CN116814181A - Ultrathin heat-conducting adhesive tape and preparation method thereof - Google Patents
Ultrathin heat-conducting adhesive tape and preparation method thereof Download PDFInfo
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- CN116814181A CN116814181A CN202310954317.8A CN202310954317A CN116814181A CN 116814181 A CN116814181 A CN 116814181A CN 202310954317 A CN202310954317 A CN 202310954317A CN 116814181 A CN116814181 A CN 116814181A
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- heat
- adhesive tape
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- conducting
- adhesive layer
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- 239000002390 adhesive tape Substances 0.000 title claims abstract description 76
- 238000002360 preparation method Methods 0.000 title claims abstract description 19
- 239000010410 layer Substances 0.000 claims abstract description 44
- 239000012790 adhesive layer Substances 0.000 claims abstract description 40
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052810 boron oxide Inorganic materials 0.000 claims abstract description 18
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 14
- 238000004804 winding Methods 0.000 claims abstract description 13
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims description 46
- 239000000203 mixture Substances 0.000 claims description 29
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 18
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 18
- -1 dimethyl siloxane Chemical class 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 14
- 229920000642 polymer Polymers 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 12
- 239000002994 raw material Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 239000000919 ceramic Substances 0.000 claims description 11
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 239000007822 coupling agent Substances 0.000 claims description 11
- 239000003431 cross linking reagent Substances 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 10
- 238000004945 emulsification Methods 0.000 claims description 10
- 230000001804 emulsifying effect Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 3
- VJTJVFFICHLTKX-UHFFFAOYSA-N dipyridin-2-yldiazene Chemical compound N1=CC=CC=C1N=NC1=CC=CC=N1 VJTJVFFICHLTKX-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000012948 isocyanate Substances 0.000 claims description 3
- 150000002513 isocyanates Chemical class 0.000 claims description 3
- 239000002113 nanodiamond Substances 0.000 claims description 3
- 150000001451 organic peroxides Chemical class 0.000 claims description 3
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 3
- 239000004800 polyvinyl chloride Substances 0.000 claims description 3
- 150000005846 sugar alcohols Polymers 0.000 claims description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 239000006185 dispersion Substances 0.000 abstract description 5
- 230000003647 oxidation Effects 0.000 abstract description 4
- 238000007254 oxidation reaction Methods 0.000 abstract description 4
- 238000009826 distribution Methods 0.000 abstract description 2
- 239000002245 particle Substances 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 description 5
- 125000005375 organosiloxane group Chemical group 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 238000010561 standard procedure Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/10—Homopolymers or copolymers of propene
- C09J123/14—Copolymers of propene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
- C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J127/04—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C09J127/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses an ultrathin heat-conducting adhesive tape, which comprises an adhesive tape body and a winding drum, wherein the adhesive tape body comprises a base layer, a heat-conducting adhesive layer and a release film, and the heat-conducting adhesive layer is adhered between the base layer and the release film. According to the ultrathin heat-conducting adhesive tape and the preparation method thereof, the nano boron oxide, the nano aluminum oxide and the graphene are added into the heat-conducting adhesive layer, so that the heat-conducting property of the adhesive tape is improved to a great extent, the nano boron oxide has a good heat conductivity value, and the other important thermal property of the nano boron nitride is excellent high-temperature oxidation resistance, the nano aluminum oxide has high porosity, high dispersion and high activity, belongs to active aluminum oxide, has high porosity, high heat resistance and good formability, has stronger surface acidity and certain surface alkalinity, has uniform particle size distribution, high purity and excellent dispersion, has a high-temperature-resistant inertia and high activity, and belongs to active oxidation.
Description
Technical Field
The invention relates to the technical field of adhesive tapes, in particular to an ultrathin heat-conducting adhesive tape and a preparation method thereof.
Background
The adhesive tape is an article composed of two parts of a base material and an adhesive, two or more unconnected objects can be connected together through adhesion, a layer of adhesive is coated on the surface of the adhesive tape, the earliest adhesive is from animals and plants, rubber is the main component of the adhesive in nineteenth century, various polymers are widely used in modern times, the adhesive can adhere things, the bonding can firmly bond molecules together due to the bonding formed between molecules of the adhesive tape and molecules of the articles to be connected, the components of the adhesive tape are different polymers according to different brands and different types, and the adhesive tape can be divided into a high-temperature adhesive tape, a double-sided adhesive tape, an insulating adhesive tape, a special adhesive tape, a pressure-sensitive adhesive tape and a die-cutting adhesive tape according to the effects of the adhesive tape, and the different effects are suitable for different industrial requirements.
The existing adhesive tape does not have the effect of heat conduction and heat dissipation, particularly has the phenomenon that bubbles are easy to generate when the adhesive tape is attached, and the problem that the addition amount of the filler is limited when the heat conduction filler is added into the high polymer is solved, so that the heat conduction coefficient is small, the heat dissipation requirement is difficult to meet, or the adhesive tape is difficult to be made thin, and the adhesive tape is difficult to operate and has poor adhesion because a large amount of filler is required to be added to improve the heat conduction coefficient of the adhesive tape.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an ultrathin heat conduction adhesive tape and a preparation method thereof, and solves the problems of no heat conduction and heat dissipation effect, difficult operation and poor adhesive force.
In order to achieve the above purpose, the invention is realized by the following technical scheme: an ultrathin heat-conducting adhesive tape comprises an adhesive tape body and a winding drum, wherein the adhesive tape body comprises a base layer, a heat-conducting adhesive layer and a release film, and the heat-conducting adhesive layer is adhered between the base layer and the release film;
the raw materials of the heat conducting adhesive layer comprise the following components in parts by weight: 8-20 parts of composition, 4-10 parts of acrylic acid, 4-12 parts of high molecular polymer, 8-16 parts of nano ceramic heat conducting filler, 8-14 parts of flatting agent, 6-10 parts of cross-linking agent and 4-8 parts of coupling agent;
the raw material composition of the composition comprises the following components: nano boron oxide, nano aluminum oxide, and graphene.
Preferably, the nano boron oxide and nano aluminum oxide are (0.7-1.8): 1, the amount of the graphene is one half of the total amount of the nanometer boron oxide and the nanometer aluminum oxide.
Preferably, the heat conducting glue layer comprises a flat glue layer and a spot glue layer, the spot glue layer is formed by curing on the flat glue layer in a spot coating mode, and the spot glue layer is arranged for collecting and guiding out heat.
Preferably, the leveling agent comprises at least one of dimethyl siloxane, polydimethylsiloxane, polyether modified organosiloxane, polyester modified organosiloxane and alkyl modified organosiloxane.
Preferably, the nano ceramic heat conducting filler is one of nano zirconia, nano alumina, nano diamond and nano boron nitride or a mixture thereof, the high molecular polymer is one of polyethylene, polypropylene, epoxy resin, polyethylene terephthalate and polyvinyl chloride or a mixture thereof, the thickness of the heat conducting adhesive layer is 5-10um, the base layer is a polyimide film, and the thickness of the base layer is 8-15um.
Preferably, the coupling agent is at least one of the marks KH550, KH560, KH570 and KH792, and the crosslinking agent is at least one of polyalcohols, organic silicon, isocyanates, organic peroxides, epoxy and azopyridine.
The invention also discloses a preparation method of the ultrathin heat conduction adhesive tape, which specifically comprises the following steps:
s1, preparation of a composition: uniformly mixing a proper amount of nano boron oxide and nano aluminum oxide, gradually heating to 220-250 ℃ to melt, then adding graphene, melting and solidifying at 220-250 ℃, and cooling to obtain a composition;
s2, preparing heat-conducting glue: preparing a proper amount of acrylic acid, adding the raw material of the adhesive tape into an emulsifying tank for emulsification, adding the acrylic acid into the emulsifying tank for emulsification, then placing the emulsified acrylic acid into a reaction kettle for heating at 220-250 ℃, adding a proper amount of high polymer, nano ceramic heat-conducting filler, leveling agent, cross-linking agent, coupling agent and the composition prepared in S1, dispersing at a high speed of 2000-3000 rpm for 30-45 minutes by a high-speed stirrer, and uniformly stirring at a temperature of 80-120 ℃ to obtain the heat-conducting adhesive;
s3, preparing a heat conducting adhesive layer: uniformly coating the heat-conducting glue prepared in the step S2 on a base layer, drying the heat-conducting glue to obtain a flat glue layer, then dispensing the heat-conducting glue prepared in the step S2 on the flat glue layer in a glue dispensing mode, and drying to obtain a glue dispensing layer;
s4, preparation of an adhesive tape body: and (3) attaching a release film on the surface of the heat conducting adhesive layer prepared in the step (S3), so that an adhesive tape body can be obtained, and the adhesive tape body is wound on a winding drum.
Advantageous effects
The invention provides an ultrathin heat conduction adhesive tape and a preparation method thereof. Compared with the prior art, the method has the following beneficial effects:
(1) According to the ultrathin heat conduction adhesive tape and the preparation method thereof, nano boron oxide, nano aluminum oxide and graphene are added into the heat conduction adhesive layer, so that the heat conduction performance of the adhesive tape is improved to a great extent, the nano boron oxide has a good heat conduction value, the other important thermal property of nano boron nitride is excellent high-temperature oxidation resistance, the nano aluminum oxide is porous, highly dispersed and highly active, and belongs to the active aluminum oxide, the porosity is high, the heat resistance is strong, the formability is good, the surface acidity and certain surface alkalinity are high, the particle size distribution is uniform, the purity is high, the dispersion is excellent, the specific surface is high, the inertia and the high activity of the adhesive tape are high, the active oxidation is carried out, the stirring and stirring are not needed, the uniform dispersion can be fully carried out, and the graphene has extremely excellent heat conduction performance, so that the heat conduction performance and the heat dissipation uniformity of the heat conduction adhesive layer can be remarkably improved, the use reliability of the oriented heat conduction adhesive tape is improved, the heat conduction capability and the heat dissipation capability of the adhesive tape are improved on the premise that the adhesive tape is compounded and the adhesive tape is used, the three raw materials are greatly improved, and the heat conduction performance is greatly prolonged, and the service life of the adhesive tape is prolonged.
(2) According to the ultrathin heat conduction adhesive tape and the preparation method thereof, the adhesive tape can be prepared into an ultrathin adhesive tape with the thickness of about 5-10 microns, various nanoscale heat conduction materials are added, heat can be effectively conducted, the bonding strength of each component molecule is enhanced, the dispersion performance of nano boron nitride and nano aluminum oxide is also improved, the wettability of the nano boron nitride and the nano aluminum oxide in the whole system is enhanced, the heat conduction capability of the whole adhesive tape is finally improved, the adhesive tape can be rapidly solidified through ultraviolet, and the extrusion stress of elements can be effectively reduced.
Drawings
FIG. 1 is a perspective view of a tape body structure of the present invention;
FIG. 2 is an exploded view of the body structure of the adhesive tape of the present invention;
fig. 3 is a schematic structural diagram of a heat conductive adhesive layer according to the present invention.
In the figure: 1-adhesive tape body, 11-basic unit, 12-heat conduction glue layer, 121-flat glue layer, 122-adhesive dispensing layer, 13-release film and 2-reel.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-3, the present invention provides three technical solutions: an ultrathin heat-conducting adhesive tape comprises an adhesive tape body 1 and a winding drum 2, wherein the adhesive tape body 1 comprises a base layer 11, a heat-conducting adhesive layer 12 and a release film 13, and the heat-conducting adhesive layer 12 is adhered between the base layer 11 and the release film 13;
the raw materials of the heat conducting adhesive layer 12 comprise the following components in parts by weight: 8-20 parts of composition, 4-10 parts of acrylic acid, 4-12 parts of high molecular polymer, 8-16 parts of nano ceramic heat conducting filler, 8-14 parts of flatting agent, 6-10 parts of cross-linking agent and 4-8 parts of coupling agent;
the raw materials of the composition comprise the following components: nano boron oxide, nano aluminum oxide, and graphene.
In the invention, the nanometer boron oxide and the nanometer aluminum oxide adopt 0.7 to 1.8:1, the amount of the graphene is one half of the total amount of the nanometer boron oxide and the nanometer aluminum oxide.
In the present invention, the heat conductive adhesive layer 12 includes a flat adhesive layer 121 and a spot adhesive layer 122, the spot adhesive layer 122 is formed by curing on the flat adhesive layer 121 by spot coating, and the spot adhesive layer 122 is arranged to collect and conduct out heat.
In the invention, the leveling agent comprises at least one of dimethyl siloxane, polydimethylsiloxane, polyether modified organosiloxane, polyester modified organosiloxane and alkyl modified organosiloxane.
In the invention, the nano ceramic heat-conducting filler is one or a mixture of nano zirconia, nano alumina, nano diamond and nano boron nitride, the high molecular polymer is one or a mixture of polyethylene, polypropylene, epoxy resin, polyethylene terephthalate and polyvinyl chloride, the thickness of the heat-conducting adhesive layer 12 is 5-10um, the base layer 11 is a polyimide film, and the thickness of the base layer 11 is 8-15um.
In the invention, the coupling agent is at least one of the marks KH550, KH560, KH570 and KH792, and the cross-linking agent is at least one of polyalcohol, organosilicon, isocyanate, organic peroxide, epoxy and azopyridine.
The invention also discloses a preparation method of the ultrathin heat conduction adhesive tape, which specifically comprises the following embodiments:
example 1
S1, preparation of a composition: uniformly mixing 1.2:1 nano boron oxide and nano aluminum oxide, gradually heating to 235 ℃ to melt, adding graphene, melting and solidifying at 235 ℃, and cooling to obtain a composition;
s2, preparing heat-conducting glue: preparing 7 parts of acrylic acid, adding the raw material of the adhesive tape into an emulsifying tank for emulsification, adding the acrylic acid into the emulsifying tank for emulsification, then placing the emulsified acrylic acid into a reaction kettle for heating at 235 ℃, adding 8 parts of high polymer, 12 parts of nano ceramic heat conducting filler, 11 parts of flatting agent, 8 parts of cross-linking agent, 6 parts of coupling agent and 14 parts of composition prepared in S1, dispersing for 37 minutes at a high speed of 2500 rpm by adopting a high-speed stirrer, and uniformly stirring at a temperature of 100 ℃ to obtain heat conducting adhesive;
s3, preparing a heat conducting adhesive layer 12: uniformly coating the heat-conducting glue prepared in the step S2 on the base layer 11, drying the heat-conducting glue to obtain a flat glue layer 121, then dispensing the heat-conducting glue prepared in the step S2 on the flat glue layer 121 in a glue dispensing mode, and drying to obtain a glue dispensing layer 122;
s4, preparation of the adhesive tape body 1: and (3) attaching a release film 13 on the surface of the heat conducting adhesive layer 12 prepared in the step (S3), thus obtaining the adhesive tape body 1, and winding the adhesive tape body on the winding drum 2.
Example two
S1, preparation of a composition: uniformly mixing 0.7:1 nano boron oxide and nano aluminum oxide, gradually heating to 220 ℃ to melt, adding graphene, melting and solidifying at 220 ℃, and cooling to obtain a composition;
s2, preparing heat-conducting glue: preparing 4 parts of acrylic acid, adding the raw material of the adhesive tape into an emulsifying tank for emulsification, adding the acrylic acid into the emulsifying tank for emulsification, then placing the emulsified acrylic acid into a reaction kettle for heating at 220 ℃, adding 4 parts of high polymer, 8 parts of nano ceramic heat conducting filler, 8 parts of flatting agent, 6 parts of cross-linking agent, 4 parts of coupling agent and 8 parts of composition prepared in S1, dispersing at a high speed of 2000 rpm for 30 minutes by a high-speed stirrer, and uniformly stirring at 80 ℃ to obtain heat conducting adhesive;
s3, preparing a heat conducting adhesive layer 12: uniformly coating the heat-conducting glue prepared in the step S2 on the base layer 11, drying the heat-conducting glue to obtain a flat glue layer 121, then dispensing the heat-conducting glue prepared in the step S2 on the flat glue layer 121 in a glue dispensing mode, and drying to obtain a glue dispensing layer 122;
s4, preparation of the adhesive tape body 1: and (3) attaching a release film 13 on the surface of the heat conducting adhesive layer 12 prepared in the step (S3), thus obtaining the adhesive tape body 1, and winding the adhesive tape body on the winding drum 2.
Example III
S1, preparation of a composition: uniformly mixing 1.8:1 nano boron oxide and nano aluminum oxide, gradually heating to 250 ℃ to melt, adding graphene, melting and solidifying at the temperature of 250 ℃, and cooling to obtain a composition;
s2, preparing heat-conducting glue: preparing 10 parts of acrylic acid, adding the raw material of the adhesive tape into an emulsifying tank for emulsification, adding the acrylic acid into the emulsifying tank for emulsification, then placing the emulsified acrylic acid into a reaction kettle for heating at the temperature of 250 ℃, adding 12 parts of high polymer, 16 parts of nano ceramic heat conducting filler, 14 parts of flatting agent, 10 parts of cross-linking agent, 8 parts of coupling agent and 20 parts of composition prepared in S1, dispersing at a high speed of 3000 rpm for 45 minutes by a high-speed stirrer, and stirring uniformly at the temperature of 80-120 ℃ to obtain heat conducting adhesive;
s3, preparing a heat conducting adhesive layer 12: uniformly coating the heat-conducting glue prepared in the step S2 on the base layer 11, drying the heat-conducting glue to obtain a flat glue layer 121, then dispensing the heat-conducting glue prepared in the step S2 on the flat glue layer 121 in a glue dispensing mode, and drying to obtain a glue dispensing layer 122;
s4, preparation of the adhesive tape body 1: and (3) attaching a release film 13 on the surface of the heat conducting adhesive layer 12 prepared in the step (S3), thus obtaining the adhesive tape body 1, and winding the adhesive tape body on the winding drum 2.
And all that is not described in detail in this specification is well known to those skilled in the art.
Performance testing
In order to better illustrate the technical effects brought by the invention, the heat conduction performance, the bonding performance and the flame retardant performance of the embodiment are tested, wherein the heat conduction performance is measured by referring to an ASTMD5470 for heat conduction coefficient test standard method, the bonding performance is tested for peel strength according to a GB/T2792 standard method, and meanwhile, the high temperature resistance is also tested, and specific detection data are shown in the following table:
from the table, the adhesive tapes prepared in the first embodiment, the second embodiment and the third embodiment have good peel strength and primary adhesiveness, high thermal conductivity coefficient and good high temperature resistance.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. An ultrathin heat conduction adhesive tape comprises an adhesive tape body (1) and a winding drum (2), and is characterized in that: the adhesive tape body (1) comprises a base layer (11), a heat conducting adhesive layer (12) and a release film (13), wherein the heat conducting adhesive layer (12) is adhered between the base layer (11) and the release film (13);
the raw materials of the heat conducting adhesive layer (12) comprise the following components in parts by weight: 8-20 parts of composition, 4-10 parts of acrylic acid, 4-12 parts of high molecular polymer, 8-16 parts of nano ceramic heat conducting filler, 8-14 parts of flatting agent, 6-10 parts of cross-linking agent and 4-8 parts of coupling agent;
the raw material composition of the composition comprises the following components: nano boron oxide, nano aluminum oxide, and graphene.
2. The ultra-thin heat conductive tape of claim 1, wherein: the nanometer boron oxide and the nanometer aluminum oxide are adopted (0.7-1.8): 1, the amount of the graphene is one half of the total amount of the nanometer boron oxide and the nanometer aluminum oxide.
3. The ultra-thin heat conductive tape of claim 1, wherein: the heat conducting adhesive layer (12) comprises a flat adhesive layer (121) and a spot adhesive layer (122), the spot adhesive layer (122) is formed by solidifying the spot adhesive layer (121) in a spot coating mode, and the spot adhesive layer (122) is arranged for collecting and guiding out heat.
4. The ultra-thin heat conductive tape of claim 1, wherein: the leveling agent comprises at least one of dimethyl siloxane, polydimethyl siloxane, polyether modified organic siloxane, polyester modified organic siloxane and alkyl modified organic siloxane.
5. The ultra-thin heat conductive tape of claim 1, wherein: the nano ceramic heat conducting filler is one or a mixture of nano zirconia, nano alumina, nano diamond and nano boron nitride, the high molecular polymer is one or a mixture of polyethylene, polypropylene, epoxy resin, polyethylene terephthalate and polyvinyl chloride, the thickness of the heat conducting adhesive layer (12) is 5-10 mu m, the base layer (11) is a polyimide film, and the thickness of the base layer is 8-15 mu m.
6. The ultra-thin heat conductive tape of claim 1, wherein: the coupling agent is at least one of KH550, KH560, KH570 and KH792, and the crosslinking agent is at least one of polyalcohol, organosilicon, isocyanate, organic peroxide, epoxy and azopyridine.
7. A method for preparing an ultrathin heat conduction adhesive tape, comprising the ultrathin heat conduction adhesive tape as set forth in any one of claims 1 to 6, characterized in that: the method specifically comprises the following steps:
s1, preparation of a composition: uniformly mixing a proper amount of nano boron oxide and nano aluminum oxide, gradually heating to 220-250 ℃ to melt, then adding graphene, melting and solidifying at 220-250 ℃, and cooling to obtain a composition;
s2, preparing heat-conducting glue: preparing a proper amount of acrylic acid, adding the raw material of the adhesive tape into an emulsifying tank for emulsification, adding the acrylic acid into the emulsifying tank for emulsification, then placing the emulsified acrylic acid into a reaction kettle for heating at 220-250 ℃, adding a proper amount of high polymer, nano ceramic heat-conducting filler, leveling agent, cross-linking agent, coupling agent and the composition prepared in S1, dispersing at a high speed of 2000-3000 rpm for 30-45 minutes by a high-speed stirrer, and uniformly stirring at a temperature of 80-120 ℃ to obtain the heat-conducting adhesive;
s3, preparing a heat conducting adhesive layer (12): uniformly coating the heat-conducting glue prepared in the step S2 on a base layer (11), drying the heat-conducting glue to obtain a flat glue layer (121), then dispensing the heat-conducting glue prepared in the step S2 on the flat glue layer (121) in a dispensing mode, and drying to obtain a dispensing layer (122);
s4, preparing an adhesive tape body (1): and (3) attaching a release film (13) on the surface of the heat conducting adhesive layer (12) prepared in the step (S3), thus obtaining the adhesive tape body (1), and winding the adhesive tape body on the winding drum (2).
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