WO2022227027A1 - Structure d'emballage de cavité, procédé d'emballage de cavité et dispositif électronique - Google Patents

Structure d'emballage de cavité, procédé d'emballage de cavité et dispositif électronique Download PDF

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Publication number
WO2022227027A1
WO2022227027A1 PCT/CN2021/091579 CN2021091579W WO2022227027A1 WO 2022227027 A1 WO2022227027 A1 WO 2022227027A1 CN 2021091579 W CN2021091579 W CN 2021091579W WO 2022227027 A1 WO2022227027 A1 WO 2022227027A1
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WO
WIPO (PCT)
Prior art keywords
cavity
substrate
holes
hole
housing
Prior art date
Application number
PCT/CN2021/091579
Other languages
English (en)
Chinese (zh)
Inventor
潘伟健
刘闻凤
王海明
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN202180097631.8A priority Critical patent/CN117242584A/zh
Priority to PCT/CN2021/091579 priority patent/WO2022227027A1/fr
Publication of WO2022227027A1 publication Critical patent/WO2022227027A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation

Definitions

  • the present application relates to the field of semiconductor technology, and in particular, to a cavity packaging structure, a cavity packaging method, and an electronic device.
  • the current cavity packaging structure mainly includes a base plate 1 , an installation platform 2 and an encapsulation shell 3 .
  • the encapsulation shell 3 and the base plate 1 are connected by glue, and the installation platform 2 is arranged between the encapsulation shell 3 and the base plate 1 .
  • the electronic device is arranged on the installation platform 2 .
  • the adhesive undergoes a curing process after connecting the encapsulation shell 3 and the base plate 1.
  • the gas in the cavity formed by the encapsulation shell 3 and the base plate 1 is thermally expanded, which in turn leads to thermal expansion.
  • the air pressure in the cavity increases, and the connecting portion between the packaging shell 3 and the bottom plate 1 is prone to warp under the action of the pressure, resulting in poor packaging effect.
  • the present application provides a cavity encapsulation structure, which can keep the air pressure inside and outside the cavity structure in balance, thereby improving the encapsulation effect.
  • an embodiment of the present application provides a cavity package structure, including a substrate, a housing and a blocking member, wherein the substrate has a mounting surface, the mounting surface is used for mounting electronic devices, and the housing is mounted on the mounting surface of the substrate, A cavity is formed between the housing and the mounting surface of the substrate, and the electronic device is located in the cavity; the housing is provided with one or more through holes and a blocking member matched with the one or more through holes, wherein the blocking member is Detachable structure.
  • the substrate has a mounting surface
  • the mounting surface is used for mounting electronic devices
  • the housing is mounted on the mounting surface of the substrate,
  • a cavity is formed between the housing and the mounting surface of the substrate, and the electronic device is located in the cavity
  • the housing is provided with one or more through holes and a blocking member matched with the one or more through holes, wherein the blocking member is Detachable structure.
  • the blocking member does not match with one or more through holes, so that one or more through holes are in an open state , the gas in the cavity can be exhausted to the outside of the cavity through the through hole, so as to keep the air pressure inside the cavity and the outside in balance, thereby improving the stability of the connection between the shell and the substrate.
  • the blocking member When the air pressure inside the cavity is less than or equal to the air pressure outside, the blocking member is installed in one or more through holes to block one or more through holes, so as to prevent impurities from entering the cavity and prevent electronic devices in the cavity be polluted and improve the stability of electronic devices.
  • the substrate After the shell is connected to the mounting surface of the substrate, the substrate needs to be fixed on the motherboard by reflow soldering.
  • the reflow oven sets a temperature curve, so that there is a rapid heating process during reflow soldering. The heating process will cause the gas in the cavity to be heated and expand, and will also increase the air pressure in the cavity.
  • the blocking member can be removed from one or more through holes, so that the The gas can also be exhausted to the outside through the through hole, so as to keep the air pressure inside and outside the cavity balanced, so as to ensure the stability of the connection between the casing and the substrate.
  • a plurality of mounting areas may be formed on the mounting surface of the substrate, electronic devices may be mounted on each mounting area, and each mounting area is correspondingly connected with a housing. This arrangement can improve the packaging efficiency of the electronic device.
  • the housing may include a side panel and a top panel, the top panel and the side panel may be integrally injection-molded, and the side of the side panel remote from the top panel is connected to the mounting surface of the base plate, and the top panel may be provided with one or more multiple vias. Since the top plate is located on the side away from the substrate, the through holes are also located on the side away from the substrate.
  • one or more through holes can also be provided on the side plate, as long as the air pressure inside the cavity is greater than the air pressure outside the cavity, the gas inside the cavity can pass through the blocking member and one or more through holes. It is sufficient that the holes are discharged to the outside of the cavity. Additionally, the projection of the one or more vias on the substrate mounting surface does not overlap the projection of the electronic device on the substrate mounting surface (ie, the vias are not located over the electronic device). When the blocking member is damaged, the impurities entering the cavity through the through hole will not quickly contaminate the electronic device and the important traces on the substrate.
  • the structural forms of the through holes provided on the housing can be various, for example, the diameter of the through holes gradually decreases from the direction away from the cavity to the direction close to the cavity (that is, the cross section of the through hole can be Or, from the side away from the cavity to the side of the cavity, the cross-section of the through hole can be set in steps (wherein, the number of steps of the stepped through hole can be specifically two, three or four, etc.); alternatively, the cross-section of the through hole may be rectangular.
  • the blocking member may be configured as a rubber plug or a bolt.
  • the diameter of the through hole can be gradually reduced from the end of the through hole away from the cavity to the end of the through hole close to the cavity (that is, the through hole is a conical hole), and the plug (rubber plug) ) can also be provided in a shape (tapered) adapted to the through hole (tapered hole).
  • the plug (rubber plug) and the through hole can be an interference fit (that is, the size of the outer contour of the plug is larger than that of the through hole) size of the bore diameter).
  • the through hole can also be a stepped hole, and the outer contour of the blocking member can also be stepped, so that the blocking member can be adapted to the stepped through hole.
  • the blocking member and the stepped through hole are in an interference fit.
  • the through hole can also be a rectangular hole, and the blocking member and the through hole are also in an interference fit to ensure the tightness of the connection between the blocking member and the through hole.
  • the shape of the cross section of the through hole may be a tapered hole, a stepped hole or a rectangular hole.
  • the through hole also needs to be provided with a thread that matches the bolt, so that the bolt can be fastened to the casing. The tightness of the connection between the bolt and the housing.
  • the blocking member rubber plug or bolt
  • the blocking member when the casing is glued to the substrate and the substrate is connected to the motherboard by reflow soldering, the blocking member (rubber plug or bolt) needs to be removed from the through hole, so that the through hole is in the
  • the open state ensures that the casing is connected to the base plate and the base plate is welded to the main plate, and the gas pressure in the cavity formed by the casing and the base plate can be discharged through the through hole after increasing.
  • the through hole can also be sealed by dispensing operation. At this time, the shape of the through hole can be stepped. In order to increase the bonding surface area between the glue and the hole wall, ensure better bonding strength and sealing effect.
  • an embodiment of the application provides a cavity packaging structure, including a substrate, a housing and an elastic cover, wherein the substrate has a mounting surface, the mounting surface is used for mounting electronic devices, and the housing is mounted on the mounting surface of the substrate , a cavity is formed between the casing and the mounting surface of the substrate, and the electronic device is located in the cavity; wherein, the casing is provided with one or more through holes, the cover is located outside the casing, and the one or more through holes and Area coverage around one or more through holes.
  • the cover can be sleeved on the outer casing before the outer casing is glued to the substrate, and also sleeved on the outer casing when the substrate is connected to the main board by reflow soldering, so as to reduce the external impurities passing through the The probability of the hole entering the cavity, and when the shell is over-soldered and glued to the substrate and the substrate and the motherboard are connected by reflow soldering, the gas in the cavity formed between the shell and the substrate is heated and expanded, the air pressure increases, and the gas in the cavity It will enter the cover through the through hole and deform the cover, thereby releasing the air pressure in the cavity, so as to balance the air pressure in the cavity and the external environment, so as to ensure the stability of the connection between the substrate and the shell.
  • the cover can be a waterproof elastic sleeve or a waterproof elastic membrane, and the size of the opening of the cover is smaller than the size of the casing, so that when the cover is sleeved on the casing, the casing and the casing are in an interference fit.
  • the housing may include a side panel and a top panel, the top panel and the side panel may be integrally injection-molded, and the side of the side panel remote from the top panel is connected to the mounting surface of the base plate, and the top panel may be provided with one or more multiple vias. Since the top plate is located on the side away from the substrate, the through holes are also located on the side away from the substrate.
  • one or more through holes can also be provided on the side plate, as long as the air pressure inside the cavity is greater than the air pressure outside the cavity, the gas inside the cavity can pass through the blocking member and one or more through holes. It is sufficient that the holes are discharged to the outside of the cavity. Additionally, the projection of the one or more vias on the substrate mounting surface does not overlap the projection of the electronic device on the substrate mounting surface (ie, the vias are not located over the electronic device). When the cover is damaged, impurities entering into the cavity through the through hole will not quickly contaminate the electronic device and the important traces on the substrate.
  • the structural forms of the through holes provided on the housing can be various, for example, the diameter of the through holes gradually decreases from the direction away from the cavity to the direction close to the cavity (that is, the cross section of the through hole can be Or, from the side away from the cavity to the side of the cavity, the cross-section of the through hole can be set in steps (wherein, the number of steps of the stepped through hole can be specifically two, three or four, etc.); alternatively, the cross-section of the through hole may be rectangular.
  • the cover includes a top cover and a side cover connected to the top cover, the top cover covers the top plate, the side cover covers the side plate, and the top cover and the side cover connect one or more through holes and the surrounding area of the through holes. area coverage.
  • the application embodiments provide a cavity package structure, including a substrate, a housing and a one-way ventilation valve, wherein the substrate has a mounting surface, the mounting surface is used for mounting electronic devices, and the housing is mounted on the mounting surface of the substrate, A cavity is formed between the housing and the mounting surface of the base plate, and the electronic device is located in the cavity; wherein, the housing is provided with one or more through holes, and the one-way ventilation valve is installed in the one or more through holes.
  • the gas in the cavity formed between the casing and the substrate is heated and expanded, the air pressure inside the cavity increases, and the gas in the cavity can be ventilated through one-way The valve is discharged into the cavity; and when the air pressure outside the cavity is greater than the air pressure in the cavity, the one-way vent valve is in a closed state, thereby ensuring that impurities cannot enter the cavity and improving the reliability of the package.
  • the housing may include a side panel and a top panel, the top panel and the side panel may be integrally injection-molded, and the side of the side panel remote from the top panel is connected to the mounting surface of the base plate, and the top panel may be provided with one or more multiple vias. Since the top plate is located on the side away from the substrate, the through holes are also located on the side away from the substrate.
  • one or more through holes can also be provided on the side plate, as long as the air pressure inside the cavity is greater than the air pressure outside the cavity, the gas inside the cavity can pass through the blocking member and one or more through holes. It is sufficient that the holes are discharged to the outside of the cavity. Additionally, the projection of the one or more vias on the substrate mounting surface does not overlap the projection of the electronic device on the substrate mounting surface (ie, the vias are not located over the electronic device). When the one-way vent valve is damaged, the impurities entering the cavity through the through hole will not quickly contaminate the electronic device and the important wiring on the substrate.
  • the present application also provides a method for encapsulating a cavity, comprising the following steps:
  • the electronic device is arranged on the surface of the substrate;
  • a blocking member is detachably mounted to the one or more through holes.
  • the stability of the connection between the casing and the substrate can be improved, and the reliability of the package can be improved.
  • the blocking member may be a bolt or a rubber plug.
  • the blocking member is a bolt or a rubber plug, it is necessary to wait until the casing is bonded to the substrate and the curing is completed, that is, waiting for each component to cool down, and the cavity inside When the air pressure is balanced with the air pressure outside the cavity, one or more through holes are then blocked. That is, in this case, the casing is bonded to the substrate through adhesive, and during the curing process of the adhesive, at least one through hole on the casing needs to be kept open.
  • the present application also provides a method for encapsulating a cavity, comprising the following steps:
  • the electronic device is arranged on the surface of the substrate;
  • the elastic cover is sleeved on the outer side of the casing, and the cover covers the one or more through holes and the area around the one or more through holes.
  • the stability of the connection between the casing and the substrate can be improved, and the reliability of the package can be improved.
  • the encapsulation process can be simplified because the cover can be sleeved on the outer side of the casing all the time.
  • the housing includes a top cover and a side cover connected with the top cover, the top cover covers the top panel of the housing, the side covers cover the side panels of the housing, and the top cover and the side covers combine one or more Through-hole coverage.
  • the present application also provides a method for encapsulating a cavity, comprising the following steps:
  • the electronic device is arranged on the surface of the substrate;
  • a one-way vent valve is installed in the one or more through holes.
  • the stability of the connection between the casing and the substrate can be improved, and the reliability of the package can be improved.
  • the one-way vent valve can always be installed in the through hole, which can simplify the packaging process.
  • the present application further provides an electronic device, including a printed circuit board and the cavity package structure in any of the foregoing technical solutions.
  • the working reliability of the electronic device using the above-mentioned cavity packaging structure is higher.
  • FIG. 1 is a schematic diagram of a cavity package structure in the prior art
  • FIG. 2 is a schematic structural diagram of a cavity packaging structure provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of a cavity encapsulation structure provided on a motherboard according to an embodiment of the present application
  • FIG. 4 is another schematic structural diagram of a cavity packaging structure provided by an embodiment of the present application.
  • FIG. 5 is another schematic structural diagram of a cavity packaging structure provided by an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a cavity package structure provided by an embodiment of the present application when there are two through holes;
  • FIG. 7 is a schematic structural diagram of a cavity package structure provided by an embodiment of the present application when there are two through holes;
  • FIG. 8 is another schematic structural diagram of a cavity package structure provided by an embodiment of the present application when there are two through holes;
  • 9a is a top view of a cavity package structure provided by an embodiment of the present application.
  • Figure 9b is a side view of Figure 9a
  • FIG. 10 is a schematic structural diagram of another cavity packaging structure provided by an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of another cavity package structure provided by an embodiment of the present application when there are two through holes;
  • FIG. 12a is a schematic structural diagram of another cavity packaging structure provided by an embodiment of the present application.
  • Figure 12b is a top view of part A in Figure 12a;
  • FIG. 13 is a schematic structural diagram of another cavity package structure provided by an embodiment of the present application when there are two through holes;
  • FIG. 14 is a schematic diagram of another structure when there are two through holes in another cavity package structure provided by an embodiment of the present application.
  • FIG. 15 is a flowchart of steps of a method for encapsulating a cavity provided by an embodiment of the present application.
  • FIG. 16 is a flowchart of steps of another method for encapsulating a cavity provided by an embodiment of the present application.
  • FIG. 17 is a flowchart of steps of still another cavity packaging method provided by an embodiment of the present application.
  • Icon 1-bottom plate; 2-installation platform; 3-encapsulation shell; 10-base plate; 11-installation area; 20-shell; 21-through hole; 22-top plate; 23-side plate; 30-blocking piece; -Cavity; 50-Electronics; 60-Mainboard; 70-Case; 80-One-way vent valve.
  • references in this specification to "one embodiment” or “some embodiments” and the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • appearances of the phrases “in one embodiment,” “in some embodiments,” “in other embodiments,” “in other embodiments,” etc. in various places in this specification are not necessarily All refer to the same embodiment, but mean “one or more but not all embodiments” unless specifically emphasized otherwise.
  • the terms “including”, “including”, “having” and their variants mean “including but not limited to” unless specifically emphasized otherwise.
  • packaging electronic devices can prevent impurities in the external environment from contaminating electronic devices, improve the reliability of electronic devices, and improve the reliability of electronic devices. service life.
  • the electronic device may be a diode, a triode, a chip, or the like.
  • a pressure difference between the air pressure inside the cavity packaging structure and the external air pressure will occur, and the strength of the bonding portion in the cavity packaging structure cannot withstand the generated pressure difference, which may cause Packaging efficiency and reliability are low.
  • the cavity package structure provided by the embodiment of the present application includes a substrate 10 , a housing 20 and a blocking member 30 , the substrate 10 has a mounting surface, the housing 20 is mounted on the mounting surface of the substrate 10 , and the housing 20 is connected to A cavity 40 is formed between the mounting surfaces of the substrate 10 , and the cavity 40 is used to accommodate one or more electronic devices 50 , and the one or more electronic devices 50 can be mounted on the mounting surface of the substrate 10 , wherein on the housing 20 One or more through holes 21 and a blocking member 30 matching with the one or more through holes 21 are provided, wherein the blocking member 30 is a detachable structure.
  • the housing 20 can be connected to the substrate 10 by means of bonding, and when the housing 20 is bonded to the substrate 10 by glue, it needs to be cured by baking, so that the housing 20 is fixed on the substrate 10 and cured by baking.
  • the process generates heat, and the generated heat will heat the cavity 40, and then the air pressure in the cavity 40 formed between the housing 20 and the mounting surface of the substrate 10 increases, so that the air pressure in the cavity 40 is greater than that outside the cavity 40.
  • the blocking member 30 is removed from the one or more through holes 21, so that the one or more through holes 21 are in an open state, and the gas in the cavity 40 passes through the blocking member 30 and the one or more through holes 21 is discharged to the outside of the cavity 40 to keep the air pressure inside the cavity 40 and the outside of the cavity 40 in a balanced state, thereby improving the stability of the connection between the casing 20 and the base plate 10, thereby reducing the pressure between the casing 20 and the base plate 10.
  • the requirements of the connection strength between the two are to prevent the casing 20 from being lifted.
  • the blocking member 30 blocks one or more through holes 21 to prevent impurities from entering the cavity 40 and prevent the cavity 40 from entering the cavity 40.
  • the substrate 10 also needs to be installed on the main board 60. Specifically, the substrate 10 can be fixed on the main board 60 by reflow soldering. There is a rapid heating process during welding. The heating process will cause the gas in the cavity 40 to be heated and expand, thereby increasing the air pressure in the cavity 40. At this time, the gas in the cavity 40 can also be discharged to the cavity through the through hole 21. 40 to keep the air pressure inside and outside the cavity 40 balanced, so as to ensure the stability of the connection between the housing 20 and the substrate 10 .
  • the blocking member 30 is removed from the through hole 21 so that the gas in the cavity 40 is discharged to the cavity 40 through the through hole 21 outside.
  • the mounting surfaces of the housing 20 and the substrate 10 may be connected together by welding, and when the housing 20 and the substrate 10 are connected by welding, the housing 20 and the substrate
  • the air pressure in the cavity 40 formed between the mounting surfaces of the 10 may also increase.
  • the through hole 21 can also discharge the air inside the cavity 40 to the outside of the cavity 40 .
  • the shell 20 and the base 10 can also be connected in other ways, which are not listed here.
  • the housing 20 may include a top plate 22 and a side plate 23, the top plate 22 and the side plate 23 may be integrally formed, and the side plate 23 may be vertically connected to the mounting surface.
  • the top plate 22 and the side plate 23 may also be connected together by means of bonding.
  • One or more through holes 21 can be provided in the top plate 22, because the top plate 22 is located on the side away from the mounting surface, that is, the through holes 21 are also far away from the mounting surface; wherein, the projection of the through holes 21 on the mounting surface and the setting on the mounting surface The projections of the one or more electronic devices 50 and the traces on the mounting surface do not overlap. In this way, when the blocking member 30 for blocking the through hole 21 is damaged, the probability of the impurities entering into the cavity 40 through the through hole 21 to fall on one or more electronic devices 50 and the wiring is reduced.
  • one or more through holes 21 may also be provided in the side plate 23 .
  • the through hole 21 can be arranged on the side of the side plate 23 away from the substrate 10 , the electronic device 50 and the traces, as long as the air pressure inside the cavity 40 is greater than the air pressure outside the cavity 40 , the gas inside the cavity 40 It can be discharged to the outside of the cavity 40 through the through hole 21 .
  • the through hole 21 may have various structural forms, for example, from the side away from the cavity 40 to the side of the cavity 40, the diameter of the through hole 21 may gradually decrease (ie The cross section of the through hole 21 may be tapered); or, from the side away from the cavity 40 to the side of the cavity 40, the cross section of the through hole 21 may be set in steps (not shown in FIG. The number of steps of the shaped through hole may be two, three or four, etc.); or, the cross section of the through hole 21 may be rectangular (not shown in FIG. 2 ).
  • the through holes 21 can also be in other forms, which are not listed here.
  • the through hole 21 is taken as an example, and when one through hole 21 is located in the top plate, the blocking member 30 can be of various types, for example: the blocking member 30 can be a rubber plug or a bolt; When the plug 30 is a rubber plug, in order to make the connection between the rubber plug and the through hole 21 more stable and tight, an interference fit between the rubber plug and the through hole 21 can be used to ensure the sealing performance of the cavity 40 .
  • the through hole 21 can be set as a stepped hole, and the number of steps of the stepped hole can be selected according to the specific situation.
  • the blocking member 30 realized by the rubber plug can also be set in a stepped shape, and In order to make the connection between the rubber plug and the through hole 21 more stable and tight, at least one step in the rubber plug arranged in a stepped shape can be partially interference fit with the corresponding through hole 21, wherein the interference fit
  • the outer diameter of the part to be fitted with the hole is larger than the inner diameter of the hole.
  • the through hole 21 can be set to be tapered, that is, from the end of the through hole 21 away from the substrate 10 to the end of the through hole 21 close to the substrate 10 , the diameter of the through hole 21 can be gradually reduced, and in order to make the rubber stopper
  • the realized plug 30 has a higher compatibility with the through hole 21, and the form of the rubber plug can be set to be the same as the shape of the through hole 21, and the size of the outer contour of the rubber plug is larger than the diameter of the through hole 21 to ensure There is an interference fit between the rubber plug and the through hole 21 .
  • the through hole 21 can also be a hole with a rectangular cross-section.
  • the cross-section of the rubber plug can also be a rectangle, as long as the cross-sectional size of the rubber plug is slightly larger than the cross-sectional diameter of the through hole 21, so as to ensure that the rubber plug and the The interference fit of the through hole 21 is sufficient.
  • the casing 20 when the casing 20 is bonded to the substrate 10, cured by baking, and the substrate 10 is connected to the main board 60 by reflow soldering, heat is generated during the above-mentioned connection process, so that the substrate The air pressure in the cavity 40 formed between the base plate 10 and the casing 20 increases. In order to ensure the same air pressure inside the cavity 40 as outside the cavity 40, and to stabilize the connection between the substrate 10 and the casing 20, the blocking member needs to be closed.
  • the gas pressure in the cavity 40 formed by the casing 20 and the substrate 10 can be discharged through the through hole 21 after the pressure is increased.
  • a gasket may be provided on the side where the bolt is in contact with the through hole 21 ( FIG. 5 (not shown), and the through hole 21 is provided with a thread for matching the bolt, so that the bolt can be fastened to the casing 20, and the connection between the bolt and the casing 20 can also be sealed, so that the casing 20 and the substrate
  • the cavity 40 formed by 10 may be a closed space.
  • the through hole 21 may be a rectangular hole (with a rectangular cross-section), and at this time, any section of the rectangular hole may be provided with threads, so that the bolts are tightly connected to the housing 20 .
  • the through hole 21 can also be set as a stepped hole (not shown in FIG. 5 ), and the number of steps of the stepped hole can be selected according to specific conditions, and a thread can be provided on the side of the stepped hole close to the substrate 10 .
  • the type of the blocking member 30 can be multiple
  • the blocking member 30 may be a rubber plug or a bolt.
  • the blocking member 30 provided on one of the two through holes 21 is a rubber plug
  • the blocking member 30 provided on the other through hole 21 may also be a rubber plug.
  • an interference fit between the rubber plug and the through hole 21 may be used to ensure the sealing performance of the cavity 40 .
  • the specific shapes of the two through holes 21 can both be set as stepped holes.
  • the two rubber plugs can both be stepped.
  • the specific shapes of the two through holes 21 can also be set to be tapered, that is, from the end of the through hole 21 away from the cavity 40 to the end of the through hole 21 close to the cavity 40, the diameter of the through hole 21 can be gradually reduced.
  • the shapes of the two rubber plugs (blocking members 30 ) can also be configured to be tapered, so as to improve the compatibility between the rubber plug and the through hole 21 .
  • the two through holes 21 can also be rectangular holes (the cross section is rectangular), and the rubber plugs can also be rectangular plugs.
  • the shapes of the two through holes 21 can also be different. Specifically, any combination of rectangular holes, stepped holes and tapered holes can be used. At this time, the rubber plug only needs to be changed according to the shape of the through hole. Interference fit is sufficient.
  • the housing 10 when the housing 10 is glued to the substrate 10 and the substrate 10 is connected to the motherboard 60 by reflow soldering, air pressure in the cavity 10 will be formed between the substrate 10 and the housing 20 Increase, in order to ensure the stability of the connection between the substrate 10 and the housing 20, the two rubber plugs can be removed from the through hole 21 together, or one of the two rubber plugs can be removed from the through hole 21, thereby ensuring the housing 10 is connected to the substrate 10 and the substrate 10 is connected to the main board 60 by reflow soldering, the gas pressure inside the cavity 40 formed by the casing 20 and the substrate 10 can be discharged through one or two through holes 21 after the increase in pressure, so that the cavity 40 can be discharged.
  • the air pressure inside the cavity 40 is balanced with the air pressure outside the cavity 40 .
  • the through hole matched with the rubber plug can be set as a tapered hole, a rectangular hole or a stepped hole, and the shape of the through hole 21 that is matched with the bolt can be a rectangular hole or a stepped hole, and the rectangular hole or the stepped hole is provided with a thread for matching with the bolt, and
  • a sealing gasket can also be provided on the outer side of the side plate 23 or the top plate 22, so as to ensure the tightness of the connection between the bolt and the casing 20 when the bolt is tightly connected to the casing 20, so that the casing 20 can be tightly connected.
  • the cavity 40 formed between the substrate 10 and the substrate 10 may be a closed space.
  • the air pressure in the casing 20 and the cavity 40 will increase during the soldering process.
  • the air pressure inside the cavity 40 is balanced, and both the bolt and the rubber plug can be disassembled from the through hole 21, or one of the bolt and the rubber plug can be disassembled from the through hole 21, so that when the air pressure inside the cavity 40 increases, the air pressure inside the cavity 40
  • the gas can be discharged to the outside of the cavity 40 through the through hole 21 to ensure that the air pressure inside the cavity 40 and the air pressure outside the cavity 40 are kept in balance.
  • the blocking member 30 provided on one of the two through holes 21 is a bolt
  • the blocking member 30 provided on the other through hole 21 can also be a bolt.
  • a gasket may be provided between the bolt and the housing 20 .
  • the through hole 21 may also be blocked by dispensing glue.
  • each mounting area 11 may be correspondingly connected to a housing 20 .
  • Each housing 20 has one or more through holes 21, and each housing 20 is provided with a blocking member 30 matched with the through hole, and one or more can be installed in the cavity 40 formed by each housing 20 and its corresponding mounting area 11. multiple electronic devices. This arrangement can improve the packaging efficiency of the electronic device.
  • an embodiment of the application provides a cavity package structure including a substrate 10 , a housing 20 and a cover 70 , the substrate 10 has a mounting surface, the housing 20 is mounted on the mounting surface of the substrate 10 , and the housing 20 is mounted on the substrate 10 A cavity 40 is formed between the surfaces, and the cavity 40 is used to accommodate one or more electronic devices 50, and the one or more electronic devices 50 can be mounted on the mounting surface of the substrate 10.
  • a plurality of through holes 21 , and the cover 70 is located on the outer side of the housing 20 and covers the one or more through holes 21 and the area around the one or more through holes 21 .
  • the cover 70 can be sleeved on the outer casing 20 before the outer casing 20 is glued to the substrate 10, and also sleeved on the outer casing 20 when the substrate 10 is connected to the main board 60 by reflow soldering, Therefore, the probability of external impurities entering the cavity 40 through the through hole 21 is reduced, and when the casing 20 is connected to the substrate 10 and the substrate 10 and the motherboard 60 are connected by reflow soldering, the cavity 40 formed between the casing 20 and the substrate 40 is formed.
  • the gas in the cavity 40 is heated and expanded, and the air pressure increases, and the gas in the cavity 40 will enter the casing 70 through the through hole 21 and deform the casing 70, thereby releasing the air pressure in the cavity 40, so that the inside of the cavity 40 and the external environment air pressure balance to ensure the stability of the connection between the substrate 10 and the housing 20 .
  • the cover 70 can be a waterproof elastic sleeve or a waterproof cover, and the aperture of the opening of the cover is smaller than the aperture of the outer casing 20 , so that when the cover is sleeved on the outer casing 20 , the outer casing and the outer casing 20 are in contact with each other. A tight fit can be made between the cover shell and the outer shell 20 to improve the tightness.
  • the housing 20 may include a top panel 22 and a side panel 23, the top panel 22 and the side panel 23 may be integrally formed, and the side panel 23 may be vertically connected to the mounting surface.
  • the top plate 22 and the side plate 23 may also be connected together by means of bonding.
  • One or more through holes 21 can be provided in the top plate 22, because the top plate 22 is located on the side away from the mounting surface, that is, the through holes 21 are also far away from the mounting surface; wherein, the projection of the through holes 21 on the mounting surface and the setting on the mounting surface The projections of the one or more electronic devices 50 and the traces on the mounting surface do not overlap. In this way, when the cover 70 for blocking the through hole 21 is damaged, the probability of impurities entering into the cavity 40 through the through hole 21 to fall onto one or more electronic devices 50 and the wiring is reduced.
  • one or more through holes 21 may also be provided in the side plate 23 .
  • the through hole 21 can be arranged on the side of the side plate 23 away from the substrate 10 , the electronic device 50 and the traces, as long as the air pressure inside the cavity 40 is greater than the air pressure outside the cavity 40 , the gas inside the cavity 40 It can be discharged to the outside of the cavity 40 through the through hole 21 .
  • the cover 70 may include a top cover and a side cover that are integrally formed. Referring to FIG. 11 , when there are two through holes 21 , the top cover covers the top plate of the casing 20 , the side cover covers the side plates of the casing 20 , and the top cover will be provided One through hole 21 in the top plate is covered, the side cover covers one through hole 21 in the side plate, and the side cover extends toward the base plate 10 to cover the area around the one through hole 21 in the side plate; wherein, The through hole 21 provided on the side plate 23 is located on the side close to the top plate 23. In order to make the casing 70 cover the two through holes 21, the sealing between the casing 70 and the outer casing 20 is better. Can be flexible.
  • the cover 70 can be sleeved on the casing 20 all the time, thereby reducing the probability of external impurities entering the cavity 40 through the through hole 21 , and the casing 20 is connected to the substrate 10 and the substrate 10 and the main board.
  • the gas in the cavity 40 formed between the shell 20 and the base 40 is heated and expanded, and the air pressure increases, and the gas inside the cavity 40 will enter the cover through the two through holes 21, and make the cover
  • the deformation is generated, and then the air pressure inside the cavity 40 is released, so that the air pressure in the cavity 40 and the air pressure outside the cavity 40 are balanced, so as to ensure the stability of the connection between the substrate 10 and the housing 20 .
  • the cover 70 to fit with the through hole 21
  • the process of connecting the substrate 10 to the main board 60 can be saved, and the soldering process can be simplified.
  • the shape of the through hole 21 may be any shape, which is not limited here.
  • the application embodiment provides a cavity package structure, including a substrate 10, a housing 20 and a one-way ventilation valve 80, the substrate 10 has a mounting surface, the housing 20 is mounted on the mounting surface of the substrate 10, and the housing 20 A cavity 40 is formed between it and the mounting surface of the substrate 10 , and the cavity 40 is used for accommodating one or more electronic devices 50 , and the one or more electronic devices 50 can be mounted on the mounting surface of the substrate 10 , wherein, in the housing 20 One or more through holes 21 are provided thereon, and the one-way ventilation valve 80 is installed in the one or more through holes 21 .
  • the gas in the cavity 40 formed between the casing 20 and the substrate 10 is heated and expanded, and the air pressure in the cavity 40 increases,
  • the gas in the cavity 40 can be discharged into the cavity 40 through the one-way vent valve 80; and when the air pressure outside the cavity 40 is greater than or equal to the air pressure in the cavity 40, the one-way vent valve The 80 is in a closed state, thereby ensuring that impurities cannot enter the cavity 40 and improving the reliability of the package.
  • the one-way vent valve 80 is also disposed on the through hole 21 when the casing 20 is connected to the substrate 10 and the substrate 10 is connected to the main board by reflow soldering, and the one-way vent valve 80 does not need to be disassembled, which can further improve the packaging efficiency.
  • the through hole 21 can be set as a stepped hole, so that the one-way vent valve can be installed in the through hole 21 .
  • the housing 20 may include a top panel 22 and a side panel 23, the top panel 22 and the side panel 23 may be integrally formed, and the side panel 23 may be vertically connected to the mounting surface.
  • the top plate 22 and the side plate 23 may also be connected together by means of bonding.
  • One or more through holes 21 can be provided in the top plate 22, because the top plate 22 is located on the side away from the mounting surface, that is, the through holes 21 are also far away from the mounting surface; wherein, the projection of the through holes 21 on the mounting surface and the setting on the mounting surface The projections of the one or more electronic devices 50 and the traces on the mounting surface do not overlap. In this way, when the one-way vent valve 80 for blocking the through hole 21 is damaged, the probability of impurities entering into the cavity 40 through the through hole 21 to fall on one or more electronic devices 50 and the wiring is reduced.
  • one or more through holes 21 may also be provided in the side plate 23 .
  • the through hole 21 can be arranged on the side of the side plate 23 away from the substrate 10 , the electronic device 50 and the traces, as long as the air pressure inside the cavity 40 is greater than the air pressure outside the cavity 40 , the gas inside the cavity 40 It can be discharged to the outside of the cavity 40 through the through hole 21 .
  • the number of the through holes 21 may be one, two or three, etc. When the number of the through holes 21 is one, the through holes 21 may be provided in the side plate 23 or the top plate 22 . Referring to FIG. 13 , when there are two through holes 21 and a one-way vent valve 80 is provided in both through holes 21 , in order to make the one-way vent valve 80 more convenient to be installed on the housing 20 , the two through holes 21 can all be set as stepped holes.
  • the casing 20 is connected to the base plate 10 and the base plate 10 is welded to the main board, the gas inside the cavity 40 formed between the casing 20 and the base plate 10 is heated and expanded, and the air pressure increases.
  • the gas can be discharged to the outside of the cavity 40 through the two one-way ventilation valves 80; and when the air pressure outside the cavity 40 is greater than the air pressure inside the cavity 40, the one-way ventilation valve is in a closed state, thereby ensuring that impurities cannot enter the air. In the cavity 40, the reliability of the electronic device can also be improved.
  • the two one-way ventilation valves 80 can speed up the speed of air pressure balance inside and outside the cavity 40, and when one of the one-way ventilation valves 80 is damaged, the high-pressure gas in the cavity 40 can pass through the other one-way ventilation valve. 80 is discharged out of the cavity 40 and does not affect the connection of the casing 20 to the substrate 10 .
  • the use of the one-way ventilation valve 80 can also save the process of connecting the base plate 10 to the main board and simplify the welding process.
  • one of the two through holes 21 can be matched with the blocking member 30 , and the other through hole can be matched with the one-way vent valve 80 , wherein the blocking member 30 is matched with the one-way vent valve 80 .
  • the cross section of the through hole 21 can be set as one of a conical hole, a rectangular hole or a stepped hole, the through hole 21 matched with the one-way vent valve 80 can be a stepped hole, and the through hole 21 matched with the one-way vent valve 80 can be a stepped hole.
  • the stepped holes may facilitate the installation of the one-way vent valve 80 on the housing 20 .
  • one of the two through holes 21 is provided with a one-way ventilation valve 80, which is connected to the other one.
  • the blocking member 30 matched with the hole 21 may not be disassembled from the through hole 21, and it can also ensure that when the air pressure in the cavity 40 increases, the gas inside the cavity 40 is discharged to the outside of the cavity 40 through the one-way ventilation valve.
  • the present application also provides a cavity packaging method, including the following steps:
  • S10a disposing the electronic device on the surface of the substrate
  • S20a Adhering a housing having one or more through holes to the surface of the substrate by adhesive, wherein the electronic device is located in a cavity formed by the housing and the substrate;
  • S30a Removably install the blocking member to the one or more through holes.
  • the stability of the connection between the casing and the substrate can be improved, and the reliability of the package can be improved.
  • the blocking member can be a bolt or a rubber plug.
  • the blocking member is a bolt or a rubber plug, it is necessary to wait until the shell is bonded to the substrate and the curing is completed, that is, waiting for each element to cool down, and the air pressure inside the cavity is related to the cavity.
  • the external air pressure is balanced, one or more through holes are then blocked. That is, in this case, the casing is bonded to the substrate through adhesive, and during the curing process of the adhesive, at least one through hole on the casing needs to be kept open.
  • the present application also provides a method for encapsulating a cavity, including the following steps:
  • S10b disposing the electronic device on the surface of the substrate
  • S20b Adhering a casing with one or more through holes to the surface of the substrate by adhesive, wherein the electronic device is located in the cavity formed by the casing and the substrate;
  • S30b Put an elastic cover on the outer side of the casing, and make the cover cover the one or more through holes and the area around the one or more through holes.
  • the stability of the connection between the casing and the substrate can be improved, and the reliability of the package can be improved.
  • the encapsulation process can be simplified because the cover can be sleeved on the outer side of the casing all the time.
  • the housing includes a top cover and a side cover connected with the top cover, the top cover covers the top panel of the housing, the side covers cover the side panels of the housing, and the top cover and the side covers combine one or more Through-hole coverage.
  • the present application also provides a method for encapsulating a cavity, including the following steps:
  • S10c disposing the electronic device on the surface of the substrate
  • S20c Adhering a casing with one or more through holes to the surface of the substrate by adhesive, wherein the electronic device is located in the cavity formed by the casing and the substrate;
  • the stability of the connection between the casing and the substrate can be improved, and the reliability of the package can be improved.
  • the one-way vent valve can always be installed in the through hole, which can simplify the packaging process.
  • the present application also provides an electronic device, including a printed circuit board and the cavity packaging structure in any of the above technical solutions.
  • the working reliability of the electronic device using the above-mentioned cavity packaging structure is higher.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

La présente invention concerne le domaine technique des semi-conducteurs, et concerne spécifiquement une structure d'emballage de cavité, un procédé d'emballage de cavité et un dispositif électronique. La structure d'emballage de cavité comprend un substrat, un boîtier et un élément de blocage. Le substrat comporte une surface de montage, qui est utilisée pour monter un composant électronique, le boîtier étant monté sur la surface de montage du substrat, une cavité étant formée entre le boîtier et la surface de montage du substrat, et le composant électronique étant situé dans la cavité ; et le boîtier comporte un ou plusieurs trous traversants, et l'élément de blocage correspond à l'un ou plusieurs trous traversants, et l'élément de blocage peut sélectivement ouvrir et bloquer l'un ou plusieurs trous traversants. La structure d'emballage de cavité dans la présente invention peut permettre à la pression à l'intérieur et à l'extérieur de la cavité de rester équilibrée, améliorant ainsi l'effet d'emballage.
PCT/CN2021/091579 2021-04-30 2021-04-30 Structure d'emballage de cavité, procédé d'emballage de cavité et dispositif électronique WO2022227027A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202180097631.8A CN117242584A (zh) 2021-04-30 2021-04-30 空腔封装结构、空腔封装方法及电子设备
PCT/CN2021/091579 WO2022227027A1 (fr) 2021-04-30 2021-04-30 Structure d'emballage de cavité, procédé d'emballage de cavité et dispositif électronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2021/091579 WO2022227027A1 (fr) 2021-04-30 2021-04-30 Structure d'emballage de cavité, procédé d'emballage de cavité et dispositif électronique

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WO2022227027A1 true WO2022227027A1 (fr) 2022-11-03

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140264699A1 (en) * 2013-03-13 2014-09-18 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
CN205944134U (zh) * 2016-06-30 2017-02-08 鸿利智汇集团股份有限公司 一种喷粉盖板
KR20180100792A (ko) * 2017-03-02 2018-09-12 앰코 테크놀로지 인코포레이티드 플러깅 벤트홀을 갖는 캐비티 센서 패키지 및 이의 제조 방법
CN208888964U (zh) * 2018-11-07 2019-05-21 刘娜娜 一种古文献的保护装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140264699A1 (en) * 2013-03-13 2014-09-18 Samsung Electronics Co., Ltd. Semiconductor package and method of manufacturing the same
CN205944134U (zh) * 2016-06-30 2017-02-08 鸿利智汇集团股份有限公司 一种喷粉盖板
KR20180100792A (ko) * 2017-03-02 2018-09-12 앰코 테크놀로지 인코포레이티드 플러깅 벤트홀을 갖는 캐비티 센서 패키지 및 이의 제조 방법
CN208888964U (zh) * 2018-11-07 2019-05-21 刘娜娜 一种古文献的保护装置

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