WO2022255171A1 - Positive photosensitive resin composition and organic el element partition - Google Patents
Positive photosensitive resin composition and organic el element partition Download PDFInfo
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- WO2022255171A1 WO2022255171A1 PCT/JP2022/021293 JP2022021293W WO2022255171A1 WO 2022255171 A1 WO2022255171 A1 WO 2022255171A1 JP 2022021293 W JP2022021293 W JP 2022021293W WO 2022255171 A1 WO2022255171 A1 WO 2022255171A1
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- WIPO (PCT)
- Prior art keywords
- group
- acid
- resin composition
- photosensitive resin
- positive photosensitive
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 109
- 238000005192 partition Methods 0.000 title claims description 21
- 229920005989 resin Polymers 0.000 claims abstract description 178
- 239000011347 resin Substances 0.000 claims abstract description 178
- -1 metal complex ions Chemical class 0.000 claims abstract description 171
- 125000000524 functional group Chemical group 0.000 claims abstract description 80
- 239000000434 metal complex dye Substances 0.000 claims abstract description 56
- 125000004432 carbon atom Chemical group C* 0.000 claims description 84
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 84
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 72
- 125000000217 alkyl group Chemical group 0.000 claims description 55
- 239000000178 monomer Substances 0.000 claims description 45
- 239000002904 solvent Substances 0.000 claims description 30
- 229920001577 copolymer Polymers 0.000 claims description 28
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 28
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 25
- 125000003545 alkoxy group Chemical group 0.000 claims description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 18
- 125000005843 halogen group Chemical group 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 13
- 125000006165 cyclic alkyl group Chemical group 0.000 claims description 13
- 239000000975 dye Substances 0.000 claims description 12
- 125000003709 fluoroalkyl group Chemical group 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229920001519 homopolymer Polymers 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000000126 substance Substances 0.000 abstract description 34
- 230000003321 amplification Effects 0.000 abstract description 6
- 238000003199 nucleic acid amplification method Methods 0.000 abstract description 6
- 239000010408 film Substances 0.000 description 51
- 125000003700 epoxy group Chemical group 0.000 description 37
- 150000001875 compounds Chemical class 0.000 description 36
- 239000002253 acid Substances 0.000 description 29
- 238000000576 coating method Methods 0.000 description 26
- 239000011248 coating agent Substances 0.000 description 24
- 238000010438 heat treatment Methods 0.000 description 24
- 230000035945 sensitivity Effects 0.000 description 24
- 239000003513 alkali Substances 0.000 description 23
- 239000003822 epoxy resin Substances 0.000 description 23
- 229920000647 polyepoxide Polymers 0.000 description 23
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 19
- 238000000034 method Methods 0.000 description 18
- 230000005855 radiation Effects 0.000 description 17
- 239000002585 base Substances 0.000 description 16
- 238000006243 chemical reaction Methods 0.000 description 16
- 238000011161 development Methods 0.000 description 16
- 230000018109 developmental process Effects 0.000 description 16
- 238000004090 dissolution Methods 0.000 description 15
- 239000007787 solid Substances 0.000 description 15
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 14
- 239000008199 coating composition Substances 0.000 description 14
- 239000007864 aqueous solution Substances 0.000 description 13
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 12
- 239000004094 surface-active agent Substances 0.000 description 11
- 239000003795 chemical substances by application Substances 0.000 description 10
- 229910052731 fluorine Inorganic materials 0.000 description 10
- CYRMSUTZVYGINF-UHFFFAOYSA-N trichlorofluoromethane Chemical compound FC(Cl)(Cl)Cl CYRMSUTZVYGINF-UHFFFAOYSA-N 0.000 description 10
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 9
- 229910052801 chlorine Inorganic materials 0.000 description 9
- 239000003086 colorant Substances 0.000 description 9
- 230000001965 increasing effect Effects 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 8
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 8
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000011737 fluorine Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 229920003986 novolac Polymers 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 7
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 7
- 229910052794 bromium Inorganic materials 0.000 description 7
- 239000000460 chlorine Substances 0.000 description 7
- 238000000354 decomposition reaction Methods 0.000 description 7
- 125000000623 heterocyclic group Chemical group 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 229910052740 iodine Inorganic materials 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000003505 polymerization initiator Substances 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 5
- WPYMKLBDIGXBTP-UHFFFAOYSA-N Benzoic acid Natural products OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 5
- 150000001721 carbon Chemical group 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910001873 dinitrogen Inorganic materials 0.000 description 5
- 239000011630 iodine Substances 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 239000003223 protective agent Substances 0.000 description 5
- PJMXUSNWBKGQEZ-UHFFFAOYSA-N (4-hydroxyphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=C(O)C=C1 PJMXUSNWBKGQEZ-UHFFFAOYSA-N 0.000 description 4
- WXTMDXOMEHJXQO-UHFFFAOYSA-N 2,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC=C1O WXTMDXOMEHJXQO-UHFFFAOYSA-N 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 4
- 229930185605 Bisphenol Natural products 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical class C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 4
- 230000001476 alcoholic effect Effects 0.000 description 4
- 125000003342 alkenyl group Chemical group 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 125000004093 cyano group Chemical group *C#N 0.000 description 4
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- NYGZLYXAPMMJTE-UHFFFAOYSA-M metanil yellow Chemical group [Na+].[O-]S(=O)(=O)C1=CC=CC(N=NC=2C=CC(NC=3C=CC=CC=3)=CC=2)=C1 NYGZLYXAPMMJTE-UHFFFAOYSA-M 0.000 description 4
- QPJVMBTYPHYUOC-UHFFFAOYSA-N methyl benzoate Chemical compound COC(=O)C1=CC=CC=C1 QPJVMBTYPHYUOC-UHFFFAOYSA-N 0.000 description 4
- 125000001624 naphthyl group Chemical group 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 229920002577 polybenzoxazole Polymers 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 229920005990 polystyrene resin Polymers 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 4
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- IYMZEPRSPLASMS-UHFFFAOYSA-N 3-phenylpyrrole-2,5-dione Chemical compound O=C1NC(=O)C(C=2C=CC=CC=2)=C1 IYMZEPRSPLASMS-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- 239000005711 Benzoic acid Substances 0.000 description 3
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 3
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 description 3
- 235000010724 Wisteria floribunda Nutrition 0.000 description 3
- 125000004018 acid anhydride group Chemical group 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 125000004423 acyloxy group Chemical group 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 3
- 125000004429 atom Chemical group 0.000 description 3
- 235000010233 benzoic acid Nutrition 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 238000010511 deprotection reaction Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 238000013007 heat curing Methods 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 3
- 229940011051 isopropyl acetate Drugs 0.000 description 3
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 3
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 3
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000012788 optical film Substances 0.000 description 3
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 3
- 150000003384 small molecules Chemical class 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- 125000005931 tert-butyloxycarbonyl group Chemical group [H]C([H])([H])C(OC(*)=O)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 125000003396 thiol group Chemical group [H]S* 0.000 description 3
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 2
- JKTCBAGSMQIFNL-UHFFFAOYSA-N 2,3-dihydrofuran Chemical compound C1CC=CO1 JKTCBAGSMQIFNL-UHFFFAOYSA-N 0.000 description 2
- GLDQAMYCGOIJDV-UHFFFAOYSA-N 2,3-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=CC(O)=C1O GLDQAMYCGOIJDV-UHFFFAOYSA-N 0.000 description 2
- UIAFKZKHHVMJGS-UHFFFAOYSA-N 2,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1O UIAFKZKHHVMJGS-UHFFFAOYSA-N 0.000 description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- AKEUNCKRJATALU-UHFFFAOYSA-N 2,6-dihydroxybenzoic acid Chemical compound OC(=O)C1=C(O)C=CC=C1O AKEUNCKRJATALU-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- MIRQGKQPLPBZQM-UHFFFAOYSA-N 2-hydroperoxy-2,4,4-trimethylpentane Chemical compound CC(C)(C)CC(C)(C)OO MIRQGKQPLPBZQM-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- WXUAQHNMJWJLTG-UHFFFAOYSA-N 2-methylbutanedioic acid Chemical compound OC(=O)C(C)CC(O)=O WXUAQHNMJWJLTG-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- YQUVCSBJEUQKSH-UHFFFAOYSA-N 3,4-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C(O)=C1 YQUVCSBJEUQKSH-UHFFFAOYSA-N 0.000 description 2
- UYEMGAFJOZZIFP-UHFFFAOYSA-N 3,5-dihydroxybenzoic acid Chemical compound OC(=O)C1=CC(O)=CC(O)=C1 UYEMGAFJOZZIFP-UHFFFAOYSA-N 0.000 description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 2
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- 206010073306 Exposure to radiation Diseases 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
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- 230000001678 irradiating effect Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 125000000400 lauroyl group Chemical group O=C([*])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 229960002510 mandelic acid Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 1
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 229940098779 methanesulfonic acid Drugs 0.000 description 1
- FMXYCZVOMYLMKM-UHFFFAOYSA-N methyl 2-hydroxy-2-methylbutanoate Chemical compound CCC(C)(O)C(=O)OC FMXYCZVOMYLMKM-UHFFFAOYSA-N 0.000 description 1
- HSDFKDZBJMDHFF-UHFFFAOYSA-N methyl 3-ethoxypropanoate Chemical compound CCOCCC(=O)OC HSDFKDZBJMDHFF-UHFFFAOYSA-N 0.000 description 1
- BDJSOPWXYLFTNW-UHFFFAOYSA-N methyl 3-methoxypropanoate Chemical compound COCCC(=O)OC BDJSOPWXYLFTNW-UHFFFAOYSA-N 0.000 description 1
- NKHAVTQWNUWKEO-IHWYPQMZSA-N methyl hydrogen fumarate Chemical compound COC(=O)\C=C/C(O)=O NKHAVTQWNUWKEO-IHWYPQMZSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- CCRCUPLGCSFEDV-BQYQJAHWSA-N methyl trans-cinnamate Chemical compound COC(=O)\C=C\C1=CC=CC=C1 CCRCUPLGCSFEDV-BQYQJAHWSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- ZIYVHBGGAOATLY-UHFFFAOYSA-N methylmalonic acid Chemical compound OC(=O)C(C)C(O)=O ZIYVHBGGAOATLY-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- QYZFTMMPKCOTAN-UHFFFAOYSA-N n-[2-(2-hydroxyethylamino)ethyl]-2-[[1-[2-(2-hydroxyethylamino)ethylamino]-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound OCCNCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCNCCO QYZFTMMPKCOTAN-UHFFFAOYSA-N 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- ZWLPBLYKEWSWPD-UHFFFAOYSA-N o-toluic acid Chemical compound CC1=CC=CC=C1C(O)=O ZWLPBLYKEWSWPD-UHFFFAOYSA-N 0.000 description 1
- BPYXFMVJXTUYRV-UHFFFAOYSA-J octanoate;zirconium(4+) Chemical compound [Zr+4].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O.CCCCCCCC([O-])=O BPYXFMVJXTUYRV-UHFFFAOYSA-J 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002923 oximes Chemical class 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- IUGYQRQAERSCNH-UHFFFAOYSA-N pivalic acid Chemical compound CC(C)(C)C(O)=O IUGYQRQAERSCNH-UHFFFAOYSA-N 0.000 description 1
- 125000003367 polycyclic group Chemical group 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- UORVCLMRJXCDCP-UHFFFAOYSA-N propynoic acid Chemical compound OC(=O)C#C UORVCLMRJXCDCP-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 238000006862 quantum yield reaction Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 239000001044 red dye Substances 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 description 1
- 235000017557 sodium bicarbonate Nutrition 0.000 description 1
- 239000012312 sodium hydride Substances 0.000 description 1
- 229910000104 sodium hydride Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 150000003440 styrenes Chemical class 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- 230000005469 synchrotron radiation Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- QEMXHQIAXOOASZ-UHFFFAOYSA-N tetramethylammonium Chemical compound C[N+](C)(C)C QEMXHQIAXOOASZ-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 125000002088 tosyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])S(*)(=O)=O 0.000 description 1
- GTZCVFVGUGFEME-UHFFFAOYSA-N trans-aconitic acid Natural products OC(=O)CC(C(O)=O)=CC(O)=O GTZCVFVGUGFEME-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- DXNCZXXFRKPEPY-UHFFFAOYSA-N tridecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCC(O)=O DXNCZXXFRKPEPY-UHFFFAOYSA-N 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- STMPXDBGVJZCEX-UHFFFAOYSA-N triethylsilyl trifluoromethanesulfonate Chemical compound CC[Si](CC)(CC)OS(=O)(=O)C(F)(F)F STMPXDBGVJZCEX-UHFFFAOYSA-N 0.000 description 1
- 150000008648 triflates Chemical class 0.000 description 1
- FTVLMFQEYACZNP-UHFFFAOYSA-N trimethylsilyl trifluoromethanesulfonate Chemical compound C[Si](C)(C)OS(=O)(=O)C(F)(F)F FTVLMFQEYACZNP-UHFFFAOYSA-N 0.000 description 1
- 239000012989 trithiocarbonate Substances 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000012991 xanthate Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
Definitions
- the present invention relates to a positive photosensitive resin composition, an organic EL element partition wall, an organic EL element insulating film, and an organic EL element using the same. More specifically, the present invention relates to a positive photosensitive resin composition containing a metal complex dye, an organic EL element partition wall, an organic EL element insulating film, and an organic EL element using the same.
- a partition material is used in the gap between the colored patterns in the display area or the edge of the display area peripheral portion.
- partition walls are first formed, and organic pixels are formed between the partition walls in order to prevent organic substance pixels from coming into contact with each other.
- This partition is generally formed by photolithography using a photosensitive resin composition and has insulating properties. Specifically, a photosensitive resin composition is applied onto a substrate using a coating device, volatile components are removed by means of heating or the like, and then exposed through a mask.
- the exposed portion is developed by removing it with a developing solution such as an alkaline aqueous solution, and the resulting pattern is heat-treated to form a partition wall (insulating film).
- a developing solution such as an alkaline aqueous solution
- the resulting pattern is heat-treated to form a partition wall (insulating film).
- an organic substance emitting three colors of red, green, and blue is deposited between the barrier ribs to form the pixels of the organic EL display device.
- Patent Document 1 Japanese Unexamined Patent Application Publication No. 2001-281440 discloses a positive radiation-sensitive resin composition containing an alkali-soluble resin and a quinonediazide compound as a radiation-sensitive resin composition exhibiting high light-shielding properties by heat treatment after exposure. describes a composition to which titanium black is added.
- Patent Document 2 Japanese Patent Application Laid-Open No. 2002-116536 describes a radiation-sensitive resin composition containing [A] an alkali-soluble resin, [B] a 1,2-quinonediazide compound, and [C] a colorant, wherein carbon black describes a method of blackening a barrier rib material using
- Patent Document 3 Japanese Patent Application Laid-Open No. 2010-237310 describes a positive radiation-sensitive resin composition containing an alkali-soluble resin and a quinonediazide compound as a radiation-sensitive resin composition that exhibits light-shielding properties by heat treatment after exposure. Compositions with added thermal dyes are described.
- Patent Document 4 International Publication No. 2017/069172 discloses (A) a binder resin, (B) a quinonediazide compound, and (C) at least one black dye selected from solvent black color indexes 27 to 47. A positive-acting photosensitive resin composition containing a black dye is described.
- the photosensitive resin composition used to form a colored partition wall material it is necessary to use a considerable amount of a coloring agent in order to sufficiently enhance the light shielding properties of the cured film.
- a coloring agent in order to sufficiently enhance the light shielding properties of the cured film.
- the radiation irradiated to the film of the photosensitive resin composition is absorbed by the colorant, so that the effective intensity of the radiation in the film is reduced, and the photosensitive resin composition is not sufficiently exposed, resulting in poor patternability.
- partition walls in organic EL elements it is important from the viewpoint of productivity that the material forming the partition walls has high sensitivity.
- a chemically amplified photosensitive resin composition generally contains a resin in which an alkali-soluble functional group is protected with an acid-decomposable group, and a photoacid generator.
- the acid generated from the photoacid generator during exposure promotes decomposition (deprotection) of the acid-decomposable group to regenerate the alkali-soluble functional group. This promotes alkali dissolution of the resin in the exposed areas during development.
- the acid derived from the photoacid generator is regenerated after decomposing a certain acid-decomposable group and participates in the decomposition of another acid-decomposable group.
- the apparent quantum efficiency of the chemical amplification system based on the above reaction mechanism is expressed as the product of the quantum efficiency of acid generation and the reaction chain, so high sensitivity is achieved by using a photosensitive resin composition as a chemical amplification system. can do.
- a metal complex dye is a soluble azo dye composed of an azo dye molecule, a metal complex ion (anion) composed of a metal such as chromium, and a counter cation.
- An object of the present invention is to provide a highly sensitive chemically amplified photosensitive resin composition containing a metal complex dye.
- the present inventors have found that the sensitivity of the chemically amplified photosensitive resin composition can be increased by setting the content of the metal complex ions constituting the metal complex dye within a predetermined range.
- the present invention includes the following aspects.
- a positive type according to [1], wherein the metal element forming the metal complex ion contained in the metal complex dye (C) is at least one selected from the group consisting of chromium, copper, cobalt, and iron.
- a photosensitive resin composition is at least one selected from the group consisting of chromium, copper, cobalt, and iron.
- the first resin (A) has the formula (3) (In formula (3), R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 5 is the acid-decomposable group, r is an integer of 0 to 5, and s is 0 to is an integer of 5, provided that r+s is an integer of 1 to 5.)
- the positive photosensitive resin composition according to [5] which has at least one structural unit represented by formula (3), wherein s is an integer of 1 or more.
- the first resin (A) has the formula (2) (In Formula (2), R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, or a fully or partially fluorinated fluoroalkyl group having 1 to 3 carbon atoms.
- the positive photosensitive resin composition further includes a second resin (D), and the second resin (D) is a homopolymer or copolymer of a polymerizable monomer having an alkali-soluble functional group, or an epoxy
- An organic EL element partition comprising a cured product of the positive photosensitive resin composition according to any one of [1] to [11].
- An organic EL element insulating film comprising a cured product of the positive photosensitive resin composition according to any one of [1] to [11].
- An organic EL device comprising a cured product of the positive photosensitive resin composition according to any one of [1] to [11].
- alkali-soluble and “alkali aqueous solution-soluble” mean that the positive photosensitive resin composition or its components, or the coating or cured coating of the positive photosensitive resin composition is an alkaline aqueous solution, for example, 2.38 mass. % tetramethylammonium hydroxide aqueous solution.
- the “alkali-soluble functional group” means a group that imparts such alkali-solubility to a positive photosensitive resin composition or a component thereof, or a coating or cured coating of a positive photosensitive resin composition.
- Alkali-soluble functional groups include, for example, a carboxy group, an alcoholic hydroxyl group, a phenolic hydroxyl group, a sulfo group, a phosphoric acid group, an acid anhydride group, and a mercapto group.
- acid-decomposable group means a group that is decomposed (deprotected) by heating in the presence of an acid as necessary to generate an alkali-soluble functional group.
- radical polymerizable functional group refers to one or more ethylenically unsaturated groups
- radical polymerizable compound refers to compounds having one or more ethylenically unsaturated groups.
- (meth)acrylic means acrylic or methacrylic
- (meth)acrylate means acrylate or methacrylate
- (meth)acryloyl means acryloyl or methacryloyl.
- the number average molecular weight (Mn) and weight average molecular weight (Mw) of a resin or polymer mean standard polystyrene equivalent values measured by gel permeation chromatography (GPC).
- the "resin component” means the total component of the first resin (A) and the second resin (D).
- solid content means the first resin (A), the photoacid generator (B), the metal complex dye (C), the second resin (D), the dissolution accelerator (E) and the optional component (F ) and excluding the solvent (G).
- a positive photosensitive resin composition of one embodiment includes a first resin (A) having a plurality of alkali-soluble functional groups, at least a portion of which is protected with an acid-decomposable group; It contains a photoacid generator (B) and a metal complex dye (C).
- the first resin (A) is not particularly limited as long as it has a plurality of alkali-soluble functional groups and at least part of the plurality of alkali-soluble functional groups are protected with an acid-decomposable group.
- Alkali-soluble functional groups include a carboxy group, an alcoholic hydroxyl group, a phenolic hydroxyl group, a sulfo group, a phosphoric acid group, an acid anhydride group, and a mercapto group.
- the alkali-soluble functional group is preferably a carboxy group or a phenolic hydroxyl group, more preferably a phenolic hydroxyl group.
- the first resin (A) may have an alkali-soluble functional group other than the alkali-soluble functional group protected with an acid-decomposable group.
- Post-exposure baking (PEB) is optionally performed in the presence of an acid generated during exposure to promote decomposition (deprotection) of the acid-decomposable groups and regenerate the alkali-soluble functional groups. This promotes alkali dissolution of the first resin (A) in the exposed areas during development.
- a 1st resin (A) can be used individually or in combination of 2 or more types.
- the first resin (A) may be a combination of two or more resins differing in polymer constitutional units, acid-decomposable groups, protection rates of alkali-soluble functional groups, or combinations thereof.
- the first resin (A) can be obtained by protecting some of the alkali-soluble functional groups of the base resin (a) having multiple alkali-soluble functional groups with acid-decomposable groups.
- the alkali-soluble functional group is a phenolic hydroxyl group
- the first resin (A) having a phenolic hydroxyl group protected with an acid-decomposable group has a partial structure of Ar—O—R 5 , and Ar is phenol and R 5 represents an acid-decomposable group.
- the acid-decomposable group is a group that is decomposed (deprotected) by heating in the presence of an acid, if necessary, to generate an alkali-soluble functional group.
- tert-butyl group 1,1-dimethyl-propyl group, 1-methylcyclopentyl group, 1-ethylcyclopentyl group, 1-methylcyclohexyl group, 1-ethylcyclohexyl group, 1-methyladamantyl group , 1-ethyladamantyl group, tert-butoxycarbonyl group, group having a tertiary alkyl group such as 1,1-dimethyl-propoxycarbonyl group; trimethylsilyl group, triethylsilyl group, tert-butyldimethylsilyl group, triisopropylsilyl group , a silyl group such as a tert-butyldiphenylsilyl group; and formula (4) —
- the alkali-soluble functional group is an alcoholic hydroxyl group or a phenolic hydroxyl group
- the group represented by formula (4) forms an acetal structure or ketal structure together with an oxygen atom derived from the alkali-soluble functional group.
- the acid-decomposable group is preferably a group represented by formula (4), since a highly sensitive photosensitive resin composition can be obtained even with a low exposure dose.
- R 6 and R 7 are each independently a hydrogen atom, a linear alkyl group having 1 to 4 carbon atoms, or a branched alkyl group having 3 to 4 carbon atoms, and R 8 is fluorine, chlorine, bromine and optionally substituted with a halogen atom selected from the group consisting of iodine, a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, or having 3 to 12 carbon atoms A cyclic alkyl group is more preferred.
- Examples of such acid-decomposable groups include 1-alkoxyalkyl groups.
- 1-alkoxyalkyl groups include, for example, methoxymethyl group, 1-methoxyethyl group, 1-ethoxyethyl group, 1-n-propoxyethyl group, 1-n-butoxyethyl group, 1-isobutoxyethyl group, 1 -(2-chloroethoxy)ethyl group, 1-(2-ethylhexyloxy)ethyl group, 1-cyclohexyloxyethyl group, and 1-(2-cyclohexylethoxy)ethyl group; - n-propoxyethyl groups are preferred.
- the acid-decomposable group a group represented by formula (4) in which one of R 6 or R 7 and R 8 are bonded to form a ring structure having 3 to 10 ring members is also preferably used. can do.
- R6 or R7 that does not participate in the formation of the ring structure is preferably a hydrogen atom.
- acid-decomposable groups include a 2-tetrahydrofuranyl group and a 2-tetrahydropyranyl group, with a 2-tetrahydrofuranyl group being preferred.
- the protective reaction of the alkali-soluble functional group can be carried out under known conditions using a general protective agent.
- a general protective agent for example, by reacting the base resin (a) of the first resin (A) with a protective agent in the absence of solvent or in a solvent such as toluene or hexane in the presence of an acid or base at a reaction temperature of -20 to 50°C. , the first resin (A) can be obtained.
- a known protective agent capable of protecting an alkali-soluble functional group can be used.
- protective agents that can be used include isobutene when the acid-decomposable group is a tert-butyl group and di-tert-butyl dicarbonate when the acid-decomposable group is a tert-butoxycarbonyl group.
- the acid-decomposable group is a silyl group such as trimethylsilyl group and triethylsilyl group
- silicon-containing chlorides such as trimethylsilyl chloride and triethylsilyl chloride
- silicon-containing triflate compounds such as trimethylsilyl triflate and triethylsilyl triflate can be used. .
- Chloromethyl methyl ether when the acid-decomposable group is a methoxymethyl group
- 2-tetrahydrofuranyl group when it is a 2-tetrahydrofuranyl group.
- 2,3-dihydrofuran and 2-tetrahydropyranyl groups 3,4-dihydro-2H-pyran and the like can be used.
- acids examples include inorganic acids such as hydrochloric acid, sulfuric acid, nitric acid and perchloric acid, and organic acids such as methanesulfonic acid, trifluoromethanesulfonic acid, p-toluenesulfonic acid and benzenesulfonic acid. Salts of organic acids, such as the pyridinium salt of p-toluenesulfonic acid, can also be used as acid sources.
- the base include inorganic hydroxides such as sodium hydroxide and potassium hydroxide, inorganic carbonates such as sodium carbonate, potassium carbonate and cesium carbonate, inorganic hydrogen carbonates such as sodium hydrogen carbonate, and metals such as sodium hydride.
- hydrides and amine compounds such as pyridine, N,N-dimethyl-4-aminopyridine, imidazole, triethylamine and diisopropylethylamine;
- the polymerizable monomer having an alkali-soluble functional group protected with an acid-decomposable group can also be obtained by polymerizing or copolymerizing the polymer and optionally other polymerizable monomers. Protection of the alkali-soluble functional group of the polymerizable monomer having an alkali-soluble functional group can be carried out in the same manner as the protection of the alkali-soluble functional group of the base resin (a).
- Base resin (a) examples of the base resin (a) of the first resin (A) include polystyrene resins, epoxy resins, polyamide resins, phenol resins, polyimide resins, polyamic acid resins, polybenzoxazole resins having a plurality of alkali-soluble functional groups, Polybenzoxazole resin precursors, silicone resins, cyclic olefin polymers, cardo resins, and derivatives of these resins.
- phenol resin derivatives include polyalkenylphenol resins in which alkenyl groups are bonded to benzene rings
- polystyrene resin derivatives include hydroxypolystyrene resin derivatives in which phenolic hydroxyl groups and hydroxyalkyl groups or alkoxy groups are bonded to benzene rings.
- a homopolymer or copolymer of a polymerizable monomer having an alkali-soluble functional group can also be used as the base resin (a).
- These base resins (a) can be used alone or in combination of two or more.
- the base resin (a) may have a radically polymerizable functional group.
- the base resin (a) has a (meth)acryloyloxy group, allyl group or methallyl group as a radically polymerizable functional group.
- the base resin (a) of the first resin (A) is a copolymer (a1) of a polymerizable monomer having an alkali-soluble functional group and another polymerizable monomer
- Polymer (a1) has a plurality of alkali-soluble functional groups.
- the first resin (A) is obtained by protecting at least part of the multiple alkali-soluble functional groups of the copolymer (a1) with an acid-decomposable group.
- the copolymer (a1) may have two or more types of alkali-soluble functional groups.
- the copolymer (a1) can be produced, for example, by radically polymerizing a polymerizable monomer having an alkali-soluble functional group and other polymerizable monomers. After synthesizing a copolymer by radical polymerization, an alkali-soluble functional group may be added to the copolymer.
- Examples of the polymerizable monomer having an alkali-soluble functional group include maleic acid derivatives such as monomethyl maleate, monoethyl maleate, and monoisopropyl maleate; (meth)acrylic acid, ⁇ -bromo(meth)acrylic acid, ⁇ - acrylic acid derivatives such as chloro (meth)acrylic acid, ⁇ -furyl (meth)acrylic acid, ⁇ -styryl (meth)acrylic acid; and maleic acid, fumaric acid, cinnamic acid, ⁇ -cyanocinnamic acid, itaconic acid , crotonic acid, propiolic acid, 3-maleimidopropionic acid, 4-maleimidobutyric acid, unsaturated carboxylic acid compounds such as 6-maleimidohexanoic acid; 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3 -Polymerizable monomers having an alcoholic hydroxy
- polymerizable monomers include, for example, styrene; styrene derivatives such as ⁇ -methylstyrene, p-methylstyrene and p-ethylstyrene; acrylamide; acrylonitrile; vinyl alcohol ether compounds such as vinyl-n-butyl ether; alkyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2 , 2,3,3-tetrafluoropropyl (meth)acrylate and isobornyl (meth)acrylate; and N-substituted maleimides such as phenylmaleimide and cyclohexylmaleimide.
- maleimides such as
- the copolymer (a1) has one or more cyclic structures such as an alicyclic structure, an aromatic structure, a polycyclic structure, an inorganic cyclic structure, and a heterocyclic structure. It is preferable to have From the viewpoint of sensitivity, the polymerizable monomer having an alkali-soluble functional group is preferably a polymerizable monomer having an acrylic acid derivative or a phenolic hydroxyl group, and is a polymerizable monomer having a phenolic hydroxyl group. is more preferred.
- R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 5.
- R 1 is preferably a hydrogen atom or a methyl group.
- a is preferably an integer of 1 to 3, more preferably 1; 4-Hydroxyphenyl methacrylate is particularly preferred as such a polymerizable monomer having a phenolic hydroxyl group.
- R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, a fully or partially fluorinated fluoroalkyl group having 1 to 3 carbon atoms, or a halogen atom
- R 4 is a hydrogen atom, a linear alkyl group having 1 to 6 carbon atoms, a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, or a A phenyl group substituted with at least one selected from the group consisting of an alkyl group and an alkoxy group having 1 to 6 carbon atoms.
- R 2 and R 3 are each independently preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, more preferably a hydrogen atom.
- R 4 is at least one selected from the group consisting of a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms and an alkoxy group having 1 to 6 carbon atoms; A phenyl group substituted with a species is preferable, and a cyclic alkyl group having 3 to 12 carbon atoms or a phenyl group is more preferable. Phenylmaleimide and N-cyclohexylmaleimide are particularly preferred as such other polymerizable monomers.
- copolymer (a1) has the formula (1) (In Formula (1), R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 5.)
- a structural unit represented by the formula (2) (In Formula (2), R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, or a fully or partially fluorinated fluoroalkyl group having 1 to 3 carbon atoms.
- R 4 is a hydrogen atom, a linear alkyl group having 1 to 6 carbon atoms, a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, or a 1 to 6 carbon atom is a phenyl group substituted with at least one selected from the group consisting of an alkyl group and an alkoxy group having 1 to 6 carbon atoms.) It has a structural unit represented by
- 4-hydroxyphenyl methacrylate as a polymerizable monomer having a phenolic hydroxyl group and phenylmaleimide or N-cyclohexylmaleimide as another polymerizable monomer.
- a resin obtained by radically polymerizing these polymerizable monomers it is possible to improve shape retention and developability and reduce outgassing.
- Polymerization initiators for producing the base resin (a) or copolymer (a1) by radical polymerization include, but are not limited to, 2,2′-azobisisobutyronitrile, 2,2′-azobis (2-methylbutyronitrile), dimethyl 2,2'-azobis (2-methylpropionate), 4,4'-azobis (4-cyanovaleric acid), 2,2'-azobis (2,4- Azo polymerization initiators such as dimethylvaleronitrile) (AVN); dicumyl peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, tert-butylcumyl peroxide, di-tert- butyl peroxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, or a peroxide polymerization initiator having a 10-hour half-life temperature of 100 to 170°C; or benzoyl peroxide, peroxide Peroxide polymer
- the amount of the polymerization initiator used is generally 0.01 parts by mass or more, 0.05 parts by mass or more, or 0.5 parts by mass or more and 40 parts by mass or less, or 20 parts by mass or more with respect to a total of 100 parts by mass of the polymerizable monomers. It is preferably 15 parts by mass or less or 15 parts by mass or less.
- a RAFT (Reversible Addition Fragmentation Transfer) agent may be used in combination with the polymerization initiator.
- Thiocarbonylthio compounds such as, but not limited to, dithioesters, dithiocarbamates, trithiocarbonates, and xanthates can be used as RAFT agents.
- the RAFT agent can be used in the range of 0.005 to 20 parts by weight, preferably in the range of 0.01 to 10 parts by weight, per 100 parts by weight of the total polymerizable monomers.
- the weight average molecular weight (Mw) of the base resin (a) or copolymer (a1) can be 3,000 to 80,000, preferably 4,000 to 70,000, and more preferably 5,000 to 60,000.
- the number average molecular weight (Mn) can be from 1,000 to 30,000, preferably from 1,500 to 25,000, more preferably from 2,000 to 20,000.
- the polydispersity (Mw/Mn) can be from 1.0 to 3.5, preferably from 1.1 to 3.0, more preferably from 1.2 to 2.8.
- 1 mol% to 99 mol%, preferably 5 mol% to 98 mol%, more preferably 10 mol% to 97 mol% of the alkali-soluble functional groups of the first resin (A) are acid-decomposable groups. protected by In the first resin (A), by setting the ratio of the alkali-soluble functional group protected by the acid-decomposable group to 1 mol% or more, a chemical amplification function is imparted to the photosensitive resin composition to achieve high sensitivity. can do.
- the proportion of alkali-soluble functional groups protected by acid-decomposable groups is calculated from the weight loss rate (%) of the first resin (A) measured by a thermogravimetric differential thermal analyzer (TG/DTA).
- TG/DTA thermogravimetric differential thermal analyzer
- the first resin (A) is represented by formula (3) (In formula (3), R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R 5 is an acid-decomposable group, r is an integer of 0 to 5, s is 0 to 5 where r + s is an integer of 1 to 5.) and has at least one structural unit represented by formula (3) where s is an integer of 1 or more is preferred.
- the acid-labile group of R 5 is represented by formula (4) —CR 6 R 7 —OR 8 (4) is preferably a group represented by In formula (4), R 6 and R 7 are each independently more preferably a hydrogen atom, a linear alkyl group having 1 to 4 carbon atoms, or a branched alkyl group having 3 to 4 carbon atoms. .
- R 8 is a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, a cyclic alkyl group having 3 to 12 carbon atoms, an aralkyl group having 7 to 12 carbon atoms, or More preferably, it is an alkenyl group having 2 to 12 carbon atoms, or one of R 6 or R 7 and R 8 combine to form a ring structure having 3 to 10 ring members.
- R 6 , R 7 and R 8 may be substituted with a halogen atom selected from the group consisting of fluorine, chlorine, bromine and iodine. Examples of such acid-decomposable groups include 1-alkoxyalkyl groups.
- 1-alkoxyalkyl groups include, for example, methoxymethyl group, 1-methoxyethyl group, 1-ethoxyethyl group, 1-n-propoxyethyl group, 1-n-butoxyethyl group, 1-isobutoxyethyl group, 1 -(2-chloroethoxy)ethyl group, 1-(2-ethylhexyloxy)ethyl group, 1-cyclohexyloxyethyl group, and 1-(2-cyclohexylethoxy)ethyl group; - n-propoxyethyl groups are preferred.
- Examples of the acid-decomposable group in which one of R 6 or R 7 and R 8 are bonded to form a ring structure having 3 to 10 ring members include 2-tetrahydrofuranyl and 2-tetrahydropyranyl. and the 2-tetrahydrofuranyl group is preferred.
- the acid-decomposable group for R 5 is, for example, tert-butyl, 1,1-dimethyl-propyl, 1-methylcyclopentyl, 1-ethylcyclopentyl, 1-methylcyclohexyl, 1 Groups having a tertiary alkyl group such as -ethylcyclohexyl group, 1-methyladamantyl group, 1-ethyladamantyl group, tert-butoxycarbonyl group, 1,1-dimethyl-propoxycarbonyl group; trimethylsilyl group, triethylsilyl group, tert -Butyldimethylsilyl group, triisopropylsilyl group, tert-butyldiphenylsilyl group, and other silyl groups.
- a tertiary alkyl group such as -ethylcyclohexyl group, 1-methyladamantyl group, 1-ethyladamantyl group
- the first resin (A) has the formula (2) (In Formula (2), R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, or a fully or partially fluorinated fluoroalkyl group having 1 to 3 carbon atoms. , or a halogen atom, and R 4 is a hydrogen atom, a linear alkyl group having 1 to 6 carbon atoms, a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, or a 1 to 6 carbon atom is a phenyl group substituted with at least one selected from the group consisting of an alkyl group and an alkoxy group having 1 to 6 carbon atoms.).
- R 2 and R 3 are each independently preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, more preferably a hydrogen atom.
- R 4 is at least one selected from the group consisting of a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, an alkyl group having 1 to 6 carbon atoms and an alkoxy group having 1 to 6 carbon atoms; A phenyl group substituted with a species is preferable, and a cyclic alkyl group having 3 to 12 carbon atoms or a phenyl group is more preferable.
- a structural unit represented by formula (3) and s is an integer of 1 or more, i.e., represented by formula (3) in which at least one alkali-soluble functional group is protected with an acid-decomposable group is 5% to 95%, preferably 15% to 90%, more preferably 25% to 85% of the total number of structural units in the first resin (A).
- a chemical amplification function can be imparted to the photosensitive resin composition to realize high sensitivity.
- the ratio of the structural unit By setting the ratio of the structural unit to 95% or less, the residual amount of unreacted acid-decomposable groups can be reduced, the solubility of the exposed area can be improved, and high sensitivity can be realized.
- the positive photosensitive resin composition contains 0.5% to 80% by mass, preferably 1% to 65% by mass, of the first resin (A) based on 100% by mass of solid content, More preferably, it contains 2% by mass to 50% by mass.
- the content of the first resin (A) is 0.5% by mass or more based on the solid content of 100% by mass, a chemical amplification function can be imparted to the photosensitive resin composition to achieve high sensitivity.
- the content of the first resin (A) is 80% by mass or less based on the solid content of 100% by mass, the residual amount of unreacted acid-decomposable groups is reduced, and the solubility of the exposed area is increased to increase the Sensitivity can be achieved.
- the positive photosensitive resin composition contains a photoacid generator (B).
- the photoacid generator (B) is a compound that generates an acid when exposed to radiation such as visible light, ultraviolet light, ⁇ -rays and electron beams.
- the photoacid generator (B) accelerates the decomposition of the acid-decomposable groups of the first resin (A) to regenerate the alkali-soluble functional groups and increases the alkali-solubility of the first resin (A).
- the acid generated from the photoacid generator (B) is present in the portion irradiated with radiation, the resin in that portion is easily dissolved in the alkaline aqueous solution together with the acid. As a result, a pattern with high sensitivity and high resolution can be formed even with a low exposure dose.
- Photoacid generator (B) can be used individually or in combination of 2 or more types.
- the positive photosensitive resin composition contains 0.1 parts by mass to 85 parts by mass, preferably 10 parts by mass to 60 parts by mass of the photoacid generator (B) based on a total of 100 parts by mass of the resin components. Parts by weight, more preferably 15 to 42 parts by weight. High sensitivity can be achieved when the content of the photoacid generator (B) is 0.1 parts by mass or more based on the above total of 100 parts by mass. When the content of the photoacid generator (B) is 85 parts by mass or less based on the above total of 100 parts by mass, the alkali developability is good.
- the positive photosensitive resin composition contains a quinonediazide compound as the photoacid generator (B).
- a quinonediazide compound produces an alkali-soluble carboxylic acid compound through the reaction shown in Reaction Formula 1 below when irradiated with radiation such as visible light, ultraviolet light, ⁇ -rays, and electron beams.
- the produced carboxylic acid compound accelerates the decomposition of the acid-decomposable groups of the first resin (A), regenerates the alkali-soluble functional groups, and increases the alkali-solubility of the first resin (A).
- the quinonediazide compound interacts (for example, forms hydrogen bonds) with the functional groups of a binder resin such as a novolak resin before exposure to make the binder resin insoluble in an alkaline aqueous solution.
- a binder resin such as a novolak resin
- the presence of the alkali-soluble carboxylic acid compound in the irradiated portion makes it easier for the resin in that portion to dissolve in the alkaline aqueous solution together with the carboxylic acid compound.
- carboxylic acid compounds have a relatively larger molecular structure than acids generated from photoacid generators commonly used in chemically amplified resists, such as p-toluenesulfonic acid and 1-propanesulfonic acid, and diffuse in the coating. hard to do.
- a quinonediazide compound can be used individually or in combination of 2 or more types.
- high-resolution patterns can be formed without the post-exposure bake (PEB) required for typical chemically amplified resists.
- PEB post-exposure bake
- a quinonediazide compound has a relatively high quantum yield, and a carboxylic acid compound is efficiently produced in an exposed area.
- the generated carboxylic acid compound causes decomposition of the acid-decomposable group even at room temperature to regenerate the alkali-soluble functional group. It is possible to increase the difference in alkali solubility of the exposed areas.
- PEB By omitting PEB, it is possible to suppress deterioration in pattern formability due to excessive diffusion of acid generated from the photo-acid generator into unexposed areas in a high-temperature environment during PEB. Further, when a resin having an epoxy group and a phenolic hydroxyl group, which will be described later, is used as an optional component, if PEB is omitted, the ring-opening polymerization of the epoxy group of the resin having an epoxy group and a phenolic hydroxyl group does not proceed. And the alkali solubility of the resin having a phenolic hydroxyl group can be maintained.
- the quinonediazide compounds include those in which the sulfonic acid of quinonediazide is bonded to a polyhydroxy compound via an ester bond, the sulfonic acid of quinonediazide to a polyamino compound in a sulfonamide bond, and the sulfonic acid of quinonediazide to a polyhydroxypolyamino compound in an ester bond or a sulfonamide bond. and the like. From the viewpoint of the contrast between the exposed and unexposed areas, it is preferable that 20 mol % or more of all the functional groups of the polyhydroxy compound, polyamino compound or polyhydroxypolyamino compound are substituted with quinonediazide.
- polyhydroxy compounds include Bis-Z, BisP-EZ, TekP-4HBPA, TrisP-HAP, TrisP-PA, TrisP-SA, TrisOCR-PA, BisOCHP-Z, BisP-MZ, BisP-PZ, BisP-IPZ, BisOCP-IPZ, BisP-CP, BisRS-2P, BisRS-3P, BisP-OCHP, methylenetris-FR-CR, BisRS-26X, DML-MBPC, DML-MBOC, DML-OCHP, DML-PCHP, DML-PC , DML-PTBP, DML-34X, DML-EP, DML-POP, Dimethylol-BisOC-P, DML-PFP, DML-PSBP, DML-MTrisPC, TriML-P, TriML-35XL, TML-BP, TML-HQ , TML-pp-BPF, TML-BPA, TMOM-BP, HML-TPPHBA, HML-TPH
- Polyamino compounds include 1,4-phenylenediamine, 1,3-phenylenediamine, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylsulfone, 4,4'-diamino Examples include, but are not limited to, diphenyl sulfide and the like.
- polyhydroxypolyamino compounds include, but are not limited to, 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane, 3,3'-dihydroxybenzidine, and the like.
- the quinonediazide compound is preferably 1,2-naphthoquinonediazide-4-sulfonate or 1,2-naphthoquinonediazide-5-sulfonate of a polyhydroxy compound.
- the positive photosensitive resin composition contains 5 parts by mass to 60 parts by mass, preferably 10 parts by mass to 50 parts by mass, more preferably 15 parts by mass of a quinonediazide compound based on a total of 100 parts by mass of the resin components. Contains parts by mass to 42 parts by mass.
- the content of the quinonediazide compound is 5 parts by mass or more based on the above total of 100 parts by mass, high sensitivity can be achieved.
- the content of the quinonediazide compound is 60 parts by mass or less based on the above total of 100 parts by mass, the alkali developability is good.
- the photoacid generator (B) other than the quinonediazide compound is preferably one that generates an acid with a pKa of 4 or less upon exposure to radiation, more preferably one that generates an acid with a pKa of 3 or less.
- Such a photoacid generator (B) can generate an acid capable of decomposing an acid-decomposable group.
- the photoacid generator (B) other than the quinonediazide compound those that generate an acid with a pKa of -15 or more upon exposure to radiation are preferable, and those that generate an acid with a pKa of -5 or more are more preferable.
- Such a photoacid generator (B) excessively promotes the ring-opening polymerization of the epoxy group of the resin having an epoxy group and a phenolic hydroxyl group, which will be described later, during exposure and post-exposure heat treatment (PEB).
- PEB post-exposure heat treatment
- the alkali solubility of the resin having epoxy groups and phenolic hydroxyl groups can be maintained during development.
- photoacid generators (B) examples include trichloromethyl-s-triazine compounds, onium salts such as sulfonium salts, phosphonium salts, diazonium salts, and iodonium salts, quaternary ammonium salts, diazomethane compounds, and imidosulfonate compounds. , and oxime sulfonate compounds. Among these, it is preferable to use an oxime sulfonate compound because of its high sensitivity and high insulating properties.
- oxime sulfonate compounds include compounds represented by Formula (5).
- R 9 is a substituted or unsubstituted alkyl group, alkoxy group, aryl group, or halogen atom
- R 10 and R 11 are each independently a substituted or unsubstituted aryl group, substituted or an unsubstituted heterocyclic group, cyano group, acyloxy group, carboxy group, alkoxycarbonyl group, or fluoroalkyl group.
- R 10 and R 11 may combine to form a ring structure.
- the number of ring members in the ring structure is preferably 3-10.
- the substituted or unsubstituted alkyl group for R 9 includes, for example, a linear alkyl group having 1 to 10 carbon atoms or a branched alkyl group having 3 to 10 carbon atoms, a methyl group, an ethyl group, or An n-propyl group is preferred.
- the substituted or unsubstituted alkoxy group for R 9 includes, for example, a linear alkoxy group having 1 to 5 carbon atoms or a branched alkoxy group having 3 to 5 carbon atoms, such as a methoxy group or an ethoxy group. is preferred.
- substituents of the alkyl group and alkoxy group of R 9 include halogen atoms (fluorine, chlorine, bromine and iodine atoms), cyano groups, nitro groups, aryl groups having 6 to 20 carbon atoms, carbon Alkoxy groups of 1 to 10 atoms and cycloalkyl groups of 3 to 10 carbon atoms are included.
- the substituted alkyl group for R 9 is preferably a fluoroalkyl group, more preferably a trifluoromethyl group, a pentafluoroethyl group, or a heptafluoropropyl group, even more preferably a trifluoromethyl group. .
- the substituted or unsubstituted aryl group for R 9 includes, for example, an aryl group having 6 to 20 carbon atoms, preferably a phenyl group, a 4-methylphenyl group or a naphthyl group.
- substituents of the aryl group of R 9 include alkyl groups having 1 to 5 carbon atoms, alkoxy groups having 1 to 5 carbon atoms, and halogen atoms (fluorine, chlorine, bromine, and iodine atoms). is mentioned.
- Halogen atoms for R9 include fluorine, chlorine, bromine and iodine atoms.
- the substituted or unsubstituted aryl group for R 10 and R 11 includes, for example, an aryl group having 6 to 20 carbon atoms, preferably a phenyl group or a naphthyl group.
- substituted or unsubstituted heterocyclic groups for R 10 and R 11 include 2-benzofuranyl, 3-benzofuranyl, 2-benzimidazolyl, 2-benzoxazolyl, 2-benzothiazolyl and 2-indolyl.
- substituents of the aryl group and heterocyclic group of R 10 and R 11 include an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, an acyloxy group having 2 to 4 carbon atoms, and halogen atoms (fluorine, chlorine, bromine, and iodine atoms).
- Acyloxy groups for R 10 and R 11 include, for example, an acetoxy group and a benzoyloxy group.
- alkoxycarbonyl groups for R 10 and R 11 include ethoxycarbonyl groups.
- fluoroalkyl groups for R 10 and R 11 include trifluoromethyl, pentafluoroethyl and heptafluoropropyl groups.
- R 10 is preferably a cyano group, a carboxy group, an alkoxycarbonyl group or a fluoroalkyl group, more preferably a cyano group or a trifluoromethyl group.
- R 11 is preferably a substituted or unsubstituted aryl group or a substituted or unsubstituted heterocyclic group, a 4-methoxyphenyl group, a substituted or unsubstituted 2-benzofuranyl group, a 3-benzofuranyl group, a 3- A coumarinyl group, a 4-coumarinyl group, a 3-isocoumarinyl group, or a 4-isocoumarinyl group is preferred.
- Examples of the oxime sulfonate compound having a ring structure formed by combining R 10 and R 11 include an oxime sulfonate compound represented by formula (5a).
- R 9 is as described for formula (5), each R 12 is independently an alkyl group, an alkoxy group, or a halogen atom, and m represents an integer of 0 to 5. .
- the alkyl group for R 12 includes, for example, a linear alkyl group having 1 to 10 carbon atoms or a branched alkyl group having 3 to 10 carbon atoms, and a methyl group, an ethyl group or an n-propyl group.
- the alkoxy group for R 12 includes, for example, a linear alkoxy group having 1 to 5 carbon atoms or a branched alkoxy group having 3 to 5 carbon atoms, preferably a methoxy group or an ethoxy group.
- the halogen atom for R 12 includes a fluorine atom, a chlorine atom, a bromine atom and an iodine atom, preferably a chlorine atom or a fluorine atom.
- m is 0 or 1.
- oximesulfonate compounds include (Z,E)-2-(4-methoxyphenyl)([(4-methylphenyl)sulfonyl)oxy]imino)acetonitrile, 2-[2-(propylsulfonyloxyimino)thiophene -3(2H)-ylidene]-2-(2-methylphenyl)acetonitrile, 2-[2-(4-methylphenylsulfonyloxyimino)thiophene-3(2H)-ylidene]-2-(2-methylphenyl ) acetonitrile and the like.
- the positive photosensitive resin composition contains 0.5 parts by mass to 60 parts by mass, preferably 5 parts by mass of a photoacid generator (B) other than a quinonediazide compound, based on a total of 100 parts by mass of the resin components. Parts by weight to 50 parts by weight, more preferably 10 parts by weight to 45 parts by weight. High sensitivity can be achieved when the content of the photoacid generator (B) other than the quinonediazide compound is 0.5 parts by mass or more based on the above total of 100 parts by mass. When the content of the photoacid generator (B) other than the quinonediazide compound is 60 parts by mass or less based on the above total of 100 parts by mass, the alkali developability is good.
- a positive photosensitive resin composition contains a metal complex dye (C).
- a typical metal complex dye (C) is a monoazo dye having a coordinating functional group such as a hydroxy group, a carboxyl group or an amino group, to metal ions such as chromium, copper, cobalt, iron and nickel. It is composed of a metal complex ion (anion) and a counter cation coordinated together.
- Metal complex dyes (C) are generally of two classes: 1:1 type metal complex dyes (1 molecule of monoazo dye coordinated to 1 atom of metal) and 1:2 type metal complex dyes (monoazo dye to 1 atom of metal). two molecules of the dye are coordinated).
- Monoazo dyes generally have either o,o'-dihydroxyazo, o-hydroxy-o'-aminoazo, or o-hydroxy-o'-carboxazo structures.
- the metal complex dye (C) leaves less residue during development than pigments, and can form a highly precise pattern on the film.
- the metal complex dye (C) is easily dissolved in an organic solvent and hardly precipitates in the solution even when mixed at a high concentration.
- the optical density (OD value) of the cured film can be efficiently increased.
- Metal complex dye (C) can be used individually or in combination of 2 or more types.
- the metal complex dye (C) contains 50 to 94% by mass of metal complex ions.
- the degree of interaction between the metal complex ion and the resin affects the solubility of the unexposed area and the exposed area. considered to have an impact.
- the metal complex dye (C) containing 50% by mass or more of metal complex ions releases the entanglement between the polymer chains of the resin, and the alkali-soluble functional groups of the resin effectively interact with the alkali component of the developer. Any operable amount of metal complex ions can be provided.
- the solubility of the exposed area can be enhanced, and the sensitivity of the positive photosensitive resin composition can be enhanced.
- the metal complex dye (C) containing 94% by mass or less of the metal complex ions moderately maintains the entanglement between the polymer chains of the resin and imparts the degree of insolubility necessary for pattern formation to the unexposed areas. can be done.
- the metal complex ion content of the metal complex dye (C) is set to 50 to 94% by mass, it is possible to provide a highly sensitive positive photosensitive resin composition.
- the metal complex ion content (% by mass) in the metal complex dye (C) is determined by the following procedure.
- a sample is prepared by adding methyl benzoate as an internal standard substance and diethyl carbonate as a dilution solvent to the metal complex dye (C) and, if necessary, adding a pretreatment agent for gas chromatography. After stirring the obtained sample, it is analyzed by GC or GC-MS using an internal standard method, and the metal complex ion content (% by mass) is calculated from the following formula.
- metal complex ion content of the metal complex dye (C) 100-Total content of each substance detected by GC (% by mass)
- the metal complex ion content of the metal complex dye (C) is the total mass of the metal complex ions of the two or more metal complex dyes (C). Determined by dividing by the total mass of one or more metal complex dyes (C).
- the metal complex dye (C) preferably contains 60% by mass or more, more preferably 70% by mass or more, and still more preferably 80% by mass or more of metal complex ions.
- the metal complex dye (C) preferably contains 93% by mass or less, more preferably 92% by mass or less of metal complex ions.
- the metal complex dye (C) preferably contains 60 to 94% by mass, more preferably 80 to 94% by mass or 60 to 92% by mass, still more preferably 80 to 92% by mass of metal complex ions.
- the metal element forming the metal complex ion contained in the metal complex dye (C) is preferably at least one selected from the group consisting of chromium, copper, cobalt, and iron, and more preferably chromium. .
- Counter cations contained in the metal complex dye (C) include Na + , Li + , K + , H + , NH 4 + , primary ammonium cations, secondary ammonium cations, tertiary ammonium cations, quaternary ammonium cations, and the like.
- the metal complex dye (C) for example, a black dye defined by the color index (C.I.) of Solvent Black 22 to 47, C.I. of Solvent Blue 137, I. C.I. of Solvent Yellow 13, 19, 21, 25, 25:1, 62, 79, 81, 82, 83, 83:1, 88, 89, 90, 151, 161; I. and solvent orange 5, 11, 20, 40:1, 41, 45, 54, 56, 58, 62, 70, 81, 99 C.I. I.
- the metal complex dye (C) is preferably Solvent Black 22-47 C.I. I. and more preferably Solvent Black 27, 29 or 34 C.I. I. At least one of the black dyes defined in When the metal complex dye (C) is used, the light-shielding property of the film of the positive photosensitive resin composition after baking can be maintained.
- the positive photosensitive resin composition contains 10 parts by mass to 150 parts by mass, preferably 30 parts by mass to 100 parts by mass of the metal complex dye (C) based on a total of 100 parts by mass of the resin components. More preferably, it contains 40 parts by mass to 60 parts by mass.
- the content of the metal complex dye (C) is 10 parts by mass or more based on the above total of 100 parts by mass, the light-shielding properties of the baked film can be maintained.
- the content of the metal complex dye (C) is 150 parts by mass or less based on the above total of 100 parts by mass, the coating can be colored without impairing the alkali developability.
- the positive photosensitive resin composition may further contain a second resin (D).
- the second resin (D) is a resin different from the first resin (A).
- the second resin (D) is not particularly limited, it preferably has an alkali-soluble functional group and is alkali-soluble.
- Alkali-soluble functional groups include, but are not particularly limited to, carboxy groups, phenolic hydroxyl groups, sulfo groups, phosphoric acid groups, and mercapto groups.
- a second resin (D) having two or more alkali-soluble functional groups may be used. However, the second resin (D) does not have an alkali-soluble functional group protected by an acid-decomposable group.
- Examples of the second resin (D) include homopolymers or copolymers of polymerizable monomers having alkali-soluble functional groups, and resins having epoxy groups and phenolic hydroxyl groups.
- Other second resins (D) include, for example, acrylic resins, polystyrene resins, epoxy resins, polyamide resins, phenol resins, polyimide resins, polyamic acid resins, polybenzoxazole resins, polybenzoxazole resin precursors, silicone resins, Cyclic olefin polymers, cardo resins, derivatives of these resins, and alkali-soluble functional groups bonded to these resins can be mentioned.
- phenol resin derivatives include polyalkenylphenol resins in which alkenyl groups are bonded to benzene rings
- polystyrene resin derivatives include hydroxypolystyrene resin derivatives in which phenolic hydroxyl groups and hydroxyalkyl groups or alkoxy groups are bonded to benzene rings. be done. These resins can be used alone or in combination of two or more.
- the second resin (D) may have a radically polymerizable functional group.
- the second resin (D) has a (meth)acryloyloxy group, an allyl group or a methallyl group as a radically polymerizable functional group.
- the second resin (D) is the polymerizable monomer having a phenolic hydroxyl group and other polymerizable monomers that can be used as the base resin (a) of the first resin (A).
- the copolymer (a1) with the The copolymer (a1) as the second resin (D) and the copolymer (a1) as the base resin (a) of the first resin (A) have a number average molecular weight Mn and a weight average molecular weight Mw , and polydispersity Mw/Mn, and types and mass ratios of polymerizable monomers constituting them, may be the same or different.
- the second resin (D) has formula (1) (In Formula (1), R 1 is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, and a is an integer of 1 to 5.)
- a structural unit represented by the formula (2) (In Formula (2), R 2 and R 3 are each independently a hydrogen atom, an alkyl group having 1 to 3 carbon atoms, or a fully or partially fluorinated fluoroalkyl group having 1 to 3 carbon atoms.
- R 4 is a hydrogen atom, a linear alkyl group having 1 to 6 carbon atoms, a cyclic alkyl group having 3 to 12 carbon atoms, a phenyl group, or a hydroxy group, or a 1 to 6 carbon atom is a phenyl group substituted with at least one selected from the group consisting of an alkyl group and an alkoxy group having 1 to 6 carbon atoms.) It is a copolymer (a1) having a structural unit represented by
- the second resin (D) contains a resin having epoxy groups and phenolic hydroxyl groups.
- a resin having an epoxy group and a phenolic hydroxyl group is an alkaline aqueous solution-soluble resin.
- a resin having an epoxy group and a phenolic hydroxyl group may have an alkali-soluble functional group other than the phenolic hydroxyl group.
- a resin having an epoxy group and a phenolic hydroxyl group is, for example, a compound having at least two epoxy groups in one molecule (hereinafter sometimes referred to as an "epoxy compound"), a part of the epoxy group and a hydroxyl It can be obtained by reacting the carboxy group of a benzoic acid compound.
- Epoxy groups of resins containing epoxy groups and phenolic hydroxyl groups form crosslinks by reacting with phenolic hydroxyl groups during heat treatment (post-baking) after development, thereby improving the chemical resistance and heat resistance of the film. be able to. Since the phenolic hydroxyl group contributes to the solubility in an alkaline aqueous solution during development, the resin having an epoxy group and a phenolic hydroxyl group is not sufficiently decomposed (deprotected) of the acid-decomposable group when exposed to light at a low exposure dose. It also functions as a dissolution accelerator for the first resin (A), thereby making the photosensitive resin composition highly sensitive.
- Reaction Formula 2 An example of the reaction in which one of the epoxy groups of the epoxy compound reacts with the carboxyl group of the hydroxybenzoic acid compound to form a compound having a phenolic hydroxyl group is shown in Reaction Formula 2 below.
- Examples of compounds having at least two epoxy groups in one molecule include phenol novolak type epoxy resins, cresol novolak type epoxy resins, bisphenol type epoxy resins, biphenol type epoxy resins, naphthalene skeleton-containing epoxy resins, and alicyclic epoxy resins. , heterocyclic epoxy resins, and the like. These epoxy compounds need only have two or more epoxy groups in one molecule, and may be used alone or in combination of two or more. Since these compounds are thermosetting, it is common knowledge for those skilled in the art that their structures cannot be uniquely described due to differences in the presence or absence of epoxy groups, types of functional groups, degrees of polymerization, and the like.
- An example of the structure of the novolak type epoxy resin is shown in formula (6).
- R 13 is a hydrogen atom, an alkyl group having 1-5 carbon atoms, an alkoxy group having 1-2 carbon atoms or a hydroxyl group
- n is an integer of 1-50.
- phenolic novolak-type epoxy resins examples include EPICLON (registered trademark) N-770 (manufactured by DIC Corporation) and JER (registered trademark)-152 (manufactured by Mitsubishi Chemical Corporation).
- cresol novolac type epoxy resins examples include EPICLON (registered trademark) N-695 (manufactured by DIC Corporation) and EOCN (registered trademark)-102S (manufactured by Nippon Kayaku Co., Ltd.).
- Bisphenol-type epoxy resins include, for example, jER (registered trademark) 828, jER (registered trademark) 1001 (manufactured by Mitsubishi Chemical Corporation), YD-128 (trade name, manufactured by Nippon Steel Chemical & Materials Co., Ltd.) and other bisphenol A types.
- Bisphenol F-type epoxy resins such as epoxy resins, jER (registered trademark) 806 (manufactured by Mitsubishi Chemical Corporation) and YDF-170 (trade name, manufactured by Nippon Steel Chemical & Materials Co., Ltd.).
- Examples of biphenol-type epoxy resins include jER (registered trademark) YX-4000 and jER (registered trademark) YL-6121H (manufactured by Mitsubishi Chemical Corporation).
- naphthalene skeleton-containing epoxy resin examples include NC-7000 (trade name, manufactured by Nippon Kayaku Co., Ltd.) and EXA-4750 (trade name, manufactured by DIC Corporation).
- Alicyclic epoxy resins include, for example, EHPE (registered trademark)-3150 (manufactured by Daicel Chemical Industries, Ltd.).
- heterocyclic epoxy resins include TEPIC (registered trademark), TEPIC-L, TEPIC-H, and TEPIC-S (manufactured by Nissan Chemical Industries, Ltd.).
- the compound having at least two epoxy groups in one molecule is preferably a novolak type epoxy resin, more preferably at least one selected from the group consisting of phenol novolak type epoxy resins and cresol novolak type epoxy resins. preferable.
- a positive photosensitive resin composition containing a resin having an epoxy group derived from a novolak-type epoxy resin and a phenolic hydroxyl group has excellent pattern formability, easy adjustment of alkali solubility, and little outgassing.
- a hydroxybenzoic acid compound is a compound in which at least one of the 2-6 positions of benzoic acid is substituted with a hydroxyl group, such as salicylic acid, 4-hydroxybenzoic acid, 2,3-dihydroxybenzoic acid, and 2,4-dihydroxybenzoic acid.
- a hydroxyl group such as salicylic acid, 4-hydroxybenzoic acid, 2,3-dihydroxybenzoic acid, and 2,4-dihydroxybenzoic acid.
- 2,5-dihydroxybenzoic acid, 2,6-dihydroxybenzoic acid, 3,4-dihydroxybenzoic acid, 3,5-dihydroxybenzoic acid, 2-hydroxy-5-nitrobenzoic acid, 3-hydroxy-4-nitro Benzoic acid, 4-hydroxy-3-nitrobenzoic acid and the like can be mentioned, and dihydroxybenzoic acid compounds are preferred from the viewpoint of enhancing alkali developability.
- a hydroxybenzoic acid compound can be used individually or in combination of 2 or more types.
- the resin having an epoxy group and a phenolic hydroxyl group is a reaction product of a compound having at least two epoxy groups in one molecule and a hydroxybenzoic acid compound, represented by formula (7) has the structure
- b is an integer of 1 to 5
- * represents a bonding portion of a compound having at least two epoxy groups in one molecule with a residue other than the epoxy group involved in the reaction.
- a resin having an epoxy group and a phenolic hydroxyl group from an epoxy compound and a hydroxybenzoic acid compound it is possible to use 0.2 to 0.95 equivalents of the hydroxybenzoic acid compound with respect to 1 equivalent of the epoxy group of the epoxy compound. preferably 0.3 to 0.9 equivalents, more preferably 0.4 to 0.8 equivalents. If the amount of the hydroxybenzoic acid compound is 0.2 equivalents or more, sufficient alkali solubility can be obtained, and if the amount is 0.95 equivalents or less, an increase in molecular weight due to side reactions can be suppressed.
- a catalyst may be used to promote the reaction between the epoxy compound and the hydroxybenzoic acid compound.
- the amount of the catalyst used can be 0.1 to 10 parts by mass based on 100 parts by mass of the reaction raw material mixture comprising the epoxy compound and the hydroxybenzoic acid compound.
- the reaction temperature can be 60-150° C., and the reaction time can be 3-30 hours.
- Examples of catalysts used in this reaction include triethylamine, benzyldimethylamine, triethylammonium chloride, benzyltrimethylammonium bromide, benzyltrimethylammonium iodide, triphenylphosphine, chromium octanoate, and zirconium octanoate.
- the number average molecular weight (Mn) of the resin having an epoxy group and a phenolic hydroxyl group is preferably 500-8000, more preferably 800-6000, even more preferably 1000-5000. If the number-average molecular weight is 500 or more, the alkali solubility is appropriate, so it is good as a resin for a photosensitive material.
- the epoxy equivalent of the resin having an epoxy group and a phenolic hydroxyl group is 300-7000, preferably 400-6000, more preferably 500-5000. If the epoxy equivalent of the resin having an epoxy group and a phenolic hydroxyl group is 300 or more, the resin having an epoxy group and a phenolic hydroxyl group can develop sufficient alkali solubility. If the epoxy equivalent of the resin having an epoxy group and a phenolic hydroxyl group is 7000 or less, the strength and heat resistance of the cured coating film can be enhanced. Epoxy equivalent is determined by JIS K 7236:2009.
- the hydroxyl equivalent weight of the resin having an epoxy group and a phenolic hydroxyl group is 160-500, preferably 170-400, more preferably 180-300. If the hydroxyl group equivalent of the resin having an epoxy group and a phenolic hydroxyl group is 160 or more, the strength and heat resistance of the cured coating film can be enhanced. When the hydroxyl equivalent of the resin having epoxy groups and phenolic hydroxyl groups is 500 or less, the resin having epoxy groups and phenolic hydroxyl groups can exhibit sufficient alkali solubility. The hydroxyl equivalent is determined according to JIS K 0070:1992.
- the positive photosensitive resin composition contains 5% by mass to 80% by mass, preferably 10% by mass to 75% by mass, more preferably 10% by mass to 75% by mass of the second resin (D) based on the solid content of 100% by mass. contains 15% by mass to 70% by mass.
- the content of the second resin (D) is 5% by mass or more based on the solid content of 100% by mass, the dissolution of the exposed area can be promoted to achieve high sensitivity, and the coating after heat curing can be improved. Stability and durability can be ensured.
- the content of the second resin (D) is 80% by mass or less based on 100% by mass of the solid content, the solubility of the unexposed areas can be kept low and the residual film rate can be kept high.
- the positive photosensitive resin composition may further contain a dissolution accelerator (E) for improving the solubility of the alkali-soluble portion in the developer during development.
- a dissolution accelerator (E) for improving the solubility of the alkali-soluble portion in the developer during development.
- examples of the dissolution accelerator (E) include organic low-molecular-weight compounds selected from the group consisting of compounds having a carboxyl group and compounds having a phenolic hydroxyl group.
- the dissolution accelerator (E) can be used alone or in combination of two or more.
- low-molecular-weight compounds refer to compounds with a molecular weight of 1000 or less.
- the organic low-molecular compound has a carboxyl group or a plurality of phenolic hydroxyl groups and is alkali-soluble.
- organic low-molecular-weight compounds include aliphatic monocarboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid, caproic acid, diethylacetic acid, enanthic acid, and caprylic acid; acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, brassylic acid, methylmalonic acid, ethylmalonic acid, dimethylmalonic acid, methylsuccinic acid, tetramethylsuccinic acid, citraconic acid, etc.
- aliphatic monocarboxylic acids such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, pivalic acid, caproic acid, diethylacetic acid, enanthic acid, and caprylic acid
- succinic acid glutaric acid, adipic acid, pimel
- Aliphatic dicarboxylic acids such as aliphatic tricarboxylic acids such as tricarballylic acid, aconitic acid and camphoronic acid; aromatic monocarboxylic acids such as benzoic acid, toluic acid, cumic acid and mesitylene acid; Aromatic polycarboxylic acids such as mellitic acid, trimesic acid, melophanic acid, pyromellitic acid and hemimellitic acid; aromatic hydroxycarboxylic acids such as dihydroxybenzoic acid, trihydroxybenzoic acid and gallic acid; phenylacetic acid, hydroatropic acid, hydrosilicone Other carboxylic acids such as mic acid, mandelic acid, phenylsuccinic acid, atropic acid, cinnamic acid, methyl cinnamate, benzyl cinnamate, cinnamylideneacetic acid, coumaric acid, umberic acid; catechol, resorcinol, hydroquinone, 1,
- the content of the dissolution accelerator (E) in the positive photosensitive resin composition can be 0.1 parts by mass to 50 parts by mass, preferably 1 part by mass, based on the total of 100 parts by mass of the resin components. parts to 35 parts by mass, more preferably 2 parts to 20 parts by mass. If the content of the dissolution accelerator (E) is 0.1 parts by mass or more based on the above total of 100 parts by mass, the dissolution of the resin component can be effectively promoted, and if it is 50 parts by mass or less Excessive dissolution of the resin component can be suppressed, and the pattern formability, surface quality, etc. of the film can be improved.
- the positive photosensitive resin composition can contain, as an optional component (F), a thermosetting agent, a surfactant, a coloring agent other than the component (C), and the like.
- optional component (F) is defined as none of (A)-(E).
- thermal radical generator can be used as a thermosetting agent.
- Preferred thermal radical generators include organic peroxides, specifically dicumyl peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, tert-butyl Organic peroxides such as cumyl peroxide, di-tert-butyl peroxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, etc. with a 10-hour half-life temperature of 100 to 170 ° C. can be mentioned.
- the content of the heat curing agent is preferably 5 parts by mass or less, more preferably 4 parts by mass or less, and still more preferably 3 parts by mass or less, based on the total 100 parts by mass of solid content excluding the heat curing agent. .
- the positive photosensitive resin composition can contain a surfactant, for example, to improve coatability, to improve the smoothness of the film, or to improve the developability of the film.
- surfactants include polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; Oxyethylene aryl ethers; nonionic surfactants such as polyoxyethylene dialkyl esters such as polyoxyethylene dilaurate and polyoxyethylene distearate; Megafac (registered trademark) F-251, F-281, F -430, F-444, R-40, F-553, F-554, F-555, F-556, F-557, F-558, F-559 (above, Trade name, manufactured by DIC Corporation), Surflon (registered trademark) S-242, S-243, S-386, S-420, S-611 (trade name, manufactured by AGC Seimi Chemical Co., Ltd.) fluorine-based surfactants
- the content of the surfactant is preferably 2 parts by mass or less, more preferably 1 part by mass or less, and still more preferably 0.5 parts by mass or less, based on the total 100 parts by mass of the solid content excluding the surfactant. is.
- the positive photosensitive resin composition can be dissolved in the solvent (G) and used as a solution state coating composition.
- a photoacid generator (B), a metal complex dye (C), and a A coating composition containing a positive photosensitive resin composition is prepared by mixing an optional component (F) such as a dissolution accelerator (E), a thermosetting agent, and a surfactant as required in a predetermined ratio. be able to.
- the coating composition can be adjusted to a viscosity suitable for the coating method used by varying the amount of solvent (G).
- Examples of the solvent (G) include glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol methyl ethyl ether and ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate; and diethylene glycol.
- glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol dimethyl ether, ethylene glycol methyl ethyl ether and ethylene glycol monoethyl ether
- ethylene glycol alkyl ether acetates such as methyl cellosolve acetate and ethyl cellosolve acetate
- diethylene glycol diethylene glycol
- diethylene glycol compounds such as monomethyl ether, diethylene glycol diethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol monoethyl ether and diethylene glycol monobutyl ether; propylene glycol alkyl ether acetate compounds such as propylene glycol methyl ether acetate and propylene glycol ethyl ether acetate; toluene; Aromatic hydrocarbons such as xylene, ketones such as methyl ethyl ketone, methyl amyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, cyclohexanone, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate , ethyl 2-hydroxy-2-methylpropionate, ethyl ethoxyacetate, ethyl hydroxyacetate, methyl 2-hydroxy-2-methylbutanoate
- the solid content concentration of the coating composition can be appropriately determined depending on the purpose of use.
- the coating composition may have a solids concentration of 1 to 60% by weight, 3 to 50% by weight, or 5 to 40% by weight.
- the prepared coating composition is usually filtered before use.
- Filtration means include, for example, a Millipore filter with a pore size of 0.05 to 1.0 ⁇ m.
- the coating composition prepared in this way also has excellent long-term storage stability.
- a coating composition is prepared by dissolving or dispersing the positive photosensitive resin composition in a solvent.
- the coating composition can then be applied to the substrate surface and the solvent removed by means such as heating to form a coating.
- the method of applying the coating composition to the substrate surface is not particularly limited, and for example, a spray method, a roll coating method, a slit method, a spin coating method, or the like can be used.
- the solvent is usually removed by heating to form a film (pre-bake).
- the heating conditions vary depending on the type of each component, the mixing ratio, etc., but usually at 70 to 130 ° C., for example, 30 seconds to 20 minutes on a hot plate, 1 to 60 minutes in an oven to obtain a coating. be able to.
- the pre-baked film is irradiated with radiation (for example, visible light, ultraviolet light, deep ultraviolet light, X-rays, electron beams, gamma rays, synchrotron radiation, etc.) through a photomask having a predetermined pattern (exposure step).
- radiation for example, visible light, ultraviolet light, deep ultraviolet light, X-rays, electron beams, gamma rays, synchrotron radiation, etc.
- radiation for example, visible light, ultraviolet light, deep ultraviolet light, X-rays, electron beams, gamma rays, synchrotron radiation, etc.
- exposure step for example, visible light, ultraviolet light, deep ultraviolet light, X-rays, electron beams, gamma rays, synchrotron radiation, etc.
- Preferred radiation is ultraviolet to visible light having a wavelength of 250-450 nm.
- the radiation is i-line.
- the radiation is ghi rays.
- PEB heat treatment
- PEB heat treatment
- the heating conditions vary depending on the type of each component, the mixing ratio, etc., but usually PEB is performed by heating at 70 to 140° C., for example, for 30 seconds to 20 minutes on a hot plate and 1 to 60 minutes in an oven. be able to.
- the PEB after the exposure step can be omitted.
- the coating is developed by contacting it with a developer, and unnecessary portions are removed to form a pattern on the coating (development process).
- the developer include inorganic alkali compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia; primary amines such as ethylamine and n-propylamine; secondary amines such as n-propylamine; tertiary amines such as triethylamine and methyldiethylamine; alcohol amines such as dimethylethanolamine and triethanolamine; quaternary amines such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline.
- inorganic alkali compounds such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, aqueous ammonia
- primary amines such as ethylamine and n-propyl
- ammonium salts pyrrole, piperidine, 1,8-diazabicyclo[5.4.0]-7-undecene, cyclic amines such as 1,5-diazabicyclo[4.3.0]-5-nonane, etc.
- Aqueous solutions can be used.
- An aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol, a surfactant, or the like to an alkaline aqueous solution can also be used as a developer.
- Development time is usually 30 to 180 seconds.
- the developing method may be any one of a liquid swell method, a shower method, a dipping method, and the like.
- the coating can be patterned by washing with running water for 30 to 90 seconds, removing unnecessary portions, and air-drying with compressed air or compressed nitrogen.
- the film having the pattern formed thereon is subjected to heat treatment at 100 to 350° C. for 20 to 200 minutes using a heating device such as a hot plate or oven to obtain a cured film (post-baking, heat treatment process).
- a heating device such as a hot plate or oven to obtain a cured film
- the temperature may be maintained constant, may be increased continuously, or may be increased stepwise.
- Heat treatment is preferably performed in a nitrogen atmosphere.
- the optical density (OD value) of the cured film of the positive photosensitive resin composition is preferably 0.5 or more, more preferably 0.7 or more, and 1.0 or more per 1 ⁇ m of film thickness. is more preferred. If the cured film has an OD value of 0.5 or more per 1 ⁇ m of film thickness, sufficient light shielding properties can be obtained.
- a method for producing an organic EL element partition wall or an insulating film of one embodiment includes dissolving or dispersing a positive photosensitive resin composition in a solvent to prepare a coating composition, applying the coating composition to a substrate to form a film. forming, drying the coating by removing the solvent contained in the coating, exposing the coating by irradiating the dried coating with radiation through a photomask, and contacting the exposed coating with a developer to form a pattern on the film, and heat treatment of the patterned film at a temperature of 100° C. to 350° C. to form an organic EL element partition wall or an insulating film.
- the above PEB can also be performed after exposure and before development.
- One embodiment is an organic EL element partition containing a cured product of a positive photosensitive resin composition.
- One embodiment is an organic EL element insulating film containing a cured product of a positive photosensitive resin composition.
- One embodiment is an organic EL device containing a cured product of a positive photosensitive resin composition.
- the weight-average molecular weight and number-average molecular weight of the first resin (A) and the second resin (D) were calculated using a calibration curve prepared using polystyrene standard substances under the following measurement conditions.
- the precipitated copolymer was collected by filtration and vacuum-dried at 90° C. for 4 hours to collect 32.4 g of white powder.
- the obtained PCX-02e had a number average molecular weight of 3,100 and a weight average molecular weight of 6,600.
- PCX-02e-THF97 the first resin (A) (PCX-02e-THF97) in which the phenolic hydroxyl group was protected with a 2-tetrahydrofuranyl group. rice field.
- the resulting PCX-02e-THF97 had a number average molecular weight of 3098, a weight average molecular weight of 5958, a proportion of phenolic hydroxyl groups protected with acid-decomposable groups of 97 mol%, and at least one phenolic hydroxyl group being acid-decomposable.
- the number of structural units represented by formula (3) protected by groups was 77% of the total number of structural units in the first resin (A).
- the proportion of phenolic hydroxyl groups protected with acid-decomposable groups was determined using a thermogravimetric differential thermal analyzer (TG/DTA6200, manufactured by Hitachi High-Tech Science Co., Ltd.) in a nitrogen gas stream at a temperature elevation rate of 10°C/min.
- the resulting two solutions were added dropwise to 90.4 g of isopropyl acetate (manufactured by Shinko Organic Chemical Industry Co., Ltd.) heated to 89° C. in a 300 mL three-necked flask under a nitrogen gas atmosphere over 2 hours. , and then reacted at 89° C. for 4 hours.
- 50 g of the reaction solution cooled to room temperature was dropped into a mixed solvent of 50 g of toluene and 200 g of hexane to precipitate a copolymer.
- the precipitated copolymer was recovered by filtration and vacuum-dried at 80° C. for 5 hours to recover 8.98 g of white powder.
- the obtained PCX-02e-TBMA50 had a number average molecular weight of 4,122, a weight average molecular weight of 7,583, and a ratio of carboxy groups protected with acid-decomposable groups of 50 mol %.
- PCX-02e-THF97 and PCX-02e-TBMA50 were used as the first resin (A).
- TS-150A and TS-200A (4,4'-[1-[4-[1-(4-hydroxyphenyl)-1-methylethyl]phenyl]ethylidene] which are quinonediazide compounds as photoacid generators
- B Ester of bisphenol (TrisP-PA) and 6-diazo-5,6-dihydro-5-oxonaphthalene-1-sulfonic acid (1,2-naphthoquinonediazide-5-sulfonic acid), manufactured by Toyo Gosei Co., Ltd.) It was used.
- the structures of TS-150A and TS-200A are shown below.
- TS-150A has a quinonediazide structure in an average of 1.5 R out of 3 R per molecule.
- TS-200A has a quinonediazide structure for an average of 2.0 R out of 3 R per molecule.
- PAG-103 (2-[2-(propylsulfonyloxyimino)thiophene-3(2H)-ylidene]-2-(2-methylphenyl)acetonitrile which is an oxime photoacid generator as the photoacid generator (B) , BASF, CAS No. 852246-55-0) and PAG-169 (BASF) were used.
- C-1 to C-5 shown in Table 1 were used as metal complex dyes (C).
- the metal element forming metal complex ions is chromium.
- C-1, C-3, and C-5 are Solvent Black 27 from different lots.
- the metal complex ion content (% by mass) of metal complex dyes C-1 to C-5 was determined by the following procedure. 0.1 g of metal complex dye is weighed, 0.1 g of methyl benzoate (manufactured by Tokyo Chemical Industry Co., Ltd.) and 6.0 g of diethyl carbonate (manufactured by Tokyo Chemical Industry Co., Ltd.) are added, and if necessary, gas chromatography Samples were prepared with the addition of pretreatment agents.
- PCX-02e was used as the second resin (D).
- Phloroglucinol was used as a dissolution accelerator (E).
- F Megafac (registered trademark) F-559 (fluorosurfactant, manufactured by DIC Corporation), which is a surfactant (leveling agent), was used.
- a mixed solvent of ⁇ -butyrolactone (GBL) and propylene glycol monomethyl ether acetate (PGMEA) was used as the solvent (G).
- a glass substrate (size 100 mm ⁇ 100 mm ⁇ 1 mm) was bar-coated with a positive photosensitive resin composition so that the dry film thickness was 2.6 ⁇ m, dried in vacuum at room temperature for 60 seconds, and placed on a hot plate with a lid at 100 °C. was heated for 100 seconds for pre-baking. Further, PEB was performed by heating at 115° C. for 200 seconds on a hot plate with a lid. After measuring the dry film thickness using an optical film thickness measuring device (F20-NIR, manufactured by Filmetrics Co., Ltd.), a spin developing device (AD-1200, manufactured by Takizawa Sangyo Co., Ltd.) was used to obtain 2.38% by mass hydroxylation.
- an optical film thickness measuring device F20-NIR, manufactured by Filmetrics Co., Ltd.
- a spin developing device AD-1200, manufactured by Takizawa Sangyo Co., Ltd.
- Alkaline development was carried out for 80 seconds with a tetramethylammonium aqueous solution.
- the film thickness after alkali development was measured again using an optical film thickness measuring device (F20-NIR, manufactured by Filmetrics Co., Ltd.), and the dissolved film thickness ( ⁇ m) before and after development was taken as an index of the unexposed area solubility. did.
- the positive photosensitive resin composition in which the film thickness dissolved before and after development was in the range of 0.3 to 1.9 ⁇ m has high alkali solubility resistance in the unexposed area, and the difference in film thickness between the unexposed area and the exposed area is It was judged to have high sensitivity because it was easy to attach.
- a glass substrate (size 100 mm ⁇ 100 mm ⁇ 1 mm) was bar-coated with a positive photosensitive resin composition to a dry film thickness of 2.6 ⁇ m, vacuum dried for 90 seconds, and then placed on a hot plate with a lid at 100 ° C. It was pre-baked by heating for 100 seconds. Exposure was performed at 150 mJ/cm 2 through a quartz photomask (having a ⁇ 10 ⁇ m pattern) with an exposure apparatus (trade name: Multilight ML-251A/B, manufactured by Ushio Inc.) incorporating an ultra-high pressure mercury lamp.
- the amount of exposure was measured using an ultraviolet integrating photometer (trade name: UIT-150 light receiving unit UVD-S365, manufactured by Ushio Inc.). After the exposure, PEB was performed by heating at 115° C. for 200 seconds on a hot plate with a lid. After that, using a spin developing device (AD-1200, manufactured by Takizawa Sangyo Co., Ltd.), alkali development was carried out for 60 seconds with a 2.38% by mass tetramethylammonium hydroxide aqueous solution. Further, the coating was cured by heating at 250° C. for 60 minutes in an inert oven (DN411I, manufactured by Yamato Scientific Co., Ltd.).
- an ultraviolet integrating photometer trade name: UIT-150 light receiving unit UVD-S365, manufactured by Ushio Inc.
- the hole diameter ( ⁇ m) obtained by observing the holes formed in the coating film after curing with a microscope (VHX-6000, manufactured by Keyence Corporation) was used as an index of sensitivity.
- a positive photosensitive resin composition having a hole diameter in the range of 9.0 to 11.0 ⁇ m was judged to have good pattern formability.
- [OD value of cured film] A glass substrate (size 100 mm ⁇ 100 mm ⁇ 1 mm) was spin-coated with a positive photosensitive resin composition to a dry film thickness of about 1.5 ⁇ m, and heated on a hot plate at 120°C for 80 seconds to dry the solvent. . After that, the coating was obtained by curing at 250° C. for 60 minutes in a nitrogen gas atmosphere. The OD value of the cured film was measured with a transmission densitometer (BMT-1, manufactured by Sakata Inx Engineering Co., Ltd.), corrected with the OD value of the glass alone, and converted to an OD value per 1 ⁇ m of film thickness. The thickness of the coating was measured using an optical film thickness measuring device (F20-NIR, manufactured by Filmetrics Co., Ltd.).
- the positive photosensitive resin composition according to the present disclosure can be suitably used for radiation lithography for forming partition walls or insulating films of organic EL elements.
- An organic EL element provided with a partition wall or an insulating film formed from the positive photosensitive resin composition according to the present disclosure is suitably used as an electronic component of a display device exhibiting good contrast.
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Abstract
Description
[1]
複数のアルカリ可溶性官能基を有し、前記複数のアルカリ可溶性官能基の少なくとも一部が酸分解性基で保護された第1樹脂(A)と、
光酸発生剤(B)と、
金属錯体染料(C)と
を含むポジ型感光性樹脂組成物であって、前記金属錯体染料(C)が、金属錯イオンを50~94質量%含む、ポジ型感光性樹脂組成物。
[2]
前記金属錯体染料(C)に含まれる前記金属錯イオンを形成する金属元素が、クロム、銅、コバルト、及び鉄からなる群より選択される少なくとも1種である、[1]に記載のポジ型感光性樹脂組成物。
[3]
前記金属錯体染料(C)が、ソルベントブラック22~47のカラーインデックス(C.I.)で規定される黒色染料のうち少なくとも1種である、[1]又は[2]に記載のポジ型感光性樹脂組成物。
[4]
前記第1樹脂(A)が、複数のフェノール性水酸基を有し、前記複数のフェノール性水酸の少なくとも一部が前記酸分解性基で保護された樹脂である、[1]~[3]のいずれかに記載のポジ型感光性樹脂組成物。
[5]
前記第1樹脂(A)が、複数のフェノール性水酸基を有し、前記複数のフェノール性水酸基の少なくとも一部が前記酸分解性基で保護された、フェノール性水酸基を有する重合性単量体とその他の重合性単量体との共重合体である、[4]に記載のポジ型感光性樹脂組成物。
[6]
前記第1樹脂(A)が、式(3)
で表される構造単位を有し、sが1以上の整数である式(3)で表される構造単位を少なくとも1つ有する、[5]に記載のポジ型感光性樹脂組成物。
[7]
前記第1樹脂(A)が、式(2)
で表される構造単位を有する、[5]又は[6]に記載のポジ型感光性樹脂組成物。
[8]
前記ポジ型感光性樹脂組成物が第2樹脂(D)を更に含み、前記第2樹脂(D)が、アルカリ可溶性官能基を有する重合性単量体の単独重合体又は共重合体、又はエポキシ基及びフェノール性水酸基を有する樹脂である、[1]~[7]のいずれかに記載のポジ型感光性樹脂組成物。
[9]
前記金属錯体染料(C)を、樹脂成分の合計100質量部を基準として10質量部~150質量部含む、[1]~[8]のいずれかに記載のポジ型感光性樹脂組成物。
[10]
前記光酸発生剤(B)を、樹脂成分の合計100質量部を基準として0.1質量部~85質量部含む、[1]~[9]のいずれかに記載のポジ型感光性樹脂組成物。
[11]
前記ポジ型感光性樹脂組成物の硬化被膜の光学濃度(OD値)が膜厚1μmあたり0.5以上である、[1]~[10]のいずれかに記載のポジ型感光性樹脂組成物。
[12]
[1]~[11]のいずれかに記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子隔壁。
[13]
[1]~[11]のいずれかに記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子絶縁膜。
[14]
[1]~[11]のいずれかに記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子。 That is, the present invention includes the following aspects.
[1]
a first resin (A) having a plurality of alkali-soluble functional groups, at least a portion of which is protected with an acid-decomposable group;
a photoacid generator (B);
A positive photosensitive resin composition containing a metal complex dye (C), wherein the metal complex dye (C) contains 50 to 94% by mass of metal complex ions.
[2]
The positive type according to [1], wherein the metal element forming the metal complex ion contained in the metal complex dye (C) is at least one selected from the group consisting of chromium, copper, cobalt, and iron. A photosensitive resin composition.
[3]
The positive photosensitivity according to [1] or [2], wherein the metal complex dye (C) is at least one of black dyes defined by a color index (C.I.) of Solvent Black 22 to 47. elastic resin composition.
[4]
[1] to [3], wherein the first resin (A) is a resin having a plurality of phenolic hydroxyl groups, and at least a portion of the plurality of phenolic hydroxyl groups are protected with the acid-decomposable groups. The positive photosensitive resin composition according to any one of .
[5]
a polymerizable monomer having a phenolic hydroxyl group in which the first resin (A) has a plurality of phenolic hydroxyl groups, at least a portion of which is protected by the acid-decomposable group; The positive photosensitive resin composition according to [4], which is a copolymer with another polymerizable monomer.
[6]
The first resin (A) has the formula (3)
The positive photosensitive resin composition according to [5], which has at least one structural unit represented by formula (3), wherein s is an integer of 1 or more.
[7]
The first resin (A) has the formula (2)
The positive photosensitive resin composition according to [5] or [6], which has a structural unit represented by:
[8]
The positive photosensitive resin composition further includes a second resin (D), and the second resin (D) is a homopolymer or copolymer of a polymerizable monomer having an alkali-soluble functional group, or an epoxy The positive photosensitive resin composition according to any one of [1] to [7], which is a resin having a group and a phenolic hydroxyl group.
[9]
The positive photosensitive resin composition according to any one of [1] to [8], comprising 10 parts by mass to 150 parts by mass of the metal complex dye (C) based on a total of 100 parts by mass of the resin components.
[10]
The positive photosensitive resin composition according to any one of [1] to [9], wherein the photoacid generator (B) is contained in an amount of 0.1 parts by mass to 85 parts by mass based on a total of 100 parts by mass of the resin components. thing.
[11]
The positive photosensitive resin composition according to any one of [1] to [10], wherein the cured film of the positive photosensitive resin composition has an optical density (OD value) of 0.5 or more per 1 μm of film thickness. .
[12]
[1] An organic EL element partition comprising a cured product of the positive photosensitive resin composition according to any one of [1] to [11].
[13]
An organic EL element insulating film comprising a cured product of the positive photosensitive resin composition according to any one of [1] to [11].
[14]
An organic EL device comprising a cured product of the positive photosensitive resin composition according to any one of [1] to [11].
一実施態様のポジ型感光性樹脂組成物は、複数のアルカリ可溶性官能基を有し、複数のアルカリ可溶性官能基の少なくとも一部が酸分解性基で保護された第1樹脂(A)と、光酸発生剤(B)と、金属錯体染料(C)とを含む。 [Positive photosensitive resin composition]
A positive photosensitive resin composition of one embodiment includes a first resin (A) having a plurality of alkali-soluble functional groups, at least a portion of which is protected with an acid-decomposable group; It contains a photoacid generator (B) and a metal complex dye (C).
第1樹脂(A)は複数のアルカリ可溶性官能基を有し、複数のアルカリ可溶性官能基の少なくとも一部が酸分解性基で保護されたものであれば特に限定されない。アルカリ可溶性官能基としては、カルボキシ基、アルコール性水酸基、フェノール性水酸基、スルホ基、リン酸基、酸無水物基、及びメルカプト基を挙げることができる。中でも、アルカリ可溶性官能基はカルボキシ基又はフェノール性水酸基であることが好ましく、フェノール性水酸基であることがより好ましい。アルカリ可溶性官能基の一部が酸分解性基で保護されていることにより、第1樹脂(A)の露光前のアルカリ溶解性は抑制されている。第1樹脂(A)は、酸分解性基で保護されたアルカリ可溶性官能基以外のアルカリ可溶性官能基を有していてもよい。露光時に発生した酸の存在下、必要に応じて露光後ベーク(PEB、post exposure bake)を行うことにより、酸分解性基の分解(脱保護)が促進され、アルカリ可溶性官能基が再生する。これにより現像時に露光部で第1樹脂(A)のアルカリ溶解が促進される。第1樹脂(A)は、単独で、又は2種類以上を組み合わせて使用することができる。例えば、第1樹脂(A)は、重合体の構成単位、酸分解性基、アルカリ可溶性官能基の保護率、又はこれらの組み合わせが異なる2種類以上の樹脂の組み合わせであってよい。 <First resin (A)>
The first resin (A) is not particularly limited as long as it has a plurality of alkali-soluble functional groups and at least part of the plurality of alkali-soluble functional groups are protected with an acid-decomposable group. Alkali-soluble functional groups include a carboxy group, an alcoholic hydroxyl group, a phenolic hydroxyl group, a sulfo group, a phosphoric acid group, an acid anhydride group, and a mercapto group. Among them, the alkali-soluble functional group is preferably a carboxy group or a phenolic hydroxyl group, more preferably a phenolic hydroxyl group. By protecting a part of the alkali-soluble functional groups with the acid-decomposable groups, the alkali-solubility of the first resin (A) before exposure is suppressed. The first resin (A) may have an alkali-soluble functional group other than the alkali-soluble functional group protected with an acid-decomposable group. Post-exposure baking (PEB) is optionally performed in the presence of an acid generated during exposure to promote decomposition (deprotection) of the acid-decomposable groups and regenerate the alkali-soluble functional groups. This promotes alkali dissolution of the first resin (A) in the exposed areas during development. A 1st resin (A) can be used individually or in combination of 2 or more types. For example, the first resin (A) may be a combination of two or more resins differing in polymer constitutional units, acid-decomposable groups, protection rates of alkali-soluble functional groups, or combinations thereof.
第1樹脂(A)は、複数のアルカリ可溶性官能基を有するベース樹脂(a)のアルカリ可溶性官能基の一部を酸分解性基で保護することによって得ることができる。例えば、アルカリ可溶性官能基がフェノール性水酸基の場合、酸分解性基で保護されたフェノール性水酸基を有する第1樹脂(A)は、Ar-O-R5の部分構造を有し、Arはフェノール由来の芳香環を表し、R5は酸分解性基を表す。 <Protection of alkali-soluble functional group by acid-decomposable group>
The first resin (A) can be obtained by protecting some of the alkali-soluble functional groups of the base resin (a) having multiple alkali-soluble functional groups with acid-decomposable groups. For example, when the alkali-soluble functional group is a phenolic hydroxyl group, the first resin (A) having a phenolic hydroxyl group protected with an acid-decomposable group has a partial structure of Ar—O—R 5 , and Ar is phenol and R 5 represents an acid-decomposable group.
-CR6R7-O-R8 (4)
(式(4)中、R6及びR7は、それぞれ独立して水素原子、炭素原子数1~4の直鎖アルキル基、又は炭素原子数3~4の分岐状アルキル基であり、R8は、炭素原子数1~12の直鎖アルキル基、炭素原子数3~12の分岐状アルキル基、炭素原子数3~12の環状アルキル基、炭素原子数7~12のアラルキル基、又は炭素原子数2~12のアルケニル基であり、R6又はR7の一方とR8とが結合して環員数3~10の環構造を形成してもよく、R6、R7及びR8は、フッ素、塩素、臭素及びヨウ素からなる群より選ばれるハロゲン原子で置換されていてもよい。)で表される基が挙げられる。式(4)で表される基は、アルカリ可溶性官能基がアルコール性水酸基、又はフェノール性水酸基の場合、アルカリ可溶性官能基由来の酸素原子と一緒にアセタール構造又はケタール構造を形成する。これらの酸分解性基は、単独で、又は2種類以上を組み合わせて用いることができる。 The acid-decomposable group is a group that is decomposed (deprotected) by heating in the presence of an acid, if necessary, to generate an alkali-soluble functional group. Specifically, for example, tert-butyl group, 1,1-dimethyl-propyl group, 1-methylcyclopentyl group, 1-ethylcyclopentyl group, 1-methylcyclohexyl group, 1-ethylcyclohexyl group, 1-methyladamantyl group , 1-ethyladamantyl group, tert-butoxycarbonyl group, group having a tertiary alkyl group such as 1,1-dimethyl-propoxycarbonyl group; trimethylsilyl group, triethylsilyl group, tert-butyldimethylsilyl group, triisopropylsilyl group , a silyl group such as a tert-butyldiphenylsilyl group; and formula (4)
—CR 6 R 7 —OR 8 (4)
(In formula (4), R 6 and R 7 are each independently a hydrogen atom, a linear alkyl group having 1 to 4 carbon atoms, or a branched alkyl group having 3 to 4 carbon atoms, and R 8 is a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, a cyclic alkyl group having 3 to 12 carbon atoms, an aralkyl group having 7 to 12 carbon atoms, or a carbon atom an alkenyl group having a number of 2 to 12, and one of R 6 or R 7 and R 8 may combine to form a ring structure having 3 to 10 ring members, and R 6 , R 7 and R 8 are optionally substituted with a halogen atom selected from the group consisting of fluorine, chlorine, bromine and iodine). When the alkali-soluble functional group is an alcoholic hydroxyl group or a phenolic hydroxyl group, the group represented by formula (4) forms an acetal structure or ketal structure together with an oxygen atom derived from the alkali-soluble functional group. These acid-decomposable groups can be used alone or in combination of two or more.
第1樹脂(A)のベース樹脂(a)としては、例えば、複数のアルカリ可溶性官能基を有する、ポリスチレン樹脂、エポキシ樹脂、ポリアミド樹脂、フェノール樹脂、ポリイミド樹脂、ポリアミック酸樹脂、ポリベンゾオキサゾール樹脂、ポリベンゾオキサゾール樹脂前駆体、シリコーン樹脂、環状オレフィンポリマー、カルド樹脂、及びこれらの樹脂の誘導体が挙げられる。例えば、フェノール樹脂の誘導体として、アルケニル基がベンゼン環に結合したポリアルケニルフェノール樹脂、ポリスチレン樹脂の誘導体として、フェノール性水酸基とヒドロキシアルキル基又はアルコキシ基とがベンゼン環に結合したヒドロキシポリスチレン樹脂誘導体が挙げられる。ベース樹脂(a)として、アルカリ可溶性官能基を有する重合性単量体の単独重合体又は共重合体を使用することもできる。これらのベース樹脂(a)は、単独で、又は2種類以上を組み合わせて使用することができる。 (Base resin (a))
Examples of the base resin (a) of the first resin (A) include polystyrene resins, epoxy resins, polyamide resins, phenol resins, polyimide resins, polyamic acid resins, polybenzoxazole resins having a plurality of alkali-soluble functional groups, Polybenzoxazole resin precursors, silicone resins, cyclic olefin polymers, cardo resins, and derivatives of these resins. For example, phenol resin derivatives include polyalkenylphenol resins in which alkenyl groups are bonded to benzene rings, and polystyrene resin derivatives include hydroxypolystyrene resin derivatives in which phenolic hydroxyl groups and hydroxyalkyl groups or alkoxy groups are bonded to benzene rings. be done. A homopolymer or copolymer of a polymerizable monomer having an alkali-soluble functional group can also be used as the base resin (a). These base resins (a) can be used alone or in combination of two or more.
一実施態様では、第1樹脂(A)のベース樹脂(a)は、アルカリ可溶性官能基を有する重合性単量体とその他の重合性単量体との共重合体(a1)であり、共重合体(a1)は複数のアルカリ可溶性官能基を有する。この実施態様において、第1樹脂(A)は、共重合体(a1)の複数のアルカリ可溶性官能基の少なくとも一部が酸分解性基で保護されたものである。共重合体(a1)は、2種類以上のアルカリ可溶性官能基を有してもよい。重合性単量体が有する重合性官能基としては、ラジカル重合性官能基を挙げることができ、例えば、CH2=CH-、CH2=C(CH3)-、CH2=CHCO-、CH2=C(CH3)CO-、-OC-CH=CH-CO-などが挙げられる。 (Copolymer (a1) of a polymerizable monomer having an alkali-soluble functional group and another polymerizable monomer)
In one embodiment, the base resin (a) of the first resin (A) is a copolymer (a1) of a polymerizable monomer having an alkali-soluble functional group and another polymerizable monomer, Polymer (a1) has a plurality of alkali-soluble functional groups. In this embodiment, the first resin (A) is obtained by protecting at least part of the multiple alkali-soluble functional groups of the copolymer (a1) with an acid-decomposable group. The copolymer (a1) may have two or more types of alkali-soluble functional groups. Examples of the polymerizable functional group possessed by the polymerizable monomer include radically polymerizable functional groups such as CH 2 ═CH—, CH 2 ═C(CH 3 )—, CH 2 ═CHCO—, CH 2 =C(CH 3 )CO-, -OC-CH=CH-CO- and the like.
で表される構造単位、及び式(2)
で表される構造単位を有する。 In one embodiment, copolymer (a1) has the formula (1)
A structural unit represented by the formula (2)
It has a structural unit represented by
-CR6R7-O-R8 (4)
で表される基であることが好ましい。式(4)中、R6及びR7は、それぞれ独立して水素原子、炭素原子数1~4の直鎖アルキル基、又は炭素原子数3~4の分岐状アルキル基であることがより好ましい。R8は、炭素原子数1~12の直鎖アルキル基、炭素原子数3~12の分岐状アルキル基、炭素原子数3~12の環状アルキル基、炭素原子数7~12のアラルキル基、又は炭素原子数2~12のアルケニル基であるか、R6又はR7の一方とR8とが結合して環員数3~10の環構造を形成することがより好ましい。R6、R7及びR8は、フッ素、塩素、臭素及びヨウ素からなる群より選ばれるハロゲン原子で置換されていてもよい。そのような酸分解性基としては、例えば、1-アルコキシアルキル基が挙げられる。1-アルコキシアルキル基としては、例えば、メトキシメチル基、1-メトキシエチル基、1-エトキシエチル基、1-n-プロポキシエチル基、1-n-ブトキシエチル基、1-イソブトキシエチル基、1-(2-クロロエトキシ)エチル基、1-(2-エチルヘキシルオキシ)エチル基、1-シクロヘキシルオキシエチル基、及び1-(2-シクロヘキシルエトキシ)エチル基が挙げられ、1-エトキシエチル基及び1-n-プロポキシエチル基が好ましい。R6又はR7の一方とR8とが結合して環員数3~10の環構造を形成した酸分解性基としては、例えば、2-テトラヒドロフラニル基、及び2-テトラヒドロピラニル基が挙げられ、2-テトラヒドロフラニル基が好ましい。式(3)中、R5の酸分解性基は、例えば、tert-ブチル基、1,1-ジメチル-プロピル基、1-メチルシクロペンチル基、1-エチルシクロペンチル基、1-メチルシクロヘキシル基、1-エチルシクロヘキシル基、1-メチルアダマンチル基、1-エチルアダマンチル基、tert-ブトキシカルボニル基、1,1-ジメチル-プロポキシカルボニル基などの三級アルキル基を有する基;トリメチルシリル基、トリエチルシリル基、tert-ブチルジメチルシリル基、トリイソプロピルシリル基、tert-ブチルジフェニルシリル基などのシリル基であってもよい。 The first resin (A) is represented by formula (3)
—CR 6 R 7 —OR 8 (4)
is preferably a group represented by In formula (4), R 6 and R 7 are each independently more preferably a hydrogen atom, a linear alkyl group having 1 to 4 carbon atoms, or a branched alkyl group having 3 to 4 carbon atoms. . R 8 is a linear alkyl group having 1 to 12 carbon atoms, a branched alkyl group having 3 to 12 carbon atoms, a cyclic alkyl group having 3 to 12 carbon atoms, an aralkyl group having 7 to 12 carbon atoms, or More preferably, it is an alkenyl group having 2 to 12 carbon atoms, or one of R 6 or R 7 and R 8 combine to form a ring structure having 3 to 10 ring members. R 6 , R 7 and R 8 may be substituted with a halogen atom selected from the group consisting of fluorine, chlorine, bromine and iodine. Examples of such acid-decomposable groups include 1-alkoxyalkyl groups. 1-alkoxyalkyl groups include, for example, methoxymethyl group, 1-methoxyethyl group, 1-ethoxyethyl group, 1-n-propoxyethyl group, 1-n-butoxyethyl group, 1-isobutoxyethyl group, 1 -(2-chloroethoxy)ethyl group, 1-(2-ethylhexyloxy)ethyl group, 1-cyclohexyloxyethyl group, and 1-(2-cyclohexylethoxy)ethyl group; - n-propoxyethyl groups are preferred. Examples of the acid-decomposable group in which one of R 6 or R 7 and R 8 are bonded to form a ring structure having 3 to 10 ring members include 2-tetrahydrofuranyl and 2-tetrahydropyranyl. and the 2-tetrahydrofuranyl group is preferred. In formula (3), the acid-decomposable group for R 5 is, for example, tert-butyl, 1,1-dimethyl-propyl, 1-methylcyclopentyl, 1-ethylcyclopentyl, 1-methylcyclohexyl, 1 Groups having a tertiary alkyl group such as -ethylcyclohexyl group, 1-methyladamantyl group, 1-ethyladamantyl group, tert-butoxycarbonyl group, 1,1-dimethyl-propoxycarbonyl group; trimethylsilyl group, triethylsilyl group, tert -Butyldimethylsilyl group, triisopropylsilyl group, tert-butyldiphenylsilyl group, and other silyl groups.
ポジ型感光性樹脂組成物は光酸発生剤(B)を含む。光酸発生剤(B)は可視光、紫外光、γ線、電子線などの放射線が照射されると酸を生成する化合物である。光酸発生剤(B)は、第1樹脂(A)の酸分解性基の分解を促進してアルカリ可溶性官能基を再生させ、第1樹脂(A)のアルカリ溶解性を増大させる。また、放射線が照射された部分に光酸発生剤(B)から生じた酸が存在することで、その部分の樹脂が酸と一緒にアルカリ水溶液に溶解し易くなる。その結果、低露光量でも高感度で高解像度のパターンを形成することができる。光酸発生剤(B)は、単独で、又は2種類以上を組み合わせて使用することができる。 <Photoacid generator (B)>
The positive photosensitive resin composition contains a photoacid generator (B). The photoacid generator (B) is a compound that generates an acid when exposed to radiation such as visible light, ultraviolet light, γ-rays and electron beams. The photoacid generator (B) accelerates the decomposition of the acid-decomposable groups of the first resin (A) to regenerate the alkali-soluble functional groups and increases the alkali-solubility of the first resin (A). In addition, since the acid generated from the photoacid generator (B) is present in the portion irradiated with radiation, the resin in that portion is easily dissolved in the alkaline aqueous solution together with the acid. As a result, a pattern with high sensitivity and high resolution can be formed even with a low exposure dose. Photoacid generator (B) can be used individually or in combination of 2 or more types.
ポジ型感光性樹脂組成物は金属錯体染料(C)を含む。典型的な金属錯体染料(C)は、ヒドロキシ基、カルボキシ基又はアミノ基のような配位能を有する官能基を有するモノアゾ染料が、クロム、銅、コバルト、鉄、ニッケルなどの金属イオンに対して配位結合した金属錯イオン(アニオン)と、カウンターカチオンとから構成されている。金属錯体染料(C)は、一般に、2つのクラス、すなわち1:1型金属錯体染料(金属1原子にモノアゾ染料1分子が配位結合)及び1:2型金属錯体染料(金属1原子にモノアゾ染料2分子が配位結合)に分類される。モノアゾ染料は、一般には、o,o’-ジヒドロキシアゾ、o-ヒドロキシ-o’-アミノアゾ、又はo-ヒドロキシ-o’-カルボキシアゾのいずれかの構造をもつ。金属錯体染料(C)は、顔料と比較して現像時の残渣が少なく、高精細のパターンを被膜に形成することができる。また、金属錯体染料(C)は、有機溶媒に溶解しやすく、高濃度で配合しても溶液中で析出しにくい。更に、露光後の加熱処理時に退色しにくいため、硬化被膜の光学濃度(OD値)を効率的に高めることができる。金属錯体染料(C)は、単独で、又は2種類以上を組み合わせて使用することができる。 <Metal complex dye (C)>
A positive photosensitive resin composition contains a metal complex dye (C). A typical metal complex dye (C) is a monoazo dye having a coordinating functional group such as a hydroxy group, a carboxyl group or an amino group, to metal ions such as chromium, copper, cobalt, iron and nickel. It is composed of a metal complex ion (anion) and a counter cation coordinated together. Metal complex dyes (C) are generally of two classes: 1:1 type metal complex dyes (1 molecule of monoazo dye coordinated to 1 atom of metal) and 1:2 type metal complex dyes (monoazo dye to 1 atom of metal). two molecules of the dye are coordinated). Monoazo dyes generally have either o,o'-dihydroxyazo, o-hydroxy-o'-aminoazo, or o-hydroxy-o'-carboxazo structures. The metal complex dye (C) leaves less residue during development than pigments, and can form a highly precise pattern on the film. In addition, the metal complex dye (C) is easily dissolved in an organic solvent and hardly precipitates in the solution even when mixed at a high concentration. Furthermore, since it is difficult to fade during heat treatment after exposure, the optical density (OD value) of the cured film can be efficiently increased. Metal complex dye (C) can be used individually or in combination of 2 or more types.
金属錯イオンの含有量(質量%)=100-GCで検出された各物質の含有量の合計(質量%)
金属錯体染料(C)が2種類以上組み合わされる場合、金属錯体染料(C)の金属錯イオン含有量は、当該2種類以上の金属錯体染料(C)の金属錯イオンの合計質量を、当該2種類以上の金属錯体染料(C)の合計質量で割ることにより決定される。 The metal complex ion content (% by mass) in the metal complex dye (C) is determined by the following procedure. A sample is prepared by adding methyl benzoate as an internal standard substance and diethyl carbonate as a dilution solvent to the metal complex dye (C) and, if necessary, adding a pretreatment agent for gas chromatography. After stirring the obtained sample, it is analyzed by GC or GC-MS using an internal standard method, and the metal complex ion content (% by mass) is calculated from the following formula.
Content of metal complex ions (% by mass) = 100-Total content of each substance detected by GC (% by mass)
When two or more metal complex dyes (C) are combined, the metal complex ion content of the metal complex dye (C) is the total mass of the metal complex ions of the two or more metal complex dyes (C). Determined by dividing by the total mass of one or more metal complex dyes (C).
ポジ型感光性樹脂組成物は第2樹脂(D)を更に含んでもよい。第2樹脂(D)は、第1樹脂(A)とは異なる樹脂である。第2樹脂(D)は特に限定されないが、アルカリ可溶性官能基を有し、アルカリ可溶性であることが好ましい。アルカリ可溶性官能基としては、特に限定されないが、例えば、カルボキシ基、フェノール性水酸基、スルホ基、リン酸基、及びメルカプト基が挙げられる。2種以上のアルカリ可溶性官能基を有する第2樹脂(D)を使用してもよい。ただし、第2樹脂(D)は、酸分解性基で保護されたアルカリ可溶性官能基を有していない。 <Second resin (D)>
The positive photosensitive resin composition may further contain a second resin (D). The second resin (D) is a resin different from the first resin (A). Although the second resin (D) is not particularly limited, it preferably has an alkali-soluble functional group and is alkali-soluble. Alkali-soluble functional groups include, but are not particularly limited to, carboxy groups, phenolic hydroxyl groups, sulfo groups, phosphoric acid groups, and mercapto groups. A second resin (D) having two or more alkali-soluble functional groups may be used. However, the second resin (D) does not have an alkali-soluble functional group protected by an acid-decomposable group.
で表される構造単位、及び式(2)
で表される構造単位を有する共重合体(a1)である。 In one embodiment, the second resin (D) has formula (1)
A structural unit represented by the formula (2)
It is a copolymer (a1) having a structural unit represented by
ポジ型感光性樹脂組成物は、現像時にアルカリ可溶性部分の現像液への溶解性を向上させるための溶解促進剤(E)をさらに含んでもよい。溶解促進剤(E)として、カルボキシ基を有する化合物及びフェノール性水酸基を有する化合物からなる群より選択される有機低分子化合物が挙げられる。溶解促進剤(E)は、単独で、又は2種類以上を組み合わせて使用することができる。 <Solubilizer (E)>
The positive photosensitive resin composition may further contain a dissolution accelerator (E) for improving the solubility of the alkali-soluble portion in the developer during development. Examples of the dissolution accelerator (E) include organic low-molecular-weight compounds selected from the group consisting of compounds having a carboxyl group and compounds having a phenolic hydroxyl group. The dissolution accelerator (E) can be used alone or in combination of two or more.
ポジ型感光性樹脂組成物は、任意成分(F)として、熱硬化剤、界面活性剤、成分(C)以外の着色剤等を含むことができる。本開示において、任意成分(F)は(A)~(E)のいずれにも当てはまらないものと定義する。 <Optional component (F)>
The positive photosensitive resin composition can contain, as an optional component (F), a thermosetting agent, a surfactant, a coloring agent other than the component (C), and the like. For purposes of this disclosure, optional component (F) is defined as none of (A)-(E).
〈溶媒(G)〉
ポジ型感光性樹脂組成物は、溶媒(G)に溶解させて溶液状態のコーティング組成物として用いることができる。例えば、第1樹脂(A)及び任意成分の第2樹脂(D)を溶媒(G)に溶解して得られた溶液に、光酸発生剤(B)、及び金属錯体染料(C)、並びに必要に応じて溶解促進剤(E)、熱硬化剤、界面活性剤等の任意成分(F)を所定の割合で混合することにより、ポジ型感光性樹脂組成物を含むコーティング組成物を調製することができる。コーティング組成物は、溶媒(G)の量を変化させることにより使用する塗布方法に適した粘度に調整することができる。 [Coating composition]
<Solvent (G)>
The positive photosensitive resin composition can be dissolved in the solvent (G) and used as a solution state coating composition. For example, a photoacid generator (B), a metal complex dye (C), and a A coating composition containing a positive photosensitive resin composition is prepared by mixing an optional component (F) such as a dissolution accelerator (E), a thermosetting agent, and a surfactant as required in a predetermined ratio. be able to. The coating composition can be adjusted to a viscosity suitable for the coating method used by varying the amount of solvent (G).
ポジ型感光性樹脂組成物を放射線リソグラフィーに使用する場合、まず、ポジ型感光性樹脂組成物を溶媒に溶解又は分散してコーティング組成物を調製する。次に、コーティング組成物を基板表面に塗布し、加熱等の手段により溶媒を除去して、被膜を形成することができる。基板表面へのコーティング組成物の塗布方法は特に限定されず、例えばスプレー法、ロールコート法、スリット法、スピンコート法等を使用することができる。 [How to use the positive photosensitive resin composition]
When a positive photosensitive resin composition is used in radiation lithography, first, a coating composition is prepared by dissolving or dispersing the positive photosensitive resin composition in a solvent. The coating composition can then be applied to the substrate surface and the solvent removed by means such as heating to form a coating. The method of applying the coating composition to the substrate surface is not particularly limited, and for example, a spray method, a roll coating method, a slit method, a spin coating method, or the like can be used.
実施例及び比較例で使用した原料を以下のとおり製造又は入手した。 (1) Raw Materials Raw materials used in Examples and Comparative Examples were manufactured or obtained as follows.
装置名:Shodex(登録商標)GPC-101
カラム:Shodex(登録商標)LF-804
移動相:テトラヒドロフラン
流速:1.0mL/分
検出器:Shodex(登録商標)RI-71
温度:40℃ The weight-average molecular weight and number-average molecular weight of the first resin (A) and the second resin (D) were calculated using a calibration curve prepared using polystyrene standard substances under the following measurement conditions.
Apparatus name: Shodex (registered trademark) GPC-101
Column: Shodex® LF-804
Mobile phase: Tetrahydrofuran Flow rate: 1.0 mL/min Detector: Shodex (registered trademark) RI-71
Temperature: 40°C
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社製「PQMA」)25.5g、及びN-シクロヘキシルマレイミド(株式会社日本触媒製)4.50gを、溶媒である1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)77.1gに、重合開始剤としてV-601(富士フイルム和光純薬株式会社製)3.66gを、1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)14.6gにそれぞれ完全に溶解させた。得られた2つの溶液を、300mLの3つ口型フラスコ中、窒素ガス雰囲気下で85℃に加熱した1-メトキシ-2-プロピルアセテート(株式会社ダイセル製)61.2gに同時に2時間かけて滴下し、その後85℃で3時間反応させた。室温まで冷却した反応溶液を815gのトルエン中に滴下し、共重合体を沈殿させた。沈殿した共重合体をろ過により回収し、90℃で4時間真空乾燥し白色の粉体を32.4g回収した。得られたPCX-02eの数平均分子量は3100、重量平均分子量は6600であった。 [Production Example 1] Production of a copolymer (PCX-02e) of a polymerizable monomer having an alkali-soluble functional group (phenolic hydroxyl group) and another polymerizable monomer 4-hydroxyphenyl methacrylate (Showa Denko K.K. 25.5 g of N-cyclohexylmaleimide (manufactured by Nippon Shokubai Co., Ltd.) and 4.50 g of N-cyclohexylmaleimide (manufactured by Nippon Shokubai Co., Ltd.) were added to 77.1 g of 1-methoxy-2-propyl acetate (manufactured by Daicel Co., Ltd.) to initiate polymerization. As an agent, 3.66 g of V-601 (manufactured by Fuji Film Wako Pure Chemical Industries, Ltd.) was completely dissolved in 14.6 g of 1-methoxy-2-propyl acetate (manufactured by Daicel Corporation). The two solutions obtained were simultaneously added to 61.2 g of 1-methoxy-2-propyl acetate (manufactured by Daicel Co., Ltd.) heated to 85° C. in a 300 mL three-necked flask under a nitrogen gas atmosphere for 2 hours. It was added dropwise and then reacted at 85° C. for 3 hours. The reaction solution cooled to room temperature was dropped into 815 g of toluene to precipitate a copolymer. The precipitated copolymer was collected by filtration and vacuum-dried at 90° C. for 4 hours to collect 32.4 g of white powder. The obtained PCX-02e had a number average molecular weight of 3,100 and a weight average molecular weight of 6,600.
100mLの3つ口型フラスコ中で、フェノール性水酸基を有する重合性単量体とその他の重合性単量体の共重合体(PCX-02e)10.00g、及び酸触媒としてp-トルエンスルホン酸のピリジニウム塩(東京化成工業株式会社製)0.60gを、テトラヒドロフラン(富士フイルム和光純薬株式会社製)50.00gに溶解させた。その後窒素ガス雰囲気下で氷冷し、2,3-ジヒドロフラン(東京化成工業株式会社製)6.68gを1時間かけて滴下した。その後室温で4時間撹拌した。飽和炭酸水素ナトリウム水溶液で酸触媒を中和した後、水層を除去した。さらに有機層を水で2回洗浄した。その後、テトラヒドロフランを留去した。得られた固体を酢酸エチル50.0gに溶解させ、200gのヘキサン中に滴下し、生成物を沈殿させた。沈殿物をろ過により回収し、80℃で4時間真空乾燥して白色の粉体9.86gを回収した。得られた粉体をプロピレングリコールモノメチルエーテルアセテートに溶解し、フェノール性水酸基が2-テトラヒドロフラニル基で保護された第1樹脂(A)(PCX-02e-THF97)の固形分20質量%溶液を得た。得られたPCX-02e-THF97の数平均分子量は3098、重量平均分子量は5958、酸分解性基で保護されているフェノール性水酸基の割合は97モル%、少なくとも1つのフェノール性水酸基が酸分解性基で保護されている式(3)で表される構造単位の数は第1樹脂(A)の全構造単位数の77%であった。酸分解性基で保護されているフェノール性水酸基の割合は、熱重量示差熱分析装置(TG/DTA6200、株式会社日立ハイテクサイエンス製)を用い、窒素ガス気流中、昇温速度10℃/分の条件下で室温から250℃まで昇温し、10分保持し、さらに昇温速度10℃/分の条件で400℃まで昇温したときの、260℃における第1樹脂(A)の重量減少率(%)より算出した。 [Production Example 2] Production of the first resin (A) (PCX-02e-THF97) in which the alkali-soluble functional group (phenolic hydroxyl group) is protected with a 2-tetrahydrofuranyl group In a 100 mL three-necked flask, phenol 10.00 g of a copolymer of a polymerizable monomer having a hydroxyl group and another polymerizable monomer (PCX-02e), and a pyridinium salt of p-toluenesulfonic acid as an acid catalyst (manufactured by Tokyo Chemical Industry Co., Ltd.) 0.60 g was dissolved in 50.00 g of tetrahydrofuran (manufactured by Fuji Film Wako Pure Chemical Industries, Ltd.). Thereafter, the mixture was ice-cooled in a nitrogen gas atmosphere, and 6.68 g of 2,3-dihydrofuran (manufactured by Tokyo Chemical Industry Co., Ltd.) was added dropwise over 1 hour. After that, the mixture was stirred at room temperature for 4 hours. After neutralizing the acid catalyst with saturated sodium bicarbonate aqueous solution, the water layer was removed. Furthermore, the organic layer was washed twice with water. The tetrahydrofuran was then distilled off. The resulting solid was dissolved in 50.0 g of ethyl acetate and added dropwise to 200 g of hexane to precipitate the product. The precipitate was recovered by filtration and vacuum dried at 80° C. for 4 hours to recover 9.86 g of white powder. The obtained powder was dissolved in propylene glycol monomethyl ether acetate to obtain a 20 mass% solids solution of the first resin (A) (PCX-02e-THF97) in which the phenolic hydroxyl group was protected with a 2-tetrahydrofuranyl group. rice field. The resulting PCX-02e-THF97 had a number average molecular weight of 3098, a weight average molecular weight of 5958, a proportion of phenolic hydroxyl groups protected with acid-decomposable groups of 97 mol%, and at least one phenolic hydroxyl group being acid-decomposable. The number of structural units represented by formula (3) protected by groups was 77% of the total number of structural units in the first resin (A). The proportion of phenolic hydroxyl groups protected with acid-decomposable groups was determined using a thermogravimetric differential thermal analyzer (TG/DTA6200, manufactured by Hitachi High-Tech Science Co., Ltd.) in a nitrogen gas stream at a temperature elevation rate of 10°C/min. The weight loss rate of the first resin (A) at 260°C when the temperature is raised from room temperature to 250°C under the conditions, held for 10 minutes, and further heated to 400°C at a temperature increase rate of 10°C/min. (%).
4-ヒドロキシフェニルメタクリレート(昭和電工株式会社製「PQMA」)17.3g、tert-ブチルメタクリレート(三菱ケミカル株式会社製「アクリルエステルTB」)13.8g、及びN-シクロヘキシルマレイミド(東京化成工業株式会社製)6.15gを、溶媒であるイソプロピルアセテート(神港有機化学工業株式会社製)56.0gに、重合開始剤としてV-601(富士フイルム和光純薬株式会社製)2.69gを、イソプロピルアセテート(神港有機化学工業株式会社製)4.05gにそれぞれ完全に溶解させた。得られた2つの溶液を、300mLの3つ口型フラスコ中、窒素ガス雰囲気下で89℃に加熱したイソプロピルアセテート(神港有機化学工業株式会社製)90.4gに同時に2時間かけて滴下し、その後89℃で4時間反応させた。室温まで冷却した反応溶液50gを50gのトルエンと200gのヘキサンを混合した溶媒中に滴下し、共重合体を沈殿させた。沈殿した共重合体をろ過により回収し、80℃で5時間真空乾燥し白色の粉体を8.98g回収した。得られたPCX-02e-TBMA50の数平均分子量は4122、重量平均分子量は7583、酸分解性基で保護されているカルボキシ基の割合は50モル%であった。 [Production Example 3] Production of the first resin (A) (PCX-02e-TBMA50) in which the alkali-soluble functional group (carboxy group) is protected with a tert-butyl group 4-hydroxyphenyl methacrylate (manufactured by Showa Denko K.K. ”) 17.3 g, tert-butyl methacrylate (manufactured by Mitsubishi Chemical Corporation “Acrylic ester TB”) 13.8 g, and N-cyclohexylmaleimide (manufactured by Tokyo Chemical Industry Co., Ltd.) 6.15 g, isopropyl acetate as a solvent ( Shinko Organic Chemical Industry Co., Ltd.) 56.0 g, V-601 (manufactured by Fuji Film Wako Pure Chemical Industries, Ltd.) 2.69 g as a polymerization initiator, isopropyl acetate (manufactured by Shinko Organic Chemical Industry Co., Ltd.)4. 05 g each completely dissolved. The resulting two solutions were added dropwise to 90.4 g of isopropyl acetate (manufactured by Shinko Organic Chemical Industry Co., Ltd.) heated to 89° C. in a 300 mL three-necked flask under a nitrogen gas atmosphere over 2 hours. , and then reacted at 89° C. for 4 hours. 50 g of the reaction solution cooled to room temperature was dropped into a mixed solvent of 50 g of toluene and 200 g of hexane to precipitate a copolymer. The precipitated copolymer was recovered by filtration and vacuum-dried at 80° C. for 5 hours to recover 8.98 g of white powder. The obtained PCX-02e-TBMA50 had a number average molecular weight of 4,122, a weight average molecular weight of 7,583, and a ratio of carboxy groups protected with acid-decomposable groups of 50 mol %.
金属錯イオンの含有量(質量%)=100-GCで検出された各物質の含有量の合計(質量%) C-1 to C-5 shown in Table 1 were used as metal complex dyes (C). In C-1 to C-5, the metal element forming metal complex ions is chromium. C-1, C-3, and C-5 are Solvent Black 27 from different lots. The metal complex ion content (% by mass) of metal complex dyes C-1 to C-5 was determined by the following procedure. 0.1 g of metal complex dye is weighed, 0.1 g of methyl benzoate (manufactured by Tokyo Chemical Industry Co., Ltd.) and 6.0 g of diethyl carbonate (manufactured by Tokyo Chemical Industry Co., Ltd.) are added, and if necessary, gas chromatography Samples were prepared with the addition of pretreatment agents. After stirring the obtained sample with a mix rotor (VMR-5 manufactured by AS ONE) for 30 minutes to 1 day, it was analyzed by GC (GC6850 series manufactured by Agilent) or GC-MS (7890A manufactured by Agilent, Q-1000 manufactured by JEOL) and analyzed as follows. The metal complex ion content (% by mass) was calculated from the formula.
Content of metal complex ions (% by mass) = 100-Total content of each substance detected by GC (% by mass)
実施例及び比較例で使用した評価方法は以下のとおりである。 (2) Evaluation methods Evaluation methods used in Examples and Comparative Examples are as follows.
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が2.6μmになるようにバーコートし、常温真空乾燥60秒間の後、蓋つきホットプレート上100℃で100秒間加熱してプリベークを行った。さらに蓋つきホットプレート上115℃で200秒間加熱してPEBを行った。乾燥膜厚を光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社製)を用いて測定後、スピン現像装置(AD-1200、滝沢産業株式会社製)を用い2.38質量%水酸化テトラメチルアンモニウム水溶液で80秒間アルカリ現像を行なった。アルカリ現像後の膜厚を再び光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社製)を用いて測定し、現像前後で溶解した膜厚(μm)を未露光部溶解性の指標とした。現像前後で溶解した膜厚が0.3~1.9μmの範囲であったポジ型感光性樹脂組成物は、未露光部の耐アルカリ溶解性が高く未露光部と露光部の膜厚差が付きやすいため、高感度であると判断した。 [Unexposed area solubility]
A glass substrate (size 100 mm × 100 mm × 1 mm) was bar-coated with a positive photosensitive resin composition so that the dry film thickness was 2.6 µm, dried in vacuum at room temperature for 60 seconds, and placed on a hot plate with a lid at 100 °C. was heated for 100 seconds for pre-baking. Further, PEB was performed by heating at 115° C. for 200 seconds on a hot plate with a lid. After measuring the dry film thickness using an optical film thickness measuring device (F20-NIR, manufactured by Filmetrics Co., Ltd.), a spin developing device (AD-1200, manufactured by Takizawa Sangyo Co., Ltd.) was used to obtain 2.38% by mass hydroxylation. Alkaline development was carried out for 80 seconds with a tetramethylammonium aqueous solution. The film thickness after alkali development was measured again using an optical film thickness measuring device (F20-NIR, manufactured by Filmetrics Co., Ltd.), and the dissolved film thickness (μm) before and after development was taken as an index of the unexposed area solubility. did. The positive photosensitive resin composition in which the film thickness dissolved before and after development was in the range of 0.3 to 1.9 μm has high alkali solubility resistance in the unexposed area, and the difference in film thickness between the unexposed area and the exposed area is It was judged to have high sensitivity because it was easy to attach.
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が2.6μmになるようにバーコートし、真空乾燥90秒間の後、蓋つきホットプレート上100℃で100秒間加熱してプリベークを行った。超高圧水銀ランプを組み込んだ露光装置(商品名マルチライトML-251A/B、ウシオ電機株式会社製)で石英製のフォトマスク(φ10μmパターンを有するもの)を介して150mJ/cm2で露光した。露光量は紫外線積算光量計(商品名UIT-150 受光部 UVD-S365、ウシオ電機株式会社製)を用いて測定した。露光後、蓋つきホットプレート上115℃で200秒間加熱してPEBを行った。その後、スピン現像装置(AD-1200、滝沢産業株式会社製)を用い2.38質量%水酸化テトラメチルアンモニウム水溶液で60秒間アルカリ現像を行なった。さらに、被膜をイナートオーブン(DN411I、ヤマト科学株式会社製)内にて250℃で60分加熱して硬化した。硬化後塗膜に形成されているホールをマイクロスコープ(VHX-6000、キーエンス株式会社製)で観察して得られたホール径(μm)を感度の指標とした。ホール径が9.0~11.0μmの範囲であったポジ型感光性樹脂組成物をパターン形成性が良好であると判断した。 [Hole diameter]
A glass substrate (size 100 mm × 100 mm × 1 mm) was bar-coated with a positive photosensitive resin composition to a dry film thickness of 2.6 μm, vacuum dried for 90 seconds, and then placed on a hot plate with a lid at 100 ° C. It was pre-baked by heating for 100 seconds. Exposure was performed at 150 mJ/cm 2 through a quartz photomask (having a φ10 μm pattern) with an exposure apparatus (trade name: Multilight ML-251A/B, manufactured by Ushio Inc.) incorporating an ultra-high pressure mercury lamp. The amount of exposure was measured using an ultraviolet integrating photometer (trade name: UIT-150 light receiving unit UVD-S365, manufactured by Ushio Inc.). After the exposure, PEB was performed by heating at 115° C. for 200 seconds on a hot plate with a lid. After that, using a spin developing device (AD-1200, manufactured by Takizawa Sangyo Co., Ltd.), alkali development was carried out for 60 seconds with a 2.38% by mass tetramethylammonium hydroxide aqueous solution. Further, the coating was cured by heating at 250° C. for 60 minutes in an inert oven (DN411I, manufactured by Yamato Scientific Co., Ltd.). The hole diameter (μm) obtained by observing the holes formed in the coating film after curing with a microscope (VHX-6000, manufactured by Keyence Corporation) was used as an index of sensitivity. A positive photosensitive resin composition having a hole diameter in the range of 9.0 to 11.0 μm was judged to have good pattern formability.
ガラス基板(大きさ100mm×100mm×1mm)にポジ型感光性樹脂組成物を乾燥膜厚が約1.5μmになるようにスピンコートし、ホットプレート上120℃で80秒加熱し溶媒を乾燥した。その後、窒素ガス雰囲気下250℃で60分硬化させることにより被膜を得た。硬化後の被膜のOD値を透過濃度計(BMT-1、サカタインクスエンジニアリング株式会社製)で測定し、ガラスのみのOD値で補正を行って、被膜の厚さ1μm当たりのOD値に換算した。被膜の厚みは光学式膜厚測定装置(F20-NIR、フィルメトリクス株式会社製)を用いて測定した。 [OD value of cured film]
A glass substrate (size 100 mm × 100 mm × 1 mm) was spin-coated with a positive photosensitive resin composition to a dry film thickness of about 1.5 µm, and heated on a hot plate at 120°C for 80 seconds to dry the solvent. . After that, the coating was obtained by curing at 250° C. for 60 minutes in a nitrogen gas atmosphere. The OD value of the cured film was measured with a transmission densitometer (BMT-1, manufactured by Sakata Inx Engineering Co., Ltd.), corrected with the OD value of the glass alone, and converted to an OD value per 1 μm of film thickness. The thickness of the coating was measured using an optical film thickness measuring device (F20-NIR, manufactured by Filmetrics Co., Ltd.).
[実施例1~5、比較例1~3]
表2に記載の組成で第1樹脂(A)、及び第2樹脂(D)を混合して溶解し、得られた溶液に、表2に記載の光酸発生剤(B)、金属錯体染料(C)、溶解促進剤(E)、界面活性剤(F)及びGBL/PGMEA混合溶媒(G)を加えて、さらに混合した。成分が溶解したことを目視で確認した後、孔径0.22μmのミリポアフィルターで濾過し、固形分濃度12質量%のポジ型感光性樹脂組成物を調製した。表2における組成の質量部は固形分換算値である。実施例1~5及び比較例1~3のポジ型感光性樹脂組成物の評価結果を表2に示す。 (3) Preparation and evaluation of positive photosensitive resin composition [Examples 1 to 5, Comparative Examples 1 to 3]
The first resin (A) and the second resin (D) are mixed and dissolved with the composition shown in Table 2, and the resulting solution is added to the photoacid generator (B) shown in Table 2 and the metal complex dye. (C), dissolution enhancer (E), surfactant (F) and GBL/PGMEA mixed solvent (G) were added and further mixed. After visually confirming that the components had dissolved, the mixture was filtered through a Millipore filter with a pore size of 0.22 μm to prepare a positive photosensitive resin composition with a solid content concentration of 12% by mass. The mass parts of the compositions in Table 2 are solid content conversion values. Table 2 shows the evaluation results of the positive photosensitive resin compositions of Examples 1 to 5 and Comparative Examples 1 to 3.
Claims (14)
- 複数のアルカリ可溶性官能基を有し、前記複数のアルカリ可溶性官能基の少なくとも一部が酸分解性基で保護された第1樹脂(A)と、
光酸発生剤(B)と、
金属錯体染料(C)と
を含むポジ型感光性樹脂組成物であって、前記金属錯体染料(C)が、金属錯イオンを50~94質量%含む、ポジ型感光性樹脂組成物。 a first resin (A) having a plurality of alkali-soluble functional groups, at least a portion of which is protected with an acid-decomposable group;
a photoacid generator (B);
A positive photosensitive resin composition containing a metal complex dye (C), wherein the metal complex dye (C) contains 50 to 94% by mass of metal complex ions. - 前記金属錯体染料(C)に含まれる前記金属錯イオンを形成する金属元素が、クロム、銅、コバルト、及び鉄からなる群より選択される少なくとも1種である、請求項1に記載のポジ型感光性樹脂組成物。 The positive type according to claim 1, wherein the metal element forming the metal complex ion contained in the metal complex dye (C) is at least one selected from the group consisting of chromium, copper, cobalt, and iron. A photosensitive resin composition.
- 前記金属錯体染料(C)が、ソルベントブラック22~47のカラーインデックス(C.I.)で規定される黒色染料のうち少なくとも1種である、請求項1に記載のポジ型感光性樹脂組成物。 The positive photosensitive resin composition according to claim 1, wherein the metal complex dye (C) is at least one of black dyes defined by color indexes (C.I.) of Solvent Black 22 to 47. .
- 前記第1樹脂(A)が、複数のフェノール性水酸基を有し、前記複数のフェノール性水酸の少なくとも一部が前記酸分解性基で保護された樹脂である、請求項1~3のいずれか一項に記載のポジ型感光性樹脂組成物。 4. Any one of claims 1 to 3, wherein the first resin (A) is a resin having a plurality of phenolic hydroxyl groups, and at least a portion of the plurality of phenolic hydroxyl groups are protected with the acid-decomposable groups. The positive photosensitive resin composition according to claim 1.
- 前記第1樹脂(A)が、複数のフェノール性水酸基を有し、前記複数のフェノール性水酸基の少なくとも一部が前記酸分解性基で保護された、フェノール性水酸基を有する重合性単量体とその他の重合性単量体との共重合体である、請求項4に記載のポジ型感光性樹脂組成物。 a polymerizable monomer having a phenolic hydroxyl group in which the first resin (A) has a plurality of phenolic hydroxyl groups, at least a portion of which is protected by the acid-decomposable group; 5. The positive photosensitive resin composition according to claim 4, which is a copolymer with other polymerizable monomers.
- 前記第1樹脂(A)が、式(3)
で表される構造単位を有し、sが1以上の整数である式(3)で表される構造単位を少なくとも1つ有する、請求項5に記載のポジ型感光性樹脂組成物。 The first resin (A) has the formula (3)
The positive photosensitive resin composition according to claim 5, which has at least one structural unit represented by formula (3), wherein s is an integer of 1 or more. - 前記第1樹脂(A)が、式(2)
で表される構造単位を有する、請求項5に記載のポジ型感光性樹脂組成物。 The first resin (A) has the formula (2)
The positive photosensitive resin composition according to claim 5, which has a structural unit represented by: - 前記ポジ型感光性樹脂組成物が第2樹脂(D)を更に含み、前記第2樹脂(D)が、アルカリ可溶性官能基を有する重合性単量体の単独重合体又は共重合体、又はエポキシ基及びフェノール性水酸基を有する樹脂である、請求項1~3のいずれか一項に記載のポジ型感光性樹脂組成物。 The positive photosensitive resin composition further includes a second resin (D), and the second resin (D) is a homopolymer or copolymer of a polymerizable monomer having an alkali-soluble functional group, or an epoxy The positive photosensitive resin composition according to any one of claims 1 to 3, which is a resin having a group and a phenolic hydroxyl group.
- 前記金属錯体染料(C)を、樹脂成分の合計100質量部を基準として10質量部~150質量部含む、請求項1~3のいずれか一項に記載のポジ型感光性樹脂組成物。 The positive photosensitive resin composition according to any one of claims 1 to 3, comprising 10 to 150 parts by mass of the metal complex dye (C) based on a total of 100 parts by mass of the resin components.
- 前記光酸発生剤(B)を、樹脂成分の合計100質量部を基準として0.1質量部~85質量部含む、請求項1~3のいずれか一項に記載のポジ型感光性樹脂組成物。 The positive photosensitive resin composition according to any one of claims 1 to 3, comprising 0.1 to 85 parts by mass of the photoacid generator (B) based on a total of 100 parts by mass of the resin components. thing.
- 前記ポジ型感光性樹脂組成物の硬化被膜の光学濃度(OD値)が膜厚1μmあたり0.5以上である、請求項1~3のいずれか一項に記載のポジ型感光性樹脂組成物。 The positive photosensitive resin composition according to any one of claims 1 to 3, wherein the cured film of the positive photosensitive resin composition has an optical density (OD value) of 0.5 or more per 1 µm of film thickness. .
- 請求項1~3のいずれか一項に記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子隔壁。 An organic EL element partition containing a cured product of the positive photosensitive resin composition according to any one of claims 1 to 3.
- 請求項1~3のいずれか一項に記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子絶縁膜。 An organic EL element insulating film containing a cured product of the positive photosensitive resin composition according to any one of claims 1 to 3.
- 請求項1~3のいずれか一項に記載のポジ型感光性樹脂組成物の硬化物を含む有機EL素子。 An organic EL device comprising a cured product of the positive photosensitive resin composition according to any one of claims 1 to 3.
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KR1020237037008A KR20230162069A (en) | 2021-06-02 | 2022-05-24 | Positive photosensitive resin composition, and organic EL device barrier rib |
CN202280039577.6A CN117480451A (en) | 2021-06-02 | 2022-05-24 | Positive photosensitive resin composition and organic EL element partition wall |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122533A (en) * | 1982-01-14 | 1983-07-21 | Somar Corp | Photosensitive material |
JPH07219228A (en) * | 1994-01-27 | 1995-08-18 | Tomoegawa Paper Co Ltd | Photosensitive resin composition for formation of pattern and pattern forming method |
WO2020246517A1 (en) * | 2019-06-03 | 2020-12-10 | 昭和電工株式会社 | Positive-type photosensitive resin composition and partition wall of organic el element |
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JP2001281440A (en) | 2000-04-03 | 2001-10-10 | Nippon Zeon Co Ltd | Light-shielding film, method for manufacturing the same and use of the same |
JP2002116536A (en) | 2000-10-06 | 2002-04-19 | Jsr Corp | Radiation sensitive resin composition, its cured body and element |
JP5343664B2 (en) | 2009-03-30 | 2013-11-13 | Jsr株式会社 | Radiation-sensitive resin composition, organic EL display element partition and insulating film, and method for forming the same |
KR102117237B1 (en) | 2015-10-21 | 2020-06-01 | 쇼와 덴코 가부시키가이샤 | Positive type photosensitive resin composition |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58122533A (en) * | 1982-01-14 | 1983-07-21 | Somar Corp | Photosensitive material |
JPH07219228A (en) * | 1994-01-27 | 1995-08-18 | Tomoegawa Paper Co Ltd | Photosensitive resin composition for formation of pattern and pattern forming method |
WO2020246517A1 (en) * | 2019-06-03 | 2020-12-10 | 昭和電工株式会社 | Positive-type photosensitive resin composition and partition wall of organic el element |
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KR20230162069A (en) | 2023-11-28 |
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