WO2023004790A1 - 光芯片及其制作方法、电子设备 - Google Patents

光芯片及其制作方法、电子设备 Download PDF

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Publication number
WO2023004790A1
WO2023004790A1 PCT/CN2021/109795 CN2021109795W WO2023004790A1 WO 2023004790 A1 WO2023004790 A1 WO 2023004790A1 CN 2021109795 W CN2021109795 W CN 2021109795W WO 2023004790 A1 WO2023004790 A1 WO 2023004790A1
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WIPO (PCT)
Prior art keywords
substrate
support structure
light engine
optical chip
edge
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PCT/CN2021/109795
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English (en)
French (fr)
Inventor
张童龙
李珩
罗威
郭茂
胡骁
罗多纳
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN202180097044.9A priority Critical patent/CN117178358A/zh
Priority to PCT/CN2021/109795 priority patent/WO2023004790A1/zh
Publication of WO2023004790A1 publication Critical patent/WO2023004790A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits

Definitions

  • the present application relates to the field of chip technology, in particular to an optical chip, a manufacturing method thereof, and electronic equipment.
  • the optical chip is used to complete the conversion of photoelectric signals, which is equivalent to an information transfer station. It is a core device on mobile devices. have certain applications.
  • An optical chip is provided in the related art, as shown in FIG. (die).
  • the light engine 3 performs photoelectric conversion, converts the external optical signal into an electrical signal and transmits it to the chip 2, or converts the electrical signal of the chip 2 into an optical signal and outputs it to an external device, thereby realizing the interaction between the chip and the external device.
  • the light engine 3 is mounted on the edge area of the substrate 1 , the force on the edge of the substrate will be uneven, and warpage may easily occur, which seriously affects the mounting yield.
  • Embodiments of the present application provide an optical chip, a manufacturing method thereof, and an electronic device, which can solve the problem of warpage caused by mounting an optical engine on an edge region of a substrate.
  • the present application provides an optical chip, and the optical chip may include a substrate, at least one chip, at least one optical engine, and a supporting structure.
  • the substrate includes an upper surface (first surface) and a lower surface (second surface) which are arranged oppositely;
  • the chip is arranged on the central area of the upper surface of the substrate, and the light engine is arranged on the edge region of the upper surface of the substrate;
  • the supporting structure is arranged on the upper surface of the substrate.
  • the lower surface, and the projection of the support structure on the substrate and the projection of the at least one light engine on the substrate have an overlapping area. In this case, the bending stiffness of the substrate in the edge region is enhanced by the supporting structure, thereby reducing the probability of substrate warping and improving the mounting yield.
  • the rigidity of the supporting structure is greater than that of the substrate; thus, the bending rigidity of the substrate can be enhanced to a greater extent, and the probability of warping of the substrate can be further reduced.
  • the supporting structure may be made of metal (such as copper, iron, etc.) or stainless steel.
  • the outer edge of the support structure protrudes from the edge of the substrate, and the inner edge of the support structure protrudes from the inner edge of the light engine;
  • the supporting structure is provided, so that the bending rigidity of the substrate can be enhanced to a greater extent, and the probability of warping of the substrate can be further reduced.
  • the outer edge of the support structure is flush with the edge of the substrate, and the inner edge of the support structure protrudes from the inner edge of the light engine.
  • a supporting structure is provided on the lower surface of the substrate at a position corresponding to the entire light engine, so that the bending rigidity of the substrate can be enhanced to a greater extent, and the probability of warping of the substrate can be further reduced.
  • the light engine includes a first extension protruding from the edge of the substrate; the support structure includes a second extension protruding from the edge of the substrate; the surface of the second extension facing the side of the light engine is in contact with the surface of the substrate The upper surface is flush; the first extension is in contact with the second extension. In this way, the light engine can be supported to a certain extent by the second extension part, and the reliability of the light engine can be improved.
  • the support structure is provided with an opening at a position facing the light engine.
  • the light engine can be electrically connected to the printed circuit board through the opening, that is, the printed circuit board can supply power to the light engine through the opening.
  • the support structure is a ring structure.
  • the supporting structure adopting the annular structure can strengthen the peripheral edge of the substrate, thereby significantly enhancing the bending stiffness of the substrate in the edge region and reducing the probability of substrate warping to a greater extent.
  • the support structure and the lower surface of the substrate may be bonded by an adhesive.
  • the foregoing at least one chip may include a system-on-a-chip.
  • the embodiment of the present application also provides a manufacturing method of an optical chip, which may include: setting a substrate; wherein, the substrate includes an upper surface (first surface) and a lower surface (second surface) that are oppositely arranged. Mount at least one chip on the central area of the upper surface of the substrate. A support structure is mounted on the lower surface of the substrate. Mount at least one light engine on the edge area of the upper surface of the substrate; wherein, the projection of the at least one light engine on the substrate and the projection of the support structure on the substrate have an overlapping area.
  • the manufacturing method of the present application by attaching the support structure on the lower surface of the substrate, the bending stiffness of the substrate in the edge region can be enhanced through the support structure, thereby reducing the probability of warping of the substrate and improving the attachment of the light engine. Yield rate.
  • attaching the supporting structure on the edge region of the lower surface of the substrate may include: attaching the supporting structure of the ring structure along the peripheral edge region of the lower surface of the substrate.
  • An embodiment of the present application also provides an electronic device, which includes a printed circuit board and at least one optical chip as described above; the optical chip is connected to the printed circuit board.
  • FIG. 1 is a schematic diagram of a planar structure of an optical chip provided in the related art of the present application
  • FIG. 2 is a schematic plan view of an optical chip provided in an embodiment of the present application.
  • Fig. 3 is a schematic cross-sectional view of Fig. 1 along OO' position
  • Fig. 4 is a schematic diagram of a support structure provided by an embodiment of the present application.
  • FIG. 5 is a schematic structural diagram of an optical chip provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of an optical chip provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of an optical chip provided by an embodiment of the present application.
  • Fig. 8 is a schematic diagram of a support structure provided by the embodiment of the present application.
  • FIG. 9 is a flow chart of a method for fabricating an optical chip provided in an embodiment of the present application.
  • FIG. 10 is a schematic structural diagram during the manufacturing process of an optical chip provided by an embodiment of the present application.
  • At least one (item) means one or more, and “multiple” means two or more.
  • “And/or” is used to describe the association relationship of associated objects, indicating that there can be three types of relationships, for example, “A and/or B” can mean: only A exists, only B exists, and A and B exist at the same time , where A and B can be singular or plural.
  • the character “/” generally indicates that the contextual objects are an “or” relationship.
  • At least one of the following” or similar expressions refer to any combination of these items, including any combination of single or plural items.
  • At least one item (piece) of a, b or c can mean: a, b, c, "a and b", “a and c", “b and c", or "a and b and c ", where a, b, c can be single or multiple.
  • Some embodiments of the present application provide an electronic device.
  • the embodiment of the present application does not impose special restrictions on the specific configuration form and application field of the electronic device.
  • the electronic device can be applied to the fields of network and supercomputing (supercomputing) products.
  • the electronic device includes a printed circuit board (printed circuit board, PCB), and at least one optical chip connected to the PCB.
  • PCB printed circuit board
  • optical chip For example, two or more optical chips can be arranged on the PCB.
  • the optical chip provided by the embodiment of the present application enhances the bending stiffness of the edge of the substrate by additionally providing a support structure, thereby improving the problem of warping when the optical engine is mounted on the edge region of the substrate, and improving the mounting yield.
  • the setting of the support structure will be described below in conjunction with the entire optical chip.
  • Fig. 2 is a schematic plan view of an optical chip provided by an embodiment of the present application
  • Fig. 3 is a cross-sectional view along OO' in Fig. 2 . 2 and 3
  • the optical chip 01 includes a substrate 1 (substrate), and a chip 2 (die) is arranged on the central area of the upper surface a1 (also referred to as the first surface) of the substrate 1, and on the substrate
  • the edge area of the upper surface a1 of 1 is provided with a light engine 3 .
  • the optical engine 3 and the chip 2 can be electrically connected through wires located in the substrate 1 , and the optical engine 3 can be connected with external electronic devices through optical fibers.
  • the external part of the optical signal can be converted into an electrical signal and then transmitted to the chip, or the electrical signal of the chip can be converted into an optical signal and output to an external electronic device, so as to realize the connection between the external electronic device and the chip. interaction between.
  • the external electronic device may be a processor, other optical chips, sensors, optical communication devices, etc., which are not limited in this application, and can be set according to actual needs.
  • the lower surface of the chip 2 can be provided with the pads on the upper surface of the substrate 1 through connection structures such as micro-bumps ( ⁇ bump), copper pillars (Cu Pillar, Cu stud) or solder balls. connect.
  • connection structures such as micro-bumps ( ⁇ bump), copper pillars (Cu Pillar, Cu stud) or solder balls.
  • the present application does not limit the number and form of chips 2 disposed on the upper surface a1 of the substrate 1 .
  • a chip 2 may be disposed on the upper surface a1 of the substrate 1 .
  • two or more chips 2 may also be provided on the upper surface a1 of the substrate 1 .
  • the chip 2 may be a system-on-chip (SOC), but it is not limited thereto. In practice, the chip 2 may be configured as required.
  • the number and form of the light engines 3 disposed on the upper surface a1 of the substrate 1 there is no limit to the number and form of the light engines 3 disposed on the upper surface a1 of the substrate 1 .
  • a plurality of light engines 3 may be dispersedly arranged in an edge region of the upper surface a1 of the substrate 1 .
  • the light engine 3 may be composed of electrical chips, optical chips and other devices. In practice, the light engine 3 can be set as required.
  • edge region and the “central region” of the upper surface a1 of the substrate 1 are two relative concepts, and are not limited to two fixed regions.
  • Edge area refers to the area extending inward with a certain width from the edge of the lower surface a2 of the substrate 1; “central area” does not refer to the geometric center area of the upper surface a1 of the substrate 1, but refers to the area located within the "edge area” Area.
  • the support structure 4 is provided at the position where the lower surface a2 faces the at least one light engine 3 , that is, the support structure 4 and the projection of the at least one light engine 3 on the substrate 1 have an overlapping area.
  • the bending stiffness of the substrate 1 in the edge region is enhanced by the support structure 4 , thereby reducing the probability of warping of the substrate 1 and improving the placement yield.
  • the projection of the support structure 4 and the light engine 3 on the substrate 1 may be partially overlapped. overlap, or completely overlap.
  • part of the projection of the support structure 4 on the substrate 1 may overlap with a part of the projection of the light engine 3 on the substrate 1 .
  • the projection of the support structure 4 on the substrate 1 may cover the projection of the light engine 3 on the substrate 1 , or the projection of the light engine 3 on the substrate 1 may cover the projection of the support structure 4 on the substrate 1 .
  • the projection of the support structure 4 on the substrate 1 may coincide with the projection of the light engine 3 on the substrate 1 (that is, completely overlap).
  • the rigidity of the support structure 4 can be set to be greater than that of the substrate 1 , so that the bending rigidity of the substrate 1 can be enhanced to a greater extent, and the probability of warping of the substrate 1 can be further reduced.
  • the supporting structure 4 can be made of metal (such as copper, iron, etc.), stainless steel, and the like.
  • the support structure 4 may be pasted on the lower surface of the substrate 1 by an adhesive.
  • the support structure 4 may be a ring structure (ring). In this case, a ring-shaped support structure 4 can be arranged along the edge region in the optical chip 01 .
  • the support structure 4 may be a block structure such as a circle or a rectangle. In this case, a plurality of support structures 4 can be distributed along the edge region in the optochip.
  • the support structure adopting a ring structure can strengthen the peripheral edge of the substrate 1, so that the support structure of the substrate 1 in the edge area can be significantly enhanced.
  • the bending rigidity can reduce the probability of warping of the substrate 1 to a greater extent.
  • the light engine 3 is arranged on the edge region of the upper surface a1 of the substrate 1, in order to ensure that the strength of the edge region of the substrate can be significantly enhanced through the support structure 4, it is possible to connect the edge of the lower surface a2 of the substrate 1 to the corresponding light engine.
  • the position of the inner edge of 3 is provided with support structure 4.
  • the outer edge s1 of the support structure 4 may be set to be flush with the edge m of the substrate 1 , and the inner edge s2 of the support structure 4 protrudes from the inner edge s3 of the light engine 3 .
  • the outer edge s1 of the support structure 4 protrudes from the edge m of the substrate 1
  • the inner edge s2 of the support structure 4 protrudes from the inner edge s3 of the light engine 3 .
  • the outer edge of the light engine 3 may protrude from the edge m of the substrate 1, and this protruding part may be called a first extension part 30; in this case,
  • the upper surface of the second extension 40 ie the surface facing the light engine 3
  • the first extension 30 is in contact with the second extension 40 . In this way, the light engine 3 can be supported by the second extension part 40 to improve the reliability of the light engine 3 .
  • openings 41 may be provided on the support structure 4 .
  • the position of setting the opening 41 can be opposite to the position of the light engine 3, that is, the position of the opening 41 is located below the light engine 3; in this way, the light engine 3 can be electrically connected to the PCB through the opening 41 , in this case, the PCB supplies power to the light engine 3 through the opening 41 .
  • the present application does not limit the size, shape, quantity, etc. of the openings 41 , as long as the power supply to the light engine 3 can be satisfied.
  • the embodiment of the present application also provides a method for manufacturing an optical chip. As shown in FIG. 9, the method may include:
  • Step 01. Referring to FIG. 10 (a), set a substrate 1; wherein, the substrate 1 includes an upper surface a1 (ie, the first surface) and a lower surface a2 (ie, the second surface) that are oppositely arranged.
  • the substrate 1 includes an upper surface a1 (ie, the first surface) and a lower surface a2 (ie, the second surface) that are oppositely arranged.
  • the present application does not limit the specific arrangement of the substrate 1 , and in practice, a suitable substrate 1 can be selected according to needs. It can be understood that the substrate 1 is usually provided with wiring layers and the like, and the upper surface a1 of the substrate 1 is usually provided with pads and the like.
  • Step 02 referring to (b) in FIG. 10 , mount at least one chip 2 on the central area of the upper surface a1 of the substrate 1 .
  • one (piece) or more (pieces) of SOC can be mounted on the central area of the upper surface a1 of the substrate 1 through the above step 02 .
  • metal interconnection can be formed between the SOC and the pad on the surface of the substrate 1 by means of reflow heating; and an underfill material can be coated between the SOC and the substrate 1 to reinforce the SOC.
  • Step 03 referring to FIG. 10 ( c ), mount the support structure 4 on the lower surface a2 of the substrate 1 .
  • the ring-shaped support structure 4 (refer to FIG. 4 ) can be bonded together with the substrate 1 through an organic adhesive at the edge region of the lower surface a2 of the substrate 1 through step 03 .
  • an opening 41, a second extension 40, etc. may be provided in the supporting structure 4 used in the above step 03, so as to connect to the PCB through the opening 41, and The light engine 3 mounted subsequently is powered, and the light engine 3 mounted subsequently is supported by the second extension part 40 .
  • Step 04 mount at least one light engine 3 on the edge area of the upper surface a1 of the substrate 1; wherein, the projection of the light engine 3 on the substrate 1 and the supporting structure 4 are on the substrate 1
  • the projections of have overlapping regions.
  • a plurality of light engines 3 may be dispersed in the edge region of the upper surface a1 of the substrate 1 through step 04 .
  • optical fiber connection part fiber attach unit, FAU
  • FAU fiber attach unit
  • the size of the sequence numbers of the above-mentioned processes does not mean the order of the steps, and the order of the steps in each process should be determined by their functions, rather than the implementation process of the embodiments of the present application. constitute any limitation.
  • the above step 02 may be before the above step 03; in other embodiments, the above step 02 may also be after the above step 03.
  • the above step 03 may be before the above step 04; in other embodiments, the above step 03 may also be after the above step 04.

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Abstract

本申请提供了一种光芯片及其制作方法、电子设备，涉及芯片技术领域，能够改善因在基板的边缘区域贴装光引擎而发生翘曲的问题。该光芯片可以包括基板、至少一个芯片、至少一个光引擎、支撑结构。其中，基板包括相对设置的上表面(第一表面)和下表面(第二表面)；芯片设置在基板上表面的中心区域，光引擎设置在基板上表面的边缘区域；支撑结构设置在基板的下表面，并且支撑结构在基板上的投影与至少一个光引擎在基板上的投影具有重叠区域。

Description

光芯片及其制作方法、电子设备 技术领域
本申请涉及芯片技术领域，尤其涉及一种光芯片及其制作方法、电子设备。
背景技术
光芯片是用来完成光电信号转换的，相当于信息中转站，它在移动设备上属于一个核心设备，光芯片在光纤通信、化学、生物或光谱传感器、计量、经典和量子信息处理等领域均具有一定的应用。
相关技术中提供一种光芯片，参考图1所示，该光芯片中包括基板1(substrate)、设置在基板边缘区域的光引擎3(optical engine，OE)以及设置在基板中心区域的芯片2(die)。通过光引擎3进行光电转换，将外部的光信号转换为电信号后传输给芯片2，或者将芯片2的电信号转换为光信号输出至外部器件，从而实现芯片与外部器件之间的交互。然而，在基板1的边缘区域贴装光引擎3时，会使得基板的边缘受力不均，容易发生翘曲，严重的影响了贴装良率。
发明内容
本申请实施例提供一种光芯片及其制作方法、电子设备，能够改善因在基板的边缘区域贴装光引擎而发生翘曲的问题。
本申请提供一种光芯片，该光芯片可以包括基板、至少一个芯片、至少一个光引擎、支撑结构。其中，基板包括相对设置的上表面(第一表面)和下表面(第二表面)；芯片设置在基板上表面的中心区域，光引擎设置在基板上表面的边缘区域；支撑结构设置在基板的下表面，并且支撑结构在基板上的投影与至少一个光引擎在基板上的投影具有重叠区域。在此情况下，通过支撑结构增强了基板在边缘区域的弯曲刚度，从而也就降低了基板发生翘曲的几率，提高了贴装良率。
在一些可能实现的方式中，支撑结构的刚度大于基板的刚度；从而能够更大程度的增强基板的弯曲刚度，进一步降低基板发生翘曲的几率。
在一些可能实现的方式中，支撑结构可以采用金属(如铜、铁等)或不锈钢材质。
在一些可能实现的方式中，支撑结构的外边缘凸出于基板的边缘，支撑结构的内边缘凸出光引擎的内边缘；在此情况下，在基板的下表面在对应整个光引擎的位置均设置有支撑结构，从而能够更大程度的增强基板的弯曲刚度，进一步降低基板发生翘曲的几率。
在一些可能实现的方式中，支撑结构的外边缘与基板的边缘平齐，支撑结构的内边缘凸出光引擎的内边缘。在此情况下，在基板的下表面在对应整个光引擎的位置均设置有支撑结构，从而能够更大程度的增强基板的弯曲刚度，进一步降低基板发生翘曲的几率。
在一些可能实现的方式中，光引擎包括凸出于基板边缘的第一延伸部；支撑结构包括凸出于基板边缘的第二延伸部；第二延伸部朝向光引擎一侧的表面与基板的上表面平齐；第一延伸部与第二延伸部接触。这样一来，通过第二延伸部能够对光引擎起到一定的支撑 作用，提高光引擎的可靠性。
在一些可能实现的方式中，支撑结构在与光引擎正对的位置设置有开孔。这样一来，光引擎可以通过该开孔与印制线路板进行电连接，也即印制线路板能够通过该开孔向光引擎进行供电。
在一些可能实现的方式中，支撑结构为环状结构。采用该环状结构的支撑结构能够对基板的一周边缘均起到增强的作用，从而能够明显增强基板在边缘区域的弯曲刚度，更大程度的降低基板发生翘曲的几率。
在一些可能实现的方式中，支撑结构与基板的下表面可以通过胶黏剂粘结。
在一些可能实现的方式中，前述的至少一个芯片中可以包括系统级芯片。
本申请实施例还提供一种光芯片的制作方法，该制作方法可以包括：设置基板；其中，基板包括相对设置的上表面(第一表面)和下表面(第二表面)。在基板的上表面的中心区域贴装至少一个芯片。在基板的下表面贴装支撑结构。在基板的上表面的边缘区域贴装至少一个光引擎；其中，至少一个光引擎在基板上的投影与支撑结构在基板上的投影具有重叠区域。
采用本申请的制作方法，通过在基板的下表面贴装支撑结构，从而能够通过支撑结构增强基板在边缘区域的弯曲刚度，进而也就降低了基板发生翘曲的几率，提高了光引擎的贴装良率。
在一些可能实现的方式中，上述在基板的下表面的边缘区域贴装支撑结构可以包括：沿基板的下表面的四周边缘区域贴装环状结构的支撑结构。
本申请实施例还提供一种电子设备，该电子设备包括印制线路板以及至少一个如前述的光芯片；该光芯片与印制线路板连接。
附图说明
图1为本申请相关技术中提供的一种光芯片的平面结构示意图；
图2为本申请实施例提供的一种光芯片的平面结构示意图；
图3为图1沿OO'位置的剖面示意图；
图4为本申请实施例提供的一种支撑结构示意图；
图5为本申请实施例提供的一种光芯片的结构示意图；
图6为本申请实施例提供的一种光芯片的结构示意图；
图7为本申请实施例提供的一种光芯片的结构示意图；
图8为本申请实施例提供的一种支撑结构示意图；
图9为本申请实施例提供的一种光芯片的制作方法流程图；
图10为本申请实施例提供的一种光芯片的制作过程中的结构示意图。
具体实施方式
为使本申请的目的、技术方案和优点更加清楚，下面将结合本申请中的附图，对本申请中的技术方案进行清楚地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请的说明书实施例和权利要求书及附图中的术语“第一”、“第二”等仅用于区分描述的目的，而不能理解为指示或暗示相对重要性，也不能理解为指示或暗示顺序。“连接”、“相连”等类似的词语，用于表达不同组件之间的互通或互相作用，可以包括直接相连或通过其他组件间接相连。此外，术语“包括”和“具有”以及他们的任何变形，意图在于覆盖不排他的包含，例如，包含了一系列步骤或单元。方法、系统、产品或设备不必限于清楚地列出的那些步骤或单元，而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。“上”、“下”、“左”、“右”等仅用于相对于附图中的部件的方位而言的，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中的部件所放置的方位的变化而相应地发生变化。
应当理解，在本申请中，“至少一个(项)”是指一个或者多个，“多个”是指两个或两个以上。“和/或”，用于描述关联对象的关联关系，表示可以存在三种关系，例如，“A和/或B”可以表示：只存在A，只存在B以及同时存在A和B三种情况，其中A，B可以是单数或者复数。字符“/”一般表示前后关联对象是一种“或”的关系。“以下至少一项(个)”或其类似表达，是指这些项中的任意组合，包括单项(个)或复数项(个)的任意组合。例如，a，b或c中的至少一项(个)，可以表示：a，b，c，“a和b”，“a和c”，“b和c”，或“a和b和c”，其中a，b，c可以是单个，也可以是多个。
本申请一些实施例提供一种电子设备。本申请实施例对该电子设备的具体设置形式以及应用领域等均不做特殊限制。示意的，该电子设备可以应用于网络和超级计算(超算)产品领域。
该电子设备中包括印制线路板(printed circuit board，PCB)，以及与PCB连接至少一个光芯片。例如，PCB上可以设置两个或两个以上的光芯片。
本申请实施例提供的光芯片通过额外设置支撑结构，来增强基板边缘的弯曲刚度，进而改善了在基板的边缘区域贴装光引擎而发生翘曲的问题，提高了贴装良率。以下结合整个光芯片对支撑结构的设置进行说明。
图2为本申请实施例提供的一种光芯片的平面结构示意图，图3为图2沿OO’位置的剖面图。参考图2和图3所示，光芯片01中包括基板1(substrate)，在基板1的上表面a1(也可以称为第一表面)的中心区域设置有芯片2(die)，并且在基板1的上表面a1的边缘区域设置有光引擎3。
示意的，在该光芯片01中，光引擎3与芯片2可以通过位于基板1中的走线电连接，光引擎3可以与外部电子器件通过光纤连接。在此情况下，通过光引擎3进行光电转换，可以将外部分光信号转换为电信号后传输给芯片，或者将芯片的电信号转换为光信号输出至外部电子器件，以实现外部电子器件与芯片之间的交互。其中，外部电子器件可以是处理器、其他的光芯片、传感器、光通信器件等，本申请对此不作限制，实际中可以根据需要进行设置。
另外，本申请中对于芯片2、光引擎3与基板1的连接方式不作限制。例如，在一些实施例中，芯片2的下表面可以通过微凸点(μbump)、铜柱(Cu Pillar、Cu stud)或焊球(solder ball)等连接结构与基板1上表面设置的焊盘连接。类似的，如光引擎3的下表面与基板1上表面设置的焊盘的连接。
此外，本申请中对设置在基板1的上表面a1的芯片2的数量和形式不作限制。例如， 基板1的上表面a1可以设置一个芯片2。又例如，基板1的上表面a1也可以设置两个或两个以上的芯片2。另外，芯片2可以是系统级芯片(system on chip，SOC)，但并不限制于此，实际中可以根据需要来设置芯片2。
本申请中对设置在基板1的上表面a1的光引擎3的数量和形式不作限制。示意的，参考图2所示，在一些可能实现的方式中，在基板1的上表面a1的边缘区域可以分散设置多个光引擎3。光引擎3中可以采用电芯片、光芯片等器件组成。实际中可以根据需要来设置光引擎3。
另外，还需要说明的是，上述基板1的上表面a1的“边缘区域”以及“中心区域”是两个相对概念，并不限制在两个固定的区域。“边缘区域”是指从基板1的下表面a2的边缘向内侧延伸一定宽度的区域；“中心区域”并不是指基板1的上表面a1的几何中心区域，而是指位于“边缘区域”以内的区域。
为了改善在基板1上表面a1的边缘区域因设置光引擎3，而导致基板1发生翘曲的问题，如图3所示，在本申请实施例提供的光芯片01中，可以在基板1的下表面a2与至少一个光引擎3正对的位置设置支撑结构4，也即支撑结构4与至少一个光引擎3在基板1上的投影具有交叠区域。在此情况下，通过支撑结构4增强了基板1在边缘区域的弯曲刚度，从而也就降低了基板1发生翘曲的几率，提高了贴装良率。
此处需要说明的是，对于上述支撑结构4与至少一个光引擎3在基板1上的投影“具有交叠区域”而言，支撑结构4与光引擎3在基板1上的投影可以是部分交叠，也可以是完全交叠。例如，可以是支撑结构4在基板1上的部分投影与光引擎3在基板1上的部分投影重叠。又例如，可以是支撑结构4在基板1上的投影覆盖光引擎3在基板1上的投影，或者，光引擎3在基板1上的投影覆盖支撑结构4在基板1上的投影。再例如，可以是支撑结构4在基板1上的投影与光引擎3在基板1上的投影重合(也即完全交叠)。
示意的，在一些可能实现的方式中，可以设置支撑结构4的刚度大于基板1的刚度，从而能够更大程度的增强基板1的弯曲刚度，进一步降低基板1发生翘曲的几率。例如，在一些实施例中，支撑结构4可以采用金属(如铜、铁等)、不锈钢等材质制成。
示意的，在一些可能实现的方式中，支撑结构4可以通过胶黏剂粘贴在基板1的下表面。
另外，本申请中对光芯片01中设置的支撑结构4的形状不作限制。例如，如图4所示，在一些可能实现的方式中，支撑结构4可以为环状结构(ring)。在此情况下，在光芯片01中可以沿边缘区域设置一个环状结构的支撑结构4。又例如，在一些可能实现的方式中，支撑结构4可以为圆形、矩形等块状结构。在此情况下，在光芯片中可以沿边缘区域分散设置多个支撑结构4。
可以理解的是，相比于采用分散设置的多个支撑结构而言，采用环状结构的支撑结构能够对基板1的一周边缘均起到增强的作用，从而能够明显增强基板1在边缘区域的弯曲刚度，更大程度的降低基板1发生翘曲的几率。本申请以下实施例均是以支撑结构4为环状结构为例进行示意说明的。
另外，由于光引擎3设置在基板1的上表面a1的边缘区域，因此，为了保证通过支撑结构4能够明显的增强基板边缘区域的强度，可以从基板1的下表面a2的边缘到对应光引擎3内边缘的位置均设置有支撑结构4。
例如，在一些可能实现的方式中，如图5所示，可以设置支撑结构4的外边缘s1与基板1的边缘m平齐，支撑结构4的内边缘s2凸出光引擎3的内边缘s3。
又例如，在一些可能实现的方式中，如图6所示，支撑结构4的外边缘s1凸出于基板1的边缘m，支撑结构4的内边缘s2凸出光引擎3的内边缘s3。
另外，参考图6所示，在一些可能实现的方式中，光引擎3的外边缘可以凸出于基板1的边缘m，该凸出部分可以称为第一延伸部30；在此情况下，对于采用图6中示出的支撑结构4的外边缘s1凸出于基板1的边缘的结构而言，支撑结构4凸出于基板1的边缘m的部分可以称为第二延伸部40，可以设置第二延伸部40的上表面(也即朝向光引擎3一侧的表面)与基板1的上表面a1平齐，并且第一延伸部30与第二延伸部40接触。这样一来，通过第二延伸部40能够对光引擎3起到一定的支撑作用，提高光引擎3的可靠性。
此外，如图7和图8(图7中支撑结构4的平面示意图)所示，在一些可能实现的方式中，可以在支撑结构4上设置开孔41。示意的，设置开孔41的位置可以与光引擎3的位置相对，也即开孔41的位置位于光引擎3的下方；这样一来，光引擎3可以通过该开孔41与PCB进行电连接，在此情况下，PCB通过该开孔41向光引擎3进行供电。
当然，本申请对于上述开孔41的大小、形状、数量等均不作限制，只要能够满足对光引擎3的供电即可。
本申请实施例还提供一种光芯片的制作方法，如图9所示，该制作方法可以包括：
步骤01、参考图10中(a)所示，设置基板1；其中，该基板1包括相对设置的上表面a1(即第一表面)和下表面a2(即第二表面)。
本申请对于基板1的具体设置不作限制，实际中可以根据需要选择合适的基板1即可。可以理解的是，基板1中通常设置有布线层等，基板1的上表面a1通常设置有焊盘(pad)等。
步骤02、参考图10中(b)所示，在基板1的上表面a1的中心区域贴装至少一个芯片2。
示意的，在一些实施例中，可以通过上述步骤02在基板1的上表面a1的中心区域贴装一个(颗)或多个(颗)SOC。对于SOC的贴装而言，SOC与基板1表面的焊盘之间可以采用回流加温的方式形成金属互联；并且可以在SOC与基板1之间会涂布底填充材料对SOC进行加固。
步骤03、参考图10中(c)所示，在基板1的下表面a2贴装支撑结构4。
示意的，在一些实施例中，可以通过步骤03在基板1的下表面a2的边缘区域，将环状结构的支撑结构4(参考图4)通过有机胶黏剂与基板1粘结在一起。
示意的，在一些实施例中，参考图7所示，上述步骤03采用的支撑结构4中可以设置有开孔41、第二延伸部40等，以通过该开孔41与PCB进行连接，对后续贴装的向光引擎3进行供电，通过第二延伸部40对后续贴装的光引擎3进行支撑。
步骤04、参考图10中(d)所示，在基板1的上表面a1的边缘区域贴装至少一个光引擎3；其中，光引擎3在基板1上的投影与支撑结构4在基板1上的投影具有重叠区域。
示意的，在一些实施例中，参考图2所示，可以通过步骤04在基板1的上表面a1的边缘区域分散多个光引擎3。
另外，需要说明的是，在上述光芯片的制作方法中，通常还需要在光引擎3上贴装光纤连接部分(fiber attach unit，FAU)；该光纤连接部分可以在光引擎3贴装到基板1上之前进行贴装，也可以在光引擎3贴装到基板1上之后进行贴装，本申请对此不作限制。
应当理解的是，在本申请的实施例中，上述各过程的序号的大小并不意味着步骤顺序的先后，各过程的步骤顺序应以其功能确定，而不应对本申请实施例的实施过程构成任何限定。例如，在一些实施例中，上述步骤02可以在上述步骤03之前；在另一些实施例中，上述步骤02也可以在上述步骤03之后。又例如，在一些实施例中，上述步骤03可以在上述步骤04之前；在另一些实施例中，上述步骤03也可以在上述步骤04之后。
关于上述光芯片的制作方法实施例中其他相关的内容，如支撑结构、开孔、第二延伸部等设置，可以对应参考前述光芯片结构实施例中对应的部分，此处不再赘述；关于前述光芯片结构实施例中相关的结构，可以对应参考上述光芯片的制作方法实施例对应制作，也可以结合相关技术进行适当的调整进行制作，本申请对此不做限制。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (13)

  1. 一种光芯片，其特征在于，包括：
    基板；其中，所述基板包括相对设置的第一表面和第二表面；
    设置在所述第一表面的中心区域的至少一个芯片；
    设置在所述第一表面的边缘区域的至少一个光引擎；
    设置在所述第二表面的支撑结构；其中，所述支撑结构在所述基板上的投影与所述至少一个光引擎在所述基板上的投影具有重叠区域。
  2. 根据权利要求1所述的光芯片，其特征在于，
    所述支撑结构的刚度大于所述基板的刚度。
  3. 根据权利要求1或2所述的光芯片，其特征在于，
    所述支撑结构的外边缘与所述基板的边缘平齐，所述支撑结构的内边缘凸出所述光引擎的内边缘。
  4. 根据权利要求1或2所述的光芯片，其特征在于，
    所述支撑结构的外边缘凸出于所述基板的边缘，所述支撑结构的内边缘凸出所述光引擎的内边缘。
  5. 根据权利要求1、2、4中任一项所述的光芯片，其特征在于，
    所述光引擎包括凸出于所述基板边缘的第一延伸部；
    所述支撑结构包括凸出于所述基板边缘的第二延伸部；
    所述第二延伸部朝向所述光引擎一侧的表面与所述第一表面平齐；
    所述第一延伸部与所述第二延伸部接触。
  6. 根据权利要求1-5任一项所述的光芯片，其特征在于，
    所述支撑结构在与所述光引擎正对的位置设置有开孔。
  7. 根据权利要求1-6任一项所述的光芯片，其特征在于，
    所述支撑结构为环状结构。
  8. 根据权利要求1-7任一项所述的光芯片，其特征在于，
    所述支撑结构与所述第二表面通过胶黏剂粘结。
  9. 根据权利要求1-8任一项所述的光芯片，其特征在于，
    所述支撑结构采用金属或不锈钢材质。
  10. 根据权利要求1-9任一项所述的光芯片，其特征在于，
    所述至少一个芯片中包括系统级芯片。
  11. 一种光芯片的制作方法，其特征在于，包括：
    设置基板；所述基板包括相对设置的第一表面和第二表面；
    在所述第一表面的中心区域贴装至少一个芯片；
    在所述第二表面贴装支撑结构；
    在所述第一表面的边缘区域贴装至少一个光引擎；其中，所述至少一个光引擎在所述基板上的投影与所述支撑结构在所述基板上的投影具有重叠区域。
  12. 根据权利要求11所述的光芯片的制作方法，其特征在于，
    所述在所述第二表面的边缘区域贴装支撑结构包括：
    沿所述第二表面的四周边缘区域贴装环状结构的支撑结构。
  13. 一种电子设备，其特征在于，包括印制线路板以及至少一个如权利要求1-10任一项所述的光芯片，所述光芯片与所述印制线路板连接。
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