WO2022243432A1 - Fabrication d'une carte à puce - Google Patents

Fabrication d'une carte à puce Download PDF

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Publication number
WO2022243432A1
WO2022243432A1 PCT/EP2022/063576 EP2022063576W WO2022243432A1 WO 2022243432 A1 WO2022243432 A1 WO 2022243432A1 EP 2022063576 W EP2022063576 W EP 2022063576W WO 2022243432 A1 WO2022243432 A1 WO 2022243432A1
Authority
WO
WIPO (PCT)
Prior art keywords
biometric sensor
sensor module
smartcard
film layer
inlay
Prior art date
Application number
PCT/EP2022/063576
Other languages
English (en)
Inventor
Devin SNELL
Original Assignee
Zwipe As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GB2107888.6A external-priority patent/GB2607113A/en
Application filed by Zwipe As filed Critical Zwipe As
Publication of WO2022243432A1 publication Critical patent/WO2022243432A1/fr

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
    • G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Definitions

  • the present invention relates to a method of manufacturing a smartcard.
  • the invention also relates to a smartcard manufactured by the method as well as to an apparatus for carrying out the method.
  • the present invention relates to a method of manufacturing a smartcard that includes a biometric sensor.
  • a smartcard is a pocket-sized card with an embedded integrated circuit. In most cases smartcards are manufactured in accordance with the requirements of ISO standards for credit card size (ISO/I EC 7810) as well as complying with other structural and functional requirements such as those set out in the ISO/IEC 7816 and ISO/IEC 7810 series of standards.
  • a smartcard typically contains volatile and non-volatile memory and microprocessor components. Smartcards provide a way of authenticating the bearer of the card and carrying a secure message from the card to the reader. For example, if a "nonsmart" credit card were to be lost or stolen, an unauthorised user may be able to use the credit card until the credit card is cancelled. Conversely, a "smart" credit card may include many more levels of security that would prevent such use by an unauthorised user.
  • One such security measure for a smartcard is the use of biometric data to identify the bearer of the card.
  • a biometric security measure may be added to a smartcard through the addition of a biometric sensor, such as a fingerprint sensor, on the smartcard.
  • a biometric sensor such as a fingerprint sensor
  • the bearer presents their finger or thumb to the fingerprint sensor, which then positively authenticates the owner of the finger or thumb.
  • a typical smartcard is manufactured by laminating an electronic circuit assembly between two outer layers of plastic to embed it with the outer plastic layers as well as typically surrounding the electronic circuit assembly with an internal filler.
  • Polyvinyl chloride (PVC) is commonly used as it softens before it oxidises and, at suitable temperatures and pressures, will conform to the shape of components on the printed circuit assembly.
  • PVC Polyvinyl chloride
  • the laminating temperatures for this type of “hot” lamination required can be as high as 250°C. It is also possible to manufacture smartcards using “cold” lamination, where the layers are coupled via application of pressure and the use of adhesive filler materials in between the layers.
  • the proposals in WO 2013/160011 provided an advance in this field through an innovative combination of embedded parts provided in the electronic circuit prior to formation of the pre-formed smartcard body, and post-placement of the biometric sensor. For example, since the biometric sensor is not installed until after the pre-formed smartcard body is formed then the biometric sensor is not exposed to any adverse conditions arising during the forming or processing of the pre-formed smartcard body (such as heat or pressure), which might cause damage to the biometric sensor.
  • the invention provides a method for manufacture of a smartcard incorporating a biometric sensor module, the method using a pre-formed smartcard body and a film layer upon which the biometric sensor module is mounted, wherein the biometric sensor module comprises a sensing array and a processor, and wherein an inlay is embedded within the pre-formed smartcard body and the pre-formed smartcard body includes a recess for receiving the biometric sensor module; the method comprising: aligning the recess and the biometric sensor module on the film layer; and using a mounting tool, punching the biometric sensor module out of the film layer with a portion of the mounting tool being pushed through the film layer toward the recess whilst engaging with the biometric sensor module and thereby propelling the biometric sensor module into the recess; wherein the mounting tool performs a concurrent punching and heating operation such that at least portions of the biometric sensor module are exposed to heat in order to couple the biometric sensor module to at least one of the pre-formed smartcard body and the inlay
  • the biometric sensor module may typically be a "surface mount technology" (SMT) type component, which in the prior art would typically be picked and placed via conventional SMT systems, and in the case of smartcards would often incorporated with an inlay of the smartcard before the inlay is embedded into the smartcard body.
  • SMT surface mount technology
  • the current proposal differs from these SMT type processes by mounting the biometric sensor module onto a film layer, such as a film on a reel as discussed below, and by the use of a combined punching and heating step.
  • the biometric sensor module can be incorporated into the smartcard with a “post-placement” technique and this can easily be done in a way that enables larger scale production of the smartcards as set out below. It will also be seen from the discussion below that the invention extends to a kit of parts including the combination of the film layer and the biometric sensor module, as well as to an apparatus for carrying out the manufacturing process.
  • the biometric sensor module includes the biometric sensor and may include further associated parts such as structures for mounting the module to the film layer, structures for mounting the module to the pre-formed smartcard body, electrically conductive parts for electrically connecting the biometric sensor to the inlay and so on.
  • the exact form of the biometric sensor module may vary depending on the form of the biometric sensor.
  • the biometric sensor module includes a sensor array for a biometric sensor, in particular a fingerprint sensor such as a capacitive area fingerprint sensor.
  • the sensor array may be mounted to a substrate layer, which advantageously may be the film layer or at least is connected thereto.
  • the sensor array may be provided without any encapsulation. That is to say, unlike some film mounted components there may be no encapsulation of the sensor array on the inner side of the biometric sensor module. Other passive parts may also not be encapsulated.
  • the biometric sensor module may include a protective coating on the outer surface of the biometric sensor, wherein the outer surface is the surface that is exposed on the smartcard surface once the biometric sensor module is incorporated into the smartcard body. On an inner surface, i.e.
  • the biometric sensor module may include contact pads for electrical connection with corresponding contact pads of the inlay in the smartcard body.
  • the outer surface may include a bezel for the biometric sensor, such as a conductive bezel for a capacitive fingerprint sensor.
  • the bezel may be used to receive and to transmit forces and/or heat from the mounting tool to the heat activated bonding material, which may be provided on parts of the inner surface of the biometric sensor module such as via a solder mask as mentioned below.
  • the sensor array may comprise a passive sensor array, which is cheaper to manufacture that other types of biometric sensors, such as where the sensor array is integrated as part of a capacitive CMOS silicon sensor.
  • the sensor array may comprise a first electrode layer and a second electrode layer, wherein each electrode layer comprise a plurality of parallel, electrically-isolated traces.
  • the traces of the first electrode layer may be perpendicular to the traces of the second electrode layer.
  • the sensor array may comprise a ground plate, which may comprises a layer of conductive material of substantially uniform thickness across substantially a full area of the sensor array.
  • the first electrode layer and the second electrode layer may be separated by a dielectric layer.
  • the second electrode layer may be separated by a dielectric layer.
  • the processor may be connected to the sensor array to selectively address a plurality of locations across an area of the sensor array.
  • the processor may be connected to the first electrode layer and the second electrode layer, and may be configured to independently address each of the conductive traces of the first electrode layer and of the second electrode layer.
  • the sensor array may be disposed inward of the film layer or outward of the film layer.
  • the film layer may be a reel-to-reel type film layer as is known in the art for other purposes, such as a 35 mm polyimide film.
  • the film layer may include a hole that receives parts of the sensor module, such as a hole for the sensor array or a hole for the processor.
  • the film layer may be arranged to be placed adjacent to the pre-formed smartcard body with the recess of the smartcard aligned with the biometric sensor module on the film layer, and in example embodiments this alignment is done by movement of the film layer. It will be appreciated that in the case of a reel-to-reel type film layer this may conveniently be done using known systems used for movement of reel-to-reel film layers in other types of sensor placement operations.
  • the film layer may be provided as a part of a reel film that includes multiple biometric sensor modules and can hence be used during mass manufacture of smartcards via repeated use of the mounting tool whilst the film layer is moved and whilst a first pre formed smartcard body with the biometric sensor module having been attached by the mounting tool is replaced by a second pre-formed smartcard body with a recess ready to receive a further biometric sensor module.
  • the latter step may be performed using a conveyor for moving the pre-formed smartcard bodies into alignment with the mounting tool.
  • the method may include a repeated sequence of steps comprising alignment of a sensor module and a recess, concurrent punching and heating to mount the sensor module to the smartcard body, movement of a conveyor to bring the next pre-formed smartcard body into position, and movement of the film layer to bring the next biometric sensor module into position.
  • the movement of the conveyor and the film layer may be done in parallel.
  • the mounting tool performs the concurrent punching and heating operation.
  • the mounting tool has the function of punching the biometric sensor module through the film layer and moving it toward the recess, and in addition the mounting tool has the function of exposing at least the portions of the biometric sensor module to heat.
  • the heat is used in order to couple the biometric sensor module to at least one of the pre-formed smartcard body and the inlay using a heat activated bonding material.
  • the mounting tool may apply heat during punching of the biometric sensor module out of the film layer.
  • the mounting tool may be held in place for a period of time after the punching stage in order to ensure that the heat activated bonding material receives sufficient heat.
  • the mounting tool may heat the biometric sensor module to a temperature of at least 100°C, and preferably between 150°C and 200°C.
  • the biometric sensor may be heated to this temperature for a period of at least 100ms, optionally at least 200ms, and preferably at least 300ms.
  • the operation may be completed within 10 seconds, optionally within 5 seconds, and preferably within 1.5 seconds.
  • the mounting tool may include a tool head with edges for detaching the biometric sensor module from the film layer, such as via cutting through the film and/or through mounting portions of the biometric sensor module.
  • the mounting tool may perform a shearing cutting action as it passes through the film layer, with the tool head of the mounting tool passing through the film layer.
  • the portion of the mounting tool that passes through the film layer may cut through the film layer or it may pass through an opening in the film layer to punch out the biometric sensor module.
  • the cutting action may include cutting through extension portions of the biometric sensor module, such as extensions to a substrate layer of the biometric sensor module, with these extension portions then being left behind attached to the film layer as the biometric sensor module is detached therefrom.
  • the mounting tool may include a die that interacts with the tool head during detachment of the biometric sensor module from the film layer.
  • the die may be fixed in place relative to the film layer whilst the tool head may move relative to the film layer in order to detach the biometric sensor module from the film layer via interaction of the tool head with the die. For example, this may be done by shearing through the film layer and/or parts of the biometric sensor module via a shearing movement of the tool head past the die.
  • the die has cutting edges surrounding a generally rectangular opening and the tool head includes complementary cutting edges for passing through the opening whilst shearing through the film layer and/or parts of the biometric sensor module.
  • the opening may have rounded corners.
  • the mounting tool acts as a source of heat during the heating operation. It may include a heater such as an electrical heater, e.g. a heating element generating heat due to electrical resistance.
  • the mounting tool may include a tool head as above with the heater being within the tool head. In alternative arrangements the mounting tool may receive heat from an outside source such as via flow of a heated fluid.
  • the mounting tool may be arranged for heat retention in a section of the tool that can exchange heat with the biometric sensor module during the punching and heating operation, such as in the portion of the tool that passes through the film layer, which may be the tool head discussed above. Heat retention may be used to ensure quicker heating during the combined punching and heating operation and for repeated use in production line.
  • the tool may be provided with a suitable heat mass, e.g. a solid metal body of sufficient size, to ensure that sufficient heat can be provided to the biometric sensor module within a relatively short time period.
  • the mounting tool may include one or more temperature sensor(s) for measuring the temperature of the tool and/or of the biometric sensor module in order to allow for monitoring and/or control of the tool temperature or the temperature of the biometric sensor module during the punching and heating operation.
  • the concurrent punching and heating step provides for both of a mechanical and an electrical connection of the biometric sensor module to the pre-formed smartcard body.
  • the biometric sensor may be electrically connected to the inlay in order to permit use of the inlay and the biometric sensor together for later identification of a user of the smartcard.
  • the biometric sensor module may be physically connected to the pre-formed smartcard body, for example it may not be possible to remove the biometric sensor and/or the biometric sensor module without damaging at least one of the biometric sensor module, the pre formed smartcard body, and/or the heat activated bonding material.
  • the heat activated bonding material is used to couple the biometric sensor module to at least one of the pre-formed smartcard body and the inlay.
  • the heat activated bonding material may provide at least one of a mechanical and an electrical connection, and advantageously may be used to provide both of the mechanical connection between the biometric sensor module and the pre-formed smartcard body and the electrical connection between the biometric sensor module and the inlay.
  • the heat activated bonding material includes a material provided as a heat activated film, such as a solder mask.
  • a heat activated film may be provided as a layer attached to the film layer, such that the film layer acts as a support for the heat activated film as well as supporting the biometric sensor module. In that case, the heat activated film may be attached by “prelamination” to the supporting film layer.
  • Such a heat activated film may include holes for other parts of the biometric sensor module, for example holes for a sensor array thereof.
  • a solder mask may be provided on conductive elements of the biometric sensor module, such as over contact pads for electrical connection with contact pads of the inlay.
  • Such a solder mask may comprise solder that can be melted for wetting onto adjoining materials at a temperature where no damage will occur to the biometric sensor module.
  • the heat from the mounting tool may melt the solder and cause it to bond electrical contacts together, and optionally at the same time creating the main mechanical interconnection of the biometric sensor module and the pre-formed smartcard body.
  • the heat activated bonding material may be provided on at least one of the pre formed smartcard body and the biometric sensor module.
  • the heat activated bonding material may be provided on surfaces of the biometric sensor module that come into contact with complementary surfaces of the pre-formed smartcard body, which would typically be surfaces within the recess.
  • the heat activated bonding material may be provided on surfaces of the pre-formed smartcard body that come into contact with complementary surfaces of the biometric sensor module.
  • the heat activated bonding material may be provided on an inner surface of the biometric sensor module, whilst it is on the film layer.
  • the HAF when using a combination of a heat activated film (HAF) and a solder, the HAF may be applied to an inner surface of the biometric sensor module, whilst it is on the film layer, and holes may be cut in the HAF corresponding to locations of electrical contact pads of the inlay and biometric sensor module.
  • a solder paste may be applied to surfaces of the electrical contact pads of the inlay or to surfaces of the electrical contact pads of the biometric sensor module.
  • the heat activated bonding material may for example comprise a solder material or a heat activated adhesive, including possible use of conductive adhesives.
  • the heat activated bonding material may comprise a heat activated anisotropic conductive film (ACF).
  • ACF heat activated anisotropic conductive film
  • multiple heat activated materials may be used, such as a heat activated adhesive for providing a mechanical connection and a heat activated conductive material (such as a solder) for providing an electrical connection.
  • the inlay is embedded in the pre-formed smartcard body and may for example be placed between outer layers of the pre-formed smartcard body, such as between two outer plastic layers.
  • the inlay advantageously includes electrical contact pads for connection to the biometric sensor module.
  • the pre-formed smartcard body is manufactured by first embedding the contact pads in a smartcard body along with the inlay, such as via lamination or other techniques; and then later forming the recess to expose the contact pads and hence provide the pre-formed smartcard body including the recess.
  • the contact pads are first fully embedded and hence are not exposed for contact to the biometric sensor module, and they are later exposed via formation of the recess.
  • a pre-formed smartcard body including an embedded inlay is pre-formed by a suitable technique.
  • the term inlay is intended to include any suitable electronic circuit for a smartcard, such as a flexible printed circuit board.
  • contact pads are connected to the circuit for a biometric sensor and, during the pre-forming, are embedded in the smartcard body, i.e. completely surrounded by the smartcard body material; however, the biometric sensor itself is not connected to the inlay when the smartcard body is formed.
  • a recess is formed in the pre-formed smartcard body in order to expose the contacts. The recess allows for the biometric sensor to be subsequently connected to the smartcard body using the mounting tool of the first aspect.
  • the contact pads may be arranged for electrical connection to the biometric sensor of the biometric sensor module. Hence, the number and layout of the contact pads may vary depending on the configuration of connection points in for the biometric sensor.
  • the contact pads may be copper, for example, or they may be gold or gold plated.
  • the step of forming the recess may comprise removing material from the pre formed smartcard body to form the recess.
  • the recess may be milled using a precision end mill or a laser mill.
  • the recess may be formed using “drill and mill” techniques that known for other purposes in relation to smartcard manufacture. The depth of the removal of material is arranged to end just at the level of the contact pads within the pre-formed smartcard body, such that the contact pads are exposed.
  • the pre-formed smartcard body may be formed by a method comprising: providing a first plastic layer; providing the inlay on the first plastic layer, the inlay having the contact pads for connection to the biometric sensor of the biometric sensor module; providing a second plastic layer on the first plastic layer with the inlay interposed between the first plastic layer and the second plastic layer; laminating the first plastic layer and the second plastic layer to form the pre-formed smartcard body; and then removing material to form the recess of the pre-formed smartcard body.
  • the laminating may be performed at a temperature of at least 135°C and/or a pressure of at least 5 MPa, and is optionally performed at a temperature of at least 150°C and/or a pressure of at least 6.5 MPa. However, other temperatures and pressure ranges may be suitable.
  • additional layers may be provided above and/or below the first and second layers prior to lamination.
  • the inlay may comprise a passive inlay. That is to say, the inlay may comprise only passive components, such as resistors, capacitors, inductors and the like, and does not comprise any active electronic components, i.e. electronic components requiring electricity to operate.
  • the inlay may comprise (only) an electrically conductive trace formed on a substrate and defining a plurality of electrical contacts.
  • the pre-formed smartcard body may comprise no electronic components mounted to the inlay embedded within the pre-formed smartcard body.
  • the inlay may comprise an active inlay. That is to say, the inlay may comprise one or more active electronic components, which are encapsulated within the pre formed smartcard body.
  • the active electronic components may comprise a processor and/or a memory.
  • the inlay may include an antenna for communications with a card reader, such as an antenna for RFID type communications.
  • the inlay may include contacts for connection to a processing chip, which may comprise a processor and/or a memory, and wherein the contacts and/or the pre-formed card body may be configured to permit the processing chip to be connected to the inlay after forming of the card body, i.e. by post-placement.
  • the memory may be arranged to store biometric information relating to bearer of the smartcard and the processor may be arranged to compare the stored biometric information to biometric information acquired by the biometric sensor.
  • the processor may be arranged to determine if the user is an authorised user based on an indication provided by the biometric sensor.
  • the processor and memory may also be arranged to store and transmit other information associated with the smartcard to a reader, wherein the transmitted information does not include the stored biometric information and the biometric information acquired by the biometric sensor.
  • the processor may be arranged such that the biometric information acquired from the sensor is never transferred from the smartcard during normal operation.
  • the processor may have the general function of controlling operation of the smartcard.
  • the processing chip may include a secure element for use in authorisation of financial transactions.
  • the secure element may include a processor that carries out other operations in addition to authorisation of financial transactions, for example it may be involved in authentication of biometric data from the biometric sensor.
  • any one or more of the functions of the processing chip described above may be performed by the active components of the inlay, if an active inlay is used.
  • the inlay may include multiple processors with differing functions including those set out above, such as a dedicated biometric processor for carrying out a biometric authentication process and/or a separate controller for more general control of smartcard operations.
  • the method of the above aspect may be used to manufacture smartcards for a number of purposes where it is necessary for the identity of the bearer of the smartcard to be verified.
  • the smartcard manufactured in accordance with the above aspect may be any one of: an access card; a payment card; a credit card; a debit card; a pre-pay card; a loyalty card; or an identity card.
  • the smartcard may be arranged to prevent access to protected features of the smartcard if the biometric sensor does not provide an indication of an authorised user.
  • the smartcard may provide its desired function only when the biometric information confirms that the user is authorised, or at least it may only provide a full range of functions when properly authorised.
  • the smartcard may provide authorisation for financial transactions such as contactless payments only when the user is authorised, or optionally when the biometric authorisation has been used within a certain previous time or a certain number of prior transactions.
  • the invention provides a kit of parts for manufacture of a smartcard using the method of the first aspect, the kit of parts comprising: a pre-formed smartcard body; and a film layer upon which the biometric sensor module is mounted; wherein the biometric sensor module comprises a sensing array and a processor; wherein the pre-formed smartcard body includes an inlay embedded within the pre formed smartcard body and a recess for receiving the biometric sensor module; wherein there is a heat activated bonding material provided with at least one of the pre-formed smartcard body and the biometric sensor module; and wherein the recess and the biometric sensor module on the film layer each have a complementary form; such that a biometric sensor of the biometric sensor module can be mounted to the inlay and thereby incorporated with the smartcard when: the recess is aligned with the biometric sensor module; the biometric sensor module is punched out of the film layer and propelled into the recess; and at least portions of the biometric sensor module are exposed to heat in
  • the biometric sensor module may typically be a "surface mount technology” (SMT) type component.
  • the biometric sensor module includes the biometric sensor and may include further associated parts such as structures for mounting the module to the film layer, structures for mounting the module to the pre-formed smartcard body, electrically conductive parts for electrically connecting the biometric sensor to the inlay and so on.
  • the exact form of the biometric sensor module may vary depending on the form of the biometric sensor.
  • the biometric sensor module includes a sensor array for a biometric sensor, in particular a fingerprint sensor such as a capacitive area fingerprint sensor.
  • the sensor array may be mounted to a substrate layer, which advantageously may be the film layer or at least is connected thereto.
  • the sensor array may be provided without any encapsulation. That is to say, unlike some film mounted components there may be no encapsulation of the sensor array on the inner side of the biometric sensor module. Other passive parts may also not be encapsulated.
  • the biometric sensor module may include a protective coating on the outer surface of the biometric sensor, wherein the outer surface is the surface that is exposed on the smartcard surface once the biometric sensor module is incorporated into the smartcard body. On an inner surface, .e.
  • the biometric sensor module may include contact pads for electrical connection with corresponding contact pads of the inlay in the smartcard body.
  • the outer surface may include a bezel for the biometric sensor, such as a conductive bezel for a capacitive fingerprint sensor.
  • the bezel may be configured to receive and to transmit forces and/or heat from the mounting tool to the heat activated bonding material, which may be provided on parts of the inner surface of the biometric sensor module and may be a solder mask as mentioned below.
  • the sensor array may comprise a passive sensor array, which is cheaper to manufacture that other types of biometric sensors, such as where the sensor array is integrated as part of a capacitive CMOS silicon sensor.
  • the sensor array may comprise a first electrode layer and a second electrode layer, wherein each electrode layer comprise a plurality of parallel, electrically-isolated traces.
  • the traces of the first electrode layer may be perpendicular to the traces of the second electrode layer.
  • the sensor array may comprise a ground plate, which may comprises a layer of conductive material of substantially uniform thickness across substantially a full area of the sensor array.
  • the first electrode layer and the second electrode layer may be separated by a dielectric layer.
  • the second electrode layer may be separated by a dielectric layer.
  • the processor may be connected to the sensor array to selectively address a plurality of locations across an area of the sensor array.
  • the processor may be connected to the first electrode layer and the second electrode layer, and may be configured to independently address each of the conductive traces of the first electrode layer and of the second electrode layer.
  • the sensor array may be disposed inward of the film layer or outward of the film layer.
  • the film layer may be a reel-to-reel type film layer as is known in the art for other purposes, such as a 35 mm polyimide film.
  • the film layer may include a hole that receives parts of the sensor module, such as a hole for the sensor array or a hole for the processor.
  • the film layer may be arranged to be placed adjacent to the pre-formed smartcard body with the recess of the smartcard aligned with the biometric sensor module on the film layer, and in example embodiments this alignment is done by movement of the film layer, which may include added features for ease of movement, such as sprocket holes. It will be appreciated that in the case of a reel-to-reel type film layer this may conveniently be done using known systems used for movement of reel-to-reel film layers in other types of sensor placement operations.
  • the film layer may be provided as a part of a reel film that includes multiple biometric sensor modules and can hence be used during mass manufacture of smartcards whilst the film layer is moved and whilst a first pre-formed smartcard body with the biometric sensor module having been attached by the mounting tool is replaced by a second pre- formed smartcard body with a recess ready to receive a further biometric sensor module.
  • the kit of parts may comprise a film layer with a plurality of biometric sensor modules along with a corresponding plurality of pre-formed smartcard bodies. Such a kit of parts can be used in mass manufacture such as via repeated use of the mounting tool in the method discussed above.
  • the film layer may be arranged such that a portion of a mounting tool may pass through the film layer during a punching operation.
  • the film layer together with the biometric sensor module may be arranged such that the biometric sensor module may be released from the film layer by a tool cutting through the film layer.
  • the film layer may include an opening and the film layer together with the biometric sensor module may be arranged such that the biometric sensor module may be released from the film layer by a tool passing through the opening in the film layer to punch out the biometric sensor module.
  • the biometric sensor module may include extension portions attached to the film layer, such as extensions to a substrate layer of the biometric sensor module, with these extension portions then being left behind attached to the film layer as the biometric sensor module is detached therefrom.
  • the film layer and/or the biometric sensor module may be arranged to engage with a die that interacts with a tool head during detachment of the biometric sensor module from the film layer.
  • the die may be as discussed above and may be arranged to shear through the film layer and/or parts of the biometric sensor module via a shearing movement of the tool head past the die.
  • the film layer and the biometric sensor module may hence be arranged for detachment of the biometric sensor module from the film layer via a shearing action using such a tool head and die.
  • the biometric sensor module and the pre-formed smartcard body may be arranged so that subsequent to the punching and heating step, the biometric sensor is electrically connected to the inlay and the biometric sensor module is physically connected to the pre formed smartcard body.
  • the biometric sensor module and the pre-formed smartcard body, including the inlay thereof may be arranged to be in electrical contact after the punching and heating in order to permit use of the inlay and the biometric sensor for later identification of a user of the smartcard.
  • the biometric sensor module and the pre-formed smartcard body may be arranged such that when the physical connection is made it may not be possible to remove the biometric sensor and/or the biometric sensor module without damaging at least one of the biometric sensor module, the pre-formed smartcard body, and/or the heat activated bonding material.
  • the heat activated bonding material is provided in order to couple the biometric sensor module to the pre-formed smartcard body and/or to the inlay.
  • the heat activated bonding material may be arranged provide at least one of a mechanical and an electrical connection, and advantageously may be arranged to provide both of the mechanical connection between the biometric sensor module and the pre-formed smartcard body and the electrical connection between the biometric sensor module and the inlay.
  • the heat activated bonding material includes a material provided as a heat activated film, such as a solder mask.
  • a heat activated film may be provided as a layer attached to the film layer, such that the film layer acts as a support for the heat activated film as well as supporting the biometric sensor module. In that case, the heat activated film may be attached by “prelamination” to the supporting film layer.
  • Such a heat activated film may include holes for other parts of the biometric sensor module, for example holes for a sensor array thereof.
  • a solder mask may be provided on conductive elements of the biometric sensor module, such as over contact pads for electrical connection with contact pads of the inlay.
  • Such a solder mask may comprise solder that can be melted for wetting onto adjoining materials at a temperature where no damage will occur to the biometric sensor module.
  • the heat applied may melt the solder and cause it to bond electrical contacts together, and optionally at the same time creating the main mechanical interconnection of the biometric sensor module and the pre-formed smartcard body.
  • the heat activated bonding material may be provided on at least one of the pre formed smartcard body and the biometric sensor module.
  • the heat activated bonding material may be provided on surfaces of the biometric sensor module that come into contact with complementary surfaces of the pre-formed smartcard body, which would typically be surfaces within the recess.
  • the heat activated bonding material may be provided on surfaces of the pre-formed smartcard body that come into contact with complementary surfaces of the biometric sensor module.
  • the heat activated bonding material may be provided on an inner surface of the biometric sensor module, whilst it is on the film layer.
  • the HAF when using a combination of a heat activated film (HAF) and a solder, the HAF may be applied to an inner surface of the biometric sensor module, whilst it is on the film layer, and holes may be cut in the HAF corresponding to locations of electrical contact pads of the inlay and biometric sensor module.
  • a solder paste may be applied to surfaces of the electrical contact pads of the inlay or to surfaces of the electrical contact pads of the biometric sensor module.
  • the heat activated bonding material may for example comprise a solder material or a heat activated adhesive, including possible use of conductive adhesives.
  • the heat activated bonding material may comprise a heat activated anisotropic conductive film (ACF).
  • ACF heat activated anisotropic conductive film
  • multiple heat activated materials may be provided, such as a heat activated adhesive for providing a mechanical connection and a heat activated conductive material (such as a solder) for providing an electrical connection. Where multiple types of heat activated bonding materials are present then these may be in differing forms, such as via films or via deposition of suitable materials onto relevant surfaces.
  • the inlay is embedded in the pre-formed smartcard body and may for example be placed between outer layers of the pre-formed smartcard body, such as between two outer plastic layers.
  • the inlay advantageously includes electrical contact pads for connection to the biometric sensor module.
  • the pre-formed smartcard body has been manufactured by first embedding the contact pads in a smartcard body along with the inlay, such as via lamination or other techniques; and then later forming the recess to expose the contact pads and hence provide the pre-formed smartcard body including the recess.
  • the contact pads are first fully embedded and hence are not exposed for contact to the biometric sensor module, and they are later exposed via formation of the recess.
  • a pre-formed smartcard body where the recess is by removal of material after the inlay is embedded in the pre-formed smartcard body and a pre-formed smartcard body where the recess is present before the inlay is embedded.
  • a recess that is present before the inlay is embedded will show evidence of material flowing at the edges of the recess or adjacent to the edges, whereas a recess formed by removing material after lamination will have edges comprising cuts that have been made through flowable materials of the laminated pre-formed smartcard body.
  • the pre-formed smartcard body hence may comprise a recess with cuts that have been made through such flowable materials.
  • the term inlay is intended to include any suitable electronic circuit for a smartcard, such as a flexible printed circuit board.
  • the inlay may comprise contact pads arranged for electrical connection to the biometric sensor of the biometric sensor module.
  • the recess may expose the contact pads, which may for example be at a bottom surface of the recess.
  • the number and layout of the contact pads may vary depending on the configuration of connection points in for the biometric sensor.
  • the contact pads may be copper, for example, or they may be gold or gold plated.
  • the recess may be formed via method steps as set out above and/or the pre-formed smartcard body may be formed by a method as set out above.
  • the pre-formed smartcard body may comprise first and second plastic layers with the inlay embedded between the first and second plastic layers, such as by lamination of the layers.
  • the inlay may comprise a passive inlay. That is to say, the inlay may comprise only passive components, such as resistors, capacitors, inductors and the like, and does not comprise any active electronic components, i.e. electronic components requiring electricity to operate.
  • the inlay may comprise (only) an electrically conductive trace formed on a substrate and defining a plurality of electrical contacts.
  • the pre-formed smartcard body may comprise no electronic components mounted to the inlay embedded within the pre-formed smartcard body.
  • the inlay may comprise an active inlay. That is to say, the inlay may comprise one or more active electronic components, which are encapsulated within the pre formed smartcard body.
  • the active electronic components may comprise a processor and/or a memory.
  • the inlay may include an antenna for communications with a card reader, such as an antenna for RFID type communications.
  • the inlay may include contacts for connection to a processing chip, which may comprise a processor and/or a memory, and wherein the contacts and/or the pre-formed card body may be configured to permit the processing chip to be connected to the inlay after forming of the card body, i.e. by post-placement.
  • the memory may be arranged to store biometric information relating to bearer of the smartcard and the processor may be arranged to compare the stored biometric information to biometric information acquired by the biometric sensor.
  • the processor may be arranged to determine if the user is an authorised user based on an indication provided by the biometric sensor.
  • the processor and memory may also be arranged to store and transmit other information associated with the smartcard to a reader, wherein the transmitted information does not include the stored biometric information and the biometric information acquired by the biometric sensor.
  • the processor may be arranged such that the biometric information acquired from the sensor is never transferred from the smartcard during normal operation.
  • the processor may have the general function of controlling operation of the smartcard.
  • the inlay may include a secure element for use in authorisation of financial transactions.
  • the secure element may include a processor that carries out other operations in addition to authorisation of financial transactions, for example it may be involved in authentication of biometric data from the biometric sensor.
  • any one or more of the functions of the processing chip described above may be performed by the active components of the inlay, if an active inlay is used.
  • the inlay may include multiple processors with differing functions including those set out above, such as a dedicated biometric processor for carrying out a biometric authentication process and/or a separate controller for more general control of smartcard operations.
  • the smartcard produced using the kit of parts of this aspect may be any one of: an access card; a payment card; a credit card; a debit card; a pre-pay card; a loyalty card; or an identity card.
  • the smartcard may be arranged to prevent access to protected features of the smartcard if the biometric sensor does not provide an indication of an authorised user.
  • the smartcard may provide its desired function only when the biometric information confirms that the user is authorised, or at least it may only provide a full range of functions when properly authorised.
  • the smartcard may provide authorisation for financial transactions such as contactless payments only when the user is authorised, or optionally when the biometric authorisation has been used within a certain previous time or a certain number of prior transactions.
  • the invention provides a system for manufacture of a smartcard incorporating a biometric sensor that is mounted to an inlay of the smartcard, the system comprising: a film layer upon which the biometric sensor is mounted with a biometric sensor module, the biometric sensor module comprising a sensing array and a processor; a pre-formed smartcard body comprising a recess for receiving the biometric sensor module and the inlay embedded within the pre-formed smartcard body; an alignment device for aligning the recess and the biometric sensor module on the film layer; and a mounting tool for punching the biometric sensor module out of the film layer with a portion of the mounting tool being pushed through the film layer toward the recess whilst engaging with the biometric sensor module and thereby propelling the biometric sensor module into the recess; wherein the mounting tool is configured to perform a concurrent punching and heating operation such that at least portions of the biometric sensor module are exposed to heat in order to couple the biometric sensor module to at least one of the pre-formed smartcard
  • the method of the first aspect can be implemented for production of smartcards including the steps required to quickly and efficiently mount the biometric sensor module to the pre-formed smartcard body and/or to the inlay.
  • the biometric sensor module may typically be a "surface mount technology" (SMT) type component, which in the prior art would typically be picked and placed via conventional SMT systems.
  • SMT surface mount technology
  • the current proposal differs from these SMT type systems by the use of the biometric sensor module onto a film layer, such as a film on a reel as discussed below, and by the use of a mounting tool that is arranged to perform a combined punching and heating step.
  • the system may make use of the kit of parts set out above and thus the film layer, the biometric sensor module and/or the pre-formed smartcard body may have features as discussed above in relation to the second aspect.
  • the biometric sensor and the inlay may have features as discussed above.
  • the sensor array may comprise a passive sensor array, which is cheaper to manufacture that other types of biometric sensors, such as where the sensor array is integrated as part of a capacitive CMOS silicon sensor.
  • the sensor array may comprise a first electrode layer and a second electrode layer, wherein each electrode layer comprise a plurality of parallel, electrically-isolated traces.
  • the traces of the first electrode layer may be perpendicular to the traces of the second electrode layer.
  • the sensor array may comprise a ground plate, which may comprises a layer of conductive material of substantially uniform thickness across substantially a full area of the sensor array.
  • the first electrode layer and the second electrode layer may be separated by a dielectric layer.
  • the second electrode layer may be separated by a dielectric layer.
  • the processor may be connected to the sensor array to selectively address a plurality of locations across an area of the sensor array.
  • the processor may be connected to the first electrode layer and the second electrode layer, and may be configured to independently address each of the conductive traces of the first electrode layer and of the second electrode layer.
  • the sensor array may be disposed inward of the film layer or outward of the film layer.
  • the film layer may be a reel-to-reel type film layer as is known in the art for other purposes, such as a 35 mm polyimide film.
  • the film layer may include a hole that receives parts of the sensor module, such as a hole for the sensor array or a hole for the processor.
  • the alignment device may be configured to move the film layer and/or the pre formed smartcard body into position adjacent to the mounting tool with the recess of the pre-formed smartcard body aligned with the biometric sensor module on the film layer.
  • movement of to align the biometric sensor module with the mounting tool is done by movement of the film layer as the mounting tool remains fixed in place.
  • the alignment device may include a mechanism for holding and moving the film layer. It will be appreciated that in the case of a reel-to-reel type film layer this may conveniently be done using known systems used for movement of reel-to-reel film layers in other types of sensor placement operations.
  • the system may comprise a sprocket arrangement for movement of a reel-to-reel film.
  • the alignment device may include such a sprocket arrangement.
  • the film layer may be provided as a part of a reel film that includes multiple biometric sensor modules and can hence be used during mass manufacture of smartcards via repeated use of the mounting tool whilst the film layer is moved and whilst a first pre formed smartcard body with the biometric sensor module having been attached by the mounting tool is replaced by a second pre-formed smartcard body with a recess ready to receive a further biometric sensor module.
  • the system may comprise a conveyor for moving the pre-formed smartcard bodies into alignment with the mounting tool and/or into alignment with the biometric sensor module on the film layer.
  • the alignment device may include a conveyor for moving one or more pre-formed smartcard body.
  • the system may be for manufacture of a plurality of smartcards and thus may be arranged to carry out a repeated sequence of steps comprising: alignment of a sensor module of a plurality of sensor modules with a recess of a pre-formed smartcard body of a plurality of pre-formed smartcard bodies; concurrent punching and heating using the mounting tool to mount the sensor module to the smartcard body; and use of the alignment device to move a next pre-formed smartcard body of the plurality of smartcard bodies and a next biometric sensor module of a plurality of sensor modules on the film and to bring them into alignment.
  • the alignment device may include a conveyor to bring the next pre-formed smartcard body into position, and a mechanism for movement of the film layer to bring the next biometric sensor module into position. The movement of the conveyor and the film layer may be done in parallel.
  • the mounting tool is arranged to carry out a concurrent punching and heating operation.
  • the mounting tool has the function of punching the biometric sensor module through the film layer and moving it toward the recess, and in addition the mounting tool has the function of exposing at least the portions of the biometric sensor module to heat.
  • the heat is used in order to couple the biometric sensor module to at least one of the pre-formed smartcard body and the inlay using the heat activated bonding material.
  • the mounting tool may be arranged to apply heat during punching of the biometric sensor module out of the film layer.
  • the system may be arranged to hold the mounting tool in place for a period of time after the punching stage in order to ensure that the heat activated bonding material receives sufficient heat.
  • the mounting tool may be configured to heat the biometric sensor module to a temperature of at least 100°C, and preferably between 150°C and 200°C.
  • the system may be configured to heat the biometric sensor module to this temperature for a period of at least 100ms, optionally at least 200ms, and preferably at least 300ms.
  • the system may be configured to complete the punching and heating operation within 10 seconds, optionally within 5 seconds, and preferably within 1.5 seconds.
  • the mounting tool may include a tool head with edges for detaching the biometric sensor module from the film layer, such as via cutting through the film and/or through mounting portions of the biometric sensor module.
  • the mounting tool may perform a shearing cutting action as it passes through the film layer, with the tool head of the mounting tool passing through the film layer.
  • the portion of the mounting tool that passes through the film layer may be arranged to cut through the film layer or it may pass through an opening in the film layer to punch out the biometric sensor module.
  • the cutting action may include cutting through extension portions of the biometric sensor module, such as extensions to a substrate layer of the biometric sensor module, with these extension portions then being left behind attached to the film layer as the biometric sensor module is detached therefrom.
  • the mounting tool may include a die that interacts with the tool head during detachment of the biometric sensor module from the film layer.
  • the die may be fixed in place relative to the film layer whilst the tool head may move relative to the film layer in order to detach the biometric sensor module from the film layer via interaction of the tool head with the die.
  • the die and the tool head may be arranged to shear through the film layer and/or parts of the biometric sensor module via a shearing movement of the tool head past the die.
  • the die has cutting edges surrounding a generally rectangular opening and the tool head includes complementary cutting edges for passing through the opening whilst shearing through the film layer and/or parts of the biometric sensor module.
  • the opening may have rounded corners.
  • the mounting tool acts as a source of heat during the heating operation. It may include a heater such as an electrical heater, e.g. a heating element generating heat due to electrical resistance.
  • the mounting tool may include a tool head as above with the heater being within the tool head. In alternative arrangements the mounting tool may receive heat from an outside source such as via flow of a heated fluid.
  • the mounting tool may be arranged for heat retention in a section of the tool that can exchange heat with the biometric sensor module during the punching and heating operation, such as in the portion of the tool that passes through the film layer, which may be the tool head discussed above. Heat retention may be used to ensure quicker heating during the combined punching and heating operation and for repeated use in production line.
  • the tool may be provided with a suitable heat mass, e.g. a solid metal body of sufficient size, to ensure that sufficient heat can be provided to the biometric sensor module within a relatively short time period.
  • the mounting tool may include one or more temperature sensor(s) for measuring the temperature of the tool and/or of the biometric sensor module in order to allow for monitoring and/or control of the tool temperature or the temperature of the biometric sensor module during the punching and heating operation.
  • the concurrent punching and heating step provides for both of a mechanical and an electrical connection of the biometric sensor module to the pre-formed smartcard body.
  • the biometric sensor may be electrically connected to the inlay in order to permit use of the inlay and the biometric sensor together for later identification of a user of the smartcard.
  • the biometric sensor module may be physically connected to the pre-formed smartcard body, for example it may not be possible to remove the biometric sensor and/or the biometric sensor module without damaging at least one of the biometric sensor module, the pre formed smartcard body, and/or the heat activated bonding material.
  • the heat activated bonding material is used to couple the biometric sensor module to at least one of the pre-formed smartcard body and the inlay.
  • the heat activated bonding material may provide at least one of a mechanical and an electrical connection, and advantageously may be used to provide both of the mechanical connection between the biometric sensor module and the pre-formed smartcard body and the electrical connection between the biometric sensor module and the inlay.
  • the heat activated bonding material includes a material provided as a heat activated film, such as a solder mask.
  • a heat activated film may be provided as a layer attached to the film layer, such that the film layer acts as a support for the heat activated film as well as supporting the biometric sensor module. In that case, the heat activated film may be attached by “prelamination” to the supporting film layer.
  • Such a heat activated film may include holes for other parts of the biometric sensor module, for example holes for a sensor array thereof.
  • a solder mask may be provided on conductive elements of the biometric sensor module, such as over contact pads for electrical connection with contact pads of the inlay.
  • Such a solder mask may comprise solder that can be melted for wetting onto adjoining materials at a temperature where no damage will occur to the biometric sensor module.
  • the system may be arranged such that heat from the mounting tool will melt the solder and cause it to bond electrical contacts together, and optionally at the same time create the main mechanical interconnection of the biometric sensor module and the pre-formed smartcard body.
  • the heat activated bonding material may be provided on at least one of the pre formed smartcard body and the biometric sensor module.
  • the heat activated bonding material may be provided on surfaces of the biometric sensor module that come into contact with complementary surfaces of the pre-formed smartcard body, which would typically be surfaces within the recess.
  • the heat activated bonding material may be provided on surfaces of the pre-formed smartcard body that come into contact with complementary surfaces of the biometric sensor module.
  • the heat activated bonding material may be [preferred locations?]
  • the heat activated bonding material may for example comprise a solder material or a heat activated adhesive, including possible use of conductive adhesives.
  • Multiple heat activated materials may be used, such as an adhesive for providing a mechanical connection and conductive material (such as a solder) for providing an electrical connection. Where multiple types of heat activated bonding materials are used then these may be provided in differing forms, such as via films or via deposition of suitable materials onto relevant surfaces.
  • the inlay is embedded in the pre-formed smartcard body and may for example be placed between outer layers of the pre-formed smartcard body, such as between two outer plastic layers.
  • the inlay advantageously includes contact pads for connection to the biometric sensor module.
  • the pre-formed smartcard body has been manufactured by first embedding the contact pads in a smartcard body along with the inlay, such as via lamination or other techniques; and then later forming the recess to expose the contact pads and hence provide the pre-formed smartcard body including the recess.
  • the contact pads are first fully embedded and hence are not exposed for contact to the biometric sensor module, and they are later exposed via formation of the recess.
  • the system may be arranged to perform the embedding steps and thus may comprise a laminator for laminating a core to form a pre-formed smartcard body with the inlay embedded therein.
  • the system may further be arranged to form the recess, as discussed below.
  • the system may receive the pre-formed smartcard body with the inlay and (optionally) the recess already present.
  • a pre-formed smartcard body where the recess is by removal of material after the inlay is embedded in the pre-formed smartcard body and a pre-formed smartcard body where the recess is present before the inlay is embedded.
  • a recess that is present before the inlay is embedded will show evidence of material flowing at the edges of the recess or adjacent to the edges, whereas a recess formed by removing material after lamination will have edges comprising cuts that have been made through flowable materials of the laminated pre-formed smartcard body.
  • the pre-formed smartcard body hence may comprise a recess with cuts that have been made through such flowable materials.
  • the term inlay is intended to include any suitable electronic circuit for a smartcard, such as a flexible printed circuit board.
  • the inlay may comprise contact pads arranged for electrical connection to the biometric sensor of the biometric sensor module.
  • the recess may expose the contact pads, which may for example be at a bottom surface of the recess.
  • the number and layout of the contact pads may vary depending on the configuration of connection points in for the biometric sensor.
  • the contact pads may be copper, for example, or they may be gold or gold plated.
  • the recess may be formed by removing material from the pre-formed smartcard body and optionally the system may be arranged to carry out this step.
  • the system may comprise a milling device for forming the recess, such as a precision end mill or a laser mill.
  • the recess may be formed using “drill and mill” techniques that known for other purposes in relation to smartcard manufacture.
  • the depth of the removal of material is arranged to end just at the level of the contact pads within the pre-formed smartcard body, such that the contact pads are exposed.
  • the system may optionally be arranged to form the pre-formed smartcard body by a method comprising: providing a first plastic layer; providing the inlay on the first plastic layer, the inlay having the contact pads for connection to the biometric sensor of the biometric sensor module; providing a second plastic layer on the first plastic layer with the inlay interposed between the first plastic layer and the second plastic layer; laminating the first plastic layer and the second plastic layer to form the pre-formed smartcard body; and then removing material to form the recess of the pre-formed smartcard body.
  • the laminating may be performed at a temperature of at least 135°C and/or a pressure of at least 5 MPa, and is optionally performed at a temperature of at least 150°C and/or a pressure of at least 6.5 MPa. However, other temperatures and pressure ranges may be suitable.
  • additional layers may be provided above and/or below the first and second layers prior to lamination.
  • the inlay may comprise a passive inlay. That is to say, the inlay may comprise only passive components, such as resistors, capacitors, inductors and the like, and does not comprise any active electronic components, i.e. electronic components requiring electricity to operate.
  • the inlay may comprise (only) an electrically conductive trace formed on a substrate and defining a plurality of electrical contacts.
  • the pre-formed smartcard body may comprise no electronic components mounted to the inlay embedded within the pre-formed smartcard body.
  • the inlay may comprise an active inlay. That is to say, the inlay may comprise one or more active electronic components, which are encapsulated within the pre formed smartcard body.
  • the active electronic components may comprise a processor and/or a memory.
  • the inlay may include an antenna for communications with a card reader, such as an antenna for RFID type communications.
  • the inlay may include contacts for connection to a processing chip, which may comprise a processor and/or a memory, and wherein the contacts and/or the pre-formed card body may be configured to permit the processing chip to be connected to the inlay after forming of the card body, i.e. by post-placement.
  • the memory may be arranged to store biometric information relating to bearer of the smartcard and the processor may be arranged to compare the stored biometric information to biometric information acquired by the biometric sensor.
  • the processor may be arranged to determine if the user is an authorised user based on an indication provided by the biometric sensor.
  • the processor and memory may also be arranged to store and transmit other information associated with the smartcard to a reader, wherein the transmitted information does not include the stored biometric information and the biometric information acquired by the biometric sensor.
  • the processor may be arranged such that the biometric information acquired from the sensor is never transferred from the smartcard during normal operation.
  • the processor may have the general function of controlling operation of the smartcard.
  • the processing chip may include a secure element for use in authorisation of financial transactions.
  • the secure element may include a processor that carries out other operations in addition to authorisation of financial transactions, for example it may be involved in authentication of biometric data from the biometric sensor.
  • any one or more of the functions of the processing chip described above may be performed by the active components of the inlay, if an active inlay is used.
  • the inlay may include multiple processors with differing functions including those set out above, such as a dedicated biometric processor for carrying out a biometric authentication process and/or a separate controller for more general control of smartcard operations.
  • the smartcard produced by the above system may be any one of: an access card; a payment card; a credit card; a debit card; a pre-pay card; a loyalty card; or an identity card.
  • the smartcard may be arranged to prevent access to protected features of the smartcard if the biometric sensor does not provide an indication of an authorised user.
  • the smartcard may provide its desired function only when the biometric information confirms that the user is authorised, or at least it may only provide a full range of functions when properly authorised.
  • the smartcard may provide authorisation for financial transactions such as contactless payments only when the user is authorised, or optionally when the biometric authorisation has been used within a certain previous time or a certain number of prior transactions.
  • the invention extends to a smartcard produced using the method of the first aspect, produced from the kit of parts of the second aspect, and/or produced using the system of the third aspect.
  • a smartcard may include features of the pre-formed smartcard body as discussed above as well as features of the biometric sensor module as discussed above.
  • the smartcard may, for example, comprise cut-offs from the film layer and/or cuts through the biometric sensor module that result from the punching step.
  • Figure 1 shows a biometrically-authorisable smartcard
  • Figure 2 is a schematic diagram showing a partially cut-away side view of a pre formed smartcard body of the smartcard with a recess formed to receive a biometric sensor module;
  • Figure 3 is a schematic diagram showing a partially cut-away plan view of the smart card of Figure 2;
  • Figure 4 is a schematic diagram showing a biometric sensor being inserted into the smart card of Figure 2
  • Figure 5 is a schematic diagram showing a biometric sensor assembled into the smartcard body of Figure 2;
  • Figure 6 shows a plurality of biometric sensor modules mounted on a film layer
  • Figures 7 to 10 show various examples for a biometric sensor module mounted to a film layer
  • Figure 11 shows a system for incorporating the biometric sensor module into a pre formed smartcard body similar to that of Figure 2;
  • Figure 12 is another view of the system of Figure 11 with the biometric sensor module placed into the recess of the pre-formed smartcard body;
  • Figure 13 shows a detailed view of the biometric sensor module of Figure 9.
  • Figure 14 shows a detailed view of the biometric sensor module of Figure 10..
  • a fingerprint-authorisable smartcard 102 configured to operate as a payment card will now be described with reference to Figure 1.
  • the smartcard 102 comprises a laminated smartcard body 140 incorporating an integral, on-board fingerprint sensor 130 as a biometric sensor.
  • An exemplary technique for manufacturing such a smartcard body 140 is described in WO 2013/160011 A1.
  • the smartcard body 140 preferably has a width of about 86 mm, a height of about 54 mm and a thickness of about 0.76 mm, i.e. such that it conforms to typical credit card dimensions, although in some embodiments the thickness may be increased to accommodate the fingerprint sensor 130. More generally the smartcard 102 may be an ID-1 identification card in accordance with ISO 7810.
  • the fingerprint sensor 130 is an area fingerprint sensor 130, and is mounted within the smartcard body 140 so as to be exposed from and substantially flush with a surface of the smartcard body 140.
  • the fingerprint sensor 130 is positioned so as to be convenient for a user of the card to present a finger (commonly their thumb) to the fingerprint sensor 130 whilst holding the smartcard 102. Due to power and size constrains, the fingerprint sensor 130 is typically smaller than an average finger.
  • biometric authorisation i.e. verification of the identity of the user by matching a presented biometric identifier to stored reference biometric data.
  • biometric authorisation will be discussed later in greater detail.
  • the smartcard 102 is configured to perform the biometric authorisation within a secure memory of the smartcard 102, i.e. such that the user’s biometric data (both the scanned data and the reference data) is never transmitted off of the smartcard 102.
  • the smartcard 102 may provide an indication of successful authorisation using a suitable indicator, such as a first LED 136.
  • the smartcard body 140 houses a fingerprint-processing module for providing biometric authorisation by verification of the identity of the user of the smartcard 102 based on a fingerprint captured by the fingerprint sensor 130.
  • the fingerprint-processing module includes a memory storing one or more reference fingerprint templates.
  • the memory of the smartcard 20 is commonly a solid-state, non volatile memory, such as Flash memory.
  • the fingerprint templates are generated and stored in the memory of the fingerprint-processing module by an enrolment process, which will be discussed later in greater detail.
  • the fingerprint-processing module is arranged to receive a scanned fingerprint of a finger or thumb presented to the fingerprint sensor 130 and to compare the scanned fingerprint to pre-stored, reference fingerprint data, which may comprise a plurality of reference fingerprint templates. A determination is then made as to whether the scanned fingerprint matches the reference fingerprint data.
  • the fingerprint-processing module takes appropriate action depending on its programming. In this example, if there is a match with the reference fingerprint data, then then the fingerprint-processing module instructs a secure element of the smartcard 102 to authorise a payment.
  • the fingerprint processing module may be a virtual module incorporated within the secure element of the smartcard 102, such as within a smartcard chip 120 of the smartcard 102..
  • the smartcard 102 includes a wireless communications interface comprising a tuned circuit that is tuned to receive an RF signal from the card reader, for example using near field communication (NFC) in the case of a payment card.
  • the tuned circuit typically comprises an antenna coil and tuning capacitor.
  • the smartcard 102 may communicate with a card reader via the wireless communications interface, for example to transmit the payment authorisation in the example above.
  • the wireless communications interface transmits data using a switch, such as a transistor, that is connected across the antenna coil. By switching on and off the transistor, a signal can be transmitted by the smartcard 102 and decoded by suitable control circuits within the card reader. This type of signalling is known as backscatter modulation and is characterised by the fact that the reader is used to power the return message to itself.
  • the wireless communications interface is further configured to harvest energy when the smartcard 102 is exposed to a radio-frequency excitation field, such as that generated by the card reader, in order to power the components of the smartcard 102, for example including the fingerprint sensor 130, the fingerprint-processing module and the secure element.
  • a radio-frequency excitation field such as that generated by the card reader
  • the smartcard 102 does not include a battery. Consequently, the components of the smartcard 102 are powered only by the energy harvested from the excitation field.
  • battery-powered smartcards may be provided that have the same features as described. With these alternatives the smartcard 102 can have the same features aside from that the use of harvested power may be supplemented or replaced by the power from a battery that is contained within the smartcard body 140.
  • Smartcards are generally of a similar size to a conventional credit card and have a similar look and feel.
  • Conventional credit cards are manufactured in accordance with international standard ID-1 of ISO/IEC 7810, that is to say having dimensions of 3 inches by 2 Vs inches (approx. 86 mm by 54 mm) and a thickness of 30 mil (approx. 0.75 mm).
  • the smartcard may be thicker than a conventional credit card in order to accommodate the biometric sensor 130.
  • Figure 2 is a schematic diagram showing a partially cut-away side view of a pre formed smartcard body 140 for a non-contact smartcard 102 including a biometric sensor 130.
  • the smartcard 102 comprises the smartcard body 140, which in the diagram of Figure 2 is a pre-formed smartcard body 140.
  • the pre-formed smartcard body 140 encases an inlay 30.
  • the inlay 30 is in the form of a printed circuit board, which comprises a copper trace formed on a PVC substrate.
  • the substrate may be made from poly amide or FR-4 grade glass-reinforced epoxy laminate.
  • the inlay 30 is embedded (e.g. via lamination) between at least two layers of plastic.
  • the at least two layers of plastic include a first layer of plastic and a second layer of plastic with the inlay 30 sandwiched between the first and second layers.
  • the layers of plastic are typically made of PVC; however, other plastics may be used. Examples of other suitable plastics include polyester, acrylonitrile-butadiene-styrene (ABS), and any other suitable plastic. Additionally, plasticisers or dyes may be added to the plastic to achieve a desired look and feel.
  • the smartcard 102 may be produced by a hot lamination method, for example as described in US 6586078.
  • a suitable hot lamination method could comprise the following steps: forming a core by providing first and second layers of plastic and positioning the inlay 30 between the first and second layers of plastic to thus form the core; placing the core in a laminator; applying a heat cycle to the core in the laminator to liquefying or partially liquefying the layers of plastic, the heat cycle operating at a temperature of between 135°C and 250°C; increasing a laminator ram pressure in combination with the heat to a pressure of approximately 6.5 MPa; applying a cooling cycle to the core in the laminator with an associated increase in ram pressure of approximately 25% until the core has cooled to approximately 5°C to 20°C; and removing the core from the laminator.
  • processing techniques may include inking, the formation of an overlaminate film, or the like.
  • FIG 3 shows a partially cut-away plan view of the smartcard body of Figure 2 with some of the internal components shown.
  • An antenna 34 is provided on the inlay 30 and this comprises the antenna coil discussed above, which is used for power harvesting and for contactless communications.
  • the antenna 34 is used to communicate with a card reader, which is external to the smartcard 102.
  • the antenna 34 may be formed by etching a suitable pattern onto a copper cladding of the printed circuit board.
  • the inlay 30 may in some embodiments include a number of additional components 36, such as active electronic components. These may include a processor and a memory as discussed above.
  • the additional components 36 may, in some embodiments, include a battery which is configured to power the memory and processor. Alternatively, or in addition to the battery and/or harvested power obtained via the antenna 34, the smartcard may be arranged to be powered via a contact pad external to the smartcard 102.
  • the biometric sensor 130 is of the area fingerprint type.
  • An example of a suitable fingerprint biometric sensor 130 is the FPC1321 biometric fingerprint sensor, manufactured by Fingerprint Cards AB of Sweden.
  • the biometric sensor 130 includes a sensor side and a contact side, preferably on opposing sides of the biometric sensor 130.
  • On the sensor (external) side of the biometric sensor 130 is a sensor area, which can be a surface generally aligned with the surface of the smartcard 102 (note that the thickness of the sensor 130 is exaggerated in the Figures).
  • the sensor area can be protected with a protective coating as discussed below with reference to Figures 6 and 7.
  • a contact area including an array of at least two contacts 45 for electrical connection of the biometric sensor 130 to the components of the smartcard 102 via the inlay 30.
  • a recess (or cavity) 50 is formed to receive the biometric sensor 130, which can be incorporated into a biometric sensor module.
  • the smartcard includes the pre-formed smartcard body 140 in which the inlay 30 is embedded.
  • Contacts 32 are provided in the inlay 30 and are arranged to align with the contacts 45 on the biometric sensor 130, when the biometric sensor 130 is in place.
  • the contacts are preferably conductive pads.
  • the recess 50 is formed in the pre-formed smartcard body 140 to expose the contacts 32 in the inlay 30.
  • the recess 50 is formed on an upper surface of the pre-formed smartcard body 140 and is sized substantially in conformity with the shape of the biometric sensor 130, such that the biometric sensor 130 (or biometric sensor module) will just fit within the recess 50.
  • the recess 50 can be milled into the surface of the pre-formed smartcard body 140 using a precision end mill or, more preferably, a laser mill.
  • the depth of the milling is set so that the base of the recess 50 is at the level of the inlay 30 within the card body 140, such that the contacts 32 are exposed.
  • the inlay 30 of the smartcard 102 may include further contacts configured for attachment to a smartcard chip 120.
  • the smartcard chip 120 comprises a secure element mounted behind a contact plate for communication with a card reader.
  • the secure element includes a memory and processor (not shown).
  • the memory is arranged to store biometric information relating to a bearer of the smartcard 102 and the processor is arranged to compare the biometric information stored on the memory to biometric information acquired by the biometric sensor 30 and communicated to the contacts 32 of the inlay 30.
  • the processor is therefore arranged to determine if the user is an authorised user based on an indication provided by the biometric sensor. This functionality may alternatively be provided by a memory and processor provided on the inlay 30, as described with reference to Figure 2.
  • FIGS 4 and 5 show the biometric sensor 130 being inserted into the smartcard body 140. In example embodiments this is done using a system as described further below with reference to Figures 10 and 11 and thus there is a film layer supporting the biometric sensor 130 prior to mounting into the recess 50.
  • the biometric sensor 130 is aligned with the recess 50 and pushed into the recess 50, using a force F along with heat from a mounting tool as discussed below, such that the contacts 45 on the biometric sensor 130 and the contacts 32 in the inlay 30 are brought into electrical contact via a heat activated bonding material 214.
  • the magnified area of Figure 4 shows a contact junction between the contacts 45 on the biometric sensor 130 and the contacts 32 in the inlay 30.
  • heat activated bonding material 214 is applied to the surface of the contacts 32 in the inlay 30 prior to the biometric sensor 130 being inserted.
  • This may be a solder material or a heat activated conductive epoxy, including a heat curable conductive epoxy.
  • interior walls 54 of the cavity are coated with an adhesive epoxy 56 prior to the biometric sensor 130 being inserted.
  • the addition of an adhesive epoxy 56 may be used to seal the biometric sensor 130 in place and add to the mechanical strength of the coupling between the sensor 130 and the smartcard body 140 to prevent the biometric sensor 130 from becoming dislodged and becoming disconnected from the contacts 32 of the electronic circuit 30.
  • Figure 6 shows a plurality of biometric sensor modules mounted to a film layer
  • Figures 7 to 10 show various examples for the structure of the biometric sensor modules.
  • a film layer 200 includes a plurality of biometric sensor modules. This enables them to be punched out and mounted in sequence to a corresponding plurality of pre-formed smartcard bodies 140.
  • the biometric sensor module includes a protective coating 202 and bezel 204 on the upper (external) surface of the film layer 200 and on the external side of the fingerprint sensor 130.
  • the protective coating 202 protects the sensing side of the fingerprint sensor 130 and the bezel 204 can be used for an electrical connection to the user's finger whilst fingerprint data is being acquired.
  • a hole (not shown in detail) is provided through the film layer 200. The hole extends over the sensing area of the fingerprint sensor 130.
  • a sensor array 206 along with passive parts 212 of the fingerprint sensor 130 extend from the lower (internal) surface of film layer 200.
  • the arrangement of the sensor array 206 and passive parts 212 of this example may be similar to those of Figure 9.
  • This part of the biometric sensor module may also include a processor 216 used during the biometric authentication process, for example an integrated circuit for the fingerprint sensor 130.
  • the biometric sensor module also includes contact pads 45 on the lower side. These contact pads 32 are for making an electrical contact with contact pads 32 of the smartcard body 140 in a way similar to that discussed above. It will be noted that there is no encapsulation of the sensor array 206.
  • the fingerprint sensor 130 is of a type that does not require a bezel.
  • the protective coating 202 can extend over the full extent of the opening in the film layer 200, and covers the entirety of the exposed sensor area once the biometric sensor module is mounted to the pre-formed smartcard body 140.
  • the biometric sensor module of Figure 8 includes a sensor array 206 and passives 212 at the lower side of the film layer 200, along with contact pads 45.
  • Figure 9 shows a further alternative configuration, where the fingerprint sensor 130 does not require a bezel and a border of the sensor area is provided by a polyimide stiffener or “dam” 218 that borders the protective coating 202.
  • the polyimide stiffener 218 is used during manufacture of the biometric sensor module to contain the protective coating 202 as it is deposited. It is removed along with the outer parts of the film layer 200 as the biometric sensor module is detached from the film layer 200 by the mounting tool 208, 210.
  • the main parts of the fingerprint sensor 130 including the sensor array 206 and passives 212 are mounted to the lower side of the film layer 200.
  • Figure 9 differs in relation to the location of the contact pads 45.
  • Figure 9 further includes a layer of heat activated bonding material 214 extending over a lower surface of the film layer in an area around the outside border of the sensor array 206.
  • This may be an adhesive for a physical connection of the biometric sensor module to the pre-formed smartcard body 140.
  • a pre-formed smartcard body 140 for receiving the biometric sensor module of Figure 9 would have a recess 50 and inlay 30 of a different geometry to a pre formed smartcard body 140 for receiving the biometric sensor module of Figure 7.
  • the inlay 30 would differ in relation to the location of the contact pads 32 and the recess 50 may have a different form to mirror the form of the lower parts of the biometric sensor module.
  • FIG. 10 A further alternative possibility is shown in Figure 10.
  • the main parts of the biometric sensor module are topside of the film layer 200, i.e. at the opposite side of the film layer 200 to the location of the pre-formed smartcard body 140 during installation of the biometric sensor module.
  • the protective coating 202 as well as the sensor array 206 are topside of the film layer 200.
  • the passives 212 as well as the processor 216 extend through the thickness of the film layer 200, which is provided with holes for that purpose.
  • the electrical contact pads 45 for the fingerprint sensor are beneath the film layer 200 and are coupled to electrical contacts at the sensor array 206 using vias extending through the film layer 200.
  • the film layer 200 and/or parts of the biometric sensor module can include a layer of heat activated bonding material 214 used for forming an electrical connection for the contact pads 45, as shown in Figures 11 and 12 for example. This is described further below.
  • the film layer 200 is coupled to the fingerprint sensor 130 and extends beneath a part of the outer surface, e.g. beneath a part of the bezel 204 of Figure 7 or beneath a part of the protective coating of Figures 8, 9 and 10.
  • the hole in the film layer 200 through which parts of the biometric sensor module fit is slightly smaller than the full extent of biometric sensor module.
  • a part of the film layer 200 is cut off and remains with the fingerprint sensor 130 when it is mounted in the pre-formed smartcard body 140. It will be appreciated that the exact form of the biometric sensor module may vary depending on the form of the fingerprint sensor 130.
  • the film layer 200 is a reel-to-reel type film layer 200 and may be a 35 mm polyimide film, with sprocket holes on one or both sides of the reel.
  • the sprocket holes engage with a sprocket arrangement to allow for manipulation of the film layer 200, and in particular for alignment of the biometric sensor module with the recess 50 of a pre-formed smartcard body 14 as in Figure 11.
  • Figure 11 shows a system for incorporating a biometric sensor module, such as the module of Figure 7 or Figure 8, into a pre-formed smartcard body 140.
  • the pre-formed smartcard body 140 can be similar to that of Figure 2. It includes an inlay 30 embedded within the smartcard body 140 with contact pads 45 for coupling the biometric sensor module to the inlay 30 in order to incorporate a biometric authentication functionality in the smartcard 102.
  • a recess 50 is provided in the pre-formed smartcard body 140 for receiving the biometric sensor module. This recess 50 is advantageously formed by removal of material after the inlay 30 is embedded in the pre-formed smartcard body 140, and this may be done by a method as described above.
  • Figure 12 is another view of the system of Figure 11 with the biometric sensor module placed into the recess 50 of the pre-formed smartcard body 140 through action of a mounting tool comprising a tool head 208 and a tool die 210.
  • This mounting tool 208, 210 is described in further detail below.
  • the film layer 200 is provided as a part of a reel film that includes multiple biometric sensor modules and can hence be used during mass manufacture of smartcards via repeated use of the mounting tool 208, 210 whilst the film layer 200 is moved, e.g. by winding of the reels, and pre-formed smartcard bodies 140 are presented to the mounting tool 208, 210 in alignment with the biometric sensor modules. This may be done using a conveyor system.
  • a heat activated bonding material 214 is provided as a layer 214 attached to the film layer 200 as shown in Figure 11.
  • the film layer 200 hence acts as a support for the heat activated bonding material 214 as well as supporting the biometric sensor module.
  • the layer of heat activated material 214 can be attached by “prelamination” to the supporting film layer 200, and in this example it takes the form of a solder mask with holes for relevant parts of the biometric sensor module.
  • the solder mask 214 comprises solder that can be melted for wetting onto adjoining materials at a temperature where no damage will occur to the biometric sensor module.
  • the heat from the tool head 208 of the mounting tool can melt the solder and cause it to bond the electrical contact pads 32, 45 together, and at the same time it can create the main mechanical interconnection of the biometric sensor module and the pre-formed smartcard body 140.
  • the mounting tool 208, 210 performs the concurrent punching and heating operation to achieve this electrical and mechanical connection.
  • the tool head 208 has the function of punching the biometric sensor module through the film layer 200 and moving it toward the recess 50, whilst interaction between the tool head 208 and the die 210 results in shearing of the film layer 200 to detach the biometric sensor module from the film layer.
  • an offcut of the film layer 200 then remains with the fingerprint sensor 130 when the biometric sensor module is mounted in the pre-formed smartcard body 140, as shown in Figure 12.
  • the tool head 208 also provides heat in order to expose the heat activated bonding material 214 to heat and activate it to complete the mounting process.
  • the solder mask 214 is exposed to sufficient heat to melt the solder and cause it to bond the biometric sensor module to the pre-formed smartcard 140, creating an electrical connection between the fingerprint sensor 130 and the inlay 30 via the contact pads 32, 45.
  • the tool head applies heat during punching of the biometric sensor module out of the film layer 200 and can remain held in place in the configuration shown in Figure 8 for a period of time after the punching stage. This may be done in order to ensure that the heat activated bonding material receives sufficient heat.
  • the bezel 204 when present, may be used to receive and to transmit forces and to conduct heat from the tool head 208 toward the heat activated bonding material 214.
  • the tool head 208 includes edges for detaching the biometric sensor module from the film layer 200 via cutting through the film layer 200 as shown.
  • the tool head hence passes through the film layer and propels biometric sensor module into the recess 50.
  • the tool die 210 interacts with the tool head 208 during detachment of the biometric sensor module from the film layer 200.
  • the tool die 210 is fixed in place relative to the film layer 200 and the pre-formed smartcard body 140, whilst the tool head 208 moves relative to the film layer 200 in order to detach the biometric sensor module.
  • the tool head 208 of the mounting tool acts as a source of heat during the punching and heating operation.
  • An electrical heater can be included within the tool head 208 and the tool head 208 can be arranged for heat retention in a section that can exchange heat with the biometric sensor module during the punching and heating operation.
  • the tool head 208 can have a solid metal body of sufficient size to ensure that sufficient heat can be provided to the biometric sensor module within a relatively short time period.
  • Temperature sensors are provided for measuring the temperature of the tool and/or of the biometric sensor module in order to allow for monitoring and/or control of temperature during the punching and heating operation.
  • the system shown in Figures 11 and 12 can be used for mass manufacture of a plurality of smartcards 102.
  • the film layer 200 may be provided as a part of a reel film that includes a plurality of biometric sensor modules with multiple fingerprint sensors.
  • the system can be provided with a similar plurality of pre-formed smartcard bodies 140.
  • Mass manufacture of smartcards can be permitted via repeated use of the mounting tool 208, 210 whilst (i) the film layer 200 is moved to bring a new biometric sensor module into alignment after the preceding biometric sensor module has been attached to a smartcard body 140; and (ii) a new pre-formed smartcard body is presented for alignment with the mounting tool 208, 210 by a conveyor system or similar, with the preceding pre-formed smartcard body 140 being moved away (along with the preceding biometric sensor module having been attached by the mounting tool 208.
  • the system may hence perform a repeated sequence of steps comprising alignment of a biometric sensor module and a recess 50 via movement of the film layer 200 and the conveyor; concurrent punching and heating to mount the biometric sensor module to the smartcard body 140 using the tool head 208; and parallel movement of the conveyor and the film layer 200 in order to bring the next pre-formed smartcard body 140 and the next biometric sensor module into position.
  • FIGS 13 and 14 show details of the biometric sensor modules of Figures 9 and 10, respectively, after having been separated from their respective film layers 200.
  • the biometric sensor modules each comprise a sensing array 206, passive components 212, and a processor 216.
  • the sensing array 206 is a passive component formed as a plurality of electrically conductive layers comprising a first electrode layer 302, a second electrode layer 304 and a ground plate 306.
  • the electrode layers 302, 304 each comprise a plurality of parallel, electrically-isolated traces.
  • the traces of the first electrode layer 302 are perpendicular to the traces of the second electrode layer 304.
  • the ground plate 306 comprises a layer of conductive material of substantially uniform thickness across substantially the full area of the sensor array 306.
  • the traces of the electrode layers 302, 304 and the ground plate 306 are typically each formed from copper, but other conductive materials may be used for one or more of these layers 302, 304, 306.
  • the electrode layers 302, 304 and ground plate 306 are interspaced between respective dielectric layers 308, 310, 312, 314.
  • a first dielectric layer is formed above (on the external side of) the first electrode layer 302
  • a second dielectric layer is formed between the first and second electrode layers 302, 304
  • a third dielectric layer is formed between the second electrode layer 304 and the ground plate 306, and
  • a fourth dielectric layer 314 is formed below (on the internal side of) the ground plate 306.
  • the dielectric layers 308, 310, 312, 314 in this example are formed from FR-4, which is a woven, glass-reinforced epoxy laminate material.
  • FR-4 is a woven, glass-reinforced epoxy laminate material.
  • other materials can be used for the formation of any one or more of these layers 308, 310, 312, 314, such as FR-2, FR-5, Teflon®, polyamide.
  • the first dielectric layer 308 is connected to the underside of the film layer 200 by an adhesive layer 214.
  • the film layer 200 may comprise a hole formed above the sensor die 216.
  • a protective coating 202 may be applied above the film layer 200 to protect the sensor die 206.
  • the processor 216 and passive components 212 are connected to the underside (inner side, in use) of the sensor die 206.
  • the electrode layers 302, 304 are both electrically connected to the processor 216, such that each trace of the electrode layers 302, 304 is individually addressable by the processor 216.
  • the processor 216 can selectively address an array of locations across the area of the sensor die 206.
  • the processor 216 is also electrically connected to the contacts 45 of the sensor module.
  • a solder mask 316 is formed on the underside of the sensor die 206, so as to constrain solder applied to the contacts 45.
  • the solder mask 316 may be formed between the sensor die 206 and the passives 212 and processor 216.
  • the sensing array 206 has substantially the same constructions as the sensing array 206 shown in Figure 13.
  • it comprises first and second electrode layers 302, 304 and a ground plate 306 interspaced between respective dielectric layers 308, 310, 312, 314.
  • the sensor array 206 and processor 216 operate substantially as described above with reference to Figure 13.
  • the sensing array 206 is formed above the film layer 200.
  • the protective coating 202 is formed directly on the first dielectric layer 308 of the sensor array 206. Holes are cut in the film layer 200 to receive the passive components 212 and processor 216 of the
  • the contacts 45 of the biometric sensor module are formed on the underside of the film layer 200.
  • the contacts 45 are connected by electrically- conductive vias through the film layer 200 to internal contacts 345 formed on the underside of the sensor array 206.
  • the internal contacts 345 in this embodiment are the same as the contacts 45 on the underside of the sensor array 206 shown in Figure 13.

Abstract

La présente invention concerne une carte à puce (102) qui comprend un capteur biométrique (130) destiné à être monté sur un insert (30) de la carte à puce (102). Elle est réalisée conformément à un procédé de fabrication en utilisant un corps de carte à puce préformé (140) et une couche de film (200) sur laquelle le capteur biométrique (130) est monté avec un module de capteur biométrique. L'insert (30) est incorporé dans le corps de carte à puce préformé (140) et le corps de carte à puce préformé (140) comprend un évidement (50) destiné à recevoir le module de capteur biométrique. Le procédé comprend les étapes consistant à : aligner l'évidement (50) et le module de capteur biométrique sur la couche de film (200) ; et à l'aide d'un outil de montage (208, 210), poinçonner le module de capteur biométrique à partir de la couche de film (200) avec une portion (208) de l'outil de montage poussée à travers la couche de film (200) vers l'évidement (50) tout en étant en prise avec le module de capteur biométrique et propulsant ainsi le module de capteur biométrique dans l'évidement (50). L'outil de montage (208, 210) réalise une opération de poinçonnage et de chauffage simultanés, de sorte qu'au moins des portions du module de capteur biométrique sont exposées à la chaleur afin de coupler le module de capteur biométrique à au moins l'un parmi le corps de carte à puce préformé (140) et l'insert (30) en utilisant un matériau de liaison thermo-activé (214).
PCT/EP2022/063576 2021-05-21 2022-05-19 Fabrication d'une carte à puce WO2022243432A1 (fr)

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US202163191409P 2021-05-21 2021-05-21
US63/191,409 2021-05-21
GB2107888.6A GB2607113A (en) 2021-05-21 2021-06-02 Manufacturing a smartcard
GB2107888.6 2021-06-02

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Cited By (1)

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WO2024049340A1 (fr) * 2022-08-29 2024-03-07 Fingerprint Cards Anacatum Ip Ab Dispositif d'imagerie biométrique et procédé de fabrication de dispositif d'imagerie biométrique

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