WO2023005712A1 - 穿戴式电子设备机芯、外壳及穿戴式电子设备 - Google Patents

穿戴式电子设备机芯、外壳及穿戴式电子设备 Download PDF

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Publication number
WO2023005712A1
WO2023005712A1 PCT/CN2022/106258 CN2022106258W WO2023005712A1 WO 2023005712 A1 WO2023005712 A1 WO 2023005712A1 CN 2022106258 W CN2022106258 W CN 2022106258W WO 2023005712 A1 WO2023005712 A1 WO 2023005712A1
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WO
WIPO (PCT)
Prior art keywords
middle frame
electronic device
metal middle
wearable electronic
core
Prior art date
Application number
PCT/CN2022/106258
Other languages
English (en)
French (fr)
Inventor
刘兵
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP22848317.8A priority Critical patent/EP4350880A4/en
Publication of WO2023005712A1 publication Critical patent/WO2023005712A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/273—Adaptation for carrying or wearing by persons or animals
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/08—Housings
    • G—PHYSICS
    • G04—HOROLOGY
    • G04R—RADIO-CONTROLLED TIME-PIECES
    • G04R60/00—Constructional details
    • G04R60/02—Antennas also serving as components of clocks or watches, e.g. motor coils
    • G—PHYSICS
    • G04—HOROLOGY
    • G04R—RADIO-CONTROLLED TIME-PIECES
    • G04R60/00—Constructional details
    • G04R60/06—Antennas attached to or integrated in clock or watch bodies
    • G04R60/10—Antennas attached to or integrated in clock or watch bodies inside cases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/50—Feeding or matching arrangements for broad-band or multi-band operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/30—Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42—Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Definitions

  • the embodiments of the present application relate to the field of electronic devices, and in particular, to a core, a shell of a wearable electronic device, and the wearable electronic device.
  • the metal middle frame of the watch movement is usually used as the antenna of the watch, such as the global navigation satellite system (global navigation satellite system, GNSS), the global positioning system (navigation satellite timing and ranging global position system) , referred to as GPS), Wi-Fi (wireless fidelity), Bluetooth (bluetooth, BT), 4G/5G communication, near field communication (near field communication, NFC for short) and other communication standard antennas.
  • the casing will cover the metal middle frame of the watch movement, thereby causing interference to the antenna signal radiated by the metal middle frame.
  • Embodiments of the present application provide a wearable electronic device movement, a casing, and a wearable electronic device, which can reduce the interference caused by the metal middle frame of the watch movement to the antenna signal when the wearable electronic device movement is installed on the casing. interference.
  • a core of a wearable electronic device in a first aspect, includes a metal middle frame and a printed circuit board (PCB) arranged on the metal middle frame; a controller is arranged on the PCB. At least one grounding point is provided on the metal middle frame, and the grounding point is coupled to the ground terminal on the PCB; at least one feed point is provided on the metal middle frame, and the feed point is coupled to the RF circuit on the PCB; A first switch is coupled between the ends, and/or, a second switch is coupled between the feed point and the radio frequency circuit; when the core of the wearable electronic device is installed in the installation space of the housing, the controller is configured to obtain A switch control signal; a controller configured to control the conduction state of at least one first switch and/or at least one second switch according to the switch control signal.
  • PCB printed circuit board
  • the radio frequency circuit can be connected with antennas with different antenna parameters (mainly referring to the capacitance value and inductance value of the metal middle frame as the antenna), so that at least one first switch and/or at least one first switch can be selected and controlled according to the actual material of the shell.
  • the conduction state of a second switch so as to configure a suitable antenna bill of material (BOM) for the radio frequency circuit, so that the antenna performance of the metal middle frame can be optimized, thereby reducing the case's ability to block the metal middle of the watch movement. Interference caused by the frame to the antenna signal.
  • BOM antenna bill of material
  • the controller is configured to generate a switch control signal in response to a selection signal triggered by a user according to the material of the housing.
  • the shell installation interface can be designed through user experience (UX), and when the watch generates the shell installation interface in response to the user triggering the shell installation function control displayed on the display screen, it can show the user the material drop-down option of the shell, so that The user selects the material of the installed shell (for example: metal material, carbon fiber material, ceramic material, plastic material, etc.), wherein different shell materials are pre-configured with a corresponding antenna material list, and responds to the triggering of the selected material by the user. If the signal is selected, the controller can generate a switch control signal to control the conduction state of the above-mentioned at least one first switch and/or at least one second switch, and configure a suitable antenna material list for the radio frequency circuit.
  • a proximity sensor chip in a possible implementation manner, it also includes: a proximity sensor chip; the proximity sensor chip is coupled to the metal middle frame; the proximity sensor chip is configured to detect the capacitance value of the metal middle frame; the controller is configured to generate switch control signal.
  • the position where the proximity sensor chip is coupled with the metal middle frame may be any position on the metal middle frame, for example, may be the aforementioned ground point or feed point.
  • the capacitance value detected by the proximity sensor chip will change. Ceramic materials have a high dielectric constant, usually 20+ to 30+, and plastic materials have a low dielectric constant, usually 2.x to 4.x.
  • the dielectric constant of ceramic material and plastic material is very different.
  • the capacitance value detected by the proximity sensor chip will be lower than that of the proximity sensor chip when the shell is made of ceramic material. According to the capacitance value detected by the proximity sensor chip, it can be determined
  • the material of the shell serves as a basis for switching the conduction state of at least one first switch and/or at least one second switch.
  • the shell is made of conductive materials such as metal or carbon fiber
  • the shell and the metal middle frame will form a capacitor with a large coupling area and a short distance, so the proximity sensor chip will detect Large capacitance value, and when the shell is connected to the metal middle frame, the proximity sensor chip will detect a small capacitance value.
  • the controller can pre-configure the corresponding antenna material list according to the material of the shell with different capacitance values, and generate a switch control signal, thereby controlling the above-mentioned at least one first switch and/or Or the conduction state of at least one second switch configures a suitable antenna BOM for the radio frequency circuit.
  • the metal middle frame is provided with a connection mechanism; when the core of the wearable electronic device is assembled in the installation space of the casing, the connection mechanism electrically connects the metal middle frame to the casing, wherein the casing is made of conductive material .
  • the connection mechanism electrically connects the metal middle frame to the casing, wherein the casing is made of conductive material .
  • the connection mechanism includes a body and an elastic piece, the body is fixed in the metal middle frame, one end of the elastic piece is connected to the body, and the other end of the elastic piece is tilted relative to the body to abut against the shell.
  • the connecting mechanism since one end of the shrapnel is connected to the body and the other end is tilted relative to the body, when the connecting mechanism is fixed to the metal middle frame and the metal middle frame is assembled to the casing, the other end of the shrapnel can effectively resist The shell, and since the other end of the shrapnel collides with the shell, there is stress, so the metal middle frame can form a good electrical connection with the shell.
  • the body includes a limit mechanism located at the other end of the elastic piece, and the limit mechanism limits the tilting range of the other end of the elastic piece; the body is fixed in the installation groove of the metal middle frame, and the elastic piece includes a The protrusions face away from the main body, and the protrusions protrude from the installation groove to abut against the shell. The other end of the shrapnel is limited by the limit mechanism to lift up, so as to protect the other end of the shrapnel from being damaged by external force.
  • an impedance matching circuit is further arranged on the PCB, wherein the impedance matching circuit is connected between the metal middle frame and the ground terminal or the radio frequency circuit.
  • the antenna material list is provided when the metal middle frame is provided with a shell of a certain material (conductor material) through the impedance configuration circuit, so that the performance of the antenna can be optimized. Power consumption can be saved as much as possible due to no need to control the switch.
  • a casing is provided.
  • the inside of the housing is provided with a connecting mechanism; when the core of the wearable electronic device is detachably installed in the installation space of the shell, the connecting mechanism electrically connects the metal middle frame of the core of the wearable electronic device with the shell, and the shell is made of conductor material .
  • the connecting mechanism electrically connects the metal middle frame of the core of the wearable electronic device with the shell, and the shell is made of conductor material .
  • the connection mechanism includes a body and an elastic piece, the body is fixed in the casing, one end of the elastic piece is connected to the body, and the other end of the elastic piece is tilted relative to the body to abut against the metal middle frame.
  • the connecting mechanism since one end of the shrapnel is connected to the body and the other end is tilted relative to the body, when the connecting mechanism is fixed to the casing and the metal middle frame is assembled to the casing, the other end of the shrapnel can effectively resist the metal middle frame. frame, and since the other end of the shrapnel collides with the metal middle frame, there is stress, so the metal middle frame can form a good electrical connection with the outer shell.
  • the body includes a limit mechanism located at the other end of the elastic piece, and the limit mechanism limits the tilting range of the other end of the elastic piece; the body is fixed in the installation groove of the shell, and the elastic piece includes a protrusion near the other end.
  • the protrusion protrudes from the installation groove to abut against the metal middle frame.
  • the other end of the shrapnel is limited by the limit mechanism to protect the other end of the shrapnel from being damaged by external force.
  • a wearable electronic device core in a third aspect, includes a metal middle frame and a PCB disposed on the metal middle frame; at least one grounding point is provided on the metal middle frame, and the grounding point is connected to the PCB The ground terminal coupling; the metal middle frame is provided with at least one feed point, and the feed point is coupled with the RF circuit on the PCB; the metal middle frame is provided with a connection mechanism; when the wearable electronic device core is installed on the shell When spaced, the connecting mechanism electrically connects the metal middle frame with the outer shell, and the outer shell is made of conductor material.
  • the metal middle frame is electrically connected to the outer shell through the connection structure as a whole, it is possible to avoid the shielding of the antenna signal by the outer shell, and to avoid the induced current on the outer shell that is opposite to the current of the antenna signal in the metal middle frame. In this way, the antenna performance of the metal middle frame is optimized, and the interference caused by the metal middle frame of the watch movement to the antenna signal is reduced.
  • the connection mechanism includes a body and an elastic piece, the body is fixed in the metal middle frame, one end of the elastic piece is connected to the body, and the other end of the elastic piece is tilted relative to the body to abut against the shell.
  • the connecting mechanism since one end of the shrapnel is connected to the body and the other end is tilted relative to the body, when the connecting mechanism is fixed to the metal middle frame and the metal middle frame is assembled to the casing, the other end of the shrapnel can effectively resist The shell, and since the other end of the shrapnel collides with the shell, there is stress, so the metal middle frame can form a good electrical connection with the shell.
  • the body includes a limit mechanism located at the other end of the elastic piece, and the limit mechanism limits the tilting range of the other end of the elastic piece; the body is fixed in the installation groove of the metal middle frame, and the elastic piece includes a The protrusion faces away from the body, and the protrusion protrudes from the installation groove to abut against the shell. The other end of the shrapnel is limited by the limit mechanism to protect the other end of the shrapnel from being damaged by external force.
  • a wearable electronic device comprising a casing and a wearable electronic device movement installed inside the installation space of the casing, wherein the wearable electronic device movement includes the first aspect or any one thereof
  • the technical effects brought about by any possible implementation manner in the fourth aspect may refer to the technical effects brought about by the different implementation manners of the above-mentioned first aspect to the third aspect, and details are not repeated here.
  • the wearable electronic device further includes conductive glue or conductive cloth, the conductive glue or the conductive cloth is located between the casing and the metal middle frame, and the casing passes through the The conductive glue or the conductive cloth is electrically connected to the metal middle frame.
  • the metal middle frame is electrically connected to the outer shell as a whole through conductive glue or conductive cloth, the shielding of the antenna signal by the outer shell can be avoided, and the reverse current of the antenna signal in the metal middle frame can be prevented from being induced on the outer shell. Induction current, so that the antenna performance of the metal middle frame can be optimized, and the interference caused by the metal middle frame of the watch movement to the antenna signal can be reduced.
  • FIG. 1 is a schematic structural diagram of a wearable electronic device provided by an embodiment of the present application
  • FIG. 2 is a schematic diagram of an exploded structure of a wearable electronic device provided by an embodiment of the present application
  • FIG. 3 is a schematic cross-sectional view of a partial structure of a wearable electronic device provided by an embodiment of the present application
  • FIG. 4 is a schematic diagram of an assembly structure of a wearable electronic device provided by an embodiment of the present application.
  • FIG. 5 is a schematic diagram of an assembly structure of a wearable electronic device provided by another embodiment of the present application.
  • FIG. 6 is a schematic diagram of an assembly structure of a wearable electronic device provided by another embodiment of the present application.
  • FIG. 7 is a schematic diagram of an assembly structure of a wearable electronic device provided by another embodiment of the present application.
  • FIG. 8 is a schematic diagram of a housing installation interface provided by an embodiment of the present application.
  • FIG. 9 is a schematic diagram of an assembly structure of a wearable electronic device provided by another embodiment of the present application.
  • Fig. 10 is the equivalent circuit diagram of Fig. 9 that the embodiment of the present application provides;
  • FIG. 11 is an equivalent circuit diagram of FIG. 9 provided by another embodiment of the present application.
  • Fig. 12 is the equivalent circuit diagram of Fig. 9 provided by another embodiment of the present application.
  • Fig. 13 is a schematic diagram of an assembly structure of a wearable electronic device provided by another embodiment of the present application.
  • FIG. 14 is a schematic cross-sectional view of a partial structure of a wearable electronic device provided by another embodiment of the present application.
  • Fig. 15 is a schematic structural diagram of a metal middle frame provided by an embodiment of the present application.
  • Fig. 16 is a schematic structural diagram of a connection mechanism provided by an embodiment of the present application.
  • FIG. 17 is a schematic side view of a connection mechanism provided by an embodiment of the present application.
  • Fig. 18 is a schematic structural diagram of a connection mechanism provided by another embodiment of the present application.
  • Fig. 19 is a schematic side view of a connection mechanism provided by another embodiment of the present application.
  • Fig. 20 is an assembly schematic diagram of a connection mechanism provided by an embodiment of the present application.
  • Fig. 21 is an assembly schematic diagram of a connection mechanism provided by another embodiment of the present application.
  • Fig. 22 is a schematic structural diagram of a casing provided by an embodiment of the present application.
  • Fig. 23 is a schematic assembly diagram of a connection mechanism provided by another embodiment of the present application.
  • Fig. 24 is a schematic assembly diagram of a connection mechanism provided by another embodiment of the present application.
  • Fig. 25 is a schematic diagram of an assembly structure of a wearable electronic device provided by another embodiment of the present application.
  • Fig. 26 is a schematic diagram of the assembly structure of a wearable electronic device provided by another embodiment of the present application.
  • FIG. 27 is a schematic diagram of an assembly structure of a wearable electronic device provided by another embodiment of the present application.
  • first”, second, etc. are used for convenience of description only, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of indicated technical features.
  • a feature defined as “first”, “second”, etc. may expressly or implicitly include one or more of that feature.
  • at least one means one or more
  • multiple means two or more.
  • “And/or” describes the association relationship of associated objects, indicating that there may be three types of relationships, for example, A and/or B, which can mean: A exists alone, A and B exist simultaneously, and B exists alone, where A, B can be singular or plural.
  • At least one of the following or similar expressions refer to any combination of these items, including any combination of single or plural items.
  • at least one item (piece) of a, b, or c can represent: a, b, c, a-b, a-c, b-c, or a-b-c, where a, b, c can be single or multiple .
  • "upper”, “lower”, “left” and “right” are not limited to be defined relative to the schematic placement orientations of components in the drawings, and it should be understood that these directional terms may be Relative concepts, which are used for description and clarification relative to, may change accordingly according to changes in the orientation of parts in the drawings.
  • the term “coupled” may mean a direct connection or an indirect connection through an intermediary.
  • the term “electrical connection” may be a direct electrical connection or an indirect electrical connection through an intermediary.
  • An embodiment of the present application provides a wearable electronic device, the wearable electronic device includes but not limited to electronic devices such as wristbands and watches.
  • FIG. 1 shows a schematic structural diagram of an electronic device 100 .
  • the electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (universal serial bus, USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, and an antenna 2 , a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a sensor module 180, a camera 190 and a display screen 191, etc.
  • a processor 110 an external memory interface 120, an internal memory 121, a universal serial bus (universal serial bus, USB) interface 130, a charging management module 140, a power management module 141, a battery 142, an antenna 1, and an antenna 2 , a mobile communication module 150, a wireless communication module 160, an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, a sensor module 180, a camera 190 and a display screen 191, etc
  • the structure illustrated in the embodiment of the present invention does not constitute a specific limitation on the electronic device 100 .
  • the electronic device 100 may include more or fewer components than shown in the figure, or combine certain components, or separate certain components, or arrange different components.
  • the illustrated components can be realized in hardware, software or a combination of software and hardware.
  • the processor 110 may include one or more processing units, for example: the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processing unit (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), controller, video codec, digital signal processor (digital signal processor, DSP), baseband processor, and/or neural network processor (neural-network processing unit, NPU), etc. Wherein, different processing units may be independent devices, or may be integrated in one or more processors.
  • application processor application processor, AP
  • modem processor graphics processing unit
  • GPU graphics processing unit
  • image signal processor image signal processor
  • ISP image signal processor
  • controller video codec
  • digital signal processor digital signal processor
  • baseband processor baseband processor
  • neural network processor neural-network processing unit
  • a memory may also be provided in the processor 110 for storing instructions and data.
  • the memory in processor 110 is a cache memory.
  • the memory may hold instructions or data that the processor 110 has just used or recycled. If the processor 110 needs to use the instruction or data again, it can be called directly from the memory. Repeated access is avoided, and the waiting time of the processor 110 is reduced, thereby improving the efficiency of the system.
  • processor 110 may include one or more interfaces.
  • the interface may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous transmitter (universal asynchronous receiver/transmitter, UART) interface, mobile industry processor interface (mobile industry processor interface, MIPI), general-purpose input and output (general-purpose input/output, GPIO) interface, subscriber identity module (subscriber identity module, SIM) interface, and /or universal serial bus (universal serial bus, USB) interface, etc.
  • I2C integrated circuit
  • I2S integrated circuit built-in audio
  • PCM pulse code modulation
  • PCM pulse code modulation
  • UART universal asynchronous transmitter
  • MIPI mobile industry processor interface
  • GPIO general-purpose input and output
  • subscriber identity module subscriber identity module
  • SIM subscriber identity module
  • USB universal serial bus
  • the charging management module 140 is configured to receive a charging input from a charger.
  • the charger may be a wireless charger or a wired charger.
  • the charging management module 140 can receive charging input from the wired charger through the USB interface 130 .
  • the charging management module 140 may receive a wireless charging input through a wireless charging coil of the electronic device 100 . While the charging management module 140 is charging the battery 142 , it can also provide power for electronic devices through the power management module 141 .
  • the power management module 141 is used for connecting the battery 142 , the charging management module 140 and the processor 110 .
  • the power management module 141 receives the input from the battery 142 and/or the charging management module 140 to provide power for the processor 110 , the internal memory 121 , the display screen 191 , the camera 190 , and the wireless communication module 160 .
  • the power management module 141 can also be used to monitor parameters such as battery capacity, battery cycle times, and battery health status (leakage, impedance).
  • the power management module 141 may also be disposed in the processor 110 .
  • the power management module 141 and the charging management module 140 may also be set in the same device.
  • the wireless communication function of the electronic device 100 can be realized by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modem processor and the baseband processor.
  • Antenna 1 and Antenna 2 are used to transmit and receive electromagnetic wave signals.
  • Each antenna in electronic device 100 may be used to cover single or multiple communication frequency bands. Different antennas can also be multiplexed to improve the utilization of the antennas.
  • Antenna 1 can be multiplexed as a diversity antenna of a wireless local area network.
  • the antenna may be used in conjunction with a tuning switch.
  • the mobile communication module 150 can provide wireless communication solutions including 2G/3G/4G/5G applied on the electronic device 100 .
  • the mobile communication module 150 may include one or more filters, switches, power amplifiers, low noise amplifiers (low noise amplifier, LNA) and the like.
  • the mobile communication module 150 can receive electromagnetic waves through the antenna 1, filter and amplify the received electromagnetic waves, and send them to the modem processor for demodulation.
  • the mobile communication module 150 can also amplify the signals modulated by the modem processor, and convert them into electromagnetic waves through the antenna 1 for radiation.
  • at least part of the functional modules of the mobile communication module 150 may be set in the processor 110 .
  • at least part of the functional modules of the mobile communication module 150 and at least part of the modules of the processor 110 may be set in the same device.
  • a modem processor may include a modulator and a demodulator.
  • the modulator is used for modulating the low-frequency baseband signal to be transmitted into a medium-high frequency signal.
  • the demodulator is used to demodulate the received electromagnetic wave signal into a low frequency baseband signal. Then the demodulator sends the demodulated low-frequency baseband signal to the baseband processor for processing.
  • the low-frequency baseband signal is passed to the application processor after being processed by the baseband processor.
  • the application processor outputs a sound signal through an audio device (not limited to a speaker 170A, a receiver 170B, etc.), or displays an image or video through a display screen 191 .
  • the modem processor may be a stand-alone device. In some other embodiments, the modem processor may be independent from the processor 110, and be set in the same device as the mobile communication module 150 or other functional modules.
  • the wireless communication module 160 can provide wireless local area networks (wireless local area networks, WLAN) (such as wireless fidelity (Wireless fidelity, Wi-Fi) network), bluetooth (Bluetooth, BT), global navigation satellite, etc. System (global navigation satellite system, GNSS), frequency modulation (frequency modulation, FM), near field communication technology (near field communication, NFC), infrared technology (infrared, IR) and other wireless communication solutions.
  • the wireless communication module 160 may be one or more devices integrating one or more communication processing modules.
  • the wireless communication module 160 receives electromagnetic waves via the antenna 2 , frequency-modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 110 .
  • the wireless communication module 160 can also receive the signal to be sent from the processor 110 , frequency-modulate it, amplify it, and convert it into electromagnetic waves through the antenna 2 for radiation.
  • the antenna 1 of the electronic device 100 is coupled to the mobile communication module 150, and the antenna 2 is coupled to the wireless communication module 160, so that the electronic device 100 can communicate with the network and other devices through wireless communication technology.
  • the wireless communication technology may include global system for mobile communications (GSM), general packet radio service (general packet radio service, GPRS), code division multiple access (code division multiple access, CDMA), broadband Code division multiple access (wideband code division multiple access, WCDMA), time division code division multiple access (time-division code division multiple access, TD-SCDMA), long term evolution (long term evolution, LTE), BT, GNSS, WLAN, NFC , FM, and/or IR techniques, etc.
  • GSM global system for mobile communications
  • GPRS general packet radio service
  • code division multiple access code division multiple access
  • CDMA broadband Code division multiple access
  • WCDMA wideband code division multiple access
  • time division code division multiple access time-division code division multiple access
  • TD-SCDMA time-division code division multiple access
  • the GNSS may include a global positioning system (global positioning system, GPS), a global navigation satellite system (global navigation satellite system, GLONASS), a Beidou navigation satellite system (beidou navigation satellite system, BDS), a quasi-zenith satellite system (quasi -zenith satellite system (QZSS) and/or satellite based augmentation systems (SBAS).
  • GPS global positioning system
  • GLONASS global navigation satellite system
  • Beidou navigation satellite system beidou navigation satellite system
  • BDS Beidou navigation satellite system
  • QZSS quasi-zenith satellite system
  • SBAS satellite based augmentation systems
  • the electronic device 100 realizes the display function through the GPU, the display screen 191, and the application processor.
  • the GPU is a microprocessor for image processing, and is connected to the display screen 191 and the application processor. GPUs are used to perform mathematical and geometric calculations for graphics rendering.
  • Processor 110 may include one or more GPUs that execute program instructions to generate or change display information.
  • the display screen 191 is used to display images, videos and the like.
  • the display screen 191 includes a display panel.
  • the display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active matrix organic light emitting diode or an active matrix organic light emitting diode (active-matrix organic light emitting diode, AMOLED), flexible light-emitting diode (flex light-emitting diode, FLED), Miniled, Microled, Micro-oled, quantum dot light emitting diodes (quantum dot light emitting diodes, QLED), etc.
  • the electronic device 100 may include 1 or N display screens 191 , where N is a positive integer greater than 1.
  • the electronic device 100 can realize the shooting function through the ISP, the camera 190 , the video codec, the GPU, the display screen 191 and the application processor.
  • the ISP is used for processing data fed back by the camera 190 .
  • the light is transmitted to the photosensitive element of the camera through the lens, and the light signal is converted into an electrical signal, and the photosensitive element of the camera transmits the electrical signal to the ISP for processing, and converts it into an image visible to the naked eye.
  • ISP can also perform algorithm optimization on image noise, brightness, and skin color. ISP can also optimize the exposure, color temperature and other parameters of the shooting scene.
  • the ISP may be located in the camera 190 .
  • Camera 190 is used to capture still images or video.
  • the object generates an optical image through the lens and projects it to the photosensitive element.
  • the photosensitive element may be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor.
  • CMOS complementary metal-oxide-semiconductor
  • the photosensitive element converts the light signal into an electrical signal, and then transmits the electrical signal to the ISP to convert it into a digital image signal.
  • the ISP outputs the digital image signal to the DSP for processing.
  • DSP converts digital image signals into standard RGB, YUV and other image signals.
  • the electronic device 100 may include 1 or N cameras 190, where N is a positive integer greater than 1.
  • the internal memory 121 may be used to store one or more computer programs including instructions.
  • the processor 110 can implement various functional applications and data processing by executing the above-mentioned instructions stored in the internal memory 121 .
  • the internal memory 121 may include an area for storing programs and an area for storing data.
  • the stored program area can store an operating system; the stored program area can also store one or more application programs (such as a gallery, contacts, etc.) and the like.
  • the storage data area can store data (such as photos, contacts, etc.) created during the use of the electronic device 101 .
  • the internal memory 121 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more disk storage devices, flash memory devices, universal flash storage (universal flash storage, UFS) and the like.
  • the processor 110 enables the electronic device 100 to execute various functional applications and data processing by executing instructions stored in the internal memory 121 and/or instructions stored in a memory provided in the processor.
  • the electronic device 100 can implement audio functions through the audio module 170 , the speaker 170A, the receiver 170B, the microphone 170C, the earphone interface 170D, and the application processor. Such as music playback, recording, etc.
  • the audio module 170 is used to convert digital audio information into analog audio signal output, and is also used to convert analog audio input into digital audio signal.
  • the audio module 170 may also be used to encode and decode audio signals.
  • the audio module 170 may be set in the processor 110 , or some functional modules of the audio module 170 may be set in the processor 110 .
  • Speaker 170A also referred to as a "horn" is used to convert audio electrical signals into sound signals.
  • Electronic device 100 can listen to music through speaker 170A, or listen to hands-free calls.
  • Receiver 170B also called “earpiece” is used to convert audio electrical signals into sound signals.
  • the receiver 170B can be placed close to the human ear to receive the voice.
  • the microphone 170C also called “microphone” or “microphone” is used to convert sound signals into electrical signals. When making a phone call or sending a voice message, the user can put his mouth close to the microphone 170C to make a sound, and input the sound signal to the microphone 170C.
  • the electronic device 100 may be provided with one or more microphones 170C. In some other embodiments, the electronic device 100 may be provided with two microphones 170C, except for collecting sound signals. Noise reduction is also available. In some other embodiments, the electronic device 100 can also be provided with three, four or more microphones 170C, so as to collect sound signals, reduce noise, identify sound sources, and realize directional recording functions, etc.
  • the sensor module 180 may include a pressure sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, and the like.
  • Touch sensor also known as "touch device”.
  • the touch sensor can be arranged on the display screen 191, and the touch sensor and the display screen 191 form a touch screen, also called “touch screen”.
  • the touch sensor is used to detect a touch operation on or near it.
  • the touch sensor can pass the detected touch operation to the application processor to determine the type of touch event.
  • Visual output related to the touch operation may be provided through the display screen.
  • a touch panel with a touch sensor array formed by a plurality of touch sensors may also be installed on the surface of the display panel in a hanging form.
  • the location of the touch sensor and the display screen 191 may also be different.
  • the proximity sensor, and the aforementioned antenna 1 and antenna 2 can reuse the metal middle frame of the core of the wearable electronic device.
  • the above-mentioned electronic equipment may also include one or more components such as buttons, crowns, motors, indicators, and subscriber identification module (subscriber identification module, SIM) card interfaces, and the embodiments of the present application do not make any restrictions on this .
  • the electronic device may include more or less components than the above, for example, in some embodiments, it may also include the earphone jack 170D, the external memory interface 120 and so on.
  • the earphone interface 170D is used for connecting wired earphones.
  • the earphone interface 170D can be a USB interface 130, or a 3.5mm open mobile terminal platform (OMTP) standard interface, or a cellular telecommunications industry association of the USA (CTIA) standard interface.
  • the external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, so as to expand the storage capacity of the electronic device 100.
  • the external memory card communicates with the processor 110 through the external memory interface 120 to implement a data storage function. Such as saving music, video and other files in the external memory card.
  • the wearable electronic device 20 provided by the embodiment of the present application includes an assembled housing 21 , a metal middle frame 22 , a printed circuit board PCB 23 , a rear housing 24 and a screen assembly 25 .
  • the housing 21 includes an installation space, and the wearable electronic device movement composed of the screen assembly 25, the metal middle frame 22, the printed circuit board PCB 23 and the back shell 24 is installed in the installation space of the housing 21.
  • the shell 21 is made of hard materials such as ceramics, metal, carbon fiber, etc.
  • the core of the wearable electronic device can be detachably installed in the installation space of the shell 21 by clamping or connecting pieces such as screws.
  • the core of the wearable electronic device can be directly nested in the installation space of the shell 21. It can be understood that when the shell 21 needs to be replaced, the The core of the wearable electronic device is pulled out from the inside of the installation space of the housing 21 .
  • the housing 21 includes a ring-shaped housing base 211 and a housing extension 212 integrally formed with the housing base 211
  • the metal middle frame 22 includes a ring-shaped middle frame base 221.
  • Two pairs of housing extensions 212 protrude from the housing base 211 toward two sides respectively.
  • the shell extension 212 of the shell 21 is used for connecting the watch strap.
  • the core of the wearable electronic device may also include buttons, crowns, etc., wherein the housing 21 may include holes for exposing or installing the buttons and the crown.
  • the button and its corresponding hole on the casing 21, or the crown and its corresponding hole on the casing 21 can be aligned to ensure precise alignment between the casing 21 and the metal middle frame 22.
  • it is not limited to installing the buttons and the crown before installing the movement of the wearable electronic device on the casing 21, or after installing the movement of the wearable electronic device on the casing 21. Crown installation.
  • the above is only a way of aligning the outer shell and the metal middle frame, and in some embodiments, other ways can also be used to realize the alignment of the outer shell and the metal middle frame.
  • the screen component 25 includes a display screen 251, and the display screen 251 displays information facing the user after the wearable electronic device is assembled. Realize interaction.
  • the screen assembly 25 is fixed together with the metal middle frame 22 above the metal middle frame 22 .
  • the metal middle frame 22 and the screen assembly 25 may be connected together by clamping, bonding, or connecting members such as screws.
  • the printed circuit board PCB 23 is fixed together with the metal middle frame 22 under the metal middle frame 22 .
  • the printed circuit board PCB23 can be arranged on the metal middle frame 22 by buckle or screw fixing.
  • the printed circuit board PCB23 is used as the carrier of the electronic devices and the wiring of the electronic equipment to carry the electronic devices and the wiring in each module shown in Fig. 22 are fixed together, so as to seal and protect the printed circuit board PCB23 from below.
  • the rear shell 24 and the metal middle frame 22 can be connected together by clamping or connecting pieces such as screws.
  • the printed circuit board PCB23 can also be integrated with the rear case 24.
  • the printed circuit board PCB23 is located in the rear case 24, and the rear case 24 is fixed with the metal middle frame 22 under the metal middle frame 22. , for example, can be connected together by clamping or connecting pieces such as screws.
  • a controller 231 is arranged on the PCB23; the controller 231 can be integrated in the processor 110 for realization, or can be realized by a separate integrated circuit .
  • the metal middle frame 22 is provided with at least one ground point G (ground points G1, G2 are shown in Fig. 4, Fig. 5, Fig. 6 and Fig. 7), and at least one feed point P (Fig. 4, Fig. 5, Fig. 6 and FIG.
  • grounding points P1, P2) grounding point G is coupled with the ground terminal GND on the PCB23
  • the feed point P is coupled with the radio frequency circuit 232 on the PCB23; thus forming a radio frequency circuit 232-feed point P-metal middle frame 22-ground point G-ground return path of ground terminal GND, the radio frequency circuit 232 transmits the antenna signal through the metal middle frame 22, wherein the number and position of the ground point G and the feed point P determine the metal
  • the parameters of the antenna formed by the middle frame 22 for example: the inductance value and the capacitance value of the antenna).
  • the core of wearable electronic equipment includes global navigation satellite system (global navigation satellite system, GNSS), global positioning system (navigation satellite timing and ranging global position system, referred to as GPS), Wi-Fi (wireless fidelity), Bluetooth (bluetooth, BT ), 4G/5G communication, near field communication (near field communication, referred to as NFC) and other communication standards
  • the metal middle frame 22 may contain one or more feed points P, wherein each feed Point P corresponds to coupling a radio frequency circuit of a communication standard, as shown in FIG. , the radio frequency circuit 232-2 supports the second communication standard), the radio frequency circuit 232-1 is coupled to a feeding point P1, and the radio frequency circuit 232-2 is coupled to a feeding point P2.
  • a radio frequency circuit of a communication standard may also be coupled to multiple feeding points P, as shown in FIG. 6 , the radio frequency circuit 232 is coupled to the feeding point P1 and the feeding point P2.
  • the metal middle frame 22 when the core of the wearable electronic device is detachably installed in the installation space of the housing 21 , the metal middle frame 22 will be covered by the housing 21 .
  • the shell 21 may be made of different materials, such as conductive materials such as metal and carbon fiber, or insulating materials such as ceramics, plastics, and silica gel. Therefore, when the outer shell 21 is made of different materials, the interference to the antenna signal emitted by the metal middle frame 22 is also different.
  • the first switch k1 can be coupled between the ground point G and the ground terminal GND (as shown in FIG. 4 , FIG. 5 and FIG. 7 , there is a first Switch k1-1, a first switch k1-2 is coupled between the ground point G2 and the ground terminal GND.
  • first switch k1-1 and the first switch k1-2 are not limited to using single-pole single-throw switches, or the first switch k1-1 and the first switch k1-2 can also be implemented by a single-pole double-throw switch. coupling ground point G1 and ground point G2), and/or, a second switch k2 is coupled between the feeding point P and the radio frequency circuit 232 (as shown in conjunction with FIG. 6 and FIG.
  • a second switch k2-1 is coupled, and a second switch k2-2 is coupled between the feed point P2 and the radio frequency circuit 232, wherein the second switch k2-1 and the second switch k2-2 are not limited to using single-pole single-throw switches , or the second switch k2-1 and the second switch k2-2 can also be realized by using a single-pole double-throw switch.
  • the two selection terminals are respectively coupled to the feed point P1 and the feed point P2).
  • the controller 231 is configured to acquire a switch control signal; the controller 231 is configured to control the conduction state of at least one first switch k1 and/or at least one second switch k2 according to the switch control signal.
  • the radio frequency circuit 232 can be connected to transmitting antennas with different antenna parameters (mainly referring to the metal middle frame 22 as the capacitance value and inductance value of the antenna), so according to the actual material of the shell 21 Selecting and controlling the conduction state of at least one first switch k1 and/or at least one second switch k2, so as to configure a suitable antenna bill of material (bill of material, BOM) for the radio frequency circuit, so that the antenna performance of the metal middle frame can be optimized Excellent, so as to reduce the interference caused by the metal middle frame of the watch movement to the antenna signal.
  • a suitable antenna bill of material (bill of material, BOM)
  • the controller 231 is configured to generate a switch control signal in response to a selection signal triggered by the user according to the material of the casing.
  • the shell installation interface can be designed through user experience (UX), and when the watch generates the shell installation interface as shown in Figure 8 in response to the user triggering the shell installation function control displayed on the display screen, the shell can be displayed to the user Material drop-down option, so that the user can select the material of the installed shell (for example: metal material, carbon fiber material, ceramic material, plastic material, etc.), wherein different shell materials are pre-configured with the corresponding antenna material list, in response to the user's request
  • the controller can generate a switch control signal, thereby controlling the conduction state of the above-mentioned at least one first switch k1 and/or at least one second switch k2, and configuring a suitable antenna material for the radio frequency circuit list.
  • the PCB 23 also includes a proximity sensor chip 233; the proximity sensor chip 233 is coupled with the metal middle frame 22; of course, in this embodiment, the proximity sensor chip 233 and the metal middle frame are not limited.
  • the coupling position of the frame 22 and the coupling position of the proximity sensor chip 233 and the metal middle frame 22 may be any position on the metal middle frame 22 , such as the ground point G or the feed point P mentioned above.
  • the proximity sensor chip 233 is configured to detect the capacitance value of the metal middle frame 22; the controller 231 is configured to generate a switch control signal according to the capacitance value.
  • the capacitance value detected by the proximity sensor chip 233 will change.
  • the dielectric constant of ceramic material is high, usually 20+ ⁇ 30+, and the dielectric constant of plastic material is low, usually 2.x ⁇ 4.x.
  • the dielectric constant difference between ceramic material and plastic material is large.
  • the capacitance value detected by the proximity sensor chip 233 will be lower than that detected by the proximity sensor chip 233 when the shell 21 is made of ceramic material.
  • the capacitance value can determine the material of the shell 21, as a basis for switching the conduction state of at least one first switch k1 and/or at least one second switch k2.
  • the outer shell 21 is made of conductive materials such as metal or carbon fiber
  • the outer shell 21 and the metal middle frame 22 will form a capacitor with a large coupling area and a short distance, so close to
  • the sensor chip 233 will detect a larger capacitance value, and when the shell 21 is connected to the metal middle frame 22 , the proximity sensor chip 233 will detect a smaller capacitance value.
  • the controller 231 can pre-configure the corresponding antenna material list according to the materials of different casings with different capacitance values, and generate a switch control signal, thereby controlling at least one of the above-mentioned first switches.
  • FIG. 9 mainly shows that the proximity sensor chip 233 is applied to the structure of the wearable electronic device shown in FIG. In the structure of the wearable electronic device shown in FIG. 7 , its functions can refer to the description in FIG. 9 , and will not be repeated here.
  • the controller is also configured to control the proximity sensor chip 233 to power off after adjusting the conduction state of at least one first switch k1 and/or at least one second switch k2 according to the switch control signal.
  • the proximity sensor chip 233 is mainly used to detect the capacitance value corresponding to the housing nested in the movement.
  • the controller 231 determines the material of the housing according to the capacitance value, and controls the conduction state of the switch to match a suitable antenna material list for the radio frequency circuit. Therefore, the power can be turned off after the operation of nesting the shell of the core is completed and the detection of the capacitance value of the proximity sensor chip 233 is completed, so as to save power consumption. Specifically, when it is necessary to install the shell for the core of the wearable electronic device, open an installation interface that reminds the user to install the shell, and wake up the proximity sensor chip 233 at the same time; and remind the user that after the shell is installed, click to confirm that the installation is complete.
  • the installation is completed and the proximity sensor chip 233 is powered off, or the default setting wakes up the proximity sensor chip 233 for a certain period of time and then automatically powers off the proximity sensor chip 233.
  • the certain period of time needs to meet the requirements of the proximity sensor chip 233 to detect the metal middle frame 22 The required length of time for the capacitance value.
  • the above operation can be repeated.
  • the above mainly describes the scheme of determining the material of the housing by using the proximity sensor chip to detect the capacitance value of the metal middle frame.
  • the detection of the material of the housing can also be carried out by carrying an identification module on the housing.
  • the identification module can be a magnet, a radio frequency identification (RFID) or a color coating, etc.
  • RFID radio frequency identification
  • the identification module adopts a magnet, magnets with different magnetic field strengths can be set on the shells of different materials, so that a magnetic sensor (such as a Hall sensor) can also be set on the PCB23, and the controller can determine the magnetic field strength of the shell according to the magnetic field strength detected by the magnetic sensor.
  • the identification module adopts RFID
  • different RFIDs can be set on the shells of different materials, so that a near field communication (near field communication, NFC) can also be set on the PCB23 ) chip
  • the controller can determine the material of the shell according to the material information stored in the RFID read by the NFC chip, and control the conduction state of the switch
  • the identification module adopts color coating it can be used on shells of different materials Color coatings of different colors are set.
  • a photoelectric sensor can also be arranged on the PCB 23. According to the color of the color layer detected by the photoelectric sensor, the controller can determine the material of the shell to control the conduction state of the switch.
  • Fig. 9 the equivalent circuit diagram of above-mentioned Fig. 9 is described as follows: wherein, generally, there is a certain capacitance (with a certain capacitance) between an electrode of a capacitor and the earth in the metal middle frame 22 Capacitance value), when the shell 21 is nested outside the metal middle frame 22, since the proximity sensor chip 233 is applied a voltage on the metal middle frame 22, the metal middle frame 22 will be subjected to electrostatic induction to generate polarization, and the closer the shell 21 is ( For example, the distance between the metal middle frame 22 and the shell 21 in Fig.
  • the isolation inductor L is usually coupled between the proximity sensor chip 233 and the metal middle frame 22, and In order to prevent the proximity sensor chip 233 from being directly coupled to the radio frequency circuit 232 or directly shorted to ground through the metal middle frame 22 , a DC blocking capacitor C is usually set between the metal middle frame 22 and the ground terminal GND and the feed point P.
  • the radio frequency circuit 232 is usually connected to the ground terminal GND through an inductance;
  • the effect of the switch is usually connected to the ground terminal GND through an inductor.
  • the proximity sensor chip 233 is coupled to the feed point P of the metal middle frame 22
  • the switch k1 is connected between the ground point G of the metal middle frame 22 and the ground terminal GND.
  • a resistor R1 and an inductor L1 are connected in series between the proximity sensor chip 233 and the feed point P, and a suitable resistance value is selected for the resistor R1 to suppress the noise of the proximity sensor chip 233; wherein, the connection between the resistor R1 and the inductor L1 is connected through a capacitor C1 Ground terminal GND.
  • a capacitor C3 and a switch k1 are connected in series between the ground point G of the metal middle frame 22 and the ground terminal GND, and the connection between the capacitor C3 and the switch k1 is connected to the ground terminal GND through the inductor L3.
  • the capacitor C3 and the inductor L3 form an isolation network of the switch k1 to avoid the influence of the capacitance change of the metal middle frame 22 on the proximity sensor chip 233 when the switch is switched.
  • the proximity sensor chip 233 is coupled to the ground point G of the metal middle frame 22
  • the switch k1 is connected between the ground point G of the metal middle frame 22 and the ground terminal GND.
  • a resistor R1 and an inductor L1 are connected in series between the proximity sensor chip 233 and the ground point G, and the resistor R1 is selected with an appropriate resistance value to suppress the noise of the proximity sensor chip 233; the connection between the resistor R1 and the inductor L1 is connected to the ground terminal through a capacitor C1 GND.
  • a capacitor C3 and a switch k1 are connected in series between the ground point G of the metal middle frame 22 and the ground terminal GND, and the connection between the capacitor C3 and the switch k1 is connected to the ground terminal GND through the inductor L3.
  • the capacitor C3 and the inductor L3 form an isolation network of the switch k1 to avoid the influence of the capacitance change of the metal middle frame 22 on the proximity sensor chip 233 when the switch is switched.
  • the proximity sensor chip 233 is coupled to the feed point P of the metal middle frame 22
  • the switch k2 is connected between the feed point P of the metal middle frame 22 and the radio frequency circuit 232 .
  • a resistor R1 and an inductor L1 are connected in series between the proximity sensor chip 233 and the feed point P, and the resistor R1 is selected with a suitable resistance value to suppress the noise of the proximity sensor chip 233; the connection between the resistor R1 and the inductor L1 is connected to the ground through a capacitor C1 Terminal GND.
  • a switch k2 and a capacitor C2 are sequentially connected in series, wherein the radio frequency circuit 232 is also coupled to the ground terminal GND through an inductor L2, wherein C2 and L2 form an isolation network of the radio frequency circuit 232 and the switch k2 to avoid the radio frequency circuit 232
  • a capacitor C3 is connected in series between the ground point G of the metal middle frame 22 and the ground terminal GND, so as to prevent the proximity sensor chip 233 from being directly short-circuited back to the ground.
  • the above-mentioned capacitor C1 can be replaced by a transient diode (transient voltage suppressor, TVS).
  • TVS transient voltage suppressor
  • the proximity sensor chip 233 should be kept as far away as possible from heat source devices such as power amplifiers (PA) on the PCB to reduce the risk of temperature drift.
  • PA power amplifiers
  • proximity sensor chip 233 and the controller 231 can be integrated into the processor 110 or implemented by a separate integrated circuit.
  • the core of the wearable electronic device provided includes a metal middle frame 22 and a set The PCB23 on the metal middle frame 22; the metal middle frame 22 is provided with at least one ground point G (G1), and the ground point G1 is coupled with the ground terminal GND on the PCB23; the metal middle frame 22 is provided with at least one feed point P (P1), the feed point P1 is coupled with the RF circuit 232 on the PCB23; in addition, the metal middle frame 22 is provided with a connection structure 26; The metal middle frame 22 is electrically connected to the outer shell 21 .
  • the embodiments of the present application are not limited to disposing one or more connection structures 26 on the metal middle frame 22 .
  • the embodiment of the present application does not limit the specific position of each connection structure, for example, they may be arranged uniformly or symmetrically along the outer peripheral surface 22 o of the metal middle frame 22 .
  • connection mechanism 26 includes a body 261 and an elastic piece 262, the body 261 is fixed in the metal middle frame 22, one end of the elastic piece 262 is connected with the body 261, and the other end of the elastic piece 262 is warped relative to the body 261. to abut against the housing 21 (shown in FIG. 14 ).
  • the body 261 can also include a limit mechanism 2611 located at the other end of the elastic piece 262, the limit mechanism 2611 limits the tilting range of the other end of the elastic piece 262; the body 261 is fixed on the metal middle frame In the installation groove 223 (shown in FIG.
  • the elastic piece 262 includes a protrusion near the other end, wherein the protrusion faces away from the body 261, and the protrusion protrudes from the installation groove 223 to abut against the shell 21.
  • Fig. 20 shows the state of the elastic piece 262 before the shell 21 is installed on the metal middle frame 22, wherein, the other end of the elastic piece 262 is limited by the limiting mechanism 2611 to lift the other end of the elastic piece. To protect the role, to avoid being broken by external force.
  • FIG. 21 shows that after the shell 21 is installed on the metal middle frame 22 , the protrusion at the other end of the elastic piece 262 abuts against the shell 21 to form an electrical connection between the metal middle frame 22 and the shell 21 .
  • connection mechanism 26 may also be provided on the housing 21 .
  • the connecting mechanism 26 electrically connects the metal middle frame 22 of the core of the wearable electronic device with the housing 21 , wherein the housing 21 is made of conductive material.
  • the metal middle frame 22 is electrically connected to the outer shell 21 as a whole through the connection structure 26, the shielding of the antenna signal by the outer shell 21 can be avoided, and the current induced on the outer shell 21 and the antenna signal in the metal middle frame 22 can be avoided. Reverse induced current, so that the antenna performance of the metal middle frame can be optimized, and the interference caused by the metal middle frame of the watch movement to the antenna signal can be reduced.
  • connection mechanism 26 includes a body 261 and an elastic piece 262. It is tilted relative to the main body 261 to abut against the metal middle frame 22 .
  • the connection mechanism since one end of the shrapnel is connected to the body and the other end is tilted relative to the body, when the connecting mechanism is fixed to the casing and the metal middle frame is assembled to the casing, the other end of the shrapnel can effectively resist the metal middle frame. frame, and since the other end of the shrapnel collides with the metal middle frame, there is stress, so the metal middle frame can form a good electrical connection with the outer shell.
  • the body 261 includes a limiting mechanism 2611 located at the other end of the elastic piece 262, and the limiting mechanism 2611 limits the tilting range of the other end of the elastic piece 262; the main body 261 is fixed in the installation groove 213 of the shell 21 (as shown in FIG. 22 ) , the elastic piece 262 includes a protrusion near the other end, wherein the protrusion faces away from the body 261 , and the protrusion protrudes from the installation groove 213 to abut against the metal middle frame 22 .
  • Figure 23 shows the state of the elastic piece 262 before the shell 21 is installed on the metal middle frame 22, wherein the other end of the elastic piece is limited by the limit mechanism 2611 to limit the tilting range, so as to protect the other end of the elastic piece role, to avoid being broken by external force.
  • FIG. 24 shows that after the shell 21 is installed on the metal middle frame 22 , the protrusion at the other end of the elastic piece 262 abuts against the metal middle frame 22 to form an electrical connection between the metal middle frame 22 and the shell 21 .
  • the embodiments of the present application are not limited to disposing one or more connection structures 26 on the housing 21 .
  • the embodiment of the present application does not limit the specific position of each connection structure, for example, they may be arranged uniformly or symmetrically along the inner peripheral surface 21 i of the housing 21 .
  • connection structure 26 can also be applied to the schemes corresponding to the above-mentioned Figure 4, Figure 5, Figure 6, Figure 7 and Figure 9, of course, Figure 26 only shows that the connection structure
  • the scheme of 26 is applied to the example in the scheme of FIG. 4 described above.
  • the difference between Fig. 15 and Fig. 22 is that the orientation of the other end of the elastic piece 262 is different.
  • the core of the wearable electronic device is usually assembled into the casing 21 from the bottom of the casing 21, when the elastic piece 262 is set in the metal middle frame 22, the other end of the elastic piece 262 faces away from the direction of the housing 21, which is more conducive to installation and avoids damage to the elastic piece caused by the housing 21 blocking the other end of the elastic piece 262 during the installation process.
  • the elastic piece 262 is arranged on the shell 21, the other end of the elastic piece 262 faces away from the metal middle frame 22, which is more convenient for installation, and avoids damage to the elastic piece caused by the metal middle frame 22 blocking the other end of the elastic piece 262 during the installation process.
  • the PCB 23 is also provided with an impedance matching circuit 27 , wherein the impedance matching circuit 27 is connected between the metal middle frame 22 and the ground terminal GND or the radio frequency circuit 232 .
  • the impedance matching circuit 27 may include a circuit formed by connecting inductance and capacitance.
  • a typical impedance matching circuit consists of a capacitor and an inductor.
  • the metal middle frame 22 returns to the ground through a fixed path.
  • a feed point P1 is connected (there is no switch between the feed point P1 and the radio frequency circuit 232 ), and the metal middle frame 22 is directly connected to the ground terminal GND through the impedance matching circuit 27 .
  • the antenna material list is provided when the metal middle frame is provided with a shell of a certain material (conductor material) through the impedance configuration circuit, so that the performance of the antenna can be optimized. Power consumption can be saved as much as possible due to no need to control the switch.
  • the controller controls the conduction state of at least one first switch and/or at least one second switch according to the switch control signal, and the impedance matching circuit 27 and The switches work at the same time to return the metal middle frame 22 to the ground.
  • the antenna performance of the electronic device at this time depends on the antenna impedance provided by the impedance matching circuit 27 and at least one first switch and/or at least one second switch.
  • the shell 21 is made of a certain material (such as metal material, carbon fiber material and other conductive materials)
  • the metal middle frame returns to the ground through a fixed path.
  • the RF circuit 232 directly passes through the impedance matching circuit on this path. 27 is connected to the metal middle frame 22, and the metal middle frame 22 is directly connected to the ground terminal GND through the ground point G1.
  • the antenna material list is provided when the metal middle frame is provided with a shell of a certain material (conductor material) through the impedance configuration circuit, so that the performance of the antenna can be optimized. Power consumption can be saved as much as possible due to no need to control the switch.
  • the controller controls the conduction state of at least one first switch and/or at least one second switch according to the switch control signal, and the impedance matching circuit 27 and The switch works simultaneously, and the metal middle frame 22 is returned to the ground.
  • the wearable electronic device includes conductive adhesive 28 .
  • the conductive glue 28 is located between the inner peripheral surface 21i of the casing 21 and the outer peripheral surface 22o of the metal middle frame 22, and the conductive glue 28 is in contact with the inner peripheral surface 21i of the casing 21, so that the casing 21 and the metal middle frame 22 are fixed via the conductive glue 28 Together, the electrical connection is also realized via the conductive glue 28 .
  • the present application does not have any restrictions on the shape and arrangement of the conductive glue 28, as long as the conductive glue 28 can achieve the above functions.
  • the shape of the conductive glue 28 disposed on the metal middle frame 22 is a substantially arc-shaped conductive glue 28, it is not limited thereto.
  • the shape of the conductive glue 28 can be set to other shapes as required in different parts of the metal middle frame 22 .
  • the present application does not have any restrictions on the base material and conductive components of the conductive adhesive 28, as long as the conductive adhesive 28 can achieve the above functions.
  • different substrates can be selected according to different curing conditions, and the substrates can include various plastics, dispersants, additives, and the like.
  • the conductive component of the conductive adhesive 28 can be silver powder, gold powder, copper powder, aluminum powder, zinc powder, nickel powder, carbon powder, graphite and other conductive materials.
  • the form of the conductive glue 28 can be paste, slurry or conductive tape.
  • the conductive glue 28 can be replaced by a conductive cloth, and the conductive cloth is located between the outer shell 21 and the metal middle frame 22, and the outer shell 21 and the metal middle frame 22 are fixed together by the conductive cloth to realize electrical connection .
  • the electrical connection may also be realized while fixing the shell 21 and the metal middle frame 22 together by bolts.
  • the metal middle frame 22 may be electrically connected to corresponding conductive parts (such as wires and electronic devices) of the PCB 23 through connecting posts or the like.

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Abstract

本申请实施例提供一种穿戴式电子设备机芯、外壳及穿戴式电子设备，涉及电子设备领域，能够降低穿戴式电子设备的外壳对机芯的天线信号的干扰。穿戴式电子设备机芯，包括金属中框、以及设置于金属中框上的印刷电路板PCB；PCB上设置有控制器；金属中框上设置有至少一个接地点，接地点与PCB上的接地端耦合；金属中框上设置有至少一个馈电点，馈电点与PCB上的射频电路耦合；其中，接地点与接地端之间耦合有第一开关，和/或,馈电点与射频电路之间耦合有第二开关；当将穿戴式电子设备机芯安装于外壳的安装空间时，控制器，被配置为获取开关控制信号；控制器，被配置为根据开关控制信号控制至少一个第一开关和/或至少一个第二开关的导通状态。

Description

穿戴式电子设备机芯、外壳及穿戴式电子设备
本申请要求于2021年07月28日提交国家知识产权局、申请号为202110859853.0、申请名称为“穿戴式电子设备机芯、外壳及穿戴式电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请实施例涉及电子设备领域，尤其涉及一种穿戴式电子设备机芯、外壳及穿戴式电子设备。
背景技术
目前，通讯领域电子产品很多，智能手表、智能手环等随身携带的穿戴式电子设备越来越多，成为人们生产生活中必不可少的必需品。以智能手表为例，为了丰富产品的外观体验，手表的厂商将手表机芯和外壳分开制作，由用户自行将手表机芯安装于外壳。这样手表的厂商可以针对不同外观设计的外壳设计通用的手表机芯，从而由用户选择具有不同的外观设计的外壳搭配手表机芯使用。然而，在这种产品中，手表机芯的金属中框通常用作手表的天线，例如可以是全球导航卫星系统(global navigation satellite system，GNSS)、全球定位系统(navigation satellite timing and ranging global position system，简称GPS)、Wi-Fi(wireless fidelity)、蓝牙(bluetooth，BT)、4G/5G通信、近场通信(near field communication，简称NFC)等通信制式的天线。这样，当将手表机芯安装于外壳时，外壳会遮挡手表机芯的金属中框，从而对金属中框辐射的天线信号造成干扰。
发明内容
本申请的实施例提供一种穿戴式电子设备机芯、外壳及穿戴式电子设备，能够在将穿戴式电子设备机芯安装于外壳时，降低外壳遮挡手表机芯的金属中框对天线信号造成的干扰。
第一方面，提供一种穿戴式电子设备机芯。穿戴式电子设备机芯包括金属中框、以及设置于金属中框上的印刷电路板(printed circuit board，PCB)；PCB上设置有控制器。金属中框上设置有至少一个接地点，接地点与PCB上的接地端耦合；金属中框上设置有至少一个馈电点，馈电点与PCB上的射频电路耦合；其中，接地点与接地端之间耦合有第一开关，和/或,馈电点与射频电路之间耦合有第二开关；当将穿戴式电子设备机芯安装于外壳的安装空间时，控制器，被配置为获取开关控制信号；控制器，被配置为根据开关控制信号控制至少一个第一开关和/或至少一个第二开关的导通状态。这样，由于金属中框上的各个馈电点以及各个接地点分别位于不同的位置，则当通过至少一个第一开关和/或至少一个第二开关的导通状态将金属中框的不同位置接入射频电路时，则可以为射频电路接入不同天线参数(主要指金属中框作为天线的电容值和电感值)的天线，这样根据外壳的实际材质选择控制至少一个第一开关和/或至少一个第二开关的导通状态，从而为射频电路配置合适的天线材料清单(bill of material，BOM)，以使金属中框的天线性能达到最优，从而降低外壳会遮挡手表机芯的金属中框对天线信号造成的干扰。
在一种可能的实现方式中，控制器，被配置为响应于用户根据外壳的材质触发的选择信号，生成开关控制信号。例如，可以通过用户体验(user experience，UX)设计外壳安装界面，当手表响应于用户对显示屏显示的外壳安装功能控件的触发生成外壳安装界面后，可以向用户展示外壳的材质下拉选项，这样由用户选择所安装的外壳的材质(例如：金属材质、碳纤维材质、陶瓷材质以及塑胶材质等)，其中不同的外壳的材质预先配置对应的天线材料清单，响应于用户对选定的材质触发的选择信号，则控制器可以生成开关控制信号，从而控制上述的至少一个第一开关和/或至少一个第二开关的导通状态，为射频电路配置合适的天线材料清单。
在一种可能的实现方式中，还包括：接近传感器芯片；接近传感器芯片与金属中框耦合；接近传感器芯片，被配置为检测金属中框的电容值；控制器，被配置为根据电容值生成开关控制信号。接近传感器芯片与金属中框耦合的位置可以是金属中框上的任一位置，例如可以是上述的接地点或馈电点。具体的，相对于不设置外壳的情况，当外壳采用为陶瓷材质、塑胶材质等绝缘材质时，接近传感器芯片检测的电容值会发生变化。陶瓷材质的介电常数高，通常为20+～30+，塑胶材质的介电常数较低，通常为2.x～4.x。陶瓷材质和塑胶材质的介电常数差异大，外壳为塑胶材质时接近传感器芯片检测的电容值会低于外壳为陶瓷材质时接近传感器芯片检测的电容值，根据接近传感器芯片检测的电容值可以判定外壳的材质，作为至少一个第一开关和/或至少一个第二开关的导通状态切换的依据。当然，外壳采用金属材质或碳纤维材质等导体材质时，如果外壳与金属中框未导通，则外壳与金属中框会形成耦合面积很大距离很近的电容，因此接近传感器芯片将检测到较大的电容值，而当外壳与金属中框导通时，接近传感器芯片将检测到较小的电容值。这样，由接近传感器芯片可以检测电容值，因此，控制器可以根据不同电容值为不同的外壳的材质预先配置对应的天线材料清单，生成开关控制信号，从而控制上述的至少一个第一开关和/或至少一个第二开关的导通状态，为射频电路配置合适的天线材料清单。
在一种可能的实现方式中，金属中框上设置有连接机构；当将穿戴式电子设备机芯装配于外壳的安装空间时，连接机构将金属中框与外壳电连接，其中外壳采用导体材质。这样，由于金属中框通过连接结构与外壳电连接为一个整体，因此可以避免外壳对天线信号造成的屏蔽，并且避免外壳上会感应产生与金属中框中天线信号的电流反向的感应电流，从而使金属中框的天线性能达到最优，降低外壳会遮挡手表机芯的金属中框对天线信号造成的干扰。
在一种可能的实现方式中，连接机构包括本体和弹片，本体固定于金属中框中，弹片的一端与所述本体相连，弹片的另一端相对于本体翘起，以抵接于外壳。在该方案中，由于弹片的一端与本体相连，另一端相对于本体翘起，因此当将连接机构固定于金属中框后，将金属中框装配于外壳时，由于弹片的另一端可以有效抵触外壳，并且由于弹片的另一端与外壳抵触后存在应力，因此可以使得金属中框与外壳形成良好的电连接。
在一种可能的实现方式中，本体包括位于弹片的另一端的限位机构，限位机构限制弹片的另一端翘起的幅度；本体固定于金属中框的安装槽内，弹片包括靠近另一端的凸起，其中凸起朝向远离本体的方案，凸起从安装槽中突出，以抵接于外壳。弹片 的另一端被限位机构限制翘起的幅度，从而对该弹片的另一端起到保护的作用，避免被外力扳坏。
在一种可能的实现方式中，PCB上还设置有阻抗匹配电路，其中阻抗匹配电路连接于金属中框与接地端或射频电路之间。这样，通过阻抗配置电路为金属中框上设置某一材质(导体材质)的外壳时提供天线材料清单，使天线性能达到最优。由于无需对开关进行控制可以尽可能节省功耗。
第二方面，提供一种外壳。外壳的内部设置有连接机构；当将穿戴式电子设备机芯可拆卸的安装于外壳的安装空间时，连接机构将穿戴式电子设备机芯的金属中框与外壳电连接，其中外壳采用导体材质。这样，由于金属中框通过连接结构与外壳电连接为一个整体，因此可以避免外壳对天线信号造成的屏蔽，并且避免外壳上会感应产生与金属中框中天线信号的电流反向的感应电流，从而使金属中框的天线性能达到最优，降低外壳会遮挡手表机芯的金属中框对天线信号造成的干扰。
在一种可能的实现方式中，连接机构包括本体和弹片，本体固定于外壳中，弹片的一端与本体相连，弹片的另一端相对于本体翘起，以抵接于金属中框。在该方案中，由于弹片的一端与本体相连，另一端相对于本体翘起，因此当将连接机构固定于外壳后，将金属中框装配于外壳时，由于弹片的另一端可以有效抵触金属中框，并且由于弹片的另一端与金属中框抵触后存在应力，因此可以使得金属中框与外壳形成良好的电连接。
在一种可能的实现方式中，本体包括位于弹片的另一端的限位机构，限位机构限制弹片的另一端翘起的幅度；本体固定于外壳的安装槽内，弹片包括靠近另一端的凸起，其中凸起朝向远离本体的方案，凸起从所述安装槽中突出，以抵接于金属中框。弹片的另一端被限位机构限制翘起的幅度，从而对该弹片的另一端起到保护的作用，避免被外力扳坏。
第三方面，提供一种穿戴式电子设备机芯，穿戴式电子设备机芯包括金属中框以及设置于金属中框上的PCB；金属中框上设置有至少一个接地点，接地点与PCB上的接地端耦合；金属中框上设置有至少一个馈电点，馈电点与PCB上的射频电路耦合；金属中框上设置有连接机构；当将穿戴式电子设备机芯安装于外壳的安装空间时，连接机构将金属中框与外壳电连接，其中外壳采用导体材质。这样，由于金属中框通过连接结构与外壳电连接为一个整体，因此可以避免外壳对天线信号造成的屏蔽，并且避免外壳上会感应产生与金属中框中天线信号的电流反向的感应电流，从而使金属中框的天线性能达到最优，降低外壳会遮挡手表机芯的金属中框对天线信号造成的干扰。
在一种可能的实现方式中，连接机构包括本体和弹片，本体固定于金属中框中，弹片的一端与本体相连，弹片的另一端相对于本体翘起，以抵接于外壳。在该方案中，由于弹片的一端与本体相连，另一端相对于本体翘起，因此当将连接机构固定于金属中框后，将金属中框装配于外壳时，由于弹片的另一端可以有效抵触外壳，并且由于弹片的另一端与外壳抵触后存在应力，因此可以使得金属中框与外壳形成良好的电连接。
在一种可能的实现方式中，本体包括位于弹片的另一端的限位机构，限位机构限制弹片的另一端翘起的幅度；本体固定于金属中框的安装槽内，弹片包括靠近另一端 的凸起，其中凸起朝向远离所述本体的方案，凸起从安装槽中突出，以抵接于外壳。弹片的另一端被限位机构限制翘起的幅度，从而对该弹片的另一端起到保护的作用，避免被外力扳坏。
第四方面，提供一种穿戴式电子设备，包括外壳和安装于外壳的安装空间的内部的穿戴式电子设备机芯，其中所述穿戴式电子设备机芯包括如第一方面或其任一种可能的实现方式所述的穿戴式电子设备机芯或者如第三方面或其任一种可能的实现方式所述的穿戴式电子设备机芯；所述外壳包括如第二方面或其任一种可能的实现方式所述的外壳。其中，第四方面中任一种可能实现方式中所带来的技术效果可参见上述第一方面至第三方面不同的实现方式所带来的技术效果，此处不再赘述。
在一种可能的实现方式中，所述穿戴式电子设备还包括导电胶或导电布，所述导电胶或所述导电布位于所述外壳和所述金属中框之间，所述外壳经由所述导电胶或所述导电布与所述金属中框电连接。这样，由于金属中框通过导电胶或导电布与外壳电连接为一个整体，因此可以避免外壳对天线信号造成的屏蔽，并且避免外壳上会感应产生与金属中框中天线信号的电流反向的感应电流，从而使金属中框的天线性能达到最优，降低外壳会遮挡手表机芯的金属中框对天线信号造成的干扰。
附图说明
图1为本申请的实施例提供的一种穿戴式电子设备的结构示意图；
图2为本申请的实施例提供的一种穿戴式电子设备的分解结构示意图；
图3为本申请的实施例提供的一种穿戴式电子设备的局部结构的剖视示意图；
图4为本申请的实施例提供的一种穿戴式电子设备的装配结构示意图；
图5为本申请的另一实施例提供的一种穿戴式电子设备的装配结构示意图；
图6为本申请的又一实施例提供的一种穿戴式电子设备的装配结构示意图；
图7为本申请的再一实施例提供的一种穿戴式电子设备的装配结构示意图；
图8为本申请的实施例提供的一种外壳安装界面的示意图；
图9为本申请的另一实施例提供的一种穿戴式电子设备的装配结构示意图；
图10为本申请的实施例提供的图9的等效电路图；
图11为本申请的另一实施例提供的图9的等效电路图；
图12为本申请的又一实施例提供的图9的等效电路图；
图13为本申请的又一实施例提供的一种穿戴式电子设备的装配结构示意图；
图14为本申请的另一实施例提供的一种穿戴式电子设备的局部结构的剖视示意图；
图15为本申请的实施例提供的一种金属中框的结构示意图；
图16为本申请的实施例提供的一种连接机构的结构示意图；
图17为本申请的实施例提供的一种连接机构的侧视结构示意图；
图18为本申请的另一实施例提供的一种连接机构的结构示意图；
图19为本申请的另一实施例提供的一种连接机构的侧视结构示意图；
图20为本申请的实施例提供的一种连接机构的装配示意图；
图21为本申请的另一实施例提供的一种连接机构的装配示意图；
图22为本申请的实施例提供的一种外壳的结构示意图；
图23为本申请的又一实施例提供的一种连接机构的装配示意图；
图24为本申请的再一实施例提供的一种连接机构的装配示意图；
图25为本申请的再一实施例提供的一种穿戴式电子设备的装配结构示意图；
图26为本申请的另一实施例提供的一种穿戴式电子设备的装配结构示意图；
图27为本申请的又一实施例提供的一种穿戴式电子设备的装配结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
以下，术语“第一”、“第二”等仅用于描述方便，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“至少一个”是指一个或者多个，“多个”的含义是两个或两个以上。“和/或”，描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B的情况，其中A，B可以是单数或者复数。“以下至少一项(个)”或其类似表达，是指的这些项中的任意组合，包括单项(个)或复数项(个)的任意组合。例如，a，b，或c中的至少一项(个)，可以表示：a，b，c，a-b，a-c，b-c，或a-b-c，其中a，b，c可以是单个，也可以是多个。此外，本申请实施例中，“上”、“下”、“左”以及“右”不限于相对附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语可以是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件附图所放置的方位的变化而相应地发生变化。在本申请中，除非另有明确的规定和限定，术语“耦合”可以是直接相连，也可以通过中间媒介间接相连。此外，术语“电连接”可以是直接的电性连接，也可以通过中间媒介间接的电性连接。
下面将结合附图对本实施例的实施方式进行详细描述。
本申请实施例提供的一种穿戴式电子设备，该穿戴式电子设备包括但不限于手环、手表等电子设备。
示例性的，图1示出了一种电子设备100的结构示意图。
电子设备100可以包括处理器110，外部存储器接口120，内部存储器121，通用串行总线(universal serial bus，USB)接口130，充电管理模块140，电源管理模块141，电池142，天线1，天线2，移动通信模块150，无线通信模块160，音频模块170，扬声器170A，受话器170B，麦克风170C，传感器模块180，摄像头190以及显示屏191等。
可以理解的是，本发明实施例示意的结构并不构成对电子设备100的具体限定。在本申请另一些实施例中，电子设备100可以包括比图示更多或更少的部件，或者组合某些部件，或者拆分某些部件，或者不同的部件布置。图示的部件可以以硬件，软件或软件和硬件的组合实现。
处理器110可以包括一个或多个处理单元，例如：处理器110可以包括应用处理器(application processor，AP)，调制解调处理器，图形处理器(graphics processing unit，GPU)，图像信号处理器(image signal processor，ISP)，控制器，视频编 解码器，数字信号处理器(digital signal processor，DSP)，基带处理器,和/或神经网络处理器(neural-network processing unit，NPU)等。其中，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器中。
处理器110中还可以设置存储器，用于存储指令和数据。在一些实施例中,处理器110中的存储器为高速缓冲存储器。该存储器可以保存处理器110刚用过或循环使用的指令或数据。如果处理器110需要再次使用该指令或数据，可从所述存储器中直接调用。避免了重复存取，减少了处理器110的等待时间，因而提高了系统的效率。
在一些实施例中，处理器110可以包括一个或多个接口。接口可以包括集成电路(inter-integrated circuit，I2C)接口，集成电路内置音频(inter-integrated circuit sound，I2S)接口，脉冲编码调制(pulse code modulation，PCM)接口，通用异步收发传输器(universal asynchronous receiver/transmitter，UART)接口，移动产业处理器接口(mobile industry processor interface，MIPI)，通用输入输出(general-purpose input/output，GPIO)接口，用户标识模块(subscriber identity module，SIM)接口，和/或通用串行总线(universal serial bus，USB)接口等。
充电管理模块140用于从充电器接收充电输入。其中，充电器可以是无线充电器，也可以是有线充电器。在一些有线充电的实施例中，充电管理模块140可以通过USB接口130接收有线充电器的充电输入。在一些无线充电的实施例中，充电管理模块140可以通过电子设备100的无线充电线圈接收无线充电输入。充电管理模块140为电池142充电的同时，还可以通过电源管理模块141为电子设备供电。
电源管理模块141用于连接电池142，充电管理模块140与处理器110。电源管理模块141接收电池142和/或充电管理模块140的输入，为处理器110，内部存储器121，显示屏191，摄像头190，和无线通信模块160等供电。电源管理模块141还可以用于监测电池容量，电池循环次数，电池健康状态(漏电，阻抗)等参数。在其他一些实施例中，电源管理模块141也可以设置于处理器110中。在另一些实施例中，电源管理模块141和充电管理模块140也可以设置于同一个器件中。
电子设备100的无线通信功能可以通过天线1，天线2，移动通信模块150，无线通信模块160,调制解调处理器以及基带处理器等实现。
天线1和天线2用于发射和接收电磁波信号。电子设备100中的每个天线可用于覆盖单个或多个通信频带。不同的天线还可以复用，以提高天线的利用率。例如：可以将天线1复用为无线局域网的分集天线。在另外一些实施例中，天线可以和调谐开关结合使用。
移动通信模块150可以提供应用在电子设备100上的包括2G/3G/4G/5G等无线通信的解决方案。移动通信模块150可以包括一个或多个滤波器，开关，功率放大器，低噪声放大器(low noise amplifier，LNA)等。移动通信模块150可以由天线1接收电磁波，并对接收的电磁波进行滤波，放大等处理，传送至调制解调处理器进行解调。移动通信模块150还可以对经调制解调处理器调制后的信号放大，经天线1转为电磁波辐射出去。在一些实施例中，移动通信模块150的至少部分功能模块可以被设置于处理器110中。在一些实施例中，移动通信模块150的至少部分功能模块可以与处理器110的至少部分模块被设置在同一个器件中。
调制解调处理器可以包括调制器和解调器。其中，调制器用于将待发送的低频基带信号调制成中高频信号。解调器用于将接收的电磁波信号解调为低频基带信号。随后解调器将解调得到的低频基带信号传送至基带处理器处理。低频基带信号经基带处理器处理后，被传递给应用处理器。应用处理器通过音频设备(不限于扬声器170A,受话器170B等)输出声音信号，或通过显示屏191显示图像或视频。在一些实施例中，调制解调处理器可以是独立的器件。在另一些实施例中，调制解调处理器可以独立于处理器110，与移动通信模块150或其他功能模块设置在同一个器件中。
无线通信模块160可以提供应用在电子设备100上的包括无线局域网(wireless local area networks，WLAN)(如无线保真(wireless fidelity，Wi-Fi)网络)，蓝牙(Bluetooth，BT)，全球导航卫星系统(global navigation satellite system，GNSS)，调频(frequency modulation，FM)，近距离无线通信技术(near field communication，NFC)，红外技术(infrared，IR)等无线通信的解决方案。无线通信模块160可以是集成一个或多个通信处理模块的一个或多个器件。无线通信模块160经由天线2接收电磁波，将电磁波信号调频以及滤波处理，将处理后的信号发送到处理器110。无线通信模块160还可以从处理器110接收待发送的信号，对其进行调频，放大，经天线2转为电磁波辐射出去。
在一些实施例中，电子设备100的天线1和移动通信模块150耦合，天线2和无线通信模块160耦合，使得电子设备100可以通过无线通信技术与网络以及其他设备通信。所述无线通信技术可以包括全球移动通讯系统(global system for mobile communications，GSM)，通用分组无线服务(general packet radio service，GPRS)，码分多址接入(code division multiple access，CDMA)，宽带码分多址(wideband code division multiple access，WCDMA)，时分码分多址(time-division code division multiple access，TD-SCDMA)，长期演进(long term evolution，LTE)，BT，GNSS，WLAN，NFC，FM，和/或IR技术等。所述GNSS可以包括全球卫星定位系统(global positioning system，GPS)，全球导航卫星系统(global navigation satellite system，GLONASS)，北斗卫星导航系统(beidou navigation satellite system，BDS)，准天顶卫星系统(quasi-zenith satellite system，QZSS)和/或星基增强系统(satellite based augmentation systems，SBAS)。
电子设备100通过GPU,显示屏191，以及应用处理器等实现显示功能。GPU为图像处理的微处理器，连接显示屏191和应用处理器。GPU用于执行数学和几何计算,用于图形渲染。处理器110可包括一个或多个GPU，其执行程序指令以生成或改变显示信息。
显示屏191用于显示图像，视频等。显示屏191包括显示面板。显示面板可以采用液晶显示屏(liquid crystal display，LCD)，有机发光二极管(organic light-emitting diode，OLED)，有源矩阵有机发光二极体或主动矩阵有机发光二极体(active-matrix organic light emitting diode，AMOLED)，柔性发光二极管(flex light-emitting diode，FLED)，Miniled，Microled，Micro-oled，量子点发光二极管(quantum dot light emitting diodes，QLED)等。在一些实施例中，电子设备100可以包括1个或N个显示屏191，N为大于1的正整数。
电子设备100可以通过ISP，摄像头190，视频编解码器，GPU，显示屏191以及应用处理器等实现拍摄功能。
ISP用于处理摄像头190反馈的数据。例如，拍照时，打开快门，光线通过镜头被传递到摄像头感光元件上，光信号转换为电信号，摄像头感光元件将所述电信号传递给ISP处理，转化为肉眼可见的图像。ISP还可以对图像的噪点，亮度，肤色进行算法优化。ISP还可以对拍摄场景的曝光，色温等参数优化。在一些实施例中，ISP可以设置在摄像头190中。
摄像头190用于捕获静态图像或视频。物体通过镜头生成光学图像投射到感光元件。感光元件可以是电荷耦合器件(charge coupled device，CCD)或互补金属氧化物半导体(complementary metal-oxide-semiconductor，CMOS)光电晶体管。感光元件把光信号转换成电信号，之后将电信号传递给ISP转换成数字图像信号。ISP将数字图像信号输出到DSP加工处理。DSP将数字图像信号转换成标准的RGB，YUV等格式的图像信号。在一些实施例中,电子设备100可以包括1个或N个摄像头190，N为大于1的正整数。
内部存储器121可以用于存储一个或多个计算机程序，该一个或多个计算机程序包括指令。处理器110可以通过运行存储在内部存储器121的上述指令，以实施各种功能应用和数据处理等。内部存储器121可以包括存储程序区和存储数据区。其中，存储程序区可存储操作系统；该存储程序区还可以存储一个或多个应用程序(比如图库、联系人等)等。存储数据区可存储电子设备101使用过程中所创建的数据(比如照片，联系人等)等。此外，内部存储器121可以包括高速随机存取存储器，还可以包括非易失性存储器，例如一个或多个磁盘存储器件，闪存器件，通用闪存存储器(universal flash storage，UFS)等。在另一些实施例中，处理器110通过运行存储在内部存储器121的指令，和/或存储在设置于处理器中的存储器的指令，来使得电子设备100执行各种功能应用和数据处理。
电子设备100可以通过音频模块170，扬声器170A，受话器170B，麦克风170C，耳机接口170D，以及应用处理器等实现音频功能。例如音乐播放，录音等。
音频模块170用于将数字音频信息转换成模拟音频信号输出，也用于将模拟音频输入转换为数字音频信号。音频模块170还可以用于对音频信号编码和解码。在一些实施例中，音频模块170可以设置于处理器110中，或将音频模块170的部分功能模块设置于处理器110中。
扬声器170A，也称“喇叭”，用于将音频电信号转换为声音信号。电子设备100可以通过扬声器170A收听音乐，或收听免提通话。
受话器170B，也称“听筒”，用于将音频电信号转换成声音信号。当电子设备100接听电话或语音信息时，可以通过将受话器170B靠近人耳接听语音。
麦克风170C，也称“话筒”，“传声器”，用于将声音信号转换为电信号。当拨打电话或发送语音信息时，用户可以通过人嘴靠近麦克风170C发声，将声音信号输入到麦克风170C。电子设备100可以设置一个或多个麦克风170C。在另一些实施例中，电子设备100可以设置两个麦克风170C，除了采集声音信号。还可以实现降噪功能。在另一些实施例中，电子设备100还可以设置三个，四个或更多麦克风170C，实现采 集声音信号，降噪，还可以识别声音来源，实现定向录音功能等。
传感器模块180可以包括压力传感器，陀螺仪传感器，气压传感器，磁传感器，加速度传感器，距离传感器，接近传感器，指纹传感器，温度传感器，触摸传感器，环境光传感器，骨传导传感器等。
触摸传感器，也称“触控器件”。触摸传感器可以设置于显示屏191，由触摸传感器与显示屏191组成触摸屏，也称“触控屏”。触摸传感器用于检测作用于其上或附近的触摸操作。触摸传感器可以将检测到的触摸操作传递给应用处理器，以确定触摸事件类型。可以通过显示屏提供与触摸操作相关的视觉输出。在另一些实施例中，也可以设置有多个触摸传感器形成的触摸传感器阵列的触控面板以外挂形式设置于显示面板的表面。在另一些实施例中，触摸传感器也可以与显示屏191所处的位置不同。
在本申请的实施例中，接近传感器、以及上述的天线1、天线2可以复用穿戴式电子设备机芯的金属中框。
另外,上述电子设备中还可以包括按键、表冠、马达、指示器以及用户标识模块(subscriber identification module，SIM)卡接口等一种或多种部件，本申请的实施例对此不做任何限制。当然，以上结构仅仅是一种示例，在一些实施例中，电子设备可以包括比以上更多或者更少的部件，例如在一些实施例中还可以包括耳机接口170D、外部存储器接口120等。耳机接口170D用于连接有线耳机。耳机接口170D可以是USB接口130，也可以是3.5mm的开放移动电子设备平台(open mobile terminal platform，OMTP)标准接口，美国蜂窝电信工业协会(cellular telecommunications industry association of the USA，CTIA)标准接口。外部存储器接口120可以用于连接外部存储卡，例如Micro SD卡，实现扩展电子设备100的存储能力。外部存储卡通过外部存储器接口120与处理器110通信，实现数据存储功能。例如将音乐，视频等文件保存在外部存储卡中。
参照图2和图3所示，以手表为例，对本申请的实施例提供的穿戴式电子设备的结构说明如下：
本申请的实施例提供的穿戴式电子设备20包括组装在一起的外壳21、金属中框22、印刷电路板PCB23、后壳24和屏幕组件25。外壳21包括安装空间，屏幕组件25与金属中框22、印刷电路板PCB 23以及后壳24组成的穿戴式电子设备机芯安装于该外壳21的安装空间的内部。具体的，当外壳21采用陶瓷、金属、碳纤维等硬质材料时，穿戴式电子设备机芯可以是通过卡接或者例如螺钉等的连接件可拆卸的安装于外壳21的安装空间。又例如，当外壳21采用硅胶、塑料等软质材料时，穿戴式电子设备机芯可以直接是嵌套于外壳21的安装空间内，可以理解的是，在需要替换外壳21时，可以直接将穿戴式电子设备机芯从外壳21的安装空间的内部抠出。
具体地，在本实施例中，如图2所示，外壳21包括环状的外壳基体211和与外壳基体211形成为一体的外壳伸出部212，金属中框22包括环状的中框基体221。两对外壳伸出部212分别从该外壳基体211朝向两侧伸出。其中，外壳21的外壳伸出部212用于连接表带。如上所述，穿戴式电子设备机芯还可以包括按键、表冠等，其中外壳21上可以包括用于露出或安装按键以及表冠的孔。从而在装配时，可以通过按键与其在外壳21上对应的孔，或者表冠与其在外壳21上对应的孔进行对位，确保外壳 21与金属中框22的精准对位。当然，在本申请的实施例中，不限于在将穿戴式电子设备机芯安装于外壳21之前进行按键以及表冠的安装，或者在将穿戴式电子设备机芯安装于外壳21之后进行按键以及表冠的安装。当然，以上仅是一种将外壳与金属中框对位的方式，在一些实施例中也可以采用其他方式实现外壳与金属中框的对位。
屏幕组件25包括显示屏251，显示屏251在穿戴式电子设备组装完毕之后面向用户显示信息，显示屏251还可以是具备输入信息的功能的触摸屏，使得用户能够经由显示屏251与穿戴式电子设备实现交互。参照图2和图3所示，屏幕组件25在金属中框22的上方与金属中框22固定在一起。具体地，金属中框22与屏幕组件25可以通过卡接、粘接或者例如螺钉等的连接件连接在一起。在本实施例中，参照图2和图3所示，印刷电路板PCB23在金属中框22的下方与金属中框22固定在一起。印刷电路板PCB23可以采用卡扣或螺丝固定的方式设置于金属中框22上。其中，印刷电路板PCB23作为电子设备的电子器件以及布线的载体用于承载图1中示出的各个模块中的电子器件及布线，其中，后壳24在金属中框22的下方与金属中框22固定在一起，从而从下方将印刷电路板PCB23密封保护，例如后壳24与金属中框22可以通过卡接或者例如螺钉等的连接件连接在一起。在另一种结构中，印刷电路板PCB23也可以与后壳24整合在一起，例如印刷电路板PCB23位于后壳24内，后壳24在金属中框22的下方与金属中框22固定在一起，例如可以通过卡接或者例如螺钉等的连接件连接在一起。
参照图4、图5、图6、图7示出的示意图，在本实施例中，PCB23上设置有控制器231；控制器231可以集成于处理器110中实现，或者采用单独的集成电路实现。金属中框22上设置有至少一个接地点G(图4、图5、图6以及图7中示出了接地点G1、G2)，以及至少一个馈电点P(图4、图5、图6以及图7中示出了接地点P1、P2)，接地点G与PCB23上的接地端GND耦合，馈电点P与PCB23上的射频电路232耦合；从而形成包含射频电路232-馈电点P-金属中框22-接地点G-接地端GND的回地通路，射频电路232将天线信号通过金属中框22进行发射，其中，接地点G和馈电点P的数量和位置决定了金属中框22构成的天线的参数(例如：天线的电感值和电容值)。穿戴式电子设备机芯包含全球导航卫星系统(global navigation satellite system，GNSS)、全球定位系统(navigation satellite timing and ranging global position system，简称GPS)、Wi-Fi(wireless fidelity)、蓝牙(bluetooth，BT)、4G/5G通信、近场通信(near field communication，简称NFC)等通信制式中的一个或多个时，金属中框22可以包含一个或多个馈电点P，其中，每个馈电点P对应耦合一种通信制式的射频电路，结合图5所示，例如穿戴式电子设备机芯包含两种通信制式的射频电路232(其中图5中射频电路232-1支持第一种通信制式，射频电路232-2支持第二种通信制式)，则射频电路232-1耦合一个馈电点P1，射频电路232-2耦合一个馈电点P2。当然，一个通信制式的射频电路也可以耦合多个馈电点P，如图6所示，射频电路232耦合馈电点P1和馈电点P2。
具体的，当将穿戴式电子设备机芯可拆卸的安装于外壳21的安装空间时，由于外壳21会将金属中框22遮挡。然而，为了丰富产品的外观体验，外壳21可能采用不同的材质，例如：金属、碳纤维等导体材质，或者，陶瓷、塑胶、硅胶等绝缘材质。因 此，当外壳21采用不同材质时对金属中框22发射的天线信号造成干扰也不相同，例如：当外壳21采用金属或碳纤维等导体材质时，主要是可能对天线信号造成屏蔽，并且外壳21上会感应产生与金属中框22中天线信号的电流反向的感应电流；当外壳21采用陶瓷、塑胶、硅胶等绝缘材质时，主要会造成金属中框22发射的天线信号产生频偏。因此，在本实施例中，可以在接地点G与接地端GND之间耦合第一开关k1(结合图4、图5和图7所示，接地点G1与接地端GND之间耦合有第一开关k1-1，接地点G2与接地端GND之间耦合有第一开关k1-2。其中，第一开关k1-1和第一开关k1-2不限于使用单刀单掷开关，或者第一开关k1-1与第一开关k1-2也可以采用单刀双掷开关实现，例如采用单刀双掷开关时，单刀双掷开关的公共端与接地端GND耦合，单刀双掷开关的两个选择端分别耦合接地点G1和接地点G2)，和/或,馈电点P与射频电路232之间耦合有第二开关k2(结合图6和图7所示，馈电点P1与射频电路232之间耦合有第二开关k2-1，馈电点P2与射频电路232之间耦合有第二开关k2-2，其中，第二开关k2-1和第二开关k2-2不限于使用单刀单掷开关，或者第二开关k2-1与第二开关k2-2也可以采用单刀双掷开关实现，例如采用单刀双掷开关时，单刀双掷开关的公共端与射频电路232耦合，单刀双掷开关的两个选择端分别耦合馈电点P1和馈电点P2)。控制器231，被配置为获取开关控制信号；控制器231，被配置为根据开关控制信号控制至少一个第一开关k1和/或至少一个第二开关k2的导通状态。这样，由于金属中框22上的各个馈电点P以及各个接地点G分别位于不同的位置，则当通过至少一个第一开关k1和/或至少一个第二开关k2的导通状态将金属中框22的不同位置接入射频电路232时，则可以为射频电路232接入不同天线参数(主要指金属中框22作为天线的电容值和电感值)的发射天线，这样根据外壳21的实际材质选择控制至少一个第一开关k1和/或至少一个第二开关k2的导通状态，从而为射频电路配置合适的天线材料清单(bill of material，BOM)，以使金属中框的天线性能达到最优，从而降低外壳会遮挡手表机芯的金属中框对天线信号造成的干扰。
具体的，控制器231，被配置为响应于用户根据外壳的材质触发的选择信号，生成开关控制信号。例如，可以通过用户体验(user experience，UX)设计外壳安装界面，当手表响应于用户对显示屏显示的外壳安装功能控件的触发生成如图8所示的外壳安装界面后，可以向用户展示外壳的材质下拉选项，这样由用户选择所安装的外壳的材质(例如：金属材质、碳纤维材质、陶瓷材质以及塑胶材质等)，其中不同的外壳的材质预先配置对应的天线材料清单，响应于用户对选定的材质触发的选择信号，则控制器可以生成开关控制信号，从而控制上述的至少一个第一开关k1和/或至少一个第二开关k2的导通状态，为射频电路配置合适的天线材料清单。
在另一个实施例中，参照图9所示，PCB23上还包括接近传感器芯片233；接近传感器芯片233与金属中框22耦合；当然，在该实施例中并不限制接近传感器芯片233与金属中框22耦合的位置，接近传感器芯片233与金属中框22耦合的位置可以是金属中框22上的任一位置，例如可以是上述的接地点G或馈电点P。接近传感器芯片233，被配置为检测金属中框22的电容值；控制器231，被配置为根据电容值生成开关控制信号。具体的，相对于不设置外壳21，当外壳21采用为陶瓷材质、塑胶材质等绝缘材质时，接近传感器芯片233检测的电容值会发生变化。陶瓷材质的介电常数高，通 常为20+～30+，塑胶材质的介电常数较低，通常为2.x～4.x。陶瓷材质和塑胶材质的介电常数差异大，外壳21为塑胶材质时接近传感器芯片233检测的电容值会低于外壳21为陶瓷材质时接近传感器芯片233检测的电容值，根据接近传感器芯片233检测的电容值可以判定外壳21的材质，作为至少一个第一开关k1和/或至少一个第二开关k2的导通状态切换的依据。当然，外壳21采用金属材质或碳纤维材质等导体材质时，如果外壳21与金属中框22未导通，则外壳21与金属中框22会形成耦合面积很大、距离很近的电容，因此接近传感器芯片233将检测到较大的电容值，而当外壳21与金属中框22导通时，接近传感器芯片233将检测到较小的电容值。这样，由于接近传感器芯片233可以检测电容值，因此，控制器231可以根据不同电容值为不同的外壳的材质预先配置对应的天线材料清单，生成开关控制信号，从而控制上述的至少一个第一开关k1和/或至少一个第二开关k2的导通状态，为射频电路配置合适的天线材料清单。其中，图9主要示出了将接近传感器芯片233应用于图4示出的穿戴式电子设备的结构中，当然可以理解的是，也可以将接近传感器芯片233应用于图5、图6以及图7示出的穿戴式电子设备的结构中，其作用可以参考图9中的描述，不再赘述。此外，为了降低能耗，该控制器还被配置为当根据开关控制信号调整至少一个第一开关k1和/或至少一个第二开关k2的导通状态后，控制接近传感器芯片233下电。接近传感器芯片233主要用于检测机芯所嵌套的外壳对应的电容值，控制器231根据电容值确定外壳的材质，并控制开关的导通状态，为射频电路匹配合适的天线材料清单。因此在完成机芯嵌套外壳的操作，并在接近传感器芯片233完成电容值的检测后即可下电，节省功耗。具体的，可以在需要为穿戴式电子设备机芯安装外壳时，打开一个提醒用户安装外壳的安装界面，同时唤醒接近传感器芯片233；并提醒用户安装外壳完成后，点击确认安装完成，响应于用户触发的确认安装完成对接近传感器芯片233下电，或是默认设置唤醒接近传感器芯片233一定时长后自动对接近传感器芯片233下电，当然该一定时长需要满足接近传感器芯片233检测金属中框22的电容值的要求时间长度。此外，用户在手表使用过程中，如果明显感觉信号质量差，可重复上述操作。
当然，以上主要描述了采用接近传感器芯片检测金属中框的电容值的方式确定外壳材质的方案。当然在一些实施例中，也可以通过在外壳上携带识别模块进行外壳材质的检测，例如，识别模块可以是磁铁、射频标识(radio frequency identification，RFID)或者颜色涂层等，可以理解的是，当识别模块采用磁铁时，可以在不同材质的外壳上设置不同磁场强度的磁铁，这样，PCB23上还可以设置有磁传感器(例如霍尔传感器)，控制器可以根据磁传感器检测的磁场强度确定外壳的材质，进行控制开关的导通状态；又例如，当识别模块采用RFID时，可以在不同材质的外壳上设置不同的RFID，这样，PCB23上还可以设置有近场通信(near field communication，NFC)芯片，根据控制器可以根据NFC芯片读取的RFID存储的材质信息确定外壳的材质，进行控制开关的导通状态；再例如：当识别模块采用颜色涂层时，可以在不同材质的外壳上设置不同颜色的颜色涂层，这样，PCB23上还可以设置有光电传感器，根据控制器可以根据光电传感器检测的颜色图层的颜色确定外壳的材质，进行控制开关的导通状态。
其中，参照图10、图11和图12所示，对上述图9的等效电路图说明如下：其中， 通常金属中框22作为电容的一个电极与大地之间存在一定的电容量(具有一定的电容值)，当金属中框22外侧嵌套外壳21时，由于接近传感器芯片233在金属中框22加有电压，金属中框22就会受到静电感应而产生极化现象，则外壳21越靠近(例如图9中金属中框22与外壳21的距离为d)金属中框22，则检测金属中框22上的感应电荷就越多，则接近传感器芯片233检测到的电容值改变量ΔC越大。其中，在该检测过程中为了避免射频电路232向金属中框22输出的射频信号影响接近传感器芯片233的检测结果，通常通过在接近传感器芯片233与金属中框22之间耦合隔离电感L，并且为了避免接近传感器芯片233直接与射频电路232耦合或者直接通过金属中框22回地短路，通常在金属中框22与接地端GND以及馈电点P之间设置隔直电容C。此外，为了避免射频电路232的射频信号对接近传感器芯片233的影响，通常通过电感将射频电路232连接到接地端GND；此外，为了避免开关切换时金属中框22的电容变化对接近传感器芯片233的影响，通常通过电感将开关连接到接地端GND。具体的，如图10所示，接近传感器芯片233与金属中框22的馈点电P耦合，开关k1连接于金属中框22的接地点G与接地端GND之间。接近传感器芯片233与馈电点P之间串联有电阻R1以及电感L1，电阻R1选用合适的阻值用来抑制接近传感器芯片233的噪声；其中，电阻R1与电感L1的连接处通过电容C1连接接地端GND。射频电路232与馈电点P之间耦合电容C2，其中射频电路232还通过电感L2耦合接地端，其中电容C2和电感L2构成射频电路232的隔离网络，避免射频电路232的射频信号对接近传感器芯片233的影响。金属中框22的接地点G与接地端GND之间串联有电容C3以及开关k1，电容C3与开关k1的连接处通过电感L3连接接地端GND。电容C3和电感L3构成开关k1的隔离网络，避免开关切换时金属中框22的电容变化对接近传感器芯片233的影响。如图11所示，接近传感器芯片233与金属中框22的接地点G耦合，开关k1连接于金属中框22的接地点G与接地端GND之间。接近传感器芯片233与接地点G之间串联有电阻R1以及电感L1，电阻R1选用合适的阻值用来抑制接近传感器芯片233的噪声；其中电阻R1与电感L1的连接处通过电容C1连接接地端GND。射频电路232与馈电点P之间耦合电容C2，其中射频电路232还通过电感L2耦合接地端GND，其中C2和L2构成射频电路232的隔离网络避免射频电路232的射频信号对接近传感器芯片233的影响。金属中框22的接地点G与接地端GND之间串联有电容C3以及开关k1，电容C3与开关k1的连接处通过电感L3连接接地端GND。电容C3和电感L3构成开关k1的隔离网络，避免开关切换时金属中框22的电容变化对接近传感器芯片233的影响。如图12所示，接近传感器芯片233与金属中框22的馈点电P耦合，开关k2连接于金属中框22的馈点电P与射频电路232之间。接近传感器芯片233与馈点电P之间串联有电阻R1以及电感L1，电阻R1选用合适的阻值用来抑制接近传感器芯片233的噪声；其中电阻R1与电感L1的连接处通过电容C1连接接地端GND。射频电路232与馈电点P之间依次串联有开关k2和电容C2，其中射频电路232还通过电感L2耦合接地端GND，其中C2和L2构成射频电路232以及开关k2的隔离网络避免射频电路232的射频信号对接近传感器芯片233的影响以及开关切换时金属中框22的电容变化对接近传感器芯片233的影响。金属中框22的接地点G与接地端GND之间串联有电容C3，避免接近传感器芯片233直接回地短路。其中上述的电容C1可以替换为瞬态二极管(transient  voltage suppressor，TVS)。为了提高接近传感器芯片233检测电容值的灵敏性，接近传感器芯片233尽量远离PCB上的功率放大器(power amplifier，PA)等热源器件，降低温漂风险。
可以理解的是，接近传感器芯片233以及控制器231可以集成于处理器110中实现，或者采用单独的集成电路实现。
在另一个实施例中，当外壳21采用导体材质(例如金属、碳纤维等)时，参照图13、图14和图15所示，提供的穿戴式电子设备机芯，包括金属中框22以及设置于金属中框22上的PCB23；金属中框22上设置有至少一个接地点G(G1)，接地点G1与PCB23上的接地端GND耦合；金属中框22上设置有至少一个馈电点P(P1)，馈电点P1与PCB23上的射频电路232耦合；此外，金属中框22上设置有连接结构26；当将穿戴式电子设备机芯装配于外壳21的安装空间时，连接机构26将金属中框22与外壳21电连接。这样，由于金属中框22通过连接结构26与外壳21电连接为一个整体，因此可以避免外壳21对天线信号造成的屏蔽，并且避免外壳21上会感应产生与金属中框22中天线信号的电流反向的感应电流，从而使金属中框的天线性能达到最优，降低外壳会遮挡手表机芯的金属中框对天线信号造成的干扰。通常为了确保金属中框与外壳的稳定连接，本申请的实施例不限于在金属中框22上设置一个或多个连接结构26。当然，在设置多个连接结构26时，本申请的实施例并不限定各连接结构的具体位置，例如：可以沿金属中框22的外周面22o均匀设置或对称设置。
此外，参照图16和图17所示，连接机构26包括本体261和弹片262，本体261固定于金属中框22中，弹片262的一端与本体相连261，弹片262的另一端相对于本体261翘起，以抵接于外壳21(参照图14所示)。在该方案中，由于弹片的一端与本体相连，另一端相对于本体翘起，因此当将连接机构固定于金属中框后，将金属中框装配于外壳时，由于弹片的另一端可以有效抵触外壳，并且由于弹片的另一端与外壳抵触后存在应力，因此可以使得金属中框与外壳形成良好的电连接。此外，参照图18和图19所示，本体261还可以包括位于弹片262的另一端的限位机构2611，限位机构2611限制弹片262的另一端翘起的幅度；本体261固定于金属中框22的安装槽223(参照图15所示)内，弹片262包括靠近另一端的凸起，其中凸起朝向远离本体261的方向，凸起从安装槽223中突出，以抵接于外壳21。其中，图20示出了将外壳21安装于金属中框22上之前，弹片262的状态，其中，弹片262的另一端被限位机构2611限制翘起的幅度，从而对该弹片的另一端起到保护的作用，避免被外力扳坏。图21出了将外壳21安装于金属中框22上之后，弹片262另一端的凸起抵接于外壳21，将金属中框22与外壳21形成电连接。
在一些示例中，也可以将连接机构26设置于外壳21。当将穿戴式电子设备机芯可拆卸的安装于外壳21的安装空间时，连接机构26将穿戴式电子设备机芯的金属中框22与外壳21电连接，其中外壳21采用导体材质。这样，由于金属中框22通过连接结构26与外壳21电连接为一个整体，因此可以避免外壳21对天线信号造成的屏蔽，并且避免外壳21上会感应产生与金属中框22中天线信号的电流反向的感应电流，从而使金属中框的天线性能达到最优，降低外壳会遮挡手表机芯的金属中框对天线信号造成的干扰。其中连接机构的具体结构可以参考上述图16-图19的连接机构，连接机 构26包括本体261和弹片262，本体261固定于外壳21中，弹片262的一端与本体261相连，弹片262的另一端相对于本体261翘起，以抵接于金属中框22。在该方案中，由于弹片的一端与本体相连，另一端相对于本体翘起，因此当将连接机构固定于外壳后，将金属中框装配于外壳时，由于弹片的另一端可以有效抵触金属中框，并且由于弹片的另一端与金属中框抵触后存在应力，因此可以使得金属中框与外壳形成良好的电连接。并且，本体261包括位于弹片262的另一端的限位机构2611，限位机构2611限制弹片262的另一端翘起的幅度；本体261固定于外壳21的安装槽213内(如图22所示)，弹片262包括靠近另一端的凸起，其中凸起朝向远离本体261的方向，凸起从安装槽213中突出，以抵接于金属中框22。图23示出了将外壳21安装于金属中框22上之前，弹片262的状态，其中，弹片的另一端被限位机构2611限制翘起的幅度，从而对该弹片的另一端起到保护的作用，避免被外力扳坏。图24出了将外壳21安装于金属中框22上之后，弹片262另一端的凸起抵接于金属中框22，将金属中框22与外壳21形成电连接。通常为了确保金属中框与外壳的稳定连接，本申请的实施例不限于在外壳21上设置一个或多个连接结构26。当然，在设置多个连接结构26时，本申请的实施例并不限定各连接结构的具体位置，例如：可以沿外壳21的内周面21i均匀设置或对称设置。
此外，如图25所示，也可以将包含上述连接结构26的方案应用于上述图4、图5、图6、图7以及图9对应的方案中，当然，图26仅示出将连接结构26的方案应用于上述图4的方案中的示例。其中，图15和图22的区别在于弹片262的另一端的朝向不同，其中，考虑穿戴式电子设备机芯通常从机壳21的下方装配到外壳21中，因此当弹片262设置于金属中框22上时，弹片262的另一端朝向远离外壳21的方向，更有利于安装，避免在安装过程中外壳21阻挡弹片262的另一端造成弹片损坏。同理，当弹片262设置于外壳21上时，弹片262的另一端朝向远离金属中框22的方向，更有利于安装，避免在安装过程中金属中框22阻挡弹片262的另一端造成弹片损坏。
另外，结合图26和图27所示，该PCB23上还设置有阻抗匹配电路27，其中阻抗匹配电路27连接于金属中框22与接地端GND或射频电路232之间。其中阻抗匹配电路27可以包含由电感和电容连接形成的电路。例如，一种典型的阻抗匹配电路是包含一个电容和一个电感。当阻抗匹配电路27设置于金属中框22与射频电路232之间时，电容串联于金属中框22与射频电路232之间，电感串联于接地端GND与金属中框与电容的连接点之间。当外壳21采用某种材质(例如：金属材质、碳纤维材质等导体材质)时，金属中框22通过固定的通路回地，如图26所示在该通路上射频电路232直接与金属中框22的一个馈电点P1连接(馈电点P1与射频电路232之间不设置开关)，金属中框22直接通过阻抗匹配电路27连接接地端GND。这样，通过阻抗配置电路为金属中框上设置某一材质(导体材质)的外壳时提供天线材料清单，使天线性能达到最优。由于无需对开关进行控制可以尽可能节省功耗。当外壳21为其他材质(例如：陶瓷材质、塑胶材质等导体材质)时，控制器根据开关控制信号控制至少一个第一开关和/或至少一个第二开关的导通状态，阻抗匹配电路27和开关同时工作，将金属中框22回地，可以理解的是，此时电子设备的天线性能同时取决于阻抗匹配电路27提供的天线阻抗以及至少一个第一开关和/或至少一个第二开关选定的馈电点和/或接地点 在金属中框上形成的天线阻抗。或者，当外壳21采用某种材质(例如：金属材质、碳纤维材质等导体材质)时，金属中框通过固定的通路回地，如图27所示在该通路上射频电路232直接通过阻抗匹配电路27与金属中框22连接，金属中框22直接通过接地点G1连接接地端GND。这样，通过阻抗配置电路为金属中框上设置某一材质(导体材质)的外壳时提供天线材料清单，使天线性能达到最优。由于无需对开关进行控制可以尽可能节省功耗。当外壳21为其他材质(例如：陶瓷材质、塑胶材质等导体材质)时，控制器根据开关控制信号控制至少一个第一开关和/或至少一个第二开关的导通状态，阻抗匹配电路27和开关同时工作，将金属中框22回地。
此外，结合图2所示，为了使得外壳21与金属中框22之间彼此固定且实现电连接，除了通过上述的弹片形式的连接机构实现，还可以通过导电胶或导电布实现，该实施例中穿戴式电子设备包括导电胶28。导电胶28位于外壳21的内周面21i和金属中框22的外周面22o之间，导电胶28与外壳21的内周面21i接触，从而使得外壳21与金属中框22经由导电胶28固定在一起的同时还经由导电胶28实现电连接。本申请对导电胶28的形状和布置没有任何限制，只要导电胶28能够实现上述作用即可。具体地，虽然在图2中示出了设置在金属中框22上的形状为大致圆弧形导电胶28，但是不限于此，导电胶28的形状可以根据需要设定为其它形状而且可以设置在金属中框22的不同部位。另外，本申请对导电胶28的基材和导电成分没有任何限制，只要导电胶28能够实现上述作用即可。具体地，可以根据不同的固化条件选择不同的基体，该基体可以包括各种塑胶、分散剂和助剂等。导电胶28的导电成分可以是银粉、金粉、铜粉、铝粉、锌粉、镍粉、碳粉、石墨等导电材质。另外，导电胶28的形态可以是膏状、浆状或导电胶带。在一种可选的方案中，可以将导电胶28替换为导电布，导电布位于外壳21和金属中框22之间，外壳21与金属中框22通过导电布固定在一起的同时实现电连接。在一种可选的方案中，也可以通过螺栓将外壳21和金属中框22固定在一起的同时实现电连接。另外，金属中框22可以通过连接柱等与PCB23的对应的导电部位(例如走线、电子器件)电连接。
尽管在此结合各实施例对本申请进行了描述，然而，在实施所要求保护的本申请过程中，本领域技术人员通过查看附图、公开内容、以及所附权利要求书，可理解并实现所公开实施例的其它变化。在权利要求中，“包括”一词不排除其他组成部分或步骤，“一”或“一个”不排除多个的情况。相互不同的从属权利要求中记载了某些措施，但这并不表示这些措施不能组合起来产生良好的效果。
以上已经描述了本申请的各实施例，上述说明是示例性的，并非穷尽性的，并且也不限于所披露的各实施例。在不偏离所说明的各实施例的范围和精神的情况下，对于本技术领域的普通技术人员来说许多修改和变更都是显而易见的。本文中所用术语的选择，旨在最好地解释各实施例的原理、实际应用或对市场中的技术的改进，或者使本技术领域的其它普通技术人员能理解本文披露的各实施例。

Claims (15)

  1. 一种穿戴式电子设备机芯，其特征在于，所述穿戴式电子设备机芯包括金属中框、以及设置于所述金属中框上的印刷电路板PCB；所述PCB上设置有控制器；
    所述金属中框上设置有至少一个接地点，所述接地点与所述PCB上的接地端耦合；所述金属中框上设置有至少一个馈电点，所述馈电点与所述PCB上的射频电路耦合；其中，所述接地点与所述接地端之间耦合有第一开关，和/或,所述馈电点与所述射频电路之间耦合有第二开关；
    当将所述穿戴式电子设备机芯安装于外壳的安装空间时，所述控制器，被配置为获取开关控制信号；
    所述控制器，被配置为根据所述开关控制信号控制至少一个所述第一开关和/或至少一个所述第二开关的导通状态。
  2. 根据权利要求1所述的穿戴式电子设备机芯，其特征在于，所述控制器，被配置为响应于用户根据所述外壳的材质触发的选择信号，生成所述开关控制信号。
  3. 根据权利要求1所述的穿戴式电子设备机芯，其特征在于，还包括：接近传感器芯片；所述接近传感器芯片与所述金属中框耦合；
    所述接近传感器芯片，被配置为检测所述金属中框的电容值；
    所述控制器，被配置为根据所述电容值生成所述开关控制信号。
  4. 根据权利要求1所述的穿戴式电子设备机芯，其特征在于，所述金属中框上设置有连接机构；当将所述穿戴式电子设备机芯装配于外壳的安装空间时，所述连接机构将所述金属中框与所述外壳电连接，其中所述外壳采用导体材质。
  5. 根据权利要求4所述的穿戴式电子设备机芯，其特征在于，所述连接机构包括本体和弹片，所述本体固定于所述金属中框中，所述弹片的一端与所述本体相连，所述弹片的另一端相对于所述本体翘起，以抵接于所述外壳。
  6. 根据权利要求5所述的穿戴式电子设备机芯，其特征在于，所述本体包括位于所述弹片的另一端的限位机构，所述限位机构限制所述弹片的另一端翘起的幅度；所述本体固定于所述金属中框的安装槽内，所述弹片包括靠近所述另一端的凸起，其中所述凸起朝向远离所述本体的方向，所述凸起从所述安装槽中突出，以抵接于所述外壳。
  7. 根据权利要求1-6任一项所述的穿戴式电子设备机芯，其特征在于，所述PCB上还设置有阻抗匹配电路，其中所述阻抗匹配电路连接于所述金属中框与所述接地端或所述射频电路之间。
  8. 一种外壳，其特征在于，所述外壳的内部设置有连接机构；当将穿戴式电子设备机芯可拆卸的安装于所述外壳的安装空间时，所述连接机构将所述穿戴式电子设备机芯的金属中框与所述外壳电连接，其中所述外壳采用导体材质。
  9. 根据权利要求8所述的外壳，其特征在于，所述连接机构包括本体和弹片，所述本体固定于所述外壳中，所述弹片的一端与所述本体相连，所述弹片的另一端相对于所述本体翘起，以抵接于所述金属中框。
  10. 根据权利要求9所述的外壳，其特征在于，所述本体包括位于所述弹片的另一端的限位机构，所述限位机构限制所述弹片的另一端翘起的幅度；所述本体固定于 所述外壳的安装槽内，所述弹片包括靠近所述另一端的凸起，其中所述凸起朝向远离所述本体的方向，所述凸起从所述安装槽中突出，以抵接于所述金属中框。
  11. 一种穿戴式电子设备机芯，其特征在于，所述穿戴式电子设备机芯包括金属中框以及设置于金属中框上的PCB；
    所述金属中框上设置有至少一个接地点，所述接地点与所述PCB上的接地端耦合；所述金属中框上设置有至少一个馈电点，所述馈电点与所述PCB上的射频电路耦合；
    所述金属中框上设置有连接机构；当将所述穿戴式电子设备机芯安装于外壳的安装空间时，所述连接机构将所述金属中框与所述外壳电连接，其中所述外壳采用导体材质。
  12. 根据权利要求11所述的穿戴式电子设备机芯，其特征在于，所述连接机构包括本体和弹片，所述本体固定于所述金属中框中，所述弹片的一端与所述本体相连，所述弹片的另一端相对于所述本体翘起，以抵接于所述外壳。
  13. 根据权利要求12所述的穿戴式电子设备机芯，其特征在于，所述本体包括位于所述弹片的另一端的限位机构，所述限位机构限制所述弹片的另一端翘起的幅度；所述本体固定于所述金属中框的安装槽内，所述弹片包括靠近所述另一端的凸起，其中所述凸起朝向远离所述本体的方向，所述凸起从所述安装槽中突出，以抵接于所述外壳。
  14. 一种穿戴式电子设备，其特征在于，包括外壳和安装于所述外壳的安装空间的内部的穿戴式电子设备机芯，其中所述穿戴式电子设备机芯包括如权利要求1-7任一项所述的穿戴式电子设备机芯或者如权利要求11-13任一项所述的穿戴式电子设备机芯；所述外壳包括如权利要求8-10任一项所述的外壳。
  15. 根据权利要求14所述的穿戴式电子设备，其特征在于，所述穿戴式电子设备还包括导电胶或导电布，所述导电胶或所述导电布位于所述外壳和所述金属中框之间，所述外壳经由所述导电胶或所述导电布与所述金属中框电连接。
PCT/CN2022/106258 2021-07-28 2022-07-18 穿戴式电子设备机芯、外壳及穿戴式电子设备 WO2023005712A1 (zh)

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