WO2022246917A1 - Dispositif bidirectionnel monofibre plan à canaux multiples à base de processus cob - Google Patents

Dispositif bidirectionnel monofibre plan à canaux multiples à base de processus cob Download PDF

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Publication number
WO2022246917A1
WO2022246917A1 PCT/CN2021/099113 CN2021099113W WO2022246917A1 WO 2022246917 A1 WO2022246917 A1 WO 2022246917A1 CN 2021099113 W CN2021099113 W CN 2021099113W WO 2022246917 A1 WO2022246917 A1 WO 2022246917A1
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WO
WIPO (PCT)
Prior art keywords
optical
slope
array
optical fiber
planar multi
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PCT/CN2021/099113
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English (en)
Chinese (zh)
Inventor
钟幸
迟景茂
许其建
Original Assignee
武汉华工正源光子技术有限公司
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Publication of WO2022246917A1 publication Critical patent/WO2022246917A1/fr

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4287—Optical modules with tapping or launching means through the surface of the waveguide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources

Definitions

  • the invention relates to the technical field of high-speed optical modules for optical fiber communication, especially for compact planar multi-channel single-fiber bidirectional optical systems such as 100G and 200G, specifically a planar multi-channel single-fiber bidirectional device based on COB technology.
  • the purpose of the present invention is to provide a planar multi-channel single-fiber bidirectional device based on COB technology, which can increase the transmission rate and compactness of the entire optical module, reduce packaging costs, and facilitate mass production.
  • the embodiment of the present invention provides the following technical solution: a planar multi-channel single-fiber bidirectional device based on COB technology, including an optical fiber array component and a light splitting device on the same horizontal plane,
  • the optical fiber array assembly has a first slope with an acute angle to a vertical line perpendicular to the horizontal plane and built-in optical fibers,
  • the light splitting device has a second slope superimposed on the first slope, and the light splitting device also has a third slope forming an acute angle with a vertical line perpendicular to the horizontal plane, the second slope and the third slope relative settings;
  • the outgoing optical signal ⁇ 1 passes through the third inclined plane, the second inclined plane and the first inclined plane in sequence, and is incident into the optical fiber to complete electro-optic conversion.
  • the far-end optical signal ⁇ 2 passes through the first inclined plane and is transmitted by the first inclined plane. The two slopes are reflected into the PD array to complete the photoelectric conversion.
  • the optical fiber array assembly also includes a quartz glass V-groove and a glass cover parallel to the bottom of the quartz glass V-groove, the optical fiber is arranged between the quartz glass V-groove and the glass cover, so One end of the quartz glass V-groove and one end of the glass cover plate are inclined planes, and the two inclined planes are combined to form the first inclined plane.
  • the side of the quartz glass V-groove away from the glass cover plate is coated with a first film layer that can transmit the remote optical signal ⁇ 2 and reflect or absorb the outgoing optical signal ⁇ 1.
  • the spectroscopic device includes a prism, and an opposite surface of the prism is the second inclined surface and the third inclined surface, and the second inclined surface is coated with an anti-reflection layer that reflects the far-end optical signal ⁇ 2 and Describe the second layer of the outgoing optical signal ⁇ 1.
  • the light splitting device includes a PLC passive chip, and opposite sides of the PLC passive chip are the second slope and the third slope respectively.
  • the PLC passive chip is bonded to an optical fiber array component with a height of 250 ⁇ m.
  • the outgoing optical signal ⁇ 1 is reversely input at the end of the optical fiber array component, and the large-area PD is used to monitor the optical power of each path one by one at the third slope end, so that the optical power of each path reaches the maximum, and then pass Refractive index matching UV glue bonding.
  • the LD COC component also includes an LD COC component and an LD lens on the electro-optical conversion optical path, and the LD COC component sends out the outgoing light signal ⁇ 1, which is focused to the spectroscopic device through the LD lens.
  • the remote optical signal ⁇ 2 is reflected by the second slope of the optical splitting device after passing through the optical fiber array assembly, and passes through the PEI integrated Thlens array and lens array transfer focus to the PD array.
  • the optical fiber array component and the optical splitting device are all packaged on the metal substrate; when there are LD COC components and LD lenses, the LD COC component, the LD lens, the optical fiber array component and the optical splitting device All are packaged on a metal substrate; when there is a PEI integrated lens array and lens array, the PEI integrated lens array, lens array, the optical fiber array component and the light splitting device are all packaged on a metal substrate.
  • the beneficial effect of the present invention is: a planar multi-channel single-fiber bidirectional device based on COB technology, which increases device integration, increases the transmission rate of optical modules, reduces packaging costs, and is mass-produced at low rates.
  • FIG. 1 is a side view of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention
  • FIG. 2 is a top view of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention
  • FIG. 3 is a cross-sectional view of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention
  • FIG. 4 is a side view of an optical fiber array assembly of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention
  • FIG. 5 is a top view of an optical fiber array component of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention
  • FIG. 6 is a schematic diagram of an optical splitting device of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention
  • FIG. 7 is a side view of a PLC passive chip of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention
  • FIG. 8 is a top view of a PLC passive chip of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention
  • Fig. 9 is a side view of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention using a PLC passive chip;
  • Fig. 10 is a top view of a planar multi-channel single-fiber bidirectional device based on a COB process provided by an embodiment of the present invention using a PLC passive chip;
  • 1-optical fiber array assembly 11-optical fiber; 12-quartz glass V-groove; 13-glass cover plate; 14-first film layer; 2-light splitting device; 20-first slope; 21-second Inclined surface; 22-second film layer; 23-third inclined plane; 24-prism; 25-PLC passive chip; 26-core layer; 30-isolator; 31-LD COC; 32-LD lens; 33-PEI integrated Thlens array; 34-lens array; 35-PD array; 36-Driver; 37-PCB board; 38-TIA chip; 39-metal substrate.
  • the embodiment of the present invention provides a planar multi-channel single-fiber bidirectional device based on COB technology, including an optical fiber array component 1 and an optical splitting device 2 on the same horizontal plane , the optical fiber array assembly 1 has a first slope 20 at an acute angle to a vertical line perpendicular to the horizontal plane and built-in optical fibers 11, the optical splitter 2 has a second slope 21 superimposed on the first slope 20, and The spectroscopic device 2 also has a third slope 23 at an acute angle to a vertical line perpendicular to the horizontal plane, the second slope 21 is opposite to the third slope 23; the outgoing optical signal ⁇ 1 passes through the third slope 23 in sequence , the second slope 21 and the first slope 20 are incident into the optical fiber 11 to complete electro-optical conversion, and the far-end optical signal ⁇ 2 passes through the first slope 20 and is reflected by the second slope 21 to the PD array35 complete the photoelectric conversion.
  • the optical fiber array assembly 1 and the optical splitting device 2 are integrated to realize conversion from electrical signals to optical signals and conversion from optical signals to electrical signals.
  • the device also includes LD COC31 components and LD lens32 on the electro-optical conversion optical path, and also includes PEI integrated lens array33, lens array34 and PD array35 on the photoelectric conversion optical path.
  • the emission optical system is mainly composed of laser LD COC31 components (semiconductor lasers), LD lens32, isolator 30, optical splitter 2, and optical fiber array component 1.
  • the device 2 is transmitted into the optical fiber 11 of the optical fiber array assembly 1 to complete the conversion of electrical signals to optical signals, and the receiving optical system is mainly composed of the optical fiber array assembly 1, the optical splitting device 2, the PEI integrated lens array33 (lens array), lens array34 and Composed of PD array35 (photodiode array), the optical signal ⁇ 2 transmitted from the far end passes through the optical fiber array component 1, is reflected by the second slope 21 of the optical splitting device 2, and is transmitted and focused to the PD array35 by PEI integrated lens array34 and lens array34. Detection, to complete the optical signal to electrical signal conversion.
  • the isolator 30 is bonded to the third slope 23 through a refractive index matching liquid, the isolator 30 is a magnetic isolator 30, and the refractive index matching liquid can not only increase the degree of integration , it is also possible to avoid coating the antireflection film on the incident surface of the light splitting device 2 .
  • the PEI integrated lens array 33 includes two groups of lenses, the lenses of the two groups are arranged in a row, each group of the lenses has four channels, corresponding to the four channel fibers in the fiber array assembly 1, the array lens will The receiving optical element is turned in parallel with the emitting optical path in the direction of the PCB cross-section, which is convenient for PCB signal routing.
  • the angle between the first slope 20 and the vertical line and the second slope 21 The included angles with the vertical line are all 41°; the included angles between the third slope 23 and the vertical line are 8°.
  • the inclination angle of the first inclined surface 20 and the second inclined surface 21 may be 41°, the inclination angle of the third inclined surface 23 may be 8°, and of course other matching angles, which are not limited in this embodiment.
  • the setting is preferably 41° and 8° to prevent reflection.
  • the optical fiber array assembly 1 also includes a quartz glass V-groove 12 and a glass cover plate 13 arranged in parallel below the quartz glass V-groove 12, the The optical fiber 11 is arranged between the quartz glass V-groove 12 and the glass cover plate 13, one end of the quartz glass V-groove 12 and one end of the glass cover plate 13 are both inclined planes, and the two inclined planes are combined to form a Describe the first slope 20.
  • the optical fiber array assembly 1 can be subdivided into optical fibers 11 , a quartz glass V-groove 12 and a glass cover 13 parallelly arranged below the quartz glass V-groove 12 .
  • the side of the quartz glass V-groove 12 facing away from the glass cover 13 is coated with a first film layer 14 that can transmit the remote optical signal ⁇ 2 and reflect or absorb the outgoing optical signal ⁇ 1.
  • the optical fiber 11 , the quartz glass V-groove 12 and the glass cover 13 are bonded by UV glue with matching refractive index.
  • the height of the quartz glass V-groove 12 is 750 ⁇ m.
  • the light splitting device 2 includes a prism 24, and an opposite surface of the prism 24 is the second slope 21 and the third slope 23 respectively, and the first The second slope 21 is coated with a second film layer 22 which reflects the remote optical signal ⁇ 2 and anti-reflects the outgoing optical signal ⁇ 1.
  • the prism 24 has two functions, one is to coat the second slope 21 with a spectroscopic film system, the film system reflects the remote optical signal ⁇ 2 and enhances the transmission of the outgoing optical signal ⁇ 1, The second is to match the incident angle of the optical fiber 11 and increase the coupling efficiency.
  • the prism 24 is made of a material whose refractive index is as close as possible to quartz glass, such as BK7 glass or quartz glass.
  • the optical splitting device 2 includes a PLC passive chip 25, and an opposite side of the PLC passive chip 25 is the second slope 21 and the Describe the third slope 23.
  • the heights of one opposite side of the PLC passive chip 25 are 250 ⁇ m and 750 ⁇ m respectively, the core layer 26 with a height of 250 ⁇ m guides light, and its near-field mode spot matches the mode spot of the single-mode optical fiber 11, and the core layer 26 with a height of 750 ⁇ m
  • the loss of the layer 26 is the same as that of the one-sided core layer 26 at a height of 250 ⁇ m.
  • the PLC passive chip 25 is bonded to the optical fiber array component 1 with a height of 250 ⁇ m.
  • the outgoing optical signal ⁇ 1 is reversely input at the end of the optical fiber array assembly 1, and the optical power of each path is monitored one by one with a large-area PD at the end of the third inclined plane 23, so that the optical power of each path reaches the maximum, and then through Refractive index matching UV glue bonding.
  • the PLC passive chip 25 is made by PLC waveguide ion exchange technology.
  • the light splitting device 2 can also be replaced by a small PLC passive chip 25.
  • the PLC passive chip 25 can be made by PLC waveguide ion exchange technology, and the two ends of the PLC chip are respectively ground 41° and 8°, wherein the 41° surface is coated with a functional film system for anti-reflection ⁇ 1 and reflection ⁇ 2, and the isolator 30 can be pasted on the 8° slope; the PLC passive chip 25 can be produced in batches through wafers , and then processed into the desired shape by cutting and grinding.
  • the PEI integrated lens array33, lens array34, PD array35, and TIA chip38 can also use the same type of components with a pitch (height) of 250um, which can reduce the cost of active PD chips and TIA chips 2/3, which greatly reduces the cost of the chip, and further increases the integrability of the device and reduces the package size.
  • the PLC passive chip 25 can be divided into two ends of 250um pitch and 750um pitch.
  • the 250um pitch core layer 26 guides light, and its near-field mode spot matches the single-mode fiber 11 mode spot, and the matching degree is high.
  • the core layer 26 of the 750um pitch end is better than 250um
  • the core layer 26 at the pitch end is slightly larger, and the low loss of the core layer 26 is reduced to the same as that of the 250um pitch end core layer 26 by etching the tapered waveguide, which can increase the coupling efficiency and coupling tolerance of the 8° bevel end and allow the lens to focus The light beam is more easily coupled into the waveguide.
  • the 25750um pitch side of the PLC passive chip can change the pitch size to 1mm or other sizes according to actual needs, considering the module package size and PLC chip size to meet the design requirements.
  • the optical fiber array assembly 1 and the optical splitting device 2 are all packaged on the metal substrate 39; when there are LD COC31 components and LD lens32, the LD The COC31 assembly, the LD lens32, the optical fiber array assembly 1 and the light splitting device 2 are all packaged on the metal substrate 39; when there are PEI integrated lens array33, lens array34, the PEI integrated lens array33, lens array34 , the optical fiber array assembly 1 and the light splitting device 2 are packaged on the metal substrate 39 .
  • optical devices and optical components such as LD COC31 assembly, PD array35, TIA, optical splitting device 2, optical fiber array assembly 1, PEI integrated lens array34, lens array34 are all packaged on the metal substrate 39, which is not only beneficial to heat dissipation , and the advantage can make the passive components all in the same plane, reducing packaging tolerances.
  • the embodiment of the present invention provides a packaging method of a planar multi-channel single-fiber bidirectional device based on the COB process, which can be realized in sequence according to the following steps, wherein the x direction is the direction of the cross-section of the PCB board, the y direction is the direction perpendicular to the PCB board, and the z direction is is the direction of the optical axis of the emitted light path:
  • the y-direction position of the pre-coupled fiber array component 1 is used to detect the ⁇ 1 optical power output by the fiber array component 1.
  • the pre-coupling position of the fiber array component 1 is flush with the PD array35 chip. After the pre-coupling is completed, the fiber array component 1 and the spectroscopic device 2 are fixed with UV glue ;
  • Coupling LD lens32 one by one make the ⁇ 1 light energy of each channel reach the required output value of the module, and cure LD lens32 with UV glue;
  • the metal cover can be designed to be placed above the entire metal substrate 39 to protect each element from dust and gold wires; driver36 (driver) is located on the PCB board 37 and connected with LD COC31.
  • the angle between the optical fiber array component 1 and the optical splitter can be designed to be other angles, and the pitch value setting of 750um or 250um can also be changed according to the actual chip pitch or requirements.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un dispositif bidirectionnel monofibre plan à canaux multiples à base de processus COB, comprenant un ensemble réseau de fibres optiques (1) et un dispositif de division de lumière (2) qui sont situés sur un même plan horizontal. L'ensemble réseau de fibres optiques (1) a une première surface inclinée (20) à un angle aigu par rapport à une ligne verticale perpendiculaire au plan horizontal et des fibres optiques intégrées (11). Le dispositif de division de lumière (2) présente une deuxième surface inclinée (21) empilée sur la première surface inclinée (20), et le dispositif de division de lumière (2) présente en outre une troisième surface inclinée (23) selon un angle aigu par rapport à une ligne verticale perpendiculaire au plan horizontal, la deuxième surface inclinée (21) étant disposée à l'opposé de la troisième surface inclinée (23). Un signal lumineux émergent λ1 passe séquentiellement à travers la troisième surface inclinée (23), la deuxième surface inclinée (21) et la première surface inclinée (20) et est incidente sur les fibres optiques (11) pour achever la conversion électro-optique. Un signal optique distant λ2 passe à travers la première surface inclinée (20) et est réfléchi par la deuxième surface inclinée (21) vers un réseau PD (35) pour achever la conversion optoélectrique. La structure augmente le niveau d'intégration du dispositif, améliore le taux de transmission d'un module optique, réduit le coût d'emballage, et facilite la production de masse.
PCT/CN2021/099113 2021-05-27 2021-06-09 Dispositif bidirectionnel monofibre plan à canaux multiples à base de processus cob WO2022246917A1 (fr)

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Application Number Priority Date Filing Date Title
CN202110586151.XA CN113109908A (zh) 2021-05-27 2021-05-27 一种基于cob工艺的平面多通道单纤双向器件
CN202110586151.X 2021-05-27

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Cited By (1)

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CN116931200A (zh) * 2023-09-19 2023-10-24 武汉钧恒科技有限公司 一种400g dr4光器件

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CN118742837A (zh) * 2022-02-28 2024-10-01 先进微晶圆私人有限公司 用于改善光纤与晶片衬底或芯片的位置的带侧面抛光的光纤阵列

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US6513993B1 (en) * 1999-09-28 2003-02-04 Sumitomo Electric Industries, Ltd. Optical communications device
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CN116931200B (zh) * 2023-09-19 2023-12-12 武汉钧恒科技有限公司 一种400g dr4光器件

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