WO2023000218A1 - Aqueous dispersion of a silicone pressure sensitive adhesive base and methods for preparation and use of the dispersion - Google Patents
Aqueous dispersion of a silicone pressure sensitive adhesive base and methods for preparation and use of the dispersion Download PDFInfo
- Publication number
- WO2023000218A1 WO2023000218A1 PCT/CN2021/107678 CN2021107678W WO2023000218A1 WO 2023000218 A1 WO2023000218 A1 WO 2023000218A1 CN 2021107678 W CN2021107678 W CN 2021107678W WO 2023000218 A1 WO2023000218 A1 WO 2023000218A1
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- WIPO (PCT)
- Prior art keywords
- alternatively
- weight parts
- aqueous dispersion
- resin
- pressure sensitive
- Prior art date
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 62
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 57
- 239000006185 dispersion Substances 0.000 title claims abstract description 49
- 238000000034 method Methods 0.000 title claims description 35
- 238000002360 preparation method Methods 0.000 title description 4
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- 239000011347 resin Substances 0.000 claims description 107
- 229920005989 resin Polymers 0.000 claims description 105
- 239000007858 starting material Substances 0.000 claims description 77
- 125000000217 alkyl group Chemical group 0.000 claims description 52
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 52
- 239000000203 mixture Substances 0.000 claims description 45
- RWGFKTVRMDUZSP-UHFFFAOYSA-N cumene Chemical compound CC(C)C1=CC=CC=C1 RWGFKTVRMDUZSP-UHFFFAOYSA-N 0.000 claims description 42
- 239000004094 surface-active agent Substances 0.000 claims description 41
- -1 peroxide compound Chemical class 0.000 claims description 38
- 229920000642 polymer Polymers 0.000 claims description 36
- 239000000758 substrate Substances 0.000 claims description 28
- 125000004432 carbon atom Chemical group C* 0.000 claims description 16
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 14
- 239000004064 cosurfactant Substances 0.000 claims description 12
- 238000005227 gel permeation chromatography Methods 0.000 claims description 6
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 5
- 125000002947 alkylene group Chemical group 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 230000001804 emulsifying effect Effects 0.000 claims description 2
- 125000002791 glucosyl group Chemical group C1([C@H](O)[C@@H](O)[C@H](O)[C@H](O1)CO)* 0.000 claims 1
- 239000002585 base Substances 0.000 description 91
- 239000003921 oil Substances 0.000 description 15
- 235000019198 oils Nutrition 0.000 description 15
- 239000000523 sample Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 15
- 239000004372 Polyvinyl alcohol Substances 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 229920002451 polyvinyl alcohol Polymers 0.000 description 12
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 12
- 238000003756 stirring Methods 0.000 description 11
- 150000002430 hydrocarbons Chemical group 0.000 description 10
- 239000012071 phase Substances 0.000 description 10
- 235000000346 sugar Nutrition 0.000 description 10
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 9
- 238000002156 mixing Methods 0.000 description 9
- 239000012855 volatile organic compound Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 150000002978 peroxides Chemical class 0.000 description 8
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 8
- 241000894007 species Species 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 239000003945 anionic surfactant Substances 0.000 description 7
- 125000003118 aryl group Chemical group 0.000 description 7
- 239000003139 biocide Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000000839 emulsion Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000004342 Benzoyl peroxide Substances 0.000 description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 5
- 235000019400 benzoyl peroxide Nutrition 0.000 description 5
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 description 5
- 230000003115 biocidal effect Effects 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- 239000008103 glucose Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 150000004756 silanes Chemical class 0.000 description 4
- WBIQQQGBSDOWNP-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid Chemical compound CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O WBIQQQGBSDOWNP-UHFFFAOYSA-N 0.000 description 3
- 239000013523 DOWSIL™ Substances 0.000 description 3
- 229920013731 Dowsil Polymers 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 3
- 230000006035 T cell-directed cellular cytotoxicity Effects 0.000 description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 3
- 238000007792 addition Methods 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- PYMYPHUHKUWMLA-UHFFFAOYSA-N arabinose Natural products OCC(O)C(O)C(O)C=O PYMYPHUHKUWMLA-UHFFFAOYSA-N 0.000 description 3
- SRBFZHDQGSBBOR-UHFFFAOYSA-N beta-D-Pyranose-Lyxose Natural products OC1COC(O)C(O)C1O SRBFZHDQGSBBOR-UHFFFAOYSA-N 0.000 description 3
- 229940060296 dodecylbenzenesulfonic acid Drugs 0.000 description 3
- 239000003925 fat Substances 0.000 description 3
- 235000019197 fats Nutrition 0.000 description 3
- 229920002689 polyvinyl acetate Polymers 0.000 description 3
- 239000011118 polyvinyl acetate Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 159000000000 sodium salts Chemical class 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 150000008163 sugars Chemical class 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 239000003643 water by type Substances 0.000 description 3
- LVDKZNITIUWNER-UHFFFAOYSA-N Bronopol Chemical compound OCC(Br)(CO)[N+]([O-])=O LVDKZNITIUWNER-UHFFFAOYSA-N 0.000 description 2
- SRBFZHDQGSBBOR-IOVATXLUSA-N D-xylopyranose Chemical compound O[C@@H]1COC(O)[C@H](O)[C@H]1O SRBFZHDQGSBBOR-IOVATXLUSA-N 0.000 description 2
- 229930091371 Fructose Natural products 0.000 description 2
- 239000005715 Fructose Substances 0.000 description 2
- RFSUNEUAIZKAJO-ARQDHWQXSA-N Fructose Chemical compound OC[C@H]1O[C@](O)(CO)[C@@H](O)[C@@H]1O RFSUNEUAIZKAJO-ARQDHWQXSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 2
- 229930006000 Sucrose Natural products 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000003619 algicide Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910052910 alkali metal silicate Inorganic materials 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 150000004996 alkyl benzenes Chemical class 0.000 description 2
- WQZGKKKJIJFFOK-PHYPRBDBSA-N alpha-D-galactose Chemical compound OC[C@H]1O[C@H](O)[C@H](O)[C@@H](O)[C@H]1O WQZGKKKJIJFFOK-PHYPRBDBSA-N 0.000 description 2
- PYMYPHUHKUWMLA-WDCZJNDASA-N arabinose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)C=O PYMYPHUHKUWMLA-WDCZJNDASA-N 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000003849 aromatic solvent Substances 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000011067 equilibration Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229930182830 galactose Natural products 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
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- JPMIIZHYYWMHDT-UHFFFAOYSA-N octhilinone Chemical compound CCCCCCCCN1SC=CC1=O JPMIIZHYYWMHDT-UHFFFAOYSA-N 0.000 description 2
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- 230000002335 preservative effect Effects 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 229920005573 silicon-containing polymer Polymers 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
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- 238000010998 test method Methods 0.000 description 2
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- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
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- 125000004343 1-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])(*)C([H])([H])[H] 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- CTIFKKWVNGEOBU-UHFFFAOYSA-N 2-hexadecylbenzenesulfonic acid Chemical class CCCCCCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O CTIFKKWVNGEOBU-UHFFFAOYSA-N 0.000 description 1
- 229940100555 2-methyl-4-isothiazolin-3-one Drugs 0.000 description 1
- NMSKTCFOZXKENS-UHFFFAOYSA-N 2-methylbutan-2-yl 3,5,5-trimethylhexaneperoxoate Chemical compound CCC(C)(C)OOC(=O)CC(C)CC(C)(C)C NMSKTCFOZXKENS-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
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- 230000007423 decrease Effects 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- SPCNPOWOBZQWJK-UHFFFAOYSA-N dimethoxy-(2-propan-2-ylsulfanylethylsulfanyl)-sulfanylidene-$l^{5}-phosphane Chemical compound COP(=S)(OC)SCCSC(C)C SPCNPOWOBZQWJK-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Natural products C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- SMVRDGHCVNAOIN-UHFFFAOYSA-L disodium;1-dodecoxydodecane;sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O.CCCCCCCCCCCCOCCCCCCCCCCCC SMVRDGHCVNAOIN-UHFFFAOYSA-L 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- ZSWFCLXCOIISFI-UHFFFAOYSA-N endo-cyclopentadiene Natural products C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 125000005908 glyceryl ester group Chemical group 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000008240 homogeneous mixture Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000002951 idosyl group Chemical class C1([C@@H](O)[C@H](O)[C@@H](O)[C@H](O1)CO)* 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- BEGLCMHJXHIJLR-UHFFFAOYSA-N methylisothiazolinone Chemical compound CN1SC=CC1=O BEGLCMHJXHIJLR-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 150000002772 monosaccharides Chemical class 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- PSZYNBSKGUBXEH-UHFFFAOYSA-N naphthalene-1-sulfonic acid Chemical compound C1=CC=C2C(S(=O)(=O)O)=CC=CC2=C1 PSZYNBSKGUBXEH-UHFFFAOYSA-N 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000012488 sample solution Substances 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 235000019333 sodium laurylsulphate Nutrition 0.000 description 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 1
- 229910052911 sodium silicate Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 150000003460 sulfonic acids Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 235000020681 well water Nutrition 0.000 description 1
- 239000002349 well water Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/02—Polysilicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
- C09J183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/10—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/01—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/02—Polysilicates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/02—Polysilicates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/31—Applications of adhesives in processes or use of adhesives in the form of films or foils as a masking tape for painting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
Definitions
- This invention relates to an aqueous dispersion of a silicone pressure sensitive adhesive base and method for its preparation.
- the aqueous dispersion can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive with good optical properties, high adhesion, and that leaves no or low residue after removal from stainless steel substrates after exposure to high temperatures.
- Silicone pressure sensitive adhesives are widely applied in a variety of large and fast-growing applications, including general purpose masking tapes/labels and protective films, in which super wetting to a substrate, stable adhesion after aging, and high/low temperature stability are desired properties.
- Conventional silicone pressure sensitive adhesives (Si PSAs) are delivered in solvent, such as benzene, toluene, ethyl benzene, xylene, or combinations thereof (BTEX) , which will result in relatively high volatile organic compound (VOC) emission when the Si PSAs are applied to substrates, dried, and cured.
- solvent borne Si PSAs are facing growing challenges, while waterborne Si PSAs, which contain low or no amounts of solvents, are becoming more attractive to customers.
- U.S. Patent 10,077,387 to Ding et al. discloses an emulsion type silicone pressure sensitive adhesive composition and a process for the production thereof.
- an aromatic solvent which is a VOC, is used as a dilute agent in this composition and process, and this Si PSA may have inadequate heat resistance for certain applications.
- An aqueous dispersion of a silicone pressure sensitive adhesive base comprises: a bis-hydroxyl-terminated polydiorganosiloxane, a polyorganosilicate resin, cumene, an alkyl polyglycoside surfactant, and water.
- the base may be combined with a curing agent comprising a peroxide or an aminosilane to form an aqueous dispersion of a silicone pressure sensitive adhesive composition (composition) .
- composition is curable to form a silicone pressure sensitive adhesive.
- the aqueous dispersion of the silicone pressure sensitive adhesive base (base) introduced above comprises: (A) the bis-hydroxyl-terminated polydiorganosiloxane, which may comprise (A1) a bis-hydroxyl-terminated polydiorganosiloxane gum (gum) , (A2) a bis-hydroxyl-terminated polydiorganosiloxane polymer (polymer) , or (A3) a combination of both the gum and the polymer; (B) the polyorganosilicate resin, which may comprise (B1) a capped resin, (B2) an uncapped resin, or (B3) a combination of both the capped resin and the uncapped resin; (C) cumene; (D) the surfactant, which comprises (D1) the alkyl polyglycoside surfactant, and may optionally further comprise (D2) a cosurfactant; and (E) water.
- the bis-hydroxyl-terminated polydiorganosiloxane which may comprise (A
- Starting material (A) in the base is the bis-hydroxyl-terminated polydiorganosiloxane.
- starting material (A) may comprise (A1) the gum, (A2) the polymer, or (A3) the combination of both the gum and the polymer.
- the amount of starting material (A) in the base depends on various factors including the species selected for (A1) the gum and/or (A2) the polymer, and the types and amounts of other starting materials in the base, however, the amount of starting material (A) may be 25 weight parts to 45 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the amount of starting material (A) in the base may be at least 25, alternatively at least 26, alternatively at least 27, alternatively at least 28, alternatively at least 29, alternatively at least 30, alternatively at least 31, and alternatively at least 32 weight parts; while at the same time the amount may be up to 45, alternatively up to 44, alternatively up to 43, alternatively up to 42, alternatively up to 41, alternatively up to 40, alternatively up to 39, and alternatively up to 38 weight parts, on the same basis.
- the gum may have formula: where each R 1 is an independently selected monovalent hydrocarbon group; and subscript a has a value sufficient to give the gum a plasticity of 20 mil (0.51 mm) to 80 mil (2.03 mm) , alternatively 30 mil (0.76 mm) to 70 mil (1.78 mm) , and alternatively 50 mil (1.27 mm) to 65 mil (1.65 mm) , where plasticity is measured based on ASTM D926 by applying 1 kg load to a spherical sample of 4.2 g in weight for 3 minutes at 25 °C and the results are measured in thousandths of an inch (mil) .
- Each R 1 is an independently selected monovalent hydrocarbon group.
- the monovalent hydrocarbon group may have 1 to 18 carbon atoms.
- the monovalent hydrocarbon group may be free of aliphatic unsaturation.
- each R 1 may have 1 to 12 carbon atoms, and alternatively 1 to 6 carbon atoms.
- Suitable monovalent hydrocarbon groups for R 1 are exemplified by alkyl groups and aromatic groups such as aryl groups and aralkyl groups.
- Alkyl is exemplified by, but not limited to, methyl, ethyl, propyl (e.g., iso-propyl and/or n-propyl) , butyl (e.g., isobutyl, n-butyl, tert-butyl, and/or sec-butyl) , pentyl (e.g., isopentyl, neopentyl, and/or tert-pentyl) , hexyl, heptyl, octyl, nonyl, and decyl, and branched alkyl groups of 6 or more carbon atoms; and cyclic alkyl groups such as cyclopentyl and cyclohexyl.
- propyl e.g., iso-propyl and/or n-propyl
- butyl e.g., isobutyl, n-butyl, ter
- Aryl is exemplified by, but not limited to, cyclopentadienyl, phenyl, tolyl, xylyl, anthracenyl, benzyl, 1-phenylethyl, 2-phenylethyl, and naphthyl.
- each R 1 may be independently selected from the group consisting of alkyl and aryl.
- each R 1 may be independently selected from methyl and phenyl.
- each R 1 may be alkyl.
- each R 1 may be methyl.
- Bis-hydroxyl-terminated polydiorganosiloxane gums suitable for use as starting material (A1) are known in the art and may be prepared by methods such as hydrolysis and condensation of the corresponding organohalosilanes or equilibration of cyclic polydiorganosiloxanes.
- suitable hydroxyl-terminated polydiorganosiloxane gum for use as starting material (A1) in the base are exemplified by:
- starting material (A1) comprise bis-hydroxyl-terminated polydimethylsiloxane.
- Starting material (A1) the bis-hydroxyl-terminated polydiorganosiloxane gum, may be present in the base in an amount of 10 weight parts to 20 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the gum may be present in an amount of at least 10, alternatively at least 11, alternatively at least 12, alternatively at least 13, alternatively at least 14, and alternatively at least 15, weight parts; while at the same time the amount may be up to 20, alternatively up to 19, alternatively up to 18 weight parts, alternatively up to 17 weight parts, and alternatively up to 16 weight parts, on the same basis.
- Starting material (A) of the base may further comprise (A2) the a bis-hydroxyl-terminated polydiorganosiloxane polymer (polymer) , introduced above.
- the polymer may have formula:
- Subscript b has a value sufficient to give the polymer a viscosity ⁇ 100,000 cst measured as described in the test method, below.
- subscript b may have a value sufficient to give the polymer a viscosity of 10,000 cst to 100,000 cst; alternatively 20,000 cst to 95,000 cst; alternatively 30,000 cst to 90,000 cst; alternatively 40,000 cst to 85,000 cst; and alternatively 50,000 cst to 80,000 cst.
- Polymers suitable for use in the base are known in the art and may be prepared by methods such as hydrolysis and condensation of the corresponding organohalosilanes or equilibration of cyclic polydiorganosiloxanes.
- Suitable polymers for use as starting material H) are exemplified by:
- the polymer may be selected from the group consisting of i) , ii) , and iii) .
- the polymer may be i) .
- Starting material (A2) the bis-hydroxyl terminated polydiorganosiloxane polymer, may be present in the base in an amount of 15 to 25 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the polymer may be present in an amount of at least 15, alternatively at least 16, alternatively at least 17, alternatively at least 18, alternatively at least 19, and alternatively at least 20, weight parts; while at the same time the amount may be up to 25, alternatively up to 24, alternatively up to 23 weight parts, alternatively up to 22 weight parts, and alternatively up to 21 weight parts, on the same basis.
- starting materials (A1) and (A2) are exemplary and not limiting.
- starting materials (A1) and (A2) may be present in the base in amounts sufficient to provide a weight ratio (A1) / (A2) (Gum/Polymer ratio) of 0.1/1 to 1/1, alternatively 0.67/1 to 1/1.
- the polyorganosilicate resin comprises monofunctional units of formula R M 3 SiO 1/2 and tetrafunctional units ( “Q” units) of formula SiO 4/2 , where each R M is an independently selected monovalent hydrocarbon group, as described above for R 1 . Alternatively, at least one-third, alternatively at least two thirds of the R M groups are methyl groups. Alternatively, the monofunctional units may be exemplified by (Me 3 SiO 1/2 ) and (Me 2 PhSiO 1/2 ) ; alternatively the monofunctional units may be selected from the group consisting of (Me 3 SiO 1/2 ) and (Me 2 PhSiO 1/2 ) .
- the polyorganosilicate resin is typically produced in an aromatic solvent (e.g., BTEX) because the resin is solid at room temperature (RT) . However, the solvent can then subsequently removed such that the resin typically has a powder or flake form.
- an aromatic solvent e.g., BTEX
- the polyorganosilicate resin When prepared, the polyorganosilicate resin comprises the monofunctional and tetrafunctional units described above, and the polyorganosilicate resin further comprises units with silanol (silicon bonded hydroxyl) groups and may comprise neopentamer of formula Si(OSiR M 3 ) 4 , where R M is as described above.
- Si 29 Nuclear Magnetic Resonance (NMR) spectroscopy as described in U.S. Patent 9,593,209 at col.
- Reference Example 2 may be used to measure molar ratio of M and Q units, where said ratio is expressed as ⁇ M (resin) + (M (neopentamer) ⁇ / ⁇ Q (resin) +Q (neopentamer) ⁇ and represents the molar ratio of the total number of triorganosiloxy groups (M units) of the resinous and neopentamer portions of the polyorganosilicate resin to the total number of silicate groups (Q units) in the resinous and neopentamer portions.
- the Mn of the polyorganosilicate resin depends on various factors including the types of monovalent hydrocarbon groups represented by R M that are present.
- the Mn of the polyorganosilicate resin refers to the number average molecular weight measured using GPC according to the procedure in U.S. Patent 9,593,209 at col. 31, Reference Example 1, when the peak representing the neopentamer is excluded from the measurement.
- the Mn of the polyorganosilicate resin may be at least 1,500 g/mol. At the same time, the Mn of the polyorganosilicate may be up to 15,000 g/mol. Alternatively, Mn of the polyorganosilicate resin may be > 3,000 g/mol to 8,000 g/mol. Alternatively, Mn of the Resin may be 2,000 g/mol to 8,000 g/mol, alternatively 2,900 g/mol to 6,000 g/mol, and alternatively 2,900 to 5,000 g/mol.
- the polyorganosilicate resin can be prepared by any suitable method, such as cohydrolysis of the corresponding silanes or by silica hydrosol capping methods.
- the polyorganosilicate resin may be prepared by silica hydrosol capping processes such as those disclosed in U.S. Patent 2,676,182 to Daudt, et al.; U.S. Patent 4,611,042 to Rivers-Farrell et al.; and U.S. Patent 4,774,310 to Butler, et al. The method of Daudt, et al.
- a silica hydrosol under acidic conditions with a hydrolyzable triorganosilane such as trimethylchlorosilane, a siloxane such as hexamethyldisiloxane, or mixtures thereof, and recovering a copolymer having monofunctional units and tetrafunctional units.
- the resulting copolymers generally contain from 2 to 5 percent by weight of hydroxyl groups.
- the intermediates used to prepare the polyorganosilicate resin may be triorganosilanes and silanes with four hydrolyzable substituents or alkali metal silicates.
- the triorganosilanes may have formula R M 3 SiX 1 , where R M is as described above and X 1 represents a hydrolyzable substituent.
- Silanes with four hydrolyzable substituents may have formula SiX 2 4 , where each X 2 is halogen, alkoxy or hydroxyl.
- Suitable alkali metal silicates include sodium silicate.
- the polyorganosilicate resin prepared as described above is uncapped and typically contains silicon bonded hydroxyl groups, e.g., of formulae, HOSi 3/2 and/or (HO) x R M (3- x) SiO 1/2 , where subscript x is 1, 2, or 3.
- the polyorganosilicate resin may comprise up to 2%of silicon bonded hydroxyl groups.
- the concentration of silicon bonded hydroxyl groups present in the polyorganosilicate resin may be determined using FTIR spectroscopy according to ASTM Standard E-168-16.
- the silicon bonded hydroxyl groups formed during preparation of the polyorganosilicate resin can be converted to trihydrocarbyl-siloxane groups or to a different hydrolyzable group by a process known as capping, e.g., reacting the polyorganosilicate resin with a silane, disiloxane, or disilazane containing the appropriate terminal group.
- Silanes containing hydrolyzable groups may be added in molar excess of the quantity required to react with the silicon bonded hydroxyl groups on the polyorganosilicate resin, thereby forming a capped resin.
- One or more polyorganosilicate resins may be combined and used in the base herein.
- an uncapped resin having a relatively high amount of hydroxyl groups may be used in combination with a capped resin having al lower amount of hydroxyl groups than the uncapped resin.
- the resin or resins used may be capped.
- the polyorganosilicate resin may comprise (B1) a capped resin as described above and (B2) an uncapped resin as described above.
- the capped resin may have unit formula: (R M 3 SiO 1/2 ) z (SiO 4/2 ) o X 2 p , where R M and X 2 are as described above, and subscripts z and o have values such that o > 1, and subscript z > 4, a quantity (o + z) has a value sufficient to give the capped resin the Mn described above (e.g., 1,500 g/mol to 5,000 g/mol, alternatively 2,000 g/mol to 5,000 g/mol, alternatively 2,500 g/mol to 4,900 g/mol, and alternatively 2,500 g/mol to 4,700 g/mol, and alternatively 2,900 g/mol to 4,700 g/mol) , and subscript p has a value sufficient to give the capped resin a hydrolyzable group content as described above (e.g
- the uncapped resin may have unit formula (R M 3 SiO 1/2 ) z’ (SiO 4/2 ) o’ X 2 p’ , where R M and X 2 are as described above and subscripts z’ and o’ have values such that o’ > 1, and subscript z’ > 4, a quantity (o’ + z’) has a value sufficient to give the capped resin the Mn described above (e.g., 1,500 g/mol to 5,000 g/mol, alternatively 2,000 g/mol to 5,000 g/mol, alternatively 2,500 g/mol to 4,900 g/mol, and alternatively 2,500 g/mol to 4,700 g/mol, and alternatively 2,700 g/mol to 4,700 g/mol) , and subscript p’ has a value sufficient to give the uncapped resin a hydrolyzable group content as described above (e.g., ⁇ 2%to 10%) .
- Suitable polyorganosilicate resins for use in the base are known in the art and are commercially available.
- flake resins sold with tradename DOWSIL TM are commercially available from DSC.
- the amount of polyorganosilicate resin in the base depends on various factors including the species of resin selected and the types and amounts of other starting materials in the base, however, the amount of (B) the polyorganosilicate resin may be 40 weight parts to 55 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the amounts of (B) the polyorganosilicate resin and (A) the bis-hydroxyl-terminated polydiorganosiloxane may be sufficient to provide a weight ratio of (B) polyorganosilicate resin to (A) bis-hydroxyl-terminated polydiorganosiloxane ratio [ (B) / (A) ratio] of 1/1 to 1.5/1, alternatively 1.4/1 to 1.5/1.
- the amount of (B1) the capped resin may be 30 weight parts to 40 weight parts, per 100 parts by weight of starting materials (A) , (B) , (C) , and (D) combined; and the amount of (B2) the uncapped resin may be 10 weight parts to 15 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the amount of (B1) the capped resin may be at least 30, alternatively at least 31, alternatively at least 32, alternatively at least 33, alternatively at least 34, and alternatively at least 35 weight parts; while at the same time the amount may be up to 40, alternatively up to 39, alternatively up to 38, alternatively up to 37, and alternatively up to 36 weight parts on the same basis.
- the amount of (B2) the uncapped resin may be at least 10, alternatively at least 11, alternatively at least 12, alternatively at least 13, alternatively at least 14, and alternatively at least 15 weight parts; while at the same time the amount may be up to 20, alternatively up to 19, alternatively up to 18, alternatively up to 17, and alternatively up to 16 weight parts on the same basis.
- the cumene is present in the base in an amount of 1 weight part to 20 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the amount of cumene may be 5 weight parts to 15 weight parts, on the same basis.
- the cumene may be present in the base in an amount of at least 1 weight part, alternatively at least 3 weight parts, alternatively at least 5 weight parts, alternatively at least 7 weight parts, alternatively at least 9 weight parts, alternatively at least 10 weight parts, alternatively at least 11 weight parts, and alternatively at least 12 weight parts; while at the same time, the amount may be up to 20 weight parts, alternatively up to 18 weight parts, alternatively up to 16 weight parts, alternatively up to 15 weight parts, alternatively up to 14 weight parts, and alternatively up to 12 weight parts, on the same bases described above.
- the base described herein may be free of volatile organic compounds that have flash point ⁇ 28 °C, which may be undesirable to customers/end users of the base and the silicone pressure sensitive adhesive composition described herein.
- volatile organic compounds include volatile hydrocarbons (e.g., volatile aliphatic hydrocarbons such as heptane and volatile aromatic hydrocarbons, such as benzene, ethyl benzene, toluene, and xylene) .
- volatile hydrocarbons e.g., volatile aliphatic hydrocarbons such as heptane and volatile aromatic hydrocarbons, such as benzene, ethyl benzene, toluene, and xylene
- cumene has a flash point of 43.9 °C, which is higher than that of the volatile organic compounds described above, and, therefore cumene is not a volatile organic compound with flash point ⁇ 28 °C.
- Free of volatile organic compounds with flash point ⁇ 28 °C means that volatile organic compounds (as described above) are not intentionally added to the base, and are either not present in the base or, if introduced as an impurity in a starting material (e.g., the polyorganosilicate resin) , they are not present in an amount that detrimentally affects performance of a silicone pressure sensitive adhesive prepared by curing a silicone pressure sensitive adhesive composition made with the base and the curing agent, described below.
- Starting material (D) in the base described above is a surfactant.
- Starting material (D) comprises (D1) the alkyl polyglycoside surfactant, and starting material (D) may optionally further comprise (D2) a cosurfactant.
- Starting material (D) may be one surfactant or a combination of two or more surfactants.
- one (D1) polyglycoside surfactant may be used.
- two or more (D1) alkyl polyglycosides that differ in at least one property e.g., molecular weight
- Alkyl polyglycosides are surfactants derived from sugars or starches and fatty alchohols.
- Alkylpolyglucosides are a class of alkylpolyglycoside derived from glucose.
- Alkyl polyglycosides may have general formula R 2 O- (R 3 O) c - (Z) d , where R 2 is an alkyl group, each R 3 is an independently selected alkylene group of 2 to 4 carbon atoms, Z is a sugar moiety (e.g., glucose moiety) , subscript c is 0 to 10, and subscript x denotes the number of sugar units, per molecule.
- the alkyl polyglycoside may contain only one specific alkyl radical R 2 .
- the alkyl groups, R 2 may be mixtures corresponding to the initial fats or oils compounds or corresponding to the particular processing of those fats and/or oils.
- the alkyl polyglycosied may be an alkyl polyglucoside in which each R 2 may comprise substantially C 8 and C 10 alkyl groups; substantially C 12 and C 14 alkyl groups; substantially C 8 to C 16 alkyl groups; or substantially C 12 to C 16 alkyl groups.
- R 3 may be a linear or branched alkylene group. Alternatively, R 3 may be linear. Alternatively, R 3 may be selected from the group consisting of ethyelene and propylene.
- sugar moiety Z Any mono-or oligosaccharides can be used as the sugar moiety Z.
- sugars having 5 or 6 carbon atoms in the sugar moiety Z, as well as the corresponding oligosaccharides, may be used.
- Such sugars are, for example, glucose, fructose, galactose, arabinose, ribose, xylose, lyxose, allose, altrose, mannose, gulose, idose, talose, and sucrose.
- the sugar moiety Z may be derived from glucose, fructose, galactose, arabinose, and sucrose.
- the sugar moiety Z may be derived from glucose.
- alkyl polyglycosides useful herein may contain on average 1 to 6 sugar units, per molecule (where subscript d has an average value of 1 to 6) .
- subscript d may have an average value of 1.1 5o 5, alternatively 1.1 to 2.0.
- subscript d may be 1.1 to 1.8.
- alkoxylated homologs of the aforesaid alkyl polyglycosides can also be used according to the present invention. These homologs can contain, on average, up to 10 ethylene oxide and/or propylene oxide units per alkyl glycoside unit.
- Alkyl polyglycosides such as alkyl polyglucosides
- Alkyl polyglycosides are known in the art, for example, see Published Patent Application WO 2004/073665 A1.
- Alkyl polyglycosides, such as alkyl polyglucosides are commercially available.
- a C9-C11 alkyl oligomeric d-glucopyranoside is commercially available as Green APG IC911 from Shanghai Fine Chemical Co. LTD of China.
- Other alkyl polyglucosides are known in the art and are commercially available, e.g., under the tradename TRITON TM BG and TRITON TM CG Alkyl Polyglucoside Surfactants from TDCC.
- Starting material (D2) is an optional cosurfactant that differs from (D1) the alkyl polyglycoside described above.
- the cosurfactant may be an anionic surfactant, such as a salt of an alkyl alkoxylate sulfate.
- the cosurfactant may be a nonionic surfactant, such as a polyvinyl alcohol compound.
- the anionic surfactants useful herein include (i) sulfonic acids and their salt derivatives, including alkyl, aralkyl, alkyl naphthalene, alkyl diphenyl ether sulfonic acids, and their salts, having at least 6 carbon atoms in the alkyl substituent, such as dodecyl benzene sulfonic acid, and its sodium salt or its amine salt; (ii) alkyl sulfates having at least 6 carbon atoms in the alkyl substituent, such as sodium lauryl sulfate; (iii) the sulfate esters of polyoxyethylene monoalkyl ethers; (iv) long chain carboxylic acid surfactants, such as lauric acid, steric acid, oleic acid, and their alkali metal and amine salts.
- sulfonic acids and their salt derivatives including alkyl, aralkyl, alkyl naphthalene,
- anionic surfactants are sulfonated glyceryl esters of fatty acids such as sulfonated monoglycerides of coconut oil acids; salts of sulfonated monovalent alcohol esters such as sodium oleyl isothionate; ; sulfonated aromatic hydrocarbons such as sodium alpha-naphthalene monosulfonate; ; alkali metal alkyl sulfates; ether sulfates having alkyl groups of eight or more carbon atoms such as sodium lauryl ether sulfate; and alkylaryl sulfonates having one or more alkyl groups of eight or more carbon atoms such as neutral salts of hexadecylbenzene sulfonic acid and C20 alkylbenzene sulfonic acid.
- anionic surfactants which can be used include the sodium salt of dodecyl benzene sulfonic acid sold under the trademark SIPONATE TM DS-10 by Alcolac Inc., Baltimore, Maryland; sodium salt of alkyl alkoxylate sulfate sold under the trademark DOWFAX TM AS-801 by The Dow Chemical Company of Midland, Michigan, USA; ; and linear alkyl benzene sulfonic acids sold under the trademark BIO-SOFT TM S-100 by the Stepan Company, Northfield, Illinois. Compositions of the latter type such as dodecyl benzene sulfonic acid, although a catalyst as noted above, can also function as the anionic surfactant when neutralized.
- Other suitable surfactants include sodium alkyl sulfonate such as HOSTAPUR TM SAS-30,
- the amount of the anionic surfactant depends on various factors, including the selection and amount of starting material (D1) , the alkyl polyglycoside surfactant, that is present, however the amount of anionic surfactant may be 0 to 5%, alternatively 0 to 3%, based on weight of silicone polymer and resins.
- Polyvinyl alcohol compounds suitable for use as the cosurfactant herein are known in the art and are disclosed, for example in U.S. Patent Application Publication 20007/0099007 at paragraphs [0172] and [0173] .
- Polyvinyl alcohol compounds may be made by saponification of polyvinylacetate, so up to 15%of polyvinylacetate may remain in the polyvinyl alcohol compound used herein.
- the polyvinyl alcohol compound may be 80%to 98%polyvinyl alcohol (with the balance being 20%to 2%polyvinylacetate) .
- the polyvinyl alcohol compound may have a minimum viscosity of 5 cP at 4 %aqueous solution at 20 °C.
- Polyvinyl alcohol is commercially available, e.g., GOHSENOL GH-17 from Nippon Gohsei.
- the amount of the polyvinyl alcohol compound depends on various factors, including the selection and amount of starting material (D1) , the alkyl polyglycoside surfactant, that is present, however the amount of polyvinyl alcohol may be 0 to 5%, alternatively 0 to 3%, based on weight of silicone polymer and resins.
- the amount of (D) the surfactant in the base depends on various factors including the species and amounts of starting materials (A) and (B) , and whether a cosurfactant is present.
- the amount of (D) the surfactant may be 2 weight parts to 15 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the amount of (D1) the alkyl polyglycoside surfactant may be 2 weight parts to 10 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the amount of (D1) the alkyl polyglycoside surfactant may be at least 2, alternatively at least 3, and alternatively at least 4, weight parts; while at the same time the amount may be up to 10, alternatively up to 8, alternatively up to 6 weight parts, on the same basis.
- the amount of (D2) the cosurfactant may be 0 to 5 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the amount of (D2) the cosurfactant may be at least 0.1 weight part, alternatively at least 0.2 weight part, alternatively at least 0.3 weight part, and alternatively at least 0.4 weight part; while at the same time the amount may be up to 5 weight parts, alternatively up to 3 weight parts, alternatively up to 1 weight part, and alternatively up to 0.5 weight part, on the same basis.
- Starting material (E) in the base is water.
- the water is not generally limited, and may be utilized neat (i.e., absent any carrier vehicles/solvents) , and/or pure (i.e., free from or substantially free from minerals and/or other impurities) .
- the water may be processed or unprocessed before being added to the base described above. Examples of processes that may be used for purifying the water include distilling, filtering, deionizing, and combinations of two or more thereof, such that the water may be deionized, distilled, and/or filtered.
- the water may be unprocessed (e.g. may be tap water, i.e., provided by a municipal water system or well water, used without further purification) .
- the water may be utilized in any amount and the exact amount may be selected by one of skill in the art, depending on various factors, e.g., the equipment to be used for preparing the base and the scale.
- the amount of water may be 30 weight parts to 80 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the amount of water may be higher than 80 weight parts, for example, if the base is further diluted before use, depending on the end use application.
- the amount of water may be lower than 30 weight parts, if less than 30 weight parts is sufficient to form the aqueous dispersion.
- the base described above may optionally further comprise starting material (F) , a biocide.
- a biocide Biocides are known in the art and are commercially available.
- the biocide may be a preservative such as BIOBAN TM products ) or KATHON TM products, which is an aqueous preservative comprising 5-chloro-2-methyl-4-isothiazolin-3-one and 2-methyl-4-isothiazolin-3-one.
- the biocide may comprise an algicide, such as KLARIX TM algicides, e.g., . BIOBAN TM , KATHON TM , KLARIX TM and other biocides are commercially available from The Dow Chemical Company of Midland, Michigan, USA.
- the biocide may be added in an amount of 0 to 5 weight parts, alternatively 0.1 weight part to 5 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- the base described above can be prepared by a method comprising:
- the method may further comprise 3) adding an additional starting material, as described above, in step 1) and/or step 2) .
- the method may further comprise 4) diluting the base with additional water.
- Steps 1) and 2) may be performed by any convenient means, such as mixing at RT or elevated temperature, in batch, semi-batch, or continuous equipment.
- Mixing in step may occur, for example using, batch mixing equipment with medium/low shear such as change-can mixers, double-planetary mixers, conical-screw mixers, ribbon blenders, double-arm or sigma-blade mixers.
- batch equipment with high-shear and/or high-speed dispersers can be used in step 1) and/or step 2) , and these include equipment such as that made by Charles Ross & Sons (NY) , Hockmeyer Equipment Corp.
- NJ batch mixing equipment
- Speedmixer TM batch mixing equipment
- batch equipment with high shear actions include Banbury-type (CW Brabender Instruments Inc., NJ) and Henschel type (Henschel mixers America, TX) .
- Illustrative examples of continuous mixers/compounders include extruders single-screw, twin-screw, and multi-screw extruders, co-rotating extruders, such as those manufactured by Krupp Werner & Pfleiderer Corp (Ramsey, NJ) , and Leistritz (NJ) ; extruders such as twin-screw counter-rotating extruders, two-stage extruders, twin-rotor continuous mixers, dynamic or static mixers or combinations of these equipment.
- the base prepared as described herein may form an oil in water (o/w) type dispersion, i.e., the dispersion comprises an oil phase dispersed in an aqueous phase.
- the oil phase will comprise (A) the bis-hydroxyl-terminated polydiorganosiloxane, (B) the polyorganosilicate resin, (C) the cumene, and (D) the surfactant.
- the starting materials may be combined concurrently in step 2) , or aliquots of one or more starting materials may be added. For example, water may be added in one or more aliquots during step 2) , and when more than one aliquot is used, the method may comprise mixing between additions.
- One skilled in the art would be able to select portions of the starting materials for combining, depending on the selection of the quantity used and the specific mixing techniques utilized to combine the starting materials.
- the method may optionally further comprise 5) devolatilizing the base.
- Devolatilizing may be performed by any convenient means, such as heating the base under vacuum. Devolatilizing may be performed during water addition or before addition of the last aliquot of water to compensate for any water which may be removed during devolatilization. Devolatilizing may be performed, for example, with a devolatilizing extruder.
- the base prepared as described above may be used to make the silicone pressure sensitive adhesive composition by a method comprising: combining (I) the base with (II) a curing agent.
- the curing agent may be a (II-1) a peroxide compound or (II-2) an aminosilane.
- the peroxide compound is selected depending on various factors, including the species and amount of (A) the bis-hydroxyl-terminated polydiorganosiloxane used in (I) the base. Without wishing to be bound by theory, it is thought that the mechanism of a peroxide curing system is that the peroxide forms a radical to extract a hydrogen from an R 1 group, such as a methyl group, of (A) the bis-hydroxyl-terminated polydiorganosiloxane described above, and generates an active silicon-carbon radical. Subsequently, the resulting intermediate undergoes a cross-linking reaction to finish the curing process. Phenyl and primary carbon free radicals can cure the silicone pressure sensitive adhesive composition described herein.
- the peroxide compound may be selected from the group consisting of benzoyl peroxide (BPO) , 2, 4-dichlorobenzoyl peroxide, dilauroyl peroxide, tert-pentyl 3, 5, 5-trimethylhexaneperoxoate, and a combination thereof.
- BPO benzoyl peroxide
- the peroxide compound may be benzoyl peroxide.
- Suitable peroxide compounds are commercially available, for example, aqueous peroxide compositions are available under the tradename LUPEROX TM from Sigma-Aldrich, Inc. of St. Louis, Missouri, USA.
- the amount of the peroxide compound depends on various factors including the species of peroxide compound selected and the species and amounts of the starting materials in the base, however, the amount of the peroxide compound may be 0.5 weight part to 6 weight part, per 100 parts by weight of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amount of peroxide compound may be at least 0.5, alternatively at least 0.6, alternatively at least 0.7, alternatively at least 0.75 weight parts; while at the same time the amount of peroxide compound may be up to 6, alternatively up to 3, alternatively up to 1, alternatively up to 0.8 weight part, on the same basis.
- the (II) curing agent may comprise (II-2) an aminosilane such as the aminosilane disclosed in U.S. Pat. No. 4,906,695 to Blizzard et al.
- the aminosilane may have general formula: where R” represents a divalent hydrocarbon group of 2 to 4 carbon atoms such as ethylene, trimethylene, or tetramethylene; R”’ is a divalent hydrocarbon group having 3 to 6 carbon atoms such as trimethylene, tetramethylene, methyltrimethylene, pentamethylene and hexamethylene; subscript n is 0, 1, or 2, subscript p is 0 or 1, R”” is a hydrocarbyl group such as alkyl (e.g., methyl, ethyl, propyl, butyl, or phenyl) or aryl (e.g., phenyl) , and X is a hydrolyzable moiety, which may be an alkoxy group (e.g.,
- Suitable aminosilanes include, for example, N-gamma-aminopropyltriethoxysilane, N-beta-aminoethyl-gamma-aminoisobutyltrimethoxysilane, and N-beta-aminoethyl-gammaaminopropyltrimethoxysilane.
- Suitable aminosilanes are commercially available. For example, XIAMETER TM OFS-6020 Silane and DOWSIL TM Z-6026 Silane are available from DSC.
- the amount of (II-2) the aminosilane depends on various factors including the species of aminosilane selected and the species and amounts of the starting materials in the base, however, the amount of the aminosilane may be 0.1 weight part to 6 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) , combined. Alternatively, the amount of the aminosilane may be at least 0.1, alternatively at least 0.2, and alternatively at least 0.25 weight parts; while at the same time the amount of peroxide compound may be up to 6, alternatively up to 3, alternatively up to 0.6, alternatively up to 0.5, alternatively up to 0.4 weight parts, on the same basis.
- composition silicone pressure sensitive adhesive composition
- the techniques and apparatus as described above may be used to combine the base and the curing agent to form the silicone pressure sensitive adhesive composition (composition) .
- the composition may be performed by mixing at RT.
- composition prepared as described above may be used to form an adhesive article, e.g., a silicone pressure sensitive adhesive prepared by a method comprising:
- Treating the surface of the substrate is optional and may be performed by any convenient means, such as cleaning the substrate, e.g., by washing with an alcohol, such as isopropanol, plasma treatment, corona discharge treatment, etching, and/or applying a primer.
- an alcohol such as isopropanol
- plasma treatment corona discharge treatment
- etching etching
- primer a primer
- Applying the curable silicone pressure sensitive adhesive emulsion to the substrate can be performed by any convenient means.
- the curable silicone pressure sensitive adhesive emulsion may be applied onto a substrate by gravure coater, comma coater, offset coater, offset-gravure coater, roller coater, reverse-roller coater, air-knife coater, or curtain coater.
- the substrate can be any material that can withstand the treatment conditions (described above) and curing conditions (described below) used to cure the silicone pressure sensitive adhesive composition to form the silicone pressure sensitive adhesive on the substrate.
- any substrate that can withstand heat treatment at a temperature equal to or greater than 180°C, alternatively 150°C is suitable.
- Examples of materials suitable for such substrates including polymeric films such as polyester, polyimide (PI) , polyetheretherketone (PEEK) , polyethylene naphthalate (PEN) , liquid-crystal polyarylate, polyamideimide (PAI) , polyether sulfide (PES) , polyethylene terephthalate (PET) , polycarbonate (PC) , thermoplastic polyurethane (TPU) , polyethylene (PE) , or polypropylene (PP) .
- the substrate may be glass.
- the thickness of the substrate is not critical, however, the thickness may be 5 ⁇ m to 300 ⁇ m, alternatively 50 ⁇ m to 250 ⁇ m, alternatively 100 ⁇ m to 300 ⁇ m, alternatively 100 ⁇ m, and alternatively 50 ⁇ m.
- the substrate may be selected from the group consisting of PET, TPU, PC, and glass.
- the substrate may be a polymeric substrate, such as PET.
- An adhesive article such as a film or tape may be prepared by applying the curable silicone pressure sensitive adhesive emulsion onto the substrate and curing, as described above.
- the method for preparing the adhesive article may further comprise removing the all, or a portion, of the water before and/or during curing, i.e., steps iii) and iv) of the method described above may be performed concurrently.
- Removing water may be performed by any convenient means, such as heating at a temperature that vaporizes the water without fully curing, e.g., heating at a temperature of 70°C to 90°C, alternatively 50°C to ⁇ 100°C, and alternatively 70°Cto 80°C for a time sufficient to remove all or a portion of the water (e.g., 30 seconds to 1 hour, alternatively 1 minute to 5 minutes) .
- Curing may be performed by heating at a temperature of 80°C to 200°C, alternatively 90°C to 180°C, alternatively 100°C to 180°C, and alternatively 110°C to 180°C for a time sufficient to cure (e.g., for 30 seconds to an hour, alternatively 1 min to 5 min) . Curing may be performed by placing the substrate in an oven.
- the amount of the composition to be applied to the substrate depends on the specific application, however, the amount may be sufficient such that after curing thickness of the silicone pressure sensitive adhesive may be 5 ⁇ m to 100 ⁇ m, and for protective film the thickness may be 5 ⁇ m to 50 ⁇ m, alternatively 10 ⁇ m to 40 ⁇ m, and alternatively 15 ⁇ m to 40 ⁇ m.
- the method described herein may optionally further comprise applying a removable release liner to the silicone pressure sensitive adhesive opposite the substrate, e.g., to protect the silicone pressure sensitive adhesive before use of the adhesive article.
- the adhesive article may be a protective film for use in a display device.
- the adhesive article may be an industrial tape.
- adhesive article may be useful in healthcare or personal care applications.
- Sample CE1 was prepared according to U.S. Patent 10,077,387, as follows: 8.5 parts of Gum 1 and 12.6 parts of Polymer 1 were mixed with 16.4 parts of Uncapped Resin 2 and 23.1 parts of Capped Resin 2 with (B) / (A) ratio of 1.4. The above was mixed with 6 parts of OCS to get a homogeneous mixture. Then 6 parts water was added with high shearing to form a thick O/W (oil in water) phase emulsion. 27.4 parts of water was added to dilute this emulsion to get the final aqueous dispersion of a silicone pressure sensitive adhesive base (base) . The average particle size of the base was 0.3-0.4 um.
- Sample CE2 an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of DIBK at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 °C for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min. Then 30.6g water was gradually added under stirring to prepare the base.
- Sample CE3 an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of DMM at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 °C for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min. Then 30.6g water was gradually added under stirring to prepare the base.
- Sample CE4 an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of heptane at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 °C for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min. Then 30.6g water was gradually added under stirring to prepare the base.
- Sample CE5 an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepare as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of DOWSIL TM OS-20 at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 °C for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming a base. The average particle size of base was 0.87um.
- an aqueous dispersion of a silicone pressure sensitive adhesive base was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of IDD at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 °C for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming a base. The average particle size of the base was 0.44um.
- Sample WE1 an aqueous dispersion of a silicone pressure sensitive adhesive base was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of Cumene at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80°C for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming the base. The average particle size of the base was 0.35um.
- an aqueous dispersion of a silicone pressure sensitive adhesive base was prepared as follows: 25.1 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of cumene at room temperature. Then 13.67 parts of Polymer 1 and 7.95 parts of Gum 1 were added into the above resin solution at 50-80 °C for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming the base. The average particle size of the base was 0.25um.
- an aqueous dispersion of a silicone pressure sensitive adhesive base was prepared as follows: 21.59 parts of Capped Resin 1 and 6.84 parts of Uncapped Resin 1 were dissolved in 8.4 parts of Cumene at room temperature. Then 13.29 parts of Polymer 1 and 12.21 parts of Gum 1 were added into the above resin solution at 50-80°C for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming a base. The average particle size of the base was 0.23um.
- Sample WE4 an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepare as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of cumene at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 °C for 3-6 hours. The resulting mixture was mixed with 5.67 parts of Organic Surfactant 2 and 0.63 parts of Organic Surfactant 1 by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming a base. The average particle size of the base was 0.42um.
- Sample WE5 an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepared as follows: 10 parts of PVA 220 were dissolved in 90 parts of deionized water by stirring at 80 °C for 3 hours to give PVOH clear solution with 10%solid content, which was then cooled to room temperature. 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of Cumene at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 °C for 3-6 hours.
- the resulting mixture was mixed with 5.67 parts of Organic Surfactant 2 and 3.15 parts of PVA-220 solution by the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 28.08g water was gradually added under stirring until forming the base. The average particle size of the base was 0.55um.
- the bases prepared as described above were used to make aqueous dispersions of silicone pressure sensitive adhesive compositions by combining each base and a curing agent.
- the peroxide curing agent was prepared by mixing 50g BPO and 50g Dispersant 1, PPH, for 30 mins to get the peroxide curing agent, which had a benzoyl peroxide content of 37.5%.
- Two silicone pressure sensitive adhesive compositions were prepared by mixing a portion of each base (10 g) prepared as described above with 0.5 g the peroxide curing agent, prepared as described above, or 0.19 g of the aminosilane in Table 1. Each composition was mixed using the FlackTek SpeedMixer TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min. The resulting compositions were coated on PET films of thickness 50 um and cured at 80 °C for 2 min and 170 °C for 3 min to obtain silicone pressure sensitive adhesive films on the PET. The Si-PSA film thickness could be controlled at 30-35um.
- Cold peel Take out the steel plate with tape adhered thereto, and place it outside until cooling to room temperature. Then peel the tape, and check the residual and migration visually. This is referred to as “Cold peel” .
- aqueous dispersion of a silicone pressure sensitive adhesive composition prepared using the base and curing agent described above can be applied to a substrate and cured with a beneficial combination of properties.
- the silicone pressure sensitive adhesive made as described above has a transparent appearance, adhesion > 700 g/in to polyethyelene terephthalate (PET) film, and excellent heat resistance (with a value ⁇ 2) , regardless of curing agent selected, when tested according to both the hot peel and cold peel tests described in the Reference Examples described above.
- the use of the alkyl polyglycoside surfactant particularly in combination with the use of cumene, provides a synergistic effect resulting in the Si PSA made from the aqueous dispersion of the silicone pressure sensitive adhesive base achieving this combination of properties.
- aqueous dispersion of a silicone pressure sensitive adhesive base refers to an oil in water type dispersion including starting materials (A) , (B) , (C) , and (D) , as described above, but not including a curing agent (II) also described above.
- Said base may further comprise additional, optional starting materials, excluding the curing agent (II) described above.
- aqueous dispersion of a silicone pressure sensitive adhesive composition refers to a combination prepared by combining a curing agent (II) as described above with the base.
- Said composition may further comprise additional, optional starting materials, as described above with respect to the base, however, one skilled in the art would recognize that one or more of the additional starting materials may be added to the base before combination with the curing agent, or one or more of the additional starting materials may be added to the composition (i.e., after combining the base and curing agent) .
- ranges includes the range itself and also anything subsumed therein, as well as endpoints.
- disclosure of a range of 1 to 20 includes not only the range of 1 to 20, including endpoints, but also 1, 4, 6.5, 10, 15, 16, and 20 individually, as well as any other number subsumed in the range.
- disclosure of a range of, for example, 1 to 20 includes the subsets of, for example, 1 to 6, 7 to 13, and 14 to 20, as well as any other subset subsumed in the range.
- the disclosure of Markush groups includes the entire group and also any individual members and subgroups subsumed therein.
- disclosure of the Markush group alkyl, alkenyl, and aryl includes the member alkyl individually; the subgroup alkyl and aryl; and any other individual member and subgroup subsumed therein.
- Mn of the bis-hydroxyl-terminated polydiorganosiloxane and the polyorganosilicate resin may be measured by GPC according to the following technique.
- the chromatographic equipment was a Waters 2695 Separations Module equipped with a vacuum degasser, and a Waters 2414 refractive index detector.
- the separation was made with three Styragel TM HR columns (300 mm ⁇ 7.8 mm) (molecular weight separation range of 100 to 4,000,000) , preceded by a Styragel TM guard column (30 mm ⁇ 4.6 mm) .
- the analyses were performed using certified grade toluene flowing at 1.0 mL/min as the eluent, and the columns and detector were both heated to 45 °C.
- 0.5%wt. /v sample was prepared by weighing 0.025 g of neat sample into a 12-mL glass vial and diluting with 5mL toluene. Sample solution was transferred to a glass autosampler vial after centrifuged or filtered through 0.45 ⁇ m PTFE filter. An injection volume of 100 ⁇ l was used and data was collected for 38 minutes. Data collection and analyses were performed using Waters Empower GPC software. Molecular weight averages were determined relative to a calibration curve (3rd order) created using polystyrene standards covering the molecular weight range of 370 g/mol –1,270,000 g/mol.
- Viscosity of (A2) the bis-hydroxyl-terminated polydiorganosiloxane polymer used herein may be measured at 25 °C at 0.1 to 50 RPM on a Brookfield DV-III cone & plate viscometer with #CP-52 spindle, e.g., for polymers with viscosity of 120 to 250,000 mPa ⁇ s.
- Brookfield DV-III cone & plate viscometer with #CP-52 spindle
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Abstract
An aqueous dispersion of a silicone pressure sensitive adhesive base can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive.
Description
CROSS REFERENCE TO RELATED APPLICATIONS
None.
This invention relates to an aqueous dispersion of a silicone pressure sensitive adhesive base and method for its preparation. The aqueous dispersion can be combined with a curing agent and cured to form a silicone pressure sensitive adhesive with good optical properties, high adhesion, and that leaves no or low residue after removal from stainless steel substrates after exposure to high temperatures.
INTRODUCTION
Silicone pressure sensitive adhesives are widely applied in a variety of large and fast-growing applications, including general purpose masking tapes/labels and protective films, in which super wetting to a substrate, stable adhesion after aging, and high/low temperature stability are desired properties. Conventional silicone pressure sensitive adhesives (Si PSAs) are delivered in solvent, such as benzene, toluene, ethyl benzene, xylene, or combinations thereof (BTEX) , which will result in relatively high volatile organic compound (VOC) emission when the Si PSAs are applied to substrates, dried, and cured. Such solvent borne Si PSAs are facing growing challenges, while waterborne Si PSAs, which contain low or no amounts of solvents, are becoming more attractive to customers.
However, there are relatively few commercially available waterborne Si PSAs. U.S. Patent 10,077,387 to Ding et al. discloses an emulsion type silicone pressure sensitive adhesive composition and a process for the production thereof. However, an aromatic solvent, which is a VOC, is used as a dilute agent in this composition and process, and this Si PSA may have inadequate heat resistance for certain applications.
BRIEF SUMMARY OF THE INVENTION
An aqueous dispersion of a silicone pressure sensitive adhesive base (base) comprises: a bis-hydroxyl-terminated polydiorganosiloxane, a polyorganosilicate resin, cumene, an alkyl polyglycoside surfactant, and water. The base may be combined with a curing agent comprising a peroxide or an aminosilane to form an aqueous dispersion of a silicone pressure sensitive adhesive composition (composition) . The composition is curable to form a silicone pressure sensitive adhesive.
The aqueous dispersion of the silicone pressure sensitive adhesive base (base) introduced above comprises: (A) the bis-hydroxyl-terminated polydiorganosiloxane, which may comprise (A1) a bis-hydroxyl-terminated polydiorganosiloxane gum (gum) , (A2) a bis-hydroxyl-terminated polydiorganosiloxane polymer (polymer) , or (A3) a combination of both the gum and the polymer; (B) the polyorganosilicate resin, which may comprise (B1) a capped resin, (B2) an uncapped resin, or (B3) a combination of both the capped resin and the uncapped resin; (C) cumene; (D) the surfactant, which comprises (D1) the alkyl polyglycoside surfactant, and may optionally further comprise (D2) a cosurfactant; and (E) water.
(A) Bis-Hydroxyl-Terminated Polydiorganosiloxane
Starting material (A) in the base is the bis-hydroxyl-terminated polydiorganosiloxane. As introduced above, starting material (A) may comprise (A1) the gum, (A2) the polymer, or (A3) the combination of both the gum and the polymer. The amount of starting material (A) in the base depends on various factors including the species selected for (A1) the gum and/or (A2) the polymer, and the types and amounts of other starting materials in the base, however, the amount of starting material (A) may be 25 weight parts to 45 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amount of starting material (A) in the base may be at least 25, alternatively at least 26, alternatively at least 27, alternatively at least 28, alternatively at least 29, alternatively at least 30, alternatively at least 31, and alternatively at least 32 weight parts; while at the same time the amount may be up to 45, alternatively up to 44, alternatively up to 43, alternatively up to 42, alternatively up to 41, alternatively up to 40, alternatively up to 39, and alternatively up to 38 weight parts, on the same basis.
(A1) Gum
The gum may have formula:
where each R
1 is an independently selected monovalent hydrocarbon group; and subscript a has a value sufficient to give the gum a plasticity of 20 mil (0.51 mm) to 80 mil (2.03 mm) , alternatively 30 mil (0.76 mm) to 70 mil (1.78 mm) , and alternatively 50 mil (1.27 mm) to 65 mil (1.65 mm) , where plasticity is measured based on ASTM D926 by applying 1 kg load to a spherical sample of 4.2 g in weight for 3 minutes at 25 ℃ and the results are measured in thousandths of an inch (mil) .
Each R
1 is an independently selected monovalent hydrocarbon group. The monovalent hydrocarbon group may have 1 to 18 carbon atoms. The monovalent hydrocarbon group may be free of aliphatic unsaturation. Alternatively, each R
1 may have 1 to 12 carbon atoms, and alternatively 1 to 6 carbon atoms. Suitable monovalent hydrocarbon groups for R
1 are exemplified by alkyl groups and aromatic groups such as aryl groups and aralkyl groups. Alkyl is exemplified by, but not limited to, methyl, ethyl, propyl (e.g., iso-propyl and/or n-propyl) , butyl (e.g., isobutyl, n-butyl, tert-butyl, and/or sec-butyl) , pentyl (e.g., isopentyl, neopentyl, and/or tert-pentyl) , hexyl, heptyl, octyl, nonyl, and decyl, and branched alkyl groups of 6 or more carbon atoms; and cyclic alkyl groups such as cyclopentyl and cyclohexyl. Aryl is exemplified by, but not limited to, cyclopentadienyl, phenyl, tolyl, xylyl, anthracenyl, benzyl, 1-phenylethyl, 2-phenylethyl, and naphthyl. Alternatively, each R
1 may be independently selected from the group consisting of alkyl and aryl. Alternatively, each R
1 may be independently selected from methyl and phenyl. Alternatively, each R
1 may be alkyl. Alternatively, each R
1 may be methyl.
Bis-hydroxyl-terminated polydiorganosiloxane gums suitable for use as starting material (A1) are known in the art and may be prepared by methods such as hydrolysis and condensation of the corresponding organohalosilanes or equilibration of cyclic polydiorganosiloxanes. Examples of suitable hydroxyl-terminated polydiorganosiloxane gum for use as starting material (A1) in the base are exemplified by:
i) bis-hydroxyl-terminated polydimethylsiloxane,
ii) bis-hydroxyl-terminated poly (dimethylsiloxane/methylphenylsiloxane) ,
iii) bis-hydroxyl-terminated poly (dimethylsiloxane/diphenylsiloxane) ,
iv) phenyl, methyl, hydroxyl-siloxy-terminated polydimethylsiloxane,
v) a combination of two or more of i) to iv) . Alternatively, starting material (A1) comprise bis-hydroxyl-terminated polydimethylsiloxane.
Starting material (A1) , the bis-hydroxyl-terminated polydiorganosiloxane gum, may be present in the base in an amount of 10 weight parts to 20 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, (A1) the gum may be present in an amount of at least 10, alternatively at least 11, alternatively at least 12, alternatively at least 13, alternatively at least 14, and alternatively at least 15, weight parts; while at the same time the amount may be up to 20, alternatively up to 19, alternatively up to 18 weight parts, alternatively up to 17 weight parts, and alternatively up to 16 weight parts, on the same basis.
(A2) Polymer
Starting material (A) of the base may further comprise (A2) the a bis-hydroxyl-terminated polydiorganosiloxane polymer (polymer) , introduced above. The polymer may have formula:
where R
1 is as described above and subscript b <subscript a. Subscript b has a value sufficient to give the polymer a viscosity ≤ 100,000 cst measured as described in the test method, below. Alternatively, subscript b may have a value sufficient to give the polymer a viscosity of 10,000 cst to 100,000 cst; alternatively 20,000 cst to 95,000 cst; alternatively 30,000 cst to 90,000 cst; alternatively 40,000 cst to 85,000 cst; and alternatively 50,000 cst to 80,000 cst.
Polymers suitable for use in the base are known in the art and may be prepared by methods such as hydrolysis and condensation of the corresponding organohalosilanes or equilibration of cyclic polydiorganosiloxanes. Suitable polymers for use as starting material H) are exemplified by:
i) bis-hydroxyl-terminated polydimethylsiloxane,
ii) bis-hydroxyl-terminated poly (dimethylsiloxane/methylphenylsiloxane) ,
iii) bis-hydroxyl-terminated poly (dimethylsiloxane/diphenylsiloxane) ,
iv) phenyl, methyl, hydroxyl-siloxy-terminated polydimethylsiloxane,
v) a combination of two or more of i) to iv) . Alternatively, the polymer may be selected from the group consisting of i) , ii) , and iii) . Alternatively, the polymer may be i) .
Starting material (A2) , the bis-hydroxyl terminated polydiorganosiloxane polymer, may be present in the base in an amount of 15 to 25 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, (A2) the polymer may be present in an amount of at least 15, alternatively at least 16, alternatively at least 17, alternatively at least 18, alternatively at least 19, and alternatively at least 20, weight parts; while at the same time the amount may be up to 25, alternatively up to 24, alternatively up to 23 weight parts, alternatively up to 22 weight parts, and alternatively up to 21 weight parts, on the same basis.
One skilled in the art would recognize that the above amounts for starting materials (A1) and (A2) are exemplary and not limiting. When a combination of (A1) gum and (A2) polymer are used, starting materials (A1) and (A2) may be present in the base in amounts sufficient to provide a weight ratio (A1) / (A2) (Gum/Polymer ratio) of 0.1/1 to 1/1, alternatively 0.67/1 to 1/1.
(B) Polyorganosilicate Resin
Starting material (B) in the base is a polyorganosilicate resin. The polyorganosilicate resin comprises monofunctional units of formula R
M
3SiO
1/2 and tetrafunctional units ( “Q” units) of formula SiO
4/2, where each R
M is an independently selected monovalent hydrocarbon group, as described above for R
1. Alternatively, at least one-third, alternatively at least two thirds of the R
M groups are methyl groups. Alternatively, the monofunctional units may be exemplified by (Me
3SiO
1/2) and (Me
2PhSiO
1/2) ; alternatively the monofunctional units may be selected from the group consisting of (Me
3SiO
1/2) and (Me
2PhSiO
1/2) . The polyorganosilicate resin is typically produced in an aromatic solvent (e.g., BTEX) because the resin is solid at room temperature (RT) . However, the solvent can then subsequently removed such that the resin typically has a powder or flake form.
When prepared, the polyorganosilicate resin comprises the monofunctional and tetrafunctional units described above, and the polyorganosilicate resin further comprises units with silanol (silicon bonded hydroxyl) groups and may comprise neopentamer of formula Si(OSiR
M
3)
4, where R
M is as described above. Si
29 Nuclear Magnetic Resonance (NMR) spectroscopy, as described in U.S. Patent 9,593,209 at col. 32, Reference Example 2, may be used to measure molar ratio of M and Q units, where said ratio is expressed as {M (resin) + (M (neopentamer) } / {Q (resin) +Q (neopentamer) } and represents the molar ratio of the total number of triorganosiloxy groups (M units) of the resinous and neopentamer portions of the polyorganosilicate resin to the total number of silicate groups (Q units) in the resinous and neopentamer portions.
The Mn of the polyorganosilicate resin depends on various factors including the types of monovalent hydrocarbon groups represented by R
M that are present. The Mn of the polyorganosilicate resin refers to the number average molecular weight measured using GPC according to the procedure in U.S. Patent 9,593,209 at col. 31, Reference Example 1, when the peak representing the neopentamer is excluded from the measurement. The Mn of the polyorganosilicate resin may be at least 1,500 g/mol. At the same time, the Mn of the polyorganosilicate may be up to 15,000 g/mol. Alternatively, Mn of the polyorganosilicate resin may be > 3,000 g/mol to 8,000 g/mol. Alternatively, Mn of the Resin may be 2,000 g/mol to 8,000 g/mol, alternatively 2,900 g/mol to 6,000 g/mol, and alternatively 2,900 to 5,000 g/mol.
The polyorganosilicate resin can be prepared by any suitable method, such as cohydrolysis of the corresponding silanes or by silica hydrosol capping methods. The polyorganosilicate resin may be prepared by silica hydrosol capping processes such as those disclosed in U.S. Patent 2,676,182 to Daudt, et al.; U.S. Patent 4,611,042 to Rivers-Farrell et al.; and U.S. Patent 4,774,310 to Butler, et al. The method of Daudt, et al. described above involves reacting a silica hydrosol under acidic conditions with a hydrolyzable triorganosilane such as trimethylchlorosilane, a siloxane such as hexamethyldisiloxane, or mixtures thereof, and recovering a copolymer having monofunctional units and tetrafunctional units. The resulting copolymers generally contain from 2 to 5 percent by weight of hydroxyl groups.
The intermediates used to prepare the polyorganosilicate resin may be triorganosilanes and silanes with four hydrolyzable substituents or alkali metal silicates. The triorganosilanes may have formula R
M
3SiX
1, where R
M is as described above and X
1 represents a hydrolyzable substituent. Silanes with four hydrolyzable substituents may have formula SiX
2
4, where each X
2 is halogen, alkoxy or hydroxyl. Suitable alkali metal silicates include sodium silicate.
The polyorganosilicate resin prepared as described above is uncapped and typically contains silicon bonded hydroxyl groups, e.g., of formulae, HOSi
3/2 and/or (HO)
xR
M
(3-
x) SiO
1/2, where subscript x is 1, 2, or 3. The polyorganosilicate resin may comprise up to 2%of silicon bonded hydroxyl groups. The concentration of silicon bonded hydroxyl groups present in the polyorganosilicate resin may be determined using FTIR spectroscopy according to ASTM Standard E-168-16. To reduce the amount of silicon bonded hydroxyl groups to be below 0.7%, alternatively below 0.3%, alternatively less than 1%, and alternatively 0.3%to 0.8%, the silicon bonded hydroxyl groups formed during preparation of the polyorganosilicate resin can be converted to trihydrocarbyl-siloxane groups or to a different hydrolyzable group by a process known as capping, e.g., reacting the polyorganosilicate resin with a silane, disiloxane, or disilazane containing the appropriate terminal group. Silanes containing hydrolyzable groups may be added in molar excess of the quantity required to react with the silicon bonded hydroxyl groups on the polyorganosilicate resin, thereby forming a capped resin.
One or more polyorganosilicate resins may be combined and used in the base herein. For example, an uncapped resin having a relatively high amount of hydroxyl groups may be used in combination with a capped resin having al lower amount of hydroxyl groups than the uncapped resin. Alternatively, the resin or resins used may be capped.
Therefore, (B) the polyorganosilicate resin may comprise (B1) a capped resin as described above and (B2) an uncapped resin as described above. The capped resin may have unit formula: (R
M
3SiO
1/2)
z (SiO
4/2)
oX
2
p, where R
M and X
2 are as described above, and subscripts z and o have values such that o > 1, and subscript z > 4, a quantity (o + z) has a value sufficient to give the capped resin the Mn described above (e.g., 1,500 g/mol to 5,000 g/mol, alternatively 2,000 g/mol to 5,000 g/mol, alternatively 2,500 g/mol to 4,900 g/mol, and alternatively 2,500 g/mol to 4,700 g/mol, and alternatively 2,900 g/mol to 4,700 g/mol) , and subscript p has a value sufficient to give the capped resin a hydrolyzable group content as described above (e.g., 0 to < 2%, alternatively 0 to 1.5%, and alternatively 0 to 1.0%) . Starting material (B2) , the uncapped resin, may have unit formula (R
M
3SiO
1/2)
z’ (SiO
4/2)
o’X
2
p’, where R
M and X
2 are as described above and subscripts z’ and o’ have values such that o’ > 1, and subscript z’ > 4, a quantity (o’ + z’) has a value sufficient to give the capped resin the Mn described above (e.g., 1,500 g/mol to 5,000 g/mol, alternatively 2,000 g/mol to 5,000 g/mol, alternatively 2,500 g/mol to 4,900 g/mol, and alternatively 2,500 g/mol to 4,700 g/mol, and alternatively 2,700 g/mol to 4,700 g/mol) , and subscript p’ has a value sufficient to give the uncapped resin a hydrolyzable group content as described above (e.g., ≥ 2%to 10%) .
Suitable polyorganosilicate resins for use in the base are known in the art and are commercially available. For example, flake resins sold with tradename DOWSIL
TM are commercially available from DSC. The amount of polyorganosilicate resin in the base depends on various factors including the species of resin selected and the types and amounts of other starting materials in the base, however, the amount of (B) the polyorganosilicate resin may be 40 weight parts to 55 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amounts of (B) the polyorganosilicate resin and (A) the bis-hydroxyl-terminated polydiorganosiloxane may be sufficient to provide a weight ratio of (B) polyorganosilicate resin to (A) bis-hydroxyl-terminated polydiorganosiloxane ratio [ (B) / (A) ratio] of 1/1 to 1.5/1, alternatively 1.4/1 to 1.5/1.
Alternatively, when (B3) the combination of both (B1) the capped resin and (B2) the uncapped resin are used, the amount of (B1) the capped resin may be 30 weight parts to 40 weight parts, per 100 parts by weight of starting materials (A) , (B) , (C) , and (D) combined; and the amount of (B2) the uncapped resin may be 10 weight parts to 15 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amount of (B1) the capped resin may be at least 30, alternatively at least 31, alternatively at least 32, alternatively at least 33, alternatively at least 34, and alternatively at least 35 weight parts; while at the same time the amount may be up to 40, alternatively up to 39, alternatively up to 38, alternatively up to 37, and alternatively up to 36 weight parts on the same basis. Alternatively, the amount of (B2) the uncapped resin may be at least 10, alternatively at least 11, alternatively at least 12, alternatively at least 13, alternatively at least 14, and alternatively at least 15 weight parts; while at the same time the amount may be up to 20, alternatively up to 19, alternatively up to 18, alternatively up to 17, and alternatively up to 16 weight parts on the same basis.
(C) Cumene
Starting material (C) in the base described above is cumene, which has IUPAC name: (propan-2-yl) benzene. Cumene has formula
The cumene is present in the base in an amount of 1 weight part to 20 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amount of cumene may be 5 weight parts to 15 weight parts, on the same basis. Alternatively, the cumene may be present in the base in an amount of at least 1 weight part, alternatively at least 3 weight parts, alternatively at least 5 weight parts, alternatively at least 7 weight parts, alternatively at least 9 weight parts, alternatively at least 10 weight parts, alternatively at least 11 weight parts, and alternatively at least 12 weight parts; while at the same time, the amount may be up to 20 weight parts, alternatively up to 18 weight parts, alternatively up to 16 weight parts, alternatively up to 15 weight parts, alternatively up to 14 weight parts, and alternatively up to 12 weight parts, on the same bases described above.
The base described herein may be free of volatile organic compounds that have flash point < 28 ℃, which may be undesirable to customers/end users of the base and the silicone pressure sensitive adhesive composition described herein. For example, such volatile organic compounds include volatile hydrocarbons (e.g., volatile aliphatic hydrocarbons such as heptane and volatile aromatic hydrocarbons, such as benzene, ethyl benzene, toluene, and xylene) . Without wishing to be bound by theory, it is thought that cumene has a flash point of 43.9 ℃, which is higher than that of the volatile organic compounds described above, and, therefore cumene is not a volatile organic compound with flash point < 28 ℃. “Free of volatile organic compounds with flash point < 28 ℃” means that volatile organic compounds (as described above) are not intentionally added to the base, and are either not present in the base or, if introduced as an impurity in a starting material (e.g., the polyorganosilicate resin) , they are not present in an amount that detrimentally affects performance of a silicone pressure sensitive adhesive prepared by curing a silicone pressure sensitive adhesive composition made with the base and the curing agent, described below.
(D) Surfactant
Starting material (D) in the base described above is a surfactant. Starting material (D) comprises (D1) the alkyl polyglycoside surfactant, and starting material (D) may optionally further comprise (D2) a cosurfactant. Starting material (D) may be one surfactant or a combination of two or more surfactants. For example, one (D1) polyglycoside surfactant may be used. Alternatively, two or more (D1) alkyl polyglycosides that differ in at least one property (e.g., molecular weight) may be used.
(D1) Alkyl Polyglycoside Surfactant
Alkyl polyglycosides are surfactants derived from sugars or starches and fatty alchohols. Alkylpolyglucosides are a class of alkylpolyglycoside derived from glucose. Alkyl polyglycosides may have general formula R
2O- (R
3O)
c- (Z)
d, where R
2 is an alkyl group, each R
3 is an independently selected alkylene group of 2 to 4 carbon atoms, Z is a sugar moiety (e.g., glucose moiety) , subscript c is 0 to 10, and subscript x denotes the number of sugar units, per molecule. The alkyl polyglycoside may contain only one specific alkyl radical R
2. Alternatively, when the alkyl polyglycosides are manufactured from natural fats and oils or mineral oils, the alkyl groups, R
2, may be mixtures corresponding to the initial fats or oils compounds or corresponding to the particular processing of those fats and/or oils. The alkyl polyglycosied may be an alkyl polyglucoside in which each R
2 may comprise substantially C
8 and C
10 alkyl groups; substantially C
12 and C
14 alkyl groups; substantially C
8 to C
16 alkyl groups; or substantially C
12 to C
16 alkyl groups. R
3 may be a linear or branched alkylene group. Alternatively, R
3 may be linear. Alternatively, R
3 may be selected from the group consisting of ethyelene and propylene. Any mono-or oligosaccharides can be used as the sugar moiety Z. Alternatively, sugars having 5 or 6 carbon atoms in the sugar moiety Z, as well as the corresponding oligosaccharides, may be used. Such sugars are, for example, glucose, fructose, galactose, arabinose, ribose, xylose, lyxose, allose, altrose, mannose, gulose, idose, talose, and sucrose. Alternatively, the sugar moiety Z may be derived from glucose, fructose, galactose, arabinose, and sucrose. Alternatively, the sugar moiety Z may be derived from glucose. The alkyl polyglycosides useful herein may contain on average 1 to 6 sugar units, per molecule (where subscript d has an average value of 1 to 6) . Alternatively, subscript d may have an average value of 1.1 5o 5, alternatively 1.1 to 2.0. Alternatively, subscript d may be 1.1 to 1.8. Alternatively, alkoxylated homologs of the aforesaid alkyl polyglycosides can also be used according to the present invention. These homologs can contain, on average, up to 10 ethylene oxide and/or propylene oxide units per alkyl glycoside unit. Alkyl polyglycosides, such as alkyl polyglucosides, are known in the art, for example, see Published Patent Application WO 2004/073665 A1. Alkyl polyglycosides, such as alkyl polyglucosides are commercially available. For example, a C9-C11 alkyl oligomeric d-glucopyranoside is commercially available as Green APG IC911 from Shanghai Fine Chemical Co. LTD of China. Other alkyl polyglucosides are known in the art and are commercially available, e.g., under the tradename TRITON
TM BG and TRITON
TM CG Alkyl Polyglucoside Surfactants from TDCC.
(D2) Cosurfactant
Starting material (D2) is an optional cosurfactant that differs from (D1) the alkyl polyglycoside described above. The cosurfactant may be an anionic surfactant, such as a salt of an alkyl alkoxylate sulfate. Alternatively, the cosurfactant may be a nonionic surfactant, such as a polyvinyl alcohol compound.
The anionic surfactants useful herein include (i) sulfonic acids and their salt derivatives, including alkyl, aralkyl, alkyl naphthalene, alkyl diphenyl ether sulfonic acids, and their salts, having at least 6 carbon atoms in the alkyl substituent, such as dodecyl benzene sulfonic acid, and its sodium salt or its amine salt; (ii) alkyl sulfates having at least 6 carbon atoms in the alkyl substituent, such as sodium lauryl sulfate; (iii) the sulfate esters of polyoxyethylene monoalkyl ethers; (iv) long chain carboxylic acid surfactants, such as lauric acid, steric acid, oleic acid, and their alkali metal and amine salts. Some other examples of anionic surfactants are sulfonated glyceryl esters of fatty acids such as sulfonated monoglycerides of coconut oil acids; salts of sulfonated monovalent alcohol esters such as sodium oleyl isothionate; ; sulfonated aromatic hydrocarbons such as sodium alpha-naphthalene monosulfonate; ; alkali metal alkyl sulfates; ether sulfates having alkyl groups of eight or more carbon atoms such as sodium lauryl ether sulfate; and alkylaryl sulfonates having one or more alkyl groups of eight or more carbon atoms such as neutral salts of hexadecylbenzene sulfonic acid and C20 alkylbenzene sulfonic acid.
Commercial anionic surfactants which can be used include the sodium salt of dodecyl benzene sulfonic acid sold under the trademark SIPONATE
TM DS-10 by Alcolac Inc., Baltimore, Maryland; sodium salt of alkyl alkoxylate sulfate sold under the trademark DOWFAX
TM AS-801 by The Dow Chemical Company of Midland, Michigan, USA; ; and linear alkyl benzene sulfonic acids sold under the trademark BIO-SOFT
TM S-100 by the Stepan Company, Northfield, Illinois. Compositions of the latter type such as dodecyl benzene sulfonic acid, although a catalyst as noted above, can also function as the anionic surfactant when neutralized. Other suitable surfactants include sodium alkyl sulfonate such as HOSTAPUR
TM SAS-30,
The amount of the anionic surfactant depends on various factors, including the selection and amount of starting material (D1) , the alkyl polyglycoside surfactant, that is present, however the amount of anionic surfactant may be 0 to 5%, alternatively 0 to 3%, based on weight of silicone polymer and resins.
Polyvinyl alcohol compounds suitable for use as the cosurfactant herein are known in the art and are disclosed, for example in U.S. Patent Application Publication 20007/0099007 at paragraphs [0172] and [0173] . Polyvinyl alcohol compounds may be made by saponification of polyvinylacetate, so up to 15%of polyvinylacetate may remain in the polyvinyl alcohol compound used herein. Alternatively, the polyvinyl alcohol compound may be 80%to 98%polyvinyl alcohol (with the balance being 20%to 2%polyvinylacetate) . The polyvinyl alcohol compound may have a minimum viscosity of 5 cP at 4 %aqueous solution at 20 ℃. Polyvinyl alcohol is commercially available, e.g., GOHSENOL GH-17 from Nippon Gohsei. The amount of the polyvinyl alcohol compound depends on various factors, including the selection and amount of starting material (D1) , the alkyl polyglycoside surfactant, that is present, however the amount of polyvinyl alcohol may be 0 to 5%, alternatively 0 to 3%, based on weight of silicone polymer and resins. [0036] The amount of (D) the surfactant in the base depends on various factors including the species and amounts of starting materials (A) and (B) , and whether a cosurfactant is present. However, the amount of (D) the surfactant may be 2 weight parts to 15 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amount of (D1) the alkyl polyglycoside surfactant may be 2 weight parts to 10 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amount of (D1) the alkyl polyglycoside surfactant may be at least 2, alternatively at least 3, and alternatively at least 4, weight parts; while at the same time the amount may be up to 10, alternatively up to 8, alternatively up to 6 weight parts, on the same basis. Alternatively, the amount of (D2) the cosurfactant may be 0 to 5 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amount of (D2) the cosurfactant may be at least 0.1 weight part, alternatively at least 0.2 weight part, alternatively at least 0.3 weight part, and alternatively at least 0.4 weight part; while at the same time the amount may be up to 5 weight parts, alternatively up to 3 weight parts, alternatively up to 1 weight part, and alternatively up to 0.5 weight part, on the same basis.
(E) Water
Starting material (E) in the base is water. The water is not generally limited, and may be utilized neat (i.e., absent any carrier vehicles/solvents) , and/or pure (i.e., free from or substantially free from minerals and/or other impurities) . For example, the water may be processed or unprocessed before being added to the base described above. Examples of processes that may be used for purifying the water include distilling, filtering, deionizing, and combinations of two or more thereof, such that the water may be deionized, distilled, and/or filtered. Alternatively, the water may be unprocessed (e.g. may be tap water, i.e., provided by a municipal water system or well water, used without further purification) .
The water may be utilized in any amount and the exact amount may be selected by one of skill in the art, depending on various factors, e.g., the equipment to be used for preparing the base and the scale. However, the amount of water may be 30 weight parts to 80 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amount of water may be higher than 80 weight parts, for example, if the base is further diluted before use, depending on the end use application. Alternatively, the amount of water may be lower than 30 weight parts, if less than 30 weight parts is sufficient to form the aqueous dispersion.
(F) Biocide
The base described above may optionally further comprise starting material (F) , a biocide. Biocides are known in the art and are commercially available. For example, the biocide may be a preservative such as BIOBAN
TM products ) or KATHON
TM products, which is an aqueous preservative comprising 5-chloro-2-methyl-4-isothiazolin-3-one and 2-methyl-4-isothiazolin-3-one. Alternatively, the biocide may comprise an algicide, such as KLARIX
TM algicides, e.g., . BIOBAN
TM, KATHON
TM, KLARIX
TM and other biocides are commercially available from The Dow Chemical Company of Midland, Michigan, USA. The biocide may be added in an amount of 0 to 5 weight parts, alternatively 0.1 weight part to 5 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
Method of Making the Base
The base described above can be prepared by a method comprising:
1) dissolving (B) the polyorganosilicate resin in (C) the cumene to form a solution, and
2) emulsifying the solution, (A) the bis-hydroxyl-terminated polydiorganosiloxane, (D) the surfactant, and (E) the water.
The method may further comprise 3) adding an additional starting material, as described above, in step 1) and/or step 2) . The method may further comprise 4) diluting the base with additional water.
Steps 1) and 2) may be performed by any convenient means, such as mixing at RT or elevated temperature, in batch, semi-batch, or continuous equipment. Mixing in step may occur, for example using, batch mixing equipment with medium/low shear such as change-can mixers, double-planetary mixers, conical-screw mixers, ribbon blenders, double-arm or sigma-blade mixers. Alternatively, batch equipment with high-shear and/or high-speed dispersers can be used in step 1) and/or step 2) , and these include equipment such as that made by Charles Ross & Sons (NY) , Hockmeyer Equipment Corp. (NJ) ; batch mixing equipment such as those sold under the tradename Speedmixer
TM; and batch equipment with high shear actions include Banbury-type (CW Brabender Instruments Inc., NJ) and Henschel type (Henschel mixers America, TX) . Illustrative examples of continuous mixers/compounders include extruders single-screw, twin-screw, and multi-screw extruders, co-rotating extruders, such as those manufactured by Krupp Werner & Pfleiderer Corp (Ramsey, NJ) , and Leistritz (NJ) ; extruders such as twin-screw counter-rotating extruders, two-stage extruders, twin-rotor continuous mixers, dynamic or static mixers or combinations of these equipment.
The base prepared as described herein may form an oil in water (o/w) type dispersion, i.e., the dispersion comprises an oil phase dispersed in an aqueous phase. The oil phase will comprise (A) the bis-hydroxyl-terminated polydiorganosiloxane, (B) the polyorganosilicate resin, (C) the cumene, and (D) the surfactant. The starting materials may be combined concurrently in step 2) , or aliquots of one or more starting materials may be added. For example, water may be added in one or more aliquots during step 2) , and when more than one aliquot is used, the method may comprise mixing between additions. One skilled in the art would be able to select portions of the starting materials for combining, depending on the selection of the quantity used and the specific mixing techniques utilized to combine the starting materials.
The method may optionally further comprise 5) devolatilizing the base. Devolatilizing may be performed by any convenient means, such as heating the base under vacuum. Devolatilizing may be performed during water addition or before addition of the last aliquot of water to compensate for any water which may be removed during devolatilization. Devolatilizing may be performed, for example, with a devolatilizing extruder.
Silicone Pressure Sensitive Adhesive Composition
The base prepared as described above, may be used to make the silicone pressure sensitive adhesive composition by a method comprising: combining (I) the base with (II) a curing agent. The curing agent may be a (II-1) a peroxide compound or (II-2) an aminosilane.
(II-1) Peroxide Curing Agent
The peroxide compound is selected depending on various factors, including the species and amount of (A) the bis-hydroxyl-terminated polydiorganosiloxane used in (I) the base. Without wishing to be bound by theory, it is thought that the mechanism of a peroxide curing system is that the peroxide forms a radical to extract a hydrogen from an R
1 group, such as a methyl group, of (A) the bis-hydroxyl-terminated polydiorganosiloxane described above, and generates an active silicon-carbon radical. Subsequently, the resulting intermediate undergoes a cross-linking reaction to finish the curing process. Phenyl and primary carbon free radicals can cure the silicone pressure sensitive adhesive composition described herein. Therefore, the peroxide compound may be selected from the group consisting of benzoyl peroxide (BPO) , 2, 4-dichlorobenzoyl peroxide, dilauroyl peroxide, tert-pentyl 3, 5, 5-trimethylhexaneperoxoate, and a combination thereof. Alternatively, the peroxide compound may be benzoyl peroxide. Suitable peroxide compounds are commercially available, for example, aqueous peroxide compositions are available under the tradename LUPEROX
TM from Sigma-Aldrich, Inc. of St. Louis, Missouri, USA.
The amount of the peroxide compound depends on various factors including the species of peroxide compound selected and the species and amounts of the starting materials in the base, however, the amount of the peroxide compound may be 0.5 weight part to 6 weight part, per 100 parts by weight of starting materials (A) , (B) , (C) , and (D) combined. Alternatively, the amount of peroxide compound may be at least 0.5, alternatively at least 0.6, alternatively at least 0.7, alternatively at least 0.75 weight parts; while at the same time the amount of peroxide compound may be up to 6, alternatively up to 3, alternatively up to 1, alternatively up to 0.8 weight part, on the same basis.
Aminosilane Curing Agent
Alternatively, the (II) curing agent may comprise (II-2) an aminosilane such as the aminosilane disclosed in U.S. Pat. No. 4,906,695 to Blizzard et al. The aminosilane may have general formula:
where R” represents a divalent hydrocarbon group of 2 to 4 carbon atoms such as ethylene, trimethylene, or tetramethylene; R”’ is a divalent hydrocarbon group having 3 to 6 carbon atoms such as trimethylene, tetramethylene, methyltrimethylene, pentamethylene and hexamethylene; subscript n is 0, 1, or 2, subscript p is 0 or 1, R”” is a hydrocarbyl group such as alkyl (e.g., methyl, ethyl, propyl, butyl, or phenyl) or aryl (e.g., phenyl) , and X is a hydrolyzable moiety, which may be an alkoxy group (e.g., methoxy or ethoxy) , acyloxy group (e.g., acetoxy) , or halogen (e.g., Cl) . Suitable aminosilanes include, for example, N-gamma-aminopropyltriethoxysilane, N-beta-aminoethyl-gamma-aminoisobutyltrimethoxysilane, and N-beta-aminoethyl-gammaaminopropyltrimethoxysilane. Suitable aminosilanes are commercially available. For example, XIAMETER
TM OFS-6020 Silane and DOWSIL
TM Z-6026 Silane are available from DSC.
The amount of (II-2) the aminosilane depends on various factors including the species of aminosilane selected and the species and amounts of the starting materials in the base, however, the amount of the aminosilane may be 0.1 weight part to 6 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) , combined. Alternatively, the amount of the aminosilane may be at least 0.1, alternatively at least 0.2, and alternatively at least 0.25 weight parts; while at the same time the amount of peroxide compound may be up to 6, alternatively up to 3, alternatively up to 0.6, alternatively up to 0.5, alternatively up to 0.4 weight parts, on the same basis.
The techniques and apparatus as described above may be used to combine the base and the curing agent to form the silicone pressure sensitive adhesive composition (composition) . For example, the composition may be performed by mixing at RT.
Method of Use
The composition prepared as described above may be used to form an adhesive article, e.g., a silicone pressure sensitive adhesive prepared by a method comprising:
optionally i) treating a surface of a substrate,
ii) coating the surface of the substrate with the aqueous dispersion of the silicone pressure sensitive adhesive composition, as described above,
iii) removing water, and
iv) curing the silicone pressure sensitive adhesive composition to form a silicone pressure sensitive adhesive on the surface of the substrate.
Treating the surface of the substrate is optional and may be performed by any convenient means, such as cleaning the substrate, e.g., by washing with an alcohol, such as isopropanol, plasma treatment, corona discharge treatment, etching, and/or applying a primer. One skilled in the art would be able to select an appropriate treatment based on various factors including the type of substrate selected.
Applying the curable silicone pressure sensitive adhesive emulsion to the substrate can be performed by any convenient means. For example, the curable silicone pressure sensitive adhesive emulsion may be applied onto a substrate by gravure coater, comma coater, offset coater, offset-gravure coater, roller coater, reverse-roller coater, air-knife coater, or curtain coater.
The substrate can be any material that can withstand the treatment conditions (described above) and curing conditions (described below) used to cure the silicone pressure sensitive adhesive composition to form the silicone pressure sensitive adhesive on the substrate. For example, any substrate that can withstand heat treatment at a temperature equal to or greater than 180℃, alternatively 150℃ is suitable. Examples of materials suitable for such substrates including polymeric films such as polyester, polyimide (PI) , polyetheretherketone (PEEK) , polyethylene naphthalate (PEN) , liquid-crystal polyarylate, polyamideimide (PAI) , polyether sulfide (PES) , polyethylene terephthalate (PET) , polycarbonate (PC) , thermoplastic polyurethane (TPU) , polyethylene (PE) , or polypropylene (PP) . Alternatively, the substrate may be glass. The thickness of the substrate is not critical, however, the thickness may be 5 μm to 300 μm, alternatively 50 μm to 250 μm, alternatively 100 μm to 300 μm, alternatively 100 μm, and alternatively 50 μm. Alternatively, the substrate may be selected from the group consisting of PET, TPU, PC, and glass. Alternatively, the substrate may be a polymeric substrate, such as PET.
An adhesive article such as a film or tape may be prepared by applying the curable silicone pressure sensitive adhesive emulsion onto the substrate and curing, as described above. The method for preparing the adhesive article may further comprise removing the all, or a portion, of the water before and/or during curing, i.e., steps iii) and iv) of the method described above may be performed concurrently. Removing water may be performed by any convenient means, such as heating at a temperature that vaporizes the water without fully curing, e.g., heating at a temperature of 70℃ to 90℃, alternatively 50℃ to < 100℃, and alternatively 70℃to 80℃ for a time sufficient to remove all or a portion of the water (e.g., 30 seconds to 1 hour, alternatively 1 minute to 5 minutes) .
Curing may be performed by heating at a temperature of 80℃ to 200℃, alternatively 90℃ to 180℃, alternatively 100℃ to 180℃, and alternatively 110℃ to 180℃ for a time sufficient to cure (e.g., for 30 seconds to an hour, alternatively 1 min to 5 min) . Curing may be performed by placing the substrate in an oven. The amount of the composition to be applied to the substrate depends on the specific application, however, the amount may be sufficient such that after curing thickness of the silicone pressure sensitive adhesive may be 5 μm to 100 μm, and for protective film the thickness may be 5 μm to 50 μm, alternatively 10 μm to 40 μm, and alternatively 15 μm to 40 μm.
The method described herein may optionally further comprise applying a removable release liner to the silicone pressure sensitive adhesive opposite the substrate, e.g., to protect the silicone pressure sensitive adhesive before use of the adhesive article. The adhesive article may be a protective film for use in a display device. Alternatively, the adhesive article may be an industrial tape. Alternatively, adhesive article may be useful in healthcare or personal care applications.
EXAMPLES
The starting materials used in the following illustrative examples are described in Table 1.
Table 1 -Starting Materials
In this Comparative Example 1, Sample CE1 was prepared according to U.S. Patent 10,077,387, as follows: 8.5 parts of Gum 1 and 12.6 parts of Polymer 1 were mixed with 16.4 parts of Uncapped Resin 2 and 23.1 parts of Capped Resin 2 with (B) / (A) ratio of 1.4. The above was mixed with 6 parts of OCS to get a homogeneous mixture. Then 6 parts water was added with high shearing to form a thick O/W (oil in water) phase emulsion. 27.4 parts of water was added to dilute this emulsion to get the final aqueous dispersion of a silicone pressure sensitive adhesive base (base) . The average particle size of the base was 0.3-0.4 um.
In this Comparative Example 2, Sample CE2, an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of DIBK at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 ℃ for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min. Then 30.6g water was gradually added under stirring to prepare the base.
In this Comparative Example 3, Sample CE3, an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of DMM at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 ℃ for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min. Then 30.6g water was gradually added under stirring to prepare the base.
In this Comparative Example 4, Sample CE4, an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of heptane at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 ℃ for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min. Then 30.6g water was gradually added under stirring to prepare the base.
In this Comparative Example 5, Sample CE5, an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepare as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of DOWSIL
TM OS-20 at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 ℃ for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming a base. The average particle size of base was 0.87um.
In this Comparative Example 6, an aqueous dispersion of a silicone pressure sensitive adhesive base was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of IDD at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 ℃ for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming a base. The average particle size of the base was 0.44um.
In this Working Example 1, Sample WE1, an aqueous dispersion of a silicone pressure sensitive adhesive base was prepared as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of Cumene at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80℃ for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming the base. The average particle size of the base was 0.35um.
In this Working Example 2, Sample WE2, an aqueous dispersion of a silicone pressure sensitive adhesive base was prepared as follows: 25.1 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of cumene at room temperature. Then 13.67 parts of Polymer 1 and 7.95 parts of Gum 1 were added into the above resin solution at 50-80 ℃ for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming the base. The average particle size of the base was 0.25um.
In this Working Example 3, Sample WE3, an aqueous dispersion of a silicone pressure sensitive adhesive base was prepared as follows: 21.59 parts of Capped Resin 1 and 6.84 parts of Uncapped Resin 1 were dissolved in 8.4 parts of Cumene at room temperature. Then 13.29 parts of Polymer 1 and 12.21 parts of Gum 1 were added into the above resin solution at 50-80℃ for 3-6 hours. The resulting mixture was mixed with 6.3 parts of Organic Surfactant 2 by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming a base. The average particle size of the base was 0.23um.
In this Working Example 4, Sample WE4, an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepare as follows: 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of cumene at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 ℃ for 3-6 hours. The resulting mixture was mixed with 5.67 parts of Organic Surfactant 2 and 0.63 parts of Organic Surfactant 1 by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 30.6g water was gradually added under stirring until forming a base. The average particle size of the base was 0.42um.
In this Working Example 5, Sample WE5, an aqueous dispersion of a silicone pressure sensitive adhesive base, was prepared as follows: 10 parts of PVA 220 were dissolved in 90 parts of deionized water by stirring at 80 ℃ for 3 hours to give PVOH clear solution with 10%solid content, which was then cooled to room temperature. 25.19 parts of Capped Resin 1 and 7.98 parts of Uncapped Resin 1 were dissolved in 8.4 parts of Cumene at room temperature. Then 11.39 parts of Polymer 1 and 10.14 parts of Gum 1 were added into the above resin solution at 50-80 ℃ for 3-6 hours. The resulting mixture was mixed with 5.67 parts of Organic Surfactant 2 and 3.15 parts of PVA-220 solution by the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min to form a thick O/W (oil in water) phase. Then 28.08g water was gradually added under stirring until forming the base. The average particle size of the base was 0.55um.
In this Reference Example 1, the bases prepared as described above were used to make aqueous dispersions of silicone pressure sensitive adhesive compositions by combining each base and a curing agent. The peroxide curing agent was prepared by mixing 50g BPO and 50g Dispersant 1, PPH, for 30 mins to get the peroxide curing agent, which had a benzoyl peroxide content of 37.5%.
Two silicone pressure sensitive adhesive compositions were prepared by mixing a portion of each base (10 g) prepared as described above with 0.5 g the peroxide curing agent, prepared as described above, or 0.19 g of the aminosilane in Table 1. Each composition was mixed using the FlackTek SpeedMixer
TM DAC 150.1 FV-K at 3500 rpm for 2 min or batch mixer at 800 rpm for at least 5 min. The resulting compositions were coated on PET films of thickness 50 um and cured at 80 ℃ for 2 min and 170 ℃ for 3 min to obtain silicone pressure sensitive adhesive films on the PET. The Si-PSA film thickness could be controlled at 30-35um.
In this Reference Example 2, the samples prepared as described above were tested as follows:
Film appearance was evaluated visually.
Adhesion was tested according to CTM 0270 ADHESION –USER SELECTED PEEL ANGLE –PRESSURE SENSITIVE, as follows:
1) Cut coated crepe paper as 1 inch wide tape and adhesion on cleaned standard steel plate.
2) Place it under room temperature for 30 min.
3) And then peel the Si-PSA tape by the adhesion test machine.
Heat resistance was tested according to the following test method:
1) Cut coated crepe paper as 1 inch wide tape and adhesion on cleaned standard steel plate. Two samples were prepared using each composition.
2) Place the samples under room temperature for 30 min.
3) Place the samples into an oven at 200 ℃ for 30 min.
4) Peel one sample of the tape while the sample was at 200 ℃, and check the residual and migration visually. This is referred to as “Hot peel” .
5) Take out the steel plate with tape adhered thereto, and place it outside until cooling to room temperature. Then peel the tape, and check the residual and migration visually. This is referred to as “Cold peel” .
6) Rank the residual on a scale of 0 to 5, with 0 being the best (least residual) and 5 being the worst (most residual) .
The results of film appearance, adhesion and heat resistance including cold or hot peel are shown below in Tables 2 and 3.
Table 2 Comparative Examples
In Table 2, “N/A” denotes not applicable. Samples failed because they did not form a stable aqueous dispersion and could not be tested. In tables 2 and 3, heat resistance values ≤ 2 were desirable, and > 2 were undesirable. For a Si PSA to pass, both hot peel and cold peel tests using both curing agents had to have a value of no more than 2 to pass the heat resistance. Samples with transparent appearance were also desirable. Samples with adhesion > 700 g/in were desirable.
Table 3 Working Examples
An aqueous dispersion of a silicone pressure sensitive adhesive composition prepared using the base and curing agent described above can be applied to a substrate and cured with a beneficial combination of properties. The silicone pressure sensitive adhesive made as described above has a transparent appearance, adhesion > 700 g/in to polyethyelene terephthalate (PET) film, and excellent heat resistance (with a value ≤ 2) , regardless of curing agent selected, when tested according to both the hot peel and cold peel tests described in the Reference Examples described above. Without wishing to be bound by theory, it is thought that the use of the alkyl polyglycoside surfactant, particularly in combination with the use of cumene, provides a synergistic effect resulting in the Si PSA made from the aqueous dispersion of the silicone pressure sensitive adhesive base achieving this combination of properties.
Usage of Terms
The BRIEF SUMMARY OF THE INVENTION and ABSTRACT are hereby incorporated by reference. All amounts, ratios, and percentages are by weight unless otherwise indicated by the context of the specification. The articles ‘a’ , ‘an’ , and ‘the’ each refer to one or more, unless otherwise indicated by the context of the specification. terms “aqueous dispersion of a silicone pressure sensitive adhesive base” and “base” refer to an oil in water type dispersion including starting materials (A) , (B) , (C) , and (D) , as described above, but not including a curing agent (II) also described above. Said base may further comprise additional, optional starting materials, excluding the curing agent (II) described above. The term “aqueous dispersion of a silicone pressure sensitive adhesive composition” and “composition” refer to a combination prepared by combining a curing agent (II) as described above with the base. Said composition may further comprise additional, optional starting materials, as described above with respect to the base, however, one skilled in the art would recognize that one or more of the additional starting materials may be added to the base before combination with the curing agent, or one or more of the additional starting materials may be added to the composition (i.e., after combining the base and curing agent) .
The disclosure of ranges includes the range itself and also anything subsumed therein, as well as endpoints. For example, disclosure of a range of 1 to 20 includes not only the range of 1 to 20, including endpoints, but also 1, 4, 6.5, 10, 15, 16, and 20 individually, as well as any other number subsumed in the range. Furthermore, disclosure of a range of, for example, 1 to 20 includes the subsets of, for example, 1 to 6, 7 to 13, and 14 to 20, as well as any other subset subsumed in the range. Similarly, the disclosure of Markush groups includes the entire group and also any individual members and subgroups subsumed therein. For example, disclosure of the Markush group alkyl, alkenyl, and aryl includes the member alkyl individually; the subgroup alkyl and aryl; and any other individual member and subgroup subsumed therein.
Abbreviations used in this application are as defined below in Table 5.
Table 5
Abbreviation | Definition |
Abbreviation | Definition |
℃ | Degrees Celsius |
cm | centimeter |
cst | units for dynamic viscosity measured as described above |
DSC | Dow Silicones Corporation of Midland, Michigan, USA |
DIS | Dow Industrial Solutions, a department of TDCC |
FTIR | Fourier Transform-Infra Red |
g/in | Grams per inch (g/2.54 cm) |
g/mol | Grams per mole |
GPC | Gel permeation chromatography |
Me | methyl |
mm | millimeters |
Mn | Number average molecular weight |
Ph | phenyl |
rpm | revolutions per minute |
TDCC | The Dow Chemical Company of Midland, Michigan, USA |
μL or uL | microliters |
μm or um | micrometers |
Vi | vinyl |
Mn of the bis-hydroxyl-terminated polydiorganosiloxane and the polyorganosilicate resin may be measured by GPC according to the following technique. The chromatographic equipment was a Waters 2695 Separations Module equipped with a vacuum degasser, and a Waters 2414 refractive index detector. The separation was made with three Styragel
TM HR columns (300 mm × 7.8 mm) (molecular weight separation range of 100 to 4,000,000) , preceded by a Styragel
TM guard column (30 mm × 4.6 mm) . The analyses were performed using certified grade toluene flowing at 1.0 mL/min as the eluent, and the columns and detector were both heated to 45 ℃. 0.5%wt. /v sample was prepared by weighing 0.025 g of neat sample into a 12-mL glass vial and diluting with 5mL toluene. Sample solution was transferred to a glass autosampler vial after centrifuged or filtered through 0.45 μm PTFE filter. An injection volume of 100 μl was used and data was collected for 38 minutes. Data collection and analyses were performed using Waters Empower GPC software. Molecular weight averages were determined relative to a calibration curve (3rd order) created using polystyrene standards covering the molecular weight range of 370 g/mol –1,270,000 g/mol.
Viscosity of (A2) the bis-hydroxyl-terminated polydiorganosiloxane polymer used herein may be measured at 25 ℃ at 0.1 to 50 RPM on a Brookfield DV-III cone & plate viscometer with #CP-52 spindle, e.g., for polymers with viscosity of 120 to 250,000 mPa·s. One skilled in the art would recognize that as viscosity increases, rotation rate decreases.
Claims (15)
- An aqueous dispersion of a silicone pressure sensitive adhesive base, where said dispersion comprises starting materials (A) to (E) , wherestarting material (A) is a bis-hydroxyl-terminated polydiorganosiloxane;starting material (B) is a polyorganosilicate resin;starting material (C) is cumene, in an amount of 1 weight part to 25 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined;starting material (D) is a surfactant in an amount of 0.1 weight part to 20 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined, where the surfactant comprises(D1) an alkyl polyglycoside surfactant andoptionally (D2) a cosurfactant; andstarting material (E) is water.
- The aqueous dispersion of claim 1, where starting material (A) comprises:(A1) a gum of formula where each R 1 is an independently selected alkyl group of 1 to 12 carbon atoms, and subscript a has an average value sufficient to give the gum a plasticity of 20 mil (0.51 mm) to 80 mil (2.03 mm) ; and(A2) a polymer of formula each R 1 is an independently selected alkyl group of 1 to 12 carbon atoms, and subscript b < a, and subscript b has an average value sufficient to give the polymer viscosity ≤ 100,000 cSt measured at 25 ℃; andwhere a weight ratio of (A1) the gum/ (A2) the polymer [ (A1) / (A2) ratio] is 0.1/1 to 1/1.
- The aqueous dispersion of claim 2, where the (A1) / (A2) ratio is 0.67/1 to 1/1.
- The aqueous dispersion of claim 1, where starting material (B) comprises:(B1) a capped resin comprising unit formula (R M 3SiO 1/2) z (SiO 4/2) o (X 2 1/2) P, where X is a hydroxyl group, each R M is an independently selected alkyl group of 1 to 4 carbon atoms, subscripts z and o represent mole fractions of monofunctional and tetrafunctional units, respectively, z > 4, o > 1, subscript p has a value sufficient to give the capped resin a hydroxyl group content < 2 %, and (B1) the capped resin has a number average molecular weight of 1,500 g/mol to 5,000 g/mol measured by gel permeation chromatography; and(B2) an uncapped resin comprising unit formula (R M 3SiO 1/2) z’ (SiO 4/2) o’ (X 2 1/2) p’, where subscripts z’ and o’ represent mole fractions of monofunctional and tetrafunctional units, respectively, z’ > 4, o’ > 1, subscript h has a value sufficient to give the capped resin a hydroxyl group content ≥ 2%, and (B2) the uncapped resin has a number average molecular weight of 1,500 g/mol to 5,000 g/mol measured by gel permeation chromatography.
- The aqueous dispersion of any one of claims 1 to 4, where (B) the polyorganosilicate resin and (A) the bis-hydroxyl-terminated polydiorganosiloxane are present in a weight ratio [ (B) / (A) ratio] of 1/1 to 1.5/1.
- The aqueous dispersion of any one of claims 1 to 5, where cumene is present in an amount of 5 weight parts to 20 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- The aqueous dispersion of any one of claims 1 to 6, where starting material (D) the alkylpolyglycoside surfactant comprises an alkyl polyglucoside surfactant of formula: R 2O- (R 3O) c- (Z) d, where R 2 is an alkyl group, each R 3 is an indepently selected alkylene group of 2 to 4 carbon atoms, Z is a glucose moiety, subscript c is 0 to 10, and subscript d has an average value of 1 to 6.
- The aqueous dispersion of any one of claims 1 to 7, where starting material (D1) , the alkyl polyglycoside surfactant is present in an amount of 2 weight parts to 10 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined.
- The aqueous dispersion of any one of claims 1 to 8, where starting material (D2) the cosurfactant is present in an amount of 0.1%to 5%based on combined weights of (A) to (D) .
- The aqueous dispersion of any one of claims 1 to 9, where starting material (E) the water is present in an amount of 30 weight parts to 85 weight parts, per 100 weight parts of starting materials (A) to (D) combined.
- The aqueous dispersion of any one of claims 1 to 10, further comprising 0.5 weight part to 6 weight parts, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined, of a peroxide compound.
- The aqueous dispersion of any one of claims 1 to 10, further comprising 0.1 weight part to 6 weight part, per 100 weight parts of starting materials (A) , (B) , (C) , and (D) combined, of an aminosilane.
- A method for preparing the aqueous dispersion of any one of claims 1 to 10, the method comprising:1) dissolving (B) the polyorganosilicate resin in (C) the cumene to form a solution, and2) emulsifying the solution, (A) the bis-hydroxyl-terminated polydiorganosiloxane, (D) the surfactant, and (E) the water.
- A method for preparing an aqueous dispersion of a silicone pressure sensitive adhesive composition, the method comprising: combining the aqueous dispersion of claim 13 and a curing agent selected from the group consisting of a peroxide compound and an aminosilane.
- A method for forming a pressure sensitive adhesive article, the method comprising: optionally i) treating a surface of a substrate,ii) coating the surface of the substrate with the aqueous dispersion of the silicone pressure sensitive adhesive composition of claim 14,iii) removing water, andiv) curing the silicone pressure sensitive adhesive composition to form a silicone pressure sensitive adhesive on the surface of the substrate.
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JP2022555906A JP7343714B2 (en) | 2021-07-21 | 2021-07-21 | Methods of Preparation and Use of Aqueous Dispersions and Dispersions Based on Silicone Pressure Sensitive Adhesives |
CN202180029524.1A CN116134109B (en) | 2021-07-21 | 2021-07-21 | Aqueous dispersion of silicone pressure sensitive adhesive binder and methods of making and using the dispersion |
US17/793,786 US11781050B2 (en) | 2021-07-21 | 2021-07-21 | Aqueous dispersion of a silicone pressure sensitive adhesive base and methods for preparation and use of the dispersion |
KR1020227037118A KR102553392B1 (en) | 2021-07-21 | 2021-07-21 | Aqueous Dispersions of Silicone Pressure Sensitive Adhesive Bases and Methods of Making and Using Dispersions |
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US20230193096A1 (en) | 2023-06-22 |
KR20230015323A (en) | 2023-01-31 |
CN116134109A (en) | 2023-05-16 |
JP7343714B2 (en) | 2023-09-12 |
EP4150025A4 (en) | 2024-02-21 |
JP2023536377A (en) | 2023-08-25 |
CN116134109B (en) | 2024-04-26 |
KR102553392B1 (en) | 2023-07-11 |
US11781050B2 (en) | 2023-10-10 |
EP4150025A1 (en) | 2023-03-22 |
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