WO2022268017A1 - 电子设备 - Google Patents
电子设备 Download PDFInfo
- Publication number
- WO2022268017A1 WO2022268017A1 PCT/CN2022/099747 CN2022099747W WO2022268017A1 WO 2022268017 A1 WO2022268017 A1 WO 2022268017A1 CN 2022099747 W CN2022099747 W CN 2022099747W WO 2022268017 A1 WO2022268017 A1 WO 2022268017A1
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- WO
- WIPO (PCT)
- Prior art keywords
- tongue
- electronic device
- connection
- hole
- cavity
- Prior art date
Links
- 238000005530 etching Methods 0.000 claims description 2
- 210000002105 tongue Anatomy 0.000 description 66
- 238000000034 method Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 7
- 238000001746 injection moulding Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 230000003190 augmentative effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
- H01R13/521—Sealing between contact members and housing, e.g. sealing insert
Definitions
- the present application belongs to the technical field of mobile terminal equipment, and specifically relates to an electronic equipment.
- the electronic device is usually provided with a data interface, and the electronic device can be connected with other external devices through the tongue provided in the data interface.
- the tongue in the data interface can not only charge the electronic device, but also realize the data mutual transmission function between the electronic device and other external devices such as PC (personal computer).
- the data interface on the electronic device taking the currently more commonly used Type-C interface as an example, is usually arranged on the frame of the device. In fact, the position of the data interface on the device frame is mainly affected by the assembly position of the tongue.
- the tongues in the data interface are mostly welded plate structures, which are fixed on the circuit board of the electronic device by welding. Therefore, the layout position of the data interface on the frame can be determined by the height of the circuit board inside the electronic device. decision, and the existing data interface usually exhibits an off-center position on one side of the device frame, as shown in FIG. 4 .
- the outside of the tongue usually needs to be wrapped with a casing to support and protect the tongue and assist in positioning the data interface.
- the purpose of this application is to provide an electronic device that at least solves the problem that the assembly scheme of the inner tongue of the existing data interface tends to cause the thickness of the whole machine to be relatively large, and the position of the data interface on the frame of the device tends to be eccentric and cannot be centered.
- An embodiment of the present application proposes an electronic device, which includes:
- the casing has a through hole and a cavity communicating with the through hole;
- circuit board is arranged in the cavity
- the tongue piece is arranged in the cavity and blocks the through hole;
- a connecting device the connecting device is arranged in the cavity, one end of the connecting device is provided with a connecting part, the connecting part is connected to the tongue, and the other end of the connecting device is connected to the circuit board;
- An external device can be connected to the electronic device through the tongue, and the tongue is used for transmitting data between the electronic device and the external device.
- a new assembly scheme is provided for the tongue in the data interface.
- the traditional scheme of welding the tongue with the circuit board is changed, which makes the circuit
- the position of the plate no longer affects the position of the tongue, which is conducive to the data interface being in the center on one side of the housing, and cancels the housing outside the tongue, which helps to reduce the thickness of the data interface, and then
- the size of the electronic device in the thickness direction can be reduced; and, if the casing outside the tongue is canceled, the gap between the tongue and the casing is not involved, so that the formed data interface is equivalent to a blind hole structure, so that the external Moisture cannot enter the interior of the electronic device through this, and there is no need to use additional waterproof auxiliary materials to waterproof and seal the position of the data interface.
- FIG. 1 is one of the structural schematic diagrams of an electronic device according to an embodiment of the present application.
- Fig. 2 is a schematic diagram of an assembly method of a data interface of an existing electronic device
- Fig. 3 is a sectional view along A-A in Fig. 2;
- Fig. 4 is a schematic diagram of the position of the data interface of the existing electronic equipment
- FIG. 5 is a second structural schematic diagram of an electronic device according to an embodiment of the present application.
- FIG. 6 is a schematic diagram of a partial structure of an electronic device according to an embodiment of the present application.
- Fig. 7 is one of the structural schematic diagrams of the connecting device of the electronic device according to the embodiment of the present application.
- FIG. 8 is a second structural schematic diagram of a connecting device of an electronic device according to an embodiment of the present application.
- connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it may be mechanically connected or electrically connected; it may be directly connected or indirectly connected through an intermediary, and it may be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application in specific situations.
- the electronic device may be a terminal, or other devices other than the terminal.
- the electronic device can be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle electronic device, a mobile Internet device (Mobile Internet Device, MID), an augmented reality (augmented reality, AR)/virtual reality (virtual reality, VR) ) equipment, robots, wearable devices, ultra-mobile personal computer (ultra-mobile personal computer, UMPC), netbook or personal digital assistant (personal digital assistant, PDA), etc.
- the electronic equipment includes: a housing 1, a circuit board, a tongue 2 and a connecting device 3; the housing 1 has a through hole 101 and A cavity 102 communicating with the through hole 101; the circuit board is arranged in the cavity 102; the tongue 2 is arranged in the cavity 102 and blocks the through hole 101; the connection One end of the device 3 is provided with a connecting portion, the connecting portion is connected to the tongue 2, and the other end of the connecting device 3 is connected to the circuit board; external equipment can be connected to the electronic device through the tongue 2.
- device connection the tongue 2 is used to transmit data between the electronic device and the external device.
- the circuit board (for example, PCB board) is an important electronic component in electronic equipment, a support body for electronic components, and a carrier for electrical interconnection between electronic components.
- the circuit board may be, for example, a main board in the electronic device, and of course it may also be a sub-board, which is not limited in the present application.
- the scheme of the embodiment of the present application provides a new type of assembly scheme for the tongue in the data interface on the electronic device.
- the traditional method of welding the tongue and the circuit board is changed. solution, which makes the position of the circuit board no longer affect the position of the tongue, which is beneficial for the data interface to be in the center on one side of the device casing, and cancels the traditional design of setting the casing outside the tongue 2, which It is helpful to reduce the thickness of the data interface, thereby reducing the size of the electronic device in the thickness direction; and, by canceling the outer casing of the tongue 2, it does not involve the relationship between the tongue 2 and the casing 1.
- the gap between them makes the formed data interface equivalent to a blind hole structure, so that external moisture cannot enter the interior of the electronic device through this, and there is no need to use additional waterproof accessories (for example, waterproof rubber ring) to the data interface.
- the position is waterproof sealed.
- the tongue 2 is electrically connected to the circuit board in the electronic device through the connecting device 3, wherein the tongue 2 and the connecting device 3 are connected by contact , which changes the previous plug-in connection method, which is more flexible and convenient, and does not require plug-in operation.
- the data interface of the existing electronic equipment taking the most commonly used Type-C interface as an example, it is fixed on the PCB board 6 of the electronic equipment by welding, can refer to the four welding pins 5 shown in Figure 2, based on Therefore, the position of the Type-C interface on the device frame can be determined by the height of the PCB board 6 inside the electronic device.
- the tongue 2 of the Type-C interface usually needs to be wrapped with the case 7, and there is a gap between the case 7 and the tongue 2, and the thickness of this position usually determines the overall The thickness of the machine; and due to the existence of this gap and the exposed Type-C interface, it is easy to cause external moisture to flow in through the Type-C interface and this gap and damage the PCB board 6 and the electronic components on the PCB board 6. It is necessary to use additional waterproof material (for example, a silicone ring) to cooperate with the casing 7 to improve the waterproofness. Due to the position of the circuit board and the thickness of the Type-C interface, it is difficult to ensure that the Type-C interface is in a centered position on one side of the device frame, resulting in an eccentric position in appearance.
- additional waterproof material for example, a silicone ring
- the dotted line on it indicates the center line of the Type-C interface
- the solid line indicates the center line of the frame.
- D shows that the position of the Type-C interface is in Appears to be eccentric.
- the solution of the present application can improve this situation by making the position of the data interface center, as shown in FIG. 1 .
- the housing 1 includes a frame, the through hole 101 is arranged on one side of the frame, and the through hole 101 can be located in the center s position.
- connection plugs such as USB plugs or Type-C plugs, etc.
- earphone plugs can also be used. There is no limit to this in the application.
- the tongue piece 2 is directly connected to the casing 1 (such as a frame), and the design of wrapping the casing outside the tongue piece 2 can be cancelled.
- the casing 1 such as a frame
- it can reduce the thickness of the data interface, thereby reducing the thickness of the electronic device.
- the gap between the tongue 2 and the casing is not involved, so that the formed data interface is equivalent to a blind hole structure, and external water cannot enter the interior of the electronic device through this, so there is no need to use Additional waterproof auxiliary materials (for example, waterproof rubber ring) perform waterproof sealing on the position of the data interface. That is to say, the structural design adopted in this application has good airtightness and can improve waterproof performance.
- the electronic device as shown in FIG. 6 , further includes a mount 4, the mount 4 is disposed in the cavity 102, and the tongue 2 is connected to the mount 4;
- the mounting base 4 is provided with a first clamping portion 401, and the housing 1 is provided with a second clamping portion.
- the mounting base 4 is connected to the housing 1 in a clamping manner, which can block the through hole 101 .
- the tongue piece 2 can be connected with the housing 1 through a mounting seat 4 , so that the tongue piece 2 and the housing 1 can be connected together.
- the mounting seat 4 is connected to the housing 1 by snap-fitting, which is relatively simple and convenient to assemble and disassemble.
- the mounting base 4 can block the through hole 101 to prevent external moisture from entering the electronic device.
- one of the first engaging portion 401 and the second engaging portion is a raised structure with a trapezoidal cross section, and the other of the first engaging portion 401 and the second engaging portion It is a limiting groove matching the shape of the protruding structure. In this way, the first engaging portion 401 can form a reliable and stable engaging connection with the second engaging portion.
- protruding structure is not limited to the above-mentioned trapezoidal cross-section, and may also be in other shapes, such as semicircle, triangle, rectangle, etc., which is not limited in the present application.
- a connection structure is provided at one end of the tongue 2; a through hole is provided on the mounting base 4, and the tongue 2 is disposed on the mounting base 4 away from the cavity 102 , the connection structure passes through the through hole, and the connection structure is in contact with the connection part on the connection device 3 .
- the tongue 2 is provided with a connection structure for connecting with the connection device 3, and the connection structure passes through the through hole on the mounting base 4 to facilitate the connection with the connection device 3.
- the connecting part of the contact connection Therefore, the tongue 2 can be electrically connected to the circuit board in the electronic device through the connecting device 3 .
- a side of the mounting base 4 close to the cavity 102 is coplanar with a surface of the housing 1 close to the cavity 102 .
- This design can provide more space for the cavity 102 while ensuring the reliability of the connection between the mounting base 4 and the housing 1 .
- the mounting seat 4 is, for example, a plastic part.
- the tongue 2 can be connected with the mounting seat 4 by injection molding, so that the tongue 2 and the mounting seat 4 are connected into an integrated structure. In this way, the tongue 2 and the mounting seat 4 The stability of the connection is better.
- the mounting seat 4 can also form an integrated structure with the housing 1 (eg frame) by injection molding.
- a housing with tongues can be formed, which can be used in electronic devices such as smartphones.
- the way of injection molding can adopt the way of insert injection molding, for example.
- the housing 1, especially the frame therein, is the main load-bearing structural member of electronic devices such as smart phones, and can be used to support the screen and provide strength.
- the tongue piece 2 can be integrated with the frame by insert injection molding when processing the frame.
- the tongue piece 2 can also be bonded and fixed to the mounting seat 4 by dispensing glue.
- connection method between the tongue piece 2 and the mounting seat 4 there is no limitation on the connection method between the tongue piece 2 and the mounting seat 4, and it is not limited to the above-mentioned connection method of injection molding or glue dispensing, and other fixed connection methods are also possible. , as long as the tongue piece 2 can be firmly connected with the installation base 1 .
- connection between the mounting base 4 and the housing 1 is not limited to the above-mentioned locking connection and injection molding.
- one end of the connecting device 3 is provided with a connecting portion, and the connecting portion is contact-connected to the tongue 2 , wherein , the connection portion includes a plurality of connection contacts 301 , and the tongue 2 is provided with a plurality of connection contacts matching the plurality of connection contacts 301 .
- connection device 3 One end of the connection device 3 is provided with a plurality of connection contacts 301, and the plurality of connection contacts 301 can form a contact connection with the plurality of connection contacts on the tongue 2 and conduct electrical conduction. . That is to say, in the solution of the present application, it is designed to connect the tongue piece 2 with the connecting device 3 by way of point contact.
- This contact connection method is more flexible, and compared with the traditional plug-in connection, the connection method is simpler and easier to disassemble.
- the connecting contact 301 may have a telescoping function, so as to facilitate engineering assembly.
- a plurality of connecting contacts 301 are arranged in a matrix with intervals between them. So that each of the connecting contacts 301 can form a contact connection with the corresponding connecting contact on the tongue 2 .
- the other end of the connecting device 3 is provided with a spring contact area 302, and the circuit board can communicate with the active contact area 302 through the spring.
- the spring contact area 302 is in contact with each other to realize electrical conduction.
- the elastic piece is, for example, pre-set at a designated position on the circuit board.
- the elastic piece is, for example, made of metal.
- the elastic contact area 302 is used to realize electrical conduction with the circuit board.
- the elastic contact area 302 is made of metal material, for example.
- connection device 3 may also be connected to the circuit board through an electrical connector.
- the electrical connector is, for example, a board-to-board connector (BTB connector).
- BTB connector board-to-board connector
- other electrical connection devices may also be used, which is not limited in the present application.
- the connecting device 3 is responsible for communicating the tongue piece 2 with the circuit board, and the circuit board may be a main board or a sub-board of an electronic device.
- the tongue 2 is transferred to the circuit board through the connecting device 3 .
- the tongue 2 does not need to be directly connected to the circuit board, and the position of the tongue does not need to be considered when designing the stack of electronic devices, which helps to ensure that the data interface can always keep the appearance centered. It helps to improve the appearance expressiveness of electronic equipment, and can also improve the freedom of stacking design.
- both sides of the connecting device 3 are respectively connected to the housing 1 through fasteners. It is used to fix the connecting device 3 on the housing 1 .
- both sides of the connecting device 3 are fixedly connected to the frame by screws.
- connecting holes 303 are respectively provided on both sides of the connecting device 3 .
- a connection device installation position is provided in the cavity 102, and an assembly hole 103 is provided on it, and the assembly hole 103 can be used to cooperate with the connection hole on the connection device 3, and then through the screw Fasteners such as bolts or bolts can connect the connecting device 3 and the frame together.
- a circuit area is provided on the surface of the tongue 2, and a conductive circuit pattern is formed in the circuit area by etching.
- the conductive circuit pattern is engraved on the tongue 2 , which can be used for connecting external data lines.
- references to the terms “one embodiment,” “some embodiments,” “exemplary embodiments,” “example,” “specific examples,” or “some examples” are intended to mean that the implementation A specific feature, structure, material, or characteristic described by an embodiment or example is included in at least one embodiment or example of the present application.
- schematic representations of the above terms do not necessarily refer to the same embodiment or example.
- the specific features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
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- Casings For Electric Apparatus (AREA)
Abstract
一种电子设备,包括:壳体,电路板,舌片以及连接器件,壳体具有通孔和与通孔连通的腔体;电路板设置于腔体内;舌片设置于通孔内并封堵通孔;连接器件设置于腔体内,连接器件的一端设置有连接部,连接部与舌片接触连接,连接器件的另一端与电路板连接;外部设备可通过舌片与电子设备连接,舌片用于在电子设备与外部设备之间传输数据。
Description
相关申请的交叉引用
本申请要求于2021年06月23日提交的申请号为2021107015559,发明名称为“电子设备”的中国专利申请的优先权,其通过引用方式全部并入本申请。
本申请属于移动终端设备技术领域,具体涉及一种电子设备。
电子设备上通常设置有数据接口,电子设备可以通过设置在数据接口内的舌片与其他外部设备进行连接。通过数据接口内的舌片不仅可以实现为电子设备充电,还可以实现电子设备与PC(个人计算机)等其他外部设备之间的数据互传功能。电子设备上的数据接口,以目前较为常用的Type-C接口为例,其通常设置在设备的框架上。而实际上,数据接口在设备框架上的位置主要受到舌片装配位置的影响。
相关技术中,数据接口中的舌片多为焊板式结构,其是通过焊接的方式固定在电子设备的电路板上,因此,数据接口在框架上的布设位置可由电路板在电子设备内部的高度决定,而现有的数据接口在设备框架的其中一侧上通常表现出位置偏心的情况,可参见图4所示。并且,舌片外通常需要用机壳包裹,以起到支撑和保护舌片以及辅助定位数据接口的作用。但是,舌片外的机壳与舌片之间具有一定的间隙,此位置的厚度通常决定了整机的厚度;而且,此间隙的存在以及数据接口外露,容易导致外部的水分经数据接口和此间隙流入而损伤电路板及电路板上的电子元器件,这就需要使用额外的防水物料(例如硅胶圈)与机壳配合。
发明内容
本申请旨在提供一种电子设备,至少解决现有数据接口内舌片的装配方案易导致整机的厚度尺寸较大,以及数据接口在设备的框架上容易出现位置偏心、不能居中的问题。
为了解决上述技术问题,本申请是这样实现的:
本申请实施例提出了一种电子设备,其包括:
壳体,所述壳体具有通孔和与所述通孔连通的腔体;
电路板,所述电路板设置于所述腔体内;
舌片,所述舌片设置于所述腔体内并封堵所述通孔;
连接器件,所述连接器件设置于腔体内,所述连接器件的一端设置有连接部,所述连接部与所述舌片接触连接,所述连接器件的另一端与所述电路板连接;
外部设备可通过所述舌片与所述电子设备连接,所述舌片用于在所述电子设备与所述外部设备之间传输数据。
在本申请的实施例中,为数据接口内的舌片提供了一种新型的装配方案,通过将舌片与壳体相连,改变了传统的将舌片与电路板焊接的方案,这使得电路板的位置不再影响所述舌片的位置,有利于数据接口在外壳其中一侧部上处于居中位置,同时取消了在舌片外设置机壳,这有助于降低数据接口的厚度,进而可降低电子设备整机厚度方向的尺寸;并且,取消舌片外的机壳,也就不涉及舌片与机壳之间存在的间隙,使得形成的数据接口相当于盲孔结构,这样外部的水分就不能通过此处进入到电子设备内部,也就无需使用额外的防水辅料对数据接口位置进行防水密封。
本申请的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。
本申请的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:
图1是根据本申请实施例的电子设备的结构示意图之一;
图2是现有电子设备的数据接口的组装方式示意图;
图3是图2中沿A-A的剖视图;
图4是现有电子设备的数据接口的位置示意图;
图5是根据本申请实施例的电子设备的结构示意图之二;
图6是根据本申请实施例的电子设备的局部结构示意图;
图7是根据本申请实施例的电子设备的连接器件的结构示意图之一;
图8是根据本申请实施例的电子设备的连接器件的结构示意图之二。
附图标记:
1-壳体,101-通孔,102-腔体,103-装配孔,2-舌片,3-连接器件,301-连接触头,302-弹片触点区域,303-连接孔,4-安装座,401-第一卡接部,5-焊脚,6-PCB板,7-机壳。
下面将详细描述本申请的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本申请,而不能理解为对本申请的限制。基于本申请中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。
本申请的说明书和权利要求书中的术语“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中,除非另有说明,“多个”的含义是两个或两个以上。此外,说明书以及权利要求中“和/或”表示所连接对象的至少其中之一,字符“/”,一般表示前后关联对象是一种“或”的关系。
在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本申请中的具体含义。
下面结合图1至图8描述根据本申请实施例提供的电子设备。
当然,在本申请实施例中,该电子设备可以是终端,也可以为除终端之外的其他设备。示例性的,电子设备可以为手机、平板电脑、笔记本电脑、掌上电脑、车载电子设备、移动上网装置(Mobile Internet Device,MID)、增强现实(augmented reality,AR)/虚拟现实(virtual reality,VR)设备、机器人、可穿戴设备、超级移动个人计算机(ultra-mobile personal computer,UMPC)、上网本或者个人数字助理(personal digital assistant,PDA)等,还可以为服务器、网络附属存储器(Network Attached Storage,NAS)、个人计算机(personal computer,PC)、电视机(television,TV)、柜员机或者自助机等,本申请实施例不作具体限定。
本申请实施例提供的电子设备,参见图1、图5和图6所示,其包括有:壳体1,电路板,舌片2以及连接器件3;所述壳体1具有通孔101和与所述通孔101连通的腔体102;所述电路板设置于所述腔体102内;所述舌片2设置于所述腔体102内并封堵所述通孔101;所述连接器件3的一端设置有连接部,所述连接部与所述舌片2接触连接,所述连接器件3的另一端与所 述电路板连接;外部设备可通过所述舌片2与所述电子设备连接,所述舌片2用于在所述电子设备与所述外部设备之间传输数据。
其中,所述电路板(例如,PCB板)是电子设备中重要的电子部件,是电子元器件的支撑体,也是电子元器件之间电气相互连接的载体。
在本申请的实施例中,所述电路板例如可以是电子设备内的主板,当然也可以是副板,本申请中对此不作限制。
本申请实施例的方案,为电子设备上数据接口内的舌片提供了一种新型的组装方案,通过将舌片2与壳体1直接连接,改变了传统的将舌片与电路板焊接的方案,这使得电路板的位置不再影响舌片的位置,有利于数据接口在设备外壳其中一侧部上处于居中位置,同时取消了在所述舌片2外设置机壳的传统设计,这有助于降低数据接口的厚度,进而可降低电子设备整机厚度方向的尺寸;并且,通过取消所述舌片2外包裹的机壳,也就不涉及所述舌片2与机壳1之间的间隙,使得形成的数据接口相当于为盲孔结构,这样外部的水分就不能通过此处进入到电子设备的内部,也就无需使用额外的防水辅料(例如,防水胶圈)对数据接口位置进行防水密封。
并且,本申请的实施例中还设计所述舌片2通过所述连接器件3与电子设备内的电路板进行电性连接,其中,所述舌片2与所述连接器件3为接触式连接,这改变了以往插接的连接方式,该连接方式更为灵活、方便,无需插拔操作。
现有电子设备的数据接口,以最为常用的Type-C接口为例,其是通过焊接的方式固定在电子设备的PCB板6上,可参见图2中示出的四个焊脚5,基于此,Type-C接口在设备框架上的位置可由其中的PCB板6在电子设备内部的高度决定。并且,参见图2和图3所示,Type-C接口的舌片2外通常需要用机壳7进行包裹,而机壳7与舌片2之间具有间隙,此位置的厚度通常决定了整机的厚度;而且由于此间隙的存在,以及Type-C接口外露的原因,容易导致外部的水分经Type-C接口和此间隙流入而损伤PCB板6及PCB板6上的电子元器件,这就需要使用额外的防水物料(例如,硅胶圈)与机壳7 配合才能提升防水性。由于电路板的位置以及Type-C接口的厚度,难以保证Type-C接口在设备框架的其中一侧上处于居中的位置,从而出现外观上位置偏心的情况。
参见图4所示,其上的虚线表示Type-C接口的中心线,实线表示框架的中心线,二者并未重合,而是有一定差值D,这说明Type-C接口的位置在外观上呈现出偏心的情况。而本申请的方案能改善该情况,使数据接口的位置居中,可参见图1所示。
在本申请的实施例中,参见图1和图5所示,所述壳体1包括框架,所述通孔101设置在所述框架的其中一侧上,且所述通孔101可位于居中的位置。
其中,本领域技术人员可以根据具体需要灵活调整所述通孔101的具体形状,以适应于不同的连接插头,例如:USB插头或者Type-C插头等,此外,也可以是耳机插头等,本申请中对此不作限制。
在本申请的实施例中设计,所述舌片2与所述壳体1(例如框架)直接相连,可取消在所述舌片2外包裹机壳的设计。一方面,其可以降低数据接口的厚度,进而降低电子设备的厚度。另一方面,其中不涉及所述舌片2与机壳之间的间隙,使得形成的数据接口相当于为盲孔结构,外部的水就不能通过此处进入到电子设备的内部,从而无需使用额外的防水辅料(例如,防水胶圈)对数据接口位置进行防水密封。也就是说,本申请中采用的结构设计密封性好,可提升防水性能。
本申请实施例的电子设备,参见图6所示,其还包括安装座4,所述安装座4设置于所述腔体102内,所述舌片2与所述安装座4连接;所述安装座4上设置有第一卡接部401,所述壳体1上设置有第二卡接部,所述安装座4与所述壳体1以卡合方式相连接,可封堵所述通孔101。
也就是说,所述舌片2可通过一个所述安装座4与所述壳体1相连,以使所述舌片2与所述壳体1能够连接在一起。并且,所述安装座4与所述壳体1之间为卡合连接,该连接方式较为简单,且组装和拆卸都比较方便。所 述安装座4可以封堵住所述通孔101,以防止外部水分进入到电子设备内部。
其中,所述第一卡接部401和所述第二卡接部其中的一个为截面呈梯形的凸起结构,所述第一卡接部401和所述第二卡接部其中的另一个为与所述凸起结构形状相匹配的限位凹槽。这样,所述第一卡接部401可以与所述第二卡接部形成可靠、稳定的卡合连接。
需要说明的是,所述凸起结构并不限于为上述的截面呈梯形,也可以是其他形状,例如,半圆形、三角形、矩形等,本申请对此不作限制。
在本申请一个可选的例子中,所述舌片2的一端设置有连接结构;所述安装座4上设置有贯通孔,所述舌片2设置于所述安装座4背离所述腔体102的一侧,所述连接结构穿过所述贯通孔,且所述连接结构与所述连接器件3上的所述连接部接触连接。
也就是说,所述舌片2上设置有用于与所述连接器件3连接的连接结构,而该连接结构从所述安装座4上的贯通孔穿出,以方便与所述连接器件3上的连接部进行接触连接。从而可实现所述舌片2通过所述连接器件3与电子设备内的电路板电性导通。
在本申请一个可选的例子中,参见图6所示,所述安装座4靠近所述腔体102的一侧面与所述壳体1靠近所述腔体102的面为共面设置。该设计可以在保证所述安装座4与所述壳体1连接可靠性的同时,给所述腔体102提供更多的空间。其中,所述安装座4例如为塑胶件。
例如,所述舌片2可通过注塑方式与所述安装座4连接,以使所述舌片2与所述安装座4连为一体化结构这样,所述舌片2与所述安装座4连接的稳定性更好。
例如,所述安装座4也可通过注塑方式与所述壳体1(例如框架)形成一体化的结构。即可形成带有舌片的壳体,其可用于例如智能手机等电子设备。
其中,注塑的方式例如可以采用嵌件注塑的方式。
壳体1,特别是其中的框架为智能手机等电子设备的主要承重结构件, 可用于支撑屏幕,提供强度。本申请的实施例中,所述舌片2可以是在加工框架的时候通过嵌件注塑的方式将其与框架做成一体化结构。
例如,所述舌片2还可以通过点胶方式与所述安装座4粘结固定。
需要说明的是,本申请的实施例中对所述舌片2与所述安装座4的连接方式不作限定,其并不限于上述的注塑或者点胶的连接方式,还可以为其他固定连接方式,只要使所述舌片2与所述安装座1能牢固连接即可。此外,所述安装座4与所述壳体1之间也不限于上述卡合连接的方式和注塑的方式。
在本申请一个可选的例子中,参见图6、图7和图8所示,所述连接器件3的一端设置有连接部,所述连接部与所述舌片2为接触式连接,其中,所述连接部包括多个连接触头301,所述舌片2上设置有与多个所述连接触头301相匹配的多个连接触点。
所述连接器件3的一端设置有多个所述连接触头301,多个所述连接触头301可与所述舌片2上的多个所述连接触点形成接触连接并电性导通。也就是说,本申请的方案中设计通过点接触的方式将所述舌片2与所述连接器件3连接。这种接触连接方式更为灵活,其与传统的插拔连接相比,连接方式更为简单,也易于拆装。
其中,所述连接触头301可以具有伸缩功能,以便于工程装配。
在本申请一个可选的例子中,参见图8所示,多个所述连接触头301呈矩阵排列且相互之间设置有间隔。以便于各所述连接触头301可与所述舌片2上相应的所述连接触点形成接触连接。
在本申请一个可选的例子中,参见图6、图7和图8所示,所述连接器件3的另一端上设置有弹片触点区域302,所述电路板可通过弹片与所述有弹片触点区域302接触连接,以实现电性导通。
其中,所述弹片例如预先设置在所述电路板的指定位置上。
其中,所述弹片例如为金属材质。
所述弹片触点区域302用于与所述电路板实现电性导通。所述弹片触点区域302例如为金属材质。
在本申请一个可选的例子中,所述连接器件3的另一端还可通过电连接器与所述电路板连接。其中,所述电连接器例如为板对板连接器(BTB连接器)。当然,也可以为其它的电连接器件,本申请对此不作限制。
在本申请的实施例中,所述连接器件3负责联通所述舌片2与所述电路板,所述电路板可以为电子设备的主板,也可以为副板。
也就是说,所述舌片2是通过所述连接器件3转接至所述电路板上的。相比于传统的方式,所述舌片2无需与电路板直接连接,在进行电子设备的堆叠设计时,无需考虑舌片所在的位置,有助于使数据接口能始终保证外观居中。有助于提升电子设备的外观表现力,又能提高堆叠设计的自由度。
在本申请一个可选的例子中,所述连接器件3的两侧分别通过紧固件与所述壳体1连接。用以将所述连接器件3固定在所述壳体1上。
例如,所述连接器件3的两侧通过螺钉与所述框架固定连接。
参见图7所示,在所述连接器件3的两侧分别设置有连接孔303。参见图5所示,在所述腔体102内设置有连接器件安装位,并在其上设置有装配孔103,装配孔103可用于与所述连接器件3上的连接孔配合,再通过螺钉或螺栓等紧固件即可将所述连接器件3与所述框架连接在一起。
在本申请一个可选的例子中,所述舌片2的表面上设置有电路区域,所述电路区域通过刻蚀的方式形成导电线路图案。
也就是说,所述舌片2上刻有导电线路图案,其可用于实现连接外部数据线。
根据本申请实施例的电子设备的其他构成例如显示模组等,以及操作对于本领域普通技术人员而言都是已知的,这里不再详细描述。
在本说明书的描述中,参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中,对上述术语的示意性表述不一定指的是相同的实施例或示例。而且,描述的具体特征、结构、材料或者特点可以在任何 的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本申请的实施例,本领域的普通技术人员可以理解:在不脱离本申请的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型,本申请的范围由权利要求及其等同物限定。
Claims (10)
- 一种电子设备,包括:壳体,所述壳体具有通孔和与所述通孔连通的腔体;电路板,所述电路板设置于所述腔体内;舌片,所述舌片设置于所述通孔内并封堵所述通孔;连接器件,所述连接器件设置于腔体内,所述连接器件的一端设置有连接部,所述连接部与所述舌片接触连接,所述连接器件的另一端与所述电路板连接;外部设备可通过所述舌片与所述电子设备连接,所述舌片用于在所述电子设备与所述外部设备之间传输数据。
- 根据权利要求1所述的电子设备,其中,还包括安装座,所述舌片与所述安装座连接;所述安装座上设置有第一卡接部,所述壳体上设置有第二卡接部,所述安装座与所述壳体以卡合方式相连接,可封堵所述通孔。
- 根据权利要求2所述的电子设备,其中,所述第一卡接部和所述第二卡接部其中的一个为截面呈梯形的凸起结构,所述第一卡接部和所述第二卡接部其中的另一个为与所述凸起结构形状相匹配的限位凹槽。
- 根据权利要求2所述的电子设备,其中,所述舌片的一端设置有连接结构;所述安装座上设置有贯通孔,所述舌片设置于所述安装座背离所述腔体的一侧,所述连接结构穿过所述贯通孔,且所述连接结构与所述连接器件上的所述连接部接触连接。
- 根据权利要求2所述的电子设备,其中,所述安装座靠近所述腔体的一侧面与所述壳体靠近所述腔体的面为共面设置。
- 根据权利要求1所述的电子设备,其中,所述连接部包括多个连接触头,所述舌片上设置有与多个所述连接触头相匹配的多个连接触点。
- 根据权利要求1所述的电子设备,其中,所述连接器件的另一端上设置有弹片触点区域,所述电路板通过弹片与所述有弹片触点区域接触连接。
- 根据权利要求1所述的电子设备,其中,还包括伸缩驱动件,所述连接部通过所述伸缩驱动件与所述舌片连接,所述伸缩驱动件用以驱动所述舌片在第一位置和第二位置之间切换,在所述第一位置,所述舌片与所述连接部相接触,在所述第二位置,所述舌片与所述连接部分离。
- 根据权利要求1所述的电子设备,其中,所述连接器件的两侧分别通过紧固件与所述壳体连接。
- 根据权利要求1所述的电子设备,其中,所述舌片的表面上设置有电路区域,所述电路区域通过刻蚀的方式形成导电线路图案。
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CN111082248B (zh) * | 2018-10-19 | 2022-04-29 | 中兴通讯股份有限公司 | 一种移动终端 |
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CN111146619A (zh) * | 2019-12-06 | 2020-05-12 | 华为技术有限公司 | 一种电子设备和母座连接器 |
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- 2021-06-23 CN CN202110701555.9A patent/CN113437550B/zh active Active
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- 2022-06-20 WO PCT/CN2022/099747 patent/WO2022268017A1/zh active Application Filing
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CN211605481U (zh) * | 2019-03-26 | 2020-09-29 | 华为技术有限公司 | 母座连接器和电子设备 |
CN113437550A (zh) * | 2021-06-23 | 2021-09-24 | 维沃移动通信有限公司 | 电子设备 |
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