WO2022233220A1

WO2022233220A1 - Shielding differential vias, fabrication methods therefor, and differential signal high-speed channel

Info

Publication number: WO2022233220A1
Application number: PCT/CN2022/086146
Authority: WO
Inventors: 张远望
Original assignee: 中兴通讯股份有限公司
Priority date: 2021-05-07
Filing date: 2022-04-11
Publication date: 2022-11-10
Also published as: CN115315059A

Abstract

Shielding differential vias, methods for fabricating a shielding differential via, and a differential signal high-speed channel. By dividing a metal hole wall on an inner wall of a strip-shaped hole into a differential transmission line and a shielding hole wall, the shielding hole wall can be used as a reference for the differential transmission line, impedance thereof is stable, and is not affected by the length of the hole, aperture size, dielectric constant of a printed circuit board material, or counter pad size, or the like; and an interference signal can be well isolated, and in particular, coupling between adjacent parallel long vias can be blocked. In addition, the width and line spacing of the differential transmission line can be controlled by adjusting the position and aperture of a dividing hole, thereby controlling the impedance of the differential transmission line to be a design value, such that the impedance of the differential transmission line and the impedance of a connected signal line is matched, so as to reduce return loss.

Description

Shielded differential via, fabrication method, and differential signal high-speed channel

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based on the Chinese patent application with the application number of 202110494365.4 and the application date of May 7, 2021, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is incorporated herein by reference.

technical field

The present application relates to the technical field of high-speed design, and in particular, to a shielded differential via, a method for fabricating a shielded differential via, and a differential signal high-speed channel.

Background technique

With the continuous improvement of the signal transmission rate, the signal channel is more and more sensitive to impedance continuity/return loss and crosstalk, especially for the rate above 56Gbps. The via hole diameter, anti-pad, length, and dielectric constant of the high-speed board all affect the impedance of the via, resulting in unstable impedance and unable to meet the design requirements, especially for the crimping holes of high-speed connectors, because the pins are thicker , usually the impedance is low, and the impedance that deviates from the transmission line is more; in addition, for parallel vias, especially parallel long vias, the crosstalk is also greatly affected. At present, there are no effective measures for high-speed design of vias. In some cases, the technology is difficult to apply to high-speed channel design. Some single vias are shielded, using multiple plug holes and copper sinking, and the process is complicated and cannot be used. for differential vias.

SUMMARY OF THE INVENTION

The present application aims to solve one of the technical problems existing in the related art at least to a certain extent, and provides a shielded differential via, a method for fabricating a shielded differential via, and a differential signal high-speed channel.

In a first aspect, an embodiment of the present application provides a shielded differential via, including an elongated hole and at least three split holes arranged on a printed circuit board, wherein the inner wall of the elongated hole is provided with a metal hole wall, so The at least three dividing holes pass through the metal hole wall, so that the metal hole wall is divided into a first differential transmission line, a second differential transmission line and a first shielding hole wall.

In a second aspect, an embodiment of the present application provides a method for fabricating a shielded differential via, including: milling an elongated hole on a printed circuit board; performing copper immersion electroplating on the inner wall of the elongated hole to form a metal hole wall; At least three dividing holes are drilled on the printed circuit board, and the at least three dividing holes pass through the metal hole wall, so that the metal hole wall is divided into a first differential transmission line, a second differential transmission line and a The first shielding hole wall.

In a third aspect, embodiments of the present application provide a shielded differential via, including a first crimp via, a second crimp via, a long blind via, and three split blind vias disposed on a printed circuit board, wherein , the long blind holes are respectively overlapped with the first crimping vias and the second crimping vias, the first crimping vias, the second crimping vias and the long crimping vias The inner wall of the blind hole is provided with a metal hole wall; the three divided blind holes pass through the metal hole wall of the inner wall of the long blind hole, so that the metal hole wall of the inner wall of the long blind hole is divided into third A differential transmission line, a fourth differential transmission line and a second shielding hole wall; wherein: the third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimped via, and the fourth differential transmission line is connected to the second The metal hole wall crimping the inner wall of the via hole is electrically connected.

In a fourth aspect, an embodiment of the present application provides a method for fabricating a shielded differential via, including: drilling a first crimping via and a second crimping via on a printed circuit board; milling the printed circuit board A long blind hole is formed, and the long blind hole is partially overlapped with the first crimping via hole and the second crimping via hole; in the first crimping via hole and the second crimping via hole The via hole and the inner wall of the long blind hole are electroplated with copper immersion to form a metal hole wall; three divided blind holes are drilled on the printed circuit board, and the three divided blind holes pass through the long blind hole the metal hole wall of the inner wall of the hole, so that the metal hole wall of the inner wall of the long blind hole is divided into a third differential transmission line, a fourth differential transmission line and a second shielding hole wall; wherein: the third differential transmission line and the The metal hole wall of the first crimped via hole is electrically connected, and the fourth differential transmission line is electrically connected to the metal hole wall of the second crimped via hole inner wall.

In a fifth aspect, an embodiment of the present application provides a differential signal high-speed channel: the differential signal high-speed channel includes an elongated hole and at least three separation holes arranged on a printed circuit board, wherein the inner wall of the elongated hole is provided with There is a metal hole wall, and the at least three dividing holes pass through the metal hole wall of the inner wall of the elongated hole, so that the metal hole wall of the inner wall of the elongated hole is divided into a first differential transmission line, a second differential transmission line and a The first shielding hole wall; the differential signal high-speed channel further includes a first crimping via hole, a second crimping via hole, a long strip blind hole and three split blind holes arranged on the printed circuit board. The blind holes are respectively overlapped with the first crimping vias and the second crimping vias, the first crimping vias, the second crimping vias and the inner walls of the elongated blind holes A metal hole wall is provided, and the three divided blind holes pass through the metal hole wall of the inner wall of the long blind hole, so that the metal hole wall of the inner wall of the long blind hole is divided into a third differential transmission line, a fourth A differential transmission line and a second shielding hole wall; wherein: the third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimped via hole, and the fourth differential transmission line is electrically connected to the inner wall of the second crimped via hole The differential signal high-speed channel also includes a first transmission line and a second transmission line arranged on the printed circuit board, and the first differential transmission line is connected to the third differential transmission line through the first transmission line. ; The second differential transmission line is connected to the fourth differential transmission line through the second transmission line.

Other features and advantages of the present application will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the present application. The objectives and other advantages of the application may be realized and attained by the structure particularly pointed out in the description, claims and drawings.

Description of drawings

The accompanying drawings are used to provide a further understanding of the technical solutions of the present application, and constitute a part of the specification. They are used to explain the technical solutions of the present application together with the embodiments of the present application, and do not constitute a limitation on the technical solutions of the present application.

The application is further described below in conjunction with the accompanying drawings and embodiments;

FIG. 1 is a schematic structural diagram of a shielded differential via provided by an embodiment of the present application;

FIG. 2 is a schematic structural diagram of a shielded differential via provided by another embodiment of the present application;

3 is a schematic structural diagram of an elongated hole for shielding differential vias provided by an embodiment of the present application when no dividing holes are provided;

4 is a flowchart of a method for fabricating a shielded differential via provided by an embodiment of the present application;

FIG. 5 is a schematic structural diagram of a first crimped via and a second crimped via part for shielding a differential via provided by another embodiment of the present application;

6 is a schematic structural diagram of an elongated blind hole portion for shielding differential vias provided by another embodiment of the present application;

7 is a flowchart of a method for fabricating a shielded differential via provided by another embodiment of the present application;

FIG. 8 is a schematic structural diagram of a differential signal high-speed channel provided by still another embodiment of the present application.

Detailed ways

This section will describe the specific embodiments of the present application in detail. Several embodiments of the present application are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand the present application. each technical feature and overall technical solution, but it should not be construed as a limitation on the protection scope of this application.

In the description of this application, if the first and second are described only for the purpose of distinguishing technical features, they should not be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features or implicitly indicating The order of the indicated technical features.

In the description of this application, unless otherwise clearly defined, terms such as setting, installation, and connection should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in this application in combination with the specific content of the technical solution.

Embodiments of the present application provide a shielded differential via hole, a method for fabricating a shielded differential via hole, and a differential signal high-speed channel, the impedance of the shielded differential via hole is stable, the interference signal can be isolated, and the fabrication process is simple.

The embodiments of the present application will be further described below with reference to the accompanying drawings.

The embodiment of the first aspect of the present application provides a shielded differential via, including a long hole 100 and at least three dividing holes 300 arranged on a printed circuit board. The inner wall of the long hole 100 is provided with a metal hole wall. Referring to FIG. As shown in 3, the metal hole wall of the inner wall of the elongated hole 100 includes a first straight wall 240, a second straight wall 250 and two arc-shaped hole walls. The first straight wall 240 and the second straight wall 250 are parallel to each other, and the two arcs The shaped hole walls connect the first straight wall 240 and the second straight wall 250 respectively.

In addition, referring to FIGS. 1 and 2 , at least three dividing holes 300 pass through the metal hole wall so that the metal hole wall is divided into the first differential transmission line 210 , the second differential transmission line 220 and the first shielding hole wall 230 .

By dividing the metal hole wall of the inner wall of the elongated hole 100 into a differential transmission line and a shielding hole wall, the shielding hole wall can be used as the reference ground of the differential transmission line, and the impedance is stable, and is not affected by the hole length, aperture size, and the dielectric constant of the printed circuit board. , the size of the anti-pad, etc.; it can well isolate the interference signal, especially can block the coupling between adjacent parallel long vias; in addition, the differential transmission line can also be controlled by adjusting the position and aperture of the split hole 300 Therefore, the impedance of the differential transmission line is controlled to be the design value, so that the impedance of the differential transmission line is matched with the impedance of the connected signal line, so as to reduce the return loss; the embodiment of the present application overcomes the problem that the differential signal via impedance is uncontrolled, There are problems such as large return loss, no shielding or poor shielding effect, and the manufacturing process is simple and uncomplicated, and is easy to implement.

Referring to FIG. 1 , in the shielded differential via holes provided in this embodiment, three dividing holes 300 are provided, and the three dividing holes 300 pass through the first straight wall 240 or pass through the second straight wall 250 . It can be understood that the three dividing holes 300 are all arranged on one long straight wall of the metal hole wall, so that the first straight wall 240 or the second straight wall 250 is divided into the first differential transmission line 210 by the three dividing holes 300 , the second differential transmission line 220 .

The first differential transmission line 210 and the second differential transmission line 220 are divided by one long straight wall of the metal hole wall on the inner wall of the elongated hole 100 as an edge-coupled differential signal, and then the other long straight wall of the metal hole wall is used. And the two arc-shaped hole walls are used as the reference ground and shield for the differential signal, which is suitable for the situation where the differential pin arrangement is perpendicular to the edge of the chip.

Referring to FIG. 2 , different from the differential transmission line structure shown in the embodiment of FIG. 1 , in the shielded differential via holes provided in this embodiment, four split holes 300 are provided, and two split holes 300 pass through the first straight wall 240 to The first differential transmission line 210 is divided, and the other two dividing holes 300 pass through the second straight wall 250 to divide the second differential transmission line 220 .

The first differential transmission line 210 is divided by one long straight wall of the metal hole wall of the inner wall of the elongated hole 100, and the second differential transmission line 220 is divided by the other long straight wall, that is, the two sides of the elongated hole 100 are used as the width Edge-coupled differential signal, other parts are used as reference ground and shielding, which is suitable for the case where the differential pin arrangement is parallel to the edge of the chip.

Referring to FIG. 4 , an embodiment of a second aspect of the present application provides a method for fabricating a shielded differential via, and the fabrication method includes the following steps.

Step S410: Milling the elongated hole 100 on the printed circuit board.

Step S420 : performing copper immersion electroplating on the inner wall of the elongated hole 100 to form a metal hole wall.

Step S430: Drill at least three dividing holes 300 on the printed circuit board, and the at least three dividing holes 300 pass through the metal hole wall, so that the metal hole wall is divided into the first differential transmission line 210, the second differential transmission line 220 and the first differential transmission line 220. A shielding hole wall 230 .

It should be noted that after step S440 is performed to form a metal hole wall on the inner wall of the elongated hole 100 , a resin plug hole may also be used to facilitate subsequent drilling of the split hole 300 .

It can be understood that the printed circuit board is generally a multi-layer board that is laminated and laminated according to the conventional processing technology. The processing technology of the printed circuit board includes but is not limited to: making an inner layer board according to a pre-designed inner layer pattern; The boards are pressed together to obtain a multi-layer board.

The structure of the elongated hole 100 of the printed circuit board after step S420 is performed is shown in FIG. 3 . The metal hole wall of the inner wall of the elongated hole 100 includes a first straight wall 240 , a second straight wall 250 and two arc-shaped holes. wall, the first straight wall 240 and the second straight wall 250 are parallel to each other, and the two arc-shaped hole walls are respectively connected to the first straight wall 240 and the second straight wall 250; the elongated hole 100 of the printed circuit board after step S430 is executed The structure is shown in Figure 1 or Figure 2.

In addition, after step S430 is performed, back-drilling may be used to reduce via stubs, or 0 stub technology may be used to realize stub-free vias.

In the manufacturing method of the shielded differential via in this embodiment, by dividing the metal hole wall on the inner wall of the elongated hole 100 into a differential transmission line and a shielding hole wall, the shielding hole wall can be used as the reference ground of the differential transmission line, and the impedance is stable and not affected by Hole length, aperture size, dielectric constant of printed circuit board, anti-pad size, etc.; can well isolate interference signals, especially can block the coupling between adjacent parallel long vias; Adjust the position and aperture of the split hole 300 to control the width and line spacing of the differential transmission line, so as to control the impedance of the differential transmission line to be the design value, so that the impedance of the differential transmission line and the impedance of the connected signal line are matched to reduce return loss; The application embodiment overcomes the problems of uncontrolled differential signal via impedance, large return loss, no shielding or poor shielding effect, and the manufacturing process is simple and uncomplicated, and is easy to implement.

Referring to FIG. 1 , in the above-mentioned manufacturing method of the shielded differential via, the metal hole wall includes a first straight wall 240 and a second straight wall 250 that are parallel to each other, and three split holes 300 are drilled on the multilayer board. The hole 300 passes through the first straight wall 240 or through the second straight wall 250 .

Referring to FIG. 2 , in the above-mentioned manufacturing method of the shielded differential via, the metal hole wall includes a first straight wall 240 and a second straight wall 250 that are parallel to each other, and four split holes 300 are drilled on the multi-layer board, two The dividing holes 300 pass through the first straight wall 240 to divide the first differential transmission line 210 , and the two dividing holes 300 pass through the second straight wall 250 to divide the second differential transmission line 220 .

In the above-mentioned manufacturing method of the shielded differential via, before milling the elongated hole 100 on the printed circuit board, the method further includes setting a hole disk on the printed circuit board.

Before step S410 is performed, it is necessary to design a hole plate for the via hole of the differential signal to locate the position of the via hole of the differential signal, that is, first set the hole plate on the printed circuit board, and then mill a long strip on the hole plate in step S410 Hole 100. It can be understood that the shape of the hole plate is consistent with the shape of the elongated hole 100 .

The embodiment of the present application can not only realize the controllable impedance of the differential via to reduce the return loss, but also realize the shielding of the differential pair to reduce the crosstalk; supplemented by the zero-stub technology, the performance optimization of the next-generation high-speed channel with a rate of more than 112G can be realized ; And the use of the mature technology of PCB processing greatly reduces the production cost and is highly achievable.

In addition, a third aspect of the present application provides a shielded differential via, including a first crimp via 400 , a second crimp via 500 , a long blind via 600 and three The blind holes 700 are divided, the long blind holes 600 are respectively overlapped with the first crimping vias 400 and the second crimping vias 500 , the first crimping vias 400 , the second crimping vias 500 and the long blind holes The inner wall of 600 is provided with a metal hole wall, wherein the schematic structural diagram of the first crimping via 400 and the second crimping via 500 is shown in Figure 5; the structural schematic diagram of the long blind hole 600 is shown in Figure 6; The three split blind holes 700 pass through the metal hole wall of the inner wall of the elongated blind hole 600, so that the metal hole wall of the inner wall of the elongated blind hole 600 is divided into a third differential transmission line 810, a fourth differential transmission line 820 and a second shielding hole wall 830.

The third differential transmission line 810 is electrically connected to the metal hole wall of the inner wall of the first crimped via 400 , and the fourth differential transmission line 820 is electrically connected to the metal hole wall of the inner wall of the second crimped via 500 .

It can be understood that FIG. 5 and FIG. 6 are schematic diagrams of the same position of the printed circuit board at different heights. The printed circuit board is regarded as having two layers, and the upper layer only sees the first crimping

vias

400 and 400 . For the second crimping via 500 , not only the first crimping via 400 and the second crimping via 500 , but also the long blind hole 600 can be seen in the layer below. The upper layer, namely the first crimping via 400 and the second crimping via 500 shown in FIG. 5 , is generally used for the differential outlet of the crimping pin of the high-speed connector; The fisheye position goes up to the top surface of the printed circuit board to meet the crimping requirements, and the original crimping via design remains unchanged. The fisheye position of the connector crimping pins goes down to the wiring layer as shown in Figure 6 design, set a long blind hole 600, and divide the metal hole wall of the inner wall of the long blind hole 600 into a third differential transmission line 810, a fourth differential transmission line 820 and a second shielding hole wall 830 by dividing the blind hole 700, the second The shielding hole wall 830 can be used as the reference ground for the differential transmission line, and the impedance is stable, and is not affected by the hole length, aperture size, dielectric constant of the printed circuit board, anti-pad size, etc. In addition, it is also possible to control the width and line spacing of the differential transmission line by adjusting the position and aperture of the split blind hole 700, so as to control the impedance of the differential transmission line to the design value, so that the differential The impedance of the transmission line is matched with the impedance of the connected signal line to reduce the return loss; the embodiment of the present application overcomes the problems of uncontrolled differential signal via impedance, large return loss, no shielding or poor shielding effect, etc., and the manufacturing process Simple and not complicated, easy to implement.

Referring to FIG. 7 , a fourth aspect of the present application provides a method for fabricating a shielded differential via, and the fabrication method includes the following steps.

Step S710: Drilling the first crimping via hole 400 and the second crimping via hole 500 on the printed circuit board.

Step S720: Milling long blind holes 600 on the printed circuit board, the long blind holes 600 are partially overlapped with the first crimping vias 400 and the second crimping vias 500 respectively.

Step S730 : performing copper immersion electroplating on the inner walls of the first crimping via 400 , the second crimping via 500 and the elongated blind hole 600 to form metal hole walls.

Step S740: Drilling three divided blind holes 700 on the printed circuit board, and the three divided blind holes 700 pass through the metal hole wall of the inner wall of the elongated blind hole 600, so that the metal hole wall of the inner wall of the elongated blind hole 600 is divided A third differential transmission line 810, a fourth differential transmission line 820 and a second shielding hole wall 830 are formed; wherein: the third differential transmission line 810 is electrically connected to the metal hole wall of the inner wall of the first crimping via hole 400, and the fourth differential transmission line 820 is connected to the The two crimped metal holes on the inner wall of the via hole 500 are electrically connected.

The method for fabricating a shielded differential via provided in this embodiment is used to fabricate the shielded differential via provided in the third aspect of the embodiment. The metal hole wall of the inner wall of the elongated blind via 600 is divided into third differential transmission lines by dividing the blind via 700 810, the fourth differential transmission line 820, and the second shielding hole wall 830, the second shielding hole wall 830 can be used as the reference ground for the differential transmission line, and the impedance is stable, not affected by the hole length, the aperture size, the dielectric constant of the printed circuit board, and the reverse. It can well isolate interference signals, especially the coupling between adjacent long parallel vias; in addition, it is also possible to control the differential transmission line by adjusting the position and aperture of the split blind vias 700. Width and line spacing, so as to control the impedance of the differential transmission line to be the design value, so that the impedance of the differential transmission line and the impedance of the connected signal lines are matched to reduce the return loss; the embodiment of the present application overcomes the differential signal via impedance uncontrolled, return It has problems such as large loss, no shielding or poor shielding effect, and the manufacturing process is simple and not complicated, and it is easy to realize.

In addition, referring to FIG. 8 , an embodiment of the fifth aspect of the present application provides a differential signal high-speed channel.

The differential signal high-speed channel includes a long hole 100 and at least three dividing holes 300 arranged on the printed circuit board. The inner wall of the long hole 100 is provided with a metal hole wall, and the at least three dividing holes 300 pass through the inner wall of the long hole 100. metal hole wall, so that the metal hole wall of the inner wall of the long hole 100 is divided into the first differential transmission line 210 , the second differential transmission line 220 and the first shielding hole wall 230 .

The differential signal high-speed channel also includes a first crimping via 400, a second crimping via 500, a long blind via 600 and three split blind vias 700, which are respectively provided on the printed circuit board. The first crimping via 400 and the second crimping via 500 are partially overlapped, the inner walls of the first crimping via 400, the second crimping via 500 and the elongated blind hole 600 are provided with metal hole walls, and the three divided blind holes The hole 700 passes through the metal hole wall of the inner wall of the long blind hole 600, so that the metal hole wall of the inner wall of the long blind hole 600 is divided into a third differential transmission line 810, a fourth differential transmission line 820 and a second shielding hole wall 830; wherein : The third differential transmission line 810 is electrically connected to the metal hole wall of the inner wall of the first crimped via 400 , and the fourth differential transmission line 820 is electrically connected to the metal hole wall of the inner wall of the second crimped via 500 .

The differential signal highway also includes a first transmission line 910 and a second transmission line 920 arranged on the printed circuit board. The first differential transmission line 210 is connected to the third differential transmission line 810 through the first transmission line 910; the second differential transmission line 220 is connected through the second transmission line 920 is connected to the fourth differential transmission line 820 .

The differential signal high-speed channel provided by the embodiment of the present application is provided with not only the elongated hole 100 shown in the embodiment of the first aspect, but also the first crimping via 400 and the second crimping hole shown in the embodiment of the third aspect. Vias 500 and long blind vias 600, the first differential transmission line 210 is connected to the third differential transmission line 810 through the first transmission line 910, and the second differential transmission line 220 is connected to the fourth differential transmission line 820 through the second transmission line 920, forming a high-speed performance channel, which greatly improves the application of high-speed performance above 56G.

Embodiments of the present application include: a shielded differential via, a method for fabricating a shielded differential via, and a differential signal high-speed channel. According to the solution provided by the embodiment of the present application, by dividing the metal hole wall of the inner wall of the elongated hole into a differential transmission line and a shielding hole wall, the shielding hole wall can be used as the reference ground of the differential transmission line, and the impedance is stable, which is not affected by the hole length, aperture size, The dielectric constant of the printed circuit board, the size of the anti-pad, etc.; can well isolate the interference signal, especially can block the coupling between adjacent parallel long vias; The aperture is used to control the width and line spacing of the differential transmission line, thereby controlling the impedance of the differential transmission line to be the design value, so that the impedance of the differential transmission line and the impedance of the connected signal lines are matched to reduce return loss; the embodiment of the present application overcomes the differential signal The via impedance is not controlled, the return loss is large, there is no shielding or the shielding effect is poor, etc., and the manufacturing process is simple and uncomplicated, and it is easy to implement.

The embodiments of the present application have been described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned embodiments. Within the scope of knowledge possessed by those of ordinary skill in the technical field, various aspects can be made without departing from the purpose of the present application. kind of change.

Claims

A shielded differential via, comprising a long hole arranged on a printed circuit board and at least three dividing holes, wherein the inner wall of the long hole is provided with a metal hole wall, and the at least three dividing holes pass through the The metal hole wall is divided into a first differential transmission line, a second differential transmission line and a first shielding hole wall.
The shielded differential via hole according to claim 1, wherein the metal hole wall comprises a first straight wall and a second straight wall that are parallel to each other, the number of the dividing holes is three, and the three dividing holes pass through the the first straight wall or pass through the second straight wall.
The shielded differential via hole according to claim 1, wherein the metal hole wall comprises a first straight wall and a second straight wall that are parallel to each other, four of the dividing holes are provided, and two of the dividing holes pass through The first straight wall divides the first differential transmission line, and the two dividing holes pass through the second straight wall to divide the second differential transmission line.
A method for manufacturing a shielded differential via, comprising:

Milling elongated holes on the printed circuit board;

Carry out copper immersion electroplating on the inner wall of the elongated hole to form a metal hole wall;

At least three dividing holes are drilled on the printed circuit board, and the at least three dividing holes pass through the metal hole wall, so that the metal hole wall is divided into a first differential transmission line, a second differential transmission line and a The first shielding hole wall.
The manufacturing method according to claim 4, wherein the metal hole wall comprises a first straight wall and a second straight wall that are parallel to each other, and three split holes are drilled on the multilayer board, and the three split holes pass through the the first straight wall or pass through the second straight wall.
The manufacturing method according to claim 4, wherein the metal hole wall comprises a first straight wall and a second straight wall that are parallel to each other, and four divided holes are drilled on the multilayer board, and two of the divided holes pass through The first straight wall divides the first differential transmission line, and the two dividing holes pass through the second straight wall to divide the second differential transmission line.
The manufacturing method according to claim 4, wherein before milling the elongated hole on the printed circuit board, it further comprises the following steps:

A hole plate is provided on the printed circuit board.
A shielded differential via hole, comprising a first crimp via hole, a second crimp via hole, a long blind hole and three split blind holes arranged on a printed circuit board, wherein the long blind holes are respectively connected with The first crimping via hole and the second crimping via hole are partially overlapped, and the inner wall of the first crimping via hole, the second crimping via hole and the long blind hole is provided with a metal hole The three divided blind holes pass through the metal hole wall of the inner wall of the elongated blind hole, so that the metal hole wall of the inner wall of the elongated blind hole is divided into a third differential transmission line, a fourth differential transmission line and a third differential transmission line. Two shielding hole walls;

Wherein, the third differential transmission line is electrically connected to the metal hole wall of the first crimped via hole, and the fourth differential transmission line is electrically connected to the metal hole wall of the second crimped via hole inner wall.
A method for manufacturing a shielded differential via, comprising:

Drilling a first crimp via and a second crimp via on the printed circuit board;

A long blind hole is milled on the printed circuit board, and the long blind hole is partially overlapped with the first crimping via hole and the second crimping via hole;

Copper immersion electroplating is performed on the inner walls of the first crimping via hole, the second crimping via hole and the elongated blind hole to form a metal hole wall;

Drill three divided blind holes on the printed circuit board, and the three divided blind holes pass through the metal hole wall of the inner wall of the long blind hole, so that the metal hole wall of the inner wall of the long blind hole is It is divided into a third differential transmission line, a fourth differential transmission line and a second shielding hole wall; wherein: the third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimping hole, and the fourth differential transmission line is connected to The metal hole wall of the second crimping hole inner wall is electrically connected.
A differential signal high-speed channel, the differential signal high-speed channel includes an elongated hole and at least three separation holes arranged on a printed circuit board, wherein the inner wall of the elongated hole is provided with a metal hole wall, and the at least three a plurality of dividing holes pass through the metal hole wall of the inner wall of the elongated hole, so that the metal hole wall of the inner wall of the elongated hole is divided into a first differential transmission line, a second differential transmission line and a first shielding hole wall;

The differential signal high-speed channel further includes a first crimping via, a second crimping via, a long blind hole and three split blind holes, which are respectively arranged on the printed circuit board. The first crimping via hole and the second crimping via hole are partially overlapped, and the inner wall of the first crimping via hole, the second crimping via hole and the long blind hole is provided with a metal hole wall, The three divided blind holes pass through the metal hole wall of the inner wall of the elongated blind hole, so that the metal hole wall of the inner wall of the elongated blind hole is divided into a third differential transmission line, a fourth differential transmission line and a second shield a hole wall; wherein: the third differential transmission line is electrically connected to the metal hole wall of the inner wall of the first crimped via hole, and the fourth differential transmission line is electrically connected to the metal hole wall of the second crimped via hole inner wall ;

The differential signal high-speed channel further includes a first transmission line and a second transmission line arranged on the printed circuit board, the first differential transmission line is connected with the third differential transmission line through the first transmission line; the second differential transmission line It is connected to the fourth differential transmission line through the second transmission line.