WO2023013834A1 - Heat sink paint composition, preparation method therefor, heat sink coating film formed therefrom, and heat sink comprising same - Google Patents

Heat sink paint composition, preparation method therefor, heat sink coating film formed therefrom, and heat sink comprising same Download PDF

Info

Publication number
WO2023013834A1
WO2023013834A1 PCT/KR2022/003158 KR2022003158W WO2023013834A1 WO 2023013834 A1 WO2023013834 A1 WO 2023013834A1 KR 2022003158 W KR2022003158 W KR 2022003158W WO 2023013834 A1 WO2023013834 A1 WO 2023013834A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
paint composition
polyoxyethylene
dissipating
graphite
Prior art date
Application number
PCT/KR2022/003158
Other languages
French (fr)
Korean (ko)
Inventor
이상헌
송진호
최상일
유민숙
김태한
Original Assignee
퓨어만 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 퓨어만 주식회사 filed Critical 퓨어만 주식회사
Publication of WO2023013834A1 publication Critical patent/WO2023013834A1/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/18Fireproof paints including high temperature resistant paints
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40Additives
    • C09D7/60Additives non-macromolecular
    • C09D7/61Additives non-macromolecular inorganic

Definitions

  • the present application relates to a heat-dissipating paint composition, and relates to a heat-dissipating coating film formed on a surface of a metal substrate with the composition and a heat sink including the coating film.
  • Heat sinks and cooling fans have traditionally been used to solve or mitigate the heat generation problem of electronic products, but considering that slimming, high integration, and high capacity are the development directions of electronic products, as well as noise and vibration generation, they can be obstacles in designing electronic products. easy.
  • graphite sheets with a thickness of only a few tens of microns, flat metal heat sinks, and vapor chambers are used as heat dissipation components for high-performance, thin electronic products such as mobile phones, OLED displays, and personal computers. These components rapidly spread heat in the horizontal direction to prevent local heat accumulation in electronic products, thereby suppressing rapid temperature rise in semiconductor chips or small hot spots.
  • heat diffusion in the horizontal direction is excellent, but heat dissipation in the vertical direction is relatively inefficient. This is because the thermal conductivity of the metal material is high, but the surface thermal emissivity is low. Therefore, the surface of the heat sink, heat sink, vapor chamber, etc. made of metal components is treated with heat dissipation paint to improve the overall heat dissipation performance of the product.
  • Heat-dissipating paint is prepared by dispersing particles or fillers with excellent thermal conductivity in an organic, inorganic, or ceramic binder and adding a certain solvent to a viscosity suitable for processes such as spraying and dipping, and then used for coating.
  • heat dissipation paints developed or commercialized so far typically use or absorb carbon-based graphite (graphite), carbon black, CNT, and graphene and non-carbon-based high thermal conductivity particles such as BN, AlN, and SiC. Ceramic particles emitting far-infrared rays as the main component use one type or a mixture of two or more types.
  • CNTs having very high thermal conductivity in the transverse direction have limitations in realizing a heat dissipation effect because effective dispersion in the binder is difficult even though the production cost has recently been lowered.
  • One aspect of the present application is to provide a heat dissipation paint composition capable of forming a coating layer having excellent heat dissipation properties, adhesion, hardness, durability, etc. by one-time coating without pretreatment of the surface of a metal substrate.
  • One aspect of the present application is to provide a method for preparing the heat dissipating paint composition.
  • One aspect of the present application is to provide a heat-dissipating coating film formed using the heat-dissipating paint composition.
  • One aspect of the present application is to provide a heat sink including a heat-dissipating coating film formed using the heat-dissipating paint composition.
  • One embodiment of the present application based on the total weight of the composition, 30 to 60% by weight of the binder resin; 10 to 25% by weight of thermally conductive particles; 5 to 15% by weight of additives; and 10 to 50% by weight of a solvent; It provides a heat dissipation paint composition comprising a.
  • the binder resin includes a urethane resin or an epoxy resin
  • the thermally conductive particles include at least one graphite selected from the group consisting of expanded graphite, impression graphite, artificial graphite, and earthy graphite; and metal particles; can include
  • the composition is milled for 1 hour to 6 hours to separate graphene nanoplates (GNPs) or graphene from graphite. Specifically, the composition is exfoliated to separate graphene nanoplates (GNPs) or graphene from expanded graphite by milling.
  • the composition may include two or more of graphite particles, graphene nanoplate particles, and graphene particles after milling, or all of them. After the milling, the graphite particles, graphene nanoplate (GNP) particles, or graphene particles may have a diameter of 0.1 ⁇ m to 50 ⁇ m.
  • the milling bead may be zirconia having a diameter of 0.05 mm to 3.0 mm.
  • the composition may be cured by adding a diisocyanate-based curing agent or an amine-based curing agent.
  • the expansion side edge may be graphite in which interlayer expansion is performed by heat treatment after acid treatment.
  • the composition may have a viscosity of 300 cps or more to 1500 cps or less.
  • the composition is a dibutyl tin dilaurate curing catalyst; and ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3- Propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1 a spacer selected from the group consisting of 8-octanediol, 1,8-decanediol, octanedecanediol, glycerin, trimethylolpropane, pentaerythri
  • the metal particles are at least one selected from the group consisting of aluminum, iron, copper, zinc, tin, titanium, nickel, antimony, magnesium, vanadium, chromium, and zirconium, and have a diameter of 5 to It may be a flake type with a size of 40 ⁇ m.
  • the thermally conductive particles may include at least one carbon selected from the group consisting of carbon black, single-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, and carbon fibers; and heat dissipating filler; may further include.
  • the thermally conductive particles include 5 to 15% by weight of graphite; 1 to 6% by weight of metal particles; and 1 to 5% by weight of other thermally conductive particles; can include
  • the urethane resin is acrylic polyol, caprolactone polyol, epoxy polyol, ester polyol, ether polyol, polycarbonate polyol, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, ethylene glycol, diethylene Glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl -1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8 - It may be at least one selected from the group consisting of
  • the epoxy resin is a bisphenol-based epoxy, a phenol novolac-based epoxy, an o-cresol novolac-based epoxy, a multifunctional epoxy, an amine-based epoxy, or a heterocycle containing Epoxy, substitution type epoxy, naphthol type epoxy, bisphenol A epoxy resin, epichlorhydrin type epoxy resin.
  • Ethylene glycol glycidyl ether polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl Cidylaniline, diglycidylamine, N,N,N',N'-tetraglycidyl-m-xylenediamine and 1,3-bis(N,N'-diglycidylaminemethyl)cyclohexane It may be at least one or more selected from the group consisting of.
  • the diisocyanate-based curing agent forming the urethane binder includes hexamethylene diisocyanate (HDI), trimethylene diisocyanate, tetramethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate and 2,4,4-trimethylhexa It may be at least one selected from the group consisting of methylene diisocyanate (2,4,4-trimethylhexamethylene diisocyanate).
  • HDI hexamethylene diisocyanate
  • trimethylene diisocyanate trimethylene diisocyanate
  • tetramethylene diisocyanate 1,2-propylene diisocyanate
  • 1,3-butylene diisocyanate 1,decamethylene diisocyanate
  • dodecamethylene diisocyanate 2,4,4-trimethylhexa It may be at least one selected from the group consisting of methylene diisocyanate (2,4,
  • the amine-based curing agent for the epoxy resin is hexamethylenediamine, triethyldiamine, polyethyleneimine, hexamethylenetetramine, diethylenetriamine, triethyltetramine, isoformdiamine, diethylene Diethylene Triamine, Triethylene Tetramine, Diethylamino propyl amine, Menthane diamine, N-aminoethylpiperazine, M-Xyl M-xylene diamine, Isophorone diamine, N,N'-di-tert-butylethylenediamine, N,N-di-iso- Propylethylenediamine (N,N-di-iso-propylethylene-diamine), N,N'-diisopropyl-1,3-propanediamine (N,N'-diisopropyl-1,3-propanediamine), and bis( It may be at least one selected from the group consisting of
  • the solvent is N-butyl acetate, acetate, ethyl acetate, amyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol methyl acetate, diethylene glycol ethyl acetate, It may be at least one selected from the group consisting of ethylene glycol monoethyl ether acetate, 3-methoxybutyl acetate, and propylene glycol methyl ether acetate (PGMEA).
  • PGMEA propylene glycol methyl ether acetate
  • the heat dissipating filler among the thermally conductive particles is alumina, aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, aluminum nitride, boron nitride, silicon nitride, aluminum hydroxide, magnesium hydroxide, boron carbide, and zirconia.
  • silicon nitride, barium titanate, strontium titanate, beryllium oxide, manganese oxide, zirconia oxide, boron oxide and may be at least one selected from the group consisting of silicon oxide.
  • the additive may include at least one selected from the group consisting of a matting agent, a colorant, an adhesion promoter, a dispersing agent, an antisettling agent, an antifoaming agent, and a leveling agent.
  • the dispersant is a phosphoric acid ester of polyethoxylated alkylphenol, ethoxylated alkylphenol, ethoxylated castor oil, polyoxyethylene tristyrylphenyl ether, ethoxylated aliphatic alcohol, ethylene oxide/ Propylene oxide block copolymer, sodium salt of lignosulfonic acid, disodium salt of sulfuric acid, sodium salt of acrylic acid polymer, sodium salt of dodecyl sulfate, urea-formaldehyde resin, polyethylene glycol mono(tristyrylphenyl) ether, dodecyl Calcium salt of sylbenzene sulfonic acid, sodium stearate, sorbitan monostearate, polyoxyethylene ester of rosin, polyoxyethylene dodecyl mono ether, polyoxyethylene-polyoxypropylene block copolymer, polyoxyethylene monolaurate, Polyoxyethylene monohex
  • the adhesion promoter may be epoxy ester phosphate acid.
  • the anti-settling agent may be a urea-based compound.
  • One embodiment of the present application includes preparing a dispersion by milling the heat dissipating paint composition (S1); and preparing a heat-dissipating paint by adding a diisocyanate-based curing agent or an amine-based curing agent to the dispersion (S2); It provides a method for producing a heat dissipating paint comprising a.
  • Preparing the dispersion (S1) may include preparing a dispersion mixture by mixing the heat dissipating paint composition (S11); and milling the dispersion mixture to grind and exfoliate graphite and other thermally conductive particles to an optimal size to prepare a uniformly dispersed solution (S12).
  • ultrasonic treatment of graphite or dispersion treatment of graphite with an ultra-high pressure disperser, or processing of graphite with a high-speed shear ( S0); may further include.
  • the step (S2) of preparing a heat-dissipating paint by adding a diisocyanate-based curing agent or an amine-based curing agent to the dispersion may be a step of uniformly mixing the prepared solution with diisocyanate in case of a urethane binder (S2'), or a step of preparing a heat-dissipating paint composition by mixing with an amine-based curing agent in case of an epoxy binder (S2'').
  • One embodiment of the present application provides a heat-dissipating coating film formed by applying a heat-dissipating paint composition on a substrate and firing at 70 °C to 100 °C.
  • One embodiment of the present application provides a heat sink including the heat dissipation coating film.
  • the heat-dissipating paint composition according to one embodiment of the present application has excellent thermal conductivity and thermal radiation characteristics, excellent adhesion to the coated surface, and durability such as strength and thermal shock of the coating layer for cooling the latest electronic products and LED boards. It is suitable for heat sinks and has the advantage of implementing superior heat dissipation performance compared to existing heat sinks when applied to a metal surface such as aluminum.
  • the heat-dissipating paint composition according to one embodiment of the present application forms a coating film with excellent adhesion with one coating, prevents peeling from the surface of the heat-dissipating part during use, and maintains high durability against thermal shock and salt spray from the outside. .
  • the heat dissipation paint composition according to one embodiment of the present application has the advantage of being able to be used for metal surface treatment requiring heat dissipation including various metal heat dissipation parts such as aluminum.
  • FIG. 1(a) shows an aluminum plate
  • FIG. 1(b) shows an aluminum plate coated with a heat dissipating paint.
  • Figure 3 shows the measurement results of the heat dissipation efficiency according to the milling time of the compositions of Examples 1 and 4.
  • FIG. 6 shows a TEM image of expanded graphite after milling for 3 hours.
  • One embodiment of the present application in the heat dissipation paint composition, based on the total weight of the composition, 30 to 60% by weight of the binder resin; 10 to 25% by weight of thermally conductive particles; 5 to 15% by weight of additives; and 10 to 50% by weight of a solvent; It provides a heat dissipation paint composition comprising a.
  • the binder resin includes at least one or more of a urethane resin, an epoxy resin, and polyester.
  • the thermally conductive particles may include at least one graphite selected from the group consisting of expanded graphite, impression graphite, artificial graphite, and earthy graphite. Preferably, it may be expanded graphite.
  • the expanded graphite may be exfoliated into graphene nanoplates (GNPs) or graphene through various processes such as milling, ultra-high pressure dispersion, and ultrasonic waves.
  • GNP refers to a state composed of hundreds of graphene layers by exfoliation between graphene layers constituting graphite. Expanded graphite is easily separated between layers when an external force is applied due to the widening of the space between the graphene layers of the graphite, and as a result, a certain portion of graphene and GNP are generated.
  • the expanded graphite is pre-exfoliated using an ultra-high pressure disperser or ultrasonic waves, and then mixed with a binder, other particles and additives, and treated in a mixing-milling process to produce a heat-dissipating paint, and without a separate pre-treatment and exfoliation process, the binder, etc. It was confirmed that peeling could occur only through the milling process after mixing with other components.
  • the milling speed and the size of zirconia (ZrO 2 ) used as milling beads affect exfoliation.
  • the diameter of zirconia is preferably 0.05 mm to 3.0 mm. Further, the diameter of zirconia is more preferably 0.1 to 2.0 mm. In the case of milling beads having a size of 0.1 to 2.0 mm, the graphite exfoliation effect is excellent even after milling for 2 to 4 hours.
  • the graphite is obtained by exfoliating the graphite by wet milling for 1 hour to 6 hours, specifically for 2 hours to 6 hours, more specifically for 2 hours to 5 hours, and after milling the graphite
  • the diameter of the particles may be between 0.1 ⁇ m and 50 ⁇ m.
  • expanded graphite having a diameter of 3 ⁇ m to 100 ⁇ m was crushed and exfoliated to a size of 0.1 ⁇ m to 50 ⁇ m after milling for 2 to 4 hours.
  • natural graphite such as impression graphite and earth graphite can shorten the milling time, and even if sufficient milling time is maintained, delamination of graphite does not occur easily, so the heat dissipation efficiency does not change significantly depending on the milling time.
  • natural graphite has advantages in that it is easy to control the viscosity of paint and has excellent productivity.
  • the composition may be mixed by adding a diisocyanate-based curing agent or an amine-based curing agent after the milling.
  • the expanded graphite may be graphite in which interlayer expansion is performed by heat treatment after acid treatment.
  • the heat-dissipating paint composition may have a viscosity of 300 cps or more to 1500 cps or less at 25° C., and may have a viscosity of 600 cps or more and 800 cps or less. When the viscosity is within the above range, it may be more advantageous in terms of the sedimentation rate of the thermally conductive particles and the stability of the dispersion process.
  • the adhesive force with the coated surface may be weakened, and if it exceeds 1500 cps, it is difficult to manufacture a thin heat-dissipating coating film. Even if it is, the surface may not be uniform, and the coating process may not be easy, especially in the case of spray-type coating, the coating process may be more difficult. In addition, the dispersibility of the heat-dissipating filler in the heat-dissipating coating film may decrease.
  • the composition may further include a curing catalyst that is dibutyltin dilaurate, ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1 ,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1 consisting of 8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8-decanediol, octanedecanediol, glycerin, trimethylolpropane, pentaerythritol and hexanetriol A space
  • the thermally conductive particles may include metal particles.
  • the metal particles may be at least one selected from the group consisting of aluminum, iron, copper, zinc, tin, titanium, nickel, antimony, magnesium, vanadium, chromium, and zirconium.
  • the metal particles, specifically aluminum powder can use flake-type particles with a diameter of 5 to 40 ⁇ m, and in addition to heat dissipation properties, they can produce a pearl effect on the coating film and help to strengthen the surface of the coating film. there is.
  • the thermally conductive particles may further include at least one carbon selected from the group consisting of carbon black, single-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, and carbon fibers.
  • Carbon nanotubes are a modified form of graphene, and include single-wall carbon nanotubes (SWCNTs), in which a single layer of graphene is rolled into a tube, and multi-wall carbon nanotubes composed of several layers.
  • SWCNTs single-wall carbon nanotubes
  • MWCNTs multi-wall carbon nanotubes
  • Carbon nanotubes have excellent mechanical properties and have a very high aspect ratio (length/diameter), so they have excellent tensile stress and excellent thermal conductivity, so their application range is diverse. In addition, it has the properties of a conductor or a semiconductor depending on its winding shape, its energy gap varies according to its diameter, and it has a quasi-one-dimensional structure, so it exhibits a unique quantum effect.
  • MWCNTs can also give a thermal bridge effect between graphite or GNPs produced during milling, and graphene particles.
  • Graphene is a material with an atom-sized honeycomb structure made of carbon atoms. It is 0.2 nm thick, has very high physical and chemical stability, conducts electricity more than 100 times better than copper, and has electron mobility more than 100 times faster than silicon. . In addition, its strength is more than 200 times stronger than steel, its thermal conductivity is more than twice as high as that of diamond, which has the highest thermal conductivity, and it transmits most of the light, so it is transparent and has excellent elasticity.
  • carbon fiber When carbon fiber has a strength of 10 to 20 g/d and a specific gravity of 1.5 to 2.1, it has excellent heat resistance and impact resistance, is strong against chemicals, and has high resistance to pests. During the heating process, molecules such as oxygen, hydrogen, nitrogen, etc. escape and the weight is reduced, so it is lighter than metal (aluminum), but has excellent elasticity and strength compared to metal (iron).
  • the carbon material dispersion formed of such a carbon material is mixed with the graphite material, the carbon material such as carbon nanotubes contained in the carbon material dispersion is connected between the particles of the graphite material to improve thermal conductivity and exhibit excellent heat dissipation performance. be able to
  • the particle size of the carbon material may be preferably 200 nm to 1 ⁇ m.
  • the amount of carbon may be 1% to 5% by weight in the heat dissipating paint composition.
  • the carbon is less than 1% by weight in the heat dissipation paint composition, it is difficult to see the effect of thermal radiation due to a too small amount, and if it is more than 5% by weight, the aggregation of the fillers of heat dissipation characteristics increases, so that in the heat dissipation paint composition Acidity may be lowered, and adhesive strength may be lowered.
  • the graphite and the carbon material may have a weight ratio of 1:1 to 10:1 in the filler.
  • the thermally conductive particles may further include a heat dissipating filler.
  • the heat dissipating filler may include alumina, aluminum oxide (Al 2 O 3 ), magnesium oxide, zinc oxide, silicon carbide (SiC), aluminum nitride, boron nitride, silicon nitride, aluminum hydroxide, magnesium hydroxide, zirconia ( zirconia (ZrO 2 ), boron carbide (B 4 C), silicon nitride (Si 3 N 4 ), barium titanate, strontium titanate, beryllium oxide, manganese oxide, zirconia oxide, boron oxide and silicon oxide It may be at least one or more selected from the group consisting of.
  • the heat dissipating filler may have an average particle diameter of 1 ⁇ m to 10 ⁇ m. If it exceeds the above range, the adhesion to the substrate is reduced, and workability may be deteriorated.
  • the heat dissipating filler may be selected without limitation as long as it has insulation and heat dissipation properties at the same time in its material.
  • the shape and size of the heat dissipating filler are not limited, and may be porous or non-porous in structure, and may be selected differently depending on the purpose.
  • a filler whose surface is modified with a functional group such as a silane group, an amino group, an amine group, a hydroxyl group, or a carboxyl group may be used.
  • the functional group may be directly bonded to the surface of the filler, or carbon number It may be indirectly bonded to the filler via a substituted or unsubstituted aliphatic hydrocarbon having 1 to 20 atoms or a substituted or unsubstituted aromatic hydrocarbon having 6 to 14 carbon atoms.
  • the heat-dissipating filler may be a core-shell type filler in which a known conductive heat-dissipating filler such as carbon-based or metal is used as a core and an insulating component surrounds the core.
  • a known conductive heat-dissipating filler such as carbon-based or metal is used as a core and an insulating component surrounds the core.
  • the binder determines the thermal and mechanical strength of the coating film, so it can be selected according to the purpose.
  • Urethane resin binders have the advantage of being able to design from thin films with high strength and heat resistance to flexible and elastic thin films.
  • the urethane resin may be a polyol.
  • the polyols include acrylic polyol, caprolactone polyol, epoxy polyol, ester polyol, ether polyol, polycarbonate polyol, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, ethylene glycol, diethylene glycol, 1,3-butanediol, 1 ,4-butanediol, neopentylglycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl-1,5-pentanediol, 1 ,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8-decane
  • the polyether polyol is water, low molecular weight polyol (propylene glycol, ethylene glycol, glycerin, trimethylolpropane, pentaerythritol, etc.), bisphenols (bisphenol A, etc.), dihydroxybenzene (catechol, resorcin, hydroquinone, etc.) etc.) as an initiator, obtained by addition polymerization of an alkylene oxide selected from ethylene oxide, propylene oxide or butylene oxide. Specific examples include polyethylene glycol, polypropylene glycol, and polytetramethylene glycol.
  • the polycaprolactone polyol is a caprolactone-based polyester diol obtained by ring-opening polymerization of cyclic ester monomers such as ⁇ -caprolactone or ⁇ -valerolactone.
  • An example thereof is a polycarbonate polyol obtained by polycondensation of the polyol component and phosgene, the polyol component and dimethyl carbonate, diethyl carbonate, dipropyl carbonate, diisopropyl carbonate, dibutyl carbonate, ethyl butyl carbonate, ethylene carbide
  • Polycarbonate polyols obtained by transesterification and condensation of diester carbonates such as bonate, propylene carbonate, diphenyl carbonate or dibenzyl carbonate, copolymer polycarbonate polyols obtained by using two or more of the above polyol components in combination, and various polycarbonates described above polycarbonate polyols obtained by esterification of carbonate polyols and carboxyl group
  • any polymer having a hydroxyl group capable of forming a main chain of a polyurethane compound may be used without limitation. Due to the polyol component, excellent reworkability characteristics such as residue reduction can be expressed.
  • polyester polyol which is widely used in polyurethane production, exhibits a disadvantage in that adhesion to a metal interface is poor when used alone, and as a result, it is weak against thermal shock. Therefore, when considering interfacial adhesion, impact resistance, hardness, and curing characteristics, a three-component polyol may be used by mixing acrylic polyol and polyester polyol or adding polylactone polyol to further improve adhesion and impact resistance.
  • the type and mixing ratio of resin can be variously selected in consideration of strength, hardness, and heat resistance (Tg) according to the requirements of the properties of the coating film.
  • the diisocyanate-based curing agent is preferably a polyfunctional aliphatic isocyanate compound.
  • an aromatic isocyanate compound or an alicyclic isocyanate compound is used, it hardens within 1 hour, so if sufficient time is not secured for heat dissipation coating, there is a problem in that usability is deteriorated. Since the aliphatic isocyanate compound has low reactivity, it does not harden for more than 6 hours, so the usability of the paint is improved.
  • the curing temperature can be fired within 15 minutes to 1 hour, 20 minutes to 40 minutes at 70 ° C to 100 ° C, 75 ° C to 90 ° C. In the case of a heat-dissipating paint composition used for electronic parts, it is preferable that the firing temperature of the heat-dissipating paint is within 100 degrees Celsius because problems may occur in electronic parts when the firing temperature exceeds 100 °C.
  • the diisocyanate-based curing agent specifically, hexamethylene diisocyanate (HDI), trimethylene diisocyanate, tetramethylene diisocyanate, 1,2-propylene diisocyanate (1,2 - Propylene diisocyanate), 1,3-butylene diisocyanate, dodecamethylene diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate (2,4,4-trimethylhexamethylene diisocyanate), but is not limited thereto.
  • HDI hexamethylene diisocyanate
  • trimethylene diisocyanate trimethylene diisocyanate
  • tetramethylene diisocyanate 1,2-propylene diisocyanate
  • 1,3-butylene diisocyanate 1,3-butylene diisocyanate
  • dodecamethylene diisocyanate 2,4,4-trimethylhexamethylene diisocyanate (2,4,4-trimethylhexamethylene diisocyanate
  • the composition includes ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1, 3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl
  • a spacer selected from the group consisting of -1,8-octanediol, 1,8-decanediol, octanedecanediol, glycerin, trimethylolpropane, pentaerythritol, and hexanetriol may be used. It is possible to control the length of the
  • the composition may use a curing catalyst that is dibutyl tin dilaurate.
  • the epoxy resin is not particularly limited as long as it exhibits a curing and bonding action, but as a solid or close-to-solid epoxy, an epoxy resin having one or more functional groups is preferred.
  • the epoxy resin is a bisphenol-based epoxy, a phenol novolac-based epoxy, an o-cresol novolac-based epoxy, a multifunctional epoxy, an amine-based epoxy, a heterocyclic epoxy, a substituted epoxy, a naphthol-based epoxy Epoxy can be exemplified, and more specifically, as an example of an epoxy-type compound, a bisphenol A epoxy resin and an epichlorhydrin-type epoxy resin.
  • Ethylene glycol glycidyl ether polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl Cidylaniline, diglycidylamine, N,N,N',N'-tetraglycidyl-m-xylenediamine and 1,3-bis(N,N'-diglycidylaminemethyl)cyclohexane It may be at least one or more selected from the group consisting of.
  • YDCN-704 examples of the multifunctional epoxy resin include Epon 1031S from Yuka Shell Epoxy Co., Ltd., Araldite 0163 from Ciba Specialty Chemicals Co., Ltd., Detacol EX-611 from Naga Celsius Chemical Co., Ltd., Detacol EX-614, and Detacol.
  • Detacol EX-614B Detacol EX-622, Detacol EX-512, Detacol EX-521, Detacol EX-421, Detacol EX-411, Detacol EX-321, etc. Sumitomo Chemical Co., Ltd.'s ELM-120, Yukashell Epoxy Co., Ltd.
  • Epicoat 604 There are YH-434 of Dokdo Chemical Co., Ltd., TETRAD-X and TETRAD-C of Mitsubishi Gas Chemical Co., Ltd., PT-810 of Civas Specialty Chemical Co., Ltd. as a heterocyclic epoxy resin, and ERL- of UCC as a substitution type epoxy. 4234, ERL-4299, ERL-4221, ERL-4206, and naphthol-based epoxies include Epiclone HP-4032, Epiclone HP-4032D, Epiclone HP-4700, and Epiclone 4701 of Daenippon Ink Chemicals. , These can be used individually or in mixture of two or more types.
  • amine-based curing agent examples include hexamethylenediamine, triethyldiamine, polyethyleneimine, hexamethylenetetramine, diethylenetriamine, triethyltetramine, isoformdiamine, diethylenetriamine, and triethylenetetramine.
  • the solvent may be selected according to the selected binder resin, curing agent, etc., this is not particularly limited in the present invention, and any solvent capable of properly dissolving each component may be used as the solvent.
  • the solvent may specifically use an organic solvent, and more specifically, N-butyl acetate, acetate, ethyl acetate, amyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol methyl acetate, diethylene glycol At least one selected from the group consisting of ethyl acetate, ethylene glycol monoethyl ether acetate, 3-methoxybutyl acetate, and propylene glycol methyl ether acetate (PGMEA) may be used.
  • PMEA propylene glycol methyl ether acetate
  • the solvent may be 10% to 50% by weight of the heat dissipating paint composition. If the solvent is less than 10% by weight of the heat-dissipating paint composition, the resin does not dissolve well, dispersibility is poor, and the viscosity increases, and if the solvent is greater than 50% by weight, the heat-dissipating paint composition is coated on a substrate Gaps may be formed, and the heat dissipation effect may be reduced.
  • the viscosity can be adjusted by adding a similar amount of the solvent to the resin.
  • the weight ratio of the resin to the solvent may be 1:1.
  • the content of the solvent can be adjusted according to the condition of the spray coater. In the case of bar coating or gravure coating, it may contain less than spray coating, as the viscosity should be slightly higher.
  • the solvent may be volatilized after coating the heat-dissipating paint composition on a substrate, and the heat-dissipating paint composition may be solvent-free after coating and drying. After coating the heat dissipating paint composition on a substrate for heat dissipation, the solvent included in the heat dissipating paint composition may be volatilized and thus the solvent component may not be present.
  • the composition may further include at least one selected from the group consisting of a matting agent, a colorant, an adhesion promoter, a dispersing agent, an antisettling agent, an antifoaming agent, and a leveling agent as an additive.
  • the matting agent is at least one selected from the group consisting of titanium dioxide, airgel silica, hydrogel silica, PP wax, PE wax, PTFE wax, urea formaldehyde resin and benzoguamine formaldehyde resin, preferably titanium dioxide can include
  • the matting agent may be spherical particles having a diameter of 1.0 to 10.0 ⁇ m.
  • the matting agent may be included in 2 to 5% by weight based on the total weight of the composition.
  • the colorant may include at least one selected from the group consisting of talc, zinc oxide, zinc sulfide, metal oxide, hydroxyl, sulfide, azo, nitro, and phthalocyanine, preferably talc.
  • Talc which can be used as the colorant
  • titanium dioxide which can be used as the matting agent, can be used together with the heat radiation filler as a filler to improve withstand voltage characteristics.
  • the above-described heat-dissipating paint composition may further include a dispersant and a solvent for improving the dispersibility of the heat-dissipating filler and realizing a uniform heat-dissipating coating film.
  • the antifoaming agent prevents the generation and retention of air bubbles during mixing of each composition and prevents the generation of air bubbles or craters on the surface of a coating film.
  • the leveling agent may improve the uniformity of the coating film and reduce surface roughness.
  • the heat-dissipating paint composition described above is a pH adjuster, an ion trapping agent, a viscosity modifier, a thixotropy imparting agent, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, a colorant, a dehydrating agent, a flame retardant, an antistatic agent, and an antimold.
  • a pH adjuster an ion trapping agent, a viscosity modifier, a thixotropy imparting agent, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, a colorant, a dehydrating agent, a flame retardant, an antistatic agent, and an antimold.
  • One type or two or more types of various additives such as antiseptics, preservatives, and the like may be added.
  • the various additives described above may be those known in the art and are not particularly limited in the present invention.
  • the above-described heat-dissipating paint composition may further include an antioxidant for preventing discoloration of the coated dry film, brittleness due to oxidation, and deterioration of physical properties such as adhesion strength.
  • the antioxidant may be a known component employed in the art as an antioxidant of a heat-dissipating paint composition.
  • the antioxidant is tri-methylphosphate, tri-phenylphosphate, tris(2,4-di-tert-butylphenyl)phosphate, triethylene glycol-bis-3-(3-tert-butyl-4-hydride) Roxy-5-methylphenyl)propionate, 1,6-hexane-diol-3(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, pentaerythrityl-tetrakis(3- (3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 2-hydroxybenzophenone, 2-hydroxyphenylbenzothiazole, hindered amine, organic nickel compound, salicylate, cinnamate derivatives, resorcinol monobenzoate, oxanilide, and p-hydroxybenzoate may include at least one
  • the antioxidant may preferably be included in an amount of 0.1 to 3% by weight based on the total weight of the composition. If the antioxidant is provided in less than 0.1 parts by weight, discoloration may occur, and if the antioxidant is provided in more than 3 parts by weight, brittleness and adhesive strength may be weakened.
  • the adhesion promoter may be epoxy ester phosphate acid.
  • the adhesion enhancer improves the interfacial adhesion between the coating film and the adherend, and prevents peeling and cracking of the coating film even during thermal shock and long-term use.
  • the adhesion promoter may be included in an amount of 3 to 10% by weight based on the total weight of the composition.
  • the dispersant may be included in an amount of 0.5 to 1.5% by weight based on the total weight of the composition. If it is provided in less than 0.5% by weight, the desired effect may not be expressed, and if the dispersant is provided in excess of 1.5% by weight, the adhesion strength of the adherend is weakened or pinholes and orange peel are formed on the surface of the coating film. (Orange Peel) may occur.
  • the dispersant may be included to increase the dispersibility of the heat dissipating paint composition, to make the density even, and to appropriately adjust the rheology control.
  • the dispersant may be a nonionic surfactant, and cationic surfactants, anionic surfactants, and amphoteric surfactants may be used. Since the polyol has a surfactant effect, a surfactant may not be used, but a nonionic surfactant may be preferably used. When the heat-dissipating paint composition of the present application is stored for 4 weeks or more, the effect of improving the storage stability of the nonionic surfactant is more excellent.
  • the nonionic surfactant is, for example, polyethoxylated alkylphenol phosphoric acid ester, ethoxylated alkylphenol, sulfuric acid ester, ethoxylated castor oil, polyoxyethylene tristyrylphenyl ether, ethoxylated aliphatic alcohol, ethylene oxide / Propylene oxide block copolymer, sodium salt of lignosulfonic acid, disodium salt of sulfuric acid, sodium salt of acrylic acid polymer, sodium salt of dodecyl sulfate, urea-formaldehyde resin, polyethylene glycol mono(tristyrylphenyl) ether, Calcium salt of dodecylbenzene sulfonic acid, sodium stearate, sorbitan monostearate, polyoxyethylene esters of rosin, polyoxyethylene dodecyl monoether, polyoxyethylene-polyoxypropylene block copolymer, polyoxyethylene monolaurate , polyoxyethylene monohex
  • the anionic surfactant is potassium laurate, triethanolamine stearate, sodium lauryl sulfate, sodium dodecyl sulfate, alkyl polyoxyethylene sulfate, sodium alginate, dioctyl sodium sulfosuccinate, phosphatidyl glycerol, phosphatidyl Inositol, phosphatidylserine, phosphatidic acid and salts thereof, glyceryl esters, sodium carboxymethylcellulose, bile acids and salts thereof, cholic acid, deoxycholic acid, glycocholic acid, taurocholic acid, glycodeoxycholic acid, alkyl sulfonates, aryl sulfos nates, alkyl phosphates, alkyl phosphonates, stearic acid and salts thereof, calcium stearate, phosphates, sodium carboxymethylcellulose, dioctylsulfosuccinate, dialkyl est
  • Such cationic surfactants include, but are not limited to, quaternary ammonium compounds, benzalkonium chloride, cetyltrimethylammonium bromide, chitosan, lauryldimethylbenzylammonium chloride, acyl carnitine hydrochloride, alkylpyridinium halide, cetyl pyridinium chloride , cationic lipid, polymethyl methacrylate trimethylammonium bromide, sulfonium compound, polyvinylpyrrolidone-2-dimethylaminoethyl methacrylate dimethyl sulfate, hexadecyltrimethyl ammonium bromide, phosphonium compound, benzyl-di( 2-Chloroethyl)ethylammonium Bromide, Coconut Trimethyl Ammonium Chloride, Coconut Trimethyl Ammonium Bromide, Coconut Methyl Dihydroxyethyl Ammonium Chloride, coconut Meth
  • Zwitterionic surfactants are electrically neutral but possess local positive and negative charges within the same molecule.
  • Suitable zwitterionic surfactants include, but are not limited to, zwitterionic phospholipids.
  • Suitable phospholipids include phosphatidylcholine, phosphatidylethanolamine, diacyl-glycero-phosphoethanolamine (e.g.
  • DMPE dimyristoyl-glycero-phosphoethanolamine
  • DPPE dipalmitoyl-glycero-phosphoethanolamine
  • DSPE distearoyl-glycero-phosphoethanolamine
  • DOPE dioleolyl-glycero-phosphoethanolamine
  • Phospholipid mixtures comprising anionic and zwitterionic phospholipids are Such mixtures include, but are not limited to, lysophospholipids, egg or soybean phospholipids, or any combination thereof.
  • the dispersant may be included to increase the dispersibility of the heat dissipating paint composition, to make the density even, and to appropriately adjust the rheology control.
  • the dispersant may be 0.5% to 1.5% by weight of the heat dissipating paint composition.
  • the filler is not well dispersed, and thus aggregation may increase.
  • the anti-settling agent controls the flowability of the composition and serves to prevent or slow down the sedimentation and caking phenomena of the particles.
  • the anti-settling agent may use a urea-based compound or an amide-based compound, and may prevent sedimentation of thermally conductive particles having a high specific gravity.
  • the heat-dissipating paint composition includes an anti-settling agent dispersed in the binder resin, and in this case, the anti-settling agent may be included in an amount of 0.5 to 1% by weight based on the total weight of the composition.
  • One embodiment of the present application includes preparing a dispersion by milling the heat dissipating paint composition (S1); and preparing a heat-dissipating paint by adding a diisocyanate-based curing agent or an amine-based curing agent to the dispersion (S2); It provides a method for producing a heat dissipating paint comprising a.
  • Preparing the dispersion (S1) may include mixing the heat dissipating paint composition to prepare a dispersion mixture (S11).
  • the composition may be put into a stirrer and stirred for 5 minutes to 6 hours at a speed of, for example, 50 rpm to 1500 rpm. If the stirring time is too short, it is difficult to achieve uniform mixing, and even if the stirring time is too long, it is difficult to expect a more uniform mixing effect.
  • the dispersion mixture is milled to pulverize and exfoliate graphite and other thermally conductive particles to an optimal size to obtain a uniformly dispersed solution.
  • Manufacturing step (S12); may include.
  • the milling may be performed by at least one method selected from the group consisting of ultrasonic, roll milling, ball milling, jet milling, screw mixing, attrition milling, bead milling, basket milling, co-rotational mixing, and super mill.
  • One embodiment of the present application provides a heat-dissipating coating film formed by applying a heat-dissipating paint composition on a substrate and firing at 70 ° C to 120 ° C, preferably 70 ° C to 100 ° C, for 30 minutes to 6 hours.
  • the application may use various methods including at least one selected from the group consisting of spray coating, inkjet printing, roll printing, dipping coating, comma coating, gravure coating, roll-to-roll and bar coating.
  • the thickness of the coating can be used as a heat sink for a light emitting diode or a printed circuit board as well as a heat sink for a high-power device, in consideration of this, it is formed to a thickness of 10 ⁇ m to 50 ⁇ m, more specifically, 20 ⁇ m to 40 ⁇ m. can If the thickness is more than the above, there is a possibility of cost increase and cracking, and if it is less than that, good heat dissipation performance cannot be exhibited.
  • the coating of the heat-dissipating paint composition When the coating of the heat-dissipating paint composition is formed on the substrate, it is thermally cured so that the solvent is volatilized (or evaporated) and the heat-dissipating ink composition is cured.
  • the substrate can be used without limitation for various metal materials such as aluminum and copper, as well as glass and plastic, and has excellent heat dissipation and adhesion, as well as excellent hardness, solvent resistance and water resistance.
  • the drying may be performed at a temperature higher than the temperature at which the solvent volatilizes (or evaporates) and lower than the melting temperature of the substrate. For example, it may be performed at a temperature of 70° C. to 120° C. for 30 minutes to 6 hours. If the thermal curing time is too short, it is difficult to completely remove the solvent, and if the thermal curing time is too long, it may be difficult to expect a further thermal curing effect.
  • the heat-dissipating paint prepared by the heat-dissipating material manufacturing method can emit heat effectively, has a fast heat release rate and high heat emissivity, and emits light by being coated with a heat-dissipating paint composition having excellent adhesion to a three-dimensional substrate. It is very effective in dissipating heat generated from diodes or printed circuit boards.
  • One embodiment of the present application includes a heat-dissipating circuit board including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the circuit board on which elements are mounted with the heat-dissipating paint composition according to the present application.
  • the element may be a known element mounted on a circuit board in an electronic device such as a driving chip.
  • the substrate may be a known circuit board provided in an electronic device, and may be, for example, a PCB or FPCB. Since the size and thickness of the substrate can be changed according to the internal design of the electronic device to be implemented, the present application is not particularly limited thereto.
  • the present application includes a heat dissipation part for lighting including a heat dissipation coating film cured by treating at least a portion of an outer surface of the heat dissipation paint composition according to the present application.
  • the heat dissipation component for lighting may be a heat dissipation heat sink for lighting.
  • the heat dissipation heat sink for lighting may include a heat sink and a heat dissipation coating layer formed on at least a part or all of an outer surface of the heat sink.
  • the heat sink may be a known heat sink provided in lighting. Since the material, size, thickness, and shape of the heat sink can be changed according to the purpose, shape, and internal design of lighting to be realized, the present application is not particularly limited thereto.
  • the heat dissipation paint composition according to the present application is an electronic device component including mobile devices, TVs, wearable devices and flexible devices, LED lamps, ECU (electronic control unit), EV, in addition to the above-described heat dissipation unit, circuit board and lighting parts Automotive parts including batteries and inverters, RF equipment, digital equipment, telecommunications devices including server devices and setup boxes, network devices, solar panels, LEDs and AI/AIN PCBs (Printed Circuit Boards), etc. It can be applied to parts for lighting including devices, lighting cases and sockets.
  • a heat-dissipating busbar for EV high-voltage switching relays a heat-dissipating case for EV high-voltage switching relays, a heat-dissipating DC-DC converter for vehicles, It can be applied to automobile parts including at least one selected from the group consisting of automobile engine cooling devices, automobile LED headlamps, and PTC heaters.
  • the automotive part may be a heat-dissipating bus bar for an EV high-voltage relay including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the heat-dissipating paint composition according to the present application.
  • the EV high voltage relay busbar may be a known EV high voltage relay busbar commonly used in the art, and the material, size, thickness, and shape of the busbar are the desired input of the EV high voltage relay to be implemented. As the voltage and / or output voltage can be changed according to the internal design in consideration, the present application is not particularly limited thereto.
  • the automotive part may be a heat dissipation case for an EV high voltage switching relay including a heat dissipation coating film cured by treating at least a portion of an outer surface of the heat dissipation paint composition according to the present application.
  • the case for the EV high voltage switching relay may be a case for a known EV high voltage relay commonly used in the art.
  • the EV high voltage switching relay case may include the above-described EV high voltage relay busbar, and the material, size, thickness and shape of the case may be determined by the shape and number of busbars located inside the EV high voltage relay to be implemented. As it is possible to change according to the internal design of the present application is not particularly limited thereto.
  • the automotive part may be a heat-dissipating DC-DC converter including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the heat-dissipating paint composition according to the present application.
  • the DC-DC converter functions to convert DC power of a specific voltage into DC power of another voltage, and may be a known DC-DC converter commonly used in the art. Since the size and shape of the DC-DC converter can be changed according to the internal design of a device to be implemented, the present application is not particularly limited thereto.
  • the automotive part may be a heat dissipation engine cooling device including a heat dissipation coating film cured by treating at least a portion of an outer surface of the heat dissipation paint composition according to the present application.
  • a heat dissipation coating film may be formed on a part of a radiator included in the heat dissipation engine cooling device or, for example, a part or all of the radiator included in the heat dissipation engine cooling device.
  • the radiator may be a known radiator commonly used in the art, and since the material, size and shape of the radiator can be changed according to the internal design of the engine cooling device to be implemented, the present application is specifically limited thereto. I never do that.
  • the automotive part may be a heat-dissipating LED headlamp including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the heat-dissipating paint composition according to the present application.
  • the LED headlamp may be a known LED headlamp commonly used in the art, and the material, size and shape of the LED headlamp depend on the design of the vehicle to be implemented and / or the internal design of the LED headlamp. As changes are possible, this application is not particularly limited thereto.
  • the automotive part may be a heat-dissipating PTC heater for an electric vehicle including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the heat-dissipating paint composition according to the present application.
  • the PTC heater may include PTC fins, and as a heat dissipation coating film is formed on some or all of the PTC fins, heat dissipation efficiency may be improved and power consumption of the electric vehicle may be reduced.
  • the PTC pin is in the art
  • PTC pin It may be a known PTC pin that can be commonly used, and since the material, size, and shape of the PTC pin can be changed according to the internal design of the PTC heater to be implemented, the present application is not particularly limited thereto.
  • the heat-dissipating coating composition for forming the heat-dissipating coating film of the present application may improve excellent adhesion between the heat-dissipating coating film and the substrate, improved moisture resistance and weather resistance, and wettability of the heat-dissipating filler.
  • a heat dissipation unit including an insulating heat dissipation coating layer realized with this can continuously express improved physical properties.
  • the dispersibility of the heat-dissipating filler dispersed in the heat-dissipating coating film is excellent, so that uniform insulation and heat dissipation performance can be exhibited. It can be widely applied to electrical and electronic, automobile, energy, and aerospace industries such as circuit boards mounted with various electric and electronic components requiring insulation and heat dissipation, lighting devices such as LED lamps, and display devices.
  • Example 2 It was the same as in Example 1 except that 20 parts by weight of ester polyol (OH value 66, MW 400) was used instead of '20 parts by weight of caprolactone polyol' in Example 1.
  • the viscosity of the final paint was 700 cps.
  • Example 1 It is the same as Example 1 except for 40 parts by weight of acrylic polyol (OH value 90) instead of '20 parts by weight of acrylic polyol (OH value 90), 20 parts by weight of caprolactone polyol (OH value 280, MW 400)' of Example 1.
  • Example 1 It is the same as in Example 1 except for using 9.0 parts by weight of natural impression graphite (average particle size 25 ⁇ m) instead of 9.0 parts by weight of 'expanded graphite (average particle size 50 ⁇ m)' of Example 1.
  • Example 1 It is the same as in Example 1 except that the 'anti-settling agent (urea) 0.5 parts by weight' of Example 1 was not used.
  • Example 1 Same as Example 1 except for 30 minutes of milling instead of 3 hours of Example 1.
  • Example 1 It is the same as Example 1 except that '0.5 parts by weight of a dispersant (phosphoric ester of polyethoxylated alkyl phenol), 1.0 parts by weight of a silicone-based antifoaming agent (AFCONA 2722), and 0.5 parts by weight of an anti-settling agent (urea)' of Example 1 was not used.
  • a dispersant phosphoric ester of polyethoxylated alkyl phenol
  • AFCONA 2722 silicone-based antifoaming agent
  • urea an anti-settling agent
  • Example 1 Same as Example 1 except for 40 parts by weight of BPA-based epoxy resin (YD-128) instead of 'acrylic polyol (OH value 90) 20 parts by weight, caprolactone polyol (OH value 280, MW 400) 20 parts by weight' of Example 1 do.
  • BPA-based epoxy resin YD-128
  • 'acrylic polyol OH value 90
  • caprolactone polyol OH value 280, MW 400
  • Example 1 The paint prepared in Example 1 was used as the subject and coated in the same manner except that TDI was used instead of HDI.
  • Example 1 Except for 2 parts by weight of expanded graphite instead of 9 parts by weight of expanded graphite of Example 1 and 7 parts by weight of carbon black having an average particle size of 0.5 ⁇ m, it was the same as in Example 1.
  • Expanded graphite (average particle size 50 ⁇ m) 9.0 parts by weight, aluminum powder (Flake, average particle size 25 ⁇ m) 4.2 parts by weight, porous SiO 2 (average particle size 4 ⁇ m) 3.2 parts by weight instead of expanded graphite 16.4 parts by weight Same as in Example 1 except for did
  • a heat-dissipating paint composition composed of 50% toluene solvent, 25% urethane binder, 12.5% carbon black, and 12.5% inorganic thermally conductive particles SiO 2 was coated to evaluate heat dissipation performance.
  • HDI hexamethylene diisocyanate
  • the heat dissipating paint prepared in each example 20 parts by weight of the heat dissipating paint prepared in each example so that the amount corresponding to the NCO value of 1.1 was well mixed, and the mixed solution was sprayed on both sides of an aluminum plate in an 80 ° C oven. It was dried and cured for 30 minutes in However, in the case of Example 9, the coating was cured in an oven at 100 ° C. for 3 hours using the same amount of diethylenetriamine as the epoxy group as a curing agent.
  • HDI hexamethylene diisocyanate
  • the temperature inside the chamber was adjusted to 40°C. Both sides of a 1.5 mm aluminum (5000 series) plate of 235 mm and 150 mm in width and length, respectively, were sprayed with the prepared paint and coated to a thickness of 30 ⁇ 5 ⁇ m.
  • the coated aluminum plate was positioned at the center of the acrylic chamber, and a 15W ceramic heater was attached to the aluminum plate using thermal grease. At this time, the surface to which the heater is attached was masked during paint coating so that the paint was not applied. The heater was operated to measure the temperature when the temperature of the heater was in equilibrium.
  • the heat dissipation performance was expressed as the temperature difference (°C) of T1 when the aluminum plate coated with the heat dissipation paint was attached to the aluminum plate.
  • 1(a) is an aluminum plate
  • FIG. 1(b) is an aluminum plate coated with a heat dissipating paint.
  • 2 shows a sample for evaluating heat dissipation performance.
  • a heat dissipation coating film 10 is formed on both sides of an aluminum plate 100 and a ceramic heater 30 is attached using a thermal grease 20 .
  • T1 represents the temperature of the heating element
  • T2 represents the temperature of the outside
  • T3 represents the temperature of the chamber.
  • the prepared paint was left at 20 ° C to measure and evaluate the storability of the paint, and then the heat dissipation performance was measured every week. After stirring the stored paint for 10 minutes at a stirring speed of 300 rpm, a curing agent was added, stirred for another 10 minutes, and then coated to measure heat dissipation performance. The number of times the heat dissipation paint was initially and unchanged was measured.
  • the lead of the MITSUBUSHI hardness measurement pencil is left as it is, and the wood is cut into a length of about 5 to 6 mm, and the tip of the pencil is sharpened and the tip of the pencil is ground with sandpaper.
  • the heat dissipation performance of all examples in Table 1 showed a temperature drop of 3 to 6 ° C. compared to representative heat dissipation paints currently on the market, showing excellent heat dissipation performance. It is believed that graphite is exfoliated during milling, and some of it is dispersed in the binder in the form of GNPs or graphene, resulting in excellent heat dissipation characteristics. Comparing Example 1, Example 6, and Example 7, heat dissipation characteristics of the paint milled for 3 hours were superior to those milled for 30 minutes. This shows that the exfoliation of the expanded graphite continues to occur according to the milling time.
  • Example 4 when comparing Example 4 and Example 8, it can be seen that the heat dissipation characteristics are the same, which can be interpreted as indicating that in the case of natural impression graphite, delamination due to external force does not occur significantly compared to expanded graphite.
  • Examples 11 and 12 show the effect of the expanded graphite content.
  • Example 11 when the expanded graphite content is relatively small as 2 parts by weight, the physical properties of the coating film are the same as in Example 1, but the heat dissipation performance is significantly deteriorated. In contrast, it can be seen that the heat dissipation performance is rather deteriorated even when the expanded graphite amount is 16.4 parts by weight and used in a relatively large amount.
  • Example 7 As an additive effect, it can be seen that when the anti-settling agent is not used in Example 5, the storage property of the paint is noticeably deteriorated. However, what is interesting is that when the anti-settling agent is not used, the heat dissipation performance of the paint is rather improved. It can be seen that the anti-settling agent greatly affects the arrangement of heat dissipating particles in the binder. In particular, in the case of Example 7, when various additives, in particular, dispersants were not used, it could be confirmed that the heat dissipation performance was improved even though the storage stability of the paint was deteriorated. This is contrary to the conventional prediction that an improvement in particle dispersion in a binder leads to an improvement in heat dissipation. That is, in the arrangement of the thermally conductive particles in the binder, it can be said that the heat dissipation efficiency is improved only when the particles have contact and aggregation to some extent.
  • Example 2 it was shown that the ester polyol contains an aromatic component that is structurally stronger than the aliphatic chain, increasing the hardness of the coating film but lowering the adhesiveness.
  • Example 9 it can be seen in Example 9 that there is no difference in heat dissipation performance even when epoxy is used as a binder instead of urethane, and when TDI is used instead of HDI as a urethane curing agent, there is no difference in heat dissipation property, but since the curing agent is an aromatic compound, the coating film is relatively brittle and It has poor adhesive strength and is highly reactive compared to HDI, so it was not easy to secure storage for more than 4 weeks at the same room temperature.
  • heat dissipation efficiency is 10% before milling, 30% after milling for 1 hour, 50% after milling for 2 hours, and 55% after milling for 3 hours. It can be confirmed that this is good and the heat dissipation efficiency is very good when milling for 3 hours or more. In the case of 3 hours or more and 6 hours or less, there was no difference in heat dissipation efficiency. However, in the case of impression graphite, heat dissipation efficiency was 20% before milling, but it was confirmed that heat dissipation efficiency was 25% after 1 hour of milling. Heat radiation efficiency was expressed as temperature reduction efficiency (based on °C) compared to existing commercially available paints.
  • Example 1 the thermal conductivity was measured according to the milling time at 25° C. and is shown in Table 2 below. It can be seen that the thermal conductivity is very excellent when the expanded graphite is milled for 3 hours.
  • Figure 4 shows the expanded graphite before milling
  • Figure 5 shows a SEM picture of expanded graphite after milling for 3 hours
  • Figure 6 shows a TEM picture of expanded graphite after milling for 3 hours.

Abstract

The present application provides a heat sink paint composition comprising, on the basis of the total weight of the composition, 30-60 wt% of binder resin, 10-25 wt% of thermally conductive particles, 5-15 wt% of an additive, and 10-50 wt% of a solvent. The heat sink paint composition of the present application has excellent thermal emissivity.

Description

방열 도료 조성물, 이의 제조방법, 이로부터 형성된 방열 코팅막 및 이를 포함하는 히트씽크Heat-dissipating paint composition, manufacturing method thereof, heat-dissipating coating film formed therefrom, and heat sink including the same
본 출원은 2021년 8월 5일에 한국 특허청에 제출된 한국 특허 출원 제10-2021-0103515호의 출원일의 이익을 주장하며, 그 내용 전부는 본 명세서에 포함된다.This application claims the benefit of the filing date of Korean Patent Application No. 10-2021-0103515 filed with the Korean Intellectual Property Office on August 5, 2021, all of which are incorporated herein.
본 출원은 방열도료 조성물에 관한 것으로, 이 조성물로 금속 기재 표면에 형성한 방열 코팅막 및 이 코팅막을 포함하는 히트씽크에 관한 것이다.The present application relates to a heat-dissipating paint composition, and relates to a heat-dissipating coating film formed on a surface of a metal substrate with the composition and a heat sink including the coating film.
전자제품의 소형화, 박형화, 고성능화에 따라 반도체 칩이나 PCB, 부품의 발열 제어가 더욱 중요해지고 있다. 전자제품의 발열문제 해결 또는 완화를 위해 전통적으로 히트씽크와 냉각팬이 사용되어 왔으나 소음과 진동의 발생 뿐 아니라 슬림화, 고집적화, 대용량화가 전자제품의 개발방향임을 감안하면 전자제품을 디자인함에 있어서 장애가 되기 쉽다. 실제 최근 휴대폰, OLED 디스플레이, 퍼스널 컴퓨터 등과 같은 고성능, 박형 전자제품의 방열부품으로는 두께가 수십 미크론에 불과한 그래파이트 시트나 평판 형태의 금속방열판, 베이퍼챔버 등이 사용되고 있다. 이들 부품들은 수평방향으로 열을 급속히 확산시켜 전자제품 내 국부적인 열축적을 방지함으로써 반도체 칩이나 작은 열점에서의 급격한 온도 상승을 억제한다. With the miniaturization, thinning and high performance of electronic products, heat control of semiconductor chips, PCBs, and components is becoming more important. Heat sinks and cooling fans have traditionally been used to solve or mitigate the heat generation problem of electronic products, but considering that slimming, high integration, and high capacity are the development directions of electronic products, as well as noise and vibration generation, they can be obstacles in designing electronic products. easy. In fact, graphite sheets with a thickness of only a few tens of microns, flat metal heat sinks, and vapor chambers are used as heat dissipation components for high-performance, thin electronic products such as mobile phones, OLED displays, and personal computers. These components rapidly spread heat in the horizontal direction to prevent local heat accumulation in electronic products, thereby suppressing rapid temperature rise in semiconductor chips or small hot spots.
한편 금속 방열판이나 베이퍼챔버의 경우 수평방향의 열확산은 매우 우수하나 수직방향의 열방출은 상대적으로 효율적이지 않다. 이는 금속소재의 열전도율은 높지만 표면 열방사율이 낮기 때문이다. 따라서 금속 성분으로 이루어진 방열판, 히트씽크, 베이퍼챔버 등의 표면은 방열도료로 표면을 처리하여 제품의 전체적인 방열성능을 높인다. On the other hand, in the case of a metal heat sink or vapor chamber, heat diffusion in the horizontal direction is excellent, but heat dissipation in the vertical direction is relatively inefficient. This is because the thermal conductivity of the metal material is high, but the surface thermal emissivity is low. Therefore, the surface of the heat sink, heat sink, vapor chamber, etc. made of metal components is treated with heat dissipation paint to improve the overall heat dissipation performance of the product.
방열도료는 유기,무기 또는 세라믹 바인더 내에 열전도성이 우수한 입자나 필러를 분산하고 일정한 용매를 첨가하여 스프레이, 디핑 등의 공정에 적합한 점도로 제조하여 코팅에 사용한다.Heat-dissipating paint is prepared by dispersing particles or fillers with excellent thermal conductivity in an organic, inorganic, or ceramic binder and adding a certain solvent to a viscosity suitable for processes such as spraying and dipping, and then used for coating.
열전도성 입자 또는 필러에 대하여, 그간 개발 또는 상용화된 방열도료는 대표적으로 탄소계인 흑연(그래파이트), 카본블랙, CNT, 그래핀과 비탄소계인 BN, AlN, SiC 등 고열전도성 입자를 사용하거나 흡수한 열을 원적외선을 방출하는 세라믹 입자를 주성분으로 하여 한 종류를 사용하거나 또는 두 종류 이상을 혼합하여 사용한다. 이들 중 횡방향으로의 열전도도가 매우 높은 CNT는 최근 생산단가가 낮아졌다고 하여도 바인더 내의 효과적인 분산이 어려워 방열효과를 구현하는데 한계가 있다. 또한, 나노물질 특성상 첨가량이 일정 수준 이상일 경우 응집이 발생하고 기재와의 부착력이 떨어지는 등 물성의 급격한 저하가 발생하는 문제가 있다. 특히 그래핀, BN과 같이 소재를 사용한 방열도료는 그 방열성능은 차치하고 아직까지 소재의 양산화가 이루어지고 있지 않아 실제 이들을 사용한 방열도료가 상업적으로 사용되고 있는 예는 알려진 바가 거의 없다. 열전도성이 우수한 소재들 중 가성비가 우수한 흑연을 사용하는 방열도료는 다수 보고되어 있으나 다른 소재들에 비해 방열 성능이 우수한 예는 특별히 보고된 바 없다. Regarding thermally conductive particles or fillers, heat dissipation paints developed or commercialized so far typically use or absorb carbon-based graphite (graphite), carbon black, CNT, and graphene and non-carbon-based high thermal conductivity particles such as BN, AlN, and SiC. Ceramic particles emitting far-infrared rays as the main component use one type or a mixture of two or more types. Among these, CNTs having very high thermal conductivity in the transverse direction have limitations in realizing a heat dissipation effect because effective dispersion in the binder is difficult even though the production cost has recently been lowered. In addition, due to the nature of the nanomaterial, when the amount of addition is above a certain level, there is a problem in that aggregation occurs and physical properties are rapidly deteriorated, such as a decrease in adhesion to the substrate. In particular, apart from the heat dissipation performance of heat dissipation paints using materials such as graphene and BN, mass production of materials has not yet been achieved, so there are few known examples of heat dissipation paints using these materials commercially. Among the materials with excellent thermal conductivity, many heat dissipation paints using graphite with excellent cost performance have been reported, but no example with excellent heat dissipation performance compared to other materials has been reported.
그러므로, 방열 성능이 우수하고, 경도나 내구성들이 우수한 방열 도료의 개발이 필요하였다.Therefore, it is necessary to develop a heat dissipation paint having excellent heat dissipation performance and excellent hardness and durability.
본 출원의 일 측면은 금속 기재 표면의 전처리 없이 일회 코팅으로 방열성, 접착성, 경도, 내구성 등이 우수한 코팅층을 형성할 수 있는 방열 도료 조성물을 제공하는 것이다. One aspect of the present application is to provide a heat dissipation paint composition capable of forming a coating layer having excellent heat dissipation properties, adhesion, hardness, durability, etc. by one-time coating without pretreatment of the surface of a metal substrate.
본 출원의 일 측면은 상기 방열 도료 조성물의 제조방법을 제공하는 것이다. One aspect of the present application is to provide a method for preparing the heat dissipating paint composition.
본 출원의 일 측면은 상기 방열 도료 조성물을 이용하여 형성한 방열 코팅막을 제공하는 것이다. One aspect of the present application is to provide a heat-dissipating coating film formed using the heat-dissipating paint composition.
본 출원의 일 측면은 상기 방열 도료 조성물을 이용하여 형성한 방열 코팅막을 포함하는 히트씽크를 제공하는 것이다. One aspect of the present application is to provide a heat sink including a heat-dissipating coating film formed using the heat-dissipating paint composition.
본 출원의 해결 과제는 이상에서 언급된 것들에 한정되지 않으며, 언급되지 아니한 다른 해결과제들은 아래의 기재로부터 당업자에게 명확하게 이해될 수 있을 것이다.The problem of the present application is not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.
본 출원의 하나의 실시예는, 조성물 총 중량을 기준으로, 바인더 수지 30 내지 60 중량%; 열전도성 입자 10 내지 25 중량%; 첨가제 5 내지 15 중량 %; 및 용제 10 내지 50 중량%; 를 포함하는 방열도료 조성물을 제공한다. One embodiment of the present application, based on the total weight of the composition, 30 to 60% by weight of the binder resin; 10 to 25% by weight of thermally conductive particles; 5 to 15% by weight of additives; and 10 to 50% by weight of a solvent; It provides a heat dissipation paint composition comprising a.
본 출원의 하나의 실시예에서 상기 바인더 수지는, 우레탄 수지 또는 에폭시 수지를 포함하고, 상기 열전도성 입자는, 팽창흑연, 인상흑연, 인조흑연 및 토상흑연으로 이루어진 군에서 선택되는 적어도 하나 이상의 흑연; 및 금속 입자; 를 포함할 수 있다. In one embodiment of the present application, the binder resin includes a urethane resin or an epoxy resin, and the thermally conductive particles include at least one graphite selected from the group consisting of expanded graphite, impression graphite, artificial graphite, and earthy graphite; and metal particles; can include
본 출원의 하나의 실시예에서 상기 조성물은, 1시간 내지 6시간 동안 밀링하여 흑연에서 그래핀나노플레이트(GNP: graphene nanoplate) 또는 그래핀이 분리되도록 박리시킨 것이다. 구체적으로 상기 조성물은, 밀링하여 팽창흑연에서 그래핀나노플레이트(GNP: graphene nanoplate) 또는 그래핀이 분리되도록 박리시킨 것이다. In one embodiment of the present application, the composition is milled for 1 hour to 6 hours to separate graphene nanoplates (GNPs) or graphene from graphite. Specifically, the composition is exfoliated to separate graphene nanoplates (GNPs) or graphene from expanded graphite by milling.
상기 조성물은, 밀링 후 흑연 입자, 그래핀나노플레이트 입자, 및 그래핀 입자 중 둘 이상을 포함하거나, 이들 모두를 포함할 수 있다. 상기 밀링 후 흑연 입자, 그래핀나노플레이트(GNP: graphene nanoplate) 입자 또는 그래핀 입자의 직경은 0.1 μm 내지 50 μm 일 수 있다. The composition may include two or more of graphite particles, graphene nanoplate particles, and graphene particles after milling, or all of them. After the milling, the graphite particles, graphene nanoplate (GNP) particles, or graphene particles may have a diameter of 0.1 μm to 50 μm.
본 출원의 하나의 실시예에서 상기 밀링 비드는, 0.05 mm 내지 3.0 mm 직경의 지르코니아일 수 있다. In one embodiment of the present application, the milling bead may be zirconia having a diameter of 0.05 mm to 3.0 mm.
본 출원의 하나의 실시예에서 상기 조성물은 디이소시아네이트계 경화제 또는 아민계 경화제를 첨가하여 경화시킬 수 있다. In one embodiment of the present application, the composition may be cured by adding a diisocyanate-based curing agent or an amine-based curing agent.
본 출원의 하나의 실시예에서 상기 팽창측연은, 산 처리 후 열처리에 의해서 층간 팽창이 이루어진 흑연일 수 있다. In one embodiment of the present application, the expansion side edge may be graphite in which interlayer expansion is performed by heat treatment after acid treatment.
본 출원의 하나의 실시예에서 상기 조성물의 점도는, 300 cps 이상 내지 1500 cps 이하일 수 있다. In one embodiment of the present application, the composition may have a viscosity of 300 cps or more to 1500 cps or less.
본 출원의 하나의 실시예에서 상기 조성물은, 디부틸틴디라우레이트인 경화 촉매; 및 에틸렌글리콜, 프로필렌글리콜, 디에틸렌글리콜, 1,3-부탄디올, 1,4-부탄디올, 네오펜틸글리콜, 3-메틸-1,5-펜탄디올, 2-부틸-2-에틸-1,3-프로판디올, 2,4-디에틸-1,5-펜탄디올, 1,2-헥산디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 2-메틸-1,8-옥탄디올, 1,8-데칸디올, 옥탄데칸디올, 글리세린, 트리메틸올프로판, 펜타에리트리톨 및 헥산트리올로 이루어진 군에서 선택되는 스페이서; 를 더 포함할 수 있다. In one embodiment of the present application, the composition is a dibutyl tin dilaurate curing catalyst; and ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3- Propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1 a spacer selected from the group consisting of 8-octanediol, 1,8-decanediol, octanedecanediol, glycerin, trimethylolpropane, pentaerythritol and hexanetriol; may further include.
본 출원의 하나의 실시예에서 상기 금속 입자는, 알루미늄, 철, 동, 아연, 주석, 티탄, 니켈, 안티몬, 마그네슘, 바나듐, 크롬 및 지르코늄으로 이루어지는 군에서 선택되는 적어도 하나 이상이고, 직경 5~40 μm 크기의 후레이크 타입일 수 있다. In one embodiment of the present application, the metal particles are at least one selected from the group consisting of aluminum, iron, copper, zinc, tin, titanium, nickel, antimony, magnesium, vanadium, chromium, and zirconium, and have a diameter of 5 to It may be a flake type with a size of 40 μm.
본 출원의 하나의 실시예에서 상기 열전도성 입자는, 카본블랙, 단일벽탄소나노튜브, 다중벽탄소나노튜브, 그래핀 및 카본파이버로 이루어진 군에서 선택되는 적어도 하나 이상의 탄소; 및 방열 필러; 를 더 포함할 수 있다. In one embodiment of the present application, the thermally conductive particles may include at least one carbon selected from the group consisting of carbon black, single-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, and carbon fibers; and heat dissipating filler; may further include.
본 출원의 하나의 실시예에서 상기 열전도성 입자는, 흑연 5 내지 15 중량%; 금속 입자 1 내지 6 중량%; 및 기타 열전도성 입자 1 내지 5 중량%; 를 포함할 수 있다. In one embodiment of the present application, the thermally conductive particles include 5 to 15% by weight of graphite; 1 to 6% by weight of metal particles; and 1 to 5% by weight of other thermally conductive particles; can include
본 출원의 하나의 실시예에서 상기 우레탄 수지는, 아크릴 폴리올, 카프로락톤 폴리올, 에폭시폴리올, 에스터폴리올, 에테르폴리올, 폴리카보네이트폴리올, 폴리에틸렌글리콜, 폴리프로필렌글리콜, 폴리테트라메틸렌글리콜, 에틸렌글리콜, 디에틸렌글리콜, 1,3-부탄디올, 1,4-부탄디올, 네오펜틸글리콜, 3-메틸-1,5-펜탄디올, 2-부틸-2-에틸-1,3-프로판디올, 2,4-디에틸-1,5-펜탄디올, 1,2-헥산디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 2-메틸-1,8-옥탄디올, 1,8-데칸디올, 옥탄데칸디올, 글리세린, 트리메틸올프로판, 펜타에리트리톨, 헥산트리올 및 폴리프로필렌글리콜로 이루어진 군에서 선택되는 적어도 하나 이상일 수 있다. In one embodiment of the present application, the urethane resin is acrylic polyol, caprolactone polyol, epoxy polyol, ester polyol, ether polyol, polycarbonate polyol, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, ethylene glycol, diethylene Glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl -1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8 - It may be at least one selected from the group consisting of decanediol, octanedecanediol, glycerin, trimethylolpropane, pentaerythritol, hexanetriol, and polypropylene glycol.
본 출원의 하나의 실시예에서 상기 에폭시 수지는, 비스페놀계 에폭시, 페놀 노볼락(Phenol novolac)계 에폭시, o-크레졸 노볼락(Cresol novolac)계 에폭시, 다관능 에폭시, 아민계 에폭시, 복소환 함유 에폭시, 치환형 에폭시, 나프톨계 에폭시, 비스페놀 A 에폭시 수지, 에피클로르히드린형의 에폭시 수지. 에틸렌글리콜 글리시딜 에테르, 폴리에틸렌글리콜 디글리시딜에테르, 글리세린 디글리시딜에테르, 글리세린 트리글리시딜에테르, 1,6-헥산디올 디글리시딜에테르, 트리메틸올프로판 트리글리시딜에테르, 디글리시딜아닐린, 디글리시딜아민, N,N,N',N'-테트라글리시딜-m-크실렌디아민 및 1,3-비스(N,N'-디글리시딜아민메틸)시클로헥산으로 이루어진 군에서 선택되는 적어도 하나 이상일 수 있다. In one embodiment of the present application, the epoxy resin is a bisphenol-based epoxy, a phenol novolac-based epoxy, an o-cresol novolac-based epoxy, a multifunctional epoxy, an amine-based epoxy, or a heterocycle containing Epoxy, substitution type epoxy, naphthol type epoxy, bisphenol A epoxy resin, epichlorhydrin type epoxy resin. Ethylene glycol glycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl Cidylaniline, diglycidylamine, N,N,N',N'-tetraglycidyl-m-xylenediamine and 1,3-bis(N,N'-diglycidylaminemethyl)cyclohexane It may be at least one or more selected from the group consisting of.
본 출원의 하나의 실시예에서 상기 우레탄 바인더를 형성하는 상기 디이소시아네이트계 경화제는, 헥사메틸렌디이소시아네이트(Hexamethylene diisocyanate, HDI), 트리메틸렌디이소시아네이트(Timethylene diisocyanate), 테트라메틸렌디이소시아네이트(Tetramethylene diisocyanate), 1,2-프로필렌디이소시아네이트(1,2- propylene diisocyanate), 1,3-부틸렌디이소시아네이트(1,3-butylene diisocyanate), 도데카메틸렌디이소시아네이트(dodecamethylene diisocyanate) 및 2,4,4-트리메틸헥사메틸렌디이소시아네이트(2,4,4-trimethylhexamethylene diisocyanate)로 이루어지는 군에서 선택되는 적어도 하나 이상일 수 있다. In one embodiment of the present application, the diisocyanate-based curing agent forming the urethane binder includes hexamethylene diisocyanate (HDI), trimethylene diisocyanate, tetramethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butylene diisocyanate, dodecamethylene diisocyanate and 2,4,4-trimethylhexa It may be at least one selected from the group consisting of methylene diisocyanate (2,4,4-trimethylhexamethylene diisocyanate).
본 출원의 하나의 실시예에서, 상기 에폭시 수지의 아민계 경화제는, 헥사메틸렌디아민, 트리에틸디아민, 폴리에틸렌이민, 헥사메틸렌테트라민, 디에틸렌트리아민, 트리에틸테트라민, 이소포름디아민, 디에틸렌트리아민(Diethylene Triamine), 트리에틸렐테트라아민(Triethylene Tetramine), 디에틸아미노프로필아민(Diethylamino propyl amine), 멘탄디아민 (Menthane diamine), N-아미노에틸피페라진 (N-aminoethylpiperazine), M-자일렌디아민 (M-xylene diamine), 이소포론디아민 (Isophorone diamine), N,N'-디-터트-부틸에틸렌디아민(N,N'-di-tert-butylethylenediamine), N,N-디-이소-프로필에틸렌디아민(N,N-di-iso-propylethylene-diamine), N,N'-디이소프로필-1,3-프로판디아민(N,N'-diisopropyl-1,3-propanediamine), 및 비스(2,2,6,6-테트라메틸-4-피페리딜)세바케이트(bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate)으로 이루어지는 군에서 선택되는 적어도 하나 이상일 수 있다.In one embodiment of the present application, the amine-based curing agent for the epoxy resin is hexamethylenediamine, triethyldiamine, polyethyleneimine, hexamethylenetetramine, diethylenetriamine, triethyltetramine, isoformdiamine, diethylene Diethylene Triamine, Triethylene Tetramine, Diethylamino propyl amine, Menthane diamine, N-aminoethylpiperazine, M-Xyl M-xylene diamine, Isophorone diamine, N,N'-di-tert-butylethylenediamine, N,N-di-iso- Propylethylenediamine (N,N-di-iso-propylethylene-diamine), N,N'-diisopropyl-1,3-propanediamine (N,N'-diisopropyl-1,3-propanediamine), and bis( It may be at least one selected from the group consisting of 2,2,6,6-tetramethyl-4-piperidyl) sebacate (bis(2,2,6,6-tetramethyl-4-piperidyl) sebacate).
본 출원의 하나의 실시예에서, 상기 용제는, N-부틸아세테이트, 아세테이트, 에틸아세테이트, 아밀아세테이트, 메틸셀로솔브아세테이트, 에틸셀로솔브아세테이트, 디에틸렌글리콜메틸아세테이트, 디에틸렌글리콜에틸아세테이트, 에틸렌글리콜모노에틸에테르아세테이트 및 3-메톡시부틸아세테이트, 프로필렌글리콜메틸에테르아세테이트(PGMEA)로 이루어지는 군에서 선택되는 적어도 하나 이상일 수 있다. In one embodiment of the present application, the solvent is N-butyl acetate, acetate, ethyl acetate, amyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol methyl acetate, diethylene glycol ethyl acetate, It may be at least one selected from the group consisting of ethylene glycol monoethyl ether acetate, 3-methoxybutyl acetate, and propylene glycol methyl ether acetate (PGMEA).
본 출원의 하나의 실시예에서, 상기 열전도성 입자 중 방열 필러는, 알루미나, 산화알루미늄, 산화마그네슘, 산화아연, 탄화규소, 질화알루미늄, 질화붕소, 질화규소, 수산화알루미늄, 수산화마그네슘, 보론카바이드, 지르코니아, 실리콘나이트라이드, 티탄산바륨, 티탄산스트론튬, 산화베릴륨, 산화망간, 산화지르코니아, 산화붕소 및 산화규소로 이루어진 군에서 선택되는 적어도 하나 이상일 수 있다. In one embodiment of the present application, the heat dissipating filler among the thermally conductive particles is alumina, aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, aluminum nitride, boron nitride, silicon nitride, aluminum hydroxide, magnesium hydroxide, boron carbide, and zirconia. , silicon nitride, barium titanate, strontium titanate, beryllium oxide, manganese oxide, zirconia oxide, boron oxide, and may be at least one selected from the group consisting of silicon oxide.
본 출원의 하나의 실시예에서, 상기 첨가제는, 소광제, 착색제, 접착증진제, 분산제, 침강방지제, 소포제 및 레벨링제로 이루어진 군에서 선택되는 적어도 하나 이상을 포함할 수 있다. In one embodiment of the present application, the additive may include at least one selected from the group consisting of a matting agent, a colorant, an adhesion promoter, a dispersing agent, an antisettling agent, an antifoaming agent, and a leveling agent.
본 출원의 하나의 실시예에서, 상기 분산제는, 폴리에톡실화 알킬페놀의 인산에스테르, 에톡실화 알킬페놀, 에톡실화 피마자유, 폴리옥시에틸렌트리스티릴페닐에테르, 에톡실화 지방족알코올, 에틸렌옥사이드/프로필렌옥사이드 블록코폴리머, 리그노술폰산의 소듐염, 황산의 이나트륨염, 아크릴산 중합체의 나트륨염, 도데실설페이트의 나트륨염, 우레아-포름알데히드 수지, 폴리에틸렌글리콜모노(트리스티릴페닐)에테르, 도데실 벤젠 술폰산의 칼슘염, 나트륨 스테아레이트, 소르비탄 모노스테아레이트, 로진의 폴리옥시에틸렌 에스테르, 폴리옥시에틸렌 도데실 모노 에테르, 폴리옥시에틸렌-폴리옥시프로필렌 블록 공중합체, 폴리옥시에틸렌 모노라우레이트, 폴리옥시에틸렌 모노헥사데실 에테르, 폴리옥시에틸렌 모노올레이트, 폴리옥시에틸렌 모노(시스-9-옥타데세닐)에테르, 폴리옥시에틸렌 모노스테아레이트, 폴리옥시에틸렌 모노옥타데실 에테르, 폴리옥시에틸렌 디올레이트, 폴리옥시에틸렌 디스테아레이트, 폴리옥시에틸렌 소르비탄 모노라우레이트, 폴리옥시에틸렌 소르비탄 모노올레이트, 폴리옥시에틸렌 소르비탄 모노팔미테이트, 폴리옥시에틸렌 소르비탄 모노스테아레이트, 폴리옥시에틸렌 소르비탄 트리올레이트, 폴리옥시에틸렌 소르비탄 트리스테아레이트, 올레산의 폴리글리세롤 에스테르, 폴리옥시에틸렌 소르비톨 헥사스테아레이트, 폴리옥시에틸렌 모노테트라데실 에테르, 폴리옥시에틸렌 소르비톨 헥사올레이트, 지방산, 톨-오일, 소르비톨 헥사에스테르, 에톡실화 피마자 오일, 에톡시화 대두 오일, 에톡실화 폴리옥시에틸렌 소르비톨 테트라올레이트, 글리세롤 및 폴리에틸렌 글리콜 혼합된 에스테르, 폴리글리세롤 에스테르, 모노글리세리드 및 수크로스 에스테르로 이루어지는 군에서 선택되는 적어도 하나 이상일 수 있다. In one embodiment of the present application, the dispersant is a phosphoric acid ester of polyethoxylated alkylphenol, ethoxylated alkylphenol, ethoxylated castor oil, polyoxyethylene tristyrylphenyl ether, ethoxylated aliphatic alcohol, ethylene oxide/ Propylene oxide block copolymer, sodium salt of lignosulfonic acid, disodium salt of sulfuric acid, sodium salt of acrylic acid polymer, sodium salt of dodecyl sulfate, urea-formaldehyde resin, polyethylene glycol mono(tristyrylphenyl) ether, dodecyl Calcium salt of sylbenzene sulfonic acid, sodium stearate, sorbitan monostearate, polyoxyethylene ester of rosin, polyoxyethylene dodecyl mono ether, polyoxyethylene-polyoxypropylene block copolymer, polyoxyethylene monolaurate, Polyoxyethylene monohexadecyl ether, polyoxyethylene monooleate, polyoxyethylene mono(cis-9-octadecenyl)ether, polyoxyethylene monostearate, polyoxyethylene monooctadecyl ether, polyoxyethylene diolate , Polyoxyethylene Distearate, Polyoxyethylene Sorbitan Monolaurate, Polyoxyethylene Sorbitan Monooleate, Polyoxyethylene Sorbitan Monopalmitate, Polyoxyethylene Sorbitan Monostearate, Polyoxyethylene Sorbitan Tri Oleates, polyoxyethylene sorbitan tristearate, polyglycerol esters of oleic acid, polyoxyethylene sorbitol hexastearate, polyoxyethylene monotetradecyl ether, polyoxyethylene sorbitol hexaoleate, fatty acids, tall-oil, sorbitol hexa It may be at least one selected from the group consisting of esters, ethoxylated castor oil, ethoxylated soybean oil, ethoxylated polyoxyethylene sorbitol tetraoleate, glycerol and polyethylene glycol mixed esters, polyglycerol esters, monoglycerides, and sucrose esters. there is.
본 출원의 하나의 실시예에서, 상기 접착증진제는, 에폭시에스터인산(epoxy ester phosphate acid)일 수 있다. In one embodiment of the present application, the adhesion promoter may be epoxy ester phosphate acid.
본 출원의 하나의 실시예에서, 상기 침강방지제는, 우레아계 화합물일 수 있다. In one embodiment of the present application, the anti-settling agent may be a urea-based compound.
본 출원의 하나의 실시예는, 상기 방열 도료 조성물을 밀링하여 분산액을 제조하는 단계(S1); 및 상기 분산액에 디이소시아네이트계 경화제 또는 아민계 경화제를 첨가하여 방열 도료를 제조하는 단계(S2); 를 포함하는 방열도료의 제조방법을 제공한다.One embodiment of the present application includes preparing a dispersion by milling the heat dissipating paint composition (S1); and preparing a heat-dissipating paint by adding a diisocyanate-based curing agent or an amine-based curing agent to the dispersion (S2); It provides a method for producing a heat dissipating paint comprising a.
상기 분산액을 제조하는 단계(S1)는, 상기 방열 도료 조성물을 혼합하여 분산 혼합액을 제조하는 단계(S11); 및 상기 분산 혼합액을 밀링하여 흑연과 기타 열전도성 입자들을 최적 크기로 분쇄, 박리하여 균일하게 분산된 용액을 제조하는 단계(S12);를 포함하는 방열도료의 제조방법을 제공한다.Preparing the dispersion (S1) may include preparing a dispersion mixture by mixing the heat dissipating paint composition (S11); and milling the dispersion mixture to grind and exfoliate graphite and other thermally conductive particles to an optimal size to prepare a uniformly dispersed solution (S12).
본 출원의 하나의 실시예에서, 상기 분산액을 제조하는 단계(S1) 이전에, 흑연에 초음파 처리하는 단계, 또는 초고압 분산기로 흑연을 분산처리하는 단계, 또는 고속전단기로 흑연을 처리하는 단계(S0);를 더 포함할 수 있다. In one embodiment of the present application, before preparing the dispersion (S1), ultrasonic treatment of graphite, or dispersion treatment of graphite with an ultra-high pressure disperser, or processing of graphite with a high-speed shear ( S0); may further include.
본 출원의 하나의 실시예에서 상기 분산액에 디이소시아네이트계 경화제 또는 아민계 경화제를 첨가하여 방열 도료를 제조하는 단계(S2)는. 제조한 용액을 우레탄 바인더인 경우 디이소시아네이트로 혼합하여 균일하게 혼합하는 단계(S2'), 이거나 에폭시 바인더인 경우 아민계 경화제와 혼합하여 방열도료 조성물을 제조하는 단계(S2'')일 수 있다.In one embodiment of the present application, the step (S2) of preparing a heat-dissipating paint by adding a diisocyanate-based curing agent or an amine-based curing agent to the dispersion. It may be a step of uniformly mixing the prepared solution with diisocyanate in case of a urethane binder (S2'), or a step of preparing a heat-dissipating paint composition by mixing with an amine-based curing agent in case of an epoxy binder (S2'').
본 출원의 하나의 실시예는 방열 도료 조성물을 기재 상에 도포하고, 70 ℃ 내지 100 ℃에서 소성하여 형성된 방열 코팅막을 제공한다. One embodiment of the present application provides a heat-dissipating coating film formed by applying a heat-dissipating paint composition on a substrate and firing at 70 °C to 100 °C.
본 출원의 하나의 실시예는 상기 방열 코팅막을 포함하는 히트씽크를 제공한다. One embodiment of the present application provides a heat sink including the heat dissipation coating film.
본 출원의 하나의 실시예에 따른 방열 도료 조성물은 열전도성과 열방사특성이 우수하고, 피코팅면과의 부착력이 우수하고, 코팅층의 강도와 열충격성 등 내구성이 최신의 전자제품과 LED 보드 냉각용 방열판 등에 적합하여 알루미늄 등의 금속표면에 도포할 경우 기존 방열판에 비해 월등한 방열성능을 구현할 수 있는 장점이 있다. The heat-dissipating paint composition according to one embodiment of the present application has excellent thermal conductivity and thermal radiation characteristics, excellent adhesion to the coated surface, and durability such as strength and thermal shock of the coating layer for cooling the latest electronic products and LED boards. It is suitable for heat sinks and has the advantage of implementing superior heat dissipation performance compared to existing heat sinks when applied to a metal surface such as aluminum.
본 출원의 하나의 실시예에 따른 방열 도료 조성물은 1회 코팅으로 우수한 접착력을 지닌 코팅막을 형성하며 방열부품의 사용 중 표면으로부터의 박리가 방지되고 외부로부터의 열충격과 염수분무에 높은 내구성을 유지한다. The heat-dissipating paint composition according to one embodiment of the present application forms a coating film with excellent adhesion with one coating, prevents peeling from the surface of the heat-dissipating part during use, and maintains high durability against thermal shock and salt spray from the outside. .
본 출원의 하나의 실시예에 따른 방열 도료 조성물은 알루미늄 등 각종 금속 방열부품을 포함한 방열이 요구되는 금속표면 처리에 사용될 수 있는 장점이 있다. The heat dissipation paint composition according to one embodiment of the present application has the advantage of being able to be used for metal surface treatment requiring heat dissipation including various metal heat dissipation parts such as aluminum.
본 출원에 따른 효과는 이상에서 예시된 내용에 의해 제한되지 않으며, 더욱 다양한 효과들이 본 명세서 내에 포함되어 있다.Effects according to the present application are not limited by the contents exemplified above, and various more effects are included in the present specification.
도 1(a)는 알루미늄 판을 나타낸 것이고, 도 1(b)는 방열도료가 코팅된 알루미늄 판을 나타낸 것이다. 1(a) shows an aluminum plate, and FIG. 1(b) shows an aluminum plate coated with a heat dissipating paint.
도 2는 방열성능을 평가하기 위한 샘플을 나타낸 것이다. 2 shows a sample for evaluating heat dissipation performance.
도 3은 실시예 1과 실시예 4의 조성물의 밀링 시간에 따른 방열 효율의 측정 결과를나타낸 것이다. Figure 3 shows the measurement results of the heat dissipation efficiency according to the milling time of the compositions of Examples 1 and 4.
도 4는 밀링 전의 팽창흑연을 나타낸 것이다. 4 shows expanded graphite before milling.
도 5는 3시간 밀링 후 팽창흑연의 SEM 사진을 나타낸 것이다.5 shows a SEM picture of expanded graphite after milling for 3 hours.
도 6은 3시간 밀링 후 팽창흑연의 TEM 사진을 나타낸 것이다. 6 shows a TEM image of expanded graphite after milling for 3 hours.
본 출원의 이점 및 특징, 그리고 그것들을 달성하는 방법은 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 출원은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 수 있으며, 단지 본 실시예들은 본 출원의 개시가 완전하도록 하고, 본 출원이 속하는 기술분야에서 통상의 지식을 가진 자에게 출원의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 출원은 청구항의 범주에 의해 정의될 뿐이다. 명세서 전체에 걸쳐 동일 참조 부호는 동일 구성 요소를 지칭한다.Advantages and features of the present application, and how to achieve them, will become clear with reference to the embodiments described below in detail. However, the present application is not limited to the embodiments disclosed below and may be implemented in various different forms, but only the present embodiments make the disclosure of the present application complete, and common knowledge in the art to which this application belongs. It is provided to fully inform the person who has the scope of the application, and this application is only defined by the scope of the claims. Like reference numbers designate like elements throughout the specification.
다른 정의가 없다면, 본 명세서에서 사용되는 모든 용어(기술 및 과학적 용어를 포함)는 본 출원이 속하는 기술분야에서 통상의 지식을 가진 자에게 공통적으로 이해될 수 있는 의미로 사용될 수 있을 것이다. 또 일반적으로 사용되는 사전에 정의되어 있는 용어들은 명백하게 특별히 정의되어 있지 않는 한 이상적으로 또는 과도하게 해석되지 않는다.Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used in a meaning commonly understood by those of ordinary skill in the art to which this application belongs. In addition, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless explicitly specifically defined.
본 명세서에서 사용된 용어는 실시예들을 설명하기 위한 것이며 본 출원을 제한하고자 하는 것은 아니다. 본 명세서에서, 단수형은 문구에서 특별히 언급하지 않는 한 복수형도 포함한다. 명세서에서 사용되는 "포함한다(comprises)" 및/또는 "포함하는(comprising)"은 언급된 구성요소 외에 하나 이상의 다른 구성요소의 존재 또는 추가를 배제하지 않는다. Terminology used herein is for describing the embodiments and is not intended to limit the present application. In this specification, singular forms also include plural forms unless specifically stated otherwise in a phrase. As used herein, "comprises" and/or "comprising" does not exclude the presence or addition of one or more other elements other than the recited elements.
본 명세서에 있어서, 「~」로 나타나는 수치 범위는 「이상」, 「이하」를 의미한다. 예를 들면, 2~15mm과의 표기는 2mm 이상 15mm 이하를 의미한다.In this specification, the numerical range represented by "-" means "above" and "below". For example, notation with 2 to 15 mm means 2 mm or more and 15 mm or less.
본 출원의 하나의 실시예는, 방열도료 조성물에 있어서, 조성물 총 중량을 기준으로, 바인더 수지 30 내지 60 중량%; 열전도성 입자 10 내지 25 중량%; 첨가제 5 내지 15 중량 %; 및 용제 10 내지 50 중량%; 을 포함하는 방열도료 조성물을 제공한다. One embodiment of the present application, in the heat dissipation paint composition, based on the total weight of the composition, 30 to 60% by weight of the binder resin; 10 to 25% by weight of thermally conductive particles; 5 to 15% by weight of additives; and 10 to 50% by weight of a solvent; It provides a heat dissipation paint composition comprising a.
본 출원의 하나의 실시예에서 상기 바인더 수지는, 우레탄 수지, 에폭시 수지 및 폴리에스터 중 적어도 하나 이상을 포함한다.In one embodiment of the present application, the binder resin includes at least one or more of a urethane resin, an epoxy resin, and polyester.
상기 열전도성 입자는, 팽창흑연, 인상흑연, 인조흑연 및 토상흑연으로 이루어진 군에서 선택되는 적어도 하나 이상의 흑연을 포함할 수 있다. 바람직하게는 팽창흑연일 수 있다. The thermally conductive particles may include at least one graphite selected from the group consisting of expanded graphite, impression graphite, artificial graphite, and earthy graphite. Preferably, it may be expanded graphite.
상기 팽창흑연은 밀링, 초고압분산, 초음파 등과 같은 다양한 공정을 통해 그래핀 나노플레이트(GNP) 또는 그래핀으로 박리될 수 있다. GNP는 흑연을 구성하는 그래핀 층 간의 박리가 이루어져 그래핀 수백층으로 이루어진 상태를 일컫는다. 팽창흑연은 흑연의 그래핀 층간 공간이 벌어져 외력이 가해질 때 층간 박리가 발생하기 쉬워 결과적으로 그래핀과 GNP가 일정부분 생성된다. 본 발명에서는 초고압분산기나 초음파를 이용하여 팽창흑연을 미리 박리 처리한 후 바인더와 기타 입자 및 첨가제와 혼합하여 혼합-밀링 공정으로 처리하여 방열도료를 제조할 수 있고, 별도의 전처리 박리공정 없이 바인더 등 다른 성분들과 혼합 후 밀링공정만으로도 박리가 발생할 수 있음을 확인하였다. 밀링공정에 있어서 밀링속도와 밀링 비드(bead)로 사용한 지르코니아(ZrO2)의 크기가 박리에 영향을 미치고. 지르코니아의 직경은 0.05 mm 내지 3.0 mm 가 바람직하다. 또한, 지르코니아의 직경은 0.1 ~ 2.0 mm가 더욱 바람직하다. 0.1 ~ 2.0 mm 크기의 밀링 비드일 경우 2시간 내지 4시간 동안 밀링하여도 흑연의 박리 효과가 우수하다는 장점이 있다. The expanded graphite may be exfoliated into graphene nanoplates (GNPs) or graphene through various processes such as milling, ultra-high pressure dispersion, and ultrasonic waves. GNP refers to a state composed of hundreds of graphene layers by exfoliation between graphene layers constituting graphite. Expanded graphite is easily separated between layers when an external force is applied due to the widening of the space between the graphene layers of the graphite, and as a result, a certain portion of graphene and GNP are generated. In the present invention, the expanded graphite is pre-exfoliated using an ultra-high pressure disperser or ultrasonic waves, and then mixed with a binder, other particles and additives, and treated in a mixing-milling process to produce a heat-dissipating paint, and without a separate pre-treatment and exfoliation process, the binder, etc. It was confirmed that peeling could occur only through the milling process after mixing with other components. In the milling process, the milling speed and the size of zirconia (ZrO 2 ) used as milling beads affect exfoliation. The diameter of zirconia is preferably 0.05 mm to 3.0 mm. Further, the diameter of zirconia is more preferably 0.1 to 2.0 mm. In the case of milling beads having a size of 0.1 to 2.0 mm, the graphite exfoliation effect is excellent even after milling for 2 to 4 hours.
본 출원의 하나의 실시예에서 상기 흑연은, 1시간 내지 6시간 동안, 구체적으로 2시간 내지 6시간 동안, 더 구체적으로 2시간 내지 5시간 동안 습식 밀링하여 흑연을 박리시킨 것이고, 밀링 후 상기 흑연 입자의 직경은 0.1 μm 내지 50 μm일 수 있다. 본 발명에서는 3 μm 내지 100 μm 직경의 팽창흑연을 2~4시간 밀링 후에는 0.1 μm 내지 50 μm로 파쇄 및 박리되는 것으로 확인하였다. 인상흑연과 토상흑연과 같은 천연흑연은 팽창흑연에 비해 밀링 시간을 짧게 할 수 있으며 충분한 밀링 시간을 유지하여도 흑연의 층간박리가 쉽게 일어나지 않아 방열효율은 밀링시간에 따라 큰 변화가 없다. 그러나 천연흑연은 팽창흑연에 비해 도료의 점도조절이 용이하고 생산성이 우수하다는 장점이 있다. In one embodiment of the present application, the graphite is obtained by exfoliating the graphite by wet milling for 1 hour to 6 hours, specifically for 2 hours to 6 hours, more specifically for 2 hours to 5 hours, and after milling the graphite The diameter of the particles may be between 0.1 μm and 50 μm. In the present invention, it was confirmed that expanded graphite having a diameter of 3 μm to 100 μm was crushed and exfoliated to a size of 0.1 μm to 50 μm after milling for 2 to 4 hours. Compared to expanded graphite, natural graphite such as impression graphite and earth graphite can shorten the milling time, and even if sufficient milling time is maintained, delamination of graphite does not occur easily, so the heat dissipation efficiency does not change significantly depending on the milling time. However, compared to expanded graphite, natural graphite has advantages in that it is easy to control the viscosity of paint and has excellent productivity.
본 출원의 하나의 실시예에서 상기 조성물은 상기 밀링 후에 디이소시아네이트계 경화제 또는 아민계 경화제를 첨가하여 혼합한 것일 수 있다. In one embodiment of the present application, the composition may be mixed by adding a diisocyanate-based curing agent or an amine-based curing agent after the milling.
본 출원의 하나의 실시예에서 상기 팽창흑연은, 산 처리 후 열처리에 의해서 층간 팽창이 이루어진 흑연일 수 있다. In one embodiment of the present application, the expanded graphite may be graphite in which interlayer expansion is performed by heat treatment after acid treatment.
상기 방열 도료 조성물의 점도는 25℃에서 300 cps 이상 내지 1500 cps 이하 일 수 있고, 600 cps 이상, 800 cps 이하의 점도를 가질 수 있다. 점도가 상기 범위 내일 때, 상기 열전도성 입자의 침강 속도와 분산 공정 안정성 면에서 보다 유리할 수 있다. 300 cps 미만일 경우 조성물의 흘러내림 등으로 방열 코팅막의 생성이 어려울 수 있고, 생성 후에도 피코팅면과의 접착력이 약화될 수 있고, 1500 cps를 초과할 경우 얇은 두께의 방열 코팅막으로 제조하기 어렵고, 제조되더라도 표면이 균일하지 않을 수 있으며, 코팅공정이 용이하지 않을 수 있고, 특히 스프레이 방식의 코팅일 경우 더욱 코팅공정이 어려울 수 있다. 또한, 방열 코팅막 내 방열필러의 분산성이 저하될 수 있다.The heat-dissipating paint composition may have a viscosity of 300 cps or more to 1500 cps or less at 25° C., and may have a viscosity of 600 cps or more and 800 cps or less. When the viscosity is within the above range, it may be more advantageous in terms of the sedimentation rate of the thermally conductive particles and the stability of the dispersion process. If it is less than 300 cps, it may be difficult to create a heat-dissipating coating film due to flow of the composition, etc., and even after creation, the adhesive force with the coated surface may be weakened, and if it exceeds 1500 cps, it is difficult to manufacture a thin heat-dissipating coating film. Even if it is, the surface may not be uniform, and the coating process may not be easy, especially in the case of spray-type coating, the coating process may be more difficult. In addition, the dispersibility of the heat-dissipating filler in the heat-dissipating coating film may decrease.
상기 조성물은, 디부틸틴디라우레이트인 경화 촉매를 더 포함할 수 있고, 에틸렌글리콜, 프로필렌글리콜, 디에틸렌 글리콜, 1,3-부탄디올, 1,4-부탄디올, 네오펜틸 글리콜, 3-메틸-1,5-펜탄디올, 2-부틸-2-에틸-1,3-프로판디올, 2,4-디에틸-1,5-펜탄디올, 1,2-헥산디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 2-메틸-1,8-옥탄디올, 1,8-데칸디올, 옥탄데칸디올, 글리세린, 트리메틸올프로판, 펜타에리트리톨 및 헥산트리올로 이루어진 군에서 선택되는 스페이서; 를 더 포함할 수 있다. The composition may further include a curing catalyst that is dibutyltin dilaurate, ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1 ,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1 consisting of 8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8-decanediol, octanedecanediol, glycerin, trimethylolpropane, pentaerythritol and hexanetriol A spacer selected from the group; may further include.
상기 열전도성 입자는, 금속 입자를 포함할 수 있다. 상기 금속 입자는, 알루미늄, 철, 동, 아연, 주석, 티탄, 니켈, 안티몬, 마그네슘, 바나듐, 크롬 및 지르코늄으로 이루어지는 군에서 선택되는 적어도 하나 이상일 수 있다. 상기 금속 입자, 구체적으로 알루미늄 파우더는 직경 5~40 μm 후레이크(Fkake) 타입의 입자를 사용할 수 있으며 방열특성 외, 도막에 펄(pearl) 효과를 낼 수 있고 도막 표면의 강도 강화에 도움이 될 수 있다.The thermally conductive particles may include metal particles. The metal particles may be at least one selected from the group consisting of aluminum, iron, copper, zinc, tin, titanium, nickel, antimony, magnesium, vanadium, chromium, and zirconium. The metal particles, specifically aluminum powder, can use flake-type particles with a diameter of 5 to 40 μm, and in addition to heat dissipation properties, they can produce a pearl effect on the coating film and help to strengthen the surface of the coating film. there is.
상기 열전도성 입자는, 카본블랙, 단일벽 탄소나노튜브, 다중벽 탄소나노튜브, 그래핀 및 카본파이버로 이루어진 군에서 선택되는 적어도 하나 이상의 탄소를 더 포함할 수 있다. The thermally conductive particles may further include at least one carbon selected from the group consisting of carbon black, single-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, and carbon fibers.
탄소나노튜브는 그래핀(graphene)의 변형된 형태로 한 겹의 그래핀이 튜브로 말려있는 형태의 단일벽 탄소 나노튜브(Single-wall carbon nanotubes, SWCNT)와 여러 겹으로 구성된 다중벽 탄소나노튜브(Multi-wall carbon nanotubes, MWCNTs)로 구분할 수 있다. 탄소나노튜브는 뛰어난 역학적 특성을 가지며, 매우 높은 형상비(길이/직경)를 가지고 있어 인장응력이 뛰어나고 열전도성도 탁월하여 그 적용범위가 다양하다. 또한, 감긴 형태에 따라 도체, 반도체의 성질을 띠며 직경에 따라 에너지갭이 달라지고, 준일차원적 구조를 가지고 있어 특이한 양자효과를 나타낸다. 탄소나노튜브의 가장 중요한 열적 성질은 상온에서의 열전도도가 ~6,600W/mㆍK로 아주 높다는 것이며, 이는 phonon의 평균 자유 경로가 아주 큰 것에 기인하는 것임이 이론적으로 입증되었다. MWCNT 또한 흑연 또는 밀링시 생성된 GNP, 그래핀 입자 사이에 열적 가교(thermal bridge) 효과를 줄 수 있다Carbon nanotubes are a modified form of graphene, and include single-wall carbon nanotubes (SWCNTs), in which a single layer of graphene is rolled into a tube, and multi-wall carbon nanotubes composed of several layers. (Multi-wall carbon nanotubes, MWCNTs). Carbon nanotubes have excellent mechanical properties and have a very high aspect ratio (length/diameter), so they have excellent tensile stress and excellent thermal conductivity, so their application range is diverse. In addition, it has the properties of a conductor or a semiconductor depending on its winding shape, its energy gap varies according to its diameter, and it has a quasi-one-dimensional structure, so it exhibits a unique quantum effect. The most important thermal property of carbon nanotubes is that the thermal conductivity at room temperature is very high at ~6,600 W/m·K, and it has been theoretically proven that this is due to the very large mean free path of phonons. MWCNTs can also give a thermal bridge effect between graphite or GNPs produced during milling, and graphene particles.
그래핀은 탄소 원자로 만들어진 원자 크기의 벌집 형태 구조를 가진 소재로, 0.2 nm 두께로 물리적 및 화학적 안정성이 매우 높으며, 구리보다 100배 이상 전기가 잘 통하고, 실리콘보다 100배 이상 전자의 이동성이 빠르다. 또한, 강도는 강철보다 200배 이상 강하며, 최고의 열전도성을 나타내는 다이아몬드보다 2배 이상 열전도성이 높고, 빛을 대부분 통과시키므로 투명하고 신축성도 매우 우수하다.Graphene is a material with an atom-sized honeycomb structure made of carbon atoms. It is 0.2 nm thick, has very high physical and chemical stability, conducts electricity more than 100 times better than copper, and has electron mobility more than 100 times faster than silicon. . In addition, its strength is more than 200 times stronger than steel, its thermal conductivity is more than twice as high as that of diamond, which has the highest thermal conductivity, and it transmits most of the light, so it is transparent and has excellent elasticity.
카본 파이버는 10~20g/d의 강도 및 1.5~2.1의 비중을 가지면, 내열성, 내충격성이 뛰어나며 화학약품에 강하고 해충에 대한 저항성이 크다. 가열과정에서 산소, 수소, 질소 등의 분자가 빠져나가 중량이 감소되므로 금속(알루미늄)보다 가볍고 반면에 금속(철)에 비해 탄성과 강도가 뛰어나다. 이런 특성으로 인해 스포츠용품(낚싯대, 골프채, 테니스 라켓), 항공우주산업(내열재, 항공기 동체), 자동차, 토목건축(경량재, 내장재), 전기전자, 통신(안테나), 환경산업(공기정화기, 정수기) 등 각 분야의 고성능 산업용 소재로 널리 이용된다.When carbon fiber has a strength of 10 to 20 g/d and a specific gravity of 1.5 to 2.1, it has excellent heat resistance and impact resistance, is strong against chemicals, and has high resistance to pests. During the heating process, molecules such as oxygen, hydrogen, nitrogen, etc. escape and the weight is reduced, so it is lighter than metal (aluminum), but has excellent elasticity and strength compared to metal (iron). Due to these characteristics, sports goods (fishing rods, golf clubs, tennis rackets), aerospace industry (heat-resistant materials, aircraft fuselages), automobiles, civil engineering (lightweight materials, interior materials), electrical and electronics, telecommunications (antennas), and environmental industries (air purifiers) , water purifier) and is widely used as a high-performance industrial material in each field.
이와 같은 탄소재료로 형성된 탄소재료 분산액을 흑연재료와 혼합하는 경우, 흑연재료의 입자 사이를 탄소재료 분산액에 함유되어 있는 탄소나노튜브 등의 탄소재료가 연결시킴으로써 열전도도를 향상시켜 우수한 방열 성능을 발휘할 수 있게 된다.When the carbon material dispersion formed of such a carbon material is mixed with the graphite material, the carbon material such as carbon nanotubes contained in the carbon material dispersion is connected between the particles of the graphite material to improve thermal conductivity and exhibit excellent heat dissipation performance. be able to
상기의 탄소재료의 입자 크기는 200 ㎚ 내지 1 ㎛인 것이 바람직할 수 있다. 탄소재료의 입자 크기가 200 ㎚ 미만인 경우에는 응집이 일어나기 쉽고, 1 ㎛를 초과하는 경우에는 이미 응집이 일어난 상태로 탄소재료의 균일한 분산액을 제조하는 것이 어려울 수 있다. 상기 탄소는, 상기 방열 도료 조성물 중 1 중량% 내지 5 중량%인 것일 수 있다. The particle size of the carbon material may be preferably 200 nm to 1 μm. When the particle size of the carbon material is less than 200 nm, aggregation is likely to occur, and when the particle size exceeds 1 μm, it may be difficult to prepare a uniform dispersion of the carbon material in a state in which aggregation has already occurred. The amount of carbon may be 1% to 5% by weight in the heat dissipating paint composition.
상기 탄소가 상기 방열 도료 조성물 중 1 중량% 미만인 경우 너무 적은 양으로 인한 열방사성의 효과를 보기 힘들고, 5 중량% 초과인 경우 방열 특성의 충전제끼리의 응집현상이 증가하여 상기 방열 도료 조성물 내에서 분산성이 저하되고, 점착력이 저하될 수 있다. 상기 흑연 및 상기 탄소재료는, 상기 충전제 중 중량비가 1 : 1 내지 10 : 1인 것일 수 있다.If the carbon is less than 1% by weight in the heat dissipation paint composition, it is difficult to see the effect of thermal radiation due to a too small amount, and if it is more than 5% by weight, the aggregation of the fillers of heat dissipation characteristics increases, so that in the heat dissipation paint composition Acidity may be lowered, and adhesive strength may be lowered. The graphite and the carbon material may have a weight ratio of 1:1 to 10:1 in the filler.
상기 열전도성 입자는, 방열 필러를 더 포함할 수 있다. The thermally conductive particles may further include a heat dissipating filler.
상기 방열 필러는, 알루미나(alumina), 산화알루미늄(Al2O3), 산화마그네슘, 산화아연, 탄화규소(silicon carbide; SiC), 질화알루미늄, 질화붕소, 질화규소, 수산화알루미늄, 수산화마그네슘, 지르코니아(zirconia; ZrO2), 보론 카바이드(boron carbide; B4C), 실리콘 나이트라이드(silicon nitride; Si3N4), 티탄산바륨, 티탄산스트론튬, 산화베릴륨, 산화망간, 산화지르코니아, 산화붕소 및 산화규소로 이루어진 군에서 선택되는 적어도 하나 이상일 수 있다. The heat dissipating filler may include alumina, aluminum oxide (Al 2 O 3 ), magnesium oxide, zinc oxide, silicon carbide (SiC), aluminum nitride, boron nitride, silicon nitride, aluminum hydroxide, magnesium hydroxide, zirconia ( zirconia (ZrO 2 ), boron carbide (B 4 C), silicon nitride (Si 3 N 4 ), barium titanate, strontium titanate, beryllium oxide, manganese oxide, zirconia oxide, boron oxide and silicon oxide It may be at least one or more selected from the group consisting of.
상기 방열 필러는, 평균입경이 1 ㎛ 내지 10 ㎛일 수 있다. 상기 범위를 초과하는 경우는 기재와의 밀착성이 저하되며, 작업성이 나빠질 수 있다.The heat dissipating filler may have an average particle diameter of 1 μm to 10 μm. If it exceeds the above range, the adhesion to the substrate is reduced, and workability may be deteriorated.
상기 방열필러는 그 재질에 있어서 절연성 및 방열성을 동시에 가지는 것이라면 제한 없이 선택할 수 있다. 또한, 상기 방열 필러의 형상, 크기는 제한이 없으며, 구조에 있어서도 다공질이거나 비다공질일 수 있고, 목적에 따라 달리 선택할 수 있다. The heat dissipating filler may be selected without limitation as long as it has insulation and heat dissipation properties at the same time in its material. In addition, the shape and size of the heat dissipating filler are not limited, and may be porous or non-porous in structure, and may be selected differently depending on the purpose.
다만, 바람직하게는 우수한 절연 및 방열성능, 방열 코팅막의 형성 용이성, 방열 코팅막 형성 후 균일한 절연 및 방열성능, 방열 코팅막의 표면 품질을 달성하게 할 수 있다. However, preferably, it is possible to achieve excellent insulation and heat dissipation performance, easy formation of a heat dissipation coating film, uniform insulation and heat dissipation performance after forming the heat dissipation coating film, and surface quality of the heat dissipation coating film.
또한, 상기 방열필러의 경우 표면이 실란기, 아미노기, 아민기, 히드록시기, 카르복실기 등의 관능기로 개질시킨 필러를 사용할 수 있고, 이때, 상기 관능기는 직접 필러의 표면에 결합되어 있을 수 있고, 또는 탄소수 1 ~ 20개의 치환 또는 비치환의 지방족 탄화수소나 탄소수 6 ~ 14개의 치환 또는 비치환의 방향족 탄화수소를 매개로 필러에 간접적으로 결합되어 있을 수 있다.In addition, in the case of the heat-radiating filler, a filler whose surface is modified with a functional group such as a silane group, an amino group, an amine group, a hydroxyl group, or a carboxyl group may be used. In this case, the functional group may be directly bonded to the surface of the filler, or carbon number It may be indirectly bonded to the filler via a substituted or unsubstituted aliphatic hydrocarbon having 1 to 20 atoms or a substituted or unsubstituted aromatic hydrocarbon having 6 to 14 carbon atoms.
또한, 상기 방열 필러는 카본계, 금속 등의 공지된 전도성 방열필러를 코어로 하고, 절연성 성분이 상기 코어를 둘러싸는 코어쉘 타입의 필러일 수도 있다.In addition, the heat-dissipating filler may be a core-shell type filler in which a known conductive heat-dissipating filler such as carbon-based or metal is used as a core and an insulating component surrounds the core.
방열도료에서 바인더는 도막의 열적, 기계적 강도를 좌우하므로 용도에 따라 선택이 가능하다. 우레탄 수지 바인더는, 강도와 내열성이 높은 박막부터 유연하고 탄성이 있는 박막까지 디자인할 수 있는 장점이 있다. In heat-dissipating paints, the binder determines the thermal and mechanical strength of the coating film, so it can be selected according to the purpose. Urethane resin binders have the advantage of being able to design from thin films with high strength and heat resistance to flexible and elastic thin films.
상기 우레탄 수지는, 폴리올일 수 있다. 상기 폴리올은, 아크릴 폴리올, 카프로락톤 폴리올, 에폭시 폴리올, 에스터 폴리올, 에테르 폴리올, 폴리카보네이트폴리올, 폴리에틸렌글리콜, 폴리프로필렌글리콜, 폴리테트라메틸렌글리콜, 에틸렌글리콜, 디에틸렌글리콜, 1,3-부탄디올, 1,4-부탄디올, 네오펜틸글리콜, 3-메틸-1,5-펜탄디올, 2-부틸-2-에틸-1,3-프로판디올, 2,4-디에틸-1,5-펜탄디올, 1,2-헥산디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 2-메틸-1,8-옥탄디올, 1,8-데칸디올, 옥탄데칸디올, 글리세린, 트리메틸올프로판, 펜타에리트리톨, 헥산트리올 및 폴리프로필렌 글리콜로 이루어진 군에서 선택되는 적어도 하나 이상일 수 있다. 더 구체적으로, 아크릴 폴리올, 락톤 폴리올, 에스터 폴리올 또는 이들의 혼합물일 수 있다. The urethane resin may be a polyol. The polyols include acrylic polyol, caprolactone polyol, epoxy polyol, ester polyol, ether polyol, polycarbonate polyol, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, ethylene glycol, diethylene glycol, 1,3-butanediol, 1 ,4-butanediol, neopentylglycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl-1,5-pentanediol, 1 ,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8-decanediol, octanedecanediol, glycerin , It may be at least one selected from the group consisting of trimethylolpropane, pentaerythritol, hexanetriol, and polypropylene glycol. More specifically, it may be an acrylic polyol, a lactone polyol, an ester polyol or a mixture thereof.
상기 폴리에테르폴리올은 물, 저분자량 폴리올(프로필렌 글리콜, 에틸렌 글리콜, 글리세린, 트리메틸올프로판, 펜타에리트리톨 등), 비스페놀류(비스페놀 A 등), 디히드록시벤젠(카테콜, 레조르신, 하이드로퀴논 등)을 개시제로 이용하여, 에틸렌옥사이드, 프로필렌옥사이드 또는 부틸렌옥사이드에서 선택되는 알킬렌옥사이드를 부가 중합시킴으로써 얻어진다. 구체적인 일례로는 폴리에틸렌글리콜, 폴리프로필렌글리콜, 폴리테트라메틸렌글리콜 등이 있다.The polyether polyol is water, low molecular weight polyol (propylene glycol, ethylene glycol, glycerin, trimethylolpropane, pentaerythritol, etc.), bisphenols (bisphenol A, etc.), dihydroxybenzene (catechol, resorcin, hydroquinone, etc.) etc.) as an initiator, obtained by addition polymerization of an alkylene oxide selected from ethylene oxide, propylene oxide or butylene oxide. Specific examples include polyethylene glycol, polypropylene glycol, and polytetramethylene glycol.
상기 폴리카프로락톤 폴리올은 ε-카프로락톤 또는 σ-발레로락톤 등의 환상 에스테르 단량체의 개환중합에 의해 얻어지는 카프로락톤계 폴리에스테르디올이다. 그 일례로는 상기의 폴리올 성분과 포스겐을 중축합 반응시켜 얻어지는 폴리카보네이트 폴리올, 상기 폴리올 성분과 탄산디메틸, 탄산디에틸, 탄산디프로필, 탄산디이소프로필, 탄산디부틸, 탄산에틸부틸, 에틸렌 카르보네이트, 프로필렌 카르보네이트, 탄산디페닐 또는 탄산디벤질 등의 탄산 디에스테르류를 에스테르 교환 및 축합시켜 얻어지는 폴리카보네이트 폴리올, 상기 폴리올 성분을 2 종 이상 병용하여 얻어지는 공중합 폴리카보네이트 폴리올, 상기 각종 폴리카보네이트 폴리올과 카르복실기 함유 화합물을 에스테르화 반응시켜 얻어지는 폴리카보네이트 폴리올, 상기 각종 폴리카보네이트 폴리올과 히드록실기 함유 화합물을 에테르화 반응시켜 얻어지는 폴리카보네이트 폴리올; 상기 각종 폴리카보네이트 폴리올과 에스테르 화합물을 에스테르 교환 반응시켜서 얻어지는 폴리카보네이트 폴리올; 상기 각종 폴리카보네이트 폴리올과 히드록실기 함유 화합물을 에스테르 교환 반응시켜 얻어지는 폴리카보네이트 폴리올; 상기 각종 폴리카보네이트 폴리올과 디카르복실산 화합물을 중축합 반응시켜서 얻어지는 폴리에스테르계 폴리카보네이트 폴리올;및 상기 각종 폴리카보네이트 폴리올과 알킬렌 옥사이드를 공중합시켜 얻어지는 공중합 폴리에테르계 폴리카보네이트 폴리올 등이 있다. 다관능 폴리올의 경우에도 폴리우레탄 화합물의 주쇄를 이룰 수 있는 히드록시기를 갖는 폴리머이면 제한없이 사용될 수 있다. 폴리올 성분으로 인해, 잔류물 저감 등의 재작업성이 우수한 특성을 발현할 수 있다.The polycaprolactone polyol is a caprolactone-based polyester diol obtained by ring-opening polymerization of cyclic ester monomers such as ε-caprolactone or σ-valerolactone. An example thereof is a polycarbonate polyol obtained by polycondensation of the polyol component and phosgene, the polyol component and dimethyl carbonate, diethyl carbonate, dipropyl carbonate, diisopropyl carbonate, dibutyl carbonate, ethyl butyl carbonate, ethylene carbide Polycarbonate polyols obtained by transesterification and condensation of diester carbonates such as bonate, propylene carbonate, diphenyl carbonate or dibenzyl carbonate, copolymer polycarbonate polyols obtained by using two or more of the above polyol components in combination, and various polycarbonates described above polycarbonate polyols obtained by esterification of carbonate polyols and carboxyl group-containing compounds, polycarbonate polyols obtained by etherification of the various polycarbonate polyols and hydroxyl group-containing compounds; polycarbonate polyols obtained by subjecting the various polycarbonate polyols and ester compounds to a transesterification reaction; polycarbonate polyols obtained by subjecting the various polycarbonate polyols and hydroxyl group-containing compounds to a transesterification reaction; Polyester-based polycarbonate polyols obtained by polycondensation of the various polycarbonate polyols and dicarboxylic acid compounds; and copolymerized polyether-based polycarbonate polyols obtained by copolymerizing the various polycarbonate polyols with alkylene oxide. Even in the case of a polyfunctional polyol, any polymer having a hydroxyl group capable of forming a main chain of a polyurethane compound may be used without limitation. Due to the polyol component, excellent reworkability characteristics such as residue reduction can be expressed.
디스플레이 등 전자제품용 방열판과 알루미늄 히트씽크 방열 용도를 고려하여 금속 계면과의 접착성이 우수하고 전자제품의 사용 여부에 따라 온도 상승과 냉각이 반복되는 방열판의 특성에 맞게 경도와 내열충격성이 우수하도록 폴리올을 선택하였다. 폴리우레탄 제조에 널리 사용되는 폴리에스터 폴리올은 단독으로 사용할 경우 금속계면과의 접착성이 떨어지고 그 결과 열충격에도 약한 단점을 보인다. 따라서 계면접착성과 내충격성, 경도, 경화특성을 고려할 때 폴리올은 아크릴 폴리올과 폴리에스터 폴리올을 혼합 사용하거나 접착성과 내충격성의 추가개선을 위해 폴리락톤 폴리올을 추가하여 3성분계를 사용할 수 있다. 수지의 종류와 혼합비율은 도막물성의 요구조건에 따라 강도와 경도, 내열성(Tg)를 고려하여 다양하게 선택할 수 있다. Considering the use of heat dissipation for electronic products such as displays and aluminum heat sinks, it has excellent adhesion with metal interfaces and has excellent hardness and thermal shock resistance to match the characteristics of heat sinks that are repeatedly subjected to temperature rise and cooling depending on whether or not electronic products are used. polyol was selected. Polyester polyol, which is widely used in polyurethane production, exhibits a disadvantage in that adhesion to a metal interface is poor when used alone, and as a result, it is weak against thermal shock. Therefore, when considering interfacial adhesion, impact resistance, hardness, and curing characteristics, a three-component polyol may be used by mixing acrylic polyol and polyester polyol or adding polylactone polyol to further improve adhesion and impact resistance. The type and mixing ratio of resin can be variously selected in consideration of strength, hardness, and heat resistance (Tg) according to the requirements of the properties of the coating film.
상기 디이소시아네이트계 경화제는, 다관능성 지방족계(aliphatic) 이소시아네이트 화합물이 바람직하다. 방향족계 이소시아네이트 화합물이나 지환족계 이소시아네이트 화합물을 사용하는 경우 1시간 이내로 굳어지므로 방열 코팅에 충분한 시간을 확보하지 못하게 될 경우, 사용성이 나쁘게 되는 문제가 있다. 지방족계 이소시아네이트 화합물은 반응성이 낮으므로 6시간 이상 굳어지지 않아서 도료의 사용성이 좋아지는 장점이 있다. 또한, 경화 온도가 70℃ 내지 100℃, 75℃ 내지 90℃에서 15분에서 1시간 이내, 20분 내지 40분 이내로 소성할 수 있는 장점이 있다. 전자부품에 사용하는 방열 도료 조성물의 경우, 소성 온도가 100℃가 넘어가게 되면, 전자부품에 문제가 생길 수 있기 때문에 방열 도료의 소성 온도가 100 ℃ 이내인 것이 바람직하다.The diisocyanate-based curing agent is preferably a polyfunctional aliphatic isocyanate compound. When an aromatic isocyanate compound or an alicyclic isocyanate compound is used, it hardens within 1 hour, so if sufficient time is not secured for heat dissipation coating, there is a problem in that usability is deteriorated. Since the aliphatic isocyanate compound has low reactivity, it does not harden for more than 6 hours, so the usability of the paint is improved. In addition, there is an advantage that the curing temperature can be fired within 15 minutes to 1 hour, 20 minutes to 40 minutes at 70 ° C to 100 ° C, 75 ° C to 90 ° C. In the case of a heat-dissipating paint composition used for electronic parts, it is preferable that the firing temperature of the heat-dissipating paint is within 100 degrees Celsius because problems may occur in electronic parts when the firing temperature exceeds 100 °C.
상기 디이소시아네이트계 경화제는, 구체적으로, 헥사메틸렌디이소시아네이트(Hexamethylene diisocyanate, HDI), 트리메틸렌디이소시아네이트(Timethylene diisocyanate), 테트라메틸렌디이소시아네이트(Tetramethylene diisocyanate), 1,2-프로필렌디이소시아네이트(1,2- propylene diisocyanate), 1,3-부틸렌디이소시아네이트(1,3-butylene diisocyanate), 도데카메틸렌디이소시아네이트(dodecamethylene diisocyanate) 및 2,4,4-트리메틸헥사메틸렌디이소시아네이트(2,4,4-trimethylhexamethylene diisocyanate)로 이루어지는 군에서 선택되는 적어도 하나 이상일 수 있으나 이에 한정되는 것은 아니다. The diisocyanate-based curing agent, specifically, hexamethylene diisocyanate (HDI), trimethylene diisocyanate, tetramethylene diisocyanate, 1,2-propylene diisocyanate (1,2 - Propylene diisocyanate), 1,3-butylene diisocyanate, dodecamethylene diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate (2,4,4-trimethylhexamethylene diisocyanate), but is not limited thereto.
상기 조성물은 에틸렌글리콜, 프로필렌글리콜, 디에틸렌 글리콜, 1,3-부탄디올, 1,4-부탄디올, 네오펜틸 글리콜, 3-메틸-1,5-펜탄디올, 2-부틸-2-에틸-1,3-프로판디올, 2,4-디에틸-1,5-펜탄디올, 1,2-헥산디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 2-메틸-1,8-옥탄디올, 1,8-데칸디올, 옥탄데칸디올, 글리세린, 트리메틸올프로판, 펜타에리트리톨 및 헥산트리올로 이루어진 군에서 선택되는 스페이서를 사용할 수 있다. 스페이서를 사용하여 경화 후 우레탄 사슬의 길이와 경화밀도(crosslink density)의 조절이 가능하다. The composition includes ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1, 3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl A spacer selected from the group consisting of -1,8-octanediol, 1,8-decanediol, octanedecanediol, glycerin, trimethylolpropane, pentaerythritol, and hexanetriol may be used. It is possible to control the length of the urethane chain and the crosslink density after curing by using a spacer.
상기 조성물은, 디부틸틴디라우레이트인 경화 촉매를 사용할 수 있다.The composition may use a curing catalyst that is dibutyl tin dilaurate.
상기 에폭시 수지는 경화 및 접착 작용을 나타내는 것이면 특별히 한정되지 않으나, 고상 혹은 고상에 근접한 에폭시로서, 하나 이상의 관능기를 가지고 있는 에폭시 수지가 바람직하다The epoxy resin is not particularly limited as long as it exhibits a curing and bonding action, but as a solid or close-to-solid epoxy, an epoxy resin having one or more functional groups is preferred.
상기 에폭시 수지는, 비스페놀계 에폭시, 페놀 노볼락(Phenol novolac)계 에폭시, o-크레졸 노볼락(Cresol novolac)계 에폭시, 다관능 에폭시, 아민계 에폭시, 복소환 함유 에폭시, 치환형 에폭시, 나프톨계 에폭시를 예시할 수 있으며, 더욱 구체적으로 에폭시계 화합물의 예로서는, 비스페놀 A 에폭시 수지, 에피클로르히드린형의 에폭시 수지. 에틸렌글리콜 글리시딜 에테르, 폴리에틸렌글리콜 디글리시딜에테르, 글리세린 디글리시딜에테르, 글리세린 트리글리시딜에테르, 1,6-헥산디올 디글리시딜에테르, 트리메틸올프로판 트리글리시딜에테르, 디글리시딜아닐린, 디글리시딜아민, N,N,N',N'-테트라글리시딜-m-크실렌디아민 및 1,3-비스(N,N'-디글리시딜아민메틸)시클로헥산으로 이루어진 군에서 선택되는 적어도 하나 이상일 수 있다.The epoxy resin is a bisphenol-based epoxy, a phenol novolac-based epoxy, an o-cresol novolac-based epoxy, a multifunctional epoxy, an amine-based epoxy, a heterocyclic epoxy, a substituted epoxy, a naphthol-based epoxy Epoxy can be exemplified, and more specifically, as an example of an epoxy-type compound, a bisphenol A epoxy resin and an epichlorhydrin-type epoxy resin. Ethylene glycol glycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl Cidylaniline, diglycidylamine, N,N,N',N'-tetraglycidyl-m-xylenediamine and 1,3-bis(N,N'-diglycidylaminemethyl)cyclohexane It may be at least one or more selected from the group consisting of.
현재 시판되고 있는 제품으로서는 비스페놀계로서는 유카 쉘에폭시 주식회사의 에피코트 807, 에피코트 815, 에피코트 825, 에피코트 827, 에피코트 828, 에피코트 834, 체피코트 1001, 에피코트 1004, 에피코트 1007, 에피코트 1009, 다우케미컬사의 DER-330, DER-301, DER-361, 대일본 잉크화학의 에피클론 830-S, 에피클론 EXA-830CRP, 에피클론 EXA 850-S, 에피클론 EXA-850CRP, 에피클론 EXA-835LV, 국도화학의 YD-011, YD-012, YD-014, YD-128, YD-134, YDF-170등이 있고, 페놀 노볼락(Phenol novolac)계로서는 유카 쉘 에폭시 주식회사의 체피코트 152, 에피코트 154, 일본화약주식회사의 EPPN-201, 다우케미컬의 DN-483 등이 있고, o-크레졸 노볼락(Cresol novolac)계로서는 대일본 잉크화학의 에피클론 N-665-EXP, 국도화학의 YDCN-500-1P, YDCN-500-2P, YDCN-500-4P, YDCN-500-5P, YDCN-500-7P, YDCN-500-8P, YDCN-500-10P, YDCN-500-80P, YDCN-500-90P, 일본화약주식회사의 EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027, 독도화학주식회사의 YDCN-701, YDCN-702, YDCN-703, YDCN-704 등이 있고, 다관능 에폭시 수지로서는 유카 쉘에폭시 주식회사 Epon 1031S, 시바스페샬리티케미칼주식회사의 아랄디이토 0163, 나가섭씨온도화성 주식회사의 데타콜 EX-611, 데타콜 EX-614, 데타콜 EX-614B, 데타콜 EX-622, 데타콜 EX-512, 데타콜 EX-521, 데타콜 EX-421, 데타콜 EX-411, 데타콜 EX-321 등이 있으며, 아민계 에폭시 수지로서는 스미토모화학주식회사의 ELM-120, 유카쉘에폭시 주식회사 에피코트 604, 독도화학주식회사의 YH-434, 미쓰비시가스화학 주식회사의 TETRAD-X, TETRAD-C 등이 있고, 복소환 함유 에폭시수지로는 시바스페샬리티 케미칼주식회사의 PT-810, 치환형 에폭시로는 UCC사의 ERL-4234, ERL-4299, ERL-4221, ERL-4206, 나프톨계 에폭시로는 대일본 잉크화학의 에피클론 HP-4032, 에피클론 HP-4032D, 에피클론 HP-4700, 에피클론 4701등을 들 수 있고, 이것들은 단독으로 또는 2종류 이상을 혼합하여 이용할 수 있다. As bisphenol-based products currently on the market, Epicoat 807, Epicoat 815, Epicoat 825, Epicoat 827, Epicoat 828, Epicoat 834, Chepicoat 1001, Epicoat 1004, Epicoat 1007, Epicoat 1009, Dow Chemical's DER-330, DER-301, DER-361, Daenippon Ink Chemical's Epiclone 830-S, Epiclone EXA-830CRP, Epiclone EXA 850-S, Epiclone EXA-850CRP, Epiclone There are clone EXA-835LV, Kukdo Chemical's YD-011, YD-012, YD-014, YD-128, YD-134, YDF-170, etc., and as a phenol novolac system, Yuka Shell Epoxy Co., Ltd. There are Picot 152, Epicoat 154, EPPN-201 of Nippon Explosives Co., Ltd., DN-483 of Dow Chemical, etc., and as o-Cresol novolac, Daenippon Ink Chemical's Epiclone N-665-EXP, Kukdo Chemical YDCN-500-1P, YDCN-500-2P, YDCN-500-4P, YDCN-500-5P, YDCN-500-7P, YDCN-500-8P, YDCN-500-10P, YDCN-500-80P, YDCN-500-90P, EOCN-102S, EOCN-103S, EOCN-104S, EOCN-1012, EOCN-1025, EOCN-1027 of Nippon Explosive Co., Ltd., YDCN-701, YDCN-702, YDCN-703 of Dokdo Chemical Co., Ltd. There are YDCN-704 and the like, and examples of the multifunctional epoxy resin include Epon 1031S from Yuka Shell Epoxy Co., Ltd., Araldite 0163 from Ciba Specialty Chemicals Co., Ltd., Detacol EX-611 from Naga Celsius Chemical Co., Ltd., Detacol EX-614, and Detacol. Detacol EX-614B, Detacol EX-622, Detacol EX-512, Detacol EX-521, Detacol EX-421, Detacol EX-411, Detacol EX-321, etc. Sumitomo Chemical Co., Ltd.'s ELM-120, Yukashell Epoxy Co., Ltd. Epicoat 604, There are YH-434 of Dokdo Chemical Co., Ltd., TETRAD-X and TETRAD-C of Mitsubishi Gas Chemical Co., Ltd., PT-810 of Civas Specialty Chemical Co., Ltd. as a heterocyclic epoxy resin, and ERL- of UCC as a substitution type epoxy. 4234, ERL-4299, ERL-4221, ERL-4206, and naphthol-based epoxies include Epiclone HP-4032, Epiclone HP-4032D, Epiclone HP-4700, and Epiclone 4701 of Daenippon Ink Chemicals. , These can be used individually or in mixture of two or more types.
아민계 경화제의 예로서는, 헥사메틸렌디아민, 트리에틸디아민, 폴리에틸렌이민, 헥사메틸렌테트라민, 디에틸렌트리아민, 트리에틸테트라민, 이소포름디아민, 디에틸렌트리아민(Diethylene Triamine), 트리에틸렐테트라아민 (Triethylene Tetramine), 디에틸아미노프로필아민(Diethylamino propyl amine), 멘탄디아민 (Menthane diamine), N-아미노에틸피페라진 (N-aminoethylpiperazine), M-자일렌디아민 (M-xylene diamine), 이소포론디아민 (Isophorone diamine), N,N'-디-터트-부틸에틸렌디아민(N,N'-di-tert-butylethylenediamine), N,N-디-이소-프로필에틸렌디아민(N,N-di-iso-propylethylene-diamine), N,N'-디이소프로필-1,3-프로판디아민(N,N'-diisopropyl-1,3-propanediamine), 및 비스(2,2,6,6-테트라메틸-4-피페리딜)세바케이트(bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate)으로 이루어지는 군에서 선택되는 적어도 하나 이상일 수 있다.Examples of the amine-based curing agent include hexamethylenediamine, triethyldiamine, polyethyleneimine, hexamethylenetetramine, diethylenetriamine, triethyltetramine, isoformdiamine, diethylenetriamine, and triethylenetetramine. (Triethylene Tetramine), Diethylamino propyl amine, Menthane diamine, N-aminoethylpiperazine, M-xylene diamine, Isophorone diamine (Isophorone diamine), N,N'-di-tert-butylethylenediamine (N,N'-di-tert-butylethylenediamine), N,N-di-iso-propylethylenediamine (N,N-di-iso- propylethylene-diamine), N,N'-diisopropyl-1,3-propanediamine, and bis(2,2,6,6-tetramethyl-4 -It may be at least one selected from the group consisting of piperidyl) sebacate (bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate).
또한, 상기 용제는 선택되는 바인더 수지, 경화제 등에 따라 이에 맞는 용매를 선택할 수 있어 본 발명에서는 이를 특별히 한정하는 것은 아니며, 상기 용매로는 각 성분의 적절한 용해를 가능케 하는 임의의 용매를 사용할 수 있다. 상기 용제는, 구체적으로 유기 용매를 사용할 수 있고, 더욱 구체적으로 N-부틸아세테이트, 아세테이트, 에틸아세테이트, 아밀아세테이트, 메틸셀로솔브아세테이트, 에틸셀로솔브아세테이트, 디에틸렌글리콜메틸아세테이트, 디에틸렌글리콜에틸아세테이트, 에틸렌글리콜모노에틸에테르아세테이트 및 3-메톡시부틸아세테이트, 프로필렌글리콜메틸에테르아세테이트(PGMEA)로 이루어지는 군에서 선택되는 적어도 하나 이상인 것을 사용할 수 있다. In addition, since the solvent may be selected according to the selected binder resin, curing agent, etc., this is not particularly limited in the present invention, and any solvent capable of properly dissolving each component may be used as the solvent. The solvent may specifically use an organic solvent, and more specifically, N-butyl acetate, acetate, ethyl acetate, amyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol methyl acetate, diethylene glycol At least one selected from the group consisting of ethyl acetate, ethylene glycol monoethyl ether acetate, 3-methoxybutyl acetate, and propylene glycol methyl ether acetate (PGMEA) may be used.
용제의 첨가량이 높을수록 점도가 낮아지고 입자의 침강 속도가 빨라지고, 용제의 첨가량이 적을수록 점도는 높아지나 분산 공정에서의 안정성이 떨어질 수 있으므로, 이를 고려하여 조성물에 용제가 적정량 첨가될 수 있다. 상기 용제는, 상기 방열 도료 조성물 중 10 중량% 내지 50 중량%인 것일 수 있다. 상기 용제가 상기 방열 도료 조성물 중 10 중량% 미만인 경우 상기 수지가 잘 용해되지 않고, 분산성이 좋지 않으며, 점도가 높아지게 되고, 50 중량% 초과인 경우 방열을 위한 기재에 상기 방열 도료 조성물을 코팅하였을 때 공극이 형성될 수 있고, 방열효과가 저하될 수 있다. The higher the added amount of the solvent, the lower the viscosity and the faster the sedimentation rate of the particles. The smaller the added amount of the solvent, the higher the viscosity but may decrease stability in the dispersion process. The solvent may be 10% to 50% by weight of the heat dissipating paint composition. If the solvent is less than 10% by weight of the heat-dissipating paint composition, the resin does not dissolve well, dispersibility is poor, and the viscosity increases, and if the solvent is greater than 50% by weight, the heat-dissipating paint composition is coated on a substrate Gaps may be formed, and the heat dissipation effect may be reduced.
스프레이 코팅의 경우, 상기 용제는 상기 수지와 비슷한 양을 넣어서 점도를 조절할 수 있다.In the case of spray coating, the viscosity can be adjusted by adding a similar amount of the solvent to the resin.
예를 들어, 상기 수지 : 용제의 중량비는 1 : 1일 수 있다. 스프레이 코터의 상태에 따라 용제의 함량을 조절할 수 있다. 바 코팅이나 그래비어 코팅의 경우, 점도가 약간 높아야 하므로 스프레이 코팅보다는 더 적게 포함할 수 있다.For example, the weight ratio of the resin to the solvent may be 1:1. The content of the solvent can be adjusted according to the condition of the spray coater. In the case of bar coating or gravure coating, it may contain less than spray coating, as the viscosity should be slightly higher.
상기 용제는 상기 방열 도료 조성물을 기재에 코팅한 후 휘발되는 것이고, 상기 방열도료 조성물은 코팅 및 건조 이후에 용제-프리인 것일 수 있다. 상기 방열 도료 조성물을 방열을 위한 기재에 코팅한 후, 상기 방열 도료 조성물에 포함되어 있는 상기 용제가 휘발되어 용제의 성분이 없는 것일 수도 있다.The solvent may be volatilized after coating the heat-dissipating paint composition on a substrate, and the heat-dissipating paint composition may be solvent-free after coating and drying. After coating the heat dissipating paint composition on a substrate for heat dissipation, the solvent included in the heat dissipating paint composition may be volatilized and thus the solvent component may not be present.
상기 조성물은 첨가제로, 소광제, 착색제, 접착증진제, 분산제, 침강방지제, 소포제 및 레벨링제로 이루어진 군에서 선택되는 적어도 하나 이상을 더 포함할 수 있다. The composition may further include at least one selected from the group consisting of a matting agent, a colorant, an adhesion promoter, a dispersing agent, an antisettling agent, an antifoaming agent, and a leveling agent as an additive.
상기 소광제는 이산화티타늄, 에어로젤 실리카, 하이드로젤 실리카, PP 왁스, PE 왁스, PTFE 왁스, 우레아 포름알데이드 수지 및 벤조구아민 포름알데이드 수지로 이루어진 군에서 선택된 1종 이상, 바람직하게는 이산화티타늄을 포함할 수 있다. 상기 소광제는 직경 1.0~10.0 μm의 구형입자일 수 있다. 상기 소광제는 조성물 총 중량을 기준으로 2~5 중량%로 포함될 수 있다. The matting agent is at least one selected from the group consisting of titanium dioxide, airgel silica, hydrogel silica, PP wax, PE wax, PTFE wax, urea formaldehyde resin and benzoguamine formaldehyde resin, preferably titanium dioxide can include The matting agent may be spherical particles having a diameter of 1.0 to 10.0 μm. The matting agent may be included in 2 to 5% by weight based on the total weight of the composition.
상기 착색제는 탈크, 징크옥사이드, 징크설파이드, 금속산화물계, 하이드록실계, 설파이드계, 아조계, 니트로계 및 프탈로시아닌계로 이루어진 군에서 선택된 1종 이상, 바람직하게는 탈크를 포함할 수 있다. 상기 착색제로 사용될 수 있는 탈크 및 소광제로 사용될 수 있는 이산화티타늄은 상기 방열필러와 함께 필러로 사용하여 내전압 특성을 향상시킬 수도 있다.The colorant may include at least one selected from the group consisting of talc, zinc oxide, zinc sulfide, metal oxide, hydroxyl, sulfide, azo, nitro, and phthalocyanine, preferably talc. Talc, which can be used as the colorant, and titanium dioxide, which can be used as the matting agent, can be used together with the heat radiation filler as a filler to improve withstand voltage characteristics.
한편, 상술한 방열 도료 조성물은 방열필러의 분산성을 향상시키고, 균일한 방열 코팅막을 구현하기 위한 분산제, 용매를 더 포함할 수 있다. Meanwhile, the above-described heat-dissipating paint composition may further include a dispersant and a solvent for improving the dispersibility of the heat-dissipating filler and realizing a uniform heat-dissipating coating film.
상기 소포제는 각 조성물의 혼합 중 기포의 발생과 잔류를 방지하고 도막표면에 기포나 분화구가 발생하는 것을 방지한다. The antifoaming agent prevents the generation and retention of air bubbles during mixing of each composition and prevents the generation of air bubbles or craters on the surface of a coating film.
상기 레벨링제는 도막의 균일성을 향상시키고 표면 거칠기를 완화하는 효과를 낼 수 있다. The leveling agent may improve the uniformity of the coating film and reduce surface roughness.
또한, 상술한 방열 도료 조성물은 pH 조절제, 이온포착제, 점도조정제, 요변성(搖變性) 부여제, 산화방지제, 열안정제, 광안정제, 자외선흡수제, 착색제, 탈수제, 난연제, 대전방지제, 방미제(防黴劑), 방부제, 등의 각종 첨가제의 1 종류 또는 2 종류 이상이 첨가될 수도 있다. 상기 기재된 각종 첨가제는 당업계에 공지된 것을 사용할 수 있어 본 발명에서 특별히 한정하지 않는다.In addition, the heat-dissipating paint composition described above is a pH adjuster, an ion trapping agent, a viscosity modifier, a thixotropy imparting agent, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, a colorant, a dehydrating agent, a flame retardant, an antistatic agent, and an antimold. One type or two or more types of various additives such as antiseptics, preservatives, and the like may be added. The various additives described above may be those known in the art and are not particularly limited in the present invention.
한편, 상술한 방열 도료 조성물은 코팅 건조 도막의 변색 방지, 산화에 의한 취성, 부착 강도 등의 물성저하를 방지하기 위한 산화방지제를 더 포함할 수 있다.On the other hand, the above-described heat-dissipating paint composition may further include an antioxidant for preventing discoloration of the coated dry film, brittleness due to oxidation, and deterioration of physical properties such as adhesion strength.
상기 산화방지제는 방열 도료 조성물의 산화방지제로 당업계에서 채용하는 공지된 성분을 사용할 수 있다. 일예로, 상기 산화방지제는 트리-메틸포스페이트, 트리-페닐포스페이트, 트리스(2,4-디-터트-부틸페닐)포스페이트, 트리에틸렌글리콜-비스-3-(3-터트-부틸-4-하이드록시-5-메틸페닐)프로피오네이트, 1,6-헥세인-디올-3(3,5-디-터트-부틸-4-하이드록시페닐)프로피오네이트, 펜타에리스리틸-테트라키스(3-(3,5-디-터트-부틸-4-하이드록시페닐)프로피오네이트, 2-하이드록시벤조페논, 2-하이드록시페닐벤조티아졸, 힌더드아민, 유기 니켈 화합물, 살리실산염, 신나메이트 유도체, 레조르시놀 모노벤조에이트, 옥사닐리드 및 p-하이드록시벤조에이트로 이루어지는 군으로부터 선택되는 어느 하나 이상을 포함할 수 있다. 또한, 일예로, 상기 산화방지제는 2-하이드록시페닐벤조티아졸 일 수 있다.The antioxidant may be a known component employed in the art as an antioxidant of a heat-dissipating paint composition. For example, the antioxidant is tri-methylphosphate, tri-phenylphosphate, tris(2,4-di-tert-butylphenyl)phosphate, triethylene glycol-bis-3-(3-tert-butyl-4-hydride) Roxy-5-methylphenyl)propionate, 1,6-hexane-diol-3(3,5-di-tert-butyl-4-hydroxyphenyl)propionate, pentaerythrityl-tetrakis(3- (3,5-di-tert-butyl-4-hydroxyphenyl)propionate, 2-hydroxybenzophenone, 2-hydroxyphenylbenzothiazole, hindered amine, organic nickel compound, salicylate, cinnamate derivatives, resorcinol monobenzoate, oxanilide, and p-hydroxybenzoate may include at least one selected from the group consisting of 2-hydroxyphenylbenzothia can be sleepy
또한, 상기 산화방지제는 바람직하게는 상기 조성물 총 중량을 기준으로 0.1~3 중량%로 포함될 수 있다. 만일 산화방지제가 0.1 중량부 미만으로 구비될 경우 변색이 발생할 수 있고, 만일 산화방지제가 3 중량부를 초과하여 구비되는 경우 취성 및 부착 강도가 약해질 수 있다.In addition, the antioxidant may preferably be included in an amount of 0.1 to 3% by weight based on the total weight of the composition. If the antioxidant is provided in less than 0.1 parts by weight, discoloration may occur, and if the antioxidant is provided in more than 3 parts by weight, brittleness and adhesive strength may be weakened.
상기 접착증진제는, 에폭시에스터인산(epoxy ester phosphate acid)일 수 있다. 접착증진제는 도막과 피착물 간 계면접착성을 증진시켜주는 것으로 열충격과 장기사용시에도 도막의 박리, 균열 등을 방지한다. 상기 접착증진제는 조성물 총 중량을 기준으로 3~10중량%로 포함될 수 있다. The adhesion promoter may be epoxy ester phosphate acid. The adhesion enhancer improves the interfacial adhesion between the coating film and the adherend, and prevents peeling and cracking of the coating film even during thermal shock and long-term use. The adhesion promoter may be included in an amount of 3 to 10% by weight based on the total weight of the composition.
상기 분산제는 조성물 총 중량을 기준으로 0.5~1.5 중량%로 포함될 수 있다. 0.5 중량% 미만으로 구비될 경우 목적하는 효과의 발현이 되지 않을 수 있고, 분산제가 1.5중량%를 초과하여 구비될 경우 피착제의 부착 강도가 약해지거나 코팅 도막 표면에 핀홀(Pin hole) 및 오렌지 필(Orange Peel)이 발생할 수 있다.The dispersant may be included in an amount of 0.5 to 1.5% by weight based on the total weight of the composition. If it is provided in less than 0.5% by weight, the desired effect may not be expressed, and if the dispersant is provided in excess of 1.5% by weight, the adhesion strength of the adherend is weakened or pinholes and orange peel are formed on the surface of the coating film. (Orange Peel) may occur.
상기 분산제는, 방열 도료 조성물의 분산성을 증대시키고, 밀도를 고르게 하며, 레올로지(Rheology) 컨트롤을 적절히 조정할 수 있도록 포함되는 것일 수 있다.The dispersant may be included to increase the dispersibility of the heat dissipating paint composition, to make the density even, and to appropriately adjust the rheology control.
상기 분산제는, 비이온성 계면활성제일 수 있고, 양이온성 계면활성제, 음이온성 계면활성제, 양쪽성 계면활성제를 사용할 수 있다. 폴리올이 계면활성 효과를 가지므로, 계면활성제를 사용하지 않을 수도 있으나, 바람직하게는 비이온성 계면활성제를 사용할 수 있다. 본 출원의 방열 도료 조성물을 4주 이상을 보관하는 경우 비이온성 계면활성제가 보관성을 좋게 하는 효과가 더욱 우수하다. The dispersant may be a nonionic surfactant, and cationic surfactants, anionic surfactants, and amphoteric surfactants may be used. Since the polyol has a surfactant effect, a surfactant may not be used, but a nonionic surfactant may be preferably used. When the heat-dissipating paint composition of the present application is stored for 4 weeks or more, the effect of improving the storage stability of the nonionic surfactant is more excellent.
상기 비이온성 계면활성제는, 예를 들어, 폴리에톡실화 알킬페놀의 인산에스테르, 에톡실화 알킬페놀, 황산에스테르, 에톡실화 피마자유, 폴리옥시에틸렌트리스티릴페닐에테르, 에톡실화 지방족알코올, 에틸렌옥사이드/프로필렌옥사이드 블록코폴리머, 리그노술폰산의 소듐염, 황산의 이나트륨염, 아크릴산 중합체의 나트륨염, 도데실설페이트의 나트륨염, 우레아-포름알데히드 수지, 폴리에틸렌글리콜모노(트리스티릴페닐)에테르, 도데실 벤젠 술폰산의 칼슘염, 나트륨 스테아레이트, 소르비탄 모노스테아레이트, 로진의 폴리옥시에틸렌 에스테르, 폴리옥시에틸렌 도데실 모노 에테르, 폴리옥시에틸렌-폴리옥시프로필렌 블록 공중합체, 폴리옥시에틸렌 모노라우레이트, 폴리옥시에틸렌 모노헥사데실 에테르, 폴리옥시에틸렌 모노올레이트, 폴리옥시에틸렌 모노(시스-9-옥타데세닐)에테르, 폴리옥시에틸렌 모노스테아레이트, 폴리옥시에틸렌 모노옥타데실 에테르, 폴리옥시에틸렌 디올레이트, 폴리옥시에틸렌 디스테아레이트, 폴리옥시에틸렌 소르비탄 모노라우레이트, 폴리옥시에틸렌 소르비탄 모노올레이트, 폴리옥시에틸렌 소르비탄 모노팔미테이트, 폴리옥시에틸렌 소르비탄 모노스테아레이트, 폴리옥시에틸렌 소르비탄 트리올레이트, 폴리옥시에틸렌 소르비탄 트리스테아레이트, 올레산의 폴리글리세롤 에스테르, 폴리옥시에틸렌 소르비톨 헥사스테아레이트, 폴리옥시에틸렌 모노테트라데실 에테르, 폴리옥시에틸렌 소르비톨 헥사올레이트, 지방산, 톨-오일, 소르비톨 헥사에스테르, 에톡실화 피마자 오일, 에톡시화 대두 오일, 에톡실화 폴리옥시에틸렌 소르비톨 테트라올레이트, 글리세롤 및 폴리에틸렌 글리콜 혼합된 에스테르, 폴리글리세롤 에스테르, 모노글리세리드 및 수크로스 에스테르로 이루어지는 군에서 선택되는 적어도 하나 이상일 수 있다. The nonionic surfactant is, for example, polyethoxylated alkylphenol phosphoric acid ester, ethoxylated alkylphenol, sulfuric acid ester, ethoxylated castor oil, polyoxyethylene tristyrylphenyl ether, ethoxylated aliphatic alcohol, ethylene oxide / Propylene oxide block copolymer, sodium salt of lignosulfonic acid, disodium salt of sulfuric acid, sodium salt of acrylic acid polymer, sodium salt of dodecyl sulfate, urea-formaldehyde resin, polyethylene glycol mono(tristyrylphenyl) ether, Calcium salt of dodecylbenzene sulfonic acid, sodium stearate, sorbitan monostearate, polyoxyethylene esters of rosin, polyoxyethylene dodecyl monoether, polyoxyethylene-polyoxypropylene block copolymer, polyoxyethylene monolaurate , polyoxyethylene monohexadecyl ether, polyoxyethylene monooleate, polyoxyethylene mono(cis-9-octadecenyl)ether, polyoxyethylene monostearate, polyoxyethylene monooctadecyl ether, polyoxyethylene diol Late, Polyoxyethylene Distearate, Polyoxyethylene Sorbitan Monolaurate, Polyoxyethylene Sorbitan Monooleate, Polyoxyethylene Sorbitan Monopalmitate, Polyoxyethylene Sorbitan Monostearate, Polyoxyethylene Sorbitan Trioleate, polyoxyethylene sorbitan tristearate, polyglycerol esters of oleic acid, polyoxyethylene sorbitol hexastearate, polyoxyethylene monotetradecyl ether, polyoxyethylene sorbitol hexaoleate, fatty acids, tall-oil, sorbitol At least one selected from the group consisting of hexaesters, ethoxylated castor oil, ethoxylated soybean oil, ethoxylated polyoxyethylene sorbitol tetraoleate, glycerol and polyethylene glycol mixed esters, polyglycerol esters, monoglycerides and sucrose esters can
상기 음이온성 계면활성제는, 칼륨 라우레이트, 트리에탄올아민 스테아레이트, 나트륨 라우릴 술페이트, 나트륨 도데실술페이트, 알킬 폴리옥시에틸렌 술페이트, 나트륨 알기네이트, 디옥틸 나트륨 술포숙시네이트, 포스파티딜 글리세롤, 포스파티딜 이노시톨, 포스파티딜세린, 포스파티드산 및 그의 염, 글리세릴 에스테르, 나트륨 카르복시메틸셀룰로즈, 담즙산 및 그의 염, 콜산, 데옥시콜산, 글리코콜산, 타우로콜산, 글리코데옥시콜산, 알킬 술포네이트, 아릴 술포네이트, 알킬 포스페이트, 알킬 포스포네이트, 스테아르산 및 그의 염, 칼슘 스테아레이트, 포스페이트, 카르복시메틸셀룰로스 나트륨, 디옥틸술포숙시네이트, 나트륨 술포숙신산의 디알킬에스테르, 인지질 및 칼슘 카르복시메틸셀룰로즈로 구성된 군으로부터 선택되는 것일 수 있다. The anionic surfactant is potassium laurate, triethanolamine stearate, sodium lauryl sulfate, sodium dodecyl sulfate, alkyl polyoxyethylene sulfate, sodium alginate, dioctyl sodium sulfosuccinate, phosphatidyl glycerol, phosphatidyl Inositol, phosphatidylserine, phosphatidic acid and salts thereof, glyceryl esters, sodium carboxymethylcellulose, bile acids and salts thereof, cholic acid, deoxycholic acid, glycocholic acid, taurocholic acid, glycodeoxycholic acid, alkyl sulfonates, aryl sulfos nates, alkyl phosphates, alkyl phosphonates, stearic acid and salts thereof, calcium stearate, phosphates, sodium carboxymethylcellulose, dioctylsulfosuccinate, dialkyl esters of sodium sulfosuccinic acid, phospholipids and calcium carboxymethylcellulose It may be selected from.
상기 양이온성 계면활성제에는, 이에 제한되지 않지만, 4급 암모늄 화합물, 벤즈알코늄 클로라이드, 세틸트리메틸암모늄 브로마이드, 키토산, 라우릴디메틸벤질암모늄 클로라이드, 아실 카르니틴 히드로클로라이드, 알킬피리디늄 할라이드, 세틸 피리디늄 클로라이드, 양이온성 지질, 폴리메틸메타크릴레이트 트리메틸암모늄 브로마이드, 술포늄 화합물, 폴리비닐피롤리돈-2-디메틸아미노에틸 메타크릴레이트 디메틸 술페이트, 헥사데실트리메틸 암모늄 브로마이드, 포스포늄 화합물, 벤질-디(2-클로로에틸)에틸암모늄 브로마이드, 코코넛 트리메틸 암모늄 클로라이드, 코코넛 트리메틸 암모늄 브로마이드, 코코넛 메틸 디히드록시에틸 암모늄 클로라이드, 코코넛 메틸 디히드록시에틸 암모늄 브로마이드, 데실 트리에틸 암모늄 클로라이드, 데실 디메틸 히드록시에틸 암모늄 클로라이드 브로마이드, C12-C15디메틸 히드록시에틸암모늄클로라이드, C12-C15 디메틸히드록시에틸 암모늄 클로라이드 브로마이드, 코코넛 디메틸 히드록시에틸 암모늄 클로라이드, 코코넛 디메틸 히드록시에틸 암모늄 브로마이드, 미리스틸 트리메틸 암모늄 메틸술페이트, 라우릴 디메틸 벤질 암모늄 클로라이드, 라우릴 디메틸 벤질 암모늄 브로마이드, 라우릴 디메틸 (에테녹시)4 암모늄 클로라이드, 라우릴 디메틸 (에테녹시)4 암모늄 브로마이드, N-알킬 (C12-18)디메틸벤질 암모늄 클로라이드, N-알킬 (C14-C18)디메틸-벤질 암모늄 클로라이드, N-테트라데실디메틸벤질 암모늄 클로라이드 일수화물, 디메틸 디데실 암모늄 클로라이드, N-알킬 및 (C12-C14)디메틸 1-나프틸메틸 암모늄 클로라이드, 트리메틸암모늄 할라이드 알킬-트리메틸암모늄 염, 디알킬-디메틸암모늄 염, 라우릴 트리메틸 암모늄 클로라이드, 에톡실화 알킬아미도알킬디알킬암모늄 염, 에톡실화 트리알킬 암모늄 염, 디알킬벤젠 디알킬암모늄 클로라이드, N-디데실디메틸 암모늄 클로라이드, N-테트라데실디메틸벤질 암모늄 클로라이드 일수화물, N-알킬(C12-C14) 디메틸 1-나프틸메틸 암모늄 클로라이드, 도데실디메틸벤질 암모늄 클로라이드, 디알킬 벤젠알킬 암모늄클로라이드, 라우릴 트리메틸 암모늄 클로라이드, 알킬벤질 메틸 암모늄 클로라이드, 알킬 벤질 디메틸 암모늄브로마이드, C12 트리메틸 암모늄 브로마이드, C15 트리메틸 암모늄 브로마이드, C17 트리메틸 암모늄 브로마이드, 도데실벤질 트리에틸 암모늄 클로라이드, 폴리디알릴디메틸암모늄 클로라이드, 디메틸 암모늄 클로라이드, 알킬디메틸암모늄 할로게니드, 트리세틸 메틸 암모늄 클로라이드, 데실트리메틸암모늄 브로마이드, 도데실트리에틸암모늄 브로마이드, 테트라데실트리메틸암모늄 브로마이드, 메틸 트리옥틸암모늄 클로라이드, 폴리쿼트(POLYQUAT) 10, 테트라부틸암모늄 브로마이드, 벤질 트리메틸암모늄 브로마이드, 콜린 에스테르, 벤즈알코늄 클로라이드, 스테아르알코늄 클로라이드, 세틸 피리디늄 브로마이드, 세틸 피리디늄 클로라이드, 4급화(quaternized) 폴리옥시에틸알킬아민의 할라이드 염, "미라폴(MIRAPOL)" (폴리쿼터늄-2) "알카쿼트(Alkaquat)" (알킬 디메틸 벤질암모늄 클로라이드, 로디아(Rhodia)에 의해 제조됨), 알킬 피리디늄 염, 아민, 아민 염, 이미드 아졸리늄 염, 양성자화 4급 아크릴아미드, 메틸화 4급 중합체, 및 양이온성 구아 검. 벤즈알코늄 클로라이드, 도데실 트리메틸 암모늄 브로마이드, 트리에탄올아민 및 폴옥사민이 포함된다.Such cationic surfactants include, but are not limited to, quaternary ammonium compounds, benzalkonium chloride, cetyltrimethylammonium bromide, chitosan, lauryldimethylbenzylammonium chloride, acyl carnitine hydrochloride, alkylpyridinium halide, cetyl pyridinium chloride , cationic lipid, polymethyl methacrylate trimethylammonium bromide, sulfonium compound, polyvinylpyrrolidone-2-dimethylaminoethyl methacrylate dimethyl sulfate, hexadecyltrimethyl ammonium bromide, phosphonium compound, benzyl-di( 2-Chloroethyl)ethylammonium Bromide, Coconut Trimethyl Ammonium Chloride, Coconut Trimethyl Ammonium Bromide, Coconut Methyl Dihydroxyethyl Ammonium Chloride, Coconut Methyl Dihydroxyethyl Ammonium Bromide, Decyl Triethyl Ammonium Chloride, Decyl Dimethyl Hydroxyethyl Ammonium Chloride bromide, C 12 -C 15 dimethyl hydroxyethylammonium chloride, C 12 -C 15 dimethylhydroxyethyl ammonium chloride bromide, coconut dimethyl hydroxyethyl ammonium chloride, coconut dimethyl hydroxyethyl ammonium bromide, myristyl trimethyl ammonium methylsulfate , lauryl dimethyl benzyl ammonium chloride, lauryl dimethyl benzyl ammonium bromide, lauryl dimethyl (ethenoxy) tetra ammonium chloride, lauryl dimethyl (ethenoxy) tetra ammonium bromide, N-alkyl (C 12 - 18 ) dimethylbenzyl Ammonium chloride, N-alkyl (C 14 -C 18 )dimethyl-benzyl ammonium chloride, N-tetradecyldimethylbenzyl ammonium chloride monohydrate, dimethyl didecyl ammonium chloride, N-alkyl and (C 12 -C 14 )dimethyl 1- naphthylmethyl ammonium chloride, trimethylammonium halide alkyl-trimethylammonium salt, dialkyl-dimethylammonium salt, lauryl trimethyl ammonium chloride, ethoxylated alkylamidoalkyldialkylammonium salt, ethoxylated trialkyl ammonium salt, dialkylbenzene di Alkylammonium chloride, N-didecyldimethyl ammonium chloride, N-tetradecyldimethylbenzyl ammonium chloride monohydrate, N-alkyl (C 12 -C 14 ) Dimethyl 1-naphthylmethyl ammonium chloride, dodecyldimethylbenzyl ammonium chloride, dialkyl benzenealkyl ammonium chloride, lauryl trimethyl ammonium chloride, alkylbenzyl methyl ammonium chloride, alkyl benzyl dimethyl ammonium bromide, C 12 trimethyl ammonium bromide, C 15 trimethyl ammonium bromide, C 17 trimethyl ammonium bromide, dodecylbenzyl triethyl ammonium chloride, polydiallyldimethylammonium chloride, dimethyl ammonium chloride, alkyldimethylammonium halogenide, tricetyl methyl ammonium chloride, decyltrimethylammonium bromide , dodecyltriethylammonium bromide, tetradecyltrimethylammonium bromide, methyl trioctylammonium chloride, POLYQUAT 10, tetrabutylammonium bromide, benzyl trimethylammonium bromide, choline ester, benzalkonium chloride, stearalkonium chloride, Cetyl pyridinium bromide, cetyl pyridinium chloride, halide salt of quaternized polyoxyethylalkylamine, "MIRAPOL" (Polyquaternium-2) "Alkaquat" (alkyl dimethyl benzylammonium chloride, manufactured by Rhodia), alkyl pyridinium salts, amines, amine salts, imide azolinium salts, protonated quaternary acrylamides, methylated quaternary polymers, and cationic guar gum. benzalkonium chloride, dodecyl trimethyl ammonium bromide, triethanolamine and poloxamine.
양쪽 이온성 계면활성제는 전기적으로 중성이지만 동일 분자 내에서 국부적인 양전하 및 음전하를 보유한다. 적합한 양쪽 이온성 계면활성제에는, 이에 제한되지 않지만, 양쪽 이온성 인지질이 포함된다. 적합한 인지질에는 포스파티딜콜린, 포스파티딜에탄올아민, 디아실-글리세로-포스포에탄올아민 (예컨대, 디미리스토일-글리세로-포스포에탄올아민(DMPE), 디팔미토일-글리세로-포스포에탄올아민 (DPPE), 디스테아로일-글리세로-포스포에탄올아민(DSPE) 및 디올레올릴-글리세로-포스포에탄올아민(DOPE)이 포함된다. 음이온성 및 양쪽 이온성 인지질을 포함하는 인지질 혼합물이 본 발명에서 사용될 수 있다. 이러한 혼합물에는, 이에 제한되지 않지만, 라이소인지질, 달걀 또는 대두 인지질, 또는 이의 임의의 조합물이 포함된다.Zwitterionic surfactants are electrically neutral but possess local positive and negative charges within the same molecule. Suitable zwitterionic surfactants include, but are not limited to, zwitterionic phospholipids. Suitable phospholipids include phosphatidylcholine, phosphatidylethanolamine, diacyl-glycero-phosphoethanolamine (e.g. dimyristoyl-glycero-phosphoethanolamine (DMPE), dipalmitoyl-glycero-phosphoethanolamine ( DPPE), distearoyl-glycero-phosphoethanolamine (DSPE) and dioleolyl-glycero-phosphoethanolamine (DOPE) Phospholipid mixtures comprising anionic and zwitterionic phospholipids are Such mixtures include, but are not limited to, lysophospholipids, egg or soybean phospholipids, or any combination thereof.
상기 분산제는, 방열 도료 조성물의 분산성을 증대 시키고, 밀도를 고르게 하며, 레올로지(Rheology) 컨트롤을 적절히 조정할 수 있도록 포함되는 것일 수 있다.The dispersant may be included to increase the dispersibility of the heat dissipating paint composition, to make the density even, and to appropriately adjust the rheology control.
상기 분산제는, 상기 방열 도료 조성물 중 0.5 중량% 내지 1.5 중량%인 것일 수 있다. 상기 분산제가 상기 방열 도료 조성물 중 0.5 중량% 미만인 경우 상기 충전제가 잘 분산되지 않아 응집현상이 증가할 수 있고, 1.5 중량% 초과인 경우 접착력이 저하될 우려가 있다.The dispersant may be 0.5% to 1.5% by weight of the heat dissipating paint composition. When the dispersant is less than 0.5% by weight in the heat dissipating paint composition, the filler is not well dispersed, and thus aggregation may increase.
상기 침강방지제는 조성물의 흐름성을 조절하고, 입자의 침강과 케이킹(caking) 현상을 방지하거나 늦춰주는 역할을 한다. 상기 침강방지제는 우레아(urea)계 화합물 또는 아마이드계 화합물을 사용할 수 있고, 비중이 높은 열전도성 입자의 침강을 방지할 수 있다.The anti-settling agent controls the flowability of the composition and serves to prevent or slow down the sedimentation and caking phenomena of the particles. The anti-settling agent may use a urea-based compound or an amide-based compound, and may prevent sedimentation of thermally conductive particles having a high specific gravity.
상기 방열 도료 조성물은 상기 바인더 수지 내에 분산된 침강방지제를 포함하고, 이때 상기 침강방지제를 조성물 총 중량을 기준으로 0.5~1중량%로 포함될 수 있다. The heat-dissipating paint composition includes an anti-settling agent dispersed in the binder resin, and in this case, the anti-settling agent may be included in an amount of 0.5 to 1% by weight based on the total weight of the composition.
본 출원의 하나의 실시예는, 상기 방열 도료 조성물을 밀링하여 분산액을 제조하는 단계(S1); 및 상기 분산액에 디이소시아네이트계 경화제 또는 아민계 경화제를 첨가하여 방열 도료를 제조하는 단계(S2); 를 포함하는 방열도료의 제조방법을 제공한다.One embodiment of the present application includes preparing a dispersion by milling the heat dissipating paint composition (S1); and preparing a heat-dissipating paint by adding a diisocyanate-based curing agent or an amine-based curing agent to the dispersion (S2); It provides a method for producing a heat dissipating paint comprising a.
상기 분산액을 제조하는 단계(S1)는, 상기 방열 도료 조성물을 혼합하여 분산 혼합액을 제조하는 단계(S11)를 포함할 수 있다. 상기 조성물을 교반기에 넣고, 예를 들어, 50 rpm 내지 1500 rpm의 속도로 5분 내지 6시간 동안 교반을 수행하는 것일 수 있다. 교반 시간이 너무 짧은 경우에는 균일한 혼합이 이루어지기 어렵고, 교반 시간이 너무 긴 경우에도 더 이상의 균일한 혼합 효과를 기대하기 어렵다.Preparing the dispersion (S1) may include mixing the heat dissipating paint composition to prepare a dispersion mixture (S11). The composition may be put into a stirrer and stirred for 5 minutes to 6 hours at a speed of, for example, 50 rpm to 1500 rpm. If the stirring time is too short, it is difficult to achieve uniform mixing, and even if the stirring time is too long, it is difficult to expect a more uniform mixing effect.
상기 분산액을 제조하는 단계(S1)는, 상기 분산 혼합액을 제조하는 단계(S11) 이후에, 상기 분산 혼합액을 밀링하여 흑연과 기타 열전도성 입자들을 최적 크기로 분쇄, 박리하여 균일하게 분산된 용액을 제조하는 단계(S12);를 포함할 수 있다. 상기 밀링은 초음파, 롤 밀링, 볼 밀링, 제트 밀링, 스크루 혼합, 어트리션 밀링, 비즈 밀링, 바스켓 밀링, 공자전 혼합 및 수퍼밀로 이루어진 군으로부터 선택되는 일 이상의 방식에 의해 이루어질 수 있다.In the step of preparing the dispersion (S1), after the step of preparing the dispersion mixture (S11), the dispersion mixture is milled to pulverize and exfoliate graphite and other thermally conductive particles to an optimal size to obtain a uniformly dispersed solution. Manufacturing step (S12); may include. The milling may be performed by at least one method selected from the group consisting of ultrasonic, roll milling, ball milling, jet milling, screw mixing, attrition milling, bead milling, basket milling, co-rotational mixing, and super mill.
상기 분산액을 제조하는 단계(S1) 이전에, 흑연에 초음파 처리하는 단계, 또는 초고압 분산기로 흑연을 분산처리하는 단계, 또는 고속전단기로 흑연을 처리하는 단계(S0);를 더 포함할 수 있다. Prior to preparing the dispersion (S1), ultrasonic treatment of graphite, dispersing treatment of graphite with an ultra-high pressure disperser, or processing of graphite with a high-speed shear (S0) may be further included. .
본 출원의 하나의 실시예는 방열 도료 조성물을 기재 상에 도포하고, 70℃ 내지 120℃에서, 바람직하게는 70℃ 내지 100℃에서, 30분 내지 6시간 동안 소성하여 형성된 방열 코팅막을 제공한다. One embodiment of the present application provides a heat-dissipating coating film formed by applying a heat-dissipating paint composition on a substrate and firing at 70 ° C to 120 ° C, preferably 70 ° C to 100 ° C, for 30 minutes to 6 hours.
상기 도포는, 스프레이 코팅(spray coating), 잉크젯 프린팅, 롤 프린팅, 디핑(dipping) 코팅, 콤마 코팅, 그라비아 코팅, 롤투롤 및 바 코팅으로 이루어진 군으로부터 선택되는 적어도 어느 하나를 포함하는 다양한 방법을 이용할 수 있다. 상기 코팅되는 두께는 발광다이오드 또는 인쇄회로기판 등의 방열판으로 사용될 뿐만 아니라 고전력 소자의 방열판으로도 사용될 수 있으므로, 이를 고려하여, 10 ㎛ 내지 50 ㎛ 두께, 더 구체적으로 20 ㎛ 내지 40 ㎛ 로 형성할 수 있다. 상기 두께 이상으로 코팅될 경우 비용 상승 및 크랙이 발생할 가능성이 있고, 그 이하일 경우에는 좋은 방열 성능을 발휘할 수 없다.The application may use various methods including at least one selected from the group consisting of spray coating, inkjet printing, roll printing, dipping coating, comma coating, gravure coating, roll-to-roll and bar coating. can Since the thickness of the coating can be used as a heat sink for a light emitting diode or a printed circuit board as well as a heat sink for a high-power device, in consideration of this, it is formed to a thickness of 10 μm to 50 μm, more specifically, 20 μm to 40 μm. can If the thickness is more than the above, there is a possibility of cost increase and cracking, and if it is less than that, good heat dissipation performance cannot be exhibited.
상기 방열 도료 조성물의 코팅이 기재에 이루어지면 열경화하여 용매가 휘발(또는 증발)되고, 방열잉크 조성물이 경화되도록 할 수 있다. When the coating of the heat-dissipating paint composition is formed on the substrate, it is thermally cured so that the solvent is volatilized (or evaporated) and the heat-dissipating ink composition is cured.
상기 기재는, 알루미늄, 구리 등의 여러 금속 소재 및 유리, 플라스틱 등에 대해 제한 없이 사용할 수 있으며, 방열성 및 부착성이 우수할 뿐만 아니라 경도, 내용제성 및 내수성도 뛰어나다.The substrate can be used without limitation for various metal materials such as aluminum and copper, as well as glass and plastic, and has excellent heat dissipation and adhesion, as well as excellent hardness, solvent resistance and water resistance.
상기 건조는 용매가 휘발(또는 증발)되는 온도보다 높고 기재의 용융 온도보다는 낮은 온도에서 수행하는 것일 수 있다. 예를 들어, 70℃ 내지 120℃의 온도에서, 30 분 내지 6 시간 동안 수행되는 것일 수 있다. 상기 열경화 시간이 너무 짧은 경우에는 용제의 완전한 제거가 어렵고, 열경화 시간이 너무 긴 경우에는 더 이상의 열경화 효과를 기대하기 어려울 수 있다.The drying may be performed at a temperature higher than the temperature at which the solvent volatilizes (or evaporates) and lower than the melting temperature of the substrate. For example, it may be performed at a temperature of 70° C. to 120° C. for 30 minutes to 6 hours. If the thermal curing time is too short, it is difficult to completely remove the solvent, and if the thermal curing time is too long, it may be difficult to expect a further thermal curing effect.
방열재료의 제조방법에 의하여 제조된 방열 도료는, 열을 효과적으로 방출할 수 있고, 빠른 열 방출속도와 높은 열 방사율을 가지며, 3차원 형상의 기재와의 접착력이 매우 우수한 방열 도료 조성물로 코팅함으로써 발광다이오드 또는 인쇄회로기판 등에서 발생하는 열을 방출하기에 매우 효과적이다.The heat-dissipating paint prepared by the heat-dissipating material manufacturing method can emit heat effectively, has a fast heat release rate and high heat emissivity, and emits light by being coated with a heat-dissipating paint composition having excellent adhesion to a three-dimensional substrate. It is very effective in dissipating heat generated from diodes or printed circuit boards.
본 출원의 하나의 실시예는 소자가 실장된 회로기판 외부면의 적어도 일부분에 본 출원에 따른 방열 도료 조성물이 처리되어 경화된 방열 코팅막을 포함하는 방열 회로기판을 포함한다.One embodiment of the present application includes a heat-dissipating circuit board including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the circuit board on which elements are mounted with the heat-dissipating paint composition according to the present application.
상기 소자는 구동칩과 같은 전자기기내 회로기판에 실장되는 공지된 소자일 수 있다. 또한, 상기 기판은 전자기기에 구비되는 공지된 회로기판일 수 있으며, 일예로 PCB, FPCB일 수 있다. 상기 기판의 크기, 두께는 구현하고자 하는 전자기기의 내부설계에 따라 변경이 가능함에 따라서 본 출원은 이에 대해 특별히 한정하지 않는다.The element may be a known element mounted on a circuit board in an electronic device such as a driving chip. In addition, the substrate may be a known circuit board provided in an electronic device, and may be, for example, a PCB or FPCB. Since the size and thickness of the substrate can be changed according to the internal design of the electronic device to be implemented, the present application is not particularly limited thereto.
본 출원은 외부면의 적어도 일부분에 본 출원에 따른 방열 도료 조성물이 처리되어 경화된 방열 코팅막을 포함하는 조명용 방열 부품을 포함한다.The present application includes a heat dissipation part for lighting including a heat dissipation coating film cured by treating at least a portion of an outer surface of the heat dissipation paint composition according to the present application.
상기 조명용 방열 부품은 조명용 방열 히트싱크일 수 있다. 구체적으로, 상기 조명용 방열 히트싱크는 히트싱크 및 상기 히트싱크의 외부면의 적어도 일부 또는 전부에 형성된 방열 코팅층를 포함할 수 있다.The heat dissipation component for lighting may be a heat dissipation heat sink for lighting. Specifically, the heat dissipation heat sink for lighting may include a heat sink and a heat dissipation coating layer formed on at least a part or all of an outer surface of the heat sink.
상기 히트싱크는 조명에 구비되는 공지된 히트싱크일 수 있다. 상기 히트싱크의 재질, 크기, 두께, 및 형상은 구현하고자 하는 조명의 용도, 형상 및 내부설계에 따라 변경이 가능함에 따라서 본 출원은 이에 대해 특별히 한정하지 않는다.The heat sink may be a known heat sink provided in lighting. Since the material, size, thickness, and shape of the heat sink can be changed according to the purpose, shape, and internal design of lighting to be realized, the present application is not particularly limited thereto.
한편, 본 출원에 따른 방열 도료 조성물은 상술한 방열유닛, 회로기판 및 조명용 부품 외에도 모바일 기기, TV, 웨어러블 기기 및 플렉서블 기기 등을 포함하는 전자장치 부품, LED 램프, ECU(electronic control unit), EV 배터리 및 인버터 등을 포함하는 자동차 부품, RF 장비, 디지털 장비, 서버기기 및 셋업박스 등을 포함하는 전기통신장치와 네트워크 장치 및 태양전지판, LED 및 AI/AIN PCB(Printed circuit Board) 등을 포함하는 장치, 조명 케이스 및 소켓 등을 포함하는 조명용 부품 등에 적용할 수 있다. 일예로, 외부면의 적어도 일부분에 본 출원에 따른 방열 도료 조성물이 처리되어 경화된 방열 코팅막이 적용된 EV 고전압 스위칭 릴레이용 방열 부스바, EV 고전압 스위칭 릴레이용 방열 케이스, 자동차용 방열 DC-DC 컨버터, 자동차 엔진 냉각 장치, 자동차 LED 헤드램프 및 PTC 히터로 이루어진 군에서 선택된 1종 이상을 포함하는 자동차용 부품에 적용될 수 있다.On the other hand, the heat dissipation paint composition according to the present application is an electronic device component including mobile devices, TVs, wearable devices and flexible devices, LED lamps, ECU (electronic control unit), EV, in addition to the above-described heat dissipation unit, circuit board and lighting parts Automotive parts including batteries and inverters, RF equipment, digital equipment, telecommunications devices including server devices and setup boxes, network devices, solar panels, LEDs and AI/AIN PCBs (Printed Circuit Boards), etc. It can be applied to parts for lighting including devices, lighting cases and sockets. As an example, a heat-dissipating busbar for EV high-voltage switching relays, a heat-dissipating case for EV high-voltage switching relays, a heat-dissipating DC-DC converter for vehicles, It can be applied to automobile parts including at least one selected from the group consisting of automobile engine cooling devices, automobile LED headlamps, and PTC heaters.
상기 자동차용 부품은 외부면의 적어도 일부분에 본 출원에 따른 방열 도료 조성물이 처리되어 경화된 방열 코팅막을 포함하는 EV 고전압 릴레이용 방열 부스바일 수 있다.The automotive part may be a heat-dissipating bus bar for an EV high-voltage relay including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the heat-dissipating paint composition according to the present application.
상기 EV 고전압 릴레이용 부스바는 당업계에서 통상적으로 사용할 수 있는 공지된 EV 고전압 릴레이용 부스바일 수 있으며, 상기 부스바의 재질, 크기, 두께, 및 형상은 구현하고자 하는 EV 고전압 릴레이의 목적하는 입력전압 및/또는 출력전압을 고려한 내부설계에 따라 변경이 가능함에 따라서 본 출원은 이에 대해 특별히 한정하지 않는다.The EV high voltage relay busbar may be a known EV high voltage relay busbar commonly used in the art, and the material, size, thickness, and shape of the busbar are the desired input of the EV high voltage relay to be implemented. As the voltage and / or output voltage can be changed according to the internal design in consideration, the present application is not particularly limited thereto.
또한, 상기 자동차용 부품은 외부면의 적어도 일부분에 본 출원에 따른 방열 도료 조성물이 처리되어 경화된 방열 코팅막을 포함하는 EV 고전압 스위칭 릴레이용 방열 케이스일 수 있다.In addition, the automotive part may be a heat dissipation case for an EV high voltage switching relay including a heat dissipation coating film cured by treating at least a portion of an outer surface of the heat dissipation paint composition according to the present application.
상기 EV 고전압 스위칭 릴레이용 케이스는 당업계에서 통상적으로 사용할 수 있는 공지된 EV 고전압 릴레이용 케이스 일 수 있다. 상기 EV 고전압 스위칭 릴레이용 케이스 내부에 상술한 EV 고전압 릴레이용 부스바를 포함할 수 있으며, 상기 케이스의 재질, 크기, 두께 및 형상은 구현하고자 하는 EV 고전압 릴레이 내부에 위치되는 부스바의 형상 및 개수 등의 내부설계에 따라 변경이 가능함에 따라서 본 출원은 이에 대해 특별히 한정하지 않는다.The case for the EV high voltage switching relay may be a case for a known EV high voltage relay commonly used in the art. The EV high voltage switching relay case may include the above-described EV high voltage relay busbar, and the material, size, thickness and shape of the case may be determined by the shape and number of busbars located inside the EV high voltage relay to be implemented. As it is possible to change according to the internal design of the present application is not particularly limited thereto.
또한, 상기 자동차용 부품은 외부면의 적어도 일부분에 본 출원에 따른 방열 도료 조성물이 처리되어 경화된 방열 코팅막을 포함하는 방열 DC-DC 컨버터일 수 있다.In addition, the automotive part may be a heat-dissipating DC-DC converter including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the heat-dissipating paint composition according to the present application.
상기 DC-DC 컨버터는 특정 전압의 직류전원에서 다른 전압의 직류전원으로 변환하는 기능을 하며, 당업계에서 통상적으로 사용할 수 있는 공지된 DC-DC 컨버터일 수 있다. 상기 DC-DC 컨버터의 크기 및 형상은 구현하고자 하는 장치의 내부설계에 따라 변경이 가능함에 따라서 본 출원은 이에 대해 특별히 한정하지 않는다.The DC-DC converter functions to convert DC power of a specific voltage into DC power of another voltage, and may be a known DC-DC converter commonly used in the art. Since the size and shape of the DC-DC converter can be changed according to the internal design of a device to be implemented, the present application is not particularly limited thereto.
또한, 상기 자동차용 부품은 외부면의 적어도 일부분에 본 출원에 따른 방열 도료 조성물이 처리되어 경화된 방열 코팅막을 포함하는 방열 엔진 냉각 장치일 수 있다.In addition, the automotive part may be a heat dissipation engine cooling device including a heat dissipation coating film cured by treating at least a portion of an outer surface of the heat dissipation paint composition according to the present application.
일예로, 상기 방열 엔진 냉각 장치에 포함되는 라디에이터의 일부 또는 일예로, 상기 방열 엔진 냉각 장치에 포함되는 라디에이터의 일부 또는 전부에 방열 코팅막이 형성될 수 있다. 상기 라디에이터는 당업계에서 통상적으로 사용할 수 있는 공지된 라디에이터일 수 있으며, 상기 라디에이터의 재질, 크기 및 형상은 구현하고자 하는 엔진 냉각 장치의 내부설계에 따라 변경이 가능함에 따라서 본 출원에서는 이에 대해 특별히 한정하지 않는다.For example, a heat dissipation coating film may be formed on a part of a radiator included in the heat dissipation engine cooling device or, for example, a part or all of the radiator included in the heat dissipation engine cooling device. The radiator may be a known radiator commonly used in the art, and since the material, size and shape of the radiator can be changed according to the internal design of the engine cooling device to be implemented, the present application is specifically limited thereto. I never do that.
또한, 상기 자동차용 부품은 외부면의 적어도 일부분에 본 출원에 따른 방열 도료 조성물이 처리되어 경화된 방열 코팅막을 포함하는 방열 LED 헤드 램프일 수 있다.In addition, the automotive part may be a heat-dissipating LED headlamp including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the heat-dissipating paint composition according to the present application.
LED 헤드 램프의 외부면의 적어도 일부분에 방열 코팅막을 포함함에 따라, 절연 및 방열 특성을 현저히 향상시킬 수 있으며 LED 헤드 램프가 경량화될 수 있다. 상기 LED 헤드 램프는 당업계에서 통상적으로 사용할 수 있는 공지된 LED 헤드 램프일 수 있으며, 상기 LED 헤드 램프의 재질, 크기 및 형상은 구현하고자 하는 차량의 디자인 및/또는 LED 헤드 램프의 내부설계에 따라 변경이 가능함에 따라서 본 출원에서는 이에 대해 특별히 한정하지 않는다.As the heat dissipation coating film is included on at least a portion of the outer surface of the LED head lamp, insulation and heat dissipation characteristics can be remarkably improved and the LED head lamp can be lightweight. The LED headlamp may be a known LED headlamp commonly used in the art, and the material, size and shape of the LED headlamp depend on the design of the vehicle to be implemented and / or the internal design of the LED headlamp. As changes are possible, this application is not particularly limited thereto.
또한, 상기 자동차용 부품은 외부면의 적어도 일부분에 본 출원에 따른 방열 도료 조성물이 처리되어 경화된 방열 코팅막을 포함하는 전기 자동차용 방열 PTC 히터일 수 있다.In addition, the automotive part may be a heat-dissipating PTC heater for an electric vehicle including a heat-dissipating coating film cured by treating at least a portion of an outer surface of the heat-dissipating paint composition according to the present application.
상기 PTC 히터는 PTC 핀을 포함할 수 있는데, 상기 PTC 핀의 일부 또는 전부에 방열 코팅막이 형성됨에 따라, 방열 효율이 개선될 수 있고, 전기 자동차의 소모 전력량이 감소할 수 있다. 상기 PTC 핀은 당업계에서The PTC heater may include PTC fins, and as a heat dissipation coating film is formed on some or all of the PTC fins, heat dissipation efficiency may be improved and power consumption of the electric vehicle may be reduced. The PTC pin is in the art
통상적으로 사용할 수 있는 공지된 PTC 핀일 수 있으며, 상기 PTC 핀의 재질, 크기 및 형상은 구현하고자 하는 PTC 히터의 내부설계에 따라 변경이 가능함에 따라서 본 출원에서는 이에 대해 특별히 한정하지 않는다.It may be a known PTC pin that can be commonly used, and since the material, size, and shape of the PTC pin can be changed according to the internal design of the PTC heater to be implemented, the present application is not particularly limited thereto.
한편, 본 출원의 방열 코팅막을 형성시키는 방열 코팅 조성물은 방열 코팅막과 기재간의 우수한 접착력, 향상된 내습성 및 내후성, 방열필러의 습윤성을 향상시킬 수 있다. 또한, 우수한 방열성 및 절연성, 유기용매에 대해 뛰어난 내용매성을 발현하며, 경화 시 변색이 없고, 열전도의 조절이 용이함에 따라 이로 구현된 절연성 방열코팅층을 포함하는 방열유닛은 향상된 물성을 지속적으로 발현할 수 있다. 또한, 방열 코팅막 내에 분산된 방열필러의 분산성이 우수하여 균일한 절연 및 방열성능을 나타낼 수 있다. 절연성 및 방열성이 동시에 요구되는 각종 전기전자 부품이 실장된 회로기판, LED 램프 등의 조명장치, 디스플레이 장치 등의 전기전자, 자동차, 에너지, 항공우주 산업 전반에 널리 응용될 수 있다.Meanwhile, the heat-dissipating coating composition for forming the heat-dissipating coating film of the present application may improve excellent adhesion between the heat-dissipating coating film and the substrate, improved moisture resistance and weather resistance, and wettability of the heat-dissipating filler. In addition, as it exhibits excellent heat dissipation and insulation properties, excellent solvent resistance to organic solvents, no discoloration during curing, and easy control of heat conduction, a heat dissipation unit including an insulating heat dissipation coating layer realized with this can continuously express improved physical properties. can In addition, the dispersibility of the heat-dissipating filler dispersed in the heat-dissipating coating film is excellent, so that uniform insulation and heat dissipation performance can be exhibited. It can be widely applied to electrical and electronic, automobile, energy, and aerospace industries such as circuit boards mounted with various electric and electronic components requiring insulation and heat dissipation, lighting devices such as LED lamps, and display devices.
하기의 실시예를 통하여 본 출원을 더욱 구체적으로 설명하기로 하지만, 하기 실시예가 본 출원의 범위를 제한하는 것은 아니며, 이는 본 출원의 이해를 돕기 위한 것으로 해석되어야 할 것이다.Although the present application will be described in more detail through the following examples, the following examples are not intended to limit the scope of the present application, which should be interpreted to aid understanding of the present application.
이하, 본 출원의 실시예, 비교예 및 실험예를 설명하기로 한다.Hereinafter, Examples, Comparative Examples, and Experimental Examples of the present application will be described.
<실시예 1><Example 1>
아크릴 폴리올(OH value 90) 20 중량부, 카프로락톤 폴리올(OH value 280, MW 400) 20 중량부, 팽창흑연(평균입도 50 μm) 9.0 중량부, 알루미늄 파우더(Flake, 평균입도 25 μm) 4.2 중량부, 다공성 SiO2(평균입도 4 μm) 3.2 중량부, 인산에폭시에스터 8.5 중량부, 분산제(phosphoric ACID ester of polyethoxylated alkyl phenol) 0.5 중량부, 실리콘계 소포제(AFCONA 2722) 1.0 중량부, 침강방지제(우레아) 0.5 중량부, 슬립제(폴리에테르 폴리실록산) 0.1 중량부. N-부틸아세테이트 13 중량부, PMA(프로필렌글리콜 모노메틸에테르 아세테이트) 20 중량부를 디졸버 믹서로 균일하게 혼합하였다. 혼합액을 바스킷 밀링기(Basket mill)에 옮긴 후 3시간 밀링하였다. 최종적인 도료의 점도는 700 cps였다. Acrylic polyol (OH value 90) 20 parts by weight, caprolactone polyol (OH value 280, MW 400) 20 parts by weight, expanded graphite (average particle size 50 μm) 9.0 parts by weight, aluminum powder (Flake, average particle size 25 μm) 4.2 parts by weight Part, porous SiO 2 (average particle size 4 μm) 3.2 parts by weight, phosphoric acid epoxy ester 8.5 parts by weight, dispersing agent (phosphoric ACID ester of polyethoxylated alkyl phenol) 0.5 parts by weight, silicone-based antifoaming agent (AFCONA 2722) 1.0 parts by weight, anti-settling agent (urea ) 0.5 part by weight, slip agent (polyether polysiloxane) 0.1 part by weight. 13 parts by weight of N-butyl acetate and 20 parts by weight of PMA (propylene glycol monomethyl ether acetate) were uniformly mixed with a dissolver mixer. The mixture was transferred to a basket mill and milled for 3 hours. The viscosity of the final paint was 700 cps.
<실시예 2><Example 2>
실시예 1의 '카프로락톤 폴리올 20 중량부' 대신, 에스터 폴리올(OH value 66, MW 400) 20 중량부를 사용한 것 외는 실시예 1과 동일하였다. 최종적인 도료의 점도는 700 cps였다. It was the same as in Example 1 except that 20 parts by weight of ester polyol (OH value 66, MW 400) was used instead of '20 parts by weight of caprolactone polyol' in Example 1. The viscosity of the final paint was 700 cps.
<실시예 3><Example 3>
실시예 1의 '아크릴 폴리올(OH value 90) 20 중량부, 카프로락톤 폴리올(OH value 280, MW 400) 20 중량부' 대신 아크릴 폴리올(OH value 90) 40 중량부 외에는 실시예 1과 동일하다. It is the same as Example 1 except for 40 parts by weight of acrylic polyol (OH value 90) instead of '20 parts by weight of acrylic polyol (OH value 90), 20 parts by weight of caprolactone polyol (OH value 280, MW 400)' of Example 1.
<실시예 4><Example 4>
실시예 1의 '팽창흑연(평균입도 50 μm) 9.0 중량부'대신 천연인상흑연(평균입도 25 μm) 9.0 중량부 사용 외는 실시예 1과 동일하다. It is the same as in Example 1 except for using 9.0 parts by weight of natural impression graphite (average particle size 25 μm) instead of 9.0 parts by weight of 'expanded graphite (average particle size 50 μm)' of Example 1.
<실시예 5><Example 5>
실시예 1의 '침강방지제(우레아) 0.5 중량부'를 사용하지 않은 것 외에는 실시에 1과 동일하다.It is the same as in Example 1 except that the 'anti-settling agent (urea) 0.5 parts by weight' of Example 1 was not used.
<실시예 6><Example 6>
실시예 1의 3시간 밀링 대신 30분 밀링 외에는 실시예 1과 동일하다. Same as Example 1 except for 30 minutes of milling instead of 3 hours of Example 1.
<실시예 7><Example 7>
실시예 1의 '분산제(phosphoric ester of polyethoxylated alkyl phenol) 0.5 중량부, 실리콘계 소포제(AFCONA 2722) 1.0 중량부, 침강방지제(우레아) 0.5 중량부'를 사용하지 않은 것 외에는 실시예 1과 동일하다.It is the same as Example 1 except that '0.5 parts by weight of a dispersant (phosphoric ester of polyethoxylated alkyl phenol), 1.0 parts by weight of a silicone-based antifoaming agent (AFCONA 2722), and 0.5 parts by weight of an anti-settling agent (urea)' of Example 1 was not used.
<실시예 8><Example 8>
3시간 밀링 대신 30분 밀링 외에는 실시예 4와 동일하다. Same as Example 4 except milling for 30 minutes instead of milling for 3 hours.
<실시예 9><Example 9>
실시예 1의 '아크릴 폴리올(OH value 90) 20 중량부, 카프로락톤 폴리올(OH value 280, MW 400) 20 중량부' 대신 BPA계 에폭시 수지(YD-128) 40중량부 외에는 실시예 1과 동일하다. Same as Example 1 except for 40 parts by weight of BPA-based epoxy resin (YD-128) instead of 'acrylic polyol (OH value 90) 20 parts by weight, caprolactone polyol (OH value 280, MW 400) 20 parts by weight' of Example 1 do.
<실시예 10><Example 10>
실시예 1에서 제조한 도료를 주제로 하여 HDI 대신 TDI를 사용한 것 외에는 동일하게 코팅하였다. The paint prepared in Example 1 was used as the subject and coated in the same manner except that TDI was used instead of HDI.
<실시예 11><Example 11>
실시예 1의 팽창흑연 9 중량부 대신 팽창흑연 2 중량부, 평균입도 0.5 μm의 카본블랙 7 중량부 외에는 실시예 1과 동일하였다. Except for 2 parts by weight of expanded graphite instead of 9 parts by weight of expanded graphite of Example 1 and 7 parts by weight of carbon black having an average particle size of 0.5 μm, it was the same as in Example 1.
<실시예 12><Example 12>
팽창흑연(평균입도 50 μm) 9.0 중량부, 알루미늄 파우더(Flake, 평균입도 25 μm) 4.2 중량부, 다공성 SiO2(평균입도 4 μm) 3.2 중량부 대신 팽창흑연 16.4 중량부 외에는 실시예 1과 동일하였다. Expanded graphite (average particle size 50 μm) 9.0 parts by weight, aluminum powder (Flake, average particle size 25 μm) 4.2 parts by weight, porous SiO 2 (average particle size 4 μm) 3.2 parts by weight instead of expanded graphite 16.4 parts by weight Same as in Example 1 except for did
<비교예 1><Comparative Example 1>
톨루엔 용제 50%와 우레탄 바인더 25%, 카본블랙 12.5%과 무기계 열전도성 입자 SiO2 12.5%로 이루어진 방열도료 조성물을 코팅하여 방열성능 평가하였다. A heat-dissipating paint composition composed of 50% toluene solvent, 25% urethane binder, 12.5% carbon black, and 12.5% inorganic thermally conductive particles SiO 2 was coated to evaluate heat dissipation performance.
<실험예 1> 방열도료 코팅<Experimental Example 1> Heat dissipation paint coating
NCO value 1.1에 해당하는 양이 되도록 각 실시예에서 제조한 방열도료 100 중량부에 HDI(헥사메틸렌디이소시아네이트) 삼량화제(trimer) 20 중량부를 잘 혼합하고 혼합액을 알루미늄 판에 양면 스프레이하여 80℃ 오븐 내에서 30분간 건조, 경화하였다. 다만, 실시예 9의 경우 에폭시기와 동일한 당량의 디에틸렌트리아민을 경화제로 사용하여 100℃ 오븐에서 3시간 경화하여 코팅하였다. 20 parts by weight of HDI (hexamethylene diisocyanate) trimer was well mixed with 100 parts by weight of the heat dissipating paint prepared in each example so that the amount corresponding to the NCO value of 1.1 was well mixed, and the mixed solution was sprayed on both sides of an aluminum plate in an 80 ° C oven. It was dried and cured for 30 minutes in However, in the case of Example 9, the coating was cured in an oven at 100 ° C. for 3 hours using the same amount of diethylenetriamine as the epoxy group as a curing agent.
<실험예 2> 방열성능 평가<Experimental Example 2> Evaluation of heat dissipation performance
가로, 세로, 높이 각각 400 mm x 150 mm x 500 mm인 아크릴 챔버를 항온오븐에 장착한 후 챔버 내부온도가 40℃가 되도록 조절하였다. 가로, 세로, 각각 235 mm, 150 mm 인 두께 1.5 mm 알루미늄(5000 계열) 판의 양면을 제조한 도료로 스프레이 하여 30±5 μm 두께로 코팅하였다. 코팅된 알루미늄판을 아크릴 챔버 정중앙에 위치하게 하고 15W 세라믹 히터를 써멀그리스(Thermal Grease)를 사용하여 알루미늄 판에 부착하였다. 이때 히터가 부착되는 면은 도료 코팅시 마스킹하여 도료가 도포되지 않도록 하였다. 히터를 가동하여 히터의 온도가 평형을 유지할 때의 온도를 측정하였다. 방열성능은 알루미늄판 대비 방열도료 코팅된 알루미늄 판을 부착하였을시 T1의 온도차이(℃)로 표기하였다. 도 1(a)는 알루미늄 판이고, 도 1(b)는 방열도료가 코팅된 알루미늄 판이다. 도 2는 방열성능을 평가하기 위한 샘플을 나타낸 것이다. 도 2의 샘플은 알루미늄 판(100)의 양면에 방열 도막(10)을 형성시키고, 세라믹 히터(30)를 써멀그리스(20)를 사용하여 부착한 것이다. 도 2에서 T1은 발열체 온도를 나타낸 것이고, T2는 외곽의 온도를 나타낸 것이며, T3는 챔버의 온도를 나타낸 것이다. After installing an acrylic chamber with dimensions of 400 mm x 150 mm x 500 mm in width, length, and height, respectively, in a constant temperature oven, the temperature inside the chamber was adjusted to 40°C. Both sides of a 1.5 mm aluminum (5000 series) plate of 235 mm and 150 mm in width and length, respectively, were sprayed with the prepared paint and coated to a thickness of 30 ± 5 μm. The coated aluminum plate was positioned at the center of the acrylic chamber, and a 15W ceramic heater was attached to the aluminum plate using thermal grease. At this time, the surface to which the heater is attached was masked during paint coating so that the paint was not applied. The heater was operated to measure the temperature when the temperature of the heater was in equilibrium. The heat dissipation performance was expressed as the temperature difference (℃) of T1 when the aluminum plate coated with the heat dissipation paint was attached to the aluminum plate. 1(a) is an aluminum plate, and FIG. 1(b) is an aluminum plate coated with a heat dissipating paint. 2 shows a sample for evaluating heat dissipation performance. In the sample of FIG. 2 , a heat dissipation coating film 10 is formed on both sides of an aluminum plate 100 and a ceramic heater 30 is attached using a thermal grease 20 . In FIG. 2 , T1 represents the temperature of the heating element, T2 represents the temperature of the outside, and T3 represents the temperature of the chamber.
<실험예 3> 보관성 평가<Experimental Example 3> Storage evaluation
도막의 물리적 특성을 측정하기 위해 도료의 보관성을 측정, 평가하기 위해 제조한 도료를 20℃에서 방치한 후 매주 방열성능을 측정하였다. 보관된 도료를 300 rpm의 교반속도로 10분간 교반 후 경화제를 투입한 후 다시 10분간 교반한 다음 코팅작업하여 방열성능을 측정하였다. 방열도료가 초기와 변동이 없는 주수를 측정하였다. In order to measure the physical properties of the paint film, the prepared paint was left at 20 ° C to measure and evaluate the storability of the paint, and then the heat dissipation performance was measured every week. After stirring the stored paint for 10 minutes at a stirring speed of 300 rpm, a curing agent was added, stirred for another 10 minutes, and then coated to measure heat dissipation performance. The number of times the heat dissipation paint was initially and unchanged was measured.
<실험예 4> 부착성(크로스컷), 평가<Experimental Example 4> Adhesion (crosscut), evaluation
도막의 물리적 특성을 측정하기 위해 예리한 칼을 사용해 시료에 가로X가로 간격 1mm씩 11줄을 그어 정사각형 100개를 만들고 이 면 위에 3M사 Scotch Brand No.600 Tape를 충분히 밀착한 후, 평면으로부터 약 15°위치에서 순간적으로 당긴다. 도막 두께 성적서 제출 시 Cross-cut 간격 변경 가능하다.(60㎛이하: 1mm, 61㎛이상: 2mm) ISO Class 1 기준으로 판정하여 표시하였다. (1개소도 박리 20% 넘어서면 안됨. 박리된 부위가 전체 면적의 5% 이내일 것)To measure the physical properties of the coating film, use a sharp knife to draw 11 lines at a distance of 1 mm horizontally and horizontally on the sample to make 100 squares. Momentarily pull at the ° position. It is possible to change the cross-cut interval when submitting the film thickness test report. (Do not exceed 20% of peeling in one area. The peeled area must be within 5% of the total area)
<실험예 5> 경도 평가<Experimental Example 5> Hardness evaluation
도막의 물리적 특성을 측정하기 위해 MITSUBUSHI 경도 측정용 연필의 심은 그대로 두고 연필심 약 5~6mm 길이로 나무를 깎아내고 연필 끝부분의 날이 날카롭게 연필심 끝을 사포에 갈아낸다. 연필경도 시험용 지그에 연필을 고정시키고 시편 표면과 45° 각도로 유지하면서 750±10g의 하중을 가한 상태로 전방으로 밀어낸다. 1개의 시편에 부위를 변경하면서 3회 시험하여 1회 이상 긁힘 흔적이 생기지 않으면 합격으로 한다. (연필긁힘 자국 수/시험 횟수, 1/3: 합격, 2/3: 불합격)긁힘 자국의 육안 판정이 어려울 경우 20배율 이상의 확대경으로 확인한다. 부품별 표면 경도(Plastic-연필경도 HB / 금속류-연필경도 2H 이상)In order to measure the physical properties of the coating film, the lead of the MITSUBUSHI hardness measurement pencil is left as it is, and the wood is cut into a length of about 5 to 6 mm, and the tip of the pencil is sharpened and the tip of the pencil is ground with sandpaper. Fix the pencil on the pencil hardness test jig and push it forward with a load of 750±10g applied while maintaining a 45° angle with the specimen surface. It is tested three times while changing the site on one specimen, and it is considered acceptable if there is no scratch mark more than once. (Number of pencil scratches/Number of tests, 1/3: pass, 2/3: fail) If it is difficult to visually determine the scratches, check with a magnifying glass of 20x magnification or higher. Surface hardness of each part (Plastic-Pencil hardness HB / Metals-Pencil hardness 2H or more)
<실험예 6> 열충격성 평가<Experimental Example 6> Evaluation of thermal shock
도막의 물리적 특성을 측정하기 위해 70℃ 1시간, -25℃ 1시간을 1Cycle로 하여 6Cycle 시험을 실시한 후, 외관, 후기 Cross-cut 이상 없을 것을 기준으로 하였다. In order to measure the physical properties of the coating film, after conducting a 6-cycle test with 70 ° C for 1 hour and -25 ° C for 1 hour as 1 cycle, it was based on the absence of abnormalities in appearance and later cross-cut.
하기 실시예 1 내지 12와 비교예 1에 따라 제조한 방열판의 실험예 1 내지 6에 따른 성능평가 결과를 하기 표 1에 나타내었다. The performance evaluation results according to Experimental Examples 1 to 6 of the heat sink manufactured according to Examples 1 to 12 and Comparative Example 1 are shown in Table 1 below.
도료항목Paint category 실시예 1Example 1 실시예 2Example 2 실시예 3Example 3 실시예 4Example 4 실시예 5Example 5 실시예 6Example 6 실시예 7Example 7 실시예 8Example 8 실시예 9Example 9 실시예 10Example 10 실시예
11
Example
11
실시예 12Example 12 비교예comparative example
도료 보관성(주)Paint Storage (Note) 88 88 88 77 66 88 55 77 88 44 88 88 77
도막 크로스컷 (B)Coating crosscut (B) 55 44 55 55 55 55 55 55 55 44 55 55 55
도막 표면경도 (H)Coating surface hardness (H) 22 22 22 22 22 22 22 22 22 22 22 22 22
도막 열충격 (B)Film thermal shock (B) 55 44 55 55 55 55 55 55 55 44 55 44 55
방열성능 (℃)Heat dissipation performance (℃) 1717 1717 1717 1515 1818 1616 1818 1515 1717 1717 1313 1616 1212
* 기준: 알루미늄판(히터 온도 95 ℃)* Standard: Aluminum plate (heater temperature 95 ℃)
표 1의 모든 실시예의 방열성능은 현재 시판 중인 대표적인 방열도료에 비해 3~6℃의 온도저하를 보여 우수한 방열성능을 나타냈다. 흑연은 밀링시 박리가 일어나 일부가 GNP나 그래핀 형태로 바인더 내에 분산되어 결과적으로 우수한 방열특성을 나타낸다고 판단된다. 실시예 1, 실시예 6, 실시예 7을 비교하였을 때 30분 밀링한 경우에 비해 3시간 밀링한 도료의 방열특성이 우수하였다. 이는 팽창흑연이 밀링시간에 따라 박리가 계속 발생함을 보여주는 것이다. 이에 비해 실시예 4와 실시예 8을 비교할 때 방열특성이 동일함을 알 수 있으며 이는 천연인상흑연의 경우 팽창흑연에 비해 외력에 의한 층간 박리가 크게 발생하지 않음을 나타낸다고 해석할 수 있다. The heat dissipation performance of all examples in Table 1 showed a temperature drop of 3 to 6 ° C. compared to representative heat dissipation paints currently on the market, showing excellent heat dissipation performance. It is believed that graphite is exfoliated during milling, and some of it is dispersed in the binder in the form of GNPs or graphene, resulting in excellent heat dissipation characteristics. Comparing Example 1, Example 6, and Example 7, heat dissipation characteristics of the paint milled for 3 hours were superior to those milled for 30 minutes. This shows that the exfoliation of the expanded graphite continues to occur according to the milling time. On the other hand, when comparing Example 4 and Example 8, it can be seen that the heat dissipation characteristics are the same, which can be interpreted as indicating that in the case of natural impression graphite, delamination due to external force does not occur significantly compared to expanded graphite.
실시예 11, 12는 팽창흑연 함량에 따른 효과를 보여준다. 실시예 11에서 팽창흑연 함량이 2 중량부로서 상대적으로 적은 경우는 도막의 물성은 실시예 1과 동일하나 방열성능은 현저히 떨어짐을 보여준다. 이와는 달리 팽창흑연 양이 16.4 중량부로 상대적으로 과량을 사용한 경우에도 오히려 방열성능은 떨어짐을 알 수 있다.Examples 11 and 12 show the effect of the expanded graphite content. In Example 11, when the expanded graphite content is relatively small as 2 parts by weight, the physical properties of the coating film are the same as in Example 1, but the heat dissipation performance is significantly deteriorated. In contrast, it can be seen that the heat dissipation performance is rather deteriorated even when the expanded graphite amount is 16.4 parts by weight and used in a relatively large amount.
첨가제 효과로서 실시예 5에서 침강방지제를 사용하지 않으면 도료의 보관성이 눈에 띄게 나빠짐을 알 수 있다. 그러나 흥미로운 점은 침강방지제를 사용하지 않을 경우 오히려 도료의 방열성능은 향상됨을 알 수 있다. 이는 침강방지제가 바인더 내의 방열입자 배열에 영향을 크게 미친다고 볼 수 있다. 특히 실시예 7의 경우 각종 첨가제, 특히 분산제를 사용하지 않은 경우 도료의 보관성은 악화되더라도 방열성능은 향상됨을 확인할 수 있다. 이는 바인더 내 입자 분산의 향상이 방열의 향상으로 이어진다는 통상적인 예측과는 반대되는 현상이다. 즉, 바인더내 열전도성 입자의 배열은 어느 정도 입자가 접촉과 응집이 있어야 방열효율이 좋아진다고 할 수 있다. As an additive effect, it can be seen that when the anti-settling agent is not used in Example 5, the storage property of the paint is noticeably deteriorated. However, what is interesting is that when the anti-settling agent is not used, the heat dissipation performance of the paint is rather improved. It can be seen that the anti-settling agent greatly affects the arrangement of heat dissipating particles in the binder. In particular, in the case of Example 7, when various additives, in particular, dispersants were not used, it could be confirmed that the heat dissipation performance was improved even though the storage stability of the paint was deteriorated. This is contrary to the conventional prediction that an improvement in particle dispersion in a binder leads to an improvement in heat dissipation. That is, in the arrangement of the thermally conductive particles in the binder, it can be said that the heat dissipation efficiency is improved only when the particles have contact and aggregation to some extent.
실시예 2에서 에스터 폴리올은 지방족 사슬에 비해 구조적으로 견고한 방향족 성분을 함유하여, 도막의 경도를 증가시키지만 접착성을 저하시키는 것으로 나타났다. 한편 우레탄 대신 에폭시를 바인더로 사용하여도 방열성능에는 차이가 없음을 실시예 9에서 확인할 수 있으며, 우레탄 경화제로 HDI 대신 TDI를 사용하면 방열성에는 차이가 없으나 경화제가 방향족 화합물이므로 도막이 상대적으로 잘 부스러지고 접착력도 떨어지며 HDI에 비해 높은 반응성으로 동일한 실온 보관시 4주 이상의 보관성을 확보하기가 쉽지 않았다. In Example 2, it was shown that the ester polyol contains an aromatic component that is structurally stronger than the aliphatic chain, increasing the hardness of the coating film but lowering the adhesiveness. On the other hand, it can be seen in Example 9 that there is no difference in heat dissipation performance even when epoxy is used as a binder instead of urethane, and when TDI is used instead of HDI as a urethane curing agent, there is no difference in heat dissipation property, but since the curing agent is an aromatic compound, the coating film is relatively brittle and It has poor adhesive strength and is highly reactive compared to HDI, so it was not easy to secure storage for more than 4 weeks at the same room temperature.
<실험예 7> 밀링 시간에 따른 방열 효율의 측정 <Experimental Example 7> Measurement of heat dissipation efficiency according to milling time
실시예 1과 실시예 4의 조성물의 밀링 시간에 따른 방열 효율의 측정 결과를 도 3에 나타내었다. The results of measuring the heat dissipation efficiency according to the milling time of the compositions of Examples 1 and 4 are shown in FIG. 3 .
팽창흑연의 경우 밀링 전은 10%의 방열 효율을 보이고, 1시간 밀링 후 30%, 2시간 밀링 후 50%, 3시간 밀링 후 55%의 방열 효율을 보이므로, 2시간 이상 밀링 하였을 때 방열 효율이 좋고, 3시간 이상 밀링하였을 때 방열 효율이 매우 좋음을 확인할 수 있다. 3시간 이상부터 6시간 이하인 경우에는 방열 효율에 차이가 없었다. 그러나, 인상흑연의 경우 밀링 전은 20%의 방열 효율을 보이지만,밀링 1시간 후부터 25%의 방열 효율을 보임을 확인할 수 있다. 방열 효율(Heat radiation efficiency)은 기존 시판 도료 대비 온도저하 효율(℃ 기준)로 나타내었다. In the case of expanded graphite, heat dissipation efficiency is 10% before milling, 30% after milling for 1 hour, 50% after milling for 2 hours, and 55% after milling for 3 hours. It can be confirmed that this is good and the heat dissipation efficiency is very good when milling for 3 hours or more. In the case of 3 hours or more and 6 hours or less, there was no difference in heat dissipation efficiency. However, in the case of impression graphite, heat dissipation efficiency was 20% before milling, but it was confirmed that heat dissipation efficiency was 25% after 1 hour of milling. Heat radiation efficiency was expressed as temperature reduction efficiency (based on °C) compared to existing commercially available paints.
<실험예 8> 열전도도의 측정 <Experimental Example 8> Measurement of thermal conductivity
실시예 1에 대하여 25℃에서 밀링 시간에 따라 열전도도를 측정하여 하기 표 2에 나타내었다. 팽창흑연을 3시간 밀링하였을 때 열전도도가 매우 우수함을 확인할 수 있다.For Example 1, the thermal conductivity was measured according to the milling time at 25° C. and is shown in Table 2 below. It can be seen that the thermal conductivity is very excellent when the expanded graphite is milled for 3 hours.
1시간 1 hours 2시간2 hours 3시간3 hours
수직 열전도도(W/m.K)Vertical Thermal Conductivity (W/m.K) 1One 0.90.9 1.441.44
수평 열전도도(W/m.K)Horizontal Thermal Conductivity (W/m.K) 44 55 5.25.2
도 4는 밀링 전의 팽창흑연을 나타낸 것이고, 도 5는 3시간 밀링 후 팽창흑연의 SEM 사진을 나타낸 것이며, 도 6은 3시간 밀링 후 팽창흑연의 TEM 사진을 나타낸 것이다. 본 출원이 속하는 기술분야의 통상의 지식을 가진 자는 본 출원이 그 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다. 본 출원의 범위는 상기 상세한 설명보다는 후술하는 청구범위에 의하여 나타내어지며, 청구범위의 의미 및 범위 그리고 그 균등 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 출원의 범위에 포함되는 것으로 해석되어야 한다.Figure 4 shows the expanded graphite before milling, Figure 5 shows a SEM picture of expanded graphite after milling for 3 hours, Figure 6 shows a TEM picture of expanded graphite after milling for 3 hours. Those skilled in the art to which this application pertains will understand that this application can be implemented in other specific forms without changing its technical spirit or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. The scope of the present application is indicated by the following claims rather than the detailed description above, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts thereof should be construed as being included in the scope of the present application.

Claims (23)

  1. 방열도료 조성물에 있어서, In the heat dissipation paint composition,
    조성물 총 중량을 기준으로, Based on the total weight of the composition,
    바인더 수지 30 내지 60 중량%; 열전도성 입자 10 내지 25 중량%; 첨가제 5 내지 15 중량 %; 및 용제 10 내지 50 중량%; 을 포함하고, 30 to 60% by weight of a binder resin; 10 to 25% by weight of thermally conductive particles; 5 to 15% by weight of additives; and 10 to 50% by weight of a solvent; including,
    상기 바인더 수지는, The binder resin,
    우레탄 수지 또는 에폭시 수지를 포함하고, Contains a urethane resin or an epoxy resin,
    상기 열전도성 입자는, The thermally conductive particles,
    팽창흑연, 인상흑연, 인조흑연 및 토상흑연으로 이루어진 군에서 선택되는 적어도 하나 이상의 흑연; 및 금속 입자; 를 포함하는 방열도료 조성물. at least one or more graphite selected from the group consisting of expanded graphite, impression graphite, artificial graphite, and earthy graphite; and metal particles; A heat-dissipating paint composition comprising a.
  2. 청구항 1에 있어서,The method of claim 1,
    상기 조성물은, The composition,
    밀링하여 흑연에서 그래핀나노플레이트(GNP: graphene nanoplate) 또는 그래핀이 분리되도록 박리시킨 것이고,It is milled to separate graphene nanoplates (GNP) or graphene from graphite and exfoliate,
    상기 밀링 후 흑연 입자, 그래핀나노플레이트(GNP: graphene nanoplate) 입자 또는 그래핀 입자의 직경은 0.1 μm 내지 50 μm 인 것을 특징으로 하는 방열도료 조성물.After the milling, the graphite particles, graphene nanoplate (GNP) particles or graphene particles have a diameter of 0.1 μm to 50 μm, characterized in that the heat dissipation paint composition.
  3. 청구항 2에 있어서,The method of claim 2,
    상기 밀링에서 사용한 밀링 비드는, The milling beads used in the milling,
    0.05 mm 내지 3.0 mm 직경의 지르코니아인 것을 특징으로 하는 방열도료 조성물.A heat-dissipating paint composition characterized in that the zirconia has a diameter of 0.05 mm to 3.0 mm.
  4. 청구항 2에 있어서,The method of claim 2,
    상기 조성물은, The composition,
    디이소시아네이트계 경화제 또는 아민계 경화제를 첨가하여 경화시키는 것을 특징으로 하는 방열도료 조성물.A heat-dissipating paint composition characterized in that it is cured by adding a diisocyanate-based curing agent or an amine-based curing agent.
  5. 청구항 1에 있어서,The method of claim 1,
    상기 팽창측연은, The expansion side edge,
    산 처리 후 열처리에 의해서 층간 팽창이 이루어진 흑연인 것을 특징으로 하는 방열도료 조성물.A heat-dissipating paint composition, characterized in that graphite in which interlayer expansion is made by heat treatment after acid treatment.
  6. 청구항 1에 있어서,The method of claim 1,
    상기 조성물의 점도는, The viscosity of the composition is
    300 cps 이상 내지 1500 cps 이하인 것을 특징으로 하는 방열도료 조성물.A heat dissipation paint composition, characterized in that 300 cps or more to 1500 cps or less.
  7. 청구항 1에 있어서,The method of claim 1,
    상기 조성물은, The composition,
    디부틸틴디라우레이트인 경화 촉매; 및A curing catalyst which is dibutyl tin dilaurate; and
    에틸렌글리콜, 프로필렌글리콜, 디에틸렌글리콜, 1,3-부탄디올, 1,4-부탄디올, 네오펜틸글리콜, 3-메틸-1,5-펜탄디올, 2-부틸-2-에틸-1,3-프로판디올, 2,4-디에틸-1,5-펜탄디올, 1,2-헥산디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 2-메틸-1,8-옥탄디올, 1,8-데칸디올, 옥탄데칸디올, 글리세린, 트리메틸올프로판, 펜타에리트리톨 및 헥산트리올로 이루어진 군에서 선택되는 스페이서; 를 더 포함하는 것을 특징으로 하는 방열도료 조성물.Ethylene glycol, propylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3-propane Diol, 2,4-diethyl-1,5-pentanediol, 1,2-hexanediol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1, a spacer selected from the group consisting of 8-octanediol, 1,8-decanediol, octanedecanediol, glycerin, trimethylolpropane, pentaerythritol and hexanetriol; A heat-dissipating paint composition characterized in that it further comprises.
  8. 청구항 1에 있어서,The method of claim 1,
    상기 금속 입자는,The metal particles,
    알루미늄, 철, 동, 아연, 주석, 티탄, 니켈, 안티몬, 마그네슘, 바나듐, 크롬 및 지르코늄으로 이루어지는 군에서 선택되는 적어도 하나 이상이고, at least one selected from the group consisting of aluminum, iron, copper, zinc, tin, titanium, nickel, antimony, magnesium, vanadium, chromium, and zirconium;
    직경 5 μm 내지 40 μm 크기의 후레이크 타입인 것을 특징으로 하는 방열도료 조성물.A heat-dissipating paint composition characterized in that it is a flake type with a diameter of 5 μm to 40 μm.
  9. 청구항 1에 있어서,The method of claim 1,
    상기 열전도성 입자는, The thermally conductive particles,
    카본블랙, 단일벽탄소나노튜브, 다중벽탄소나노튜브, 그래핀 및 카본파이버로 이루어진 군에서 선택되는 적어도 하나 이상의 탄소; 및 at least one carbon selected from the group consisting of carbon black, single-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, and carbon fibers; and
    방열 필러; 중 하나 이상을 더 포함하는 것을 특징으로 하는 방열도료 조성물.heat-dissipating filler; A heat-dissipating paint composition, characterized in that it further comprises one or more of.
  10. 청구항 9에 있어서,The method of claim 9,
    상기 열전도성 입자는, The thermally conductive particles,
    흑연 5 내지 15 중량%; 5 to 15% by weight of graphite;
    금속 입자 1 내지 6 중량%; 1 to 6% by weight of metal particles;
    탄소 1 내지 5 중량%; 및1 to 5% by weight carbon; and
    방열 필러 1 내지 5 중량%; 를 포함하는 것을 특징으로 하는 방열도료 조성물.1 to 5% by weight of a heat dissipating filler; A heat-dissipating paint composition comprising a.
  11. 청구항 9에 있어서,The method of claim 9,
    상기 방열 필러는, The heat radiation filler,
    알루미나, 산화알루미늄, 산화마그네슘, 산화아연, 탄화규소, 질화알루미늄, 질화붕소, 질화규소, 수산화알루미늄, 수산화마그네슘, 보론카바이드, 지르코니아, 실리콘나이트라이드, 티탄산바륨, 티탄산스트론튬, 산화베릴륨, 산화망간, 산화지르코니아, 산화붕소 및 산화규소로 이루어진 군에서 선택되는 적어도 하나 이상인 것을 특징으로 하는 방열도료 조성물.Alumina, aluminum oxide, magnesium oxide, zinc oxide, silicon carbide, aluminum nitride, boron nitride, silicon nitride, aluminum hydroxide, magnesium hydroxide, boron carbide, zirconia, silicon nitride, barium titanate, strontium titanate, beryllium oxide, manganese oxide, oxide A heat-dissipating paint composition, characterized in that it is at least one selected from the group consisting of zirconia, boron oxide and silicon oxide.
  12. 청구항 1에 있어서,The method of claim 1,
    상기 우레탄 수지는, The urethane resin,
    아크릴 폴리올, 카프로락톤 폴리올, 에폭시 폴리올, 에스터 폴리올, 에테르 폴리올, 폴리카보네이트 폴리올, 폴리에틸렌글리콜, 폴리프로필렌글리콜, 폴리테트라메틸렌글리콜, 에틸렌 글리콜, 디에틸렌 글리콜, 1,3-부탄디올, 1,4-부탄디올, 네오펜틸 글리콜, 3-메틸-1,5-펜탄디올, 2-부틸-2-에틸-1,3-프로판디올, 2,4-디에틸-1,5-펜탄디올, 1,2-헥산디올, 1,6-헥산디올, 1,8-옥탄디올, 1,9-노난디올, 2-메틸-1,8-옥탄디올, 1,8-데칸디올, 옥탄데칸디올, 글리세린, 트리메틸올프로판, 펜타에리트리톨, 헥산트리올 및 폴리프로필렌 글리콜로 이루어진 군에서 선택되는 적어도 하나 이상인 것을 특징으로 하는 방열도료 조성물.Acrylic polyol, caprolactone polyol, epoxy polyol, ester polyol, ether polyol, polycarbonate polyol, polyethylene glycol, polypropylene glycol, polytetramethylene glycol, ethylene glycol, diethylene glycol, 1,3-butanediol, 1,4-butanediol , neopentyl glycol, 3-methyl-1,5-pentanediol, 2-butyl-2-ethyl-1,3-propanediol, 2,4-diethyl-1,5-pentanediol, 1,2-hexane Diol, 1,6-hexanediol, 1,8-octanediol, 1,9-nonanediol, 2-methyl-1,8-octanediol, 1,8-decanediol, octanedecanediol, glycerin, trimethylolpropane , Pentaerythritol, hexanetriol, and at least one selected from the group consisting of polypropylene glycol, characterized in that the heat dissipation paint composition.
  13. 청구항 1에 있어서,The method of claim 1,
    상기 에폭시 수지는, The epoxy resin,
    비스페놀계 에폭시, 페놀 노볼락(Phenol novolac)계 에폭시, o-크레졸 노볼락(Cresol novolac)계 에폭시, 다관능 에폭시, 아민계 에폭시, 복소환 함유 에폭시, 치환형 에폭시, 나프톨계 에폭시, 비스페놀 A 에폭시 수지, 에피클로르히드린형의 에폭시 수지. 에틸렌글리콜 글리시딜 에테르, 폴리에틸렌글리콜 디글리시딜에테르, 글리세린 디글리시딜에테르, 글리세린 트리글리시딜에테르, 1,6-헥산디올 디글리시딜에테르, 트리메틸올프로판 트리글리시딜에테르, 디글리시딜아닐린, 디글리시딜아민, N,N,N',N'-테트라글리시딜-m-크실렌디아민 및 1,3-비스(N,N'-디글리시딜아민메틸)시클로헥산으로 이루어진 군에서 선택되는 적어도 하나 이상인 것을 특징으로 하는 방열도료 조성물.Bisphenol-based epoxy, phenol novolac-based epoxy, o-cresol novolac-based epoxy, multifunctional epoxy, amine-based epoxy, heterocyclic epoxy, substituted epoxy, naphthol-based epoxy, bisphenol A epoxy Resin, epichlorhydrin-type epoxy resin. Ethylene glycol glycidyl ether, polyethylene glycol diglycidyl ether, glycerin diglycidyl ether, glycerin triglycidyl ether, 1,6-hexanediol diglycidyl ether, trimethylolpropane triglycidyl ether, diglycidyl Cidylaniline, diglycidylamine, N,N,N',N'-tetraglycidyl-m-xylenediamine and 1,3-bis(N,N'-diglycidylaminemethyl)cyclohexane A heat-dissipating paint composition, characterized in that at least one selected from the group consisting of.
  14. 청구항 4에 있어서,The method of claim 4,
    상기 디이소시아네이트계 경화제는, The diisocyanate-based curing agent,
    헥사메틸렌디이소시아네이트(Hexamethylene diisocyanate, HDI), 트리메틸렌디이소시아네이트(Timethylene diisocyanate), 테트라메틸렌디이소시아네이트(Tetramethylene diisocyanate), 1,2-프로필렌디이소시아네이트(1,2-propylene diisocyanate), 1,3-부틸렌디이소시아네이트(1,3-butylene diisocyanate), 도데카메틸렌디이소시아네이트(dodecamethylene diisocyanate) 및 2,4,4-트리메틸헥사메틸렌디이소시아네이트(2,4,4-trimethylhexamethylene diisocyanate)로 이루어지는 군에서 선택되는 적어도 하나 이상인 것을 특징으로 하는 방열도료 조성물.Hexamethylene diisocyanate (HDI), trimethylene diisocyanate, tetramethylene diisocyanate, 1,2-propylene diisocyanate, 1,3-butyl At least one selected from the group consisting of 1,3-butylene diisocyanate, dodecamethylene diisocyanate and 2,4,4-trimethylhexamethylene diisocyanate A heat-dissipating paint composition characterized by the above.
  15. 청구항 4에 있어서,The method of claim 4,
    상기 아민계 경화제는, The amine-based curing agent,
    헥사메틸렌디아민, 트리에틸디아민, 폴리에틸렌이민, 헥사메틸렌테트라민, 디에틸렌트리아민, 트리에틸테트라민, 이소포름디아민, 디에틸렌트리아민(Diethylene Triamine), 트리에틸렐테트라아민(Triethylene Tetramine), 디에틸아미노프로필아민(Diethylamino propyl amine), 멘탄디아민(Menthane diamine), N-아미노에틸피페라진(N-aminoethylpiperazine), M-자일렌디아민(M-xylene diamine), 이소포론디아민(Isophorone diamine), N,N'-디-터트-부틸에틸렌디아민(N,N'-di-tert-butylethylenediamine), N,N-디-이소-프로필에틸렌디아민(N,N-di-iso-propylethylene-diamine), N,N'-디이소프로필-1,3-프로판디아민(N,N'-diisopropyl-1,3-propanediamine), 및 비스(2,2,6,6-테트라메틸-4-피페리딜)세바케이트(bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate)으로 이루어지는 군에서 선택되는 적어도 하나 이상인 것을 특징으로 하는 방열도료 조성물.Hexamethylenediamine, Triethyldiamine, Polyethyleneimine, Hexamethylenetetramine, Diethylenetriamine, Triethyltetramine, Isoformdiamine, Diethylene Triamine, Triethylene Tetramine, Di Ethylamino propyl amine, Menthane diamine, N-aminoethylpiperazine, M-xylene diamine, Isophorone diamine, N ,N'-di-tert-butylethylenediamine (N,N'-di-tert-butylethylenediamine), N,N-di-iso-propylethylenediamine (N,N-di-iso-propylethylene-diamine), N ,N'-diisopropyl-1,3-propanediamine (N,N'-diisopropyl-1,3-propanediamine), and bis(2,2,6,6-tetramethyl-4-piperidyl)seba A heat-dissipating paint composition, characterized in that at least one selected from the group consisting of bis (2,2,6,6-tetramethyl-4-piperidyl) sebacate.
  16. 청구항 1에 있어서,The method of claim 1,
    상기 용제는, The solvent is
    N-부틸아세테이트, 아세테이트, 에틸아세테이트, 아밀아세테이트, 메틸셀로솔브아세테이트, 에틸셀로솔브아세테이트, 디에틸렌글리콜메틸아세테이트, 디에틸렌글리콜에틸아세테이트, 에틸렌글리콜모노에틸에테르아세테이트 및 3-메톡시부틸아세테이트, 프로필렌글리콜메틸에테르아세테이트(PGMEA)로 이루어지는 군에서 선택되는 적어도 하나 이상인 것을 특징으로 하는 방열도료 조성물.N-butyl acetate, acetate, ethyl acetate, amyl acetate, methyl cellosolve acetate, ethyl cellosolve acetate, diethylene glycol methyl acetate, diethylene glycol ethyl acetate, ethylene glycol monoethyl ether acetate and 3-methoxybutyl acetate , At least one selected from the group consisting of propylene glycol methyl ether acetate (PGMEA), characterized in that the heat dissipation paint composition.
  17. 청구항 1에 있어서,The method of claim 1,
    상기 첨가제는, The additive is
    소광제, 착색제, 접착증진제, 분산제, 침강방지제, 소포제 및 레벨링제로 이루어진 군에서 선택되는 적어도 하나 이상인 것을 특징으로 하는 방열도료 조성물.A heat dissipation paint composition, characterized in that at least one selected from the group consisting of a matting agent, a colorant, an adhesion promoter, a dispersing agent, an antisettling agent, an antifoaming agent, and a leveling agent.
  18. 청구항 17에 있어서,The method of claim 17
    상기 분산제는, The dispersing agent,
    폴리에톡실화 알킬페놀의 인산에스테르, 황산에스테르, 에톡실화 알킬페놀, 에톡실화 피마자유, 폴리옥시에틸렌트리스티릴페닐에테르, 에톡실화 지방족알코올, 에틸렌옥사이드/프로필렌옥사이드 블록코폴리머, 리그노술폰산의 소듐염, 황산의 이나트륨염, 아크릴산 중합체의 나트륨염, 도데실설페이트의 나트륨염, 우레아-포름알데히드 수지, 폴리에틸렌글리콜모노(트리스티릴페닐)에테르, 도데실 벤젠 술폰산의 칼슘염, 나트륨 스테아레이트, 소르비탄 모노스테아레이트, 로진의 폴리옥시에틸렌 에스테르, 폴리옥시에틸렌 도데실 모노 에테르, 폴리옥시에틸렌-폴리옥시프로필렌 블록 공중합체, 폴리옥시에틸렌 모노라우레이트, 폴리옥시에틸렌 모노헥사데실 에테르, 폴리옥시에틸렌 모노올레이트, 폴리옥시에틸렌 모노(시스-9-옥타데세닐)에테르, 폴리옥시에틸렌 모노스테아레이트, 폴리옥시에틸렌 모노옥타데실 에테르, 폴리옥시에틸렌 디올레이트, 폴리옥시에틸렌 디스테아레이트, 폴리옥시에틸렌 소르비탄 모노라우레이트, 폴리옥시에틸렌 소르비탄 모노올레이트, 폴리옥시에틸렌 소르비탄 모노팔미테이트, 폴리옥시에틸렌 소르비탄 모노스테아레이트, 폴리옥시에틸렌 소르비탄 트리올레이트, 폴리옥시에틸렌 소르비탄 트리스테아레이트, 올레산의 폴리글리세롤 에스테르, 폴리옥시에틸렌 소르비톨 헥사스테아레이트, 폴리옥시에틸렌 모노테트라데실 에테르, 폴리옥시에틸렌 소르비톨 헥사올레이트, 지방산, 톨-오일, 소르비톨 헥사에스테르, 에톡실화 피마자 오일, 에톡시화 대두 오일, 에톡실화 폴리옥시에틸렌 소르비톨 테트라올레이트, 글리세롤 및 폴리에틸렌 글리콜 혼합된 에스테르, 폴리글리세롤 에스테르, 모노글리세리드 및 수크로스 에스테르로 이루어지는 군에서 선택되는 적어도 하나 이상인 것을 특징으로 하는 방열도료 조성물.Phosphate ester of polyethoxylated alkylphenol, sulfuric acid ester, ethoxylated alkylphenol, ethoxylated castor oil, polyoxyethylene tristyrylphenyl ether, ethoxylated aliphatic alcohol, ethylene oxide/propylene oxide block copolymer, lignosulfonic acid Sodium salt, disodium salt of sulfuric acid, sodium salt of acrylic acid polymer, sodium salt of dodecyl sulfate, urea-formaldehyde resin, polyethylene glycol mono(tristyrylphenyl) ether, calcium salt of dodecylbenzenesulfonic acid, sodium stearate , sorbitan monostearate, polyoxyethylene ester of rosin, polyoxyethylene dodecyl mono ether, polyoxyethylene-polyoxypropylene block copolymer, polyoxyethylene monolaurate, polyoxyethylene monohexadecyl ether, polyoxy Ethylene monooleate, polyoxyethylene mono(cis-9-octadecenyl)ether, polyoxyethylene monostearate, polyoxyethylene monooctadecyl ether, polyoxyethylene diolate, polyoxyethylene distearate, polyoxy Ethylene Sorbitan Monolaurate, Polyoxyethylene Sorbitan Monooleate, Polyoxyethylene Sorbitan Monopalmitate, Polyoxyethylene Sorbitan Monostearate, Polyoxyethylene Sorbitan Trioleate, Polyoxyethylene Sorbitan Tristea oleic acid, polyglycerol ester of oleic acid, polyoxyethylene sorbitol hexastearate, polyoxyethylene monotetradecyl ether, polyoxyethylene sorbitol hexaoleate, fatty acid, tall-oil, sorbitol hexaester, ethoxylated castor oil, ethoxylated soybean A heat-dissipating paint composition comprising at least one selected from the group consisting of oil, ethoxylated polyoxyethylene sorbitol tetraoleate, glycerol and polyethylene glycol mixed esters, polyglycerol esters, monoglycerides, and sucrose esters.
  19. 청구항 17에 있어서,The method of claim 17
    상기 접착증진제는, The adhesion promoter,
    에폭시에스터인산(epoxy ester phosphate acid)이고, It is an epoxy ester phosphate acid,
    상기 침강방지제는, The anti-settling agent,
    우레아계 화합물인 것을 특징으로 하는 방열도료 조성물.A heat dissipation paint composition characterized in that it is a urea-based compound.
  20. 청구항 1의 조성물을 밀링하여 분산액을 제조하는 단계; 및milling the composition of claim 1 to prepare a dispersion; and
    상기 분산액에 디이소시아네이트계 경화제 또는 아민계 경화제를 첨가하여 방열 도료를 제조하는 단계; 를 포함하는 방열 도료의 제조방법.preparing a heat-dissipating paint by adding a diisocyanate-based curing agent or an amine-based curing agent to the dispersion; Method for producing a heat-dissipating paint comprising a.
  21. 청구항 20에 있어서,The method of claim 20
    상기 분산액을 제조하는 단계 이전에, Prior to preparing the dispersion,
    흑연에 초음파 처리하는 단계, 초고압 분산기로 흑연을 분산처리하는 단계, 또는 고속전단기로 흑연을 처리하는 단계;를 더 포함하는 것을 특징으로 하는 방열도료의 제조방법.A method for producing a heat-dissipating paint, further comprising: ultrasonically treating graphite, dispersing graphite with an ultra-high pressure disperser, or treating graphite with a high-speed shear.
  22. 청구항 1 내지 청구항 19 중 어느 한 항의 방열 도료 조성물을 기재 상에 도포하고, 70 ℃ 내지 100 ℃에서 소성하여 형성된 방열 코팅막.A heat-dissipating coating film formed by applying the heat-dissipating paint composition according to any one of claims 1 to 19 on a substrate and firing at 70 ° C to 100 ° C.
  23. 청구항 22의 방열 코팅막을 포함하는 히트씽크.A heat sink comprising the heat dissipation coating film of claim 22.
PCT/KR2022/003158 2021-08-05 2022-03-07 Heat sink paint composition, preparation method therefor, heat sink coating film formed therefrom, and heat sink comprising same WO2023013834A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2021-0103515 2021-08-05
KR1020210103515A KR102496435B1 (en) 2021-08-05 2021-08-05 Composition having heat dissipation, manufacturing method thereof, heat dissipatting coating film foramed with the same, and heat sink inculuding the same

Publications (1)

Publication Number Publication Date
WO2023013834A1 true WO2023013834A1 (en) 2023-02-09

Family

ID=85156065

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2022/003158 WO2023013834A1 (en) 2021-08-05 2022-03-07 Heat sink paint composition, preparation method therefor, heat sink coating film formed therefrom, and heat sink comprising same

Country Status (2)

Country Link
KR (1) KR102496435B1 (en)
WO (1) WO2023013834A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116239919A (en) * 2023-03-03 2023-06-09 上海南华换热器制造有限公司 Frosting-preventing superhydrophobic coating for evaporator and preparation method thereof
CN116814181A (en) * 2023-08-01 2023-09-29 凯仁精密材料(江苏)有限公司 Ultrathin heat-conducting adhesive tape and preparation method thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101573898B1 (en) * 2014-07-24 2015-12-02 가드넥(주) Method for manufacturing heat dissipation sheet and thermally conductive composite sheet comprising heat dissipation sheet manufactured thereby
KR20170065883A (en) * 2015-12-04 2017-06-14 주식회사 케이씨씨 Heat-Dissipation Sheet
KR20170122435A (en) * 2016-04-27 2017-11-06 주식회사 영우 Heat-discharging Film and Thermal-Conductive Composite Sheets comprising the same
KR20190008128A (en) * 2017-07-14 2019-01-23 세종대학교산학협력단 Material for radiating Heat and Method of forming the same
KR20200076443A (en) * 2018-12-19 2020-06-29 테사 소시에타스 유로파에아 Heat Radiation and Adhesive Sheet for LED Package

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110078577A (en) * 2009-12-31 2011-07-07 지씨에스커뮤니케이션(주) Manufacturing method for conductive polyurethane nanocomposite with expanded graphite
KR101508202B1 (en) 2013-09-13 2015-04-07 한국생산기술연구원 Fabrication method of thermal coating layer comprising vertical-aligned graphene
KR101704728B1 (en) * 2014-12-31 2017-02-08 주식회사 대신테크젠 The Composition of High Heat Dissipative Adhesives

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101573898B1 (en) * 2014-07-24 2015-12-02 가드넥(주) Method for manufacturing heat dissipation sheet and thermally conductive composite sheet comprising heat dissipation sheet manufactured thereby
KR20170065883A (en) * 2015-12-04 2017-06-14 주식회사 케이씨씨 Heat-Dissipation Sheet
KR20170122435A (en) * 2016-04-27 2017-11-06 주식회사 영우 Heat-discharging Film and Thermal-Conductive Composite Sheets comprising the same
KR20190008128A (en) * 2017-07-14 2019-01-23 세종대학교산학협력단 Material for radiating Heat and Method of forming the same
KR20200076443A (en) * 2018-12-19 2020-06-29 테사 소시에타스 유로파에아 Heat Radiation and Adhesive Sheet for LED Package

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116239919A (en) * 2023-03-03 2023-06-09 上海南华换热器制造有限公司 Frosting-preventing superhydrophobic coating for evaporator and preparation method thereof
CN116239919B (en) * 2023-03-03 2023-11-24 上海南华换热器制造有限公司 Frosting-preventing superhydrophobic coating for evaporator and preparation method thereof
CN116814181A (en) * 2023-08-01 2023-09-29 凯仁精密材料(江苏)有限公司 Ultrathin heat-conducting adhesive tape and preparation method thereof

Also Published As

Publication number Publication date
KR102496435B1 (en) 2023-02-06

Similar Documents

Publication Publication Date Title
WO2023013834A1 (en) Heat sink paint composition, preparation method therefor, heat sink coating film formed therefrom, and heat sink comprising same
WO2013009133A2 (en) Resin composition for a surface treatment, and steel sheet coated with same
WO2018128368A1 (en) Insulating and heat-radiating coating composition, and insulating and heat-radiating product implemented therewith
WO2017204565A1 (en) Insulating and heat dissipating coating composition, and insulating and heat dissipating unit formed thereby
WO2012018242A2 (en) High-efficiency heat-dissipating paint composition using a carbon material
WO2015012427A1 (en) Heat-radiating sheet using graphene/graphite nanoplate/carbon nanotube/nanometal complex, and manufacturing method therefor
WO2013100502A1 (en) Insulating adhesive composition for metal-based copper clad laminate (mccl), coated metal plate using same, and method for manufacturing same
KR101957532B1 (en) Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet
CN109563343B (en) Resin composition, sheet using same, laminate, power semiconductor device, plasma processing apparatus, and method for manufacturing semiconductor
WO2017065340A1 (en) Method for manufacturing two-dimensional hybrid composite
WO2015147449A1 (en) Electromagnetic wave shielding sheet and method for manufacturing same
WO2017171392A1 (en) Ptc unit for vehicle heater, ptc heater including same, and air conditioning device for vehicle
WO2019066543A1 (en) Method for producing thermally conductive thin film using synthetic graphite powder
TW201333179A (en) Thermal conductive sheet
KR20120003676A (en) Heat radiation tape and manufacturing method thereof
KR101829195B1 (en) Method of manufacturing metal-base substrate and method of manufacturing circuit board
JP6428032B2 (en) Resin composition, heat radiation paint and electronic component using the same
WO2012165265A1 (en) Substrate, method for producing same, heat-releasing substrate, and heat-releasing module
WO2023080349A1 (en) One-part type urethane heat-dissipating paint composition and method for preparing same
WO2022153931A1 (en) Method for producing liquid composition and composition
KR101333260B1 (en) Resin compositon for highly thermal conductive insulating materail and insulating fime
WO2023080350A1 (en) Method for cooling semiconductor component, and heat dissipation film for semiconductor component
CN110408206B (en) Polyamic acid resin composition, method for preparing the same, and film formed from the same
KR102448959B1 (en) Coating method of heat-conductive graphite sheet for display panel
WO2014137162A1 (en) Electromagnetic interference shielding film and method for manufacturing same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 22853215

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE