WO2022269031A1 - Kommutierzelle für einen inverter - Google Patents
Kommutierzelle für einen inverter Download PDFInfo
- Publication number
- WO2022269031A1 WO2022269031A1 PCT/EP2022/067325 EP2022067325W WO2022269031A1 WO 2022269031 A1 WO2022269031 A1 WO 2022269031A1 EP 2022067325 W EP2022067325 W EP 2022067325W WO 2022269031 A1 WO2022269031 A1 WO 2022269031A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- commutation cell
- circuit board
- circuit carrier
- current
- conductor track
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 claims abstract description 24
- 239000000919 ceramic Substances 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920002620 polyvinyl fluoride Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- CBECDWUDYQOTSW-UHFFFAOYSA-N 2-ethylbut-3-enal Chemical compound CCC(C=C)C=O CBECDWUDYQOTSW-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R15/00—Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
- G01R15/14—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
- G01R15/20—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
- G01R15/202—Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B61/00—Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N59/00—Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/40—Testing power supplies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0225—Single or multiple openings in a shielding, ground or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Definitions
- the invention relates to a commutation cell, in particular for an inverter.
- the commutation cell has, in particular, a ceramic circuit carrier and a semiconductor switch half-bridge.
- the commutation cell also has a current sensor which is designed and arranged to detect a phase current of the commutation cell.
- An integrated circuit is known from DE 102011 003998 B4, which has a semiconductor chip and a magnetic field sensor, the magnetic field sensor being designed to detect a magnetic field that is generated by a current that flows through the sintered metal layer.
- the commutation cell has a flexible printed circuit board which is in particular materially connected to the circuit carrier and is arranged parallel to the circuit carrier.
- the circuit carrier has a conductor track which is designed to carry the output current of the half-bridge.
- the current sensor is electrically connected to the flexible printed circuit board and arranged to detect a magnetic field generated by the conductor track, in particular through which current flows, and designed to generate a current signal that represents the current flowing in the conductor track.
- a structure that is particularly stable with respect to thermal expansion can be formed by means of the flexible printed circuit board. That can be advantageous
- the magnetic field to be detected by the current sensor can be passed through the flexible printed circuit board, so that the current sensor can be mechanically and electrically connected to the flexible printed circuit board in a cost-effective manner.
- the current sensor is preferably soldered to the flexible circuit board, sintered or glued by means of an electrically conductive adhesive.
- the commutation cell and the current sensor can be formed in a cost-effective manner.
- the flexible printed circuit board and the circuit carrier are materially bonded to one another lying flat on top of one another.
- the integral connection between the flexible printed circuit board and the circuit carrier is preferably formed by a soldered connection or an adhesive connection.
- a layered composite can advantageously be formed in this way, which can be produced at low cost.
- the conductor track is S-shaped in the region of the circuit carrier.
- a magnetic field reinforcement for detecting the current in the conductor track can advantageously be formed in this way.
- the conductor track is I-shaped in the region of the circuit carrier.
- the conductor track can thus have two recesses which enclose the I-shaped conductor track between one another and through which a magnetic field can be conducted for detection by the current sensor.
- the commutation cell has a shielding element.
- the shielding element is preferably formed between the current sensor and the conductor track.
- such an electric field generated by the conductor track of the circuit carrier, in particular a ceramic one cannot scatter into conductor tracks on the flexible printed circuit board or in electrical components connected to the flexible printed circuit board.
- the shielding element is covered by an electrically conductive layer of the flexible printed circuit board educated.
- the shielding element can be provided as part of the flexible printed circuit board in a cost-effective manner.
- the current sensor is formed by an in particular differentiating Hall sensor, with the Hall sensor having two sensor elements.
- the current sensor is preferably formed by a component designed for surface mounting with the flexible printed circuit board.
- the current sensor is preferably formed by an unpackaged semiconductor, also known as a bare die.
- the current sensor can thus advantageously be connected to the flexible printed circuit board in a cost-effective manner, in particular by means of reflow soldering.
- the conductor track of the ceramic circuit carrier in particular, has two cutouts that are adjacent to one another. More preferably, the shielding element has cutouts corresponding to the cutouts, which are arranged one above the other, in particular in an orthogonal projection—with the cutouts of the conductor track.
- two slots can be formed under the sensor cells, so that a magnetic field propagation of the magnetic field generated by the busbar is possible in the slots.
- the shielding element in particular a shielding layer, can largely inhibit or prevent capacitive coupling through parasitic capacitances between the current conductor and the current sensor, and thus coupling into a signal routing on the flexible printed circuit board.
- signal lines leading to the sensor are shielded by the shielding element. In this way, a capacitive coupling due to parasitic capacitances between the current conductor and the signal routing in the signal lines can advantageously be prevented.
- the shielding element is formed by an electrically conductive layer, in particular an inner layer, of the flexible printed circuit board, which is formed by at least one or two surrounding electrically insulating layers is isolated from the conductor track, or additionally from the current sensor.
- the flexible printed circuit board is preferably designed to be reversibly bendable in such a way that the printed circuit board can be bent without breaking.
- the flexible printed circuit board is preferably designed to be flexible or resilient in such a way that the printed circuit board can be bent at least at right angles or in a U-shape without breaking.
- a particularly vibration-resistant connection between the circuit carrier and the printed circuit board can advantageously be formed in this way in a cost-effective manner.
- the electrically insulating layer of the flexible printed circuit board is preferably designed to electrically insulate live conductor tracks of the circuit carrier, in particular high-voltage conductor tracks, from the at least one electrically conductive layer of the flexible printed circuit board, in particular low-voltage rewiring layer.
- the invention also relates to an inverter with a commutation cell of the type described above.
- the inverter has at least three phases for energizing an electrical machine, with at least one commutation cell being formed on the inverter for each of the phases.
- the commutation cell preferably has at least one semiconductor switch half-bridge, comprising a high-side semiconductor switch and a low-side semiconductor switch.
- Figure 1 shows an embodiment of a commutation cell for an inverter, in which a flexible printed circuit board and a circuit carrier are connected to one another lying flat on top of one another, and a current sensor is arranged on the flexible printed circuit board, a current flowing in the circuit carrier depending on a magnetic field generated by the current to detect, wherein a magnetic field generated by a conductor track of the circuit carrier can reach the current sensor through gaps in a shielding layer;
- FIG. 2 shows the commutation cell shown in FIG. 1 in a top view.
- FIG. 1 shows - schematically - an embodiment of a commutation cell 1 for an inverter in a sectional view.
- the commutation cell 1 has a circuit carrier 2, which in this exemplary embodiment is in the form of a ceramic circuit carrier and, for this purpose, has an electrically insulating ceramic layer 5, in particular an aluminum oxide layer or a silicon nitride layer.
- the circuit carrier 2 also has an electrically conductive layer 6, in particular a copper layer, for rewiring, which in this exemplary embodiment forms an output terminal of a semiconductor switch half-bridge—shown in more detail in Figure 2.
- the circuit carrier 2 also includes a rear side contact 7, which in this exemplary embodiment is formed by a A layer thickness of the ceramic layer is between 100 and 500 micrometers, for example, and a layer thickness of the redistribution layer and the back layer is between 150 and 800 micrometers, for example.
- the commutation cell 1 also includes a flexible printed circuit board 3.
- the flexible printed circuit board 3 has a plurality of electrically conductive layers, in particular copper layers, and electrically insulating layers, in particular polyimide layers.
- the electrically insulating layers have, for example, a thickness of between 40 and 100 microns, in this embodiment 60 microns.
- the electrically conductive layers have a thickness of between 15 and 50 micrometers.
- the flexible printed circuit board 3 has an electrically conductive rear side layer 11, in this exemplary embodiment a copper layer, which is designed for materially bonded connection to the circuit carrier 2.
- the electrically conductive rear-side layer 11 has a layer thickness of 18 micrometers.
- the flexible printed circuit board 3 also has an electrically insulating layer 12, in particular a polyimide layer, which is connected to the electrically conductive layer 11 one on top of the other—in particular by means of lamination.
- the flexible printed circuit board 3 also has an electrically conductive shielding layer 13, in particular a copper layer, which is connected to the electrically insulating layer 12, in particular by means of lamination, and together with the electrically conductive layer 11, the electrically insulating layer 12—in particular in the manner of a sandwich—between one another includes.
- an electrically conductive shielding layer 13 in particular a copper layer, which is connected to the electrically insulating layer 12, in particular by means of lamination, and together with the electrically conductive layer 11, the electrically insulating layer 12—in particular in the manner of a sandwich—between one another includes.
- the electrically conductive shielding layer 13 is connected repellently from the electrically insulating layer 12 to a further electrically insulating layer 14, so that the further electrically insulating layer 14 and the electrically insulating layer 12 enclose the shielding layer 13 - in particular in the manner of a sandwich - between one another, so in common form a layered composite of layers arranged flat on top of one another.
- the flexible circuit board 3 also has an electrically conductive top layer 15, which forms a rewiring layer in this exemplary embodiment.
- the electrically conductive layer 15 is connected to the further electrically insulating layer 14, in particular by means of lamination.
- the flexible circuit board 3 is integrally connected to the circuit carrier 2 by means of a solder 10 .
- the flexible printed circuit board 3 can also be connected to the circuit carrier 2 by means of an adhesive, in particular an electrically conductive adhesive, or by means of a gel, in particular silicone gel.
- the electrically conductive layer 6 of the circuit carrier 2 is formed along a width section 31 of the circuit carrier 2, on the sides of which the electrically conductive layer 6 has a cutout 8 and a cutout 9 in the sectional view shown in FIG.
- the electrically conductive layer 6 is thus constricted by means of the cutouts 8 and 9, so that a current which flows perpendicular to the sectional plane shown in Figure 1 in the electrically conductive layer 6 can generate a magnetic field 20 which has a vertical component in the Recesses 8 and 9 extends.
- the flexible printed circuit board 3 is connected to a magnetic field sensor 4 in this exemplary embodiment.
- the magnetic field sensor 4 which is part of the commutation cell 1 in this exemplary embodiment, is connected to the further electrically insulating layer 14 by means of a connecting means 16, for example an adhesive or a solder.
- the flexible printed circuit board 3 has a cutout 19 in the area of the magnetic field sensor 4 , the cutout 19 being formed in the electrically conductive layer, in particular the rewiring layer 15 .
- the magnetic field sensor 4 is thus inserted into a recess in the rewiring layer 15 .
- the magnetic field sensor 4 has two Hall sensors 17 and 18 which are each embedded or accommodated in a housing or in a solid material of the magnetic field sensor 4 .
- the Hall sensors 17 and 18 are each designed and arranged to detect a vertical component of the magnetic field 20 and, in particular, to generate an electrical output signal which represents the magnetic field strength of the magnetic field 20 by means of subtraction.
- the magnetic field sensor 4 is arranged in the area of the width section 31 in an orthogonal projection above the electrically conductive layer 6, so that around the electrically conductive layer 6, which in this exemplary embodiment forms an electrical flat conductor, in encircling magnetic field lines of the magnetic field 20 through the Hall sensors 17 and 18 gone.
- the flexible printed circuit board 3 has two cutouts 25 and 26 in the area of the shielding layer 13, which are each aligned with the cutout 8 and the cutout 9, in particular in an orthogonal projection.
- the recesses 8 and 25 extend on the width portion 29, and the recesses 26 and 9 extend on the width portion 30.
- the width portions 29 and 30 are adjacent to the width portion 31 on opposite sides, respectively.
- the magnetic field lines 20 can thus pass through the cutouts 25 and 26 and are thus not impeded by the shielding layer 13 .
- the shielding layer 13 is designed to adequately shield an electric field generated by the electrically conductive layer 6 from the current sensor 4 .
- FIG. 2 shows the commutation cell 1 already shown in FIG. 1 in a top view.
- the commutation cell 1 includes two semiconductor switches 21 and 22, which together form a semiconductor switch half-bridge.
- the semiconductor switch 21 is, for example, a low-side semiconductor switch of the semiconductor switch half-bridge
- the semiconductor switch 22 is a high-side semiconductor switch of the semiconductor switch half-bridge.
- the semiconductor switches 21 and 22 are each electrically connected to the electrically conductive layer 6 with a contact gap connection, so that the electrically conductive layer 6 forms an output connection of the half-bridge formed by the semiconductor switches 21 and 22 .
- the electrically conductive layer 6 is T-shaped in this exemplary embodiment, with the output current being able to flow on a T-bar on which the constrictions formed by the cutouts 8 and 9 are formed.
- the flexible printed circuit board 3 is arranged in the area of the cutouts 8 and 9 in such a way that the cutout 25 in the shielding layer 13 of the flexible printed circuit board is aligned with the cutout 8 in the electrically conductive layer 6 of the circuit carrier 2—in particular in an orthogonal projection.
- the output current of the semiconductor switch half-bridge can flow in the electrically conductive layer along a longitudinal extension 32 on a web 33 formed between the cutouts 8 and 9 . In the sectional view shown in Figure 1, the web 33 extends over the width section 31.
- the flexible printed circuit board 3 has an electrically conductive rewiring layer 27 as the top layer, which is electrically conductively connected to the current sensor 4 by means of a bonding wire 28 .
- the current sensor 4 is in the form of an SMD component and is in the form of surface soldering to the redistribution layer.
- the semiconductor switch 21 is electrically connected to the flexible printed circuit board 3 by means of bonding wires for its control, of which a bonding wire 23 is designated as an example.
- the semiconductor switch 22 is electrically connected to the flexible printed circuit board 3 by means of bonding wires, of which a bonding wire 24 is designated as an example.
- the flexible printed circuit board 3 can thus form a control level for the commutation cell 1, in which low-voltage signals for driving the semiconductor switches 21 and 22, as well as sensor signals from the magnetic field sensor 4, flow.
- the circuit carrier 2 can form a high-voltage level in which the electrical potential switched by the semiconductor switches 21 and 22 can be formed.
- an electrical field extending between the high-voltage level, formed by the circuit carrier 2, and the low-voltage level, formed by the flexible printed circuit board 3, can be adequately shielded.
- the field lines of magnetic field 20 to be detected by magnetic field sensor 4 can propagate sufficiently in cutouts 8, 9 of electrically conductive layer 6 and in cutouts 25 or 26 arranged parallel thereto, so that Hall sensors 17 and 18 detect magnetic field 20 can.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Instrument Details And Bridges, And Automatic Balancing Devices (AREA)
- Inverter Devices (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202280044365.7A CN117546030A (zh) | 2021-06-25 | 2022-06-24 | 用于逆变器的换向单元 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102021206621.6 | 2021-06-25 | ||
DE102021206621.6A DE102021206621A1 (de) | 2021-06-25 | 2021-06-25 | Kommutierzelle für einen Inverter |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2022269031A1 true WO2022269031A1 (de) | 2022-12-29 |
Family
ID=82492649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2022/067325 WO2022269031A1 (de) | 2021-06-25 | 2022-06-24 | Kommutierzelle für einen inverter |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN117546030A (de) |
DE (1) | DE102021206621A1 (de) |
WO (1) | WO2022269031A1 (de) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011003998A1 (de) * | 2010-02-11 | 2011-08-11 | Infineon Technologies AG, 85579 | Stromsensor, der eine gesinterte Metallschicht umfasst |
DE102019124391A1 (de) * | 2019-09-11 | 2021-03-11 | Sensitec Gmbh | Magnetfeldbasierter Stromsensor zur frequenzkompensierten Messung von Wechselströmen |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9678173B2 (en) | 2013-05-03 | 2017-06-13 | Infineon Technologies Ag | Power module with integrated current sensor |
US10699976B1 (en) | 2019-01-29 | 2020-06-30 | Infineon Technologies Ag | Semiconductor module with external power sensor |
DE102019003373B4 (de) | 2019-05-14 | 2023-08-10 | Infineon Technologies Austria Ag | Leistungshalbleitervorrichtung mit integrierter Strommessung und Leistungsmodul diese aufweisend und Verfahren zum Messen eines Stroms darin |
-
2021
- 2021-06-25 DE DE102021206621.6A patent/DE102021206621A1/de active Pending
-
2022
- 2022-06-24 WO PCT/EP2022/067325 patent/WO2022269031A1/de active Application Filing
- 2022-06-24 CN CN202280044365.7A patent/CN117546030A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011003998A1 (de) * | 2010-02-11 | 2011-08-11 | Infineon Technologies AG, 85579 | Stromsensor, der eine gesinterte Metallschicht umfasst |
DE102011003998B4 (de) | 2010-02-11 | 2019-07-25 | Infineon Technologies Ag | Stromsensor, der eine gesinterte Metallschicht umfasst |
DE102019124391A1 (de) * | 2019-09-11 | 2021-03-11 | Sensitec Gmbh | Magnetfeldbasierter Stromsensor zur frequenzkompensierten Messung von Wechselströmen |
Also Published As
Publication number | Publication date |
---|---|
DE102021206621A1 (de) | 2022-12-29 |
CN117546030A (zh) | 2024-02-09 |
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