WO2023016716A1 - Agencement d'une puce de capteur sur un objet de mesure - Google Patents

Agencement d'une puce de capteur sur un objet de mesure Download PDF

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Publication number
WO2023016716A1
WO2023016716A1 PCT/EP2022/069023 EP2022069023W WO2023016716A1 WO 2023016716 A1 WO2023016716 A1 WO 2023016716A1 EP 2022069023 W EP2022069023 W EP 2022069023W WO 2023016716 A1 WO2023016716 A1 WO 2023016716A1
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WO
WIPO (PCT)
Prior art keywords
adapter plate
sensor chip
measurement object
attached
tool
Prior art date
Application number
PCT/EP2022/069023
Other languages
German (de)
English (en)
Inventor
Philipp Lang
Günther Scharnagel
Original Assignee
Zf Friedrichshafen Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zf Friedrichshafen Ag filed Critical Zf Friedrichshafen Ag
Publication of WO2023016716A1 publication Critical patent/WO2023016716A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments

Definitions

  • the invention relates to an arrangement of a sensor chip on a measurement object.
  • the arrangement and a method for attaching a sensor chip to a measurement object are claimed in particular.
  • the measurement object can consist of different materials such as metal, silicon or an organic material.
  • the tie layer must provide strong adhesion and be dimensionally stable to ensure good force and deformation transfer without (unpredictable) damping or time delays. Sensor performance over lifetime depends on long-term stability of compound layer, especially temperature/humidity/chemical stability to avoid signal drift, signal amplitude shrinkage and time lag.
  • An object of the present invention can be seen as providing an alternative connection between a sensor chip and a measurement object, which takes into account the problems described above.
  • the object is solved by the subject matter of the independent patent claims.
  • Advantageous embodiments are the subject matter of the dependent claims, the following description and the figures.
  • the present invention it is proposed to attach and contact a sensor chip with a larger measurement object via an adapter plate.
  • This adapter plate offers several advantages, e.g. the separation of the sensor chip from the measurement object, efficient manufacturing, the reduction of the bias voltage in the sensor chip, mechanical signal filtering or the alignment of the signals and reduction of negative environmental conditions.
  • the present invention enables a firm and long-term stable connection between the measurement object and the sensor chip. This connection enables direct signal transmission without attenuation or time delay.
  • an adaptation of the sensor chip to different physical signal parameters, to different directions and different strengths is made possible without the sensor chip itself having to be changed.
  • an arrangement of a sensor chip on a measurement object includes a sensor chip, an adapter plate and a measurement object, the sensor chip being set up to detect a physical property of the measurement object.
  • the measurement object can be significantly larger than the sensor chip and the adapter plate.
  • the measurement object can be, for example, an axle, an engine shaft or a transmission shaft of a motor vehicle.
  • the sensor chip can be set up, for example, a deformation, a strain, a To measure force and/or torque generated by the axle, the motor shaft or the transmission shaft.
  • the sensor chip is attached to the measurement object indirectly via the adapter plate and in particular is in contact with the measurement object without the sensor chip being attached directly to the measurement object.
  • the adapter plate can be arranged in a sandwich configuration between the sensor chip and the measurement object, so that the sensor chip is not in direct contact with the measurement object.
  • the adapter plate is arranged between the sensor chip and the measurement object, the sensor chip being firmly connected to the adapter plate and the adapter plate being firmly connected to the measurement object.
  • the adapter plate can be made larger than the sensor chip.
  • the sensor chip can thus touch part of the surface of the adapter plate and be connected to the adapter plate there.
  • a remaining part of the surface of the adapter plate can remain free of the sensor chip and can be used to connect the adapter plate to the measurement object, which is thus arranged laterally offset from the connection between the sensor chip and the adapter plate.
  • the sensor chip can be arranged centrally on the surface of the adapter plate and connected to the adapter plate there, whereas the remaining part of the surface of the adapter plate surrounds the sensor chip.
  • the adapter plate has a sensor chip connection area in which the sensor chip is attached to the adapter plate, the adapter plate being attached to the measurement object laterally next to the sensor chip connection area and at a distance from the sensor chip connection area.
  • the adapter plate can in particular be made from a metal sheet that is bent.
  • the sheet metal can be bent in such a way that the adapter plate is not directly below the sensor chip directly on the measurement object but only on the side next to the sensor chip, where the adapter plate is firmly connected to the measurement object.
  • the curved shape of the adapter plate means that a sensitive part of the sensor chip (eg designed as a force sensor) does not lie directly on the measurement object. Different expansion coefficients can also be compensated.
  • small deformations in the measurement object can be accommodated in a free space formed by the curved shape.
  • the adapter plate is made of a metal sheet, wherein the metal sheet is bent in such a way that there is a clearance between the adapter plate and the measurement object, and the clearance is arranged below the sensor chip connection region.
  • the adapter plate can be materially connected to the measurement object, e.g. by means of a welded connection, an adhesive connection, a sintered connection, a eutectic connection or a soldered connection.
  • the adapter plate can be positively and/or non-positively connected to the measurement object by means of an adapter plate connecting element.
  • “separate” can be understood in particular to mean that the adapter plate connecting element is not connected in one piece either to the adapter plate or to the measurement object.
  • Commercially available screws or rivets for example, can be used as adapter plate connecting elements.
  • a clinching process e.g. TOX® clinching
  • a clamping process or a pressing process can also be used.
  • the adapter plate can form a form-fitting element that can be inserted into a corresponding recess in the measurement object. so that a positive connection is created between the adapter plate and the measurement object.
  • the form-fitting element is in particular connected in one piece to the adapter plate. In this sense, it is provided according to a further embodiment that a form-fitting element of the adapter plate is framed in a form-fitting manner in the measurement object.
  • the sensor chip is bonded to the adapter plate.
  • the sensor chip can include a housing which is materially connected to the adapter plate.
  • the housing can at least partially surround the sensor chip, in particular on that side which faces the adapter plate.
  • the housing of the sensor chip and the adapter plate can be made of a metallic material.
  • the integral connection between the sensor chip and the adapter plate is an intermetallic connection between the metal housing of the sensor chip and the metal adapter plate.
  • the sensor chip can be connected to the adapter plate under safe or clean room conditions (MEMS processes can be used, for example sputtering, galvanic processes, lithography processes and furnace processes).
  • MEMS processes can be used, for example sputtering, galvanic processes, lithography processes and furnace processes).
  • the connection between the sensor chip and the adapter plate can be in the micro range or in the nano range.
  • the sensor chip and in particular the adapter plate is a small part whose length in one or more directions does not exceed 10 cm, for example. This means that the sensor chip and the adapter plate fit in a conventional oven, in a sputtering system and in an evaporation system for chip bonding.
  • the measurement object is typically much larger and would not fit in the aforementioned systems together with the sensor chip. This means that several parts (sensor chip and adapter plate) can be processed at the same time.
  • bonding can be mass-produced (batch oven process, etc.) under optimal conditions for the sensor chip.
  • bonding can take place in batch mode.
  • Batch operation refers to the size of the parts, and therefore how many parts can fit in a furnace, sputtering system, and evaporator at one time. Due to the small dimensions of the sensor chip and the adapter plate, a particularly large number of parts per process step can be processed at the same time.
  • the sensor chip and the adapter plate can be connected to one another by means of a connecting foil.
  • a so-called NanoFoil® from the Indium Corporation can be used as the connecting foil.
  • the NanoFoil® is a reactive multi-layer foil made by vapor deposition of thousands of alternating nanoscale layers of aluminum and nickel. When activated by a small pulse of localized energy from electrical, optical or thermal sources, the foil reacts exothermically to generate precise localized heat up to temperatures of 1500°C in fractions of a second.
  • connection foil can be placed between the sensor chip and the adapter plate.
  • the placement can be such that the bonding foil is in a sandwich configuration directly against facing surfaces of the sensor chip and the adapter plate, or in a sandwich configuration between two solder layers, the solder layers being on facing surfaces of the sensor chip and the adapter plate are applied.
  • the solder layers can consist of copper, gold, palladium or nickel, for example. These materials can be applied particularly advantageously as metallic starting layers (soldering layer) by plasma processes, sputtering processes or vapor deposition on surfaces of the parts to be connected (sensor chip, adapter plate) that face one another. Other options are two-shot injection molding, additive manufacturing, etc.
  • the metallic materials of the connecting film can be activated so that the connecting film heats up in such a way that the sensor chip is connected to the adapter plate in a materially bonded manner.
  • the activation can take place, for example, by an ignition.
  • the process requires no special heat, no vacuum and no gas atmosphere.
  • the connection foil can be ignited with a standard 9V battery.
  • the material of the sensor chip and / or the adapter plate can be melted or melted, so that the sensor chip directly welded to the adapter plate.
  • the sensor chip can be indirectly soldered to the adapter plate by melting the solder layers.
  • a sintering process can be used that makes do with particularly low pressures that are exerted on the sensor chip.
  • silver particles can be applied to the sensor chip and/or to the adapter plate.
  • the silver particles can be applied to a surface of the sensor chip and/or the adapter plate in the form of a paste, the paste containing at least one solvent which binds the silver particles.
  • the silver particles can have a size in the range of a few nanometers or micrometers.
  • the sensor chip and the adapter plate can then be brought into contact with one another so that the paste with the silver particles is located between the sensor chip and the adapter plate.
  • the silver particles are in particular already in contact with the sensor chip and with the adapter plate.
  • the paste is then heated so that the silver particles combine through diffusion processes to form a layer which, after it has hardened, firmly connects the sensor chip to the adapter plate.
  • the hardening can in particular be associated with a cooling of the silver layer.
  • the paste with the solvent and with the silver particles can in particular be heated to a temperature above 200°. At temperatures above 200°C, the silver particles of the sinter paste combine through diffusion processes and harden into a stable layer after cooling down.
  • the solvents contained in the paste outgas, leaving a pure silver compound.
  • the adapter plate has cutouts that enable force to be absorbed at a predetermined angle or in a predetermined angular range.
  • the cutouts can be arranged in such a way that the adapter plate forms a central part and four lateral webs.
  • the middle part can, for example, be rectangular or square in shape.
  • the sensor chip can be attached to the adapter plate in the middle part.
  • the four lateral webs can protrude laterally from the central part, in particular from one at a time corner of the rectangle or square.
  • the webs can each form an angle of 90° to one another. With such an arrangement, for example, forces in an angular range of +/- 45° around the four lateral webs can be absorbed particularly well.
  • a further embodiment provides that the adapter plate has a surface structure that allows force to be absorbed at a predetermined angle or in a predetermined angular range and/or allows deformation of the adapter plate at different temperature expansion coefficients in predetermined spatial directions.
  • An inwardly directed surface structure of the adapter plate can be designed in such a way that the surface structure connects surfaces of the adapter plate that face away from one another. In this context one can speak of an opening or a perforation.
  • the inward surface structure of the adapter plate can be designed in such a way that the surface structure only forms a recess that extends inward from a first surface of the adapter plate, but does not reach a second surface that faces away from the first surface of the adapter plate is.
  • the inwardly directed surface structure can run along the surface of the adapter plate in such a way that the surface structure enables the adapter plate to be deformed in preferred spatial directions, particularly if the adapter plate and the measurement object have different temperature expansion coefficients. The resulting deformations can be controlled via a direction and via a size of the surface structure.
  • An outwardly directed surface structure can be designed as an elevation of one of the surfaces of the adapter plate.
  • the surface structuring directed outwards can be produced, for example, by applying additional material.
  • the absorption of force can be increased at a specific angle or in a specific angular range.
  • the adapter plate is rectangular or square in shape, then a surface structure can be applied to each of the four corners of the rectangle or square, so that a possible force absorption of the adapter plate is increased in four angular ranges of +/- 45° each.
  • the adapter plate has, for example, the cutouts described above, which are arranged in such a way that the adapter plate forms the central part and the four lateral webs, then an outer surface structuring can be applied to each of the four webs to reduce the force absorption in the angle range of +/- - 45° increase.
  • a method for attaching a sensor chip to a measurement object includes the following steps:
  • the method according to the invention is characterized in particular by the fact that no high force, pressure, temperature, electromagnetic fields or current are exerted on the sensor chip itself.
  • the process does not involve any difficult process parameters, e.g. B. in a vacuum, under protective gas or in the furnace process.
  • the adapter plate in step (300) on the measurement object be attached by means of a tool, the dimensions and shapes of the adapter plate and the tool being matched to one another in such a way that attaching the adapter plate to the measurement object does not affect the sensor chip.
  • the adapter plate can have a sensor chip connection area, in which the sensor chip is attached to the adapter plate in step (100), the adapter plate being attached to the measurement object in step (300) by means of the tool.
  • the tool is designed in such a way that it touches the adapter plate for connection to the measurement object at several points on the side next to the sensor chip connection area, but not in the sensor chip connection area.
  • the tool can form contact elements that are placed on the adapter plate at the intended locations in order to connect the adapter plate to the measurement object.
  • the tool can have a recess between the contact elements that is at least as large as the sensor chip connection area of the adapter plate.
  • the tool cannot therefore act on the adapter plate in the sensor chip connection area because it does not come into contact with the adapter plate there due to the recess.
  • the recess is so large that the tool does not come into contact with the sensor chip when the tool acts on the adapter plate by means of the contact elements.
  • the sensor chip is thus protected within the recess of the tool without contact with the tool when the contact plate is attached to the measurement object by means of the tool.
  • the tool can be set up to act on the adapter plate in such a way that the adapter plate is connected to the measurement object.
  • the tool can heat the adapter plate where the contact elements touch the adapter plate.
  • the tool can, for example, exert a force on the adapter plate where the contact elements touch the adapter plate.
  • the contact elements of the tool can exert a force on the adapter plate and at the same time heat the adapter plate.
  • the adapter plate can be connected to the measurement object by sintering, for example, if a sintered solder is placed between the adapter plate and the measurement object applied and thermally activated by the power and heat of the tool.
  • the tool can, for example, transmit a current to the adapter plate where the contact elements touch the adapter plate.
  • the current can be used for welding, in particular combined with a power of the tool.
  • the adapter plate is attached to the measurement object in step (300) by means of a sintered solder which is applied in a pattern to the adapter plate and connected to the measurement object, the pattern having a shape such that the sintered solder is in a predetermined Way as a power conductor or as a heat conductor or as a current conductor or as an electrical resistance acts.
  • a desired or predetermined heat dissipation, electrical field control, mechanical force filtering and/or mechanical force reduction can be achieved.
  • the intermetallic compound which acts as a force, heat, current conductor or resistance.
  • patterns can be selected in such a way that, for example, a different “aeration” is brought about during the sintering process, which is typically accompanied by outgassing.
  • the pattern selected in each case can also cause a different pre-embossing of mechanical stress in the adapter plate during the sintering process.
  • the parts of the adapter plate not connected to the measurement object, which are located where no sintered solder is applied, can deform relatively freely.
  • the type of deformation depends on the structure or shape of the bonding points. For example, if the sintered solder lies in straight bonding lines and forms 90° angles, a deformation can be measured in these directions. In a 180° angle, however, no force is transmitted and this direction is "filtered".
  • PCB printed circuit board
  • a suitable method in this regard is described, for example, by Johannes Heinrich Glasschröder in "Additively manufactured workpieces with integrated electrical circuits using the 3D printing process” (dissertation Technical University of Kunststoff; 2018).
  • so-called 3D forming can also be used, for example as described by Marcel Plogmeyer in the publication "Thin-film sensors for temperature measurement in mixed friction contact” (Fraunhofer Institute 2020).
  • electrical conductor tracks are applied to the adapter plate by 3D printing or 3D forming.
  • This additional method step can take place before the surface of the adapter plate is connected to the surface of the sensor chip in step (100), but at least before the unit made up of sensor chip and adapter plate is arranged on the measurement object in step (200).
  • FIG. 1 is a perspective view of a relatively large measurement object to which a relatively small sensor chip is attached by means of an adapter plate that is also relatively small,
  • FIG. 2 shows an enlarged longitudinal section of part of the measurement object according to FIG. 1 in the area of the sensor chip and the adapter plate,
  • FIGS. 1 and 2 show a process diagram of a method for attaching the sensor chip to the measurement object according to FIGS. 1 and 2,
  • FIG. 4 shows a sectional view of a measurement object to which a sensor chip is attached by means of a curved adapter plate
  • FIG. 5 different attachment variants of an adapter plate on a measurement object
  • 6 shows a plan view of a unit made up of a sensor chip and an adapter plate, which has cutouts and webs resulting therefrom,
  • FIG. 7 shows a plan view of a unit made up of a sensor chip and an adapter plate which has openings
  • FIG. 9 shows a sectional illustration through a unit made of a sensor chip and an adapter plate to be fastened to a measurement object by means of a tool.
  • a measurement object 1 and 2 show a measurement object 1, e.g. an axle rotating about an axis of rotation L, an engine shaft or a transmission shaft of a motor vehicle.
  • An adapter plate 2 is fastened directly to the measurement object 1, in the exemplary embodiment shown by means of four screw connections 3.
  • a sensor chip 4 is fastened to the adapter plate 2.
  • the sensor chip 4 can, for example, measure a torque or a force that is generated by the measurement object 1 .
  • the adapter plate 2 is arranged between the sensor chip 4 and the measurement object 1 .
  • the adapter plate 2 has a first surface 5 which faces the sensor chip 4 .
  • the adapter plate 2 also has a second surface 6 which faces the measurement object 1 .
  • the sensor chip 4 comprises an optional housing 7 which at least partially surrounds the sensor chip 4 .
  • the housing 7 has a first surface 8 which faces the adapter plate 2 .
  • the housing 7 also has a second surface 9 which faces away from the adapter plate 2 .
  • the housing 7 of the sensor chip 4 and the adapter plate 2 can both be made of a metallic material.
  • the first surface 5 of the adapter plate 2 can be firmly connected to the first surface 8 of the housing 7 of the sensor chip 4 in a first method step 100 (see FIG. 3), so that a unit consisting of the sensor chip 4 and the adapter plate 2 is formed.
  • the adapter plate 2 has a sensor chip connection area 11 in which the sensor chip 4 is attached to the adapter plate 2 via its housing 7 .
  • the housing 7 and the adapter plate 2 were joined using a sintering process, with a sintered solder 10 being activated between the housing 7 and the adapter plate 2 and providing an intermetallic connection between the housing 7 of the sensor chip 4 and the adapter plate 2.
  • electrical conductor tracks (not shown) can optionally be applied to the adapter plate 2 by 3D printing or 3D forming.
  • a second method step 200 (Fig. 3) the unit of sensor chip 4 and adapter plate 2 can be arranged on the measurement object 1, so that the adapter plate 2 is in contact with the measurement object 1 and between the sensor chip 4 and the measurement object 1, as is the case shown by Fig.2.
  • a third method step 300 (FIG. 3) the adapter plate 2 can then be firmly connected to the measurement object 1 via a plurality of screw connections 3 next to the sensor chip connection area 11 and at a distance from the sensor chip connection area 11 .
  • the second surface 6 of the adapter plate 2 is in contact with the measurement object 1 .
  • the sensor chip 4 is attached to the device under test 1 indirectly via the adapter plate 2 and is in contact with the device under test 1 without the sensor chip 4 being attached directly to the device under test 1 and without the attachment of the adapter plate 2 to the device under test 1 breaking the sensor chip 4 negatively impacted.
  • the exemplary embodiment according to FIG. 4 shows an adapter plate 2 which is made from a metal sheet 12 which is bent.
  • the sensor chip 4 can be connected to the adapter plate 2 in a manner similar to that shown by FIG.
  • the metal sheet 12 is bent in such a way that the adapter plate 2 below the sensor chip 4 does not bear directly against the measurement object 1, but only laterally next to the sensor chip 4, where the Adapter plate 2 is firmly connected to the measurement object 1 by screw connections 3.
  • the sheet metal 12 and the measurement object 1 delimit a free space 13 between them, which extends below the sensor chip connection area 11 and laterally a little beyond it.
  • FIG. 5 illustrates different methods for attaching the adapter plate 2 to the measurement object, which is not shown by variants A to C of FIG. 5 but is (as shown by variant D) below the adapter plate 2 in each case.
  • Variant A thus shows a screw connection 3 which can also be used in the exemplary embodiments according to FIGS.
  • a rivet can also be used to attach the adapter plate 2 to the measurement object.
  • a clinching process e.g. TOX® clinching
  • a clamping process or a pressing process can be used.
  • the adapter plate 2 can be joined to the measurement object 1 by soldering, sintering, gluing or by a eutectic method.
  • variant C the adapter plate 2 is connected to the measurement object by welding or gluing.
  • a form-fitting element 14 of the adapter plate is enclosed in the measurement object 1 in a form-fitting manner.
  • the adapter plate 2 is made from a rectangular sheet metal 12 that has been cut out in four areas 15 to 18, as a result of which the adapter plate 2 has a first cutout 15, a second cutout 16, a third cutout 17 and a fourth cutout 18 in the exemplary embodiment shown.
  • the four cutouts 15 to 18 create a first web 19 , a second web 20 , a third web 21 and a fourth web 22 .
  • the four webs 19 to 22 protrude from a middle part 23 of the adapter plate 2 .
  • the central part 23 has a rectangular shape.
  • the sensor chip 4 is attached to the adapter plate 2 in the middle part 23 .
  • the four lateral webs 19 to 22 each protrude from a corner of the rectangular central part 23 .
  • two adjacent webs eg the first web 19 and the second web 20
  • This arrangement of the webs 19 to 22 allows forces in an angular range of +/- 45° around the respective webs 19 to 22 to be absorbed particularly well, which is illustrated in FIG. 6 for the first web 19 .
  • Figure 7 shows another rectangular adapter plate 2 on which a sensor chip 4 is fixed centrally, for example as shown by Figures 1 and 2.
  • This unit can be attached to a measurement object, for example by applying and activating a sintered solder 10 that is located on that surface which faces the measurement object and not the sensor chip 4 .
  • the inwardly directed surface structure 25 has four inner openings 26 and four outer openings 27 . All openings 26, 27 are rectangular and the respective longer side of the openings 26, 27 runs parallel to one of four mutually rectangular side edges 28 of the adapter plate 2. The inner openings 26 are thus offset by 90° to one another. The same applies to the outer openings 27.
  • the four outer openings 27 are larger than the four inner openings 26.
  • the four outer openings 27 surround the four inner openings 26, with an outer opening 27 parallel to and at a distance from an inner opening 26 is arranged. Due to these shapes and arrangements of the inner and outer openings 26, 27, the adapter plate according to Fig. 7 (similar to the adapter plate 2 according to Fig. 6) can absorb forces in four complementary angular ranges of +/- 45° each, one of which is shown in Fig 7 is shown as an example. Furthermore, the inner surface structure 25 allows a deformation of the adapter plate 2 in preferred spatial directions (in particular transversely to the side edges 28 of the adapter plate 2), in particular when the adapter plate 2 and the measurement object (not shown by FIG. 7; see, for example, FIG. 1, 2) have different temperature expansion coefficients.
  • FIG. 8 shows another rectangular adapter plate 2 on which a sensor chip 4 is attached centrally, for example as shown in FIGS. 1 and 2.
  • FIG. Fig. 8 also shows that attaching the adapter plate 2 to the measurement object (see, for example, Fig. 1, 2) in step 300 (cf. FIG. 3) by means of a sintered solder 10, which is applied to the adapter plate 2 in different patterns (variants A, B, C) and then connected to the measurement object by activation.
  • the sintered solder is located on that surface which faces the measurement object and not the sensor chip 4 .
  • the sintered solder 10 acts in a predetermined manner as a force conductor or as a heat conductor or as a current conductor or as an electrical resistor.
  • a desired or predetermined heat dissipation, electrical field control, mechanical force filtering and/or mechanical force reduction can be achieved.
  • the intermetallic connection between the adapter plate 2 and the measurement object acts as a force, heat, electricity conductor or resistance.
  • patterns can be selected in such a way that, for example, a different “aeration” is brought about during the sintering process, which is typically accompanied by outgassing.
  • the pattern selected in each case can also cause a different pre-embossing of mechanical stress in the adapter plate 2 during the sintering process.
  • the parts of the adapter plate 2 that are not connected, ie areas in which no sintered solder 10 is applied, can deform relatively freely.
  • the type of deformation depends on the structure or shape of the bonding points. If the sintered solder 10 lies, for example, in straight bonding lines (variant B) and forms a 90° angle, a deformation can be measured in these directions. In a 180° angle, however, no force is transmitted and this direction is "filtered".
  • FIG. 9 shows a unit made up of sensor chip 4 and adapter plate 2, which are connected to one another as shown by FIGS. In step 300 (cf. FIG. 3), this unit is fastened to a measurement object 1 by means of a tool 29 .
  • Dimensions and shapes of the adapter plate 2 and the tool 29 for attaching the adapter plate 2 to the measurement object 1 are designed such that influences of the manufacturing process, in particular bias, temperature, electromagnetic fields, current and/or force are compensated.
  • the adapter plate has a sensor chip connection area 11 in which the sensor chip 4 is attached to the adapter plate 2 in step 100 .
  • step 300 the adapter plate 2 is then attached to the measurement object 1 by means of the tool 29, the tool 29 being designed in such a way that it does not touch the adapter plate 2 for connection to the measurement object 1 at several points laterally next to the sensor chip connection area 11 however, in the sensor chip connection area 11.
  • the tool 29 forms contact elements 30, which are placed on the adapter plate 2 at the intended locations in order to connect the adapter plate 2 to the measurement object 1.
  • the tool 29 has a recess 31 between the contact elements 30, which is larger than the sensor chip connection area 11 of the adapter plate 2. In the sensor chip connection area 11, the tool 29 can therefore not act on the adapter plate 2 because it is there due to the recess 31 does not come into contact with the adapter plate 2. As far as the height or depth of the recess 31 is concerned, the recess is so large that the tool 29 does not come into contact with the sensor chip 4 when the tool 29 acts on the adapter plate 2 by means of the contact elements 30 . In other words, the sensor chip 4 is protected within the recess 31 of the tool 29 without contact with the tool 29 when the contact plate 2 is attached to the measurement object 1 by means of the tool 29 .
  • the tool 29 can be set up to act on the adapter plate 2 in such a way that the adapter plate 2 is connected to the measurement object 1 .
  • the tool 29 can heat the adapter plate 2 there (T as in temperature in FIG. 9) where the contact elements 30 touch the adapter plate 2 .
  • the tool 29 can, for example, exert a force F on the adapter plate 2 where the contact elements 30 touch the adapter plate 2 .
  • the contact elements 30 of the tool 29 can exert a force F on the adapter plate and heat the adapter plate 2 at the same time.
  • the adapter plate 2 can be connected to the measurement object 1 by sintering, for example, when a sintered solder 10 is applied between the adapter plate 2 and the measurement object 1 and is thermally activated by force F and heat T of the tool 29 (shown by variants A, B in the right part of Fig. 9).
  • the tool 29 can, for example, transfer a current I to the adapter plate 2 where the contact elements 30 touch the adapter plate 2 .
  • the current I can be used for welding, in particular combined with a force F of the tool 29.
  • Variant C in the right-hand part of FIG can be used in order to engage there in a form-fitting manner

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Abstract

L'invention se rapporte un agencement d'une puce de capteur (4) sur un objet de mesure (1). L'agencement comprend une puce de capteur (4), une plaque d'adaptation (2) et un objet de mesure (1). La puce de capteur (4) est configurée pour détecter une propriété physique de l'objet de mesure (1). En outre, la puce de capteur (4) est fixée indirectement à l'objet de mesure (1) par l'intermédiaire de la plaque d'adaptation (2) sans que la puce de capteur (4) soit directement fixée à l'objet de mesure (1).
PCT/EP2022/069023 2021-08-11 2022-07-08 Agencement d'une puce de capteur sur un objet de mesure WO2023016716A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021208776.0 2021-08-11
DE102021208776.0A DE102021208776A1 (de) 2021-08-11 2021-08-11 Anordnung eines Sensorchips an einem Messobjekt

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WO2023016716A1 true WO2023016716A1 (fr) 2023-02-16

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69309392T2 (de) * 1992-10-29 1997-07-10 Sextant Avionique Sensor für eine richtungsabhängige physikalische Grösse
US20150020601A1 (en) * 2012-03-02 2015-01-22 Hitachi, Ltd. Device for Measuring Mechanical Quantity
DE102014213217A1 (de) * 2014-07-08 2016-01-14 Continental Teves Ag & Co. Ohg Körperschallentkopplung an mit Geberfeldern arbeitenden Sensoren
EP3163274A1 (fr) * 2014-06-30 2017-05-03 Hitachi, Ltd. Appareil de production d'électricité mû par le vent, système de surveillance d'appareil de production d'électricité mû par le vent, et procédé de surveillance d'appareil de production d'électricité mû par le vent

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DE4031161A1 (de) 1990-10-03 1992-04-09 Karl Stegmeier Befestigungsvorrichtung fuer einen heizkostenverteiler

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69309392T2 (de) * 1992-10-29 1997-07-10 Sextant Avionique Sensor für eine richtungsabhängige physikalische Grösse
US20150020601A1 (en) * 2012-03-02 2015-01-22 Hitachi, Ltd. Device for Measuring Mechanical Quantity
EP3163274A1 (fr) * 2014-06-30 2017-05-03 Hitachi, Ltd. Appareil de production d'électricité mû par le vent, système de surveillance d'appareil de production d'électricité mû par le vent, et procédé de surveillance d'appareil de production d'électricité mû par le vent
DE102014213217A1 (de) * 2014-07-08 2016-01-14 Continental Teves Ag & Co. Ohg Körperschallentkopplung an mit Geberfeldern arbeitenden Sensoren

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