WO2022266812A1 - Ensemble capteur photoélectrique, photodétecteur et système de mesure de distance - Google Patents

Ensemble capteur photoélectrique, photodétecteur et système de mesure de distance Download PDF

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Publication number
WO2022266812A1
WO2022266812A1 PCT/CN2021/101326 CN2021101326W WO2022266812A1 WO 2022266812 A1 WO2022266812 A1 WO 2022266812A1 CN 2021101326 W CN2021101326 W CN 2021101326W WO 2022266812 A1 WO2022266812 A1 WO 2022266812A1
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WO
WIPO (PCT)
Prior art keywords
light
photoelectric sensor
substrate
assembly according
sensor assembly
Prior art date
Application number
PCT/CN2021/101326
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English (en)
Chinese (zh)
Inventor
吴佩欣
Original Assignee
深圳市大疆创新科技有限公司
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Priority to PCT/CN2021/101326 priority Critical patent/WO2022266812A1/fr
Publication of WO2022266812A1 publication Critical patent/WO2022266812A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/02—Details

Definitions

  • the present application relates to the technical field of optical communication equipment, in particular to a photoelectric sensor component, a photodetector and a distance measurement system.
  • the avalanche multiplication effect is generated, and it has a very high internal gain. It is widely used in weak signal detection, optical fiber sensing, optical fiber communication, photoelectric ranging and planetary orientation and other fields.
  • the temperature drift of the avalanche photodiode will seriously affect the temperature performance of the gain of the device, and even reduce the measurement accuracy.
  • the temperature of the avalanche photodiode is usually detected by a temperature sensor, so that the system that treats the avalanche photodiode can perform corresponding compensation adjustments according to the detected temperature to ensure that the system can work normally and stably.
  • the existing package structure including the avalanche photodiode and the temperature sensor is difficult to balance the temperature detection accuracy and the package miniaturization requirements of the package structure.
  • the present application provides a photoelectric sensor component, a photodetector and a distance measurement system, aiming at both temperature detection accuracy and package miniaturization.
  • the embodiment of the present application provides a photoelectric sensor assembly, including:
  • a housing formed with a light window, the housing is mechanically coupled with the substrate and cooperates to form a sealed space;
  • a photoelectric sensor arranged on the substrate and located in the sealed space, the photoelectric sensor is used to receive the light signal entering from the light window, and convert the received light signal into an electrical signal;
  • a temperature sensor located on the substrate and in the sealed space, for sensing the temperature of the photoelectric sensor
  • the photoelectric sensor assembly further includes a shading member, the shading member is arranged in the sealed space and spaced apart from the temperature sensor, and is used to reduce the light signal entering the sealed space from the light window. the temperature sensor.
  • an embodiment of the present application provides a photodetector, including:
  • a data processor configured to process the data output by the photoelectric sensor assembly to obtain detection data corresponding to the light signal.
  • the embodiment of the present application provides a distance measurement system, including:
  • At least part of the optical signal can reach the photoelectric sensor through the optical window.
  • the embodiment of the present application provides a photoelectric sensor assembly, a photodetector and a distance measurement system.
  • the temperature sensor is located in a sealed space, which can directly test the real-time temperature of the photoelectric sensor, reduces the temperature test error, and improves the temperature test accuracy.
  • the shading member is set in the sealed space and spaced apart from the temperature sensor. The design is simple and easy to implement, and the package size is small. This structural design will not cause a large change in the size of the photoelectric sensor component, thereby meeting the miniaturization of the package. Requirement; at the same time, the temperature sensor is protected by the shading member, reducing or preventing the light signal entering the sealed space from the light window from reaching the temperature sensor, thereby preventing the temperature sensor from failing.
  • Fig. 1 (a) is the structural representation of a kind of traditional photoelectric sensor assembly
  • Fig. 1 (b) is the structural representation of a kind of traditional photoelectric sensor assembly
  • Fig. 1 (c) is the structural representation of a kind of traditional photoelectric sensor assembly
  • Fig. 2 is a schematic structural diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 3 is a partial structural schematic diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 4 is a schematic structural diagram of a photoelectric sensor assembly provided by another embodiment of the present application.
  • Fig. 5 is a schematic structural diagram of a photoelectric sensor assembly provided by another embodiment of the present application.
  • Fig. 6 is a partial structural schematic diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 7 (a) is a schematic structural diagram of a photoelectric sensor assembly provided by another embodiment of the present application.
  • Fig. 7(b) is a partial structural schematic diagram of a photoelectric sensor assembly provided by the embodiment of the present application.
  • Fig. 8 is a partial structural schematic diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 9 is a partial structural schematic diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 10 is a partial structural schematic diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 11 is a partial structural schematic diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 12 is a partial structural schematic diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 13 is a schematic structural diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 14 is a partial structural schematic diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • Fig. 15 is a partial structural schematic diagram of a photoelectric sensor assembly provided by an embodiment of the present application.
  • shading member 51, the first shading side wall; 52, the shading top wall; 53, the second shading side wall; 54, the shading side; 55, the shading top;
  • first and second are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • a feature defined as “first” or “second” may explicitly or implicitly include one or more of said features.
  • “plurality” means two or more, unless otherwise specifically defined.
  • Avalanche photodiode (Avalanche Photo Diode, APD) chip and other photoelectric sensors are the core key of semiconductor photodetectors, which are used to receive signals such as laser light of a certain wavelength emitted by the corresponding transmitter laser.
  • the temperature sensor is a sensor that can sense temperature and convert it into an available output signal. It is generally used to detect the real-time temperature of photoelectric sensors such as APD chips. The system performs corresponding compensation adjustments according to the detected real-time temperature so that the whole machine can continue to work normally and stably.
  • the temperature sensor In terms of packaging, in order to test the real-time temperature of the photoelectric sensor such as the APD chip and avoid the package body being too large, the temperature sensor is usually plastic-sealed first and then mounted on the substrate, or the thermistor is used instead of the temperature sensor and the integrated package of the APD chip, or Apply black glue on the temperature sensor.
  • the plastic-encapsulated temperature sensor 101 is packaged on the substrate 102 .
  • the temperature sensor since the temperature sensor itself is sensitive to laser light and the environment, the temperature sensor needs to be packaged and protected before being packaged on the substrate, which increases the packaging process and affects the overall packaging efficiency.
  • the temperature sensor in order to prevent the entire package from being too large, the temperature sensor is packaged outside the cavity formed by the housing 103 and the substrate, so that the distance between the temperature sensor and the APD 104 is relatively large, and the real-time temperature monitored by the temperature sensor is not the accurate actual temperature of the APD. , there is a temperature difference between the two.
  • the photoelectric sensor assembly in Fig. 1 (b) is that the thermistor 105 and the APD 104 are integrated and packaged in the cavity formed by the housing 103 and the substrate 102.
  • the thermistor is not sensitive to laser and can be directly packaged into the cavity, but the test error of this solution itself is relatively large, generally about ⁇ 5°C.
  • the temperature sensor 101 is integrated in the cavity formed by the housing 103 and the substrate 102 , and black glue 106 is coated on the temperature sensor.
  • This solution is relatively simple and easy to apply black glue, but this solution has requirements for the uniformity and consistency of the black glue, and there is still a risk of failure in places where the thickness of the glue is too small, such as the edge of the chip, after being strongly irradiated by the laser.
  • the photoelectric sensor assembly 100 provided by the embodiment of the present application includes a substrate 10 , a casing 20 , a photoelectric sensor 30 , a temperature sensor 40 and a light shielding member 50 .
  • the housing 20 is formed with a light window 21 .
  • the housing 20 is mechanically coupled with the substrate 10 and cooperates to form a sealed space 61 .
  • the photoelectric sensor 30 is disposed on the substrate 10 and located in the sealed space 61 .
  • the photoelectric sensor 30 is used for receiving the light signal entering from the light window 21 and converting the received light signal into an electrical signal.
  • the temperature sensor 40 is disposed on the substrate 10 and located in the sealed space 61 for sensing the temperature of the photoelectric sensor 30 .
  • the shading member 50 is disposed in the sealed space 61 and spaced from the temperature sensor 40 to reduce the light signal entering the sealed space 61 from the light window 21 from reaching the temperature sensor 40 .
  • the temperature sensor 40 is located in the sealed space 61, which can directly test the real-time temperature of the photoelectric sensor 30, which reduces the temperature test error and improves the temperature. Accuracy of the temperature test; the temperature sensor 40 does not need to be packaged and protected before being packaged on the substrate 10 , which reduces the packaging process and improves the overall packaging efficiency.
  • the shading member 50 is arranged in the sealed space 61 and is spaced apart from the temperature sensor 40.
  • the design is simple, easy to implement, and the package size is small. This structural design will not cause a large change in the size of the photoelectric sensor assembly 100; at the same time , the temperature sensor 40 is protected by the shading member 50 , reducing or avoiding the light signal entering the sealed space 61 from the light window 21 from reaching the temperature sensor 40 , thereby avoiding failure of the temperature sensor 40 .
  • the shading member 50 and the temperature sensor 40 are arranged at intervals, which has strong realizability and manufacturability. On the basis of ensuring that the shading member 50 protects the temperature sensor 40 from failure due to the light signal irradiation from the light window 21 into the sealed space 61 , low requirements on uniformity and consistency of the shading member 50 .
  • the shading member 50 can effectively prevent oblique scattered light and some stray light entering from the light window 21 from reaching the temperature sensor 40 , thereby protecting the temperature sensor 40 .
  • the optical signal includes laser light.
  • the heat on the photosensor 30 can be conducted to the temperature sensor 40 through the substrate 10 .
  • the heat on the photoelectric sensor 30 can be conducted to the substrate 10, and the temperature sensor 40 disposed on the substrate 10 can sense the temperature on the substrate 10 and convert it into a preset output signal, thereby detecting the temperature of the photoelectric sensor 30, And make the light detector or the distance measurement system perform corresponding compensation and adjustment according to the detected temperature, so as to ensure that the whole machine can continue to work normally and stably.
  • both the shading member 50 and the temperature sensor 40 are spaced apart from the photoelectric sensor 30 .
  • the temperature sensor 40 and the photoelectric sensor 30 are spaced apart on the substrate 10 to prevent the two from interfering with each other and affecting the normal operation of the temperature sensor 40 or the photoelectric sensor 30 .
  • the light-shielding member 50 and the photoelectric sensor 30 are disposed on the substrate 10 at intervals to prevent the light-shielding member 50 from interfering with the normal operation of the photoelectric sensor 30 .
  • the distance between the shading member 50 and the temperature sensor 40 , the distance between the temperature sensor 40 and the photoelectric sensor 30 , and the distance between the shading member 50 and the photoelectric sensor 30 can be designed according to actual needs, and there is no limitation here.
  • the substrate 10 includes a ceramic substrate, a metal substrate, or a plastic substrate and the like.
  • the substrate 10 includes at least one of a ceramic substrate, an FR4 substrate, a rogers (Rogers, a plate) material substrate, and the like.
  • the housing 20 includes a casing 22 and a light-transmitting member 23 .
  • the casing 22 has light-shielding properties.
  • the housing 22 is connected to the substrate 10 .
  • the housing 22 is formed with a first opening.
  • the light-transmitting member 23 is disposed at the first opening to form the light window 21 and is sealed with the housing 22 .
  • the housing 22 is sealed and connected to the substrate 10 , and the light-transmitting member 23 is sealed and connected to the housing 22 , so that the housing 20 cooperates with the substrate 10 to form a sealed space 61 .
  • the housing 22 is packaged on the substrate 10 by at least one of bonding, energy storage welding, gold-tin brazing, silver-copper brazing, laser welding, and the like.
  • the specific size of the light window 21 is determined according to factors such as the optical path, the size of the light-sensing surface of the photoelectric sensor 30 , and the height of the photoelectric sensor 30 from the light-transmitting member 23 .
  • the light window 21 is formed on the top of the housing 20 .
  • the housing 22 is made of light-shielding material.
  • the material of the casing 22 includes at least one of metal, inorganic non-metal, organic polymer material, composite material and the like.
  • the light-transmitting member 23 can be made of any suitable transparent or translucent material. In some embodiments, the light-transmitting member 23 includes a glass member.
  • a metal layer is disposed on the substrate 10 . Both the photoelectric sensor 30 and the temperature sensor 40 are fixed on the substrate 10 through their corresponding metal layers.
  • the photoelectric sensor 30 is fixed on the substrate 10 by means of a conductive silver paste or solder through a die bond, and then the top surface (Top Side) electrode of the photoelectric sensor 30 is connected by a wire bond. It is electrically connected with the substrate 10 .
  • the temperature sensor 40 is fixed on the substrate 10 by means of conductive silver paste, solder or non-conductive glue through a die bond. Then, the top side electrode of the temperature sensor 40 is electrically connected to the substrate 10 by means of a wire bond. Exemplarily, the top surface electrode of the temperature sensor 40 is electrically connected to the metal layer on the substrate 10 (such as the first soldering portion 11 in FIG. 2 ) through the electrical connection wire 70 .
  • the silver paste or solder for die bond includes AuGe, AuSn, PbSn, AgCuSn and other materials.
  • Wire bond can be gold wire, alloy wire, aluminum wire and other materials.
  • Non-conductive glues include epoxy types, silicone types, polyurethane types, and more.
  • photosensor 30 and/or temperature sensor 40 includes a chip.
  • the material of the photoelectric sensor 30 and/or the temperature sensor 40 includes at least one of Si, Ge, SiC, SiN, GaAs, InGaAs and the like.
  • the photosensor 30 includes at least one of an avalanche photodiode, a single-photon avalanche photodiode, a single-photon detector, a CMPS image sensor, a silicon photomultiplier tube, and the like.
  • the temperature sensor 40 includes a first surface 41 and a second surface 42 oppositely disposed.
  • the second surface 42 faces the substrate 10 .
  • the shading member 50 is used to prevent the light signal entering the sealed space 61 from the light window 21 from reaching the first surface 41 of the temperature sensor 40 , thereby avoiding failure of the temperature sensor 40 .
  • the first surface 41 of the temperature sensor 40 is electrically connected to the first soldering portion 11 on the substrate 10 through an electrical connection wire 70 .
  • the first surface 41 is electrically connected to one end of the electrical connection wire 70
  • the other end of the electrical connection wire 70 is electrically connected to the first soldering portion 11 on the substrate 10 .
  • the second face 42 of the temperature sensor 40 is mechanically coupled and electrically connected to the substrate 10 .
  • the shape of the shading member 50 can be designed according to actual needs, such as a plate shape, a strip shape, other regular shapes or irregular shapes, and the like.
  • the shading member 50 has a plate-like structure.
  • the shading member 50 is made of shading material.
  • the material of the shading member 50 includes at least one of metal, inorganic non-metal, organic polymer material, composite material, etc., such as gold, nickel, copper, plastic, and the like.
  • the shading member 50 is located between the photoelectric sensor 30 and the temperature sensor 40 to ensure that the shading member 50 can reduce or prevent the light signal entering the sealed space 61 from the light window 21 from reaching the temperature sensor 40 .
  • the light shielding member 50 is mechanically coupled to the housing 22 of the housing 20 .
  • the shade 50 and the housing 22 of the housing 20 are integrally formed.
  • the shade 50 and the casing 22 may be manufactured through integral molding.
  • the shade 50 may also be fixedly connected to the housing 22 by at least one of adhesive connection, snap connection, welding and the like.
  • the casing 22 of the housing 20 includes a top wall portion 221 and a side wall portion 222 connected to the top wall portion 221 .
  • One opposite two ends of the shading member 50 are respectively connected to the top wall portion 221 and spaced apart from the substrate 10 , and the other opposite ends of the shading member 50 are respectively connected to opposite sides of the side wall portion 222 .
  • the distance between the lower end of the shading member 50 and the substrate 10 is smaller than the height of the temperature sensor 40 along the up-and-down direction in FIG. 40 of the first side 41 .
  • the distance between the lower end of the shading member 50 and the substrate 10 is designed to be 0.2mm-0.3mm, such as 0.2mm , 0.25mm, 0.3mm and any suitable distance between 0.2mm-0.3mm, and the distance between the lower end of the light shielding member 50 and the substrate 10 is smaller than the height of the temperature sensor 40 .
  • the distance between the lower end of the light shielding member 50 and the substrate 10 may also be zero.
  • opposite ends of the light shielding member 50 along the left-right direction in FIG. 3 are mechanically coupled to opposite two sides of the side wall portion 222 respectively.
  • the extension dimension of the shading member 50 along the height direction of the housing 20 is greater than or equal to the distance between the temperature sensor 40 and the top wall 221 , and less than or equal to the distance between the sealed space 61 height, thereby effectively reducing or avoiding the light signal entering the sealed space 61 from the light window 21 from reaching the first surface 41 of the temperature sensor 40, and reducing the material consumption of the photoelectric sensor assembly 100, thereby reducing the cost and lightening the photoelectric sensor assembly 100 weight.
  • the height direction of the housing 20 is shown as the up and down direction in FIG. 3 .
  • the shading member 50 is intersected with the top wall 221 of the casing 22 , and the angle between them is substantially a right angle. In other embodiments, the shading member 50 is intersected with the top wall 221 of the housing 22 , and the angle between them is not a right angle.
  • the packaging process of the photosensor assembly 100 includes: fixing the photosensor 30 on the substrate 10 by means of a conductive silver paste or solder through a die bond, and then fixing the photosensor 30 through a wire bond.
  • the Top Side electrode is electrically connected to the substrate 10.
  • the temperature sensor 40 is fixed on the substrate 10 through a die bond with conductive silver paste, solder or non-conductive glue, and then the Top Side electrode of the temperature sensor 40 is electrically connected to the substrate 10 through a wire bond.
  • the casing 20 is packaged on the substrate 10 by bonding or welding, so as to complete the package of the photosensor assembly 100 .
  • the light shielding member 50 is mechanically coupled to the substrate 10 .
  • the light shielding member 50 and the substrate 10 are separate structures.
  • the light shielding member 50 is fixedly connected to the substrate 10 through at least one of adhesive connection, snap connection, welding and the like.
  • the shading member 50 and the substrate 10 are manufactured through integral molding.
  • the shading member 50 is in the shape of a plate or a strip.
  • one opposite end of the shading member 50 is respectively connected to the substrate 10 and spaced apart from the top wall 221 , and the other opposite end of the shading member 50 is respectively connected to the side wall 222 .
  • the weight of it is possible to effectively reduce or prevent the light signal entering the sealed space 61 from the light window 21 from reaching the first surface 41 of the temperature sensor 40, and reduce the material consumption of the photoelectric sensor assembly 100, thereby reducing the cost and reducing the weight of the photoelectric sensor assembly 100. the weight of.
  • opposite ends of the light shielding member 50 along a direction perpendicular to the substrate 10 are respectively mechanically coupled to the substrate 10 and spaced apart from the top wall 221 of the housing 22 . That is, the lower end of the light shielding member 50 is mechanically coupled to the substrate 10 , and the upper end of the light shielding member 50 is spaced apart from the top wall portion 221 of the casing 22 .
  • the upper end of the shading member 50 is spaced apart from the top wall 221 of the housing 22 , including a part of the upper end of the shading member 50 mechanically coupled with the top wall 221 of the housing 22 , and another part of the upper end of the shading member 50 mechanically coupled with the top wall of the housing 22
  • the top wall portion 221 of the housing 22 is spaced apart from the top wall portion 221 of the casing 22 .
  • the distance between the upper end of the shading member 50 and the substrate 10 is smaller than the height of the temperature sensor 40 along the direction perpendicular to the substrate 10, thereby effectively reducing or preventing the optical signal entering the sealed space 61 from the light window 21 from reaching the temperature.
  • the first face 41 of the sensor 40 is a first face 41 of the sensor 40 .
  • the distance between the upper end of the shading member 50 and the top wall 221 of the housing 22 can be designed according to actual needs, for example, considering that the heights of the shading member 50, the substrate 10, the temperature sensor 40, etc. have deviations.
  • the distance between the upper end of the shading member 50 and the top wall 221 of the housing 22 is designed to be 0.2mm-0.3mm, that is, between 0.2mm, 0.25mm, 0.3mm and 0.2mm-0.3mm. Any other suitable value; and the distance between the upper end of the light shielding member 50 and the top wall 221 of the housing 22 is smaller than the distance between the first surface 41 of the temperature sensor 40 and the top wall 221 .
  • opposite ends of the light shielding member 50 along the left-right direction in FIG. 3 are mechanically coupled to opposite two sides of the side wall portion 222 respectively.
  • the extension dimension of the shading member 50 along the height direction of the housing 20 is greater than the height of the temperature sensor 40 and less than or equal to the height of the sealed space 61, thereby effectively reducing or preventing the light from entering through the light window 21.
  • the light signal in the sealed space 61 reaches the first surface 41 of the temperature sensor 40 .
  • the height direction of the housing 20 is perpendicular to the substrate 10 .
  • the projection of the shading member 50 on the top wall 221 of the housing 22 and the light window 21 are sequentially arranged along the -X direction in FIG. 4 .
  • the projection of the shading member 50 on the top wall portion 221 of the casing 22 is spaced apart from the light window 21 .
  • the packaging process of the photosensor assembly 100 includes: fixing the photosensor 30 on the substrate 10 by means of a conductive silver paste or solder through a die bond, and then fixing the photosensor 30 through a wire bond.
  • the Top Side electrode is electrically connected to the substrate 10.
  • the temperature sensor 40 is fixed on the substrate 10 through a die bond with conductive silver paste, solder or non-conductive glue, and then the Top Side electrode of the temperature sensor 40 is electrically connected to the substrate 10 through a wire bond.
  • the shading member 50 is fixed on the substrate 10 by means of conductive silver paste, solder or non-conductive glue through die bond.
  • the casing 20 is packaged on the substrate 10 by bonding or welding, so as to complete the package of the photosensor assembly 100 .
  • the shading member 50 has a cover structure.
  • the light-shielding member 50 is connected with the substrate 10 and cooperates to form a receiving space 62 for receiving the temperature sensor 40 .
  • the light shielding member 50 and the substrate 10 are separate structures.
  • the light shielding member 50 is fixedly connected to the substrate 10 through at least one of adhesive connection, snap connection, welding and the like.
  • the shading member 50 and the substrate 10 are manufactured through integral molding.
  • the light shielding member 50 and the substrate 10 form a second opening 63 communicating with the receiving space 62 .
  • the second opening 63 is disposed away from the photoelectric sensor 30 , and the electrical connection wire 70 passes through the second opening 63 from the receiving space 62 to be electrically connected to the first soldering portion 11 .
  • the shading member 50 effectively protect the temperature sensor 40, but also prevent the temperature sensor 40 from failing due to the influence of the light signal entering the sealed space 61 from the light window 21; and the weight of the shading member 50 can be reduced, which is beneficial to the photoelectric sensor. Lightweight design of the assembly 100 .
  • the light-shielding member 50 includes a first light-shielding side wall 51 , a light-shielding top wall 52 and two oppositely disposed second light-shielding side walls 53 .
  • the first light-shielding sidewall 51 is disposed between the photosensor 30 and the temperature sensor 40 .
  • the first light-shielding sidewall 51 , the two second light-shielding sidewalls 53 , the substrate 10 and the light-shielding top wall 52 cooperate to form a receiving space 62 .
  • a side of the light-shielding member 50 away from the first light-shielding sidewall 51 cooperates with the substrate 10 to form a second opening 63 .
  • first light-shielding side wall 51, the light-shielding top wall 52 and the two second light-shielding side walls 53 can prevent the light signal entering the sealed space 61 from the light window 21 from reaching the temperature sensor 40 from different angles, thereby effectively protecting the temperature. sensor 40.
  • the shape of the shading member 50 can be designed according to actual needs.
  • both the first light-shielding sidewall 51 and the second light-shielding sidewall 53 are substantially perpendicular to the substrate 10 .
  • the light-shielding top wall 52 is substantially parallel to the substrate 10.
  • both the first light-shielding sidewall 51 and the second light-shielding sidewall 53 intersect with the substrate 10 but are not perpendicular.
  • the plane where the light-shielding top wall 52 is located intersects the substrate 10 .
  • the light-shielding top wall 52 is spaced apart from the first surface 41 of the temperature sensor 40 . It can be understood that the distance between the light-shielding top wall 52 and the first surface 41 of the temperature sensor 40 can be designed according to actual requirements. Exemplarily, considering the tolerance of the temperature sensor 40 and the shading member 50, the routing of the electrical connection wire 70, etc., the distance between the shading top wall 52 and the first surface 41 of the temperature sensor 40 is greater than or equal to 0.4mm, and Less than or equal to the distance between the first surface 41 of the temperature sensor 40 and the top wall 221 of the casing 22 .
  • the projection of the end of the light-shielding top wall 52 away from the first light-shielding side wall 51 on the top wall portion 221 of the housing 22 and the light window 21 are sequentially arranged along the ⁇ X direction in FIG. 5 .
  • the projection of the end of the light-shielding top wall 52 away from the first light-shielding side wall 51 on the top wall portion 221 of the housing 22 is spaced apart from the light window 21 .
  • the packaging process of the photosensor assembly 100 includes: fixing the photosensor 30 on the substrate 10 by means of a die bond with conductive silver paste or solder, and then fixing the photosensor 30 by means of a wire bond.
  • the Top Side electrode is electrically connected to the substrate 10.
  • the temperature sensor 40 is fixed on the substrate 10 through a die bond with conductive silver paste, solder or non-conductive glue, and then the Top Side electrode of the temperature sensor 40 is electrically connected to the substrate 10 through a wire bond.
  • the shading member 50 is fixed on the substrate 10 by means of conductive silver paste, solder or non-conductive glue through die bond.
  • the casing 20 is packaged on the substrate 10 by bonding or welding, so as to complete the package of the photosensor assembly 100 .
  • the receiving space 62 is a closed space.
  • one window corresponds to multiple photoelectric sensors 30 and multiple temperature sensors 40 .
  • one photoelectric sensor assembly 100 may only be designed with one window opening, multiple photoelectric sensors 30 and multiple temperature sensors 40 , and the photoelectric sensors 30 and the temperature sensors 40 are provided in one-to-one correspondence.
  • both the electrical connection wire 70 and the first welding portion 11 are located in the receiving space 62 .
  • the first surface 41 of the temperature sensor 40 located in the storage space 62 is electrically connected to the first welding part 11 located in the storage space 62 through the electrical connection wire 70 located in the storage space 62, thereby realizing the first surface 41 of the temperature sensor 40. electrical connection to the substrate 10.
  • the shade 50 includes a shade side portion 54 and a shade top 55. Two ends of the light-shielding side portion 54 are respectively connected to the light-shielding top 55 and the substrate 10 to form a receiving space 62 .
  • the light-shielding side portion 54 and the light-shielding top 55 are manufactured through integral molding.
  • the light-shielding side portion 54 is fixedly connected to the substrate 10 through at least one of adhesive connection, snap connection, welding and the like.
  • the light-shielding top 55 is substantially parallel to the substrate 10 .
  • the light-shielding side portion 54 is substantially perpendicular to the substrate 10 .
  • the plane where the light-shielding top 55 is located intersects with the substrate 10 and is non-perpendicular.
  • the light-shielding side portion 54 intersects with the substrate 10 and is non-perpendicular.
  • the projection of the light-shielding top 55 on the top wall 221 of the housing 22 partially overlaps with the light window 21 .
  • the projection of the end of the light-shielding top 55 close to the photoelectric sensor 30 on the top wall 221 of the casing 22 is located in the area where the light window 21 is located.
  • the projection of the end of the light-shielding top 55 close to the photoelectric sensor 30 on the top wall 221 of the housing 22 and the light window 21 are sequentially arranged along the ⁇ X direction in FIG. 7( a ).
  • the extension dimension of the light-shielding side portion 54 along the height direction of the housing 20 is greater than the height of the temperature sensor 40 and less than or equal to the height of the sealed space 61 .
  • the height direction is perpendicular to the substrate 10 in FIG. 7( a ).
  • the top wall 221 of the housing 22 and the temperature sensor 40 are both spaced apart from the light-shielding top 55 .
  • the distance between the shading top 55 and the first surface 41 of the temperature sensor 40 is greater than or equal to 0.4mm and less than Or equal to the distance between the first surface 41 of the temperature sensor 40 and the top wall portion 221 of the casing 22 .
  • the number of photoelectric sensors 30 can be designed according to actual needs. Exemplarily, the number of photoelectric sensors 30 includes one or more, such as one, two, three, four, five or more. One or more photoelectric sensors 30 are disposed on the substrate 10 at intervals.
  • the number of temperature sensors 40 is adapted to the number of photoelectric sensors 30 , and the temperature sensors 40 are arranged beside the corresponding photoelectric sensors 30 , so as to accurately detect the temperature of the photoelectric sensors 30 .
  • the number of temperature sensors 40 is set in one-to-one correspondence with the number of photoelectric sensors 30 .
  • the photoelectric sensor 30 and the temperature sensor 40 are both one in number.
  • there are multiple data of the photoelectric sensor 30 and the temperature sensor 40 and one photoelectric sensor 30 is correspondingly provided with one temperature sensor 40 .
  • the number of temperature sensors 40 and the number of photoelectric sensors 30 may also be set in a non-one-to-one correspondence.
  • one temperature sensor 40 correspondingly detects the temperatures of two or more photoelectric sensors 30 .
  • the number of photoelectric sensors 30 and the number of temperature sensors 40 include multiple, and the arrangement of the plurality of temperature sensors 40 is adapted to the arrangement of the plurality of photoelectric sensors 30 .
  • the same shading member 50 can prevent light signals entering the sealed space 61 from the light window 21 from reaching the one or more temperature sensors 40 .
  • the number of photoelectric sensors 30 and the number of temperature sensors 40 both include multiple, such as two, three or more.
  • One photoelectric sensor 30 is correspondingly provided with one temperature sensor 40 .
  • One photosensor module 100 is provided with one light shielding member 50 .
  • the structure of the shading member 50 refers to the structure of the shading member 50 in FIG. 2 .
  • the same shade 50 can protect at least two temperature sensors 40 .
  • the number of photoelectric sensors 30 and the number of temperature sensors 40 both include multiple.
  • One photoelectric sensor 30 is correspondingly provided with one temperature sensor 40 .
  • a photoelectric sensor assembly 100 is provided with a plurality of shading members 50, such as two, three, four, five or more.
  • the structure of the shading member 50 refers to the structure of the shading member 50 in FIG. 2 .
  • a plurality of shading members 50 are arranged at intervals. Each light shield 50 can protect at least two temperature sensors 40 .
  • the number of photoelectric sensors 30 and the number of temperature sensors 40 both include multiple.
  • One photoelectric sensor 30 is correspondingly provided with one temperature sensor 40 .
  • One temperature sensor 40 is correspondingly provided with one shading member 50 .
  • For the structure of the shading member 50 refer to the structure of the shading member 50 in FIG. 5 .
  • the number of photoelectric sensors 30 includes multiple.
  • a plurality of photosensors 30 are arranged in an array to form one or more photosensor array units.
  • a plurality of photosensors 30 are arranged in an array to form a photosensor array unit.
  • a plurality of photosensors 30 are arranged in an array to form three photosensor array units.
  • each photosensor array unit is correspondingly provided with one or more light-shielding elements 50 .
  • each photosensor array unit is correspondingly provided with a light shielding member 50 .
  • each photosensor array unit is correspondingly provided with a plurality of light shielding members 50 .
  • Each photosensor 30 in the photosensor array unit is correspondingly provided with a light shielding member 50 .
  • each photosensor array unit corresponds to a temperature sensor array unit, and the temperature sensor array unit includes at least one temperature sensor 40 .
  • the temperature sensor array unit includes at least one temperature sensor 40 .
  • each photosensor 30 in the photosensor array unit is provided with a temperature sensor 40 to improve the temperature detection accuracy of each photosensor 30 .
  • a plurality of photoelectric sensors 30 and a plurality of temperature sensors 40 are arranged in an array, which is extensive and versatile for actual packaging.
  • the substrate 10 includes an M ⁇ N block area
  • the plurality of photosensors include M ⁇ N photosensors 30 respectively located in the M ⁇ N block area, where M and N are respectively is a positive integer not less than 1.
  • each area in the M ⁇ N block area wraps a first sub-area and a second sub-area that do not overlap each other, the first sub-area is provided with a photosensor 30, and the second sub-area is provided with the first sub-area and the first sub-area.
  • the photoelectric sensor 30 in the sub-region corresponds to a temperature sensor 40 .
  • An embodiment of the present application further provides a photodetector, including the photoelectric sensor component and a data processor in any one of the above embodiments.
  • the data processor is used for processing the data output by the photoelectric sensor component to obtain detection data corresponding to the light signal.
  • the data processor can obtain time data for indicating the emission time of the optical signal from the transmitting end of the optical signal, and receive time data for indicating the time-of-flight of the optical signal from the photoelectric sensor; then, the data The processor can generate a depth image of the object to be measured according to the time-of-flight of the light signal and adopt the TOF principle.
  • An embodiment of the present application further provides a distance measurement system, including a light emitter and the photoelectric sensor assembly of any one of the above embodiments.
  • Optical transmitters are used to transmit optical signals. At least part of the light signal emitted by the light transmitter can reach the photosensor through the light window.
  • the distance measurement system may include a laser detection and measurement system, or a laser radar.
  • the distance measurement system is used to sense external environment information, for example, distance information, angle information, reflection intensity information, speed information, etc. of environmental objects.
  • the distance measurement system according to the embodiment of the present application can be applied to a movable platform, and the distance measurement system can be installed on the platform body of the movable platform.
  • the movable platform with a distance measurement system can measure the external environment, for example, measure the distance between the movable platform and obstacles for purposes such as obstacle avoidance, and perform two-dimensional or three-dimensional mapping of the external environment.
  • the mobile platform includes at least one of an unmanned aerial vehicle, an automobile, a remote controlled vehicle, a robot, a mobile vessel, and the like.
  • the platform body When the distance measurement system is applied to an unmanned aerial vehicle, the platform body is the fuselage of the unmanned aerial vehicle. When the distance measurement system is applied to a car, the platform body is the body of the car. When the distance measurement system is applied to the remote control car, the platform body is the body of the remote control car.
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. connected, or integrally connected. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
  • a first feature being “on” or “under” a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them.
  • “above”, “above” and “above” the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature.
  • "Below”, “under” and “under” the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)

Abstract

La présente invention concerne un ensemble capteur photoélectrique (100) comprenant un substrat (10), un boîtier (20), un capteur photoélectrique (30), un capteur de température (40) et un écran de protection contre la lumière (50). Le boîtier (20) est formé avec une fenêtre (21) laissant passée la lumière, et le boîtier (20) est accouplé mécaniquement au substrat (10), en s'ajustant pour former un espace étanche (61). Le capteur photoélectrique (30) est disposé sur le substrat (10) et situé dans l'espace étanche (61), le capteur photoélectrique (30) étant conçu pour recevoir un signal optique entrant par la fenêtre (21) laissant passée la lumière et pour convertir le signal optique reçu en un signal électrique. Le capteur de température (40) est disposé sur le substrat (10) et situé dans l'espace étanche (61), et sert à détecter une température du capteur photoélectrique (30). L'écran de protection contre la lumière (50) est disposé dans l'espace étanche (61), disposé séparément du capteur de température (40), et sert à réduire un signal optique entrant dans l'espace étanche (61) par la fenêtre (21) laissant passée la lumière qui atteint le capteur de température (40). La présente invention concerne également un photodétecteur et un système de mesure de distance.
PCT/CN2021/101326 2021-06-21 2021-06-21 Ensemble capteur photoélectrique, photodétecteur et système de mesure de distance WO2022266812A1 (fr)

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PCT/CN2021/101326 WO2022266812A1 (fr) 2021-06-21 2021-06-21 Ensemble capteur photoélectrique, photodétecteur et système de mesure de distance

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CN203432681U (zh) * 2013-08-27 2014-02-12 奚易堃 亮度检测器
JP2016213307A (ja) * 2015-05-07 2016-12-15 新日本無線株式会社 反射型センサ装置及びその製造方法
CN209674401U (zh) * 2018-12-05 2019-11-22 深圳市光微科技有限公司 应用于相位式tof传感器的温度补偿装置
CN111312767A (zh) * 2020-02-21 2020-06-19 京东方科技集团股份有限公司 显示基板及显示装置
CN211265963U (zh) * 2019-10-18 2020-08-14 深圳市大疆创新科技有限公司 激光二极管封装模块及距离探测装置、电子设备
CN111998875A (zh) * 2020-08-19 2020-11-27 北京市汉华环球科技发展有限责任公司 一种基于光电探测器的角度位置传感器及其测量方法
CN212084315U (zh) * 2020-04-13 2020-12-04 山西新思备科技股份有限公司 带有红外校准灯和温度监测及补偿功能的高速火焰探测器

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203432681U (zh) * 2013-08-27 2014-02-12 奚易堃 亮度检测器
JP2016213307A (ja) * 2015-05-07 2016-12-15 新日本無線株式会社 反射型センサ装置及びその製造方法
CN209674401U (zh) * 2018-12-05 2019-11-22 深圳市光微科技有限公司 应用于相位式tof传感器的温度补偿装置
CN211265963U (zh) * 2019-10-18 2020-08-14 深圳市大疆创新科技有限公司 激光二极管封装模块及距离探测装置、电子设备
CN111312767A (zh) * 2020-02-21 2020-06-19 京东方科技集团股份有限公司 显示基板及显示装置
CN212084315U (zh) * 2020-04-13 2020-12-04 山西新思备科技股份有限公司 带有红外校准灯和温度监测及补偿功能的高速火焰探测器
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