WO2022239361A1 - Unité d'alimentation électrique pour dispositif de génération d'aérosol - Google Patents

Unité d'alimentation électrique pour dispositif de génération d'aérosol Download PDF

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Publication number
WO2022239361A1
WO2022239361A1 PCT/JP2022/007388 JP2022007388W WO2022239361A1 WO 2022239361 A1 WO2022239361 A1 WO 2022239361A1 JP 2022007388 W JP2022007388 W JP 2022007388W WO 2022239361 A1 WO2022239361 A1 WO 2022239361A1
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WIPO (PCT)
Prior art keywords
switch
power supply
terminal
voltage
supply unit
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PCT/JP2022/007388
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English (en)
Japanese (ja)
Inventor
達也 青山
拓嗣 川中子
徹 長浜
貴司 藤木
亮 吉田
Original Assignee
日本たばこ産業株式会社
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Application filed by 日本たばこ産業株式会社 filed Critical 日本たばこ産業株式会社
Publication of WO2022239361A1 publication Critical patent/WO2022239361A1/fr

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    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/40—Constructional details, e.g. connection of cartridges and battery parts
    • A—HUMAN NECESSITIES
    • A24—TOBACCO; CIGARS; CIGARETTES; SIMULATED SMOKING DEVICES; SMOKERS' REQUISITES
    • A24F—SMOKERS' REQUISITES; MATCH BOXES; SIMULATED SMOKING DEVICES
    • A24F40/00—Electrically operated smoking devices; Component parts thereof; Manufacture thereof; Maintenance or testing thereof; Charging means specially adapted therefor
    • A24F40/50—Control or monitoring
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • the present invention relates to a power supply unit for an aerosol generator.
  • Patent Document 1 describes an operational amplifier that heats an aerosol source and outputs according to a voltage applied to a load having a correlation between temperature and electrical resistance, and a configuration that performs processing based on the voltage according to the output. and a first circuit and a second circuit electrically connected in parallel between the power supply and the load, wherein the first circuit and the second circuit connect the first switch and the second switch.
  • Control devices for aerosol inhalers are described, each including a device. This control device is configured to obtain a voltage corresponding to the output of the operational amplifier while the second switch is in the ON state.
  • Patent Document 2 discloses a heating element having a predetermined resistance value, a power supply for supplying power to the heating element, a plurality of resistors connected in parallel with the heating element, a control unit, and an on-state control unit for the heating element.
  • a configured non-combustion inhaler is described.
  • predetermined control such as heating control of the heater may be performed using the resistance value of the heater.
  • Switching elements such as bipolar transistors and MOSFETs (metal-oxide-semiconductor field-effect transistors) are used to measure the resistance value of the heater, as in the prior art. In order to improve the accuracy of predetermined control, it is necessary to consider what position these switching elements should be mounted.
  • the purpose of the present invention is to provide an aerosol generator capable of improving control accuracy.
  • the power supply unit of the aerosol generating device of one aspect of the present invention includes a power supply, a + pole and a - pole, and a heater that consumes power supplied from the power supply to heat the aerosol source comprises the + pole and the - pole.
  • a heater connector connected to the pole; a switch connected in series to either one of the + pole and the - pole; a fixed resistor connected in series to either one of the + pole and the - pole; a circuit board on which a switch is mounted; and a controller configured to perform predetermined control based on a voltage applied to the fixed resistor or the heater connector when the switch is ON, The distance between a first mounting area where the switch is mounted on the circuit board and a first closest edge which is an edge of the circuit board closest to the switch is equal to the first mounting area. less than the distance between the centers of the circuit boards.
  • FIG. 1 is a perspective view of a non-combustion inhaler
  • FIG. 1 is a perspective view of a non-combustion inhaler showing a state in which a rod is attached
  • FIG. Fig. 10 is another perspective view of a non-combustion type inhaler
  • 1 is an exploded perspective view of a non-combustion inhaler
  • FIG. Fig. 3 is a perspective view of the internal unit of the non-combustion inhaler
  • FIG. 6 is an exploded perspective view of the internal unit of FIG. 5
  • FIG. 3 is a perspective view of the internal unit with the power supply and chassis removed
  • FIG. 11 is another perspective view of the internal unit with the power supply and chassis removed
  • It is a schematic diagram for demonstrating the operation mode of an aspirator.
  • FIG. 4 is a diagram for explaining the operation of an electric circuit in sleep mode; It is a figure for demonstrating the operation
  • FIG. 4 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode; It is a figure for demonstrating the operation
  • FIG. 5 is a diagram for explaining the operation of the electric circuit when detecting the temperature of the heater in the heating mode; FIG.
  • FIG. 4 is a diagram for explaining the operation of the electric circuit in charging mode;
  • FIG. 4 is a diagram for explaining the operation of an electric circuit when an MCU is reset (restarted);
  • FIG. 11 is a circuit diagram of a main part of the electric circuit shown in FIG. 10, showing the main electronic components used for heating the heater and detecting the temperature. It is a figure which shows an example of the voltage change input into the gate terminal of switch S3 and switch S4 in heating mode.
  • FIG. 4 is a diagram showing current flow during heating control in a heating mode.
  • FIG. 5 is a diagram showing current flow during temperature detection control in a heating mode;
  • FIG. 22 is a diagram showing the current flow when both the switch S3 and the switch S4 are turned on in the drive example EX2 of FIG. 21;
  • FIG. 4 is a plan view of the receptacle-mounted substrate viewed from the main surface side; It is the top view which looked at the receptacle mounting board
  • suction system which is one embodiment of the aerosol generator of the present invention, will be described below with reference to the drawings.
  • This suction system includes a non-combustion type suction device 100 (hereinafter also simply referred to as "suction device 100"), which is an embodiment of the power supply unit of the present invention, and a rod 500 heated by the suction device 100.
  • suction device 100 a non-combustion type suction device 100
  • the suction device 100 accommodates the heating unit in a non-detachable manner
  • the heating unit may be detachably attached to the aspirator 100 .
  • the rod 500 and the heating unit may be integrated and detachably attached to the aspirator 100 .
  • the power supply unit of the aerosol generator may have a configuration that does not include the heating section as a component.
  • “non-detachable” refers to a mode in which detachment is not possible as far as the intended use is concerned.
  • an induction heating coil provided in the aspirator 100 and a susceptor built in the rod 500 may cooperate to form a heating unit.
  • FIG. 1 is a perspective view showing the overall configuration of the aspirator 100.
  • FIG. FIG. 2 is a perspective view of the suction device 100 showing a state in which the rod 500 is attached.
  • FIG. 3 is another perspective view of the suction device 100.
  • FIG. FIG. 4 is an exploded perspective view of the aspirator 100.
  • FIG. Also, in the following description, for the sake of convenience, the orthogonal coordinate system of a three-dimensional space is used, in which the three mutually orthogonal directions are the front-back direction, the left-right direction, and the up-down direction. In the figure, the front is indicated by Fr, the rear by Rr, the right by R, the left by L, the upper by U, and the lower by D.
  • the inhaler 100 generates flavor-containing aerosol by heating an elongated, substantially cylindrical rod 500 (see FIG. 2) as an example of a flavor component-generating base having a filling containing an aerosol source and a flavor source. configured to
  • Rod 500 includes a fill containing an aerosol source that is heated at a predetermined temperature to produce an aerosol.
  • the type of aerosol source is not particularly limited, and extracts from various natural products and/or their constituent components can be selected according to the application.
  • the aerosol source may be solid or liquid, for example polyhydric alcohols such as glycerin, propylene glycol, or water.
  • the aerosol source may include a flavor source such as a tobacco material or an extract derived from the tobacco material that releases flavor components upon heating.
  • the gas to which the flavor component is added is not limited to an aerosol, and for example an invisible vapor may be generated.
  • the filling of rod 500 may contain tobacco shreds as a flavor source.
  • Materials for shredded tobacco are not particularly limited, and known materials such as lamina and backbone can be used.
  • the filling may contain one or more perfumes.
  • the type of flavoring agent is not particularly limited, but menthol is preferable from the viewpoint of imparting a good smoking taste.
  • Flavor sources may contain plants other than tobacco, such as mints, herbal medicines, or herbs. Depending on the application, rod 500 may not contain a flavor source.
  • the suction device 100 includes a substantially rectangular parallelepiped case 110 having a front surface, a rear surface, a left surface, a right surface, an upper surface, and a lower surface.
  • the case 110 comprises a bottomed cylindrical case body 112 in which front, rear, top, bottom, and right surfaces are integrally formed, and a left surface that seals an opening 114 (see FIG. 4) of the case body 112. It has an outer panel 115 , an inner panel 118 , and a slider 119 .
  • the inner panel 118 is fixed to the case body 112 with bolts 120 .
  • the outer panel 115 is fixed to the case body 112 so as to cover the outer surface of the inner panel 118 by a magnet 124 held by a chassis 150 (see FIG. 5) housed in the case body 112 and described later. Since the outer panel 115 is fixed by the magnet 124, the user can replace the outer panel 115 according to his or her preference.
  • the inner panel 118 is provided with two through holes 126 through which the magnets 124 pass.
  • the inner panel 118 is further provided with a longitudinally elongated hole 127 and a circular round hole 128 between the two vertically arranged through holes 126 .
  • This long hole 127 is for transmitting light emitted from eight LEDs (Light Emitting Diodes) L1 to L8 built in the case body 112 .
  • a button-type operation switch OPS built in the case body 112 passes through the round hole 128 . Thereby, the user can detect the light emitted from the eight LEDs L1 to L8 through the LED window 116 of the outer panel 115. FIG. Also, the user can press down the operation switch OPS via the pressing portion 117 of the outer panel 115 .
  • the upper surface of the case body 112 is provided with an opening 132 into which the rod 500 can be inserted.
  • the slider 119 is coupled to the case body 112 so as to be movable in the front-rear direction between a position for closing the opening 132 (see FIG. 1) and a position for opening the opening 132 (see FIG. 2).
  • the operation switch OPS is used to perform various operations of the aspirator 100.
  • the user operates the operation switch OPS via the pressing portion 117 while inserting the rod 500 into the opening 132 as shown in FIG.
  • the heating unit 170 (see FIG. 5) heats the rod 500 without burning it.
  • an aerosol is generated from the aerosol source contained in the rod 500 and the flavor of the flavor source contained in the rod 500 is added to the aerosol.
  • the user can inhale the flavor-containing aerosol by holding the mouthpiece 502 of the rod 500 projecting from the opening 132 and inhaling.
  • a charging terminal 134 is provided for receiving power supply by being electrically connected to an external power source such as an outlet or a mobile battery.
  • the charging terminal 134 is a USB (Universal Serial Bus) Type-C receptacle, but is not limited to this.
  • Charging terminal 134 is hereinafter also referred to as receptacle RCP.
  • the charging terminal 134 may include, for example, a power receiving coil and be configured to be capable of contactlessly receiving power transmitted from an external power supply.
  • the wireless power transfer method in this case may be an electromagnetic induction type, a magnetic resonance type, or a combination of the electromagnetic induction type and the magnetic resonance type.
  • the charging terminal 134 can be connected to various USB terminals or the like, and may have the power receiving coil described above.
  • the configuration of the aspirator 100 shown in FIGS. 1-4 is merely an example.
  • the inhaler 100 holds the rod 500 and applies an action such as heating to generate gas to which a flavor component is added from the rod 500, and the user can inhale the generated gas. It can be configured in various forms.
  • FIG. 5 is a perspective view of the internal unit 140 of the suction device 100.
  • FIG. 6 is an exploded perspective view of the internal unit 140 of FIG. 5.
  • FIG. 7 is a perspective view of internal unit 140 with power supply BAT and chassis 150 removed.
  • FIG. 8 is another perspective view of the internal unit 140 with the power supply BAT and chassis 150 removed.
  • the internal unit 140 housed in the internal space of the case 110 includes a chassis 150, a power supply BAT, a circuit section 160, a heating section 170, a notification section 180, and various sensors.
  • the chassis 150 includes a plate-shaped chassis body 151 arranged substantially in the center of the interior space of the case 110 in the front-rear direction and extending in the vertical and front-rear directions, and a chassis body 151 disposed substantially in the center of the interior space of the case 110 in the front-rear direction.
  • a plate-shaped front and rear dividing wall 152 extending in the vertical and horizontal directions
  • a plate-shaped upper and lower dividing wall 153 extending forward from substantially the center of the front and rear dividing wall 152 in the vertical direction
  • the front and rear dividing wall 152 and the upper edges of the chassis body 151 and a plate-shaped chassis lower wall 155 extending rearward from the front-rear dividing wall 152 and the lower edge of the chassis body 151 .
  • the left surface of the chassis body 151 is covered with the inner panel 118 and the outer panel 115 of the case 110 described above.
  • the internal space of the case 110 is defined by a chassis 150 such that a heating unit housing area 142 is defined in the upper front, a board housing area 144 is defined in the lower front, and a power supply housing space 146 is defined in the rear to extend vertically. ing.
  • the heating part 170 housed in the heating part housing area 142 is composed of a plurality of tubular members, which are concentrically arranged to form a tubular body as a whole.
  • the heating section 170 has a rod housing section 172 capable of housing a portion of the rod 500 therein, and a heater HTR (see FIGS. 10 to 19) that heats the rod 500 from its outer circumference or center.
  • the surface of the rod housing portion 172 and the heater HTR are insulated by forming the rod housing portion 172 from a heat insulating material or providing a heat insulating material inside the rod housing portion 172 .
  • the heater HTR may be any element that can heat the rod 500 .
  • the heater HTR is, for example, a heating element.
  • Heating elements include heating resistors, ceramic heaters, induction heaters, and the like.
  • the heater HTR for example, one having a PTC (Positive Temperature Coefficient) characteristic in which the resistance value increases as the temperature increases is preferably used.
  • a heater HTR having NTC (Negative Temperature Coefficient) characteristics in which the resistance value decreases as the temperature increases may be used.
  • the heating part 170 has a function of defining a flow path of air to be supplied to the rod 500 and a function of heating the rod 500 .
  • the case 110 is formed with a vent (not shown) for introducing air, and is configured to allow air to enter the heating unit 170 .
  • the power supply BAT housed in the power supply housing space 146 is a rechargeable secondary battery, an electric double layer capacitor, or the like, preferably a lithium ion secondary battery.
  • the electrolyte of the power supply BAT may be composed of one or a combination of a gel electrolyte, an electrolytic solution, a solid electrolyte, and an ionic liquid.
  • the notification unit 180 notifies various information such as the SOC (State Of Charge) indicating the state of charge of the power supply BAT, the preheating time during suction, and the suction possible period.
  • the notification unit 180 of this embodiment includes eight LEDs L1 to L8 and a vibration motor M.
  • the notification unit 180 may be composed of light emitting elements such as LEDs L1 to L8, may be composed of vibrating elements such as the vibration motor M, or may be composed of sound output elements.
  • the notification unit 180 may be a combination of two or more elements selected from the light emitting element, the vibration element, and the sound output element.
  • Various sensors include an intake air sensor that detects the user's puff action (sucking action), a power supply temperature sensor that detects the temperature of the power supply BAT, a heater temperature sensor that detects the temperature of the heater HTR, and a case temperature sensor that detects the temperature of the case 110. , a cover position sensor that detects the position of the slider 119, a panel detection sensor that detects attachment/detachment of the outer panel 115, and the like.
  • the intake sensor is mainly composed of a thermistor T2 arranged near the opening 132, for example.
  • the power supply temperature sensor is mainly composed of, for example, a thermistor T1 arranged near the power supply BAT.
  • the heater temperature sensor is mainly composed of, for example, a thermistor T3 arranged near the heater HTR.
  • the rod housing portion 172 is preferably insulated from the heater HTR.
  • the thermistor T3 is preferably in contact with or close to the heater HTR inside the rod housing portion 172 . If the heater HTR has PTC characteristics or NTC characteristics, the heater HTR itself may be used as the heater temperature sensor.
  • the case temperature sensor is mainly composed of, for example, a thermistor T4 arranged near the left surface of the case 110 .
  • the cover position sensor is mainly composed of a Hall IC 14 including a Hall element arranged near the slider 119 .
  • the panel detection sensor is mainly composed of a Hall IC 13 including a Hall element arranged near the inner surface of the inner panel 118 .
  • the circuit section 160 includes four circuit boards, multiple ICs (Integrate Circuits), and multiple elements.
  • the four circuit boards are an MCU-mounted board 161 on which an MCU (Micro Controller Unit) 1 and a charging IC 2, which will be described later, are mainly arranged, a receptacle-mounted board 162 mainly on which charging terminals 134 are arranged, an operation switch OPS, and an LED An LED mounting substrate 163 on which L1 to L8 and a communication IC 15 described later are arranged, and a Hall IC mounting substrate 164 on which a Hall IC 14 including a Hall element constituting a cover position sensor is arranged.
  • the MCU mounting board 161 and the receptacle mounting board 162 are arranged parallel to each other in the board accommodation area 144 . More specifically, the MCU mounting board 161 and the receptacle mounting board 162 are arranged such that their element mounting surfaces are arranged along the horizontal direction and the vertical direction, and the MCU mounting board 161 is arranged in front of the receptacle mounting board 162. .
  • the MCU mounting board 161 and the receptacle mounting board 162 are each provided with openings.
  • the MCU mounting board 161 and the receptacle mounting board 162 are fastened with bolts 136 to the board fixing portion 156 of the front/rear dividing wall 152 with a cylindrical spacer 173 interposed between the peripheral edges of these openings.
  • the spacer 173 fixes the positions of the MCU mounting board 161 and the receptacle mounting board 162 inside the case 110 and mechanically connects the MCU mounting board 161 and the receptacle mounting board 162 .
  • the MCU mounting board 161 and the receptacle mounting board 162 it is possible to prevent the MCU mounting board 161 and the receptacle mounting board 162 from coming into contact with each other and causing a short-circuit current between them.
  • the MCU mounting board 161 and the receptacle mounting board 162 have main surfaces 161a and 162a that face forward, and secondary surfaces 161b and 162b that are opposite to the main surfaces 161a and 162a. and the main surface 162a of the receptacle mounting substrate 162 face each other with a predetermined gap therebetween.
  • a main surface 161 a of the MCU mounting board 161 faces the front surface of the case 110
  • a secondary surface 162 b of the receptacle mounting board 162 faces the front and rear dividing walls 152 of the chassis 150 .
  • Elements and ICs mounted on the MCU mounting board 161 and the receptacle mounting board 162 will be described later.
  • the LED mounting board 163 is arranged on the left side of the chassis body 151 and between the two magnets 124 arranged vertically.
  • the element mounting surface of the LED mounting substrate 163 is arranged along the vertical direction and the front-rear direction.
  • the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 are orthogonal to the element mounting surface of the LED mounting board 163 .
  • the element mounting surfaces of the MCU mounting board 161 and the receptacle mounting board 162 and the element mounting surface of the LED mounting board 163 are not limited to being orthogonal, but preferably intersect (non-parallel).
  • the vibration motor M which forms the notification unit 180 together with the LEDs L1 to L8, is fixed to the bottom surface of the chassis bottom wall 155 and electrically connected to the MCU mounting board 161.
  • the Hall IC mounting board 164 is arranged on the upper surface of the chassis upper wall 154 .
  • FIG. 9 is a schematic diagram for explaining the operation modes of the aspirator 100.
  • the operating modes of the suction device 100 include charging mode, sleep mode, active mode, heating initialization mode, heating mode, and heating termination mode.
  • the sleep mode is a mode for saving power by stopping the power supply to the electronic parts required for heating control of the heater HTR.
  • the active mode is a mode in which most functions except heating control of the heater HTR are enabled.
  • the operation mode is switched to the active mode.
  • the slider 119 is closed or the non-operating time of the operation switch OPS reaches a predetermined time while the aspirator 100 is operating in the active mode, the operating mode is switched to the sleep mode.
  • the heating initial setting mode is a mode for initializing control parameters and the like for starting heating control of the heater HTR.
  • the aspirator 100 detects the operation of the operation switch OPS while operating in the active mode, it switches the operation mode to the heating initial setting mode, and when the initial setting is completed, switches the operation mode to the heating mode.
  • the heating mode is a mode that executes heating control of the heater HTR (heating control for aerosol generation and heating control for temperature detection).
  • the aspirator 100 starts heating control of the heater HTR when the operation mode is switched to the heating mode.
  • the heating end mode is a mode for executing heating control end processing (heating history storage processing, etc.) of the heater HTR.
  • the operation mode is switched to the heating end mode.
  • the operation mode is switched to the active mode.
  • the USB connection is established while the aspirator 100 is operating in the heating mode, the operating mode is switched to the heating end mode, and when the end processing is completed, the operating mode is switched to the charging mode. As shown in FIG.
  • the operating mode may be switched to the active mode before switching the operating mode to the charging mode.
  • the aspirator 100 may switch the operation mode in order of the heating end mode, the active mode, and the charging mode when the USB connection is made while operating in the heating mode.
  • the charging mode is a mode in which the power supply BAT is charged with power supplied from an external power supply connected to the receptacle RCP.
  • the aspirator 100 switches the operation mode to the charge mode when an external power source is connected (USB connection) to the receptacle RCP while operating in sleep mode or active mode.
  • the aspirator 100 switches the operation mode to the sleep mode when the charging of the power supply BAT is completed or the connection between the receptacle RCP and the external power supply is released while operating in the charging mode.
  • FIG. 11 shows a range 161A mounted on the MCU mounting board 161 (range surrounded by thick dashed lines) and a range 163A mounted on the LED mounting board 163 (range surrounded by thick solid lines) in the electric circuit shown in FIG.
  • FIG. 12 is the same as FIG. 10 except that a range 162A mounted on the receptacle mounting board 162 and a range 164A mounted on the Hall IC mounting board 164 are added to the electric circuit shown in FIG. is.
  • the wiring indicated by the thick solid line in FIG. 10 is the wiring (the wiring connected to the ground provided in the internal unit 140) that has the same potential as the reference potential (ground potential) of the internal unit 140. It is described as a ground line below.
  • an electronic component in which a plurality of circuit elements are chipped is indicated by a rectangle, and the symbols of various terminals are indicated inside the rectangle.
  • a power supply terminal VCC and a power supply terminal VDD mounted on the chip indicate power supply terminals on the high potential side, respectively.
  • a power supply terminal VSS and a ground terminal GND mounted on the chip indicate power supply terminals on the low potential side (reference potential side).
  • the power supply voltage is the difference between the potential of the power supply terminal on the high potential side and the potential of the power supply terminal on the low potential side. Chipped electronic components use this power supply voltage to perform various functions.
  • the MCU-mounted board 161 includes, as main electronic components, an MCU1 that controls the entire sucker 100, a charging IC2 that controls charging of the power source BAT, a capacitor, a resistor load switches (hereinafter referred to as LSW) 3, 4, 5, a ROM (Read Only Memory) 6, a switch driver 7, and a step-up/step-down DC/DC converter 8 (in the figure, buck-boost DC/DC 8), operational amplifier OP2, operational amplifier OP3, flip-flops (FF) 16, 17, connector Cn (t2) (which is electrically connected to thermistor T2 constituting an intake sensor) ( The figure shows the thermistor T2 connected to this connector), and a connector Cn(t3) electrically connected to the thermistor T3 constituting the heater temperature sensor (the figure shows the thermistor T3 connected to this connector).
  • LSW resistor load switches
  • LSW resistor load switches
  • ROM Read Only Memory
  • switch driver 7 a switch driver 7
  • a ground terminal GND of each of the charging IC 2, LSW3, LSW4, LSW5, switch driver 7, step-up/step-down DC/DC converter 8, FF16, and FF17 is connected to a ground line.
  • a power terminal VSS of the ROM 6 is connected to the ground line.
  • a negative power supply terminal of each of the operational amplifiers OP2 and OP3 is connected to the ground line.
  • the LED mounting board 163 (area 163A) has, as main electronic components, a Hall IC 13 including a Hall element constituting a panel detection sensor, LEDs L1 to L8, an operation switch OPS, a communication IC 15 and are provided.
  • the communication IC 15 is a communication module for communicating with electronic devices such as smartphones.
  • a power supply terminal VSS of the Hall IC 13 and a ground terminal GND of the communication IC 15 are each connected to a ground line.
  • Communication IC 15 and MCU 1 are configured to be communicable via communication line LN.
  • One end of the operation switch OPS is connected to the ground line, and the other end of the operation switch OPS is connected to the terminal P4 of the MCU1.
  • the receptacle mounting board 162 (range 162A) includes a power connector electrically connected to the power supply BAT as a main electronic component (in the figure, the power supply BAT connected to this power connector is shown). ), a connector electrically connected to a thermistor T1 constituting a power supply temperature sensor (in the figure, the thermistor T1 connected to this connector is shown), and a boost DC/DC converter 9 (in the figure, a boost DC/DC 9 ), the protection IC 10, the overvoltage protection IC 11, the fuel gauge IC 12, the receptacle RCP, the switches S3 to S6 configured by MOSFETs, the operational amplifier OP1, and the heater HTR. (positive electrode side and negative electrode side) heater connectors Cn are provided.
  • ground terminals GND of receptacle RCP, ground terminal GND of step-up DC/DC converter 9, power supply terminal VSS of protection IC 10, power supply terminal VSS of fuel gauge IC 12, ground terminal GND of overvoltage protection IC 11, and operational amplifier The negative power supply terminals of OP1 are each connected to the ground line.
  • the Hall IC mounting substrate 164 (area 164A) is provided with a Hall IC 14 including a Hall element that constitutes a cover position sensor.
  • a power terminal VSS of the Hall IC 14 is connected to the ground line.
  • the output terminal OUT of the Hall IC 14 is connected to the terminal P8 of the MCU1.
  • the MCU1 detects opening/closing of the slider 119 from a signal input to the terminal P8.
  • a connector electrically connected to the vibration motor M is provided on the MCU mounting board 161 .
  • the two power supply input terminals V BUS of the receptacle RCP are each connected to the input terminal IN of the overvoltage protection IC11 via a fuse Fs.
  • the USB voltage V USB is supplied to the two power input terminals V BUS of the receptacle RCP.
  • An input terminal IN of the overvoltage protection IC 11 is connected to one end of a voltage dividing circuit Pa consisting of a series circuit of two resistors.
  • the other end of the voltage dividing circuit Pa is connected to the ground line.
  • a connection point between the two resistors forming the voltage dividing circuit Pa is connected to the voltage detection terminal OVLo of the overvoltage protection IC11.
  • the overvoltage protection IC 11 outputs the voltage input to the input terminal IN from the output terminal OUT when the voltage input to the voltage detection terminal OVLo is less than the threshold.
  • the overvoltage protection IC 11 stops voltage output from the output terminal OUT (cuts off the electrical connection between the LSW3 and the receptacle RCP) when the voltage input to the voltage detection terminal OVLo exceeds the threshold (overvoltage). By doing so, the electronic components downstream of the overvoltage protection IC 11 are protected.
  • the output terminal OUT of the overvoltage protection IC11 is connected to the input terminal VIN of the LSW3 and one end of the voltage dividing circuit Pc (series circuit of two resistors) connected to the MCU1. The other end of the voltage dividing circuit Pc is connected to the ground line. A connection point of the two resistors forming the voltage dividing circuit Pc is connected to the terminal P17 of the MCU1.
  • An input terminal VIN of LSW3 is connected to one end of a voltage dividing circuit Pf consisting of a series circuit of two resistors.
  • the other end of the voltage dividing circuit Pf is connected to the ground line.
  • a connection point between the two resistors forming the voltage dividing circuit Pf is connected to the control terminal ON of the LSW3.
  • the collector terminal of the bipolar transistor S2 is connected to the control terminal ON of LSW3.
  • the emitter terminal of the bipolar transistor S2 is connected to the ground line.
  • the base terminal of bipolar transistor S2 is connected to terminal P19 of MCU1.
  • the output terminal VOUT of LSW3 is connected to the input terminal VBUS of charging IC2.
  • the MCU1 turns on the bipolar transistor S2 while the USB connection is not made.
  • the control terminal ON of LSW3 is connected to the ground line via the bipolar transistor S2, so that a low level signal is input to the control terminal ON of LSW3.
  • the bipolar transistor S2 connected to LSW3 is turned off by MCU1 when the USB connection is made.
  • the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3. Therefore, when the USB connection is made and the bipolar transistor S2 is turned off, a high level signal is input to the control terminal ON of the LSW3.
  • the LSW 3 outputs the USB voltage VUSB supplied from the USB cable from the output terminal VOUT. Even if the USB connection is made while the bipolar transistor S2 is not turned off, the control terminal ON of the LSW3 is connected to the ground line via the bipolar transistor S2. Therefore, it should be noted that a low level signal continues to be input to the control terminal ON of LSW3 unless MCU1 turns off bipolar transistor S2.
  • the positive terminal of the power supply BAT is connected to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC2. Therefore, the power supply voltage V BAT of the power supply BAT is supplied to the protection IC 10 , the charging IC 2 and the step-up DC/DC converter 9 .
  • a resistor Ra, a switch Sa composed of a MOSFET, a switch Sb composed of a MOSFET, and a resistor Rb are connected in series in this order to the negative terminal of the power supply BAT.
  • a current detection terminal CS of the protection IC 10 is connected to a connection point between the resistor Ra and the switch Sa. Control terminals of the switches Sa and Sb are connected to the protection IC 10 . Both ends of the resistor Rb are connected to the fuel gauge IC12.
  • the protection IC 10 acquires the value of the current flowing through the resistor Ra during charging and discharging of the power supply BAT from the voltage input to the current detection terminal CS, and when this current value becomes excessive (overcurrent), the switch Sa , the switch Sb is controlled to open and close to stop the charging or discharging of the power source BAT, thereby protecting the power source BAT. More specifically, when the protection IC 10 acquires an excessive current value while charging the power supply BAT, it stops charging the power supply BAT by turning off the switch Sb. When the protection IC 10 acquires an excessive current value during discharging of the power supply BAT, the protection IC 10 stops discharging the power supply BAT by turning off the switch Sa.
  • the protection IC 10 performs opening/closing control of the switch Sa and the switch Sb to The power supply BAT is protected by stopping the charging or discharging of BAT. More specifically, when the protection IC 10 detects that the power supply BAT is overcharged, the protection IC 10 stops charging the power supply BAT by turning off the switch Sb. When detecting overdischarge of the power supply BAT, the protection IC 10 turns off the switch Sa to stop the discharge of the power supply BAT.
  • a resistor Rt1 is connected to a connector connected to the thermistor T1 arranged near the power supply BAT.
  • a series circuit of the resistor Rt1 and the thermistor T1 is connected to the ground line and the regulator terminal TREG of the fuel gauge IC12.
  • a connection point between the thermistor T1 and the resistor Rt1 is connected to a thermistor terminal THM of the fuel gauge IC12.
  • the thermistor T1 may be a PTC (Positive Temperature Coefficient) thermistor whose resistance value increases as the temperature increases, or an NTC (Negative Temperature Coefficient) thermistor whose resistance value decreases as the temperature increases.
  • the fuel gauge IC 12 detects the current flowing through the resistor Rb, and based on the detected current value, indicates the remaining capacity of the power supply BAT, SOC (State Of Charge) indicating the state of charge, and SOH (State Of Charge) indicating the state of health. Health) and other battery information.
  • the fuel gauge IC12 supplies a voltage to the voltage dividing circuit of the thermistor T1 and the resistor Rt1 from the built-in regulator connected to the regulator terminal TREG.
  • the fuel gauge IC 12 acquires the voltage divided by this voltage dividing circuit from the thermistor terminal THM, and acquires temperature information regarding the temperature of the power supply BAT based on this voltage.
  • the fuel gauge IC12 is connected to the MCU1 via a communication line LN for serial communication, and is configured to be able to communicate with the MCU1.
  • the fuel gauge IC12 transmits the derived battery information and the acquired temperature information of the power supply BAT to the MCU1 in response to a request from the MCU1.
  • serial communication requires a plurality of signal lines such as a data line for data transmission and a clock line for synchronization. Note that only one signal line is shown in FIGS. 10-19 for simplicity.
  • the fuel gauge IC 12 has a notification terminal 12a.
  • the notification terminal 12a is connected to the terminal P6 of the MCU1 and the cathode of a diode D2, which will be described later.
  • the fuel gauge IC 12 detects an abnormality such as an excessive temperature of the power supply BAT, it notifies the MCU 1 of the occurrence of the abnormality by outputting a low-level signal from the notification terminal 12a. This low level signal is also input to the CLR ( ⁇ ) terminal of the FF 17 via the diode D2.
  • One end of the reactor Lc is connected to the switching terminal SW of the step-up DC/DC converter 9 .
  • the other end of this reactor Lc is connected to the input terminal VIN of the step-up DC/DC converter 9 .
  • the step-up DC/DC converter 9 performs on/off control of the built-in transistor connected to the switching terminal SW to step up the input voltage and output it from the output terminal VOUT.
  • the input terminal VIN of the step-up DC/DC converter 9 constitutes a power supply terminal of the step-up DC/DC converter 9 on the high potential side.
  • the boost DC/DC converter 9 performs a boost operation when the signal input to the enable terminal EN is at high level.
  • the signal input to the enable terminal EN of the boost DC/DC converter 9 may be controlled to be low level by the MCU1.
  • the MCU 1 does not control the signal input to the enable terminal EN of the boost DC/DC converter 9, so that the potential of the enable terminal EN may be made indefinite.
  • the output terminal VOUT of the step-up DC/DC converter 9 is connected to the source terminal of the switch S4 composed of a P-channel MOSFET.
  • the gate terminal of switch S4 is connected to terminal P15 of MCU1.
  • One end of the resistor Rs is connected to the drain terminal of the switch S4.
  • the other end of the resistor Rs is connected to a positive heater connector Cn connected to one end of the heater HTR.
  • a voltage dividing circuit Pb consisting of two resistors is connected to the connection point between the switch S4 and the resistor Rs.
  • a connection point of the two resistors forming the voltage dividing circuit Pb is connected to the terminal P18 of the MCU1.
  • a connection point between the switch S4 and the resistor Rs is further connected to the positive power supply terminal of the operational amplifier OP1.
  • a connection line between the output terminal VOUT of the step-up DC/DC converter 9 and the source terminal of the switch S4 is connected to the source terminal of the switch S3 composed of a P-channel MOSFET.
  • the gate terminal of switch S3 is connected to terminal P16 of MCU1.
  • a drain terminal of the switch S3 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
  • a circuit including the switch S3 and a circuit including the switch S4 and the resistor Rs are connected in parallel between the output terminal VOUT of the boost DC/DC converter 9 and the positive electrode side of the heater connector Cn. . Since the circuit including the switch S3 does not have a resistor, it has a lower resistance than the circuit including the switch S4 and the resistor Rs.
  • the non-inverting input terminal of the operational amplifier OP1 is connected to the connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
  • the inverting input terminal of the operational amplifier OP1 is connected to the negative heater connector Cn connected to the other end of the heater HTR and to the drain terminal of the switch S6 composed of an N-channel MOSFET.
  • the source terminal of switch S6 is connected to the ground line.
  • a gate terminal of the switch S6 is connected to the terminal P14 of the MCU1, the anode of the diode D4, and the enable terminal EN of the step-up DC/DC converter 9.
  • the cathode of diode D4 is connected to the Q terminal of FF17.
  • resistor R4 One end of a resistor R4 is connected to the output terminal of the operational amplifier OP1. The other end of the resistor R4 is connected to the terminal P9 of the MCU1 and the drain terminal of the switch S5 composed of an N-channel MOSFET. A source terminal of the switch S5 is connected to the ground line. A gate terminal of the switch S5 is connected to a connection line between the resistor Rs and the heater connector Cn on the positive electrode side.
  • the input terminal VBUS of charging IC2 is connected to the anode of each of LEDs L1-L8.
  • the cathodes of the LEDs L1-L8 are connected to the control terminals PD1-PD8 of the MCU1 via current limiting resistors. That is, LEDs L1 to L8 are connected in parallel to the input terminal VBUS.
  • the LEDs L1 to L8 are operable by the USB voltage V USB supplied from the USB cable connected to the receptacle RCP and the voltage supplied from the power supply BAT via the charging IC2.
  • the MCU 1 incorporates transistors (switching elements) connected to each of the control terminals PD1 to PD8 and the ground terminal GND.
  • the MCU1 turns on the transistor connected to the control terminal PD1 to energize the LED L1 to light it, and turns off the transistor connected to the control terminal PD1 to turn off the LED L1.
  • the brightness and light emission pattern of the LED L1 can be dynamically controlled.
  • LEDs L2 to L8 are similarly controlled by the MCU1.
  • the charging IC2 has a charging function of charging the power supply BAT based on the USB voltage VUSB input to the input terminal VBUS.
  • the charging IC 2 acquires the charging current and charging voltage of the power supply BAT from terminals and wiring (not shown), and based on these, performs charging control of the power supply BAT (power supply control from the charging terminal bat to the power supply BAT). Also, the charging IC 2 may acquire the temperature information of the power supply BAT transmitted from the fuel gauge IC 12 to the MCU 1 from the MCU 1 through serial communication using the communication line LN, and use it for charging control.
  • the charging IC2 further comprises a V BAT power pass function and an OTG function.
  • the V BAT power pass function is a function of outputting from the output terminal SYS a system power supply voltage Vcc0 substantially matching the power supply voltage V BAT input to the charging terminal bat.
  • the OTG function is a function for outputting from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input to the charging terminal bat.
  • ON/OFF of the OTG function of the charging IC 2 is controlled by the MCU 1 through serial communication using the communication line LN.
  • the power supply voltage V BAT input to the charging terminal bat may be directly output from the input terminal VBUS. In this case, power supply voltage VBAT and system power supply voltage Vcc4 are substantially the same.
  • the output terminal SYS of the charging IC 2 is connected to the input terminal VIN of the step-up/step-down DC/DC converter 8 .
  • One end of a reactor La is connected to the switching terminal SW of the charging IC2.
  • the other end of the reactor La is connected to the output terminal SYS of the charging IC2.
  • a charge enable terminal CE ( ⁇ ) of the charge IC2 is connected to a terminal P22 of the MCU1 via a resistor.
  • the collector terminal of the bipolar transistor S1 is connected to the charge enable terminal CE ( ⁇ ) of the charge IC2.
  • the emitter terminal of the bipolar transistor S1 is connected to the output terminal VOUT of the LSW4 which will be described later.
  • the base terminal of bipolar transistor S1 is connected to the Q terminal of FF17.
  • one end of a resistor Rc is connected to the charge enable terminal CE ( ⁇ ) of the charge IC2.
  • the other end of the resistor Rc is connected to the output terminal VOUT of LSW4.
  • a resistor is connected to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 .
  • the signal input to the enable terminal EN of the step-up/step-down DC/DC converter 8 is at a high level. Then, the step-up/step-down DC/DC converter 8 starts step-up operation or step-down operation.
  • the step-up/step-down DC/DC converter 8 steps up or steps down the system power supply voltage Vcc0 input to the input terminal VIN by switching control of the built-in transistor connected to the reactor Lb to generate the system power supply voltage Vcc1, and the output terminal VOUT.
  • Output from The output terminal VOUT of the buck-boost DC/DC converter 8 includes the feedback terminal FB of the buck-boost DC/DC converter 8, the input terminal VIN of the LSW 4, the input terminal VIN of the switch driver 7, the power supply terminal VCC and the D terminal of the FF 16. and connected to A wiring to which system power supply voltage Vcc1 output from output terminal VOUT of step-up/step-down DC/DC converter 8 is supplied is referred to as power supply line PL1.
  • the LSW4 When the signal input to the control terminal ON becomes high level, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN from the output terminal VOUT.
  • the control terminal ON of LSW4 and the power supply line PL1 are connected via a resistor. Therefore, by supplying the system power supply voltage Vcc1 to the power supply line PL1, a high level signal is input to the control terminal ON of the LSW4.
  • the voltage output from LSW4 is the same as the system power supply voltage Vcc1 if wiring resistance and the like are ignored. Described as voltage Vcc2.
  • the output terminal VOUT of the LSW4 is connected to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM6, the emitter terminal of the bipolar transistor S1, and the resistor Rc. , and the power supply terminal VCC of the FF 17 .
  • a wiring to which system power supply voltage Vcc2 output from output terminal VOUT of LSW4 is supplied is referred to as power supply line PL2.
  • the LSW5 When the signal input to the control terminal ON becomes high level, the LSW5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT.
  • a control terminal ON of LSW5 is connected to terminal P23 of MCU1.
  • the voltage output from LSW5 is the same as the system power supply voltage Vcc2 if wiring resistance and the like are ignored. Described as voltage Vcc3.
  • a wiring to which system power supply voltage Vcc3 output from output terminal VOUT of LSW5 is supplied is referred to as power supply line PL3.
  • a series circuit of a thermistor T2 and a resistor Rt2 is connected to the power supply line PL3, and the resistor Rt2 is connected to the ground line.
  • the thermistor T2 and the resistor Rt2 form a voltage dividing circuit, and their connection point is connected to the terminal P21 of the MCU1.
  • the MCU1 detects the temperature variation (resistance value variation) of the thermistor T2 based on the voltage input to the terminal P21, and determines the presence or absence of the puff operation based on the amount of temperature variation.
  • a series circuit of a thermistor T3 and a resistor Rt3 is connected to the power supply line PL3, and the resistor Rt3 is connected to the ground line.
  • the thermistor T3 and the resistor Rt3 form a voltage dividing circuit, and their connection point is connected to the terminal P13 of the MCU1 and the inverting input terminal of the operational amplifier OP2.
  • the MCU1 detects the temperature of the thermistor T3 (corresponding to the temperature of the heater HTR) based on the voltage input to the terminal P13.
  • a series circuit of a thermistor T4 and a resistor Rt4 is connected to the power supply line PL3, and the resistor Rt4 is connected to the ground line.
  • the thermistor T4 and the resistor Rt4 form a voltage dividing circuit, and the connection point between them is connected to the terminal P12 of the MCU1 and the inverting input terminal of the operational amplifier OP3.
  • the MCU1 detects the temperature of the thermistor T4 (corresponding to the temperature of the case 110) based on the voltage input to the terminal P12.
  • a source terminal of a switch S7 composed of a MOSFET is connected to the power supply line PL2.
  • the gate terminal of switch S7 is connected to terminal P20 of MCU1.
  • a drain terminal of the switch S7 is connected to one of a pair of connectors to which the vibration motor M is connected. The other of the pair of connectors is connected to the ground line.
  • the MCU1 can control the opening/closing of the switch S7 by manipulating the potential of the terminal P20, and vibrate the vibration motor M in a specific pattern.
  • a dedicated driver IC may be used instead of the switch S7.
  • a positive power supply terminal of the operational amplifier OP2 and a voltage dividing circuit Pd (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP2 are connected to the power supply line PL2.
  • a connection point between the two resistors forming the voltage dividing circuit Pd is connected to the non-inverting input terminal of the operational amplifier OP2.
  • the operational amplifier OP2 outputs a signal corresponding to the temperature of the heater HTR (signal corresponding to the resistance value of the thermistor T3).
  • the thermistor T3 since the thermistor T3 has the NTC characteristic, the higher the temperature of the heater HTR (the temperature of the thermistor T3), the lower the output voltage of the operational amplifier OP2.
  • the output of the voltage dividing circuit of the thermistor T3 and the resistor Rt3 is connected to the non-inverting input terminal of the operational amplifier OP2, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP2.
  • the output of the pressure circuit Pd may be connected.
  • a positive power supply terminal of the operational amplifier OP3 and a voltage dividing circuit Pe (a series circuit of two resistors) connected to the non-inverting input terminal of the operational amplifier OP3 are connected to the power supply line PL2.
  • a connection point between the two resistors forming the voltage dividing circuit Pe is connected to the non-inverting input terminal of the operational amplifier OP3.
  • the operational amplifier OP3 outputs a signal corresponding to the temperature of the case 110 (a signal corresponding to the resistance value of the thermistor T4).
  • the thermistor T4 having the NTC characteristic is used, so the higher the temperature of the case 110, the lower the output voltage of the operational amplifier OP3.
  • the output of the voltage dividing circuit of the thermistor T4 and the resistor Rt4 is connected to the non-inverting input terminal of the operational amplifier OP3, and the dividing circuit is connected to the inverting input terminal of the operational amplifier OP3.
  • the output of the pressure circuit Pe may be connected.
  • a resistor R1 is connected to the output terminal of the operational amplifier OP2.
  • a cathode of a diode D1 is connected to the resistor R1.
  • the anode of the diode D1 is connected to the output terminal of the operational amplifier OP3, the D terminal of the FF17, and the CLR ( ⁇ ) terminal of the FF17.
  • a connection line between the resistor R1 and the diode D1 is connected to a resistor R2 connected to the power supply line PL1. Also, the CLR ( ⁇ ) terminal of the FF 16 is connected to this connection line.
  • resistor R3 One end of a resistor R3 is connected to the connection line between the anode of the diode D1 and the output terminal of the operational amplifier OP3 and the D terminal of the FF17.
  • the other end of resistor R3 is connected to power supply line PL2.
  • the anode of the diode D2 connected to the notification terminal 12a of the fuel gauge IC12, the anode of the diode D3, and the CLR ( ⁇ ) terminal of the FF 17 are connected to this connection line.
  • the cathode of diode D3 is connected to terminal P5 of MCU1.
  • the FF16 When the temperature of the heater HTR becomes excessive and the signal output from the operational amplifier OP2 becomes low and the signal input to the CLR ( ⁇ ) terminal becomes low level, the FF16 outputs a high level signal from the Q ( ⁇ ) terminal. Input to terminal P11 of MCU1. A high-level system power supply voltage Vcc1 is supplied from the power supply line PL1 to the D terminal of the FF16. Therefore, in the FF 16, a low level signal continues to be output from the Q ( ⁇ ) terminal unless the signal input to the CLR ( ⁇ ) terminal operating in negative logic becomes low level.
  • the signal input to the CLR ( ⁇ ) terminal of the FF 17 is when the temperature of the heater HTR becomes excessive, when the temperature of the case 110 becomes excessive, and when an abnormality is detected from the notification terminal 12a of the fuel gauge IC 12.
  • the low-level signal shown When the low-level signal shown is output, it becomes low-level.
  • the FF 17 outputs a low level signal from the Q terminal when the signal input to the CLR ( ⁇ ) terminal becomes low level.
  • This low-level signal is input to terminal P10 of MCU1, the gate terminal of switch S6, the enable terminal EN of boost DC/DC converter 9, and the base terminal of bipolar transistor S1 connected to charging IC2. be.
  • the CE ( ⁇ ) terminal of the charging IC2 is of negative logic, the charging of the power source BAT is stopped. As a result, the heating of the heater HTR and the charging of the power supply BAT are stopped. Even if the MCU1 attempts to output a low-level enable signal from the terminal P22 to the charge enable terminal CE ( ⁇ ) of the charging IC2, when the bipolar transistor S1 is turned on, the amplified current is transferred from the collector terminal to the MCU1 and the charge enable terminal CE ( ⁇ ) of the charge IC2. Note that a high level signal is input to the charge enable terminal CE ( ⁇ ) of the charge IC2.
  • a high-level system power supply voltage Vcc2 is supplied from the power supply line PL2 to the D terminal of the FF17. Therefore, the FF 17 continues to output a high level signal from the Q terminal unless the signal input to the CLR ( ⁇ ) terminal operating in negative logic becomes low level.
  • a low level signal is output from the output terminal of the operational amplifier OP3
  • a low level signal is input to the CLR ( ⁇ ) terminal of the FF17 regardless of the level of the signal output from the output terminal of the operational amplifier OP2.
  • the low level signal output from the output terminal of the operational amplifier OP3 is not affected by the high level signal due to the diode D1. sea bream.
  • the high level signal is passed through the diode D1. signal.
  • the power line PL2 is further branched from the MCU mounting board 161 toward the LED mounting board 163 and the Hall IC mounting board 164 side.
  • the power terminal VDD of the hall IC 13, the power terminal VCC of the communication IC 15, and the power terminal VDD of the hall IC 14 are connected to the branched power line PL2.
  • the output terminal OUT of the Hall IC 13 is connected to the terminal P3 of the MCU1 and the terminal SW2 of the switch driver 7. When the outer panel 115 is removed, a low level signal is output from the output terminal OUT of the Hall IC 13 .
  • the MCU 1 determines whether or not the outer panel 115 is attached based on the signal input to the terminal P3.
  • a series circuit (a series circuit of a resistor and a capacitor) connected to the operation switch OPS is provided on the LED mounting board 163 .
  • This series circuit is connected to power supply line PL2.
  • a connection point between the resistor and the capacitor in this series circuit is connected to the terminal P4 of the MCU 1, the operation switch OPS, and the terminal SW1 of the switch driver 7.
  • FIG. When the operation switch OPS is not pressed, the operation switch OPS is not conductive, and the signals input to the terminal P4 of the MCU1 and the terminal SW1 of the switch driver 7 are at a high level due to the system power supply voltage Vcc2.
  • the operation switch OPS When the operation switch OPS is pressed and turned on, the signals input to the terminal P4 of the MCU 1 and the terminal SW1 of the switch driver 7 are connected to the ground line, and thus become low level.
  • the MCU1 detects the operation of the operation switch OPS from the signal input to the terminal P4.
  • the switch driver 7 is provided with a reset input terminal RSTB.
  • the reset input terminal RSTB is connected to the control terminal ON of LSW4.
  • the switch driver 7 By outputting a low level signal from the reset input terminal RSTB, the output operation of LSW4 is stopped.
  • the operation switch OPS which is originally pushed down via the pressing portion 117 of the outer panel 115, is directly pushed down by the user with the outer panel 115 removed, the signal is input to the terminals SW1 and SW2 of the switch driver 7. become low level.
  • FIG. 13 is a diagram for explaining the operation of the electric circuit in sleep mode.
  • FIG. 14 is a diagram for explaining the operation of the electric circuit in active mode.
  • FIG. 15 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode.
  • FIG. 16 is a diagram for explaining the operation of the electric circuit during heating of the heater HTR in the heating mode.
  • FIG. 17 is a diagram for explaining the operation of the electric circuit when the temperature of the heater HTR is detected in the heating mode.
  • FIG. 18 is a diagram for explaining the operation of the electric circuit in charging mode.
  • FIG. 13 is a diagram for explaining the operation of the electric circuit in sleep mode.
  • FIG. 14 is a diagram for explaining the operation of the electric circuit in active mode.
  • FIG. 15 is a diagram for explaining the operation of the electric circuit in the heating initial setting mode.
  • FIG. 16 is a diagram for explaining the operation of the electric circuit during heating of the heater HTR in the heating mode.
  • FIG. 17 is a diagram for explaining the operation
  • FIGS. 13 to 19 are diagrams for explaining the operation of the electric circuit when the MCU 1 is reset (restarted).
  • the terminals surrounded by dashed ellipses have inputs or outputs such as the power supply voltage V BAT , the USB voltage V USB , and the system power supply voltage. It shows the terminals that have been made.
  • the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC 2.
  • FIG. 1 the power supply voltage V BAT is input to the power supply terminal VDD of the protection IC 10, the input terminal VIN of the step-up DC/DC converter 9, and the charging terminal bat of the charging IC 2.
  • MCU1 enables the V BAT power pass function of charging IC2 and disables the OTG function and charging function. Since the USB voltage VUSB is not input to the input terminal VBUS of the charging IC2, the VBAT power pass function of the charging IC2 is enabled. Since the signal for enabling the OTG function is not output from the MCU1 to the charging IC2 from the communication line LN, the OTG function is disabled. Therefore, the charging IC2 generates the system power supply voltage Vcc0 from the power supply voltage VBAT input to the charging terminal bat, and outputs it from the output terminal SYS.
  • the system power supply voltage Vcc0 output from the output terminal SYS is input to the input terminal VIN and enable terminal EN of the step-up/step-down DC/DC converter 8 .
  • the buck-boost DC/DC converter 8 is enabled by inputting a high-level system power supply voltage Vcc0 to an enable terminal EN of positive logic, generates a system power supply voltage Vcc1 from the system power supply voltage Vcc0, and outputs it to an output terminal VOUT.
  • Output from The system power supply voltage Vcc1 output from the output terminal VOUT of the buck-boost DC/DC converter 8 is applied to the input terminal VIN of the LSW4, the control terminal ON of the LSW4, the input terminal VIN of the switch driver 7, the power supply terminal VCC of the FF16, and the D terminal and , respectively.
  • the LSW4 When the system power supply voltage Vcc1 is input to the control terminal ON, the LSW4 outputs the system power supply voltage Vcc1 input to the input terminal VIN as the system power supply voltage Vcc2 from the output terminal VOUT.
  • the system power supply voltage Vcc2 output from the LSW4 is applied to the power supply terminal VDD of the MCU1, the input terminal VIN of the LSW5, the power supply terminal VDD of the Hall IC 13, the power supply terminal VCC of the communication IC 15, and the power supply terminal VDD of the Hall IC 14. is entered.
  • the system power supply voltage Vcc2 is the power supply terminal VDD of the fuel gauge IC12, the power supply terminal VCC of the ROM 6, the resistor Rc and the bipolar transistor S1 connected to the charge enable terminal CE ( ⁇ ) of the charging IC2, and the FF17. They are supplied to the power supply terminal VCC, the positive power supply terminal of the operational amplifier OP3, the voltage dividing circuit Pe, the positive power supply terminal of the operational amplifier OP2, and the voltage dividing circuit Pd.
  • the bipolar transistor S1 connected to the charging IC2 is off unless a low level signal is output from the Q terminal of the FF17. Therefore, the system power supply voltage Vcc2 generated by the LSW4 is also input to the charging enable terminal CE ( ⁇ ) of the charging IC2. Since the charge enable terminal CE ( ⁇ ) of the charge IC2 is of negative logic, the charge function of the charge IC2 is turned off in this state.
  • LSW 5 stops outputting system power supply voltage Vcc3, so power supply to electronic components connected to power supply line PL3 is stopped. Also, in the sleep mode, the OTG function of the charging IC 2 is stopped, so power supply to the LEDs L1 to L8 is stopped.
  • Fig. 14> When the MCU 1 detects that the signal input to the terminal P8 becomes high level from the sleep mode state of FIG. 13 and the slider 119 is opened, it inputs a high level signal from the terminal P23 to the control terminal ON of the LSW5. . As a result, the LSW 5 outputs the system power supply voltage Vcc2 input to the input terminal VIN from the output terminal VOUT as the system power supply voltage Vcc3. The system power supply voltage Vcc3 output from the output terminal VOUT of the LSW5 is supplied to the thermistor T2, the thermistor T3, and the thermistor T4.
  • the MCU1 detects that the slider 119 is opened, the MCU1 enables the OTG function of the charging IC2 via the communication line LN.
  • the charging IC2 outputs from the input terminal VBUS a system power supply voltage Vcc4 obtained by boosting the power supply voltage VBAT input from the charging terminal bat.
  • the system power supply voltage Vcc4 output from the input terminal VBUS is It is fed to the LEDs L1-L8.
  • Fig. 15> From the state of FIG. 14, when the signal input to the terminal P4 becomes low level (the operation switch OPS is pressed), the MCU1 performs various settings necessary for heating, and then boosts the voltage from the terminal P14. A high-level enable signal is input to the enable terminal EN of the DC/DC converter 9 . As a result, the step-up DC/DC converter 9 outputs the driving voltage V bst obtained by stepping up the power supply voltage V BAT from the output terminal VOUT. The drive voltage Vbst is supplied to switch S3 and switch S4. In this state, the switches S3 and S4 are off. Also, the switch S6 is turned on by the high-level enable signal output from the terminal P14.
  • the negative terminal of the heater HTR is connected to the ground line, and the heater HTR can be heated by turning on the switch S3.
  • the mode shifts to the heating mode.
  • Fig. 16> In the state of FIG. 15, the MCU1 starts switching control of the switch S3 connected to the terminal P16 and switching control of the switch S4 connected to the terminal P15. These switching controls may be automatically started when the heating initial setting mode described above is completed, or may be started by further pressing the operation switch OPS. Specifically, as shown in FIG. 16, the MCU 1 turns on the switch S3 and turns off the switch S4 to supply the driving voltage Vbst to the heater HTR to heat the heater HTR for generating aerosol. and temperature detection control for detecting the temperature of the heater HTR by turning off the switch S3 and turning on the switch S4 as shown in FIG.
  • the driving voltage Vbst is also supplied to the gate of the switch S5 to turn on the switch S5. Further, during heating control, the drive voltage Vbst that has passed through the switch S3 is also input to the positive power supply terminal of the operational amplifier OP1 via the resistor Rs.
  • the resistance value of the resistor Rs is negligibly small compared to the internal resistance value of the operational amplifier OP1. Therefore, during heating control, the voltage input to the positive power supply terminal of the operational amplifier OP1 is approximately equal to the drive voltage Vbst .
  • the resistance value of the resistor R4 is greater than the ON resistance value of the switch S5.
  • the switch S5 is turned on during heating control.
  • the output voltage of the operational amplifier OP1 is divided by the voltage dividing circuit of the resistor R4 and the switch S5 and input to the terminal P9 of the MCU1. Since the resistance value of the resistor R4 is higher than the ON resistance value of the switch S5, the voltage input to the terminal P9 of the MCU1 is sufficiently reduced. This can prevent a large voltage from being input from the operational amplifier OP1 to the MCU1.
  • Fig. 17> As shown in FIG. 17, during temperature detection control, the driving voltage Vbst is input to the positive power supply terminal of the operational amplifier OP1 and also to the voltage dividing circuit Pb. The voltage divided by the voltage dividing circuit Pb is input to the terminal P18 of the MCU1. Based on the voltage input to the terminal P18, the MCU1 acquires the reference voltage V temp applied to the series circuit of the resistor Rs and the heater HTR during temperature detection control.
  • the driving voltage V bst (reference voltage V temp ) is supplied to the series circuit of the resistor Rs and the heater HTR.
  • a voltage V heat obtained by dividing the driving voltage V bst (reference voltage V temp ) by the resistor Rs and the heater HTR is input to the non-inverting input terminal of the operational amplifier OP1. Since the resistance value of the resistor Rs is sufficiently higher than the resistance value of the heater HTR, the voltage V heat is sufficiently lower than the driving voltage V bst .
  • the switch S5 is turned off by supplying the low voltage V heat to the gate terminal of the switch S5.
  • the operational amplifier OP1 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage V heat input to the non-inverting input terminal.
  • the output signal of operational amplifier OP1 is input to terminal P9 of MCU1.
  • the MCU1 obtains the temperature of the heater HTR based on the signal input to the terminal P9, the reference voltage V temp obtained based on the input voltage of the terminal P18, and the known electrical resistance value of the resistor Rs. . Based on the acquired temperature of the heater HTR, the MCU 1 performs heating control of the heater HTR (for example, control so that the temperature of the heater HTR becomes a target temperature).
  • the MCU 1 can obtain the temperature of the heater HTR even during periods when the switches S3 and S4 are turned off (periods when the heater HTR is not energized). Specifically, the MCU1 obtains the temperature of the heater HTR based on the voltage input to the terminal P13 (the output voltage of the voltage dividing circuit composed of the thermistor T3 and the resistor Rt3).
  • the MCU 1 can acquire the temperature of the case 110 at any timing. Specifically, the MCU1 obtains the temperature of the case 110 based on the voltage input to the terminal P12 (the output voltage of the voltage dividing circuit composed of the thermistor T4 and the resistor Rt4).
  • FIG. 18 exemplifies a case where a USB connection is made in sleep mode.
  • the USB voltage VUSB is input to the input terminal VIN of LSW3 via the overvoltage protection IC11.
  • the USB voltage V USB is also supplied to a voltage dividing circuit Pf connected to the input terminal VIN of LSW3. Since the bipolar transistor S2 is ON immediately after the USB connection is made, the signal input to the control terminal ON of the LSW3 remains at a low level.
  • the USB voltage V USB is also supplied to the voltage dividing circuit Pc connected to the terminal P17 of the MCU1, and the voltage divided by this voltage dividing circuit Pc is input to the terminal P17.
  • the MCU1 detects that the USB connection has been made based on the voltage input to the terminal P17.
  • the MCU1 When the MCU1 detects that the USB connection has been made, the MCU1 turns off the bipolar transistor S2 connected to the terminal P19.
  • the USB voltage VUSB divided by the voltage dividing circuit Pf is input to the control terminal ON of the LSW3.
  • a high-level signal is input to the control terminal ON of LSW3, and LSW3 outputs the USB voltage VUSB from the output terminal VOUT.
  • the USB voltage VUSB output from LSW3 is input to the input terminal VBUS of charging IC2.
  • the USB voltage V_USB output from LSW3 is directly supplied to LEDs L1 to L8 as system power supply voltage Vcc4.
  • the MCU1 When the MCU1 detects that the USB connection has been established, the MCU1 further outputs a low-level enable signal from the terminal P22 to the charge enable terminal CE( ⁇ ) of the charge IC2. As a result, the charging IC 2 enables the charging function of the power supply BAT, and starts charging the power supply BAT with the USB voltage VUSB input to the input terminal VBUS.
  • the MCU1 When the USB connection is made in the active mode, when the MCU1 detects that the USB connection is made, it turns off the bipolar transistor S2 connected to the terminal P19. A low-level enable signal is output to the charge enable terminal CE ( ⁇ ) of , and the OTG function of the charge IC 2 is turned off by serial communication using the communication line LN. As a result, the system power supply voltage Vcc4 supplied to the LEDs L1 to L8 is switched from the voltage generated by the OTG function of the charging IC 2 (voltage based on the power supply voltage VBAT) to the USB voltage VUSB output from the LSW3. . The LEDs L1 to L8 do not operate unless the MCU1 turns on the built-in transistors. This prevents an unstable voltage from being supplied to the LEDs L1-L8 during the on-to-off transition of the OTG function.
  • the switch driver 7 outputs a low-level signal from the reset input terminal RSTB when it reaches a predetermined time, or when the signal input to either the terminal SW1 or the terminal SW2 becomes high level, the reset input terminal RSTB is output. return the signal output from to high level. As a result, the control terminal ON of LSW4 becomes high level, and the state in which the system power supply voltage Vcc2 is supplied to each part is restored.
  • FIG. 20 is a circuit diagram of main parts of the electric circuit shown in FIG. 10, showing the main electronic components used for heating and temperature detection of the heater HTR.
  • FIG. 20 shows a reactor Ld, a resistor RS4 , an npn-type bipolar transistor TS4 , and a voltage dividing circuit Pb as electronic components and nodes whose illustration or reference numerals are omitted in FIG.
  • the resistors R Pb1 and R Pb2 , the parasitic diode D5 of the switch S5, the nodes N1 to N8, and the operational amplifiers OP4, OP5, ADC (analog-digital converter) 1a, and ADC1b built in the MCU1 are It is shown.
  • Various resistors resistor R S4 , resistor Rs, resistor R Pb1 , resistor R Pb2 , and resistor R4) shown in FIG. 20 are fixed resistors having predetermined resistance values.
  • resistor RS4 One end of resistor RS4 is connected to the gate terminal of switch S4 .
  • the other end of resistor RS4 is connected to the collector terminal of bipolar transistor TS4 .
  • the emitter terminal of bipolar transistor TS4 is connected to ground.
  • the base terminal of bipolar transistor TS4 is connected to terminal P15 of MCU1.
  • the reactor Ld is provided for the purpose of reducing noise in the drive voltage Vbst output from the boost DC/DC converter 9 .
  • Reactor Ld is connected between the source terminal of switch S4 and the output terminal VOUT of boost DC/DC converter 9 .
  • another noise reduction first reactor is provided between the switch S4 and the resistor Rs
  • another noise reduction reactor is provided between the resistor Rs and the heater connector Cn(+) on the positive electrode side.
  • a second reactor for reduction may be provided. Any one of the reactor Ld, the first reactor, and the second reactor may be omitted, or any two of them may be omitted.
  • these reactors for noise reduction are not essential and can be omitted.
  • the node N1 connects the source terminal of the switch S3 and one end of the reactor Ld.
  • the node N1 is connected to the output terminal VOUT of the boost DC/DC converter 9 .
  • the node N7 connects the heater connector Cn(+) on the positive electrode side (+ pole) and the non-inverting input terminal of the operational amplifier OP1.
  • the node N2 connects the drain terminal of the switch S3 and the node N7.
  • the node N4 connects the node N2 and the resistor Rs.
  • the node N4 is connected to the gate terminal of the switch S5.
  • the node N5 connects the end of the resistor R4 opposite to the operational amplifier OP1 side and the drain terminal of the switch S5. Node N5 is connected to terminal P9 of MCU1.
  • a node N3 connects the drain terminal of the switch S4 and the opposite end of the resistor Rs on the node N4 side.
  • the node N3 is connected to the positive power supply terminal of the operational amplifier OP1 and one end of the resistor RPb1 .
  • a node N6 connects the other end of the resistor RPb1 and one end of the resistor RPb2 .
  • Node N6 is connected to terminal P18 of MCU1.
  • the other end of resistor RPb2 is connected to ground.
  • the node N8 connects the heater connector Cn(-) on the negative electrode side (- pole) and the drain terminal of the switch S6.
  • the node N8 is connected to the inverting input terminal of the operational amplifier OP1.
  • the parasitic diode D5 has a configuration in which the anode is connected to the source terminal of the switch S5 and the cathode is connected to the drain terminal of the switch S5.
  • the flow when the switch S4 is turned on is as follows. First, in a state where the drive voltage Vbst is being output from the output terminal VOUT of the step -up DC/DC converter 9, the MCU 1 turns on the bipolar transistor TS4 (current amplified from the emitter terminal of the bipolar transistor TS4 is output). This connects the gate terminal of the switch S4 to ground via the resistor R S4 , the collector terminal of the bipolar transistor T S4 and the emitter terminal of the bipolar transistor T S4 .
  • the gate voltage of the switch S4 becomes close to the ground potential (0 V in this embodiment), and the absolute value of the gate-source voltage of the switch S4 becomes larger than the absolute value of the threshold voltage of the switch S4.
  • switch S4 is turned on.
  • the bipolar transistor TS4 is turned off, the absolute value of the gate-source voltage of the switch S4 becomes equal to or less than the absolute value of the threshold voltage of the switch S4, so the switch S4 is turned off.
  • Gate-to-source voltage refers to the voltage applied between the gate and source terminals. Since the switch S4 in this embodiment is a P-channel MOSFET, a negative gate-source voltage is required to turn on the switch S4.
  • the switch S4 when the potential of the source terminal becomes lower than the potential of the gate terminal by less than the threshold voltage, the switch S4 is turned on.
  • the threshold voltage of the switch S4 is -4.5V
  • the source potential is 4.9V
  • the gate potential is 0V
  • the gate-source voltage is -4.9V. Since -4.9V is lower than the threshold voltage of -4.5V, the switch S4 is turned on.
  • the source potential is 4.9V and the gate potential is 3.3V
  • the voltage between the gate and the source Since -1.6V is higher than the threshold voltage of -4.5V, the switch S4 is turned off.
  • the gate-source voltage and the threshold voltage of a P-channel MOSFET are described as absolute values ignoring signs.
  • the system power supply voltage Vcc2 (the MCU1 power supply voltage input to the MCU1 power supply terminal VDD) and the driving voltage Vbst described above preferably have the following values.
  • FIG. 21 is a diagram showing an example of voltage changes input to the gate terminals of the switches S3 and S4 in the heating mode. Note that the switches S3 and S4 are turned on when the voltage input to the gate terminal is at a low level because the switches S3 and S4 are P-channel MOSFETs in this embodiment.
  • FIG. 21 shows a driving example EX1 and a driving example EX2.
  • the MCU1 alternately turns on and off the switches S3 and S4. That is, in the drive example EX1, the MCU1 turns off the switch S4 while the switch S3 is on, and turns on the switch S4 while the switch S3 is off.
  • the period during which the voltage input to the gate terminal of the switch S3 is at low level and the period during which the voltage input to the gate terminal of the switch S4 is at low level do not overlap.
  • the drive example EX2 is different from the drive example EX1 in that the period during which the switch S3 is turned on and the period during which the switch S4 is turned on partially overlap.
  • the period during which the voltage input to the gate terminal of the switch S3 is at low level overlaps with the period during which the voltage input to the gate terminal of the switch S4 is at low level.
  • FIG. 21 shows the control cycle Tc of the MCU1.
  • the MCU 1 keeps the switch S4 ON time constant and controls the switch S3 ON time. That is, the MCU 1 supplies power to the heater HTR by PWM (Pulse Width Modulation) control during heating control.
  • the maximum value of the time during which the switch S3 is turned on is the control period Tc, excluding the fixed time during which the switch S4 is turned on.
  • the certain time period during which the switch S4 is turned on is sufficiently smaller than the maximum value of the time period during which the switch S3 is turned on, for example, 1/10 or less of this maximum value.
  • the switch S3 may be turned on multiple times during the control period Tc. In this case, if the duty ratio calculated by the PWM control is less than 100%, the switch S3 is intermittently turned on during the control period Tc excluding the certain time during which the switch S4 is turned on. Become.
  • the MCU1 controls so that the switch S4 is switched from off to on at the timing when the switch S3 is switched from on to off.
  • the MCU 1 changes the ON time of the switch S3 by fixing the timing of turning off the switch S3 and controlling the timing of turning on the switch S3.
  • the MCU 1 may supply power to the heater HTR by PFM (Pulse Frequency Modulation) control.
  • FIG. 22 is a diagram showing current flow during heating control in the heating mode.
  • the switch S3 is turned on and the switch S4 is turned off.
  • a first heating discharge path HR1 through which current flows in the order of node N1, switch S3, node N2, node N7, heater HTR, node N8, switch S6, and ground;
  • a second heating discharge path HR2 through which current flows in order of N4 and the gate terminal of switch S5, and a current in order of node N1, switch S3, node N2, node N4, resistor Rs, node N3, and the positive power supply terminal of operational amplifier OP1.
  • a third heating discharge path HR3 through which the current flows is formed.
  • a voltage lower than the drive voltage Vbst (the voltage after stepping down the drive voltage Vbst by the resistor Rs) is supplied to the positive power supply terminal of the operational amplifier OP1, and the operational amplifier OP1 is operational. That is, during heating control, due to the presence of the third heating discharge path HR3, the voltage applied between the positive power supply terminal and the negative power supply terminal of the operational amplifier OP1 is lower than the drive voltage Vbst (however, the MCU1 power supply voltage is higher than the system power supply voltage Vcc2).
  • FIG. 23 is a diagram showing current flow during temperature detection control in the heating mode.
  • the switch S3 is turned off and the switch S4 is turned on.
  • the resistance value of reactor Ld and the ON resistance value of switch S4 are sufficiently small. Therefore, due to the presence of the third detection discharge path MR3, the positive power supply terminal of the operational amplifier OP1 is supplied with a voltage (reference voltage V temp ) that is substantially the same as the drive voltage Vbst , thereby enabling the operational amplifier OP1 to operate. .
  • V temp reference voltage
  • the power supply voltage of the operational amplifier OP1 becomes higher than during heating control, so the upper limit value of the differential input value of the operational amplifier OP1 can be increased.
  • the voltage V heat obtained by dividing the voltage of the node N3 (reference voltage V temp ) by the resistor Rs and the heater HTR is input to the non-inverting input terminal of the operational amplifier OP1.
  • the potential of the node N7 matches the potential of the node N4 if wiring resistance is ignored. Therefore, the voltage input to the gate terminal of the switch S5 is also the same as the voltage V heat . Since the voltage V heat is equal to or lower than the threshold voltage of the switch S5, the switch S5 is turned off in the state of FIG. Thus, it is preferable to determine the resistance value of the resistor Rs so that the voltage V heat is equal to or lower than the threshold voltage of the switch S5.
  • the output voltage V OUT of the operational amplifier OP1 is input to the terminal P9 of the MCU1 without being divided.
  • the parasitic diode D5 behaves like a Zener diode. Therefore, even if the output voltage V OUT of the operational amplifier OP1 becomes excessive due to some factor, it is possible to prevent the voltage input to the terminal P9 of the MCU1 from increasing.
  • the resistance values of resistor R4 and resistor Rs are determined so that the voltage input to terminal P9 of MCU1 is equal to or lower than the operating voltage (system power supply voltage Vcc2) of MCU1. ing.
  • the output of the operational amplifier OP1 is Voltage V OUT is represented by the following equation (1).
  • the terms excluding the amplification factor A on the right side of the equation (1) correspond to the voltage V heat .
  • the subsequent voltage is converted into a digital value (denoted as ADC_V temp ) by the built-in ADC 1a.
  • the inverting input terminals of the operational amplifier OP4 and/or the operational amplifier OP5 are not necessarily connected to the ground potential, and may be connected to another reference potential. If this reference potential is sufficiently high, the reference potential may be connected to the non-inverting input terminal, and the divided voltage value of the output voltage V OUT or the reference voltage V temp may be connected to the inverting input terminal.
  • the output of ADC1a and operational amplifier OP4 causes temperature drift error ⁇ 1 due to the temperature inside MCU1
  • the output of ADC1b and operational amplifier OP5 causes temperature drift error ⁇ 2 due to the temperature inside MCU1. That is, strictly speaking, the digital value output from ADC 1a is ADC_V temp (1+ ⁇ 1), and strictly speaking, the digital value output from ADC 1b is ADC_V OUT (1+ ⁇ 2).
  • Equation (3) is obtained by substituting the digital value ADC_V temp (1+ ⁇ 1) for V temp in equation (2) and substituting the digital value ADC_V OUT (1+ ⁇ 2) for V OUT in equation (2).
  • ADC1a and operational amplifier OP4 and ADC1b and operational amplifier OP5 are provided inside MCU1, respectively. Therefore, the temperature drift error ⁇ 1 and the temperature drift error ⁇ 2 can be regarded as substantially the same. That is, (1+ ⁇ 1) and (1+ ⁇ 2) in equation (3) are the same value. Therefore, the temperature drift error is canceled in equation (3).
  • the MCU 1 derives the resistance value RHTR of the heater HTR by calculating the equation (3). Since the heater HTR has a characteristic that the resistance value changes according to the temperature, the temperature of the heater HTR can be obtained by deriving the resistance value RHTR.
  • equation (3) allows the temperature drift error that can occur in the output voltage V OUT (more precisely, the electronic components (op-amp OP5 and ADC1b) necessary to acquire information corresponding to the output voltage V OUT ).
  • temperature drift error that may occur in the output of V temp) and temperature drift error that may occur in the reference voltage V temp can be canceled, and the resistance value RHTR of the heater HTR can be derived more accurately. In other words, the resistance value RHTR of the heater HTR can be easily derived without being affected by the temperature of the MCU1.
  • operational amplifiers OP5 and ADC1b and operational amplifiers OP4 and ADC1a are separately provided inside the MCU1. However, these may be made common. That is, the operational amplifier and ADC for obtaining information on the output voltage V OUT and the operational amplifier and ADC for obtaining information on the reference voltage V temp are shared, and the digital value ADC_V temp (1+ ⁇ 1) and the digital value ADC_V OUT (1+ ⁇ 2) may be obtained by time division. According to this configuration, temperature drift errors occurring in these two digital values can be more matched, and the resistance value RHTR of the heater HTR can be derived with higher accuracy.
  • the MCU1 may acquire the potential of the node N1 as the reference voltage V temp and use it to derive the resistance value of the heater HTR.
  • the positive power supply terminal of the operational amplifier OP1 is always supplied with voltage and the increase in power consumption is allowed, the positive power supply terminal of the operational amplifier OP1 is connected to the node N1 instead of the node N3, and the node N1 and the voltage divider circuit are connected. Pb may be connected.
  • FIG. 24 is a diagram showing current flow when both the switch S3 and the switch S4 are on in the driving example EX2 of FIG.
  • node N4, and the gate terminal of switch S5 and a third detection path, through which current flows in the order of node N1, reactor Ld, switch S4, node N3, and the positive power supply terminal of operational amplifier OP1.
  • a discharge path MR3 is formed.
  • the node N3 and the node N4 are at substantially the same potential, so that almost no current flows through the resistor Rs. Therefore, the power supply voltage of the operational amplifier OP1 becomes the drive voltage Vbst . That is, in this state, the upper limit value of the differential input value of the operational amplifier OP1 is equal to the driving voltage Vbst . Therefore, the output voltage of the operational amplifier OP1 becomes higher than in the state of FIG.
  • the resistance of the resistor R4 and the ON resistance of the switch S5 is set so that the voltage input to the terminal P9 of the MCU1 is equal to or lower than the operating voltage (system power supply voltage Vcc2) of the MCU1. ratio is determined. Therefore, a voltage higher than the operating voltage is not input to the terminal P9 of the MCU1. That is, the operation of MCU1 is stabilized.
  • the third heating discharge path HR3 applies a voltage lower than the drive voltage Vbst to the operational amplifier OP1. It can be supplied as a power supply voltage. Further, as shown in FIG. 23, during the period in which the switch S4 is on and the switch S3 is off, a voltage equivalent to the drive voltage Vbst can be supplied as the power supply voltage of the operational amplifier OP1 through the third detection discharge path MR3. can. Therefore, as shown in FIG.
  • the period from the start of the heating of the heater HTR to the end of the heating until the end of the temperature detection of the heater HTR (from the fall of the gate voltage of the switch 3 to the period immediately after that).
  • the power supply voltage can be continuously supplied to the operational amplifier OP1. Therefore, compared with the reference example in which the power supply voltage is not supplied to the operational amplifier OP1 during the ON period of the switch S3 (heating period of the heater HTR), it is not necessary to wait until the power supply voltage of the operational amplifier OP1 sufficiently rises during the temperature detection control. Heating control and temperature detection control can be efficiently executed.
  • the drive example EX2 it is possible to supply the power supply voltage of the operational amplifier OP1 required for temperature detection control while performing heating control. Therefore, the power supply voltage of the operational amplifier OP1 can be brought into a sufficiently raised state at the timing when the heating control is finished, and the heater HTR can be turned on at an earlier timing after the heating of the heater HTR is finished, as compared with the drive example EX1. can be detected with high accuracy.
  • the power supply voltage may not be supplied to the operational amplifier OP1 during the period after the switch S4 is turned off until the switch S3 is turned on next time. be.
  • it is the heating control that is performed immediately after this period and the operation of the operational amplifier OP1 is not essential. Therefore, there is no problem even if the power supply voltage is not supplied to the operational amplifier OP1 during this period.
  • power consumption by the operational amplifier OP1 can be eliminated during this period, it is possible to contribute to power saving of the sucker 100 as a whole.
  • switch S3, switch S4, and switch S6 shown in FIG. 20 each have a preferred configuration. Preferred examples of each switch will be described below.
  • the switch S3 preferably has a small on-resistance value (in other words, a large chip size) in order to allow more current to flow through the heater HTR when heating the heater HTR.
  • a small on-resistance value in other words, a large chip size
  • the comparison is performed under the condition that the temperature and the flowing current are the same.
  • the switch S3 is turned on and off at high speed by PWM control, PFM control, or the like when heating the heater HTR. For this reason, it is preferable that the maximum current value that can be output instantaneously (maximum current value that can be output in a pulse form) is large. Moreover, the switch S3 preferably has a maximum current value that can be continuously output larger than that of the switch S4 from the viewpoints of allowing a large amount of current to flow through the heater HTR and having a longer ON time than the switch S4.
  • the maximum current values that can be output from each of the switches S3, S4, and S6 the comparison is performed under the condition that the temperatures are the same.
  • Switch S3 is preferably a P-channel MOSFET, as illustrated in FIG.
  • the switch S3 can also be composed of an N-channel MOSFET.
  • the voltage supplied from the terminal P16 of the MCU1 to the gate terminal of the switch S3 is set to a value higher than the drive voltage Vbst in order to turn on the switch S3. It is necessary to raise the power supply voltage of MCU1.
  • the switch S3 is composed of a P-channel MOSFET, the power supply voltage of the MCU1 can be lowered below the driving voltage Vbst , so that the power consumption of the MCU1 can be suppressed.
  • the switch S4 preferably has a small on-resistance so that a sufficient voltage can be applied to the series circuit of the resistor Rs and the heater HTR. However, if the on-resistance value is made too small, the size increases. Therefore, in order to reduce the circuit area, the on-resistance value of the switch S4 is preferably larger than the on-resistance value of the switch S3. In order that the current for detecting the resistance value of the heater HTR does not change the temperature of the heater HTR, it is preferable that the ON resistance value of the switch S4 is not too small. Specifically, the on-resistance value of the switch S4 is preferably smaller than the resistance value of the resistor Rs and larger than the on-resistance value of the switch 3 .
  • the detection of the resistance value of the heater HTR needs to be performed in a shorter time than the heating of the heater HTR.
  • the switch S6 since the switch S6 is always turned on in the heating mode, it does not have to be highly responsive. Therefore, the responsiveness of the switch S4 is preferably higher than the responsiveness of the switches S3 and S6. Indicators of transistor responsiveness include turn-on time t on , turn-on delay time t d(on) , rise time t r , turn-off time t off , turn-off delay time t d(off) , and fall time t f . .
  • the turn-on delay time td (on) is the time required for the drain-source voltage to reach 90% of the set value after the gate-source voltage reaches 10% of the set value at turn-on.
  • the rise time tr is the time required for the drain-source voltage to reach from 90% to 10% of the set value at turn-on.
  • Turn-on time t on is the sum of turn-on delay time t d(on) and rise time t r .
  • the turn-off delay time td (off) is the time required for the drain-source voltage to reach 10% of the set value after the gate-source voltage reaches 90% of the set value at turn-off.
  • the fall time tf is the time required for the drain-source voltage to reach from 10% to 90% of the set value at turn-off.
  • the turn-off time toff is the sum of the turn- off delay time td (off) and the fall time tf .
  • the resistance value of the heater HTR must be detected in a shorter time than the heating of the heater HTR.
  • the turn-on delay or rise time of switch S4 is preferably shorter than the turn-on delay or rise time of switches S3 and S6, respectively.
  • the turn-off delay or fall time of switch S4 is preferably shorter than the turn-off delay or fall time of switches S3 and S6, respectively.
  • Switch S4 is preferably a P-channel MOSFET, as illustrated in FIG.
  • the switch S4 can also be composed of an N-channel MOSFET.
  • the voltage supplied from the terminal P15 of the MCU1 to the gate terminal of the switch S4 is set to a value higher than the drive voltage Vbst in order to turn on the switch S4. Therefore, the power supply voltage of MCU1 is increased.
  • the switch S4 is composed of a P-channel MOSFET, the power supply voltage of the MCU1 can be lowered below the driving voltage Vbst , so that the power consumption of the MCU1 can be suppressed.
  • the switch S6 preferably has a small on-resistance value (in other words, a large chip size) in order to allow more current to flow through the heater HTR when heating the heater HTR.
  • the on-resistance value of the switch S6 is preferably equal to the on-resistance value of the switch S3.
  • the switch S6 needs to pass current continuously in the heating mode. Therefore, it is preferable that the maximum current value that the switch S6 can continuously output is larger than that of the switches S4 and S3. On the other hand, since the switch S6 is always turned on in the heating mode, it is preferable that the maximum current value that the switch S6 can instantaneously output (output in pulse form) is smaller than that of the switch S3, which is repeatedly turned on and off. If the maximum current value that can be instantaneously output (output in the form of a pulse) is excessively increased for the application of the switch S6, the chip size and cost of the switch S6 may increase.
  • the switch S3 is connected to a high-potential location on the circuit, it is more difficult to improve the responsiveness than the switch S6 from the viewpoint of safety. Therefore, making the switch S6 more responsive than the switch S3 is effective in improving the responsiveness of the entire circuit.
  • the turn-off delay time or fall time of switch S6 is preferably shorter than the turn-off delay time or fall time of switch S3.
  • the turn-on delay or rise time of switch S6 is preferably shorter than the turn-on delay or rise time of switch S3.
  • Switch S6 is preferably an N-channel MOSFET, as illustrated in FIG.
  • the switch S6 can also be composed of a P-channel MOSFET.
  • the switch S6 is composed of a P-channel MOSFET, it is necessary to set the voltage supplied from the terminal P14 of the MCU1 to the gate terminal of the switch S6 to a value lower than the ground level in order to turn on the switch S6. be.
  • Generating voltages below ground requires specialized circuitry such as negative power supplies and rail splitter circuits.
  • the switch S6 is composed of an N-channel MOSFET, the MCU 1 can turn on the switch S6 by inputting a voltage equivalent to its own power supply voltage to the gate terminal, thereby suppressing the complexity of the circuit. .
  • the switch S6 is composed of an N-channel MOSFET, a high level signal is input to the enable terminal EN of the boost DC/DC converter 9 at the same time when the switch S6 is turned on, and the drive voltage is output from the boost DC/DC converter 9. V bst can be output.
  • the switch S6 is composed of a P-channel MOSFET, it is necessary to connect an inverter for logic inversion between the enable terminal EN of the boost DC/DC converter 9 and the gate terminal of the switch S6.
  • an inverter can be made unnecessary, and a reduction in circuit scale and manufacturing cost can be realized.
  • the switch S3, the switch S4, and the switch S6 have different configurations.
  • the term "switches having different configurations including transistors” means that at least one of the types of transistors and the specifications of the transistors (on-resistance, responsiveness, etc.) is different. To tell. By adopting such a configuration, compared to the case where all three switches are of the same type and specifications, the type and specifications of each switch can be made to correspond to the location where each switch is connected. . Therefore, the performance of the aspirator 100 can be improved.
  • FIG. 25 is a plan view of the receptacle mounting substrate 162 viewed from the main surface 162a side.
  • FIG. 26 is a plan view of the receptacle mounting substrate 162 viewed from the side of the secondary surface 162b.
  • the main surface 162a of the receptacle mounting substrate 162 is provided with the reactor Lc, resistor Rs, switch S4, switch S6, and heater connector Cn among the electronic components shown in FIG.
  • the secondary surface 162b of the receptacle mounting board 162 is provided with the boost DC/DC converter 9, the switch S3, the resistor R Pb1 , and the resistor R Pb2 among the electronic components shown in FIG. be done.
  • resistor RPb1 and resistor RPb2 are closely spaced.
  • a resistor RPb1 and a resistor RPb2 form a voltage dividing circuit Pb that divides the potential of the node N3. If there is a temperature difference between the resistor RPb1 and the resistor RPb2 , the voltage division ratio of the voltage dividing circuit Pb fluctuates, and the accuracy of obtaining the potential of the node N3 required to derive the resistance value of the heater HTR decreases. . As shown in FIG.
  • the resistor RPb1 and the resistor RPb2 are mounted on the same surface of the receptacle mounting board 162, and are arranged close to each other, so that the resistor RPb1 and the resistor RPb2 are mounted on the same surface. It can prevent temperature differences. In order to enhance this effect, it is preferable that the electronic component closest to the resistor RPb1 among the electronic components mounted on the receptacle mounting substrate 162 is the resistor RPb2 .
  • those that can become heat sources or noise sources include the switch S3, the step-up DC/DC converter 9, the reactor Lc, and the heater connector Cn.
  • the switch S3 generates the largest amount of heat
  • the step-up DC/DC converter 9 generates the second largest amount of heat.
  • the switch S3 and the step-up DC/DC converter 9, which generate a large amount of heat, the switch S4, the switch S6, and the resistor Rs are mounted on different surfaces of the same substrate.
  • switch S3 and boost DC/DC converter 9 are mounted on minor surface 162b
  • switch S4, switch S6 and resistor Rs are mounted on main surface 162a.
  • the switch S3 and the step-up DC/DC converter 9, the switch S4, the switch S4, and the The switch S6 and the resistor Rs are arranged so as not to overlap. By doing so, the heat or noise generated by the switch S3 and the boost DC/DC converter 9 is less likely to be transmitted to the switch S4, the switch S6 and the resistor Rs through the substrate. That is, the switch S4, the switch S6, and the resistor Rs can be more strongly suppressed from being affected by heat or noise from the switch S3 and the step-up DC/DC converter 9.
  • the switch S4 or the switch S6 may be mounted on the secondary surface 162b. By doing so, either the switch S4 or the switch S6 can be prevented from being affected by heat or noise from the switch S3 and the step-up DC/DC converter 9.
  • FIG. 25 the switch S4 or the switch S6 may be mounted on the secondary surface 162b.
  • At least one of the switches S4 and S6 among the electronic components of the circuit shown in FIG. 20 may be mounted on a board different from the receptacle mounting board 162 (for example, the MCU mounting board 161, etc.). . By doing so, at least one of the switch S4 and the switch S6 can be prevented from being affected by heat or noise from the switch S3 and the boost DC/DC converter 9 .
  • FIG. 25 shows a distance DS4 between the mounting area where the resistor Rs is mounted on the main surface 162a and the mounting area where the reactor Lc is mounted on the main surface 162a (the straight line connecting the two mounting areas at the shortest distance). length) is shown.
  • FIG. 25 also shows a distance DS5 between the mounting area where the switch S4 is mounted on the main surface 162a and the mounting area where the reactor Lc is mounted on the main surface 162a (a straight line connecting the two mounting areas at the shortest distance). length) is shown. And the distance DS4 is shorter than the distance DS5.
  • the resistance value of the resistor Rs is less susceptible to temperature fluctuations than the on-resistance value of the switch S4. Therefore, the substrate area can be effectively utilized by arranging the resistor Rs, which is less susceptible to temperature changes, closer to the reactor Lc than the switch S4.
  • a resistor Rs is mounted between the switch S4 and the reactor Lc. That is, the mounting area of the resistor Rs exists on a straight line connecting the mounting area of the switch S4 and the mounting area of the reactor Lc. By doing so, the resistor Rs becomes a physical barrier that protects the switch S4 from the heat generated by the reactor Lc. As a result, it is possible to strongly suppress the temperature change of the switch S4. If the on-resistance value of the switch S4 fluctuates, it affects the measurement accuracy of the resistance value of the heater HTR. Therefore, it is particularly important to suppress the temperature change of switch S4.
  • FIG. 27 is an enlarged view of range H shown in FIG. 25.
  • FIG. 27 As shown in FIG. 27, on the main surface 162a of the receptacle mounting substrate 162, the mounting area of the switch S4 and the mounting area of the heater connector Cn are separated from each other. A resistor R S4 and a bipolar transistor T S4 at are implemented. In other words, the resistor R S4 and the bipolar transistor T S4 are mounted on the straight lines DL1 and DL2 connecting the mounting area of the switch S4 and the mounting area of the heater connector Cn, respectively. According to this configuration, resistor R S4 and bipolar transistor T S4 provide a physical barrier to protect switch S4 from heat generated at heater connector Cn. As a result, it is possible to strongly suppress the temperature change of the switch S4.
  • the switch S4 is arranged near the outer edge of the main surface 162a of the receptacle mounting substrate 162. As shown in FIGS. Specifically, on the main surface 162a of the receptacle mounting board 162, the switch S4 mounting area and the closest edge 162em, which is the edge closest to the switch S4 mounting area among the rightward edges 162e of the main surface 162a, are separated. The distance DS1 between them is shorter than the distance DS2 between the center of the main surface 162a of the receptacle mounting board 162 in the horizontal direction and the mounting area of the switch S4.
  • the switch S4 is arranged near the edge of the receptacle mounting board 162, so that it is less likely to be affected by heat generated by other electronic components. In particular, as shown in FIG. 27, no other electronic component exists between the closest edge 162em and the switch S4. By using S4, the temperature change of the switch S4 can be further suppressed.
  • the distance DS3 between the mounting area of the resistor Rs on the main surface 162a of the receptacle mounting board 162 and the edge 162en closest to the mounting area of the resistor Rs among the edges 162e is the distance It is larger than DS1.
  • resistor Rs is less sensitive to temperature changes than switch S4. Therefore, by arranging the resistor Rs close to the center of the receptacle mounting board 162, the board area can be effectively utilized.
  • the voltage V GS (absolute value) applied between the gate and the source when the switch S4 is turned on is as high as possible. That is, when the switch S4 is a P-channel MOSFET, it is preferable to set the voltage VGS applied between the gate and the source when it is on to a negative value as large as possible. This is because the on-resistance value of the switch S4 can be lowered by doing so, the Joule heat generated when the switch S4 is on can be reduced, and the temperature fluctuation of the switch S4 can be suppressed.
  • the maximum rated value (absolute value) of the voltage that can be applied between the gate and source of the switch S4 is defined as voltage V GSS
  • the threshold voltage (absolute value) between the gate and source of switch S4 is defined as voltage V th .
  • the MCU 1 preferably controls the voltage applied to the gate terminal of the switch S4 so that the voltage V GS (absolute value) is closer to the voltage V GSS between the voltage V GSS and the voltage V th . .
  • the gate terminal of the switch S4 is set such that the absolute value of the difference between the voltage V GSS and the voltage V GS (absolute value) is smaller than the absolute value of the difference between the voltage V th and the voltage V GS (absolute value). It is preferable to control the voltage applied to .
  • an overvoltage protection diode such as a varistor between the gate terminal and the source terminal of the switch S4.
  • a power supply (power supply BAT); a heater connector (heater connector Cn) in which a heater (heater HTR) including a + pole and a - pole and consuming power supplied from the power supply to heat the aerosol source is connected to the + pole and the - pole; , a switch (switch S4) connected in series to either one of the + pole and the - pole; a fixed resistor (resistor Rs) connected in series to either one of the + pole and the - pole; a circuit board (receptacle mounting board 162) on which the switch is mounted; a controller (MCU1) configured to perform predetermined control based on the voltage applied to the fixed resistor or the heater connector when the switch is ON; The distance between the first mounting area where the switch is mounted on the circuit board and the first nearest edge (closest edge 162em) which is the edge closest to the switch among the edges of the circuit board ( The distance DS1) is shorter than the distance (distance DS2) between the first mounting area and the center of
  • the switch has the characteristic that the ON resistance value varies depending on its own temperature. Therefore, if the switch is susceptible to heat generated by other electronic components mounted on the circuit board, the ON resistance value will fluctuate. According to (1), the switch is arranged near the edge of the circuit board, which is less susceptible to heat generated by other electronic components. Therefore, the error in the voltage value applied to the fixed resistor or heater connector acquired by the controller is reduced, and the accuracy of predetermined control is improved.
  • the switch S3, the switch S4 and the resistor Rs are connected in parallel between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side.
  • a switch S3, a switch S4 and a resistor Rs may be connected in parallel between the line and the heater connector Cn on the negative electrode side.
  • the switch S6 is connected between the output terminal of the boost DC/DC converter 9 and the heater connector Cn on the positive electrode side or omitted. Even in this configuration, the configuration (1) reduces the error in the voltage value applied to the fixed resistor or heater connector acquired by the controller, and improves the accuracy of the predetermined control.
  • the switch since the switch is arranged closest to the first nearest edge, it is possible to avoid the influence of heat generated by other electronic components on the switch as much as possible. Therefore, the error in the voltage value applied to the fixed resistor or heater connector acquired by the controller is reduced, and the accuracy of the predetermined control is improved.
  • a fixed resistor having a resistance value with lower temperature dependence than the ON resistance of the switch is mounted closer to the center of the substrate than the switch. Therefore, the substrate area can be effectively utilized. As a result, the cost and size of the aerosol generator can be reduced.
  • the switch is connected in series to the + pole and includes a P-channel MOSFET;
  • the P-channel MOSFET includes a source terminal, a gate terminal, and a drain terminal, a boost converter (boost DC/DC converter 9) having an input terminal (switching terminal SW) connected to the power supply and having an output terminal (output terminal VOUT) connected to the source terminal;
  • the controller includes a terminal (terminal P15) connected to the gate terminal; the voltage input to the power supply terminal (power supply terminal VDD) of the controller is lower than the voltage output from the output terminal of the boost converter; Power supply unit for the aerosol generator.
  • the boost converter apply a high voltage with excellent aerosol generation efficiency to the heater, but also a power-saving controller that operates at a low voltage can easily turn on the voltage between the gate and source of the switch. can be a value for For this reason, it is possible to achieve both high functionality and power saving of the aerosol generating device at the same time.
  • the power supply unit of the aerosol generator, the switch includes an overvoltage protection diode connected between the gate terminal and the source terminal; Power supply unit for the aerosol generator.
  • the switch even if a surge voltage that can be generated by switching in the boost converter is applied to the switch, the surge voltage can be kept below the maximum rated value by the overvoltage protection diode. As a result, the switch is less likely to fail, and the durability of the aerosol generator can be improved.
  • the P-channel MOSFET is turned ON when the value of the voltage (voltage VGS) applied between the gate terminal and the source terminal exceeds a threshold (voltage Vth) so that the source terminal side becomes high potential
  • the controller adjusts the gate terminal so that a voltage applied between the gate terminal and the source terminal has a predetermined voltage value so that the source terminal side is at a high potential in the ON state of the P-channel MOSFET. configured to apply a voltage to The absolute value of the difference between the predetermined voltage value and the maximum rated value (voltage VGSS) of the voltage that can be applied between the gate terminal and the source terminal so that the source terminal side has a high potential is the threshold value and the predetermined voltage. less than the absolute value of the difference between the values, Power supply unit for the aerosol generator.
  • the ON resistance can be lowered and the Joule heat due to the ON resistance can be reduced. This makes it more difficult for the temperature of the switch to change when it is ON, so that the error in the voltage value applied to the fixed resistor or heater connector obtained by the controller is reduced, and the accuracy of predetermined control is improved.
  • the power supply unit of the aerosol generator A voltage converter (step-up DC/DC converter 9) capable of converting the voltage output from the power supply and outputting it to the heater,
  • the circuit board includes an A side (major side 162a) on which the switch is mounted, and a B side (minor side 162b) on which the voltage converter is mounted and which is the back side of the A side. Power supply unit for the aerosol generator.
  • the switch since the voltage converter, which generates considerable heat when converting the voltage, is not mounted on the same surface as the switch, the switch is less susceptible to the heat generated by the voltage converter. As a result, there is less error in the voltage value applied to the fixed resistor or heater connector obtained by the controller, and the accuracy of the predetermined control is more improved.
  • the power supply unit of the aerosol generator includes an IC (step-up DC/DC converter 9) mounted on the B surface and a reactor (reactor Lc) mounted on the A surface, Power supply unit for the aerosol generator.
  • the IC and reactor that make up the voltage converter are both large electronic components, so they occupy a large area on the board.
  • a reactor that generates less heat than the IC is mounted on the same surface as the switch since it does not include switching elements. As a result, the temperature of the switch is less likely to change while avoiding the enlargement of the substrate, so that the accuracy of predetermined control can be improved while reducing the cost and size of the aerosol generating device.
  • the power supply unit of the aerosol generator The distance (distance DS4) between the second mounting region, which is the region where the fixed resistor is mounted on the A surface, and the third mounting region, which is the region where the reactor is mounted on the A surface, is equal to the first shorter than the distance (distance DS5) between the mounting area and the third mounting area; Power supply unit for the aerosol generator.
  • the resistance value of the fixed resistor is less temperature dependent than the ON resistance of the switch. According to (10), the fixed resistor is mounted close to the reactor that generates heat, so that the board area can be effectively utilized. As a result, the cost and size of the aerosol generator can be reduced.
  • the fixed resistor becomes a physical barrier that protects the switch from the heat generated by the reactor. For this reason, the temperature of the switch is less likely to change, and the predetermined control is more stable.
  • a power supply unit for an aerosol generator according to any one of (1) to (11),
  • the circuit board includes an A side (main surface 162a) on which the switch and the heater connector are mounted,
  • An electronic component (bipolar transistor TS4 and resistor RS4) mounted on a straight line (straight line DL1, straight line DL2) connecting the first mounting area and the heater connector, Power supply unit for the aerosol generator.
  • the electronic component becomes a physical barrier that protects the switch from the heat generated by the heater connector. For this reason, the temperature of the switch is less likely to change, and the predetermined control is more stable.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Charge And Discharge Circuits For Batteries Or The Like (AREA)

Abstract

L'invention concerne un dispositif de génération d'aérosol avec lequel la précision de commande peut être améliorée.　Dans la présente invention, un dispositif d'inhalation (100) comprend un commutateur S4 connecté en série à un connecteur de chauffage côté électrode positive Cn, une résistance Rs connectée en série au connecteur de chauffage côté électrode positive Cn, un substrat équipé d'un réceptacle (162) sur lequel le commutateur S4 est monté, et une MCU 1 configurée de façon à exécuter une commande prescrite sur la base de la tension appliquée au connecteur de dispositif de chauffage Cn lorsque le commutateur S4 est allumé. La distance D1 entre une première région de montage, qui est une région sur le substrat équipé d'un réceptacle (162) où le commutateur S4 est monté, et un bord de contact le plus proche (162 em), qui est le bord le plus proche du commutateur S4 parmi les bords (162e) du substrat équipé d'un réceptacle (162), est inférieure à la distance D2 entre la première région de montage et le centre du substrat équipé d'un réceptacle (162).
PCT/JP2022/007388 2021-05-10 2022-02-22 Unité d'alimentation électrique pour dispositif de génération d'aérosol WO2022239361A1 (fr)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243484A (ja) * 2009-03-31 2010-10-28 Advantest Corp 試験装置およびドライバ回路
JP2012230937A (ja) * 2011-04-25 2012-11-22 Denso Corp 回路基板
CN111262118A (zh) * 2020-01-20 2020-06-09 北京恭科光电科技有限公司 一种适用于近地空间环境的器件散热结构
CN111513365A (zh) * 2020-04-02 2020-08-11 深圳麦时科技有限公司 加热式气溶胶产生装置及方法
JP2020150347A (ja) * 2019-03-12 2020-09-17 日立オートモティブシステムズ株式会社 車両用電子装置
JP6865879B1 (ja) * 2020-09-07 2021-04-28 日本たばこ産業株式会社 エアロゾル発生システム、吸引器用コントローラ、および電源装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010243484A (ja) * 2009-03-31 2010-10-28 Advantest Corp 試験装置およびドライバ回路
JP2012230937A (ja) * 2011-04-25 2012-11-22 Denso Corp 回路基板
JP2020150347A (ja) * 2019-03-12 2020-09-17 日立オートモティブシステムズ株式会社 車両用電子装置
CN111262118A (zh) * 2020-01-20 2020-06-09 北京恭科光电科技有限公司 一种适用于近地空间环境的器件散热结构
CN111513365A (zh) * 2020-04-02 2020-08-11 深圳麦时科技有限公司 加热式气溶胶产生装置及方法
JP6865879B1 (ja) * 2020-09-07 2021-04-28 日本たばこ産業株式会社 エアロゾル発生システム、吸引器用コントローラ、および電源装置

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