WO2022216509A3 - Overmolded film capacitor - Google Patents

Overmolded film capacitor Download PDF

Info

Publication number
WO2022216509A3
WO2022216509A3 PCT/US2022/022723 US2022022723W WO2022216509A3 WO 2022216509 A3 WO2022216509 A3 WO 2022216509A3 US 2022022723 W US2022022723 W US 2022022723W WO 2022216509 A3 WO2022216509 A3 WO 2022216509A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
film capacitor
layer
film
overmolded
Prior art date
Application number
PCT/US2022/022723
Other languages
French (fr)
Other versions
WO2022216509A2 (en
Inventor
Evangelista BONI
Federico FANTINI
Gabriele Piccinini
Walter Bruno
Original Assignee
Kemet Electronics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kemet Electronics Corporation filed Critical Kemet Electronics Corporation
Priority to CN202280026809.4A priority Critical patent/CN117321713A/en
Priority to JP2023560204A priority patent/JP2024513200A/en
Priority to EP22785177.1A priority patent/EP4320635A2/en
Publication of WO2022216509A2 publication Critical patent/WO2022216509A2/en
Publication of WO2022216509A3 publication Critical patent/WO2022216509A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H01G2/103—Sealings, e.g. for lead-in wires; Covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Provided is a method for forming an overmolded film capacitor. The method includes forming a working element comprising a first film layer with a first conductive layer on the first film layer and a second film layer with a second conductive layer on the second film layer wherein the first conductive layer and second conductive layer form a capacitive couple. A first lead is formed and is in electrical contact with the first conductive layer. A second lead is formed and is in electrical contact with the second conductive layer. An overmold is formed on the working element wherein the overmold comprises a thermoplastic resin.
PCT/US2022/022723 2021-04-07 2022-03-31 Overmolded film capacitor WO2022216509A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN202280026809.4A CN117321713A (en) 2021-04-07 2022-03-31 Secondary injection molding film capacitor
JP2023560204A JP2024513200A (en) 2021-04-07 2022-03-31 overmolded film capacitor
EP22785177.1A EP4320635A2 (en) 2021-04-07 2022-03-31 Overmolded film capacitor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202163171730P 2021-04-07 2021-04-07
US63/171,730 2021-04-07

Publications (2)

Publication Number Publication Date
WO2022216509A2 WO2022216509A2 (en) 2022-10-13
WO2022216509A3 true WO2022216509A3 (en) 2022-11-17

Family

ID=83510968

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2022/022723 WO2022216509A2 (en) 2021-04-07 2022-03-31 Overmolded film capacitor

Country Status (5)

Country Link
US (1) US11935699B2 (en)
EP (1) EP4320635A2 (en)
JP (1) JP2024513200A (en)
CN (1) CN117321713A (en)
WO (1) WO2022216509A2 (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195747A (en) * 1998-12-25 2000-07-14 Matsushita Electric Ind Co Ltd Manufacture of plastic film capacitor
US20110107835A1 (en) * 2008-07-28 2011-05-12 Curt Douglas Campbell Method and apparatus for packaging crash sensors
US20120040208A1 (en) * 2004-01-29 2012-02-16 Teijin Dupont Films Japan Limited Biaxially oriented film
JP2016210957A (en) * 2015-05-13 2016-12-15 アイシン化工株式会社 Heat storage polymer molded body
US20180370096A1 (en) * 2015-06-16 2018-12-27 Leonhard Kurz Stiftung & Co. Kg Method for Producing a Plastic Molded Article, Plastic Molded Article and Mold
US20200343051A1 (en) * 2019-04-25 2020-10-29 Avx Corporation Integrated Component Including a Capacitor and Discrete Varistor

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6441741B1 (en) 1999-05-17 2002-08-27 Avid Identification Systems, Inc. Overmolded transponder
ES2430391T3 (en) * 2010-05-12 2013-11-20 Epcos Ag Capacitor element and method to encapsulate a capacitor base body
US9127153B2 (en) 2012-11-02 2015-09-08 Henkel IP & Holding GmbH Molding and overmolding compositions for electronic devices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000195747A (en) * 1998-12-25 2000-07-14 Matsushita Electric Ind Co Ltd Manufacture of plastic film capacitor
US20120040208A1 (en) * 2004-01-29 2012-02-16 Teijin Dupont Films Japan Limited Biaxially oriented film
US20110107835A1 (en) * 2008-07-28 2011-05-12 Curt Douglas Campbell Method and apparatus for packaging crash sensors
JP2016210957A (en) * 2015-05-13 2016-12-15 アイシン化工株式会社 Heat storage polymer molded body
US20180370096A1 (en) * 2015-06-16 2018-12-27 Leonhard Kurz Stiftung & Co. Kg Method for Producing a Plastic Molded Article, Plastic Molded Article and Mold
US20200343051A1 (en) * 2019-04-25 2020-10-29 Avx Corporation Integrated Component Including a Capacitor and Discrete Varistor

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
AGARWAL ASHISH, SARVIYA R.M.: "Characterization of Commercial Grade Paraffin wax as Latent Heat Storage material for Solar dryers", MATERIALS TODAY: PROCEEDINGS, ELSEVIER, NL, vol. 4, no. 2, 1 January 2017 (2017-01-01), NL , pages 779 - 789, XP093008154, ISSN: 2214-7853, DOI: 10.1016/j.matpr.2017.01.086 *

Also Published As

Publication number Publication date
US20220328246A1 (en) 2022-10-13
CN117321713A (en) 2023-12-29
US11935699B2 (en) 2024-03-19
JP2024513200A (en) 2024-03-22
WO2022216509A2 (en) 2022-10-13
EP4320635A2 (en) 2024-02-14

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