (first circuit board)
20a front surface (substrate surface)
21 connector connection part (component)
23 female connector part (first connector part)
S void

Claims (2)

a first circuit board provided with components for power distribution;
a second circuit board which is stacked with a gap with respect to the first circuit board and provided with one or more relays facing the first circuit board;
a first connector portion provided on the first circuit board so as to face the second circuit board and connected to the component;
a second connector section provided on the second circuit board so as to face the first circuit board and connected to the one or more relays;
An electronic component module comprising
When the first connector portion and the second connector portion are in a connected state, a gap having a predetermined height is defined between the one or more relays and the board surface of the first circuit board. configured to
One or more electronic components are provided at locations corresponding to the voids of the first circuit board ,
The plurality of relays are spaced apart in the width direction parallel to the board surface of the second circuit board, and arranged in two directions along the front-rear direction parallel to the board surface of the second circuit board and orthogonal to the width direction. arranged in rows on the second circuit board;
The plurality of second connector portions are arranged on the second circuit board so as to line up in one row along the front-rear direction at positions in the width direction between the plurality of relays arranged in two rows,
The plurality of components are arranged on the first circuit board so as to be arranged in two rows along the front-rear direction at intervals in the width direction,
The plurality of first connector portions are arranged in one row along the front-rear direction at positions in the width direction between the plurality of parts arranged in two rows, and the first connectors in the width direction. arranged on the first circuit board such that gaps extending in two rows in the front-rear direction are formed on both sides of the first connector portion in the width direction between the portion and the component;
When the first connector portion and the second connector portion are in a connected state, the plurality of relays arranged in two rows enter the gaps extending in two rows, respectively.
Electronic component module. In the electronic component module according to claim 1,
When in the connected state, the relay and the component are arranged adjacent to each other in the width direction parallel to the board surface of the first circuit board;
Electronic component module.

Images