JP2011218661A5 - - Google Patents
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- JP2011218661A5 JP2011218661A5 JP2010090056A JP2010090056A JP2011218661A5 JP 2011218661 A5 JP2011218661 A5 JP 2011218661A5 JP 2010090056 A JP2010090056 A JP 2010090056A JP 2010090056 A JP2010090056 A JP 2010090056A JP 2011218661 A5 JP2011218661 A5 JP 2011218661A5
- Authority
- JP
- Japan
- Prior art keywords
- layer
- molded
- transfer foil
- molded product
- primary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (10)
前記対象製品の外観部分の少なくとも一部を構成する１次成形層と、
加飾層及び導電層のうち少なくとも一方を有し、前記１次成形層にインモールド成形により転写された転写箔と、
前記１次成形層との間に、前記転写箔が配置されるように、前記１次成形層上に形成された２次成形層と
を具備する成形品。 It is a molded product applied to the target product,
A primary molding layer constituting at least a part of the appearance of the target product ;
A transfer foil having at least one of a decorative layer and a conductive layer, and transferred to the primary molding layer by in-mold molding;
A molded article comprising: a secondary molding layer formed on the primary molding layer so that the transfer foil is disposed between the primary molding layer.
前記１次成形層が透明樹脂である The primary molding layer is a transparent resin
成形品。 Molding.
前記転写箔の前記導電層の一部が、前記２次成形層に設けられた溝部を介して露出するように設けられている
成形品。 The molded article according to claim 1 or 2,
A molded product provided such that a part of the conductive layer of the transfer foil is exposed through a groove provided in the secondary molding layer .
前記転写箔の前記導電層は、センシング用、電磁波シールド用、または、電力供給用の導電層と、外部接続用の端子電極層とを含み、
前記端子電極層の一部が、前記溝部を介して露出するように設けられている
成形品。 The molded product according to claim 3 ,
The conductive layer of the transfer foil is seen containing a sensing, electromagnetic wave shielding, or a conductive layer for power supply and a terminal electrode layer for external connection,
A molded product provided such that a part of the terminal electrode layer is exposed through the groove .
前記溝部には、外部素子に設けられたコネクタが挿入可能となっている
成形品。 The molded product according to claim 4 ,
Before SL The groove, molded articles connector provided on the external device can be inserted.
前記転写箔は、前記加飾層及び前記導電層の間に介在された防御層をさらに有する
成形品。 The molded article according to any one of claims 1 to 5 ,
The transfer foil further includes a protective layer interposed between the decorative layer and the conductive layer.
前記成形品は、前記成形品が適用される対象製品の筐体の少なくとも一部である
成形品。 The molded article according to any one of claims 1 to 6 ,
The molded product is a molded product that is at least a part of a casing of a target product to which the molded product is applied .
前記対象製品が、ディスプレイを有する電子機器である場合に、
前記筐体は、
前記ディスプレイが配置される窓部を有し、前記転写箔の前記導電層の第１の部分が転写された主面と、
前記転写箔の前記導電層の前記第１の部分とは異なる第２の部分が転写された側面とを有する
成形品。 The molded product according to claim 7,
When the target product is an electronic device having a display ,
The housing is
A main surface having a window portion on which the display is disposed, to which a first portion of the conductive layer of the transfer foil is transferred;
A molded article having a side surface to which a second portion different from the first portion of the conductive layer of the transfer foil is transferred.
前記成形品は、
前記対象製品の外観部分の少なくとも一部を構成する１次成形層と、
加飾層及び導電層のうち少なくとも一方を有し、前記１次成形層にインモールド成形により転写された転写箔と、
前記１次成形層との間に、前記転写箔が配置されるように、前記１次成形層上に形成された２次成形層とを有する
対象製品。 A target product comprising a molded article,
The molded article is
A primary molding layer constituting at least a part of the appearance of the target product ;
A transfer foil having at least one of a decorative layer and a conductive layer, and transferred to the primary molding layer by in-mold molding;
A secondary molding layer formed on the primary molding layer so that the transfer foil is disposed between the primary molding layer and the primary molding layer;
Target product .
前記１次成形層と２次成形層との間に、前記転写箔を挟み込むように、前記１次成形層上に前記２次成形層を形成する
成形品の製造方法。 A transfer foil having at least one of a decorative layer and a conductive layer is used to form at least a part of an appearance portion of a target product to which a molded product is applied, to which the transfer foil is transferred by in-mold molding. Forming the next molding layer,
A method for producing a molded product, wherein the secondary molded layer is formed on the primary molded layer so as to sandwich the transfer foil between the primary molded layer and the secondary molded layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010090056A JP5263215B2 (en) | 2010-04-09 | 2010-04-09 | Molded article, electronic device and method for producing molded article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010090056A JP5263215B2 (en) | 2010-04-09 | 2010-04-09 | Molded article, electronic device and method for producing molded article |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011218661A JP2011218661A (en) | 2011-11-04 |
| JP2011218661A5 true JP2011218661A5 (en) | 2012-12-06 |
| JP5263215B2 JP5263215B2 (en) | 2013-08-14 |
Family
ID=45036252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010090056A Expired - Fee Related JP5263215B2 (en) | 2010-04-09 | 2010-04-09 | Molded article, electronic device and method for producing molded article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5263215B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5525574B2 (en) * | 2012-08-07 | 2014-06-18 | ホシデン株式会社 | Component module and component module manufacturing method |
| JP5484529B2 (en) * | 2012-08-07 | 2014-05-07 | ホシデン株式会社 | Component module and component module manufacturing method |
| DE102019126232A1 (en) * | 2019-09-30 | 2021-04-01 | Lisa Dräxlmaier GmbH | MANUFACTURING A LIVE VEHICLE COMPONENT |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4932987B1 (en) * | 1969-03-13 | 1974-09-04 | ||
| JPS63257298A (en) * | 1987-04-15 | 1988-10-25 | サカエ理研工業株式会社 | Electromagnetic or radio frequency shielded product and manufacture of the same |
| BRPI0608841A2 (en) * | 2005-03-10 | 2010-02-02 | Nissha Printing | method for producing housing for electronic apparatus |
-
2010
- 2010-04-09 JP JP2010090056A patent/JP5263215B2/en not_active Expired - Fee Related
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