CN115315059A - Shielding differential via hole, manufacturing method and differential signal high-speed channel - Google Patents
Shielding differential via hole, manufacturing method and differential signal high-speed channel Download PDFInfo
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- CN115315059A CN115315059A CN202110494365.4A CN202110494365A CN115315059A CN 115315059 A CN115315059 A CN 115315059A CN 202110494365 A CN202110494365 A CN 202110494365A CN 115315059 A CN115315059 A CN 115315059A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 230000005540 biological transmission Effects 0.000 claims abstract description 139
- 239000002184 metal Substances 0.000 claims abstract description 93
- 229910052751 metal Inorganic materials 0.000 claims abstract description 93
- 238000002788 crimping Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 23
- 230000006835 compression Effects 0.000 claims description 16
- 238000007906 compression Methods 0.000 claims description 16
- 238000005553 drilling Methods 0.000 claims description 10
- 238000003801 milling Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000008021 deposition Effects 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims 2
- 230000008878 coupling Effects 0.000 abstract description 7
- 238000010168 coupling process Methods 0.000 abstract description 7
- 238000005859 coupling reaction Methods 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 8
- 238000005192 partition Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
Abstract
The invention discloses a shielded differential via hole, a manufacturing method of the shielded differential via hole and a differential signal high-speed channel.A metal hole wall of the inner wall of a strip hole is divided into a differential transmission line and a shielded hole wall, and the shielded hole wall can be used as a reference ground of the differential transmission line, has stable impedance and is not influenced by the length of the hole, the size of the hole diameter, the dielectric constant of a printed circuit board plate, the size of an anti-welding disc and the like; interference signals can be well isolated, and especially, coupling between adjacent parallel long through holes can be blocked; in addition, the width and the line spacing of the differential transmission line can be controlled by adjusting the position and the aperture of the dividing hole, so that the impedance of the differential transmission line is controlled to be a design value, and the impedance of the differential transmission line is matched with the impedance of the connected signal line, so that return loss is reduced; the embodiment of the invention overcomes the problems of uncontrolled impedance, large return loss, no shielding or poor shielding effect and the like of the differential signal via hole, and has simple and uncomplicated manufacturing process and easy realization.
Description
Technical Field
The invention relates to the technical field of high-speed design, in particular to a shielded differential via hole, a manufacturing method of the shielded differential via hole and a differential signal high-speed channel.
Background
With the continuous increase of signal transmission rate, the signal channel is more and more sensitive to impedance continuity/return loss and crosstalk, especially to the rate of more than 56 Gbps. The aperture, the anti-bonding pad, the length, the dielectric constant of the high-speed plate and the like of the via hole influence the impedance of the via hole, so that the impedance is unstable and cannot meet the design requirement, and particularly for the crimping hole of the high-speed connector, because the pin is thick, the impedance is usually low and deviates from the impedance of a transmission line more; in addition, for parallel vias, especially the cross talk effect of the parallel long vias is also great. At present, no effective measure is available for the via hole in high-speed design, the disclosed related technology is difficult to be applied to the high-speed channel design, a single via hole is subjected to shielding treatment, multiple hole plugging and copper deposition are used, the process is complex, and the differential via hole cannot be applied to the differential via hole.
Disclosure of Invention
The invention aims to solve at least one of the technical problems in the prior art, and provides a shielded differential via hole, a manufacturing method of the shielded differential via hole and a differential signal high-speed channel.
In a first aspect, an embodiment of the present invention provides a shielded differential via, including a long hole and at least three split holes, where the long hole is disposed on a printed circuit board, and a metal hole wall is disposed on an inner wall of the long hole, and the at least three split holes penetrate through the metal hole wall, so that the metal hole wall is divided into a first differential transmission line, a second differential transmission line, and a first shielded hole wall.
In a second aspect, an embodiment of the present invention provides a method for manufacturing a shielded differential via, including:
milling a long hole on the printed circuit board;
carrying out copper deposition electroplating on the inner wall of the strip hole to form a metal hole wall;
drilling at least three split holes through the metal aperture wall such that the metal aperture wall is split into a first differential transmission line, a second differential transmission line, and a first shield aperture wall.
In a third aspect, an embodiment of the present invention provides a shielded differential via, including a first press-connection via, a second press-connection via, a long blind hole, and three split blind holes, which are disposed on a printed circuit board, where the long blind hole is partially overlapped with the first press-connection via and the second press-connection via, respectively, and inner walls of the first press-connection via, the second press-connection via, and the long blind hole are provided with metal hole walls; the three dividing blind holes penetrate through the metal hole wall of the inner wall of the long blind hole, so that the metal hole wall of the inner wall of the long blind hole is divided into a third differential transmission line, a fourth differential transmission line and a second shielding hole wall;
wherein: the third differential transmission line is electrically connected with the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected with the metal hole wall of the inner wall of the second crimping through hole.
In a fourth aspect, an embodiment of the present invention provides a method for manufacturing a shielded differential via, including:
drilling a first crimping through hole and a second crimping through hole on the printed circuit board;
milling a long-strip blind hole on the printed circuit board, wherein the long-strip blind hole is respectively overlapped with the first compression joint through hole and the second compression joint through hole;
carrying out copper deposition electroplating on the inner walls of the first compression joint through hole, the second compression joint through hole and the strip blind hole to form a metal hole wall;
drilling three partition blind holes on the printed circuit board, wherein the three partition blind holes penetrate through the metal hole wall of the inner wall of the long blind hole, so that the metal hole wall of the inner wall of the long blind hole is partitioned into a third differential transmission line, a fourth differential transmission line and a second shielding hole wall; wherein: the third differential transmission line is electrically connected with the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected with the metal hole wall of the inner wall of the second crimping through hole.
In a fifth aspect, an embodiment of the present invention provides a differential signal high-speed channel:
the differential signal high-speed channel comprises a long hole and at least three separation holes, the long hole is provided with a metal hole wall on the inner wall, and the at least three separation holes penetrate through the metal hole wall on the inner wall of the long hole, so that the metal hole wall on the inner wall of the long hole is divided into a first differential transmission line, a second differential transmission line and a first shielding hole wall;
the differential signal high-speed channel further comprises a first compression joint through hole, a second compression joint through hole, a long blind hole and three partition blind holes, wherein the first compression joint through hole, the second compression joint through hole, the long blind hole and the three partition blind holes are arranged on the printed circuit board, the long blind holes are respectively partially overlapped with the first compression joint through hole and the second compression joint through hole, metal hole walls are arranged on the inner walls of the first compression joint through hole, the second compression joint through hole and the long blind hole, and the three partition blind holes penetrate through the metal hole walls on the inner walls of the long blind holes so that the metal hole walls on the inner walls of the long blind holes are partitioned into a third differential transmission line, a fourth differential transmission line and a second shielding hole wall; wherein: the third differential transmission line is electrically connected with the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected with the metal hole wall of the inner wall of the second crimping through hole;
the differential signal high-speed channel also comprises a first transmission line and a second transmission line which are arranged on the printed circuit board, and the first differential transmission line is connected with the third differential transmission line through the first transmission line; the second differential transmission line is connected to the fourth differential transmission line through the second transmission line.
The embodiment of the invention comprises the following steps: the patent refers to the field of 'transmission of digital information'. According to the scheme provided by the embodiment of the invention, the metal hole wall of the inner wall of the long-strip hole is divided into the differential transmission line and the shielding hole wall, the shielding hole wall can be used as a reference ground of the differential transmission line, the impedance is stable, and the shielding hole wall is not influenced by the length of the hole, the size of the hole diameter, the dielectric constant of a printed circuit board plate, the size of an anti-welding pad and the like; interference signals can be well isolated, and especially, coupling between adjacent parallel long through holes can be blocked; in addition, the width and the line spacing of the differential transmission line can be controlled by adjusting the position and the aperture of the dividing hole, so that the impedance of the differential transmission line is controlled to be a designed value, and the impedance of the differential transmission line is matched with the impedance of the connected signal line, so that the return loss is reduced; the embodiment of the invention overcomes the problems of uncontrolled impedance, large return loss, no shielding or poor shielding effect and the like of the differential signal via hole, and has simple and uncomplicated manufacturing process and easy realization.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the example serve to explain the principles of the invention and not to limit the invention.
The invention is further described below with reference to the accompanying drawings and examples;
FIG. 1 is a schematic diagram of a shielded differential via according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a shielded differential via according to another embodiment of the present invention;
fig. 3 is a schematic structural diagram of a shielded differential via according to an embodiment of the present invention when a split hole is not disposed in the long hole;
FIG. 4 is a flowchart of a method for forming a shielded differential via according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a first crimped via and a second crimped via portion of a shielded differential via according to yet another embodiment of the present invention;
FIG. 6 is a schematic structural diagram of an elongate blind via portion of a shielded differential via according to yet another embodiment of the present invention;
FIG. 7 is a flow chart of a method for fabricating a shielded differential via according to another embodiment of the present invention;
FIG. 8 is a schematic diagram of a differential signal high-speed channel according to yet another embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, if there are first and second described only for the purpose of distinguishing technical features, it is not understood that relative importance is indicated or implied or that the number of indicated technical features or the precedence of the indicated technical features is implicitly indicated or implied.
In the description of the present invention, unless otherwise specifically limited, terms such as set, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention by combining the specific contents of the technical solutions.
The embodiment of the invention provides a shielded differential via hole, a manufacturing method of the shielded differential via hole and a differential signal high-speed channel.
The embodiments of the present invention will be further explained with reference to the drawings.
In a first embodiment of the present invention, a shielded differential via is provided, including a long hole 100 and at least three dividing holes 300 disposed on a printed circuit board, where an inner wall of the long hole 100 is provided with a metal hole wall, and as shown in fig. 3, the metal hole wall of the inner wall of the long hole 100 includes a first straight wall 240, a second straight wall 250 and two arc hole walls, the first straight wall 240 and the second straight wall 250 are parallel to each other, and the two arc hole walls connect the first straight wall 240 and the second straight wall 250, respectively.
In addition, referring to fig. 1 and 2, at least three dividing holes 300 pass through the metal hole wall such that the metal hole wall is divided into the first differential transmission line 210, the second differential transmission line 220, and the first shield hole wall 230.
By dividing the metal hole wall of the inner wall of the elongated hole 100 into the differential transmission line and the shielding hole wall, the shielding hole wall can be used as a reference ground of the differential transmission line, the impedance is stable, and the shielding hole wall is not influenced by the hole length, the hole diameter size, the dielectric constant of the printed circuit board, the size of the anti-welding pad and the like; interference signals can be well isolated, and especially, coupling between adjacent parallel long through holes can be blocked; in addition, the width and the line spacing of the differential transmission line can be controlled by adjusting the position and the aperture of the dividing hole 300, so that the impedance of the differential transmission line is controlled to be a designed value, and the impedance of the differential transmission line is matched with the impedance of the connected signal line, so that the return loss is reduced; the embodiment of the invention overcomes the problems of uncontrolled impedance, large return loss, no shielding or poor shielding effect and the like of the differential signal via hole, and has simple and uncomplicated manufacturing process and easy realization.
Referring to fig. 1, in the shielded differential via provided in the present embodiment, three split holes 300 are provided, and the three split holes 300 pass through the first straight wall 240 or the second straight wall 250. It is understood that the three split holes 300 are all disposed on one long-side straight wall of the metal hole wall, so that the first straight wall 240 or the second straight wall 250 is split into the first differential transmission line 210 and the second differential transmission line 220 by the three split holes 300.
The first differential transmission line 210 and the second differential transmission line 220 are divided from one long-side straight wall of the metal hole wall of the inner wall of the long hole 100 and used as edge-coupled differential signals, and then the other long-side straight wall and the two sections of arc-shaped hole walls of the metal hole wall are used as reference grounds and shields of the differential signals, so that the method is suitable for the condition that the differential pins are distributed and perpendicular to the edges of the chips.
Referring to fig. 2, unlike the differential transmission line structure shown in the embodiment of fig. 1, in the shielded differential via provided in the embodiment, four dividing holes 300 are provided, two dividing holes 300 penetrate through the first straight wall 240 to divide the first differential transmission line 210, and the other two dividing holes 300 penetrate through the second straight wall 250 to divide the second differential transmission line 220.
The first differential transmission line 210 is divided from one long-side straight wall of the metal hole wall on the inner wall of the long hole 100, and the second differential transmission line 220 is divided from the other long-side straight wall, namely, two sides of the long hole 100 are used for broadside-coupled differential signals, and the other parts are used for reference ground and shielding, so that the method is suitable for the condition that the differential pin arrangement is parallel to the edge of a chip.
Referring to fig. 4, a second embodiment of the present invention provides a method for manufacturing a shielded differential via, where the method includes the following steps:
step S410: milling a long hole 100 on the printed circuit board;
step S420: carrying out copper deposition electroplating on the inner wall of the strip hole 100 to form a metal hole wall;
step S430: at least three dividing holes 300 are drilled in the printed circuit board, and the at least three dividing holes 300 pass through the metal hole wall such that the metal hole wall is divided into the first differential transmission line 210, the second differential transmission line 220, and the first shield hole wall 230.
It should be noted that after the step S440 is performed, a metal hole wall is formed on the inner wall of the elongated hole 100, and then a resin hole may be filled to facilitate the subsequent drilling of the dividing hole 300.
It will be appreciated that the printed circuit board is typically a multi-layer board laminated according to conventional processes including, but not limited to: manufacturing an inner layer plate according to a pre-designed inner layer graph; and pressing the inner layer plate to obtain the multilayer plate.
Fig. 3 shows a partial structure of the elongated hole 100 of the printed circuit board after step S420, where the metal hole walls of the inner wall of the elongated hole 100 include a first straight wall 240, a second straight wall 250 and two arc hole walls, the first straight wall 240 and the second straight wall 250 are parallel to each other, and the two arc hole walls are respectively connected to the first straight wall 240 and the second straight wall 250; the structure of the elongated hole 100 of the pcb after step S430 is completed is shown in fig. 1 or fig. 2.
In addition, after step S430 is performed, via stubs may be reduced by back drilling, or a stub-free via may be implemented by using a 0stub technology.
In the method for manufacturing the shielded differential via hole of the embodiment, the metal hole wall on the inner wall of the elongated hole 100 is divided into the differential transmission line and the shielded hole wall, and the shielded hole wall can be used as a reference ground of the differential transmission line, so that the impedance is stable and is not influenced by the length of the hole, the size of the aperture, the dielectric constant of a printed circuit board plate, the size of an anti-bonding pad and the like; interference signals can be well isolated, and especially, coupling between adjacent parallel long through holes can be blocked; in addition, the width and the line spacing of the differential transmission line can be controlled by adjusting the position and the aperture of the dividing hole 300, so that the impedance of the differential transmission line is controlled to be a designed value, and the impedance of the differential transmission line is matched with the impedance of the connected signal line, so that the return loss is reduced; the embodiment of the invention overcomes the problems of uncontrolled impedance, large return loss, no shielding or poor shielding effect and the like of the differential signal via hole, and has simple and uncomplicated manufacturing process and easy realization.
Referring to fig. 1, in the method for manufacturing the shielded differential via, the metal hole wall includes a first straight wall 240 and a second straight wall 250 that are parallel to each other, and three split holes 300 are drilled in the multilayer board, where the three split holes 300 penetrate through the first straight wall 240 or the second straight wall 250.
The first differential transmission line 210 and the second differential transmission line 220 are divided from one long-side straight wall of the metal hole wall of the inner wall of the long hole 100 and used as edge-coupled differential signals, and then the other long-side straight wall and the two sections of arc-shaped hole walls of the metal hole wall are used as reference grounds and shields of the differential signals, so that the differential transmission line is suitable for the condition that the differential pins are arranged to be perpendicular to the edges of the chips.
Referring to fig. 2, in the method for manufacturing the shielded differential via, the metal hole wall includes a first straight wall 240 and a second straight wall 250 that are parallel to each other, four split holes 300 are drilled on the multilayer board, two split holes 300 penetrate through the first straight wall 240 to divide the first differential transmission line 210, and two split holes 300 penetrate through the second straight wall 250 to divide the second differential transmission line 220.
One long-side straight wall of the metal hole wall on the inner wall of the strip hole 100 is divided into a first differential transmission line 210, and the other long-side straight wall is divided into a second differential transmission line 220, namely, two sides of the strip hole 100 are used as differential signals of broadside coupling, and the other parts are used as reference ground and shielding, so that the differential transmission line is suitable for the condition that the differential pins are arranged in parallel to the edge of a chip.
In the method for manufacturing the shielded differential via, before the milling of the elongated hole 100 on the printed circuit board, a hole disc is further provided on the printed circuit board.
Before step S410 is executed, it is necessary to perform hole disc design on the via holes of the differential signals to locate the via holes of the differential signals, that is, firstly, a hole disc is disposed on the printed circuit board, and then, in step S410, a long hole 100 is milled on the hole disc. It will be appreciated that the shape of the orifice disc conforms to the shape of the elongated orifice 100.
The embodiment of the invention can realize that the impedance of the differential via hole is controllable so as to reduce return loss; shielding of differential pairs to reduce crosstalk may also be implemented; the performance optimization of a high-speed channel with a speed of more than 112G of the next generation can be realized by the aid of a zero stub technology; and the mature process of PCB processing is utilized, the production cost is greatly reduced, and the realizability is strong.
In addition, a shielded differential via is provided in an embodiment of the third aspect of the present invention, and includes a first crimp via 400, a second crimp via 500, an elongated blind hole 600, and three split blind holes 700, which are disposed on a printed circuit board, where the elongated blind hole 600 is partially overlapped with the first crimp via 400 and the second crimp via 500, respectively, and inner walls of the first crimp via 400, the second crimp via 500, and the elongated blind hole 600 are provided with metal hole walls, where a schematic structural diagram of the first crimp via 400 and the second crimp via 500 is shown in fig. 5; the structural schematic diagram of the part of the elongated blind hole 600 is shown in fig. 6; the three divided blind holes 700 penetrate through the metal hole wall of the inner wall of the elongated blind hole 600, so that the metal hole wall of the inner wall of the elongated blind hole 600 is divided into a third differential transmission line 810, a fourth differential transmission line 820 and a second shielding hole wall 830;
wherein: the third differential transmission line 810 is electrically connected to the metal hole wall of the inner wall of the first crimp via 400, and the fourth differential transmission line 820 is electrically connected to the metal hole wall of the inner wall of the second crimp via 500.
It is to be understood that fig. 5 and 6 are schematic views of the same location of the printed circuit board at different height positions, and the printed circuit board is considered to have two layers, wherein the upper layer only sees the first crimp via 400 and the second crimp via 500, and the lower layer can see both the first crimp via 400 and the second crimp via 500 and the elongated blind via 600. The above layers, namely the first crimp via 400 and the second crimp via 500 shown in fig. 5, are generally used for differential outgoing lines of the high-speed connector crimp pins; the fisheye position of the connector crimping pin upwards reaches the Top surface of the printed circuit board, and the original design of the crimping via hole is kept unchanged because the crimping requirement is met, the fisheye position of the connector crimping pin downwards reaches the wiring layer, the long blind hole 600 is arranged according to the design shown in fig. 6, the metal hole wall on the inner wall of the long blind hole 600 is divided into a third differential transmission line 810, a fourth differential transmission line 820 and a second shielding hole wall 830 through the divided blind hole 700, and the second shielding hole wall 830 can be used as a reference ground of the differential transmission line, so that the impedance is stable and is not influenced by the hole length, the hole diameter, the dielectric constant of a printed circuit board material, the size of a reverse welding disc and the like; interference signals can be well isolated, and especially, the coupling between the adjacent parallel long through holes can be blocked; in addition, the width and the line spacing of the differential transmission line can be controlled by adjusting the position and the aperture of the split blind hole 700, so that the impedance of the differential transmission line is controlled to be a design value, and the impedance of the differential transmission line is matched with the impedance of the connected signal line, so that return loss is reduced; the embodiment of the invention overcomes the problems of uncontrolled impedance, large return loss, no shielding or poor shielding effect and the like of the differential signal via hole, and has simple and uncomplicated manufacturing process and easy realization.
Referring to fig. 7, a fourth aspect of the present invention provides a method for manufacturing a shielded differential via, where the method includes the following steps:
step S710: drilling a first crimp via 400 and a second crimp via 500 on the printed circuit board;
step S720: milling a long blind hole 600 on the printed circuit board, wherein the long blind hole 600 is partially overlapped with the first crimp through hole 400 and the second crimp through hole 500 respectively;
step S730: performing copper deposition electroplating on the inner walls of the first crimp via hole 400, the second crimp via hole 500 and the strip blind hole 600 to form a metal hole wall;
step S740: drilling three blind via holes 700 on the printed circuit board, wherein the three blind via holes 700 penetrate through the metal hole wall on the inner wall of the elongated blind via 600, so that the metal hole wall on the inner wall of the elongated blind via 600 is divided into a third differential transmission line 810, a fourth differential transmission line 820 and a second shielding hole wall 830; wherein: the third differential transmission line 810 is electrically connected to the metal hole wall of the inner wall of the first crimp via 400, and the fourth differential transmission line 820 is electrically connected to the metal hole wall of the inner wall of the second crimp via 500.
The method for manufacturing the shielded differential via hole provided in this embodiment is used for manufacturing the shielded differential via hole provided in the third aspect, the metal hole wall on the inner wall of the elongated blind hole 600 is divided into the third differential transmission line 810, the fourth differential transmission line 820 and the second shielded hole wall 830 by dividing the blind hole 700, and the second shielded hole wall 830 can be used as a reference ground of the differential transmission line, has stable impedance, and is not affected by the hole length, the hole diameter, the dielectric constant of a printed circuit board, the size of an anti-pad, and the like; interference signals can be well isolated, and especially, the coupling between the adjacent parallel long through holes can be blocked; in addition, the width and the line spacing of the differential transmission line can be controlled by adjusting the position and the aperture of the split blind hole 700, so that the impedance of the differential transmission line is controlled to be a designed value, and the impedance of the differential transmission line is matched with the impedance of the connected signal line, so that the return loss is reduced; the embodiment of the invention overcomes the problems of uncontrolled impedance, large return loss, no shielding or poor shielding effect and the like of the differential signal via hole, and has simple and uncomplicated manufacturing process and easy realization.
In addition, referring to fig. 8, a fifth embodiment of the present invention provides a differential signal high-speed channel:
the differential signal high-speed channel comprises a long hole 100 and at least three dividing holes 300 which are arranged on the printed circuit board, the inner wall of the long hole 100 is provided with a metal hole wall, and the at least three dividing holes 300 penetrate through the metal hole wall of the inner wall of the long hole 100, so that the metal hole wall of the inner wall of the long hole 100 is divided into a first differential transmission line 210, a second differential transmission line 220 and a first shielding hole wall 230;
the differential signal high-speed channel further comprises a first press-connection through hole 400, a second press-connection through hole 500, a long blind hole 600 and three dividing blind holes 700 which are arranged on the printed circuit board, wherein the long blind hole 600 is partially overlapped with the first press-connection through hole 400 and the second press-connection through hole 500 respectively, metal hole walls are arranged on the inner walls of the first press-connection through hole 400, the second press-connection through hole 500 and the long blind hole 600, and the three dividing blind holes 700 penetrate through the metal hole walls on the inner wall of the long blind hole 600 so that the metal hole walls on the inner wall of the long blind hole 600 are divided into a third differential transmission line 810, a fourth differential transmission line 820 and a second shielding hole wall 830; wherein: the third differential transmission line 810 is electrically connected with the metal hole wall of the inner wall of the first crimp via 400, and the fourth differential transmission line 820 is electrically connected with the metal hole wall of the inner wall of the second crimp via 500;
the differential signal high-speed channel further comprises a first transmission line 910 and a second transmission line 920 arranged on the printed circuit board, and the first differential transmission line 210 is connected with the third differential transmission line 810 through the first transmission line 910; the second differential transmission line 220 is connected to the fourth differential transmission line 820 through a second transmission line 920.
The differential signal high-speed channel provided in the embodiment of the present invention is provided with the elongated hole 100 shown in the first aspect of the embodiment, and is also provided with the first crimp via 400, the second crimp via 500, and the elongated blind hole 600 shown in the third aspect of the embodiment, the first differential transmission line 210 is connected to the third differential transmission line 810 through the first transmission line 910, and the second differential transmission line 220 is connected to the fourth differential transmission line 820 through the second transmission line 920, so as to form a high-speed performance channel, and greatly improve the high-speed performance application meeting the requirement of more than 56G.
The embodiments of the present invention have been described in detail with reference to the drawings, but the present invention is not limited to the embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. The shielded differential via hole comprises a strip hole and at least three split holes, wherein the strip hole and the at least three split holes are arranged on a printed circuit board, a metal hole wall is arranged on the inner wall of the strip hole, and the at least three split holes penetrate through the metal hole wall, so that the metal hole wall is divided into a first differential transmission line, a second differential transmission line and a first shielded hole wall.
2. The shielded differential via of claim 1, wherein the metal hole wall comprises a first straight wall and a second straight wall that are parallel to each other, and the singulation holes are provided in three, three of the singulation holes passing through the first straight wall or the second straight wall.
3. The shielded differential via of claim 1, wherein the metal aperture wall comprises a first straight wall and a second straight wall parallel to each other, four of the split apertures are provided, two of the split apertures pass through the first straight wall to split the first differential transmission line, and two of the split apertures pass through the second straight wall to split the second differential transmission line.
4. A method for manufacturing a shielded differential via, comprising:
milling a long hole on the printed circuit board;
carrying out copper deposition electroplating on the inner wall of the long hole to form a metal hole wall;
drilling at least three split holes through the metal aperture wall such that the metal aperture wall is split into a first differential transmission line, a second differential transmission line, and a first shield aperture wall.
5. The method of claim 4, wherein the metal aperture wall comprises a first straight wall and a second straight wall parallel to each other, and wherein three split apertures are drilled in the multilayer plate, the three split apertures passing through the first straight wall or the second straight wall.
6. The method of claim 4, wherein the metal hole wall comprises a first straight wall and a second straight wall parallel to each other, four dividing holes are drilled in the multilayer board, two of the dividing holes penetrate through the first straight wall to divide the first differential transmission line, and two of the dividing holes penetrate through the second straight wall to divide the second differential transmission line.
7. The method of claim 4, wherein before milling the elongated hole in the printed circuit board, further comprising the steps of:
a hole plate is provided on the printed circuit board.
8. A shielded differential via hole comprises a first crimping via hole, a second crimping via hole, a long blind hole and three cutting blind holes, wherein the first crimping via hole, the second crimping via hole, the long blind hole and the three cutting blind holes are arranged on a printed circuit board; the three dividing blind holes penetrate through the metal hole wall of the inner wall of the long blind hole, so that the metal hole wall of the inner wall of the long blind hole is divided into a third differential transmission line, a fourth differential transmission line and a second shielding hole wall;
wherein: the third differential transmission line is electrically connected with the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected with the metal hole wall of the inner wall of the second crimping through hole.
9. A method for manufacturing a shielded differential via, comprising:
drilling a first crimping through hole and a second crimping through hole on the printed circuit board;
milling a long-strip blind hole on the printed circuit board, wherein the long-strip blind hole is partially overlapped with the first compression joint through hole and the second compression joint through hole respectively;
carrying out copper deposition electroplating on the inner walls of the first compression joint through hole, the second compression joint through hole and the strip blind hole to form a metal hole wall;
drilling three dividing blind holes on the printed circuit board, wherein the three dividing blind holes penetrate through the metal hole wall of the inner wall of the long blind hole, so that the metal hole wall of the inner wall of the long blind hole is divided into a third differential transmission line, a fourth differential transmission line and a second shielding hole wall; wherein: the third differential transmission line is electrically connected with the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected with the metal hole wall of the inner wall of the second crimping through hole.
10. A differential signal high speed path, comprising:
the differential signal high-speed channel comprises a long hole and at least three separation holes, the long hole is provided with a metal hole wall on the inner wall, and the at least three separation holes penetrate through the metal hole wall on the inner wall of the long hole, so that the metal hole wall on the inner wall of the long hole is divided into a first differential transmission line, a second differential transmission line and a first shielding hole wall;
the differential signal high-speed channel further comprises a first crimping through hole, a second crimping through hole, a long blind hole and three dividing blind holes, wherein the first crimping through hole, the second crimping through hole, the long blind hole and the three dividing blind holes are formed in the printed circuit board, the long blind holes are partially overlapped with the first crimping through hole and the second crimping through hole respectively, metal hole walls are formed in the inner walls of the first crimping through hole, the second crimping through hole and the long blind holes, and the three dividing blind holes penetrate through the metal hole walls of the inner walls of the long blind holes so that the metal hole walls of the inner walls of the long blind holes are divided into a third differential transmission line, a fourth differential transmission line and a second shielding hole wall; wherein: the third differential transmission line is electrically connected with the metal hole wall of the inner wall of the first crimping through hole, and the fourth differential transmission line is electrically connected with the metal hole wall of the inner wall of the second crimping through hole;
the differential signal high-speed channel also comprises a first transmission line and a second transmission line which are arranged on the printed circuit board, and the first differential transmission line is connected with the third differential transmission line through the first transmission line; the second differential transmission line is connected to the fourth differential transmission line through the second transmission line.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110494365.4A CN115315059A (en) | 2021-05-07 | 2021-05-07 | Shielding differential via hole, manufacturing method and differential signal high-speed channel |
| PCT/CN2022/086146 WO2022233220A1 (en) | 2021-05-07 | 2022-04-11 | Shielding differential vias, fabrication methods therefor, and differential signal high-speed channel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110494365.4A CN115315059A (en) | 2021-05-07 | 2021-05-07 | Shielding differential via hole, manufacturing method and differential signal high-speed channel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115315059A true CN115315059A (en) | 2022-11-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110494365.4A Pending CN115315059A (en) | 2021-05-07 | 2021-05-07 | Shielding differential via hole, manufacturing method and differential signal high-speed channel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN115315059A (en) |
| WO (1) | WO2022233220A1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107896418B (en) * | 2017-10-10 | 2020-11-06 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN108538811A (en) * | 2018-03-20 | 2018-09-14 | 杭州电子科技大学 | With the low stopping area differential transfer structure and its interlayer interconnection structure of silicon hole |
| CN112449494B (en) * | 2019-08-27 | 2022-04-12 | 深南电路股份有限公司 | Manufacturing method of printed circuit board |
-
2021
- 2021-05-07 CN CN202110494365.4A patent/CN115315059A/en active Pending
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2022
- 2022-04-11 WO PCT/CN2022/086146 patent/WO2022233220A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022233220A1 (en) | 2022-11-10 |
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